TW201306184A - Package structure and manufacturing method thereof - Google Patents

Abstract

A package structure including a circuit substrate, at least one pad, at least one electronic element and a molding compound is provided. The circuit substrate has an upper surface. The pad is disposed on the upper surface of the circuit substrate and electrically connected to the circuit substrate. The electronic element is disposed on the upper surface of the circuit substrate and electrically connected to the circuit substrate. The molding compound encapsulates the upper surface of the circuit substrate, the pad and the electronic element and exposes a first side surface of the pad. The first side surface of the pad is aligned with a second side surface of the molding compound.

Description

Package structure and manufacturing method thereof

The present invention relates to a package structure and a method of fabricating the same, and more particularly to a package structure of an electronic component and a method of fabricating the same.

In recent years, integrated circuit technology and materials have made rapid progress, and the size of its wafers has been shrinking, but its functions have become increasingly powerful. The wide range of applications can be said to be far-reaching. Therefore, the products produced by integrated circuit technology have gradually become lighter and thinner. The short form, such as handheld electronic devices, electronic dictionaries, digital cameras and various digital products, are numerous.

Surface Mounting Technology (SMT) is a common technique for bonding electronic components and circuit boards or other components. It has the advantage of reducing the size of the overall package structure and contributing to the miniaturization of electronic devices.

The invention provides a package structure, wherein the encapsulant of the package exposes one side surface of the pad, which can effectively improve the convenience of soldering the electronic component to the package structure in a subsequent process, thereby increasing the applicability of the package structure.

The invention provides a manufacturing method of a package structure, which is used for manufacturing the above package structure, which can effectively reduce production cost and improve production efficiency.

The invention provides a package structure comprising a circuit substrate, at least one pad, at least one electronic component and an encapsulant. The circuit substrate has an upper surface. The pad is disposed on the upper surface of the circuit substrate and electrically connected to the circuit substrate. The electronic component is disposed on the upper surface of the circuit substrate and electrically connected to the circuit substrate. The encapsulant covers the upper surface of the circuit substrate, the pads and the electronic components, and exposes a first side surface of the pad, wherein a second side surface of the encapsulant is aligned with the first side surface of the pad.

In an embodiment of the invention, the package structure further includes a light emitting element. The light-emitting element is disposed on the first side surface of the pad exposed by the encapsulant, and the light-emitting element is electrically connected to the electronic component through the pad and the circuit substrate.

In an embodiment of the invention, the at least one pad comprises a first pad and a second pad. The encapsulant exposes a third side surface of the first pad and a fourth side surface of the second pad. The light emitting element has a first electrode portion and a second electrode portion, and the first electrode portion and the second electrode portion are respectively soldered to the third side surface and the fourth side surface.

In an embodiment of the invention, the light-emitting element comprises a light-emitting diode.

In an embodiment of the invention, the light emitting diode is a surface mount device (SMD) light emitting diode.

In an embodiment of the invention, the light emitting diode includes a side-emitting type light emitting diode. The side-emitting type light-emitting diode has a light-emitting surface, and the light-emitting surface faces the outside of the package rubber.

In an embodiment of the invention, the edge of the encapsulant is aligned with the edge of the circuit substrate.

In an embodiment of the invention, the at least one electronic component comprises a flash memory chip and a control wafer.

In an embodiment of the invention, the circuit substrate has a lower surface opposite to the upper surface and a plurality of connection pads disposed on the lower surface. The connection pad is electrically connected to the electronic component through the circuit substrate.

The present invention provides a method of fabricating a package structure that includes the following steps. An array substrate is provided. The array substrate has a surface and a plurality of circuit substrate units, wherein each of the circuit substrate units is defined by a plurality of cutting lines. A plurality of pads are formed on the surface of the array substrate, wherein the pads are disposed between the adjacent two circuit substrate units and arranged on the partial cutting lines. The pad is electrically connected to the array substrate. At least one electronic component is disposed on each of the circuit substrate units, wherein the electronic components are electrically connected to the circuit substrate unit. Forming an encapsulant on the array substrate to cover the surface of the array substrate, the pads, and the electronic components. A singulation step is performed to cut the array substrate and the pads along the dicing lines. A first side surface of each of the pads is exposed to the outside of the encapsulant, and a first side surface of each of the pads is aligned with a second side surface of the encapsulant.

In an embodiment of the present invention, the method for fabricating the package structure further includes: after performing the singulation step, soldering the plurality of light emitting elements respectively on the first side surface of the pad exposed to the outside of the package glue.

In an embodiment of the invention, the light-emitting element comprises a light-emitting diode.

In an embodiment of the invention, the light emitting diode is a surface mount device (SMD) light emitting diode.

In an embodiment of the invention, the light emitting diode includes a side-emitting type light emitting diode. The side-emitting type light-emitting diode has a light-emitting surface, and the light-emitting surface faces the outside of the package rubber.

In an embodiment of the invention, the at least one electronic component comprises a flash memory chip and a control wafer.

In an embodiment of the invention, the method for fabricating the package structure further includes: forming a plurality of connection pads on a bottom surface of the array substrate relative to the surface before performing the singulation step.

In an embodiment of the invention, the pad is a plurality of surface-adhesive pads.

In an embodiment of the invention, the material of the pad comprises solder.

In one embodiment of the invention, each of the pads is formed by a solder layer and a metal block soldered thereto.

In an embodiment of the invention, the material of the metal block comprises aluminum.

Based on the above, since the package structure of the present invention has a design in which one side surface of the pad is exposed to the outside of the package rubber, the electronic component can be directly soldered to the side surface of the pad exposed to the outside of the package rubber through surface adhesion technology. The applicability of the package structure of the present invention can be effectively improved. Furthermore, the package structure of the present invention is formed by sequentially forming pads, arranging electronic components, forming an encapsulant, and then performing a singulation process to simultaneously form a plurality of package structures. Therefore, the manufacturing method of the package structure of the present invention is suitable for mass production, and can effectively reduce production costs and improve production efficiency.

The above described features and advantages of the present invention will be more apparent from the following description.

1A to 1C are schematic top views of a method of fabricating a package structure according to the present invention. According to the manufacturing method of the package structure of the present embodiment, first, referring to FIG. 1A, an array substrate 10 having a surface 12 and a plurality of circuit substrate units 110a is provided, wherein each of the circuit substrate units 110a is formed by a plurality of cutting lines L. Defined. In addition, a plurality of connection pads 116 are formed on the bottom surface 14 of the array substrate 10 of the present embodiment with respect to the bottom surface 14 of the surface 12, and the connection pads 116 are electrically connected to the array substrate 10. Here, these connection pads 116 are, for example, gold fingers.

Next, referring to FIG. 1A, a plurality of pads 120 are formed on the surface 12 of the array substrate 10. The pads 120 are disposed between the adjacent two circuit substrate units 110a and arranged on the partial cutting lines L. Here, the pads 120 are electrically connected to the array substrate 10 . It should be noted that the present embodiment does not limit the number of pads 120 disposed between the two circuit substrates 110a, although only one pad is disposed between adjacent two circuit substrate units 110a in FIG. 1A. 120 or two pads 120. However, in other embodiments, the same number of pads 120 may be disposed between the two adjacent circuit board units 110a, or the number of pads 120 may be increased or decreased according to the needs of use. . In addition, in the embodiment, the pads 120 are a plurality of surface-adhesive pads, and the pads 120 are made of solder, for example.

Next, referring to FIG. 1B, at least one electronic component (only the electronic component 130a and the electronic component 130b are schematically shown) is disposed on each of the circuit substrate units 110a, wherein the electronic components 130a, 130b are electrically connected to the circuit substrate. Unit 110a. In this embodiment, the electronic components 130a are, for example, a control chip, and the electronic components 130b are, for example, a flash memory chip, which is not limited herein. The electronic component 130a and the electronic component 130b in each of the circuit substrate units 110a are electrically connected to each other through the circuit substrate unit 110a.

Thereafter, referring again to FIG. 1B, an encapsulant is formed on the 140 array substrate 10 to cover the surface 112 of the array substrate 110, the pads 120, and the electronic components 130a, 130b. Here, the encapsulant 140 does not cover the connection pads 116 on the bottom surface 14 of the array substrate 10.

Finally, referring to FIG. 1B and FIG. 1C, a singulation step is performed to cut the array substrate 10 and the pads 120 along the cutting lines L to form a plurality of independent package structures (only in FIG. 1C). A package structure 100a) is schematically illustrated. A first side surface 122 of each of the pads 120 is exposed to the outside of the encapsulant 140, and the first side surface 122 of each of the pads 120 is substantially aligned with a second side surface 142 of the encapsulant 140. The first side surface 122 exposed to the outside of the encapsulant 140 can be considered a contact. So far, the fabrication of the package structure 100a has been completed.

2A is a perspective view of the package structure of FIG. 1C. Fig. 2B is a schematic cross-sectional view taken along line I-I of Fig. 1C. 2C is a side elevational view of the package structure of FIG. 1C. Structurally, referring to FIG. 2A, FIG. 2B and FIG. 2C, the package structure 100a of the present embodiment includes a circuit substrate 110 (ie, the circuit substrate unit 110a), pads 120, the electronic components 130a and 130b, and the encapsulant 140. The circuit substrate 110 has an upper surface 112 (ie, a portion of the surface 12 of the array substrate 10), a lower surface 114 relative to the upper surface 112 (ie, a portion of the bottom surface 14 of the array substrate 10), and the connections disposed on the lower surface 114. Pad 116. The pad 120 is disposed on the upper surface 112 of the circuit substrate 110 and electrically connected to the circuit substrate 110. The electronic components 130a and 130b are disposed on the upper surface 112 of the circuit substrate 110 and electrically connected to the circuit substrate 110. The electronic component 130a is, for example, a control chip, and the electronic component 130b is, for example, a flash memory chip, and the connection pads 116 are electrically connected to the electronic components 130a and 130b through the circuit substrate 110. The encapsulant 140 covers the upper surface 112 of the circuit substrate 110, the pads 120, and the electronic components 130a, 130b, and exposes the first side surface 122 of the pad 120. In particular, the second side surface 142 of the encapsulant 140 is substantially aligned with the first side surface 122 of the pad 120, and the edge of the encapsulant 140 is substantially aligned with the edge of the circuit substrate 110.

Since the first side surface 122 of the pad 120 of the package structure 100a of the embodiment is exposed to the encapsulant 140, the electronic component (for example, the illuminating component) can be directly transmitted through the surface adhesion technology in the application of the subsequent product. Solder to the first side surface 122 (ie, the contact) of the pad 120 exposed to the outside of the encapsulant 140. That is, heating the solder pad 120 can directly bond the electronic component to the pad 120. Therefore, the package structure 100a of the present embodiment does not need to be coated with solder first, and the convenience of the subsequent process of the package structure 100a can be effectively improved, as compared with the conventional soldering of the electronic component to the pad. Moreover, since the pad 120 of the present invention is a surface-adhesive type pad, the production cost of the package structure 100a can be effectively reduced and the production efficiency can be improved. In addition, in this embodiment, the pads 120 are sequentially formed, the electronic components 130a and 130b are disposed, and the encapsulant 140 is formed on the array substrate 10 (please refer to FIG. 1A or FIG. 1B), and then the singulation step is performed. The plurality of first side surfaces 122 having the pads 120 are exposed to the package structure 100a outside the encapsulant 140. Therefore, the manufacturing method of the package structure 100a of the present embodiment is suitable for mass production.

In addition, the present invention does not limit the material and shape of the pad 120. In other embodiments, please refer to FIG. 2C and FIG. 2D simultaneously. In the package structure 100c, the pad 120c is a surface-adhesive pad, wherein the pad 120c is soldered by a solder layer 124 and a metal block 126 is soldered thereon. The material of the metal block 126 is, for example, aluminum, but is not limited thereto. Since the pad 120c is composed of the solder layer 124 and the metal block 126, it may have a larger bonding area, that is, the first side surface 127 of the solder layer 124 and the metal block 126 exposed to the outside of the encapsulant 140 may have a larger Area. Therefore, in the application of the subsequent product, when the electronic component (for example, the light-emitting component) is directly soldered to the first side surface 127 (ie, the contact) of the pad 120c exposed outside the encapsulant 140 by surface adhesion technology. It can have a better bonding force.

3A is a perspective view of a package structure according to another embodiment of the present invention. 3B is a side elevational view of the package structure of FIG. 3A. The same reference numerals are used to denote the same or similar elements, and the description of the same technical content is omitted. For the description of the omitted portions, reference may be made to the foregoing embodiments, and the detailed description is not repeated herein. It must be noted here that, for convenience of explanation, some of the members are omitted in FIG. 3B.

Referring to FIG. 3A and FIG. 3B, the package structure 100b of the present embodiment is similar to the package structure 100a of the foregoing embodiment, but the main difference between the two is that the package structure 100b of the embodiment further includes a light-emitting element 150, and The package structure 100b has a first pad 120a and a second pad 120b. In detail, the encapsulant 140 exposes a third side surface 122a of the first pad 120a and a fourth side surface 122b of the second pad 120b, and the light emitting element 150 has a first electrode portion 152 and a second electrode. The portion 154 and the first electrode portion 152 and the second electrode portion 154 of the light emitting element 150 are soldered to the third side surface 122a of the first pad 120a and the fourth side surface 122b of the second pad 120b, respectively. In addition, the light emitting device 150 is electrically connected to the electronic components 130a and 130b through the first pad 120a, the second pad 120b, and the circuit substrate 110. Therefore, when the electronic component 130a (for example, a control chip) is driven, the light-emitting component 150 is also driven to emit light to indicate that the package structure 100a is in use to facilitate the user to determine whether the package structure 100b is in use. Using.

Here, the light-emitting element 150 is, for example, a surface mount device (SMD) light-emitting diode. Therefore, the first electrode portion 152 and the second electrode portion 154 of the light-emitting element 150 can be directly soldered to the third side of the first pad 120a exposed to the outside of the encapsulant 150 by surface mount technology (SMT). The surface 122a and the fourth side surface 122b of the second pad 120b can effectively improve the manufacturing efficiency of the package structure 100b. Furthermore, the light-emitting element 150 can also be a side-emitting type light-emitting diode having a light-emitting surface 156 and the light-emitting side 156 facing away from the encapsulant 140. Therefore, the light emitted by the light-emitting element 150 can be directly emitted parallel to the second side surface 142 of the encapsulant 140 without penetrating the encapsulant 140, and can have better light utilization efficiency. In addition, in other embodiments, the light-emitting element 150 can also be protected by a protective component (not shown), such as a cover (not shown), which is not limited herein.

In summary, since the package structure of the present invention has a design in which one side surface of the pad is exposed to the outside of the package rubber, the electronic component can be directly soldered to the side surface of the pad exposed to the outside of the package rubber through surface adhesion technology. In addition, the applicability of the package structure of the present invention can be effectively improved. Compared with the prior art, it is necessary to apply solder to solder the electronic component to the pad. The package structure of the present invention does not need to be coated with solder first, which can effectively improve the convenience of the subsequent process and can effectively reduce the production cost and improve the production. effectiveness. Since the pad of the present invention is a surface-adhesive type pad, the production cost of the package structure can be effectively reduced and the production efficiency can be improved. Furthermore, the package structure of the present invention is formed by sequentially forming pads, arranging electronic components, forming an encapsulant, and then performing a singulation process to simultaneously form a plurality of package structures. Therefore, the manufacturing method of the package structure of the present invention is suitable for mass production. In addition, the embodiment can display whether the package structure is in use through the light emitting element, so as to facilitate the user to use the package structure of the present invention.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.

10. . . Array substrate

12. . . surface

14. . . Bottom surface

100a, 100b, 100c. . . Package structure

110. . . Circuit substrate

110a. . . Circuit substrate unit

112. . . Upper surface

114. . . lower surface

116. . . Connection pad

120, 120c. . . Pad

120a. . . First pad

120b. . . Second pad

122, 127. . . First side surface

122a. . . Third side surface

122b. . . Fourth side surface

124. . . Solder layer

126. . . Metal block

130a, 130b. . . Electronic component

140. . . Encapsulant

142. . . Second side surface

150. . . Light-emitting element

152. . . First electrode portion

154. . . Second electrode portion

156. . . Glossy surface

L. . . Cutting line

1A to 1C are schematic top views of a method of fabricating a package structure according to the present invention.

2A is a perspective view of the package structure of FIG. 1C.

Fig. 2B is a schematic cross-sectional view taken along line I-I of Fig. 1C.

2C is a side elevational view of the package structure of FIG. 1C.

2D is a cross-sectional view of a package structure in accordance with an embodiment of the present invention.

2E is a side elevational view of the package structure of FIG. 2D.

3A is a perspective view of a package structure according to another embodiment of the present invention.

3B is a side elevational view of the package structure of FIG. 3A.

100a. . . Package structure

110. . . Circuit substrate

112. . . Upper surface

116. . . Connection pad

120. . . Pad

122. . . First side surface

130a, 130b. . . Electronic component

140. . . Encapsulant

142. . . Second side surface

Claims (20)

A package structure comprising: a circuit substrate having an upper surface; at least one pad disposed on the upper surface of the circuit substrate and electrically connected to the circuit substrate; at least one electronic component disposed on the circuit substrate On the upper surface, and electrically connected to the circuit substrate; and an encapsulant covering the upper surface of the circuit substrate, the pad and the electronic component, and exposing a first side surface of the pad Wherein a second side surface of the encapsulant is aligned with the first side surface of the pad. The package structure of claim 1, further comprising a light-emitting element disposed on the first side surface of the package exposed by the package, and the light-emitting element is transmitted through the pad and the circuit substrate And electrically connected to the electronic component. The package structure of claim 2, wherein the at least one pad comprises a first pad and a second pad, the encapsulant exposing a third side surface of the first pad and the a fourth side surface of the second pad, the light emitting element has a first electrode portion and a second electrode portion, and the first electrode portion and the second electrode portion are respectively soldered to the third side surface and the first Four side surfaces. The package structure of claim 3, wherein the light-emitting element comprises a light-emitting diode. The package structure of claim 4, wherein the light emitting diode is a surface-adhesive light-emitting diode. The package structure of claim 4, wherein the light emitting diode comprises a side light emitting type light emitting diode, the side light emitting type light emitting diode has a light emitting surface, and the light emitting surface faces the encapsulant outer. The package structure of claim 1, wherein an edge of the encapsulant is aligned with an edge of the circuit substrate. The package structure of claim 1, wherein the at least one electronic component comprises a flash memory chip and a control wafer. The package structure of claim 1, wherein the circuit substrate further has a lower surface opposite to the upper surface and a plurality of connection pads disposed on the lower surface, wherein the connection pads pass through the circuit substrate Electrically connected to the electronic component. A method for fabricating a package structure includes: providing an array substrate having a surface and a plurality of circuit substrate units, wherein each circuit substrate unit is defined by a plurality of cutting lines; forming a plurality of pads on the array On the surface of the substrate, the pads are disposed between the two adjacent circuit substrate units and are arranged on the plurality of cutting lines, the pads are electrically connected to the array substrate; and at least one electronic component is disposed on the substrate Each of the circuit substrate units, wherein the electronic components are electrically connected to the circuit substrate unit; forming an encapsulant on the array substrate to cover the surface of the array substrate, the pads, and the electronic components And performing a singulation step of cutting the array substrate and the pads along the cutting lines, wherein a first side surface of each of the pads is exposed to the outside of the encapsulant, and each of the The first side surface of the pad is aligned with a second side surface of the encapsulant. The method for fabricating a package structure according to claim 10, further comprising: after performing the singulation step, soldering the plurality of light-emitting elements respectively to the first portions of the pads exposed to the package glue On the side surface. The method of fabricating a package structure according to claim 11, wherein the light-emitting element comprises a light-emitting diode. The method for fabricating a package structure according to claim 12, wherein the light emitting diode is a surface-adhesive light-emitting diode. The method for fabricating a package structure according to claim 12, wherein the light emitting diode comprises a side light emitting type light emitting diode, the side light emitting type light emitting diode has a light emitting surface, and the light emitting surface is oriented The encapsulant is external to the body. The method of fabricating a package structure according to claim 10, wherein the at least one electronic component comprises a flash memory chip and a control wafer. The method for fabricating a package structure according to claim 10, further comprising: forming a plurality of connection pads on a bottom surface of the array substrate relative to the surface before performing the singulation step. The method for fabricating a package structure according to claim 10, wherein the pads are a plurality of surface-adhesive pads. The method for fabricating a package structure according to claim 17, wherein the materials of the pads comprise solder. The method of fabricating a package structure according to claim 17, wherein each of the pads is formed by a solder layer and a metal block soldered thereon. The method for fabricating a package structure according to claim 19, wherein the material of the metal block comprises aluminum.