TW201305579A - High frequency calibration device for RF measurement - Google Patents

High frequency calibration device for RF measurement Download PDF

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TW201305579A
TW201305579A TW100127012A TW100127012A TW201305579A TW 201305579 A TW201305579 A TW 201305579A TW 100127012 A TW100127012 A TW 100127012A TW 100127012 A TW100127012 A TW 100127012A TW 201305579 A TW201305579 A TW 201305579A
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probe
high frequency
correction
measuring
measurement
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TW100127012A
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TWI431296B (en
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Tzyy-Sheng Horng
Kuan-Chung Lu
Sung-Mao Wu
Sheng-Wei Guan
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Univ Nat Sun Yat Sen
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Abstract

A high frequency calibration device for RF measurement comprises a measurement machine having a carrier, a first arm and a second arm. The carrier can support a device under test. The first arm has a first probe and the second arm has a second probe. The first and second arms are disposed correspondingly to the two ends of the carrier. The first and second probes move close to or away from the carrier in a direction. A high frequency measurement system has two cables are connected to the first and second probes respectively.

Description

應用於射頻量測之高頻校正裝置High frequency correction device for radio frequency measurement

本發明係關於一種高頻校正裝置,特別是一種應用於射頻量測之高頻校正裝置。The present invention relates to a high frequency correcting device, and more particularly to a high frequency correcting device for use in radio frequency measurement.

近年來,隨著科技的發展,積體電路設計已逐漸走向3D堆疊式的高效能晶片,為使該3D堆疊之電路能有垂直方向的電性連接,習知有如直通矽晶穿孔(Through Silicon Via,TSV)與金屬穿孔(Plated Through Hole,PTH)等垂直互連線(vertical interconnect)之電性連接技術,而隨著頻率逐漸攀升以及數位訊號傳輸速度不斷的加快,具有垂直互連線之元件的高頻特性分析成為一門重要的課題,為使具有垂直互連線之元件能正常運作,必須要有更準確與更快速的垂直互連線元件之量測系統。In recent years, with the development of technology, the integrated circuit design has gradually moved toward the 3D stacked high-performance chip. In order to make the 3D stacked circuit have a vertical electrical connection, it is known as a through-silicon via (Through Silicon). Via, TSV) and the vertical interconnection of vertical through-holes (PTH), and the vertical interconnects as the frequency increases and the digital signal transmission speed increases. The analysis of the high-frequency characteristics of components has become an important issue. In order for components with vertical interconnects to function properly, it is necessary to have a more accurate and faster measurement system for vertical interconnect components.

針對一個具有垂直互連線之待測裝置(Device Under Test,DUT)進行高頻量測時,若不使用雙面量測技術,而欲使該待測裝置於共平面進行量測,需透過一個微帶線及二貫孔來將異面端轉為共平面,使該信號輸入埠與信號輸出埠能呈現於同一平面上。然而,該微帶線和貫孔本身亦具有高頻響應,為了讓該微帶線與貫孔所產生之寄生效應與該待測裝置之高頻響應有所區隔,除量測過程中必須加入一套複雜的去嵌化數學理論與技術,且使用去嵌化理論進行,也容易因微帶線之高頻特性擾動過大,造成貫孔的高頻效應無法有效被分離。此外,若需於晶圓上製做去嵌化套欠待測裝置上耗費面積製造測試套件,不符合經濟效益。For high-frequency measurement of a Device Under Test (DUT) with a vertical interconnect, if you do not use the double-sided measurement technology, and you want to measure the device under test in the common plane, you need to pass A microstrip line and two through holes are used to convert the opposite end to a coplanar plane, so that the signal input 埠 and the signal output 埠 can be presented on the same plane. However, the microstrip line and the through hole itself also have a high frequency response, in order to distinguish the parasitic effect generated by the microstrip line and the through hole from the high frequency response of the device to be tested, in addition to the measurement process Adding a complex set of de-embedding mathematical theories and techniques, and using the de-embedding theory, is also easy to be disturbed by the high-frequency characteristics of the microstrip line, causing the high-frequency effects of the through-holes to be effectively separated. In addition, it is not economical to manufacture a test kit for the area of the de-embedded device under test on the wafer.

習知量測方法中,在量測待測裝置的高頻響應之前,需透過一校正板執行高頻校正(Calibration)的動作。請參閱第1圖所示,係揭示一種射頻量測系統9(例如美國公告第6,396,296號專利案之發明),該量測系統9欲進行高頻量測前,首先必須使該二探針92之尖端位於同一側,透過一傳統共平面校正板81進行高頻校正。待校正步驟完成後,如第2圖所示,再將一待測裝置82垂直置於該量測系統9中,並利用轉動探針操作器91之方式改變二探針92之方向,使該二探針92之方向分別針對該待測裝置82之二端進行量測。然而,在校正完畢至射頻量測的過程中,轉動該探針操作器91的動作,會移動到該量測系統9之高頻傳輸纜線(Cable),使得高頻校正精準度產生誤差。In the conventional measurement method, before the high-frequency response of the device to be tested is measured, a high-frequency calibration operation is performed through a calibration plate. Referring to Fig. 1, there is disclosed a radio frequency measurement system 9 (e.g., the invention of U.S. Patent No. 6,396,296), which is required to first make the two probes 92 before performing the high frequency measurement. The tips are on the same side and are frequency corrected by a conventional coplanar correction plate 81. After the step of correcting is completed, as shown in FIG. 2, a device to be tested 82 is vertically placed in the measuring system 9, and the direction of the two probes 92 is changed by rotating the probe operator 91. The directions of the two probes 92 are respectively measured for the two ends of the device under test 82. However, during the calibration to the radio frequency measurement, the action of rotating the probe operator 91 moves to the high frequency transmission cable of the measurement system 9, causing an error in the high frequency correction accuracy.

本發明之主要目的係提供一種應用於射頻量測之高頻校正裝置,該校正裝置能應用於具有垂直互連線之待測裝置,且該待測裝置不需額外增加測試套件。The main object of the present invention is to provide a high frequency correcting device for radio frequency measurement, which can be applied to a device under test having a vertical interconnect, and the device to be tested does not require an additional test kit.

本發明之次要目的係提供一種應用於射頻量測之高頻校正裝置,該校正裝置能應用於具有垂直互連線之待測裝置,並提供較高之量測精準度。A secondary object of the present invention is to provide a high frequency correction device for use in radio frequency measurement, which can be applied to a device under test having vertical interconnection lines and provides a higher measurement accuracy.

為達到前述發明目的,本發明所運用之技術手段包含有:一種應用於射頻量測之高頻校正裝置,係包含:一量測機台,具有一載台、一第一量測臂及一第二量測臂,該載台供承載一待測裝置,該第一量測臂具有一第一探針,該第二量測臂具有一第二探針,該第一量測臂與第二量測臂相對設置於該載台之兩端,各該第一探針與第二探針分別沿一直線軌跡移動以接近或遠離該載台;一高頻量測裝置,具有二高頻傳輸纜線,該二高頻傳輸纜線分別連接該第一探針及第二探針。In order to achieve the foregoing object, the technical means used in the present invention include: a high frequency calibration device for radio frequency measurement, comprising: a measuring machine having a loading platform, a first measuring arm and a a second measuring arm for carrying a device to be tested, the first measuring arm having a first probe, the second measuring arm having a second probe, the first measuring arm and the first measuring arm Two measuring arms are oppositely disposed at two ends of the stage, and each of the first probe and the second probe respectively move along a straight track to approach or away from the stage; a high frequency measuring device has two high frequency transmissions a cable, the two high frequency transmission cables are respectively connected to the first probe and the second probe.

本發明之應用於射頻量測之高頻校正裝置,其中,該高頻訊號量測裝置為一網路分析儀。The high frequency calibration device for radio frequency measurement according to the present invention, wherein the high frequency signal measurement device is a network analyzer.

本發明之應用於射頻量測之高頻校正裝置,其中,該網路分析儀具有一穿透校正器。The high frequency correction device for radio frequency measurement according to the present invention, wherein the network analyzer has a penetration corrector.

本發明之應用於射頻量測之高頻校正裝置,其中,該第一探針的移動軌跡與載台朝向第一探針的表面垂直。The high frequency correction device for radio frequency measurement according to the present invention, wherein the movement path of the first probe is perpendicular to a surface of the stage toward the first probe.

本發明之應用於射頻量測之高頻校正裝置,其中,該第二探針的移動軌跡與載台朝向第二探針的表面垂直。The high frequency correction device for radio frequency measurement according to the present invention, wherein the movement path of the second probe is perpendicular to a surface of the stage toward the second probe.

為讓本發明之上述及其他目的、特徵及優點能更明顯易懂,下文特舉本發明之較佳實施例,並配合所附圖式,作詳細說明如下:本發明所述之「互易性(reciprocity)」,係指對於一雙埠網路而言,若其S參數的S12等於S21,則該雙埠網路具有互易性。由於其為本領域之人士可輕易理解,因此在此不多加敘述。The above and other objects, features and advantages of the present invention will become more <RTIgt; Reciprocity means that for a pair of networks, if the S 12 of the S parameter is equal to S 21 , the dual network has reciprocity. Since it is easily understood by those skilled in the art, it will not be described here.

本發明所述之「待測裝置(Device Under Test,DUT)」,係指一具有垂直互連線設計之電路,且該電路之輸入埠與輸出埠具有互易性。The "Device Under Test (DUT)" as used in the present invention refers to a circuit having a vertical interconnect design, and the input port of the circuit has reciprocity with the output port.

請參照第3圖所示,本發明應用於射頻量測之高頻校正裝置較佳實施例,係包含一量測機台1及一高頻量測裝置2,該量測機台1透過一高頻傳輸纜線與該高頻量測裝置2連結。Referring to FIG. 3, the preferred embodiment of the present invention is applied to a high frequency calibration device for radio frequency measurement, comprising a measuring machine 1 and a high frequency measuring device 2, wherein the measuring machine 1 transmits a The high frequency transmission cable is coupled to the high frequency measuring device 2.

該量測機台1具有一載台11、一第一量測臂12及一第二量測臂13。該載台11可供穩固承載一待測裝置。The measuring machine 1 has a loading platform 11, a first measuring arm 12 and a second measuring arm 13. The stage 11 can be used to stably carry a device to be tested.

該第一量測臂12及第二量測臂13分別配置於該載台11之相對二側,例如位在該載台11的上下二端(依圖面而言),該第一量測臂12具有一第一探針121,該第二量測臂13具有一第二探針131,該第一探針121及第二探針131可由相對之二方向指向該載台11,該第一探針121的移動軌跡與載台11朝向該第一探針121的表面垂直,該第二探針131的移動軌跡與載台11朝向該第二探針131的表面垂直,並於該載台11之相對二端抵接該載台11上所置放之待測裝置,使該第一探針121與第二探針131能對該待測裝置進行量測或實施校正動作。The first measuring arm 12 and the second measuring arm 13 are respectively disposed on opposite sides of the stage 11, for example, at the upper and lower ends of the stage 11 (in terms of the drawing), the first measurement The arm 12 has a first probe 121, and the second measuring arm 13 has a second probe 131. The first probe 121 and the second probe 131 can be directed to the stage 11 by two opposite directions. The movement trajectory of a probe 121 is perpendicular to the surface of the stage 11 facing the first probe 121, and the movement trajectory of the second probe 131 is perpendicular to the surface of the stage 11 facing the second probe 131, and The opposite ends of the stage 11 abut the device to be tested placed on the stage 11, so that the first probe 121 and the second probe 131 can measure or perform a correcting action on the device to be tested.

該高頻量測裝置2具有二高頻傳輸纜線21、22,該二高頻傳輸纜線21、22分別連接該第一探針121及第二探針131,該二高頻傳輸纜線21、22,可將第一量測臂12之第一探針121與該第二量測臂13之第二探針131所感知的資料,傳送至該該高頻量測裝置2。該高頻量測裝置2用於射頻量測,較佳為一網路分析儀,並設有一校正軟體,使該量測機台1得以透過該校正軟體進行高頻校正。該校正軟體可提供一短路、一開路及一負載校正,並具有一穿透校正器進行穿透校正。The high frequency measuring device 2 has two high frequency transmission cables 21 and 22, and the two high frequency transmission cables 21 and 22 are respectively connected to the first probe 121 and the second probe 131. The two high frequency transmission cables 21, 22, the data sensed by the first probe 121 of the first measuring arm 12 and the second probe 131 of the second measuring arm 13 can be transmitted to the high-frequency measuring device 2. The high-frequency measuring device 2 is used for radio frequency measurement, preferably a network analyzer, and is provided with a correction software, so that the measuring machine 1 can perform high-frequency correction through the correction software. The correction software provides a short circuit, an open circuit and a load correction, and has a penetration corrector for penetration correction.

請參照第4圖所示,本發明應用於射頻量測之高頻校正裝置進行校正操作時,需藉由該量測機台1結合該高頻量測裝置2,並搭配一校正板3實施校正。該校正步驟係包含一機台選取步驟S1,係選定具有二量測臂之量測機台;一探針選取步驟S2,根據該待測裝置決定該量測機台之探針的種類;一校正板選取步驟S3,根據該探針找出對應之校正板;一參數輸入步驟S4,輸入該探針所對應之一短路參數、一開路參數和一負載參數;及一校正步驟S5,係進行該量測機台之高頻校正。Referring to FIG. 4, when the present invention is applied to a high-frequency correction device for radio frequency measurement, the high-frequency measurement device 2 is combined with the calibration device 3 and implemented with a calibration plate 3. Correction. The correcting step includes a machine selecting step S1, selecting a measuring machine having two measuring arms; a probe selecting step S2, determining a type of the probe of the measuring machine according to the device to be tested; The calibration board selects step S3, and finds a corresponding calibration board according to the probe; a parameter input step S4, inputting one short-circuit parameter, an open-circuit parameter and a load parameter corresponding to the probe; and a correcting step S5, performing The high frequency correction of the measuring machine.

請參照第3、4圖所示,該機台選取步驟S1,較佳選定本實施例之量測機台1,該量測機台1適用於射頻量測,且具有可承置該校正板3之載台11,該量測機台1之第一量測臂12與第二量測臂13相對設置於該載台11之二端,且該第一量測臂12與第二量測臂13可由相對之二方向朝向載台11移動,使該量測機台1進行校正動作或射頻量測時,該第一探針121與第二探針131可由相對二端抵接校正板3或待測裝置。Referring to FIG. 3 and FIG. 4, the machine selects step S1, and preferably selects the measuring machine 1 of the embodiment. The measuring machine 1 is suitable for radio frequency measurement and has the correcting plate. The first measuring arm 12 and the second measuring arm 13 of the measuring machine 1 are disposed opposite to the two ends of the loading table 11 , and the first measuring arm 12 and the second measuring unit When the measuring device 1 performs the correcting action or the radio frequency measurement, the first probe 121 and the second probe 131 can abut the correcting plate 3 from the opposite ends. Or the device under test.

請再參照第3、4圖所示,該探針選取步驟S2,係根據該待測裝置之類型,決定該量測機台1之第一探針121與第二探針131種類。必須注意的是,本發明之高頻校正方法係針對具有垂直互連線和互易性的待測裝置。該第一探針121與第二探針131的種類係根據該待測裝置之輸入埠和輸出埠的信號組態,以及該信號組態的間距(pitch)決定。詳言之,該待測裝置的輸入埠和輸出埠可以是G-S(Ground-Signal)、G-S-G或G-S-G-S-G的信號組態,而該信號組態的間距即為G-S、G-S-G或G-S-G-S-G各兩相鄰腳位之間的距離。該信號組態的間距可以分為100至250μm的短間距,以及250至1250μm的長間距。在本實施例中,本發明選擇待測裝置之輸入埠和輸出埠為G-S-G的信號組態,以及250μm的間距,同時,該第一探針121與第二探針131之種類係選擇為對應G-S-G信號組態之具有G-S-G三端接腳的探針。然而,本發明之目標待測裝置並不以此為限。Referring to FIG. 3 and FIG. 4 again, the probe selects step S2, and determines the types of the first probe 121 and the second probe 131 of the measuring machine 1 according to the type of the device to be tested. It must be noted that the high frequency correction method of the present invention is directed to a device under test having vertical interconnects and reciprocity. The types of the first probe 121 and the second probe 131 are determined according to the signal configuration of the input port and the output port of the device under test, and the pitch of the signal configuration. In detail, the input port and output port of the device under test may be a signal configuration of GS (Ground-Signal), GSG or GGSSG, and the spacing of the signal configuration is two adjacent legs of GS, GSG or GGSSG. The distance between the bits. The pitch of the signal configuration can be divided into short pitches of 100 to 250 μm and long pitches of 250 to 1250 μm. In this embodiment, the present invention selects the input 埠 and output 埠 of the device under test to be a signal configuration of the GSG, and a pitch of 250 μm, and at the same time, the types of the first probe 121 and the second probe 131 are selected to correspond. GSG signal configuration probe with GSG three-terminal pin. However, the target device to be tested of the present invention is not limited thereto.

請參閱第3至5圖所示,該校正板選取步驟S3,係根據該第一探針121與第二探針131之種類找出對應之校正板3。詳言之,在本實施例中,根據探針G-S-G的接腳以及其250μm的間距,決定適合的校正板3。請參閱第4圖所示,其係本發明校正板選取步驟S3中,對應於G-S-G信號組態所決定之校正板3的局部示意圖。該校正板3具有至少二校正圖形31和32,校正圖形31具有一第一抵接部311、一第二抵接部312和一第三抵接部313。同理,校正圖形32具有一第一抵接部321、一第二抵接部322和一第三抵接部323。Referring to FIGS. 3 to 5, the calibration plate selects step S3, and the corresponding calibration plate 3 is found according to the types of the first probe 121 and the second probe 131. In detail, in the present embodiment, the appropriate correction plate 3 is determined based on the pins of the probe G-S-G and the pitch of 250 μm. Please refer to FIG. 4, which is a partial schematic diagram of the calibration plate 3 determined in the step S3 of the calibration plate of the present invention corresponding to the G-S-G signal configuration. The calibration plate 3 has at least two correction patterns 31 and 32. The correction pattern 31 has a first abutting portion 311, a second abutting portion 312 and a third abutting portion 313. Similarly, the correction pattern 32 has a first abutting portion 321 , a second abutting portion 322 , and a third abutting portion 323 .

請再參閱第3、4圖所示,該參數輸入步驟S4,係將該第一探針121與第二探針131所對應之一短路參數、一開路參數和一負載參數輸入該高頻量測裝置2。該短路、開路及負載參數可根據該第一探針121與第二探針131的種類,查詢得到相對應的數值,在本實施例中,該第一探針121代表量測時之連接輸入埠,該第二探針131代表量測時之連接輸出埠,當欲進行輸入埠和輸出埠之校正時,係輸入該第一探針121和第二探針131所對應之各項參數值。Referring to FIG. 3 and FIG. 4 again, the parameter input step S4 is to input a short circuit parameter, an open circuit parameter and a load parameter corresponding to the first probe 121 and the second probe 131 into the high frequency amount. Measuring device 2. The short circuit, the open circuit and the load parameter can be queried according to the type of the first probe 121 and the second probe 131. In the embodiment, the first probe 121 represents the connection input during the measurement.第二, the second probe 131 represents the connection output 量 when measuring, and when the correction of the input 埠 and the output 欲 is to be performed, the parameter values corresponding to the first probe 121 and the second probe 131 are input. .

請再參閱第3至5圖所示,該校正步驟S5,係利用該第一探針121與第二探針131執行該待測裝置之一輸入埠和一輸出埠個別的短路(Short)、開路(Open)和負載(Load)校正,以及利用該高頻量測裝置2執行該輸入埠和輸出埠之間的一穿透(Thru)參數校正。Referring to FIG. 3 to FIG. 5 again, the correcting step S5 is performed by using the first probe 121 and the second probe 131 to perform an input short circuit and an output short circuit (Short) of the device to be tested. Open and load corrections are performed, and a high-voltage measurement device 2 performs a penetration (Thru) parameter correction between the input and output ports.

首先進行輸入埠的短路校正,在該校正項目時,需將該第一探針121與第二探針131抵接該校正板3之第一校正圖形31。抵接的方式是該第一探針121之G-S-G三端需分別接觸該第一校正圖形31之第一抵接部311、第二抵接部312和第三抵接部313。據此,可操作該高頻量測裝置2的校正軟體進行短路校正。接著進行輸入埠的負載校正,在此校正項目時,需將該第一探針121改以抵接該校正板3之第二校正圖形32。抵接的方式是該第一探針121之G-S-G三端需分別接觸該第二校正圖形32之第一抵接部321、第二抵接部322和第三抵接部323。據此,可操作該高頻量測裝置2的校正軟體進行負載校正。最後進行輸入埠的開路校正,在此校正項目時,需將該第一探針121浮接(floating),亦即不抵接任何校正圖形。據此,可操作該高頻量測裝置2的校正軟體進行開路校正。First, the short correction of the input 埠 is performed. In the correction item, the first probe 121 and the second probe 131 are brought into contact with the first correction pattern 31 of the correction plate 3. The abutting manner is that the three ends of the G-S-G of the first probe 121 respectively contact the first abutting portion 311, the second abutting portion 312 and the third abutting portion 313 of the first correcting pattern 31. Accordingly, the correction software of the high-frequency measuring device 2 can be operated to perform short-circuit correction. Next, the load correction of the input port is performed. When the item is corrected, the first probe 121 needs to be changed to abut the second correction pattern 32 of the correction plate 3. The abutting manner is that the G-S-G three ends of the first probe 121 respectively contact the first abutting portion 321 , the second abutting portion 322 and the third abutting portion 323 of the second correcting pattern 32 . According to this, the correction software of the high-frequency measuring device 2 can be operated to perform load correction. Finally, the open circuit correction of the input port is performed. When the item is corrected, the first probe 121 needs to be floated, that is, it does not abut any correction pattern. Accordingly, the correction software of the high-frequency measuring device 2 can be operated to perform open circuit correction.

至此,本發明之校正步驟S5已經完成待測裝置輸入埠的短路、開路和負載校正。接著執行待測裝置輸入埠的短路、開路和負載校正。透過移動該載台11上之校正板3,使該校正板3能與該待測裝置輸出埠的短路、開路和負載進行同樣的校正。據此,本發明之校正步驟S5可完成待測裝置輸入埠和輸出埠兩者的短路、開路和負載校正。So far, the correction step S5 of the present invention has completed the short circuit, open circuit and load correction of the input port of the device under test. Then, short circuit, open circuit and load correction of the input port of the device under test are performed. By moving the correction plate 3 on the stage 11, the correction plate 3 can be corrected in the same manner as the short circuit, open circuit and load of the output of the device under test. Accordingly, the correcting step S5 of the present invention can perform short circuit, open circuit and load correction for both the input port and the output port of the device under test.

本發明之校正步驟S5的最後一個校正項目係進行待測裝置輸入埠和輸出埠之間的穿透校正。校正的方式係操作該高頻量測裝置2的校正軟體進行一未知穿透參數(unknown thru)的校正。此時,該待測裝置輸入埠和輸出埠之間的穿透參數(例如時間延遲(time delay)和功率損失(power loss))可透過該高頻量測裝置2的穿透校正器(Adapter)所計算而得。至此,本發明之高頻校正方法係全部完成。The last correction item of the correction step S5 of the present invention performs the penetration correction between the input port and the output port of the device under test. The correction is performed by operating the correction software of the high-frequency measuring device 2 to perform an unknown thru correction. At this time, the penetration parameter (for example, time delay and power loss) between the input device and the output port of the device under test can pass through the penetration corrector of the high-frequency measuring device 2 (Adapter). ) calculated. So far, the high frequency correction method of the present invention has been completed.

在本發明之高頻校正完成之後,由於該第一探針121及第二探針131之尖端分別由上下二端(依圖面而言)指向載台11,因此可將該校正板3移除,並將待測裝置放置於載台11之上,進行後續待測裝置相關的高頻測試。依照本發明之高頻校正裝置,該第一探針121及第二探針131不需旋轉90度,可避免因該第一探針12及第二探針13的旋轉而移動高頻傳輸纜線21、22,進而影響高頻校正精準度的缺點。After the high frequency correction of the present invention is completed, since the tips of the first probe 121 and the second probe 131 are respectively directed to the stage 11 by the upper and lower ends (in terms of the drawing), the correction plate 3 can be moved. In addition, the device to be tested is placed on the stage 11 to perform high frequency testing related to the device to be tested. According to the high-frequency calibration device of the present invention, the first probe 121 and the second probe 131 do not need to be rotated by 90 degrees, and the high-frequency transmission cable can be prevented from moving due to the rotation of the first probe 12 and the second probe 13. Lines 21, 22, in turn, affect the shortcomings of high frequency correction accuracy.

相較於習知需要在待測裝置上另行開設微帶線和垂直互連線的貫孔將異端面轉為共平面,因而需要使用複雜的去嵌化計算與耗費面積製作測試套件的缺點,本發明之高頻校正裝置可以在待測裝置具有互易性的前提之下,不需要對待測裝置另行開設微帶線和垂直互連線之貫孔,因此可省去相關的去嵌化計算以及節省晶圓之面積。Compared with the conventional practice, it is necessary to open the through-holes of the microstrip line and the vertical interconnect line on the device to be tested to convert the different end faces into a coplanar plane, thus requiring the use of complicated de-embedding calculations and the cost-producing test suite. The high-frequency calibration device of the present invention can eliminate the need for the micro-belt line and the vertical interconnection line through the hole of the device to be tested under the premise of reciprocity of the device to be tested, thereby eliminating the relevant de-embedding calculation. And save the area of the wafer.

本發明運用於射頻量測之高頻校正裝置,該量測機台得以應用於具有垂直互連線之待測裝置,具有使該待測裝置不需額外增加測試套件之功效。The invention is applied to a high frequency calibration device for radio frequency measurement, and the measurement machine can be applied to a device to be tested having a vertical interconnection, and has the effect of making the device to be tested unnecessary to additionally add a test suite.

本發明運用於射頻量測之高頻校正裝置,該量測機台得以應用於具有垂直互連線之待測裝置,具有提供較高之量測精準度之功效。The invention is applied to a high frequency calibration device for radio frequency measurement, and the measurement machine can be applied to a device to be tested having a vertical interconnection line, and has the effect of providing a higher measurement accuracy.

雖然本發明已利用上述較佳實施例揭示,然其並非用以限定本發明,任何熟習此技藝者在不脫離本發明之精神和範圍之內,相對上述實施例進行各種更動與修改仍屬本發明所保護之技術範疇,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。While the invention has been described in connection with the preferred embodiments described above, it is not intended to limit the scope of the invention. The technical scope of the invention is protected, and therefore the scope of the invention is defined by the scope of the appended claims.

[本發明][this invention]

1...量測機台1. . . Measuring machine

11...載台11. . . Loading platform

12...第一量測臂12. . . First measuring arm

121...第一探針121. . . First probe

13...第二量測臂13. . . Second measuring arm

131...第二探針131. . . Second probe

2...高頻量測裝置2. . . High frequency measuring device

21...高頻傳輸纜線twenty one. . . High frequency transmission cable

22...高頻傳輸纜線twenty two. . . High frequency transmission cable

3...校正板3. . . Calibration board

31...第一校正圖形31. . . First correction pattern

311...第一抵接部311. . . First abutment

312...第二抵接部312. . . Second abutment

313...第三抵接部313. . . Third abutment

32...第二校正圖形32. . . Second correction pattern

321...第一抵接部321. . . First abutment

322...第二抵接部322. . . Second abutment

323...第三抵接部323. . . Third abutment

S1...機台選取步驟S1. . . Machine selection step

S2...探針選取步驟S2. . . Probe selection step

S3...校正板選取步驟S3. . . Calibration board selection step

S4...參數輸入步驟S4. . . Parameter input step

S5...校正步驟S5. . . Correction step

[習知][知知]

8...待測裝置8. . . Device under test

9...量測系統9. . . Measuring system

91...探針操作器91. . . Probe operator

92...探針92. . . Probe

第1圖:習知射頻量測系統架構校正示意圖。Figure 1: Schematic diagram of the conventional RF measurement system architecture correction.

第2圖:習知射頻量測系統架構量測示意圖。Figure 2: Schematic diagram of the conventional RF measurement system architecture measurement.

第3圖:本發明較佳實施例之量測系統架構示意圖。Figure 3 is a block diagram showing the architecture of a measurement system in accordance with a preferred embodiment of the present invention.

第4圖:本發明較佳實施例流程圖。Figure 4 is a flow chart of a preferred embodiment of the invention.

第5圖:本發明較佳實施例之校正板局部示意圖。Figure 5 is a partial schematic view of a calibration plate in accordance with a preferred embodiment of the present invention.

1...量測機台1. . . Measuring machine

11...載台11. . . Loading platform

12...第一量測臂12. . . First measuring arm

121...第一探針121. . . First probe

13...第二量測臂13. . . Second measuring arm

131...第二探針131. . . Second probe

2...高頻量測裝置2. . . High frequency measuring device

21...高頻傳輸纜線twenty one. . . High frequency transmission cable

22...高頻傳輸纜線twenty two. . . High frequency transmission cable

Claims (5)

一種應用於射頻量測之高頻校正裝置,係包含:一量測機台,具有一載台、一第一量測臂及一第二量測臂,該載台供承載一待測裝置,該第一量測臂具有一第一探針,該第二量測臂具有一第二探針,該第一量測臂與第二量測臂相對設置於該載台之兩端,各該第一探針與第二探針分別沿一直線軌跡移動以接近或遠離該載台;一高頻量測裝置,具有二高頻傳輸纜線,該二高頻傳輸纜線分別連接該第一探針及第二探針。A high frequency calibration device for radio frequency measurement comprises: a measuring machine having a loading platform, a first measuring arm and a second measuring arm, wherein the loading platform is configured to carry a device to be tested, The first measuring arm has a first probe, and the second measuring arm has a second probe. The first measuring arm and the second measuring arm are opposite to each other at the two ends of the loading platform. The first probe and the second probe respectively move along a straight track to approach or away from the stage; a high frequency measuring device has two high frequency transmission cables, and the two high frequency transmission cables are respectively connected to the first probe Needle and second probe. 依申請專利範圍第1項所述之高頻校正裝置,其中該高頻量測裝置為一網路分析儀。The high frequency calibration device according to claim 1, wherein the high frequency measurement device is a network analyzer. 依申請專利範圍第2項所述之高頻校正裝置,其中該網路分析儀具有一穿透校正器。The high frequency calibration device of claim 2, wherein the network analyzer has a penetration corrector. 依申請專利範圍第1項所述之高頻校正裝置,其中該第一探針的移動軌跡與載台朝向第一探針的表面垂直。The high frequency correcting device according to claim 1, wherein the movement path of the first probe is perpendicular to a surface of the stage toward the first probe. 依申請專利範圍第1項所述之高頻校正裝置,其中該第二探針的移動軌跡與載台朝向第二探針的表面垂直。The high frequency correcting device according to claim 1, wherein the movement path of the second probe is perpendicular to a surface of the stage toward the second probe.
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109581072A (en) * 2018-11-30 2019-04-05 贸联电子(昆山)有限公司 Cable high frequency measurement equipment and the method for measuring cable
CN109996282A (en) * 2017-12-29 2019-07-09 和硕联合科技股份有限公司 WIFI products detection system and WIFI product inspection method
TWI747750B (en) * 2021-02-25 2021-11-21 元智大學 Calibration structure and calibration method for double-sided probing measurement

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109996282A (en) * 2017-12-29 2019-07-09 和硕联合科技股份有限公司 WIFI products detection system and WIFI product inspection method
CN109996282B (en) * 2017-12-29 2022-11-15 和硕联合科技股份有限公司 WIFI product detection system and WIFI product detection method
CN109581072A (en) * 2018-11-30 2019-04-05 贸联电子(昆山)有限公司 Cable high frequency measurement equipment and the method for measuring cable
TWI747750B (en) * 2021-02-25 2021-11-21 元智大學 Calibration structure and calibration method for double-sided probing measurement

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