TW201302959A - Adhesive composition and adhesive sheet for surface protection - Google Patents

Adhesive composition and adhesive sheet for surface protection Download PDF

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TW201302959A
TW201302959A TW101124585A TW101124585A TW201302959A TW 201302959 A TW201302959 A TW 201302959A TW 101124585 A TW101124585 A TW 101124585A TW 101124585 A TW101124585 A TW 101124585A TW 201302959 A TW201302959 A TW 201302959A
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Taiwan
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copolymer
polymer block
mass
unit
aromatic alkenyl
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TW101124585A
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Chinese (zh)
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Katsunori Toyoshima
Toshiyuki Hayakawa
Takeo Nakamura
Akihiko Ookubo
Takuya Sano
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Sekisui Chemical Co Ltd
Jsr Corp
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Publication of TW201302959A publication Critical patent/TW201302959A/en

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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02Vinyl aromatic monomers and conjugated dienes
    • C09J153/025Vinyl aromatic monomers and conjugated dienes modified
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22Plastics; Metallised plastics
    • C09J7/24Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/241Polyolefin, e.g.rubber
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/318Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/10Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/122Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2409/00Presence of diene rubber
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2425/00Presence of styrenic polymer
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2453/00Presence of block copolymer

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)

Abstract

An adhesive composition comprising: a copolymer (i) that is a copolymer (I) having a structure expressed by the general formula [A-B]n (n is an integer of 1-3 inclusive), or a hydrogenation product thereof; and a copolymer (ii) that is a copolymer (II) having a structure expressed by the general formula A-B-A or the general formula (A-B)x-Y (In the formula, x is an integer of one or more, and Y is a coupling agent residue), or a hydrogenation product thereof. The vinyl bond content of the conjugated diene unit of the polymer block (B) is 70-85%, and the content of alkenyl aromatic compound units in all of the polymer blocks (B), on the basis of the total monomer mass of copolymers (i) and (ii), is 15-35 mass% (A: a block comprising primarily alkenyl aromatic compound units in which the alkenyl aromatic compound unit is continuous. B: a block randomly comprising conjugated diene units and alkenyl aromatic compound units.).

Description

黏著劑組成物及表面保護用黏著片 Adhesive composition and surface protection adhesive sheet

本發明係關於一種黏著劑組成物及表面保護用黏著片。 The present invention relates to an adhesive composition and an adhesive sheet for surface protection.

先前,於如光學器件、金屬板、經塗裝之金屬板、樹脂板及玻璃板之各種製品(零件)之保管或輸送時等,為了防止其表面附著污漬或灰塵、亦或受到損傷,而常常使用於聚烯烴系基材之一個主面上配置有黏著層之表面保護膜。此種表面保護膜之目的在於保護表面,而貼附於上述製品之表面。 In the past, in the storage or transportation of various products (parts) such as optical devices, metal plates, coated metal plates, resin plates, and glass plates, in order to prevent the surface from adhering to stains, dust, or damage, A surface protective film in which an adhesive layer is disposed on one main surface of a polyolefin-based substrate is often used. The purpose of such a surface protective film is to protect the surface and adhere to the surface of the above article.

表面保護膜必需於上述製品之保管中及輸送中不發生意外之剝離(包括部分剝離)。因此,表面保護膜必需具有一定程度以上之黏著力。尤其是,於將表面保護膜貼附於具有凹凸形狀表面之製品(零件)時,因無法獲得大接觸面積,故必需形成有黏著力強之黏著劑層。作為此種具有凹凸形狀表面之製品(零件),例如可列舉液晶顯示器用之光學構件即稜鏡片及擴散膜等。 The surface protective film must be free from accidental peeling (including partial peeling) during storage and transportation of the above-mentioned products. Therefore, the surface protective film must have a certain degree of adhesion. In particular, when a surface protective film is attached to a product (part) having a concave-convex surface, since a large contact area cannot be obtained, it is necessary to form an adhesive layer having a strong adhesive force. Examples of such a product (part) having a concave-convex surface include a ruthenium sheet and a diffusion film which are optical members for liquid crystal displays.

另一方面,表面保護膜必需如上述製品之使用時般於使用者欲有意將其剝離之情形時以較小之力而剝離去除。作為其相關之問題,存在由時間及溫度等外因所致之黏著力上升(所謂黏著亢進)之情況。產生此種問題狀況之一例,可列舉貼附有表面保護膜之製品於其輸送及保管中等被暴露於高溫之情況。該問題尤其容易產生於製品(被黏 著體)之表面為凹凸形狀之情形時。 On the other hand, the surface protective film must be peeled off with a small force as the user desires to peel it off as described above. As a related problem, there is a case where the adhesion force due to external factors such as time and temperature rises (so-called adhesion). An example of a problem in which such a problem occurs is a case where a product to which a surface protective film is attached is exposed to a high temperature during transportation and storage. This problem is especially easy to produce in products (adhesive When the surface of the body is a concave-convex shape.

進而,要求表面保護膜不污染上述製品之表面,即,剝離時一部分之黏著層不殘留於上述製品之表面。尤其於上述製品為光學膜或光學片時,該必要性高。 Further, the surface protective film is required not to contaminate the surface of the above-mentioned article, that is, a part of the adhesive layer does not remain on the surface of the above-mentioned article at the time of peeling. Especially when the above product is an optical film or an optical sheet, this necessity is high.

然而,表面保護膜通常形成長條狀並被捲繞為輥狀,而製造成捲繞體之形態。該捲繞體形態之表面保護膜於使用時被捲開。又,亦要求表面保護膜之捲開所需之力(展開力)小,即,要求展開性優異。又,於因展開性不足而無法順利進行捲開時,於黏著層產生所謂之終止標記(stop mark),其有損害表面保護膜外觀之虞,及有轉印至製品(被黏著體)之虞。 However, the surface protective film is usually formed into a long strip shape and wound into a roll shape to be in the form of a wound body. The surface protective film in the form of the wound body is wound up at the time of use. Further, it is also required that the force (expansion force) required for the roll-off of the surface protective film is small, that is, the spreadability is required to be excellent. Further, when the winding is not smoothly performed due to insufficient development, a so-called stop mark is generated in the adhesive layer, which may damage the appearance of the surface protective film and may be transferred to the product (adhered body). Hey.

對於此種要求,專利文獻1中提出有一種表面保護膜,其藉由將具有芳香族烯基聚合物嵌段與芳香族烯基-共軛二烯共聚合物嵌段之2種特定的嵌段共聚物或其氫化物用於黏著層,而具有適當之初始黏著力及優異之展開性,且抑制了黏著亢進及黏著層殘渣之產生(即,黏著層之一部分殘留於上述被黏著體表面之情況)。 In order to meet such a demand, Patent Document 1 proposes a surface protective film which comprises two specific embedding blocks having an aromatic alkenyl polymer block and an aromatic alkenyl-conjugated diene copolymer block. The segment copolymer or its hydride is used for the adhesive layer, and has an appropriate initial adhesion and excellent spreadability, and inhibits adhesion and adhesion layer residue (ie, a part of the adhesive layer remains on the surface of the adherend). The situation).

[專利文獻1]國際公開第2010/029773號手冊 [Patent Document 1] International Publication No. 2010/029773

然而,要求一種黏著亢進更加受抑制且具有更優異之展開性的表面保護膜。 However, a surface protective film which is more inhibited and has a more excellent spreadability is required.

因此,本發明之目的在於提供一種可製造黏著亢進受抑制之表面保護膜的黏著劑組成物、及黏著亢進受抑制之表面保護膜。 Accordingly, an object of the present invention is to provide an adhesive composition capable of producing a surface protective film having suppressed adhesion and a surface protective film having suppressed adhesion.

本發明進一步之目的在於提供一種可製造具有優異之展開性之表面保護膜的黏著劑組成物、及具有優異之展開性之表面保護膜。 A further object of the present invention is to provide an adhesive composition capable of producing a surface protective film having excellent spreadability and a surface protective film having excellent spreadability.

本發明人等發現:藉由將含有共軛二烯化合物單位及芳香族烯基化合物單位之2種嵌段共聚物之乙烯鍵含量控制於特定範圍內,而可抑制由含有該等之黏著劑組成物所得之表面保護膜的黏著亢進。 The present inventors have found that by controlling the vinyl bond content of two kinds of block copolymers including a conjugated diene compound unit and an aromatic alkenyl compound unit within a specific range, it is possible to suppress the adhesion of the adhesive containing the same. Adhesion of the surface protective film obtained by the composition.

本發明人等進而發現:藉由將上述2種嵌段共聚物之芳香族烯基化合物含量控制於特定範圍內,而可改善由含有該等之黏著劑組成物所得之表面保護膜的展開性。 The present inventors have further found that by controlling the content of the aromatic alkenyl compound of the above two kinds of block copolymers within a specific range, the spreadability of the surface protective film obtained from the adhesive composition containing the same can be improved. .

本發明提供以下各項所記載之發明形態。 The present invention provides the form of the invention described in the following.

1.一種黏著劑組成物,其含有共聚物(i)及共聚物(ii),共聚物(i):含有下述聚合物嵌段A及下述聚合物嵌段B,且具有以通式[A-B]n所示結構之共聚物(I)或其氫化物(式中,A表示聚合物嵌段A,B表示聚合物嵌段B,n表示1~3之整數),及共聚物(ii):含有下述聚合物嵌段A及下述聚合物嵌段B,且具有以通式A-B-A(式中之記號表示與上述相同之意思)或以通式(A-B)x-Y(式中,x表示1以上之整數,Y表示偶合劑殘基,其他記號表示與上述相同之意思)所示結構之共聚物(II)或其氫化物,聚合物嵌段B中共軛二烯單位之乙烯鍵含量為70~85%之範圍內,且, 以共聚物(i)及(ii)之總單體質量為基準,總聚合物嵌段B中芳香族烯基化合物單位含量(St(B))為15~35質量%之範圍內;聚合物嵌段A為:芳香族烯基化合物單位為連續,且主要由芳香族烯基化合物單位所構成之聚合物嵌段聚合物嵌段B為:無規地含有共軛二烯單位及芳香族烯基化合物單位之芳香族烯基-共軛二烯共聚合物嵌段。 An adhesive composition comprising a copolymer (i) and a copolymer (ii), a copolymer (i) comprising the following polymer block A and a polymer block B described below, and having a general formula [AB] Copolymer (I) of the structure shown by n or a hydride thereof (wherein A represents a polymer block A, B represents a polymer block B, n represents an integer of 1 to 3), and a copolymer ( Ii): containing the following polymer block A and the following polymer block B, and having the general formula ABA (the symbol in the formula represents the same meaning as described above) or the general formula (AB) x -Y (formula) Wherein, x represents an integer of 1 or more, Y represents a coupling agent residue, and other symbols represent the copolymer (II) having the structure shown in the above) or a hydride thereof, and a conjugated diene unit in the polymer block B The content of the vinyl bond is in the range of 70 to 85%, and the unit content of the aromatic alkenyl compound in the total polymer block B based on the total monomer mass of the copolymers (i) and (ii) (St (B) )) is in the range of 15 to 35% by mass; the polymer block A is: the aromatic alkenyl compound unit is continuous, and the polymer block polymer block B mainly composed of the aromatic alkenyl compound unit is : random Containing the conjugated diene unit and an aromatic alkenyl aromatic alkenyl compound Units - conjugated diene block copolymer.

2.如上述項1之黏著劑組成物,其中聚合物嵌段B整體之芳香族烯基化合物單位含量(St(b))為10~40質量%之範圍,共聚物(i)及(ii)整體之芳香族烯基化合物單位含量(St(A+B))為35~55質量%之範圍內,且聚合物嵌段A之總量與聚合物嵌段B之總量的質量比(A:B)為5:95~30:70之範圍內。 2. The adhesive composition according to item 1, wherein the unit content (St(b)) of the aromatic alkenyl compound as a whole of the polymer block B is in the range of 10 to 40% by mass, and the copolymers (i) and (ii) The unit content (St(A+B)) of the entire aromatic alkenyl compound is in the range of 35 to 55% by mass, and the mass ratio of the total amount of the polymer block A to the total amount of the polymer block B ( A: B) is in the range of 5:95~30:70.

3.一種表面保護膜,其具有基材層、及配置於上述基材層之一個主面上的由上述項1或2之黏著劑組成物所構成的黏著層。 A surface protective film comprising a base material layer and an adhesive layer comprising the adhesive composition of the above item 1 or 2 disposed on one main surface of the base material layer.

本發明之黏著劑組成物可製造黏著亢進受抑制之表面保護膜。進而,本發明之黏著劑組成物之一態樣為可製造具有優異之展開性的表面保護膜。 The adhesive composition of the present invention can produce a surface protective film which is adhered and inhibited. Further, one aspect of the adhesive composition of the present invention is that a surface protective film having excellent spreadability can be produced.

本發明之表面保護膜,其黏著亢進受到抑制。進而,本發明之表面保護膜之一態樣為具有優異之展開性。 The surface protective film of the present invention is inhibited from sticking to adhesion. Further, one aspect of the surface protective film of the present invention has excellent spreadability.

1.本說明書中之記號之定義 1. Definition of the mark in this manual

於本說明書中,用以表示數值範圍之記號「~」只要沒有特別記載,即表示該數值範圍包含其兩端之數值。 In the present specification, the symbol "~" used to indicate the numerical range means that the numerical range includes the numerical values at both ends unless otherwise specified.

於本說明書中,聚合物之重複單位之「含量」表示換算成來自重複單位之單體之質量比(即,來自上述重複單位之單體質量相對於用以形成上述聚合物之總單體質量的比)(質量%)。此處,「用以形成上述聚合物之總單體之質量」近似於上述聚合物之質量。 In the present specification, the "content" of the repeating unit of the polymer means the mass ratio converted to the monomer derived from the repeating unit (that is, the mass of the monomer derived from the above repeating unit with respect to the total monomer mass used to form the above polymer) Ratio) (% by mass). Here, "the mass of the total monomer used to form the above polymer" approximates the mass of the above polymer.

相同地,於本說明書中,聚合物嵌段之重複單位之「含量」表示換算成來自重複單位之單體的質量比(即,來自上述重複單位之單體質量相對於用以形成上述聚合物嵌段之總單體質量的比)(質量%)。此處,「用以形成上述聚合物嵌段之總單體之質量」近似於上述聚合物嵌段之質量。 Similarly, in the present specification, the "content" of the repeating unit of the polymer block means the mass ratio converted to the monomer derived from the repeating unit (that is, the mass of the monomer derived from the above repeating unit relative to the polymer used to form the above polymer The ratio of the total monomer mass of the block) (% by mass). Here, "the mass of the total monomer used to form the above polymer block" approximates the mass of the above polymer block.

具體而言,本說明書中使用之用語:「共聚物(i)及(ii)整體之芳香族烯基化合物單位含量」(St(A+B))、「全部聚合物嵌段A中芳香族烯基化合物單位含量」(St(A))、「全部聚合物嵌段B中芳香族烯基化合物單位含量」(St(B))、及「聚合物嵌段B整體之芳香族烯基化合物單位含量」(St(b))分別表示後述數式所定義之數值。再者,於本說明書中使用之術語:「全部聚合物嵌段A」及「全部聚合物嵌段B」只要沒有特別記載,即表示「聚合物(i)及(ii)中全部聚合物嵌段A」及「聚合物(i)及(ii)中全部聚合物嵌段B」。此種芳香族烯基化合物單位 含量由1H-NMR(氫核磁共振)來決定。又,此種芳香族烯基化合物單位含量亦可以紅外線光譜法來決定,且獲得與1H-NMR大致相同之值。 Specifically, the term used in the present specification is "the copolymer (i) and (ii) the overall aromatic alkenyl compound unit content" (St (A + B)), "all of the polymer block A aromatic Unit content of alkenyl compound" (St (A)), "unit content of aromatic alkenyl compound in all polymer block B" (St (B)), and "aromatic alkenyl compound of polymer block B as a whole" The unit content (St(b)) represents the numerical value defined by the following formula. In addition, the term "all polymer block A" and "all polymer block B" used in the present specification means that all of the polymers in the polymers (i) and (ii) are embedded unless otherwise specified. Section A" and "all polymer blocks B" in polymers (i) and (ii). The unit content of such an aromatic alkenyl compound is determined by 1 H-NMR (hydrogen nuclear magnetic resonance). Further, the unit content of such an aromatic alkenyl compound can also be determined by infrared spectroscopy, and a value substantially the same as that of 1 H-NMR can be obtained.

本說明書中之「乙烯鍵含量」表示使用紅外線吸收光譜法以摩雷羅氏(Morello)法所算出之1,2-乙烯鍵及3,4-乙烯鍵之總含量。再者,氫化物之乙烯鍵含量表示對應於其之氫化前之聚合物之乙烯鍵含量。 The "vinyl bond content" in the present specification means the total content of 1,2-vinyl bond and 3,4-vinyl bond calculated by the Morello method by infrared absorption spectroscopy. Further, the vinyl bond content of the hydride indicates the vinyl bond content of the polymer corresponding to the hydrogenation thereof.

本說明書中「共軛二烯單位之乙烯鍵含量」表示來自共軛二烯化合物(單體)之部分的乙烯鍵含量。 In the present specification, the "ethylene bond content of the conjugated diene unit" means the content of the vinyl bond derived from the portion of the conjugated diene compound (monomer).

2.黏著劑組成物 2. Adhesive composition

本發明之黏著劑組成物含有後文中詳細說明之共聚物(i)及(ii)。該共聚物(i)及(ii)分別含有後文中說明之聚合物嵌段A及B兩者。 The adhesive composition of the present invention contains copolymers (i) and (ii) which will be described later in detail. The copolymers (i) and (ii) respectively contain both of the polymer blocks A and B described later.

於本發明之黏著劑組成物中,就獲得具有足夠保持力(抗偏移之力)之表面保護膜之觀點而言,上述聚合物(i) 及(ii)所含之聚合物嵌段A之總量與聚合物嵌段B之總量的質量比(A:B)之下限較佳為5:95,更佳為10:90。另一方面,就獲得對於被黏著體表面之凹凸具有良好之追隨性、及具有被黏著體表面保護之高可靠性之表面保護膜的觀點而言,該比(A:B)之上限較佳為30:70,更佳為25:75。該比(A:B)較佳為5:95~30:70之範圍內,更佳為10:90~25:75之範圍內。 In the adhesive composition of the present invention, the above polymer (i) is obtained from the viewpoint of obtaining a surface protective film having a sufficient holding force (force against offset). And the lower limit of the mass ratio (A:B) of the total amount of the polymer block A contained in (ii) to the total amount of the polymer block B is preferably 5:95, more preferably 10:90. On the other hand, the upper limit of the ratio (A: B) is preferably from the viewpoint of obtaining a good followability to the unevenness of the surface of the adherend and a highly reliable surface protective film protected by the surface of the adherend. It is 30:70, more preferably 25:75. The ratio (A:B) is preferably in the range of 5:95 to 30:70, more preferably in the range of 10:90 to 25:75.

2.1.聚合物嵌段A 2.1. Polymer Block A

聚合物嵌段A係由芳香族烯基化合物單位為主所構成之聚合物嵌段。 The polymer block A is a polymer block mainly composed of an aromatic alkenyl compound unit.

「芳香族烯基化合物單位」係來自芳香族烯基化合物之重複單位。作為芳香族烯基化合物,例如可列舉:苯乙烯、第三丁基苯乙烯、α-甲基苯乙烯、對甲基苯乙烯(p-methylstyrene)、對乙基苯乙烯、二乙烯苯、1,1-二苯乙烯、乙烯基萘(vinylnaphthalene)、乙烯蒽(vinyl anthracene)、N,N-二乙基-對胺乙基苯乙烯(N,N-diethyl-p-amino ethyl styrene)及乙烯基吡啶(vinylpyridine)等。其中,就原料於工業上容易獲得之理由,故而「芳香族烯基化合物單位」為苯乙烯單位為佳。 The "aromatic alkenyl compound unit" is a repeating unit derived from an aromatic alkenyl compound. Examples of the aromatic alkenyl compound include styrene, t-butylstyrene, α-methylstyrene, p-methylstyrene, p-ethylstyrene, divinylbenzene, and 1 , 1-stilbene, vinylnaphthalene, vinyl anthracene, N,N-diethyl-p-amino ethyl styrene and ethylene Vinylpyridine or the like. Among them, the reason why the raw material is easily obtained industrially is that the "aromatic alkenyl compound unit" is preferably a styrene unit.

聚合物嵌段A必需含有以芳香族烯基化合物單位為主之重複單位。具體而言,其芳香族烯基化合物單位含量為80質量%以上。藉由有此種較高之芳香族烯基化合物單位含量,而可使黏著劑組成物之熱塑性提高,且黏著劑組成物之再利用較為容易。聚合物嵌段A亦可在未達20質量% 之範圍內含有芳香族烯基化合物單位以外之重複單位。作為此種重複單位,例如可列舉如來自共軛二烯化合物或(甲基)丙烯酸酯化合物之重複單位、即可與來自芳香族烯基化合物進行共聚合之化合物的重複單位。其中,基於與芳香族烯基化合物之共聚合性高之理由而較佳為1,3-丁二烯及異戊二烯。此種重複單位可為1種,亦可為2種以上。 The polymer block A must contain a repeating unit mainly composed of an aromatic alkenyl compound unit. Specifically, the aromatic alkenyl compound has a unit content of 80% by mass or more. By having such a higher unit content of the aromatic alkenyl compound, the thermoplasticity of the adhesive composition can be improved, and the reuse of the adhesive composition can be facilitated. Polymer block A can also be less than 20% by mass The range of repeating units other than the unit of the aromatic alkenyl compound is contained in the range. As such a repeating unit, for example, a repeating unit derived from a conjugated diene compound or a (meth) acrylate compound, that is, a compound which can be copolymerized with an aromatic alkenyl compound can be mentioned. Among them, 1,3-butadiene and isoprene are preferred because of their high copolymerizability with the aromatic alkenyl compound. Such a repeating unit may be one type or two or more types.

2.2.聚合物嵌段B 2.2. Polymer Block B

聚合物嵌段B係無規地含有共軛二烯單位及芳香族烯基化合物單位之聚合物嵌段。 The polymer block B randomly contains a polymer block of a conjugated diene unit and an aromatic alkenyl compound unit.

此處,所謂「無規地」廣義解釋為:共軛二烯單位及芳香族烯基化合物單位的鏈分佈的狀態是將共軛二烯及芳香族烯基化合物同時聚合所得之遵循固定的統計學規則之狀態。 Here, the term "randomly" is broadly interpreted as a state in which the chain distribution of the conjugated diene unit and the aromatic alkenyl compound unit is a fixed statistic obtained by simultaneously polymerizing a conjugated diene and an aromatic alkenyl compound. The state of the rules.

就使本發明之效果得以發揮之觀點而言,聚合物嵌段B較佳為由共軛二烯單位及芳香族烯基化合物單位為主所構成。具體而言,以全部聚合物嵌段B之質量為基準,聚合物嵌段B中共軛二烯單位及芳香族烯基化合物單位之含量總計,較佳為65質量%以上,更佳為80質量%以上。 From the viewpoint of exerting the effects of the present invention, the polymer block B is preferably composed mainly of a conjugated diene unit and an aromatic alkenyl compound unit. Specifically, the content of the conjugated diene unit and the aromatic alkenyl compound unit in the polymer block B is preferably 65% by mass or more, and more preferably 80% by mass based on the mass of all the polymer blocks B. %the above.

所謂構成「聚合物嵌段B」之「共軛二烯化合物單位」,係指來自共軛二烯化合物之重複單位。作為「共軛二烯化合物」,例如可列舉:1,3-丁二烯、異戊二烯、2,3-二甲基-1,3-丁二烯、1,3-戊二烯、2-甲基-1,3-辛二烯(2-methyl-1,3-octadiene)、1,3-己二烯、1,3-環己二烯、4,5-二乙基-1,3-辛二烯(4,5-diethyl-1,3-octadiene)、3-丁 基-1,3-辛二烯(3-butyl-1,3-octadiene)、月桂油烯(myrcene)及氯丁二烯等,其中較佳為1,3-丁二烯等。 The "conjugated diene compound unit" constituting "polymer block B" means a repeating unit derived from a conjugated diene compound. Examples of the "conjugated diene compound" include 1,3-butadiene, isoprene, 2,3-dimethyl-1,3-butadiene, and 1,3-pentadiene. 2-methyl-1,3-octadiene, 1,3-hexadiene, 1,3-cyclohexadiene, 4,5-diethyl-1 , 3-octadiene (4,5-diethyl-1,3-octadiene), 3-butyl 3-butyl-1,3-octadiene, myrcene, chloroprene, etc., among which 1,3-butadiene or the like is preferred.

作為「共軛二烯化合物單位」,例如可列舉:1,4-丁二烯、1,2-丁二烯、1,2-異戊二烯、1,4-異戊二烯及3,4-異戊二烯等重複單位,其中,較佳為1,4-丁二烯及1,2-丁二烯等重複單位。再者,當業者亦已了解,此處之接頭詞(例,1,4-)表示聚合反應之反應形式。 Examples of the "conjugated diene compound unit" include 1,4-butadiene, 1,2-butadiene, 1,2-isoprene, 1,4-isoprene, and 3. A repeating unit such as 4-isoprene, wherein a repeating unit such as 1,4-butadiene or 1,2-butadiene is preferred. Furthermore, it is also known to the practitioner that the terminology herein (example, 1,4-) means the reaction form of the polymerization reaction.

聚合物嵌段B中共軛二烯單位之乙烯鍵含量為70~85質量%之範圍內,更佳為75~85質量%之範圍內。藉由該含量為70質量%以上,而獲得黏著亢進受抑制之表面保護膜。另一方面,藉由該含量為85質量%以下,而獲得具有足夠黏著力之表面保護膜。 The content of the vinyl bond of the conjugated diene unit in the polymer block B is in the range of 70 to 85% by mass, more preferably in the range of 75 to 85% by mass. By the content of 70% by mass or more, a surface protective film in which adhesion is suppressed is obtained. On the other hand, the content is 85 mass% or less, and a surface protective film having a sufficient adhesive force is obtained.

就獲得具有優異展開性之表面保護膜之觀點而言,聚合物嵌段B整體之芳香族烯基化合物單位含量(St(b))之下限較佳為10質量%,更佳為20質量%,最佳為30質量%。另一方面,就獲得具有足夠黏著力之表面保護膜之觀點而言,該含量(St(b))之上限較佳為40質量%。該含量(St(b))較佳為10~40質量%之範圍內,更佳為15~40質量%之範圍內,最佳為20~40質量%之範圍內。 The lower limit of the unit content (St(b)) of the aromatic alkenyl compound as a whole of the polymer block B is preferably 10% by mass, more preferably 20% by mass, from the viewpoint of obtaining a surface protective film having excellent expandability. The best is 30% by mass. On the other hand, from the viewpoint of obtaining a surface protective film having sufficient adhesion, the upper limit of the content (St(b)) is preferably 40% by mass. The content (St (b)) is preferably in the range of 10 to 40% by mass, more preferably in the range of 15 to 40% by mass, most preferably in the range of 20 to 40% by mass.

再者,聚合物嵌段B亦可於不失去本發明效果之範圍內而含有共軛二烯化合物單位及芳香族烯基化合物單位以外之重複單位。作為此種重複單位,例如可列舉:丙烯、2-甲基-2-丁烯、3-甲基-1-丁烯、及2-甲基-1-丁烯等。此種重複單位之含量通常相對於全部聚合物嵌段B中總單體單 位質量為10質量%以下,較佳為5質量%以下。 Further, the polymer block B may contain a repeating unit other than the unit of the conjugated diene compound and the unit of the aromatic alkenyl compound without departing from the effects of the present invention. Examples of such a repeating unit include propylene, 2-methyl-2-butene, 3-methyl-1-butene, and 2-methyl-1-butene. The content of such repeating units is usually relative to the total monomer number in the entire polymer block B. The bit mass is 10% by mass or less, preferably 5% by mass or less.

2.3.共聚物組成物 2.3. Copolymer composition

本發明之黏著劑組成物係如上述,含有由共聚物(i)及(ii)組成之共聚物組成物。本說明書中,有將該「由共聚物(i)及(ii)組成之共聚物組成物」僅稱為「共聚物組成物」之情形。關於共聚物(i)及(ii),於下文中進行詳細說明。 The adhesive composition of the present invention contains a copolymer composition composed of copolymers (i) and (ii) as described above. In the present specification, the "copolymer composition composed of the copolymers (i) and (ii)" is simply referred to as "copolymer composition". The copolymers (i) and (ii) are described in detail below.

就獲得具有足夠黏著力之表面保護膜之觀點而言,共聚物(i)與共聚物(ii)之質量比((i):(ii))之下限較佳為10:90。另一方面,就獲得具有優異展開性之表面保護膜之觀點而言,該比((i):(ii))之上限較佳為70:30。該比((i):(ii))較佳為10:90~70:30之範圍內。 The lower limit of the mass ratio of the copolymer (i) to the copolymer (ii) ((i): (ii)) is preferably 10:90 from the viewpoint of obtaining a surface protective film having sufficient adhesion. On the other hand, from the viewpoint of obtaining a surface protective film having excellent spreadability, the upper limit of the ratio ((i): (ii)) is preferably 70:30. The ratio ((i): (ii)) is preferably in the range of 10:90 to 70:30.

以共聚物(i)及(ii)之總單體質量為基準,全部聚合物嵌段B中芳香族烯基化合物單位含量(St(B))為15~35質量%的範圍內,較佳為25~35質量%之範圍內。藉由該含量(St(B))為15質量%以上,而獲得具有優異展開性之表面保護膜。另一方面,藉由該含量(St(B))為35質量%以下,而獲得具有足夠黏著力之表面保護膜。 The unit content (St(B)) of the aromatic alkenyl compound in all the polymer blocks B is in the range of 15 to 35 mass% based on the total monomer mass of the copolymers (i) and (ii), preferably. It is in the range of 25 to 35 mass%. By the content (St (B)) being 15% by mass or more, a surface protective film having excellent developability is obtained. On the other hand, the content (St (B)) is 35 mass% or less, and a surface protective film having a sufficient adhesive force is obtained.

於本發明之黏著劑組成物中,就獲得具有優異之展開性、且黏著亢進受抑制之表面保護膜的觀點而言,上述聚合物(i)及(ii)中芳香族烯基化合物單位含量(St(A+B))之下限較佳為30質量%,更佳為35質量%,最佳為40質量%。另一方面,就獲得具有足夠黏著力之表面保護膜之觀 點而言,該含量(St(A+B))之上限較佳為50質量%。該含量(St(A+B))較佳為30~50質量%,更佳為35~50質量%,最佳為40~50質量%之範圍內。 In the adhesive composition of the present invention, the unit content of the aromatic alkenyl compound in the above polymers (i) and (ii) is obtained from the viewpoint of obtaining a surface protective film having excellent spreadability and suppressed adhesion. The lower limit of (St (A + B)) is preferably 30% by mass, more preferably 35% by mass, most preferably 40% by mass. On the other hand, the concept of obtaining a surface protective film with sufficient adhesion The upper limit of the content (St (A + B)) is preferably 50% by mass. The content (St (A + B)) is preferably from 30 to 50% by mass, more preferably from 35 to 50% by mass, most preferably from 40 to 50% by mass.

於共聚物(i)及共聚物(ii)之混合物中,共聚物(i)及共聚物(ii)分別為氫化物。於該氫化物中,就混合物整體而言,來自共軛二烯單體之雙鍵(不飽和鍵)的80%以上、較佳為90%以上、更佳為95%以上(例,約98%)被氫化為飽和鍵。 In the mixture of the copolymer (i) and the copolymer (ii), the copolymer (i) and the copolymer (ii) are each a hydride. In the hydride, as a whole, the double bond (unsaturated bond) derived from the conjugated diene monomer is 80% or more, preferably 90% or more, more preferably 95% or more (for example, about 98). %) is hydrogenated to a saturated bond.

關於共聚物(i)及(ii)混合物之分子量,並無特別限制,但其重量平均分子量較佳為3萬~50萬,更佳為8萬~30萬,進而較佳為10萬~25萬,特佳為10萬~20萬。若重量平均分子量過小,則有工業生產性變差之情形。另一方面,若重量平均分子量過大,則有加工性變差之情形。 The molecular weight of the copolymer (i) and (ii) is not particularly limited, but the weight average molecular weight thereof is preferably from 30,000 to 500,000, more preferably from 80,000 to 300,000, and still more preferably from 100,000 to 25 Ten thousand, especially good for 100,000 to 200,000. If the weight average molecular weight is too small, there is a case where industrial productivity is deteriorated. On the other hand, if the weight average molecular weight is too large, workability may deteriorate.

2.3.1.共聚物(i) 2.3.1. Copolymer (i)

共聚物(i)係如上所述含有聚合物嵌段A及B,且為通式:[A-B]n所示之共聚物或其氫化物,(式中,A表示聚合物嵌段A,B表示聚合物嵌段B,及n表示1~3之整數)。 The copolymer (i) contains the polymer blocks A and B as described above, and is a copolymer represented by the formula: [AB] n or a hydrogenated product thereof (wherein A represents a polymer block A, B) The polymer block B is represented, and n represents an integer of 1 to 3).

於共聚物(i)中,於存在2個以上聚合物嵌段A或B時,2個以上之聚合物嵌段A或B可相同亦可不同,但較佳為各自相同。 In the copolymer (i), when two or more polymer blocks A or B are present, two or more polymer blocks A or B may be the same or different, but are preferably the same.

於通式[A-B]n中,n表示1~3之整數。因此,以通式 [A-B]n所示之結構為A-B、A-B-A-B、或A-B-A-B-A-B。由於n為該範圍內,而使該通式所示之嵌段共聚物或其氫化物之工業生產性變良好。進而,就黏著層適當的黏著力之觀點而言,n較佳為1或2,特佳為1。 In the general formula [AB] n , n represents an integer of 1 to 3. Therefore, the structure represented by the general formula [AB] n is AB, ABAB, or ABABAB. Since n is in this range, the industrial productivity of the block copolymer represented by the above formula or its hydride is improved. Further, n is preferably 1 or 2, and particularly preferably 1 from the viewpoint of an appropriate adhesion of the adhesive layer.

就獲得具有足夠保持力(抗偏移之力)之表面保護膜之觀點而言,共聚物(i)之芳香族烯基化合物單位含量之下限較佳為30質量%,更佳為33質量%。另一方面,就獲得對於被黏著體表面之凹凸具有良好追隨性、及具有被黏著體表面保護之高可靠性之表面保護膜的觀點而言,該含量之上限較佳為50質量%,更佳為45質量%。共聚物(i)之芳香族烯基化合物單位含量較佳為30~50質量%之範圍內,更佳為33~45質量%之範圍內。 The lower limit of the unit content of the aromatic alkenyl compound of the copolymer (i) is preferably 30% by mass, more preferably 33% by mass, from the viewpoint of obtaining a surface protective film having a sufficient holding force (force against offset). . On the other hand, from the viewpoint of obtaining a surface protective film having good followability to the unevenness of the surface of the adherend and having high reliability by the surface protection of the adherend, the upper limit of the content is preferably 50% by mass, more Good is 45% by mass. The unit content of the aromatic alkenyl compound of the copolymer (i) is preferably in the range of 30 to 50% by mass, more preferably in the range of 33 to 45% by mass.

關於共聚物(i)之分子量,並無特別限制,但其重量平均分子量較佳為3萬~40萬,更佳為3萬~30萬,進而較佳為5萬~25萬,特佳為5萬~20萬。若重量平均分子量過小,則有工業生產性變差之情形。另一方面,若重量平均分子量過大,則有加工性變差之情形。 The molecular weight of the copolymer (i) is not particularly limited, but the weight average molecular weight thereof is preferably from 30,000 to 400,000, more preferably from 30,000 to 300,000, and still more preferably from 50,000 to 250,000. 50,000 to 200,000. If the weight average molecular weight is too small, there is a case where industrial productivity is deteriorated. On the other hand, if the weight average molecular weight is too large, workability may deteriorate.

本發明之黏著劑組成物中共聚物(i)可為1種或2種以上之混合物,但較佳為1種。此處,聚合物是否為1種係依據本發明所屬之技術領域中之技術常識來判斷。即,例如,聚合物之聚合度或分子量存在一定偏差之情況為技術常識,因此於一定偏差之範圍內僅聚合度及分子量不同之共聚物(i)為相同種類。 The copolymer (i) in the adhesive composition of the present invention may be one type or a mixture of two or more types, and is preferably one type. Here, whether or not the polymer is one type is judged based on the technical common sense in the technical field to which the present invention pertains. In other words, for example, when the degree of polymerization or the molecular weight of the polymer is deviated by a certain amount of technical knowledge, only the copolymer (i) having a different degree of polymerization and molecular weight is the same type within a certain range of variation.

共聚物(i)較佳為氫化物。於該氫化物中,來自共軛 二烯單體之雙鍵(不飽和鍵)80%以上、較佳為90%以上、更佳為95%以上(例,約98%)被氫化為飽和鍵。 The copolymer (i) is preferably a hydride. In the hydride, from the conjugate The double bond (unsaturated bond) of the diene monomer is 80% or more, preferably 90% or more, more preferably 95% or more (for example, about 98%) is hydrogenated to a saturated bond.

2.3.2.共聚物(ii) 2.3.2. Copolymer (ii)

共聚物(ii)係如上所述含有聚合物嵌段A及B,且具有以通式:(A-B)x-Y所示結構之共聚物或其氫化物,(式中,X表示2以上之整數,Y表示偶合劑殘基,及其他記號表示與上述意義相同)。 The copolymer (ii) contains the polymer blocks A and B as described above, and has a copolymer of the formula: (AB) x -Y or a hydrogenated product thereof (wherein X represents 2 or more) An integer, Y represents a coupling agent residue, and other symbols indicate the same meaning as above).

於共聚物(ii)中,於存在2個以上聚合物嵌段A或B時,2個以上之聚合物嵌段A或B可相同亦可不同,但較佳為各自相同。 In the copolymer (ii), when two or more polymer blocks A or B are present, two or more polymer blocks A or B may be the same or different, but are preferably the same.

自上述通式亦可知共聚物(ii)於其全部分子末端具有聚合物嵌段A。 It is also known from the above formula that the copolymer (ii) has a polymer block A at all molecular terminals thereof.

就使聚合物嵌段A之效果確實發揮之觀點而言,末端之聚合物嵌段A較佳為佔共聚物(ii)整體之2質量%以上。再者,即便一部分共聚物(ii)之末端具有-B之結構,於末端之聚合物嵌段B之含量未達共聚物(ii)整體之2質量%時,亦可發揮與末端為聚合物嵌段A相同之效果。即,可認為上述結構實質上末端為聚合物嵌段A。 From the viewpoint of realizing the effect of the polymer block A, the polymer block A at the end is preferably 2% by mass or more based on the entire copolymer (ii). Further, even if a part of the copolymer (ii) has a structure of -B, and the content of the polymer block B at the terminal is less than 2% by mass of the copolymer (ii) as a whole, it can also be a polymer with a terminal. The same effect of block A. That is, it is considered that the above structure is substantially the polymer block A at the end.

具有以通式(A-B)x-Y(式中,x表示2以上之整數,Y表示偶合劑殘基,其他記號表示與上述相同之意思)所示結構之共聚物,換言之,具有共聚物(i)藉由Y來偶合而成之結構。當x為2時,可認為該共聚物實質上為三嵌段 聚合物(A-B-A)。當x為3以上時,該共聚物為所謂的星形聚合物。就抑制該共聚物製造時之副反應,且控制該共聚物之物性之觀點而言,x較佳為2~4。 A copolymer having a structure represented by the formula (AB) x -Y (wherein x represents an integer of 2 or more, Y represents a coupling agent residue, and other symbols represent the same meaning as described above), in other words, has a copolymer ( i) A structure that is coupled by Y. When x is 2, the copolymer is considered to be substantially a triblock polymer (ABA). When x is 3 or more, the copolymer is a so-called star polymer. From the viewpoint of suppressing the side reaction at the time of production of the copolymer and controlling the physical properties of the copolymer, x is preferably from 2 to 4.

就獲得具有足夠保持力(抗偏移之力)之表面保護膜之觀點而言,共聚物(ii)之芳香族烯基化合物單位含量之下限較佳為30質量%,更佳為33質量%。另一方面,就獲得對於被黏著體表面之凹凸具有良好的追隨性、及具有被黏著體表面保護之高可靠性之表面保護膜的觀點而言,該含量之上限較佳為50質量%,更佳為45質量%。共聚物(ii)之芳香族烯基化合物單位含量較佳為30~50質量%之範圍內,更佳為33~45質量%之範圍內。 The lower limit of the unit content of the aromatic alkenyl compound of the copolymer (ii) is preferably 30% by mass, more preferably 33% by mass, from the viewpoint of obtaining a surface protective film having a sufficient holding force (force against offset). . On the other hand, from the viewpoint of obtaining a surface protective film having good followability to the unevenness of the surface of the adherend and having high reliability by the surface protection of the adherend, the upper limit of the content is preferably 50% by mass. More preferably, it is 45 mass%. The unit content of the aromatic alkenyl compound of the copolymer (ii) is preferably in the range of 30 to 50% by mass, more preferably in the range of 33 to 45% by mass.

關於共聚物(ii)之分子量,並無特別限制,但重量平均分子量較佳為5萬~50萬,更佳為8萬~30萬,進而較佳為10萬~25萬,特佳為10萬~20萬。若重量平均分子量過小,則有工業生產性變差之情形。另一方面,若重量平均分子量過大,則有加工性變差之情形。 The molecular weight of the copolymer (ii) is not particularly limited, but the weight average molecular weight is preferably 50,000 to 500,000, more preferably 80,000 to 300,000, further preferably 100,000 to 250,000, and particularly preferably 10 10,000 ~ 200,000. If the weight average molecular weight is too small, there is a case where industrial productivity is deteriorated. On the other hand, if the weight average molecular weight is too large, workability may deteriorate.

共聚物(ii)可單獨使用,或組合2種以上使用。 The copolymer (ii) may be used singly or in combination of two or more.

共聚物(ii)較佳為氫化物。該氫化物中,來自共軛二烯單體之雙鍵(不飽和鍵)80%以上、較佳為90%以上、更佳為95%以上(例,約98%)被氫化為飽和鍵。 The copolymer (ii) is preferably a hydride. In the hydride, the double bond (unsaturated bond) derived from the conjugated diene monomer is 80% or more, preferably 90% or more, more preferably 95% or more (for example, about 98%), and is hydrogenated to a saturated bond.

2.3.3.共聚物組成物之製造方法 2.3.3. Method for producing copolymer composition

共聚物組成物例如根據需要,藉由將後述共聚物(I)及(II)之混合物氫化而獲得。作為其他方法,共聚物組成物例如亦藉由以慣用之方法混合共聚物(i)及(ii)來獲得, 該共聚物(i)及(ii)係根據需要分別使共聚物(I)及(II)氫化而獲得。於共聚物組成物中,共聚物(i)及(ii)較佳為均為氫化物。 The copolymer composition is obtained, for example, by hydrogenating a mixture of the copolymers (I) and (II) described below as needed. As another method, the copolymer composition is also obtained, for example, by mixing the copolymers (i) and (ii) in a conventional manner. The copolymers (i) and (ii) are obtained by hydrogenating the copolymers (I) and (II), respectively, as needed. In the copolymer composition, the copolymers (i) and (ii) are preferably all hydrides.

共聚物(I)含有後述之聚合物嵌段A'及B',且具有以通式:[A'-B']n所示之結構,(式中,A'表示聚合物嵌段A',B'表示聚合物嵌段B',及n表示1~3之整數)。 The copolymer (I) contains the polymer blocks A' and B' described later, and has a structure represented by the formula: [A'-B'] n (wherein A' represents the polymer block A' , B' represents the polymer block B', and n represents an integer of 1 to 3).

共聚物(II)含有後述之聚合物嵌段A'及B',且具有以通式:(A'-B')x-Y所示之結構,(式中,x表示2以上之整數,Y表示偶合劑殘基,及其他記號表示與上述意義相同),並且聚合物嵌段B'之全部共軛二烯化合物單位之乙烯鍵含量為70~85質量%之範圍內。 The copolymer (II) contains a polymer block A' and B' which will be described later, and has a structure represented by the formula: (A'-B') x - Y (wherein x represents an integer of 2 or more, Y represents a coupling agent residue, and other symbols indicate the same meaning as described above, and the vinyl bond content of all the conjugated diene compound units of the polymer block B' is in the range of 70 to 85% by mass.

聚合物嵌段A'係由芳香族烯基化合物單位為主所構成之聚合物嵌段。 The polymer block A' is a polymer block mainly composed of an aromatic alkenyl compound unit.

聚合物嵌段B'係含有具有共軛二烯化合物單位及芳香族烯基化合物單位之嵌段的聚合物嵌段。 The polymer block B' contains a polymer block having a block of a conjugated diene compound unit and an aromatic alkenyl compound unit.

共聚物(I)及(II)可分別藉由嵌段聚合而製造。 The copolymers (I) and (II) can be produced by block polymerization, respectively.

藉由混合所得之共聚物(I)及(II),而獲得共聚物 (I)及(II)之混合物。 Copolymer obtained by mixing the obtained copolymers (I) and (II) a mixture of (I) and (II).

作為其他方法,共聚物(I)及(II)之混合物亦可藉由如下方法(偶合法)而獲得。偶合法因有如下等優點故較佳:可使共聚物(I)及(II)於單一容器中合成因此製造步驟簡單;可使製造成本低廉化;及可藉由偶合劑之種類或量不同來控制共聚物(I)及(II)之比率。 As another method, a mixture of the copolymers (I) and (II) can also be obtained by the following method (even method). It is preferred that the coupling method has the following advantages: the copolymers (I) and (II) can be synthesized in a single container, so that the manufacturing steps are simple; the manufacturing cost can be reduced; and the type or amount of the coupling agent can be different. To control the ratio of the copolymers (I) and (II).

偶合法包括以下步驟:第1步驟:藉由嵌段聚合來合成具有[A'-B']結構之共聚物的步驟,及第2步驟:藉由偶合劑Y-Zx(其中,「Y」表示偶合劑殘基,「Z」表示脫離基,「x」表示2以上之整數)而使上述具有[A'-B']結構的共聚物之一部分偶合,以合成具有{[A'-B']x-Y}結構之共聚物的步驟。 The even method includes the following steps: a first step: a step of synthesizing a copolymer having a structure of [A'-B'] by block polymerization, and a second step: by a coupling agent YZ x (wherein, "Y" a coupler residue, "Z" represents a leaving group, and "x" represents an integer of 2 or more) and a part of the copolymer having the structure [A'-B'] is coupled to have {[A'-B' The step of the copolymer of x -Y} structure.

Y所表示之偶合劑殘基係因應以上述通式表示之嵌段共聚物或其氫化物之製造中所用之偶合劑來界定。 The coupling agent residue represented by Y is defined by a coupling agent used in the production of the block copolymer represented by the above formula or a hydride thereof.

作為偶合劑,例如可列舉:甲基二氯矽烷(methyl dichlorosilane)、二甲基二氯矽烷、甲基三氯矽烷、丁基三氯矽烷、四氯矽烷、二溴乙烷、四氯化錫、丁基三氯化錫、四氯化鍺、雙(三氯矽烷基)乙烷(bis(trichlorosilyl)ethane)等鹵素化合物;環氧化大豆油等環氧化合物;己二酸二乙酯、己二酸二甲酯、對苯二甲酸二甲酯、對苯二甲酸二乙酯等羰基化合物;二乙烯苯等聚乙烯化合物;聚異氰酸酯等。其中,就工業上容易獲得且反應性亦高之理由,故而甲基二氯矽烷、二甲基二氯矽烷、甲基三氯矽烷、四氯矽 烷為佳。 Examples of the coupling agent include methyl dichlorosilane, dimethyl dichloromethane, methyl trichlorodecane, butyl trichloromethane, tetrachlorodecane, dibromoethane, and tin tetrachloride. , halogen compounds such as butyltin trichloride, antimony tetrachloride, bis(trichlorosilyl)ethane; epoxy compounds such as epoxidized soybean oil; diethyl adipate, a carbonyl compound such as dimethyl diacid, dimethyl terephthalate or diethyl terephthalate; a polyvinyl compound such as divinylbenzene; a polyisocyanate. Among them, it is industrially easy to obtain and the reactivity is high, so methyl dichlorodecane, dimethyl dichlorodecane, methyl trichlorodecane, tetrachloroguanidine Alkane is preferred.

氫化係實施例如利用於氫化觸媒之存在下供給氫氣之方法即可。 The hydrogenation system may be, for example, a method of supplying hydrogen gas in the presence of a hydrogenation catalyst.

作為氫化觸媒,可使用含有元素週期表Ib、IVb、Vb、VIb、VIIb、VIII族金屬中之任一者之化合物。例如,可列舉含有Ti、V、Co、Ni、Zr、Ru、Rh、Pd、Hf、Re、Pt原子之化合物。具體而言,可使用含有Ti、Zr、Hf、Co、Ni、Rh、Ru等二茂金屬系化合物;或Pd、Ni、Pt、Rh、Ru等金屬被載於碳、二氧化矽、氧化鋁、矽藻土、鹼性活性碳等載體之載持型不均勻系觸媒。 As the hydrogenation catalyst, a compound containing any one of metals of Groups Ib, IVb, Vb, VIb, VIIb, and VIII of the periodic table can be used. For example, a compound containing atoms of Ti, V, Co, Ni, Zr, Ru, Rh, Pd, Hf, Re, and Pt may be mentioned. Specifically, a metallocene compound containing Ti, Zr, Hf, Co, Ni, Rh, Ru, or the like; or a metal such as Pd, Ni, Pt, Rh, or Ru can be used for carbon, cerium oxide, or aluminum oxide. Carrier-type heterogeneous catalysts such as diatomaceous earth and alkaline activated carbon.

作為二茂金屬系化合物之具體例,可列舉:具有2個配位基之Kaminsky觸媒、ansa(ansa)型二茂金屬觸媒、非交聯半茂金屬觸媒(half metallocene)、交聯半茂金屬觸媒等,且該配位基係以烷基取代環戊二烯基環(Cp環)或Cp環上之氫而成。若列舉具體之例,則可列舉如下所記載之觸媒:日本特開平1-275605號公報、日本特開平5-271326號公報、日本特開平5-271325號公報、日本特開平5-222115號公報、日本特開平11-292924號公報、日本特開2000-37632號公報、日本特開昭59-133203號公報、日本特開昭63-5401號公報、日本特開昭62-218403號公報、日本特開平7-90017號公報、日本特公昭43-19960號公報、日本特公昭47-40473號公報。該等各種觸媒可單獨使用,或組合2種以上使用。 Specific examples of the metallocene-based compound include a Kaminsky catalyst having two ligands, an ansa (ansa) type metallocene catalyst, a non-crosslinked metallocene catalyst, and crosslinking. A semimetallocene catalyst or the like, and the ligand is formed by substituting an alkyl group for a cyclopentadienyl ring (Cp ring) or a hydrogen on a Cp ring. For example, Japanese Patent Application Laid-Open No. Hei 1-275605, Japanese Patent Laid-Open No. Hei 5-271326, Japanese Patent Application Laid-Open No. Hei No. 5-271325, No. 5-222115 Japanese Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. Japanese Laid-Open Patent Publication No. Hei 7-90017, Japanese Patent Publication No. Sho 43-19960, and Japanese Patent Publication No. Sho 47-40473. These various catalysts may be used singly or in combination of two or more.

來自共軛二烯化合物單位之雙鍵,通常其80%以上、 較佳為90%以上、更佳為95%以上(例,約98%)被氫化。 a double bond derived from a unit of a conjugated diene compound, usually 80% or more thereof, Preferably, 90% or more, more preferably 95% or more (for example, about 98%) is hydrogenated.

此處,氫化之比率(氫化率)係使用四氯化碳作為溶劑並根據270 MHz、1H-NMR光譜而算出之氫化率。 Here, the hydrogenation ratio (hydrogenation rate) is a hydrogenation ratio calculated from 270 MHz and 1 H-NMR spectrum using carbon tetrachloride as a solvent.

2.4.其他成分 2.4. Other ingredients

該黏著劑組成物除上述共聚物(i)及(ii)以外,亦可視需要適當地含有增黏劑、苯乙烯系嵌段相補強劑(styrenic block phase-reinforcing agent)、軟化劑、抗氧化劑、光穩定劑、紫外線吸收劑、填充劑、顏料、抗黏著亢進劑、烯烴系樹脂、矽酮系聚合物、液狀丙烯酸系共聚物、磷酸酯系化合物等通常用於黏著劑組成物中之添加劑。 In addition to the above copolymers (i) and (ii), the adhesive composition may optionally contain a tackifier, a styrenic block phase-reinforcing agent, a softener, and an antioxidant. A light stabilizer, a UV absorber, a filler, a pigment, an anti-adhesion agent, an olefin resin, an anthrone polymer, a liquid acrylic copolymer, a phosphate compound, etc. are usually used in an adhesive composition. additive.

增黏劑例如可以進一步抑制黏著劑層殘渣之產生為目的而使用。增黏劑係指相溶於作為軟鏈段(soft segment)之橡膠層,且可控制黏著力者。再者,「相溶」係指藉由於共聚物組成物中添加增黏劑而獲得之混合物的tan δ峰值溫度成為與共聚物組成物之tan δ峰值溫度不同之值的狀態。再者,本說明書中,「tan δ峰值溫度」表示tan δ之最大溫度。 The tackifier can be used, for example, for the purpose of further suppressing the generation of the residue of the adhesive layer. The tackifier refers to a phase in which the rubber layer is dissolved as a soft segment and the adhesion can be controlled. In addition, "compatibility" means a state in which the tan δ peak temperature of the mixture obtained by adding a tackifier to the copolymer composition is a value different from the tan δ peak temperature of the copolymer composition. In addition, in this specification, "tan δ peak temperature" represents the maximum temperature of tan δ.

作為增黏劑,並無特別限定,,可無特別限制使用例如脂肪族共聚物、芳香族共聚物、脂肪族‧芳香族共聚物、脂環共聚物等石油系樹脂;薰草哢-茚系樹脂(coumarone-indene resin);萜烯樹脂;萜烯-酚系樹脂;聚合松脂等松脂系樹脂;(烷基)酚系樹脂;二甲苯系樹脂;或該等之氫化物等通常用於黏著劑者。較佳為具有90~140℃範圍內之軟化點的增黏劑。又,為了提高剝離性及耐候 性等,較佳為使用氫化物型之增黏劑。該等增黏劑可單獨使用1種,亦可併用2種以上。又,亦可使用市售之增黏劑,該市售增黏劑為含有如上述之增黏劑與烯烴樹脂組合之混合物。 The tackifier is not particularly limited, and a petroleum resin such as an aliphatic copolymer, an aromatic copolymer, an aliphatic ‧ aromatic copolymer or an alicyclic copolymer can be used without particular limitation; Coumarone-indene resin; terpene resin; terpene-phenolic resin; rosin resin such as polymerized rosin; (alkyl) phenol resin; xylene resin; or such hydrides, etc. Agent. A tackifier having a softening point in the range of 90 to 140 ° C is preferred. Also, in order to improve the peelability and weather resistance It is preferred to use a hydride type tackifier. These tackifiers may be used alone or in combination of two or more. Further, a commercially available tackifier may be used, and the commercially available tackifier is a mixture containing the above-mentioned tackifier in combination with an olefin resin.

當使用增黏劑時,其使用量之上限相對於共聚物組成物100質量份例如較佳為1~50質量份左右,更佳為1~40質量份左右。 When the tackifier is used, the upper limit of the amount used is, for example, about 1 to 50 parts by mass, more preferably about 1 to 40 parts by mass, per 100 parts by mass of the copolymer composition.

苯乙烯系嵌段相補強劑係補強芳香族烯基嵌段共聚物所形成之海島結構之島相的製劑,例如,可出於如下目的而使用:進一步抑制黏著層之黏著亢進;進一步提高表面保護膜之展開性;及進一步抑制將表面保護膜自被黏著體剝離時之殘糊黏著劑層殘渣之產生。 The styrene block phase reinforcing agent is a formulation of an island phase of a sea-island structure formed by reinforcing an aromatic alkenyl block copolymer, and can be used, for example, for the purpose of further suppressing adhesion of the adhesive layer; further improving the surface The spreadability of the protective film; and further suppressing the generation of the residual adhesive layer residue when the surface protective film is peeled off from the adherend.

苯乙烯系嵌段相補強劑可列舉:單體單位例如苯乙烯及α-甲基苯乙烯、對甲基苯乙烯、對氯苯乙烯、氯甲基苯乙烯、第三丁基苯乙烯、對乙基苯乙烯、二乙烯苯等苯乙烯系化合物。該等可單獨使用或組合2種以上使用。即,苯乙烯系嵌段相補強劑可藉由使該等單體聚合而獲得。於由2種以上之單體組成時,可為嵌段共聚物,亦可為無規共聚物。其中,苯乙烯系嵌段相補強劑較佳為具有100℃左右以上之軟化點,更佳為150℃以上。具體而言,較佳為使用Eastman Chemical公司製造之商品名「ENDEX155」(軟化點155℃)、「ENDEX160」(軟化點160℃)等。 Examples of the styrene-based block phase reinforcing agent include monomer units such as styrene and α-methylstyrene, p-methylstyrene, p-chlorostyrene, chloromethylstyrene, and t-butylstyrene. A styrene compound such as ethyl styrene or divinyl benzene. These may be used alone or in combination of two or more. That is, the styrene block phase reinforcing agent can be obtained by polymerizing the monomers. When it is composed of two or more kinds of monomers, it may be a block copolymer or a random copolymer. Among them, the styrene block phase reinforcing agent preferably has a softening point of about 100 ° C or more, more preferably 150 ° C or more. Specifically, it is preferable to use the trade name "ENDEX 155" (softening point 155 ° C) and "ENDEX 160" (softening point 160 ° C) manufactured by Eastman Chemical Co., Ltd., and the like.

於使用苯乙烯系嵌段相補強劑時,其使用量例如相對於共聚物組成物100質量份較佳為1~40質量份左右,更 佳為1~30質量份左右。 When the styrene-based block phase reinforcing agent is used, the amount thereof is preferably, for example, about 1 to 40 parts by mass based on 100 parts by mass of the copolymer composition. It is about 1 to 30 parts by mass.

軟化劑例如可為了進一步提高黏著層之黏著力而使用。軟化劑並無特別限制,可使用例如:低分子量之二烯系聚合物、聚異丁烯(polyisobutylene)、氫化聚異戊二烯、氫化聚丁二烯、石蠟系加工油(process oil)、環烷(naphthene)系加工油、芳香族加工油、蓖麻油、妥爾油(tall oil)、天然油、液體聚異丁烯樹脂、聚丁烯或該等之氫化物等通常用於黏著劑者。 The softener can be used, for example, to further increase the adhesion of the adhesive layer. The softening agent is not particularly limited, and for example, a low molecular weight diene polymer, polyisobutylene, hydrogenated polyisoprene, hydrogenated polybutadiene, paraffin process oil, naphthenic acid can be used. (naphthene) is a processing oil, an aromatic processing oil, castor oil, tall oil, natural oil, liquid polyisobutylene resin, polybutene or the like, and the like, which is usually used for an adhesive.

作為抗氧化劑,並無特別限定,例如可列舉:酚系(單酚系、雙酚系、高分子型酚系)抗氧化劑、硫系抗氧化劑、磷系抗氧化劑等。 The antioxidant is not particularly limited, and examples thereof include a phenol-based (monophenol-based, bisphenol-based, and polymeric phenol-based) antioxidant, a sulfur-based antioxidant, and a phosphorus-based antioxidant.

作為光穩定化劑,並無特別限定,例如可列舉阻胺系化合物。 The light stabilizer is not particularly limited, and examples thereof include a hindered amine compound.

作為紫外線吸收劑,並無特別限定,例如可列舉:水楊酸系紫外線吸收劑、二苯基酮系紫外線吸收劑、苯并三唑系紫外線吸收劑、氰基丙烯酸酯(cyanoacrylate)系紫外線吸收劑等。 The ultraviolet absorber is not particularly limited, and examples thereof include a salicylic acid-based ultraviolet absorber, a diphenylketone-based ultraviolet absorber, a benzotriazole-based ultraviolet absorber, and a cyanoacrylate-based ultraviolet absorber. Agents, etc.

作為填充劑,例如可列舉:碳酸鈣、碳酸鎂、二氧化矽、氧化鋅、氧化鈦等。 Examples of the filler include calcium carbonate, magnesium carbonate, cerium oxide, zinc oxide, and titanium oxide.

作為抗黏著亢進劑,可列舉:脂肪酸醯胺、聚乙亞胺(polyethyleneimine)之長鏈烷基接枝物、大豆油改質醇酸樹脂(例如,荒川化學工業公司製造之商品名「ARAKYD 251」等)、妥爾油改質醇酸樹脂(例如,荒川化學工業公司製造之商品名「ARAKYD 6300」等)等。 Examples of the anti-adhesive agent include a fatty acid decylamine, a long-chain alkyl graft of polyethyleneimine, and a soybean oil-modified alkyd resin (for example, a product name "ARAKYD 251" manufactured by Arakawa Chemical Industries, Ltd. ", etc.), tall oil modified alkyd resin (for example, trade name "ARAKYD 6300" manufactured by Arakawa Chemical Industries Co., Ltd.), and the like.

該等添加劑可單獨使用,或組合2種以上使用。 These additives may be used singly or in combination of two or more.

2.5.製造方法 2.5. Manufacturing method

本發明之黏著劑組成物係藉由以慣用之方法混合共聚物(I)及(II)以及視需要使用之添加劑而製造。 The adhesive composition of the present invention is produced by mixing the copolymers (I) and (II) and additives as needed in a conventional manner.

3.表面保護膜 3. Surface protection film

本發明之表面保護膜具有:基材層、與配置於上述基材層一個主面上的由上述本發明之黏著劑組成物組成之黏著層。 The surface protective film of the present invention comprises a base material layer and an adhesive layer composed of the above-described adhesive composition of the present invention disposed on one main surface of the base material layer.

3.1基材層 3.1 substrate layer

本發明之表面保護膜中基材層較佳為聚烯烴基材層。 The base material layer in the surface protective film of the present invention is preferably a polyolefin base material layer.

該「聚烯烴」例如可列舉:低密度聚乙烯、中密度聚乙烯、高密度聚乙烯、直鏈低密度聚乙烯、乙烯-α-烯烴共聚物、乙烯-丙烯酸乙酯共聚物、乙烯-乙酸乙烯酯共聚物、乙烯-丙烯酸甲酯共聚物、乙烯-丙烯酸正丁酯共聚物、及聚丙烯(均聚物、無規共聚物、嵌段共聚物)等。又,「聚烯烴」亦可為具有取代基之聚烯烴。該等可單獨使用,或組合2種以上使用。 Examples of the "polyolefin" include low density polyethylene, medium density polyethylene, high density polyethylene, linear low density polyethylene, ethylene-α-olefin copolymer, ethylene-ethyl acrylate copolymer, and ethylene-acetic acid. A vinyl ester copolymer, an ethylene-methyl acrylate copolymer, an ethylene-n-butyl acrylate copolymer, and a polypropylene (a homopolymer, a random copolymer, a block copolymer) and the like. Further, the "polyolefin" may also be a polyolefin having a substituent. These may be used alone or in combination of two or more.

基材層進而亦可含有聚烯烴以外之樹脂。又,基材層亦可由聚烯烴、所需聚烯烴以外之樹脂、以及於表面保護膜之製造過程中產生之聚烯烴基材層及/或表面保護膜端材所形成。 The base material layer may further contain a resin other than polyolefin. Further, the base material layer may be formed of a polyolefin, a resin other than the desired polyolefin, and a polyolefin base material layer and/or a surface protective film end material produced in the production process of the surface protective film.

基材層可為單層,亦可為具有不同組成之2種以上之多層結構之層。 The base material layer may be a single layer or a layer having a multilayer structure of two or more different compositions.

於基材層具有由聚烯烴、所需聚烯烴以外之樹脂、以及於表面保護膜之製造過程中產生之聚烯烴基材層及/或表面保護膜端材所形成之層時,該層較佳為鄰接於黏著層。 When the substrate layer has a layer formed of a polyolefin, a resin other than the desired polyolefin, and a polyolefin substrate layer and/or a surface protective film end material produced in the process of manufacturing the surface protective film, the layer is more Good is adjacent to the adhesive layer.

基材層之厚度可根據表面保護膜之用途等來適當調整。通常,設定為10~100 μm左右之厚度為佳。 The thickness of the base material layer can be appropriately adjusted depending on the use of the surface protective film or the like. Generally, it is preferable to set the thickness to about 10 to 100 μm.

藉此,即便於將本態樣之表面保護膜貼附於稜鏡片表面以進行積層保管時,亦可使稜鏡片之透鏡部(稜鏡)上難以產生損傷,因此可良好地用於保護稜鏡片之稜鏡面。 Therefore, even when the surface protective film of the present aspect is attached to the surface of the enamel sheet for laminating storage, the lens portion of the cymbal sheet can be hardly damaged, so that it can be favorably used for protecting the cymbal sheet. After the face.

尤其是,藉由該基材層背面之表面粗糙度、波紋度平均高度、及波紋度平均長度為上述特定範圍,而於將複數片貼附有表面保護膜者進行積層保管時,即便有微小之卡入異物,該微小之卡入異物亦能進入表面起伏之凹陷部分,故認為與表面平滑之情形相比,可使集中於透鏡部之應力下降。 In particular, when the surface roughness, the average waviness height, and the average waviness length of the back surface of the base material layer are within the above specific range, even if a plurality of sheets are attached with a surface protective film, even if there is a small amount When the foreign matter is stuck, the small foreign matter can enter the concave portion of the surface undulation, and it is considered that the stress concentrated on the lens portion can be lowered as compared with the case where the surface is smooth.

3.2.黏著層 3.2. Adhesive layer

上述黏著層係由本發明之黏著劑組成物形成。 The above adhesive layer is formed of the adhesive composition of the present invention.

黏著層之厚度並無特別限制,若使用本發明之黏著劑組成物,則即便為相對較薄之黏著層亦可獲得足夠之黏著力,例如,通常為0.5~20 μm左右,較佳為1~15 μm,更佳為2~10 μm。可藉由使黏著層變薄而削減製造成本,且可抑制黏著亢進。 The thickness of the adhesive layer is not particularly limited. If the adhesive composition of the present invention is used, sufficient adhesion can be obtained even for a relatively thin adhesive layer, for example, usually about 0.5 to 20 μm, preferably 1 ~15 μm, more preferably 2~10 μm. The manufacturing cost can be reduced by making the adhesive layer thin, and adhesion can be suppressed.

3.3.製造方法 3.3. Manufacturing method

本發明之表面保護膜例如可藉由如下方法製造:藉由擠出成形而製造基材片(基材層)後,使上述黏著劑組成 物熔融或溶解而成之液體塗佈或噴霧於基材片的方法;使藉由吹製法(inflation)而得之基材片與黏著片貼合之方法;或使用具備多層歧管(manifold)之T型模將基材原料與上述黏著劑組成物共擠出之方法。其中,由於可獲得基材層與黏著層密合之多層片,故而較佳為藉由共擠出來製造之方法。再者,使本發明之黏著劑組成物熔融或溶解而成之液體亦又包含於本發明之黏著劑組成物。 The surface protective film of the present invention can be produced, for example, by a method in which a substrate sheet (base material layer) is produced by extrusion molding, and the above adhesive composition is formed. a method of coating or spraying a liquid obtained by melting or dissolving a substrate sheet; a method of bonding a substrate sheet obtained by an inflation method to an adhesive sheet; or using a multi-layer manifold The T-die mold coextrudes the substrate material with the above-mentioned adhesive composition. Among them, since a multilayer sheet in which a base material layer and an adhesive layer are adhered can be obtained, a method of production by co-extrusion is preferred. Further, a liquid obtained by melting or dissolving the adhesive composition of the present invention is also included in the adhesive composition of the present invention.

4.應用 4. Application

本發明之表面保護膜可較佳地用於各種製品(零件)之表面保護。其中,可較佳地用於光學板及擴散膜等具有凹凸之被黏著體,但並不限於此,例如亦可用於表面平滑片材之表面保護。 The surface protective film of the present invention can be preferably used for surface protection of various articles (parts). Among them, it can be preferably used for an adherend having irregularities such as an optical plate and a diffusion film. However, the present invention is not limited thereto, and can be used, for example, for surface protection of a surface smooth sheet.

作為構成為被黏著體之片材材料,並無特別限定,可列舉具有透光性之樹脂,例如丙烯酸系樹脂、聚碳酸酯等。 The material of the sheet to be adhered to the adherend is not particularly limited, and examples thereof include a resin having light transmissivity, such as an acrylic resin or polycarbonate.

[實施例] [Examples]

以下,基於實施例來對本發明之表面保護膜進行詳細說明,但本發明並不限定於以下實施例。 Hereinafter, the surface protective film of the present invention will be described in detail based on examples, but the present invention is not limited to the following examples.

(共聚物組成物之製造) (Manufacture of copolymer composition) (聚合物嵌段A之合成) (Synthesis of Polymer Block A)

於經氮氣置換之反應容器加入500質量份經脫氣脫水之環己烷、15質量份之苯乙烯及5質量份之四氫呋喃,並於聚合起始溫度40℃添加0.13質量份之正丁基鋰(n-butyllithium),進行升溫聚合。 500 parts by mass of degassed dehydrated cyclohexane, 15 parts by mass of styrene and 5 parts by mass of tetrahydrofuran were added to a nitrogen-substituted reaction vessel, and 0.13 parts by mass of n-butyllithium was added at a polymerization initiation temperature of 40 ° C. (n-butyllithium), temperature polymerization is carried out.

(聚合物嵌段B之合成) (Synthesis of polymer block B)

聚合物A之聚合轉化率達約100%後,使反應液冷卻至15℃,繼而,加入55質量份之1,3-丁二烯及30質量份之苯乙烯,進一步進行升溫聚合。 After the polymerization conversion ratio of the polymer A was about 100%, the reaction liquid was cooled to 15 ° C, and then 55 parts by mass of 1,3-butadiene and 30 parts by mass of styrene were added, and the temperature polymerization was further carried out.

(共聚物(i)及(ii)之合成) (Synthesis of copolymers (i) and (ii))

聚合轉化率達約100%後,加入0.06質量份之甲基二氯矽烷作為偶合劑來進行偶合反應。偶合反應結束後,一面以0.4 MPa-Gauge之壓力供給氫氣一面放置10分鐘。一部分提取之聚合物,其聚合物嵌段B中共軛二烯單位之乙烯鍵含量為73%,重量平均分子量為約16萬,偶合率為40%。 After the polymerization conversion ratio was about 100%, 0.06 parts by mass of methyldichlorodecane was added as a coupling agent to carry out a coupling reaction. After the completion of the coupling reaction, the hydrogen gas was supplied while being pressurized at a pressure of 0.4 MPa-Gauge for 10 minutes. A part of the extracted polymer has a vinyl bond content of 73% in a conjugated diene unit in the polymer block B, a weight average molecular weight of about 160,000, and a coupling ratio of 40%.

其後,於反應容器內加入0.03質量份之氯化二乙基鋁(diethylaluminium chloride)及0.06質量份之bis(cyclopentadienyl)titanium furfuryl chloride並進行攪拌。於氫氣供給壓0.7 MPa-Gauge、反應溫度80℃開始氫化反應,並於氫之吸收結束時使反應溶液恢復至常溫、常壓,再自反應容器取出,藉此獲得由共聚物(i)及(ii)組成之共聚物組成物(表1之合成例1)。 Thereafter, 0.03 parts by mass of diethylaluminium chloride and 0.06 parts by mass of bis(cyclopentadienyl)tifurum furfuryl chloride were added to the reaction vessel and stirred. The hydrogenation reaction is started at a hydrogen supply pressure of 0.7 MPa-Gauge and a reaction temperature of 80 ° C, and the reaction solution is returned to normal temperature and normal pressure at the end of the absorption of hydrogen, and then taken out from the reaction vessel, thereby obtaining the copolymer (i) and (ii) Composition of the copolymer composition (Synthesis Example 1 of Table 1).

以下,使用組成比不同之原料,進行相同操作來獲得所需之共聚物組成物(表1之合成例1~8)。將該等共聚物組成物之性質示於表1。表中,「wt%」表示質量%。聚合物嵌段B中共軛二烯單位之乙烯鍵含量簡記為「乙烯鍵含量」。 Hereinafter, the same operation as the raw materials having different composition ratios was carried out to obtain a desired copolymer composition (Synthesis Examples 1 to 8 of Table 1). The properties of the copolymer compositions are shown in Table 1. In the table, "wt%" means mass%. The vinyl bond content of the conjugated diene unit in the polymer block B is simply referred to as "vinyl bond content".

(實施例1~5、比較例1~3) (Examples 1 to 5, Comparative Examples 1 to 3)

於基材中,使用聚丙烯(PrimePolymer公司製造之J715M),以T模法將基材與利用上述各合成方法而得之各共聚物組成物進行共擠出成形,藉此使34 μm厚之基材層與6 μm厚之黏著層積層一體化而成之實施例1~5及比較例1~3之表面保護膜成形,而獲得捲繞於內徑3英吋之紙芯的捲繞體。 In the substrate, polypropylene (manufactured by Prime Polymer Co., Ltd., J715M) was used, and the substrate and the respective copolymer compositions obtained by the above respective synthesis methods were co-extruded by a T-die method to thereby make a 34 μm thick layer. The surface protective film of Examples 1 to 5 and Comparative Examples 1 to 3 in which the base material layer and the 6 μm thick adhesive layer were integrated was formed, and a wound body wound around a paper core having an inner diameter of 3 inches was obtained. .

(評價試驗) (evaluation test)

對以上述方式獲得之各表面保護膜,進行以下(1)~(4)項目之評價。將該等之結果示於表2。 The following (1) to (4) items were evaluated for each of the surface protective films obtained in the above manner. The results of these are shown in Table 2.

(1)成膜性 (1) Film formation

以目視觀察由上述方式進行共擠出所製膜而成之各表面保護膜的外觀,並進行評價。表中記號「○」表示外觀上沒有問題。 The appearance of each surface protective film formed by co-extrusion of the film formed as described above was visually observed and evaluated. The symbol "○" in the table indicates that there is no problem in appearance.

(2)初始黏著力 (2) Initial adhesion

於室溫23℃及相對濕度50%之環境下,使用桌上貼合機,以壓力5.9×105 Pa及速度30 mm/min之速度,將各表面保護膜分別貼附於丙烯酸系板(表面粗糙度0.10 μm以下)、及使表面粗糙度成為0.30~0.80 μm之方式研磨表面之SUS(不鏽鋼)板。於該環境下放置30分鐘後,依據JIS Z0237之方法,以300 mm/min之速度測定該等膜(25 mm寬)之180度剝離黏著力,並將其作為初始黏著力。 Each surface protective film was attached to an acrylic plate at a pressure of 5.9×10 5 Pa and a speed of 30 mm/min using a tabletop laminator at room temperature of 23° C. and a relative humidity of 50%. The surface roughness is 0.10 μm or less, and the surface of the SUS (stainless steel) plate is polished so that the surface roughness is 0.30 to 0.80 μm. After standing for 30 minutes in this environment, the 180-degree peel adhesion of the films (25 mm width) was measured at a speed of 300 mm/min according to JIS Z0237, and this was used as the initial adhesion.

再者,此時,以目視觀察丙烯酸系板及SUS板之表面,確認於丙烯酸系板表面沒有黏著層之殘渣。 In this case, the surfaces of the acrylic plate and the SUS plate were visually observed, and it was confirmed that there was no residue of the adhesive layer on the surface of the acrylic plate.

(3)經時黏著力 (3) Time-dependent adhesion

於室溫23℃及相對濕度50%之環境下,使用桌上貼合機,以壓力5.9×105 Pa及速度30 mm/min之速度,將各表面保護膜分別貼附於用於上述(2)之初始黏著力評價之丙烯酸系板及SUS板之表面。其後,於60℃或80℃之環境下放置30分鐘,繼而於室溫下放置30分鐘,此後依據JIS Z0237之方法,以300 mm/min之速度測定該等膜(25 mm寬)之180度剝離黏著力。 Each surface protective film was attached to the above for use at a temperature of 23 ° C and a relative humidity of 50% using a table laminator at a pressure of 5.9 × 10 5 Pa and a speed of 30 mm / min. 2) The surface of the acrylic plate and SUS plate evaluated for the initial adhesion. Thereafter, it was allowed to stand at 60 ° C or 80 ° C for 30 minutes, and then left at room temperature for 30 minutes, after which the film (25 mm width) was measured at a speed of 300 mm/min according to JIS Z0237. Degree of peeling adhesion.

再者,此時,以目視觀察丙烯酸系板及SUS板之表面,確認於丙烯酸系板表面沒有黏著層之殘渣。 In this case, the surfaces of the acrylic plate and the SUS plate were visually observed, and it was confirmed that there was no residue of the adhesive layer on the surface of the acrylic plate.

以上述方式測出之剝離黏著力作為經時黏著力,並利用下述式算出自初始黏著力至經時黏著力之變化比(黏著亢進比)。 The peeling adhesive force measured in the above manner was used as the temporal adhesive force, and the change ratio from the initial adhesive force to the temporal adhesive force (adhesion ratio) was calculated by the following formula.

變化比(黏著亢進比)=(經時黏著力/初始黏著力) Ratio of change (adhesion ratio) = (time-dependent adhesion / initial adhesion)

<判定基準> <Judgement criteria>

變化比(黏著亢進比) Ratio of change (adhesion ratio)

◎(優異):未達1.5 ◎ (excellent): less than 1.5

○(良好):1.5以上、2以下 ○ (good): 1.5 or more and 2 or less

×(不良):超過2 × (bad): more than 2

(4)自背面黏著力 (4) adhesion from the back

利用桌上貼合機,於壓力5.9×105 Pa及速度30 m/min之條件下貼合實施例及比較例之各表面保護膜,並分別於室溫、80℃之環境下放置60分鐘。 Each surface protective film of the examples and the comparative examples was bonded under the conditions of a pressure of 5.9×10 5 Pa and a speed of 30 m/min using a table bonding machine, and left at room temperature and 80° C. for 60 minutes. .

自80℃之環境取出至室溫下,放置30分鐘後,包括於 室溫環境下放置者,依據JIS Z0237,以15 m/min之速度測定25 mm寬之180度剝離強度。 Removed from room temperature to room temperature at 80 ° C, placed for 30 minutes, included in For placement at room temperature, a 180-degree peel strength of 25 mm width is measured at a speed of 15 m/min according to JIS Z0237.

(5)終止標記評價 (5) Termination mark evaluation

利用桌上貼合機,於壓力5.9×105 Pa及速度30 m/分之條件下貼附實施例及比較例之各表面保護膜,並於80℃之環境放置60分鐘。將其取出至室溫,放置30分鐘後,依據JIS Z0237,以15 m/min之速度測定25 mm寬之180度剝離強度,並評價有無終止標記。 Each surface protective film of the examples and the comparative examples was attached under the conditions of a pressure of 5.9 × 10 5 Pa and a speed of 30 m / min using a table bonding machine, and allowed to stand in an environment of 80 ° C for 60 minutes. This was taken out to room temperature, and after standing for 30 minutes, a 180-degree peel strength of 25 mm width was measured at a speed of 15 m/min in accordance with JIS Z0237, and the presence or absence of the termination mark was evaluated.

其後,於壓力5.9×105 Pa及速度30 m/min之條件,將經剝離之表面保護膜貼附於由厚度為60 μm之丙烯酸系樹脂形成之稜鏡片(稜鏡之間距50 μm,高度25 μm),並於60℃環境下放置30分鐘,剝離表面保護膜後,以目視評價有無轉印至稜鏡片的終止標記。再者,為了例示終止標記,而載有比較例2之表面保護膜之照片。 Thereafter, the peeled surface protective film was attached to a crucible formed of an acrylic resin having a thickness of 60 μm at a pressure of 5.9 × 10 5 Pa and a speed of 30 m/min (the distance between the crucibles was 50 μm, The height was 25 μm), and it was allowed to stand in an environment of 60 ° C for 30 minutes. After peeling off the surface protective film, the presence or absence of the end mark transferred to the enamel sheet was visually evaluated. Further, in order to exemplify the termination mark, a photograph of the surface protective film of Comparative Example 2 was carried.

<判定標準> <Judgement criteria>

◎(優異):於膜未觀察到終止標記,且未轉印至稜鏡片 ◎ (excellent): no end mark was observed on the film and was not transferred to the bracts

○(良好):於膜觀察到終止標記,但未轉印至稜鏡片 ○ (good): the end mark was observed on the film but not transferred to the bracts

×(不良):於膜觀察到終止標記,且轉印至稜鏡片 × (bad): a stop mark was observed on the film and transferred to the bracts

[產業上之可利用性] [Industrial availability]

本發明之黏著劑組成物適合用於擴散膜等表面保護膜之黏著層。本發明之表面保護膜適合用於擴散膜等之表面保護。 The adhesive composition of the present invention is suitably used for an adhesive layer of a surface protective film such as a diffusion film. The surface protective film of the present invention is suitable for surface protection of a diffusion film or the like.

圖1係顯示終止標記之照片(比較例2)。 Fig. 1 is a photograph showing the termination mark (Comparative Example 2).

Claims (3)

一種黏著劑組成物,係含有共聚物(i)及共聚物(ii),共聚物(i)係含有下述聚合物嵌段A及下述聚合物嵌段B,且具有以通式[A-B]n(式中,A表示聚合物嵌段A,B表示聚合物嵌段B,n表示1~3之整數)所示結構之共聚物(I)或其氫化物,共聚物(ii)係含有下述聚合物嵌段A及下述聚合物嵌段B,且具有以通式A-B-A(式中之記號表示與上述意義相同)或以通式(A-B)x-Y(式中,x表示1以上之整數,Y表示偶合劑殘基,其他記號表示與上述意義相同)所示結構之共聚物(II)或其氫化物,聚合物嵌段B中共軛二烯單位之乙烯鍵含量為70~85%之範圍內,且,以共聚物(i)及(ii)之總單體質量為基準,全部聚合物嵌段B中芳香族烯基化合物單位含量(St(B))為15~35質量%之範圍內;聚合物嵌段A:芳香族烯基化合物單位為連續,且主要由芳香族烯基化合物單位所構成之聚合物嵌段聚合物嵌段B:無規地含有共軛二烯單位及芳香族烯基化合物單位之芳香族烯基-共軛二烯共聚合物嵌段。 An adhesive composition comprising a copolymer (i) and a copolymer (ii), the copolymer (i) comprising the following polymer block A and the following polymer block B, and having the general formula [AB ] n-(wherein, A represents the polymer block A, B represents polymer block B, n represents an integer of 1 to 3) shown in copolymer (I), or a hydride of structure, copolymer (ii) based Containing the following polymer block A and the following polymer block B, and having the general formula ABA (the symbol in the formula is the same as defined above) or the general formula (AB) x -Y (wherein x is represented by a copolymer (II) having a structure of 1 or more, Y represents a coupling agent residue, and other symbols represent the same meaning as defined above, or a hydride thereof, and a conjugated diene unit in the polymer block B has a vinyl bond content of 70 Within the range of ~85%, and based on the total monomer mass of the copolymers (i) and (ii), the unit content (St(B)) of the aromatic alkenyl compound in all the polymer blocks B is 15~ In the range of 35 mass%; polymer block A: the aromatic alkenyl compound unit is continuous, and the polymer block polymer block B composed mainly of aromatic alkenyl compound units: randomly contains a conjugate An aromatic alkenyl-conjugated diene copolymer block of a diene unit and an aromatic alkenyl compound unit. 如申請專利範圍第1項之黏著劑組成物,其中,聚合物嵌段B整體之芳香族烯基化合物單位含量(St(b))為 10~40質量%之範圍,共聚物(i)及(ii)整體之芳香族烯基化合物單位含量(St(A+B))為35~55質量%之範圍內,且聚合物嵌段A之總量與聚合物嵌段B之總量的質量比(A:B)為5:95~30:70之範圍內。 The adhesive composition of claim 1, wherein the unit content of the aromatic alkenyl compound (St(b)) of the polymer block B as a whole is In the range of 10 to 40% by mass, the unit content (St(A+B)) of the copolymer (i) and (ii) as a whole aromatic alkenyl compound is in the range of 35 to 55% by mass, and the polymer block A The mass ratio (A:B) of the total amount to the total amount of the polymer block B is in the range of 5:95 to 30:70. 一種表面保護膜,係具有基材層、與配置於上述基材層之一個主面上之由申請專利範圍第1或2項之黏著劑組成物所構成的黏著層。 A surface protective film comprising an adhesive layer composed of a base material layer and an adhesive composition according to claim 1 or 2 disposed on one main surface of the base material layer.
TW101124585A 2011-07-07 2012-07-06 Adhesive composition and adhesive sheet for surface protection TW201302959A (en)

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Publication number Priority date Publication date Assignee Title
TWI690576B (en) * 2017-09-04 2020-04-11 日商東洋紡股份有限公司 Adhesive resin composition and protective film using the adhesive resin composition

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