TW201248322A - Photosensitive resin composition, low dielectric constant light shielding layer and liquid crystal display apparatus using the same - Google Patents

Photosensitive resin composition, low dielectric constant light shielding layer and liquid crystal display apparatus using the same Download PDF

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TW201248322A
TW201248322A TW101107616A TW101107616A TW201248322A TW 201248322 A TW201248322 A TW 201248322A TW 101107616 A TW101107616 A TW 101107616A TW 101107616 A TW101107616 A TW 101107616A TW 201248322 A TW201248322 A TW 201248322A
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group
acid
resin composition
photosensitive resin
epoxy
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TW101107616A
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Chinese (zh)
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TWI544279B (en
Inventor
Seok Han
Gyung-Sik Choi
Jong-Ho Na
Sun Ryu
Hag-Ju Lee
Hyeon-Jin Yun
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Rohm & Haas Elect Mat
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D207/00—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom
    • C07D207/02—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom
    • C07D207/04—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom having no double bonds between ring members or between ring members and non-ring members
    • C07D207/08—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom having no double bonds between ring members or between ring members and non-ring members with hydrocarbon radicals, substituted by hetero atoms, attached to ring carbon atoms
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D231/00—Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings
    • C07D231/02—Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings not condensed with other rings
    • C07D231/10—Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings not condensed with other rings having two or three double bonds between ring members or between ring members and non-ring members
    • C07D231/14—Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings not condensed with other rings having two or three double bonds between ring members or between ring members and non-ring members with hetero atoms or with carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals, directly attached to ring carbon atoms
    • C07D231/18—One oxygen or sulfur atom
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D409/00—Heterocyclic compounds containing two or more hetero rings, at least one ring having sulfur atoms as the only ring hetero atoms
    • C07D409/02—Heterocyclic compounds containing two or more hetero rings, at least one ring having sulfur atoms as the only ring hetero atoms containing two hetero rings
    • C07D409/12—Heterocyclic compounds containing two or more hetero rings, at least one ring having sulfur atoms as the only ring hetero atoms containing two hetero rings linked by a chain containing hetero atoms as chain links
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D417/00—Heterocyclic compounds containing two or more hetero rings, at least one ring having nitrogen and sulfur atoms as the only ring hetero atoms, not provided for by group C07D415/00
    • C07D417/02—Heterocyclic compounds containing two or more hetero rings, at least one ring having nitrogen and sulfur atoms as the only ring hetero atoms, not provided for by group C07D415/00 containing two hetero rings
    • C07D417/12—Heterocyclic compounds containing two or more hetero rings, at least one ring having nitrogen and sulfur atoms as the only ring hetero atoms, not provided for by group C07D415/00 containing two hetero rings linked by a chain containing hetero atoms as chain links
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09B—ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES, e.g. PIGMENTS; MORDANTS; LAKES
    • C09B11/00—Diaryl- or thriarylmethane dyes
    • C09B11/04—Diaryl- or thriarylmethane dyes derived from triarylmethanes, i.e. central C-atom is substituted by amino, cyano, alkyl
    • C09B11/10—Amino derivatives of triarylmethanes
    • C09B11/24—Phthaleins containing amino groups ; Phthalanes; Fluoranes; Phthalides; Rhodamine dyes; Phthaleins having heterocyclic aryl rings; Lactone or lactame forms of triarylmethane dyes
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/22—Absorbing filters
    • G02B5/223—Absorbing filters containing organic substances, e.g. dyes, inks or pigments
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Optics & Photonics (AREA)
  • Materials For Photolithography (AREA)
  • Optical Filters (AREA)

Abstract

The present invention relates to a photosensitive resin composition comprising a photopolymerizable unsaturated binder resin, an ethylenically unsaturated functional monomer, a polymerization initiator, a black organic mixed pigment, and a solvent, wherein the photopolymerizable unsaturated binder resin is formed by reacting an epoxy adduct obtained by adding an unsaturated basic acid to an epoxy resin represented by formula (I) with a polybasic acid anhydride. The present invention provides a photosensitive resin composition for a light shielding layer that can exhibit an improved light shielding performance represented by an optical density of 1. 0 or more per unit μ m, and superior properties in terms of elastic recovery rates, adhesion to a substrate and development margin, and that can express a high resolution of pattern having the height difference, wherein lines and dots having a size of from 10 to 100 μ m can be formed due to a good solubility in a developer before and after exposure to light and wherein the dielectric constant of the lines and dots thus formed is 8 F/m or less.

Description

201248322 六、發明說明： 【發明所屬之技術領域】 本發明有關一種光敏樹脂組成物、一種具有低介電常 數之光屏蔽層以及一種使用該光屏蔽層之液晶顯示器設 備’特別是一種用於具有高解析度、低介，電常數以及高光 屏蔽性質之光屏蔽層之驗溶性光敏樹脂組成物、以及一種 使用該光屏蔽層之液晶顯示器設備。 【先前技術] 液晶顯示器（LCD)為當今最廣泛使用之平面顯示器的 一種’其中包括晝素電極之薄膜電晶體（TFT)陣列和包括共 電極之彩色濾波器陣列排列成使其彼此相對。液晶（LC)層 置於它們之間。此液晶顯示器裝置藉由在畫素電極和共電 極之間施加電壓而使LC層中所含之LC分子重新對準及控 制光傳導量，進而顧示影像。 最近，具有諸如輕重量、薄度、低價格、低功率消耗 以及積體電路之增進的適合性等之特徵之LCD被廣泛地使 用於各種應用中，諸如，膝上型電腦、掌上型電腦、彩色 TV顯示器等等。 由於最近對於更大尺寸之顯示器之要求，曾將目標對 準小型移動式顯示器裝置和監測器之LCD市場現在轉移至 大螢幕之TV和監測器。因此，有各種嘗試欲使面板更薄。 作為一個例子，相對於其中彩色濾波器陣列和TFT陣列係 刀開製造然後組裝之傳統技術，有一種直接在TFT陣列上 製造彩色濾波器陣列之方法。 95523 4 .201248322 * 於此方法中，黑矩陣（black matrix)應不僅作為光屏 ' 蔽層’亦作為在上和下板之間維持特定空隙之間隔物。再 者’其應具有低介電性質’以使其在TFT源極/沒極電極和 氧化銦錫（ΙΤ0)晝素電極之間作為絕緣層。尤其，由於主要 間隔物和次間隔物（subspacer)之間必須有差異，最終間隔 物之高度與能量曝光應成比例。又，黑矩陣必須擁有良好 的彈性恢復率，以承受上板所施加之壓力。 由於用於黑矩陣之光敏樹脂組成物包括經摻和以形成 用於屏蔽光之黑色之不同顏色或種類之色素，其可含有不 溶於液體顯影劑中之多種色素。這可產生諸如差的可顯影 性、延長的顯影時間以及差的解析度等問題。 【發明内容】 據此，本發明之目的為提供一種用於光屏蔽層之光敏 樹脂組成物，該光屏蔽層可展現由每單位微米（以…為1.0 或更高之光學密度所表示之增進之光屏蔽效能，以及就彈 性恢復率、對基板之附著力及顯影邊界（development margin)而言卓越的性質，而且可表現具有高度差異之高解 析度圖案，其中由於曝光於光之前與之後在顯影劑中有良 好溶解度，而可以形成具有10至1〇〇 之尺寸之線條和 圓點’以及其中因而形成之線條和圓點之介電常數為8法 拉/公尺（F/m)或更少。 本發明之另一目的為提供一種包括從該光敏樹脂組成 物形成之經固化塗佈膜之光屏蔽層。 本發明之又一目的為提供一種包括該光屏蔽層之液晶 95523 5 201248322 顯示器設備。 為了達成此等目的，本發明之一個態樣為提供一種包 括光可聚合性不飽和黏合劑樹脂、烯系不飽和官能性單 體聚σ起始劑、黑色有機混合色素、及溶劑之光敏樹脂 組成物，其中該光可聚合性不飽和黏合劑樹脂係藉由使在 式（I)所示之環氧樹脂中添加不飽和酸（unsaturated basic acid)而獲得之環氧加成物與多元酸酐反應而形成：201248322 VI. Description of the Invention: [Technical Field] The present invention relates to a photosensitive resin composition, a light shielding layer having a low dielectric constant, and a liquid crystal display device using the same, particularly for A high-resolution, low-intermediate, low-conductivity, high-light-shielding property of a light-shielding layer of a light-sensitive photosensitive resin composition, and a liquid crystal display device using the light-shielding layer. [Prior Art] A liquid crystal display (LCD) is one of the most widely used flat panel displays. A thin film transistor (TFT) array including a halogen electrode and a color filter array including a common electrode are arranged to face each other. A liquid crystal (LC) layer is placed between them. The liquid crystal display device realigns and controls the amount of light conducted by the LC molecules contained in the LC layer by applying a voltage between the pixel electrodes and the common electrode, thereby further reflecting the image. Recently, LCDs having characteristics such as light weight, thinness, low price, low power consumption, and improved suitability of integrated circuits have been widely used in various applications such as laptops, palmtops, Color TV display and more. Due to recent requirements for larger displays, the LCD market, which targets the small mobile display devices and monitors, is now being transferred to TVs and monitors for large screens. Therefore, there are various attempts to make the panel thinner. As an example, there is a method of fabricating a color filter array directly on a TFT array with respect to a conventional technique in which a color filter array and a TFT array are fabricated and assembled. 95523 4 .201248322 * In this method, the black matrix should serve not only as a screen 'mask' but also as a spacer for maintaining a specific gap between the upper and lower plates. Further, it should have a low dielectric property such that it functions as an insulating layer between the TFT source/nopole electrode and the indium tin oxide (ΙΤ0) halogen electrode. In particular, since there must be a difference between the primary spacer and the subspacer, the height of the final spacer should be proportional to the energy exposure. Also, the black matrix must have a good elastic recovery rate to withstand the pressure exerted by the upper plate. Since the photosensitive resin composition for the black matrix includes pigments which are blended to form different colors or kinds of black for shielding light, they may contain a plurality of pigments which are insoluble in the liquid developer. This can cause problems such as poor developability, extended development time, and poor resolution. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a photosensitive resin composition for a light shielding layer which exhibits an increase in optical density per unit micrometer (1.0 or higher, ...) Light shielding effectiveness, and superior properties in terms of elastic recovery rate, adhesion to substrates, and development margin, and can exhibit high-resolution patterns with high differences, where before and after exposure to light There is good solubility in the developer, and lines and dots having a size of 10 to 1 Å can be formed, and the thus formed lines and dots have a dielectric constant of 8 Farads/meter (F/m) or more. A further object of the present invention is to provide a light shielding layer comprising a cured coating film formed from the photosensitive resin composition. It is still another object of the present invention to provide a liquid crystal 95523 5 201248322 display including the light shielding layer. In order to achieve the above objects, an aspect of the present invention provides a photopolymerizable unsaturated binder resin, an ethylenically unsaturated functional monomer. a photosensitive polystyrene initiator, a black organic mixed pigment, and a solvent photosensitive resin composition, wherein the photopolymerizable unsaturated binder resin is unsaturated by adding an epoxy resin represented by the formula (I) The epoxy adduct obtained by the unsaturated basic acid is reacted with a polybasic acid anhydride to form:

R6 R7 其中， R1至R4各獨立地為氫、Cl i。烷基、Ci i()烷氧基、C2^。烯 基、C6-u芳基或齒素，其中該Ci 1D院基、Ci i。烷氧基、c2 i〇 烯基或C6-H芳基係視需要經齒素取代， R為氫、Ci-1Q烷基、c3-14環烷基、Cm。烷氧基、c2-H)烯 基、Ce-u芳基、Ce-!4烷基芳基或c6_14芳基烷基， R和R各獨立地為選自由下列各者所組成群組：氫、 Cl-1D烷基、C3-14環烷基、Cl-ίο烷氧基、C2-1Q烯基、C6-U芳基、 C6-H烷基芳基以及C6-U芳基烷基，其中該Cl_1Q烷基、a u 環烷基、Ch。烷氧基、C2—丨ο烯基、Ce-H芳基、C6-H烷基芳基 或C6-H芳基烷基係視需要經Cl_1D烷基、Ci 1Q烷氧基、c2 1〇 烯基或鹵素取代，以及 η係範圍為〇至1〇之整數。 95523 6 201248322 根據本發明之另一個態樣，提供一種包括形成自該光 敏樹脂組成物之經固化塗佈膜之光屏蔽層。 根據本發明之又一個態樣，提供一種包括該光屏蔽層 之液晶顯示器設備。 有利的效果 因此’本發明提供了一種用於光屏蔽層之光敏樹脂組 成物’該光屏蔽層可展現由每單位μιη為1.〇或更高之光 學选度所表示之增進之光屏蔽效能，以及就彈性恢復率、 對基板之附著及顯影邊界而言卓越的性質，而且可表現具 有向度差異之高解析度圖案，其中由於曝光於光之前與之 後在顯影齊1中有良好溶解度，而可以形成具有1〇至1〇〇, 之尺寸之線條和圓點’以及其中因而形成之線條和圓點之 w電常數為8 F/m或更少。 再者’本發明提供一種包括從該光敏樹脂組成物形成 經固化塗佈膜之光屏蔽層。 此外’本發明提供一種包括該光屏蔽層之液晶顯示器 設備。 【實施方式】 後文中，本發明現在將參閲附隨的圖式而更詳述，其 ，不本發明之例示性具體㈣使彼㈣悉 一步了解本發明。 $ J逆 等旦二 ㈣是，以欲限制本發明i 、體例’而是意欲涵蓋該相兄念和不同面 相當去W ；« l J匕3置換$ 替換者。在本發#已特㈣特定描述可 95523 201248322 使本發明之概念_线之情況下，將省略詳細描述。 本發明中所用之術語僅用於說明特定具體例，因此不 意欲將本發明之4限於此。單數表述包含複數表述，除 非兩個表述内容上彼料同。於本發明中，術語“包人，「 =“具有”意欲指出存在有說明書所揭露之特徵、圖二 步驟、操作、組分、元件或其組合。然而，術言吾“包含” 或“具有”應理解為不預先排除有至少一種其他特徵、圖 =、步驟、操作、組分、細或其組合或另外的可能性之 存在》 ^了完成本發明之技術目的，本發明之光敏樹脂組成 物包括光可聚合性不飽和黏合劑樹脂；稀系不飽和官 單體；光聚合起始劑；黑色有機混合色素；以及較 佳為0.5 S 5G重量％之光可聚合性不飽和黏合劑樹脂；i 至50重量％之烯系不飽和官能性單體；^至η重量％之 聚合起始劑；5至40重量％之黑色有機混合色|里° 量之溶劑。 久餘 1.光可聚合性不飽和黏合劑樹脂 光可聚合性不飽和黏合劑樹脂可藉由使在式G)所示 之環氧樹脂（A)中添加不飽和酸⑻而獲得之環氧加= 多元酸酐（C)反應而形成。 、 以排除溶劑之光敏樹脂組成物之總重量為基準計，光 Y聚合性不飽和黏合劑樹脂之含量可在0.5至50重量％之 範圍内。若光可聚合性不飽和黏合劑樹脂之含量少於〇 5 重量％’在曝露於光後可能不會形成圖案，而且光屏蔽層可 95523R6 R7 wherein R1 to R4 are each independently hydrogen and Cl i . Alkyl, Ci i() alkoxy, C2^. Alkenyl, C6-u aryl or dentate, wherein the Ci 1D yard, Ci i. The alkoxy group, c2 i〇 alkenyl group or C6-H aryl group is optionally substituted by dentate, and R is hydrogen, Ci-1Q alkyl group, c3-14 cycloalkyl group, Cm. Alkoxy, c2-H)alkenyl, Ce-u aryl, Ce-!4 alkylaryl or c6_14 arylalkyl, R and R are each independently selected from the group consisting of: hydrogen , Cl-1D alkyl, C3-14 cycloalkyl, Cl-ίο alkoxy, C2-1Q alkenyl, C6-U aryl, C6-H alkylaryl and C6-U arylalkyl, wherein The Cl_1Q alkyl group, the au cycloalkyl group, and the Ch. Alkoxy, C2-indolyl, Ce-H aryl, C6-H alkylaryl or C6-H arylalkyl are optionally subjected to Cl_1D alkyl, Ci 1Q alkoxy, c2 1 decene Substituted by halogen or halogen, and the η series ranges from 〇 to an integer of 1〇. 95523 6 201248322 According to another aspect of the present invention, there is provided a light shielding layer comprising a cured coating film formed from the photosensitive resin composition. According to still another aspect of the present invention, a liquid crystal display device including the light shielding layer is provided. Advantageous Effects Accordingly, the present invention provides a photosensitive resin composition for a light-shielding layer which exhibits enhanced light-shielding performance expressed by an optical selectivity of 1.〇 or higher per unit μηη. And excellent properties in terms of elastic recovery rate, adhesion to the substrate, and development boundary, and can exhibit a high-resolution pattern having a difference in the degree of difference, wherein there is good solubility in the development before and after exposure to light, Instead, the line and dot ' having a size of 1 〇 to 1 〇〇, and the line and the dot thus formed, may have a power constant of 8 F/m or less. Further, the present invention provides a light shielding layer comprising a cured coating film formed from the photosensitive resin composition. Further, the present invention provides a liquid crystal display device including the light shielding layer. The invention will now be described in more detail with reference to the accompanying drawings, which are not to be construed as a $J inverse is equal to two (four) is intended to limit the invention i, the system 'is intended to cover the brother and the different face quite W; « l J匕3 replacement $ replacement. The detailed description will be omitted in the case where the present invention has been described in detail in the present invention. The terminology used in the present invention is only used to describe a specific embodiment, and thus it is not intended to limit the invention 4 to this. The singular expression includes the plural expression unless the two expressions are identical. In the present invention, the term "includes," "has" is intended to indicate that there are features disclosed in the specification, steps of the steps, operations, components, elements or combinations thereof. However, the language "includes" or "has "It should be understood that the presence of at least one other feature, figure =, step, operation, component, fine or combination thereof or another possibility is not precluded". For the technical purpose of the present invention, the photosensitive resin composition of the present invention The material includes a photopolymerizable unsaturated binder resin; a rare unsaturated monomer; a photopolymerization initiator; a black organic mixed pigment; and preferably a 0.5 S 5 G weight photopolymerizable unsaturated binder resin i to 50% by weight of ethylenically unsaturated functional monomer; from ～% by weight of polymerization initiator; from 5 to 40% by weight of black organic mixed color|Liquid amount of solvent. Polymerizable Unsaturated Binder Resin The photopolymerizable unsaturated binder resin can be obtained by adding an unsaturated acid (8) to the epoxy resin (A) represented by the formula G). ) formed by reaction The content of the photo-polymerizable unsaturated binder resin may be in the range of 0.5 to 50% by weight based on the total weight of the photosensitive resin composition of the solvent. If the content of the photopolymerizable unsaturated binder resin is less than 〇 5 wt% ' may not form a pattern after exposure to light, and the light shielding layer may be 95523

S 201248322 月b具有差的性質。在另一方面，若含量大於5〇重量％，可 月t*需要更長的顯影時間和更強的光敏性，而且光屏蔽層可 能具有差的化學抗性和彈性恢復。 光可聚合性不飽和黏合劑樹脂可藉由使在式（丨）所示 之裱氧樹脂（A)中添加不飽和酸（b)而獲得之環氧加成物與 多元酸酐（C)反應以形成中間產物，然後將該中間產物與單 或多官能性環氧化合物（D)進行反應而獲得。 環氧樹脂 本發明之環氧樹脂（A)可為以下式丨所示之化合物。本 發明之經上色之鹼可顯影性光敏樹脂組成物可藉由採用具 有三芳基單環烷基曱烷骨架之環氧樹脂（A)而製備。 環氧樹脂（A)之三芳基單環烷基甲烷骨架提供有優異 的對基板之附著力、抗鹼性、加工性、強度等等之經固化 物件又，咸3忍為當未經固化之部分於顯影中移除時，甚 至在微圖案m ’可以高精準度形成清楚的影像。S 201248322 month b has a poor nature. On the other hand, if the content is more than 5% by weight, a longer development time and a stronger photosensitivity may be required for the month t*, and the light shielding layer may have poor chemical resistance and elastic recovery. The photopolymerizable unsaturated binder resin can be reacted with a polybasic acid anhydride (C) by adding an unsaturated acid (b) to the oxirane resin (A) represented by the formula (A). It is obtained by forming an intermediate product and then reacting the intermediate product with a mono- or polyfunctional epoxy compound (D). Epoxy Resin The epoxy resin (A) of the present invention may be a compound represented by the following formula. The pigmented alkali developable photosensitive resin composition of the present invention can be produced by using an epoxy resin (A) having a triarylmonocycloalkylnonane skeleton. The triarylmonocycloalkylmethane skeleton of the epoxy resin (A) provides a cured article having excellent adhesion to the substrate, alkali resistance, processability, strength, etc., and the salt is forcibly cured. When the part is removed in development, even the micropattern m' can form a clear image with high precision.

其中R1至R4各獨立地為氫、Cl_1D烷基、Ci_iQ烷氧基、 烯基、α-Μ芳基或齒素，其中該αι。烷基、Ci ia烷氧基、 烯基或（Vu芳基係視需要經齒素取代，較佳為^至R4 各獨=地為氫原子或Cl_道基’較佳為R1至R4為氫原子； R5為氫原子、Cw烷基、C3-u環烷基、Ch。烷氧基、C210 95523 9 201248322 ，基^ α-u芳基、c6-14烷基芳基或C6_14芳基烷基，較佳為 R5為氫、c!-3烷基或環烷基，較佳為R5為匕7環烷基； R6和R7各獨立地為氫原子、c⑷烷基、^14環烷基、Ci i〇 烷氧基、C2-1D稀基、c6-14芳基、c6-u烧基芳基或c6_u芳基烷 基，其中該C!,烷基、C3-H環烷基、Cu烷氧基、C2_1Q烯基、 Ce-H芳基、Ce-H烷基芳基或Ce-H芳基烷基係視需要經Ci i〇 院基、Cl-1D烧氧基、Q-io烯基或鹵素取代，較佳為r6至r7 各獨立地為氫原子或〇6-Η芳基，較佳為^為Ce 14芳基且R7 為風，以及 η係範圍為〇至1〇之整數，較佳係範圍為〇至5，更 佳為0或1。 該C3-u環烷基之具體實例可包含環丙基、環丁基、環 戊基、環己基、甲基環己基、環庚基、環辛基、環壬基、 環癸基等等。 該c,-ie垸基之具體實例可包含甲基、乙基、丙基、異 丙基、丁基、異丁基、第二丁基、第三丁基、戊基、異戊 基、第二戊基、己基、庚基、辛基、異辛基、第三辛基、 2-乙基己基、壬基、異壬基、癸基、異癸基等等。 該匕-!。烷氧基之具體實例可包含甲氧基、乙氧基、丙 氧基、丁氧基、第=丁氧基、第三丁氧基、纟氧基、己氧 基、庚氧基、辛氧基、2-乙基-己氧基等等。 該烯基之具體實例可包含乙烯基、烯丙基、丁烯 基、戊婦基等等。 該鹵素原子之具體實例可包含氟、氯、溴以及碘原子。 95523 10 201248322 經氟原子取代之該Cl_1()烷基之具體實例可包含單氟 甲基、二氟甲基、三氟甲基、三氟乙基、全氟乙基，等等虱 光可聚合性不飽和黏合劑樹脂可藉由使在式〇)所示 之環氧樹腊（A)中添加不飽和酸⑻而獲得之環氧加成物: 多元酸iKG)反應而形成中間產物，然後使财間產物與單 或多s能性環氧化合物（D)進行反應而獲得。 環氧加成物可藉由含量為1當量環氧基之環氧樹脂⑴ 與含量為0. 1至5當量致基之不飽和酸⑻（較佳為〇 2至 =量=，更佳為〇.4至1#量誠）之間之加成反應而 又付壞氧加成物可藉由本領域周知的環氧樹脂⑷與不飽 和酸（B)之間之加成反應而獲得。 "再者，光可聚合性不餘和黏合劑樹脂可藉由含量 =氫氧化物之環氧加成物與含量為01 i 5當量酸肝之 = = SKC)(較佳為〇.2至2當量酸酐，更佳為 ^^酐）之間之反應而獲得。光敏樹脂組成物可藉由本領 =周知的環氧加成物與多元酸酐⑹之間之醋化反應而獲 物之32^樹脂組成物可藉由將含量為1當量氮氧化 衣氧加成物加入到含量為0.1至5當量酸肝之多元酸 針（C)(較佳為〇 2至2 ♦晋祕击 田酐，更佳為〇.4至1當量酸 美之單^產物’其進一步與含量為0·1至5當量環氧 二=能性環氧化合物⑻(較佳為。.…當量環 \^為〇·3幻當量環氧基）進行反應而獲得。 藉由壞氧加成物與多元酸肝（c)之間之醋化反應而獲 95523 201248322 得之中間產物可經歷與單-或多官能性環氧化合物（D)之進 一步的酯化反應，其中該中間產物中之源自多元酸酐（c) 之羧基係與單-或多官能性環氧化合物（]))之環氧基反應。 再者，至於源自多元酸肝（c)之叛基與單-或多官能性 裒氧化σ物（D)之ί衣氧基之有效的反應，光可聚合性不飽和 黏合劑樹脂可藉由環氧加成物和多元酸酐（c)之間之加成 反應而形成中間產物，然後使該中間產物與單或多官能性 環氧化合物⑻進行反應而獲得，纟中反應物之含量調整為 致使1虽量氫氧化物之環氧加成物對應於多元酸酐（c)之 ‘酐§量和單或多官能性環氧化合物（D)之環氧基當量之 總和，該總和係超過1.0當量’較佳為M至2 0 ^量。 不飽和酸 使用不飽和酸（B)以增加光敏樹脂組成物之光敏性。不 餘和酸之實例包含丙烯酸、甲基丙烯酸、巴豆酸、肉桂酸、 山梨酸、甲基丙烯酸經乙基酯蘋果酸g旨、丙稀酸經乙基醋 蘋果酸S旨、甲基丙烯酸㈣基s旨蘋果_、丙烯酸經丙基 能蘋果酸酯、蘋果酸二環戊二_、具有—個縣和至少 兩個（甲基）丙烯醯基之多冑能性（曱基）丙烯㈣、及其混 合物。更佳地，可使用丙烯酸、甲基丙烯酸、或具有一個 竣基和兩個（甲基）丙烯醢基之多官能性（甲基）丙稀酸醋。 具有一個羧基和至少兩個（甲基）丙烯醯基之多官能性 (曱基）丙烯酸醋可以’例如’藉由使具有一個經基和至少 兩個基）丙烯醯基之多官能性（甲基）丙騎醋與二元酸 酐或碳酸反應而獲得。 95523 12 201248322 多元酸酐 在光敏樹脂組成物之製備中採用多元酸酐（D)以增加 鹼可顯影性之樹脂組成物之酸值，藉以改善圖案形狀、可 顯影性、以及顯影速率。多元酸酐之實例包含，但不限 於，琥珀酸酐、順丁烯二酸酐、苯偏三酸酐（trimellitic anhydride)、苯均四酸酐（pyr〇melHtic anhydride)、 2,2’，3,3’-二苯曱酮四羧酸酐、3,3’，4,4，_二苯曱酮四羧 酉文if乙一醇雙脱水偏本二酸酷、甘油參脱水偏苯三酸酯、 欧酸酐、六氫⑽肝、甲基氫駄酸針、四氫酞酸酐、納迪 克酸酐（nadic anhydride)、甲基納迪克酸酐、三烷基四氫 酞酸酐、5-(2, 5-二側氧基四氫呋喃)一3一曱基_3_環己烯 ~1’2-二羧酸酐、三烷基四氫酞酸酐_順丁烯二酸酐加成 物、十二稀基琥賴野、甲基腐植較（咐祕加c)、及 其混合物。更佳地，可翔或組合使㈣賴肝、苯偏三 酸酐、或六氫醜酸酐。 單官能性或多官能性環氧化合物 光敏樹脂組成物之製備中採用多官能性環氧化合物⑼ 以增加光可聚合性不鮮黏合麟脂之分子量_於調整 顯影速率。 ，用來作為多官能性環氧化合物⑼者為藉由以氧化 ^將夕價醇之多魏丙細或其伸絲氧化物加成物環氧 ，化而獲得之含環己稀氧化物或環㈣氧化物之化合物、 兀酸之多環氧丙基驗、或含環己烯環或環鱗環之化合 及類似者。其特別實例包含亞燒基料多環氧丙基鍵 θ5523 201248322 型環氧樹脂，諸如雔 雙紛c環氧樹月雔 氧_、雙㈣環氧樹脂、 ㈣環氧ϋ雙㈣環氧樹月旨、雙紛F環氣樹脂、雙 Ζ環氧，Ρ環氧樹脂、雙酴S環氧_、雙酴 環氧樹脂：/ ;藉由亞烷基雙酚多環氧丙基醚型 曰虱化反應而製備之經氫化雙酚型— 醚；脂肪族多價醇夕产备…上 謂I—%氧丙基 基m二3= ’諸如’乙二醇二環氧丙 喊、1，4-丁二二：；基喊、1,2_丙二醇二環氧两基 】只一醇一％氧丙基醚、己二醇二環氧丙基醚、 辛二醇二環氧丙基驗、U0-癸二醇二環氧丙基趟、 一一甲基-1，3-丙二醇二環氧丙基鍵、二乙二醇二環氧丙 土趟、。二乙二醇二環氧丙基_、四乙二醇二環氧丙基驗、六 乙二醇二環氧丙細、U-環己院二甲醇二環氧丙細、、 l’l’l二（環氧丙氧基甲基）丙烷、丨丨，丨_三（環氧丙氧基甲 基）乙烷、1，1，1-三（環氧丙氧基甲基）曱烷、u u L卜四（環 氧丙氧基甲基）甲烷、甘油三環氧丙基醚、三羥甲基丙烷三 %氧丙基醚、山梨醇四環氧丙基醚、二季戊四醇六環氧丙 基醚、及類似者；藉由將兩種或更多種伸烷基氧化物加入 多價醇，諸如，丙二醇、三羥曱基丙烷、甘油、及類似者 而獲得之多醚多元醇之多環氧丙基醚；酚醛環氧化合物， 諸如，酚系酚醛環氧化合物、聯苯酚醛環氧化合物、甲酚 紛醛環氧化合物、雙酚A酚醛環氧化合物、二環戊二烯酚 搭環氧化合物、及類似者；脂環族環氧化合物，諸如，3,4-環氧基-3-甲基環己基曱基-3, 4-環氧基-3-曱基環己烷羧 酸酯、3, 4-環氧基-5-曱基環己基曱基-3, 4-環氧基-5-曱基 95523 14 201248322 ;己烧麟醋、3,4'環氧基I甲基環己基甲基-3, 4—環氧 基♦甲基環己驗_旨、3,4_環氧基環己基甲基_3,4_環 氧基環己烧竣酸酉旨、卜環氧基乙基—3, 4_環氧基環己燒、雙 (3,4-環氧基環己基甲基）己二酸輯、亞甲基雙（3,4_環氧基 =烧）、異亞丙基雙（3,4_環氧基環己烧）、二環戊二締二 王衣氧化物〜伸乙基雙⑶卜環氧基環己烧魏㈤^^環 氧基-2-環氧基乙基環己料等；二元酸之環氧丙醋，諸 如’酿酸二環氧丙8旨1氫酜酸二環氧丙細、二聚酸環 氧丙醋、及類似者；環氧⑽，諸如，四魏丙基二胺基 二苯基甲烧、三環氧丙基對，基盼、N，N_二環氧丙基苯 胺、及類似者；雜環環氧化合物，諸如，二環氧丙基 -5, 5-二曱基乙内醯脲、異氰尿酸三環氧丙酯、及類似者； 二氧化物化合物’諸如，二環戊二烯二氧化物、及類似者； 以及萘型環氧化合物、三笨基曱烷型環氧化合物、二環戊 二烯型環氧化合物、及類似者。 多官能性環氧化合物係可商購者，而且其實例包含Wherein R1 to R4 are each independently hydrogen, Cl_1D alkyl, Ci_iQ alkoxy, alkenyl, α-indenyl or dentate, wherein the α1. The alkyl group, the Ci ia alkoxy group, the alkenyl group or the (Vu aryl group is optionally substituted by dentate, preferably from ^ to R4 each independently is a hydrogen atom or a Cl_channel group. Preferably, R1 to R4 are a hydrogen atom; R5 is a hydrogen atom, a Cw alkyl group, a C3-u cycloalkyl group, a Ch. alkoxy group, C210 95523 9 201248322, a base α-u aryl group, a c6-14 alkyl aryl group or a C6_14 aryl alkane Preferably, R5 is hydrogen, c!-3 alkyl or cycloalkyl, preferably R5 is 匕7 cycloalkyl; R6 and R7 are each independently hydrogen, c(4)alkyl, ^14 cycloalkyl , Ci i alkoxy, C2-1D, c6-14 aryl, c6-ualkylaryl or c6_u arylalkyl, wherein the C!, alkyl, C3-H cycloalkyl, Cu Alkoxy group, C2_1Q alkenyl group, Ce-H aryl group, Ce-H alkyl aryl group or Ce-H arylalkyl group, if desired, via Ci i 〇, Cl-1D alkoxy, Q-ioene Substituted by halogen or halogen, preferably r6 to r7 are each independently a hydrogen atom or a fluorene 6-fluorene aryl group, preferably a Ce 14 aryl group and R 7 is a wind, and an η series is an integer ranging from 〇 to 1 〇. Preferably, the range is from 〇 to 5, more preferably 0 or 1. Specific examples of the C3-u cycloalkyl group may include a cyclopropyl group, a cyclobutyl group, a cyclopentyl group, and a cyclohexyl group. Methylcyclohexyl, cycloheptyl, cyclooctyl, cyclodecyl, cyclodecyl, etc. Specific examples of the c,-ie fluorenyl group may include methyl, ethyl, propyl, isopropyl, butyl. , isobutyl, t-butyl, tert-butyl, pentyl, isopentyl, second pentyl, hexyl, heptyl, octyl, isooctyl, trioctyl, 2-ethylhexyl, Mercapto, isodecyl, fluorenyl, isodecyl, etc. Specific examples of the alkoxy group may include a methoxy group, an ethoxy group, a propoxy group, a butoxy group, a decoxy group , a third butoxy group, a decyloxy group, a hexyloxy group, a heptyloxy group, an octyloxy group, a 2-ethyl-hexyloxy group, etc. Specific examples of the alkenyl group may include a vinyl group, an allyl group, and a butyl group. Alkenyl, pentyl group, etc. Specific examples of the halogen atom may include fluorine, chlorine, bromine, and iodine atoms. 95523 10 201248322 Specific examples of the Cl_1() alkyl group substituted with a fluorine atom may include a monofluoromethyl group, Difluoromethyl, trifluoromethyl, trifluoroethyl, perfluoroethyl, and the like, a photopolymerizable unsaturated binder resin can be obtained by using an epoxy resin (A) as shown in formula () Adding unsaturated The epoxy adduct obtained by the acid (8): polybasic acid iKG) is reacted to form an intermediate product, which is then obtained by reacting a financial product with a mono- or poly-s-energy epoxy compound (D). The epoxy adduct may be an epoxy resin (1) having a content of 1 equivalent of an epoxy group and an unsaturated acid (8) having a content of 0.1 to 5 equivalents of a group (preferably 〇2 to = amount =, more preferably The addition reaction between 〇.4 and 1#, and the addition of the oxygen adduct can be obtained by an addition reaction between the epoxy resin (4) and the unsaturated acid (B) which are well known in the art. " Furthermore, the photopolymerizable property and the binder resin can be obtained by content = hydroxide epoxy adduct and content of 01 i 5 equivalents of acid liver = = SKC) (preferably 〇.2) It is obtained by a reaction between 2 equivalents of an acid anhydride, more preferably an anhydride. The photosensitive resin composition can be obtained by a acetalization reaction between a conventionally known epoxy adduct and a polybasic acid anhydride (6). The resin composition can be obtained by adding a content of 1 equivalent of an oxynitride oxygen addition product. To a polyacid needle (C) having a content of 0.1 to 5 equivalents of sour liver (preferably 〇2 to 2 ♦ 晋 击 击 酐 , , , , 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 The content is from 0. 1 to 5 equivalents of the epoxy bis-energy epoxy compound (8) (preferably, the equivalent ring is a 〇·3 phantom equivalent epoxy group) and is obtained by a reaction. The intermediate product obtained by the acetation reaction between the substance and the polyacid liver (c) can be subjected to further esterification reaction with the mono- or polyfunctional epoxy compound (D), wherein the intermediate product is The carboxyl group derived from the polybasic acid anhydride (c) is reacted with an epoxy group of a mono- or polyfunctional epoxy compound (])). Furthermore, as for the effective reaction of the thiol group derived from the polyacid liver (c) with the mono- or polyfunctional ruthenium oxidized yttrium (D), the photopolymerizable unsaturated binder resin can be borrowed. An intermediate product is formed by an addition reaction between an epoxy adduct and a polybasic acid anhydride (c), and then the intermediate product is obtained by reacting the intermediate product with a mono- or polyfunctional epoxy compound (8), and the content of the reactant in the crucible is adjusted. In order to cause the epoxy adduct of the hydroxide to correspond to the sum of the anhydride amount of the polybasic acid anhydride (c) and the epoxy equivalent of the mono- or polyfunctional epoxy compound (D), the total is more than 1.0 equivalents is preferably from M to 20%. Unsaturated acid The unsaturated acid (B) is used to increase the photosensitivity of the photosensitive resin composition. Examples of the acid and the acid include acrylic acid, methacrylic acid, crotonic acid, cinnamic acid, sorbic acid, methacrylic acid, ethyl ester malic acid, acrylic acid, ethyl vine malic acid, and methacrylic acid. Base s for apple _, acrylic acid propyl malate, malate dicyclopentane _, multi-functional (mercapto) propylene (four) with - county and at least two (meth) propylene fluorenyl groups, And mixtures thereof. More preferably, acrylic acid, methacrylic acid, or a polyfunctional (meth) acrylate having one thiol group and two (meth) acrylonitrile groups may be used. A polyfunctional (fluorenyl) acrylate having one carboxyl group and at least two (meth) acrylonitrile groups can be 'for example, by having a polyfunctional group having one trans group and at least two groups of acryl groups. Base) C. vinegar is obtained by reacting with dibasic anhydride or carbonic acid. 95523 12 201248322 Polybasic acid anhydride The polyacid anhydride (D) is used in the preparation of the photosensitive resin composition to increase the acid value of the alkali developable resin composition, thereby improving pattern shape, developability, and development rate. Examples of polybasic anhydrides include, but are not limited to, succinic anhydride, maleic anhydride, trimellitic anhydride, pyr〇melHtic anhydride, 2,2', 3,3'-di Phenyl ketone tetracarboxylic anhydride, 3,3',4,4,-dibenzophenone tetracarboxy hydrazine if ethyl alcohol double dehydration partial diacid acid, glycerol ginseng dehydration trimellitate, uric anhydride, hexahydrogen (10) Liver, methylhydroperhydride needle, tetrahydrophthalic anhydride, nadic anhydride, methyl nadic anhydride, trialkyltetrahydrophthalic anhydride, 5-(2,5-di-oxytetrahydrofuran) 33-曱 __3_cyclohexene~1'2-dicarboxylic anhydride, trialkyltetrahydrophthalic anhydride _ maleic anhydride adduct, twelve-saturated azure, methyl humic Secretly add c), and mixtures thereof. More preferably, (iv) lysine, benzene trimellitic anhydride, or hexahydro ugly anhydride may be combined or combined. Monofunctional or Polyfunctional Epoxy Compound The polyfunctional epoxy compound (9) is used in the preparation of the photosensitive resin composition to increase the molecular weight of the photopolymerizable non-sticky binder - to adjust the development rate. The polyfunctional epoxy compound (9) is a cyclohexene oxide or ring obtained by epoxidizing a polypropene fine or a silk oxide oxide adduct thereof by oxidation. A compound of an oxide, a polyepoxypropyl group of citric acid, or a combination of a cyclohexene ring or a ring-shaped ring and the like. Specific examples thereof include a calcined base polyepoxypropyl bond θ5523 201248322 type epoxy resin, such as bismuth c-epoxy tree epoxide oxygen, bis (tetra) epoxy resin, (iv) epoxy bismuth (tetra) epoxy tree month Purpose, double F ring gas resin, double bismuth epoxy, bismuth epoxy resin, double bismuth S epoxy _, double bismuth epoxy resin: /; by alkylene bisphenol polyepoxypropyl ether type 曰虱The hydrogenated bisphenol-ether prepared by the reaction; the aliphatic polyvalent alcohol is prepared by the above-mentioned I-% oxypropyl group m 2 = 'such as 'ethylene glycol epoxide propylene shout, 1, 4 - Ding 22:; base shout, 1,2 propylene glycol diepoxy two groups] only one alcohol -% oxypropyl ether, hexanediol diepoxypropyl ether, octanediol diepoxypropyl test, U0-decanediol diepoxypropyl fluorene, monomethyl-1,3-propanediol diepoxypropyl bond, diethylene glycol digoxifen. Diethylene glycol diepoxypropyl _, tetraethylene glycol diepoxypropyl test, hexaethylene glycol diepoxypropyl fine, U-cyclohexyl dimethanol propylene oxide, l'l' l bis(glycidoxymethyl)propane, hydrazine, hydrazine tris(glycidoxymethyl)ethane, 1,1,1-tris(glycidoxymethyl)decane, Uu L 卜 tetra(glycidoxymethyl)methane, glycerol triepoxypropyl ether, trimethylolpropane trioxypropyl ether, sorbitol tetraepoxypropyl ether, dipentaerythritol hexamethacrylate An ether, and the like; a polyether polyol obtained by adding two or more alkylene oxides to a polyvalent alcohol such as propylene glycol, trishydroxypropyl propane, glycerin, and the like Epoxy propyl ether; phenolic epoxy compound, such as phenolic novolac epoxy compound, biphenol aldehyde epoxy compound, cresol aldehyde epoxide compound, bisphenol A phenolic epoxy compound, dicyclopentadiene phenol Epoxy compounds, and the like; alicyclic epoxy compounds such as 3,4-epoxy-3-methylcyclohexyldecyl-3, 4-epoxy-3-indolylcyclohexanecarboxylate Acid ester, 3, 4-ring 5-yl-nonylcyclohexyldecyl-3,4-epoxy-5-fluorenyl 95523 14 201248322 ; hexane vinegar, 3,4' epoxy I methylcyclohexylmethyl-3, 4 —epoxy ♦methylcyclohexene _, 3,4_epoxycyclohexylmethyl _3,4-epoxycyclohexanoate decanoic acid, epoxide oxyethyl-3, 4 _Epoxycyclohexane, bis(3,4-epoxycyclohexylmethyl)adipate, methylenebis(3,4-epoxy=burning), isopropylidene bis (3) , 4_epoxycyclohexene), dicyclopentadienyl ruthenium oxide oxide ~ extended ethyl bis (3) epoxide oxirane hexazone (5) ^ ^ epoxy-2-epoxyethyl ring Ethylene glycol vinegar of dibasic acid, such as 'hydrogenated diepoxypropane 8 hydrazine dimethicone dimethacrylate, dimer acid propylene vinegar, and the like; epoxy (10), such as , tetraweipropyldiaminodiphenylmethane, triepoxypropyl, carbamide, N,N-diepoxypropylaniline, and the like; heterocyclic epoxy compound, such as diepoxypropyl -5, 5-dimercaptoinouramide, triglycidyl isocyanurate, and the like; dioxide compounds such as dicyclopentadiene dioxide, and Persons; and naphthalene type epoxy compound, a stupid alkoxy group Yue type epoxy compound, a dicyclopentadiene type epoxy compounds, and the like. Polyfunctional epoxy compounds are commercially available, and examples thereof include

BREN-S、EPPN-201、EPPN-501N、EOCN-1020、GAN、GOT (Nippon Kayaku Co., Ltd.) ' Adeka Resin EP-4000 ' Adeka Resin EP-4003S ' Adeka Resin EP-4080 > Adeka Resin EP-4085 、 Adeka Resin EP-4088 、 Adeka Resin EP-4100 、BREN-S, EPPN-201, EPPN-501N, EOCN-1020, GAN, GOT (Nippon Kayaku Co., Ltd.) 'Adeka Resin EP-4000 ' Adeka Resin EP-4003S ' Adeka Resin EP-4080 > Adeka Resin EP-4085, Adeka Resin EP-4088, Adeka Resin EP-4100,

Adeka Resin EP-4900、Adeka Resin ED-505、Adeka Resin ED-506、Adeka Resin KRM-2110、Adeka Resin KRM-2199、 Adeka Resin KRM-2720(Adeka Corporation) 、 R-508 、 R-531、R-710 (Mitsui Chemicals, Inc· )、Epicoat 190P、 95523 15 201248322Adeka Resin EP-4900, Adeka Resin ED-505, Adeka Resin ED-506, Adeka Resin KRM-2110, Adeka Resin KRM-2199, Adeka Resin KRM-2720 (Adeka Corporation), R-508, R-531, R- 710 (Mitsui Chemicals, Inc. ), Epicoat 190P, 95523 15 201248322

Denacoal EX-314 Denacoal EX-421 Denacoal EX-614 Denacoal EX-731 Denacoal EX-850Denacoal EX-314 Denacoal EX-421 Denacoal EX-614 Denacoal EX-731 Denacoal EX-850

Epicoat 191P、Epicoat 604、Epicoat 801、Epicoat 828、 Epicoat 871、Epicoat 872、Epicoat 1031、Epicoat RXE15、 Epicoat YX-4000 ' Epicoat YDE-205 ' Epicoat YDE-305 (Japan Epoxy Resins Co., Ltd. )、Sumiepoxy ELM-120、 Sumiepoxy ELM-434 (SumitomoChemicalCo.， Ltd.)、 Denacoal EM-150， Denacoal EX-201 、 Denacoal EX-211 、 Denacoal EX-212 ' Denacoal EX-313Epicoat 191P, Epicoat 604, Epicoat 801, Epicoat 828, Epicoat 871, Epicoat 872, Epicoat 1031, Epicoat RXE15, Epicoat YX-4000 ' Epicoat YDE-205 ' Epicoat YDE-305 (Japan Epoxy Resins Co., Ltd. ), Sumiepoxy ELM-120, Sumiepoxy ELM-434 (SumitomoChemicalCo., Ltd.), Denacoal EM-150, Denacoal EX-201, Denacoal EX-211, Denacoal EX-212 ' Denacoal EX-313

Denacoal EX-322 Denacoal EX-512 Denacoal EX-711 Denacoal EX-811 Denacoal EX-851 、Denacoal EX-411 ' Denacoal EX-521 、Denacoal EX-721 、Denacoal EX-821 、Denacoal EX-911 (Nagase cherateX Corporation) 、 Epolite 70P 、 Epolite 200P 、 Epolite 400P、Epol ite 40E、Epol ite 100E、Epol ite 200E、Epol ite 400E、Epolite 80MF、Epolite 100MF、Epolite 1500NP、 Epolite 1600 、 Epolite 3002 、 Epolite 4000 、 Epolite FR-1500 ' Epolite M-1230 > Epolite EHDG-L (Kyoeisha Chemical Co.，Ltd.)、SB-20 (Okamura Oil Mill, Ltd)、 Epicron 720 (Dainippon Ink and Chemicals, Inc.)、 UVR-6100 、 UVR-6105 、 UVR-6110 、 UVR-6200 、 UVR-6228 (Union Carbide Corporation)、Celoxide 2000、Celoxide 202卜 Celoxide 2021P、Celoxide 208卜 Celoxide 2083、 Celoxide 2085 、 Celoxide 3000 、 Cycomer A200 、 Cycomer M100、Cycomer M101、Epolead GT-301、Epolead GT-302、 95523 16 201248322Denacoal EX-322 Denacoal EX-512 Denacoal EX-711 Denacoal EX-811 Denacoal EX-851, Denacoal EX-411 'Denacoal EX-521, Denacoal EX-721, Denacoal EX-821, Denacoal EX-911 (Nagase cherateX Corporation) , Epolite 70P, Epolite 200P, Epolite 400P, Epol ite 40E, Epol ite 100E, Epol ite 200E, Epol ite 400E, Epolite 80MF, Epolite 100MF, Epolite 1500NP, Epolite 1600, Epolite 3002, Epolite 4000, Epolite FR-1500 ' Epolite M-1230 > Epolite EHDG-L (Kyoeisha Chemical Co., Ltd.), SB-20 (Okamura Oil Mill, Ltd), Epicron 720 (Dainippon Ink and Chemicals, Inc.), UVR-6100, UVR-6105, UVR-6110, UVR-6200, UVR-6228 (Union Carbide Corporation), Celoxide 2000, Celoxide 202, Celoxide 2021P, Celoxide 208, Celoxide 2083, Celoxide 2085, Celoxide 3000, Cycomer A200, Cycomer M100, Cycomer M101, Epolead GT- 301, Epolead GT-302, 95523 16 201248322

Epolead 401、Epolead 403、Epolead HD300、EHPE-3150、 ETHB 、 Epoblend (Daicel Chemical Industries， Ltd.)、 PY-306 > 0163 ' DY-022 (Chiba Specialty Chemicals Corporation) 、 Suntohto ST0000 、 Epotohto YD-011 、 Epotohto YD-115 、 Epotohto YD-127 、 Epotohto YD-134 、 Epotohto YD-172、Epotohto YD-6020、Epotohto YD-716、 Epotohto YD-7011R 、 Epotohto YD-901 、 Epotohto YDPN-638、Epotohto YH-300、Neotohto PG-202、Neotohto PG-207 (Tohto Kasei Co., Ltd. ) ' Blenmer G (NOF Corporation)、及類似者。 本發明中可使用單官能性環氧化合物（D)，以達到調整 光可?κ合性不飽和黏合劑樹脂之酸值之目的。該單官能性 環氧化合物係用以增進本發明之鹼可顯影性、經上色之光 敏樹脂組成物之可顯影性。單官能性環氧化合物之實例包 含曱基丙稀酸環氧丙S旨、甲基環氧丙基趟、乙基環氧丙基 醚、丙基環氧丙基醚、異丙基環氧丙基醚、丁基環氧丙基 醚、異丁基環氧丙細、第三了基環氧丙細、戊基環氣 丙基趟、己基環氧丙基醚、庚基環氧丙基喊、辛基環氧丙 基醚、壬基環氧丙基醚、癸基環氧丙基醚、十一基環氧丙 細、十二基環氧丙基醚、十三基環氧丙基醚、=基環 氧丙基醚、十五基環氧丙基趟、十六基環氧丙基越、2_乙 基己基環氧丙細、婦丙基環氧丙基醚、炔丙基環氧丙基 鍵、2-曱氧基乙基環氧丙基⑽、笨基環氧丙基鍵、對甲氧 基環氧丙細、對丁基驗環氧丙基喊、甲絲基環氧丙基 95523 17 201248322 謎（c胃i gycidyi ether)、2-甲基甲笨紛基環氧丙基喊、 4-壬基苯基環氧丙基醚、苯甲基環氧丙基醚、對異丙苯基 苯基環氧丙基醚（p-cumylphenyl gycidyl ether)、三苯甲 基環氧丙基醚、甲基丙烯酸2, 3-環氧基丙酯、環氧化大豆 油、環氧化亞麻子油、丁酸環氧丙醋、乙稀基環己烧單氧 化物、1，2-環氧基-4-乙烯基環己烷、苯乙烯氧化物、蒎烯 (Pinene)氧化物、曱基苯乙烯氧化物、環己烯氧化物 丙基氧化物、及其他者。 較佳地’單官能性環氧化合物⑼之含量為致使本發明 之光敏樹脂組成物之酸值較佳為在2〇至12〇毫克 (mgKOH/g)之範圍内者。 2.烯系不飽和官能性單體 烯系不飽和官能性單體（為反應性不飽和化合物）為使 用於光敏樹脂組成物中之傳統的單體或寡聚物。可以使用 具有至少-種料、不飽和鍵之丙稀酸或f基丙烯酸之 能性或多官能性酯。 以排除溶劑之光敏樹脂組成物之總重量為基準計， 系不飽和官能性單體之含量可在自i纟5()重量狄範圍 内。若稀系不飽和官紐單體之含量少於丨重量％，可能很 難於顯影時形成圖案。又，若含量超過5G重量％，顯^ 在底部可能發生過度顯影。 p 烯系不飽和官能性單體為反應性不飽和化合物，其包 含乙二醇二丙烯酸酯、二乙二醇二丙烯酸酯、三乙二醇： 丙烯酸酯、二乙二醇二甲基丙烯酸酯、j，6一己 95523 18 201248322 酸酯、季戊四醇三丙烯酸酯、二季戊四醇五丙稀酸酯、二 季戊四醇六丙烯酸酯、雙酚A環氧基丙烯酸酯、乙二醇單 甲基醚丙烯酸酯、乙二醇二曱基丙烯酸酯、1，6-己二醇二 曱基丙烯酸酯、及其混合物，但不限於此。 可商購之作為烯系不飽和官能性單體之單官能性（甲 基）丙烯酸酯之實例包含Aronix M-101、Aronix M-111、 Aronix M-114 (Toagosei Co.，LTD. )、AKAYARAD TC-110S、 Aronix TC-120S (Nippon Kayaku Co.， Ltd.) 、 V-158 、 V-2311 (Osaka Yuki Kagaku Co.，Ltd.)、及類似者。 此外，可商購之雙官能性（曱基）丙烯酸酯之實例包含 Aronix M-210 ' Aronix M-240 ' Aronix M-6200 (Toagosei Co.，LTD. )、KAYARADHDDA、KAYARADHX-220、KAYARADR-604 (Nippon Kayaku Co., Ltd. ) ' V260, V312, V335 HP (Osaka Yuki Kagaku Co.，Ltd.)、及類似者。 再者，可商購之至少三官能性（曱基）丙烯酸酯之實例 包含 Aronix M-309、Aronix M-400、Aronix M-405、Aronix M-450 、 Aronix M-7100 、 Aronix M-8030 、 Aronix M-8060 (Toagosei Co.，LTD. )、KAYARAD TMPTA、KAYARAD DPCA-20、 KAYARAD DPCA-30 、 KAYARAD DPCA-60 、 KAYARAD DPCA-120 (Nippon Kayaku Co.，Ltd. )、V-295、V-300、V-360、V-GPT、 V-3PA、V-400 (Osaka Yuki Kagaku Co.，Ltd.)、及類似 者。可單獨或組合使用化合物。 以排除溶劑之光敏樹脂組成物之總重量為基準計，烯 系不飽和官能性單體之含量在1至50重量％，更佳為在1 95523 19 201248322 至20重量％ ’最佳為在1至π重量％之範圍内。若烯系不 飽和官能性單體之含量少於1重量％，光敏性可在氧之存在 下減少，而且可能難以形成圖案。又，若含量超過5〇重量 %’可能降低與共聚物之相容性，造成其具有粗糙表面之膜。 3.聚合起始劑 本發明之聚合起始劑為曝光於輻射，諸如，可見光線、 紫外線、深紫外光線、電子射線、X射線、及類似者時， 產生起始官能性單體’或具有烯系不飽和鍵之單官能性或 多B此性之環氧化合物之聚合之活性物種之化合物。 以排除溶劑之光敏樹脂組成物之總重量為基準計，聚 合起始劑之含量較佳為在重量為〇1至1〇重量％之範圍 内。若聚合起始劑之含量少於〇. 1重量％，曝照於光時之固 化可能不足，而且可能不會獲得所欲之經上色之圖案層。 又，若含量超過10重量％，因而形成之經上色之圖案層可 能在顯影時從基板分層。 聚合起始劑之具體實例可包含苯乙酮系化合物、雙咪 、0-醯基肟系化合物、钂鹽系Epolead 401, Epolead 403, Epolead HD300, EHPE-3150, ETHB, Epoblend (Daicel Chemical Industries, Ltd.), PY-306 > 0163 'DY-022 (Chiba Specialty Chemicals Corporation), Suntohto ST0000, Epotohto YD-011, Epotohto YD-115, Epotohto YD-127, Epotohto YD-134, Epotohto YD-172, Epotohto YD-6020, Epotohto YD-716, Epotohto YD-7011R, Epotohto YD-901, Epotohto YDPN-638, Epotohto YH-300, Neotohto PG-202, Neotohto PG-207 (Tohto Kasei Co., Ltd.) 'Blenmer G (NOF Corporation), and the like. The monofunctional epoxy compound (D) can be used in the present invention for the purpose of adjusting the acid value of the photo-kappable unsaturated binder resin. The monofunctional epoxy compound is used to enhance the developability of the alkali developability of the present invention and the color of the photosensitive resin composition. Examples of monofunctional epoxy compounds include mercaptopropyl acrylate, methyl epoxypropyl hydrazine, ethyl epoxidized propyl ether, propyl epoxidized propyl ether, isopropyl epoxide Ether, butyl epoxidized propyl ether, isobutyl epoxide, succinyl propylene propyl, pentyl cyclopropyl hydrazine, hexyl epoxypropyl ether, heptyl epoxide propyl , octyl epoxypropyl ether, decyl epoxidized propyl ether, decyl epoxidized propyl ether, eleven based propylene propylene oxide, dodecyl epoxidized propyl ether, thirteen based epoxy propyl ether , = base epoxy propyl ether, fifteen base epoxy propyl hydrazine, hexadecyl epoxy propyl, 2-ethylhexyl epoxide, propyl propyl epoxide, propargyl ring Oxypropyl group, 2-decyloxyethyl epoxypropyl (10), stupid epoxy propyl bond, p-methoxy propylene propylene, p-butyl oxiranyl propyl, methyl methacrylate Propyl 95523 17 201248322 mystery (c stomach i gycidyi ether), 2-methyl phenyl propyl propyl group, 4-mercapto phenyl epoxide propyl ether, benzyl epoxide propyl ether, pair P-cumylphenyl gycidyl ether, triphenyl Glycidyl propyl ether, 2, 3-epoxypropyl methacrylate, epoxidized soybean oil, epoxidized linseed oil, butyric acid propylene vinegar, ethylene hexanone monooxide, 1, 2-epoxy-4-vinylcyclohexane, styrene oxide, pinene oxide, mercaptostyrene oxide, cyclohexene oxide propyl oxide, and others. Preferably, the content of the monofunctional epoxy compound (9) is such that the acid value of the photosensitive resin composition of the present invention is preferably in the range of from 2 Å to 12 Å (mgKOH/g). 2. Ethylenically Unsaturated Functional Monomer The ethylenically unsaturated functional monomer (which is a reactive unsaturated compound) is a conventional monomer or oligomer used in the photosensitive resin composition. An energy- or polyfunctional ester having at least a seed, an unsaturated bond of acrylic acid or f-based acrylic acid can be used. The content of the unsaturated functional monomer may be in the range of from 纟5() by weight based on the total weight of the photosensitive resin composition excluding the solvent. If the content of the rare unsaturated monomer is less than 丨% by weight, it may be difficult to form a pattern upon development. Further, if the content exceeds 5 G% by weight, excessive development may occur at the bottom. The p-ethylenically unsaturated functional monomer is a reactive unsaturated compound comprising ethylene glycol diacrylate, diethylene glycol diacrylate, triethylene glycol: acrylate, diethylene glycol dimethacrylate , j, 6 one 95523 18 201248322 acid ester, pentaerythritol triacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, bisphenol A epoxy acrylate, ethylene glycol monomethyl ether acrylate, B Glycol dimercapto acrylate, 1,6-hexanediol dimercapto acrylate, and mixtures thereof, but are not limited thereto. Examples of commercially available monofunctional (meth) acrylates which are ethylenically unsaturated functional monomers include Aronix M-101, Aronix M-111, Aronix M-114 (Toagosei Co., LTD.), AKAYARAD. TC-110S, Aronix TC-120S (Nippon Kayaku Co., Ltd.), V-158, V-2311 (Osaka Yuki Kagaku Co., Ltd.), and the like. Further, examples of commercially available bifunctional (mercapto) acrylates include Aronix M-210 'Aronix M-240 ' Aronix M-6200 (Toagosei Co., LTD.), KAYARADHDDA, KAYARADHX-220, KAYARADR-604 (Nippon Kayaku Co., Ltd. ) 'V260, V312, V335 HP (Osaka Yuki Kagaku Co., Ltd.), and the like. Further, examples of commercially available at least trifunctional (fluorenyl) acrylates include Aronix M-309, Aronix M-400, Aronix M-405, Aronix M-450, Aronix M-7100, Aronix M-8030, Aronix M-8060 (Toagosei Co., LTD.), KAYARAD TMPTA, KAYARAD DPCA-20, KAYARAD DPCA-30, KAYARAD DPCA-60, KAYARAD DPCA-120 (Nippon Kayaku Co., Ltd.), V-295, V -300, V-360, V-GPT, V-3PA, V-400 (Osaka Yuki Kagaku Co., Ltd.), and the like. The compounds can be used singly or in combination. The content of the ethylenically unsaturated functional monomer is from 1 to 50% by weight, based on the total weight of the photosensitive resin composition excluding the solvent, more preferably at 1 95523 19 201248322 to 20% by weight 'best at 1 To the range of π% by weight. If the content of the ethylenically unsaturated functional monomer is less than 1% by weight, the photosensitivity may be reduced in the presence of oxygen, and it may be difficult to form a pattern. Further, if the content exceeds 5 〇 by weight, the compatibility with the copolymer may be lowered to cause a film having a rough surface. 3. Polymerization initiator The polymerization initiator of the present invention produces a starting functional monomer when exposed to radiation, such as visible light, ultraviolet light, deep ultraviolet light, electron rays, X-rays, and the like. A compound of an active species of a monofunctional or multi-B epoxy compound which is an ethylenically unsaturated bond. The content of the polymerization initiator is preferably in the range of from 1 to 1% by weight based on the total weight of the photosensitive resin composition excluding the solvent. If the content of the polymerization initiator is less than 0.1% by weight, the curing upon exposure to light may be insufficient, and the desired patterned layer may not be obtained. Further, if the content exceeds 10% by weight, the formed patterned layer may be layered from the substrate during development. Specific examples of the polymerization initiator may include an acetophenone-based compound, a dimethicone, a 0-fluorenyl anthracene compound, and a phosphonium salt system.

由下列各者所組成群組之至少一者：苯 唑系化合物、三畊系化合物 化合物、安息香系化合物、 化合物、多核醌系化合物、 合物、重氮系化合物、醯巧 起始劑較佳為選自由下列各者 95523 20 201248322 乙酮系化合物、雙咪唑系化合物、三畊系化合物、及肟系 化合物。 聚合起始劑之實例包含對二甲基胺基苯乙酮、2-羥基 -2-曱基-1-苯基-丙-1-酮、苯曱基二曱基縮酮、二苯基酮、 安息香丙基醚、二乙基噻吨酮、2, 4-雙（三氯曱基）-6-對曱 氧基苯基-s-三哄、2-三氯曱基-5 -苯乙稀基-1，3，4-側氧基 二唑、9-苯基吖啶、3-曱基-5-胺基-((s-三畊-2-基）胺基） -3-苯基薰草素、2-(〇-氯苯基）-4, 5-二苯基咪唑基二聚 物、1-苯基-1,2-丙烧二嗣-2-(〇-乙氧基裁基）將、1-[9-乙基-6-(2-曱基苯曱酿基）-9H-味〇坐-3-基]-乙嗣-1 -（〇-乙 醯基肟）、〇-苯曱醯基-4’-(苯并巯基）苯甲醯基-己基-酮 肟、2, 4, 6-三曱基苯基羰基-二苯基膦醯基氧化物、六氟偶 磷基-三烷基苯基巯鹽、2-酼基苯并咪唑、2, 2’-苯并噻唑 基二硫化物、及其混合物，但不限於此。 4.黑色有機混合色素 黑色有機混合色素意指藉由有機色素之組合而顯示類 似炭黑之深色者。 黑色有機混合色素可為苯胺黑、内醯胺黑或其混合 物，但不限於此。苯胺黑和内醯胺黑分別意指苯胺系黑色 色素和内醯胺系黑色色素。 以排除溶劑之光敏樹脂組成物之總重量為基準計，黑 色有機混合色素之含量可在5至40重量％之範圍内。若黑 色有機色素混合物之含量少於5重量％，光學密度可能太 低。又，若含量大於40重量％，儘管有高光學密度，可加 95523 21 201248322 工性（例如，可顯影性）可能降低。 此外，黑色有機混合色素可進一步包括至少一種選自 由下列各者所組成群組之無機色素：炭黑、氧化鉻、氧化 鐵、及鈦黑。以100重量份之有機色素為基準計，黑色有 機混合色素可包括0至70重量份，較佳為0. 1至67重量 份之至少一種選自由下列各者所組成群組之無機色素：炭 黑、氧化鉻、氧化鐵、以及鈦黑。 可使用分散劑以分散本發明之光敏樹脂組成物中之色 素。可將分散劑併入色素中，例如，藉由事先處理色素之 表面，或可與在樹脂組成物之製備中之色素摻和。 溶劑 本發明中所採用之溶劑係可與上述組分相容者，且不 會與上述組分反應。溶劑之實例包含醇類，諸如，甲醇、 乙醇、及類似者；醚類，諸如，二氯乙基醚、正丁基醚、 二異戊基醚、曱基苯基醚、四氫呋喃、及類似者；甘醇醚 類，諸如，乙二醇單曱基醚、乙二醇單乙基醚、及類似者； 乙酸赛璐蘇酯類，諸如，乙酸甲賽璐蘇、乙酸乙賽璐蘇、 乙酸二乙赛璐蘇、及類似者；卡必醇類，諸如，曱基乙基 卡必醇、二乙基卡必醇、二乙二醇單甲基醚、二乙二醇單 乙基醚、二乙二醇二曱基醚、二乙二醇甲基乙基醚、二乙 二醇二乙基醚、及類似者；丙二醇烷基醚乙酸酯類，諸如， 丙二醇-1-單甲基醚-2-乙酸酯、丙二醇-1-單丙基醚-2-乙 酸酯、及類似者；芳香烴類，諸如，甲苯、二甲苯、及類 似者；酮類，諸如，曱基乙基酮、環己酮、4-羥基-4-曱基 95523 22 201248322 -2-戊酮、甲基正丙基酮、曱基正丁基酮、曱基正戊基酮、 2-庚酮、及類似者；飽和脂肪族單羧酸烷酯類，諸如，乙 酉文乙3曰、乙酸正丁酯、乙酸異丁酯、及類似者；乳酸酯類， 諸如，乳酸甲酯、乳酸乙酯、及類似者；氧基乙酸烷酯類， 諸如，氧基乙酸甲酯、氧基乙酸乙酯、氧基乙酸丁酯、及 類似者，烧氧基烷基乙酸酯類，諸如，曱氧基曱基乙酸酯、 甲氧基乙基乙酸酯、甲氧基丁基乙酸酯、乙氧基甲基乙醆 酯、乙氧基乙基乙酸酯、及類似者；3_氧基丙酸烧酯類， 諸如，3-氧基丙酸曱酯、3-氧基丙酸乙酯、及類似者；3_ 燒氧基丙酸烧酯類，諸如，3-甲氧基丙酸曱酯、3-曱氧基 丙酸乙酯、3-乙氧基丙酸乙酯、3-乙氧基丙酸甲酯、及類 似者；2-氧基丙酸烧酯類，諸如，2-氧基丙酸甲酯、2—氧 基丙酸乙酯、2-氧基丙酸丙酯、及類似者；2-烷氡基丙酸 烧S旨類，諸如’ 2-曱氧基丙酸曱酯、2-甲氧基丙酸乙酯、 2-乙氧基丙酸乙酯、2-乙氧基丙酸曱酯、及類似者；2-氧 基-2-曱基丙酸酯類，諸如，2-氧基—2-甲基丙酸甲酯、2-氧基-2-曱基丙酸乙酯、及類似者；2-烷氧基-2-曱基丙酸 烷基之單氧基單羧酸烷酯類，諸如，2_甲氧基_2_甲基丙酸 甲醋、2-乙氧基-2-曱基丙酸乙酯、及類似者；酯類，諸如， 2-羥基乙基丙酸酯、2-羥基-2-曱基乙基丙酸酯、羥基乙酸 乙酉旨、2-經基-3-曱基曱基丁酸醋、及類似者；嗣酸醋類， 諸如，丙酮酸乙酯、及類似者。適合用於本發明之其他例 示性溶劑可進一步包含具有高炼點之溶劑，諸如，N-曱基 甲酿胺、N，N-二曱基曱醯胺、N-甲基曱醯苯胺、N-曱基乙 95523 23 201248322 醯胺、N，N-二甲基乙醢胺、N-曱基。比洛咬酮、二甲基亞石風、 本曱基乙基醚、二己醚、乙酿基丙酮、異佛_ (isophorone)、己酸、辛酸、1-辛醇、1-壬醇、苯甲基醇、 乙酸苯曱酯、苯甲酸乙酯、草酸二乙酯、馬來酸二乙自旨、 r -丁内酯、碳酸乙稀酯、碳酸丙稀酯、乙酸苯赛赙蘇、及 類似者。 就相容性和反應性而論’以上溶劑之較佳者為甘醇鱗 類，諸如，乙二醇單乙基醚、及類似者；乙二醇烷基醚乙 酸酿類’諸如，乙酸乙赛璐蘇、及類似者；酯類，諸如， 2 ϋ基乙基丙酸g旨；二乙二醇類，諸如，二乙二醇單甲武 醚、及類似者；丙二醇烷基醚乙酸酯類，諸如，丙二醇甲 基喊乙酸酯、丙二醇丙基醚乙酸酯，等等。 以包含溶劑之100重量％之光敏樹脂組成物為基準 '^以50至90重量％之含量使用溶劑。當溶劑之含量落 此範園内，則組成物會具有適#的黏度和改善的可加工 $ 夕境轉合劑 可進!1增加對基板之附著力，本發明之光_脂組成物 者所也成=括夕烧輕σ齊1，其具有至少一種選自由下列各 氖峻賴取代基:羧基、甲基丙烯醢基、異 衣氧基及其組合。 曱基丙例包括三甲氧基矽烧基苯甲酸、Τ- 燒、乙缚基三甲氧基錢基钱、乙嫦基三乙醢氧基石夕 9S523 沉異氰酸酯丙基三乙氧基矽 24 ♦ ♦201248322 烷、r-環氧丙氧基丙基三曱氧基矽烷以及環氧 基環己基）乙基三甲氧基矽烷，其可單獨或縝合使用。 界面活性劑 為了增進塗佈能力和防止缺陷，本發明之光敏樹脂組 成物可進一步包括界面活性劑。 界面活性劑之實例包括可商購之氟系界面活性劑’諸 如，BM-1000 and ΒΜ-1100 (由 BM Chemie Co. Ltd.製造）、At least one of the group consisting of: an azole compound, a tri-farming compound, a benzoin compound, a compound, a polynuclear lanthanide compound, a diazo compound, and a chlorinated initiator are preferred. It is selected from the following 95523 20 201248322 ethyl ketone type compound, a bisimidazole type compound, a tri-grain type compound, and an oxime type compound. Examples of the polymerization initiator include p-dimethylaminoacetophenone, 2-hydroxy-2-mercapto-1-phenyl-propan-1-one, benzoguanidinyl ketal, diphenyl ketone , benzoin propyl ether, diethyl thioxanthone, 2, 4-bis(trichloroindenyl)-6-p-methoxyphenyl-s-trisole, 2-trichloroindolyl-5-phenylethyl Dilute-1,3,4-sided oxydiazole, 9-phenyl acridine, 3-mercapto-5-amino-((s-tricot-2-yl)amino)-3-benzene Kaempferol, 2-(indolyl-chlorophenyl)-4, 5-diphenylimidazolyl dimer, 1-phenyl-1,2-propanedifluorene-2-(indole-ethoxyl)裁)), 1-[9-Ethyl-6-(2-mercaptobenzoyl)-9H- miso--3-yl]-acetam-1-(〇-ethylhydrazine) , fluorenyl-benzoinyl-4'-(benzofluorenyl)benzimidyl-hexyl-ketooxime, 2,4,6-tridecylphenylcarbonyl-diphenylphosphonium ruthenium oxide, hexafluoro Butyl-trialkylphenyl phosphonium salt, 2-mercaptobenzimidazole, 2,2'-benzothiazolyl disulfide, and mixtures thereof, but are not limited thereto. 4. Black organic mixed pigment The black organic mixed pigment means a dark one similar to carbon black by a combination of organic pigments. The black organic mixed coloring matter may be aniline black, indole amine black or a mixture thereof, but is not limited thereto. Aniline black and indoleamine black mean an aniline black pigment and an indoleamine black pigment, respectively. The content of the black organic mixed pigment may be in the range of 5 to 40% by weight based on the total weight of the photosensitive resin composition excluding the solvent. If the content of the black organic pigment mixture is less than 5% by weight, the optical density may be too low. Further, if the content is more than 40% by weight, the workability (e.g., developability) may be lowered in spite of the high optical density. Further, the black organic mixed pigment may further include at least one inorganic pigment selected from the group consisting of carbon black, chromium oxide, iron oxide, and titanium black. The black organic mixed pigment may include 0 to 70 parts by weight, preferably 0.1 to 67 parts by weight, based on 100 parts by weight of the organic pigment, of at least one inorganic pigment selected from the group consisting of: carbon Black, chromium oxide, iron oxide, and titanium black. A dispersing agent may be used to disperse the colorants in the photosensitive resin composition of the present invention. The dispersing agent may be incorporated into the pigment, for example, by previously treating the surface of the pigment, or may be blended with the pigment in the preparation of the resin composition. Solvent The solvent used in the present invention is compatible with the above components and does not react with the above components. Examples of the solvent include alcohols such as methanol, ethanol, and the like; ethers such as dichloroethyl ether, n-butyl ether, diisoamyl ether, nonylphenyl ether, tetrahydrofuran, and the like. Glycol ethers, such as ethylene glycol monodecyl ether, ethylene glycol monoethyl ether, and the like; cyproterone acetate, such as acesulfame acetate, acesulfame acetate, acetic acid Dimethicone, and similar; carbitol, such as mercaptoethyl carbitol, diethyl carbitol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, Diethylene glycol didecyl ether, diethylene glycol methyl ethyl ether, diethylene glycol diethyl ether, and the like; propylene glycol alkyl ether acetate, such as propylene glycol-1-monomethyl ether -2-acetate, propylene glycol-1-monopropyl ether-2-acetate, and the like; aromatic hydrocarbons such as toluene, xylene, and the like; ketones such as mercaptoethyl Ketone, cyclohexanone, 4-hydroxy-4-mercapto 95523 22 201248322 -2-pentanone, methyl n-propyl ketone, decyl n-butyl ketone, decyl-n-pentyl ketone, 2-heptanone, and similar Saturated aliphatic monocarboxylic acid alkyl esters such as ethyl acetonitrile, n-butyl acetate, isobutyl acetate, and the like; lactic acid esters such as methyl lactate, ethyl lactate, and the like An alkyl oxyacetate such as methyl oxyacetate, ethyl oxyacetate, butyl oxyacetate, and the like, an alkoxyalkyl acetate such as decyloxymercaptoacetic acid Ester, methoxyethyl acetate, methoxybutyl acetate, ethoxymethylacetate, ethoxyethyl acetate, and the like; 3-oxypropionate And, for example, decyl 3-oxypropionate, ethyl 3-oxypropionate, and the like; 3_ anthranilate, such as 3-methoxypropionate, 3- Ethyl methoxypropionate, ethyl 3-ethoxypropionate, methyl 3-ethoxypropionate, and the like; 2-oxypropionic acid esters such as 2-oxypropionic acid Methyl ester, ethyl 2-oxypropionate, propyl 2-oxypropionate, and the like; 2-alkylmercaptopropionic acid S, such as '2-nonoxypropionate decyl ester, 2 -ethyl methoxypropionate, ethyl 2-ethoxypropionate, 2-B Ethyl propyl propionate, and the like; 2-oxy-2-mercaptopropionate, such as methyl 2-oxy-2-methylpropanoate, 2-oxy-2-mercaptopropyl Ethyl acetate, and the like; 2-alkoxy-2-mercaptopropionic acid alkyl monoalkyl monocarboxylic acid alkyl esters, such as 2-methoxy-2-methylpropionic acid methyl vinegar, Ethyl 2-ethoxy-2-mercaptopropionate, and the like; esters such as 2-hydroxyethylpropionate, 2-hydroxy-2-mercaptoethylpropionate, acetoxyacetate And 2-amino-3-mercapto-butyric acid vinegar, and the like; citric acid vinegars, such as ethyl pyruvate, and the like. Other exemplary solvents suitable for use in the present invention may further comprise a solvent having a high refining point such as N-mercaptoamine, N,N-didecylguanamine, N-methylanilinoline, N - 曱基乙95523 23 201248322 decylamine, N,N-dimethylacetamide, N-fluorenyl. Pilotone, dimethyl sulphur, decylethyl ether, dihexyl ether, ethyl acetonide, isophorone, hexanoic acid, octanoic acid, 1-octanol, 1-nonanol, Benzyl alcohol, phenyl decyl acetate, ethyl benzoate, diethyl oxalate, diethyl phthalate, r-butyrolactone, ethylene carbonate, propylene carbonate, benzoquinone acetate, And similar. In terms of compatibility and reactivity, the preferred solvents are glycol squamos, such as ethylene glycol monoethyl ether, and the like; ethylene glycol alkyl ether acetic acid, such as acetic acid B. Celluloid, and the like; esters, such as, 2, mercaptoethyl propionate; diethylene glycols, such as diethylene glycol monomethyl ether, and the like; propylene glycol alkyl ether acetate For example, propylene glycol methyl ketone acetate, propylene glycol propyl ether acetate, and the like. The solvent is used in an amount of 50 to 90% by weight based on 100% by weight of the photosensitive resin composition containing the solvent. When the content of the solvent falls within this range, the composition will have the viscosity of the # and the improved processable. The background transfer agent can enter! 1 increase the adhesion to the substrate, and the light-fat composition of the present invention is also </ RTI> </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> </ RTI> <RTIgt; Examples of mercapto include trimethoxysulfonylbenzoic acid, bismuth-burning, trimethyltrimethoxy ketone, ethenyltriethoxy oxime 9S523, isocyanate propyl triethoxy hydrazine 24 ♦ ♦ 201248322 alkane, r-glycidoxypropyltrimethoxy decane and epoxycyclohexyl)ethyltrimethoxydecane, which may be used singly or in combination. Surfactant The photosensitive resin composition of the present invention may further comprise a surfactant in order to improve coating ability and prevent defects. Examples of the surfactant include commercially available fluorine-based surfactants such as BM-1000 and ΒΜ-1100 (manufactured by BM Chemie Co. Ltd.),

MegapackTMF142D，F172, F173 以及 F183(由 DinipponlnkMegapackTM F142D, F172, F173 and F183 (by Dinipponlnk

Kokyo Co. Ltd.製造）、FluoradTM FC-135、FC-HOC、FC-430Made by Kokyo Co. Ltd.), FluoradTM FC-135, FC-HOC, FC-430

TM 以及 FC-431 (由 Sumitomo 3M Co. Ltd.製造）、Surfron S-112、S-113、S-131、S-141 以及 S-145 (由 Asahigaras Co. Ltd·製造）、以及 SH-28PA、SH-190、SH-l93、SZ-6032、 以及 SF-8428 (由 Torey silicon Co. Ltd.製造）。 本發明之光敏樹脂組成物可進一步包括其他添加劑， 諸如，抗氧化劑和安定劑，至其不會不利地影響組成物之 性質之程度。 根據本發明之另i態樣，提供包括藉由使光敏樹脂 組成物固化而製備之塗佈膜之光屏蔽層，其包括主要間隔 物和次間格物之圖案。 較佳地’塗佈膜具有8 F/m或更少之介電常數。 高之::恢::膜具有^或更高之先學密度和職更 而且又，塗佈膜具有主要間隔物圖案和次間隔物圖 95523 25 201248322 根據本發明又一個態樣’提供包括該光屏蔽層之 顯示器裝置。 ％ 以下實施例意欲進一步闡釋本發明’而不限制其範&lt; 合成例1 : 1，卜雙（4’ -環氧基丙氧基苯基）、；[〜〇,，认 V1 -聯 苯）-1-環己基曱烷之製備 〈步驟1&gt; 1，1-雙（4’-羥基苯基聯笨^卜環 己基甲烷之製備 將70.5 g之聯苯環己基酮與200.7 g之酚和1〇. 15 • 〇 之硫醋酸摻和，然後於18°C在其中滴加40.0 g之三敗甲 烷磺酸20分鐘。在反應混合物於17至19°C反應18小時; 之後，在其中添加500 g之水以完成反應。以500 g之f 苯洗務有機層，直到pH值達到3至4，接著回收有機層。 從反應混合物移除曱苯、水以及過量的酚。進一步以甲苯 純化殘質，以獲得59. 2 g之淺黃色結晶（產率為51%)。所 測得之結晶之熔點為239· 5°C，而且結晶鑑定為標題化合 物。 〈步驟2&gt; 1,1-雙（4，-環氧基丙氧基笨基^卜^，，-聯 苯）-1-環己基甲烷之製備 將57.5g之步驟1中所獲得之1，1-雙（4，_羥基苯基）_ 1-(1 _聯苯）_1 -環己基甲烷與195.8 g之環氧氯丙烷摻 和’然後在其中添加0.602 g之氯化笨曱基三乙基銨 (benzyltriethylammonium chloride)，接著於 64°C 授拌 18小時。冷卻至54〇c之後，在反應混合物中滴加43.〇 g 之24重量％氫氧化鈉水溶液，接著攪拌3〇分鐘。從反應混 95523 26 201248322 口物移除環氧氯丙烷和水，然後在其中添加216 g之曱基 異丁基鲖。在反應混合物中滴加2.2 g之24重量％之氫氧 化鈉，接著於8 〇。(：攪拌2小時。使反應混合物冷卻至室溫， j後以3重量％之單墙酸鈉水溶液中和。接著，移除溶劑以 獲得57 g之黃色結晶（產率為79%)(熔點為64. 2。〇且環氧 當量為282)。結晶鑑定為標題化合物。 製備例1 將16. 95 g之合成例1之步驟2中所獲得之1，卜雙（4,-環氧基丙氡基苯基）-1-(1聯苯）_1_環己基曱烧（後文中 簡稱為“化合物a”）與4.43 g之丙烯酸（後文中簡稱為 化合物b-Γ )、0. 06 g之2, 6-二第三丁基-對曱酚、〇. 11 g之四丁基醋酸敍以及14.25 g之丙二醇-1-單甲基醚-2-乙酸酯摻和，接著於12〇°c攪拌16小時。冷卻至室溫之後， 在反應混合物中添加7. 18g之丙二醇-1-單曱基越-2-乙酸 醋、4.82 g之琥珀酸酐（後文中簡稱為“化合物c-Γ )以 及〇· 25 g之四丁基醋酸銨，接著於l〇(TC攪拌5小時。接 著’在反應混合物中添加5. 08 g之合成例1之步驟2中所 獲得之1，1-雙（4，-環氧基丙氧基苯基聯苯）-1-環己基甲烷（後文中簡稱為“化合物d-Γ )和2.18 g之丙 二醇-1-單曱基醚-2-乙酸酯，接著於120°C攪拌12小時， 於80°C攪拌2小時，然後於40°C攪拌2小時。使反應混合 物以水和醇進行再沉澱，以獲得呈粉末之鹼可顯影性樹脂 組成物（Mw=4, 200，Mn=2, 100，以及 55mgKOH/g 之酸值（固 體））。 95523 27 201248322 .藉由以化合物a之環氧基對化合物b之叛基之比率= 1 . 1 在化合物卜1⑻中添加化合物a (A)以製備環氧 加成物’以及藉由以環氧加成物之祕對化合物d之酸 野對化合物d-i之環氧基之比率=1: G 8: G 3，而使環氧 加成物與化合物Μ⑹和化合物卜進行自旨化反應製 備驗可顯雜職組成物作為最終產物。 製備例2 产_將43 g之合成例1之步驟2中所獲得之1, 1-雙（4，-1氧基丙氧絲基）—卜（1’ 苯）_卜環己基曱似化合物 =與33.6 g之丙烯酸（化合物by)、〇 〇4 g之2 6_二第 二丁基-對甲酚、0.21 g之乙酸四丁基銨以及18 g之丙二 =1單曱基域-2-乙酸酯摻合，接著於i2〇〇c攪拌13小 醇在，卻至室溫之後，在反應混合物中添加24 g之丙二 1單曱基趟-2-乙酸酯和1〇 g之琥珀酸酐（化合物 1：)，接著於lOOt：攪拌3小時。然後，在反應混合物中 添加 8 ^ g之雙酚ζ環氧丙基醚（後文中簡稱為“化合物 d、2，，\ ^ 厂接著於12(TC攪拌4小時，於90。(：攪拌3小時， 於 6〇γ&gt; 物、L檀拌2小時，然後於4(TC攪拌5小時。使反應混合 杈乂水和醇進行再沉澱，以獲得呈粉末之鹼可顯影性樹脂 髀，物（Mw=4600，Mn=2100，以及 54mgK0H/g 之酸值（固 9s523TM and FC-431 (manufactured by Sumitomo 3M Co. Ltd.), Surfron S-112, S-113, S-131, S-141, and S-145 (manufactured by Asahigaras Co. Ltd.), and SH-28PA , SH-190, SH-l93, SZ-6032, and SF-8428 (manufactured by Torey silicon Co. Ltd.). The photosensitive resin composition of the present invention may further include other additives such as an antioxidant and a stabilizer to such an extent that it does not adversely affect the properties of the composition. According to another aspect of the invention, there is provided a light shielding layer comprising a coating film prepared by curing a photosensitive resin composition, which comprises a pattern of a primary spacer and a secondary spacer. Preferably, the coating film has a dielectric constant of 8 F/m or less. High::Recovery:: The film has a pre-school density of ^ or higher and a job. Moreover, the coating film has a main spacer pattern and a secondary spacer pattern 95523 25 201248322. According to yet another aspect of the present invention, A display device for a light shielding layer. % The following examples are intended to further illustrate the invention 'without limitation'. <Synthesis Example 1 : 1, bis(4'-epoxypropoxyphenyl), [~〇,,V1 -biphenyl Preparation of 1-cyclohexyldecane <Step 1> Preparation of 1,1-bis(4'-hydroxyphenyl phenyl) Cyclohexylmethane 70.5 g of biphenylcyclohexanone and 200.7 g of phenol and 1〇. 15 • Sulphuric acid was blended, and then 40.0 g of sulphuric acid methanesulfonic acid was added dropwise thereto at 18 ° C for 20 minutes. The reaction mixture was reacted at 17 to 19 ° C for 18 hours; after that, it was added thereto. 500 g of water is used to complete the reaction. The organic layer is washed with 500 g of benzene until the pH reaches 3 to 4, and then the organic layer is recovered. The benzene, water and excess phenol are removed from the reaction mixture. Further purification with toluene The residue was obtained to obtain 56.2 g of pale yellow crystals (yield: 51%). The melting point of the crystals was determined to be 239. 5 ° C, and the crystals were identified as the title compound. <Step 2> 1,1- Preparation of bis(4,-epoxypropoxyphenyl)-,--biphenyl)-1-cyclohexylmethane 57.5 g of 1,1-double (4,_ obtained in step 1) Phenyl)) 1-(1 _biphenyl)_1 -cyclohexylmethane was blended with 195.8 g of epichlorohydrin and then 0.602 g of benzyltriethylammonium chloride was added thereto. Then, the mixture was stirred at 64 ° C for 18 hours. After cooling to 54 ° C, 43. g of a 24% by weight aqueous sodium hydroxide solution was added dropwise to the reaction mixture, followed by stirring for 3 minutes. From the reaction mixture 95523 26 201248322 The epichlorohydrin and water were removed, and then 216 g of decylisobutylphosphonium was added thereto. 2.2 g of 24% by weight of sodium hydroxide was added dropwise to the reaction mixture, followed by 8 Torr. (: stirring for 2 hours) The reaction mixture was cooled to room temperature, and then neutralized with a 3% by weight aqueous solution of sodium sulphate. Then, the solvent was removed to obtain 57 g of yellow crystals (yield: 79%). Further, the epoxy equivalent is 282. The crystals are identified as the title compound. Preparation Example 1 16.95 g of the compound obtained in the step 2 of Synthesis Example 1, b-bis(4,-epoxypropionylphenyl) )-1-(1 biphenyl)_1_cyclohexyl fluorene (hereinafter referred to as "compound a") and 4.43 g of acrylic acid (post Referred to as compound b-Γ ), 0. 06 g of 2, 6-di-t-butyl-p-nonylphenol, 〇. 11 g of tetrabutyl acetate and 14.25 g of propylene glycol-1-monomethyl ether -2- acetate blending, followed by stirring at 12 ° C for 16 hours. After cooling to room temperature, add 7.18 g of propylene glycol-1-monodecyl-2-acetic acid vinegar, 4.82 g The succinic anhydride (hereinafter abbreviated as "compound c-Γ" and 〇·25 g of tetrabutylammonium acetate were then stirred at 1 Torr for 5 hours. Next, '1,1-bis(4,-epoxypropoxyphenylbiphenyl)-1-cyclohexylmethane obtained in the step 2 of Synthesis Example 1 was added to the reaction mixture. Abbreviated as "compound d-Γ" and 2.18 g of propylene glycol-1-monodecyl ether-2-acetate, followed by stirring at 120 ° C for 12 hours, stirring at 80 ° C for 2 hours, then at 40 ° C The mixture was stirred for 2 hours, and the reaction mixture was reprecipitated with water and an alcohol to obtain a powdery alkali developable resin composition (Mw = 4, 200, Mn = 2, 100, and 55 mgKOH/g acid value (solid) 95523 27 201248322. By the ratio of the epoxy group of compound a to the base of compound b = 1. 1 compound (a) is added to compound 1 (8) to prepare epoxy adduct' and by The secret of the epoxy adduct is prepared by the ratio of the acid field of the compound d to the epoxy group of the compound di = 1: G 8: G 3 , and the epoxy adduct is prepared by reacting the compound ruthenium (6) with the compound b. The test can be used as a final product. Preparation Example 2 Production of 43 g of 1,1-bis(4,-1oxypropoxyl) obtained in the second step of Synthesis Example 1. Bu (1' benzene)-b-cyclohexyl quinone compound = 33.6 g of acrylic acid (compound by), 〇〇 4 g of 2 6_di-second butyl-p-cresol, 0.21 g of tetrabutylammonium acetate And 18 g of propylene-2 = monoterpene domain-2-acetate blending, followed by stirring 13 small alcohols in i2〇〇c, but after adding to room temperature, adding 24 g of propylene 2 to the reaction mixture Monodecyl hydrazine-2-acetate and 1 gram of succinic anhydride (compound 1:), followed by stirring at 100 Torr for 3 hours. Then, 8 ^ g of bisphenol oxime epoxide propyl ether was added to the reaction mixture. (Hereinafter referred to as "compound d, 2,, \ ^ plant followed by 12 (TC stirred for 4 hours, at 90. (: stirring for 3 hours, at 6 〇 γ), L Tan for 2 hours, then at 4 ( The TC was stirred for 5 hours. The reaction was mixed with water and alcohol to reprecipitate to obtain a powdery alkali developable resin 髀, (Mw = 4600, Mn = 2100, and 54 mg K0H / g acid value (solid 9s523

玉：轉由以化合物a之環氧基對化合物b-1之羧基之比痒 加成1私而在化合物卜1⑻中添加化合物a (A)以製備環 ，以及藉由環氧加成物之羥基對化合物之酸I 28 201248322 對化合物d-2之環氧基之比率=1 : 0. 8 : 0. 3，而使環氧加 成物與化合物c-1 (C)和化合物d-2 (D)進行g旨化反應，以 製備鹼可顯影性樹脂組成物作為最終產物。 製備例3 將16. 95 g之合成例1之步驟2中所獲得之1，1-雙（4’ -環氧基丙氧基苯基聯苯）-卜環己基曱烷（化合物 a)與4. 43 g之丙烯酸（化合物b-1)、6 g之2, 6-二第三丁 基-對甲酚、0. 11 g之四丁基醋酸銨以及14.25 g之丙二 醇-1-單曱基醚-2-乙酸酯摻和，接著於120°C攪拌16小 時。在冷卻至室溫之後，在反應混合物中添加9. 31 g之丙 二醇-1-單曱基醚-2-乙酸酯及7.41 g之六氫酞酸酐（後文 中簡稱為“化合物c-2”）及0.25 g之乙酸四正丁基銨， 接著於70°C攪拌4小時。使反應混合物以水和醇進行再沉 澱以獲得呈粉末之鹼可顯影性樹脂組成物（Mw=3000， Mn=1700，以及43 mgKOH/g之酸值（固體））。 藉由以化合物a之環氧基對化合物b-Ι之羧基之比率 =1 : 1，在化合物b-l(B)中添加化合物a(A)而製備環氧加 成物，以及藉由以環氧加成物之經基對化合物c-2之酸酐 之比率=1 : 0.8，而使環氧加成物與化合物c-2(C)進行酉旨 化反應，以製備鹼可顯影性樹脂組成物作為最終產物。 製備例4 將 37. 3 g 之 Light AcrylateTM PE-3A (丙烯酸衍生物， 由Kyoeisha Chemical Co.製造）與12. 5 g之琥珀酸酐、 0.087 g之三苯基膦以及0.050 g之2, 6-二第三丁基-對曱 95523 29 201248322 盼摻和’接著於1 〇 〇 C攪拌3小時，以獲得具有多官能性 丙烯基之不飽和酸（後文中簡稱為“化合物b_2”）。在冷 卻至室溫之後，在反應混合物中添加138 g之1,1-雙（4，-環氧基丙氧基苯基-聯笨）_1_環己基甲炫（化合物 a)、27.7 g之丙烯酸（化合物b-Ι)、0.51 g之2, 6-二第三 丁基-對曱酚、0.90 g之乙酸四丁基銨以及144 g之丙二 醇-1-單甲基醚-2-乙酸酯，接著於i2〇°c攪拌12小時。在 冷卻至室溫之後，在反應混合物中添加65. 4 g之丙二醇-1-單曱基喊-2-乙酸酯、40· 0 g之琥珀酸酐（化合物c-i)以及 2. 1 g之乙酸四丁基銨，接著於l〇(rc授拌5小時。然後， 在反應混合物中添加41. 4 g之1，1-雙（4,-環氧基丙氧基 苯基）-1-(1’’-聯苯）-1-環己基甲燒（化合物（1-1)、0.56宮 之2, 6-二第三丁基-對甲苯酚以及18.0 g之丙二醇-1-單 曱基醚-2-乙酸酯’接著於90°C攪拌1小時，然後於12(TC 攪拌8小時。冷卻至室溫之後’將反應混合物以水和醇進 行再沉澱，以獲得呈粉末之鹼可顯影性樹脂組成物 (Mw=6700 ’ Mn=2700 ’ 以及 51mgKOH/g 之酸值（固體））。 藉由以化合物8·之環氧基對化合物b-丨之緩基與化合 物b-2之羧基之比率=1 : 0. 75 : 0. 25，而在化合物卜丨和 b-2(B)中添加化合物a(A)以製備環氧基，以及藉由以環氧 加成物之羥基對化合物c-1之酸酐對化合物d__i之環氧基 之比率=1 : 0.8: 0.3,以使環氧化物與化合物c—1(c)和化 合物d-l(D)進行醋化反應’以製備驗可顯影性樹脂組成物 作為最終產物。 95523 30 201248322 製備例5 將26·8 g之Light EsterTM G201P (曱基丙烯酸衍生 物，由Kyoeisha Chemical Co.製造）與12.5 g之琥5白酸 酐、0.087 g之三苯基膦以及0.039 g之2, 6-二第三丁基、 對甲酚摻和，接著於100°C攪拌3小時，以獲得具有多官 能性（曱基）丙烯基之不飽和酸（後文中簡稱為“化合物 b-3”）。在冷卻至室溫之後，在反應混合物中添加138 g 之1，1-雙（4，-環氧基丙氧基苯基）-1-(Γ 聯苯環己 基甲烧（化合物a)、27.7 g之丙稀酸（化合物b-Ι)、〇 § 之2, 6-二第三丁基-對甲酚、〇· 90 g之四丁基醋酸銨以及 137 g之丙二醇-1-單曱基醚-2-乙酸酯’接著於i2(TC攪掉 12小時。在冷卻至室溫之後，在反應混合物中添加8这 之丙二醇-1-單甲基趟-2-乙酸酯和40. 0 g之琥珀酸酐“匕 合物c-1)和2. 1 g之乙酸四丁基銨，接著於1〇(rc攪拌5 小時。在反應混合物中添加41.4 g之1，1-雙（4，-環氧基 丙氡基苯基聯苯）_〗_環己基曱烷（化合物d—丨）、 〇·56 g之2, 6-二第三丁基一對曱苯酚以及18.〇 §之丙二醇 -1-單曱基醚-2-乙酸酯，接著於9(rc攪拌丨小時，然後於 120°C攪拌8小時。在冷卻至室溫之後，使反應混合物以水 和醇進行再沉澱’叫得呈粉末之鹼可㈣彡性樹脂組成物 (Mw=4800，Mn=2400，以及 54mgK〇H/g 之酸值（固體。 藉由以化合物a之環氡基對化合物b-Ι之羧基與化合 物b-3之叛基之比率=4 : 〇·75 : 〇 25，而在化合物和 b-3⑻中添加化合物a (A)以製備環氧基，以及藉由以環 95523 31 201248322 氧加成物之羥基對化合物c-1之酸酐對化合物d-l之環氧 基之比率=1 : 0. 8 : 0. 3，而使環氧加成物與化合物C-I(c) 和化合物d-l(D)進行酯化反應，以製備鹼可顯影性樹脂組 成物作為最終產物。 製備例6:黑色有機混合色素組成物之製備 將内醜胺黑（黑色5 8 2，由C i ba Company製造）、分散 劑、以及分散聚合物以50 : 8 : 8之固體重量比率摻和，然 後在其中以25重量％之固體濃度添加作為溶劑之pgmea。 將具有50g之總重量之所產生之分散液於混合機中充分地 預先混合。然後，進一步將分散液在塗料振盪器中於25至 60°C分散6小時，其中’分散時使用與分散液所具之相同 重量具有0. 3 mm之直徑之鍅珠。在程序完成之後，將珠從 分散液中移除，以獲得黑色色素組成物。 製備例7 :黑色有機混合色素組成物之製備 重複製備例6之過程，以獲得色素組成物，除了使用 35重量份之内醯胺黑和15重量份之可由Degussa獲得之 炭黑代替50重量份之内醯胺黑。 製備例8:黑色有機混合色素組成物之製備 重複製備例6之過程，以獲得色素組成物，除了使用 30重量份之内醯胺黑和20重量份之由Degussa獲得之户 黑代替50重量份之内醯胺黑。 製備例9:黑色有機混合色素組成物之製備 重複製備例6之過程’以獲得色素組成物，除了使用 25重量份之内醯胺黑和25重量份之可由Degussa獲得之 95523 32 201248322 炭黑代替50重量份之内醯胺黑。 製備例10 :黑色有機混合色素組成物之製備 重複製備例6之過程，以獲得色素組成物，除了使用 15重量份之内醯胺黑和35重量份之可由Degussa獲得之 炭黑代替50重量份之内醯胺黑。 製備例11 :黑色有機混合色素組成物之製備 重複製備例6之過程，以獲得色素組成物，除了使用 50重量份之可由Degussa獲得之炭黑代替50重量份之内 醯胺黑。 實施例1 在9.2094 g之丙二醇-1-單曱基醚~2-乙酸|旨中添加 1.0874 g之製備例1中獲得之驗可顯影性光敏樹脂組成 物、0.7249 g之二季戊四醇六丙烯酸酯、0 〇651 g之肪起 始劑（OXE-2，Ciba Geigy Corp·)、0.0042 g 之整平界面 活性劑（BYK Corp. )、〇· 0084 g之黏著助劑、以及8 9 g 之製備例6中獲得之黑色有機混合色素級成物（内醯胺黑 與炭黑-50 · 0重里份）’以製備黑色可驗顯影性光敏樹脂 組成物。 實施例2 以與實施例1之相同方式製備黑色可驗顯影性光敏樹 脂組成物’除了使用製備例2中所獲得之鹼可顯影性光敏 樹脂組成物代替製備例丨中所獲得之鹼可顯影性Z敏樹脂 組成物。 實施例 95523 33 201248322 以與實施例1之相同方式製備累 樹脂組成物’除了使用製備例3中辑〜 顯影性之光敏 樹脂組成物代替製備例1中獲得之气驗可顯影性光敏 成物。 ^胃如性光敏樹脂組 實施例4 色輪·可 蠖得之 之驗可 _影性之光敏 崎可顯影性光 顯影性光敏樹 以與實施例1之相同方式製備零 樹脂組成物，除了使用製備例4中所 敏樹脂組成物代替製備例1中所獲得 脂組成物。 實施例5 …六貝卿列上曰乃八裂備黑色鹼 脂組成物，除了使用製備例5中所獲得之影性光敏樹 樹脂組成物代替製備例1中所獲得之：:鹼可顯影性光敏 組成物。 可顯影性光敏樹脂 實施例6 付之黑色有機混合色素 實施例 以與實施例1之相同方式製備黑色鹼可 脂組成物’除了使用製備例7中所獲得之里色；：： 素（内醯胺黑與炭黑當· 15重量份）代替製備例6 ;賴 以與實施例1之相同方式製備黑色驗可顯影性光敏樹 脂組成物’除了使㈣備例8巾顺得之黑色有機混合色 素（内酿胺黑與炭黑=3〇 : 2〇重量份）代替製備例6中所獲 得之黑色有機混合色素。 95523 34 201248322 比較例1 以與實施例1之相同方式，用含量為8 543 g之丙二Jade: The compound a (A) is added to the compound b (1) to prepare a ring, and the epoxy adduct is added by the ratio of the epoxy group of the compound a to the carboxyl group of the compound b-1. The ratio of the hydroxyl group to the acid I 28 201248322 to the epoxy group of the compound d-2 = 1: 0.8: 0.3, and the epoxy adduct and the compound c-1 (C) and the compound d-2 (D) The g-reaction is carried out to prepare an alkali-developable resin composition as a final product. Preparation Example 3 1.95 g of 1,1-bis(4'-epoxypropoxyphenylbiphenyl)-cyclohexyldecane (compound a) obtained in the second step of Synthesis Example 1 4. 43 g of acrylic acid (compound b-1), 6 g of 2,6-di-t-butyl-p-cresol, 0.11 g of tetrabutylammonium acetate and 14.25 g of propylene glycol-1-monoterpene The base ether-2-acetate was blended, followed by stirring at 120 ° C for 16 hours. After cooling to room temperature, 9.31 g of propylene glycol-1-monodecyl ether-2-acetate and 7.41 g of hexahydrophthalic anhydride (hereinafter referred to as "compound c-2") were added to the reaction mixture. And 0.25 g of tetra-n-butylammonium acetate, followed by stirring at 70 ° C for 4 hours. The reaction mixture was reprecipitated with water and an alcohol to obtain a powdery alkali developable resin composition (Mw = 3000, Mn = 1700, and an acid value (solid) of 43 mgKOH/g). An epoxy adduct is prepared by adding the compound a (A) to the compound bl (B) by the ratio of the epoxy group of the compound a to the carboxyl group of the compound b-oxime = 1: 1, and by using an epoxy The ratio of the base of the adduct to the acid anhydride of the compound c-2 = 1: 0.8, and the epoxy adduct is reacted with the compound c-2 (C) to prepare an alkali developable resin composition. As the final product. Preparation Example 4 33.7 g of Light AcrylateTM PE-3A (acrylic acid derivative, manufactured by Kyoeisha Chemical Co.) and 12.5 g of succinic anhydride, 0.087 g of triphenylphosphine, and 0.050 g of 2,6- The second tert-butyl-p-95523 29 201248322 is expected to be blended and then stirred at 1 Torr C for 3 hours to obtain an unsaturated acid having a polyfunctional acryl group (hereinafter referred to as "compound b_2" hereinafter). After cooling to room temperature, 138 g of 1,1-bis(4,-epoxypropoxyphenyl-biphenyl)_1_cyclohexylmethylxyl (compound a), 27.7 g were added to the reaction mixture. Acrylic acid (compound b-indole), 0.51 g of 2,6-di-t-butyl-p-nonylphenol, 0.90 g of tetrabutylammonium acetate, and 144 g of propylene glycol-1-monomethyl ether-2-acetic acid The ester was then stirred at i2 ° C for 12 hours. After the chilling to room temperature, 65. 4 g of propylene glycol-1-monodecyl shout-2-acetate, 40 g of succinic anhydride (compound ci) and 2.1 g of acetic acid were added to the reaction mixture. Tetrabutylammonium, followed by stirring at rt for 5 hours. Then, 41.4 g of 1,1-bis(4,-epoxypropoxyphenyl)-1-(4) was added to the reaction mixture. 1''-biphenyl)-1-cyclohexylmethane (compound (1-1), 0.56, 2,6-di-t-butyl-p-cresol and 18.0 g of propylene glycol-1-monodecyl ether) -2-acetate' was then stirred at 90 ° C for 1 hour and then at 12 (TC stirred for 8 hours. After cooling to room temperature 'recipitate the reaction mixture with water and alcohol to obtain a powdery base developable Resin composition (Mw = 6700 'Mn = 2700 ' and an acid value (solid) of 51 mg KOH / g). The base group of the compound b-oxime and the carboxyl group of the compound b-2 by the epoxy group of the compound 8· Ratio = 1 : 0. 75 : 0. 25, while compound a (A) is added to the compound dip and b-2 (B) to prepare an epoxy group, and by the hydroxyl group of the epoxy adduct Anhydride of compound c-1 to epoxy group of compound d__i Ratio = 1: 0.8: 0.3 to acetate the epoxide with the compound c-1 (c) and the compound dl (D) to prepare a developable resin composition as a final product. 95523 30 201248322 Preparation Example 5 26·8 g of Light EsterTM G201P (methacrylic acid derivative, manufactured by Kyoeisha Chemical Co.) with 12.5 g of succinic acid 5, 0.087 g of triphenylphosphine, and 0.039 g of 2, 6-di Tributyl, p-cresol was blended, followed by stirring at 100 ° C for 3 hours to obtain an unsaturated acid having a polyfunctional (fluorenyl) propylene group (hereinafter referred to as "compound b-3" for short). After the reaction to room temperature, 138 g of 1,1-bis(4,-epoxypropoxyphenyl)-1-(indenebicyclohexylcarbamate (compound a), 27.7 g was added to the reaction mixture. Acrylic acid (compound b-Ι), 〇§ 2,6-di-t-butyl-p-cresol, 〇·90 g of tetrabutylammonium acetate, and 137 g of propylene glycol-1-monodecyl ether- The 2-acetate was then stirred at 12 ° for 12 hours. After cooling to room temperature, 8 propylene glycol-1-monomethylhydrazine-2-acetate and 40.0 g were added to the reaction mixture. It Peracetic acid "chelate c-1" and 2.1 g of tetrabutylammonium acetate, followed by stirring at 1 Torr for 5 hours. Add 41.4 g of 1,1-bis (4,-ring) to the reaction mixture. Oxypropyl phenyl phenyl biphenyl) _ _ _ cyclohexyl decane (compound d - 丨), 〇 · 56 g of 2, 6-di-t-butyl quinone phenol and 18. § § propylene glycol - 1-monodecyl ether-2-acetate, followed by stirring at 9 (rc) for an hour, then at 120 °C for 8 hours. After cooling to room temperature, the reaction mixture was reprecipitated with water and alcohol, which was called a powdery base (4) an inert resin composition (Mw = 4,800, Mn = 2,400, and an acid value of 54 mg K 〇 H / g ( By adding a compound a to the compound and b-3 (8) by the ratio of the carboxyl group of the compound b-oxime to the base of the compound b-3 = 4: 〇·75 : 〇25; A), in order to prepare an epoxy group, and the ratio of the hydroxyl group of the compound c-1 to the epoxy group of the compound dl by the hydroxyl group of the ring 95523 31 201248322 = 1: 0.8: 0.3, and The epoxy adduct is esterified with the compound CI(c) and the compound dl(D) to prepare an alkali developable resin composition as a final product. Preparation Example 6: Preparation of a black organic mixed pigment composition Uglycine black (black 5 8 2, manufactured by C i ba Company), a dispersant, and a dispersion polymer were blended at a solid weight ratio of 50:8:8, and then added as a solvent at a solid concentration of 25% by weight. Pgmea. The resulting dispersion having a total weight of 50 g is thoroughly premixed in the mixer Then, the dispersion is further dispersed in a coating shaker at 25 to 60 ° C for 6 hours, wherein the dispersion is carried out with the same weight of the dispersion having a diameter of 0.3 mm. The beads were removed from the dispersion to obtain a black pigment composition. Preparation Example 7: Preparation of Black Organic Mixed Pigment Composition The procedure of Preparation Example 6 was repeated to obtain a pigment composition except for using 35 parts by weight of yttrium. Amine black and 15 parts by weight of carbon black obtained by Degussa in place of 50 parts by weight of decylamine black. Preparation Example 8: Preparation of black organic mixed pigment composition The procedure of Preparation Example 6 was repeated to obtain a pigment composition, except for use. 30 parts by weight of decylamine black and 20 parts by weight of the black obtained by Degussa in place of 50 parts by weight of decylamine black. Preparation Example 9: Preparation of black organic mixed pigment composition The procedure of Preparation Example 6 was repeated to obtain The pigment composition was prepared by using 25 parts by weight of decylamine black and 25 parts by weight of 95523 32 201248322 carbon black available from Degussa in place of 50 parts by weight of decylamine black. Preparation Example 10: Black organic Preparation of the dye composition The procedure of Preparation Example 6 was repeated to obtain a pigment composition except that 15 parts by weight of decylamine black and 35 parts by weight of carbon black obtainable by Degussa were used instead of 50 parts by weight of decylamine black. Preparation Example 11: Preparation of Black Organic Mixed Pigment Composition The procedure of Preparation Example 6 was repeated to obtain a pigment composition except that 50 parts by weight of carbon black obtainable by Degussa was used instead of 50 parts by weight of decylamine black. Example 1 1.0874 g of the developable photosensitive resin composition obtained in Preparation Example 1, 0.7249 g of dipentaerythritol hexaacrylate, was added to 9.2094 g of propylene glycol-1-monodecyl ether~2-acetic acid. 0 〇 651 g of fat starter (OXE-2, Ciba Geigy Corp.), 0.0042 g of leveling surfactant (BYK Corp.), 〇·0084 g of adhesion promoter, and 8 9 g of preparation The black organic mixed pigment grade (indole amine black and carbon black - 50 · 0 parts) obtained in 6 was prepared to prepare a black developable photosensitive resin composition. Example 2 A black developable photosensitive resin composition was prepared in the same manner as in Example 1 except that the alkali developable photosensitive resin composition obtained in Preparation Example 2 was used instead of the alkali obtained in the preparation example. A Z-sensitive resin composition. Example 95523 33 201248322 A resin composition was prepared in the same manner as in Example 1 except that the photosensitive resin composition obtained in Preparation Example 1 was used instead of the photosensitive resin composition obtained in Preparation Example 1. ^Stomach-like photosensitive resin group Example 4 Color wheel · achievable test - Photosensitive photo developable photodevelopable photosensitive tree A zero resin composition was prepared in the same manner as in Example 1, except The resin composition obtained in Preparation Example 4 was substituted for the lipid composition obtained in Preparation Example 1. Example 5 ... a composition of a bismuth black sulphuric acid, which was obtained by using the photographic photosensitive resin composition obtained in Preparation Example 5, instead of the one obtained in Preparation Example 1: alkali developability Photosensitive composition. Developable Photosensitive Resin Example 6 Black Organic Mixed Pigment Example Example A erythroid lipid composition was prepared in the same manner as in Example 1 except that the color obtained in Preparation Example 7 was used;:: Amine black and carbon black were used as 15 parts by weight instead of Preparation Example 6; a black test developable photosensitive resin composition was prepared in the same manner as in Example 1 except that the black organic mixed pigment of (4) Preparation No. 8 was obtained. (Inner amine black and carbon black = 3 〇: 2 parts by weight) Instead of the black organic mixed pigment obtained in Preparation Example 6. 95523 34 201248322 Comparative Example 1 In the same manner as in Example 1, a propylene content of 8 543 g was used.

醇-1-單甲㈣-2-乙㈣製備黑色鹼可·性光敏樹脂組 成物，除了使用1·脳g之雙盼義合劑⑽·HAlcohol-1-monomethyl(tetra)-2-ethyl(iv) was prepared as a ferrous alkali-sensitive photosensitive resin composition, except that the use of bismuth mixture (10)·H was used.

Ni卯onKayakuCo. Ltd.)代替製備例丨中所獲得之鹼可顯 影性光敏樹脂組成物。 比較例2 以與實施例1相同的方式，用含量為7.6188g之丙二 醇-1-單曱基醚-2-乙酸酯製備黑色鹼可顯影性光敏樹脂組 成物’除 了使用 3· 398 g 之 cardo 黏合劑（CBR-1，Kyung-InNi卯on Kayaku Co. Ltd.) was used instead of the alkali-developable photosensitive resin composition obtained in the preparation of the crucible. Comparative Example 2 A black base developable photosensitive resin composition was prepared in the same manner as in Example 1 except that propylene glycol-1-monodecyl ether-2-acetate was used in an amount of 7.6188 g, except that 3·398 g was used. Cardo adhesive (CBR-1, Kyung-In

Synthetic Coloration)代替製備例1中所獲得之驗可顯 影性光敏樹脂組成物。 比較例3 以與實施例1相同的方式製備黑色鹼可顯影性之光敏 樹脂組成物’除了使用製備例9中所獲得之黑色有機混合 色素（内醯胺黑與炭黑=25 : 25重量份）代替製備例6中所 獲得之黑色有機混合色素。 比較例4 以與實施例1相同的方式製備黑色鹼可顯影性光敏樹 脂組成物，除了使用製備例10中所獲得之黑色有機混合色 素（内醯胺黑與炭黑=15 ·· 35重量份）代替製備例6中所獲 得之黑色有機混合色素。 比較例5 以與實施例1相同的方式製備黑色鹼可顯影性光敏樹 95523 35 201248322 脂組成物，除了使用製備例11中所獲得之黑色有機混合色 素（内醯胺黑與炭黑=0 : 50重量份）代替製備例6中所獲得 之黑色有機混合色素。 [影像圖案之形成] 藉由旋塗、狹縫塗佈（Slit c〇ating)、輥塗、網印或 灑施器（applicator)方法，而將光敏樹脂組成物塗佈於經 預處理之基板上至2至25 厚度。將經塗佈之層於範圍 在70至90 C之溫度加熱1至1〇分鐘，以藉由移除溶劑之 方式產生膜。 以光罩覆蓋膜，然後曝照於2〇〇至5〇〇 nm之光化射 線。用於輻射之光源係選自低壓水銀燈、高壓水銀燈、超 高壓水銀燈、金屬齒素燈以及氬氣雷射，而且，若需要，χ 射線以及電子束。在高壓水銀燈之情況下，取決於組成物 之組分和膜之厚度，將曝光程度設為5〇〇 mJ/cm2或更低 (365 nm感測器）。 藉由以驗性溶液溶解和移除非經曝光之部分而將膜顯 影，為了圖案形成。將圖案冷卻至室溫，然後在熱空氣循 環乾燥烤箱巾以230 t㈣烤2Q分鐘轉射彡像圖案。 [光屏蔽效能之評估] 傳導通過材料之光與落在材料上之光之對數比率為材 料之吸光值，而且以吸光值除以材料之厚度而計算光學密 度。 以1〇胙（1。/1)之式計算樣本之吸光值’其中1為穿過 樣本之光之強度，而且Iq為入射光之強度。從因而獲得之 95523 36 畢 201248322 吸光值計算光學密度。以宋声叫^ 光之強度。 以在度&amp;十（由X—hte Co.製造）測量 [彈性恢復率之評估] 、使用方疋塗益將黑色光敏樹脂組成物塗佈在玻璃板上， 並且於90 C乾燥2. 5分鐘以形成塗佈膜。將圖案光罩放置 在以365 mn之波長於5G raJ/cm2之強度曝露於光之塗佈媒 上。然後，將所產生之塗佈膜在丨重量％氫氧化钟水溶液中 於23°C顯影1分鐘，以及以純水洗務i分鐘以形成預定的 間隔物圖案。將因而形成之間隔物圖案在烤箱中以2就 加熱30分鐘，以獲得具有3.7±〇.2 之厚度和3〇±i 之寬度之經固化之管柱間隔物圖案。 藉由使用具有50 # m直徑平面穿透器之彈性測量儀器 (Shimatz，Japan)之負載-卸載方法，測定間隔物圖案之壓 縮位移和彈性恢復率。以0.45 gf/秒之速度和3秒之保持 時間，在間隔物圖案上施加5 gf之負載。使用以下方程式 °十舁彈性恢復率’其中D1表示施加負载時之長度（&quot;m)， 亦即，壓縮位移，而且（D1-D2)表示施加負載之後恢復之長 度（β m)。 〈方程式1&gt; 彈性恢復率（％) = [(D1-D2) / Dl]xl〇〇 [介電常數之測量] 將實施例1至7和比較例1至5中所獲得之各光敏樹 脂組成物塗佈在Π0 (氧化銦錫）玻璃上，以及以9〇°C於熱 板上乾燥2· 5分鐘以獲得具有1. 5至2. 之厚度之塗佈 95523 37 201248322 膜。 將具有300 /zm之直徑之金（Au)電極沉積在塗佈膜 上，而製備樣本。 使用精準度電阻抗分析器（HP 4294A)測量樣本之電 容，以及使用以下方程式2計算介電常數（F/m)。 〈方程式2&gt; ^ - £ 〇 X £ X - d 其中C為電容’ 為真空中之介電常數，ε為塗佈膜 之相對介電常數，Α為電極面積，以及d為塗佈膜之厚度。 〈評估之準則〉 〇：8 F/m或更低之介電常數 X :大於8 F/m之介電常數 [黏著力之評估] 根據ASTMD3359進行橫切測試，以及根據如下所示之 評估之準則評估黏著力性質。將各光敏樹脂組成物施用於 具有1 mm之厚度之經鉻塗佈之玻璃基板上達1至2之 厚度’以及在熱空氣循環爐中於8(rc乾燥1分鐘而獲得塗 佈膜以365 nm之波長和5〇 mJ之強度之超高壓水銀燈對 塗佈膜進行照射。在經曝光之膜於熱空氣循環爐中以230°C 加熱30分鐘之後，使其冷卻至室溫。使用雷射刀，將塗佈 膜刀。j成1〇〇片（各具有1 mm X 1 mm之面積）。將片貼上 跟德 、 &quot;’以及突然地從該片分離膠帶。視覺觀察剝離狀態。 &lt;評估之準則〉 95523 38 201248322 OB : 65%或更多片從膜完全地剝離。 1B : 35至65%片之邊緣從膜剝離。 2B : 15至35°/。片之交集處從膜部分地剝離。 3B : 5至15%片之交集處從膜部分地剝離。 4B :少於5片之交集處從膜部分地剝離。 5B :沒有片從膜剝離且其邊緣保持柔軟。 [解析度：顯影邊界之評估] 將各光敏樹脂組成物施用於具有1 mm之厚度之經鉻塗 佈之玻璃基板上達1至2//m之厚度，並且在熱板上以60°C 乾燥1分鐘以獲得塗佈膜。接著，將具有光罩尺寸為8、 10、20、30以及50/zm之遮罩放置於塗佈膜上，然後以365 nm波長之高壓水銀燈對塗佈膜進行照射。將經曝光之膜以 1% K0H水溶液於環境壓力下，在30°C以給定時期（70秒、 100秒、以及130秒）顯影。測量最小圓點之尺寸以產生顯 影邊界。 [評估之結果] 實驗之結果顯示於以下表1。 95523 39 201248322 [表1] 光學密度 /1 Ai m 彈性恢復率 ⑻ 介電常數 (F/m) 黏著力 解析度 (# m) 實施例1 1.22 75 3. 62 5B 8 實施例2 1.24 ^— 76 3.64 5B --、 9 實施例3 !· 22 〜----- 73 3.59 5B 8 實施例4 1.27 71 3.61 5B 7 實施例5 1,24 75 3.66 5B 8 實施例6 155 — 78 6.42 5B 8 實施例7 !·72 —, 78 7.43 5B ----- 9 比較例1 1.20 ---- 52 3.63 3B 13 比較例2 1.23 60 3.65 2B ---^ 11 比較例3 2-12 73 8.36 5B ~---〜 7 比較例4 2. 94 、----- 50 18. 51 4B ----^ 9 比較例5 3. 48 68 30. 09 5B 10 如表1所示’相較彼等從比較例1至5中製備之樹脂 組成物所獲得者’從實施例1至7中製備之樹脂組成物所 獲得之塗佈膜顯示卓越的彈性恢復率、介電常數、黏著力、 顯影邊界。特別地，就彈性恢復率和顯影邊界而言， 例1至7較比較例1和2卓越，而且就介電常數而古，， 顯地較比較例4和5卓越。 Q ’明 彼等熟悉本領域者將暸解先前描述中所揭露之相八 特定具體例可輕易地使用作為修飾或設計用於進行=== 95523 40 201248322 明相同目的之其他具體例之基準。彼等熟悉本領域者亦將 暸解此相等具體例不會悖離所附加之申請專利範圍中所載 之發明之精神與範疇。 【圖式簡單說明】 無。 【主要元件符號說明】 無0 95523 41Synthetic Coloration) was used instead of the photosensitive photosensitive resin composition obtained in Preparation Example 1. Comparative Example 3 A black alkali developable photosensitive resin composition was prepared in the same manner as in Example 1 except that the black organic mixed pigment obtained in Preparation Example 9 (indole amine black and carbon black = 25:25 parts by weight) was used. Instead of the black organic mixed pigment obtained in Preparation Example 6. Comparative Example 4 A ferrous alkali developable photosensitive resin composition was prepared in the same manner as in Example 1, except that the black organic mixed pigment obtained in Preparation Example 10 (indole amine black and carbon black = 15 · · 35 parts by weight) was used. Instead of the black organic mixed pigment obtained in Preparation Example 6. Comparative Example 5 A erythro-developable photosensitive tree 95523 35 201248322 fat composition was prepared in the same manner as in Example 1 except that the black organic mixed pigment obtained in Preparation Example 11 (indole amine black and carbon black = 0: 50 parts by weight) Instead of the black organic mixed pigment obtained in Preparation Example 6. [Formation of Image Pattern] The photosensitive resin composition is applied to the pretreated substrate by spin coating, slit coating, roll coating, screen printing or applicator method. Up to 2 to 25 thickness. The coated layer is heated at a temperature ranging from 70 to 90 C for 1 to 1 minute to form a film by removing the solvent. The film is covered with a reticle and then exposed to an actinic ray of 2 〇〇 to 5 〇〇 nm. The source of radiation is selected from the group consisting of low pressure mercury lamps, high pressure mercury lamps, ultra high pressure mercury lamps, metal dentate lamps, and argon lasers, and, if necessary, xenon rays and electron beams. In the case of a high pressure mercury lamp, the degree of exposure is set to 5 〇〇 mJ/cm 2 or less (365 nm sensor) depending on the composition of the composition and the thickness of the film. The film is developed by dissolving and removing the non-exposed portion with an experimental solution for pattern formation. The pattern was cooled to room temperature and then rotated in a hot air circulating oven towel at 230 t (d) for 2Q minutes to transfer the image. [Evaluation of Light Shielding Effectiveness] The logarithmic ratio of the light passing through the material to the light falling on the material is the absorbance of the material, and the optical density is calculated by dividing the absorbance by the thickness of the material. The absorbance of the sample is calculated as 1 〇胙 (1. / 1) where 1 is the intensity of light passing through the sample, and Iq is the intensity of the incident light. The optical density was calculated from the thus obtained absorbance value of 95523 36 Bi 201248322. Called by Song Song ^ The intensity of light. 5的干燥。 2. The black photosensitive resin composition was coated on a glass plate, and dried at 90 C, using a measurement of [elastic recovery rate], using a square [10] (manufactured by X-hte Co.). Minutes to form a coating film. The pattern mask was placed on a coating medium exposed to light at a wavelength of 365 mn at 5 G raJ/cm2. Then, the resulting coating film was developed in a 丨 weight % hydrazine solution at 23 ° C for 1 minute, and washed with pure water for 1 minute to form a predetermined spacer pattern. The thus formed spacer pattern was heated in the oven at 2 for 30 minutes to obtain a cured column spacer pattern having a thickness of 3.7 ± 〇.2 and a width of 3 〇 ± i. The compression displacement and the elastic recovery rate of the spacer pattern were measured by a load-unloading method using an elastic measuring instrument (Shimatz, Japan) having a 50 # m diameter plane penetrator. A load of 5 gf was applied to the spacer pattern at a rate of 0.45 gf/sec and a hold time of 3 seconds. The following equation ° 舁 舁 elastic recovery rate' where D1 represents the length when the load is applied (&quot;m), that is, the compression displacement, and (D1-D2) represents the length of recovery (β m) after the load is applied. <Equation 1> Elastic recovery ratio (%) = [(D1 - D2) / Dl] xl 〇〇 [Measurement of dielectric constant] Each of the photosensitive resins obtained in Examples 1 to 7 and Comparative Examples 1 to 5 was composed. The film was coated on Π0 (indium tin oxide) glass, and dried on a hot plate at 9 ° C for 2.5 minutes to obtain a coating of 95523 37 201248322 film having a thickness of 1.5 to 2. A gold (Au) electrode having a diameter of 300 /zm was deposited on the coating film to prepare a sample. The capacitance of the sample was measured using a precision electrical impedance analyzer (HP 4294A) and the dielectric constant (F/m) was calculated using Equation 2 below. <Equation 2> ^ - £ 〇X £ X - d where C is the capacitance ' is the dielectric constant in vacuum, ε is the relative dielectric constant of the coating film, Α is the electrode area, and d is the thickness of the coating film . <Guidelines for Evaluation> 〇: Dielectric constant of 8 F/m or lower X: Dielectric constant of more than 8 F/m [Evaluation of adhesion] Cross-cut test according to ASTM D3359, and evaluation according to the following The criteria assess the nature of adhesion. Each photosensitive resin composition was applied to a chrome-coated glass substrate having a thickness of 1 mm to a thickness of 1 to 2' and in a hot air circulating oven at 8 (r drying for 1 minute to obtain a coating film at 365 nm) The coating film was irradiated with an ultrahigh pressure mercury lamp having a wavelength of 5 〇mJ and the film was heated at 230 ° C for 30 minutes in a hot air circulating furnace, and then cooled to room temperature. The film knife will be coated into a 1 piece (each having an area of 1 mm X 1 mm). The piece is attached to the German, &quot; and the tape is suddenly separated from the piece. The peeling state is visually observed. ;Guidelines for evaluation> 95523 38 201248322 OB : 65% or more of the film is completely peeled off from the film. 1B: 35 to 65% of the edge of the sheet is peeled off from the film. 2B: 15 to 35° /. Intersection of the film from the film portion Stripping. 3B: The intersection of 5 to 15% of the sheets was partially peeled off from the film. 4B: The intersection of less than 5 sheets was partially peeled off from the film. 5B: No sheet was peeled off from the film and its edges remained soft. : Evaluation of development boundary] Each photosensitive resin composition was applied to a chrome coating having a thickness of 1 mm The glass substrate has a thickness of 1 to 2/m and is dried on a hot plate at 60 ° C for 1 minute to obtain a coating film. Next, it will have a mask size of 8, 10, 20, 30, and 50/zm. The mask is placed on the coating film, and then the coating film is irradiated with a high-pressure mercury lamp at a wavelength of 365 nm. The exposed film is subjected to an aqueous solution of 1% K0H at ambient pressure at a given period of 30 ° C (70 Development in seconds, 100 seconds, and 130 seconds. The size of the smallest dot is measured to produce a development boundary. [Results of Evaluation] The results of the experiment are shown in Table 1. 95523 39 201248322 [Table 1] Optical Density / 1 Ai m Elasticity Recovery rate (8) Dielectric constant (F/m) Adhesion resolution (# m) Example 1 1.22 75 3. 62 5B 8 Example 2 1.24 ^- 76 3.64 5B --, 9 Example 3 !· 22 ~- ---- 73 3.59 5B 8 Example 4 1.27 71 3.61 5B 7 Example 5 1,24 75 3.66 5B 8 Example 6 155 — 78 6.42 5B 8 Example 7 !·72 —, 78 7.43 5B ---- - 9 Comparative Example 1 1.20 ---- 52 3.63 3B 13 Comparative Example 2 1.23 60 3.65 2B ---^ 11 Comparative Example 3 2-12 73 8.36 5B ~---~ 7 Comparative Example 4 2. 94 , -- --- 50 18. 51 4B ----^ 9 Comparative Example 5 3. 48 68 30. 09 5B 10 As shown in Table 1 'Compared with those obtained from the resin compositions prepared in Comparative Examples 1 to 5' The coating films obtained in the resin compositions prepared in Examples 1 to 7 exhibited excellent elastic recovery, dielectric constant, adhesion, and development boundary. In particular, Examples 1 to 7 were superior to Comparative Examples 1 and 2 in terms of elastic recovery rate and development boundary, and were superior to Comparative Examples 4 and 5 in terms of dielectric constant. It will be appreciated that those skilled in the art will appreciate that the specific embodiments disclosed in the foregoing description can be readily utilized as a basis for other specific examples of the same purpose of modification or design for the purposes of === 95523 40 201248322. It will be appreciated by those skilled in the art that the equivalents are not to be construed as a departure from the spirit and scope of the invention. [Simple description of the diagram] None. [Main component symbol description] No 0 95523 41

Claims (1)

201248322 七、申請專利範圍： 1. 一種光敏樹脂組成物，包括光可聚合性不飽和黏合劑樹 脂、烯系不飽和官能性單體、聚合起始劑、黑色有機現 合色素以及溶劑， &amp; 其中，該光可聚合性不飽和黏合劑樹脂係藉由使在 式（I)所示之環氧樹脂中添加不飽和酸而獲得之環氧加 成物與多元酸酐反應而獲得：201248322 VII. Patent application scope: 1. A photosensitive resin composition, including photopolymerizable unsaturated binder resin, ethylenically unsaturated functional monomer, polymerization initiator, black organic ready-to-use pigment and solvent, &amp; Wherein, the photopolymerizable unsaturated binder resin is obtained by reacting an epoxy adduct obtained by adding an unsaturated acid to the epoxy resin represented by the formula (I) and a polybasic acid anhydride: 其中， (I) R1至R4各獨立地為氫、Ch。烷基、Cl_1Q烷氧基、C21〇 烯基、α-H芳基或鹵素，其中該Cl_1Q烷基、Ci id烷氧基、 C2-i。烯基或Ce-u芳基係視需要經齒素取代； R為虱、Cl-1D烧基、C3-U環统基、Cl-ίο院氧基、C2-10 稀基、C6-U方基、C6-〗4烧基方基或C6-14芳基烧基； R6和R7各獨立地為選自由下列各者所組成群組： 氫、Cl-l。烷基、C3_M環烷基、Cl-1D烷氧基、C2-10烯基、Ce-14 芳基、C6_u烧基芳基以及Ce-u芳基烧基，其中該Cho烧 基、C3-M環烧基、Cho烷氧基、Cm。烯基、Ce-14芳基、C6-U 烧基芳基或Ce-M芳基烷基係視需要經Ci-H烷基、（:㈣烷 氧基、C2-1D稀基或鹵素取代；以及 η係範圍為〇至10之整數。 95523 1 201248322 2.如申請專利範圍第1項所述之光敏樹脂組成物， 其中，R1至R4各獨立地為氫或Cl-3说基； … R5為氫、Cm烷基或C5-7環烷基； R6和R7各獨立地為氫或Ce-M芳基。 3·如申請專利範圍第1項所述之光敏樹脂組成物，其包 括： 0.5至50重量％之該光可聚合性不飽和黏合劑樹 脂； 1至50重量％之該烯系不飽和官能性單體； 〇· 1至10重量％之該聚合起始劑； 5至40重量％之該黑色有機混合色素；以及 該溶劑為餘量。 4·如申請專利範圍第1項所述之光敏樹脂組成物，其中， 該光可聚合性不飽和黏合劑樹脂係藉由使在式（I)所示 之環氧樹脂中添加不飽和酸而獲得之環氧加成物與多 元酸酐反應以獲得中間產物，以及使該中間產物與單-或多官能性環氧化合物反應而獲得。 5·如申請專利範圍第1項所述之光敏樹脂組成物，其中， 該不飽和酸係選自由下列各者所組成群組之至少一 者：丙烯酸、曱基丙烯酸、巴豆酸、肉桂酸、山梨酸、 曱基丙烯酸羥乙基酯蘋果酸酯、丙烯酸羥乙基酯蘋果酸 酯、甲基丙烯酸羥丙基酯蘋果酸酯、丙烯酸羥丙基酯蘋 果酸酯以及蘋果酸二環戊二婦醋。 6·如申請專利範圍第丨項所述之光敏樹脂組成物，其中， 95523 2 201248322 該多兀酸it係選自由下列各者所組成群纟且之至，丨、一 者：玻、順丁豨二_、笨偏三_、笨均二酸 酐、2, 2，3, 3’ ~二笨曱酮四羧酸酐、3, 3,，4, 4, _二 =喊酸軒、乙二醇雙脱水偏笨三酸S旨、甘油參脱水偏 苯三酸®旨、醜峡、六氫⑽針、曱基氫轉肝、四氬 酞酸酐、納迪克酸酐（nadic anhydride)、曱基納迪克 酸酐、三烷基四氫酞酸酐、5-(2, 5-二側氡基四氫呋 。南）-3-曱基-3-環己烯-1，2-二細請、三燒基四氫酜酸 酐-順丁烯二酸酐加成物、十二烯基琥珀酸酐以及曱基 腐植酸酐（methylhymic anhydride)。 7·如申請專利範圍第1項所述之光敏樹脂組成物，其中， 該聚合起始劑係選自由下列各者所組成群組之至少一 者：對二曱基胺基苯乙酮、2-羥基-2-甲基-1-苯基—丙 -1-酮、笨曱基二曱基縮酮、二苯基酮、安息香丙基醚、 二乙基噻吨酮、2, 4-雙（三氯曱基）-6-對甲氧基笨基_s_ 三哄、2-三氣曱基-5-苯乙稀基-1，3, 4-側氧基二唾、9-苯基0丫咬、3-甲基-5-胺基-（（s-三哄-2-基）胺基）-3-苯基薰草素、2-(〇-氣苯基）-4, 5-二苯基坐基二聚 物、1-苯基-1，2-丙烷二酮-2-(ο-乙氧基羰基）肟、1_[9_ 乙基-6-(2-甲基苯甲醯基）_9H- °卡嗤-3-基]-乙酮 ~1-（〇-乙酿基肟）、〇-苯甲醯基-4’-(苯并巯基）苯曱酿 基-己基-酮肟，2,4,6-三甲基苯基羰基-二苯基膦醯基 氧化物、六氟偶磷基-三烷基笨基锍鹽、2-毓基苯并咪 唑以及2, 2,-苯并噻唑基二硫化物。 95523 3 201248322 8.如申 組 1 所述之无敏树月曰組成物’其中 〜I睛專利範園第 rt -IT S丨々4» 該黑色有機混合色素包括選下列各者所組成群 之有機色素1#、内賴黑以及其混合物。 9.如申請專利範圍第1項所述之光敏樹脂組成物，其中， 該黑色有機混合色素進一步包括至少一種選自由下列 各者所組成群組之無機色素：炭黑、氧化鉻、氧化鐵以 及鈦黑，其中，以1〇〇重量份該有機色素為基準計，該 無機色素之含量係在〇至70重量份之範圍内。 10.如申請專利範圍第1至9項中任一項所述之光敏樹脂組 成物，其中，藉由固化該光敏樹脂組成物而製備之塗佈 膜具有8 F/m或更少之介電常數、1〇或更高之光學密 度、以及70%或更高之彈性恢復率。 95523 4 201248322 四、指定代表圖： (一) 本案指定代表圖為：本案無圖式。 (二) 本代表圖之元件符號簡單說明：無。 五、本案若有化學式時，請揭示最能顯示發明特徵的化學式：Wherein (I) R1 to R4 are each independently hydrogen and Ch. An alkyl group, a Cl_1Q alkoxy group, a C21 nonenyl group, an α-H aryl group or a halogen, wherein the Cl_1Q alkyl group, the Ci id alkoxy group, C2-i. Alkenyl or Ce-u aryl groups are optionally substituted by dentate; R is hydrazine, Cl-1D alkyl, C3-U cycline, Cl- ί oxi, C 2-10, C6-U a group, a C6-]4 alkyl group or a C6-14 aryl group; each of R6 and R7 is independently selected from the group consisting of hydrogen, Cl-l. An alkyl group, a C3_M cycloalkyl group, a Cl-1D alkoxy group, a C2-10 alkenyl group, a Ce-14 aryl group, a C6_u alkyl group, and a Ce-u aryl group, wherein the Cho group, C3-M Cycloalkyl, Cho alkoxy, Cm. Alkenyl, Ce-14 aryl, C6-U alkylaryl or Ce-M arylalkyl is optionally substituted with Ci-H alkyl, (:(tetra)alkoxy, C2-1D dilute or halogen; And the η 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 And a C5-7 cycloalkyl group; each of R6 and R7 is independently hydrogen or a Ce-M aryl group. The photosensitive resin composition according to claim 1, which comprises: 0.5 Up to 50% by weight of the photopolymerizable unsaturated binder resin; 1 to 50% by weight of the ethylenically unsaturated functional monomer; 1 to 10% by weight of the polymerization initiator; 5 to 40 by weight % of the black organic mixed pigment; and the solvent is the balance. The photosensitive resin composition according to claim 1, wherein the photopolymerizable unsaturated binder resin is made by The epoxy adduct obtained by adding an unsaturated acid to the epoxy resin shown in (I) is reacted with a polybasic acid anhydride to obtain an intermediate product, and The photosensitive resin composition according to claim 1, wherein the unsaturated acid is selected from the group consisting of the following: At least one of: acrylic acid, methacrylic acid, crotonic acid, cinnamic acid, sorbic acid, hydroxyethyl methacrylate malate, hydroxyethyl acrylate malate, hydroxypropyl methacrylate malate, a hydroxypropyl acrylate malate and a malic acid dicyclopentan vinegar vinegar. The photosensitive resin composition as described in claim 2, wherein 95523 2 201248322 the polydecanoic acid is selected from the following The group consists of 纟 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , 3,, 4, 4, _ 2 = shouting acid, ethylene glycol double dehydration, stearic acid, glycerol, dehydration, trimellitic acid, ugly, hexahydro (10), thiol hydrogen , tetraargonic anhydride, nadic anhydride, quinone diacyl anhydride, trialkyl tetrahydrogen Anhydride, 5-(2,5-di-fluorenyltetrahydrofuran.s.)-3-mercapto-3-cyclohexene-1,2-di-, tris-tetrahydrophthalic anhydride-butylene a dianhydride anhydride, a dodecenyl succinic anhydride, and a methyl methic acid anhydride. The photosensitive resin composition according to claim 1, wherein the polymerization initiator is selected from the group consisting of At least one of the groups consisting of: p-didecylaminoacetophenone, 2-hydroxy-2-methyl-1-phenyl-propan-1-one, agglomerated dinonyl ketal, Diphenyl ketone, benzoin propyl ether, diethyl thioxanthone, 2, 4-bis(trichloroindenyl)-6-p-methoxyphenyl ss-trisyl, 2-trimethyl decyl-5 - phenethyl-1,3,4-oxyl di-salt, 9-phenyl oxime, 3-methyl-5-amino-((s-tris-2-yl)amino) 3-phenyl oxacillin, 2-(anthracene-phenyl)-4, 5-diphenyl-sitting dimer, 1-phenyl-1,2-propanedione-2-(ο- Ethoxycarbonyl) hydrazine, 1_[9_ethyl-6-(2-methylbenzhydryl)_9H- °carbin-3-yl]-ethanone~1-(〇-乙糖基肟), 〇-Benzyl fluorenyl-4'-(benzomercapto)benzoquinone-based a ketone oxime, 2,4,6-trimethylphenylcarbonyl-diphenylphosphonium decyl oxide, hexafluorophosphino-trialkyl sulfonium sulfonium salt, 2-mercaptobenzimidazole, and 2, 2,-Benzothiazolyl disulfide. 95523 3 201248322 8. The composition of the non-allergic tree scorpion as described in the application group 1 wherein the _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Organic pigment 1#, Nere black and mixtures thereof. 9. The photosensitive resin composition according to claim 1, wherein the black organic mixed pigment further comprises at least one inorganic pigment selected from the group consisting of carbon black, chromium oxide, iron oxide, and Titanium black, wherein the content of the inorganic pigment is in the range of from 〇 to 70 parts by weight based on 1 part by weight of the organic dye. The photosensitive resin composition according to any one of claims 1 to 9, wherein the coating film prepared by curing the photosensitive resin composition has a dielectric of 8 F/m or less Constant, optical density of 1 〇 or higher, and elastic recovery of 70% or higher. 95523 4 201248322 IV. Designated representative map: (1) The representative representative of the case is: There is no schema in this case. (2) A brief description of the symbol of the representative figure: None. 5. If there is a chemical formula in this case, please disclose the chemical formula that best shows the characteristics of the invention: 95523 395523 3
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