TW201215630A - Photosensitive resin composition and light blocking layer using the same - Google Patents

Photosensitive resin composition and light blocking layer using the same Download PDF

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Publication number
TW201215630A
TW201215630A TW099146893A TW99146893A TW201215630A TW 201215630 A TW201215630 A TW 201215630A TW 099146893 A TW099146893 A TW 099146893A TW 99146893 A TW99146893 A TW 99146893A TW 201215630 A TW201215630 A TW 201215630A
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Taiwan
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chemical formula
resin composition
photosensitive resin
acid
methacrylate
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TW099146893A
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Chinese (zh)
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TWI414539B (en
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Chang-Min Lee
Jun-Seok Kim
Kil-Sung Lee
Jung-Sik Choi
Min-Sung Kim
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Cheil Ind Inc
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D471/00—Heterocyclic compounds containing nitrogen atoms as the only ring hetero atoms in the condensed system, at least one ring being a six-membered ring with one nitrogen atom, not provided for by groups C07D451/00 - C07D463/00
    • C07D471/02—Heterocyclic compounds containing nitrogen atoms as the only ring hetero atoms in the condensed system, at least one ring being a six-membered ring with one nitrogen atom, not provided for by groups C07D451/00 - C07D463/00 in which the condensed system contains two hetero rings
    • C07D471/08—Bridged systems
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D498/00—Heterocyclic compounds containing in the condensed system at least one hetero ring having nitrogen and oxygen atoms as the only ring hetero atoms
    • C07D498/02—Heterocyclic compounds containing in the condensed system at least one hetero ring having nitrogen and oxygen atoms as the only ring hetero atoms in which the condensed system contains two hetero rings
    • C07D498/04—Ortho-condensed systems
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/22—Absorbing filters
    • G02B5/223—Absorbing filters containing organic substances, e.g. dyes, inks or pigments
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509—Filters, e.g. light shielding masks
    • G02F1/133512—Light shielding layers, e.g. black matrix
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029

Abstract

Disclosed are a photosensitive resin composition that includes (A) a cardo-based resin including a repeating unit represented by the following Chemical Formula 1, (B) a reactive unsaturated compound, (C) a pigment, (D) an initiator and (E) a solvent, and a light blocking layer using the same. In Chemical Formula 1, each substituent is the same as defined in the specification.

Description

201215630 六、發明說明： r:發明戶斤屬之技術領域3 發明領域 本揭示係有關於一種包括。卡°朵為主之(cardo-based)樹 脂之光敏性樹脂組成物以及使用該組成物的一光阻隔層。 【先前技術3 發明背景 一液晶顯示裝置包括一個下基材，其含有一光阻隔 層、一濾色片，及一IT0像素電極；一有效電路部件，包括 一液晶層、一薄膜電晶體，及一電容器層；以及包括一 ITO 像素電極之一個上基材。 光阻隔層阻隔了未經控制的光傳輸離開一基材的一透 明像素電極以及因而避免由於光傳輸經過一薄膜電晶體所 生的對比降低。紅色、綠色及藍色的光阻隔層傳輸具一預 定的波長的白光之光以及顯示色彩。 光阻隔層一般係藉由色素分散法來製造。色素分散法 包括用一含著色劑光可聚合性組成物來塗覆一透明基材， 曝光以藉由熱固化來提供一圖案，以及用一溶劑移除未曝 光的部分。 然而，當作為一黏結劑樹脂時，一種光敏性聚醯亞胺 或酚為主之樹脂係使用於色素分散法中，可以獲得高的抗 熱性但是敏感性降低以及需要一有機溶劑作為一顯影溶 劑。使用一疊氮化物化合物之光阻劑具有低的敏感性與抗 熱性以及可以受曝光的期間之氧的影響。 201215630 並且，一丙烯醯基為主之樹脂具有良好的抗熱性、抗 收縮性、耐化學性，及類似物，但是具有降低的敏感性、 顯影性質，以及緊密的接觸性質。因包括大量的黑色色素 俾以調整一光阻隔層的光學密度，敏感性、顯影性質，及 緊密的接觸性質可能會明顯地劣化。 【發明内容】 發明概要 本發明的一態樣提供了一種光敏性樹脂組成物，其具 有優良的敏感性、顯影性質、緊密的接觸性質、抗熱性、 抗收縮性、耐化學性，以及推拔的性質。 本發明的另一態樣提供了使用該光敏性樹脂組成物來 製造的一光阻隔層。. 根據本發明的一態樣，提供了一種光敏性樹脂組成物 係，其包括（A)含有由下列化學式1表示的一重覆單元之咔 哚為主之樹脂；（B)—反應性不飽和化合物；（C)一色素；（D) 一起始劑；及(E) —溶劑。 [化學式1]201215630 VI. Description of the invention: r: Technical field of inventions 3 Field of the invention The present disclosure relates to an inclusion. A photosensitive resin composition of cardo-based resin and a light-blocking layer using the composition. [Prior Art 3] A liquid crystal display device includes a lower substrate including a light blocking layer, a color filter, and an IOT pixel electrode; an effective circuit component including a liquid crystal layer, a thin film transistor, and a capacitor layer; and an upper substrate including an ITO pixel electrode. The photointerceptor layer blocks uncontrolled light transmission away from a transparent pixel electrode of a substrate and thereby avoids contrast reduction due to light transmission through a thin film transistor. The red, green, and blue light-blocking layers transmit white light with a predetermined wavelength and display color. The photo-barrier layer is generally produced by a pigment dispersion method. The pigment dispersion method comprises coating a transparent substrate with a colorant-containing photopolymerizable composition, exposing to provide a pattern by thermal curing, and removing the unexposed portion with a solvent. However, when used as a binder resin, a photosensitive polyimide or phenol-based resin is used in the pigment dispersion method to obtain high heat resistance but reduced sensitivity and an organic solvent as a developing solvent. . A photoresist using a single azide compound has low sensitivity and heat resistance and can be affected by oxygen during exposure. 201215630 Also, an acryl-based resin has good heat resistance, shrink resistance, chemical resistance, and the like, but has reduced sensitivity, developing properties, and tight contact properties. Since a large amount of black pigment enamel is included to adjust the optical density of a light-blocking layer, sensitivity, developing properties, and tight contact properties may be significantly deteriorated. SUMMARY OF THE INVENTION An aspect of the present invention provides a photosensitive resin composition which has excellent sensitivity, developing properties, tight contact properties, heat resistance, shrink resistance, chemical resistance, and push-out The nature. Another aspect of the present invention provides a light blocking layer produced using the photosensitive resin composition. According to an aspect of the present invention, there is provided a photosensitive resin composition comprising (A) a resin mainly comprising a repeating unit represented by the following Chemical Formula 1; (B) - Reactive unsaturated a compound; (C) a pigment; (D) a starter; and (E) a solvent. [Chemical Formula 1]

於化學式1中， R3與R4為相同或不同的，以及為氩、鹵素，或經取代 或未經取代的C1至C20烷基， 201215630 R1與R2為相同或不同的，以及為氫或 ch2och2cr6r7r8(其中，R6至R8為相同或不同的，氫’或 經取代或未經取代的（甲基）丙烯酸酯）’但有條件是Rl與r2 之至少一者為CH2OCH2CR6R7R8(其中，R6至R8為相同或不 同的，氫，或經取代或未經取代的（甲基）丙烯酸酯，以及r6 至R8之至少一者為經取代或未經取代的（甲基）丙烯酸酯）’ Z1 為一單鍵、〇、co、s〇2、cr9R10、siR"Rl (其中代 R9至R12為相同或不同的，以及為氫，或經取代成未、’ 4 、 的C1至C20烷基），或是為由下列化學式2-1至2-11表不的連 接基團之至少一者， Z2為酸酐殘餘基團或酸二酐殘餘基團’ m1與in2獨立地為範圍由〇至4的整數’以及η’1至10 的整數。 [化學式2-1] 負 *In Chemical Formula 1, R3 and R4 are the same or different, and are argon, halogen, or substituted or unsubstituted C1 to C20 alkyl, 201215630 R1 and R2 are the same or different, and are hydrogen or ch2och2cr6r7r8 ( Wherein R6 to R8 are the same or different, hydrogen 'or substituted or unsubstituted (meth) acrylate)', but conditionally at least one of R1 and r2 is CH2OCH2CR6R7R8 (wherein R6 to R8 are the same) Or different, hydrogen, or substituted or unsubstituted (meth) acrylate, and at least one of r6 to R8 is substituted or unsubstituted (meth) acrylate) 'Z1 is a single bond , 〇, co, s〇2, cr9R10, siR" Rl (wherein R9 to R12 are the same or different, and are hydrogen, or substituted into un, '4, C1 to C20 alkyl), or At least one of the linking groups represented by the following Chemical Formulas 2-1 to 2-11, Z2 is an acid anhydride residual group or an acid dianhydride residue group 'm1 and in2 are independently an integer ranging from 〇 to 4' and An integer from η'1 to 10. [Chemical Formula 2-1] Negative *

[化學式2-3][Chemical Formula 2-3]

5 201215630 [化學式2-4] ★ 舞5 201215630 [Chemical Formula 2-4] ★ Dance

[化學式2-5] k 4r[Chemical Formula 2-5] k 4r

於化學式2-5中，In Chemical Formula 2-5,

Ra為氫、乙基、C2H4C卜 C2H4OH、CH2CH=CH2，或苯基。 [化學式2-6] * *Ra is hydrogen, ethyl, C2H4C, C2H4OH, CH2CH=CH2, or phenyl. [Chemical Formula 2-6] * *

[化學式2-7] * *[Chemical Formula 2-7] * *

XX

6 201215630 [化學式2-9]6 201215630 [Chemical Formula 2-9]

該咔哚為主之樹脂可以具有至1，000至50,000 g/mol的 重量平均分子量。 該咔哚為主之樹脂可以包括由下列化學式4表示的一 末端基於二個末端端的至少一者。 [化學式4]The ruthenium-based resin may have a weight average molecular weight of from 1,000 to 50,000 g/mol. The ruthenium-based resin may include one end represented by the following Chemical Formula 4 based on at least one of the two terminal ends. [Chemical Formula 4]

於化學式4中， Z3為由下列化學式5-1至5-7表示的連接基團之至少一者。 201215630 [化學式5-1]In Chemical Formula 4, Z3 is at least one of the linking groups represented by the following Chemical Formulas 5-1 to 5-7. 201215630 [Chemical Formula 5-1]

* * 於化學式5-1中，Rb與Re為相同或不同的，以及為氫、 經取代或未經取代的C1至C20烷基、酯基，或醚基。 [化學式5-2]* * In Chemical Formula 5-1, Rb and Re are the same or different, and are a hydrogen, substituted or unsubstituted C1 to C20 alkyl group, an ester group, or an ether group. [Chemical Formula 5-2]

H 禽 [化學式5-5] RdH avian [Chemical Formula 5-5] Rd

•k ★ 於化學式5-5中，1^為0、S、NH、經取代或未經取代的 201215630• k ★ In Chemical Formula 5-5, 1^ is 0, S, NH, substituted or unsubstituted 201215630

Cl至C20烷基、Cl至C20烷基胺基，或是C2至C20丙烯胺基。 [化學式5-6]Cl to C20 alkyl, Cl to C20 alkyl amine, or C2 to C20 propylene amine. [Chemical Formula 5-6]

該光敏性樹脂組成物可以包括1至30 wt%的該味π朵為 主之樹脂（Α) ; 1至3〇 wt%的該反應性不飽和化合物（β) ; 1 至30 wt%的該色素(〇 ; 〇.〇1至1〇 wt%的該起始劑（D);以及 差額的該溶劑（E)。 該光敏性樹脂組成物可以進一步包括一丙烯醯基為主 之樹脂’以及該丙烯醯基為主之樹脂可以包括第一乙稀屬 不飽和單體與第二乙烯屬不飽和單體之一共聚物：該第一 乙烯屬不飽和單體為曱基丙烯酸、馬來酸、衣康酸、反丁 稀一自文’或其荨之組合的第一乙稀屬不飽和單體；以及該 第二乙烯屬不飽和單體為苯乙烯、α_曱基苯乙烯、乙稀基 甲苯、乙稀基节基甲基醚、甲基丙烯酸甲酯、甲基丙烯酸 乙酯、甲基丙烯酸丁酯、甲基丙烯酸2-羥基乙酯、曱基丙 烯酸2-羥基丁酯、曱基丙烯酸苄酯、曱基丙烯酸環己酯、 甲基丙烯酸苯酯、甲基丙烯酸2-胺基乙酯、甲基丙稀酸2_ 201215630 二甲基胺基乙酯、乙酸乙烯酯、苯甲酸乙烯酯、曱基丙稀 酸縮水甘油酯、曱基丙烯骑、曱基丙稀醞胺，或其等之組 合的第二乙烯屬不飽和單體。 該丙烯醯基為主之樹脂可以具有大約3,〇〇〇至4〇,〇〇〇 g/mol的重量平均分子量。 該咔哚為主之樹脂與丙烯醯基為主之樹脂可以以99: i 至30:70的重量比被包括。 該起始劑可以包括一種光聚合化起始劑、一種自由基 聚合化起始劑5或其等之一組合。 該光敏性樹脂組成物可以以該光敏性樹脂組成物的i 〇〇 份重量計為基準包括〇.〇1至20份以重量計的環氧化合物。 根據本發明的另一態樣，提供了使用該光敏性樹脂組 成物來製造的一光阻隔層。 下文中，其他的具體例將詳盡地予以說明。 該光敏性樹脂組成物具有優良的敏感性、顯影性質、 緊密的接觸性質、抗熱性、抗收縮性、耐化學性，和推拔 的性質以及通常可以實施至一光阻隔層，及類似物。 圖式簡單說明 第1圖為一掃描式電子顯微鏡圖，其顯示出依據實施例 1的光敏性樹脂組成物的殘餘物； 第2圖為一掃描式電子顯微鏡圖，其顯示出依據比較實 施例3的光敏性樹脂組成物的殘餘物. 第3圖為-掃描式電子顯微鏡圖，其顯示出依據比极實 施例1的光敏性樹脂組成物的殘餘斗勿. 10 201215630 第4圖為一掃描式電子顯微鏡圖’其顯示出依據實施例 2的光敏性樹脂組成物的殘餘物； 第5圖為一掃描式電子顯微鏡圖，其顯示出依據實施例 1的光敏性樹脂組成物之圖案形成性質； 第6圖為一掃描式電子顯微鏡圖，其顯示出依據比較實 施例3的光敏性樹脂組成物之圖案形成性質； 第7圖為一掃描式電子顯微鏡圖，其顯示出依據比較實 施例2的光敏性樹脂組成物之圖案形成性質； 第8圖為一光學顯微鏡圖，其顯示出依據實施例2之光 敏性樹脂組成物的圖案尺寸； 第9圖為一光學顯微鏡圖，其顯示出依據比較實施例2 之光敏性樹脂、纟且成物的圖案尺寸； 第1 〇圖為一光學顯微鏡圖，其顯示出依據比較實施例4 之光敏性樹脂紐成物的圖案尺寸。 C實施冷式；3 較佳實施例之詳細說明 在下文中將詳細地說明本揭示之例示性具體例。然 而’此等具體例僅供舉例說明之用而不會限制本揭示。 田使用於本文巾’當未提供特定定義時，「經取代的」 —詞係指用以下的至少—者’代替至少-個氫：函素(F、 Cl、Br，或I)、羥基、ClsC2〇烷氧基、硝基、氰基、胺基、 亞胺基、疊氮基、甲肺基、肼基、亞肼基、叛基、胺甲醯 基、硫醇基、酯基、醚基、羧基或其鹽類、磺酸基或其鹽 類、麟酸基或其鹽類、dC2〇炫基、^至⑽稀基、C2 11 201215630 至C20炔基、C6至C30芳基、C3至C20環烷基、C3至C20環 烯基、C3至C20環炔基、C2至C20雜環烷基、C2至C20雜環烯 基、C2至C20雜環炔基、C3至C30雜芳基，或其等之一組合。 當使用於本文中，當未提供特定定義時，「雜」一詞可 指包括選自於N、0、S，及P的至少一雜原子於一環系基團 中的一者。 當使用於本文中，當未提供特定定義時，「（甲基）丙烯 酸酯（(meth)acrylate)」係指「丙烯酸酯」與「甲基丙烯酸酯」 一者’以及「（甲基）丙烯酸((meth)acrylic acid)」係指「丙 稀酸」與「曱基丙稀酸(methacrylicacid)」。 依據一具體例之光敏性樹脂組成物包括（A) —咔哚為 主之樹脂、（B)—反應性不飽和化合物' (〇—色素、（d) — 起始劑，及(E) —溶劑。 在下文中，詳細地說明各組份。 (A)咔哚為主之樹脂 該咔哚為主之樹脂包括由下列化學式1表示的一重覆 HS 一 單7L。 [化學式1]The photosensitive resin composition may include 1 to 30% by weight of the π-based resin (Α); 1 to 3% by weight of the reactive unsaturated compound (β); 1 to 30 wt% of the a pigment (〇; 〇.〇1 to 1% by weight of the initiator (D); and a difference of the solvent (E). The photosensitive resin composition may further comprise an acrylic resin-based resin' and The acryl-based resin may include a copolymer of a first ethylenically unsaturated monomer and a second ethylenically unsaturated monomer: the first ethylenically unsaturated monomer is mercaptoacrylic acid or maleic acid. a first ethylenically unsaturated monomer which is a combination of itaconic acid and antibutanil, or a combination thereof; and the second ethylenically unsaturated monomer is styrene, α-mercaptostyrene, B Dilute toluene, ethylene benzyl methyl ether, methyl methacrylate, ethyl methacrylate, butyl methacrylate, 2-hydroxyethyl methacrylate, 2-hydroxybutyl methacrylate, hydrazine Benzyl acrylate, cyclohexyl methacrylate, phenyl methacrylate, 2-aminoethyl methacrylate, methyl acrylate 2 _ 2 01215630 Dimethylaminoethyl ester, vinyl acetate, vinyl benzoate, glycidyl thioglycolate, mercapto propylene riding, mercapto acrylamide, or a combination thereof, the second ethylene is not The acryl-based resin may have a weight average molecular weight of about 3, 〇〇〇 to 4 〇, 〇〇〇g/mol. The bismuth-based resin and the acryl-based resin. It may be included in a weight ratio of from 99: i to 30: 70. The initiator may include a photopolymerization initiator, a radical polymerization initiator 5, or a combination thereof. The material may include from 1 to 20 parts by weight of the epoxy compound based on the weight of the photosensitive resin composition. According to another aspect of the present invention, the use of the photosensitive resin is provided. A light-blocking layer produced by the composition. Hereinafter, other specific examples will be described in detail. The photosensitive resin composition has excellent sensitivity, developing properties, tight contact properties, heat resistance, shrink resistance, Chemical resistance, and the nature of push And generally can be implemented to a light-blocking layer, and the like. Brief Description of the Drawings Fig. 1 is a scanning electron microscope image showing the residue of the photosensitive resin composition according to Example 1; A scanning electron microscope image showing the residue of the photosensitive resin composition according to Comparative Example 3. Fig. 3 is a scanning electron micrograph showing the composition of the photosensitive resin according to the specific electrode example 1. 10 201215630 FIG. 4 is a scanning electron microscope image showing the residue of the photosensitive resin composition according to Example 2; FIG. 5 is a scanning electron microscope image showing The pattern forming property of the photosensitive resin composition according to Example 1; FIG. 6 is a scanning electron microscope image showing the pattern forming property of the photosensitive resin composition according to Comparative Example 3; Scanning electron micrograph showing the pattern forming property of the photosensitive resin composition according to Comparative Example 2; FIG. 8 is an optical micrograph showing the basis The pattern size of the photosensitive resin composition of Example 2; FIG. 9 is an optical micrograph showing the pattern size of the photosensitive resin according to Comparative Example 2, and the pattern of the composition; A micrograph showing the pattern size of the photosensitive resin composition according to Comparative Example 4. C. Cold Mode; 3 DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, exemplary embodiments of the present disclosure will be described in detail. However, these specific examples are for illustrative purposes only and do not limit the disclosure. "Used in this document" when a specific definition is not provided, the word "substituted" means replacing at least one hydrogen with at least one of the following: a hydrogen (F, Cl, Br, or I), a hydroxyl group, ClsC2 decyloxy, nitro, cyano, amine, imido, azido, methyl lung, sulfhydryl, fluorenylene, thiol, amine carbaryl, thiol, ester, ether a base, a carboxyl group or a salt thereof, a sulfonic acid group or a salt thereof, a linonic acid group or a salt thereof, a dC2 fluorene group, a toluene group, a C2 11 201215630 to a C20 alkynyl group, a C6 to C30 aryl group, a C3 group To C20 cycloalkyl, C3 to C20 cycloalkenyl, C3 to C20 cycloalkynyl, C2 to C20 heterocycloalkyl, C2 to C20 heterocycloalkenyl, C2 to C20 heterocycloalkynyl, C3 to C30 heteroaryl , or a combination of one of them. As used herein, when a particular definition is not provided, the term "hetero" may mean one of at least one heteroatom selected from the group consisting of N, 0, S, and P in a ring system. As used herein, when a specific definition is not provided, "(meth)acrylate" means "acrylate" and "methacrylate" and "(meth)acrylic acid" ((meth)acrylic acid)" means "acrylic acid" and "methacrylic acid". The photosensitive resin composition according to a specific example includes (A) a ruthenium-based resin, (B) a reactive unsaturated compound' (〇-pigment, (d) - an initiator, and (E) - In the following, each component is explained in detail. (A) Rhodium-based resin The rhodium-based resin includes a repetitive HS-single 7L represented by the following Chemical Formula 1. [Chemical Formula 1]

12 201215630 R3與R4為相同或不同的，以及為氫、鹵素，或經取代 或未經取代的C1至C20烷基， R1與R2為相同或不同的’以及為氫或 CH2OCH2CR6R7R8(其中，R6至R8為相同或不同的，氫，或經 取代或未經取代的（甲基）丙烯酸酯），但有條件是R1與R2之至 少一者為ch2och2cr6r7R8(其中，R6至r8為相同或不同的， 氫，或經取代或未經取代的（曱基）丙烯酸酯，但有條件是R6 至R8之至少一者為經取代或未經取代的（甲基）丙烯酸酯）， Z1 為一單鍵、〇、CO、so2、CR9Ri〇、SiR"Ri2(其中， R9至R12為相同或不同的’以及為氫，或經取代或未經取代 的C1至C20烷基），或是為由下列化學式2-1至2-11表示的連 接基團之至少一者， Z2為酸酐殘餘基團或酸二酐殘餘基團， [化學式2-1]12 201215630 R3 and R4 are the same or different, and are hydrogen, halogen, or substituted or unsubstituted C1 to C20 alkyl, R1 and R2 are the same or different 'and hydrogen or CH2OCH2CR6R7R8 (where R6 to R8 is the same or different, hydrogen, or substituted or unsubstituted (meth) acrylate), provided that at least one of R1 and R2 is ch2och2cr6r7R8 (wherein R6 to r8 are the same or different, Hydrogen, or a substituted or unsubstituted (fluorenyl) acrylate, provided that at least one of R6 to R8 is a substituted or unsubstituted (meth) acrylate), Z1 is a single bond, 〇, CO, so2, CR9Ri〇, SiR"Ri2 (wherein R9 to R12 are the same or different 'and hydrogen, or a substituted or unsubstituted C1 to C20 alkyl group), or are the following chemical formula 2 At least one of the linking groups represented by -1 to 2-11, Z2 is an acid anhydride residual group or an acid dianhydride residual group, [Chemical Formula 2-1]

13 201215630 [化學式2-4]13 201215630 [Chemical Formula 2-4]

[化學式2-5][Chemical Formula 2-5]

於化學式2-5中，In Chemical Formula 2-5,

Ra為氫、乙基、C2H4a、c2h4oh、ch2ch=ch2 >或苯基》 [化學式2-6] * *Ra is hydrogen, ethyl, C2H4a, c2h4oh, ch2ch=ch2 > or phenyl" [Chemical Formula 2-6] * *

[化學式2-7] it *[Chemical Formula 2-7] it *

XX

[化學式2-8][Chemical Formula 2-8]

14 201215630 4r [化學式2-9] 4r14 201215630 4r [Chemical Formula 2-9] 4r

[化學式2-10] ★[Chemical Formula 2-10] ★

★★

[化學式2-11] * 該咔哚為主之樹脂可以包括一者，該處於化學式1中之 各R1與R2為由下列化學式3表示的一取代基。 [化學式3][Chemical Formula 2-11] The ruthenium-based resin may include one, and each of R1 and R2 in Chemical Formula 1 is a substituent represented by the following Chemical Formula 3. [Chemical Formula 3]

由以上的化學式1表示的重覆單元包括（曱基）丙烯酸酯 之至少一者，特別地於R1與R2位置處之6個（曱基）丙烯酸 15 201215630 酯。既然該咔哚為主之樹脂每一個重覆單元包括6個（曱基) 丙烯酸酯，可以實現優良的相容性、顯影性質、敏感性、 緊密的接觸性質，和機械強度，以及當其被應用至一種光 敏性樹脂組成物時，由於優良的抗熱性與财光性，於高溫 下工作可為可能的。 該咔哚為主之樹脂可以包括為由下列化學式4表示的 一末端基於二個末端端的至少一者。 [化學式4]The repeating unit represented by the above Chemical Formula 1 includes at least one of (fluorenyl) acrylate, particularly 6 (mercapto)acrylic acid 15 201215630 ester at the positions of R1 and R2. Since the ruthenium-based resin includes six (fluorenyl) acrylates per recycling unit, excellent compatibility, development properties, sensitivity, tight contact properties, and mechanical strength can be achieved, as well as when When applied to a photosensitive resin composition, it is possible to work at a high temperature due to excellent heat resistance and richness. The ruthenium-based resin may include at least one of two terminal ends represented by the following chemical formula 4. [Chemical Formula 4]

於化學式4中， Z3為由下列化學式5-1至5-7表示的連接基團之至少一者。 [化學式5-1]In Chemical Formula 4, Z3 is at least one of the linking groups represented by the following Chemical Formulas 5-1 to 5-7. [Chemical Formula 5-1]

於化學式5-1中，Rb與Re為相同或不同的，以及為氫、 經取代或未經取代的C1至C20烷基、酯基，或醚基。 [化學式5-2]In Chemical Formula 5-1, Rb and Re are the same or different and are a hydrogen, substituted or unsubstituted C1 to C20 alkyl group, an ester group, or an ether group. [Chemical Formula 5-2]

16 201215630 [化學式5-3]16 201215630 [Chemical Formula 5-3]

it 禽 [化學式5-4]It avian [Chemical Formula 5-4]

夤 食 [化學式5-5]夤食 [Chemical Formula 5-5]

# * 於化學式5-5中，Rd為Ο、S、NH、經取代或未經取代的 C1至C20烷基、C1至C20烷基胺基，或是C2至C20丙烯胺基。 [化學式5-6]# * In Chemical Formula 5-5, Rd is hydrazine, S, NH, a substituted or unsubstituted C1 to C20 alkyl group, a C1 to C20 alkylamino group, or a C2 to C20 acrylamide group. [Chemical Formula 5-6]

[化學式5-7][Chemical Formula 5-7]

17 201215630 該咔哚為主之樹脂之實例可以包括以下之二或更多 者：含氟的化合物，例如9,9’-雙(4-環氧乙基曱氧基苯基) 氟，及類似物；酐化合物，例如：苯四甲酸二酐、萘四甲 酸二酐、聯苯四甲酸二酐、二苯曱酮四甲酸二酐、焦蜜石 酸二酐、環丁四曱酸二酐、茈四甲酸二酐、四氫呋喃四甲 酸二酐、四氫鄰苯二甲酐（tetrahydrophthacid anhydride)，及 類似物；乙二醇（glycol)化合物，例如：乙二醇 (ethyleneglycol)、丙二醇、聚乙二醇，及類似物；醇化合物， 例如：甲醇、乙醇、丙醇、正丁醇、環己醇、苯曱醇，及 類似物；一溶劑化合物，例如：丙二醇甲乙醋酸酯、N-甲 基吡咯啶酮，及類似物；一磷化合物，例如三苯膦，及類 似物；一胺或銨鹽化合物，氣化四曱銨、溴化四乙銨、苄 基二乙胺'三乙胺、三丁胺'苄基三乙基氣化銨，及類似物。 该°卡°朵為主之樹脂可以具有1，〇〇〇至50,000 g/mol的重 S平均分子量’特別地2,000至50,000 g/mol的重量平均分子 量，以及更特別地2〇〇〇至2〇〇〇〇8/111〇1的重量平均分子量。 §該°卡°木為主之樹脂具有於此範圍内的重量平均分子量 時’在-光阻隔層的製造期間，—圖案被形成而無殘餘物， 以及在顯影期間沒有損失—膜厚度，導致—良好的圖案。 5亥"卡。木為主之樹脂可以以該光敏性樹脂組成物的總重 量為基準’以1至30㈣，以及特別地2至20 wt%的-量被 包括*包括此範圍内的該°卡°朵為主之樹脂時，優良的敏 感!生、顯影性質、抗熱性、财光性，和緊密的接觸性質可 以被實現。 18 201215630 該光敏性樹脂組成物可以除了該咔哚為主之樹脂之外 進一步包括一丙稀醯基為主之樹脂。 該丙烯酼基為主之樹脂為一第一乙烯屬不飽和單體以 及可與該第一乙烯屬不飽和單體共聚合的一第二乙稀屬不 飽和單體之一種共聚物，以及包括至少一丙烯醯基為主之 重覆單元的一樹脂。 該第一乙烯屬不飽和單體為包括至少一叛基之—乙稀 屬不飽和單體。該單體之實例包括丙稀酸、曱基丙烯酸、 馬來酸、衣康酸、反丁烯二酸，或其等之組合。 該第一乙烯屬不飽和單體以該丙烯醯基為主之樹脂的 總量為基準’可以包括範圍由5至50 wt%，以及特別地，由 10至40 wt%的一量。 該第二乙烯屬不飽和單體之實例可以包括：芳香族乙 稀基化合物’例如苯乙烯、（X-甲基苯乙稀、乙稀基甲苯、 乙稀基卞基甲基鍵，及類似物，不飽和緩酸醋化合物，例 如：甲基丙烯酸甲酯、甲基丙烯酸乙酯、曱基丙稀酸桂皮 酯、甲基丙烯酸丁酯、曱基丙烯酸2-羥基乙酯、曱基丙稀 酸2-羥基丁酯、曱基丙烯酸苄酯、曱基丙烯酸環己酯，曱 基丙烯酸苯酯，及類似物；不飽和羧酸胺基烷基酯化合物， 例如：甲基丙烯酸2-胺基乙酯、曱基丙烯酸2-二曱基胺基乙 醋，及類似物；叛酸乙稀基酯化合物，例如：乙酸乙稀醋、 苯曱酸乙烯酯，及類似物；不飽和羧酸縮水甘油酯化合物， 例如曱基丙烯酸縮水甘油酯，及類似物；乙烯基氰化物化 合物，例如甲基丙烯腈及類似物；不飽和醯胺化合物，例 19 201215630 如甲基丙烯醯胺及類似物；以及類似物。其等可以單一地 或如多於二個之混合物來使用。 該丙烯醯基為主之樹脂之實例可以包括甲基丙烯酸/ 曱基丙烯酸苄酯共聚物、甲基丙晞酸/甲基丙稀酸苄酯/苯乙 烯共聚物、甲基丙稀酸/甲基丙烯酿节酯/曱基丙稀酸2-經基 乙酯共聚物、曱基丙烯酸/甲基丙烯酸苄酯/苯乙烯/甲基丙 烯酸2-羥基乙酯共聚物，及類似物，但不限於彼等。其等 可以單一地或是如二個或更多個之混合物來使用。 該丙烯醯基為主之樹脂可以具有範圍從3,000至 150,000 g/mo卜特別地3,〇〇〇至40,000 g/mol，以及更特別地 5,000至30,000 g/m〇1的重量平均分子量。當該丙烯醯基為主 之樹脂具有於此範圍内的重量平均分子量時，該光敏性樹 脂組成物具有良好的物理性質與化學性質、適當的黏度，以 及與一基材之緊密的接觸性質，當被應用至一光阻隔層時。 該6稀酿基為主之樹脂可以具有範圍從30至200 mgK〇H/g的酸價，以及特別地50至180 mgKOH/g的酸價。 當丙稀酿基為主之樹脂具有於此範圍内的酸價時，可以實 現優異的像素解析度。 田°亥丙締職基為主之樹脂被包括於該光敏性樹脂組成 物之内時’該咔哚為主之樹脂和該丙烯醯基為主之樹脂可 以以99·1至199的重量比存在’以及特別地以95:5至50:50 ' 子在·當該β卡β朵為主之樹脂和丙稀酿基為主之樹 月曰係以5亥重量比被包括時’優良的顯影性質與敏感性係被 貫見以及可以獲得具有優良的圖案形成能力之光阻隔層圖 20 201215630 案而抑制底切的產生。 (B)反應性不飽和化合物 該反應性不飽和化合物可以是於一種光敏性樹脂組成 物中之普遍使用的單體或寡聚物。其可以為包括至少一乙 烯屬不飽和雙鍵之單官能或多官能性甲基丙烯酸酯。 該反應性不飽和化合物在曝光時於圖案形成製程期 間，由於乙烯屬不飽和雙鍵’引起了充分的光聚合化作用 以形成具有優良的抗熱性、财光性，及财化學性之圖案。 該反應性不飽和化合物之實例可以包括二丙烯酸乙二 醇酯、乙二醇二曱基丙烯酸酯、二丙稀酸二乙二醇酯、二 丙烯酸三乙二醇酯、三乙二醇二甲基丙烯酸酯、丨，6_己二醇 二丙烯酸酯、1,6-己二醇二甲基丙烯酸酯、季戊四醇三丙稀 酸酯、季戊四醇四丙烯酸酯、二季戊四醇五丙烯酸酯、二 季戊四醇六丙烯酸酯、雙酚A環氧丙烯酸酯、乙二醇曱醚丙 烯酸酯、三羥甲基丙烷三丙烯酸酯、三丙烯醯基氧乙基磷 酸酯，及類似物。 該反應性不飽和化合物之商業上可得的實例係如下 列。單官能性甲基丙烯酸酯可以包括Aronix M-101®、 M-lll®、M-114® (TOAGOSEI CHEMICAL INDUSTRY CO.，LTD.) ; KAYARAD TC-110S®、TC-120S® (NIPPON KAYAKU CO. > LTD.) ； V-158®' V-2311 ® (OSAKA ORGANIC CHEMICAL IND.，LTD.)，及類似物。雙官能性曱基丙稀 酸酯之實例可以包括Aronix M-210®、M-240®、M-6200® (TOAGOSEI CHEMICAL INDUSTRY CO. , LTD.)、 21 201215630 KAYARAD HDDA®、HX-220®、R-604® (NIPPON KAYAKU CO.，LTD.)、V-260®、V-312®、V-335 HP® (OSAKA ORGANIC CHEMICAL IND.，LTD.)，及類似物。三官能性甲基丙烯 酸酯之實例可以包括Aronix M-309®、M-400®、M-405®、 M-450®、M-7100®、M-8030®、M-8060® (TOAGOSEI CHEMICAL INDUSTRY CO. ’ LTD.)、KAYARAD TMPTA®、 DPCA-20®、DPCA-30®、DPCA-60®、DPCA-120® (NIPPON KAYAKU CO.，LTD.)、V-295®、V-300®、V-360®、V-GPT®、 V-3PA®、V-400® (Osaka Yuki Kayaku Kogyo Co. Ltd.)，及類 似物。該反應性不飽和化合物可以單一地或是如二個或更 多個之混合物來使用。 該反應性不飽和化合物可以用酸酐予以處理以改善顯 影性質。 該反應性不飽和化合物以該光敏性樹脂組成物的總量 為基準，可以以範圍由1至30 wt%，以及特別地1至15 wt% 的一量被包括。當包括此範圍内的反應未飽和化合物時， 固化在曝光時於圖案形成製程期間被充分地執行，以及可 以實現可靠性、抗熱性、耐光性，和耐化學性、解析度以 及圖案之緊密的接觸性質。 (C)色素 色素可以為一有機色素或一無機色素。 色素可以包括一紅色色素、一綠色色素、一藍色色素、 一黃色色素、一黑色色素，及類似物。 紅色色素之實例包括C.I.紅色色素254、C.I.紅色色素 22 201215630 255 C.I.紅色色素264、C.I·紅色色素27〇、c !•紅色色素272、 C.I.紅色色素177、C.I.紅色色素89，及類似物。綠色色素之 實例包括素取代的銅酞藍色素，例如：C I•綠色色素 36、CJ-綠色色素7，及類似物。藍色色素之實例包括一銅 欧藍色素，例如：C·!·藍色色素15:6、c』藍色色素15、c丄 藍色色素15:卜C.L藍色色素15:2、c 1藍色色素15:3、c丄 藍色色素15:4、C.L藍色色素15:5、cα藍色色扣，及類似 物。黃色色素之實例包括一異。引嗓啉色素，例如cj黃色色 素139 ’及類似物，一噎淋黃色素，例如ci黃色色素⑽， 及類似物’-鎳錯合物色素’例如C l黃色色素⑼，及類 似物。黑色色素之實例包括苯胺黑、花黑(ρ_·此⑻、 鈦黑（titanium black)、碳黑，及類似物。色素可以單一地或 疋如一個或更夕個之混合物來使用以及不限於以上說明的 色素。 在其等之中’為了有效地執行—光阻隔層的光阻隔， 可以包括黑色色素。當使用黑色色素時，亦可以使用一顏 色校正劑’例如蒽醌為主的色素、花為主的色t、酞花青 為主的色素、偶氮為主的色素，及類似物。 該光敏性樹脂組成物可以進一步包括一分散劑俾以改 善色素的分散。 特別地，色素可以用一分散劑來表面預處理或是色素 與分散劑可以在該光敏性樹脂組成物的製備期間一起添加。 該分散劑可以包括非離子性分散劑、陰離子性分散 劑、陽離子性分散劑，及類似物。分散劑之實例包括聚亞 23 201215630 烧基二醇及其之S旨、聚氧化稀(p〇ly〇Xyalkylene)、多經基醇 酯環氧烷加合產物、醇環氧烷加合產物、磺酸酯類、磺酸鹽、 羧酸酯類、羧酸鹽、烷基醯胺環氧烷加合產物、烷基胺，及 類似物’但不限於彼等。分散劑可以單一地或是如二個或 更多個之混合物來使用。 該分散劑之商業上可得的實例係如下列： DISPERBYK-101、DISPERBYK-130、DISPERBYK-140、 DISPERBYK-160、DISPERBYK-161、DISPERBYK-162、 DISPERBYK-163、DISPERBYK-164、DISPERBYK-165、 DISPERBYK-166、DISPERBYK-170、DISPERBYK-171、 DISPERBYK-182、DISPERBYK-2000、DISPERBYK-2001 , 及類似物（BYK) ; EFKA-47、EFKA-47EA、EFKA-48、 EFKA-49、EFKA-100、EFKA-400、EFKA-450，及類似物 (EFKA chemicals) ; Solsperse 5000、Solsperse 12000、 Solsperse 13240、Solsperse 13940、Solsperse 17000、 Solsperse 20000、Solsperse 24000GR、Solsperse 27000、 Solsperse 28000，及類似物（Zeneka);或是PB7U、PB821， 及類似物（Ajinomoto)。 該分散劑可以以該光敏性樹脂組成物的總量為基準， 以0.01至10 wt%的一量被包括。當包括以上範圍内的分散 劑時，該光敏性樹脂組成物的分散係被改善導致在一光阻隔 層的製造期間之優良的安定性、顯影性質，及圖案化性質。 色素可以以該光敏性樹脂組成物的總量為基準，以1至 30 wt%，以及特別地2至20 wt%的一量被包括。當包括以上 24 201215630 範圍内的色素時，色彩再現性、固化能力’以及圖案之緊 密的接觸性質為優良的。 (D)起始劑 該起始劑可以為一種光聚合化起始劑、一種自由基聚 合化起始劑，或其等之一組合。 該光聚合化起始劑可以為於一種光敏性樹脂組成物中 普遍使用的起始劑，舉例而言：苯乙酮為主的化合物、二 苯基_為主的化合物、嚷α山酮（thioxanthone)為主的化合 物、安息香（benzoin)為主的化合物、三β井為主的化合物， 及類似物。 該笨乙酮為主的化合物包括：2,2’-二乙氧基苯乙酮、 2,2 -二丁氧基苯乙銅、2-經基-2-曱基苯丙綱 (methylpropinophenone)、對-第三-丁基三氣苯乙酿I、對-第 三-丁基二氣苯乙酮、4-氣苯乙酮、2,2’-二氣-4-苯氧基苯乙 酮、2-曱基-1-(4-(甲硫基）苯基)-2-嗎福啉丙-1-酮、2-苯曱基 -2-二曱基胺基-1-(4-嗎福啉苯基)-丁-1-酮，及類似物。 該二苯基酮為主的化合物包括二苯基酮、苯甲醯基苯 甲酸酯、苯甲盤基苯曱酸曱酯（benzoyl methyl benzoate)、 4-苯基二苯基酮、羥基二苯基酮 '丙烯酸化二苯基酮 (acrylated benzophenone)、4,4’-雙（二甲基胺基）二苯基_、 4,4’-雙(二乙基胺基)二苯基酮、4,4’-二甲基胺基二苯基酮、 4,4’-二氯二苯基酮、3,3’-二曱基-2-曱氧基二苯基酮，及類 似物。 該嘍11山酮為主的化合物包括噻°山酮、2-甲基噻α山酮、 25 201215630 異丙基噻仙酮、2,4-二乙基噻。山酮、2,4_二異丙基嘴〇山酮、 2-氣°塞°山酮，及類似物。 該安息香為主的化合物包括安息香、安息香甲轉、安 息香乙醚、安息香異丙醚、安息香異丁醚、安息香二甲基 縮搭(benzyldimethylketal)，及類似物。 該三。井為主的化合物包括2,4,6-三氣-s-三畊、2-苯基 -4,6-雙(三氣曱基)-s-三讲、2-(3，，4，-二曱氧基笨乙烯基)46_ 雙（二氣曱基)-s-二啡、2-(4’-曱氧基萘基)_4,6·雙（三氣曱 基)-s-三畊、2-(對-甲氧基苯基)_4,6·雙（三氯甲基)s三讲、 2-(對-曱笨基)-4,6-雙(二氣甲基)_s_三啡、2_聯苯基4 6雙(三 氣曱基)-s-二。井、雙(二氣曱基)_6_苯乙烯基_s_三啡、2_(萘-丄_ 基)-4,6-雙（三氣甲基)-s_三畊、2_(4_甲氧基萘小基)4,6雙 (二氣甲基)-s-二畊' 2-4-三氣甲基（向曰葵基)_6三畊、2 4_ 二氣甲基(4’-甲氧基笨乙稀基)_6_三啡，及類似物。 該聚合化起始劑可以進一步包括叶唾為主的化合物、 二酮為主的化合物、硼酸銃為主的化合物、重氮為主的化 合物、雙咪嗤為主的化合物，及類似物。 该自由基聚合化起始劑可以包括一過氧化物為主之化 合物、一偶氮雙為主之化合物，及類似物。 該過氧化物為主之化合物之實例包括過氧化 酮，舉例 而言：過氧化甲乙酮、過氧化環己酮、過氧化曱基環己酮、 過氧化乙醯丙酮，及類似物；二醯基過氧化物，舉例而言： 過氧化異丁醯基、2,4-二氣苯甲醯過氧化物、鄰甲基苯甲醯 過氧化物、雙·3,5,5·三f基己醯基過氧化物，及類似物；氮 26 201215630 過乳化物，舉例而言 s工f基戊基_2_氫過氧化物、 一異基本氣過氧化物、氫過氧化異丙笨、三級丁氫過氧 化物及類似物’二烧基過氧化物，舉例而言：雙異苯丙 基過氧化物、2’5·:曱基_2,5·:(三級丁基氫過氧）己烧、U- 雙(二級丁氧基異丙基)苯、三級丁基氫過氧戍酸正丁醋，及 類似物；烧基過氧化酿，舉例而言：2,4,4_三曱基戊基過氧 苯氧乙酸@旨、α·異丙苯基過氧新癸酸S旨、三級丁基過氧苯 甲酸a曰一-二級丁基過氧三甲基己二酸酯，及類似物；過 碳酸醋，舉例而言：二_3_甲氧基丁基過氧二碳酸醋、二_2_ 乙基己基過氧二碳酸酯、雙_4_三級丁基環己基過氧二碳酸 酯、二異丙基過氧二碳酸酯、乙醯環己基磺醯基過氧化物、 三級丁基過氧化乙醯基碳酸酯，及類似物。 該偶氮雙為主之化合物之實例包括1，1，_偶氮雙環己烷 -1-甲腈、2,2’-偶氮雙(2,4-二曱基戊腈）、2,2-偶氮雙(2,4-曱 基異丁酸酯）、2,2·-偶氮雙(4-甲氧基-2,4-二甲基戊腈）、α，α·-偶氮雙（異丁腈)及、4,4·-偶氮雙(4-氰戊酸），及類似物。 因該起始劑吸收光且予以激化以及繼而傳遞能量，其 可與一光敏劑來使用以產生一化學反應。 該光敏劑之實例包括四甘醇雙-3-酼基丙酸酯、新戊四 醇肆-3-疏基丙酸酯、二新戊四醇肆-3-疏基丙酸酯，以及 類似物。 該起始劑可以以該光敏性樹脂組成物的總量為基準’ 以O.Olwt%至10wt%的一量被包括，以及特別地ο·1至5wt% 的一量被包括。當包括此範圍内的起始劑時’於圖案形成 27 201215630 製程期間在曝光時執行了充分的固化以獲得優良的可靠 性、抗熱性、耐光性，及耐化學性、解析度以及緊密的接 觸性質而不使透射率劣化，由於非反應性起始劑。 (E)溶劑 溶劑具有與該咔哚為主之樹脂、反應性不飽和化合 物、色素，以及起始劑之相容性，但是與之不具有一反應。 溶劑之實例可以包括醇，例如甲醇、乙醇，及類似物； 醚，例如：二氣乙醚、η- 丁醚、二異戊醚、甲基苯基醚、 四氫呋喃，及類似物；二醇醚，例如：乙二醇單甲醚、乙 二醇單乙醚，及類似物；乙酸賽璐蘇，例如：乙酸曱賽璐 蘇、乙酸乙赛璐蘇、乙酸二乙賽璐蘇，及類似物；卡必醇， 例如：曱基乙基卡必醇、二乙基卡必醇、二乙二醇單甲醚、 二乙二醇單乙醚、二乙二醇甲醚、二乙二醇曱乙醚、二乙 二醇乙醚等等；丙二醇烷基醚乙酸酯，例如：丙二醇甲醚 乙酸酯、丙二醇丙醚乙酸酯，及類似物；芳烴，例如甲苯、 二甲苯，及類似物；酮，例如：甲乙酮、環己酮、4-羥基-4-甲基-2-戊酮、曱基-η-丙酮、甲基-η-丁酮、曱基-η-戊酮、 2-庚酮，及類似物；飽和脂族單羧酸烷基酯，例如：乙酸 乙酯、η-丁基乙酸酯、異丁基乙酸酯，及類似物；乳酸酯， 例如：乳酸曱酯、乳酸乙酯，及類似物；烷基氧基乙酸酯， 例如：甲基氧基乙酸酯、乙基氧基乙酸酯、丁基氧基乙酸 醋，及類似物；烧基烧氧基乙酸醋，例如：甲氧基乙酸甲 酯、曱氧基乙酸乙酯、曱氧基乙酸丁酯、乙氧基乙酸曱酯、 乙氧基乙酸乙酯，及類似物；3-氧基丙酸烷基酯（3-oxy 28 201215630 propionate alkylesters)，例如3-氧基丙酸甲S旨、3-氧基丙酸 乙酉旨，及類似物；3-烧氧基丙酸烧基S旨，例如：3-曱氧基丙 酸曱酯、3-甲氧基丙酸乙酯、3-乙氧基丙酸乙酯、3-乙氧基 丙酸曱酯，及類似物；2-氧基丙酸烷基酯，例如：2-氧基丙 酸甲S旨、2-氧基丙酸乙醋、2-氧基丙酸丙基(2-oxy propionic acid propyl)，及類似物；2-烧氧基丙酸烧基酯，例如：2-甲氧基丙酸甲酯、2-曱氧基丙酸乙酯、2-乙氧基丙酸乙酯、 2-乙氧基丙酸甲酯，及類似物；2-氧基-2-甲基丙酸酯，例 如：2-氧基-2-甲基丙酸甲酯、2-氧基-2-甲基丙酸乙酯，及 類似物；2-烷氧基-2-曱基丙酸烷基的單氧基單羧酸烷基 酯，例如：2-甲氧基-2-曱基丙酸曱酯、2-乙氧基-2-甲基丙 酸乙酯，及類似物；酯，例如：2-羥基丙酸乙酯、2-羥基-2-曱基丙酸乙酯、羥基乙酸乙酯、2-羥基-3-曱基丁酸甲酯， 及類似物；酮醋（ketonate ester)系列，例如丙酮酸乙醋，及 類似物。此外，可以進一步添加下列高沸點的溶劑：N-曱 基曱醯胺、N、N-二曱基甲醯胺、N-甲基甲醯胺、N-甲基 乙醯胺、N、N-二曱基乙醯胺、N-甲基吡咯烷酮、二甲亞 砜、苄基乙基醚、二己基醚、乙醯丙酮、異佛酮、己酸、 辛酸、1-辛醇、1-壬醇、苯甲醇、乙酸苯曱酯、苯甲酸乙酯、 草酸二乙酯、馬來酸二乙酯、γ-丁内酯、碳酸乙烯酯、碳 酸丙烯酯、苯基乙酸賽璐蘇，及類似物。 考慮到相容性以及反應性，二醇醚，例如乙二醇單乙 醚，及類似物；乙二醇烷基醚乙酸酯，例如乙酸乙賽璐蘇， 及類似物；酯，例如2-羥基丙酸乙酯，及類似物；卡必醇， 29 201215630 例如一乙二醇單甲醚，及類似物；丙二醇烷基醚乙酸酯， 0.内二醇曱醚乙酸酯、丙二醇丙醚乙酸酯，以及類似物。 …劑係使用為一差額’以及特別地2〇至95 wt%以該光 敏性樹脂組成物的總量為基準。包括此範圍内的溶劑時， 該光敏性樹脂組成物可具有適當的黏度導致一光阻隔層的 可加工性之改善。 (F)其他添加劑 该光敏性樹脂組成物可以進一步包括一環氧化合物俾 以改善與一基材之之緊密的接觸性質。 該環氧化合物之實例包括酚醛環氧化合物、四甲基聯 苯環氧化合物、雙酚A環氧化合物、脂環環氧化合物，或其 等之一組合。 該環氧化合物可以以該光敏性樹脂組成物的100份重 量計為基準’以〇·〇1至5份以重量計的一量被包括，以及特 別地0.1至5份以重量計的一量被包括。當包括以上範圍内 的環氧化合物時，緊密的接觸性質、抗熱性，以及耐化學 性可以被改善。 該光敏性樹脂組成物可以進一步包括具有一反應性取 代基，例如羧基' 曱基丙烯醯基、異氰酸酯基、環氧基， 及類似物的矽烷偶合劑俾以改善對一基材之附著。 矽烷偶合劑之實例包括三甲氧矽烷基苯甲酸、γ-曱基 丙烯酸氧丙基三曱氧基矽烷、乙烯基三乙醯氧基矽烷、乙 烯基三曱氧基矽烷、Τ -異氰酸丙基三乙氧基矽烷、γ-縮水 甘油醚氧丙基三甲氧基矽烷、β-(3,4-乙氧環己基）乙基三甲 30 201215630 氧基矽烷，及類似物。其等可以單一地或是如二個或更多 個之混合物來使用。 該矽烷偶合劑可以以該光敏性樹脂組成物的100份重 量計為基準，以0.01至10份以重量計的一量被包括。當包 括以上範圍内的矽烷偶合劑時，緊密的接觸性質、儲存性 質，及類似物係改善的。 該光敏性樹脂組成物可以進一步包括一界面活性劑俾 以改善塗覆性質且抑制斑點。 該界面活性劑之實例可以包括一氟為主的界面活性 劑，舉例而言，BM-1000®，及BM-1100® (BM Chemie Inc_); MEGAFACE F 142D®、F 172®、F 173®，與 F 183® DAINIPPON INK KAGAKU KOGYO CO.，LTD.)； FULORAD FC-135®、FULORAD FC-170C®、FULORAD FC-430®，與FULORAD FC-431® (SUMITOMO 3M CO.， LTD.) ; SURFLON S-112®、SURFLON S-113®、SURFLON S-131®、SURFLON S-141®，與 SURFLON S-145® (ASAHI GLASS CO.，LTD·);及 SH-28PA®、SH-190®、SH-193®、 SZ-6032®，與SF-8428®，及類似物(TORAY SILICONE CO·， LTD.)。 該界面活性劑可以以該光敏性樹脂組成物的10 0份重 量計為基準，以0.001至5份以重量計的一量被包括❶當包 括此範圍内的界面活性劑時，可以確保塗覆均勻性，不會 產生污斑，以及一玻璃基材之潤濕性質係改善的。 該光敏性樹脂組成物可以進一步其他添加劑，舉例而 31 201215630 言，一抗氧化劑、一安定劑，及類似物以預定量，當其等 降低性質時。 依據另一個具體例，提供了使用該光敏性樹脂組成物 來製造的一光阻隔層。該光阻隔層可以製造如下。 (1) 應用及膜形成 前述的光敏性樹脂組成物係使用一旋轉塗覆法或狹縫 塗覆法、滾軸塗覆法、網板印刷法、施用器法，及類似物 而塗覆以具有一所欲的厚度，舉例而言，範圍由0.5至25μηι 的厚度，於進行一預定的預處理之一基材上。繼而，該經 塗覆的基材係於範圍由70至110°C的溫度下加熱歷時1至10 分鐘以移除一溶劑。 (2) 曝光 產生的膜係在放置具一預定的形狀的遮罩之後藉由 190至500 nm的活性射線來照射以形成一所欲的圖案。輻射 係藉由使用一光源予以執行，例如具低壓、高壓，或是超 高壓的一水銀燈，一金屬齒化物燈，一氬氣雷射，及類似 物。然而，其可以使用一X射線、一電子束，及類似物，取 決於狀況。 當使用一高壓水銀燈時，曝光製程使用，舉例而言， 500 mJ/cm2或更少的（具365 nm感測器）光劑量。然而，光劑 量可以取決於該光敏性樹脂組成物的各組份之種類、其之 組合比例，以及一乾燥膜厚度而變化。 (3) 顯影 在曝光製程之後，使用一鹼性水溶液以顯影曝光膜， 32 201215630 其係藉由溶解且移除除了曝光部分外之不必要的部分，形 成一影像圖案。 δ亥顯影溶液可以為—有機溶劑型與—驗性顯影型。有 機溶劑型溶液可料成環境的污染以及對人體作出傷害。 因而’以環境而論驗性顯影型溶液可以為較佳的。依據一 具體例，—㈣水溶液錢用作為彡雜，其係環境 ^善的。鹼性水溶液中和存在於…卡料主之樹脂内之叛 酸以及因而’溶解該料為主之樹脂。 (4)後處理 經顯影的影像圖案可以再次加熱或藉由一活性射線及 類似物予以照㈣㈣化，俾以完成優良的品f，以抗熱 性、光阪性、緊密的接觸性質、耐裂性、耐化學性、高強 度、儲存安定性，及類似物而論。 因而，刚述的光敏性樹脂組成物可以帶來一光阻隔層 所需要的優良的絕緣與光學密度。 在下文中’本發明係更詳盡地參照實施例予以闡釋。 然而，此等為本發明的例示性具體例以及為非限制性的。 製備實施例1 :咔哚為主之樹脂的製備 (1)將29.8g的季戊四醇三丙烯酸酯（Sigma-Aldrich Co.) 及35.43g的丙二醇甲乙醋酸g旨（Daicel Chemical Industries Ltd.)放至一反應器内以及加熱升高至5〇°C。接而，將6.8g 的乙氧鈉（Sigma-Aldrich Co.)以小量添加至該處，以及將 9.3g的表氣醇(epichlorohydrine) (Sigma-Aldrich Co.)添加至 該處歷時30分鐘。將混合物加熱升高至80°C，以及維持在 33 201215630 相同的溫度下歷時3小時以及接而，予以過濾以合成由下列 化學式6-1表示的一化合物。 [化學式6-1]17 201215630 Examples of the ruthenium-based resin may include two or more of the following: a fluorine-containing compound such as 9,9'-bis(4-epoxyethyl decyloxyphenyl) fluoride, and the like An anhydride compound, for example, pyromellitic dianhydride, naphthalene tetracarboxylic dianhydride, biphenyltetracarboxylic dianhydride, benzophenone tetracarboxylic dianhydride, pyromellitic dianhydride, cyclotetracarboxylic dianhydride, Terpene tetracarboxylic acid dianhydride, tetrahydrofuran tetracarboxylic acid dianhydride, tetrahydrophthacid anhydride, and the like; glycol compounds, such as ethylene glycol (ethyleneglycol), propylene glycol, polyethylene glycol Alcohols, and the like; alcohol compounds, such as: methanol, ethanol, propanol, n-butanol, cyclohexanol, benzofuranol, and the like; a solvent compound such as propylene glycol methyl acetate, N-methylpyrrole a ketone, and the like; a phosphorus compound such as triphenylphosphine, and the like; a monoamine or ammonium compound, gasified tetraammonium ammonium, tetraethylammonium bromide, benzyldiethylamine 'triethylamine, three Butylamine 'benzyltriethylammonium hydride, and the like. The resin of the ° card type may have a weight average molecular weight of from 〇〇〇 to 50,000 g/mol, particularly a weight average molecular weight of 2,000 to 50,000 g/mol, and more particularly 2 to 2 The weight average molecular weight of 〇〇〇〇8/111〇1. § The resin of the ° card-based wood has a weight average molecular weight within this range - during the manufacture of the photoresist layer, the pattern is formed without residue, and there is no loss during development - film thickness, resulting in - Good pattern. 5 Hai " card. The wood-based resin may be included in the range of 1 to 30 (four), and particularly 2 to 20 wt%, based on the total weight of the photosensitive resin composition, including the range of the ° card in this range. Excellent sensitivity to the resin! Raw, developable, heat resistant, luminescent, and tight contact properties can be achieved. 18 201215630 The photosensitive resin composition may further comprise an acrylic-based resin in addition to the bismuth-based resin. The acryl-based resin is a copolymer of a first ethylenically unsaturated monomer and a second ethylenically unsaturated monomer copolymerizable with the first ethylenically unsaturated monomer, and includes a resin of at least one acryl-based repeating unit. The first ethylenically unsaturated monomer is comprised of at least one thiol-ethylenically unsaturated monomer. Examples of the monomer include acrylic acid, mercaptoacrylic acid, maleic acid, itaconic acid, fumaric acid, or a combination thereof. The first ethylenically unsaturated monomer may be included in an amount ranging from 5 to 50% by weight, and particularly from 10 to 40% by weight, based on the total amount of the acryl-based resin. Examples of the second ethylenically unsaturated monomer may include: an aromatic vinyl compound such as styrene, (X-methylstyrene, ethylene toluene, ethylidenemethyl bond, and the like, Unsaturated acid vinegar compound, for example: methyl methacrylate, ethyl methacrylate, decyl propyl citrate, butyl methacrylate, 2-hydroxyethyl methacrylate, thiol acrylate 2 - hydroxybutyl ester, benzyl methacrylate, cyclohexyl methacrylate, phenyl methacrylate, and the like; an aminoalkyl ester of an unsaturated carboxylic acid, for example: 2-aminoethyl methacrylate , 2-didecylaminoethyl methacrylate, and the like; a tetrabasic acid ester compound, for example: ethyl acetate vinegar, vinyl benzoate, and the like; unsaturated carboxylic acid glycidyl ester Compounds such as glycidyl methacrylate, and the like; vinyl cyanide compounds such as methacrylonitrile and the like; unsaturated guanamine compounds, Examples 19 201215630 such as methacrylamide and the like; Matter Or used as a mixture of more than two. Examples of the acryl-based resin may include methacrylic acid/benzyl methacrylate copolymer, methacrylic acid/benzyl methacrylate/ Styrene copolymer, methacrylic acid/methacrylic acid ester/mercaptoacrylic acid 2-carbyl ethyl ester copolymer, mercaptoacrylic acid/benzyl methacrylate/styrene/methacrylic acid 2- Hydroxyethyl ester copolymers, and the like, but not limited to them. They may be used singly or as a mixture of two or more. The acryl-based resin may have a range of from 3,000 to 150,000. The weight average molecular weight of g/mo, particularly 3, 〇〇〇 to 40,000 g/mol, and more particularly 5,000 to 30,000 g/m 。 1. When the acryl-based resin has a weight in this range In the average molecular weight, the photosensitive resin composition has good physical properties and chemical properties, a suitable viscosity, and a close contact property with a substrate when applied to a light barrier layer. The main resin can have a range from 30 to 200 mgK〇H/g The price, and especially the acid value of 50 to 180 mgKOH/g. When the acrylic-based resin has an acid value in this range, excellent pixel resolution can be achieved. When the main resin is included in the photosensitive resin composition, 'the bismuth-based resin and the acryl-based resin may be present in a weight ratio of 99.1 to 199' and particularly 95: 5 to 50:50 'when the β-card β-based resin and the acryl-based tree are mainly included in the weight ratio of 5 hai, the excellent development properties and sensitivity are observed. And a light-blocking layer having excellent pattern forming ability can be obtained as shown in Fig. 20 201215630 to suppress the generation of undercuts. (B) Reactive unsaturated compound The reactive unsaturated compound can be generally used in a photosensitive resin composition. Monomer or oligomer used. It may be a monofunctional or polyfunctional methacrylate comprising at least one ethylenically unsaturated double bond. The reactive unsaturated compound causes sufficient photopolymerization during the pattern forming process due to the ethylenically unsaturated double bond to form an excellent heat resistance, a light-rich property, and a chemically-chemical pattern. Examples of the reactive unsaturated compound may include ethylene glycol diacrylate, ethylene glycol dimercapto acrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, and triethylene glycol dimethyl Acrylate, hydrazine, 6-hexanediol diacrylate, 1,6-hexanediol dimethacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate Ester, bisphenol A epoxy acrylate, ethylene glycol oxime ether acrylate, trimethylolpropane triacrylate, tripropylene decyl oxyethyl phosphate, and the like. Commercially available examples of such reactive unsaturated compounds are listed below. Monofunctional methacrylates may include Aronix M-101®, M-lll®, M-114® (TOAGOSEI CHEMICAL INDUSTRY CO., LTD.); KAYARAD TC-110S®, TC-120S® (NIPPON KAYAKU CO.). >LTD.); V-158® 'V-2311 ® (OSAKA ORGANIC CHEMICAL IND., LTD.), and the like. Examples of the bifunctional mercapto acrylate may include Aronix M-210®, M-240®, M-6200® (TOAGOSEI CHEMICAL INDUSTRY CO., LTD.), 21 201215630 KAYARAD HDDA®, HX-220®, R-604® (NIPPON KAYAKU CO., LTD.), V-260®, V-312®, V-335 HP® (OSAKA ORGANIC CHEMICAL IND., LTD.), and the like. Examples of trifunctional methacrylates may include Aronix M-309®, M-400®, M-405®, M-450®, M-7100®, M-8030®, M-8060® (TOAGOSEI CHEMICAL INDUSTRY) CO. ' LTD.), KAYARAD TMPTA®, DPCA-20®, DPCA-30®, DPCA-60®, DPCA-120® (NIPPON KAYAKU CO., LTD.), V-295®, V-300®, V-360®, V-GPT®, V-3PA®, V-400® (Osaka Yuki Kayaku Kogyo Co. Ltd.), and the like. The reactive unsaturated compound may be used singly or as a mixture of two or more. The reactive unsaturated compound can be treated with an acid anhydride to improve the development properties. The reactive unsaturated compound may be included in an amount ranging from 1 to 30 wt%, and particularly from 1 to 15 wt%, based on the total amount of the photosensitive resin composition. When a reactive unsaturated compound in this range is included, curing is sufficiently performed during the patterning process at the time of exposure, and reliability, heat resistance, light resistance, and chemical resistance, resolution, and pattern closeness can be achieved. The nature of the contact. (C) Pigment The pigment may be an organic pigment or an inorganic pigment. The pigment may include a red pigment, a green pigment, a blue pigment, a yellow pigment, a black pigment, and the like. Examples of the red pigment include C.I. Red Pigment 254, C.I. Red Pigment 22 201215630 255 C.I. Red Pigment 264, C.I. Red Pigment 27〇, c•• Red Pigment 272, C.I. Red Pigment 177, C.I. Red Pigment 89, and the like. Examples of green pigments include prime substituted copper indocyanin, such as: C I•green pigment 36, CJ-green pigment 7, and the like. Examples of the blue pigment include a copper chloroblue pigment, for example: C·!·blue pigment 15:6, c′′ blue pigment 15, c丄blue pigment 15: Bu CL blue pigment 15:2, c 1 Blue pigment 15:3, c丄 blue pigment 15:4, CL blue pigment 15:5, cα blue color buckle, and the like. Examples of yellow pigments include a difference. The porphyrin pigment, for example, cj yellow pigment 139 'and the like, a yellow pigment, such as ci yellow pigment (10), and the analog '-nickel complex pigment' such as C yellow pigment (9), and the like. Examples of the black pigment include aniline black, flower black (ρ_· this (8), titanium black, carbon black, and the like. The pigment may be used singly or as a mixture of one or more, and is not limited to the above The pigments described therein may be included in the light barrier of the light-blocking layer in order to be effectively performed. When a black pigment is used, a color correcting agent such as a sputum-based pigment or flower may also be used. The main color t, the phthalocyanine-based pigment, the azo-based pigment, and the like. The photosensitive resin composition may further include a dispersing agent to improve the dispersion of the pigment. A dispersant for surface pretreatment or a pigment and a dispersant may be added together during the preparation of the photosensitive resin composition. The dispersant may include a nonionic dispersant, an anionic dispersant, a cationic dispersant, and the like. Examples of the dispersing agent include poly sia 23 201215630 aryl diol and its purpose, polyphosphoric acid (p〇ly〇Xyalkylene), polyhydric alcohol ester alkylene oxide adduct product Alcohol alkylene oxide addition products, sulfonate esters, sulfonates, carboxylates, carboxylates, alkylguanamine alkylene oxide adducts, alkylamines, and the like 'but not limited to The dispersing agent may be used singly or as a mixture of two or more. Commercially available examples of the dispersing agent are as follows: DISPERBYK-101, DISPERBYK-130, DISPERBYK-140, DISPERBYK-160, DISPERBYK-161, DISPERBYK-162, DISPERBYK-163, DISPERBYK-164, DISPERBYK-165, DISPERBYK-166, DISPERBYK-170, DISPERBYK-171, DISPERBYK-182, DISPERBYK-2000, DISPERBYK-2001, and the like (BYK) EFKA-47, EFKA-47EA, EFKA-48, EFKA-49, EFKA-100, EFKA-400, EFKA-450, and the like (EFKA chemicals); Solsperse 5000, Solsperse 12000, Solsperse 13240, Solsperse 13940, Solsperse 17000, Solsperse 20000, Solsperse 24000GR, Solsperse 27000, Solsperse 28000, and the like (Zeneka); or PB7U, PB821, and the like (Ajinomoto). The dispersant can be based on the total amount of the photosensitive resin composition. , from 0.01 to 10 A quantity of wt% is included. When the dispersant in the above range is included, the dispersion of the photosensitive resin composition is improved to cause excellent stability, developing properties, and patterning properties during the manufacture of a photoresist layer. The pigment may be included in an amount of 1 to 30% by weight, and particularly 2 to 20% by weight based on the total amount of the photosensitive resin composition. When the pigments in the range of 2012 20121530 are included, the color reproducibility, the curing ability', and the tight contact properties of the pattern are excellent. (D) Starting agent The initiator may be a photopolymerization initiator, a radical polymerization initiator, or a combination thereof. The photopolymerization initiator may be an initiator commonly used in a photosensitive resin composition, for example, an acetophenone-based compound, a diphenyl-based compound, and anthra-xanthone ( Thioxanthone)-based compounds, benzoin-based compounds, tri-beta-based compounds, and the like. The acetophenone-based compound includes: 2,2'-diethoxyacetophenone, 2,2-dibutoxyphenethyl copper, 2-methyl-2-mercaptophenylene (methylpropinophenone) , p-tert-butyl tri-gas benzene, I, p-tert-butyl diacetophenone, 4-acetophenone, 2,2'-digas-4-phenoxybenzene Ketone, 2-mercapto-1-(4-(methylthio)phenyl)-2-morpholinepropan-1-one, 2-phenylhydrazino-2-didecylamino-1-(4) - morpholine phenyl)-butan-1-one, and the like. The diphenyl ketone-based compound includes diphenyl ketone, benzamidine benzoate, benzoyl methyl benzoate, 4-phenyldiphenyl ketone, and hydroxy group II. Phenyl ketone 'acrylated benzophenone, 4,4'-bis(dimethylamino)diphenyl-, 4,4'-bis(diethylamino)diphenyl ketone , 4,4'-dimethylaminodiphenyl ketone, 4,4'-dichlorodiphenyl ketone, 3,3'-dimercapto-2-indolyl diphenyl ketone, and the like . The guanidene 11-based compound includes thioxanthone, 2-methylthia-alpha ketone, 25 201215630 isopropyl thiazinone, and 2,4-diethyl thiophene. Ketone, 2,4-diisopropyl guanyl ketone, 2-gas ketone, and the like. The benzoin-based compounds include benzoin, benzoin, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzodimethylketal, and the like. The three. Well-based compounds include 2,4,6-tri-gas-s-three-plow, 2-phenyl-4,6-bis (tris-methyl)-s-three, 2-(3,,4, -dimethoxyoxy stupid vinyl) 46_ bis(dioxamethyl)-s-dimorphine, 2-(4'-nonyloxynaphthyl)_4,6·bis(triseodecyl)-s-three Tillage, 2-(p-methoxyphenyl)_4,6·bis(trichloromethyl)s, three-speaking, 2-(p-stupyl)-4,6-bis(dimethyl)_s _ trimorphine, 2_biphenyl 4 6 bis(triseodecyl)-s-di. Well, double (diqi fluorenyl) _6_styryl _s_trimorphine, 2_(naphthalene-indole yl)-4,6-bis (trismethyl)-s_three tillage, 2_(4_ Methoxynaphthalene small base) 4,6 bis(dimethylmethyl)-s-two plowing ' 2-4-trimethylmethyl (to geranium base) _6 three tillage, 2 4 _ two gas methyl (4' - methoxyethylidene)_6_trimorphine, and the like. The polymerization initiator may further include a leaf saliva-based compound, a diketone-based compound, a barium borate-based compound, a diazo-based compound, a dipyridyl-based compound, and the like. The radical polymerization initiator may include a peroxide-based compound, an azobis-based compound, and the like. Examples of the peroxide-based compound include ketone peroxides, for example, methyl ethyl ketone peroxide, cyclohexanone peroxide, decyl cyclohexanone peroxide, acetam peroxide, and the like; Peroxides, for example: isobutyl sulfoxide, 2,4-dibenzophenone peroxide, o-methyl benzamidine peroxide, bis 3,5,5·trifyl hexyl decyl Peroxides, and the like; nitrogen 26 201215630 over-emulsified, for example, s-f-pentyl-2-d hydroperoxide, a different basic gas peroxide, hydrogen peroxide isopropyl stupid, tertiary butyl Hydroperoxides and the like 'dialkyl peroxides, for example: bisisophenylpropyl peroxide, 2'5·: fluorenyl 2,5·: (tertiary butyl hydroperoxide) Benzene, U-bis(2-butoxypropyl)benzene, tert-butyl butyl hydroperoxy ruthenium citrate, and the like; calcined peroxidation, for example: 2, 4, 4 _Tridecylpentyl peroxyphenoxyacetic acid @, α·cumyl peroxy neodecanoic acid S, tertiary butyl peroxybenzoic acid a 曰-secondary butyl peroxytrimethyl Diester, and the like; percarbonate For example: bis-3-methoxybutyl peroxydicarbonate, di-2-ethylhexyl peroxydicarbonate, bis-4_tert-butylcyclohexylperoxydicarbonate, diisopropyl Base peroxydicarbonate, acetamidine cyclohexylsulfonyl peroxide, tertiary butyl peroxyethylene carbonate, and the like. Examples of the azobis-based compound include 1,1,-azobiscyclohexane-1-carbonitrile, 2,2'-azobis(2,4-dimercaptophthalonitrile), 2,2 - azobis(2,4-mercaptoisobutyrate), 2,2·-azobis(4-methoxy-2,4-dimethylvaleronitrile), α,α·-azo Bis(isobutyronitrile) and 4,4·-azobis(4-cyanovaleric acid), and the like. Since the initiator absorbs light and intensifies and then transfers energy, it can be used with a photosensitizer to produce a chemical reaction. Examples of the photosensitizer include tetraethylene glycol bis-3-mercaptopropionate, neopentyl decyl-3-pyridyl propionate, dipentaerythritol decyl-3-pyridyl propionate, and the like. Things. The initiator may be included in an amount of from 0.01% by weight to 10% by weight based on the total amount of the photosensitive resin composition, and particularly an amount of from ο1 to 5% by weight. When including the initiator in this range, sufficient curing is performed during exposure during patterning 27 201215630 to achieve excellent reliability, heat resistance, light resistance, chemical resistance, resolution, and close contact. Properties do not degrade the transmittance due to the non-reactive starter. (E) Solvent The solvent has compatibility with the bismuth-based resin, reactive unsaturated compound, pigment, and initiator, but does not have a reaction therewith. Examples of the solvent may include alcohols such as methanol, ethanol, and the like; ethers such as dioxyl ether, η-butyl ether, diisoamyl ether, methylphenyl ether, tetrahydrofuran, and the like; glycol ethers, For example: ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, and the like; acetaminophen acetate, for example: acesulfame acetate, acesulfame acetate, acesulfame acetate, and the like; Alcohol, for example: mercaptoethyl carbitol, diethyl carbitol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol methyl ether, diethylene glycol oxime ether, two Ethylene glycol ether or the like; propylene glycol alkyl ether acetate, for example: propylene glycol methyl ether acetate, propylene glycol propyl ether acetate, and the like; aromatic hydrocarbons such as toluene, xylene, and the like; ketones, for example : methyl ethyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone, decyl-η-acetone, methyl-η-butanone, decyl-η-pentanone, 2-heptanone, and Analogs; saturated aliphatic monocarboxylic acid alkyl esters such as ethyl acetate, η-butyl acetate, isobutyl acetate, and the like; lactate, Such as: decyl lactate, ethyl lactate, and the like; alkyloxy acetate, such as: methyloxy acetate, ethyloxy acetate, butyloxyacetic acid vinegar, and the like a calcined oxyacetic acid vinegar, for example: methyl methoxyacetate, ethyl decyloxyacetate, butyl oxyacetate, decyl ethoxyacetate, ethyl ethoxyacetate, and the like; 3-oxy 28 201215630 propionate alkylesters, for example, 3-oxypropionic acid, S, 3-oxypropionate, and the like; 3-alkoxypropionic acid The base is, for example, 3-decyloxypropionate, ethyl 3-methoxypropionate, ethyl 3-ethoxypropionate, decyl 3-ethoxypropionate, and the like ; 2-oxy propionic acid propyl, and 2-oxy propionic acid propyl, and 2-oxy propionic acid propyl, and 2-oxy propionic acid propyl, and Analog; 2-alkoxypropionate, for example: methyl 2-methoxypropionate, ethyl 2-methoxypropionate, ethyl 2-ethoxypropionate, 2-ethoxy Methyl propyl propionate, and the like; 2-oxy-2-methylpropionate, for example: 2- Methyl 2-methylpropionate, ethyl 2-oxy-2-methylpropanoate, and the like; monooxymonocarboxylic acid of 2-alkoxy-2-mercaptopropionic acid alkyl Alkyl esters, for example: decyl 2-methoxy-2-mercaptopropionate, ethyl 2-ethoxy-2-methylpropionate, and the like; esters, for example: 2-hydroxypropionic acid Ester, ethyl 2-hydroxy-2-mercaptopropionate, ethyl hydroxyacetate, methyl 2-hydroxy-3-mercaptobutyrate, and the like; ketonate ester series, such as ethyl acetonate , and the like. Further, the following high boiling point solvent may be further added: N-mercaptodecylamine, N,N-dimercaptocarbamide, N-methylformamide, N-methylacetamide, N, N- Dimercaptoacetamide, N-methylpyrrolidone, dimethyl sulfoxide, benzyl ethyl ether, dihexyl ether, acetamidine, isophorone, caproic acid, octanoic acid, 1-octanol, 1-nonanol , benzyl alcohol, phenyl decyl acetate, ethyl benzoate, diethyl oxalate, diethyl maleate, γ-butyrolactone, ethylene carbonate, propylene carbonate, cyanoacetate, and the like . In view of compatibility and reactivity, glycol ethers such as ethylene glycol monoethyl ether, and the like; ethylene glycol alkyl ether acetates such as ethyl acesulfame acetate, and the like; esters such as 2- Ethyl hydroxypropionate, and the like; carbitol, 29 201215630, for example, monoethylene glycol monomethyl ether, and the like; propylene glycol alkyl ether acetate, 0. diol oxime ether acetate, propylene glycol Ether acetate, and the like. The agent is used as a difference 'and particularly 2 to 95% by weight based on the total amount of the photosensitive resin composition. When a solvent in this range is included, the photosensitive resin composition may have an appropriate viscosity to cause an improvement in workability of a light barrier layer. (F) Other Additives The photosensitive resin composition may further comprise an epoxy compound 俾 to improve the close contact property with a substrate. Examples of the epoxy compound include a novolac epoxy compound, a tetramethylbiphenyl epoxy compound, a bisphenol A epoxy compound, an alicyclic epoxy compound, or a combination thereof. The epoxy compound may be included in an amount of from 1 to 5 parts by weight, based on 100 parts by weight of the photosensitive resin composition, and particularly 0.1 to 5 parts by weight. is included. When the epoxy compound in the above range is included, tight contact properties, heat resistance, and chemical resistance can be improved. The photosensitive resin composition may further comprise a decane coupling agent having a reactive substituent such as a carboxy 'mercaptopropenyl group, an isocyanate group, an epoxy group, and the like to improve adhesion to a substrate. Examples of the decane coupling agent include trimethoxy sulfonyl benzoic acid, γ-mercapto oxypropyltrimethoxy decane, vinyl triethoxy decane, vinyl trimethoxy decane, Τ-isocyanate Triethoxy decane, γ-glycidyloxypropyl trimethoxy decane, β-(3,4-ethoxycyclohexyl)ethyltrimethyl 30 201215630 oxoxane, and the like. They may be used singly or as a mixture of two or more. The decane coupling agent may be included in an amount of 0.01 to 10 parts by weight based on 100 parts by weight of the photosensitive resin composition. When the decane coupling agent in the above range is included, the close contact properties, storage properties, and the like are improved. The photosensitive resin composition may further include a surfactant 俾 to improve coating properties and suppress spots. Examples of the surfactant may include a fluorine-based surfactant, for example, BM-1000®, and BM-1100® (BM Chemie Inc_); MEGAFACE F 142D®, F 172®, F 173®, With F 183® DAINIPPON INK KAGAKU KOGYO CO.,LTD.); FULORAD FC-135®, FULORAD FC-170C®, FULORAD FC-430®, and FULORAD FC-431® (SUMITOMO 3M CO., LTD.); SURFLON S-112®, SURFLON S-113®, SURFLON S-131®, SURFLON S-141®, and SURFLON S-145® (ASAHI GLASS CO., LTD.); and SH-28PA®, SH-190®, SH-193®, SZ-6032®, and SF-8428®, and the like (TORAY SILICONE CO·, LTD.). The surfactant may be used in an amount of 0.001 to 5 parts by weight based on 100 parts by weight of the photosensitive resin composition, and when the surfactant is included in the range, the coating may be ensured. Uniformity, no staining, and improved wetting properties of a glass substrate. The photosensitive resin composition may further contain other additives, for example, 31 201215630, an antioxidant, a stabilizer, and the like in a predetermined amount, when they lower the properties. According to another specific example, a light-blocking layer produced using the photosensitive resin composition is provided. The light blocking layer can be manufactured as follows. (1) Application and film formation The photosensitive resin composition described above is coated by a spin coating method or a slit coating method, a roll coating method, a screen printing method, an applicator method, and the like. It has a desired thickness, for example, ranging from 0.5 to 25 μm, for performing a predetermined pretreatment on one of the substrates. Then, the coated substrate is heated at a temperature ranging from 70 to 110 ° C for 1 to 10 minutes to remove a solvent. (2) Exposure The resulting film is irradiated with active rays of 190 to 500 nm after placing a mask having a predetermined shape to form a desired pattern. The radiation is performed by using a light source such as a mercury lamp having a low pressure, a high pressure, or an ultrahigh pressure, a metal toothed lamp, an argon laser, and the like. However, it is possible to use an X-ray, an electron beam, and the like, depending on the situation. When a high pressure mercury lamp is used, the exposure process uses, for example, a light dose of 500 mJ/cm2 or less (with a 365 nm sensor). However, the amount of the photosensing agent may vary depending on the kind of each component of the photosensitive resin composition, the combination ratio thereof, and the thickness of a dry film. (3) Development After the exposure process, an alkaline aqueous solution was used to develop the exposed film, and 32 201215630 formed an image pattern by dissolving and removing unnecessary portions other than the exposed portion. The δ hai development solution may be an organic solvent type and an experimental development type. Organic solvent-based solutions can be used to contaminate the environment and cause harm to the human body. Therefore, it is preferable to use an environmentally-developable development type solution. According to a specific example, - (4) aqueous solution money is used as noisy, and its environment is good. The alkaline aqueous solution neutralizes the tarenic acid present in the resin of the main binder and thus the resin which is mainly dissolved. (4) The post-processed image pattern can be heated again or by an active ray and the like (4) (4), to complete the excellent product f, to resist heat, light, tight contact properties, crack resistance , chemical resistance, high strength, storage stability, and the like. Therefore, the photosensitive resin composition just described can bring about an excellent insulating and optical density required for a light-blocking layer. In the following, the invention is explained in more detail with reference to the examples. However, these are exemplary embodiments of the invention and are non-limiting. Preparation Example 1: Preparation of ruthenium-based resin (1) 29.8 g of pentaerythritol triacrylate (Sigma-Aldrich Co.) and 35.43 g of propylene glycol methylacetate g (Daicel Chemical Industries Ltd.) were placed in one The inside of the reactor and the heating were raised to 5 °C. Next, 6.8 g of sodium ethoxide (Sigma-Aldrich Co.) was added thereto in small amounts, and 9.3 g of epichlorohydrine (Sigma-Aldrich Co.) was added thereto for 30 minutes. . The mixture was heated to 80 ° C and maintained at the same temperature of 33 201215630 for 3 hours and, in turn, filtered to synthesize a compound represented by the following Chemical Formula 6-1. [Chemical Formula 6-1]

〇 (2)將35g的9,9’-雙(4-羥苯基）氟(HearchemCo.，Ltd.)、 141.6g的由以上的化學式5-1表示的化合物、0.23g的苄基三 乙基氣化敍（Daejung Chemicals & Metals Co.，Ltd.)，以及 0.23g的三苯膦（Sigma-Aldrich Co.)放至一反應器内以及接 而，加熱升高至90°C以及維持在相同的溫度下歷時12小時 以合成由下列化學式6-2表示的一化合物。 [化學式6-2]〇(2) 35 g of 9,9'-bis(4-hydroxyphenyl)fluoro (Hearchem Co., Ltd.), 141.6 g of the compound represented by the above Chemical Formula 5-1, and 0.23 g of benzyltriethyl Daejung Chemicals & Metals Co., Ltd., and 0.23 g of triphenylphosphine (Sigma-Aldrich Co.) were placed in a reactor and connected, and the heating was raised to 90 ° C and maintained. A compound represented by the following Chemical Formula 6-2 was synthesized at the same temperature for 12 hours. [Chemical Formula 6-2]

(3)將30g的由以上的化學式6-2表示的化合物、2.1g的 34 201215630 聯苯四甲酸二Sf (Mitsubishi Gas Chemical Co·，Ltd.)，以及 l.lg 的四氫鄰苯二曱針（tetrahydrophth anhydride) (Sigma-Aldrich Co.)放至一反應器内。將混合物加熱升高至 12 0。〇以及維持在相同的溫度下歷時2小時以合成由下列化 學式6-3表示的一化合物(5,400 g/mol的重量平均分子量）。 [化學式6-3](3) 30 g of the compound represented by the above Chemical Formula 6-2, 2.1 g of 34 201215630 biphenyltetracarboxylic acid di Sf (Mitsubishi Gas Chemical Co., Ltd.), and 1.lg of tetrahydrophthalic acid Tetrahydrophth anhydride (Sigma-Aldrich Co.) was placed in a reactor. The mixture was heated to rise to 120. The hydrazine was maintained at the same temperature for 2 hours to synthesize a compound represented by the following Chemical Formula 6-3 (weight average molecular weight of 5,400 g/mol). [Chemical Formula 6-3]

製備實施例2 :紅色色素分散的製備 將 15g 的 C.I·紅色色素 254(Ciba-Geigy Ltd.)、4g 的 DISPERBYK-163 (BYK Additives & Instruments)、3g的丙稀 酸/曱基丙稀酸苄S旨共聚物(Miwon Commercial Co，Ltd.， NPR8000)，以及78g的丙二醇甲乙醋酸酯於一反應器内混 合。混合物係藉由使用一塗料搖動器（Asada Iron Works Co.， Ltd.)予以分散歷時12小時，來製備一紅色色素分散溶液。 製備實施例3 :黑色色素分散的製備 將 15g的碳黑（Cabot Co.)、4g的 DISPERBYK-163 (BYK Additives & Instruments)、3g的丙稀酸/甲基丙嫦酸苄酯共聚 物（NPR8000，Miwon Commercial Co，Ltd.)，以及78g的丙 二醇甲乙醋酸酯放至一反應器内。混合物係藉由使用一塗 料搖動器（Asada Iron Works Co.，Ltd.)予以分散歷時12小 時，來製備一黑色色素分散溶液。 35 201215630 實施例1和2與比較實施例1至4 :光敏性樹脂組成物的製備 依據實施例1和2以及比較實施例！至4的各光敏性樹脂 組成物係予以製備以包括下列的表丨中提供之下列的組份。 特別地，將一起始劑溶解於一溶劑之中。將溶液於室 溫下攪拌歷時2小時。繼而，將一黏結劑樹脂與一反應性不 飽和化合物添加至溶液。將混合物於室溫下攪拌歷時2小 時。然後，將依據製備實施例丨之紅色色素分散溶液或依據 製備貫施例2的黑色色素分散溶液與一矽烷偶合劑添加至 反應物。將產生的混合物於室溫下攪拌歷時丨小時。接而， 將產物過濾3次以移除雜質，來製備一種光敏性樹脂組成物。 (A)黏結劑樹脂 (A-1)依據製備實施例1之由化學式6-3表示的化合物 係使用作為一咔哚為主之樹脂。 (A_2) 一丙烯酸/甲基丙烯酸苄酯共聚物（NPR8000，Preparation Example 2: Preparation of red pigment dispersion 15 g of CI·Red Pigment 254 (Ciba-Geigy Ltd.), 4 g of DISPERBYK-163 (BYK Additives & Instruments), 3 g of acrylic acid/mercaptopropionic acid A benzylic S copolymer (Miwon Commercial Co, Ltd., NPR 8000), and 78 g of propylene glycol methyl acetate were mixed in a reactor. The mixture was prepared by dispersing using a paint shaker (Asada Iron Works Co., Ltd.) for 12 hours to prepare a red pigment dispersion solution. Preparation Example 3: Preparation of black pigment dispersion 15 g of carbon black (Cabot Co.), 4 g of DISPERBYK-163 (BYK Additives & Instruments), 3 g of acrylic acid / benzyl methacrylate copolymer ( NPR 8000, Miwon Commercial Co, Ltd.), and 78 g of propylene glycol methyl acetate were placed in a reactor. The mixture was prepared by dispersing using a coating shaker (Asada Iron Works Co., Ltd.) for 12 hours to prepare a black pigment dispersion solution. 35 201215630 Examples 1 and 2 and Comparative Examples 1 to 4: Preparation of photosensitive resin composition According to Examples 1 and 2 and Comparative Examples! Each of the photosensitive resin compositions of 4 was prepared to include the following components provided in the following Tables. In particular, an initiator is dissolved in a solvent. The solution was stirred at room temperature for 2 hours. Then, a binder resin and a reactive unsaturated compound are added to the solution. The mixture was stirred at room temperature for 2 hours. Then, the red pigment dispersion solution according to the preparation example or the black pigment dispersion solution according to Preparation Example 2 and a decane coupling agent were added to the reactant. The resulting mixture was stirred at room temperature for several hours. Next, the product was filtered 3 times to remove impurities to prepare a photosensitive resin composition. (A) Adhesive Resin (A-1) The compound represented by Chemical Formula 6-3 according to Preparation Example 1 was used as a main resin. (A_2) acrylic acid/benzyl methacrylate copolymer (NPR8000,

Miwon Commercial Co，Ltd·)係使用作為一丙烯醯基為主之 樹脂。 (A-3)至於一咔哚為主之樹脂，使用由Nipp〇n steeiMiwon Commercial Co, Ltd.) uses a resin mainly composed of an acrylonitrile group. (A-3) As for the main resin, use by Nipp〇n steei

Chemical Co.所製造的 V259ME。 (B) 反應性不飽和化合物 使用二季戊四醇六丙烯酸酯。 (C) 色素分散溶液 (C-1)使用依據製備實施例2之紅色色素分散溶液。於 此，一色素固體係以紅色色素分散溶液的全部量為基準， 以15 wt%的一量被包括。 36 201215630 (C-2)使用依據製備實施例3的黑色色素分散溶液。於 此’一色素固體係以黑色色素分散溶液的全部量為基準， 以15 wt%的一量被包括。 (D) 起始劑 使用由 Ciba Geigy Ltd.所製造的 IRGACURE OXE02。 (E) 溶劑 使用丙二醇曱喊乙酸酯。 (F) 添加劑 至於一矽烷偶合劑，使用γ-縮水甘油醚氧丙基三甲氧 基矽烷(S-510，Chisso Co.)。 (表1) (單位：wt%) 實施例 比較實施例 1 2 1 2 3 4 (A)黏結劑樹脂 (A-1)咔哚為主之樹脂 9.5 9.5 - - - - (A-2)丙烯醯基為主之樹脂 - - 9.5 9.5 - - (A-3)咔哚為主之樹脂 - - - - 9.5 9.5 (B)反應性不飽和化合物 3.5 3.5 3.5 3.5 3.5 3.5 (C)色素分散 C-1 40 6* - 40 6* - 40 6* - C-2 - 40 6* - 40 6* - 40 6* (D)起始劑 0.5 0.5 0.5 0.5 0.5 0.5 (E)溶劑 44 44 44 44 44 44 (F)添加劑 2.5 2.5 2.5 2.5 2.5 2.5 標記*指示出一色素固體的量，以一 (C-1)紅色色素分散 溶液或一(C-2)之黑色色素分散溶液的總量為基準。 37 201215630 評估1 :顯影性質 將依據實施例1和2以及比較實施例1至4的各光敏性樹 脂組成物用一旋轉塗覆器（KDNS, K-Spin8)予以塗覆成為 0.8 μιη厚於一矽晶圓之上（LG siltron)以及接而，以一曝光 器（Nikon, I1QC)予以曝光歷時350 ms。接而，當曝光產物係 藉由使用一顯影器（SSP-200，SVS Corp.)、用〇·2 wt%氫氧 化四曱銨(TMAH)水溶液予以顯影時，顯影性質係用一參考 予以評估時差，當水溶液被塗覆時以及當經塗覆的膜開始 要被顯影時。結果係提供於下列的表2中。 <顯影性質評估> 〇：少於20秒 △:多於20秒且少於30秒 X :多於30秒 評估2 :殘餘物 將依據實施例1、比較實施例1，以及比較實施例3的各 光敏性樹脂組成物用一旋轉塗覆器（K-Spin8，KDNS Inc.) 塗覆成0.8 μηι厚於一矽晶圓之上(LG Siltron Inc.)以及以一 曝光器（I10C ’ Nikon Co.)予以曝光歷時350 ms。接而，曝 光膜係藉由使用一顯影器（SSP-200，SVS Corp.)、用0.2 wt% 氫氧化四甲銨(TMAH)水溶液予以顯影以形成一圖案。接 而，圖案係藉由使用一 CD掃描式電子顯微鏡分析儀 (8100XP ’ KLA-Tencor Co.)予以檢查以評估是否其具有殘 餘物。結果係提供於下列的表2中。此外，經顯影的膜係藉 由檢查是否其具有殘餘物而經由於第1至3圖中之CD的掃 38 201215630 描式電子顯微鏡圖予以評估。 第1圖為顯示出依據實施例1之光敏性樹脂組成物的殘 餘物之掃描式電子顯微鏡圖，第2圖為顯示出依據比較實施 例3之光敏性樹脂組成物的殘餘物之掃描式電子顯微鏡 圖’以及第3圖為顯示出依據比較實施例1之光敏性樹脂組 成物的殘餘物之掃描式電子顯微鏡圖。 <殘餘物評估> Ο :如於第1圖中顯示之平滑的圖案 △:如於第2圖中顯示之小量的殘餘物 X ·如於第3圖中顯示之大量的殘餘物 參照第1至3圖，依據實施例1的光敏性樹脂組成物具有 不帶任何殘餘物之平滑的表面。依據比較實施例1及3的光 敏性樹脂組成物具有殘餘物。 評估3 :圖案形成性質 依據實施例1和2以及比較實施例1至4的光敏性樹脂組 成物係使用一旋轉塗覆器予以塗覆成為1.5μιη高於一玻璃 基材上以及接而，使用一圖案遮罩與一曝光器（USHIO Inc.) 來曝露至45 mJ/cm2的光。經塗覆的玻璃係於23°C用1 wt% 氫氧化鉀稀釋的一水溶液予以顯影歷時1分鐘以及接而，用 純水予以清潔歷時丨分鐘。此15 um-高的圖案係於一22CTC 供箱中予以加熱來固化歷時30分鐘。經固化的圖案係使用 一掃描式電子顯微鏡就形狀而檢查。結果係提供於下列的 表2以及第4至7圖中。 第4圖為顯示出依據實施例2之光敏性樹脂組成物的圖 39 201215630 案形成性質之掃描式電子顯微鏡圖，第5圖為顯示出依據實 施例1之光敏性樹脂組成物的圖案形成性質之掃描式電子 顯微鏡圖’第6圖為顯示出依據比較實施例3之光敏性樹脂 組成物的圖案形成性質之掃描式電子顯微鏡圖，以及第7圖 為顯不出依據比較實施例2之光敏性樹脂組成物的圖案形 成性質之掃描式電子顯微鏡圖。 <圖案形成性質> ◎:如於第4圖中顯示之優良的圖案形成性質 〇：如於第5圖中顯示之良好的圖案形成性質 △:如於第6圖中顯示之不好的圖案形成性質 X :如於第7圖中顯示之沒有圖案 參照第4至7圖，依據實施例1和2的光敏性樹脂組成物 形成了優良的圖案，然而依據比較實施例2及3的該等沒有 良好的圖案。 評估4 :細線圖案形成性質評估 依據實施例2以及比較實施例2及4的光敏性樹脂組成 物係於使用於圖案形成性質之相同的條件下用來形成—圖 案。圖案係使用一光學顯微鏡予以檢查以評估其之最小的 尺寸。結果係提供於下列的表2以及第8至10圖中。 第8圖為顯示出依據實施例2之光敏性樹脂組成物的圖 案尺寸之掃描式電子顯微鏡圖’第9圖為顯示出依據比較實 施例2之光敏性樹脂組成物的圖案尺寸之光學顯微鏡圖，以 及第10圖為顯示出依據比較實施例4之光敏性樹脂組成物 的圖案尺寸之光學顯微鏡圖。 40 201215630 參照第8至依據實施例2的光敏性樹脂組成物具 有7μΓΠ之最小的圖案尺寸，然而依據比較實施例2及4的該 等具有9μιη之最小的圖案尺寸。 (表2) 顯影性質 殘餘物 圖案形成性質 最小的圖案尺寸 (u 實施例1 〇 〇 〇 \ lllJ_ 實施例2 〇 〇 ◎ 7 比較實施例1 X X 〇 . 比較實施例2 X X X 9 比較實施例3 〇 Δ Δ 比較實施例4 Δ 〇 〇 9 參照表2與第1至10圖，使用依據實施例丨和2的咔哚為 主之樹脂來製備的光敏性樹脂組成物顯示出優良的顯影性 質、殘餘物，以及圖案形成性質，相較於依據比較實施例i 及2的一丙烯醯基為主之樹脂予以製備的該等以及依據比 較貫施例3及4之具有與實施例丨和2中使用的咔哚為主之樹 脂不同結構之料為主之樹料以製備的該等。 儘管已以目前視為實際可行例示性具體例來說明本揭 示，但要理解到本發明不限於所揭示的具體例，而是，相 反地，欲涵蓋包括在隨附申請專利範圍之精神與範疇内的 各種修飾與等效配置。前述的具體例為例示性的但無論如 何非限制性的。 【圖式簡單說明】 第1圖為一掃描式電子顯微鏡圖，其顯示出依據實施例 1的光敏性樹脂組成物的殘餘物； 第2圖為一掃描式電子顯微鏡圖，其顯示出依據比較實 41 201215630 施例3的光敏性樹脂組成物的殘餘物. 第3圖為一掃描式電子顯微錯 ^ 見圖’其顯示出依據比較貫 施例1的光敏性樹脂組成物的殘餘物. 第4圖為一掃描式電子顯微#面 貝喊鏡圖’其顯示出依據實施例 2的光敏性樹脂組成物的殘餘物. 第5圖為一掃描式電子顯微許园 彳攻鏡圖’其顯示出依據實施例 1的光敏性樹脂組成物之圖案形成^生胃 第6圖為一掃描式電子顯微 1鏡圖，其顯示出依據比較貫 施例3的光敏性樹脂組成物之圇 系形成性質； 第7圖為一掃描式電子顯微 1鏡圖’其顯示出依據比較實 施例2的光敏性樹脂組成物之_ M茶形成性質； 第8圖為一光學顯微鏡圖， ,, 丹顯示出依據實施例2之光 敏性樹脂組成物的圖案尺寸； 第9圖為一光學顯微鏡圖， "顯示出依據比較實施例2 之光敏性樹脂組成物的圖案尺寸. 第10圖為一光學顯微鏡圊， 兵顯示出依據比較實施例4 之光敏性樹脂組成物的圖案尺寸 【主要元件符號說明】 (無） 42V259ME manufactured by Chemical Co. (B) Reactive unsaturated compound Dipentaerythritol hexaacrylate was used. (C) Pigment Dispersion Solution (C-1) A red pigment dispersion solution according to Preparation Example 2 was used. Thus, a pigment solid is included in an amount of 15 wt% based on the total amount of the red pigment dispersion solution. 36 201215630 (C-2) The black pigment dispersion solution according to Preparation Example 3 was used. Here, the "one pigment solid" is included in an amount of 15 wt% based on the total amount of the black pigment dispersion solution. (D) Starting agent IRGACURE OXE02 manufactured by Ciba Geigy Ltd. was used. (E) Solvent Use propylene glycol to slap acetate. (F) Additive As the monodecane coupling agent, γ-glycidyloxypropyltrimethoxydecane (S-510, Chisso Co.) was used. (Table 1) (Unit: wt%) Example Comparative Example 1 2 1 2 3 4 (A) Resin resin (A-1) bismuth-based resin 9.5 9.5 - - - - (A-2) propylene Resin-based resin - - 9.5 9.5 - - (A-3) bismuth-based resin - - - - 9.5 9.5 (B) Reactive unsaturated compound 3.5 3.5 3.5 3.5 3.5 3.5 (C) Pigment dispersion C- 1 40 6* - 40 6* - 40 6* - C-2 - 40 6* - 40 6* - 40 6* (D) Starting agent 0.5 0.5 0.5 0.5 0.5 0.5 (E) Solvent 44 44 44 44 44 44 (F) Additive 2.5 2.5 2.5 2.5 2.5 2.5 The mark * indicates the amount of a pigment solid based on the total amount of one (C-1) red pigment dispersion solution or one (C-2) black pigment dispersion solution. 37 201215630 Evaluation 1: Development property Each photosensitive resin composition according to Examples 1 and 2 and Comparative Examples 1 to 4 was coated with a spin coater (KDNS, K-Spin 8) to be 0.8 μm thicker than one. The LG siltron was connected and exposed to an exposure device (Nikon, I1QC) for 350 ms. Incidentally, when the exposed product was developed by using a developing device (SSP-200, SVS Corp.) using an aqueous solution of wt·2 wt% tetraammonium hydroxide (TMAH), the developing properties were evaluated with a reference. Time difference, when the aqueous solution is coated and when the coated film begins to be developed. The results are provided in Table 2 below. <Development property evaluation> 〇: less than 20 seconds Δ: more than 20 seconds and less than 30 seconds X: more than 30 seconds Evaluation 2: Residues will be according to Example 1, Comparative Example 1, and Comparative Example Each of the photosensitive resin compositions of 3 was coated with a spin coater (K-Spin 8, KDNS Inc.) to a thickness of 0.8 μm on a wafer (LG Siltron Inc.) and an exposure device (I10C ' Nikon Co.) exposed for 350 ms. Further, the exposed film was developed by using a developing device (SSP-200, SVS Corp.) with a 0.2 wt% aqueous solution of tetramethylammonium hydroxide (TMAH) to form a pattern. In turn, the pattern was examined by using a CD scanning electron microscope analyzer (8100XP 'KLA-Tencor Co.) to evaluate whether it had a residue. The results are provided in Table 2 below. Further, the developed film was evaluated by scanning the electron microscope image of the CD of 2012-1530 in Figs. 1 to 3 by checking whether it had a residue. 1 is a scanning electron micrograph showing a residue of a photosensitive resin composition according to Example 1, and FIG. 2 is a scanning electron showing a residue of a photosensitive resin composition according to Comparative Example 3. The micrographs ' and 3 are scanning electron micrographs showing the residue of the photosensitive resin composition according to Comparative Example 1. <Residue Evaluation> Ο : a smooth pattern Δ as shown in Fig. 1 : a small amount of residue X as shown in Fig. 2 · a large amount of residue as shown in Fig. 3 In the first to third embodiments, the photosensitive resin composition according to Example 1 has a smooth surface without any residue. The photosensitive resin compositions according to Comparative Examples 1 and 3 had a residue. Evaluation 3: Pattern forming properties The photosensitive resin compositions according to Examples 1 and 2 and Comparative Examples 1 to 4 were coated with a spin coater to be 1.5 μm higher than a glass substrate, and used. A pattern mask and an exposure device (USHIO Inc.) were exposed to light of 45 mJ/cm2. The coated glass was developed with an aqueous solution diluted with 1 wt% potassium hydroxide at 23 ° C for 1 minute and then rinsed with pure water for 1/2 minute. The 15 um-height pattern was heated in a 22 CTC box for curing for 30 minutes. The cured pattern was inspected for shape using a scanning electron microscope. The results are provided in Table 2 below and Figures 4 to 7. Fig. 4 is a scanning electron micrograph showing the formation properties of the photosensitive resin composition according to Example 2, Fig. 39, 201215630, and Fig. 5 is a view showing the pattern formation property of the photosensitive resin composition according to Example 1. Scanning electron microscope image 'Fig. 6 is a scanning electron micrograph showing the pattern forming property of the photosensitive resin composition according to Comparative Example 3, and Fig. 7 is a view showing the photosensitive according to Comparative Example 2 Scanning electron micrograph of the pattern forming properties of the resin composition. <Pattern forming property> ◎: Excellent pattern forming property as shown in Fig. 4: good pattern forming property as shown in Fig. 5: bad as shown in Fig. 6 Pattern forming property X: No pattern shown in Fig. 7 Referring to Figures 4 to 7, the photosensitive resin compositions according to Examples 1 and 2 formed an excellent pattern, however, according to Comparative Examples 2 and 3 Wait for no good patterns. Evaluation 4: Evaluation of fine line pattern formation property The photosensitive resin composition according to Example 2 and Comparative Examples 2 and 4 was used to form a pattern under the same conditions as those used for pattern formation properties. The pattern was examined using an optical microscope to evaluate its minimum size. The results are provided in Table 2 below and Figures 8 to 10. 8 is a scanning electron microscope image showing the pattern size of the photosensitive resin composition according to Example 2. FIG. 9 is an optical micrograph showing the pattern size of the photosensitive resin composition according to Comparative Example 2. And Fig. 10 is an optical micrograph showing the pattern size of the photosensitive resin composition according to Comparative Example 4. 40 201215630 The photosensitive resin composition according to the eighth to the second embodiment has a minimum pattern size of 7 μΓΠ, whereas the pattern according to Comparative Examples 2 and 4 has a minimum pattern size of 9 μm. (Table 2) Pattern size in which the development property residue pattern formation property is the smallest (u Example 1 l\llj_ Example 2 〇〇 ◎ 7 Comparative Example 1 XX 〇. Comparative Example 2 XXX 9 Comparative Example 3 〇 Δ Δ Comparative Example 4 Δ 〇〇 9 Referring to Table 2 and Figures 1 to 10, the photosensitive resin composition prepared using the ruthenium-based resin according to Examples 丨 and 2 showed excellent development properties and residuals. And the pattern forming properties, which are prepared in comparison with the acryl-based resin based on Comparative Examples i and 2, and the use according to Comparative Examples 3 and 4 and in Examples 丨 and 2 The present invention is described in terms of what is presently considered to be a practical example, but it is to be understood that the invention is not limited to the disclosed embodiments. The specific examples are intended to cover various modifications and equivalent arrangements within the spirit and scope of the appended claims. The specific examples described above are illustrative but not limiting in any way. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a scanning electron microscope image showing a residue of a photosensitive resin composition according to Example 1; and Fig. 2 is a scanning electron microscope image showing a comparison 41 201215630 Residue of the photosensitive resin composition of Example 3. Fig. 3 is a scanning electron microscopic error. Fig. 4 shows the residue of the photosensitive resin composition according to Comparative Example 1. The figure shows a scanning electron microscope #面面镜图' which shows the residue of the photosensitive resin composition according to Example 2. Fig. 5 is a scanning electron microscope The pattern formation of the photosensitive resin composition according to Example 1 is shown in FIG. 6 as a scanning electron microscope 1 mirror image showing the lanthanide according to the photosensitive resin composition of Comparative Example 3. Forming property; Fig. 7 is a scanning electron microscope 1 mirror image showing the formation property of the photosensitive resin composition according to Comparative Example 2; Fig. 8 is an optical microscope image, ,, Dan Shows the photosensitivity tree according to Example 2 The pattern size of the composition; Fig. 9 is an optical micrograph, " shows the pattern size of the photosensitive resin composition according to Comparative Example 2. Fig. 10 is an optical microscope, and the soldier shows according to the comparative example 4 Pattern size of photosensitive resin composition [Main component symbol description] (None) 42

Claims (1)

201215630 七、申請專利範圍： 1. 一種光敏性樹脂組成物，其包含： (A) —叶哚為主之(cardo-based)樹脂，其含有由下 列化學式1表示的一重覆單元； (B) —反應性不飽和化合物； (C) 一色素； (D) 一起始劑；及 (E) —溶劑： [化學式1]201215630 VII. Patent application scope: 1. A photosensitive resin composition comprising: (A) a cardo-based resin containing a re-fraction unit represented by the following Chemical Formula 1: (B) - a reactive unsaturated compound; (C) a pigment; (D) an initiator; and (E) - a solvent: [Chemical Formula 1] 其中，於化學式1中， R3與R4為相同或不同的，以及為氫、鹵素，或經取 代或未經取代的C1至C20烷基， R1與R2為相同或不同的，以及為氫或 CH2OCH2CR6R7R8(其中，R6至R8為相同或不同的，氫， 或經取代或未經取代的（曱基）丙烯酸酯），但有條件是R1 與R2之至少一者為CH2OCH2CR6R7R8(其中，R6至R8為相 同或不同的，氫，或經取代或未經取代的（甲基）丙烯酸 酯，以及R6至R8之至少一者為經取代或未經取代的（甲 基）丙烯酸酯）， 43 201215630 Z1 為一單鍵、Ο、CO、S〇2、CR9R10、SiRnR12(其 中，R9至R12為相同或不同的，以及為氫，或經取代或 未經取代的C1至C20烷基），或是為由下列化學式2-1至 2-11表示的連接基團之至少一者， Z2為酸酐殘餘基團或酸二酐殘餘基團， m1與m2獨立地為範圍由0至4的整數，以及η為1至 1000的整數， [化學式2-1]Wherein, in Chemical Formula 1, R3 and R4 are the same or different, and are hydrogen, halogen, or substituted or unsubstituted C1 to C20 alkyl, R1 and R2 are the same or different, and are hydrogen or CH2OCH2CR6R7R8 (wherein R6 to R8 are the same or different, hydrogen, or substituted or unsubstituted (fluorenyl) acrylate), provided that at least one of R1 and R2 is CH2OCH2CR6R7R8 (wherein R6 to R8 are The same or different, hydrogen, or substituted or unsubstituted (meth) acrylate, and at least one of R6 to R8 is a substituted or unsubstituted (meth) acrylate), 43 201215630 Z1 is a single bond, hydrazine, CO, S 〇 2, CR9R10, SiRnR12 (wherein R9 to R12 are the same or different, and are hydrogen, or a substituted or unsubstituted C1 to C20 alkyl group), or At least one of the linking groups represented by the following Chemical Formulas 2-1 to 2-11, Z2 is an acid anhydride residual group or an acid dianhydride residual group, m1 and m2 are independently an integer ranging from 0 to 4, and η is An integer from 1 to 1000, [Chemical Formula 2-1] [化學式2-2][Chemical Formula 2-2] [化學式2-3][Chemical Formula 2-3] [化學式2-4][Chemical Formula 2-4] [化學式2-5] 44 201215630 ★ *[Chemical Formula 2-5] 44 201215630 ★ * 其中，於化學式2-5中， Ra為氫、乙基、C2H4a、C2H4OH、CH2CH=CH2， 或苯基， [化學式2-6] * kWherein, in Chemical Formula 2-5, Ra is hydrogen, ethyl, C2H4a, C2H4OH, CH2CH=CH2, or phenyl, [Chemical Formula 2-6] * k it -k [化學式2-8]It -k [Chemical Formula 2-8] [化學式2-9][Chemical Formula 2-9] 45 201215630 [化學式2-10]45 201215630 [Chemical Formula 2-10] [化學式2-11][Chemical Formula 2-11] 2. 如申請專利範圍第1項之光敏性樹脂組成物，其中該咔哚 為主之樹脂具有1，000至50,000 g/mol的重量平均分子量。 3. 如申請專利範圍第1項之光敏性樹脂組成物，其中該咔 哚為主之樹脂包含為由下列化學式4表示的一末端基於 二個末端端的至少一者： [化學式4]2. The photosensitive resin composition of claim 1, wherein the ruthenium-based resin has a weight average molecular weight of 1,000 to 50,000 g/mol. 3. The photosensitive resin composition according to claim 1, wherein the resin mainly composed of at least one of the terminal ends represented by the following Chemical Formula 4 is based on two terminal ends: [Chemical Formula 4] 其中，於化學式4中， Z3為由下列化學式5-1至5-7表示的連接基團之至少 [化學式5-1] 46 201215630Wherein, in Chemical Formula 4, Z3 is at least a linking group represented by the following Chemical Formulas 5-1 to 5-7 [Chemical Formula 5-1] 46 201215630 it 4r 其中，於化學式5-1中，Rb與Re為相同或不同的， 以及為氫、經取代或未經取代的C1至C20烷基、酯基， 或鍵基。 [化學式5-2]It 4r wherein, in Chemical Formula 5-1, Rb and Re are the same or different, and are a hydrogen, a substituted or unsubstituted C1 to C20 alkyl group, an ester group, or a bond group. [Chemical Formula 5-2] # 禽 其中，於化學式5-5中，Rd為0、S、NH、經取代或 47 201215630 未經取代的Cl至C20烷基、Cl至C20烷基胺基，或C2至 C20丙烯胺基， [化學式5-6]#禽中中, In Chemical Formula 5-5, Rd is 0, S, NH, substituted or 47 201215630 unsubstituted Cl to C20 alkyl, Cl to C20 alkyl amine group, or C2 to C20 acryl amine group, [Chemical Formula 5-6] [化學式5-7][Chemical Formula 5-7] 4. 如申請專利範圍第1項之光敏性樹脂組成物，其中該光 敏性樹脂組成物包含 1至30 wt%的該咔哚為主之樹脂(A); 1至30wt%的該反應性不飽和化合物(b); 1至30 wt%的該色素(〇 ; 0.01至10 wt%的該起始劑（D);以及 差額的該溶劑(E)。 5. 如申請專利範圍第丨項之光敏性樹脂組成物，其中該光 敏性樹脂組成物進一步包含一丙稀醯基為主之樹脂。 6. 如申請專利範圍第5項之光敏性樹脂組成物，其中該丙 稀酿基為主之樹脂包含第一乙烯屬不飽和單體與第二 乙烯屬不飽和單體之一共聚物’該第一乙烯屬不飽和單 48 201215630 體為甲基丙烯酸、馬來酸、衣康酸、反丁烯二酸，或其 等之組合的第一乙稀屬不飽和單體；以及該第二乙稀屬 不飽和單體為苯乙烯、曱基苯乙烯、乙烯基甲笨、乙 烯基苄基甲基醚、甲基丙烯酸曱酯、曱基丙烯酸乙酯、 甲基丙烯酸丁酯、甲基丙烯酸2-羥基乙酯、甲基丙烯酸 2-羥基丁酯、曱基丙烯酸苄酯、曱基丙烯酸環己酯、曱 基丙稀酸苯醋、甲基丙稀酸2-胺基乙自旨、甲基丙稀酸2-二甲基胺基乙酯、乙酸乙烯酯、苯甲酸乙烯酯、曱基丙 烯酸縮水甘油酯、甲基丙烯腈、甲基丙烯醯胺，或其等 之組合的第二乙稀屬不飽和單體。 7. 如申請專利範圍第5項之光敏性樹脂組成物，其中該丙 烯醯基為主之樹脂具有3，〇〇〇至40,000 g/mol的重量平均 分子量。 8. 如申請專利範圍第5項之光敏性樹脂組成物，其中該咔 哚為主之樹脂和該丙烯醯基為主之樹脂係以99:1至 30:70的重量比被包括。 9. 如申請專利範圍第1項之光敏性樹脂組成物，其中該起 始劑包含一光聚合化起始劑、一自由基聚合化起始劑， 或其等之一組合。 10. 如申請專利範圍第1項之光敏性樹脂組成物，其中該光 敏性樹脂組成物包含0.01至20份以重量計的環氧化合 物，以該光敏性樹脂組成物的100份重量計為基準。 11. 一種光阻隔層，其係使用如申請專利範圍第1至10項中 任一項之光敏性樹脂組成物來製造的。 494. The photosensitive resin composition of claim 1, wherein the photosensitive resin composition contains 1 to 30% by weight of the bismuth-based resin (A); and 1 to 30% by weight of the reactivity is not Saturated compound (b); 1 to 30 wt% of the pigment (〇; 0.01 to 10 wt% of the initiator (D); and the solvent (E) of the difference. 5. a photosensitive resin composition, wherein the photosensitive resin composition further comprises a acrylonitrile-based resin. 6. The photosensitive resin composition of claim 5, wherein the acryl-based resin is mainly The resin comprises a copolymer of a first ethylenically unsaturated monomer and a second ethylenically unsaturated monomer. The first ethylenically unsaturated monomer 48 201215630 is methacrylic acid, maleic acid, itaconic acid, and anti-butyl a first ethylenically unsaturated monomer of a combination of adipic acid, or the like; and the second ethylenically unsaturated monomer is styrene, mercaptostyrene, vinylmethyl, vinylbenzyl Ether, decyl methacrylate, ethyl methacrylate, butyl methacrylate, methacrylic acid 2 -hydroxyethyl ester, 2-hydroxybutyl methacrylate, benzyl methacrylate, cyclohexyl methacrylate, phenyl acrylate acetonate, 2-aminoethyl methacrylate, methyl a second ethyl acrylate of 2-dimethylaminoethyl acrylate, vinyl acetate, vinyl benzoate, glycidyl methacrylate, methacrylonitrile, methacrylamide, or the like 7. The photosensitive resin composition according to claim 5, wherein the acryl-based resin has a weight average molecular weight of 3, 〇〇〇 to 40,000 g/mol. The photosensitive resin composition of claim 5, wherein the bismuth-based resin and the acryl-based resin are included in a weight ratio of 99:1 to 30:70. The photosensitive resin composition of the above item 1, wherein the initiator comprises a photopolymerization initiator, a radical polymerization initiator, or a combination thereof, etc. 10. a photosensitive resin composition in which the photosensitive resin composition contains 0.01 to 20 parts by weight The epoxy compound is based on 100 parts by weight of the photosensitive resin composition. 11. A light-blocking layer using the photosensitive resin composition according to any one of claims 1 to 10 Manufactured. 49
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