TW201247745A - Organopolysiloxane, method for producing the same and curable resin composition containing the same - Google Patents

Organopolysiloxane, method for producing the same and curable resin composition containing the same Download PDF

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TW201247745A
TW201247745A TW101111318A TW101111318A TW201247745A TW 201247745 A TW201247745 A TW 201247745A TW 101111318 A TW101111318 A TW 101111318A TW 101111318 A TW101111318 A TW 101111318A TW 201247745 A TW201247745 A TW 201247745A
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substituted
organic
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unsubstituted
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TW101111318A
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TWI475050B (en
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Yuji Okada
Yoshito Kuroda
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Asahi Kasei Chemicals Corp
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Abstract

The present invention provides an organopolysiloxane, which can forms a cured material with excellent balanced characteristics on hardness, gas barrier properties, yellowing resistance, light resistance, cold and heat shock resistance, and adhesiveness to substrate. The organopolysiloxane is a group containing one or more unsaturated bonds in one molecule, and containing the constitutional unit contains any combination of (1)F1 and M1, (2)F1 and T, (3)F1, M1, and T, in which the constitutional units F1, M1, and T are represented by the following formulae (1) to (3). (wherein, R1 represents any group selected from of the group consisting of: a substituted or unsubstituted alkyl group with a carbon number of 1 to 10, a substituted or unsubstituted cycloalkyl group with a carbon number of 3 to 10, a substituted or unsubstituted aryl group or a substituted or unsubstituted aralkyl group; R2 represents an unsaturated bond-containing group with a carbon number of 2 to 10; X represents a divalent hydrocarbon group with a carbon number of 2 to 10, a, b, c, each independently represents an integer more than or equal to 1. wherein, F1 represents a constitutional unit of cyclic organopolysiloxane.)

Description

201247745 六、發明說明: 【發明所屬之技術領域】 本發明係關於一種有機聚石夕氧烧、其製造方法及含有 上述有機聚矽氧烷之硬化性樹脂組成物。 【先前技術】 一直以來,已知使用酸酐系硬化劑之環氧系樹脂組成 物,可以形成透明之硬化物,而適於作為發光二極體、光 二極體等之光半導體元件的密封材料。 其例如以雙紛A型環氧樹脂、雙盼f型環氧樹脂及曱 基-3’4-環氧環己烷羧酸(3 -,4 環氧環己基)酯等之以 有機樹脂骨架的環氧樹脂為主成分之環氧樹脂組成物,可 使用在光半導體元件之領域中。 但近年來,隨著光半導體之高性能化之進步,對光半 導體元件的密封材料要求具有更為優異之耐熱性、耐光性 等,使上述已往以來一般所知之環氧樹脂組成物,其特性 已不夠充分。 鑑於上述問題,已往以來在各種光半導體用途之樹脂 組成物方面,亦已有各種之提案。 例如提案一種以特定之聚矽氧組成物經過矽氫化反 應使其硬化之光半導體用途的熱硬化性樹脂組成物(可參 考如專利文獻1。)。 同時,亦提案一種以已改善其硬度的特定之聚矽氧組 成物作為光半導體用途使用的技術(可參考如專利文獻 323923 5 201247745 "此外又有提案一種其中含具有特定構造 氧烷之作為光半導體用途的組成物有機聚矽 3。)。 參考如專利文獻 除此之外,亦有提案以含甲基丙 成物作為光半導體用途的技術(可參考如氣級 其他’又有提案以環氧樹脂組成物戌、4。)。 料及印墨等之技術,該技術中併用塗覆材 _化合物(可參考如專利文獻5及6。) °物及乙 之外’又有提案在併用環氧化合物及 材料中,再使藉由含特定之紛樹脂,以控制其硬:勿的 械特性之技術(可參考如專散獻7〇。〃 的機 [先前技術文獻] 專利文獻 [專利文獻1]日本專利特開2〇ι〇_1358號公報 [專利文獻2]日本專利特開2008-274185號公報 [專利文獻3]曰本專利特開2008-201851號公報 [專利文獻4]日本專利特開2008-131009號公報 [專利文獻5]日本專利特開平6_298911號公報 [專利文獻6]日本專利特開平9_328634號公報 [專利文獻7]日本專利第4235698號公報 【發明内容】 (發明欲解決之課題) 然而,上述之先前提案的技術,仍有下述問題點。 在專利文獻1中所提案之熱硬化性樹脂組成物,其耐 323923 6 201247745 熱黃變性及财光性雖佳,但硬化物之硬度仍低因此易發生 損傷而難以使用。同時,其阻氣性及對基材之密接性亦低, 因此無法適用在光半導體用密封材之用途方面。 在專利文獻2中所提案之聚矽氧組成物,為提高其硬 度而使用苯基,惟該苯基卻成為降低耐熱黃變性及耐光性 之原因’因此在光半導體用密封材之用途方面亦不適於使 用。 在專利文獻3中所提案之組成物,在硬度、密接性及 阻氣性方面雖佳,惟形成基本骨架之異三聚氰酸酯卻成為 降低耐熱黃變性、耐光性之原因,因此在光半導體用密封 材之用途方面未必達到可滿足之程度。 在專利文獻4中所提案之聚矽氧組成物,在耐熱黃變 性及耐光性方面雖佳,由於分子構造中並無可緩和應力 (stress)之部位’在進行冷熱衝擊試驗等之環境變化試驗 時’會使硬化物發生破裂。亦即,在光半導體用途方面’ 在反複操作開關之0N-0FF時會使樹脂發生破裂,而此又與 斷線問題有關。同時,又未能達到可滿足阻氣性及對基材 之密接性的程度。 在專利文獻5至7中所提案之材料,雖然阻氣性及密 接性佳’但均為易發生黃變之環氧樹脂組成物,故在耐熱 黃變性、耐光性之點方面亦未能達到可滿足的程度。 如上所述’先前提案之樹脂組成物,在硬度、阻氣性、 耐熱黃變性、耐光性、耐冷熱衝擊性及對基材之密接性的 全部特性方面,仍無法得到可充分滿足在光半導體用途及 323923 7 201247745 塗覆材等領域方面所要求的程度良好地平衡之硬化物。 亦印本發明之目的係提供一種可形成充分地滿足在 硬度、阻氣性、耐熱黃變性、耐光性、耐冷熱衝擊性及對 基材之密接性之全部特性,特別是在光半導體用途方面所 要求之程度良好地平衡之硬化物的有機聚矽氧烷、其製造 方法及使用其之硬化性樹脂組成物,以及上述特性中所必 要之光半導用晶片接合(die__bonding)材、塗覆材、奈米 模印用硬化性樹脂組成物及印墨。 、本發明人料解決域_經過刻意檢狀結果,發 見以3有特疋構造的有機聚❸纽之硬化性樹脂組成物, 可以達成上述目的,心成本發明。 亦即本發明,係如下之各項。 〔1〕 法絲ί有機聚♦纽’係在1分子中含1個以上含不飽 i Μ Τ,Γ具有下述通式⑴至(3)所示之構成單位 Μ、Ml、Τ中的 (i) F1 及 Ml、 (ii) F1 及 τ、 (iii) FI、ΜΙ 及 τ 之任意組合的構成單位。 丫, FI: (RlSi〇2/a)a 323923 8 201247745 (R12s\o^/2) Μ 1 : ---(2) (R1.Si03/2 ) T C · · · ( 3 ) (上述通式(1)至(3)中,r1表示由:取代或未取代之 碳數1至10的烧基、取代或未取代之碳數3至1〇的環烷 基、取代或未取代之芳基及取代或未取代之芳烷基所成之 群中選擇之任忍者,R表示碳數2至1〇含不飽和鍵之基; X表示碳數2至10.^ —價煙基;Y表示碳數2至10之二價 煙基,a、b、c各自獨立地表示1以上之整數。其中,pi 表示環狀有機聚矽氧烷之構成單位。) 〔2〕 如上述〔1〕所述之有機聚石夕氧院,上述通式(1)至 (3)中,a、b、c滿足下述通式(I)。 0. l^a/ (b+c) ^5- · -(1) 〔3〕 如上述〔1〕或〔2〕所述之有機聚矽氧烷,上述通式 〇)所示之構成單位F1中之R2係丙烯醯氧基或曱基丙稀 醯氧基。 〔4〕 如上述〔1〕至〔3〕中任一項所述之有機聚矽氧烷, 其中’含下述通式(4)至(6)所示之構成單位:D1、D2、 D3之任意者。 323923 9 201247745 D 1 : ( Rl2Si02/2) · · X—201247745 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to an organic polyoxic oxide, a method for producing the same, and a curable resin composition containing the above organopolysiloxane. [Prior Art] It has been known that an epoxy resin composition using an acid anhydride-based curing agent can form a transparent cured product, and is suitable as a sealing material for an optical semiconductor element such as a light-emitting diode or a photodiode. The organic resin skeleton is, for example, a double-type A type epoxy resin, a double-prepared f-type epoxy resin, and a mercapto-3'4-epoxycyclohexanecarboxylic acid (3-, 4-epoxycyclohexyl) ester. The epoxy resin-based epoxy resin composition can be used in the field of optical semiconductor components. However, in recent years, with the advancement of the high performance of the optical semiconductor, the sealing material for the optical semiconductor element is required to have more excellent heat resistance, light resistance, and the like, and the epoxy resin composition generally known in the prior art is The characteristics are not sufficient. In view of the above problems, various proposals have been made in various resin compositions for optical semiconductor applications. For example, a thermosetting resin composition for photo-semiconductor use in which a specific polyoxymethylene composition is subjected to a hydrogenation reaction by a hydrazine is proposed (refer to Patent Document 1). At the same time, a technique for using a specific polyoxyl composition having improved hardness as a photo-semiconductor is also proposed (refer to, for example, Patent Document 323923 5 201247745 " In addition, there is proposed a method in which a specific structural oxyalkylene is contained therein. The composition of optical semiconductors is organically polymerized. For example, there is also a proposal to use a methyl propyl compound as a technique for optical semiconductor use (see, for example, gas grade others) and a proposal for an epoxy resin composition 4, 4). In the technique of ink and ink, etc., the coating material_compound (refer to Patent Documents 5 and 6) and the use of epoxy compounds and materials are also used in this technology. A technique containing a specific resin to control its hardness: no mechanical properties (refer to the special product of 〇 〇 〇 〃 〃 先前 先前 先前 先前 先前 先前 先前 先前 先前 先前 先前 先前 先前 先前 先前 先前 先前 先前 先前 先前 先前 先前 先前 先前 先前 先前 先前 先前 先前 先前 先前 先前Japanese Patent Laid-Open Publication No. 2008-201185 [Patent Document 3] Japanese Patent Laid-Open Publication No. 2008-201009 (Patent Document 4) [Patent Document 6] Japanese Patent Laid-Open Publication No. Hei 9-328634 (Patent Document 7) Japanese Patent No. 4235698 (Summary of the Invention) However, the above-mentioned previously proposed There is still a problem in the technique. The thermosetting resin composition proposed in Patent Document 1 is resistant to 323923 6 201247745. Although the heat yellowing property and the goodness are good, the hardness of the cured product is still low and the damage is liable to occur. It is difficult to make At the same time, the gas barrier properties and the adhesion to the substrate are also low, so that it is not suitable for use in the sealing material for optical semiconductors. The polyfluorene composition proposed in Patent Document 2 is for improving the hardness. When a phenyl group is used, the phenyl group is a cause of the reduction of heat-resistant yellowing and light resistance. Therefore, it is not suitable for use in the use of a sealing material for an optical semiconductor. The composition proposed in Patent Document 3 is in hardness and adhesion. Although it is excellent in terms of properties and gas barrier properties, the isomeric cyanurate which forms the basic skeleton is a cause of reducing heat-resistant yellowing and light resistance, and thus it is not necessarily satisfactory in terms of the use of the sealing material for optical semiconductors. The polyfluorene-oxygen composition proposed in Patent Document 4 is excellent in heat-resistant yellowing and light resistance, and there is no part in the molecular structure that can relieve stress. When performing environmental change tests such as thermal shock test. 'It will cause the hardened material to rupture. That is, in the use of optical semiconductors', the resin will be cracked when the switch is operated at 0N-0FF, which is related to the disconnection problem. At the same time, the degree of gas barrier properties and the adhesion to the substrate is not achieved. The materials proposed in Patent Documents 5 to 7 have good gas barrier properties and good adhesion. Since the epoxy resin composition is changed, it is not satisfactory in terms of heat yellowing resistance and light resistance. As described above, the resin composition previously proposed has hardness, gas barrier property, heat yellowing resistance, In terms of all the characteristics of light resistance, thermal shock resistance, and adhesion to a substrate, it has not been possible to obtain a cured product which satisfactorily satisfies the degree required for optical semiconductor applications and coating materials such as 323923 7 201247745. It is also an object of the present invention to provide a property that satisfies all of the properties of hardness, gas barrier properties, heat yellow resistance, light resistance, thermal shock resistance, and adhesion to a substrate, particularly in optical semiconductor applications. An organic polyoxyalkylene which is required to have a well-balanced cured product, a method for producing the same, and a curable resin composition using the same, and a photo-conductive wafer bonding (die__bonding) material and a coating material which are necessary for the above characteristics , a hardening resin composition for nanoimprinting and an ink. The inventors of the present invention have solved the above-mentioned problems by obtaining a hardening resin composition of an organic polyfluorene having a characteristic structure, and the above object can be attained. That is, the present invention is as follows. [1] The French eucalyptus organic conjugate has one or more unsaturated i 1 in one molecule, and has the constituent units Μ, Ml, Τ in the following general formulas (1) to (3) (i) The constituent units of any combination of F1 and Ml, (ii) F1 and τ, (iii) FI, ΜΙ and τ.丫, FI: (RlSi〇2/a)a 323923 8 201247745 (R12s\o^/2) Μ 1 : ---(2) (R1.Si03/2 ) TC · · · ( 3 ) (The above formula In (1) to (3), r1 represents a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 1 ring carbon number, or a substituted or unsubstituted aryl group. And a ninja selected from the group consisting of a substituted or unsubstituted aralkyl group, R represents a carbon number of 2 to 1 oxime containing an unsaturated bond; X represents a carbon number of 2 to 10. a divalent smoky group having 2 to 10 carbon atoms, a, b, and c each independently represent an integer of 1 or more, wherein pi represents a constituent unit of the cyclic organopolyoxane.) [2] as in the above [1] In the above-mentioned general formula (1) to (3), a, b, and c satisfy the following general formula (I). 0. l^a/ (b+c) ^5- (1) [3] The organopolyoxyalkylene as described in the above [1] or [2], the constituent unit represented by the above formula (〇) R2 in F1 is an acryloxy group or a mercapto acryloxy group. [4] The organopolyoxane according to any one of the above [1] to [3] wherein 'the constituent units represented by the following general formulae (4) to (6) are: D1, D2, D3 Any of them. 323923 9 201247745 D 1 : ( Rl2Si02/2) · · X—

D3: (Rl2Si02/2)…⑹ j上述通式(4)至(6)中,Rl表示由:取代或未取代之 ^數1至1G的絲、取代或未取代之碳數3至1G的環燒 二或未取代之絲及取代或未取代之找基所成之 群中選擇之任意者;Χ表示碳數2 JL 1〇之二價烴基。 其中’ Dl、D2表示環狀有機聚妙氧燒之構成單位,⑽ 表不鏈狀有機聚矽氧烷之構成單位。) 〔5〕 如上述⑴至⑷中任一項所述之有機聚石夕氧燒, 、中匕3下述通式(7)所示之構成單位s,且該通式(?) 二示之構成單位的含量,相對於上料式⑴所示之構 單位F1的含量可滿足下述通式(π)。 d/a ^0. 1 . . · ( Π)D3: (Rl2Si02/2) (6) j In the above formulae (4) to (6), R1 represents a substituted or unsubstituted filament of 1 to 1 G, a substituted or unsubstituted carbon number of 3 to 1 G. Any one selected from the group consisting of a ring-fired or unsubstituted filament and a substituted or unsubstituted radical; Χ represents a divalent hydrocarbon group having a carbon number of 2 JL 1 Å. Wherein 'Dl, D2 denotes a constituent unit of a cyclic organic polyoxygen oxymethane, and (10) denotes a constituent unit of a chain-like organopolyoxane. [5] The organic polyoxo-oxygenate according to any one of the above (1) to (4), and the constituent unit s represented by the following formula (7), and the formula (?) The content of the constituent unit can satisfy the following general formula (π) with respect to the content of the structural unit F1 shown in the charging formula (1). d/a ^0. 1 . . · ( Π)

s : ( R1HSi02/2)d (上述通式⑺+ ’ R1表㈣:取代或未取代之碳數i 至1〇的烧基、取代或未取代之碳數3幻㈣環現基、取 代或未取代之絲及取倾未取狀芳縣载之群中選 擇之任意者。其巾’構成單位S表㈣狀錢狀有機聚石夕 323923 201247745 氧烷之構成單位。) 如上述〔1〕至〔5〕中任一項所述之有機聚石夕氧境, 其中,係只含有如上述(1)所示之構成單位F1作為上迷 含有R2之構成單位。 C7] 如上述〔1〕至〔5〕中任一項所述之有機聚矽氧燒, 其中,係含有上述通式(1)所示之構成單位F1及下逃通 式(8)所示之構成單位F2作為上述含有R2之構成單也:。 (其中,下述通式(8)中,R21係包含於上述R2中。) P 2 : Y—R21 (R^Sio^z) • · · ( 8 ) (上述通式(8)中,R1表示由:取代或未取代之碳數又 至10的烷基、取代或未取代之碳數3至1〇的環烷基、 代或未取代之芳基及取代或未取代之芳烷基所成之群中 擇之任意者;R21表㈣烯醯氧基或甲基丙烯醯氧基選 示碳數2至10之二價烴基。 表 其中,F2表示鏈狀有機聚矽氧烷之構成單仅 〔8〕 〇 ) -種有機料氧烧,其中,相對於刚 述〔1〕至〔7〕中任-項所述之有機聚錢烧,又=如上 至1〇0質量份之下述通式(9)所示之環狀有機聚 323923 11 201247745s : ( R1HSi02 / 2)d (the above formula (7) + ' R1 Table (4): substituted or unsubstituted carbon number i to 1 〇 alkyl group, substituted or unsubstituted carbon number 3 phantom (tetra) ring present, substituted or Unsubstituted silk and any one selected from the group of Fangxian County. The towel's composition unit S (4)-like organic polycica 323923 201247745 oxane constituent unit.) as above [1] The organic polyoxo oxygen atmosphere according to any one of the above aspects, wherein the constituent unit F1 as shown in the above (1) is contained as a constituent unit containing R2. The organic polyoxoxime according to any one of the above [1] to [5], wherein the composition unit F1 and the lower formula (8) represented by the above formula (1) are contained. The constituent unit F2 is also a constituent sheet containing the above R2. (In the following general formula (8), R21 is contained in the above R2.) P 2 : Y—R21 (R^Sio^z) • (8) (in the above formula (8), R1 Represents: a substituted or unsubstituted alkyl group having up to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 1 ring carbon number, a substituted or unsubstituted aryl group, and a substituted or unsubstituted aralkyl group. Any one of the selected groups; R21 (4) olefinic oxy or methacryloxy group is selected from a divalent hydrocarbon group having 2 to 10 carbon atoms. wherein F2 represents a constituent of a chain organopolysiloxane. [8] 〇) - an organic material oxy-combustion, wherein, as described in the above-mentioned item [1] to [7], the organic polycoin is further reduced to the following: Cyclic organic poly 323923 represented by the general formula (9)

R21 (上述通式(9)巾’ R1表示由:取代或未取代之碳數i 至10的燒基、取代或未取代之碳數3至1〇的環烷基、取 代或未取狀絲絲代或麵狀芳縣所成之群中選 擇之任意者;R21表示丙雜氧基或甲基丙烯醯氧基;χ表 不碳數2至1()之二價烴基;e表示i以上之整數;f表示 0以上之整數;e+f表示3至2〇之整數。) 〔9〕 、一種有機聚矽氧烷,其中,相對於10〇質量份之如上 述⑴至〔8〕中任一項所示的有機聚魏烧,又含有〇 〇1 至_質量份之下述通式(1Q)所示的化合物。. Ψ R1 R1 R1R21 (the above formula (9) towel 'R1 represents a substituted or unsubstituted carbon number i to 10 alkyl group, substituted or unsubstituted carbon number 3 to 1 fluorene cycloalkyl group, substituted or undrawn wire Any one selected from the group consisting of silk or fragrans; R21 represents a propenoxy or methacryloxy group; χ represents a divalent hydrocarbon group having 2 to 1 carbon atoms; e represents i or more An integer: f represents an integer of 0 or more; e+f represents an integer of 3 to 2 。.) [9] An organopolyoxane, wherein, in the above (1) to [8], relative to 10 parts by mass The organic poly-fibrin shown in any one of the formulas further contains a compound represented by the following formula (1Q) in an amount of from 1 to _ parts by mass. . Ψ R1 R1 R1

nSiO^SiO^^iO)-(SiO)-J X Rl Y R1 γ R21 R1—SiO—(Si R1 R1 <si〇)r-si- •R1 R1 (上述通式U0)巾,R1表示由:取代或未取代 的絲、取代絲取代之碳數3至lG的環數 =未取代之芳基及取代或未取代之芳絲所 1? 201247745 擇之任意者;R21表示丙_氧基或甲基丙烯醯氧基;χ表 示碳數2至10之二價烴基;g表示!以上之整數;匕表示 〇以上之整數;i表示0至20之整數。) 〔10〕 如上述〔1〕至〔9〕中任一項所述之有機聚矽氧烷’ 其中,含有下述通式(9)所示之環狀有機聚矽氧烷及下述 通式(10 )所示之化合物, R1 R1 v^iC%—{SiO)j-X R1 R21 • · · ( y ) (上述通式(9)中’R表示由:取代或未取代之碳數i 至10的烷基、取代或未取代之碳數3至1〇的環烷基、取 代或未取代之芳基及取代或未取代之芳烧基所成之群中選 擇之任意者;R21表示丙婦酿氧基或曱基丙烯醯氧基;X表 示碳數2至10之二價烴基;e表示1以上之整數;f表示 〇以上之整數;e+f表示3至20之整數。) R1 R1 R1 R1nSiO^SiO^^iO)-(SiO)-JX Rl Y R1 γ R21 R1—SiO—(Si R1 R1 <si〇)r-si- •R1 R1 (the above formula U0) towel, R1 is represented by: Substituted or unsubstituted filaments, substituted filaments substituted by number of rings 3 to 1G = unsubstituted aryl groups and substituted or unsubstituted aromatic filaments 1? 201247745 Any one of them; R21 means propylene-oxyl or A a propylene oxy group; χ represents a divalent hydrocarbon group having 2 to 10 carbon atoms; g represents! The above integer; 匕 represents an integer above ;; i represents an integer from 0 to 20. [10] The organopolyoxane as described in any one of the above [1] to [9] wherein the cyclic organopolyoxane represented by the following formula (9) is contained and the following a compound represented by the formula (10), R1 R1 v^iC% - {SiO)jX R1 R21 • · ( y ) (in the above formula (9), 'R represents a carbon number i from a substituted or unsubstituted Any one selected from the group consisting of alkyl, substituted or unsubstituted cycloalkyl having 3 to 1 ring carbon, substituted or unsubstituted aryl, and substituted or unsubstituted aryl group; R21 represents C Glycoloxy or mercaptopropenyloxy; X represents a divalent hydrocarbon group having 2 to 10 carbon atoms; e represents an integer of 1 or more; f represents an integer above 〇; and e+f represents an integer of 3 to 20.) R1 R1 R1 R1

X R1 I R1 VX R1 I R1 V

I , I I I r21 R1—SiO-iSiO^Si-R1 R1 R1 R1 10) 323923 13 201247745 (上述通式(ίο)中,R1表示由:取代或未取代之碳數1 至10的烷基、取代或未取代之碳數3至10的環烷基、取 代或未取代之芳基及取代或未取代之芳烷基所成之群中選 擇之任意者;R21表示丙烯醯氧基或甲基丙烯醯氧基;χ表 不石反數2至10之二價烴基;g表示丨以上之整數;h表示 0以上之整數;i表示〇至2〇之整數。) 其由以基質輔助游離化飛行時間型質譜分析法測定 所得之峰強度以下述通式(111)計算,所得之上述通式(1〇) 所示之化合物含量〔WB〕相對於上述通式(9)所示之化合 物含量〔WA〕之比:〔WB〕/〔WA〕之值為〇1以上2〇 〇 以下。 · [數1] [WB]/[WA] =符合通式(1〇)構造的質量與鈉質量 :合計質量所相當之峰的強度/符合通式⑷之構造的質 量與鈉質量23之合計質量所相當之峰的強度....... (III) . · · 〔11〕 如上述〔1〕至〔10〕中任一項所述之有機聚矽氧烷, 其中’上述R1為碳數1至10之烷基。 ① 〔12〕 項所述之有機聚;g夕氧燒, 如上述〔1〕至〔Π〕中任一 其中,上述R1為甲基。 〔13〕 323923 如上述〔1〕至〔12〕中任一 項所述之有機聚>5夕氧燒, 201247745 " 其中,上述R2含有丙烯醯氧基或曱基丙烯醯氧基,且丙烯 醯氧基或甲基丙烯醯氧基之官能基當量為210至2100g/莫 〇 〔14〕 如上述〔1〕至〔13〕中任一項所述之有機聚矽氧烷, 其重量平均分子量為700至5000000,25°C下之黏度為50 至 1000000 mPa · s 。 〔15〕 一種有機聚矽氧烷的製造方法,係製造如上述〔1〕 至〔14〕中任一項所述之有機聚矽氧烷的方法,其具有下 述步驟: 將下述通式(11)所示之氫化聚矽氧烷(al)及 依所需之具有1個以上直接鍵結於矽原子之氫原子的氫化 聚矽氧烷(a2)、 i) 具有2個以上直接鍵結於矽原子的乙烯基之含乙烯 基的有機聚矽氧烷(bl)或具有2個以上直接鍵結於 矽原子的羥基之聚矽氧烷(b2),以及 ii) 1分子中具有2個以上不飽和鍵的有機化合物(c) 之加成反應, 在石夕氫化反應催化劑(d)之存在下進行, R1 R1 -(SiC%-(^iC% H R1 --.(11) 323923 15 201247745 (上述通式(11)中,R1表示由:取代或未取代之碳數j 至10的烷基、取代或未取代之碳數3至10的環烷基、取 代或未取代之芳基及取代或未取代之芳烷基所成之群中選 擇之任意者;j表示1以上之整數;k表示〇以上之整數; j+k表示3至20之整數。)。 ’ 〔16〕 如上述〔15〕項所述之有機聚矽氧烷的製造方法,其 中’上述進打加成反應之步驟係包含:調製反應液的步驟、 以及在上述反應液中添加錢化反應催化劑(d)之步驟, 其中、’該反舰含有上料式(11)料之氫化㈣氡燒 al)、依所需之上述具有上直接鍵結於 之虱原子的氩化㉔魏(a2)、 席子 ?固以上之直接鍵結於矽原子的乙烯基之含 飽寿_聚秒氣院(Μ)及1分子中具有2個以上不 飽和鍵的有機化合物卩彳个 石夕原子的經基之或疋具有2個以上直接鍵結於 的錄之來矽氧烷(b2)及1分子中且有 不飽和鍵的有機化合物(c)。 上 〔17〕 ^上述〔15〕項所述之有機聚石夕氧燒的製造方法,且 中,上述進行加成反紅步職序進行下述㈣:” 所干驟,該反應液係含有上述通式(U) 接鍵結於上述⑦原子 U 1個以上直 分子中具有2個以上聚w(a2)及1 上不飽和鍵的有機化合物(c); 323923 16 201247745 生成加成體之步驟,係在上述反 應催化劑(d)而生成上述通式(丨丨)應液令添加矽氣化反 (al)、依所需之上述具有1個以上 厂、之氫化聚發氧燒 原子的氫化聚矽氧烷(a2)及丨分子接鰱結於矽原子之氫 和鍵的有機化合物(c)之加成物之步中具有2個以上不飽 添加步驟,係在上述反應液中如驟,以及 直接鍵結於矽原子的乙烯基之含乙入上述具有2個以上 (bl)、或具有2個以上直接鍵結於矽基的二有機聚矽氧烷 烷(b2)。 、原子的羥基之聚矽氧 〔18〕 一種硬化性樹脂組成物,其含 〔1〕至〔14〕中任一項所述之有^二質量份之如上述 質量份之熱自由基產生劑。 夕氣烷及〇. 5至 〔19〕 一種硬化性樹脂組成物,其 〔1〕至〔14〕中任一項所述之有0質量份之如上述 質量份之光自由基產生劑。 軋烷及0.5至20 〔20〕 如上述〔18〕或〔19〕項所述之硬化性 其中,相對於1〇〇質IP 樹月曰2成物, 層質里伤之如上述⑴至〔 所述之有機聚矽氧烷t J中任一項 劑。 纟减又3有ο.1至10質量份之石夕燒偶合 21 如上述〔18〕至〔2〇〕中任—項所述之硬化性樹脂組 323923 201247745 成物,其中,相對於100質量份之如上述〔n至〔14〕中 任-項所述之有機聚石夕氧烧,又含有0.001質量份以下之 (d)珍氫化反應催化劑。 〔22〕 如上述〔18〕至〔21〕中任-項所述之硬化性樹脂組 成物,其中,相對於100質量份之如上述〔1〕至〔14〕中 任一項所述之有機聚矽氧烷,又含有〇. 1炱50〇質Ϊ份之 無機氧化物。 〔23〕 一種光半導體用密封材,其含有如上述〔18〕至〔22〕 中任一項所述之硬化性樹脂組成物。 〔24〕 一種光半導體用晶片接合材(die bonding material) ’其包含如上述〔18〕至〔22〕中任一項所述之 硬化性樹脂組成物。 〔25〕 一種塗覆材,其包含如上述〔18〕至〔22〕中任一項 所述之硬化性樹脂組成物。 〔26〕 一種奈米模印用硬化性樹脂組成物,其包含如上述 〔18〕至〔22〕+任一項所述之硬化性樹脂組成物。 〔27〕 一種印墨,其包含如上述〔18〕至〔22〕中任一項所 述之硬化性樹脂組成物及著色劑。 323923 18 201247745 〔28〕 一種光半導體封裝體,係以如上述〔23〕項所述之光 半導體用密封材而成形。 (發明之效果) 如依本發明,可以得到在硬度、阻氣性、耐熱黃變性、 耐光性、耐冷熱衝擊性及對基材之密接性的全部特性方 面,形成其在光半導體之用途上所要求的程度可以良好地 平衡而充分地滿足之硬化物的有機聚石夕氧院及使用此之硬 化性樹脂組成物。 如依本發明,亦可以提供具有上述特性之光半導體用 密封材、光半導體用晶片接合材、塗覆材、奈米模印用硬 化性樹脂組成物、印墨領域上有用之材料及將上述光半導 體用密封材成形之光半導體封裝體。 【實施方式】 以下再對本發明之實施形態(以下,稱為「本實施形 態」)詳加說明。 惟本發明並不限定於以下所記載,在合於其要點之範 圍内亦可作種種變形而實施。 〔有機聚矽氧烷〕 本實施形態之有機聚矽氧烷,係在1分子中含有1個 以上不飽和鍵之基,而具有下述通式(1)至(3)所示之 構成單位FI、Ml、T中的 (i) F1及Μ卜 (ii) F1 及 Τ、 323923 19 201247745 (iii) FI 、 Ml 及 Τ 之任意組合的構成單位之有機聚矽氧烷。I , III r21 R1—SiO—iSiO^Si—R1 R1 R1 R1 10) 323923 13 201247745 (In the above formula (ίο), R1 represents a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substitution or Any one selected from the group consisting of an unsubstituted cycloalkyl group having 3 to 10 carbon atoms, a substituted or unsubstituted aryl group, and a substituted or unsubstituted aralkyl group; R21 represents an acryloxy group or a methacrylium group Oxyl; χ represents a divalent hydrocarbon group having an inverse number of 2 to 10; g represents an integer above 丨; h represents an integer greater than 0; i represents an integer from 〇 to 2〇.) The peak intensity obtained by mass spectrometry is calculated by the following formula (111), and the content of the compound represented by the above formula (1〇) [WB] is relative to the content of the compound represented by the above formula (9) [WA] Ratio: The value of [WB]/[WA] is 〇1 or more and 2〇〇 or less. · [Number 1] [WB] / [WA] = mass and sodium mass in accordance with the general formula (1〇) structure: the intensity of the peak corresponding to the total mass / the mass of the structure conforming to the general formula (4) and the sodium mass 23 The organic polyfluorene oxide according to any one of the above [1] to [10] wherein the above R1 is An alkyl group having 1 to 10 carbon atoms. The organopoly group according to the above [12], wherein the above R1 is a methyl group, or any one of the above [1] to [Π]. [13] 323923. The organic poly>5 oxirane according to any one of the above [1] to [12], wherein the above R2 contains an acryloxy group or a mercaptopropenyloxy group, and The functional group equivalent weight of the propylene methoxy group or the methacryl methoxy group is from 210 to 2,100 g / 摩尔 [14] The organic polysiloxane according to any one of the above [1] to [13], which has an average weight. The molecular weight is 700 to 5000000, and the viscosity at 25 ° C is 50 to 1000000 mPa · s. [15] A method for producing an organopolyoxane according to any one of the above [1] to [14], which has the following steps: The hydrogenated polyoxyalkylene (al) shown in (11) and the hydrogenated polyoxyalkylene (a2), i) having one or more hydrogen atoms directly bonded to a halogen atom, have two or more direct bonds. a vinyl group-containing organopolyoxane (bl) bonded to a vinyl group of a halogen atom or a polyoxyalkylene (b2) having two or more hydroxyl groups directly bonded to a halogen atom, and ii) having 2 molecules in one molecule The addition reaction of the above organic compound (c) having an unsaturated bond is carried out in the presence of the catalyst (d) of Rishi, R1 R1 -(SiC%-(^iC% H R1 --. (11) 323923 15 201247745 (In the above formula (11), R1 represents an alkyl group having a carbon number of from 1 to 10 substituted or unsubstituted, a substituted or unsubstituted cycloalkyl group having from 3 to 10 carbon atoms, a substituted or unsubstituted aromatic group Any one selected from the group consisting of a substituted or unsubstituted aralkyl group; j represents an integer of 1 or more; k represents an integer above 〇; j+k represents 3 to 20 [16] The method for producing an organopolyoxane according to the above [15], wherein the step of the above-mentioned addition reaction comprises: a step of preparing a reaction liquid, and a reaction liquid in the above Adding a step of the hydroxylation reaction catalyst (d), wherein the 'anti-ship contains the hydrogenation of the feed (11) material (tetra), and the above-mentioned argon having the atom directly bonded thereto 24 Wei (a2), mats, solids, etc., which are directly bonded to the vinyl group of the ruthenium atom. 聚聚气院(Μ) and an organic compound having two or more unsaturated bonds in one molecule. The ruthenium of the Shixi atom has two or more organic compounds (c) which are directly bonded to the oxirane (b2) and one molecule and have an unsaturated bond. [17] ^ In the method for producing an organic polyoxanthene of the above-mentioned item 15, wherein the addition of the anti-red step is carried out as follows (4): wherein the reaction liquid contains the above formula (U) Bonding to the above 7 atoms U 1 or more straight molecules having 2 or more poly w (a2) and 1 unsaturated bond Compound (c); 323923 16 201247745 The step of forming an adduct is to form the above-mentioned reaction catalyst (d) to form the above-mentioned general formula (丨丨), and to add the gasification reaction (al), as described above. The hydrogenated polyoxyalkylene (a2) having one or more hydrogenated polyoxygenated atoms in the plant and the anthracene of the organic compound (c) bonded to the hydrogen of the halogen atom and the bond have 2 The above-mentioned non-saturated addition step is carried out in the above reaction liquid, and the ethyl group directly bonded to the ruthenium atom has two or more (bl) or two or more direct bonds to the ruthenium group. Diorganopolyoxyalkylene (b2). The hydroxy group of the atomic hydroxyl group [18] A curable resin composition containing the two parts by mass of the thermal radical generating agent as described in any one of [1] to [14] . And a photo-free radical generating agent having a mass fraction of 0 parts by weight as described in any one of [1] to [14]. Rolling alkane and 0.5 to 20 [20] The hardening property as described in the above [18] or [19], wherein the layered smear is as described above (1) to [1] with respect to the 1 enamel IP tree. Any one of the organopolyoxanes t J.纟 又 又 3 3 ο ο ο 21 如 如 如 如 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 The organic polyoxazine calcined according to any one of the above [n to [14], further containing 0.001 parts by mass or less of the (d) hydrogenation reaction catalyst. [22] The curable resin composition according to any one of the above [1] to [21], wherein the organic material according to any one of the above [1] to [14], with respect to 100 parts by mass Polyoxane, which also contains 炱.1炱50 Ϊ 之 of inorganic oxide. [23] A sealing material for an optical semiconductor, comprising the curable resin composition according to any one of the above [18] to [22]. [24] A die bonding material for an optical semiconductor, comprising the curable resin composition according to any one of the above [18] to [22]. [25] A coating material comprising the curable resin composition according to any one of the above [18] to [22]. [26] A curable resin composition for a nano-imprint, comprising the curable resin composition according to any one of the above [18] to [22]. [27] An ink comprising the curable resin composition and the coloring agent according to any one of the above [18] to [22]. 323923 18 201247745 [28] An optical semiconductor package which is formed by the sealing material for an optical semiconductor according to the above [23]. (Effects of the Invention) According to the present invention, it is possible to obtain all properties of hardness, gas barrier properties, heat yellow resistance, light resistance, thermal shock resistance, and adhesion to a substrate, and to form them for use in an optical semiconductor. The organic polychlorination of the hardened material and the curable resin composition using the same can be satisfactorily balanced. According to the present invention, it is also possible to provide a sealing material for an optical semiconductor having the above characteristics, a wafer bonding material for an optical semiconductor, a coating material, a curable resin composition for nanoimprint printing, a material useful in the field of ink printing, and the like. An optical semiconductor package formed of a sealing material for an optical semiconductor. [Embodiment] Hereinafter, embodiments of the present invention (hereinafter referred to as "this embodiment") will be described in detail. However, the present invention is not limited to the following description, and various modifications can be made without departing from the spirit and scope of the invention. [Organic Polyoxane] The organopolyoxane of the present embodiment has a group of one or more unsaturated bonds in one molecule, and has a constituent unit represented by the following general formulae (1) to (3). (i) F1 and Μ (ii) F1 and Τ, 323923 19 201247745 (iii) Organopolyoxyalkylene of any combination of FI, Ml and Τ in FI, M1, T.

F Y—R2 (R1Si02/2 a X一 Μ Τ (F^SiOA) (R1Si03/2 ) w (2 (3 ) 上述通式(1)至(3)中,R1表示由:取代或未取代 之碳數1至10的烷基、取代或未取代之碳數3至的環 烷基、取代或未取代之芳基及取代或未取代之芳烷基所成 之群中選擇之任意者;R2表示碳數2 1 含不飽和鍵之 基;X表示碳數2至10之二價煙基;γ表示碳數2至1〇 之二價烴基d、b、e各自獨立地表示丨以上之整數。其 _,F1表示環狀有機聚矽氧烷之構成單位。 、 以人形態之有機聚錢燒,㈣紐之觀點而言, 3有任思之下述通式⑷至(6)所示之構 D2、D3之有機聚矽氧烷為佳。 < .D1 D 1 ·· ( Rl2Si〇2/2) · · · ( 4 ) X—· D 2 · ( R1SI〇2,2) · ·, 323923 20 201247745 D 3 (Rl2Si〇2/2) (6 ) 上述通式(4)至(6)中,Ri表示由:取代或未取代 之碳數1至10的烷基、取代或未取代之碳數3至1〇的環 烧基、取代或未取叙綠及取代或未取代之找基所成 之群中選擇之任意者;X表示碳數2至1〇之二價烴基。 其中,Dl、D2表示:環狀有機聚矽氧烷之構成單位, D3表示鏈狀有機聚矽氧烷之構成單位。 本實施形態之有機聚矽氧烷,宜為含有下述通式(?) 所示之構成單位S ’且該通式(7)所示之構成單位s之含 量,相對於上述通式(1)所示之構成單位F1之含量,係 滿足下述通式(II)之有機聚矽氧烷。 d/a ~0, 1 * ..............(II) 其中多含下述通式(7)所示之構成單位s時,在餾 除溶劑時或保存時會有SiH與不飽和鍵反應而膠體化之虞 慮,由製品之安定生產性及保存安定性之觀點而言,以滿 足上述通式(II)為佳。 (R1HSi02/2) b . · · · ( 7 ) 上述通式(7)中,R1表示由:取代或未取代之碳數1 至10的烷基、取代或未取代之碳數3至1〇的環烷基、取 代或未取代之芳基及取代或未取代之芳烷基所成之群中選 擇之任意者。 構成單位S表示環狀或鏈狀有機聚矽氧烷之構成單 323923 201247745 位。 此外,本實施形態之有機聚梦氧燒,由硬化物之硬度 之觀點而言,作為含有上述r2之構成單位者,係只含有上 述通式⑴所示之構成單位F1的有機聚魏烧為佳。此 乃由於’在只有構成單位F1時,可使硬化物之交聯密度變 尚。 又上述之「含有R2之構成單位」中,係含有R2之從 屬概念下之R21的構成單位,亦包含下述通式(8)至〇〇)。 亦即,上述之所謂「作為含有上述R2之構成單位者,係只 含上述通式⑴所示之構成單位F1」,意為「雖含有通式 (1)所不之構成單位Π,但並未含有含下述RZ1之構成單 位的通式(8)至(1〇)」。 又,本實施开> 態之有機聚梦氧烧,由含該有機聚矽氧 烷之硬化性樹脂組成物在低黏度下之操作性的觀點而言, 以含有上述通式(1)所示之構成單位F1及下述通式(8) 所示之構成単位F2之有機聚碎氧烧為佳。 此乃由於,四g此之SiH之一部分至其一半部分經二 官能之SiH所取代時,可以抑制矽氧烷之交聯構造的生 成,因此可使黏度減低。 Y—R21 p 2 : ( R12Si〇i,2) • · · ( 8 ) 上述通式(8)中,R表不由:取代或未取代之碳數1 至10的烷基、取代或未取代之碳數3至10的環烷基、取 323923 22 201247745 代或未取狀緑及取錢麵狀奸麵成 擇之任意者;1^表示丙咖氧基或甲基㈣醯氧基.= 示碳數2至10之二價烴基。其φ,土’ γ者 氧炫之構鮮位。 〇’F2表錢狀有機料 本實施形態之有機聚矽氧烷,以下述通式 _ 之環狀有機㈣氧炫,在其下述通式⑷以外之有^ 氧烧成分為1G0質量份時,再含有Q.丨至⑽f量 j 在其中含如下述通式(9)之構造,可使其硬化物之交 度增加,因此提高硬度及阻氣性。 ^ 下述通式(9)所示之環狀有機聚矽氧烷之含量,以 至90質量份為佳’ 5至80質量份更佳。 W^OIXIR2FY—R2 (R1Si02/2 a X Μ Τ (F^SiOA) (R1Si03/2 ) w (2 (3) In the above formula (1) to (3), R1 represents a substituted or unsubstituted carbon. Any one selected from the group consisting of an alkyl group having 1 to 10 alkyl groups, a substituted or unsubstituted carbon number 3 to a cycloalkyl group, a substituted or unsubstituted aryl group, and a substituted or unsubstituted aralkyl group; R2 represents The carbon number 2 1 contains a group of an unsaturated bond; X represents a divalent nicotine group having a carbon number of 2 to 10; and γ represents a divalent hydrocarbon group having a carbon number of 2 to 1 d, d, b, and e each independently represent an integer of 丨 or more. _, F1 represents a constituent unit of a cyclic organopolyoxane. In the form of a human form of organic poly-coin, (4) New Zealand, 3 has the following general formulas (4) to (6) It is preferable to form an organic polyoxane of D2 and D3. < .D1 D 1 ·· ( Rl2Si〇2/2) · · · ( 4 ) X—· D 2 · ( R1SI〇2, 2) · ·, 323923 20 201247745 D 3 (Rl2Si〇2/2) (6) In the above formulae (4) to (6), Ri represents a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, substituted or unsubstituted. a cycloalkyl group having 3 to 1 Å carbon, a substituted or unrecited green, and a substituted or unsubstituted base. Any one selected from the group; X represents a divalent hydrocarbon group having a carbon number of 2 to 1 Å, wherein D1 and D2 represent a constituent unit of a cyclic organopolysiloxane, and D3 represents a composition of a chain organopolysiloxane. The organopolysiloxane of the present embodiment is preferably a content of a constituent unit s represented by the following formula (?) and a constituent unit s represented by the formula (7), with respect to the above formula. (1) The content of the constituent unit F1 shown is an organic polyoxane of the following formula (II): d/a ~0, 1 * .............. (II) When the constituent unit s represented by the following formula (7) is contained in a large amount, there is a concern that SiH reacts with an unsaturated bond to colloidalize during storage of the solvent or during storage, and the product is stable in productivity. From the viewpoint of preserving stability, it is preferred to satisfy the above formula (II). (R1HSi02/2) b. In the above formula (7), R1 represents: substituted or unsubstituted Any one selected from the group consisting of a C 1 to 10 alkyl group, a substituted or unsubstituted C 3 to 1 fluorene cycloalkyl group, a substituted or unsubstituted aryl group, and a substituted or unsubstituted aralkyl group; Composition The position S represents a constitutive unit of a cyclic or chain-like organopolyoxyalkylene 323923 201247745. Further, the organic polyoxymethane of the present embodiment is a constituent unit containing the above r2 from the viewpoint of the hardness of the cured product. It is preferable that the organic polywei is contained only in the constituent unit F1 represented by the above formula (1). This is because the crosslinking density of the cured product can be improved when only the constituent unit F1 is formed. Further, the "constituting unit containing R2" includes a constituent unit of R21 in the subordinate concept of R2, and also includes the following general formulae (8) to 〇〇). In other words, the above-mentioned "constituent unit F1" represented by the above formula (1), which is a constituent unit containing the above-mentioned R2, means "although the constituent unit of the formula (1) is not contained, but The formulae (8) to (1〇) containing the constituent units of the following RZ1 are not contained. In addition, the organic polyoxylizing in the state of the present invention contains the above-mentioned general formula (1) from the viewpoint of the workability of the curable resin composition containing the organic polyoxyalkylene at a low viscosity. It is preferable that the constituent unit F1 and the organic polyacetal of the constituent F2 represented by the following formula (8) are formed. This is because, when one part of SiH is replaced by a difunctional SiH, it is possible to suppress the formation of a crosslinked structure of the oxane, thereby reducing the viscosity. Y—R21 p 2 : ( R12Si〇i, 2) • (8) In the above formula (8), R represents a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, substituted or unsubstituted. Any of the cycloalkyl groups having a carbon number of 3 to 10, 323923 22 201247745 generation or untaken green, and the face of the money; 1^ means propyloxy or methyl (tetra) decyloxy. A divalent hydrocarbon group having 2 to 10 carbon atoms. Its φ, soil ' γ octopus is a fresh position. 〇 'F2 钱 状 状 有机 有机 有机 F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F Further, the Q.丨 to (10)f amount j has a structure of the following formula (9), and the degree of crosslinking of the cured product can be increased, thereby improving hardness and gas barrier properties. The content of the cyclic organopolyoxane represented by the following formula (9) is preferably from 5 to 80 parts by mass, preferably from 90 to 80 parts by mass. W^OIXIR2

J 1 ο 1 RIsi— R • · · ( 9 ) 上述通式(9)中,R1表示由:取代或未取代之碳數i 至10的烷基、取代或未取代之碳數3至ίο的環烷基、取 代或未取代之芳基及取代或未取代之芳烷基所成之群中選 擇之任意者^ R21表示丙烯醯氧基或曱基丙烯醯氧基β χ表 示石厌數2至1〇之二價烴基。e表示1以上之整數。f表示 〇以上之整數表不3至20之整數.〇 同時,本實施形態之有機聚石夕氧烧,又以下述通式 (10)所示之化合物,在其有機聚矽氧烷成分為100質量 323923 201247745 份時,為含有0.01至1000質量份為佳。 在其中含通式(10)之化合物時,可對其硬化物賦予 柔軟性,因此可提高其财冷熱衝擊性。 下述通式(10)所示化合物之含量,以0.03至900 質量份為佳,0. 05至750質量份更佳。J 1 ο 1 RIsi— R • (9) In the above formula (9), R1 represents a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted carbon number of 3 to ίο Any one selected from the group consisting of a cycloalkyl group, a substituted or unsubstituted aryl group, and a substituted or unsubstituted aralkyl group; R21 represents a propylene fluorenyloxy group or a fluorenyl propylene oxy group β χ represents a stone anastomosis 2 a divalent hydrocarbon group to 1 Torr. e represents an integer of 1 or more. f represents an integer of 3 to 20 in an integer of 〇. In addition, the organic polyoxanthene of the present embodiment is a compound represented by the following formula (10), and the organopolyoxane component thereof is 100 parts 323923 201247745 parts, preferably 0.01 to 1000 parts by mass. When the compound of the formula (10) is contained therein, flexibility can be imparted to the cured product, so that the cold thermal shock resistance can be improved. The content of the compound represented by the following formula (10) is preferably from 0.03 to 900 parts by mass, more preferably from 0.05 to 750 parts by mass.

SiO-(SiO)i-Si-R1 R1 R1 •(10) 通式(10)中,R1表示由:取代或未取代之碳數1至 10的烷基、取代或未取代之碳數3至10的環烷基、取代 或未取代之芳基及取代或未取代之芳烷基所成之群中選擇 之任意者。R21表示丙烯醯氧基或甲基丙烯醯氧基。X表示 碳數2至10之二價烴基。g表示1以上之整數;h表示0 以上之整數。i表示0至20之整數。 又,本實施形態之有機聚矽氧烷,由硬度、阻氣性及 耐冷熱衝擊性平衡之觀點而言,以含上述通式(9)所示之 環狀有機聚矽氧烷及上述通式(10)所示之化合物,且其 以基質輔助游離化飛行時間型質譜分析法測定時得到之峰 強度以下述通式(III)所計算所得,上述通式(10)所示 之化合物含量〔WB〕相對於上述通式(9 )所示之化合物含 量〔WA〕之比:〔WB〕/〔 WA〕之值,為0. 1以上20. 0以下 323923 24 201247745 為佳’ 0.3以上18以下更佳,〇 5以上15以下 [數2] 更佳。 _/間-符合通式(⑻構造之質量與納質 的合計質量所相當之峰的強度/符合通式⑷構造之里質量 與納質量23之合計質量所相當之蜂的強度··· ·之質1 CIII) · · · · 其中如則所述,R1表示由··取代或未取代之 至10的烧基、取代或未取代之碳數3至1〇的環 =之芳基及取代或未取代之織所成之= ^例,可舉如:甲基、乙基、丙基、丁基、異丁基、 =二丁基、戊基、新戊基、己基、環戊基、環己基 等之,數1至10之烧基;環内基、環丁基、環戊基、環= 基、環辛基、環癸基等之碳數3至1()之環燒基;苯灵、甲 笨基、二甲笨基、異丙苯基及三甲苯基等之芳基;^基、 笨乙基及苯兩基等之芳烧基;或此等基之碳原子上鍵:之 風原子的-部分或全部經經基、氰基及㈣原子等取代之 說丙基、氰乙基、卜氯丙基及3, 3, 3_三氣丙基等。 R1方面,由耐光性之觀點而言,以碳數丨至1〇之烷基 為佳。 佳 匕同時’R1’由本實施形態之有機聚石夕氧烧及硬化性樹 月曰組成物之耐熱黃變性、料性之觀點而言,以曱基為更 如前所述,R2表示碳數2至1G含不飽和鍵之基 323923 25 201247745 其例可舉如:乙烯基、烯丙基、異丙烯基、3-丁烯基、 曱基丙稀基、4-戊稀基、5-己稀基、6-庚婦基、7-辛婦 基、8-壬烯基、9-癸烯基等之不飽和鏈烴基;環己烯基、 降莰烯基等之不飽和環烴基;乙烯醚基、烯丙醚基等含醚 鍵之不飽和烴基;環己烯基等之環不飽和烴基;丙烯醯氧 基、曱基丙烯醯氧基等之不飽和脂肪酸酯基。 其中’由在形成後述之硬化性樹脂組成物時之反應 性’即其熱硬化或光硬化易於進行而快速進行反應之觀點 而言’以下述通式(12)所示之丙烯醯氧基、或下述通式 (13)所示之甲基丙烯醯氧基(此等合併稱為(曱基)丙烯 酿氧基)為佳。 -o-c-c=ch2 0 · · -(12) -〇-c-c=ch2 O CH3 r Λ Ο \ ό · · · ( 1 3 ) 如前所述’ X表示碳數2至10之二價烴基。 其例可舉如:-(CH2)2-、-(CH2)3-、-(CH2)4-、-(CH2)5_、 -(CH2)6---(CH2)8---(CH2)i〇---CH(CH3)CH2- > -C(CH3)2- 等,特別是由-(CH2)2-、-(CH2)3-、-(CH2)4-之原料易於取 得及反應性,即其熱硬化或光硬化易於進行而快速反應之 觀點而言較佳。 如前所述,Y表示碳數2至10之二價烴基。 其例可舉如:-(ch2)2-、-(ch2)3-、-(ch2)4~、-(CH2)5-、 -(CH2)6-、-(ch2)8---(CH2)i〇---CH(CH3)CH2〜、c(CH3)r 323923 26 201247745 等,特別是由,2)3_、—(CL之原料易於取 即其熱硬化或光硬化易於進行而快速反應之 觀點而言較佳。 如上所述,本實施形態之 成單位巾,係具有 H其上达之構 (i) F1 及 m、 (ii) F1 及 τ、 (i i i ) Fl、mi 及 τ 之任意組合的構成單位。 本實施形態之有機窄 中之a h… 氡烷,以上述通式⑴至(3) 中之a b e缺下料式(1)為佳。 O.l^a/ (b+c) 上述通式(1)之a/ 、’(n ^ ^ fr ^ ^ rs JU C)之值,由使用後述之有機 而 而 ^ 樹脂組成物之硬化物的硬度之觀點 吕’以0· 1以上為佳,而山 叩由耐熱黃變性及耐光性之觀點 吕,以5以下為佳。 汽文丨土久·» 又’由此觀點而今,h * a °較佳之範圍為0. 12以上4以下’ 更佳之範圍為0 · 15以上3 ^ .0从下, 本實施形態之有機聚功笔 化人物。 饵象矽氡烷之具體例,可舉如下速之 323923 27 201247745SiO-(SiO)i-Si-R1 R1 R1 • (10) In the formula (10), R1 represents a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted carbon number of 3 to Any one selected from the group consisting of a cycloalkyl group, a substituted or unsubstituted aryl group, and a substituted or unsubstituted aralkyl group. R21 represents an acryloxy group or a methacryloxy group. X represents a divalent hydrocarbon group having 2 to 10 carbon atoms. g represents an integer of 1 or more; h represents an integer of 0 or more. i represents an integer from 0 to 20. Further, the organopolysiloxane of the present embodiment contains the cyclic organopolyoxane represented by the above formula (9) and the above-mentioned viewpoint from the viewpoint of balance between hardness, gas barrier properties and cold shock resistance. a compound represented by the formula (10), and the peak intensity obtained by the matrix-assisted free time-of-flight mass spectrometry is calculated by the following formula (III), and the compound represented by the above formula (10) [WB] with respect to the content of the compound represented by the above formula (9) [WA]: the value of [WB] / [WA], which is 0.1 or more and 20. 0 or less 323923 24 201247745 is preferably '0.3 or more 18 The following is better, 〇 5 or more and 15 or less [number 2] is better. _ / between - the intensity of the peak corresponding to the sum of the mass of the (8) structure and the mass of the nano-mass / the strength of the bee corresponding to the total mass of the mass of the general formula (4) and the nano-mass 23 ··· 1 CIII) · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · Or unsubstituted woven fabrics = ^, for example, methyl, ethyl, propyl, butyl, isobutyl, = dibutyl, pentyl, neopentyl, hexyl, cyclopentyl, a cyclohexyl group or the like, a calcining group having from 1 to 10; a cycloalkyl group having a carbon number of 3 to 1 () in the ring, a cyclobutyl group, a cyclopentyl group, a ring = a group, a cyclooctyl group, a cyclodecyl group or the like; An aryl group such as a phenyl group, a phenyl group, a dimethyl group, a cumyl group or a trimethylphenyl group; an aryl group such as a phenyl group, a phenanthrene group or a phenyl group; or a bond on a carbon atom of such a group; A propyl group, a cyanoethyl group, a chloropropyl group, a 3, 3, 3_trimethyl propyl group, etc., which are partially or wholly substituted by a radical, a cyano group and a (iv) atom. In the case of R1, from the viewpoint of light resistance, an alkyl group having a carbon number of 丨 to 1 Å is preferred.匕 匕 simultaneous 'R1' is from the viewpoint of the heat-resistant yellowing and the material properties of the composition of the organic polysulfide and the curable tree scorpion of the present embodiment, and the thiol group is more as described above, and R2 represents the carbon number. 2 to 1G group containing an unsaturated bond 323923 25 201247745 Examples thereof include a vinyl group, an allyl group, an isopropenyl group, a 3-butenyl group, a mercaptopropyl group, a 4-pentyl group, and a 5-hexyl group. An unsaturated chain hydrocarbon group such as a dilute group, a 6-heptyl group, a 7-menthyl group, an 8-decenyl group or a 9-nonenyl group; an unsaturated cyclic hydrocarbon group such as a cyclohexenyl group or a nortenyl group; An unsaturated hydrocarbon group containing an ether bond such as an ether group or an allyl ether group; a cyclic unsaturated hydrocarbon group such as a cyclohexenyl group; and an unsaturated fatty acid ester group such as an acryloxy group or a mercapto propyleneoxy group. In the 'reactivity of forming a curable resin composition to be described later', that is, the thermal curing or photohardening is easy to carry out and the reaction proceeds rapidly, and the propylene oxy group represented by the following formula (12) Or a methacryloxy group represented by the following formula (13) (these are collectively referred to as (fluorenyl) propylene oxy group). -o-c-c=ch2 0 · · -(12) -〇-c-c=ch2 O CH3 r Λ Ο \ ό · · · (1 3 ) As described above, 'X' represents a divalent hydrocarbon group having 2 to 10 carbon atoms. Examples thereof include: -(CH2)2-, -(CH2)3-, -(CH2)4-, -(CH2)5_, -(CH2)6---(CH2)8---(CH2 ) i〇---CH(CH3)CH2- > -C(CH3)2-, etc., especially from -(CH2)2-, -(CH2)3-, -(CH2)4- It is preferred from the viewpoint of reactivity, that is, thermosetting or photohardening is easy to carry out and rapid reaction. As described above, Y represents a divalent hydrocarbon group having 2 to 10 carbon atoms. Examples thereof include: -(ch2)2-, -(ch2)3-, -(ch2)4~, -(CH2)5-, -(CH2)6-, -(ch2)8---( CH2)i〇---CH(CH3)CH2~, c(CH3)r 323923 26 201247745, etc., especially by 2) 3_, - (CL raw materials are easy to take, ie their thermal hardening or photohardening is easy and fast It is preferable from the viewpoint of the reaction. As described above, the united towel of the present embodiment has the structures (i) F1 and m, (ii) F1 and τ, (iii) Fl, mi and τ. The constituent unit of any combination of the organic narrow medium ah... decane in the present embodiment is preferably the abe-deficient formula (1) in the above formulas (1) to (3). Ol^a/ (b+c The value of a/ and '(n ^ ^ fr ^ ^ rs JU C) of the above formula (1) is determined by using the organic matter described later and the hardness of the cured product of the resin composition. The above is better, and the hawthorn is made of heat-resistant yellowing and light-resistance. It is preferably 5 or less. The steam-soil is long and long. » Again, from this point of view, the range of h * a ° is preferably 0.12 or more. 4 or less 'better range is 0 · 15 or more 3 ^ . 0 from below, organic polymerization of this embodiment Thereof. Specific examples of the alkoxy radon bait as silicon can be cited as the speed of 27 201 247 745 323 923

323923 28 201247745323923 28 201247745

(16) 323923 29 201247745(16) 323923 29 201247745

323923 30 201247745323923 30 201247745

•(19) 323923 31 201247745•(19) 323923 31 201247745

•••(21) 323923 32 201247745•••(21) 323923 32 201247745

323923 33 201247745323923 33 201247745

323923 34 201247745 R1 λ R1 R1 R1 R1 R1 R1 〆>,323923 34 201247745 R1 λ R1 R1 R1 R1 R1 R1 〆>,

(H2令 ^R1 R1 (Hza1-9 PH2 -Si—R1 R1 R1 R1 R1 R1 R1 R1 :1 R1 〇R1 R1 \/ / \/,yTys\ R1 ,R1 "R1 (2(H2) ^R1 R1 (Hza1-9 PH2 -Si-R1 R1 R1 R1 R1 R1 R1 R1 :1 R1 〇R1 R1 \/ / \/,yTys\ R1 ,R1 "R1 (2

R2 I YR2 I Y

323923 35 (26) 201247745323923 35 (26) 201247745

323923 36 201247745323923 36 201247745

323923 37 201247745323923 37 201247745

• 奉 •(3 1 上述通式(13)至(31)中,m表示〇至2〇〇〇之整數; η表示0至20之整數;r表示〇至2〇之整數。 本實施形態之有機聚石夕氧烧,由耐光性之觀點而言, 以上述R為甲基者為佳;由反應性之觀點而言,以上述^ 為丙_氧基或甲基丙_氧基者為佳;由原料之取得容 :::點而言,以上述Y為侧士_4★陳 本實施形態之有機聚外燒,其上述通式⑴ 係含㈣醯氧基㈣丙歸酿氧 氧基所〜酿 J S能基备罝,由使用後述之有機 38 201247745 聚矽氧烧的硬化性樹脂組成物之硬化物的耐熱黃變性、耐 光性之觀點而言以210g/mol以上為佳;由硬度之觀點而言 以2000g/mol以下為佳。由此觀點而言,又以丙烯醢氧基 或曱基丙烯醯氧基的官能基當量在250g/mol以上 1500g/mol以下較佳,3〇〇g/mol以上l〇〇〇g/mol以下更佳。 又’該丙烯醯氧基或曱基丙烯醯氧基的官能基當量可 依後述之實施例中所記載之方法測定。 本實施形態之有機聚矽氧烷,其重量平均分子量,由 使用後述之有機聚矽氧烷的硬化性樹脂組成物之硬化物的 耐冷熱衝擊性之觀點而言,以7〇〇以上為佳;由硬度之觀 點而言’以5000000以下為佳,1〇〇〇以上3〇〇〇〇〇〇以下更 佳,1500以上loooooQ以下又更佳。 又,本實施形態之有機聚矽氧烷,由有機聚矽氧烷之 f°C下的黏度’在螢光體及著色劑之分散安定性之觀點而 。、5〇mPa · s以上為佳;由作業性之觀點而言,以 lOOOOOOmPa . 500000mPa · 80mPa · s 以上 s以下為佳。黏度又以8〇mpa• (3) In the above general formulae (13) to (31), m represents an integer of 〇 to 2〇〇〇; η represents an integer of 0 to 20; and r represents an integer of 〇 to 2〇. In the case of light-resistance, it is preferred that R is a methyl group from the viewpoint of light resistance; and from the viewpoint of reactivity, those in which the above-mentioned is a propyloxy group or a methyl propyloxy group are Good; from the raw material::: point, the above Y is the side of the _4 ★ Chen Ben embodiment of the organic poly-exotherm, the above formula (1) contains (four) decyloxy (four) a glycerol It is preferable that it is 210 g/mol or more from the viewpoint of heat-resistant yellowing and light resistance of the cured product of the curable resin composition of the organic condensate resin composition of Organic 38 201247745, which will be described later; From the viewpoint of hardness, it is preferably 2000 g/mol or less. From this viewpoint, the functional group equivalent of the acryloxy group or the mercaptopropenyloxy group is preferably 250 g/mol or more and 1500 g/mol or less, and 3 Å. 〇g/mol or more l〇〇〇g/mol or less is more preferable. Further, the functional group equivalent of the propylene methoxy group or the fluorenyl propylene methoxy group may be according to the examples described later. The method for measuring the weight average molecular weight of the organopolysiloxane of the present embodiment is based on the thermal shock resistance of the cured product of the curable resin composition of the organopolysiloxane described later. 7 〇〇 or more is preferable; from the viewpoint of hardness, '5,000,000 or less is preferable, 1 〇〇〇 or more and 3 〇〇〇〇〇〇 or less is more preferable, and 1500 or more of loooooQ is more preferable. Further, this embodiment is Organic polyoxyalkylene, from the viewpoint of the viscosity of the organic polyoxyalkylene at f ° C from the viewpoint of the dispersion stability of the phosphor and the coloring agent, preferably 5 〇 mPa · s or more; In terms of 1500 mPa.

以下更佳。The following is better.

,可以後 〔有機聚⑪氧⑨之製造方法〕 s 以上 10000OmPa · s, after the [organic poly 11 oxygen 9 manufacturing method] s or more 10000OmPa · s

’原千之氫原子的氫化聚矽氧烷(a2) ’係將下述通式(11)所 靈夕a亡1個以上直接鍵 U2)、 39 201247745 i) 具有2個以上直接鍵結於矽原子的乙烯基之含乙烯 基的有機聚矽氧烷(bl)或具有2個以上直接鍵結於矽原 子的羥基之聚矽氧烷(b2),以及 ii) l分子中具有2個以上不飽和鍵的有機化合物(c) 之加成反應, 在石夕氩化反應催化劑(d)之存在下進行而製造。'Hydrogenated polyoxane (a2) of the hydrogen atom of the original thousand is a direct bond U2), 39 201247745 i) having two or more direct bonds to the following formula (11) a vinyl group-containing vinyl polyorganosiloxane (b1) of a halogen atom or a polyoxyalkylene (b2) having two or more hydroxyl groups directly bonded to a halogen atom, and ii) having two or more molecules The addition reaction of the unsaturated compound (c) of the unsaturated bond is carried out in the presence of a catalyst of the argon argonation reaction (d).

上述通式(11)中之R1表示由:取代或未取代之碳數 1至10的烷基、取代或未取代之碳數3至10的環烷基、 取代或未取代之芳基及取代或未取代之芳烷基所成之群中 選擇之任意者;j表示1以上之整數;k表示0以上之整數; j+k表示3至20之整數。 上述通式(11)所示之1分子中至少具有1個SiH基 之氫化聚矽氧烷(al)之例,可舉如:以下式(32)、(33) 或(34)所示之化合物。 201247745R1 in the above formula (11) represents a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, a substituted or unsubstituted aryl group and a substitution. Or any one selected from the group consisting of unsubstituted aralkyl groups; j represents an integer of 1 or more; k represents an integer of 0 or more; and j+k represents an integer of 3 to 20. An example of the hydrogenated polyoxyalkylene (al) having at least one SiH group in one molecule represented by the above formula (11) is as shown in the following formula (32), (33) or (34). Compound. 201247745

3 33 3

CH—sio—H 3 4 3 上述之ιι化聚錢燒(al),可為2種以上之粗人 亦可為單獨1種。 σ 切有”1個以上直接鍵結於矽原子之氫原子的1^ 聚石夕氧烧U2)之例’可舉如:下述式(35)、(36)、⑶ 或(38)所示之化合物。 ΗCH-sio-H 3 4 3 The above-mentioned ιι化聚钱烧(al) may be two or more kinds of crude persons or one single type. σ is an example of "1 or more of the polysulfide U2 which is directly bonded to a hydrogen atom of a halogen atom", and may be as follows: (35), (36), (3) or (38) The compound shown.

I H 3C—Si—CH3 ch3 0 ch3 Η* —Si一Ο_Si—Ο—Si—ΗI H 3C—Si—CH3 ch3 0 ch3 Η* —Si—Ο—Si—Ο—Si—Η

I I I 3 5 ch3 ch3 ch3 ch3 ch3I I I 3 5 ch3 ch3 ch3 ch3 ch3

H—Si—0—Si—H 3 6)H—Si—0—Si—H 3 6)

I I ch3 ch3 323923 41 201247745I I ch3 ch3 323923 41 201247745

H H3I—HH3 c—si——c H3IH3 c o c1-1-1-Η——s'——ο——s——ο——s——H I I I c oic Η H - Η H clsi丨 c 7 3H H3I—HH3 c—si —c H3IH3 c o c1-1-1-Η——s′——ο——s——ο——s——H I I I c oic Η H - Η H clsi丨 c 7 3

_3 c LH3 H——silc I 3C H 8 、有1個以上直接鍵結於矽原子的氫原子之氫化聚矽 氧烷方面,將上述(al)與上述(a2)以任意之比例組合, 即可以調節其硬化物之硬度、阻氣性及本實施形態之含有 機聚發氧烷的硬化性樹脂組成物之黏度。 在増多上述(al )之比例時,可以提高硬化物之硬度、 阻氣性,在增多上述(a2)之比例時,可以降低本實施形 態之含有機聚矽氧烷的硬化性樹脂組成物之黏度而使操作 谷易。 具有2個以上直接鍵結於上述矽原子的乙烯基之含乙 稀基的有機聚矽氧烷(bl)可舉如以下之例。例如: CH2=CHSi(Me)2〇-Si(Me)2CH=CH2、 CH2=CHSi(Me)2〇-Si(Me)2〇-Si(Me)2CH=CH2、 323923 42 201247745 CH2=CHSi(Me)2〇-(Si(Me)2〇)2-Si(Me)2CH=CH2、 CH2=CHSi(Me)2〇-(Si(Me)2〇)3-Si(Me)2CH=CH2、 CH2=CHSi(Me)2〇-(Si(Me)2〇)6-Si(Me)2CH=CH2、 CH2=CHSi (Me)2〇-(Si(Me)2〇)8-Si(Me)2CH=CH2、 CH2=CHSi(Me)2〇-(Si(Me)2〇)"-Si(Me)2CH=CH2、 CH2=CHSi(Me)2〇-(Si(Me)2〇)i2-Si(Me)2CH=CH2 > CKHSi (Me)2〇-(Si (Me)2〇)2〇-Si (Me)2CH=CH2、 CH2=CHCH2Si (Me)2〇-Si (Me)2CH2CH=CH2 及 CH2=CHCH2Si(Me)2〇-Si(Me)2〇-Si(Me)2CH2CH=CH2。 上述式中,Me表示曱基。 具有2個以上直接鍵結於矽原子的乙烯基之含乙婦基 的有機聚矽氧烷(bl),可為2種以上之組合,亦可為單獨 1種。 具有2個以上直接鍵結於上述矽原子的羥基之聚石夕氧 烷(b2)可舉如以下之例。其例如: H〇*~Si(Me)2〇-Si(Me)2-〇H、 H〇-Si(Me)2〇-Si(Me)2〇-Si(Me)2-OH、 -Si (Me)2〇-(Si (Me)2〇)2_Si (Me)2-0H、 H〇-Si(Me)2〇-(Si(Me)2〇)3-Si(Me)2-〇H、 H〇-Si(Me)2〇-(Si(Me)2〇)6-Si(Me)2-〇H、 H〇-Si (Me)2〇-(Si (Me)2〇)8_Si (Me)2-〇H、 H〇-Si(Me)2〇-(Si(Me)2〇)"-Si(Me)2-〇H、 H〇-Si(Me)2〇-(Si(Me)2〇)i2-Si(Me)2-〇H、 H〇-Si(Me)2〇-(Si(Me)2〇)2〇-Si(Me)2-〇H。 323923 43 201247745 上述式中,Me表示曱基。 具有2個以上直接鍵結於上述㈣子_基之聚石夕氧 烧⑽,可為2種以上之組合,亦可為單獨n 上述1分子中具有2個以上不飽和鍵的有機化合物 (c) ’係如下述通式(39)所示。 ch2=ch—r3-r2 ...(39 2至1〇含不飽和鍵 上述通式(39)中之R2表示碳數 之基,R表示碳數1至8之二價煙基。 。如此之下,可使矽氫 R3之碳數’特別以1至4為佳 化反應確實地進行。 另-方面’ R3在4以下時,可以抑制其彿點,因此可 將由反應溶液剩餘之上述(c)簡單地餾除。 上述1刀子中具有2個以上不飽和鍵的有機化合物 (c) ’可為2種以上之組合,亦可為單獨丨種。 在本實施形態之有機聚矽氧烷之製造步驟中,上述i 分子中具有2個以上不飽和鍵的有機化合物(c)之使用量 (莫耳量),由可在不殘留SiH基下反應至最後之觀點而 吕,相對於:將源自上述通式(u)所示之氫化聚矽氧烷 (al)之SiH基的莫耳量與依所需而添加之具有丨個以上 直接鍵結於上述矽原子之氫原子的源自氫化聚矽氧烷(a2) 之SiH基的莫耳量之和、與具有2個以上直接鍵結於上述 石夕原子的乙烯基之含乙烯基的有機聚矽氧烷(bl)之乙烯 323923 44 201247745 基的莫耳量或具有2個以上直接鍵結於矽原子的經基之聚 石夕氧烧(b2)的經基之莫耳量之差,办即,相對於〔(al) 之SiH基之莫耳量+ (a2)之siH基之莫界量〕—〔(匕1) 之乙烯基之莫耳量或(b2)之羥基之莫耳量〕,以過剩地添 加為佳。_3 c LH3 H—silc I 3C H 8 , having one or more hydrogenated polyoxyalkylenes directly bonded to a hydrogen atom of a halogen atom, combining the above (al) with the above (a2) in an arbitrary ratio, that is, The hardness and gas barrier properties of the cured product and the viscosity of the curable resin composition containing the organic polyoxyalkylene of the present embodiment can be adjusted. When the ratio of the above (al) is increased, the hardness and gas barrier properties of the cured product can be increased, and when the ratio of the above (a2) is increased, the curable resin composition containing the organopolysiloxane of the present embodiment can be reduced. The viscosity makes the operation easy. The organic polyfluorene oxide (bl) having two or more ethylene groups directly bonded to the above-mentioned fluorene atom may be exemplified below. For example: CH2=CHSi(Me)2〇-Si(Me)2CH=CH2, CH2=CHSi(Me)2〇-Si(Me)2〇-Si(Me)2CH=CH2, 323923 42 201247745 CH2=CHSi( Me)2〇-(Si(Me)2〇)2-Si(Me)2CH=CH2, CH2=CHSi(Me)2〇-(Si(Me)2〇)3-Si(Me)2CH=CH2 CH2=CHSi(Me)2〇-(Si(Me)2〇)6-Si(Me)2CH=CH2, CH2=CHSi(Me)2〇-(Si(Me)2〇)8-Si(Me) 2CH=CH2, CH2=CHSi(Me)2〇-(Si(Me)2〇)"-Si(Me)2CH=CH2, CH2=CHSi(Me)2〇-(Si(Me)2〇)i2 -Si(Me)2CH=CH2 > CKHSi (Me)2〇-(Si(Me)2〇)2〇-Si (Me)2CH=CH2, CH2=CHCH2Si (Me)2〇-Si (Me)2CH2CH =CH2 and CH2=CHCH2Si(Me)2〇-Si(Me)2〇-Si(Me)2CH2CH=CH2. In the above formula, Me represents a fluorenyl group. The organopolyoxane (bl) having two or more vinyl groups directly bonded to a ruthenium atom may be used alone or in combination of two or more kinds. The polyoxanene (b2) having two or more hydroxyl groups directly bonded to the above-mentioned ruthenium atom can be exemplified as follows. For example: H〇*~Si(Me)2〇-Si(Me)2-〇H, H〇-Si(Me)2〇-Si(Me)2〇-Si(Me)2-OH, -Si (Me)2〇-(Si(Me)2〇)2_Si(Me)2-0H, H〇-Si(Me)2〇-(Si(Me)2〇)3-Si(Me)2-〇H , H〇-Si(Me)2〇-(Si(Me)2〇)6-Si(Me)2-〇H, H〇-Si(Me)2〇-(Si(Me)2〇)8_Si ( Me) 2-〇H, H〇-Si(Me)2〇-(Si(Me)2〇)"-Si(Me)2-〇H, H〇-Si(Me)2〇-(Si( Me) 2〇) i2-Si(Me)2-〇H, H〇-Si(Me)2〇-(Si(Me)2〇)2〇-Si(Me)2-〇H. 323923 43 201247745 In the above formula, Me represents a fluorenyl group. There may be two or more combinations of the above-mentioned (four) sub-groups, and may be a combination of two or more kinds, or may be an organic compound having two or more unsaturated bonds in the above one molecule. ) ' is as shown in the following formula (39). Ch2=ch—r3-r2 (39 2 to 1〇 contains an unsaturated bond. In the above formula (39), R 2 represents a carbon number group, and R represents a divalent nicotine group having 1 to 8 carbon atoms. In the following, the carbon number of the hydrogen group R3 can be surely carried out in a particularly favorable manner by 1 to 4. In another aspect, when R3 is 4 or less, the point of the Buddha can be suppressed, so that the above-mentioned reaction solution can be left ( c) The organic compound (c) ' having two or more unsaturated bonds in the above-mentioned one knife may be a combination of two or more kinds, or may be a single species. The organic polyoxane of the present embodiment. In the production step, the amount of the organic compound (c) having two or more unsaturated bonds in the i molecule (mole amount) is determined by reacting to the last point without leaving the SiH group, with respect to: a molar amount of a SiH group derived from the hydrogenated polyoxyalkylene (al) represented by the above formula (u) and a source of more than one or more hydrogen atoms directly bonded to the above-mentioned helium atom The sum of the molar amount of the SiH group of the hydrogenated polyoxyalkylene (a2) and the vinyl group having two or more directly bonded to the above-mentioned stone atom Vinyl organopolyoxyalkylene (bl) ethylene 323923 44 201247745 base molar amount or having more than 2 groups of fluorene (b2) based on the ruthenium atom directly bonded to the ruthenium atom The difference between the quantities, ie, the molar amount of the SiH group of ((al) SiH base + (a2)), the molar amount of vinyl of ((匕1) or (b2) The molar amount of the hydroxyl group is preferably added in excess.

具體言之,即以〔1分子中具有2個以上不飽和鍵的 有機化合物(c)之莫耳量〕/〔(源自(al)、(a2)之SiH 基之莫耳量)_(源自(bl)之乙埽基之莫耳·量或源自(b2) 之經基之莫耳量)〕=1.2至3.0為佳。 上述矽氫化反應催化劑並無特別之限定,已往 所知之物種均可使用。 其例如.鉑黑、氯化銘、氯鉑酸、氯鉑酸與一元醇反 應之生成物、氯鉑酸與烯烴類之錯合物、雙_乙醯乙酸鉑等 ^系催㈣;_催化劑 '錢系催化劑等的銘系催化劑 从外之鉑族金屬系催化劑。 (d)’可為2種以上之組合’亦可 矽氫化反應催化劑 為單獨1種。 矽氫化反應催化劑( 於將通式(11 )所示之& 之量並無特別之限定,相對 1個以上直接鍵結於聚矽氧烷(al)及依所需再含Specifically, it is [the molar amount of the organic compound (c) having two or more unsaturated bonds in one molecule] / [(the molar amount of the SiH group derived from (al), (a2))_( The molar amount of the ethyl group derived from (bl) or the molar amount derived from the base of (b2) is preferably 1.2 to 3.0. The above-mentioned hydrazine hydrogenation catalyst is not particularly limited, and any of the known species can be used. For example, platinum black, chlorinated acid, chloroplatinic acid, a product of reaction of chloroplatinic acid with a monohydric alcohol, a complex of chloroplatinic acid and an olefin, a platinum bis(acetonitrile) acetate, etc. (4); 'Monetary catalysts, etc., are catalysts based on platinum group metal catalysts. (d)' may be a combination of two or more', or the hydrogenation catalyst may be used alone. The hydrazine hydrogenation catalyst (the amount of & shown in the formula (11) is not particularly limited, and is directly bonded to the polyoxyalkylene (al) and the re-containing content as needed.

Ca2)、與〇具有2個^原子之氫原子的氫化聚矽氧烷 含乙烯基的有機聚矽&amp;以上直接鍵結於矽原子的乙埽基之 於石夕原子的羥基之聚$= _bl)、或具有2個以上直接鍵結 個以上不飽和鍵的有_ = (b2)及ii) 1分子中具有2 3瑪;化合物r 323923 〈 C )’經過加成反應所得到 45 201247745 之 生成物的有機聚石夕氧燒之重量,以〇 〇1至⑽綱為佳。 上述石夕氫化反應催化劑⑷之量,由可充分得到直 添加效果之觀‘義mGlppnm上為佳;由成本之觀 點而言,以1 OOppm以下為佳。 、、同時’錢化反應催化劑⑷,亦可在加成反應之後 以活性氧化鋁及活性碳等吸附材去除。 由耐熱黃變性、耐光性之觀點而言,後述石夕氮化反應 催化劑⑷之量,以相對於_質量份之以上述通式(ιι) 所示之氩化㈣魏⑻及依所需再含丨伽上直接鍵 結於石夕原子之氫原子的氫化㈣氧燒(a2)、幻)且有2 個以上直接鍵結料原子的乙稀基之含乙烯基的有機聚石夕 氧烧(bl)、或具有2個以上直接鍵結於發原子㈣基之聚 石夕氧烧㈤)及ϋ) 1分子+具上减和鍵的有 機化合物(C)經過加成反應所得到之生成物,即有機聚矽 氧烷’以0.001質量份以下為佳。 上述硬化性樹脂組成物中之矽氫化反應催化劑(d) 之量,可經由分析後述之硬化性樹脂組成物進行測定。 本實施形態之有機聚矽氧烷的製造步驟中之上述加 成反應’一般可在室溫至1〇〇。(:下進行反應。 上述R2為(曱基)丙烯醯氧基時,由於(甲基)丙烯醯氧 基在高溫下有易於反應而膠體化之可能性,其反應溫度以 4〇°C至7〇°c為佳。 上述加成反應,亦可依所需在溶劑中進行。 §亥溶劑之例,可使用如:曱苯及二曱苯等之芳族系溶 323923 46 201247745 劑,己烷及辛烷等之脂族系溶劑;甲乙酮及甲基異丁酮等 之酮系溶劑,乙酸乙酯及乙酸異丁酯等之酯系溶劑,·二異 丙醚、1,4-二噁烷、二乙醚、四氫呋喃、乙二醇二甲醚、 乙二醇二乙醚及丙二醇單甲醚乙酸酯等之醚系溶劑;以及 異丙醇等之醇系溶劑;或此等之混合溶劑。 加成反應中之環境,可在空氣中、非活性氣體中之任 意者。在所得到之有機氫化聚矽氧烷之著色少之點方面, 以在氮、氬及氦等之非活性氣體中為佳,上述R2為(甲基) 丙烯醯氧基時,為防止(甲基)丙烯醢氧基之聚合反應之目 的亦可再導入少量之氧。 上述R2為(甲基)丙烯醯氧基時,以防止(甲基)丙烯醯 氧基之聚合反應之目的,以預先在反應系巾添加啡喧唤、 受阻紛系化合物、胺系化合物及_化合物等之阻聚劑者 為佳。該阻聚劑之種類及量,以不會因料之添加而妨礙 石夕氫化反應之進行’如可防止(甲基)丙埽醯氧基,亦即丙 稀醯氧基或甲基丙烯醯氧基之聚合反應者即可,並無特別 之限定。 ‘ 在加成反應、終了之後,該反應混合物亦可再以水洗或 活性碳處理等-般之方法去除加成反應催化劑。在使用剩 餘之1分子中具有2個以上不飽和鍵之有機化合物(c)及 溶劑時,可在加熱及/或減壓下餾除,即可得到具有上述通 式(1)至(3)所示之構成單位F1、Μ1、τ中的 ⑴F1及Μ卜 (ii) F1 及 Τ、 323923 47 201247745 (iii) FI 、 Ml 及 Τ 之任意組合的構成單位之有機聚矽氧烷。 在本實施形態之有機聚石夕氧燒的製 調製下述反缝,職在該反缝巾加 +,可事先 劑⑷進行上述之加成反應—次合成 ^化反應催化 包含上述氫化料纽(al)及依所反應液係 氧坑⑽'與含上述乙稀基之有機聚發氣心:二 分子中具有2個以上不飽和鍵的有機化合物且 有2個以上直接鍵結於上述石夕原子的經茂 〆/、八 及1分子中具有2個以上不飽和鍵的有機化合 此外’本實施形態之有機聚矽氧烷的製:步驟C中之上 述加成反應,可依序實施第1階段與第2階段,該第工階 段係:預先調製其中含上述氫化聚矽氧烷(al)、依所需的 上述氫化聚石夕氧烧(a2)及1分子中具有2個以上不飽和 鍵的有機化合物(c)之反應液’再於該反應液中添加破氮 化反應催化劑(d) ’使生成上述氫化聚;e夕氧燒(a〗&gt; #所 需的上述氫化聚矽氧烷(a2)及1分子中具有2個以上不 飽和鍵的有機化合物(c )之加成體的步驟;第2 pb ^係、. 在上述反應液中添加上述含乙烯基之有機聚石夕氧烧)、 或具有2個以上直接鍵結於上述矽原子的羥基之聚梦氧烧 (b2)之步驟。 〔硬化性樹脂組成物〕 (熱自由基產生劑) 本實施形態之熱硬化性樹脂組成物,其一形態可列舉 323923 48 201247745 如:含有上述有機聚矽氧烷及熱自由基產生劑之所謂熱硬 化性樹脂组成物。 上述熱自由基產生劑,只要為可由熱使(曱基)丙烯醯 氧基發生自由基聚合者即可並無特別之限定。 其例如:過氧化苯曱醯、過氧化月桂醯、過氧化第三 丁烷、氫過氧化異丙笨之類的有機過氧化物;偶氮雙異; 腈之類的偶氮化合物。 、 其具體之例,可舉如:2,2-偶氮雙(4_曱氧基_2,4__二 甲基戊腈)(V-70,日本和光純藥公司製造)、2, 2 - _偶氣 雙(2,4_二曱基戊腈)(v-65,日本和光純藥公司製造)、 2’ 2 -偶氮雙異丁腈(v-6〇,日本和光純藥公司製造)及 2’2&gt;-偶氮雙(2-曱基丁腈)(^59,日本和光純藥公司製 造)等之偶氮腈化合物;過氧化辛醯(pER〇YL 〇,日本油 脂公司製造)、過氧化月桂醯(PER0YL L,日本油脂公司製 造)、過氧化硬脂醯(pER0YL s,日本油脂公司製造)、過 氧化琥珀酸(PEROYL SA,日本油脂公司製造)' 過氧化笨 甲醯(NYPER BW,日本油脂公司製造)、過氧化異丁醯 (PEROYL IB,日本油脂公司製造)、過氧化_2,4_二氣笨甲 醯(NYPERCS,日本油脂公司製造)及過氧化_3,5,5―三甲 基己醯(PEROYL 355,日本油脂公司製造)等之過氧化二 醯類;過氧化二羧酸二正丙酯(pER〇YL Npp_5〇M,日本油 脂公司製造)、過氧化二羧酸二異丙酯(pER〇YL ϊρρ_5〇, 日本油脂公司製造)、過氧化二酿雙(4_第三丁基環己基) 酯(PEROYL TCP’日本油脂公司製造)、過氧化二羧酸二 323923 49 201247745 乙氧乙酯(PEROYLEEP,日本油脂公司製造)、過氧化二羧 酸二-2-乙氧己酯(PEROYL 0PP,日本油脂公司製造)、過 氧化二羧酸二-2-曱氧丁酯(PER0YLMBP,日本油脂公司製 造)及過氧化二羧酸二(3-曱基-3-曱氧基丁基)酯(PER0YL S0P,日本油脂公司製造)等之過氧化二羧酸酯類;氫過氧 化第三丁烷(PERBUTYL H-69,日本油脂公司製造)及過氧 化-1,1,3,3-四曱基丁烷(?〖跗^^11,日本油脂公司製造) 等之氫過氧化物類;過氧化二第三丁烷(PERBUTYL D,日 本油脂公司製造)、2, 5-二甲基-2, 5-雙(第三丁基過氧化) 己烷(PERHEXA25B,日本油脂公司製造)等之過氧化二烷 類;α,α’-雙(新癸醯過氧化)二異丙苯(DYPERND,日本 油脂公司製造)、過氧化新癸酸異苯丙酯(PERCUMYL ND, 曰本油脂公司製造)、過氧化新癸酸-1,1,3, 3-四甲基丁酯 (PEROCTA ND,日本油脂公司製造)、過氧化新癸酸-1-環 己基-1-甲乙酯(PERCYCLO ND,日本油脂公司製造)、過氧 化新癸酸第三己酯(PERHEXYL ND,日本油脂公司製造)、 過氧化新癸酸第三丁酯(PERBUTYL ND,日本油脂公司製 造)、過氧化三甲基乙酸第三己酯(PERHEXYL PV,日本油 脂公司製造)、過氧化三曱基乙酸第三丁酯(PERBUTYL PV, 曰本油月旨公司製造)、過氧化-2-乙基己酸-1,1,3, 3-四曱基 丁_(技叻(^^0,日本油脂公司製造)、2,5-二曱基-2,5-雙(2_乙基己醯過氧基)己烷(PERHEXA 250,日本油脂公司 製造)、過氣化-2-乙基己酸-1-環己基-1-甲乙醋(PERCYCL0 0 ’日本油脂公司製造)、過氧化-2-乙基己酸第三己酯 323923 50 201247745 (PERHEXYL 0,日本油脂公司製造)、過氧化-2-乙基己酸 第三丁酯(PERBUTYL0,日本油脂公司製造)、過氧化異丁 酸第三丁酯(PERBUTYL IB,日本油脂公司製造)、過氧化 異丙基單羧酸第三己酯(PERHEXYL I,日本油脂公司製造) 及過氧化順丁烯二酸第三丁酯(PERBUTYL MA,日本油脂公 司製造)、過氧化-2-乙基己酸第三戊酯(Trigonox 121, 曰本化藥Akzo公司製造)、過氧化-3, 5, 5-三曱基己酸第三 戊酯(Kayaester AN,曰本化藥Akzo公司製造)等之過氧 化酯類等之有機過氧化物等,但並不特別限定於此。 熱自由基產生劑,可單獨使用,亦可組合2種以上使 用。 熱自由基產生劑之含量,相對於100質量份之上述通 式(11)所示之氫化聚矽氧烷(al)及依所需再含1個以 上直接鍵結於矽原子之氫原子的上述氫化聚矽氧烷(a2)、 與i)具有2個以上直接鍵結於上述矽原子的乙烯基之含 乙烯基的有機聚矽氧烷(bl)、或具有2個以上直接鍵結於 上述石夕原子的經基之聚石夕氧烧(b2)及ii)上述1分子中 具有2個以上不飽和鍵的有機化合物(c)之加成反應生成 物的本實施形態之有機聚矽氧烷,以〇. 5至10質量份為佳。 熱自由基產生劑之含量為0.5質量份以上時可使其具 有優異之硬化性;在10質量份以下時可得到耐熱黃變性優 良之硬化性樹脂組成物及硬化物。由此觀點而言,熱自由 基產生劑之含量以1質量份以上8質量份以下較佳,2質 量份以上5質量份以下更佳。 323923 51 201247745 (光自由基產生劑) /人 施形態之硬化性樹脂組成物,其實施形態之一, :二上述有機聚矽氧烷及光自由基產生劑的 性樹脂組成物。 月兀•哎化 烯醯光自由基產生劑’只要為可以光使(曱基)丙 席醞^基知自由絲合之物種即可並無特別之限定。 其具體之例’可舉如:在日本特公昭59_1281號公報、 *日本特公昭61—9621號公報及日本特開昭6G-6G1G4號公報 己載^ 嗪竹生物;在日本特開昭59-1504號公 報及日本特開昭61_24贿號公報等之巾所記載之有機過 氧化物’在日本特公昭43_23684號公報、日本特公昭 44_6413號公報、日本特公昭44-6413號公報及日本特公 昭47-1604號公報等及美國專利帛3, 567 453號說明書之 中所記載之重氮化合物;在美國專利第2,848 328號說明 曰美國專利第2, 852, 379號說明書及美國專利第 2’940’853號之各說明書巾所記載之有機疊氮化合物;在 日本特公昭36-22062號公報、日本特公昭37_131〇9號公 報、日本特公昭38-18015號公報及日本特公昭45 %1〇 號公報等之帽記載之_二魏化合物類;在日本特公 昭55-39162號公報及日本特開昭59_14〇23號公報等之各 公報及在「Macromolecules,第 10 卷,第 13〇7 頁(1977 年)」之中所記載之各種鏽類化合物(〇n i um c〇mp〇unds ); 在日本特開昭59-142205號公報之中所記載之偶氮化合 物,在日本特開平1-54440號公報、歐洲專利第1〇9,851 323923 52 201247745 號說明書、歐洲專利第126, 712號說明書及「J. imag Sci.,第30卷,第174頁(1986年)」等之中所記載之金 屬重烯錯合物;在日本特開平6-213861號公報及日本特開 平6-255347號公報中所記載之(側氧基)銃(如丨丨加“^有 機硼錯合物;在日本特開昭61-151197號公報中所記載之 二茂鈦類;在「Coordination Chemistry Review,第 84 卷,第85·第277頁(1988年)」及日本特開平2一 182701 號公報中所5己載之含釕等過渡金屬之過渡金屬錯合物;在 曰本特開平3-209477號公報中所記載之2,4,5_三芳基咪 唑二聚物;四氯化碳及在日本特開昭59_1〇7344號公二中' 所記載之有機i素化合物等。 此等物種可單獨使用,亦可組合2種以上使用。 光自由基產生劑之含量,相對於1〇〇質量份之上述通 式(11)所示之氫化聚魏烧(al)及依所f再含i個以 上直接鍵結於上财原子之氫原子的氫化”氧烧U2)、 與i)具有2個以上直接鍵結於上述石夕原子的乙稀基之含 乙稀基的有機糾纽(M)、或具有2細上直接鍵結於 上述石夕原子的經基之聚石夕氧燒(b2)及u)上述i分子中 具有2個以上f飽和鍵的有機化合物(〇之加成反應生成 物的本實施形之有機聚⑪纽’以Q. 5至2q質量份為佳。 光自由基產生劑之含量為0.5質量份以上時可使其具 有優異^_42〇胃量㈣下時可得到耐光性優良之 硬化性樹餘成物及硬化物。由此觀點而言,^由基產 生劑之含量’以0.1質量份以上15質量份以下較佳,!質 323923 53 201247745 量份以上10質量份以下更佳。 (其他成分) 本實施形態之硬化性樹脂組成物中,依照其必要,在 促進對熱及紫外線等之能量的硬化性(提高其感度)之目 的方面,亦可添加(甲基)丙稀駿醋單體類及低聚物類及(甲 基)丙烯酸乙烯酯等之自由基聚合性化合物等。 其他,在不脫離本發明範圍之量、質之範圍内,亦可 抗老化劑、脫模劑、稀釋劑、抗氧化劑、熱安定劑、 阻燃劑、塑化劑及界面活性劑等之添加劑。 破璃又2實施形態之硬化性樹脂組成:中,亦可再含有 石等無機材料;合成樹脂等之有機材料。 的有機聚·,步二=Γ) 上述:;=Γ原子的氣化聚糧⑽、與。 的有機聚發氧炫(bl)接:子的乙烯基之含乙稀基 物中宜再調配矽物(c)經加成反應而得的生成 金屬二分子中’具有可與麵、 樹脂等有機材料形成化及可再與合成 佳之取代細化合物基或與有機材料互溶性 3 1 j並無特別之限定。 54 201247745 上述可與無機材料形成化 氧基及乙氧基等。 學鍵之反應基,可舉如: 甲 上^與有機材料形成化學鍵之反應基,可舉如:乙 稀,&amp;氧基胺基、甲基丙烯酸基、丙婦酸基、氫硫基、 異氰酸酯基等。 上述與有機材料互溶性佳之取代基,可舉如:異三聚 氰酸酯基等。其具體例可舉如:乙烯基三甲氧矽烷 (KBM-1GG3’日本信越化學公司製造)、乙稀基三乙氧石夕烧 (KBE-1003,日本信越化學公司製造)、2一(3, 4一環氧環己 基)乙基二甲氧矽烷(KBM-303,日本信越化學公司製造)、 3-環氧丙氧丙基甲基二甲氧矽烷(KBM_4〇2,曰本信越化學 公司製造)、3-環氧丙氧丙基三甲氧矽烷(KBM_4〇3,日本 信越化學公司製造)、3-環氧丙氧丙基甲基二乙氧矽烷 (KBE-402,日本信越化學公司製造)、3_環氧丙氧丙基三 乙氧矽烷(KBE-403,日本信越化學公司製造)、對苯乙烯 三曱氧矽烷(KBM-1403,日本信越化學公司製造)、3-曱基 丙烯醯氧丙基曱基二曱氧矽烷(KBM-502,日本信越化學公 司製造)、3-甲基丙烯醯氧丙基三曱氧矽烷(KBM-503,曰 本信越化學公司製造)、3-甲基丙烯醯氧丙基曱基二乙氧矽 烷(KBE-502,日本信越化學公司製造)、3-曱基丙烯醯氧 丙基三乙氧矽烷(KBE-503,日本信越化學公司製造)、3-丙烯醯氧丙基三曱氧矽烷(KBM-5103,日本信越化學公司 製造)、N-2-(胺乙基)-3-胺丙基甲基二曱氧矽烷 (KBM-602,日本信越化學公司製造)、N-2-(胺乙基)-3- 323923 55 201247745 胺丙基三甲氧矽烷(ΚΒΜ-603,日本信越化學公司製造)、 3-胺丙基三曱氧矽烷(ΚΒΜ-903,日本信越化學公司製造)、 3-胺丙基三乙氧矽烷(ΚΒΕ-903,日本信越化學公司製造)、 3_三乙氧碎基_3_Ν_(1,3_二曱基_亞丁基)丙胺 (ΚΒΕ-9103,日本信越化學公司製造)、Ν-苯基-3-胺丙基 三曱氧矽烷(ΚΒΜ-573,日本信越化學公司製造)、Ν-(乙烯 基苯曱基)-2-胺乙基-3-胺丙基三曱氧矽烷之鹽酸鹽 (KBM-575,日本信越化學公司製造)、3-脲丙基三乙氧矽 烷(KBE-585,日本信越化學公司製造)、3-氩硫丙基曱基 二曱氧矽烷(KBM-802,日本信越化學公司製造)、3-氫硫 丙基三曱氧矽烷(KBM-803,日本信越化學公司製造)、四 硫化雙(三乙氧矽丙基)(KBE-846,日本信越化學公司製 造)、3-異氰酸酯丙基三乙氧矽烷(KBE-9007,日本信越化 學公司製造)、異三聚氰酸三-(3-三曱氧矽基丙基)酯 (X-12-965,日本信越化學公司製造)等,但並不限定於 此。 又,此等矽烷偶合劑,可各單獨使用,亦可組合2種 以上使用。 本實施形態之硬化性樹脂組成物中的矽烷偶合劑之 含量,相對於100質量份之有機聚矽氧烷,以0.5至10 質量份為佳。 該石夕烧偶合劑之含量,在0. 5質量份以上時可使其密 接性優異,在10質量份以下時可使其耐熱黃變性佳。由此 觀點而言,矽烷偶合劑之含量,以0.7質量份以上8質量 323923 56 .201247745 份以下較佳’ 1質量份以上5質量份以下更佳。 本實_態之硬化性_旨組成物’在有機聚㈣烧之 加成反應之步驟中’在其中使用⑷錢化反應催化劑時, 相對於1GG質量份之财献,⑷⑦氫化反應催 化劑可含0. 001質量份以下。 該石夕氫化反應催化劑⑷,如上所述,可在有機聚石夕 氧烧之加成反應後以活性氧化缺活性碳等韻劑去除。 該⑷石夕氫化反應催化劑之含量,由耐執黃變性、 ,光性之觀點而言,以質量份以下為佳,〇.〇_質 畺份以下更佳,0.0005質量份以下又更佳。 本實施形態之硬化性樹脂組成物,在本實施形態之有 機t石夕氧院巾,以改善^彳熱黃變性、耐光性、硬度、導電 I&quot;生熱傳導性、觸變性(th1X0计opy)及低熱膨脹性等之目 的,可依所需而含有以無機氧化物為代表之填充材。 該填充材之例,可舉如:氧化矽(氣相氧化矽(fumed silica)、膠遙氧化石夕(c〇11〇idal…⑹)及沉降氧化石夕 jPrecipitated silica)等)、氮化矽、氮化硼、氧化鋁、 氧化鍅、氧化鈦及鈦酸鋇等之無機氧化物或無機氮化物、 玻璃、陶瓷、銀粉、金粉及銅粉等。 填充材可以經過或未經過表面處理之狀態使用,經過 表面處理時,可以提高硬化性樹脂組成物之流動性、增加 填充率,在工業上較佳。 經過表面處理之微粒無機填充材之例,可舉如經過: 曱氧化、三甲矽化、辛矽化、或經矽油處理者。 323923 57 201247745 本實施形態之硬化性樹脂組成物中之無機氧化物之 含量,相對於100質量份之有機聚碎氧燒,以&quot;至剛 質量份為佳。 〔硬化物〕 本實施形態之硬化性樹脂組成物,在硬化前為液狀或 固狀,可藉由施行預定之處理製作成其硬化物。 例如使硬化性樹脂組成物中含有上述熱自由基產生 劑時,可藉由施行加熱處理得到其硬化物。其中之^化溫 度一般為100至250°c。 硬化性樹脂組成物之硬化方法、成形方法,並無特別 之限定。在硬化性樹脂組成物為液狀時,可經由如:鑄模、 低壓轉注成形、裝填(potting)、浸潰、加壓成形及射出'成 形使其成形。 硬化性樹脂組成物為固狀時,可使用如:擠壓機、低 壓轉注成形機等在加壓下加熱硬化使其成形。 本實施形態之硬化性樹脂組成物之硬化物,亦適於作 為光半導體裝置之密封材使用。 又,本實施形態之硬化性樹脂組成物,亦可作為晶片 接合漿使用,其硬化物可作為晶片接合材使用。 同時,本實施形態之硬化性樹脂組成物之硬化物,亦 適於使用在包覆晶片之周圍的塗覆材、鏡片材等之光半導 體裝置用途方面。 該情形下,光半導體可舉如:led燈、晶片式LED、 半導體雷射、光耦合器及光二極體等。 323923 58 201247745 以 本實施形態之硬化性樹脂組成物的 光半導體料㈣使狀上述光铸财置化物作為其 構成:外殼材、設置於該外殼材内之砂晶片及&gt;'備:述 態之硬化性樹脂組成物的硬化物作為密封上述二:: 中上述外殼材之材料’並無特別之限〜 ’可舉如* 表本二曱醯胺等之芳族聚醯胺;66尼龍等之工 ,. 曼等,在聚笨二甲醯胺時,特別可表現高密接性塑料’陶 上述外殼材中再含玻璃纖維時可使其接著強度提高 而更佳。上述玻璃纖維之含量,以外殼材之質量為^準同 二5至40質量%為佳,1〇至3〇質量%更佳,特別以土 15至 質量%又更佳。玻璃纖維之含量在此數值範圍内時,可 更顯著發揮密接性。 _如上所述,本實施形態之硬化性樹脂組成物,在硬化 :為液狀或固狀’以預定之光自由基產生劑調配時,可以 表外線專能置線照射而製作其硬化物。 ,其中在調配光自由基產生劑時,硬化性樹脂組成物, 亦適合於在要求不加熱下快速硬化的樹脂膜、基板等作為 其塗覆材使用。 其例如可在平板顯示器(FPD)等之中使用之抗反射 膜形成用塗覆材。 又,特別在作為上述抗反射膜形成用塗覆材使用時, 為形成折射率1.4以下之硬化膜,硬化性樹脂組成物以含 形成空隙之多孔質微粒為佳。 323923 59 201247745Ca2), a hydrogenated polyoxane having a hydrogen atom of 2 atoms and a vinyl group-containing organic polyfluorene &amp; the above-mentioned ethyl group bonded directly to the ruthenium atom to the hydroxy group of the Shixi atom _bl), or having more than two direct bonds to more than one unsaturated bond, _ = (b2) and ii) having 2 3 mers in 1 molecule; compound r 323923 < C )' obtained by addition reaction 45 201247745 The weight of the organic polysulfide of the product is preferably from 〇〇1 to (10). The amount of the above-mentioned catalyst for the hydrogenation of the catalyst (4) is preferably from the viewpoint of sufficiently obtaining the effect of the direct addition, on the sense of mGlppnm; and from the viewpoint of cost, it is preferably from 100 ppm or less. At the same time, the "derivative reaction catalyst (4) may be removed by an adsorption material such as activated alumina or activated carbon after the addition reaction. From the viewpoint of heat-resistant yellowing and light resistance, the amount of the catalyst (4) to be described later is argonized (four) Wei (8) represented by the above formula (ι) with respect to _ mass parts, and Hydrogenation of a hydrogen group containing a samarium atom directly bonded to a hydrogen atom of a shixi atom (4) oxy-sinter (a2), phantom) and having more than 2 direct-bonding atoms of a vinyl group-containing organic poly-stone-oxygen (bl), or an organic compound (C) having two or more organic bonds (C) having a direct bond to the atomic group (tetra) and a ruthenium) The organic polyoxyalkylene is preferably 0.001 parts by mass or less. The amount of the hydrazine hydrogenation catalyst (d) in the curable resin composition can be measured by analyzing a curable resin composition described later. The above-mentioned addition reaction in the production step of the organopolyoxane of the present embodiment is generally from room temperature to 1 Torr. (: The reaction is carried out. When the above R2 is a (fluorenyl) acryloxy group, the (meth) propylene fluorenyl group has a possibility of colloidal reaction at a high temperature, and the reaction temperature is 4 〇 ° C to 7 〇 °c is preferred. The above addition reaction can also be carried out in a solvent as required. § In the case of hexane solvent, for example, aromatic phthalocyanine 323923 46 201247745, such as toluene and diphenylbenzene, can be used. An aliphatic solvent such as an alkane or an octane; a ketone solvent such as methyl ethyl ketone or methyl isobutyl ketone; an ester solvent such as ethyl acetate or isobutyl acetate; diisopropyl ether and 1,4-dioxin; An ether solvent such as an alkane, diethyl ether, tetrahydrofuran, ethylene glycol dimethyl ether, ethylene glycol diethyl ether or propylene glycol monomethyl ether acetate; or an alcohol solvent such as isopropyl alcohol; or a mixed solvent thereof. The environment in the addition reaction may be any one of air and inert gas, and in the point of less coloring of the obtained organic hydrogenated polyoxyalkylene, in an inert gas such as nitrogen, argon or helium. Preferably, when the above R2 is a (meth) propylene decyloxy group, the poly(oxy) decyloxy group is prevented from being aggregated. For the purpose of the reaction, a small amount of oxygen may be introduced. When the above R2 is a (meth) propylene oxime group, in order to prevent the polymerization reaction of the (meth) propylene oxime group, the morphine is added to the reaction towel in advance. It is preferred to use a compounding agent such as a compound, an amine compound or a compound such as a compound. The type and amount of the polymerization inhibitor are not hindered by the addition of the material to prevent the progress of the hydrogenation reaction. The (meth)propoxy group, that is, the polymerization reaction of acryloxy or methacryloxy group, is not particularly limited. ' After the addition reaction, the reaction mixture is also The addition reaction catalyst can be removed by a general method such as water washing or activated carbon treatment, and the organic compound (c) having two or more unsaturated bonds in the remaining one molecule and the solvent can be heated and/or reduced. By press-removing, (1) F1 and ( (ii) F1 and Τ, 323923 47 201247745 (iii) FI of the constituent units F1, Μ1, and τ represented by the above formulas (1) to (3), An organic polyoxane of any combination of M1 and Τ In the embodiment of the present invention, the following anti-seam is prepared, and the anti-seam is added to the anti-seam, and the above-mentioned addition reaction can be carried out in advance (4). The sub-synthesis reaction catalyzes the above-mentioned hydrogenation material. (al) and according to the reaction liquid oxygen crater (10)' and the organic polyfluorination core containing the above ethylene group: an organic compound having two or more unsaturated bonds in two molecules and two or more directly bonded to the above stone The organic compound having two or more unsaturated bonds in the sulfonium, eight, and one molecules of the holly atom is further produced by the organic polyoxy siloxane of the present embodiment: the above-described addition reaction in the step C can be carried out sequentially In the first stage and the second stage, the first stage is to preliminarily prepare the hydrogenated polyoxane (al) containing the hydrogenated polyoxane (a2) and two or more molecules in one molecule. The reaction solution of the unsaturated compound (c) of the unsaturated bond is further added to the reaction solution by adding a catalyst for denitrification (d) to form the above-mentioned hydrogenation polymerization; e-oxygenation (a) &gt; Polyoxane (a2) and organic having 2 or more unsaturated bonds in one molecule a step of adding an adduct of the compound (c); a second pb ^ system, adding the vinyl group-containing organic polyoxo oxo to the reaction liquid, or having two or more directly bonded to the above ruthenium atom The step of the hydroxy group of the dream oxygenation (b2). [Curing Resin Composition] (Thermal Radical Generating Agent) The thermosetting resin composition of the present embodiment is 323923 48 201247745. The so-called organic polyoxane and the thermal radical generating agent are as described. A thermosetting resin composition. The above-mentioned thermal radical generating agent is not particularly limited as long as it can radically polymerize a (mercapto) acryloxy group by heat. For example, an organic peroxide such as benzoquinone peroxide, laurel, oxidized third butane, isopropyl hydroperoxide; azobisiso; azo compound such as nitrile. Specific examples thereof include 2,2-azobis(4-methoxy-2,4_-dimethylvaleronitrile) (V-70, manufactured by Nippon Wako Pure Chemical Industries, Ltd.), 2, 2 - _ Oxygen bis(2,4-dioxyl valeronitrile) (v-65, manufactured by Nippon Wako Pure Chemical Industries, Ltd.), 2' 2 -azobisisobutyronitrile (v-6 〇, Nippon Wako Pure Chemical Co., Ltd.) (manufacturing) and 2'2&gt;-azobis(2-mercaptobutyronitrile) (^59, manufactured by Nippon Wako Pure Chemical Co., Ltd.), etc.; octanoic acid peroxide (pER〇YL 〇, Japan Oil Company) Manufactured, oxidized laurel (PEROYL L, manufactured by Nippon Oil & Fats Co., Ltd.), oxidized stearin (pER0YL s, manufactured by Nippon Oil & Fats Co., Ltd.), peroxy succinic acid (PEROYL SA, manufactured by Nippon Oil & Fats Co., Ltd.)醯 (NYPER BW, manufactured by Nippon Oil & Fats Co., Ltd.), isobutyl hydrazine peroxide (PEROYL IB, manufactured by Nippon Oil & Fats Co., Ltd.), oxidized _2, 4 _ 2 gas, and sputum (NYPERCS, manufactured by Nippon Oil & Fats Co., Ltd.) and peroxide _ 3,5,5-trimethylhexanide (PEROYL 355, manufactured by Nippon Oil & Fats Co., Ltd.), etc.; di-n-propyl peroxydicarboxylate (pER〇YL Npp_5〇M, manufactured by Nippon Oil & Fats Co., Ltd.), diisopropyl peroxydicarboxylate (pER〇YL ϊρρ_5〇, manufactured by Nippon Oil & Fats Co., Ltd.), peroxidized di-bis(4_t-butylcyclohexyl)ester (PEROYL) TCP's manufactured by Nippon Oil & Fats Co., Ltd., dicarboxylic acid dicarboxylic acid II 323923 49 201247745 Ethoxyethyl ester (PEROYLEEP, manufactured by Nippon Oil & Fats Co., Ltd.), di-2-ethoxyhexyl peroxydicarboxylate (PEROYL 0PP, Nippon Oil & Fats Co., Ltd. Manufactured, di-2-oxobutyl peroxydicarboxylate (PEROYLMBP, manufactured by Nippon Oil & Fats Co., Ltd.) and bis(3-indolyl-3-indolyl butyl) peroxydicarboxylate (PEROYL S0P, Peroxydicarboxylates, etc. manufactured by Nippon Oil & Fats Co., Ltd.; hydrogen peroxide third butane (PERBUTYL H-69, manufactured by Nippon Oil & Fats Co., Ltd.) and peroxy-1,1,3,3-tetradecylbutane (? 跗 ^^11, manufactured by Nippon Oil & Fats Co., Ltd.) Hydroperoxides, etc.; Dibutane peroxide (PERBUTYL D, manufactured by Nippon Oil & Fats Co., Ltd.), 2, 5-dimethyl-2, 5- Bis(t-butyl peroxy) hexane (PERHEXA25B, manufactured by Nippon Oil & Fats Co., Ltd.) Class; α,α'-bis(new ruthenium peroxide) diisopropylbenzene (DYPERND, manufactured by Nippon Oil & Fats Co., Ltd.), isopropenyl peroxypimelate (PERCUMYL ND, manufactured by Sakamoto Oil Co., Ltd.), peroxidation Neodecanoic acid-1,1,3,3-tetramethylbutyl ester (PEROCTA ND, manufactured by Nippon Oil & Fats Co., Ltd.), peroxy neodecanoate-1-cyclohexyl-1-methylethyl ester (PERCYCLO ND, Nippon Oil & Fats Co., Ltd. Manufactured), perhexyl neodecanoate (PERHEXYL ND, manufactured by Nippon Oil & Fats Co., Ltd.), perbutyl neodecanoate (PERBUTYL ND, manufactured by Nippon Oil Co., Ltd.), trimethylacetate peroxide Ester (PERHEXYL PV, manufactured by Nippon Oil & Fats Co., Ltd.), tributyl succinate (PERBUTYL PV, manufactured by Sakamoto Oil Co., Ltd.), peroxy-2-ethylhexanoic acid-1, 1, 3, 3-tetramethyl butyl ketone (Technology (^^0, manufactured by Nippon Oil & Fats Co., Ltd.), 2,5-dimercapto-2,5-bis(2-ethylhexylperoxy)hexane (PERHEXA 250) , manufactured by Nippon Oil & Fats Co., Ltd.), pervaporated 2-ethylhexanoic acid-1-cyclohexyl-1-methylacetic acid (PERCYCL0 0 'made by Nippon Oil & Fats Co., Ltd.), Peroxy-2-B Third hexyl hexanoate 323923 50 201247745 (PERHEXYL 0, manufactured by Nippon Oil & Fats Co., Ltd.), tert-butyl peroxy-2-ethylhexanoate (PERBUTYL0, manufactured by Nippon Oil Co., Ltd.), third butyl peroxybutyrate Ester (PERBUTYL IB, manufactured by Nippon Oil & Fats Co., Ltd.), hexyl isopropyl monocarboxylate (PERHEXYL I, manufactured by Nippon Oil & Fats Co., Ltd.) and tert-butyl peroxymaleate (PERBUTYL MA, Japanese fat) Made by the company), triamyl peroxy-2-ethylhexanoate (Trigonox 121, manufactured by Akzo Co., Ltd.), third amyl peroxy-3,5,5-tridecylhexanoate (Kayaester) AN, an organic peroxide such as a peroxyester, etc., which is manufactured by Akzo Co., Ltd., etc., is not particularly limited thereto. The thermal radical generating agent may be used singly or in combination of two or more. The content of the thermal radical generating agent is more than 100 parts by mass of the hydrogenated polyoxoxane (al) represented by the above formula (11) and, if necessary, more than one hydrogen atom directly bonded to the halogen atom of the halogen atom. The hydrogenated polyoxyalkylene oxide (a2) and i) have two or more vinyl group-containing organopolyoxanes (bl) directly bonded to the above-mentioned fluorene atom, or have two or more direct bonds to The organic polyfluorene of the present embodiment of the above-mentioned addition reaction of the organic compound (c) having two or more unsaturated bonds in one molecule of the above-mentioned group The oxane is preferably 5 to 10 parts by mass. When the content of the thermal radical generator is 0.5 part by mass or more, the curable resin composition and the cured product having excellent heat-resistant yellow denaturation can be obtained. From this viewpoint, the content of the thermal radical generating agent is preferably 1 part by mass or more and 8 parts by mass or less, more preferably 2 parts by mass or more and 5% by mass or less. 323923 51 201247745 (Photo-radical generating agent) / The curable resin composition of the human body, one of the embodiments, and the resin composition of the above-mentioned organic polysiloxane and photo-radical generating agent. The ruthenium-deuterated olefin photo-radical generating agent' is not particularly limited as long as it is a species which can be photo-activated. Specific examples thereof are as follows: Japanese Patent Publication No. 59_1281, Japanese Patent Publication No. 61-9621, and Japanese Patent Publication No. 6G-6G1G4 have been carried out; In the Japanese Patent Publication No. Sho 43-23684, Japanese Patent Publication No. Sho 44_6413, Japanese Patent Publication No. 44-6413, and Japanese Special Public Show, Japanese Patent Publication No. Sho. The diazonium compound described in the specification of U.S. Patent No. 3, 567, 453, and the specification of U.S. Patent No. 2,848,328, the specification of U.S. Patent No. 2,852,379, and the U.S. Patent No. 2' The organic azide compound described in each of the specification sheets of 940'853; Japanese Patent Publication No. Sho 36-22062, Japanese Patent Publication No. Sho 37-131〇9, Japanese Patent Publication No. Sho 38-18015, and Japanese Special Public Show 45%二 化合物 化合物 化合物 二 二 二 二 二 二 二 二 二 二 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 Page (1977 The arsenic compound described in Japanese Laid-Open Patent Publication No. Hei 59-142205, Japanese Laid-Open Patent Publication No. Hei No. Hei. Metallic heavy olefins described in European Patent No. 1, 851, 323, 923, 52, 2012, 477, 245, European Patent No. 126, No. 712, and "J. Imag Sci., Vol. 30, p. 174 (1986)" (Side oxy) oxime (such as 丨丨 “ 有机 有机 有机 有机 ; ; ; ; 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 In the "Coordination Chemistry Review, Vol. 84, No. 85 (277) (1988)" and "Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. Hei. a transition metal complex of a transition metal such as ruthenium; a 2,4,5-triarylimidazole dimer described in JP-A-3-209477; carbon tetrachloride and a special opening in Japan 59_1〇 Organic i-based compounds described in 'No. 7344'. These species can be used alone or in groups. Two or more kinds of use: The content of the photoradical generator is directly bonded to one or more of the hydrogenated polywei (al) represented by the above formula (11) with respect to 1 part by mass. The hydrogenation of the hydrogen atom of the upper atom "oxygen" (U2), and i) the organic group (M) having two or more ethylene groups directly bonded to the ethylene group of the above-mentioned stone atom, or having 2 fine An organic compound having two or more f-saturation bonds in the i molecule described above, which is directly bonded to the group of the above-mentioned shixi atom, (the present invention) The organic poly 11 New Zealand is preferably Q. 5 to 2q parts by mass. When the content of the photoradical generator is 0.5 parts by mass or more, it is possible to obtain a curable tree residue and a cured product which are excellent in light resistance when they are excellent in the amount of (4). From this point of view, it is preferable that the content of the base-generating agent is from 0.1 part by mass to 15 parts by mass or less. Quality 323923 53 201247745 More than 10 parts by mass or less. (Other components) The curable resin composition of the present embodiment may be added with (meth) propyl sulphate for the purpose of promoting the curability (enhancement of sensitivity) to energy such as heat and ultraviolet rays. A radical polymerizable compound such as a vinegar monomer or an oligomer or a vinyl (meth)acrylate. Further, additives such as an anti-aging agent, a mold release agent, a diluent, an antioxidant, a heat stabilizer, a flame retardant, a plasticizer, and a surfactant may be added within the range of quantity and quality without departing from the scope of the present invention. . In addition, the hardening resin composition of the second embodiment may further contain an inorganic material such as stone or an organic material such as a synthetic resin. Organic poly, step 2 = Γ) Above:; = Γ atomic gasification of the grain (10), and. Organic polyoxygen (bl): the vinyl-containing vinyl substrate of the sub-ethylene compound should be re-formulated with the antimony (c) by the addition reaction to form a metal molecule, which has a surface, a resin, etc. The formation of the organic material and the recombination of the fine compound group or the organic material miscibility 3 1 j are not particularly limited. 54 201247745 The above can form an oxy group and an ethoxy group with an inorganic material. The reactive group of the bond may be, for example, a reactive group which forms a chemical bond with an organic material, and may be exemplified by ethylene, &amp;oxyamino group, methacrylic group, propyl acetophenate, thiol group, Isocyanate groups and the like. The substituent which is excellent in miscibility with the organic material may, for example, be an isomeric cyanate group. Specific examples thereof include vinyltrimethoxysilane (KBM-1GG3' manufactured by Shin-Etsu Chemical Co., Ltd.), ethylene-triethoxylate (KBE-1003, manufactured by Shin-Etsu Chemical Co., Ltd.), and 2 (3, 4-epoxycyclohexyl)ethyldimethoxydecane (KBM-303, manufactured by Shin-Etsu Chemical Co., Ltd.), 3-glycidoxypropylmethyldimethoxydecane (KBM_4〇2, manufactured by Sakamoto Shin-Etsu Chemical Co., Ltd. , 3-glycidoxypropyltrimethoxy decane (KBM_4〇3, manufactured by Shin-Etsu Chemical Co., Ltd.), 3-glycidoxypropylmethyldiethoxy decane (KBE-402, manufactured by Shin-Etsu Chemical Co., Ltd.) , 3_glycidoxypropyl triethoxy decane (KBE-403, manufactured by Shin-Etsu Chemical Co., Ltd.), p-styrene trioxoxane (KBM-1403, manufactured by Shin-Etsu Chemical Co., Ltd.), 3-mercaptopropene oxime Oxypropyl decyl dioxin (KBM-502, manufactured by Shin-Etsu Chemical Co., Ltd.), 3-methacryloxypropyltrioxane (KBM-503, manufactured by Shin-Etsu Chemical Co., Ltd.), 3-A Acryloxypropyl fluorenyldiethoxy decane (KBE-502, manufactured by Shin-Etsu Chemical Co., Ltd.), 3-曱Acryl propyloxypropyl triethoxy decane (KBE-503, manufactured by Shin-Etsu Chemical Co., Ltd.), 3-propenyl methoxypropyl trioxoxane (KBM-5103, manufactured by Shin-Etsu Chemical Co., Ltd.), N-2-( Aminoethyl)-3-aminopropylmethyldioxanane (KBM-602, manufactured by Shin-Etsu Chemical Co., Ltd.), N-2-(amineethyl)-3- 323923 55 201247745 Aminopropyltrimethoxy decane ( ΚΒΜ-603, manufactured by Shin-Etsu Chemical Co., Ltd.), 3-aminopropyltrioxane (ΚΒΜ-903, manufactured by Shin-Etsu Chemical Co., Ltd.), 3-aminopropyltriethoxysilane (ΚΒΕ-903, Japan Shin-Etsu Chemical Co., Ltd. Manufactured, 3_triethoxylated _3_Ν_(1,3-didecyl-butylene) propylamine (ΚΒΕ-9103, manufactured by Shin-Etsu Chemical Co., Ltd.), Ν-phenyl-3-aminopropyltrioxane Hydrane (ΚΒΜ-573, manufactured by Shin-Etsu Chemical Co., Ltd.), Ν-(vinylphenylhydrazino)-2-amineethyl-3-aminopropyltrioxoxane hydrochloride (KBM-575, Shin-Etsu Chemical Co., Ltd. Manufactured by the company, 3-ureidopropyl triethoxy decane (KBE-585, manufactured by Shin-Etsu Chemical Co., Ltd.), 3-arylthiopropyl decyl dioxin (KBM-802, Japan Letter) Manufactured by Yue Chemical Co., Ltd., 3-Hydroxythiopropyltrioxane (KBM-803, manufactured by Shin-Etsu Chemical Co., Ltd.), bis(triethoxyphosphoryl) tetrasulfide (KBE-846, manufactured by Shin-Etsu Chemical Co., Ltd.) , 3-isocyanate propyl triethoxy decane (KBE-9007, manufactured by Shin-Etsu Chemical Co., Ltd.), tris-(3-trioxalylhydryl propyl) isocyanurate (X-12-965, Shin-Etsu, Japan) It is manufactured by a chemical company, etc., but is not limited thereto. Further, these decane coupling agents may be used singly or in combination of two or more. The content of the decane coupling agent in the curable resin composition of the present embodiment is preferably 0.5 to 10 parts by mass based on 100 parts by mass of the organopolysiloxane. When the content of the stagnation coupling agent is 0.5 parts by mass or more, the adhesion is excellent, and when it is 10 parts by mass or less, the heat resistance yellowing resistance is good. From this point of view, the content of the decane coupling agent is preferably 0.7 parts by mass or more and 8 parts by mass of 323923 56 .201247745 parts or less, more preferably 1 part by mass or more and 5 parts by mass or less. The hardening property of the present invention is based on the fact that in the step of the addition reaction of the organic poly(four) calcination, the (4)7 hydrogenation catalyst may be contained with respect to 1 g of the mass of the catalyst. 0. 001 parts by mass or less. The Lithium Hydrogenation Catalyst (4), as described above, can be removed by an active oxidation-deficient carbon or the like after the addition reaction of the organic polysulfide. The content of the (4) shixi hydrogenation catalyst is preferably from 5% by mass or less, more preferably 5% by mass or less, more preferably from 0.005 parts by mass or less, from the viewpoint of resistance to yellowing and light resistance. The curable resin composition of the present embodiment is used in the organic t-stone hospital towel of the present embodiment to improve heat yellowing, light resistance, hardness, conductivity I&quot; heat conductivity, and thixotropic (th1X0 opy). For the purpose of low thermal expansion and the like, a filler represented by an inorganic oxide may be contained as needed. Examples of the filler include cerium oxide (fumed silica, gelaphthalmic oxide (c〇11〇idal (6)), and precipitated oxidized stone), and tantalum nitride. Inorganic oxides or inorganic nitrides such as boron nitride, aluminum oxide, cerium oxide, titanium oxide and barium titanate, glass, ceramics, silver powder, gold powder and copper powder. The filler can be used with or without surface treatment, and when subjected to surface treatment, the fluidity of the curable resin composition can be increased, and the filling ratio can be increased, which is industrially preferable. Examples of the surface-treated particulate inorganic filler may be as follows: oxime oxidation, trimethyl hydrazide, octopine, or eucalyptus oil treatment. 323923 57 201247745 The content of the inorganic oxide in the curable resin composition of the present embodiment is preferably from &quot; to the mass part based on 100 parts by mass of the organic polyoxalate. [Cured material] The curable resin composition of the present embodiment is liquid or solid before curing, and can be formed into a cured product by a predetermined treatment. For example, when the above-mentioned thermal radical generator is contained in the curable resin composition, the cured product can be obtained by heat treatment. The temperature is generally from 100 to 250 ° C. The hardening method and molding method of the curable resin composition are not particularly limited. When the curable resin composition is in a liquid state, it can be shaped by, for example, molding, low pressure transfer molding, potting, dipping, press molding, and injection molding. When the curable resin composition is in a solid form, it can be molded by heating and hardening under pressure using, for example, an extruder or a low-pressure transfer molding machine. The cured product of the curable resin composition of the present embodiment is also suitable for use as a sealing material for an optical semiconductor device. Further, the curable resin composition of the present embodiment can also be used as a wafer bonding paste, and the cured product can be used as a wafer bonding material. Further, the cured product of the curable resin composition of the present embodiment is also suitably used in the use of a light semiconductor device such as a coating material or a lens material around the coated wafer. In this case, the optical semiconductor may be, for example, a led lamp, a wafer type LED, a semiconductor laser, an optical coupler, and an optical diode. 323923 58 201247745 The photo-semiconductor material (4) of the curable resin composition of the present embodiment has the above-mentioned photo-forming material as a structure: an outer shell material, a sand wafer provided in the outer shell material, and &gt; The cured product of the curable resin composition is not particularly limited as a material for sealing the above-mentioned outer casing material in the above two:: ', for example, an aromatic polyamine such as *benzamide; 66 nylon, etc. In the case of polypyridylamine, it is particularly useful to exhibit a high-adhesive plastic. In addition to the glass fiber, the outer casing of the outer casing can further improve the strength of the joint. The content of the above glass fiber is preferably from 5 to 40% by mass, more preferably from 1 to 3 % by mass, particularly preferably from 15 to 5% by mass. When the content of the glass fiber is within this numerical range, the adhesion can be more markedly exhibited. As described above, in the case where the curable resin composition of the present embodiment is cured in a liquid state or in a solid state by a predetermined photoradical generator, the cured product can be produced by wire irradiation. In the case where the photo-radical generator is formulated, the curable resin composition is also suitable for use as a coating material for a resin film, a substrate or the like which is required to be rapidly cured without heating. For example, it can be used as a coating material for forming an antireflection film which is used in a flat panel display (FPD) or the like. In particular, when used as the coating material for forming an antireflection film, it is preferable to form a cured film having a refractive index of 1.4 or less, and the curable resin composition preferably contains porous fine particles which form voids. 323923 59 201247745

上述多孔質微粒可舉如平均粒徑㈣之氧化 石夕粒子,由硬化膜之透雜之觀點⑭,㈣有5至⑽M ==之氧化矽粒子較佳。具體之例係如販售品之具親 水性或表面料疏水化處理之氣彳魂切之〜⑽…商 品名,日本Aerosil公司製造)及氣化石夕粒子以直鏈連結 之珍珠鏈㈣溶膠之「SN_XPS」(商品名日本日產化 千a司衣仏)等。此類多孔質微粒,相對於1⑽質量份之 硬化性樹脂組成物,以多孔質微粒合計在1〇至川質量份 之範圍添加使用為佳,Μ❹均f機等使硬化性樹脂組 成物内均一地分散為佳。 本實施形態之硬化性樹脂組成物在作為塗覆材使用 時,硬化膜之形成方法,可舉如在透明基材(如聚甲基丙 稀酸甲醋、聚碳酸酯、聚苯乙烯及三乙醯纖維素之樹脂基 材或玻璃專之無機材料)之表面上以含本實施形態之硬化 性樹脂組成物的塗覆材塗布,該塗膜再經過光硬化,形成 可作為抗反射膜及保護膜等之厚度為1〇nm至丨Am的硬化 膜的方法。 在基材上塗布時’由於有以高精細度形成較薄之膜的 必要,此時可使用:微凹版塗布法、輥塗法、淋塗法、旋 塗法、剛模塗布法、延流塗法及喷塗法等。 硬化性樹脂組成物’可依所需使用調整黏度用之溶劑 等進行稀釋,亦可以形成含多孔質微粒等之溶膠之形態。 在使用溶劑等進行稀釋時、及以含多孔質微粒等之溶膠形 態使用時,為預先使溶劑成分揮散,可在硬化前以5〇至 323923 60 201247745 150°C進行約數分鐘之加熱。 本實施形態之硬化性樹脂組成物中再添加著色劑,即 可成為硬化性印墨。 上述之著色劑’可使用各種有機顏料、無機顏料。其 例如:氧化鈦、鋅白、鉛白、鋅鋇白及氧化銻等之白色顏 料;苯胺黑、鐵黑及碳黑等之黑色顏料;鉻黃、黃氧化鐵' 漢薩黃(100、50、30等)、鈦黃、石油醚黃及永固黃等之 黃色顏料;鉻朱紅(Chrome Vermilion)、永固橙、硫化永 固橙(Vulcan Fast Orange)等之橙色顏料;氧化鐵、永固 棕及對位棕等之褐色顏料;紅氧化鐵、鎘紅、銻辰砂、永 固紅、玫塊紅色版、S素色殿、硫散紅、PV胭脂紅、 Monolight永固紅及喹吖酮系紅色顏料等之紅色顏料;钻 紫、錳紫、永固紫、甲基紫色澱、陰丹士林亮紫、二嗓紫 專之紫色顏料;群青、普魯士藍、始藍、驗性藍色殿、無 金屬酞花青藍、銅酞青藍、陰丹士林藍、靛藍等之藍色顏 料;鉻綠、氧化鉻、翡翠綠、萘酚綠、金黃綠、酸性綠色 澱、孔雀綠色澱、酞花青綠及多氣溴銅酞青素等之綠色顏 料;其他各種螢光顏料、金屬粉顏料及體質顏料等。此等 著色劑之量,相對於硬化性樹脂組成物之全量,以1至50 質量%為佳,5至25質量%更佳。 硬化性印墨中’著色劑亦可再依所需使用顏料分散 劑。 該顏料分散劑之例,可舉如:高級脂肪酸鹽、烧基硫 酸鹽、烧基酯硫酸鹽、烧基確酸鹽、橫破珀酸鹽、萘靖酸 323923 61 201247745 鹽、一说基概鹽、聚氧料㈣雜鹽、聚氧馳基苯醚、 丙三醇s旨、山梨酿紅狀 β产 米知野酯及聚氧乙烯脂肪醯胺等之活化 由苯乙烯、笨乙烯衍生物、乙烯萘衍生物、丙烯酸、丙烯 酸衍生物謂二酸衍生物·、衣康酸= 康酸衍生物、反丁埽二酸及反丁烯二酸衍生物之 體所構成之後段共聚物或無規共聚物及此等 硬化ί±印墨中之著色劑之分散方法,可舉如使用 磨機、砂磨機、磨碎機、輥磨機、攪拌機、亨歇爾混合機、 膠磨機、超音波均質機、珠磨機、濕式嘴射粉 振盪機等各種分散機的方法。 又,以去除硬化性印墨中之顏料分散體的粗粒份之目 的’可使用離心機或過濾器施行預定之處理。 上述著色劑在使用顏料印墨時,顏料印墨中之顏料粒 子的平均粒彳空,考慮其在硬化性印墨中之安定性、晝像濃 度、光澤感、耐光性等而選擇,在增加光澤、改善質感之 觀點上’以適當選擇顏料粒子的平均粒徑為佳。 本實施形態之硬化性樹脂組成物,可發揮其耐熱黃變 性及高透明性,而適於使用在眼鏡鏡片、光學機器用鏡片、 CD及DVD之讀取鏡片、汽車頭燈用鏡片及投影機用鏡片等 之鏡片的材料,光纖、光波導、濾光器、光學用接著劑、 光碟基板、顯示器基板、奈米模印用硬化性樹脂等的各種 光學構件材料中。 本實施形態之硬化性樹脂組成物,可作為先半導體用 323923 62 201247745 密封材使用’其硬化物,適於作為半導體封裝體用之透明 樹脂’而上述光半導體用密封材經由成形可得到半導體封 裝體。 上述光半導體用密封材,係在電漿處理後再經過底膜 處理之被處理物上,直接以分注機及旋轉分注機等塗布裝 置塗布成形。 該塗布之光半導體密封材,可使其硬化、或以成型機 等使其硬化。 [實施例] 以下再具體地舉實施例、比較例說明本發明,惟本發 明並不限定於以下之實施例。 在實施例、比較例中係依以下方法進行測定及評定。 &lt; (1) SiH之反應率之計算&gt; 將0. 05g之抽樣反應溶液(即在後述實施例、比較例 中之有機聚矽氧烷合成中的反應溶液,由反應開始經過72 小時後之溶液)溶解於lg之氘代氣仿溶劑中作為測定試 料。 之後以該測定試料’在4〇〇MHz (日本分光公司製造’ α -400)下’以累積次數ι〇〇次進行iH NMR測定,再解析 測定之結果。 其SiH之反應率,係求出反應前及反應後之緣自 Si-CH3之0.2ppm之峰與緣自siH之4. 6ppm之峰的面積 比,再依照下述式計算。 之後評定SiH之反應率在98%以上時為©,90%以上且 323923 63 201247745 低於98%時為〇,低於9〇%時為χ。The porous fine particles may be oxidized cerium particles having an average particle diameter (four), and the cerium oxide particles having 5 to (10) M == are preferable from the viewpoint of the penetration of the cured film. Specific examples are, for example, the hydrophilicity of the vending product or the hydrophobization treatment of the surface material~(10)...trade name, manufactured by Japan Aerosil Co., Ltd.) and the pearl chain of the gasification shixi particle in a straight chain (4) sol "SN_XPS" (trade name: Japan Nissan Chemical Co., Ltd.). The porous fine particles are preferably used in a range of from 1 Torr to 1 part by mass based on the total amount of the porous fine particles of the curable resin composition of 1 (10) parts by mass, and the uniformity of the curable resin composition is uniform. Dispersion is better. When the curable resin composition of the present embodiment is used as a coating material, the method for forming the cured film may be, for example, a transparent substrate (such as polymethyl methacrylate, polycarbonate, polystyrene, and tris). The surface of the acetaminophen resin substrate or the glass-specific inorganic material is coated with a coating material containing the curable resin composition of the present embodiment, and the coating film is further photocured to form an antireflection film and A method in which the thickness of the protective film or the like is from 1 〇 nm to 硬化Am. When coating on a substrate, it is necessary to form a thin film with high fineness. At this time, it can be used: micro gravure coating method, roll coating method, shower coating method, spin coating method, rigid mold coating method, and extension flow. Coating method and spraying method. The curable resin composition ' may be diluted with a solvent or the like for adjusting the viscosity as needed, or may be in the form of a sol containing porous fine particles or the like. When it is used for dilution with a solvent or the like, and when it is used in a sol form containing porous fine particles or the like, the solvent component is volatilized in advance, and it can be heated at 5 Torr to 323,923, 60, 2012, 477, and 150 ° C for about several minutes before curing. Further, a coloring agent is added to the curable resin composition of the present embodiment, that is, it can be a curable ink. As the coloring agent described above, various organic pigments and inorganic pigments can be used. For example: white pigments such as titanium oxide, zinc white, lead white, zinc antimony and antimony oxide; black pigments such as nigrosine, iron black and carbon black; chrome yellow and yellow iron oxide 'Hansa yellow (100, 50) , 30, etc., yellow pigments such as titanium yellow, petroleum ether yellow and permanent yellow; orange pigments such as Chrome Vermilion, permanent orange, Vulcan Fast Orange; iron oxide, permanent brown and Brown pigment such as brown; red iron oxide, cadmium red, enamel sand, permanent red, rose red, S plain, sulphur red, PV carmine, Monolight red and quinacone red Red pigments such as pigments; purple violet, manganese violet, permanent violet, methyl violet, indosin, bright purple, and purple violet pigments; ultramarine, Prussian blue, blue, blue hall, Blue pigments without metal phthalocyanine blue, copper sapphire blue, indanthrene blue, indigo, etc.; chrome green, chrome oxide, emerald green, naphthol green, golden green, acid green lake, peacock green lake, 酞Green pigments such as cyanine green and polybrominated copper arsenic; other various fluorescent pigments, metals Powder pigments and body pigments. The amount of the coloring agent is preferably from 1 to 50% by mass, more preferably from 5 to 25% by mass, based on the total amount of the curable resin composition. The pigment can also be used as a pigment in the hardenable ink. Examples of the pigment dispersant include higher fatty acid salts, alkyl sulfates, alkyl ester sulfates, decyl sulfates, trans-salt salts, naphthalene acid 323923 61 201247745 salts, The activation of salt, polyoxygen (4) hetero-salt, polyoxy-phenylene phenyl ether, glycerol s, sorbus red-like β-mimi-ester and polyoxyethylene fatty decylamine is activated by styrene, stupid ethylene derivatives, a copolymer of a vinyl naphthalene derivative, an acrylic acid, an acrylic acid derivative, a diacid derivative, an itaconic acid = a cannic acid derivative, a transbutyric acid, and a fumaric acid derivative, or a random copolymer The copolymer and the dispersion method of the coloring agent in the hardened ink can be exemplified by using a mill, a sand mill, an attritor, a roll mill, a mixer, a Henschel mixer, a rubber mill, and a super A method of various dispersing machines such as a sonic homogenizer, a bead mill, and a wet nozzle powder oscillating machine. Further, the predetermined treatment can be carried out by using a centrifuge or a filter for the purpose of removing coarse particles of the pigment dispersion in the curable ink. When the pigment ink is used as the above coloring agent, the average particle hollow of the pigment particles in the pigment ink is selected in consideration of stability, image density, glossiness, light resistance, etc. in the curable ink, and is increasing. From the viewpoint of gloss and texture improvement, it is preferred to appropriately select the average particle diameter of the pigment particles. The curable resin composition of the present embodiment exhibits heat-resistant yellowing and high transparency, and is suitable for use in spectacle lenses, optical device lenses, CD and DVD reading lenses, automotive headlight lenses, and projectors. The material of the lens such as a lens is used for various optical member materials such as an optical fiber, an optical waveguide, a filter, an optical adhesive, a disk substrate, a display substrate, and a curable resin for nanoimprint. The curable resin composition of the present embodiment can be used as a first semiconductor 323923 62 201247745 sealing material, which is a cured product which is suitable for use as a transparent resin for a semiconductor package, and the above-mentioned optical semiconductor sealing material can be obtained by molding. body. The sealing material for an optical semiconductor is applied to a workpiece subjected to a base film treatment after plasma treatment, and is directly applied by a coating device such as a dispenser or a rotary dispenser. The coated optical semiconductor sealing material can be cured or cured by a molding machine or the like. [Examples] Hereinafter, the present invention will be specifically described by way of Examples and Comparative Examples, but the present invention is not limited to the examples below. In the examples and comparative examples, the measurement and evaluation were carried out in the following manner. &lt;(1) Calculation of Reaction Rate of SiH&gt; A sample reaction solution of 0.05 g (i.e., a reaction solution in the synthesis of an organopolyoxane in the examples and comparative examples described later), 72 hours after the start of the reaction The solution was dissolved in lg of a gas-like imitation solvent as a measurement sample. Then, the measurement sample was subjected to iH NMR measurement at a cumulative number of times at 4 〇〇 MHz (manufactured by JASCO Corporation, α-400), and the results of the measurement were analyzed. The reaction rate of the SiH was determined by calculating the area ratio of the peak of 0.2 ppm from Si-CH3 and the peak of 4. 6 ppm from SiH before and after the reaction, and then calculated according to the following formula. After that, when the reaction rate of SiH is 98% or more, it is ©, 90% or more, and 323923 63 201247745 is 〇 when it is less than 98%, and χ when it is less than 9%.

SiH之反應率=〔Reaction rate of SiH = [

XI . g 痛兑 U1~Y1) /XI〕xlOO X1 ·反應别之峰面積比 (反應前之Siii之峰面積)/彳5庙&amp; 面積) 干/ (反應前之Si-CIL·之峰 Y1 ··反應後之峰面積比 (反應後之SiH之峰面積)/ (反應後之si-CH3之峰 面積) &lt; (2)分子構造之鏜定〉 相對於20mg之後述實施例、比較例中所製作的有機 水矽氧烷(A1)至(A17)的試樣,以ig之比例溶解於氘 代氣仿溶劑中之溶液作為測定試料。再以該測定試料,以 日本分光公司製造之α _4〇〇以累積次數200次進行iH nmr 測定,再解析測定之結果。 另以相對於〇.3g之試樣,以lg之比例溶解於氘代氣 劑中之溶液作為測定試料。以該測定試料,以日本分 司製造之α_400以累積次數20000次進行% 疋’再解析測定之結果。 代氣^以相對於^之試樣,以1g之比例溶解於氣 、方各劑中,並添加相對於矽氧烷之8 〇XI . g pain against U1~Y1) /XI]xlOO X1 · Peak area ratio of reaction (peak area of Siii before reaction) / 彳5 temple &amp; area) dry / (Si-CIL peak before reaction) Y1 ·· Peak area ratio after reaction (peak area of SiH after reaction) / (peak area of si-CH3 after reaction) &lt; (2) Determination of molecular structure> Relative to 20 mg, examples and comparisons described later The sample of the organic hydrooxane (A1) to (A17) produced in the example was dissolved in a deuterated gas in a ratio of ig as a measurement sample, and the measurement sample was manufactured by JASCO Corporation. The α _4 进行 was measured by iH nmr in the cumulative number of times 200 times, and the result of the analysis was analyzed. The solution dissolved in the oxime gas agent at a ratio of lg was used as a measurement sample with respect to the sample of 〇.3 g. The measurement sample was subjected to % 疋' reanalysis measurement by α_400 manufactured by the Japanese division in a cumulative number of 20,000 times. The gas was dissolved in the gas and the respective agent at a ratio of 1 g with respect to the sample of ^. And add 8 相对 relative to the siloxane

Cr(aCac)3之溶液作為贱試料。再以該測定試料,里/〇的 刀光公司製造之α_4〇〇以累積次數4〇〇〇二乂日本 測定,再解析測定之結果。 _ 之後解析以該〖H NMR、丨3C NMR、29Si Nmr 323923 所得到之結 t • 201247745 = Γ】 = (Α1)至(Al7)之分子構造。 (3)(曱基)丙烯醯氧基之官能基當量之計算〉 相對於30mg之後述實施彳 聚石夕氧烧⑻至(A17)之比較例中所製作的有機 代氣仿溶财㈣液作“之關溶解於氛 以日本分光公司製造之之後以關定試料, 騰測定,再解析所得之結 有^欠數200次進行 之平均組成。 1分子中 =對於0.15g之試樣 編一夕氧燒之8質㈣心 為測定試料。之後以該測定試料,以曰本分光公 =ΓΓ400以累積次數4000次進行%臟測定, =解析心之結果求出有機㈣氧燒Μ子中之平均組 之後解析由1麵及%職戶斤得到之結果,計算(甲 土丙稀酿氧基之官能基當量(每i莫耳官能基之質量)。 &lt; (4)重量平均分子量之計算&gt; ^相對於l〇0mg之後述實施例、比較例中所製作的有機 聚矽氧烷(A1)至(A17)的測定用試樣,以以之比例溶 解於氯仿溶劑中,並以0.45βπι之濾膜過濾作為測定試料 溶液。 再於管柱溫度4(TC、溶出液(氯仿)之流量imL/分 鐘之條件下,通過管柱〔管柱之構成,保護管柱係使用曰 本東曹公司製造之Tskguard column Η小時-H (註冊商 323923 65 201247745 標),以日本東曹公司製造之Tskgel (註冊商標)G5000H 小時及曰本東曹公司製造之Tskgel (註冊商標)G3000H 小時、日本東曹公司製造之Tskgel (註冊商標)G1000H 小時之各1支串連配置〕。另外,再預先作成以Polymer Laboratories 公司製造之分子量 7,500,000、2,560,000、 841, 700、320, 000、148, 000、59, 500、28, 500、10, 850、 2, 930、580之已知分子量的單分散聚苯乙烯標準品及苯乙 烯單體(分子量104)以RI檢測求出沖提時間之校準曲線。 之後以測定試料溶液之溶出時間及檢測強度,由上述 校準曲線算出其分子量。 &lt; (5)黏度之測定&gt; 係對後述實施例、比較例中所製作的有機聚矽氧烷 (A1)至(A17)之測定用試樣,以日本東機產業公司製造 之TVE-22H,測定在溫度25°C下之黏度。 &lt; (6)通式(10)所示之化合物含量〔WB〕相對於通式(9) 所示之化合物含量〔WA〕之比(〔WB〕/〔WA〕)之計算〉 〔WA〕及〔WB〕之值,係以有機聚矽氧烷以基質輔助 游離化飛行時間型質譜分析法(以下以MALDI-TOF/MS表 示)測定所得之符合通式(9)及通式(10)的各構造之質 量、與納質量23所合計的質量所對應之峰的強度表示。 其中,符合該通式(9)及通式(10)之各構造的質 量,在上述構造之構成元素在具有同位素時,係指以在各 元素的同位素之質量内,其存在率為最大的同位素之質量 所計算之值。 323923 66 201247745 同時’符合通式(9)及通式(10)之峰存在複數個 時,具有通式(9)之構造的化合物之含量〔WA〕及通式(1〇) 所示的化合物之含量〔WB〕,各係符合其構造之峰強度之合 計值。 但’在相對於符合通式(9)及通式(1〇)之各構造 的質量及鈉質量23的合計質量所對應的峰之最大強度,其 具有強度3%以下之峰強度,在計算其峰強度之合計值時係 將其排除。 MALDI-TOF/MS之測定方法係以以下之方法進行。 &lt;MALDI-T0F/MS之測定方法&gt; 室溫下以將O.lg之如後述之實施例、比較例中所製 作的有機聚矽氧烷以5)、(人6)、(411)、(412)溶解於1〇〇此 之四氫咬喃之溶液、與以1 〇mg之蒽三紛(Di thrano 1)溶解 於lmL之四氫呋喃中之溶液’在室溫下以體積比丨:1之比 例均一混合製作成溶液其次,在其中裝入1;i/L以l〇mg 的碘化鈉溶解於lmL之丙酮中的溶液之試驗盤中再滴入1 eL之溶液a’之後於室溫下使溶劑蒸發後,以下述之測定 條件進行MALDI-TOF/MS之測定。 (測定條件) 裝置:日本島津公司AXIMA CFR plus 雷射光:氮氣雷射光( 337nm) 檢測器形式:線性式 離子檢測:正離子(正離子型) 累積次數:500次 323923 67 .201247745 &lt; (7)耐熱黃變性&gt; 以後述實施例、比較例中所製作之硬化物為測定用試 樣,使用厚度為3mm之硬化物’再以日本Konica_Min〇lta 公司製造之分光光度計CM-3600d (商品名)測定其γι (黃 度)。 其次’再將該硬化物以鋁箔包覆,於空氣中在l50°c 下進行加熱處理150小時’之後再以日本K〇nica-Minolta 公司製造之分光光度計CM-3600d (商品名)測定其γι (黃 度)。 其中以加熱處理前後之Y1的變化為ΔΥ1,評定ΔΥ1 低於1.0為◎,1.0以上且低於3.0為〇,3.0以上為χ。 &lt; (8)耐光性〉 其中以後述實施例、比較例中所製作之硬化物為測定 用試樣,使用厚度為3mm之硬化物,再以日本 Konica-Minolta公司製造之分光光度計CM-3600d (商品 名)測定其Y1 (黃度)。 其次,將該硬化物放置於設定為50°C之恒定的恒溫乾 燥機中,再以裝設365nm帶通濾波器的UV照射裝置(曰本 Ushio電機公司製造’商品名:SP-7 ) ’在365nm下以照度 4W/cm2照射1〇〇小時。 之後,再次以日本Konica-Minolta公司製造之分光 光度計CM-3600d (商品名)測定其Y1 (黃度)。以uv照射 前後之Π的變化為ΔΥ1 ’評定ΔΥ1低於1.0為©,1.0 以上且低於3. 0為〇,3.0以上為X。 323923 68 201247745 &lt; (9 )耐冷熱衝擊性&gt; 在20mmx20mnix2mm之平板中央設置有ΙΟιηπιΦ之深度 1mm的凹槽之聚苯二曱醯胺樹脂(s〇lvay公司製造AModel 4122 )之成形體的外殼材内配置5mmx5mmx0. 2mm之石夕晶片。 其次’將實施例1至17、比較例1至6中製作之硬化 性樹脂組成物注模’之後經過加熱或光硬化,形成密封石夕 晶片之硬化物(密封材),即可得到光半導體裝置之試驗 該得到之試驗片再以日本Espec公司製造之小型冷熱 衝擊裝置TSE-11以室溫至-40°C (15分鐘)至120¾ (15 分鐘)至室溫為1循環,以目視觀察至發生剝離為止之次 數0 以100次以上循環仍不發生剝離者為©,50次以上且 低於100次時發生剝離者為〇’低於50次時發生制離者為 X ° &lt; (10)硬度&gt; 後述實施例、比較例中所製作之硬化物為須彳定用試 樣’使用長35mmx寬8mmx厚2mm之硬化物,再以日本Ant〇n Parr公司製造之MCR-301測定-120°C至150°C (昇溫速度 2°C/分鐘)下之動態黏彈性。 硬度以30°C下(Γ (儲存模數)之數值,評定以1〇7 以上時為©,1〇6以上且低於107時為〇,低於1〇6時為χ。 &lt; (11)密接性&gt; 在20mmx20mmx2mm之平板中央設置有ΙΟπιηΐφ、深度 323923 69 ,201247745 lmra的凹槽之聚苯二甲醯胺樹脂(s〇ivay公司製造AModel 4122)的模型内,以實施例1至17、比較例1至6所製作 之硬化性樹脂組成物注模,之後經過加熱或光硬化即可得 到試驗片。 該得到之試驗片再以日本Espec公司製造之小型冷熱 衝擊裝置TSE-11以室溫至_4〇〇c (15分鐘)至i2〇cc (15 分鐘)至室溫為1循環,以目視觀察至剝離發生為止之次 數。 以100次以上循環仍不發生剝離者為◎,50次以上且 低於100次時發生剝離者為〇,低於50次時發生剝離者為 X ° &lt; (12)阻氣性&gt; 後述實施例、比較例中所製作之硬化物為測定用試 樣’使用其厚度〇. 2mm之l〇〇mmxi〇〇mm之硬化物,以 Systech Illinois日本公司製造,氧透過率測定裝置M〇del 8001,在溫度23°C、乾燥條件下測定其氧透過率。以氧透 過率低於500cc/m2/day時為◎,5〇〇cc/m2/day以上且低於 lOOOcc/mVday 時為〇,l〇〇〇cc/mVday 以上時為父。 〔實施例1〕 &lt;具有含不飽和鍵之基的有機聚矽氧烷(A1)之製造&gt; 在裝配有攪拌裝置、溫度計、回流冷凝器的3. 〇L之3 口蒸餾瓶中,加入53g (0.2莫耳)之作為(al)成分的 1,3,5’7-四曱基環四矽氧烷、27§(〇.1莫耳)之作為(32) 成分的甲基三(二甲矽氧基)矽烷、242g (〇.3莫耳)之作 323923 70 201247745 為(bl)成分的如下述平均組成式(B1-1)所示的重量平 均分子量為780之乙烯基二曱矽氧基末端的聚二甲基矽氧 烷、101g (0· 9莫耳)之作為(c)成分的6-乙烯基雙環 〔2.2.1〕庚-2-烯、1600g之曱苯及0.05g之氫醌單曱醚 (阻聚劑),於氮氣環境下攪拌並同時加溫至60°C。 CH2=CHSi(Me)2〇-(Si(Me)2〇)8-Si(Me)2CH=CH2.. . ( B1-1) 其中,上述平均組成式(B1-1)中,Me表示曱基(本 說明書中之實施例及比較例中所示之平均組成式中均同 樣。)。 之後,添加氯翻酸之異丙醇溶液,使銘金屬相對於加 成反應生成物之有機聚石夕氧烧的重量成為2Oppm之量。 在確定矽氫化反應開始後,即將該反應系保溫,並以 水冷或氣冷保持於55至65°C,同時攪拌72小時。 之後分析該蒸德瓶之内容物,可知其S i Η基之反應率 為 98%。 之後,再經過活性碳處理、餾除揮發成分,即可得到 350g之下述通式(40)所示之含不飽和鍵之基的有機聚石夕 氧烷(A1)。 該所得之含不飽和鍵之基的有機聚矽氧烷(A1),其 中不含(曱基)丙烯醯氧基,其含不飽和鍵之基的官能基當 量為694g/mol,由GPC測定計算之重量平均分子量為 37500,25°C 下之黏度為 2800mPa · s。 323923 71 201247745A solution of Cr(aCac)3 was used as the ruthenium sample. Further, with the measurement sample, α_4〇〇 manufactured by Knife Co., Ltd. of 里/〇 was measured by the cumulative number of times 4〇〇〇2, and the result of the measurement was analyzed. _ After that, the molecular structure of (H1 NMR, 丨3C NMR, 29Si Nmr 323923) t 201204545 = Γ = = (Α1) to (Al7) is analyzed. (3) Calculation of Functional Group Equivalent of (Mercapto) Acryloxy Group> The organic-based gas-like solution (4) liquid prepared in the comparative example of 30 mg of the above-mentioned bismuth-oxygen (8) to (A17) As a result of the dissolution of the atmosphere after the manufacture of the Japanese spectrophotometer, the sample was determined, and the analysis was carried out. The average composition of the knot was 200 times. 1 molecule = one sample for 0.15g The 8th (fourth) heart of the oxysonic gas is used for the measurement of the sample. Then, the sample is measured by the sputum, the sputum is divided into ΓΓ400, and the cumulative number of times is 4,000 times. The result of the analysis of the heart is determined by the organic (tetra) oxy-burning scorpion. After the average group, the results obtained by one side and one% of the households were analyzed and calculated (the functional equivalent of the methoxy group of the thiophene (the mass per i mole of the functional group). &lt; (4) Calculation of the weight average molecular weight &gt; ^ With respect to 100 mg of the sample for measurement of the organopolyoxane (A1) to (A17) prepared in the examples and the comparative examples described later, it was dissolved in a chloroform solvent at a ratio of 0.45. Filtration of βπι filter membrane as a sample solution. Re-column temperature 4 (TC, dissolved The flow rate of the liquid (chloroform) is imL/min, and the column (the structure of the column is used to protect the column using the Tskguard column Η hour-H (registered by 323923 65 201247745) manufactured by Sakamoto Tosoh Corporation). Tskgel (registered trademark) G5000H hour manufactured by Tosoh Corporation of Japan and Tskgel (registered trademark) G3000H hour manufactured by Sakamoto Tosoh Corporation, Tskgel (registered trademark) G1000H hour manufactured by Tosoh Corporation of Japan In addition, the molecular weights of 7,500,000, 2,560,000, 841, 700, 320,000, 148,000, 59, 500, 28, 500, 10, 850, 2, 930, 580, which are manufactured by Polymer Laboratories, are previously prepared. The molecular weight monodisperse polystyrene standard and the styrene monomer (molecular weight 104) were determined by RI to determine the calibration curve of the elution time. Then, the elution time and the detection intensity of the sample solution were measured, and the molecular weight was calculated from the calibration curve. &lt;(5) Measurement of Viscosity> Samples for measurement of organopolyoxane (A1) to (A17) produced in Examples and Comparative Examples described later, manufactured by Nippon Seiki Co., Ltd. Manufactured as TVE-22H, the viscosity at a temperature of 25 ° C was measured. (6) The content of the compound represented by the formula (10) [WB] relative to the content of the compound represented by the formula (9) [WA] Calculation of ratio ([WB]/[WA])> Values of [WA] and [WB] are matrix-assisted free time-of-flight mass spectrometry using organopolysiloxanes (hereinafter referred to as MALDI-TOF/MS) The intensity of the peak corresponding to the mass of each of the structures conforming to the general formulae (9) and (10) and the mass of the nanomass 23 is measured. In addition, the mass of each structure conforming to the general formula (9) and the general formula (10), when the constituent elements of the above structure have an isotope, means that the existence ratio is the highest within the mass of the isotope of each element. The value calculated for the mass of the isotope. 323923 66 201247745 A compound having the structure of the general formula (9) and a compound represented by the formula (1〇) when a plurality of peaks of the general formula (9) and the general formula (10) are present at the same time The content [WB], each line corresponds to the total value of the peak intensity of the structure. However, the maximum intensity of the peak corresponding to the mass of each of the structures conforming to the general formula (9) and the general formula (1) and the total mass of the sodium mass 23 has a peak intensity of 3% or less, and is calculated. The sum of the peak intensities is excluded. The measurement method of MALDI-TOF/MS was carried out in the following manner. &lt;Measurement Method of MALDI-T0F/MS&gt; The organopolysiloxane produced in the examples and the comparative examples described later in O.lg is 5), (human 6), (411) at room temperature. And (412) a solution of tetrahydrocyanate dissolved in 1 Torr, and a solution of 1 〇mg of Di thrano 1 dissolved in 1 mL of tetrahydrofuran at room temperature in a volume ratio: 1 ratio is uniformly mixed into a solution, followed by 1; i / L in a test dish of 1 〇 mg of sodium iodide dissolved in 1 mL of acetone and then dropped into 1 eL of solution a' After evaporating the solvent at room temperature, the measurement of MALDI-TOF/MS was carried out under the following measurement conditions. (Measurement conditions) Device: Japan Shimadzu Corporation AXIMA CFR plus Laser light: Nitrogen laser light (337nm) Detector form: Linear ion detection: Positive ion (positive ion type) Cumulative number: 500 times 323923 67 .201247745 &lt; (7 Heat-resistant yellowing property> The cured product produced in the examples and the comparative examples described later is a sample for measurement, and a cured product having a thickness of 3 mm is used, and a spectrophotometer CM-3600d manufactured by Konica Corporation of Japan is used. Name) Determine its γι (yellowness). Next, 'the cured product was coated with aluminum foil and heat-treated at 150 ° C for 150 hours in the air', and then measured by a spectrophotometer CM-3600d (trade name) manufactured by K〇nica-Minolta Co., Ltd., Japan. Γι (yellowness). Among them, the change in Y1 before and after the heat treatment was ΔΥ1, and it was evaluated that ΔΥ1 was less than 1.0, ◎, 1.0 or more and less than 3.0 were 〇, and 3.0 or more was χ. &lt; (8) Light resistance> The cured product produced in the examples and the comparative examples described later is a sample for measurement, and a cured product having a thickness of 3 mm is used, and a spectrophotometer CM manufactured by Konica-Minolta Co., Ltd., Japan is used. 3600d (trade name) measures its Y1 (yellowness). Next, the cured product was placed in a constant temperature dryer set to 50 ° C, and then a UV irradiation device (manufactured by Sakamoto Ushio Electric Co., Ltd., trade name: SP-7) equipped with a 365 nm band pass filter. Irradiation at 365 nm with an illumination of 4 W/cm 2 for 1 hour. Thereafter, the Y1 (yellowness) was measured again by a spectrophotometer CM-3600d (trade name) manufactured by Konica-Minolta Co., Ltd., Japan. The change in enthalpy before and after uv irradiation is ΔΥ1 ’. ΔΥ1 is less than 1.0, and 1.0 or more and less than 3.0 is 〇, and 3.0 or more is X. 323923 68 201247745 &lt; (9) Cold and thermal shock resistance> The outer shell of the molded body of a polyphenylene amide resin (AModel 4122 manufactured by s〇lvay Co., Ltd.) having a groove of 1 mm in depth at a center of a plate of 20 mm x 20 mn ix 2 mm 5mmx5mmx0. 2mm stone lithium wafer is arranged in the material. Next, 'the cured resin composition prepared in Examples 1 to 17 and Comparative Examples 1 to 6 is injection molded', and then heated or photohardened to form a cured product (sealing material) of the sealed stone wafer, thereby obtaining an optical semiconductor. Test of the device The test piece obtained was further observed by a small thermal shock device TSE-11 manufactured by Espec Corporation of Japan at room temperature to -40 ° C (15 minutes) to 1203⁄4 (15 minutes) to room temperature for 1 cycle. The number of times until the peeling occurs is 0. If the peeling does not occur in 100 cycles or more, the peeling is ©, and the peeling occurs when 50 or more and less than 100 times. When the number is less than 50, the person who produces the peeling is X ° &lt; 10) Hardness&gt; The cured product produced in the examples and the comparative examples described later is a sample for the preparation of the sample, which is a cured product having a length of 35 mm x a width of 8 mm and a thickness of 2 mm, and is measured by MCR-301 manufactured by AntAn Parr Co., Ltd., Japan. Dynamic viscoelasticity at -120 ° C to 150 ° C (temperature increase rate 2 ° C / min). The hardness is 30 ° C (the value of storage modulus), when it is 1〇7 or more, it is ©, when it is 1〇6 or more and below 107, it is 〇, and when it is less than 1〇6, it is χ. 11) Adhesiveness> In the model of a polyphthalamide resin (AModel 4122 manufactured by S〇ivay Co., Ltd.) in which a groove of ΙΟπιηΐφ, a depth of 323923 69, and 201247745 lmra was provided in the center of a 20 mm×20 mm×2 mm plate, Example 1 was 17. The curable resin composition prepared in Comparative Examples 1 to 6 was injection molded, and then subjected to heating or photohardening to obtain a test piece. The obtained test piece was further used as a small thermal shock device TSE-11 manufactured by Espec Corporation of Japan. From room temperature to _4 〇〇 c (15 minutes) to i2 〇 cc (15 minutes) to room temperature for 1 cycle, the number of times until peeling occurred was visually observed. The detachment occurred in 100 cycles or more. When 50 or more and less than 100 times, the peeling is 〇, and when it is less than 50 times, the peeling is X ° &lt; (12) Gas barrier properties> The cured products prepared in the examples and comparative examples described later are measured. Use the sample 'use a thickness of 〇. 2mm l〇〇mmxi〇〇mm hardened material to Systech The oxygen transmission rate measuring device M〇del 8001 manufactured by Illinois Japan Co., Ltd. measures the oxygen permeability at a temperature of 23 ° C under dry conditions. When the oxygen transmission rate is less than 500 cc/m 2 /day, it is ◎, 5 〇〇 cc / When m2/day or more and less than l00 cc/mVday, it is 〇, and l〇〇〇cc/mVday or more is parent. [Example 1] &lt;Organic polyoxyalkylene (A1) having a group containing an unsaturated bond Manufacture &gt; In a 3-neck retort of 3. 〇L equipped with a stirring device, a thermometer, and a reflux condenser, 53 g (0.2 mol) of 1,3,5'7-tetraindole as the (al) component was added. Base ring tetraoxane, 27 § (〇.1 mole) as the (32) component of methyl tris(dimethyl methoxy) decane, 242 g (〇. 3 mole) for 323923 70 201247745 for ( The bl) component is a polydimethylsiloxane having a weight average molecular weight of 780 as shown in the following average composition formula (B1-1), and a vinyl dimethoxy end group of 101 g (0.9 mol) (c) component of 6-vinylbicyclo [2.2.1] hept-2-ene, 1600 g of terpene and 0.05 g of hydroquinone monoterpene ether (polymerization inhibitor), stirred under nitrogen and simultaneously heated to 60 ° C. C H2=CHSi(Me)2〇-(Si(Me)2〇)8-Si(Me)2CH=CH2.. (B1-1) wherein, in the above average composition formula (B1-1), Me represents 曱The basis is the same in the average composition formula shown in the examples and comparative examples in the present specification. ). Thereafter, a chloropropanoic acid isopropanol solution was added to make the weight of the metal to the organic polyoxoflame of the addition reaction product to be 2 ppm. After confirming the start of the rhodium hydrogenation reaction, the reaction system was kept warm and kept at 55 to 65 ° C with water cooling or air cooling while stirring for 72 hours. After analyzing the contents of the steamed bottle, it was found that the reaction rate of the S i thiol group was 98%. Thereafter, the activated carbon treatment is carried out to distill off the volatile component, whereby 350 g of an organic polyoxosiloxane (A1) having an unsaturated bond group represented by the following formula (40) can be obtained. The obtained unsaturated polyether-containing organopolyoxane (A1), which does not contain (mercapto) acryloxy group, has a functional group equivalent of 694 g/mol of an unsaturated bond group, as determined by GPC The calculated weight average molecular weight was 37,500, and the viscosity at 25 ° C was 2,800 mPa · s. 323923 71 201247745

•••(40) 上述通式(40)中,m表示平均10之整數;η表示平 均8之整數。•••(40) In the above formula (40), m represents an integer of 10 on average; η represents an integer of 8 in average.

Si NMR測定之結果,可觀察到與構成單位相當之如下 所示之峰。 F1 : -17.2ppmAs a result of Si NMR measurement, a peak as shown below corresponding to the constituent unit was observed. F1 : -17.2ppm

Ml : + 8.8ppm T : -66.2ppm D2 : -19.8ppm D3 : -21.2ppm a/ ( b+c )之值為 0. 78。 但其中並未觀察到S : -32. 3ppm之峰;d/a之值為0。 &lt;硬化物之製造及特性評定&gt; 在100質量份之含不飽和鍵之基的有機聚矽氧烷(A1) 323923 72 201247745 中將2. 5質量份之過氧化-2-乙基己酸第三戊酯(日本化藥 Akzo公司製造,商品名:Trigonox 121-50E,50質量%溶 液)在氮氣下混合,攪拌使全體均一後,再經過脫泡即可 得到硬化性組成物。 之後將該硬化性組成物注入SUS316製之框架模型 中,以100°C下4小時、再以150°C下1小時進行硬化反應, 即可得到其硬化物。 該所得之硬化物特性方面之評定結果如下述表1所 示。 〔實施例2〕 &lt;含曱基丙烯醯氧基之有機聚矽氧烷(A2)之製造&gt; 在裝配有攪拌裝置、溫度計、回流冷凝器的3. 0L之3 口蒸餾瓶中,加入53g (0.2莫耳)之作為(al)成分的 1,3, 5, 7-四曱基環四矽氧烷、27g( 0.1莫耳)之作為(a2) 成分的曱基三(二曱矽氧基)矽烷、242g (0.3莫耳)之作 為(bl)成分的如下述平均組成式(B1-2)所示的重量平 均分子量為780之乙烯基二曱矽氧基末端的聚二曱基矽氧 烷、118g (0.9莫耳)之作為(c)成分的曱基丙烯酸3-丁稀酯、1600g之曱苯及0. 05g之敷酸單曱醚(阻聚劑), 於氮氣環境下攪拌並同時加溫至60°C。 CH2=CHSi(Me)2〇-(Si(Me)2〇)8-Si(Me)2CH=CH2. . . (B1-2) 之後,添加氯銘酸之異丙醇溶液,使始金屬,相對於 加成反應生成物之有機聚矽氧烷的重量成為20ppm之量。 在確定矽氫化反應開始後,即將該反應系保溫,並以 323923 73 •201247745 ' 水冷或氣冷保持於55至65°C,同時攪拌72小時。 之後分析該蒸餾瓶之内容物’可知其SiH基之反應率 為 99%。 之後,再經過活性碳處理、餾除揮發成分,即可得到 370g之下述通式(41)所示之含曱基丙烯醯氧基之有機聚 矽氧烷(A2)。 該所得之含曱基丙烯醯氧基之有機聚矽氧烷(A2)的 官能基當量為714g/mol,由GPC測定計算之重量平均分子 量為38200,25°C下之黏度為2600mPa · s。Ml: + 8.8ppm T : -66.2ppm D2 : -19.8ppm D3 : -21.2ppm a/ ( b+c ) has a value of 0.78. However, no peak of S: -32. 3ppm was observed; the value of d/a was zero. &lt;5 parts by mass of peroxy-2-ethylhexyl group in an organic polyoxyalkylene (A1) 323923 72 201247745 containing 100 parts by mass of an unsaturated bond-containing group The acid tertiary amyl ester (manufactured by the Japanese chemical company Akzo Co., Ltd., trade name: Trigonox 121-50E, 50% by mass solution) was mixed under nitrogen, stirred to make the whole uniform, and then defoamed to obtain a curable composition. Then, the curable composition was poured into a frame model made of SUS316, and the hardened material was obtained by curing at 100 ° C for 4 hours and at 150 ° C for 1 hour. The evaluation results of the obtained cured product characteristics are shown in Table 1 below. [Example 2] &lt;Production of a mercapto propylene oxy group-containing organopolyoxane (A2)&gt; In a 3.0 L retort equipped with a stirring device, a thermometer, and a reflux condenser, 53 g (0.2 mol) of 1,3,5,7-tetradecylcyclotetraoxane as an (al) component, and 27 g (0.1 mol) of a sulfhydryl group (a) as a component (a2) Oxy)decane, 242 g (0.3 mol) of a polydifluorenyl group having a weight average molecular weight of 780 as shown in the following average composition formula (B1-2) as a component (bl)矽 烷 118 118 118 118 118 118 118 118 118 118 118 118 118 118 118 118 118 118 118 118 118 118 118 118 118 118 118 118 118 118 118 118 118 118 118 118 118 118 118 118 118 118 Stir and simultaneously warm to 60 °C. CH2=CHSi(Me)2〇-(Si(Me)2〇)8-Si(Me)2CH=CH2. (B1-2) After that, add isopropyl alcohol solution in isopropyl alcohol to make the starting metal, The weight of the organopolyoxane relative to the addition reaction product was 20 ppm. After confirming the start of the rhodium hydrogenation reaction, the reaction system was incubated and maintained at 55 to 65 ° C with water cooling or air cooling at 323923 73 • 201247745 while stirring for 72 hours. Thereafter, the contents of the distillation flask were analyzed, and the reaction rate of the SiH group was found to be 99%. Thereafter, the activated carbon treatment is carried out to distill off the volatile component, whereby 370 g of the mercaptopropenyloxy group-containing organopolyoxane (A2) represented by the following formula (41) can be obtained. The obtained mercaptopropenyloxy group-containing organopolyoxane (A2) had a functional group equivalent of 714 g/mol, a weight average molecular weight calculated by GPC of 38,200, and a viscosity at 25 ° C of 2,600 mPa·s.

上述通式(41)中,m表示平均1〇之整數;n表示平 均8之整數。In the above formula (41), m represents an integer of 1 平均 on average; n represents an integer of 8 in average.

Si NMR測定之結果,可觀察到與構成單位相當之如下 323923 201247745 所示之峰。 F1 : -18. 2pPm Ml : +8. 8ΡΡ® T : -66. 2pPffl D2 : -19.8pPm D3 : -21. 2pPm a/ (b+c)之值為 〇. 78。 0 但其中並来觀察到S . -32. 3ppm之峰;d/a &lt;硬化物之製造及特性s平定〉 為 在100質量份之含甲基丙烯醯氧基之有 (A2)中將2. 5質量份之過氧化-2-乙基已醆第=矽氣烷 本化藥Akzo公司製造,商品名:Trig〇n〇x 12^酉旨(曰 質畺%溶液)在乳氣下〉昆合,進行授拌使 50 過脫泡即可得到硬化性組成物。 丹*士 之後將該硬化性Μ成物注入_16製之框架模型 中,以loot下4小時、再以15〇ΐτ丨 ”、 即可得到其硬化物。 了1 W撕硬化反應, 該所得之硬化物特性之評定結 〔實施例3〕 *如下述表1所示。 &lt;吕:基⑽醯氧基之有機料氧炫(Α3)之 口蒸餾有攪拌裝置、溫度計、回流冷凝器的3.肌之3 1 3 5 7〜甲^入^ (〇.2莫耳)之作為⑸)成分的 323923 成分的四(^四梦纽、莫耳)之作為⑽ (-W氣基)魏、2G3g( 〇. 3莫耳)之作為(⑴ 75 201247745 成分的如下述平均組成式(B1-3)所示的重量平均分子量 為780之乙烯基二甲矽氧基末端的聚二甲基矽氧烷、118g (0.9莫耳)之作為(c)成分的曱基丙烯酸-3-丁烯酯、 1500g之曱苯及0. 05g之氫醌單曱醚(阻聚劑),於氮氣下 攪拌並同時加溫至60°C。 CH2=CHSi(Me)2〇-(Si(Me)2〇)8-Si(Me)2CH=CH2. · . (B1-3) 之後,添加氯鉑酸之異丙醇溶液,使鉑金屬相對於加 成反應生成物之有機聚石夕氧烧的重量成為2Oppm之量。 在確定矽氫化反應開始後,即將該反應系保溫,並以 水冷或氣冷保持於55至65°C,同時攪拌72小時。 之後分析該蒸餾瓶之内容物,可知其SiH基之反應率 為 97%。 之後,再經過活性碳處理、餾除揮發成分,即可得到 330g之下述通式(42)所示之含曱基丙烯醯氧基之有機聚 矽氧烷(A3)。 該所得之含曱基丙烯醯氧基之有機聚矽氧烷(A3)的 官能基當量為626g/mo卜由GPC測定計算之重量平均分子 量為34200,25°C下之黏度為3500mPa · s。 323923 76 201247745As a result of Si NMR measurement, a peak represented by the following 323923 201247745 which is equivalent to the constituent unit was observed. F1 : -18. 2pPm Ml : +8. 8ΡΡ® T : -66. 2pPffl D2 : -19.8pPm D3 : -21. The value of 2pPm a/ (b+c) is 〇. 78. 0, but a peak of S. -32. 3ppm is observed in the same place; d/a &lt;manufacturing and characteristics of the hardened material s are determined> in 100 parts by mass of the methacryloxy group containing methoxy group (A2) 2. 5 parts by mass of peroxy-2-ethylhexanide = oxazane. The chemical is manufactured by Akzo, trade name: Trig〇n〇x 12^酉(曰曰畺% solution) under milk 〉 Kunming, the mixing is carried out so that 50 can be defoamed to obtain a hardenable composition. After the Danshishi, the sclerosing sputum was injected into the frame model of _16, and the hardened material was obtained by looking for 4 hours and then 15 〇ΐ 丨 。. 1 W tearing hardening reaction, the result Evaluation of the properties of the cured product [Example 3] * As shown in Table 1 below. &lt;Lv: base (10) decyloxy organic material Oxygen (Α3) is distilled with a stirring device, a thermometer, a reflux condenser 3. The muscle 3 3 3 5 7 ~ A ^ ^ ^ (〇. 2 Moer) as (5)) The composition of the 323923 component of the four (^ four dreams, Moer) as (10) (-W gas base) Wei 2G3g (〇. 3 mole) as the (1) 75 201247745 component, as shown in the following average composition formula (B1-3), the weight average molecular weight of 780 is the vinyl dimethyl methoxy end of the polydimethyl hydrazine. Oxysilane, 118 g (0.9 mol) of methacrylic acid-3-butenyl ester as component (c), 1500 g of fluorene benzene and 0.05 g of hydroquinone monoterpene ether (polymerization inhibitor), stirred under nitrogen And simultaneously heated to 60 ° C. CH2 = CHSi (Me) 2 〇 - (Si (Me) 2 〇 ) 8 - Si (Me) 2 CH = CH 2 · · (B1-3), after adding chloroplatinic acid Isopropanol solution to make platinum metal relative to addition The weight of the organic polysulfide of the product to be formed was 2Oppm. After the start of the hydrogenation reaction, the reaction system was kept warm and kept at 55 to 65 ° C with water cooling or air cooling while stirring for 72 hours. Then, the content of the retort was analyzed, and the reaction rate of the SiH group was 97%. Then, after the activated carbon treatment and the volatile component were distilled off, 330 g of the ruthenium represented by the following formula (42) was obtained. Alkyloxy alkoxy-organopolyoxyalkylene (A3). The obtained functional group equivalent of the mercaptopropenyloxy-containing organopolyoxane (A3) is 626 g/mo, and the weight average calculated by GPC The molecular weight is 34,200, and the viscosity at 25 ° C is 3500 mPa · s. 323923 76 201247745

XX

HjCHjC

-/ i、 (JJ 、〆 •〜CHj V HjC〆、 」〆? ! v ί 於、丨 X! a «i \/ y . VW、〇)rsN. 0—1、 H2C. H#、 ./ λ/'-/ i, (JJ, 〆•~CHj V HjC〆, 〆? ! v ί 于, 丨X! a «i \/ y . VW, 〇) rsN. 0-1, H2C. H#, ./ λ/'

r\ H 入haa:叫-0 &quot;vww、1 {^C /Hz ΐ / ,)〜的H b '《vOdc^C、;〆 一tC HlC—SI—CH3 -«、 »3^Γ2 Ηβ、户 ^f), Hac^ )、n (Ah2 ' 产 * v,ΓΗν'々-γΐ?Ό:sj/.Vv^^sv^csCI \_/4s^^xhy Η^ί), -( 咸 r ^ 兮'/CH3 h'/Ch3h: • · -(42) 上述通式(42)中,m表示平均5之整數;n表示平 均8之整數。r\ H into haa: called -0 &quot;vww, 1 {^C /Hz ΐ / ,)~ H b '"vOdc^C,; 〆一tC HlC-SI-CH3 -«, »3^Γ2 Ηβ , household ^f), Hac^ ), n (Ah2 'produced * v, ΓΗν'々-γΐ?Ό:sj/.Vv^^sv^csCI \_/4s^^xhy Η^ί), -( salty r ^ 兮 '/CH3 h'/Ch3h: • - (42) In the above formula (42), m represents an integer of 5; and n represents an integer of 8 on average.

Si NMR測定之結果,可觀察到與構成單位相當之如下 所示之峰。 F1 · -18.2ppm Ml : + 8.8ppm D2 : -19.8ppm 323923 77 201247745 D3 : -21. 2pPm S : -32.3pPra a/ (b+c)之值為丨· 08 ; d/a之值為〇· 〇8。 &lt;硬化物之製造及特性評定&gt; 在議質量份之含甲基丙_氧基之有機聚石夕氧烧 (A3)中將2.5質$份之過氣化_2_乙基己酸第三戊醋(日 本化藥Akzo公司製造,商品名:Trig〇n〇x 121_通,5〇 質量%溶液)在氮氣下混合,進行攪拌使全體均一後,再經 過脫泡即可得到硬化性組成物。 中二ΓΓΐ組成物注入瞻6製之框架模型 中,以100C下4小時、再以15 即可得到其硬化物。 ’、時進行硬化反應’ 該所得之硬化物特性之評 〔實施例4〕 如下核1所示。 &lt;含=丙稀醯氧基之有機聚 在裝配«拌裝置、溫料、㈣冷凝 1-,一環四為:)成分的、 成分的如T述平·成式(叫)所_ 86…苯及_之 境下攪拌並同時加溫至6代。 於氮现% 323923 CH2,Si(Me)2(Ksi(Me)2〇)8_Si(Me)2CH,2. . · (bh) 78 201247745 之後,添加氣翻酸之異丙醇溶液,使銘金屬相對於加 成反應生成物之有機聚梦氧院的重量成為2Oppm之量。 在確定矽氫化反應開始後,即將該反應系保溫,並以 水冷或氣冷保持於55至65°C,同時攪拌72小時。 之後分析該蒸德瓶之内容物,可知其S i Η基之反應率 為 99%。 之後,再經過活性碳處理、餾除揮發成分,即可得到 205g之下述通式(43)所示之含曱基丙烯醯氧基之有機聚 矽氧烷(A4)。 該所得之含曱基丙烯醯氧基之有機聚矽氧烷(A4)的 官能基當量為600g/mol,由GPC測定計算之重量平均分子 量為19800,25°C下之黏度為4500mPa · s。As a result of Si NMR measurement, a peak as shown below corresponding to the constituent unit was observed. F1 · -18.2ppm Ml : + 8.8ppm D2 : -19.8ppm 323923 77 201247745 D3 : -21. 2pPm S : -32.3pPra a/ (b+c) The value is 丨· 08 ; The value of d/a is 〇 · 〇8. &lt;Manufacturing and Characterization of Hardened Material&gt; 2.5 parts by weight of pervaporized _2-ethylhexanoic acid in the mass part of the methyl propyl-oxy group-containing organic polyoxo (A3) The third pentaacetic acid (manufactured by Akzo Co., Ltd., trade name: Trig〇n〇x 121_pass, 5〇 mass% solution) is mixed under nitrogen, stirred to make the whole uniform, and then defoamed to obtain hardening. Sexual composition. The composition of the middle bismuth compound is injected into the framework model of the 6th system, and the cured product is obtained at 4C for 4 hours and then at 15 minutes. ', hardening reaction at the time' Evaluation of the obtained cured product [Example 4] The following shows the following. &lt;organic polycondensation containing acryloxy group in the assembly «mixing device, warm material, (four) condensation 1-, one ring four is:), the composition of the composition such as T-single-form (called) _ 86... Stir under benzene and _ while heating to 6 generations. After the nitrogen is present, 3% 923923 CH2, Si(Me)2(Ksi(Me)2〇)8_Si(Me)2CH, 2. . . (bh) 78 201247745, add the gas-alcoholic isopropanol solution to make the metal The weight of the organic polyoxygenator relative to the addition reaction product was 2 ppm. After confirming the start of the rhodium hydrogenation reaction, the reaction system was kept warm and kept at 55 to 65 ° C with water cooling or air cooling while stirring for 72 hours. After analyzing the contents of the steamed bottle, it was found that the reaction rate of the S i thiol group was 99%. Thereafter, the activated carbon treatment is carried out to distill off the volatile component, whereby 205 g of the mercaptopropenyloxy group-containing organopolyoxane (A4) represented by the following formula (43) can be obtained. The obtained mercaptopropenyloxy group-containing organopolyoxane (A4) had a functional group equivalent of 600 g/mol, a weight average molecular weight calculated by GPC of 19,800, and a viscosity at 25 ° C of 4,500 mPa·s.

•••(43) 上述通式(43)中,m表示平均15之整數;η表示平 均8之整數。•••(43) In the above formula (43), m represents an integer of 15 on average; η represents an integer of 8 in average.

Si NMR測定之結果,可觀察到與構成單位相當之如下 所示之峰。 F1 : -18.2ppm 323923 79 201247745As a result of Si NMR measurement, a peak as shown below corresponding to the constituent unit was observed. F1 : -18.2ppm 323923 79 201247745

Ml : + 8.8ppm D2 : -19.8ppm D3 : -21.2ppm a/ (b+c)之值為 1· 13。 但其中並未觀察到S · -32. 3ppm之峰;d/a之值為〇。 &lt;硬化物之製造及特性評定&gt; 在100質量份之含甲基丙烯醯氧基之有機聚矽氧烷 (Α4)中將2. 5質量份之過氧化-2-乙基己酸第三戊酯(曰 本化藥Akzo公司製造’商品名:Trigonox 121-50Ε,50 質量%溶液)在氮氣下混合,進行攪拌使全體均一後,再經 過脫泡即可得到硬化性組成物。 之後將該硬化性組成物注入SUS316製之框架模型 中’以10(TC下4小時、再以150°C下1小時進行硬化反應, 即可得到其硬化物。 該所得之硬化物特性之評定結果如下述表1所示。 〔實施例5〕 &lt;含甲基丙烯醯氧基之有機聚矽氧烷(A5)之製造〉 +在袭配有攪拌裝置、溫度計、回流冷凝器的3. 〇L之3 中’加入68g (G 3莫耳)之作為(al)·成分的 成分的如四石夕氧燒、51“°.3莫耳)之作為(bi) 乙嫌其-均組成式(β1_5)所示的分子量為U6之 耳)之夕氧基末端的二甲基二石夕氧烷、11% (〇.9莫 苯及0 〇 成分的甲基丙烯酸丁烯酯、795忌之〒 .4之氳靦單甲醚(阻聚劑),於氮氣環境下攪拌並 323923 201247745 同時加溫至6〇°c反應 CH2=CHSi(Me)2〇^Cs.ru χ y UMe)2〇)8-Si(Me)2CH=CH2. . . (Bl-5) '、氣銷酸之異丙醇溶液,使銘金屬相對於加 成反應生成物之有機聚錢烧的重減為2Gppm之量。 在確定石夕氣化反應開始後,即將該反應系保溫,並以 水冷或氣冷保持於55至65¾,同時攪拌72小時。 之後分析該蒸餾瓶之内容物,可知其siH基之反應率 為 99%。 之後’再經過活性碳處理、餾除揮發成分,即可得到 188g之下述通式(44)、下述通式(45)及下述通式(46) 所示之含曱基丙稀醯氧基之有機聚矽氧烷(A5)。 該所得之含甲基丙烯醯氧基之有機聚矽氧烷(A5)的 官能基當量為350g/mol,由GPC測定計算之重量平均分子 量為16400,25°C下之黏度為15000mPa . s。 該所得之含甲基丙烯醯氧基之有機聚矽氧烧(A5)的 [WB]/[WA]之值為1. 7。又,通式(45)相當於通式(9) ’ 通式(46)相當於通式(1〇)。Ml: + 8.8 ppm D2: -19.8 ppm D3: -21.2 ppm a/ (b+c) has a value of 13.13. However, no peak of S · -32. 3ppm was observed; the value of d/a was 〇. 5质量份的氧化氧乙乙酸的第第5质量份的乙乙乙乙酸酸Triamhyl ester (product name: Trigonox 121-50 Ε, 50% by mass solution manufactured by Akzo Co., Ltd.) was mixed under nitrogen, stirred to make the whole uniform, and then defoamed to obtain a curable composition. Then, the curable composition was injected into a frame model made of SUS316 to obtain a cured product by 10 (4 hours at TC and then at 150 ° C for 1 hour). The obtained cured product was evaluated. The results are shown in the following Table 1. [Example 5] &lt;Production of a methacryloxy group-containing organopolyoxane (A5)> A stirring apparatus, a thermometer, and a reflux condenser were used. In 3L 3, '68g (G 3 mole) is added as a component of (al)·component, such as Si Shi Xi Oxygen, 51 “°. 3 Moh” (bi) The molecular weight of the formula (β1_5) is dimethyl oxalate of the oxy group at the end of the U6, 11% of the methacrylic acid butyrate of 〇.9 benzene and 0 〇, 795 After the .4 氲腼 monomethyl ether (polymerization inhibitor), stirred under nitrogen atmosphere and 323923 201247745 simultaneously heated to 6 ° ° c reaction CH2 = CHSi (Me) 2 〇 ^ Cs.ru χ y UMe) 2 〇)8-Si(Me)2CH=CH2. . . (Bl-5) ', the isopropyl alcohol solution of the gas-storing acid, the weight of the organic poly-burning of the metal with respect to the addition reaction is 2Gppm The amount of After the start of the reaction, the reaction was kept warm and kept at 55 to 653⁄4 with water or air cooling while stirring for 72 hours. After analyzing the contents of the distillation flask, the reaction rate of the siH group was 99%. Further, after the activated carbon treatment and distillation of the volatile component, 188 g of the fluorenyl-containing fluorenyloxy group represented by the following formula (44), the following formula (45), and the following formula (46) can be obtained. The organopolyoxyalkylene (A5). The obtained methacryloxy-containing organopolyoxane (A5) has a functional group equivalent of 350 g/mol, and the weight average molecular weight calculated by GPC is 16,400,25. The value of [WB]/[WA] of the obtained methacryloxy group-containing organic polyfluorene oxide (A5) is 1.7. Further, the formula (45) ) corresponds to the formula (9) ' The formula (46) corresponds to the formula (1).

323923 • · (44) 201247745323923 • · (44) 201247745

上述通式(44)中,m表示平均25之整數;η表示平 均0之整數。In the above formula (44), m represents an integer of 25; and η represents an integer of 0.

Si NMR測定之結果,可觀察到與構成單位相當之如下 所示之峰。 F1 · -18.2ppm Ml : + 8.8ppm D2 : -19·8ppm a/ (b+c)之值為 1. 04。 但其中並未觀察到S : -32. 3ppm之峰;d/a之值為0。 &lt;硬化物之製造及特性評定&gt; 在100質量份之含甲基丙烯醯氧基之有機聚矽氧烷 (A5)中將2. 5質量份之過氧化-2-乙基己酸第三戊酯(曰 323923 82 .201247745 本化藥Akzo公司製造,商品名. 質量。溶液)在氣氣下混合,進行= _Χ121—通,50 過脫泡即可得到硬化性組成物。料使全體均—後,再經 之後將該硬化性組成物注人咖31 10〇°CT4,J&gt;a$&gt;#^ 15〇〇 , ± 即可得到其硬化物。 C下卜】、時進行硬化反應, 該所得之硬化物特性之評定結果如下述表i所示。 〔實施例6〕 〈含甲基丙烯醯氧基之有機聚矽氧烷(A6)之製造〉 在襄配有麟褒置、溫度計、回流冷凝器的3.儿之3 口蒸鶴瓶中,加入201g(0.8莫耳)之作為(al)成分的 以^’了-四甲基環四石夕氧烧以㈣以莫耳⑷乍為⑻) 成分的如下述平均組成式(B1_6)所示的分子量為186之 乙烯基二曱矽氧基末端的聚二甲基矽氧烷、97g(0. 7莫耳) 之作為(c)成分的曱基丙烯酸_3_丁烯酯、2i38g之甲苯 及0. 05g之氫醌單甲醚(阻聚劑),於氮氣環境下攪拌並同 時加溫至60°C反應。 CH2=CHSi (Me)2〇~(Si (Me)2〇)8_Si (Me)2CH=CH2· ·. ( B1_6) 之後’添加氣鉑酸之異丙醇溶液,使鉑金屬相對於加 成反應生成物之有機聚矽氧烷的重量成為2〇ppm之量。 在確定矽氣化反應開始後,即將該反應系保溫,並以 水冷或氣冷保持於55炱65°C,同時攪拌72小時。 之後分析該蒸餾瓶之内容物’可知其SiH基之反應率 為 99%。 323923 83 201247745 之後,再經過活性碳處理、餾除揮發成分,即可得到 520g之下述通式(47)、下述通式(48)及下述通式(49) 所示之含甲基丙烯醯氧基之有機聚矽氧烷(A6)。 該所得之含曱基丙烯醯氧基之有機聚矽氧烷(A6)的 官能基當量為1157g/mol,由GPC測定計算之重量平均分 子量為98600,25°C下之黏度為26000mPa · s。 該所得之含曱基丙烯醯氧基之有機聚矽氧烷(A6)之 [WB]/[WA]之值為10. 1。又,通式(48)相當於通式(9), 通式(49)相當於通式(10)。As a result of Si NMR measurement, a peak as shown below corresponding to the constituent unit was observed. F1 · -18.2ppm Ml : + 8.8ppm D2 : -19·8ppm a/ (b+c) The value is 1. 04. However, no peak of S: -32. 3ppm was observed; the value of d/a was zero. 5质量份的氧化氧化乙乙酸酸的。 The mass of the methacryloxy-containing organopolyoxane (A5) in an amount of 2.5 parts by mass of peroxy-2-ethylhexanoic acid Triamyl ester (曰323923 82.201247745 manufactured by Akzo Co., Ltd., trade name. Quality. Solution) is mixed under air gas, and = _Χ121-pass is passed, and 50 is defoamed to obtain a curable composition. After the whole is made, the cured composition is obtained by injecting the curable composition into a coffee bean, 10 10 ° ° CT 4 , J &gt; a $ &gt;# 15 15 , ± . In the case of C, the hardening reaction was carried out, and the evaluation results of the obtained cured product characteristics are shown in the following Table i. [Example 6] <Production of organopolyoxyalkylene (A6) containing methacryloxyloxy group> In a steaming crane bottle equipped with a sputum, a thermometer, and a reflux condenser, 201 g (0.8 mol) of the (al) component is represented by the following average composition formula (B1_6), which is a component of (4) 莫 (4) 乍 (8)). a polydimethylsiloxane having a vinyl dimethoxy end group having a molecular weight of 186, 97 g (0.7 mol) of a methacrylic acid _3-butenyl ester as a component (c), and 2i38 g of toluene and 0. 05g of hydroquinone monomethyl ether (polymerization inhibitor), stirred under nitrogen atmosphere and simultaneously heated to 60 ° C reaction. CH2=CHSi (Me)2〇~(Si (Me)2〇)8_Si (Me)2CH=CH2· ·. (B1_6) Then add 'Ig platonic acid in isopropanol solution to form platinum metal relative to addition reaction The weight of the organic polyoxane of the substance is 2 〇 ppm. After the start of the helium gasification reaction was determined, the reaction system was kept warm and kept at 55 炱 65 ° C with water cooling or air cooling while stirring for 72 hours. Thereafter, the contents of the distillation flask were analyzed, and the reaction rate of the SiH group was found to be 99%. 323923 83 201247745 After that, after the activated carbon treatment and distillation of the volatile component, 520 g of the methyl group represented by the following formula (47), the following formula (48), and the following formula (49) can be obtained. Alkyloxy-organopolyoxymethane (A6). The obtained mercaptopropenyloxy group-containing organopolyoxane (A6) had a functional group equivalent of 1157 g/mol, a weight average molecular weight calculated by GPC of 98,600, and a viscosity at 25 ° C of 26,000 mPa·s. The value of [WB]/[WA] of the obtained fluorenyl propylene oxy group-containing organopolyoxane (A6) was 10.1. Further, the formula (48) corresponds to the formula (9), and the formula (49) corresponds to the formula (10).

HaC I/HaC I/

(47) 323923 84 201247745(47) 323923 84 201247745

'c/CH3 I P〆、'c/CH3 I P〆,

上述通式(47)中,m表示平均30之整數;n表示平 均0之整數。In the above formula (47), m represents an integer of 30 on average; n represents an integer of 0.

Si NMR測定之結果,可觀察到與構成單位相當之如下 所示之峰。 F1 : -18.2ppm Ml : + 8.8ppm D2 · -19.8ppm a/ (b+c)之值為 0. 16。 323923 85 201247745 但其中並未觀察到S: -32.3ppm之峰;d/a之值為0。 &lt;硬化物之製造及特性評定〉 在100質量份之含曱基丙烯醯氧基之有機聚矽氧烷 (⑹中將2.5Ϊ量份之過氧化-2-乙基己酸第三戊酉旨(曰 本化藥Akzo公司製造,商品名:Trig_x 1215〇Ε,5〇 質量%溶液)在氮氣下現合,進行攪拌使全體均一後 ,再經 過脫泡即可制硬恤组成物。 後將4硬化性組成物注入別$316製之框架模型 中,以100。〇:下4小β主π 。 寺、再以15〇C下1小時進行硬化反應, 即可得到其硬化物。 該所得之硬化物特性之評定結果如下絲 〔實施例7〕 〈含甲基丙烯醯氧基之有機聚矽氧烷(A?)之製造&gt; •^裝配有攪拌農置、溫度計、回流冷凝器的3.儿之3 口洛館瓶中,加入f η 1苜[、 ! Q , 7 (0. 1莫耳)之作為(al)成分的 二二:甲基環四石夕氧烧、13g(〇·05莫耳)之作為⑽ :、土二(二甲矽氧基)矽烷及0.1g( 0.002莫耳)之 四甲矽烷、U9g 9 # ή·、&gt; &amp; &amp; ^ έ0 ·莫耳)之作為(bl)成分的如下述 千句、K (BM)所示的重量平均 基二”氧基末端的聚二曱基錢燒、53丄二: 作為U)成分㈣基丙、 〇.〇5g之氫醌單甲醚「阳㈣、綱曰、,之甲本及 加溫至6(TC反應。㈣),於氮氣環境下㈣並同時 CH2.Si(Me)泰(Si(Me)2〇)8_si(Me)2CH=cH2...⑽π 323923 86 201247745 之後,添加氯鉑酸之異丙醇溶液,使鉑金屬相對於加 成反應生成物之有機聚石夕氧烧的重量成為2Oppm之量。 在確定矽氫化反應開始後,即將該反應系保溫,並以 水冷或氣冷保持於55至65°C,同時攪拌72小時。 之後分析該蒸餾瓶之内容物,可知其SiH基之反應率 為 99%。 之後,再經過活性碳處理、餾除揮發成分,即可得到 180g之下述通式(50)所示之含曱基丙烯醯氧基之有機聚 矽氧烷(A7)。 該所得之含曱基丙烯醯氧基之有機聚矽氧烷(A7)的 官能基當量為767g/mol,由GPC測定計算之重量平均分子 量為 189800,25°C 下之黏度為 4500OmPa · s。As a result of Si NMR measurement, a peak as shown below corresponding to the constituent unit was observed. F1 : -18.2ppm Ml : + 8.8ppm D2 · -19.8ppm a/ (b+c) The value is 0.16. 323923 85 201247745 However, no S: -32.3 ppm peak was observed; d/a has a value of zero. &lt;Manufacturing and Characterization of Hardened Material> In 100 parts by mass of an organopolyoxyalkylene group containing a mercaptopropenyloxy group (2.5 parts by weight of a perylene-2-ethylhexanoic acid, a third amyl group) The product (trade name: Trig_x 1215〇Ε, 5〇 mass% solution) was mixed under nitrogen, stirred to make the whole uniform, and then defoamed to prepare a hard-shirt composition. Inject the 4 hardening composition into the frame model of the other $316, to 100. 〇: the next 4 small β main π. The temple, and then harden the reaction at 15 ° C for 1 hour to obtain the hardened material. The evaluation results of the properties of the cured product are as follows (Example 7) <Manufacture of organopolyoxyalkylene (A?) containing methacryloxyloxy group&gt; • Mounted with stirring agricultural, thermometer, reflux condenser 3. In the 3 bottles of the Luo Museum, add f η 1苜[, ! Q, 7 (0. 1 mol) as the (al) component of the 22nd: methyl ring Si Shixi Oxygen, 13g ( 〇·05 Moer) (10) :, earth (dimethoxy) decane and 0.1 g (0.002 mol) of tetradecane, U9g 9 # ή·, &gt;&amp;&amp; ^ Έ0 · Moer) as a (bl) component, as shown in the following sentence, K (BM), weight average bis- oxy end group, polydiphenyl ketone, 53 丄 2: as U) component (tetra)丙, 〇. 〇 5g of hydroquinone monomethyl ether "yang (four), 曰,,, and the heating to 6 (TC reaction. (d)), under nitrogen atmosphere (four) and at the same time CH2.Si (Me) Thai ( Si(Me)2〇)8_si(Me)2CH=cH2...(10)π 323923 86 201247745 Then, a solution of chloroplatinic acid in isopropanol is added to make the platinum metal with respect to the addition reaction product of the organic polysulfide The weight is 2Oppm. After determining the start of the hydrogenation reaction, the reaction system is kept warm and kept at 55 to 65 ° C with water cooling or air cooling while stirring for 72 hours. After analyzing the contents of the distillation bottle, it is known that The reaction rate of the SiH group is 99%. After that, the activated carbon is treated and the volatile component is distilled off to obtain 180 g of an organopolyoxyalkylene group having a mercaptopropenyloxy group represented by the following formula (50). (A7) The functional group equivalent of the obtained mercaptopropenyloxy group-containing organopolyoxane (A7) is 767 g/mol, which is calculated by GPC. The average molecular weight of the viscosity of the 189800,25 ° C 4500OmPa · s.

H3C CHaHjC CHjH^C CH3 H3\ H3C—Si—CH3 0H3C ch3 〜T、)、又〆HAr ch3 h2 /\ l\ I\ h2 HaC CH^3C CHaHaC CH3H3C CHaHjC CHjH^C CH3 H3\ H3C—Si—CH3 0H3C ch3 〜T,), 〆HAr ch3 h2 /\ l\ I\ h2 HaC CH^3C CHaHaC CH3

• -(50) 323923 87 201247745 上述通式(50)中’10表示平均5〇之整數;n 均8之整數。 τ• -(50) 323923 87 201247745 In the above formula (50), '10 represents an integer of 5 Å on average; n is an integer of 8 each. τ

Si NMR測定之結果,可觀察到與構成單位相當之如下 所示之峰。 F1 ·· -18. 2ppmAs a result of Si NMR measurement, a peak as shown below corresponding to the constituent unit was observed. F1 ·· -18. 2ppm

Ml : + 8.8ppm T : -66.2ppm D2 : -19.8ppm D3 : -21·2ppm a/ (b+c)之值為 〇. 7〇。 但其中並未觀察到S : -32. 3ppm之峰;d/a之值為〇。 &lt;硬化物之製造及特性評定&gt; ‘ 在100質量份之含甲基丙烯醯氧基之有機聚矽氧烷 (Α7)中將2.5 f量份之過氧化_2_乙基己酸第三戊酉旨(曰 本,藥Akzo公司製造,商品名:Trig〇n〇x 121、5〇e,5〇 質量%溶液)在氮氣下混合,進行攪拌使全體均一後,再經 過脫泡即可得到硬化性組成物。 之後將該硬化性組成物注入卿16製之框架模型 中,以靴下4小時、再以靴下1小時進行硬化反應, 即可得到其硬化物。 該所得之硬化物特性之評定結 〔實施例8〕 &lt;含甲基⑽醯氧基之有機㈣氧燒(A8)之製造&gt; 在裝配有㈣裝置、溫度計、回流冷凝器的3· 0L之3 323923 88 201247745 口蒸餾瓶中,加入53g (0.2莫耳) 1,3,5,7_四甲基環四矽氧烷、27\(〇^作為(31)成分的 成分的曱基三(二曱矽氧基)矽烷、235莫耳)之作為(a2) 為(b2)成分的如下述平均級成弋 §(〇· 3莫耳)之作 均分子量為760之羥基二曱=Bb8)所示的重量平 烧、118g(0.9莫耳)之作為的聚二曱基石夕氧 丁烯酯、1600g之甲苯及〇· 〇5g之畫成刀的甲基丙烯酸-3-於氣氣環境下攪拌並同時加溫至6 $早曱崎(阻聚劑), HO-Si (Me)2〇-(Si (Me)2〇)8_Si (Me)2_〇H 反應。 之後,添加氯麵酸之異兩醇溶液,·估(/1-8) 成反應生成物之有機聚矽氧烷使鉑金屬相對於加 在確定脫氫反應開始後,即將^H4〇Ppm之量。 冷或氣冷保持於55至65°C,同時攪拌?;系:溫’並以水 之後分析錢舰之内容物,可W 為96%。 /、ΜΗ基之反應率 之後,再經過活性碳處理、餾除揮 _之下述通式⑼所示之含甲基其即可得到 矽氧烷(A8)。 軋基之有機聚 該所得之含甲基丙烯醯氧基之有機聚砂&amp; 官能基當量為7〇3g/mol,由GPC測定計算之jA8)的 量為34500,25〇C下之黏度為2500mPa . s。篁平均分子 323923 89 201247745Ml : + 8.8ppm T : -66.2ppm D2 : -19.8ppm D3 : -21·2ppm a/ (b+c) The value is 〇. 7〇. However, no peak of S: -32. 3ppm was observed; the value of d/a was 〇. &lt;Manufacturing and Characterization of Hardened Material&gt; ' 2.5 parts by volume of peroxy-2-ethylhexanoic acid in 100 parts by mass of methacryloxy-containing organopolyoxane (Α7) The saponin (manufactured by Akzo Co., Ltd., trade name: Trig〇n〇x 121, 5〇e, 5〇 mass% solution) is mixed under nitrogen, stirred to make the whole uniform, and then defoamed. A hardenable composition can be obtained. Then, the curable composition was poured into a frame model made of Qing 16 and the hardened material was obtained by performing a hardening reaction under the boots for 4 hours and then under the boots for 1 hour. Evaluation of the obtained cured product characteristics [Example 8] &lt;Production of organic (tetra)oxygen (A8) containing methyl (10) decyloxy group] 3. 0 L equipped with (iv) apparatus, thermometer, reflux condenser 3 323923 88 201247745 mouth retort, adding 53g (0.2 mol) 1,3,5,7-tetramethylcyclotetraoxane, 27\(〇^ as the constituent of the (31) component (dioxaoxy) decane, 235 mol) (a2) is a component of (b2), and the average molecular weight of the following is § § (〇·3 mol). The average molecular weight is 760 hydroxy dioxime = Bb8 ) shown as a flat burnt, 118g (0.9m) of polydiamine decyl butyl methacrylate, 1600g of toluene and 〇 · 〇 5g of methacrylic acid -3- in a gas atmosphere Stir and simultaneously heat to 6 $ early 曱 ( (polymerization inhibitor), HO-Si (Me) 2 〇 - (Si (Me) 2 〇) 8_Si (Me) 2 〇 H reaction. After that, a solution of the isoammonic acid of the chlorobutyric acid is added, and the organic polyoxane which is the reaction product is estimated to be added to the amount of the platinum metal after the start of the dehydrogenation reaction. . Cool or air-cooled at 55 to 65 ° C while stirring?; Department: temperature ' and after water analysis of the contents of the money ship, can be 96%. After the reaction rate of the thiol group, the methyl group represented by the following formula (9) is subjected to activated carbon treatment to distill off the oxime (A8). The organic polyglycol-containing organic poly-sand &amp; functional group equivalent of the obtained base is 7〇3g/mol, and the amount of jA8) calculated by GPC is 34,500, and the viscosity at 25〇C is 2500mPa . s.篁 average molecular 323923 89 201247745

上述通式(51)中,m表示平均10之整數;η表示平 均8之整數。In the above formula (51), m represents an integer of 10 on average; η represents an integer of 8 in average.

Si NMR測定之結果,可觀察到與構成單位相當之如下 所示之峰。 F1 : -18.2ppm T : -66.2ppm D1 及 D2 : -19.8ppm D3 · -21.2ppm S : -32.3ppm a/ (b+c)之值為 1· 33 ; d/a 之值為 0· 09。 &lt;硬化物之製造及特性評定〉 在100質量份之含曱基丙烯醯氧基之有機聚矽氧烷 (A8)中將2. 5質量份之過氧化-2-乙基己酸第三戊酯(曰 323923 90 201247745 本化藥Akzo公司製造’商品名:Trigonox 121-50E,50 質量%溶液)在氮氣下混合,進行攪拌使全體均一後,再經 過脫泡即可得到硬化性組成物。 之後將該硬化性組成物注入SUS316製之框架模型 中,以ion:下4小時、再以15代下i小時進行硬化反應, 即可得到其硬化物。 1所示。 〈含甲,稀醯氧基之有機聚錢燒(a9)之製造〉As a result of Si NMR measurement, a peak as shown below corresponding to the constituent unit was observed. F1 : -18.2ppm T : -66.2ppm D1 and D2 : -19.8ppm D3 · -21.2ppm S : -32.3ppm a/ (b+c) is 1.33; d/a is 0· 09 . 5质量份的氧化氧化乙乙酸酸3。 The mass of the thiol propylene oxy-containing organopolyoxane (A8) Amyl ester (曰323923 90 201247745, manufactured by Akzo Co., Ltd., trade name: Trigonox 121-50E, 50% by mass solution), mixed under nitrogen, stirred for uniformity, and then defoamed to obtain a hardenable composition. . Then, the curable composition was poured into a frame model made of SUS316, and the hardened product was obtained by performing a hardening reaction under ion: 4 hours and then for 15 hours. 1 is shown. <Manufacture of Organic Jujube (a9) containing A, Dilute Oxyloxy Group>

之3 口基餾&amp; 皿又计、回流冷凝器的3. 0L 之3 口蒸顧瑕中,加入啕(().2莫 的5, 7,甲基環四嫩 3 (= U2)成分的四(二〒石夕氧基 〇· 05莫耳)之作為 作為(b2)成分的 兀97S(0.3莫耳)之 平均分子量t Γ 成式(B1'9)所示的重量 丁烯醋、l5GGg&lt;¥ —之作為(C)成分的甲基丙烯酸-3一 於氮氣環境下檀挫本及G.Q5g之氫輥單甲鱗(阻聚劑), .SUM 相時加溫至阶反應。3 kinds of base distillation &amp; dish count, reflux condenser 3. 0L of 3 steaming 瑕, add 啕 ((). 2 Mo 5, 7, methyl ring four tender 3 (= U2) composition The average molecular weight t of 兀97S (0.3 mol) as the component (b2), and the weight of the butene vinegar of the formula (B1'9), l5GGg&lt;¥—the methacrylic acid-3 as the component (C) is cooled in a nitrogen atmosphere and the hydrogen roller monogram (G.Q5g) in the nitrogen atmosphere (polymerization inhibitor), and the .SUM phase is heated to the order reaction.

Sl(Me)泰(Si( 之後,添知备力 Ue)2'0H··. (B1-9) 成反應生成物之&quot;之異丙醇錢’仙金屬相對於加 在C燒的重量成為4〇_之量。 冷或氣冷保待於^開始後’即將該反應系保溫,並以水 之後分扣二至65&lt;t,同時攪拌72小時。 323923 蒸她之内容物,可知其SiH基之反應率 201247745 為 97%。 之後,再經過活性碳處理、餾除揮發成分,即可得到 325g之下述通式(52)所示之含曱基丙烯醯氧基之有機聚 矽氧烷(A9)。 該所得之含曱基丙烯醯氧基之有機聚矽氧烷(A9)的 官能基當量為617g/mo卜由GPC測定計算之重量平均分子 量為33200,25°C下之黏度為3400mPa · s。Sl(Me)Thai (Si (after, knowing the reserve Ue) 2'0H··. (B1-9) The reaction product is formed by the &quot;isopropanol money' fairy metal relative to the weight added to the C burnt Become the amount of 4〇_. Cold or air-cooled after the start of ^, the reaction system will be kept warm, and after the water is deducted two to 65 &lt; t, while stirring for 72 hours. 323923 steamed her contents, we know its The reaction rate of the SiH group is 977% in the amount of 201247745. Thereafter, after the activated carbon treatment and the volatile component are distilled off, 325 g of the organopolyoxyl group having a mercapto propylene oxy group represented by the following formula (52) can be obtained. Alkane (A9). The obtained organopolyoxyalkylene (A9) having a mercaptopropenyloxy group has a functional group equivalent of 617 g/mo. The weight average molecular weight calculated by GPC is 33,200, and the viscosity at 25 ° C. It is 3400 mPa · s.

•••(52) 上述通式(52)中,m表示平均5之整數;η表示平 均8之整數。 323923 92 201247745•••(52) In the above formula (52), m represents an integer of 5; and η represents an integer of 8 in average. 323923 92 201247745

Si NMR測定之結果,可觀察到與構成單位相當之如下 所示之《#。 F1 : -18.2ppm T * -66.2ppm D3 : -21.2ppm S : -32·3ppm a/ (b+c)之值為 i. 75 ; d/a 之值為 〇. 〇8。 &lt;硬化物之製造及特性評定&gt; 在100質量份之含甲基丙烯醯氧基之有機聚矽氧烷 (A9)中將2. 5質量份之過氧化-2-乙基己酸第三戊酯(曰 本化藥Akzo公司製造,商品名:Trig〇n〇x 12卜5〇E,5〇 質量%溶液)在氮氣下混合,進行攪拌使全體均一後,再經 過脫泡即可得到硬化性組成物。 之後將該硬化性組成物注入SUS316製之框架模型 中,以100°C下4小E 即可得到其硬化物。 J、時、再以15〇°c下1小時進行硬化反應, 〔實施例10〕 該所得之硬化物特性之評定結果如下述表2所示 〈含甲基丙稀醯氧基之有機聚硬魏ui〇) 之製造&gt;As a result of Si NMR measurement, "#. F1 : -18.2ppm T * -66.2ppm D3 : -21.2ppm S : -32·3ppm a/ (b+c) The value is i. 75 ; The value of d/a is 〇. 〇8. 5质量份的氧化氧乙乙酸酸的。 The mass of the methacryloxy-containing organopolyoxane (A9) in an amount of 2.5 parts by mass of peroxy-2-ethylhexanoic acid Triamyl ester (manufactured by Akzo Co., Ltd., trade name: Trig〇n〇x 12 Bu 5〇E, 5〇 mass% solution) is mixed under nitrogen, stirred to make the whole uniform, and then defoamed. A hardenable composition is obtained. Then, the curable composition was poured into a frame model made of SUS316, and the cured product was obtained at 4 ° C at 100 °C. J, hour, and further hardening reaction at 15 ° C for 1 hour [Example 10] The evaluation results of the obtained cured product characteristics are shown in Table 2 below. <Methyl propylene oxy group-containing organic polyhard Wei 〇) Manufacturing &gt;

93 201247745 莫耳)之作為(c)成分的甲基丙烯酸-3-丁烯酯、864g之 甲苯及0. 05g之氫醌單甲醚(阻聚劑),於氮氣環境下攪拌 並同時加溫至60°C反應。 H0-Si(Me)20-(Si(Me)20)8-Si(Me)2-0H. ·. (B1-10) 之後,添加氯銘酸之異丙醇溶液,使始金屬相對於加 成反應生成物之有機聚梦氧烧的重量成為40ppm之量。 在確定脫氫反應開始後,即將該反應系保溫,並以水 冷或氣冷保持於55至65°C,同時攪拌72小時。 之後分析該蒸顧瓶之内容物,可知其S i Η基之反應率 為 96%。 之後,再經過活性碳處理、餾除揮發成分,即可得到 20lg之下述通式(53)所示之含曱基丙烯醯氧基之有機聚 矽氧烷(A10)。 該所得之含曱基丙烯醯氧基之有機聚矽氧烷(A10) 的官能基當量為591g/mol,由GPC測定計算之重量平均分 子量為19500,25°C下之黏度為4200mPa . s。93 201247745 Mole) as a component (c) of 3-butenyl methacrylate, 864 g of toluene and 0.05 g of hydroquinone monomethyl ether (polymerization inhibitor), stirred under nitrogen atmosphere and simultaneously heated React to 60 ° C. H0-Si(Me)20-(Si(Me)20)8-Si(Me)2-0H. ·. (B1-10) After that, add isopropyl alcohol solution in isopropyl alcohol to make the starting metal relative to the addition. The weight of the organic polyoxygenated product of the reaction product was 40 ppm. Immediately after the start of the dehydrogenation reaction, the reaction system was kept warm and kept at 55 to 65 ° C with water cooling or air cooling while stirring for 72 hours. Thereafter, the contents of the steaming bottle were analyzed, and it was found that the reaction rate of the S i thiol group was 96%. Thereafter, after the activated carbon treatment and distillation of the volatile component, 20 lg of the mercaptopropenyloxy group-containing organopolyoxane (A10) represented by the following formula (53) can be obtained. The obtained mercaptopropenyloxy group-containing organopolyoxane (A10) had a functional group equivalent of 591 g/mol, a weight average molecular weight calculated by GPC of 19,500, and a viscosity at 25 ° C of 4,200 mPa·s.

•••(53) 323923 94 201247745 上述通式(53)中,1〇表示平均15之整數;n表示平 均8之整數。•••(53) 323923 94 201247745 In the above formula (53), 1 〇 represents an integer of 15 on average; n represents an integer of 8 in average.

Si NMR測定之結果,可觀察到與構成單位相當之如下 所示之峰。 F1 * -18.2ppm T : -66.2ppm D3 : -21·2ppm S · -32.3ppm a/ (b+c)之值為113 ; d/a之值為〇 〇8。 &lt;硬化物之製造及特性評定&gt; 在100質量份之含甲基丙烯醯氧基之有機聚矽氧烷 (A10)中將2. 5質量份之過氧化-2-乙基己酸第三戊酯(曰 匕藥Akz〇公司製造,商品名:Trigonox 121-50E,50 質量%溶液)在氮氣下混合,進行攪拌使全體均一後,再經 過脫泡即可得到硬化性組成物。 之後將該硬化性組成物注入SUS316製之框架模型 中以100 C下4小時、再以i5(TC下1小時進行硬化反應, 即可得到其硬化物。 該所得之硬化物特性之評定結果如下述表2所示。 〔實施例11〕 &lt; 3甲基兩埽酿氧基之有機聚矽氧烷(All)之製造&gt; 口菽在裝配有攪拌裝置、溫度計、回流冷凝器的3. 0L之3 i 3、、,『中’加入68g (〇·3莫耳)之作為(ai)成分的 四曱基環四石夕氧烧、45g (0.3莫耳)之作為(b2) 323923 95 201247745 成分的如下述平均組成式(B卜11)所示的分子量為166 之羥基二甲矽氧基末端的二甲基二矽氧烷、119g (0.9莫 耳)之作為(c)成分的曱基丙稀酸-3-丁烯酯、795g之曱 苯及0. 05g之氫醌單曱醚(阻聚劑),於氮氣環境下攪拌並 同時加溫至60°C反應。 H〇-Si(Me)2〇-(Si(Me)2〇)8-Si(Me)2-〇H. .. (B1-11) 之後,添加氯鉑酸之異丙醇溶液,使鉑金屬相對於加 成反應生成物之有機聚石夕氧烧的重量成為40ppm之量。 在確定脫氫反應開始後,即將該反應系保溫,並以水 冷或氣冷保持於55至65°C,同時攪拌72小時。 之後分析該蒸餾瓶之内容物,可知其SiH基之反應率 為 99%。 之後,再經過活性碳處理、餾除揮發成分,即可得到 183g之下述通式(54)、下述通式(55)及下述通式(56) 所示之含曱基丙烯醯氧基之有機聚矽氧烷(All)。 該所得之含甲基丙烯醯氧基之有機聚矽氧烷(All) 的官能基當量為340g/mol,由GPC測定計算之重量平均分 子量為17600,25°C下之黏度為1450OmPa · s。 該所得之含曱基丙烯醯氧基之有機聚矽氧烷(All) 之[WB]/[WA]之值為1.9。又,通式(55)相當於通式(9), 通式(56)相當於通式(10)。 323923 96As a result of Si NMR measurement, a peak as shown below corresponding to the constituent unit was observed. F1 * -18.2ppm T : -66.2ppm D3 : -21·2ppm S · -32.3ppm a/ (b+c) has a value of 113; d/a has a value of 〇 〇8. 5质量份的氧化氧乙乙酸的第第5质量份的乙乙乙乙酸酸的。 The mass of the methacryloxy-containing organopolyoxane (A10) in an amount of 2.5 parts by mass of peroxy-2-ethylhexanoic acid Triamyl ester (manufactured by Paeki Akz Co., Ltd., trade name: Trigonox 121-50E, 50% by mass solution) was mixed under nitrogen, stirred to make the whole uniform, and then defoamed to obtain a curable composition. Then, the curable composition was poured into a frame model made of SUS316 at 100 C for 4 hours, and then hardened by i5 (1 hour at TC) to obtain a cured product. The obtained cured product characteristics were evaluated as follows. [Table 11] [Example 11] &lt;Production of 3-methyl oxime-oxygenated organopolyoxane (All)&gt; The oxime was equipped with a stirring device, a thermometer, and a reflux condenser. 0L of 3 i 3,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, 477 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 Benzyl 3-butenyl ester, 795 g of hydrazine and 0.05 g of hydroquinone monoterpene ether (polymerization inhibitor), stirred under nitrogen atmosphere and simultaneously heated to 60 ° C. H〇-Si (Me)2〇-(Si(Me)2〇)8-Si(Me)2-〇H. . . (B1-11), then add chloroplatinic acid in isopropanol solution to make platinum metal relative to addition Reaction product The weight of the polyoxygen was 40 ppm. After determining the start of the dehydrogenation reaction, the reaction was kept warm and kept at 55 to 65 ° C with water or air cooling while stirring for 72 hours. The content of the SiH group was found to be 99%. Then, after the activated carbon treatment and the volatile component were distilled off, 183 g of the following formula (54), the following formula (55) and the following were obtained. The organopolyoxyalkylene (All) having a mercaptopropenyloxy group represented by the formula (56). The functional group equivalent of the obtained methacryloxy group-containing organopolyoxane (All) is 340 g/mol, the weight average molecular weight calculated by GPC is 17600, and the viscosity at 25 ° C is 1450 OmPa · s. [WB]/ of the obtained organopolyoxyalkylene (All) containing mercapto acryloxy group. The value of [WA] is 1.9. Further, the general formula (55) corresponds to the general formula (9), and the general formula (56) corresponds to the general formula (10).

η/ . . -(56) 上述通式(54)中,m表示平均25之整數;η表示平 均0之整數。 323923 97 201247745η / . . . - (56) In the above formula (54), m represents an integer of 25; and η represents an integer of 0. 323923 97 201247745

Si NMR測定之結果 所示之峰。 可觀察到與構成單位相當之如下 F1 · -18.2ppm T : -66. 2ppm a/ ( b+c)之值為 1. 〇〇。 但其中並未觀察到S : - 3 2 q 〈硬化物之製造及特性較&gt; ppm之峰’d/a之值為〇。 在100質量份之含甲其 (AU)中將2.5質量份之過H酿氧基之有機聚石夕氧烧 本化藥Akzo公司製造,商品一乙基己酸第三戊醋(日 質量%溶液)在氮氣下混合,二= lg_ 121~50E’ 50 過脫泡即可得到硬化性組成物。&amp;、’使全體均—後’再經 之後將該硬化性組成物、、 中,·1 firm 1 I ,入SUS316製之框架模型The peak shown by the result of Si NMR measurement. It can be observed that the composition is equivalent to the following F1 · -18.2ppm T : -66. The value of 2ppm a/ ( b+c) is 1. 〇〇. However, it is not observed that S: - 3 2 q <The manufacturing and characteristics of the cured product are lower than the peak value of d'd/d; Manufactured in an amount of 2.5 parts by mass of an organic polyoxochemical compound Akzo Co., Ltd., containing 100 parts by mass of methicone (AU), commercial monoethylhexanoic acid third vinegar (daily mass%) The solution is mixed under nitrogen, and two = lg_121~50E' 50. The defoaming composition can be obtained by defoaming. &amp;, 'After the whole - after', and then the curable composition, the middle 1 · 1 1 , into the frame model made by SUS316

T M 100C下4小時、再以J 即可得到其硬化物。 小時進行硬化反應, 該所得之硬化物特性 〔實施例12〕 之評定結果如下述表 2所示。 &lt;含甲基丙烯醯氧基之有機¥ 3飛眾矽氧烷(A12)之製造〉 在裝配有授拌農置、,田择^ . λ 夏,皿度计、回流冷凝器的3. 0L之3 σ 蒸餾瓶中,加入 2〇lg , . / 1 N ΛΑ V υ· 8莫耳)之作為(al )成分的 I’ 3’ 5’ 7-四曱基環四矽氣烷、24〇g( 1. 4莫耳)之作為(b2 ) 成分的如下述平均組成式(B卜12)所示的分子量為166 之规基二甲♦氧基末㈣二甲基二⑪纽、阶㈢.?莫耳) 之作為(c)成分的曱基内稀酸_3_丁烯醋、2l38g之曱苯 323923 98 201247745 及〇.〇5g之氫酉昆單甲醚(阻聚劑)’於氣氣環境下並同 時加溫至60 C反應。 H〇-Si(Me)2〇-(Si(Me)2〇)8-Si(Me)2^〇H ( b卜⑴ 之後’添加氯鉑酸之異丙醇溶液, 叹’使鉑金屬相對於加 成反應生成物之有機聚矽氧烷的重量赤&amp; ^ 叹马40ppm之量。 在確定脫氫反應開始後,即將診e ^ 反應系保溫,並以水 冷或氣冷保持於55至65°C,同時搜掉72丨時 之後分析該蒸餾瓶之内容物,可林 Γ知其SiH基之反應率 為 93%。 之後’再經過活性碳處理、餾險拴找 ,ΠΛ 羯除揮發成分,即可得到 490g之下述通式(57)、下述通式( _ 及下述通式(59) 所不之含曱基丙烯醯氧基之有機聚矽氧烷(M2)。 該所狀含甲基丙稀醯氧基之有^㈣烧⑽) 的吕能基當量為l〇94g/mo卜由Gpc測定計算之重量平均 分子量為9議’25。(:下之黏度為咖咖pa s。 之基丙烯醯氧基之有機㈣城(⑽ 通气二、之:為9.6。又’通式(58)相當於通式⑷, 通式(59)相當於通式(1〇)。 323923 99 201247745The cured product was obtained by using T M 100C for 4 hours and then J. The hardening reaction was carried out every hour, and the evaluation results of the obtained cured product [Example 12] are shown in Table 2 below. &lt;Production of methacryloxyl-containing organic ketone ketone oxane (A12)> In the assembly of the mixing plant, the field selection ^. λ summer, the meter, the reflux condenser. In the 0L of 3 σ distillation flask, add 2〇lg, . / 1 N ΛΑ V υ·8 mol) as the (al) component of I' 3' 5' 7-tetradecyl ring tetrahydroxane, 24 〇g (1. 4 mol) as the (b2) component, as shown in the following average composition formula (B 12), the molecular weight of 166 is dimethyl oxime (tetra) dimethyl di 11 nu (three).? Mohr) as the component (c), thiol-acidic acid _3_butene vinegar, 2l38g of benzene benzene 323923 98 201247745 and 〇.〇5g of hydroquinone monomethyl ether (polymerization inhibitor) Under the environment and simultaneously warm to 60 C reaction. H〇-Si(Me)2〇-(Si(Me)2〇)8-Si(Me)2^〇H (b (1) after adding 'isopropyl chloride solution of chloroplatinic acid, sigh' makes platinum metal relative to The weight of the organic polyoxane of the addition reaction product is &amp; ^ 叹 40 40 ppm. After determining the start of the dehydrogenation reaction, the e ^ reaction system will be kept warm and kept at 55 to 65 by water cooling or air cooling. °C, at the same time after searching for 72 丨, the contents of the retort were analyzed, and the reaction rate of the SiH group was 93%. After that, it was treated with activated carbon, distilled, and removed. Thus, 490 g of an organopolyoxyalkylene (M2) having a mercaptopropenyloxy group which is not represented by the following formula (57) and the following formula ( _ and the following formula (59) can be obtained. The molar energy average calculated by Gpc is 9 ' '25. (The viscosity is 咖 咖 pa s.) The ruthenium equivalent of ^(tetra)pyrene (10)) is l〇94g/mo. The organic propylene oxy group of the organic (four) city ((10) ventilating two: 9.6. And the general formula (58) corresponds to the general formula (4), and the general formula (59) corresponds to the general formula (1 〇). 323923 99 201247745

323923 100 201247745323923 100 201247745

η/ . . -(59) 上述通式(57)中,m表示平均30之整數;η表示平 均0之整數。η / . . . - (59) In the above formula (57), m represents an integer of 30; and η represents an integer of 0.

Si NMR測定之結果,可觀察到與構成單位相當之如下 所示之峰。 F1 : -18.2ppm T : -66. 2ppm a/ (b+c)之值為 0. 15。 但其中並未觀察到S : -32. 3ppm之峰;d/a之值為0。 &lt;硬化物之製造及特性評定&gt; 在100質量份之含曱基丙烯醯氧基之有機聚矽氧烷 (A12)中將2. 5質量份之過氧化-2-乙基己酸第三戊酯(曰 本化藥Akzo公司製造,商品名:Trigonox 121-50E,50 質量%溶液)在氮氣下混合,進行攪拌使全體均一後,再經 過脫泡即可得到硬化性組成物。 之後將該硬化性組成物注入SUS316製之框架模型 中,以100°C下4小時、再以150°C下1小時進行硬化反應, 即可得到其硬化物。 323923 101 201247745 該所得之硬化物特性之評定結果如下述表2所示。 〔實施例13〕 〈含曱基丙烯醯氧基之有機聚矽氧烷(A13)之製造&gt; 在裝配有攪拌裝置、溫度計、回流冷凝器的3. 0L之3 口蒸餾瓶中,加入24g (0. 1莫耳)之作為(al)成分的 1,3, 5, 7-四曱基環四矽氧烷、13g(0. 05莫耳)之作為(a2) 成分的曱基三(二曱矽氧基)矽烷及O.lg ( 0.002莫耳)之 四甲矽烷、116g( 0.2莫耳)之作為(b2)成分的如下述 平均組成式(B1-13)所示的重量平均分子量為760之羥基 二曱矽氧基末端的聚二曱基矽氧烷、53g (0.3莫耳)之作 為(c)成分的甲基丙烯酸-3-丁烯酯、768g之曱苯及0. 05g 之氫醌單曱醚(阻聚劑),於氮氣環境下攪拌並同時加溫至 60°C反應。 HO-Si(Me)2〇-(Si(Me)2〇)8-Si(Me)2-OH. . . (B1-13) 之後,添加氣始酸之異丙醇溶液,使銘金屬相對於加 成反應生成物之有機聚石夕氧烧的重量成為40ppm之量。 在確定脫氩反應開始後,即將該反應系保溫,並以水 冷或氣冷保持於55至65°C,同時攪拌72小時。 之後分析該蒸餾瓶之内容物,可知其SiH基之反應率 為 97%。 之後,再經過活性碳處理、餾除揮發成分,即可得到 170g之下述通式(60)所示之含曱基丙烯醯氧基之有機聚 矽氧烷(A13)。 該所得之含曱基丙烯醯氧基之有機聚矽氧烷(A13) 323923 102 201247745 的官能基當量為756g/mol,由GPC測定計算之重量平均分 子量為182100,25°C下之黏度為42300mPa · s。As a result of Si NMR measurement, a peak as shown below corresponding to the constituent unit was observed. F1 : -18.2ppm T : -66. The value of 2ppm a/ (b+c) is 0.15. However, no peak of S: -32. 3ppm was observed; the value of d/a was zero. 5质量份的氧化氧乙乙酸的第第5质量份的氧化乙乙乙酸酸的。 The mass of the thiol propylene oxy group-containing organopolyoxane (A12) in an amount of 2.5 parts by mass of peroxy-2-ethylhexanoic acid Triamyl ester (manufactured by Akzo Co., Ltd., trade name: Trigonox 121-50E, 50% by mass solution) was mixed under nitrogen, stirred to make the whole uniform, and then defoamed to obtain a curable composition. Then, the curable composition was poured into a frame model made of SUS316, and the hardened material was obtained by curing at 100 ° C for 4 hours and at 150 ° C for 1 hour. 323923 101 201247745 The evaluation results of the obtained cured product characteristics are shown in Table 2 below. [Example 13] <Production of an organic polydecane (A13) containing a mercapto propylene oxy group> In a 3.0 liter retort equipped with a stirring device, a thermometer, and a reflux condenser, 24 g was added. (0. 1 mol) of 1,3,5,7-tetradecylcyclotetraoxane as an (al) component, and 13 g (0.05 mol) of a mercapto III as a component (a2) Dimethoxy) decane and O.lg (0.002 mol) of tetramethyl decane, 116 g (0.2 mol) of (b2) component, weight average molecular weight as shown by the following average composition formula (B1-13) 5克。 The hydroxy hydroxy hydroxy end of the polydidecyl fluorinated argon, 53g (0.3 m) of the component (c) as a component (c) methacrylate methacrylate, 768g of benzene and 0. 05g Hydroquinone monoterpene ether (polymerization inhibitor), stirred under a nitrogen atmosphere and simultaneously heated to 60 ° C reaction. HO-Si(Me)2〇-(Si(Me)2〇)8-Si(Me)2-OH. . . (B1-13) After that, add a solution of gas-acidic isopropanol to make the metal relative The weight of the organic polyoxoflame of the addition reaction product was 40 ppm. After the start of the deamination reaction was determined, the reaction system was kept warm and kept at 55 to 65 ° C with water cooling or air cooling while stirring for 72 hours. Thereafter, the contents of the distillation flask were analyzed, and the reaction rate of the SiH group was found to be 97%. Thereafter, the activated carbon is treated and the volatile component is distilled off to obtain 170 g of a mercaptopropenyloxy group-containing organopolyoxane (A13) represented by the following formula (60). The obtained mercaptopropenyloxy-containing organopolyoxane (A13) 323923 102 201247745 has a functional group equivalent of 756 g/mol, a weight average molecular weight calculated by GPC of 182100, and a viscosity at 25 ° C of 42300 mPa. · s.

•••(60) 上述通式(60)中,m表示平均50之整數;η表示平 均8之整數。•••(60) In the above formula (60), m represents an integer of 50 on average; η represents an integer of 8 in average.

Si NMR測定之結果,可觀察到與構成單位相當之如下 所示之峰。 F1 · -18.2ppm T : -66. 2ppm D3 : -21.2ppm S · -32. 3ppm a/ (b+c)之值為 1. 25 ; d/a 之值為 0. 10。 &lt;硬化物之製造及特性評定&gt; 323923 103 201247745 在100質里伤之含甲基丙婦酿氧基之有機聚發氧烧 (A13)中將2. 5質量份之過氧化-2-乙基己酸第三戊酯(日 本化藥Akzo公司製造,商品名:Trigonox 121-50E,50 質量%溶液)在氮氣下混合,攪拌使全體均一後’再經過脫 泡即可得到硬化性組成物。 之後將該硬化性組成物注入SUS316製之框架模型 中,以100C下4小時、再以15(TC下1小時進行硬化反應, 即可得到其硬化物。 該所得之硬化物特性之評定結果如下述表2所示。 〔實施例14〕 &lt;含曱基丙烯醯氧基之有機聚矽氧烷(A14)之製造&gt; 在裝配有攪拌裝置、溫度計、回流冷凝器的3. 〇L之3 口蒸德瓶中’加入96g (〇·4莫耳)之作為(al)成分的 1,3, 5, 7-四甲基環四矽氧烷、1〇7g( 〇. 8莫耳)之作為(a2) 成分的曱基一113,3-四曱基二矽氧烷、269g (1.4莫耳) 之作為(bl)成分的如下述平均組成式(B1_14)所示的分 子量為186之乙烯基二甲矽氧基末端的二曱基二矽氧烷、 97g( 0. 7莫耳)之作為(c)成分的曱基丙烯酸-3-丁烯酯、 2138g之曱苯及〇. 05g之氫醌單曱醚(阻聚劑),於氮氣環 境下擾拌並同時加溫至6(TC反應。 CH2=CHSi(Me)2〇~(Si(Me)2〇)8-Si(Me)2CH=CH2·.. (B卜 14) 之後’添加氣鉑酸之異丙醇溶液,使鉑金屬相對於加 成反應生成物之有機聚矽氧烷的重量成為20ppm之量。 在確定石夕氫化反應開始後’即將該反應系保溫,並以 323923 104 201247745 水冷保持於55至65t,同時授拌72小時。 為99%。π析該錢瓶之内容物,可知其⑽基之反應率 之後 52〇gh,再經過活性碳處理、顧除揮發成分,即可得到 520之下述通式⑻及下述通式⑽所示之含甲基丙 焊酿氧基之有機聚矽氧烷(A14)。 該所得之含甲基丙烯醯氧基之有機聚矽氧烷(A14) 的官能基當量為1300g/mol,由GPC測定計算之重量平均 分子量為11000,25Ϊ下之黏度為600mPa . s。 該所得之含甲基丙烯醯氧基之有機聚矽氧烷(AM), 二原料之1分子中至少含丨㈤SiH基的氫化聚發氧炫成 =係共同㈣(al)及(a2)。因此之故’使其所得到之 3曱基丙_氧基之有機聚石夕氧院(A14 低,而使其黏度減低。 X㈣4As a result of Si NMR measurement, a peak as shown below corresponding to the constituent unit was observed. F1 · -18.2ppm T : -66. 2ppm D3 : -21.2ppm S · -32. 3ppm a/ (b+c) has a value of 1. 25 ; d/a has a value of 0.10. 5质量份的氧化氧化-2-2 The oxidized product of the oxidized product of the methicone The third ester of ethylhexanoate (manufactured by the Japanese chemical company Akzo, trade name: Trigonox 121-50E, 50% by mass solution) is mixed under nitrogen, stirred to make the whole uniform, and then defoamed to obtain a hardenable composition. Things. Then, the curable composition was poured into a frame model made of SUS316, and the cured product was obtained by performing a hardening reaction at 100 ° C for 4 hours and at 15 ° C for 1 hour. The obtained cured product characteristics were evaluated as follows. [Table 14] [Production of &lt;Production of a mercapto propylene oxy group-containing organopolyoxane (A14)&gt; 3. A stirring device, a thermometer, and a reflux condenser were installed. In a 3-point steaming bottle, add 96g (〇·4 moles) of 1,3,5,7-tetramethylcyclotetraoxane as an (al) component, and 1〇7g (〇. 8m). The molecular weight of the fluorenyl-113,3-tetradecyldioxane as a component (a2) and 269 g (1.4 mol) as the component (bl) has a molecular weight of 186 as shown in the following average composition formula (B1-14). Vinyl dimethyloxy-terminated dimercaptodioxane, 97 g (0.7 mol) of methacrylic acid-3-butenyl ester as component (c), 2138 g of fluorene benzene and hydrazine. 05 g Hydroquinone monoterpene ether (polymerization inhibitor), scrambled under nitrogen atmosphere and simultaneously heated to 6 (TC reaction. CH2=CHSi(Me)2〇~(Si(Me)2〇)8-Si(Me ) 2CH=CH2·.. (B Bu 14) After 'Tian The isopropyl alcohol solution of gas platinum acid makes the weight of the platinum metal relative to the organic polyoxyalkylene of the addition reaction product to be 20 ppm. After determining the start of the hydrogenation reaction, the reaction system is kept warm, and is 323,923,104. 201247745 The water cooling is maintained at 55 to 65t, and the mixing is carried out for 72 hours. It is 99%. The content of the money bottle is π, and it can be known that the reaction rate of the (10) group is 52〇gh, and then treated with activated carbon to remove volatile components. Thus, an organopolyoxyalkylene (A14) having a methyl propylene oxide oxy group represented by the following formula (8) and the following formula (10): 520. The obtained methacryloxy group-containing organic polymer The functional group equivalent of the decane (A14) is 1300 g/mol, and the weight average molecular weight calculated by GPC is 11,000, and the viscosity at 25 Torr is 600 mPa. s. The obtained methacryloxy group-containing organic polyoxyl Alkane (AM), a hydrogenated polyoxoquinone containing at least a ruthenium (5) SiH group in one molecule of two raw materials = common (4) (al) and (a2). Therefore, the resulting 3 fluorene-based oxy-oxygen Based on the organic poly-stone hospital (A14 is low, and its viscosity is reduced. X (four) 4

323923 (61) 105 201247745323923 (61) 105 201247745

HaCHaC

-CH3-CH3

^ · · · ( 6 2 ) 上述通式(61)中,m表示平均30之整數;n表示平 均0之整數;r表示平均0之整數。In the above formula (61), m represents an integer of averaging 30; n represents an integer of 0; and r represents an integer of 0.

Si NMR測定之結果,可觀察到與構成單位相當之如下 所示之峰。 F1 : -18.2ppmAs a result of Si NMR measurement, a peak as shown below corresponding to the constituent unit was observed. F1 : -18.2ppm

Ml : + 8.8ppm D2 : -19.8ppm F2 : + 7. Oppm a/ (b+c)之值為 0. 16。 但其中並未觀察到S : -32. 3ppm之锋;d/a之值為0。 &lt;硬化物之製造及特性評定&gt; 在100質量份之含甲基丙烯醯氧基之有機聚矽氧烷 (A14)中將2. 5質量份之過氧化-2-乙基己酸第三戊酯(曰 本化藥Akzo公司製造,商品名:Trigonox 121-50E,50 質量%溶液)在氮氣下混合,進行攪拌使全體均一後,再經 過脫泡即可得到硬化性組成物。 之後將該硬化性組成物注入SUS316製之框架模型 中,以100°C下4小時、再以150°C下1小時進行硬化反應, 323923 106 201247745 即可得到其硬化物。 該所得之硬化物特性之每^ 〔實施例15〕 心結果如下述表2所示 &lt;含甲基丙烯醯氧基之有機^氧烧( 回 第-階段之反應,係在袭配有擾摔裝置 流冷凝器的31之3 口蒸餾瓶中 之作為U1)成分的1,3,5,7 rQ·2異 莫耳)之作為⑽成分”:1基_魏、27g( ;/ …莫耳)之作為⑷成t匕曱彻歡_ 戰之曱笨及G.〇5g之氩驅//基丙烯酸'3-丁稀~ 境下攪拌並㈣加溫至(㈣劑)’ =二:加氣鉑酸之異丙醇溶液’使鉑金屬相對於加 成反應生錢之㈣㈣氧量成為2Gppra之量。 在確定石夕氣化反應開始後,即將該反應系保溫’炎以 水冷或氣冷保持於55至阶,同小時。 第二階段之反應,係在上述第一階段之反應液中,加 入242g(Q.3莫耳)之作為(bl)成分的如下述平均組成 式所*的重量平均分子量為之乙縣二甲石夕 氧基末端的聚二甲基魏燒、將該反應純溫,並以水冷 或氣冷保持於55至抓,同時搜掉72小時。 之後分析該蒸顧瓶之内容物,可知其灿基之反應率 為 99% 0 之後、再,1過活性石反處理、匈除揮發成分,即可得到 360g之下述通《(41)所不之含甲基丙婦醯氧基之有機聚 323923 107 201247745 矽氧烷(A2)。 该所彳于之含甲基丙烯醯氧基之有機聚矽氧烷(A2)的 s能基當f為7l4g/m〇i ’由Gpc測定計算之重量平均分子 量為38200,25。(:下之黏度為26〇〇mPa · s。Ml: + 8.8ppm D2: -19.8ppm F2: + 7. Oppm a/ (b+c) has a value of 0.16. However, no S: -32. 3ppm front was observed; the value of d/a was zero. 5质量份的氧化氧化乙乙酸酸的。 The propylene oxide oxy-containing organopolyoxane (A14) in an amount of 2.5 parts by mass of peroxy-2-ethylhexanoic acid Triamyl ester (manufactured by Akzo Co., Ltd., trade name: Trigonox 121-50E, 50% by mass solution) was mixed under nitrogen, stirred to make the whole uniform, and then defoamed to obtain a curable composition. Then, the curable composition was poured into a frame model made of SUS316, and the hardened material was obtained by curing at 100 ° C for 4 hours and at 150 ° C for 1 hour, and 323923 106 201247745. Each of the obtained cured product characteristics [Example 15] The results of the heart are as shown in Table 2 below. &lt;Methyl propylene oxy group-containing organic oxy-combustion (return to the first stage reaction) As the component (10) of the 1,3,5,7 rQ·2 isomol as the U1) component in the 31-piece retort of the falling device flow condenser: 1 base _ Wei, 27 g ( ; / ... Mo The ear) (4) into t 匕曱 欢 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The aerated alcohol solution of platinum gas is used to make the amount of oxygen in the platinum metal relative to the addition reaction (4) (4) into 2Gppra. After determining the start of the gasification reaction, the reaction system is kept warm and the water is cooled or air cooled. The reaction of the second stage is carried out in the reaction liquid of the above first stage, and 242 g (Q.3 mol) of bl (b. The weight average molecular weight is polydimethyl sulfide of the end of the dimethyl oxy group of the county, the reaction is pure temperature, and is kept at 55 to catch by water cooling or air cooling, and 72 hours are searched. After analyzing the contents of the steamed bottle, it can be seen that the reaction rate of the base is 99% 0, and then, after 1 reactive treatment, the volatile component is removed, and 360g of the following is obtained. (41) Organic 323923 107 201247745 oxoxane (A2) containing no methacryloxy group. The s-energy group of the organopolyoxyalkylene (A2) containing methacryloxyloxy group f is 7l4g/m〇i 'The weight average molecular weight calculated by Gpc is 38200, 25. (The viscosity below is 26〇〇mPa · s.

Si NMR測定之結果’可觀察到與構成單位相當之如下 所示之蜂。 F1 : -18.2ppmAs a result of Si NMR measurement, a bee shown as follows, which is equivalent to the constituent unit, was observed. F1 : -18.2ppm

Ml : + 8.8ppm T : -66.2ppm D2 : -19.8ppm D3 : -21.2ppm a/ (b+c)之值為 〇. 78。 但其中並未觀察到S : -32· 3ppm之峰;d/a之值為〇。 &lt;硬化物之製造及特性評定&gt; 在1〇〇質量份之含甲基丙烯醯氧基之有機聚矽氧烷 (Α2)中將2. 5質量份之過氧化—2_乙基己酸第三戊酯(曰 本化藥Akzo公司製造,商品名:Trigonox 121-50Ε,50 質量%溶液)在氮氣下混合,進行攪拌使全體均一後,再經 過脫泡即可得到硬化性組成物。 之後將該硬化性組成物注入SUS316製之框架模型 中’以lOOt下4小時、再以150。(;下丨小時進行硬化反應, 即可得到其硬化物。 ” 該所得之硬化物特性之評定結果如下述表2所示。 〔實施例16〕 323923 108 201247745 〈含曱基丙烯醯氧基之有機聚矽氧烷(A2)之製造&gt; 含曱基丙烯醯氧基之有機聚矽氧烷(A2),係以如實 施例2同樣之方法製造。 &lt;硬化物之製造及特性評定&gt; 在100質量份之含甲基丙烯醯氧基之有機聚石夕氧烧 (A2)中,將3質量份之1-羥基-環己基·笨酮(BASF日本 公司製造,商品名:IRGACURE 184)、3質量份之2-甲基-卜 〔4-曱硫基-苯基〕-2-N-口末啉丙烷-1-酮(BASF日本公 司製造,商品名:RGACURE 907)混合,進行攪拌使全體均 一後’再經過脫泡即可得到硬化性組成物。 之後將該硬化性組成物,設置在玻璃板(縱50mmx橫 50丽X厚3mm)上形成矽製含間隔之模型(縱50mmx橫50匪 X厚3mm),再於間隔之内部將該硬化性組成物注入,並以 玻璃板夾住。 之後’再以含高壓汞燈之紫外線照射裝置(曰本 SENENGINEERING公司製造)’以累積照射量為2000 mj/cm2 由上述玻璃板侧曝光。 其中硬化,係在溫度:23°c、濕度:6〇%RH之環境下 進行。 之後再移除該模型即可得硬化物。 該所得之硬化物特性之評定結果如下述表2所示。 〔實施例17〕 &lt;含甲基丙蝉醯氧基之有機聚錢燒(A2)之製造〉 含甲基丙制氧基之有機㈣氧烧(A2),係以如實 323923 109 201247745 施例2同樣之方法製造。 &lt;硬化物之製造及特性評定&gt; 在100食量伤之含甲基丙埽酿氧基之有機聚石夕 (A2)中將3質量份之3-甲基丙烯醯氧丙基曱基二甲 烷(KBM-502,日本信越化學公司製造)及2. 5二:氧矽 匕 y 貝童份之過 氧化-2-乙基己酸第三戊酯(日本化藥Akz〇公司製造,商 品名:Trigonox 12卜50E ’ 50質量%溶液)在氡氣下^合°, 進行擾拌使全體均-後’再經過脫泡即可得到硬化^成 物。 、 之後將該硬化性組成物注入觸16製之框架模型 中,以loot下4小時、再以15(1。广丁 , ,+ y p ^ 丄b〇cn小時進行硬化反應, 即可得到其硬化物。 該所得之硬化物特性之評定結果如下述表2所示。 〔比較例1〕 &lt;含甲基丙烯醯氧基之有機聚矽 在裝配有攪拌裝置、溫度計、之製造&gt; 口蒸德瓶中,加人134g(1G =”器的3.0L之3 矽氧烷、420g ( 3. 〇莫耳)发 1’ 1,3, 3-四曱基二 之甲笨及〇· 〇5g之氫科mu· 1600g 拌並同時加溫至6(rc反應。 象劑)’於氮氣環境下攪 之後,添加氣鉑醆之異 办 成反應生成物之有機聚$夕氣_醇溶液’使鉑金屬相對於加 在確定石夕氫化反應開^^的重1成為20ρρπι之量。 水冷或氣冷保持於55 s。。彳’即將該反應系保溫,並以 323923 至蛛’同時授拌”小時。 110 201247745 之後分析該蒸顧瓶之内容物,可知其基之反應率 為 99%。 &quot; 之後,再經過活性碳處理、餾除揮發成分,即可得到 405g之下述通式(63)所示之含甲基丙烯醯氧基之有機聚 矽氧烷(A15)。 該所得之含甲基丙烯醯氧基之有機聚矽氧烷(A15) 的官能基當量為415g/mol,由GPC測定計算之重量平均分 子量為400 ’ 25°C下之黏度為i50mPa · s。Ml : + 8.8ppm T : -66.2ppm D2 : -19.8ppm D3 : -21.2ppm a / (b + c) The value is 〇. 78. However, no peak of S: -32·3ppm was observed; the value of d/a was 〇. &lt;&lt;5&gt; </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> <RTIgt; The acid tertiary amyl ester (manufactured by Akzo Co., Ltd., trade name: Trigonox 121-50Ε, 50% by mass solution) is mixed under nitrogen, stirred to make the whole uniform, and then defoamed to obtain a curable composition. . Thereafter, the curable composition was poured into a frame model made of SUS316, and was further treated at 100 Torr for 4 hours and then at 150 hours. (The hardening reaction is carried out in the next hour, and the cured product is obtained.) The evaluation results of the obtained cured product characteristics are shown in Table 2 below. [Example 16] 323923 108 201247745 <Alkyl-containing propylene-based oxy group Production of Organic Polyoxane (A2)&gt; The organopolyoxyalkylene (A2) having a mercaptopropenyloxy group was produced in the same manner as in Example 2. &lt;Manufacturing and Characterization of Hardened Material&gt 3 parts by mass of 1-hydroxy-cyclohexyl·cyclopropanone (manufactured by BASF Japan Co., Ltd., trade name: IRGACURE 184) in 100 parts by mass of the methacryloxy group-containing organic polyoxo (A2) 3 parts by mass of 2-methyl-bu [4-indolyl-phenyl]-2-N-norpoline propan-1-one (manufactured by BASF Japan, trade name: RGACURE 907) was mixed and carried out. After the mixture is uniformly homogenized, the foaming composition is obtained by defoaming. The curable composition is then placed on a glass plate (50 mm in length, 50 cm in width, 3 mm in thickness and 3 mm in thickness) to form a mold-containing model. 50mmx cross 50匪X thickness 3mm), then inject the hardening composition inside the space and clamp it with glass plate After that, it was exposed to the above-mentioned glass plate side at a cumulative irradiation amount of 2000 mj/cm 2 by an ultraviolet irradiation device (manufactured by Sakamoto SENENGINEERING Co., Ltd.) containing a high-pressure mercury lamp. The hardening was carried out at a temperature of 23 ° C and a humidity of 6 The 〇%RH environment was carried out. After the model was removed, the cured product was obtained. The evaluation results of the obtained cured product characteristics are shown in Table 2 below. [Example 17] &lt;Methyl propylene oxide Manufacture of Organic Polycohol (A2) 〉 Organic (4) Oxygen (A2) containing methyl propyloxy is manufactured in the same manner as in Example 2 of 323923 109 201247745. &lt;Manufacturing and Properties of Hardened Materials Evaluation&gt; 3 parts by mass of 3-methylpropenyloxypropyl decyl dimethane (KBM-502, Shin-Etsu, Japan) in a 100-volume-containing organic chlorinated organic polychlorite (A2) Chemical company made) and 2. 5 2: Oxygen 矽匕 y Betong's peroxy-2-ethylhexanoic acid third amyl ester (manufactured by Akz 〇, Japan, trade name: Trigonox 12 Bu 50E ' 50 quality % solution) under the helium gas, the mixture is disturbed, so that the whole is - after the 'de-foaming The hardened composition is injected into the frame model of the touch 16 system, and the hardening reaction is carried out for 4 hours under the loot and then 15 (1, butyl, and + yp ^ 丄b〇cn hours). The cured product was obtained as shown in the following Table 2. [Comparative Example 1] &lt;A methacryloxy group-containing organic polyfluorene was equipped with a stirring device, a thermometer, Manufactured> In the mouth steamed bottle, add 134g (1G = " 3.0L of 3 oxane, 420g ( 3. 〇 Mo ear) 1' 1,3, 3-tetradecyl 2 Stupid and 〇 · 〇 5g Hydrogen Mu· 1600g Mix and heat to 6 (rc reaction). After the agent is stirred under a nitrogen atmosphere, the organic poly-alcoholic-alcohol solution of the reaction product of the gas-plated rhodium is added to make the platinum metal relative to the weight 1 added to the determination of the hydrogenation reaction. The amount of 20ρρπι. Water cooled or air cooled for 55 s. .彳 'The reaction is kept warm, and 323923 to spider 'simultaneous mixing' hours. 110 201247745 After analyzing the content of the steamed bottle, the reaction rate of the base is 99%. &quot; After that, pass the activated carbon By treating and distilling off the volatile component, 405 g of the methacryloxy group-containing organopolyoxane (A15) represented by the following formula (63) can be obtained. The obtained methacryloxy group-containing oxy group The functional group equivalent of the organopolyoxyalkylene (A15) was 415 g/mol, and the weight average molecular weight calculated by GPC was 400 ', and the viscosity at 25 ° C was i50 mPa · s.

? U U 0 ft II? U U 0 ft II

II CHz ...(63) &lt;硬化物之製造及特性評定&gt; 在100質量份之含甲基丙烯醯氧基之有機聚矽氧烷 (A15)中將2.5質量份之過氧化_2_乙基己酸第三戊酯(曰 本化藥Akzo公司製造,商品名:Trig〇n〇x 1215〇E , 5〇 質量%溶液)在氮氣下混合,進行授拌使全體均一後,再經 過脫泡即可得到硬化性組成物。 之後將該硬化性組成物注入SUS316製之框架模型 中’以1〇〇C&gt;C下4小時、再以15〇°C下1小時進行硬化反應, 即可得到其硬化物。 該所付之硬化物特性之狀結果如下述表 3所示。 〔比較例2〕 &lt; 3甲基丙神氧基之有機聚♦氧虎⑽)之製造〉 下述通S (64)戶斤示之含曱&amp;丙稀酿氧基之有機聚石夕 323923 111 201247745 氧烷(A16),係使用日本信越化學公司製造之X22_164C。 該含甲基丙烯醯氧基之有機聚矽氧烷(A16)的官能 基當量為2300g/mol,由GPC測定計算之重量平均分子量 為 4500,25°C 下之黏度為 3600mPa · sS。II CHz (63) &lt;Manufacturing and Characterization of Hardened Material&gt; 2.5 parts by mass of peroxidized _2 in 100 parts by mass of the methacryloxy group-containing organopolyoxane (A15) _ethylhexanoic acid third amyl ester (manufactured by Akzo Co., Ltd., trade name: Trig〇n〇x 1215〇E, 5〇 mass% solution) is mixed under nitrogen, and the mixture is mixed to make the whole uniform, and then After defoaming, a hardenable composition is obtained. Then, the curable composition was poured into a frame model made of SUS316, and the cured product was obtained by curing at 1 〇〇C&gt;C for 4 hours and then at 15 °C for 1 hour. The results of the properties of the cured product to be treated are shown in Table 3 below. [Comparative Example 2] &lt;3 Manufacture of organic polyoxooxime (10) of methyl propyloxy group> The following S (64) shows the organic concentrating oxime of 曱 &amp; 323923 111 201247745 Oxytomane (A16), which is X22_164C manufactured by Shin-Etsu Chemical Co., Ltd., Japan. The methacryloxy group-containing organopolyoxane (A16) had a functional group equivalent of 2,300 g/mol, a weight average molecular weight of 4,500 as determined by GPC, and a viscosity of 3,600 mPa·sS at 25 °C.

&lt;硬化物之製造及特性評定&gt; 在100質量份之含曱基丙烯醯氧基之有機聚矽氧烷 (A16)中將2· 5質量份之過氧化_2_乙基己酸第三戊酯(日 本化藥Akzo公司製造,商品名:Trig0n0X 12卜50E,50 質量%溶液)在氮氣下混合,進行攪拌使全體均一後,再經 過脫泡即可得到硬化性組成物。 之後將該硬化性組成物注入SUS316製之框架模型 中,以10(TC下4小時、再以i小時進行硬化反應, 即·得到其硬化物。 該所得之硬化物特性之評定結果如下述表3所示。 〔比較例3〕 〈含環氧基之有機聚矽氧烷(A17)之製造&gt; 在裝配有攪拌震置、溫度計、回流冷凝器的3.虬之3 口蒸餾瓶中’加人53g (0.2莫耳)之作為(al)成分的 1,3, 5, 7-四甲基環四矽氧烷、27g ( 〇. j莫耳)之作為(^ ) 成分的曱基三(二曱矽氧基)矽烷、242g (〇.3莫耳)之作 為(bl)成分的如下述平均組成式(B1-1)所示的重量平 323923 112 201247745 均分子量為780之乙歸&lt; 烧、104g ( 0. 9 莫耳) ^〜甲矽氧基末端的聚二甲基矽氧 化物、1300g之曱笨,於^ (C)成分的乙烯基環己烯氧 。(:反應。 氣鳅丨兄下攪拌並同時加溫至60 之後’添加氯麵駿之里 成反應生成物之有機幼氡:量液成=:於加 在碟定石夕氫化反應開始後’即將該反應系保溫,並以 水冷或氣冷保持於55至65 C ’同時掩拌π小時。 之後分析該蒸餾瓶之内容物,可知其SiH基之反應率 為 99%。 之後,再經過活性碳處理、餾除揮發成分,即可得到 310g之下述通式(65)所示之含環氧基之有機聚矽氧烷 (A17)。 該含環氧基之有機聚碎氧燒(A17),並無含不飽和鍵 之基。 該所得之含環氧基之有機聚矽氧烷(A17),由GPC測 定計算之重量平均分子量為30500,25°C下之黏度為 5600raPa · s。 323923 113 201247745&lt;Production and Characterization of Hardened Material&gt; 2.5 parts by mass of peroxy-2-ethylhexanoic acid in 100 parts by mass of the organopolyoxyalkylene (A16) having a mercaptopropenyloxy group Triamyl ester (manufactured by Akzo Co., Ltd., trade name: Trig0n0X 12 Bu 50E, 50% by mass solution) was mixed under nitrogen, stirred to make the whole uniform, and then defoamed to obtain a curable composition. Then, the curable composition was poured into a frame model made of SUS316, and the hardening reaction was carried out at 10 (TC for 4 hours and then for 1 hour) to obtain a cured product. The evaluation results of the obtained cured product characteristics are as follows. (Comparative Example 3) <Production of epoxy group-containing organopolyoxane (A17)&gt; In a 3-neck retort equipped with a stirring shaker, a thermometer, and a reflux condenser 53 g (0.2 mol) of 1,3,5,7-tetramethylcyclotetraoxane as an (al) component, and 27 g (〇.jm) as a (^) component (dimethoxy) decane, 242 g (〇. 3 mol) of the component (bl) as shown in the following average composition formula (B1-1), the weight is 323,923, 112, 2012,477,45, and the average molecular weight is 780. ; burnt, 104g (0.9 moles) ^ ~ polydimethyl sulfonium oxide at the end of the methoxy group, 1300g of stupid, vinyl cyclohexene oxygen in the ^ (C) component (: reaction. After stirring and heating to 60, the organic pups of the reaction product are added to the reaction of the product: the amount of liquid is determined to be added to the dish. After the start, the reaction was kept warm and kept at 55 to 65 C' with water cooling or air cooling while masking for π hours. After analyzing the contents of the distillation flask, the reaction rate of the SiH group was 99%. Further, after the activated carbon treatment and distillation of the volatile component, 310 g of the epoxy group-containing organopolyoxane (A17) represented by the following formula (65) can be obtained. Oxygen (A17), which has no unsaturated bond group. The obtained epoxy group-containing organopolyoxane (A17) has a weight average molecular weight of 30,500 as determined by GPC, and the viscosity at 25 ° C is 5600raPa · s. 323923 113 201247745

均8之整數。 &lt;硬化物之製造及特性評定&gt; 在100質量份之含環氧基之有機聚矽氧烷(A17)中, 混合60.5質量份之曱基六氫苯二曱酸酐、1質量份之二氮 雜二環十一碳烯辛酸鹽,進行攪拌使全體均一後,再經過 脫泡即可得到硬化性組成物。 之後以該硬化性組成物注入模型中,以120°C下1小 時、再以150°C下2小時進行硬化反應,即可得到其硬化 物。 該所得之硬化物特性之評定結果如下述表3所示。 〔比較例4〕 323923 114 201247745 &lt;硬化性樹脂組成物(A18) &gt; 硬化性樹脂組成物(A18),其中之光半導體密封材用 硬化性樹脂組成物係使用市售之日本信越化學公司製造之 KER-2500 。 &lt;硬化物之製造及特性評定&gt; 以已有販售之KER-2500A及KER-2500B以各1 〇Q質量 份混合’再攪拌使全體均一後,再經過脫泡即可得到硬化 性組成物。 之後將該硬化性組成物注入SUS316製 &lt;框架模型 中’以10Gt下1小時、再以150〇C下5小時進行硬化反應, 即可得到其硬化物。 該所得之硬化物特性之評定結果如下述表3所示。 〔比較例5〕 〈硬化性樹脂組成物(A19) &gt; 硬化性樹脂組成物(A19),其中之光半導體密封材用 硬化性樹脂組成物,係使用已有販售之日本信越化學公司 製造之ASP-1010。 &lt;硬化物之製造及特性評定&gt; 以該販售之ASP-1010A(商品名,日本信越化學公司 製4 )及ASP-1010B (商品名,日本信越化學公司製造) 各以100質量份混合,授拌使全體均-後,再經過脫泡即 可得到硬化性組成物。 之後將該硬化性組成物注入SUS316 夕μ恕槿剞 中,以lOOt下1小時、再以15(rc下5小時進行硬化反應, 323923 115 201247745 即可得到其硬化物。 該所得之硬化物特性方面之評定結果如下述表3所 示。 〔比較例6〕 〈硬化性樹脂組成物(A20) &gt; 硬化性樹脂組成物(A20),其中之光半導體密封材用 硬化性樹脂組成物係使用已有販售,日本Kaneka公司製造 之 FX-〇(U。 &lt;硬化物之製造及特性評定&gt; 將販售之FX-001A (商品名,日本Kaneka公司製造): 40質量份及FX-001B (商品名,日本Kaneka公司製造): 60質量份混,合,進行攪拌使全體均一後,再經過脫泡即可 得到硬化性組成物。 之後將該硬化性組成物注入SUS316製之框架模型 中,以100°C下1小時、150°C下1小時、再以180°C下0. 5 小時進行硬化反應,即可得到其硬化物。 該所得之硬化物特性之評定結果如下述表3所示。 323923 116 201247745 【表1】 倾例1 倾例2 細列3 韵包例4 倾例5 ♦ifef列 6 歡包例7 倾例8 含不飽和鍵之基的有機 聚矽氧烷(A1) 100 質量份 含甲基丙烯醯氧基之有 機聚矽氧烷(A2) 100 質量份 含甲基丙烯醯氧基之有 機聚矽氧烷(A3) 100 質量份 含曱基丙烯醯氧基之有 機聚矽氡烷(A4) 100 質量份 含甲基丙烯醯氧基之有 機聚矽氡烷(A5) 100 質量份 含曱基丙烯醯氧基之有 機聚矽氧烷(A6) 100 質量份 含甲基丙烯醯氧基之有 機聚矽氧烷(A7) 100 質量份 含甲基丙烯醯氧基之有 機聚矽氧烷(A8) 100 質量份 含甲基丙烯醯氧基之有 機聚矽氧烷(A9) 含曱基丙烯醯氧基之有 機聚矽氧烷(A10) 含甲基丙烯醯氧基之有 機聚矽氧烷(All) 含甲基丙烯醯氧基之有 機聚矽氧烷(A12) 含曱基丙烯醯氧基之有 機聚矽氧烷(A13) 含甲基丙烯醯氧基之有 機聚矽氧烷(A14) 含甲基丙烯醯氧基之有 機聚矽氧烷(A15) 含甲基丙烯醯氧基之有 機聚矽氧烷(A16) 含環氧基之有機聚矽氧 烷(A17) 硬化性樹脂組成物(A18) 硬化性樹脂組成物(A19) 硬化性樹脂組成物(A20) 3-曱基丙烯醯氧基丙基 曱基二甲氧矽烷 甲基六氫苯二甲酸酐 熱自由基產生劑 2.5 質量份 2.5 質量份 2.5 質量份 2.5 質量份 2.5 質量份 2.5 質量份 2.5 質量份 2.5 質量份 光自由基產生劑 二—雜辛總 SiH反應率 ◎ ◎ 〇 ◎ ◎ ◎ ◎ 〇 耐熱黃變性 〇 ◎ ◎ ◎ ◎ ◎ ◎ 〇 耐光性 〇 ◎ ◎ ◎ ◎ ◎ ◎ 〇 耐冷熱衝擊性 〇 ◎ 〇 〇 〇 ◎ ◎ 〇 硬度 〇 ◎ ◎ ◎ ◎ 〇 〇 〇 密接性 〇 〇 〇 〇 〇. 〇 〇 〇 阻氣性 ◎ 〇 〇 〇 ◎ ◎ 〇 〇 323923 117 201247745 【表2】 W例 9 獅例 10 雜例 11 動fe例 12 獅例 13 獅例 14 獅例 15 獅例 16 動fe例 17 含不飽和鍵之基的有 機聚矽氣烷(A1) 含甲|丙烯醯氣基之 有機聚矽氧烷(A2&gt; 100 質量份 100 質量份 100 質量份 含甲基丙烯醯氧墓之 有機聚矽氧烷(A3) 含甲基丙烯醞氧墓之 有機聚矽氧烷(A4&gt; 含甲基丙烯醞氧墓之 有機聚矽氣烷(A5) 含甲基丙烯醯氧墓之 有機聚矽氣烷ίΑ6&gt; 含甲基丙烯醞氧墓之 有機聚矽氡烧(Α7) 含甲基丙烯醯氧墓之 有機聚矽氧烧(Α8&gt; 含甲基丙烯醯氧墓之 有機聚矽氣烷(Α9) 100 質量份 含甲基丙烯醞氧墓之 有機聚矽氧烷(Α10) 100 質量份 含甲基丙烯醯氧基之 有機聚矽氣烷(All) 100 質量份 含曱基丙烯醯氧基之 有機聚矽氡烷(A12) 100 質量份 含甲基丙烯醯氧基之 有機聚矽氣院(A13) 100 質量份 含甲基丙烯醞氧基之 有機聚矽氧烷(A14) 100 質量份 含甲基丙烯醯氧基之 有機聚矽氣烷(A15) 含曱基丙烯醯氧基之 有機聚矽氡烷(A16) 含環氧1之有機聚矽 氣烷(A17) 硬化性樹脂組成物 (A18) 硬化性樹脂組成物 (A19) 硬化性樹脂組成物 (A20) 3-曱基丙烯醯氧基丙 基甲基二甲氣珍烷 3 質暈份 曱基六氫苯二甲酸酐 熱自由基產生劑 2.5 質量份 2.5 質量份 2.5 質糞份 2.5 質量份 2.5 質量份 2.5 質#份 2.5 質量份 2.5 質量份 光自由基產生劑 2.5 質量份 二氮雜二裒十一碳婦辛酸 鹽 SiH反應率 〇 〇 ◎ ◎ 〇 ◎ ◎ ◎ ◎ 耐熱黃變性 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ 〇 耐光性 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ 耐冷熱衝擊性 ◎ 〇 〇 〇 ◎ ◎ ◎ ◎ ◎ 硬度 ◎ ◎ ◎ ◎ 〇 〇 ◎ ◎ ◎ 密接性 〇 〇 〇 〇 〇 〇 〇 〇 ◎ 阻氣性 〇 〇 ◎ ◎ 〇 ◎ 〇 〇 〇 323923 118 201247745 【表3】 比較例1 比較例2 比較例3 比較例4 比較例5 比較例6 含不飽和鍵之基的有機 聚矽氧烷(A1) 含甲基丙烯醯氧基之有 機聚矽氧烷(A2) 含曱基丙烯醯氧基之有 機聚矽氧烷(A3) 含曱基丙烯醯氧基之有 機聚矽氣烷(A4) 含曱基丙烯醯氧基之有 機聚矽氧烷(A5) 含甲基丙烯醯氧基之有 機聚矽氧烷(A6) 含甲基丙烯醯氧基之有 機聚矽氧烷(A7) 含曱基丙烯醯氧基之有 機聚矽氧烷(A8) 含甲基丙烯醯氧基之有 機聚矽氧烷(A9) 含曱基丙烯醯氧基之有 機聚矽氧烷(A10) 含甲基丙烯醢氧基之有 機聚矽氣烷(All) 含甲基丙烯醯氧基之有 機聚矽氧烷(A12) 含甲基丙烯醯氧基之有 機聚矽氧烷(A13) 含甲基丙烯醯氧基之有 機聚矽氧烷(A14) 含甲基丙烯醯氧基之有 機聚矽氧烷(A15) 100 質量份 含曱基丙烯醯氧基之有 機聚矽氧烷(A16) 100 質量份 含環氧基之有機聚矽氧 烷(A17) 100 質量份 硬化性樹脂組成物(A18) 100 質量份 硬化性樹脂組成物(A19) 100 質量份 硬化性樹脂組成物(A20) 100 質量份 3-甲基丙烯醯氧基丙基 甲基二甲氣矽烷 甲基六氫苯二甲酸酐 60.5 質量份 熱自由基產生劑 2.5 質量份 2.5 質量份 2.5 質量份 2.5 質量份 2.5 質量份 光自由基產生劑 二衰十一石麟辛雜 1 質量份 SiH反應率 ◎ — ◎ — — — 耐熱黃變性 ◎ ◎ X ◎ 〇 〇 而十光1生 '◎ ◎ X ◎ X 〇 耐冷熱衝擊性 X ◎ ◎ ◎ ◎ X 硬度 ◎ X ◎ X 〇 〇 密接性 〇 〇 ◎ 〇 〇 〇 阻氣性 〇 X ◎ X X ◎ 323923 119 201247745 本實施形態之有機聚矽氧烷,係分子構造中具有上述 通式(1)至(3)所示之構成單位F1、μι、τ中的 (i) F1 及 Ml、 (ii) F1 及 T、 (iii) FI、Ml 及 T 之任意組合的構成單位。 藉由含構成單位F卜ft〇、T,可得到耐熱黃變性、 光性優異之有機聚矽氧烷。 # 同時,由構成單位F1所形成之交聯構造的 含構成單位m μ㈣氧騎構叙可緩㈣力及由 係包含在其局部之分子構造中,因而使其可以兼具硬声立、’ 耐冷熱衝擊性、阻氣性。 又 由實施例1至π可知,在财熱黃變性、耐光性 冷熱衝擊性、硬度、密祕及阻祕之點方面,^ 形成特別是在光半導體用途中所要求之程度均可充分= 的透明硬化物之有機聚錢烧及使用此之硬化性樹月刀旨組: 由比較例1至6可知’由於其中不具備上述本實施形 態之構成,因此由耐熱黃變性、耐光性、耐冷熱衝擊性、 硬度、役接性及阻氣性之中的所欲之特性及此等特性之平 衡的觀點而言,實際使用上並無法得到完全之特性。 今、号列甲s月,亦很據2〇11年3月3〇日向日本 提出申請之歐洲專利申請(第pCT/Jp2〇u/〇58115 2〇U年3月31日向中華民國經濟部智慧財產局提; 323923 120 201247745 之專利申請(第l〇〇mi96號),其中之内容亦包含在本案 作為參照。 [產業上之可利用性] 本發明之有機聚㈣院及使用其之硬化性樹脂組成 =,可作為光半導體用晶片接合材、塗覆材、奈米模印用 2性樹脂組錢、印墨㈣H在產社具有可利 【圖式簡單說明】 無。 【主要元件符號說明】 無。 323923 121An integer of 8 each. &lt;Production and Characterization of Hardened Material&gt; In 100 parts by mass of the epoxy group-containing organopolyoxane (A17), 60.5 parts by mass of mercaptohexahydrophthalic anhydride and 1 part by mass are mixed. The azabicycloundecene octoate is stirred to make the whole uniform, and then defoamed to obtain a curable composition. Thereafter, the curable composition was injected into the mold, and the hardening reaction was carried out by performing a curing reaction at 120 ° C for 1 hour and at 150 ° C for 2 hours. The evaluation results of the obtained cured product characteristics are shown in Table 3 below. [Comparative Example 4] 323923 114 201247745 &lt; Curable resin composition (A18) &gt; The curable resin composition (A18), wherein the curable resin composition for the optical semiconductor sealing material is a commercially available Japanese Shin-Etsu Chemical Co., Ltd. Manufactured by KER-2500. &lt;Production and Characterization of Hardened Material&gt; The KER-2500A and KER-2500B which have been sold are mixed in 1 〇Q parts by mass, and the whole is uniform, and then defoamed to obtain a hardenable composition. Things. Then, the curable composition was poured into a SUS316 &lt;frame model&apos; to cure at 10 Gt for 1 hour and then at 150 ° C for 5 hours to obtain a cured product. The evaluation results of the obtained cured product characteristics are shown in Table 3 below. [Comparative Example 5] <Curable resin composition (A19) &gt; A curable resin composition (A19), wherein the curable resin composition for an optical semiconductor sealing material is made of a Shinhan Chemical Co., Ltd., which is already sold. ASP-1010. &lt;Production and characterization of the cured product&gt; The ASP-1010A (trade name, manufactured by Shin-Etsu Chemical Co., Ltd., Japan) and ASP-1010B (trade name, manufactured by Shin-Etsu Chemical Co., Ltd., Japan) are each mixed in 100 parts by mass. The mixture is allowed to be mixed, and then the defoaming is carried out to obtain a curable composition. Then, the curable composition was poured into SUS316, and the cured product was obtained by performing a hardening reaction at 15 hours under 1500 hours and then at 153923 115 201247745. The obtained cured product characteristics were obtained. The evaluation result of the aspect is shown in the following Table 3. [Comparative Example 6] <Curable resin composition (A20) &gt; The curable resin composition (A20), wherein the curable resin composition for the optical semiconductor sealing material is used FX-〇 (U. &lt;Manufacturing and Characterization of Hardened Articles) manufactured by Kaneka Co., Ltd., Japan, sold FX-001A (trade name, manufactured by Kaneka, Japan): 40 parts by mass and FX- 001B (product name, manufactured by Kaneka Co., Ltd., Japan): 60 parts by mass, mixed, and stirred, and the whole is uniform, and then defoamed to obtain a curable composition. The curable composition is then injected into a frame model made of SUS316. In the medium, the hardening reaction is carried out at 100 ° C for 1 hour, at 150 ° C for 1 hour, and then at 180 ° C for 0.5 hours. The evaluation results of the obtained cured product characteristics are as follows: 3 is shown. 323923 116 2 01247745 [Table 1] Pour Example 1 Pour Example 2 List 3 Rhyme Case 4 Pour Example 5 ♦ifef Column 6 Cases 7 Pour Example 8 Organopolyoxane (A1) with unsaturated bond base 100 parts by mass Organopolyoxyalkylene (A2) containing methacryloxyloxy group 100 parts by mass of organopolyoxyalkylene containing methacryloxyloxy group (A3) 100 parts by mass of organopolyfluorene containing anthracenyl acryloxy group Alkane (A4) 100 parts by mass of organopolydecane (A5) containing methacryloxyloxy group 100 parts by mass of organopolyoxyalkylene (A6) containing mercaptopropenyloxy group 100 parts by mass of methacrylic acid containing hydrazine Oxy-organic polypolyoxyalkylene (A7) 100 parts by mass of methacryloxy-containing organopolyoxyalkylene (A8) 100 parts by mass of methacryloxy-containing organopolyoxane (A9) Alkyl propylene oxy-organic organic polyoxyalkylene (A10) methacryloxy-containing organic polyoxyalkylene (All) methacryloxy-containing oxy-organopolyoxyalkylene (A12) Acrylic oxime-based organopolyoxane (A13) containing methacryl Organic polyoxyalkylene (A14) organopolyoxyalkylene containing methacryloxyloxy group (A15) organopolyoxyalkylene containing methacryloxycarbonyl group (A16) Organic polyfluorene containing epoxy group Oxane (A17) Curable resin composition (A18) Curable resin composition (A19) Curable resin composition (A20) 3-mercapto propylene methoxy propyl fluorenyl dimethoxy decyl methyl hexahydrobenzene Dicarboxylic anhydride thermal radical generator 2.5 parts by mass 2.5 parts by mass 2.5 parts by mass 2.5 parts by mass 2.5 parts by mass 2.5 parts by mass 2.5 parts by mass 2.5 parts by mass of photo radical generating agent di-octane total SiH reaction rate ◎ ◎ 〇 ◎ ◎ ◎ ◎ 〇 〇 〇 〇 ◎ ◎ ◎ ◎ ◎ ◎ 〇 〇 〇 ◎ ◎ ◎ ◎ ◎ ◎ 〇 〇 冷 冷 热 ◎ ◎ ◎ 〇 〇 〇 ◎ ◎ ◎ ◎ 〇〇〇 〇〇〇 〇〇〇 〇〇〇 〇〇. 〇〇〇 gas barrier ◎ 〇〇〇 ◎ ◎ 〇〇 323923 117 201247745 [Table 2] W example 9 Lion case 10 Miscellaneous 11 12 Lion Case 13 Lion Case 14 Lion Case 15 Lion Case 16 Acting Example 17 Organic Polyoxane (A1) Containing Unsaturated Bonds A|Polyylene-based Organic Polyoxane (A2> 100 Quality 100 parts by mass of 100 parts by mass of organopolyoxyalkylene containing methacrylic acid tomb (A3) organic polyoxyalkylene containing methacrylic acid tomb (A4&gt; organic polyfluorene containing methacrylic acid tomb Alkane (A5) Organic polyoxane containing methacrylic oxime tombs &6&gt; Organic polyfluorene containing methacrylic oxime tomb (Α7) Organic polyoxynoxy oxymethane containing methacrylic oxime Α8&gt; Organic polyxane (meth) containing methacrylofluorene tomb (100) parts by mass of organopolyoxyalkylene containing methacrylofluorene (Α10) 100 parts by mass of organic poly(meth) oxirane Hexane (All) 100 parts by mass of an organic polydecane (A12) containing a mercapto propylene oxime group 100 parts by mass of an organic polyfluorene (A13) containing a methacryloxy group. 100 parts by mass of a methyl group Acryloxy Organic polyoxyalkylene (A14) 100 parts by mass of organopolyxylene oxide containing methacryloxyloxy group (A15) Organic polydecane containing amidino propyleneoxy group (A16) Organic polymerization containing epoxy 1 Xenon (A17) Curable resin composition (A18) Curable resin composition (A19) Curable resin composition (A20) 3-mercapto propylene methoxy propyl dimethyl dimethyl hydride 3 Part of mercapto hexahydrophthalic anhydride thermal free radical generator 2.5 parts by mass 2.5 parts by mass 2.5 quality feces 2.5 parts by mass 2.5 parts by mass 2.5 parts by mass 2.5 parts by mass 2.5 parts by mass photoradical generator 2.5 parts by mass of dinitrogen杂 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ 耐 耐 耐 耐 耐 耐 耐 耐 耐 耐 耐 耐 耐 耐 耐 耐 耐 耐 耐 耐 耐 耐 耐 耐〇〇 ◎ ◎ ◎ ◎ ◎ Hardness ◎ ◎ ◎ ◎ 〇〇 ◎ ◎ ◎ Adhesive 〇〇〇〇〇〇〇〇 ◎ Gas barrier 〇〇 ◎ ◎ 〇 ◎ 〇〇〇 323923 118 201247745 [Table 3] Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 Comparative Example 5 Comparative Example 6 Organic polyoxy siloxane (A1) containing an unsaturated bond group Containing methacryl Electrolytic organic polyoxyalkylene (A2) organic polyoxyalkylene containing mercapto propylene oxy group (A3) organic polyfluorene alkane containing fluorenyl propylene oxy group (A4) fluorenyl propylene oxide Organic polyoxyalkylene (A5) organopolyoxyalkylene containing methacryloxyloxy group (A6) organopolyoxyalkylene containing methacryloxyloxy group (A7) Organopolyoxyalkylene (A8) Organopolyoxyalkylene containing methacryloxyloxy group (A9) Organopolyoxyalkylene containing mercaptopropenyloxy group (A10) Organopoly group containing methacryloxyloxy group Hexane (All) Organopolyoxyalkylene containing methacryloxyloxy group (A12) Organopolyoxyalkylene containing methacryloxyloxy group (A13) Organopolyoxyloxy group containing methacryloxyloxy group Alkane (A14) Organopolyoxyalkylene (A15) containing methacryloxyloxy group 100 Quality Organic polyoxyalkylene (A16) containing a mercapto propylene oxime group 100 parts by mass of an organopolysiloxane containing an epoxy group (A17) 100 parts by mass of a curable resin composition (A18) 100 parts by mass of a curable resin (A19) 100 parts by mass of the curable resin composition (A20) 100 parts by mass of 3-methylpropenyloxypropylmethyl dimethyl decylmethylhexahydrophthalic anhydride 60.5 parts by mass of a thermal radical generator 2.5 parts by mass 2.5 parts by mass 2.5 parts by mass 2.5 parts by mass 2.5 parts by mass photoradical generator second fading elishifin syrup 1 part by mass SiH reaction rate ◎ — ◎ — — — heat yellowing ◎ ◎ X ◎ 〇〇十光一生'◎ ◎ X ◎ X 〇 cold thermal shock resistance X ◎ ◎ ◎ ◎ X hardness ◎ X ◎ X 〇〇 adhesion 〇〇 ◎ 〇〇〇 gas barrier 〇 X ◎ XX ◎ 323923 119 201247745 This embodiment The organopolyoxane having a molecular structure having (i) F1 and M1, (ii) F1 and T, (iii) of the constituent units F1, μ, and τ represented by the above formulas (1) to (3) ) The constituent unit of any combination of FI, Ml, and T. By containing the constituent units F ft 〇 and T, an organic polysiloxane having excellent heat yellowing resistance and excellent optical properties can be obtained. # At the same time, the constituent unit of the cross-linked structure formed by the constituent unit F1 is m μ(4), and the oxygen is trapped in the molecular structure of the part, so that it can be combined with a hard sound. Resistance to thermal shock and gas barrier. Further, from the examples 1 to π, in terms of the heat yellowing, the light-resistant thermal shock resistance, the hardness, the secret and the blocking, the degree of formation required for the use of the optical semiconductor is sufficient. The organic smoldering of the transparent cured product and the sclerosing tree of the sclerosing slabs of the present invention: It is known from the comparative examples 1 to 6 that since it does not have the above-described configuration of the present embodiment, it is resistant to yellowing, light resistance, heat and cold resistance. From the viewpoints of the desired characteristics among the impact, hardness, serviceability, and gas barrier properties and the balance of these characteristics, the actual properties cannot be obtained completely. Today, the number of s monthly, is also based on the European patent application filed with Japan on March 3, 2011 (pCT/Jp2〇u/〇58115 2〇May 31, U to the Ministry of Economic Affairs of the Republic of China Patent Application No. 323923 120 201247745 (No. l. Mi96), the contents of which are also incorporated herein by reference. [Industrial Applicability] The organic poly(four) hospital of the present invention and the sclerosing properties thereof Resin composition = can be used as a wafer bonding material for optical semiconductors, a coating material, a two-component resin for nano-imprinting, and an ink (four) H. It is profitable in production. [Simplified description of the drawing] None. 】 No. 323923 121

Claims (1)

201247745 七 、申請專利範圍: 種有機聚發氧炫,係在〗分子中人 ^ 刀千中含1個以上含不飽 和鍵之基,而具有下述通式(n 星朽Γ1 丄 巧至(3)所示之構成 皁位Fl、Ml、T中的 (i ) F1 及 Ml、 (ii) F1 及 T、 (iii) F1 及 Ml 及 T 之任意組合的構成單位; F Y—R2 (R1Si02/2 ) a Μ 1 X—— R^SiOA、 b Τ (R1Si03/2 ) 0 數1 式至(In) i (3)中’ R'表示由:取代或未取代之碳 =至Η»的炫基、取代或未取代之碳數3至1〇的環 ::之=Γ代之芳基及取代或未取代之芳坑基 之任意者;R2表示碳數2至丨。含不儉 和鍵之基;X表示碳數2 5 1n 1G之二價烴基;Y表示碳 j_;a、bL地表示1以 之整數,其中,F1表千‘ 位)。 Μ衣狀有機聚矽氧烷之構成單 323923 201247745 2.如申請專利範圍帛1項所述之有機聚石夕氧燒,上述通 式(1)至(3)中,a、b、c滿足下述式(I), 〇. l^a/ (b+c) · · · ( I)。 3·如申料鄉圍第1項或第2項所述之有機聚石夕氧 烷,上述通式(1)所示之構成單位F1中之R2係丙烯 酿氧基或甲基丙烯醯氡基。 4·如申請專利範圍第丄至3項中任一項所述之有機聚石夕 ,垸’其中’含有下述通式⑷至⑷所示之構成 單位:Dl、D2、D3之任意者,201247745 VII. Patent application scope: A kind of organic polyoxygen ray, which is contained in the molecule. The knives contain more than one group containing unsaturated bonds, and have the following general formula (n star Γ1 丄巧到( 3) The constituent units of any combination of (i) F1 and M1, (ii) F1 and T, (iii) F1 and M1 and T in the constituent soap positions F1, M1, T; FY-R2 (R1Si02/ 2) a Μ 1 X—— R^SiOA, b Τ (R1Si03/2 ) 0 Number 1 to (In) i (3) where 'R' means: replaced or unsubstituted carbon = to Η» a substituted, unsubstituted or unsubstituted carbon number of 3 to 1 fluorene:: any of the deuterated aryl group and the substituted or unsubstituted aryl group; R2 represents a carbon number of 2 to fluorene. The base; X represents a divalent hydrocarbon group having a carbon number of 2 5 1 n 1G; Y represents carbon j_; a, bL represents an integer of 1, wherein F1 represents a thousand position). The composition of the smear-like organic polyoxyalkylene 323923 201247745 2. The organic polyoxo-oxygenation according to the scope of claim 1, wherein a, b, and c satisfy the above formulas (1) to (3) The following formula (I), 〇. l^a/ (b+c) · · · (I). 3. In the case of the organic polyoxo oxane described in Item 1 or 2 of the claim, the R2 propylene oxide or methacryl oxime in the constituent unit F1 represented by the above formula (1) base. 4. The organic polylith described in any one of claims 3 to 3, wherein 其中' contains 'any of the constituent units represented by the following general formulae (4) to (4): D1, D2, D3, D 1 : ( R12Si〇2’2) D 2 : ( RlSi〇2/2 ) D 3 : ( R12Si〇2,2) (通式(4)至(6)中’R1表示由:取代或未取代之碳 數1至10的烷基、取代或未取代之碳數3至1〇的環 烷基、取代或未取代之芳基及取代或未取代之芳烷美 所成之群中選擇擔意者;X表示碳數2至1()之二^ 烴基; 一谓 其中’D卜D2表轉狀有機聚錢烧之構成單位, 3表不鏈狀有機聚矽氧烷之構成單位)。 .=請專利範圍第4 4項中任一項所述之有機聚石夕 氧燒’其中’含有下述通式⑺所示之構成單位s, 323923 2 201247745 且該通式(7)所示之構成單位的含量,相對於上述通 式(1)所示之構成單位F1的含量,滿足下述式(π): d/a ^〇.1 ---(11) S: (RiHSi〇2/2)d …⑺ (通式(7)中’ R1表示由:取代或未取代之碳數1至 10的烷基、取代或未取代之碳數3至1〇的環烷基、取 代或未取代之芳基及取代或未取代之芳烧基所成之群 中選擇之任意者;其中,構成單位S表示環狀或鏈狀 有機聚矽氧烷之構成單位)。 6. 如申請專利範圍第1至5項中任一項所述之有機聚矽 氧烷,其中,只含有上述通式(1)所示之構成單位!^, 作為含有上述R2之構成單位。 7. 如申請專利範圍第1至5項中任一項所述之有機聚石夕 氧烷,其中,含有上述通式(丨)所示之構成單位F1 及下述通式(8)所示之構成單位F2,作為含有上述 R2之構成單位, (而且,下述通式(8)中,β係包含於上述R2中) F 2 : Y—R21 (R12SiCV2) • · · ( 8 ) (上述通式(8)中,R1表示由:取代或未取代之碳數 1至10的烧基、取代或未取代之碳數3至1〇的環烧基' 323923 3 201247745 取代或未取代之芳基及取代或未取代之芳烷基所成之 群中選擇之任意者;R21表示丙烯醯氧基或甲基丙烯酿 氧基;Y表不碳數2至1〇之一價fe基; 其中,F2表示鏈狀有機聚石夕氧烧之構成單位)。 8.一種有機聚矽氧烷,其中’相對於100質量份之如申 請專利範圍第1至7項中任一項所述之有機聚矽氧 炫,又含有0.1至100質量份之下述通式(9)所示之 環狀有機聚石夕氧垸’ Ri-sio-R1 y^iolx 丨R2 • · · v y ) (上述通式(9)中,R1表示由:取代或未取代之碳數 1炱10的烷基、取代或未取代之碳數3至10的環烷基、 取代或未取代之芳基及取代或未取代之芳炫基所成之 群中選擇之任意者;R21表示丙烯醯氧基或曱基丙烯醯 氣基,X表示碳數2至10之二價煙基;e表示1以上 之整數’ f表不0以上之整數,e+f表示3至20之整 數)° 9. 一種有機聚矽氧烷’其中,相對於1〇〇質量份之如申 請專利範圍第1至8項中任一項所示的有機聚石夕I 烷,又含有〇. 01至1000質量份之下述通式(1〇)所 示的化合物, 323923 4 201247745 1H-R1 “—810—&gt;-丨S1IR1 V)Γ-lio&gt;-卩10-11 RIS'IY—-sIR«R1- wlsio—R11 .I h Rl^IX— R •••(10) (上述通式(10)中,R1表示由:取代或未取代之碳數 1至10的烷基、取代或未取代之碳數3至10的環烧基、 取代或未取代之芳基及取代或未取代之芳烧基所成之 群中選擇之任意者;R21表示丙烯醯氧基或甲基丙稀酿 氧基,X表不碳數2至10之二價經基,g表示1以上 之整數;h表示0以上之整數;i表示0至20之整數)。 10.如申請專利範圍第1至9項中任一項所述之有機聚石夕 氧烷,其中,含有下述通式(9)所示之環狀有機聚矽 氧烷及下述通式〇〇)所示之化合物’ R1 R1 (平 〇)j- X r1 I R21 • · · ( 9 ) (上述通式(9)中,R1表示由:取代或未取代之碳數 1至10的烷基、取代或未取代之碳數3至丨〇的環烷基、 取代或未取代之芳基及取代或未取代之芳烷基所成之 群中選擇之任意者;R21表示丙燦感氧基或曱基丙稀驗 323923 5 201247745 氧基;X表示碳數2至10之二價烴基;e表示1以上 之整數,f表示0以上之整數;e+f表示3至20之整 數) f R1 R1 R1 ksiO^SiOMSiO)-(SiO)- X R1 丫个1 + 丄21 R1—SiO-(SiO)i-Si—R1 R1 R1 R1 •••(10) (通式(10)中,R1表示由:取代或未取代之碳數j 至10的烷基、取代或未取代之碳數3至1〇的環烷基、 取代或未取代之芳基及取代或未取代之芳燒基所成之 群中選擇之任意者;R21表示丙烯醯氧基或甲基丙烯醯 氧基;X表示碳數2至1〇之二價烴基;g表示丨以上 之整數;h表示〇以上之整數;丨表示〇至2〇之整數) 其由以基質輔助游離化飛行時間型質譜分析法測 定時所得之峰的強度以下述式(111)計算,所得之上 述通式(10)所示之化合物含量〔WB〕 式⑻所示之化合物含量…〕之比:〔二、 之值為0· 1以上20. 〇以下, [數1] ⑽·]=符合通式⑴)之構造的質量盘納質 量23的合計質量所相當之峰的強度/符合通式⑷f 323923 構造的質量與鈉質* 23的合計質量所相當之峰的強 201247745 度..··( III)。 11·如申請專利範圍第1至10項中任一項所述之有機聚矽 氧烷’其中,上述R1為碳數1至10之烷基。 12·如申請專利範圍第1至11項中任一項所述之有機聚矽 氧烷,其中,上述R1為曱基。 13. 如申請專利範圍第1至12項中任一項所述之有機聚矽 氧院’其中,上述R2含有丙烯醯氧基或曱基丙烯醯氧 基’且丙烯醯氧基或甲基丙烯醯氧基之官能基當量為 210 至 2100g/莫耳。 14. 如申請專利範国第1至13項中任一項所述之有機聚石夕 氧燒’其重量平均分子量為700至5000000,25°C之黏 度為 50 至 loooooo mpa · s。 15, 一種有機聚矽氧烷的製造方法,係製造如申 圍第1至14項中任一項所述之有機聚 已 其具有下述步驟·· ^㈣法’ 所示之氫化聚矽 依所需之具有1舰上直接 ^ (al) 子的氫化聚矽氧烷(a2)、 -於矽原子之 i)具有2個以上直接鍵結於矽 乙稀基的有機聚發氧燒(bl)或具^的乙稀基 結於石夕原子_基之聚錢燒⑽2個以上直: ⑴1分子中具有2個以上不餘和=及 (C)之加成反應, 鍵的有機化 323923 在錢化反應催化劑⑷之存在下進行之和 201247745 R1 R1 ^ίοΗφ〇)^ η R1 ...(11) (通式(11)中,R1表示由:取代或未取代之碳數1 至10的烷基、取代或未取代之碳數3至1〇的環烷基、 取代或未取代之芳基及取代或未取代之芳烧基所成之 群中選擇之任意者;j表示1以上之整數;k表示〇以 上之整數,j+k表示3至20之整數)。 16.如申請專利範圍第15項所述之有機聚矽氧烷的製造方 法/、中,上述進行加成反應之步驟係包含:調製反 應液的步驟、以及在上述反應液中添加矽氫化反應催 化劑(d)之步驟,其中, 該反應液含有上述通式(11)所示之氫化聚矽氧 炫(a/)、依所f之上述具有i個以上直接鍵結於石夕原 子之氫原子的氫化聚矽氧烷(a2)、 上述具有2個以上之直接鍵結於矽原子的乙烯基 之含乙烯基的有機聚梦氧烧(bl)及1分子中= 個=上不飽和鍵的有機化合物(c),或是具有2、個以 上直接鍵結於發料_基之㈣氧燒(⑻及1分 子中具有2個以上不飽和鍵的有機化合物⑷ 77 n.m利範園第15項所述之有機聚嫩的製造方 ^述㈣:上切行Μ之反敲步驟,係依序進行 323923 201247745 調製反應液的步驟,該反虛 (11)所示之氫化聚錢燒(al Γ依所=:::式 1個以上直接鍵結於矽原子之氫原子 / 了有 二及1分子中具有2個以上不飽和鍵的有It 二=:::: =魏U1)、依所需之上料有丨個以上直接鍵结 原子之虱原子的氫化聚石夕氧燒U2)及1分子中 具有2個以上不飽和鍵的有機化合物⑷之加成物· 以及 添加步驟’係在上述反應液巾加人上述具有2個 以上f接鍵結於⑪原子的乙稀基之含乙的二有機 聚夕氧貌(bl )、或具有2個以上直接鍵結於石夕原子的 經基之聚矽氧烷(b2)。 认-種,化性樹脂組成物,其含有⑽質量份之如申請 專利la圍第1至14項中任—項所述之有機聚發氧烧及 ^至10質量份之熱自由基產生劑。 Μ.-種硬化性樹脂組成物,其含有⑽質量份之如申請 專利範圍第1至14項中任_項所述之有機聚發氧烧及 〇·5至20質量份之光自由基產生劑。 20·如申⑽利範圍第18項或第項所述之硬化性樹脂 組成物,其中,相對於100 f量份之如中請專利範圍 第1至14項中任一項所述之有機聚矽氧嫁’又含有0· 1 323923 9 201247745 至10質量份之矽烷偶合劑。 21·如申匕請專利範圍第18至2G項作-項所述之硬化性 樹脂組成物,其中,相對於100質量份之如申請專利 範圍第1至14項中任一項所述之有機聚矽氧烷,又含 有〇· 001質量份以下之(d) %氫化反應催化劑。 22. 如申請專利範圍第18至21項中任_項所述之硬化性 樹脂組成物,其中,相對於100質量份之如申請專利 範圍第1至14項中任一項所述之有機聚矽氧烷,又含 有0. 1至500質量份之無機氧化物。 23. 種光半導體用密封材,其包含如申請專利範圍第18 至22項中任一項所述之硬化性樹脂組成物。 24*種光半導體用晶片接合材(die bonding material), 其包含如申請專利範圍第18至22項中任一項所述之 硬化性樹脂組成物。 25· —種塗覆材,其包含如申請專利範圍第18至項中 任一項所述之硬化性樹脂組成物。 26. —種奈米模印用硬化性樹脂組成物,其包含如申請專 利範圍第18至22項中任一項所述之硬化性樹脂組成 物。 27· —種印墨,其包含如申請專利範圍第18至22項中任 一項所述之硬化性樹脂組成物及著色劑。 28·—種光半導體封裝體,係以如申請專利範圍第23項所 述之光半導體用密封材而成形。 323923 10 201247745 四、指定代表圖:本案無圖式。 (一) 本案指定代表圖為:無。 (二) 本代表圖之元件符號簡單說明:無。 五、本案若有化學式時,請揭示最能顯示發明特徵的化學式:D 1 : ( R12Si〇2'2) D 2 : ( RlSi〇2/2 ) D 3 : ( R12Si〇 2, 2) (In the general formulae (4) to (6), 'R1 represents: substituted or unsubstituted The choice of the alkyl group having 1 to 10 carbon atoms, the substituted or unsubstituted carbon group having 3 to 1 ring of a cycloalkyl group, the substituted or unsubstituted aryl group, and the substituted or unsubstituted aralkyl group X represents a dihydrocarbyl group having a carbon number of 2 to 1 (); a unit of which is a constituent unit of the 'Db D2 table-like organic polycohol, and 3 is a constituent unit of the chain-like organopolyoxane. The organic polyoxo igniting 'in which' contains the constituent unit s represented by the following general formula (7), 323923 2 201247745 and the general formula (7) is shown in the above. The content of the constituent unit satisfies the following formula (π) with respect to the content of the constituent unit F1 represented by the above formula (1): d/a ^〇.1 ---(11) S: (RiHSi〇2 /2)d (7) (In the formula (7), R1 represents a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 1 ring carbon number, a substitution or Any one selected from the group consisting of an unsubstituted aryl group and a substituted or unsubstituted aryl group; wherein the constituent unit S represents a constituent unit of a cyclic or chain organopolysiloxane. 6. The organopolysiloxane according to any one of claims 1 to 5, which contains only the constituent unit represented by the above formula (1)! ^, as a constituent unit containing the above R2. 7. The organopolyoxane according to any one of the above-mentioned claims, wherein the structural unit F1 represented by the above formula (丨) and the following formula (8) are contained. The constituent unit F2 is a constituent unit containing the above R2 (and, in the following general formula (8), β is contained in the above R2) F 2 : Y - R21 (R12SiCV2) • · · ( 8 ) (above In the formula (8), R1 represents a substituted or unsubstituted carbon group having 1 to 10 carbon atoms, a substituted or unsubstituted carbon group of 3 to 1 fluorene. 323923 3 201247745 Substituted or unsubstituted aryl Any one selected from the group consisting of a substituted or unsubstituted aralkyl group; R21 represents an acryloxy group or a methacryloxy group; and Y represents a carbon number of 2 to 1 Å; , F2 represents the constituent unit of the chain organic polysulfide. An organopolyoxane wherein the 'organic polyoxoxime according to any one of claims 1 to 7 of the patent application range contains 0.1 to 100 parts by mass with respect to 100 parts by mass of the following The cyclic organopolyphosphonium represented by the formula (9): Ri-sio-R1 y^iolx 丨R2 • · · vy ) (In the above formula (9), R1 represents a substituted or unsubstituted carbon Any one selected from the group consisting of an alkyl group having 1 to 10 alkyl groups, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, a substituted or unsubstituted aryl group, and a substituted or unsubstituted aryl group; R21醯 醯 醯 曱 曱 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示And an organic polyoxane wherein the organic polyoxane as shown in any one of claims 1 to 8 of the patent application range contains 〇. 01 to 1000 parts by mass of a compound represented by the following formula (1〇), 323923 4 201247745 1H-R1 "-810-&gt;-丨S1IR1 V)Γ-lio&gt;-卩10-11 RIS'IY--sIR« R1- wlsio-R 11. I h Rl^IX— R •••(10) (In the above formula (10), R1 represents a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted carbon number of 3 Any one selected from the group consisting of a cycloalkyl group, a substituted or unsubstituted aryl group, and a substituted or unsubstituted aryl group; R21 represents an acryloxy group or a methyl propylene oxide group, X a divalent radical having no carbon number of 2 to 10, g represents an integer of 1 or more; h represents an integer of 0 or more; i represents an integer of 0 to 20.) 10. As in any one of claims 1 to 9 of the patent application. The organopolyoxane having a cyclic organopolyoxane represented by the following formula (9) and a compound represented by the following formula (R) R1 (ping) j - X r1 I R21 • (9) (In the above formula (9), R1 represents a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted carbon number of 3 to 丨〇. Any one selected from the group consisting of a cycloalkyl group, a substituted or unsubstituted aryl group, and a substituted or unsubstituted aralkyl group; R21 represents a propylene-sensitized oxy group or a fluorenyl propyl group 323923 5 201247745 oxy group; Carbon 2 to 10 divalent hydrocarbon groups; e represents an integer of 1 or more, f represents an integer of 0 or more; e + f represents an integer of 3 to 20) f R1 R1 R1 ksiO^SiOMSiO)-(SiO)- X R1 丫1 + 丄21 R1—SiO—(SiO)i-Si—R1 R1 R1 R1 •••(10) (In the formula (10), R1 represents a substituted or unsubstituted alkyl group having a carbon number of from j to 10, Any one selected from the group consisting of a substituted or unsubstituted cycloalkyl group having 3 to 1 Å carbon atoms, a substituted or unsubstituted aryl group, and a substituted or unsubstituted aryl group; R21 represents an acryloxy group or a group a propylene oxy group; X represents a divalent hydrocarbon group having a carbon number of 2 to 1 Å; g represents an integer above 丨; h represents an integer above 〇; 丨 represents an integer of 〇 to 2〇) which is supported by matrix-assisted free radicalization The intensity of the peak obtained by the time-based mass spectrometry is calculated by the following formula (111), and the ratio of the compound content represented by the above formula (10) (WB) to the content of the compound represented by the formula (8) is: The value is 0. 1 or more and 20. The following is the case. [1] (10)·] = the peak of the mass of the mass henna quality 23 of the structure conforming to the general formula (1)) / Structure corresponding to the formula ⑷f 323923 * sodic quality and the total mass of relatively strong peaks 23 201 247 745 degrees .. ·· (III). The organopolysiloxane described in any one of the above claims, wherein R1 is an alkyl group having 1 to 10 carbon atoms. The organopolyoxane according to any one of claims 1 to 11, wherein the above R1 is a fluorenyl group. 13. The organopolyxide chamber according to any one of claims 1 to 12, wherein the above R2 contains an acryloxy group or a mercaptopropenyloxy group and an acryloxy group or a methacryl group The functional group equivalent of the methoxy group is from 210 to 2100 g/mole. 14. The organic polyoxo fired according to any one of claims 1 to 13 which has a weight average molecular weight of 700 to 5,000,000 and a viscosity at 25 ° C of 50 to loooooo mpa · s. A method for producing an organopolyoxane, which comprises the method of the following steps: - (4) The desired hydrogenated polyoxyalkylene (a2) having a direct ^ (al) on the ship, and the i) having more than two organic polyoxygens directly bonded to the vinyl group (bl) Or the ethylene group with ^ is attached to the Shi Xi atom _ base of the money to burn (10) more than 2 straight: (1) 1 molecule has more than 2 and = and (C) addition reaction, the bond organicization 323923 And the amount of the carbonization reaction catalyst (4) is 2012-0745 R1 R1 ^ίοΗφ〇)^ η R1 (11) (In the formula (11), R1 represents a substituted or unsubstituted carbon number of 1 to 10 Any one selected from the group consisting of an alkyl group, a substituted or unsubstituted cycloalkyl group having 3 to 1 Å carbon atoms, a substituted or unsubstituted aryl group, and a substituted or unsubstituted aryl group; j represents 1 or more An integer; k represents an integer above 〇, and j+k represents an integer from 3 to 20. 16. The method for producing an organopolysiloxane according to the fifteenth aspect of the invention, wherein the step of performing the addition reaction comprises: a step of preparing a reaction liquid, and adding a hydrogenation reaction to the reaction liquid. a step of the catalyst (d), wherein the reaction liquid contains the hydrogenated polyoxoxime (a/) represented by the above formula (11), and the above-mentioned one or more hydrogens directly bonded to the austenite atom Atomic hydrogenated polyoxyalkylene (a2), a vinyl group-containing organic polyoxyl (bl) having two or more vinyl groups bonded directly to a ruthenium atom, and one molecule = one upper unsaturated bond Organic compound (c), or having more than 2 or more directly bonded to the hair-based (4) oxy-fired ((8) and organic compound having 2 or more unsaturated bonds in one molecule (4) 77 nm Lifanyuan item 15 The manufacturing method of the organic poly-fat is described in (4): the reverse-knocking step of the upper-cutting line, the step of preparing the reaction liquid by 323923 201247745, and the hydrogenation of the imaginary (11) (al) According to the =::: formula, more than one hydrogen atom directly bonded to the ruthenium atom One of the two molecules having two or more unsaturated bonds is It ==:::: = Wei U1), and the hydrogenation of the ruthenium atom with more than one direct bond atom is required. And an adduct of the organic compound (4) having two or more unsaturated bonds in one molecule, and an addition step of the above-mentioned reaction liquid towel, including the above-mentioned ethylene group having two or more f-bonded to 11 atoms a di-organic polyoxyl (b) of B, or a polyoxyalkylene (b2) having two or more groups bonded directly to the Shihe atom. An organic resin composition containing (10) parts by mass of the organic polyoxygenated gas and 10 to 10 parts by mass of the thermal radical generating agent as described in any one of claims 1 to 14 of the patent application . A sclerosing resin composition containing (10) parts by mass of an organic polyoxymethane as described in any of claims 1 to 14 and 5 to 20 parts by mass of photoradical generation Agent. The sclerosing resin composition according to any one of claims 1 to 14, wherein the organic polymerization according to any one of claims 1 to 14 "Oxygen Margin" also contains 0·1 323923 9 201247745 to 10 parts by mass of decane coupling agent. The sclerosing resin composition according to the above-mentioned item of the present invention, wherein the organic material as described in any one of claims 1 to 14 of the patent application is related to 100 parts by mass. The polyoxyalkylene gas further contains (d) % of a hydrogenation catalyst of 0.001 parts by mass or less. The sclerosing resin composition according to any one of claims 1 to 4, wherein the organic polymer according to any one of claims 1 to 14 of the patent application, in relation to 100 parts by mass The oxoxane further contains 0.1 to 500 parts by mass of an inorganic oxide. A sealing material for a photo-semiconductor comprising the curable resin composition according to any one of claims 18 to 22. A die bonding material for a photo-semiconductor, which comprises a curable resin composition according to any one of claims 18 to 22. A coating material comprising the curable resin composition according to any one of claims 18 to 20. A curable resin composition for a nano-imprint, which comprises the curable resin composition according to any one of claims 18 to 22. An ink-based composition comprising a curable resin composition and a coloring agent according to any one of claims 18 to 22. The optical semiconductor package is formed by using a sealing material for an optical semiconductor as described in claim 23 of the patent application. 323923 10 201247745 IV. Designated representative map: There is no schema in this case. (1) The representative representative of the case is: No. (2) A brief description of the symbol of the representative figure: None. 5. If there is a chemical formula in this case, please disclose the chemical formula that best shows the characteristics of the invention: 323923 4323923 4
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TWI746653B (en) * 2016-09-29 2021-11-21 日商鐘化股份有限公司 Photosensitive composition, coloring pattern and manufacturing method thereof
TWI825270B (en) * 2019-02-12 2023-12-11 日商信越化學工業股份有限公司 Organically modified silicone resin composition for die bonding, its hardened product and optical semiconductor element

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KR20180129867A (en) * 2016-03-31 2018-12-05 다이요 잉키 세이조 가부시키가이샤 Curable resin composition, dry film, cured product and printed wiring board

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DE19860361A1 (en) * 1998-12-24 2000-06-29 Espe Dental Ag Crosslinkable monomers based on cyclosiloxane, their preparation and their use in polymerizable compositions
EP2138525B1 (en) * 2007-04-17 2012-12-26 Asahi Kasei Chemicals Corporation Epoxy silicone and method for production thereof, and curable resin composition using the same and use thereof

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI746653B (en) * 2016-09-29 2021-11-21 日商鐘化股份有限公司 Photosensitive composition, coloring pattern and manufacturing method thereof
TWI825270B (en) * 2019-02-12 2023-12-11 日商信越化學工業股份有限公司 Organically modified silicone resin composition for die bonding, its hardened product and optical semiconductor element

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