TW201247433A - Vacuum coating apparatus - Google Patents

Vacuum coating apparatus Download PDF

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Publication number
TW201247433A
TW201247433A TW100124896A TW100124896A TW201247433A TW 201247433 A TW201247433 A TW 201247433A TW 100124896 A TW100124896 A TW 100124896A TW 100124896 A TW100124896 A TW 100124896A TW 201247433 A TW201247433 A TW 201247433A
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TW
Taiwan
Prior art keywords
vacuum
screen
holes
workpiece
coating apparatus
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Application number
TW100124896A
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Chinese (zh)
Inventor
Jui-Hsiang Huang
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Cosei Technology Co Ltd
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Filing date
Publication date
Application filed by Cosei Technology Co Ltd filed Critical Cosei Technology Co Ltd
Publication of TW201247433A publication Critical patent/TW201247433A/en

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  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Screen Printers (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

A vacuum coating apparatus is provided herein. The present invention includes a vacuum platform; a pattern plate set on the vacuum platform to carry a workpiece, wherein a plurality of first through holes are formed on the workpiece; and a plurality of second through holes formed on the pattern plate has a position facing to the first through holes; and a halftone set over the workpiece, wherein at least a opening formed on the patterned plate has a position corresponding to the first through holes; a coating material set on the halftone; and the coating material penetrate through the opening to fill the first through holes by a draft provided from the vacuum platform. The present invention can be utilized to increase the outputs and improve the production yield.

Description

201247433 六、發明說明: 【發明所屬之技術領域】 本發明係有關一種塗佈技術,特別是一種真空塗佈裝置。 【先前技術】 網版印刷係將被印刷物載放於印刷台之既定位置,於印 刷用網版表面供給由絕緣物或介電體等所構成之糊狀或墨水 狀之塗佈物,使用厚薄規或是進而兼用刮刀而在被印刷物之 印刷面進行所需之印刷。 以往之網版印刷通常在大氣壓下進行,可分為採用金屬 等之孔版所進行之網版印刷以及使用由貼絲版所構成之網版 所進行之網版印刷。於前者之使用金屬等之孔版所進行之網 版印刷中,係使孔版抵接於被印刷物之印刷面,將糊狀或墨 水狀之塗佈物流入孔版之孔部以圖像來進行印刷,並不使用 刮刀做塗佈而是以厚薄規來進行印刷。又,使用由貼絲版所 構成之網版進行網版印刷當中,係在網版與被印刷物之印刷 面之間設置間距,利用刮刀將糊狀或墨水狀之塗佈物塗佈於 網版表面,接著利用厚薄規將塗佈於網版表面之糊狀或墨水 狀之塗佈物印刷到被印刷物上。 然而,於在以往之網版印刷方法中,於孔版的下部會積 留氣泡,無法得到高品質印刷。 【發明内容】 為了解決上述問題,本發明目的之一係提供一種真空塗 佈裝置,藉由真空台提供抽力使塗佈材料可以均勻塗佈於工 作件上,可提高產量及提升產品良率。 201247433 本發明目的之一係提供一種真空塗佈裝置係包括:一真 空台。一模板設置於真空台上,用以承載一加工件,其中加 工件具有複數個第一貫孔設置於其上;以及模板具有複數個 第二貫孔對應第一貫孔設置。以及,一網版設置於加工件上 方,其中網版含有至少一開口對應第一貫孔設置,且一塗佈 材料設置於網版上,藉真空台提供一抽力使得塗佈材料由開 口向下填入第一貫孔。 以下藉由具體實施例配合所附的圖式詳加說明,當更容 易瞭解本發明之目的、技術内容、特點及其所達成之功效。 【實施方式】 其詳細說明如下,所述較佳實施例僅做一說明非用以限 定本發明。 請參考圖1,圖1為本發明一實施例之真空塗佈裝置之示 意圖。如圖所示,真空塗佈裝置100係包括:一真空台110、 一模板120以及一網版140。於此實施例中,模板120設置 於真空台110上,用以承載一加工件130,其中加工件130 具有複數個第一貫孔132設置於其上,且模板120具有複數 個第二貫孔122對應第一貫孔132設置。 接續上述,請繼續參考圖1,網版140設置於加工件130 上方,其中網版140含有至少一開口 142對應第一貫孔132 設置,其中一塗佈材料150設置於網版140上,藉由真空台 110提供一抽力使得塗佈材料150由開口 142向下填入第一 貫孔132,如圖2所示。其中塗佈材料150可包括導電材料 與非導電材料。而如圖1、圖2所示,開口 142的大小,包 含但不限於,大於工作件120上的第一貫孔132之大小以助 於塗佈材料150受抽力而填入貫孔中,於一實施例中,開口 201247433 142的大小亦可等於第一貫孔132之大小。且如圖2所示, 一抽氣裝置160與真空台110連結以提供抽力。 响繼續參考圖2,於又一實施例中,加工件丨3〇可為一基 板,如印刷電路板,且印刷電路板上具有複數個貫孔,例如 第貝孔13 2。欲將印刷電路板的貫孔内塗佈或填充導電材 料或疋非導電材料時’先將印刷電路板設置於模板12〇上, 再將網版140設置於印刷電路板的上方,讓網版14〇上開口 142的位置相對於印刷電路板上第一貫孔132的位置,且網 版140上開口 142的大小會大於第一貫孔132的大小。於一 實轭例中,可利用一影像裝置(圖中未示)來完成網版140 與印刷電路板的對位。當抽氣裝置160啟動使真空台110產 生真空效果,使得裝載於網版140上的塗佈材料15〇由網版 140上的開口 142向下填入印刷電路板的第一貫孔η]。其中 可依使用者需求,將塗佈材料15〇抽入第一貫孔132的内壁 或填滿第一貫孔132以完成塗佈作業。 、再來請參考圖3,圖3為本發明一實施例之網版的結構俯 視圖,如圖所示,網版14〇可包括一網框144、一網格區146 以及阻隔層148。其中網格區146由複數線體交錯設置於 周忙144所圍成的範圍内;而阻隔層148設置於網格區ye 上,且阻隔層148具有複數個開口丨42圖案化設置於其上。 根據上述,本發明的真空塗佈裝置,係利用抽真空的方 式讓塗佈材料自然且快速的向下填入加工件的貫孔,可改善 一般網版印刷在刮板移動時氣泡的產生問題。此外,依據不 同加工件的塗佈設計,僅需更換網版上的阻隔層開口的圖案 化設計以及模板的貫孔位置,或者僅需更換網版開口的圖案 設計即可,使用上相當彈性。 综合上述,本發明一實施例之一種真空塗佈裝置,藉由 201247433 真空台提供抽力使塗佈材料可以均勻塗佈於工作件,可提高 產量及提升產品良率。 以上所述之實施例僅係為說明本發明之技術思想及特 點,其目的在使熟習此項技藝之人士能夠瞭解本發明之内容 並據以實施,當不能以之限定本發明之專利範圍,即大凡依 本發明所揭示之精神所作之均等變化或修飾,仍應涵蓋在本 發明之專利範圍内。 201247433 【圖式簡單說明】 圖1為本發明一實施例之真空塗佈裝置之示意圖。 圖2為本發明又一實施例之真空塗佈裝置之示意圖。 圖3為本發明一實施例之網版的結構俯視圖。 【主要元件符號說明】 100 真空塗佈裝置 110 真空台 120 模板 122 第二貫孔 130 工作件 132 第一貫孔 140 網版 142 開口 144 網框 146 網格區 148 阻隔層 150 塗佈材料 160 抽氣裝置201247433 VI. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a coating technique, and more particularly to a vacuum coating apparatus. [Prior Art] Screen printing is to place a printed matter on a predetermined position on a printing table, and apply a paste or ink-like coating composed of an insulator or a dielectric to the surface of the printing screen. The rule or the scraper is used in combination to perform the desired printing on the printed surface of the printed matter. Conventional screen printing is usually carried out under atmospheric pressure, and can be classified into screen printing using a stencil of metal or the like and screen printing using a screen composed of a stencil. In the former screen printing using a metal plate or the like, the stencil is brought into contact with the printing surface of the printed matter, and the paste-like or ink-like coating is flowed into the hole portion of the stencil to print the image. Instead of using a doctor blade for coating, it is printed with a thin gauge. Further, in the screen printing using a screen composed of a stencil, a pitch is provided between the screen and the printing surface of the object to be printed, and a paste or ink-like coating is applied to the screen by a doctor blade. The surface is then printed on the printed matter by a paste or ink-like coating applied to the surface of the screen using a gauge. However, in the conventional screen printing method, air bubbles are accumulated in the lower portion of the stencil, and high-quality printing cannot be obtained. SUMMARY OF THE INVENTION In order to solve the above problems, one of the objects of the present invention is to provide a vacuum coating apparatus which can uniformly apply a coating material to a workpiece by providing a pumping force by a vacuum table, thereby improving yield and improving product yield. . 201247433 One of the objects of the present invention is to provide a vacuum coating apparatus comprising: a vacuum stage. A template is disposed on the vacuum table for carrying a workpiece, wherein the workpiece has a plurality of first through holes disposed thereon; and the template has a plurality of second holes corresponding to the first through holes. And a screen is disposed above the workpiece, wherein the screen comprises at least one opening corresponding to the first through hole, and a coating material is disposed on the screen, and the vacuum table provides a pumping force to make the coating material from the opening Fill in the first through hole. The purpose, technical contents, features and effects achieved by the present invention will be more readily understood from the following detailed description of the embodiments. [Embodiment] The detailed description is as follows, and the preferred embodiment is not intended to limit the invention. Please refer to FIG. 1. FIG. 1 is a schematic view of a vacuum coating apparatus according to an embodiment of the present invention. As shown, the vacuum coating apparatus 100 includes a vacuum table 110, a template 120, and a screen 140. In this embodiment, the template 120 is disposed on the vacuum table 110 for carrying a workpiece 130. The workpiece 130 has a plurality of first through holes 132 disposed thereon, and the template 120 has a plurality of second through holes. 122 corresponds to the first through hole 132. Continuing to refer to FIG. 1 , the screen 140 is disposed above the workpiece 130 , wherein the screen 140 includes at least one opening 142 corresponding to the first through hole 132 , wherein a coating material 150 is disposed on the screen 140 . A pumping force is provided by the vacuum table 110 such that the coating material 150 is filled downwardly from the opening 142 into the first through hole 132, as shown in FIG. The coating material 150 may include a conductive material and a non-conductive material. As shown in FIG. 1 and FIG. 2 , the size of the opening 142 includes, but is not limited to, a size larger than the first through hole 132 of the working member 120 to help the coating material 150 to be filled into the through hole by the pumping force. In an embodiment, the size of the opening 201247433 142 may also be equal to the size of the first through hole 132. And as shown in FIG. 2, an air extraction device 160 is coupled to the vacuum table 110 to provide pumping force. Referring to Figure 2, in yet another embodiment, the workpiece 丨3〇 can be a substrate, such as a printed circuit board, and the printed circuit board has a plurality of through holes, such as a first aperture 13 2 . When the conductive hole or the non-conductive material is to be coated or filled in the through hole of the printed circuit board, the printed circuit board is first placed on the template 12, and then the screen 140 is placed on the upper side of the printed circuit board. The position of the upper opening 142 is relative to the position of the first through hole 132 on the printed circuit board, and the size of the opening 142 on the screen 140 may be larger than the size of the first through hole 132. In a practical example, an image device (not shown) can be used to align the screen 140 with the printed circuit board. When the air extracting device 160 is activated to cause the vacuum table 110 to produce a vacuum effect, the coating material 15 loaded on the screen 140 is filled downward from the opening 142 in the screen 140 into the first through hole η] of the printed circuit board. The coating material 15〇 can be drawn into the inner wall of the first through hole 132 or fill the first through hole 132 to complete the coating operation according to the user's request. Referring to FIG. 3, FIG. 3 is a top view of the structure of the screen according to an embodiment of the present invention. As shown, the screen 14A may include a frame 144, a grid area 146, and a barrier layer 148. The grid area 146 is staggered by a plurality of line bodies in a range surrounded by the weekly busy 144; and the barrier layer 148 is disposed on the grid area ye, and the barrier layer 148 has a plurality of openings 图案 42 patterned thereon. . According to the above, the vacuum coating apparatus of the present invention allows the coating material to be naturally and quickly filled down into the through hole of the workpiece by means of vacuuming, thereby improving the problem of generation of bubbles during the movement of the screen by the general screen printing. . In addition, depending on the coating design of different workpieces, it is only necessary to replace the pattern design of the barrier layer opening on the screen and the through hole position of the template, or only need to replace the pattern design of the screen opening, and the use is quite elastic. In summary, in a vacuum coating apparatus according to an embodiment of the present invention, the coating material can be uniformly applied to the workpiece by the vacuum pumping of the 201247433 vacuum table, thereby improving the yield and improving the product yield. The embodiments described above are merely illustrative of the technical spirit and the features of the present invention, and the objects of the present invention can be understood by those skilled in the art, and the scope of the present invention cannot be limited thereto. That is, the equivalent variations or modifications made by the spirit of the present invention should still be included in the scope of the present invention. 201247433 BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of a vacuum coating apparatus according to an embodiment of the present invention. 2 is a schematic view of a vacuum coating apparatus according to still another embodiment of the present invention. 3 is a top plan view showing the structure of a screen according to an embodiment of the present invention. [Main component symbol description] 100 Vacuum coating device 110 Vacuum table 120 Template 122 Second through hole 130 Working piece 132 First consistent hole 140 Screen 142 Opening 144 Frame 146 Grid area 148 Barrier layer 150 Coating material 160 Pumping Gas device

Claims (1)

201247433 七、申請專利範圍: 1. 一種真空塗佈裝置,係包含: 一真空台; 一模板,設置於該真空台上,用以承載一加工件,其中 該加工件具有複數個第一貫孔設置於其上;以及 該模板具有複數個第二貫孔對應該些第一貫孔 設置;以及 一網版,設置於該加工件上方,其中該網版含有至少一 開口+對應該些第-貫孔設置,且一塗佈材料設置於該網版 上’藉該真空台提供-抽力使得該塗佈材料由該些開口向下 填入該些第一貫孔。 2. 如請求項1所述之真空塗佈裝置,其中該加工件為—印刷電 路板。 3. 如請求項1所述之真空塗佈裝置,其中 材料與非導電材料。 3 4. 求項1所述之真空塗佈裝置,其中該些開口的大小係大 於4於該些第一貫孔之大小。 ’、 5·如請求们所述之真空塗佈裝置,其中該網版包含: 一網框; —一網格區,由複數線體交錯設置於該網框所為 的範圍内;以及 一阻隔層1置於該網格區上,且該阻隔層 该些開口圖案化設置於其上。 " 6'201247433 VII. Patent application scope: 1. A vacuum coating device comprising: a vacuum table; a template disposed on the vacuum table for carrying a workpiece, wherein the workpiece has a plurality of first through holes Provided thereon; and the template has a plurality of second through holes corresponding to the first through holes; and a screen disposed above the workpiece, wherein the screen contains at least one opening + corresponding to the first - The through hole is disposed, and a coating material is disposed on the screen. The vacuum is provided by the vacuum table to draw the coating material downward from the openings into the first through holes. 2. The vacuum coating apparatus of claim 1, wherein the workpiece is a printed circuit board. 3. The vacuum coating apparatus of claim 1, wherein the material is a non-conductive material. 3. The vacuum coating apparatus of claim 1, wherein the openings are larger than 4 in size of the first through holes. A vacuum coating apparatus as claimed in claim 5, wherein the screen comprises: a frame; a grid area interlaced by the plurality of lines within the range of the frame; and a barrier layer 1 is placed on the grid region, and the openings of the barrier layer are patterned thereon. " 6'
TW100124896A 2011-05-27 2011-07-14 Vacuum coating apparatus TW201247433A (en)

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TWI699142B (en) * 2019-04-22 2020-07-11 欣興電子股份有限公司 Multilayer circuit board structure and manufacturing method thereof

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CN105346286A (en) * 2015-11-24 2016-02-24 深圳市福耀达机电设备制造有限公司 Gas pressure type silk-screen printing method and device

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JP2722806B2 (en) * 1990-10-19 1998-03-09 三菱マテリアル株式会社 Base plate for printed wiring
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Publication number Priority date Publication date Assignee Title
TWI699142B (en) * 2019-04-22 2020-07-11 欣興電子股份有限公司 Multilayer circuit board structure and manufacturing method thereof
US10736215B1 (en) 2019-04-22 2020-08-04 Unimicron Technology Corp. Multilayer circuit board structure and manufacturing method thereof

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