TW201246346A - Method and apparatus for manufacturing glass substrate - Google Patents

Method and apparatus for manufacturing glass substrate Download PDF

Info

Publication number
TW201246346A
TW201246346A TW101104193A TW101104193A TW201246346A TW 201246346 A TW201246346 A TW 201246346A TW 101104193 A TW101104193 A TW 101104193A TW 101104193 A TW101104193 A TW 101104193A TW 201246346 A TW201246346 A TW 201246346A
Authority
TW
Taiwan
Prior art keywords
glass substrate
honing
chemical
liquid
injection
Prior art date
Application number
TW101104193A
Other languages
Chinese (zh)
Other versions
TWI559389B (en
Inventor
Sakae Nishiyama
Original Assignee
Nsc Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nsc Co Ltd filed Critical Nsc Co Ltd
Publication of TW201246346A publication Critical patent/TW201246346A/en
Application granted granted Critical
Publication of TWI559389B publication Critical patent/TWI559389B/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00Surface treatment of glass, not in the form of fibres or filaments, by etching
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00Surface treatment of glass, not in the form of fibres or filaments, by etching
    • C03C15/02Surface treatment of glass, not in the form of fibres or filaments, by etching for making a smooth surface
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00Other surface treatment of glass not in the form of fibres or filaments

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Surface Treatment Of Glass (AREA)

Abstract

To provide a chemical polishing apparatus for glass substrates, which can safely perform high quality chemical polishing treatment. This chemical polishing apparatus is configured by having: a transfer path for transferring a glass substrate (GL) in the horizontal direction; polishing treatment units (16, 22), which reduce the thickness of the glass substrate by spraying a chemical polishing liquid to the glass substrate being transferred on the transfer path; and a cleaning treatment unit (24), which cleans the glass substrate by spraying a cleaning liquid, said glass substrate having been reduced in thickness by passing through a polishing treatment unit (22). An introducing portion where the glass substrate is introduced into a polishing treatment unit (16) is provided with: a rotating roller (43), which rotates by lightly holding the surface of the glass substrate; and spray units (NZ1, NZ2), which spray water toward the rotating roller (43) from the outside of the polishing treatment unit (16).

Description

201246346 六、發明說明: 【發明所屬之技術領域】 本發明係關於能將大型的玻璃基板均一地薄型化的一 玻璃基板之製造方法及化學硏磨裝置。 【先前技術】 作爲邊將玻璃基板搬送邊將蝕刻液加以噴射的製造加 工裝置,例如引用文獻1所記載的濕蝕刻裝置是已知的。 且該裝置係利用蝕刻液除去形成於玻璃基板的鉻或鉻合金 膜。 [專利文獻1]特開2000-144454號公報 【發明內容】 [發明所欲解決之問題] 然而上述發明不過是教示去除形成於玻璃基板上的薄 膜之構造或方法,並非是教示將玻璃基板其本身予以薄型 化之構造或方法者。 在此要將玻璃基板其本身蝕刻(化學硏磨)而予以薄型 化’不得不使用含氫氟酸之化學硏磨液,此情況強烈期望 能確保作業員的安全,同時可實現高品質之化學硏磨處理 。特別是最近的電子機器都要求小型輕量化,所以玻璃基 板的更薄型化也被要求(板厚0.5 mm左右或更小),如因化 學硏磨而造成硏磨不均或白濁則其玻璃基板的使用價値就 會喪失。 -5- 201246346 本發明係鑑於上述課題而開發完成的,其目的係提供 一種既安全地實現高品質之化學硏磨處理的玻璃基板之製 造方法及化學硏磨裝置》 [用以解決問題之手段] 爲了達成上述目的,本發明之化學硏磨裝置係具備有 搬送路,其係將玻璃基板沿水平方向搬送; 硏磨處理部,其係對於在搬送路移動中的玻璃基板噴 射化學硏磨液並將玻璃基板予以薄型化: 洗淨處理部,對於通過硏磨處理部薄型化後的玻璃基 板噴射洗淨液而予以洗淨; 在前述硏磨處理部的玻璃基板導入部,設有:將玻璃 基板的表面輕輕地保持並旋轉的旋轉滾輪,與從硏磨處理 部的外側朝向前述旋轉滾輪噴射水的噴射部。 在前述硏磨處理部較佳係配置有朝玻璃基板的搬送方 向延伸的一群的噴射管,從各噴射管所形成的噴出口朝向 玻璃基板噴出化學硏磨液。在此一群的噴射管較佳係配置 於玻璃基板之上部與下部。又一群的噴射管,其軸方向長 度更佳係設定在2.5m以下。 較佳爲一群的噴射管,沿著與前述搬運方向正交之玻 璃基板的寬度方向配置,在中央位置的噴射管係構成爲比 周邊位置的噴射管供給更高壓之化學硏磨液。又一群的噴 射管較佳係被保持成可旋轉且構成爲朝噴射管之圓周方向 201246346 擺動。 前述硏磨處理部較佳係被區分成大致相同結構之複數 腔室,且構成爲由相同組成的硏磨液將玻璃基板硏磨複數 次。在此最適合係前述複數處理腔室係經由中繼腔室連接 。更佳係在前述中繼腔室,將與處理腔室相同組成的化學 硏磨液朝玻璃基板噴出。 又,本發明之一種玻璃基板的製造方法,也係使用化 學硏磨裝置,將板厚加以薄型化;該化學硏磨裝置係具備 有:搬送路,其係將玻璃基板沿水平方向搬送;硏磨處理 部,其係對於在搬送路移動中的玻璃基板噴射化學硏磨液 並將玻璃基板予以薄型化;洗淨處理部,對於通過硏磨處 理部薄型化後的玻璃基板噴射洗淨液而予以洗淨;在前述 硏磨處理部的玻璃基板導入部,設有:將玻璃基板的表面 輕輕地保持並旋轉的旋轉滾輪,與從硏磨處理部的外側朝 向前述旋轉滾輪噴射水的噴射部。 [發明之效果] 依據上述之本發明,可安全地實現高品質之化學硏磨 處理。 【實施方式】 [發明之實施形態] 以下根據實施例將本發明加以詳細說明。圖1及圖2 係表示實施例之化學硏磨裝置10的槪略正面圖。另外針 201246346 對相同之化學硏磨裝置10,圖1係表示化學硏磨液的 液線LNI與洗淨水的給水線LN2與回收線LN3,圖2 表示排氣線LN4。 如圖所示,該化學硏磨裝置1 0係以搬入部1 2、前 理腔室14、第1處理腔室16、第2處理腔室22、中繼 室18、水洗腔室24與搬出部26爲中心所構成,該搬 部12係由作業員將玻璃基板GL —枚一枚地搬入;前 理腔室14係用以將從搬入部12所搬送的玻璃基板GL 以接受:第1處理腔室16,係對於玻璃基板GL的上下 噴射化學硏磨液並將玻璃基板予以薄型化;第2處理腔 22,係將與第1處理腔室16相同組成的化學硏磨液朝 璃基板的上下面噴射,並將玻璃基板進一步薄型化;中 腔室18,係將第1與第2處理腔室16,22予以連結; 洗腔室24,係將經由第2處理腔室22的玻璃基板GL 以水洗;搬出部26,係由作業員將玻璃基板GL —枚一 地搬出。另外中繼腔室18係被區分爲朝上下方向小型 的第1中繼腔室18a,與以大致相同形狀面對第2處理 室22前面的第2中繼腔室18b * 除了至前處理腔室14的導入口 IN、來自水洗腔室 的導出口 OUT與曲柄機構CR之一部分作業空間以外, 腔室14、16、1 8、22、24全體爲密閉。另外導入口 IN 導出口 OUT係比玻璃基板GL的板厚稍高,比玻璃基 GL的橫寬稍寬的矩形開口。又,貫通各部在同一平面 配置多數之搬送滾輪42...42而形成將玻璃基板GL朝圖 給 係 處 腔 入 處 予 面 室 玻 繼 水 予 枚 化 腔 24 各 及 板 上 示 -8 - 201246346 右方搬送的搬送路。 在此搬送速度較佳設定爲200〜800mm/分,更佳應設 定爲3 00〜5 5 0mm/分。且第1處理腔室16與第2處理腔室 22的處理時間在此實施例係設定爲合計1 0分左右。超過 上述範圍搬送速度一太慢,不僅生產效率會惡化,化學硏 磨液易滯留於玻璃基板上而妨礙均一的化學硏磨。另一方 面在相同的裝置規模中,爲提高搬送速度很難實現液組成 的最佳化,結果造成無法實現均質的化學硏磨。 在化學硏磨裝置10要薄型化處理的玻璃基板GL沒 特別限定,即使針對100x1200mm或1100x1300mm以上 的大型玻璃基板也能將上下兩面均質硏磨。另外,玻璃基 板的板厚,要導入至本裝置10時假定1mm以下的話,化 學硏磨後可薄型化至0.5mm左右。 如圖1所示第1處理腔室16、第2處理腔室22及中 繼腔室18係經由給液線LN1連通至被溫度管理後的處理 液供給部30,而處理液供給部30的化學硏磨液係以 4〇~42 °C左右被供給至各腔室。在此化學硏磨液沒特別限 定’爲了以10分左右的化學硏磨處理將板厚整體100μιΏ 左右薄板化,較佳是設定成氫氟酸5〜12重量%、鹽酸 重量%,與殘留水之液組成^ 又’前處理腔室14及水洗腔室24係經由給水線LN2 連通至水供給線28,洗淨水被供給至各腔室。另外由前 處理腔室14及水洗腔室24所排出的洗淨排水就直接被排 出。 201246346 另一方面,第1處理腔室16、中繼腔室18a,18b及 第2處理腔室22的底部係經由回收線LN3連通至處理液 收容部32,而回收硏磨處理水。另外,回收後的硏磨處 理水經過反應生成物的沉澱等的處理後被送至處理液供給 部30,由送液馬達(未圖示)供給至各處理腔室再利用。 如圖2所示前處理腔室14與中繼腔室18b與水洗腔 室24係經由排氣線LN4連通至排氣部40,各腔室的內部 氣體被吸引至排氣部40。在此排氣線LN4係穩定地發揮 功能,所以至前處理腔室14的導入口 IN、來自水洗腔室 24的導出口 OUT與形成於曲柄機構CR之一部分的開口 被維持在負壓狀態,而不會通過此等開口漏出處理氣體。 在第1處理腔室16、中繼腔室18、第2處理腔室22 、水洗腔室24,朝玻璃基板的搬送方向延伸的一群(6根) 噴射管,被配置於搬送滾輪42...42之上下位置。各噴射 管Pri, Pfi,Pwi係聚氯乙烯或鐵氟龍(註冊商標)所製成 的中空之樹脂管,複數個噴射口形成一列於一根噴射管。 而且由配置於第1處理腔室16、中繼腔室18及第2處理 腔室22的上下之噴射管Pri,Pfi,Pwi朝玻璃基板的上面 及下面噴射化學硏磨液》另一方面由配置於水洗腔室24 的噴射管Pwi朝玻璃基板的上面及下面噴射洗淨水。 配置於中繼腔室18及水洗腔室24的噴射管Pfi,Pwi 係保持於固定狀態。另一方面在第1處理腔室16與第2 處理腔室22配置有藉由曲柄機構CR進行擺動的複數個 噴射管Pri。 -10- 201246346 如前所述本實施例於第1處理腔室16與第2處理腔 室22在玻璃基板的上下各自配置有 6根的噴射管Pr i(Prl〜Pr6)。圖3(A)爲由上方所劃的配置於玻璃基板的下 方之噴射管Prl〜Pr6的平面圖,在各噴射管Pri形成有例 如8個噴出口 HO。 各噴射管Pri無論配置在第1處理腔室16與第2處 理腔室22的任何一個狀況,其前端側(圖示左側)都是閉 塞的。另一方面在其基端側設有壓力控制部44。壓力控 制部44係以噴射管Pri與同數(6個)個開閉閥VAL所構 成,藉由調整各開閉閥VAL的開度而能任意設定供給至 各噴射管Pri的化學硏磨液之液壓。 在此實施例,中央位置的噴射管Pr3 , Pr4的液壓與 周邊位置的噴射管Pri,Pr6相比係設定爲稍大。對玻璃 基板GL之中央位置的接觸壓或噴射量係設定爲比對玻璃 基板GL之周邊位置的接觸壓或噴射量稍高。因此朝玻璃 基板GL之中央位置噴射的化學硏磨液能圓滑移動至玻璃 基板之周邊位置,使大致等量的化學硏磨液作用於玻璃基 板GL全面,其結果玻璃基板GL全面均一地被硏磨了。 又,各噴射管Pri其兩端係藉由軸承等軸支成可旋轉 ,而構成爲藉由曲柄機構CR擺動(oscillation)約±30。(參 照圖3(C))。另外圖3(C)係表示擺動角度者而非表示化學 硏磨液之噴射範圍。亦即由噴射管Pri之噴出口 HO化學 硏磨液呈喇叭狀噴出,所以其噴射範圍較擺動角度廣。 曲柄機構CR如圖3(B)之槪略正面圖所示,係以驅動 -11 - 201246346 馬達MO、曲柄軸Cl〜C 3、擺動棒C4與上下2根之保持 棒C5,C5爲中心所構成》2根之保持棒C5,C5係配置 在挾持搬送中的玻璃基板GL的上下位置,各自保持成可 朝處理腔室16,22的前後方向(與圖1之紙面正交的方向 )水平移動。 另外並非特別限定者,曲柄軸C1~C3與擺動棒C4係 配置在第1與第2處理腔室16,22的左側面板LS的外側 ,噴射管Prl的前端側係貫通左側面板LS而連接於傳達 棒Trl〜Tr6。另外左側面板LS的貫通孔係適當地被封止 〇 曲柄軸C2與擺動棒C4分別被固定軸01,02軸支成 可旋轉。在此,固定軸01被例如前處理腔室14或中繼 腔室18之頂板所保持,固定軸02係被各腔室14,18之 前板所保持。 因此曲柄軸C2係以固定軸01爲旋轉中心朝處理腔 室16,22的前後方向擺動。又擺動棒C4也是以固定軸 02爲旋轉中心,朝處理腔室16, 22的前後方向擺動。另 外擺動棒C4藉由在與保持棒C5, C5之連接部形成有長 孔故可進行其擺動動作。 上下各6根的噴射管(Prl〜Pr6)的閉塞前端側通過傳 達棒Trl〜Tr6連接於保持棒C5 , C5。如同之前所說明各 噴射管Prl〜Pr6被軸承保持成可旋轉,傳達棒Trl〜Tr6係 藉由保持棒C5的突出軸03被軸支。因此對應於保持棒 C5, C5之前後方向的水平移動,噴射管Prl~Pr6係變成 -12- 201246346 朝其圓周方向擺動。 圖4表示係顯示上側的噴射管pr 1〜pr6與下側的噴射 管Prl〜Pr6的擺動動作的圖面,係以固定軸〇1爲旋轉中 心使曲柄軸C1擺動另一方面以固定軸02爲旋轉中心使 擺動棒C4擺動的狀態。接著對應擺動棒C4的擺動保持 棒C5, C5往水平方向往返移動,對應此被軸支成可旋轉 的上下噴射管Prl〜Pr6約旋轉±30°。另外驅動馬達MO之 轉速限定噴射管Pri的擺動次數,驅動馬達之轉速最宜爲 10〜30rpm左右。 在上側的噴射管Prl〜Pr6其下面形成有噴射口,在下 側的噴射管Prl〜Pr6其上面形成有噴射口,所以各噴射口 邊約旋轉±3(Γ邊將化學硏磨液噴射至玻璃基板的上下面( 參照圖3(C))。 在本實施例特意將藉由相同之液組成來執行同樣的化 學硏磨之處理腔室16,22 —分爲二。這是因爲藉由抑制 噴射管Prl〜Pr6的長度來防止噴射管的變形,而且使噴射 管滑動地擺動,可均一維持與玻璃基板的距離。噴射管 Pri的長度也有關於管徑(送液量),一般來說較佳爲抑制 成2.5m以下,更佳爲2m以下。 爲了要以高速將玻璃基板予以化學硏磨,當必須使加 溫狀態的化學硏磨液之送液量增加的情形,藉由將噴射管 Pr的長度抑制成適當的長度就不會使驅動馬達MO那麼大 型化,且能以簡單機構使複數噴射管Prl〜Pr6滑順地擺動 -13- 201246346 另外也可考慮有別於本實施例的結構而設置將第1處 理腔室16與第2處理腔室22合在一起的單一腔室,但即 使使用適當長度(2.5m以下)的噴射管也難期待與本實施例 相等的滑順動作。亦即要使用單一噴射管時只能接近其左 側面板與右側面板分別設置曲柄機構,以各自的驅動馬達 MO來驅動各曲柄機構,但是各噴射管的基端部係位於單 —腔室的中央部,所以不易保持該基端部可旋轉。又也難 於在噴射管的基端部設置壓力控制部44。 接著針對前處理腔室14的構造加以說明。在前處理 腔室14接近第1處理腔室配置使噴射管Prl擺動的曲柄 機構CR係如前述一樣。除上述構造再加上在前處理腔室 14中,在玻璃基板GL對第1處理腔室16的導入口配置 :接收玻璃基板GL的旋轉滾輪43,與朝玻璃基板GL的 上下面噴射水的水洗噴嘴NZ1,NZ2。在此玻璃基板GL 在旋轉滾輪43與搬送滾輪42上的接觸壓被設定成能輕輕 地保持而導入至第〗處理腔室16。 又水洗噴嘴NZ1,NZ2要設定爲朝向玻璃基板GL對 第1處理腔室16的導入口噴射水。因此朝第1處理腔室 1 6導入的玻璃基板係相當潮濕的狀態,能防止不均勻的 初期蝕刻。亦即。第1處理腔室16係氫氟酸氣體的環境 氣體,故如玻璃基板的表面是乾燥狀態的話就有因氫氟酸 氣體所致的侵蝕成不均勻之虞,但是在本實施例玻璃基板 的表面被水所保護,所以之後於第1處理腔室丨6中開始 進行均勻的蝕刻。 -14- 201246346 又在本實施例,由水洗噴嘴NZ 1, 43或搬送滾輪42強力地噴射水,故第 玻璃基板導入口變成被水封止,可防止 前處理腔室14。另外如不採取如本實 狀況,會因漏出到前處理腔室14的化 狀態的玻璃基板被蝕刻到無法修復。另 磨液漏出到前處理腔室14而提高玻璃; 或搬送滾輪42的接觸壓時,會產生玻 之瑕疵。 針對中繼腔室1 8加以說明。如前 1 8固定狀態的噴射管Pfi被配置於搬送 後由一群(6根)噴射管Pfi,朝玻璃基板 硏磨液。在本實施例特別設有中繼腔室 下幾點:(1)由於要適當地軸支第1處理 Pri的基端側(2)由於要確保壓力控制部 由於要確保第2處理腔室22的曲柄機 等等。 在此也可考慮將中繼腔室18設爲 間,但是在本實施例特意地在該中繼腔 板噴射相同組成的化學硏磨液。因此在 時勿須擔心化學硏磨液會滯留於玻璃基 品質之玻璃硏磨。另外中繼腔室的噴射 態,當然也可採取使其擺動的構造。 通過中繼腔室18的玻璃基板移動三 NZ2朝向旋轉滾輪 1處理腔室1 6的 化學硏磨液漏出到 施例那樣的構造之 學硏磨液導致乾燥 外爲了防止化學硏 _板對旋轉滾輪43 璃基板損傷白濁等 所述,在中繼腔室 路的上下位置。然 的上下面噴射化學 ,其理由係由於以 I腔室1 6的噴射管 44的配置空間(3) 構CR的配置空間 玻璃硏磨處理的空 室1 8也朝玻璃基 中繼腔室18通過 板上,而能實現高 管Pfi雖是固定狀 g第2處理腔室22 -15- 201246346 進一举進行化學硏磨。然後完成二階段的化學硏磨孩 璃基板,由配置在第2處理腔室出口的空氣刀ΚΝ1 液體排除處理後,被由配置在水洗腔室24的一群(6 射管Pwi接受洗淨水洗淨。洗淨用的噴射管Pw雖寿 狀態,亦可採取使其擺動的構造。 總之,在洗淨處理的最終段配置有空氣刀KN2, ,由那裡所噴射的空氣可將玻璃基板的上下面迅速男 接著從水洗腔室24的導出口 OUT所排出的玻璃基枝 在搬出部26待機的作業員取出,而結束了 一系列的 處理。 以上針對本發明的實施例詳細說明,但是具體的 內容並非用來限定本發明。 【圖式簡單說明】 [圖1]表示贲施例之化學硏磨裝置的槪略正面圖 [圖2]說明圖1之化學硏磨裝置的排氣線之圖面 [圖3](A)〜(C)說明一群的噴出管與曲柄機構之圖 [圖4](A)(B)說明曲柄機構之動作的圖面。 ί的玻 進行 根)噴 :固定 ΚΝ3 :乾》 :,由 丨加工 |記載 面。 【主要元件符號說明 GL :玻璃基板 24 :洗淨處理部 43 :旋轉滾輪 16,22:硏磨處理部 1 0 :化學硏磨裝置 NZ1,NZ2 :噴射部[Technical Field] The present invention relates to a method for producing a glass substrate and a chemical honing device capable of uniformly thinning a large-sized glass substrate. [Prior Art] As a manufacturing apparatus for ejecting an etching liquid while conveying a glass substrate, for example, a wet etching apparatus described in Document 1 is known. Further, the apparatus removes a chromium or chromium alloy film formed on a glass substrate by using an etching solution. [Patent Document 1] JP-A-2000-144454 SUMMARY OF INVENTION [Problems to be Solved by the Invention] However, the above invention merely teaches a structure or a method of removing a film formed on a glass substrate, and does not teach the glass substrate A structure or method that is thinned by itself. Here, the glass substrate itself is etched (chemically honed) to be thinned. 'The chemical honing liquid containing hydrofluoric acid has to be used, and it is strongly desired to ensure the safety of the operator while achieving high quality chemistry. Honing treatment. In particular, recent electronic devices are required to be small and lightweight, so that a thinner glass substrate is required (a plate thickness of about 0.5 mm or less), such as a glass substrate due to uneven honing or white turbidity due to chemical honing. The price of use will be lost. -5- 201246346 The present invention has been developed in view of the above problems, and an object thereof is to provide a method for manufacturing a glass substrate and a chemical honing device for safely achieving high-quality chemical honing treatment. [A means for solving the problem] In order to achieve the above object, the chemical honing device of the present invention includes a conveying path for conveying the glass substrate in the horizontal direction, and a honing processing unit for spraying the chemical honing liquid on the glass substrate during the movement of the conveying path. The glass substrate is made thinner by washing the cleaning liquid on the glass substrate which has been thinned by the honing processing unit, and is provided in the glass substrate introduction portion of the honing processing unit. A rotating roller that gently holds and rotates the surface of the glass substrate, and an injection portion that ejects water from the outside of the honing processing portion toward the rotating roller. Preferably, the honing processing unit is provided with a group of ejecting tubes extending in the conveying direction of the glass substrate, and the chemical honing liquid is ejected toward the glass substrate from the ejection ports formed by the respective ejecting tubes. Preferably, the plurality of spray tubes are disposed on the upper and lower portions of the glass substrate. A group of jet tubes is preferably set to a length of 2.5 m or less in the axial direction. Preferably, a plurality of injection tubes are disposed along the width direction of the glass substrate orthogonal to the conveyance direction, and the injection pipe at the center position is configured to supply a higher pressure chemical honing liquid than the injection pipe at the peripheral position. A further group of spray tubes are preferably held rotatable and configured to swing toward the circumferential direction of the spray tube 201246346. Preferably, the honing treatment portion is divided into a plurality of chambers having substantially the same structure, and is configured to honing the glass substrate by a plurality of honing liquids having the same composition. It is most suitable here that the plurality of processing chambers are connected via a relay chamber. More preferably, in the aforementioned relay chamber, a chemical honing liquid having the same composition as that of the processing chamber is ejected toward the glass substrate. Further, in the method for producing a glass substrate of the present invention, the thickness of the glass is reduced by using a chemical honing device, and the chemical honing device is provided with a transport path for transporting the glass substrate in the horizontal direction; In the grinding treatment unit, the chemical honing liquid is sprayed on the glass substrate in which the conveyance path is moved to reduce the thickness of the glass substrate, and the cleaning treatment unit sprays the cleaning liquid on the glass substrate that has been thinned by the honing treatment unit. The glass substrate introduction portion of the honing processing unit is provided with a rotating roller that gently holds and rotates the surface of the glass substrate, and sprays water from the outside of the honing processing unit toward the rotating roller. unit. [Effects of the Invention] According to the present invention described above, it is possible to safely realize high-quality chemical honing treatment. [Embodiment] [Embodiment of the Invention] Hereinafter, the present invention will be described in detail based on examples. 1 and 2 are schematic front views showing the chemical honing device 10 of the embodiment. Further needle 201246346 For the same chemical honing device 10, Fig. 1 shows the liquid line LNI of the chemical honing liquid and the water supply line LN2 and the recovery line LN3 of the washing water, and Fig. 2 shows the vent line LN4. As shown in the figure, the chemical honing device 10 is a loading unit 1 2, a front chamber 14, a first processing chamber 16, a second processing chamber 22, a relay chamber 18, a water washing chamber 24, and a carrying-out unit. 26 is a center, and the carrying unit 12 carries the glass substrate GL one by one, and the pre-processing chamber 14 receives the glass substrate GL conveyed from the loading unit 12: first processing The chamber 16 sprays the chemical honing liquid onto the glass substrate GL and thins the glass substrate; the second processing chamber 22 is a chemical honing liquid having the same composition as the first processing chamber 16 toward the glass substrate. The upper and lower surfaces are sprayed, and the glass substrate is further thinned; the middle chamber 18 connects the first and second processing chambers 16, 22; and the washing chamber 24 is a glass substrate that passes through the second processing chamber 22. The GL is washed with water, and the unloading unit 26 carries out the glass substrate GL by the operator. Further, the relay chamber 18 is divided into a first relay chamber 18a that is small in the vertical direction, and a second relay chamber 18b that faces the front surface of the second processing chamber 22 in substantially the same shape except for the front processing chamber. The chambers 14, 16, 18, 22, and 24 are all sealed except for the inlet port IN of the chamber 14, the outlet port OUT from the water washing chamber, and the working space of one portion of the crank mechanism CR. Further, the introduction port IN. The outlet OUT is a rectangular opening slightly larger than the thickness of the glass substrate GL and slightly wider than the lateral width of the glass base GL. Further, a plurality of transport rollers 42...42 are disposed on the same plane through the respective portions, and the glass substrate GL is placed in the chamber to be filled into the chamber, and the water is supplied to the chamber 24 and the panel is displayed. 201246346 The transportation route to the right. The conveying speed is preferably set to 200 to 800 mm/min, and more preferably set to be 300 to 5 50 mm/min. The processing time of the first processing chamber 16 and the second processing chamber 22 is set to be about 10 minutes in total in this embodiment. When the transfer rate is too slow in the above range, not only the production efficiency is deteriorated, but also the chemical honing liquid tends to stay on the glass substrate and hinder uniform chemical honing. On the other hand, in the same device scale, it is difficult to optimize the liquid composition in order to increase the transport speed, and as a result, homogeneous chemical honing cannot be achieved. The glass substrate GL to be thinned in the chemical honing device 10 is not particularly limited, and the upper and lower surfaces can be homogenized even for a large glass substrate of 100 x 1200 mm or 1100 x 1300 mm or more. In addition, when the thickness of the glass substrate is assumed to be 1 mm or less when it is introduced into the apparatus 10, it can be thinned to about 0.5 mm after chemical honing. As shown in FIG. 1, the first processing chamber 16, the second processing chamber 22, and the relay chamber 18 are communicated to the temperature-managed processing liquid supply unit 30 via the liquid supply line LN1, and the processing liquid supply unit 30 is processed. The chemical honing liquid is supplied to each chamber at about 4 to 42 °C. The chemical honing liquid is not particularly limited to a thin plate having a thickness of about 100 μm in a chemical honing treatment of about 10 minutes, preferably 5 to 12% by weight of hydrofluoric acid, % by weight of hydrochloric acid, and residual water. The liquid composition ^ and the 'pretreatment chamber 14 and the water washing chamber 24 are connected to the water supply line 28 via the water supply line LN2, and the washing water is supplied to the respective chambers. Further, the washing drainage discharged from the pretreatment chamber 14 and the water washing chamber 24 is directly discharged. On the other hand, the first processing chamber 16, the relay chambers 18a and 18b, and the bottom of the second processing chamber 22 are communicated to the processing liquid accommodating portion 32 via the recovery line LN3, and the honing water is recovered. In addition, the honed water after the treatment is subjected to a treatment such as precipitation of the reaction product, and then sent to the treatment liquid supply unit 30, and is supplied to each treatment chamber by a liquid supply motor (not shown) for reuse. As shown in Fig. 2, the pretreatment chamber 14 and the relay chamber 18b and the water washing chamber 24 are communicated to the exhaust portion 40 via the exhaust line LN4, and the internal gas of each chamber is attracted to the exhaust portion 40. Since the exhaust line LN4 functions stably, the inlet IN of the pretreatment chamber 14, the outlet OUT from the washing chamber 24, and the opening formed in one portion of the crank mechanism CR are maintained in a negative pressure state. The process gas is not leaked through these openings. A group of six injection tubes extending in the first processing chamber 16, the relay chamber 18, the second processing chamber 22, and the water washing chamber 24 in the direction in which the glass substrate is transported are disposed on the transport roller 42.. Above the .42 position. Each of the spray tubes Pri, Pfi, Pwi is a hollow resin tube made of polyvinyl chloride or Teflon (registered trademark), and a plurality of injection ports are formed in a single injection tube. Further, the upper and lower spray pipes Pri, Pfi, and Pwi disposed in the first processing chamber 16, the relay chamber 18, and the second processing chamber 22 spray chemical honing liquid toward the upper surface and the lower surface of the glass substrate. The spray pipe Pwi disposed in the water washing chamber 24 sprays the washing water toward the upper and lower surfaces of the glass substrate. The injection pipes Pfi and Pwi disposed in the relay chamber 18 and the water washing chamber 24 are maintained in a fixed state. On the other hand, a plurality of ejection tubes Pri that are swung by the crank mechanism CR are disposed in the first processing chamber 16 and the second processing chamber 22. -10- 201246346 As described above, in the first processing chamber 16 and the second processing chamber 22, six ejection tubes Pr i (Prl to Pr6) are disposed on the upper and lower sides of the glass substrate. Fig. 3(A) is a plan view of the ejection tubes Pr1 to Pr6 disposed below the glass substrate, which are arranged above, and for example, eight ejection ports HO are formed in each of the ejection tubes Pri. Each of the injection tubes Pri is closed in any of the first processing chamber 16 and the second processing chamber 22, and its front end side (left side in the drawing) is closed. On the other hand, a pressure control unit 44 is provided on the proximal end side thereof. The pressure control unit 44 is configured by the injection pipe Pri and the same number (six) of the opening and closing valves VAL, and the hydraulic pressure of the chemical honing liquid supplied to each of the injection pipes Pri can be arbitrarily set by adjusting the opening degree of each of the opening and closing valves VAL. . In this embodiment, the hydraulic pressures of the injection pipes Pr3, Pr4 at the center position are set to be slightly larger than those of the injection pipes Pri, Pr6 at the peripheral positions. The contact pressure or the ejection amount to the central position of the glass substrate GL is set to be slightly higher than the contact pressure or the ejection amount of the peripheral position of the glass substrate GL. Therefore, the chemical honing liquid sprayed toward the center of the glass substrate GL can smoothly move to the peripheral position of the glass substrate, so that substantially the same amount of the chemical honing liquid acts on the glass substrate GL, and as a result, the glass substrate GL is uniformly and uniformly Grinded. Further, each of the injection tubes Pri is rotatably supported by a shaft of the bearing, and is configured to have an oscillation of about ±30 by the crank mechanism CR. (Refer to Figure 3(C)). Further, Fig. 3(C) shows the angle of the swing rather than the range of the jet of the chemical honing liquid. That is, the HO chemical honing liquid is ejected in a flared manner from the discharge port of the injection pipe Pri, so that the injection range is wider than the swing angle. As shown in the front view of Fig. 3(B), the crank mechanism CR is driven by the drive -11 - 201246346 motor MO, the crankshaft C1 to C3, the swinging bar C4, and the upper and lower holding bars C5, C5. The two holding rods C5 and C5 of the constitution are disposed at the upper and lower positions of the glass substrate GL during the gripping conveyance, and are held horizontally in the front-rear direction of the processing chambers 16 and 22 (direction orthogonal to the plane of the paper of Fig. 1). mobile. Further, the crankshafts C1 to C3 and the swinging bar C4 are disposed outside the left side panel LS of the first and second processing chambers 16 and 22, and the distal end side of the injection pipe Pr1 penetrates the left side panel LS and is connected to Communicate sticks Tr1 to Tr6. Further, the through hole of the left side panel LS is appropriately sealed. The crank shaft C2 and the swing rod C4 are respectively rotatably supported by the fixed shafts 01 and 02. Here, the fixed shaft 01 is held by, for example, the top plate of the pre-processing chamber 14 or the relay chamber 18, and the fixed shaft 02 is held by the front plates of the respective chambers 14, 18. Therefore, the crankshaft C2 is swung in the front-rear direction of the processing chambers 16, 22 with the fixed shaft 01 as the center of rotation. Further, the swinging rod C4 is also swung in the front-rear direction of the processing chambers 16, 22 with the fixed shaft 02 as the center of rotation. Further, the swing bar C4 can be swung by forming a long hole at the joint portion with the holding bars C5, C5. The blocking front end sides of the six upper and lower injection pipes (Prl to Pr6) are connected to the holding bars C5 and C5 via the transfer bars Tr1 to Tr6. As described above, each of the injection pipes P1p to Pr6 is held rotatably by the bearing, and the communication rods Tr1 to Tr6 are axially supported by the projecting shaft 03 of the holding rod C5. Therefore, in response to the horizontal movement of the holding rods C5, C5 in the front and rear directions, the injection pipes Prl to Pr6 become -12-201246346 and oscillate in the circumferential direction. 4 is a view showing a swinging motion of the upper injection pipes pr 1 to pr6 and the lower injection pipes Pr1 to Pr6, and swinging the crankshaft C1 with the fixed shaft 1 as a center of rotation and fixing the shaft 02 A state in which the swing bar C4 is swung for the center of rotation. Then, the swing holding rods C5 and C5 corresponding to the swing bar C4 are reciprocated in the horizontal direction, and the upper and lower spray pipes Pr1 to Pr6 which are pivotally supported by the shaft are rotated by about ±30°. Further, the rotational speed of the drive motor MO limits the number of oscillations of the injection pipe Pri, and the rotational speed of the drive motor is preferably about 10 to 30 rpm. In the upper side of the injection pipes P1p to Pr6, an injection port is formed on the lower side, and on the lower side of the injection pipes Pr1 to Pr6, an injection port is formed on the lower side, so that the sides of the injection ports are rotated by about ±3 (the side of the injection port is sprayed to the glass by the chemical honing liquid). The upper and lower surfaces of the substrate (refer to Fig. 3(C)). In this embodiment, the processing chambers 16, 22 which perform the same chemical honing by the same liquid composition are specifically divided into two. This is because by suppression The length of the injection pipes P1p to Pr6 prevents the deformation of the injection pipe, and the injection pipe is slidably slid to maintain the distance from the glass substrate uniformly. The length of the injection pipe Pri also relates to the pipe diameter (liquid supply amount), generally speaking. It is preferably suppressed to 2.5 m or less, more preferably 2 m or less. In order to chemically honing the glass substrate at a high speed, when it is necessary to increase the amount of the chemical honing liquid in the heated state, the injection pipe is used. When the length of Pr is suppressed to an appropriate length, the drive motor MO is not increased in size, and the plurality of injection tubes P1p to Pr6 can be smoothly oscillated by a simple mechanism. 13-201246346 It is also considered to be different from the present embodiment. Structure and setting will Although the first processing chamber 16 and the second processing chamber 22 are combined in a single chamber, even if an injection tube having an appropriate length (2.5 m or less) is used, it is difficult to expect a smoothing operation equivalent to that of the present embodiment. When a single injection pipe is used, the crank mechanism can be separately provided only to the left side panel and the right side panel, and the respective crank mechanisms are driven by the respective drive motors MO, but the base end portions of the respective injection pipes are located at the central portion of the single chamber, so It is difficult to keep the base end rotatable. It is also difficult to provide the pressure control portion 44 at the base end portion of the injection pipe. Next, the configuration of the pretreatment chamber 14 will be described. The pretreatment chamber 14 is disposed close to the first processing chamber. The crank mechanism CR that oscillates the injection pipe Prl is as described above. In addition to the above configuration, in the pretreatment chamber 14, the glass substrate GL is disposed at the inlet of the first processing chamber 16 to receive the rotation of the glass substrate GL. The roller 43 and the water washing nozzles NZ1, NZ2 that spray water toward the upper and lower surfaces of the glass substrate GL. The contact pressure between the rotating roller 43 and the conveying roller 42 of the glass substrate GL is set to be lightly held and introduced. The processing chamber 16 is further provided. The water washing nozzles NZ1 and NZ2 are set to spray water toward the inlet of the first processing chamber 16 toward the glass substrate GL. Therefore, the glass substrate introduced into the first processing chamber 16 is relatively moist. In the state, uneven initial etching can be prevented. That is, the first processing chamber 16 is an ambient gas of hydrofluoric acid gas, so if the surface of the glass substrate is in a dry state, there is corrosion due to hydrofluoric acid gas. Since the surface of the glass substrate of the present embodiment is protected by water, uniform etching is started in the first processing chamber 丨6. -14- 201246346 In this embodiment, the nozzle NZ is washed by water. 1, the conveyance roller 42 strongly injects water, so that the glass substrate introduction port is sealed by water, and the pretreatment chamber 14 can be prevented. Further, if the actual situation is not taken, the glass substrate which has leaked to the state of the pretreatment chamber 14 is etched and cannot be repaired. Further, the grinding liquid leaks out to the pretreatment chamber 14 to raise the glass; or when the contact pressure of the conveying roller 42 is applied, glass ray is generated. The relay chamber 18 will be described. The injection pipe Pfi in the fixed state of the first 18 is placed in a group (six) of the injection pipes Pfi after the conveyance, and the liquid is honed toward the glass substrate. In the present embodiment, a plurality of relay chambers are provided: (1) Since the base end side (2) of the first processing Pri is appropriately axially supported, since the pressure control portion is to ensure the second processing chamber 22 Crank machine and so on. It is also conceivable here to set the relay chamber 18 to be in between, but in the present embodiment, a chemical honing fluid of the same composition is intentionally sprayed on the relay chamber. Therefore, there is no need to worry about the chemical honing liquid remaining in the glass-based quality of the glass honing. Further, it is also possible to adopt a configuration in which the ejection state of the relay chamber is made to oscillate. The chemical honing liquid that flows through the glass substrate of the relay chamber 18 to the rotating roller 1 processing chamber 16 leaks to the structure of the honing fluid such that the drying is performed to prevent the chemical 硏 _ plate to the rotating roller 43 The glass substrate is damaged by white turbidity, etc., and is located above and below the relay chamber path. The reason for the upper and lower injection chemistry is that the empty chamber 18 which is honed by the arrangement of the space of the injection tube 44 of the I chamber 16 (3) is also directed toward the glass-based relay chamber 18 Through the plate, it is possible to realize the chemical honing of the upper tube Pfi although it is fixed, the second processing chamber 22 -15-201246346. Then, the two-stage chemical honing of the glass substrate is completed, and after the liquid squeegee 1 liquid disposed at the outlet of the second processing chamber is drained, the group is disposed in the water washing chamber 24 (6-tube Pwi is washed and washed) In addition, in the final stage of the washing process, the air knife KN2 is disposed in the final stage of the washing process, and the air ejected from the glass substrate can be placed on the glass substrate. In the following, the glass base branch which is discharged from the outlet port OUT of the washing chamber 24 is taken out by the worker who waits in the carry-out portion 26, and a series of processes are completed. The above is described in detail with reference to the embodiment of the present invention, but specific The present invention is not intended to limit the invention. [FIG. 1] FIG. 1 is a schematic front view showing a chemical honing device of the embodiment [FIG. 2] illustrating a vent line of the chemical honing device of FIG. [Fig. 3] (A) to (C) illustrate a group of discharge pipes and a crank mechanism [Fig. 4] (A) (B) illustrating the operation of the crank mechanism. ί的玻璃进行根): Fixed ΚΝ 3: Dry 》 :, processed by | | [Main component symbol description GL: Glass substrate 24: Cleaning processing unit 43: Rotating roller 16, 22: Honing processing unit 1 0 : Chemical honing device NZ1, NZ2: Injection unit

Claims (1)

201246346 七、申請專利範圍·· 1. 一種玻璃基板的化學硏磨裝置,其特徵在於,係具 備有: 搬送路,其係將玻璃基板沿水平方向搬送; 硏磨處理部,其係對於在搬送路移動中的玻璃基板, 噴射化學硏磨液並將玻璃基板予以薄型化:以及 洗淨處理部,對於通過硏磨處理部薄型化後的玻璃基 板噴射洗淨液而予以洗淨; 在前述硏磨處理部的玻璃基板導入部,設有:將玻璃 基板的表面輕輕地保持並旋轉的旋轉滾輪,與從硏磨處理 部的外側朝向前述旋轉滾輪噴射水的噴射部。 2 .如申請專利範圍第1項所述之化學硏磨裝置,其中 ,在前述硏磨處理部配置有朝玻璃基板的搬送方向延伸的 一群的噴射管,從各噴射管所形成的噴出口朝向玻璃基板 噴出化學硏磨液。 3 ·如申請專利範圍第2項所述之化學硏磨裝置,其中 ,前述一群的噴射管係配置於玻璃基板之上部與下部》 4. 如申請專利範圍第3項所述之化學硏磨裝置,其中 ,前述一群的噴射管,其軸方向長度係設定在2.5m以下 〇 5. 如申請專利範圍第3項或第4項所述之化學硏磨裝 置,其中,前述一群的噴射管,係沿著與前述搬運方向正 交之玻璃基板的寬度方向配置,在中央位置的噴射管係構 成爲比周邊位置的噴射管供給更高壓之化學硏磨液。 -17- 201246346 6. 如申請專利範圍第2項〜第4項中之任一項所述之 化學硏磨裝置,其中,前述一群的噴射管被保持成可旋轉 且構成爲朝噴射管之圓周方向擺動。 7. 如申請專利範圍第1項〜第4項中之任一項所述之 化學硏磨裝置,其中,前述硏磨處理部係被區分成大致相 同結構之複數處理腔室,且構成爲由相同組成的硏磨液將 玻璃基板硏磨複數次。 8 .如申請專利範圍第7項所述之化學硏磨裝置,其中 ,前述複數處理腔室係經由中繼腔室連接。 9. 如申請專利範圍第1〜第4項中之任一項所述之化學 硏磨裝置,其中,在前述中繼腔室,將與處理腔室相同組 成的化學硏磨液朝玻璃基板噴出。 10. —種玻璃基板的製造方法,係使用化學硏磨裝置 ,將板厚加以薄型化; 該化學硏磨裝置係具備有: 搬送路,其係將玻璃基板沿水平方向搬送: 硏磨處理部,其係對於在搬送路移動中的玻璃基板噴 射化學硏磨液並將玻璃基板予以薄型化;以及 洗淨處理部,對於通過硏磨處理部薄型化後的玻璃基 板噴射洗淨液而予以洗淨; 在前述硏磨處理部的玻璃基板導入部,設有:將玻璃 基板的表面輕輕地保持並旋轉的旋轉滾輪,與從硏磨處理 部的外側朝向前述旋轉滾輪噴射水的噴射部。 -18-201246346 VII. Patent application scope 1. A chemical honing device for a glass substrate, comprising: a transport path for transporting a glass substrate in a horizontal direction; and a honing processing unit for transporting In the glass substrate in which the path is moving, the chemical honing liquid is sprayed, and the glass substrate is thinned: and the cleaning treatment portion is washed by spraying the cleaning liquid on the glass substrate thinned by the honing treatment portion; The glass substrate introduction portion of the grinding treatment portion is provided with a rotating roller that gently holds and rotates the surface of the glass substrate, and an injection portion that ejects water from the outside of the honing processing portion toward the rotating roller. The chemical honing device according to the first aspect of the invention, wherein the honing processing unit is provided with a plurality of injection pipes extending in a conveying direction of the glass substrate, and the discharge ports formed from the respective injection pipes are oriented toward each other. The glass substrate ejects a chemical honing liquid. The chemical honing device according to the second aspect of the invention, wherein the group of the spray tubes is disposed on the upper portion and the lower portion of the glass substrate. 4. The chemical honing device according to claim 3 In the above-mentioned group of the injection tubes, the length of the axial direction is set to be less than 2.5 m, and the chemical honing device according to the third or fourth aspect of the patent application, wherein the aforementioned group of injection tubes is The ejector pipe at the center position is configured to supply a higher pressure chemical honing liquid than the injection pipe at the peripheral position along the width direction of the glass substrate orthogonal to the conveyance direction. The chemical honing device according to any one of claims 2 to 4, wherein the group of the injection tubes are held rotatably and configured to face the circumference of the injection tube Swing in the direction. 7. The chemical honing device according to any one of claims 1 to 4, wherein the honing processing unit is divided into a plurality of processing chambers having substantially the same structure, and is configured by The glass substrate is honed several times with the same composition of honing liquid. 8. The chemical honing device of claim 7, wherein the plurality of processing chambers are connected via a relay chamber. 9. The chemical honing device according to any one of claims 1 to 4, wherein in the relay chamber, a chemical honing liquid having the same composition as that of the processing chamber is ejected toward the glass substrate . 10. A method for producing a glass substrate, wherein a thickness is reduced by using a chemical honing device; the chemical honing device includes: a transfer path for transporting the glass substrate in a horizontal direction: honing processing unit In the case of spraying the chemical honing liquid on the glass substrate in the moving path, the glass substrate is thinned, and the cleaning processing unit washes the cleaning liquid on the glass substrate thinned by the honing processing unit. The glass substrate introduction portion of the honing processing unit is provided with a rotating roller that gently holds and rotates the surface of the glass substrate, and an injection portion that ejects water from the outside of the honing processing unit toward the rotating roller. -18-
TW101104193A 2011-02-10 2012-02-09 Glass substrate manufacturing method and device thereof TWI559389B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011027683A JP4975169B1 (en) 2011-02-10 2011-02-10 Method and apparatus for manufacturing glass substrate

Publications (2)

Publication Number Publication Date
TW201246346A true TW201246346A (en) 2012-11-16
TWI559389B TWI559389B (en) 2016-11-21

Family

ID=46638665

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101104193A TWI559389B (en) 2011-02-10 2012-02-09 Glass substrate manufacturing method and device thereof

Country Status (5)

Country Link
JP (1) JP4975169B1 (en)
KR (1) KR101876175B1 (en)
CN (1) CN103459342B (en)
TW (1) TWI559389B (en)
WO (1) WO2012108452A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI587435B (en) * 2016-04-19 2017-06-11 盟立自動化股份有限公司 Wet etching device

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5317304B2 (en) * 2012-01-31 2013-10-16 株式会社Nsc Chemical polishing equipment
JP5518133B2 (en) * 2012-06-14 2014-06-11 株式会社Nsc Chemical polishing equipment
CN104496197B (en) * 2014-12-26 2017-02-22 苏州晶洲装备科技有限公司 High-stability ITO glass etching system
TWI601191B (en) * 2016-09-30 2017-10-01 盟立自動化股份有限公司 Wet chemistry process apparatus
CN110078381B (en) * 2019-05-05 2023-06-09 蚌埠市羚旺新工艺材料研发科技有限公司 Spray type glass substrate thinning line

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5228949A (en) * 1991-11-07 1993-07-20 Chemcut Corporation Method and apparatus for controlled spray etching
JP3074145B2 (en) * 1996-08-12 2000-08-07 三星ダイヤモンド工業株式会社 Polishing device with cleaning function
JPH11307494A (en) * 1998-04-17 1999-11-05 Dainippon Screen Mfg Co Ltd Substrate processing device
JPH11333720A (en) * 1998-05-29 1999-12-07 Toyoda Mach Works Ltd Bearing device of working device using working fluid containing free abrasive
JP2000109216A (en) * 1998-10-02 2000-04-18 Dainippon Screen Mfg Co Ltd Substrate processing device
JP2003055779A (en) * 2001-08-13 2003-02-26 Kameria:Kk Method for etching substrate and etching device
JP3995146B2 (en) * 2002-02-01 2007-10-24 西山ステンレスケミカル株式会社 Manufacturing method of glass substrate for liquid crystal display
KR101281939B1 (en) * 2004-12-06 2013-07-05 베트록스 아게 Device for polishing hard surface, especially glass surfaces

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI587435B (en) * 2016-04-19 2017-06-11 盟立自動化股份有限公司 Wet etching device

Also Published As

Publication number Publication date
CN103459342B (en) 2016-02-03
JP2012166971A (en) 2012-09-06
JP4975169B1 (en) 2012-07-11
CN103459342A (en) 2013-12-18
KR20140045339A (en) 2014-04-16
KR101876175B1 (en) 2018-07-10
WO2012108452A1 (en) 2012-08-16
TWI559389B (en) 2016-11-21

Similar Documents

Publication Publication Date Title
TW201246346A (en) Method and apparatus for manufacturing glass substrate
TWI344173B (en)
CN101114578B (en) Substrate processing method and substrate processing apparatus
TWI601600B (en) Method of manufacturing glass substrate
TW201030879A (en) Cleaning module for a substrate and apparatus for processing a substrate having the same
JP5518133B2 (en) Chemical polishing equipment
JP5383769B2 (en) Single wafer chemical polishing equipment
JP3628919B2 (en) Substrate processing apparatus and substrate processing method
JP5317304B2 (en) Chemical polishing equipment
JP4213905B2 (en) Substrate processing apparatus and processing method
JP5202400B2 (en) Substrate processing apparatus and substrate processing method
JP2003002694A (en) Post-sealing single wafer cleaning device and method for cleaning
JPH11307493A (en) Substrate processing device
JP2018073960A (en) Etching apparatus
JPH11335872A (en) Substrate treating apparatus
JPH0777677A (en) Washing method and washing device for substrate after rubbing treatment
KR20110080836A (en) Apparatus for drying a substrate
JPH01289122A (en) Continuous work cleaning system
JPH0764091A (en) Method for cleaning square substrate after rubbing treatment and device therefor
JP2002350805A (en) Device and method for cleaning transparent substrate
JPH09283477A (en) Substrate treating device
JPH09283406A (en) Substrate treatment device

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees