201244571 六、發明說明： 【發明所屬之技術領域】 [0001]本發明涉及電路板製作技術領域，尤其涉及一種墨合裝 置。 【先前技術】 剛隨著數位錢之航發展，作為數位產品基本構件之電 路板之製作技術顯得愈來愈重要。電路板—般由覆銅基 板經裁切、鑽孔、鍍銅、曝光、顯影、蝕刻、壓合、印 刷'成型等一系列工藝製作而成。 〇 [〇〇〇3]壓合作為電路板製作之一重要製作工藝，主要是採用壓 合裝置將覆蓋㈣合至電路板表面㈣成絕緣保護層。 該覆蓋膜包括絕緣層（例如聚酿亞胺薄膜）與膠層，壓 合前，先將覆蓋膜貼合於電路板表面。壓合時，壓合裝 置產生高溫錢使膠層軟化呈溶融狀態並填充到電路板 表面從而使絕緣層黏貼到電路板作為絕緣保護層。現有 之壓合裝置包括上電熱錢板與下電熱盤壓板。壓合時 ◎ ’首先使上電熱盤I板相對於下電熱盤壓板張開成-定 角度；其次，依次將離型臈、電路板及另一離型膜放置 於下電熱錢板；織，使上電純壓板歸位，利用上 電熱盤壓板與下電熱盤壓板内之電熱盤對覆蓋膜進行加 熱，並利用Jl電熱盤壓板與下電熱盤壓板施加壓力對電 路板進仃壓合；最後，使上電熱㈣板相對於下電熱盤 壓板張開，人工取出電路板並去除貼附於該電路板之離 型膜。所述之離型臈可為聚乙烯、聚丙烯或聚對笨二曱 酸乙二醇S旨等材質，其表面塗有離型劑而具有較低之表 1002023758-0 100114145 表單編號A0101 第5頁/共24頁 201244571 面能。所述離型膜放置於上電熱盤壓板或下 與電路板之間，用於避务φ _ .、、、盤壓板 於避免電路板與上電熱盤壓板 熱盤壓板黏附於〜起。然而，使用該壓合裝置，: 工往高溫之下•«板敌置或取出電路板，不^不安 全’:且上' 下電熱龍板間反復張開與關閉將消= 量熱量，不利於節約能源。此外，使用該壓合裝置 僅能完成一塊電路板之壓合，不利於提高生產效率人 且，於分離電路板與離型膜之過程中， 二 損傷。 ^成電路板 【發明内容】 [0004] [0005] 有鑑於此，提供一種壓合裝置，以實現壓合 > 〈目動化生 產，提尚壓合之效率，並減少熱量之消耗實屬必要。 -種壓合裝置’其包括壓合機構、離型膜送料機構、其 板送料機構與分離收料機構。所述壓合機構包括複數^ 板與至少-導柱。所述複數壓板依次設置，且均套設於 所述至少-導柱上。相鄰之兩個壓板之間具有—壓人 隙。所述複數壓板可沿所述至少―導柱相對移心= 靠近或遠離’從㈣小或增大壓合間隙。所述離型膜送 料機構位於所述壓合機構之—端，且包括複數捲繞有離 型膜之放送料卷。所述離型膜送料機構用於向所述複數 壓合間隙内輸送離型膜。所述基板送料機構機械連接於 所述壓合機構’所述基板送料機構用於向所述複數壓合 間隙内輸送基板。所述壓合機構驗在複數壓板相互靠 近時對位於壓合間隙中之離型膜與基板進行壓合。所述 分離收料機構位於所述壓合機構遠離所述離型膜送料機 100114145 表單編號Α0101 第6頁/共24頁 1002023758-0 201244571 [0006] Ο [0007] ο [0008] 100114145 構之/瑞，且包括複數卷收料卷與複數基板收料盒。所 述複數卷收料卷與所述複數放送料卷一一對應，每一卷 收料卷均用於卷收離型膜以使壓合後之離型膜與基板分 離。所述複數基板收料盒與所述複數壓合間隙—一對應 ，所述複數基板收料盒均用於收集與離型臈分離後之基 板。 本技術方案之壓合裝置具有以下優點：壓合機構具有複 數壓板，可一次壓合複數塊基板，可節省大量熱能並提 高生產效率；通過離型膜送料機構、基板送料機構與分 離收料機構，可自動往壓合空隙内放置基板、離型膜， 並自動分離壓合後之基板及離型膜，實現了壓合自動化 ’消除了人工作業之安全隱患；該分離收料機構可方便 地分離基板及離型膜，避免基板之損傷，可大幅提高壓 合良率β 【實施方式】 以下將結合附圖與實施例，對本技術方案之壓合裝置進 行洋細說明。 請一併參閱圖1至圖3，本技術方案提供一種壓合裝置1〇 ’用於壓合相互分離之離型膜及基板，並使壓合後之基 板與離型膜分離。所述壓合裝置10包括機台11、壓合機 構12、離型膜送料機構13、基板送料機構14與分離收料 機構15。所述麼合機構12、離型膜送料機構13、基板送 料機構14與分離收料機構15均設置於所述機台u。其中 ’所述離型膜送料機構13與分離收料機構15分別位於所 述壓合機構12相對之兩端，亦即，所述離型膜送料機構 表單編號A0101 第7頁/共24頁 1002023758-0 201244571 13位於所述壓合機構12之一端。所述分離收料機構15位 於所述壓合機構12遠離所述離型膜送料機構13之另一端 。所述基板送料機構14位於所述壓合機構12之一側。 [0009] 所述壓合機構12包括一第一升降驅動器120、至少一導柱 121與複數壓板。所述壓合機構12用於在複數壓板相互靠 近時對位於複數壓板之間之離型膜與基板進行壓合。 [0010] 所述第一升降驅動器120可為液壓活塞氣缸，其包括相連 接之第一液壓單元1 200與第一驅動軸1201。所述第一液 壓單元1200可設置於所述機台11下方。所述第一驅動軸 1201穿過機台11並機械連接於所述複數壓板。 [0011] 本實施例中’所述導柱121之數量為四個。每根導柱121 均具有相對之第一端部1210與第二端部1211。所述第一 端部1210靠近機台11，所述第二端部1211遠離機台11。 所述導柱121之橫截面積自第一端部1210向第二端部 1211逐漸減小。 [0012] 所述複數壓板依次設置，且均套設於所述至少一導柱121 上，相鄰之兩個壓板之間具有一壓合間隙123。所述複數 壓板可沿所述至少一導柱1 21相對移動以以相互靠近或遠 離’從而減小或增大壓合間隙123。所述複數壓板均開設 有複數與所述複數導柱121相配合之導孔124，相鄰之兩 個壓板中，靠近機台11之壓板之導孔124之孔徑大於遠離 機台11之壓板之導孔124之孔徑。具體地，所述複數壓板 包括最靠近機台11之下壓板1220、最遠離機台11之上壓 板1221與至少一中間壓板1222。所述上壓板1221固定於 100114145 表單編號A0101 第8頁/共24頁 1002023758-0 201244571 Ο 所述至少—導柱121之第二端部1211。所述第一驅動軸 1201機械連接於下壓板1 220 ’用於在第-液壓單元pOO 。動所述下壓板1220並帶動所述至少一中間麼板 1222向靠近所述上壓板ΐ22ι移動以進行壓合。本實施例 中所述中間壓板1 222之數量為一。下壓板122〇之導孔 124之孔徑大於中間壓板1 222之導孔124之孔徑，中間麇 板1222之導孔124之孔徑大於上壓板1221之導孔124之扎 徑。如此，當第一液壓單元120 0釋壓時，所述下壓板 1220與中間壓板1222於重力作用下沿至少一導柱丨21向 靠近機台11處移動。具體地，所述中間壓板1 222於移動 爹j導柱121之直徑與導孔12 4之孔徑相匹配處先停止移動 ，然後，所述下壓板1220於移動到導柱121之直徑與導孔 124之孔徑相匹配處也停止移動。 [0013] 所述離型膜送料機構13用於向所述複數壓合間隙123内輸 送離型臈。所述離型膜送料機構13包括料架13{)、設置於 所述料架130之複數放送料卷131與複數換向滾輪132。 Ο 所述料架130可固定於機台11。所述放送料卷131之數量 最大可為壓合間隙123之數量之兩倍。本實施例中，所述 放送料卷131之數量為四個。所述複數放送料卷i3i上均 棬繞有離型膜101。所述放送料卷131之結構與一般料卷 大致相同，只是，放送料卷131還設置有渦卷彈簧等結構 從而具有自動回卷功能。所述複數換向滾輪132位於所述 複數放送料卷131與所述壓合機構12之間❶所述複數換甸 滚輪132可分別固定於所述複數壓板。 [0014] 請〆併參閱圖1與圖3，所述基板送料機構14機械連接於 100114145 表箪編號A0101 第9頁/共24頁 1002023758-0 201244571 所述壓合機構12，所述基板·_u祕向所述複數 壓合間隙123内輸送基板。所述基板送料機構14包括複數 用於放置基板之基板送料幻4G與與所述複數基板送料盒 140--對應之複數基板轉移哭〗& 砂。》141。所述複數基板送料 盒U0與所述複數壓合間隙123 一 —對應每一均用於將 基板送料幻㈣之基板轉移至—壓合_123内。所述 複數基板送料盒140與所述複數壓合間隙123 一一對應， 每-基板送料盒140可以於_壓板。本實施例中，所述 基板送料盒140之數量為兩個基板送料盒14〇固定於 下壓板122G ’ -基板送料盒14〇固定於中間壓板1 222。 所述基板送料盒140包括-收容槽14gq、設置於所述收容 槽1400内之複數彈性件1401以及承栽於所述複數彈性件 1401上之托板1402。所述基板可承载於所述托板14〇2上 。所述收容槽1400為僅一端封口之長方體形容器，包括 相連接之侧壁1403與底壁1404。所述複數彈性件14〇1均 彈性連接於所述底壁1404與所述托板1402之間，用於在 托板1402上之基板減少時向托板1402提供彈力以保持最 遠離托板1402之一塊基板與基板轉移器141之距離於一定 範圍内。每一基板轉移器141均包括相連接之伸縮桿141 〇 與真空吸板1411。所述伸縮桿1410可設置於所述基板送 料盒140，所述伸縮桿1410可於驅動下進行伸長與歸位。 所述真空吸板1411可連接於一抽真空裝置，且具有複數 抽氣孔1412。所述真空吸板1411於伸縮桿1410處於歸位 狀態時與所述托板1402相對，可進行抽真空以吸取托板 1402上之基板。所述真空吸板1411於伸縮桿1410處於伸 長狀態時進入一壓合間隙123内、並與壓板之一表面相對 100114145 表單編號A0101 第10頁/共24頁 1002023758-0 201244571 [0015] [0016] Ο [0017] [0018] ，可進行破真空以釋放該基板，從而將基板轉移至壓板 上。 所述分離收料機構15包括一第二升降驅動器150、至少一 導桿151、複數調向滚輪152、複數引導輪153、複數卷 收料卷154與複數基板收料盒155。 所述第二升降驅動器150機械連接於所述複數基板收料盒 155，用於驅動所述複數基板收料盒155與所述複數壓板 同步移動。所述第二升降驅動器150具有第二驅動軸1500 ，所述第二驅動轴15〇〇連接於所述複數基板收料盒155。 Ο [0019] 所述導桿151與導柱121之結構大致相同，其橫截面積自 靠近機台11處向遠離機台11處逐漸減小。 所述複數調向滾輪152均位於所述壓合機構12與所述複數 卷收料卷154之間。所述複數調向滾輪152可分別固定於 所述複數壓板。捲繞於每一放送料卷丨31之離型膜ιοί均 依次張設於至少一換向滾輪132、至少一調向滾輪152與 一對應之卷收料卷154上。 所述複數引導輪153可分別固定於所述複數壓板。每一引 導輪153均位於一壓合間隙ι23與一對應之基板收料盒 155之間’每一引導輪153均用於將所述壓合間隙123内 之基板引導傳輸至所述對應之基板收料盒155内。可理解 ，每一壓合間隙123與一對應之基板收料盒155之間之引 導輪153之數量可根據實際需要以及空間大小而作適應性 之設計。 [0020] 100114145 所述複數卷收料卷154與所述複數放送料卷131 一一對應 表單編號Α0101 第11頁/共24頁 1002023758-0 201244571 ’每-卷收料卷154均用於卷收離型膜1〇1以使離型膜 ιοί與基板分離。本實施例中，與所述複數放送料卷m 相對應之，所述卷收料卷154之數量也為四個其中，兩 個卷收料卷154位於所述基板收料盒155靠近所述壓板^ -端’另外兩個卷收料卷154位於所述基板收料盒阳遠 離所述壓板之-端。當然、，所述分離 括複數與所述複數卷收料卷154_ 一對應機械連接之Μ 驅動器，所述複數卷收驅動器均用於驅動所述複數卷收 料卷154轉動以卷收離型膜。 [0021] 所述複數基板收料盒155與所述複數壓合間隙123一一對 應，所述複數基板收料盒155均用於收集與離型獏1〇1分 離後之基板。所述複數基板收料盒155均套設於所述導桿 151，最靠近機台11之一基板收料盒155與所述第二驅動 軸1 500機械連接。每一基板收料盒155均開設有與所述導 桿151相配合之引導孔1551。相鄰之兩個基板收料盒155 中，靠近機台11之基板收料盒155之引導孔1551之孔徑 大於遠離機台11之基板收料盒155之引導孔1551之孔徑 。如此，當所述第二升降驅動器150不驅動基板收料盒 155移動時’所述複數基板收料盒155可承載於所述導桿 151之不同咼度處，從而與所述複數壓板之位置相對應。 [0022] 請一併參閱圖1至圖4，使用本技術方案之壓合裝置1〇壓 合基板時，可採取以下步驟： [0023] 首先’向所述基板送料機構14提供複數基板1〇2，使所述 基板送料機構14向每一壓合間隙123内輸送一塊基板102 。本實施例中’提供之基板102包括貼合於一起之覆蓋膜 100114145 表單編號Α0101 第12頁/共24頁 1002023758-0 201244571 [0024] Ο [0025] ❹ [0026] 100114145 103與軟性電路板104。將所述複數基板102放置於所述 基板送料機構14之複數基板送料盒140内。所述基板轉移 器141之伸縮桿141 0於真空吸板1411抽真空並吸取一塊 基板102後伸長，使得真空吸板1411將基板1〇2移至一壓 合間隙123内，此後，真空吸板1411破真空使得基板1〇2 落至一堡板表面，伸縮桿1410歸位》 然後，所述複數壓板沿所述導柱121相對移動以相互靠近 並壓合位於所述壓合間隙123中之基板1〇2。具體地，所 述第一液壓單元1200加壓，所述第一驅動軸1201驅動所 述下壓板1220並帶動所述至少一中間壓板1 222向靠近所 述上壓板1221移動直至相互閉合》當然，所述壓板還於 壓合時對基板102加熱，以利於覆蓋膜1〇3固化。保持髮 合狀態一段時間直至覆蓋膜103完全固化。 於所述下壓板1220及至少一中間壓板1222上升之過程中 ，所述複數卷收料卷154及所述複數基板收料盒155與所 述下壓板1 220及至少一中間壓板1222同步上升，而離型 膜送料機構13之複數放送料卷131也會放送出部分離型臈 101以適應複數換向滾輪132與機台π之間之距離變化。 當所述下壓板1 220及至少一中間壓板1222歸位時，所述 複數放送料卷131將自動回卷放送出之部分離型膜1〇1， 從而確保張設於所述離型膜送料機構13與分離收料機構 15之間之離型膜101始終保持平整。 最後，使所述複數壓板歸位，利用所述複數卷收料卷Η* 卷收離型膜101以使離型膜1〇1與基板1〇2分離，利用所 述複數基板收料盒155收集與離型膜ίο〗分離後之基板 表單編號Α0101 第13頁/共24頁 1002023758-0 102。 201244571 [0027] [0028] [0029] [0030] [0031] [0032] 所述複數卷收料卷154可於卷收酿 ,動器之驅動下轉動以卷 收離型膜101，此時離型膜 與基板102分離，基板1〇2 於調向滾輪152、複數引導輪153之引導作用下進入基板 收料盒155内。可理解，複數卷收料卷154卷收離型膜 m之同時，所述離型膜送料機構13也於向所述壓合間隙 123内輸送新之離型膜101以利於下_欠壓人 本技術方案之壓合裝置具有以下如1合機構具有複 數壓板ϋ壓合複數塊基板’可節省大量熱能並提 高生產效率；通過離型膜送料機構、基板送料機構血分 離收料機構’可自動往壓合空隙内玫置基板、離型膜， 並自動分離壓合後之基板及離_，實現了壓合自動化 ’消除了人工作業之安全隱患；1¾分離收料機構可方便 地分離基板及離型膜’避免基板之損傷，可大幅提高壓 合良率。 综上所述’本發明择已符合發明專利之要件，遂依法提 出專利申請。惟’以上所述者僅為本發明之較佳實施方 式，自不能以此_本案之f請專利範I舉凡熟悉本 案技藝之人士援財發日狀精神所作之料㈣或變化 ，皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 圖1係本技術方案提供之壓合裝置之俯視圖。 圖2係圖1沿Π-ΙΙ線之剖視圖。 圖3係圖1沿Π I -111線之部分剖規圖。 100114145 表單編號A0101 第14頁/共24頁 1002023758-0 201244571 [0033] 圖4係使用上述壓合裝置壓合電路板之結構示意圖 【主要元件符號說明】 [0034] 壓合裝置：10 [0035] 機台：11 [0036] 壓合機構：12 [0037] 第一升降驅動器：120 [0038] 第一液壓單元：1200 〇 [0039] 第一驅動軸：12 01 [0040] 導柱：121 [0041] 第一端部：121 0 [0042] 第二端部：1211 [0043] 下壓板：1220 [0044] 上壓板：1221 U [0045] 中間壓板：1222 [0046] 壓合間隙：123 [0047] 導孔：124 [0048] 離型膜送料機構：13 [0049] 料架：130 [0050] 放送料卷：131 [0051] 換向滚輪：132 100114145 表單編號A0101 第15頁/共24頁 1002023758-0 201244571 [0052] 基板送料機構：14 [0053] 基板送料盒：140 [0054] 收容槽：1400 [0055] 彈性件：1401 [0056] 托板：1402 [0057] 側壁：1403 [0058] 底壁：1404 [0059] 基板轉移器：141 [0060] 伸縮桿：1410 [0061] 真空吸板：1411 [0062] 抽氣孔：1 4 1 2 [0063] 分離收料機構：15 [0064] 第二升降驅動器：150 [0065] 第二驅動軸：1500 [0066] 導桿：151 [0067] 調向滾輪：152 [0068] 引導輪：153 [0069] 卷收料卷：154 [0070] 基板收料盒：155 100114145 表單編號A0101 第16頁/共24頁 1002023758-0 201244571 [0071] [0072] [0073] [0074] [0075] 引導孔：1551 離型膜：101 基板：102 覆蓋膜：103 軟性電路板：104 Ο 100114145 表單編號A0101 第17頁/共24 1 1002023758-0201244571 VI. Description of the Invention: [Technical Field of the Invention] [0001] The present invention relates to the field of circuit board manufacturing technology, and more particularly to an ink assembly apparatus. [Prior Art] Just as the development of digital money, the production technology of circuit boards, which are the basic components of digital products, has become more and more important. The board is typically fabricated from a series of processes such as cutting, drilling, copper plating, exposure, development, etching, lamination, and printing. 〇 [〇〇〇3] Pressure cooperation is an important manufacturing process for circuit board manufacturing, mainly using a press-fit device to cover (4) the board surface (4) into an insulating protective layer. The cover film comprises an insulating layer (e.g., a polyimide film) and a glue layer, and the cover film is attached to the surface of the circuit board before pressing. When pressed, the press-fit device generates high-temperature money to soften and melt the adhesive layer and fill it onto the surface of the board so that the insulating layer adheres to the board as an insulating protective layer. The existing press-fit device includes an upper electric heating plate and a lower electric hot plate pressing plate. When pressing ◎ 'Firstly, the upper hot plate I plate is opened to a fixed angle with respect to the lower electric plate. Secondly, the release 臈, the circuit board and another release film are placed in the lower electric heating plate in sequence; The electric pure pressure plate is returned to the position, and the cover film is heated by the electric heating plate in the upper hot plate and the lower electric plate, and the pressure is applied to the circuit board by using the J1 electric plate pressing plate and the lower electric plate pressing plate; finally, The upper electric heat (four) plate is opened relative to the lower electric hot plate pressing plate, and the circuit board is manually taken out and the release film attached to the circuit board is removed. The release liner may be polyethylene, polypropylene or polyethylene terephthalate, and the surface thereof is coated with a release agent and has a lower surface. 1002023758-0 100114145 Form No. A0101 No. 5 Page / Total 24 pages 201244571 Face energy. The release film is placed between the upper heat plate pressure plate or the lower circuit board for avoiding the φ _ , , , and the plate pressing plate to prevent the circuit board from adhering to the hot plate pressing plate and the hot plate pressing plate. However, using the press-fit device,: work under high temperature • « board enemy or take out the circuit board, not ^ unsafe': and the upper and lower electric hot plate repeatedly open and close will eliminate the amount of heat, unfavorable To save energy. In addition, the press-fitting device can only complete the pressing of one circuit board, which is disadvantageous for improving the production efficiency, and in the process of separating the circuit board and the release film, the damage is caused. ^成成板[Summary of the Invention] [0004] [0005] In view of this, a press-fit device is provided to achieve press-fitting > meshing production, improving the efficiency of press-fitting, and reducing the consumption of heat. necessary. A press-fit device includes a press-fit mechanism, a release film feed mechanism, a plate feed mechanism, and a separate take-up mechanism. The pressing mechanism includes a plurality of plates and at least a guide column. The plurality of pressure plates are sequentially disposed, and are sleeved on the at least the guide post. There is a pressure gap between the two adjacent pressure plates. The plurality of platens may be relatively moved along the at least "guide column" = close to or away from the (four) small or increased press-fit gap. The release film feeding mechanism is located at the end of the pressing mechanism and includes a plurality of discharge rolls wound with a release film. The release film feed mechanism is configured to convey the release film into the plurality of press-fit gaps. The substrate feeding mechanism is mechanically coupled to the pressing mechanism. The substrate feeding mechanism is configured to convey the substrate into the plurality of pressing gaps. The pressing mechanism inspects the release film located in the press-fitting gap and the substrate when the plurality of pressure plates are close to each other. The separating and receiving mechanism is located at the pressing mechanism away from the release film feeder 100114145. Form No. 1010101 Page 6/24 pages 1002023758-0 201244571 [0006] 0007 [0007] 114 [0008] 100114145 Rui, and includes a plurality of volume receiving rolls and a plurality of substrate receiving boxes. The plurality of roll receipt rolls are in one-to-one correspondence with the plurality of feed rolls, and each roll of take-up rolls is used to take up the release film to separate the pressed release film from the substrate. The plurality of substrate receiving boxes are corresponding to the plurality of pressing gaps, and the plurality of substrate receiving boxes are used for collecting the substrate separated from the release liner. The pressing device of the technical solution has the following advantages: the pressing mechanism has a plurality of pressing plates, and the plurality of substrates can be pressed at one time, which can save a lot of heat energy and improve production efficiency; through the release film feeding mechanism, the substrate feeding mechanism and the separation and receiving mechanism The substrate and the release film can be automatically placed in the pressure gap, and the pressed substrate and the release film are automatically separated, thereby realizing the pressing automation to eliminate the safety hazard of the manual operation; the separation and receiving mechanism can be conveniently The substrate and the release film are separated to avoid damage of the substrate, and the press-fit ratio β can be greatly improved. [Embodiment] Hereinafter, the press-fit device of the present invention will be described in detail with reference to the accompanying drawings and the embodiments. Referring to FIG. 1 to FIG. 3 together, the technical solution provides a pressing device 1〇' for pressing and separating the release film and the substrate, and separating the pressed substrate from the release film. The press-fit device 10 includes a machine table 11, a press mechanism 12, a release film feed mechanism 13, a substrate feed mechanism 14, and a separate take-up mechanism 15. The merging mechanism 12, the release film feeding mechanism 13, the substrate feeding mechanism 14, and the separation receiving mechanism 15 are all disposed on the machine table u. Wherein the release film feeding mechanism 13 and the separation receiving mechanism 15 are respectively located at opposite ends of the pressing mechanism 12, that is, the release film feeding mechanism form number A0101 page 7 / total 24 pages 1002023758 -0 201244571 13 is located at one end of the press mechanism 12. The separation and receiving mechanism 15 is located at the other end of the pressing mechanism 12 away from the release film feeding mechanism 13. The substrate feeding mechanism 14 is located on one side of the pressing mechanism 12. The pressing mechanism 12 includes a first lifting drive 120, at least one guiding post 121 and a plurality of pressure plates. The pressing mechanism 12 is configured to press the release film between the plurality of pressure plates and the substrate when the plurality of pressure plates are close to each other. [0010] The first lift driver 120 may be a hydraulic piston cylinder including a first hydraulic unit 1 200 and a first drive shaft 1201 that are coupled. The first hydraulic unit 1200 can be disposed under the machine table 11. The first drive shaft 1201 passes through the machine table 11 and is mechanically coupled to the plurality of platens. [0011] In the present embodiment, the number of the guide posts 121 is four. Each of the guide posts 121 has an opposite first end 1210 and a second end 1211. The first end portion 1210 is adjacent to the machine table 11, and the second end portion 1211 is remote from the machine table 11. The cross-sectional area of the guide post 121 gradually decreases from the first end portion 1210 to the second end portion 1211. [0012] The plurality of pressure plates are sequentially disposed, and are sleeved on the at least one guide post 121, and a pressing gap 123 is formed between the adjacent two pressure plates. The plurality of platens are relatively movable along the at least one guide post 121 to approach or move away from each other to reduce or increase the press-fit gap 123. The plurality of pressure plates are respectively provided with a plurality of guide holes 124 matched with the plurality of guide columns 121. Among the two adjacent pressure plates, the diameter of the guide holes 124 of the pressure plate adjacent to the machine table 11 is larger than the pressure plate of the platen 11 away from the machine table 11. The aperture of the guide hole 124. Specifically, the plurality of pressure plates includes a pressure plate 1220 closest to the machine table 11, a pressure plate 1221 farthest from the machine table 11, and at least one intermediate pressure plate 1222. The upper platen 1221 is fixed at 100114145. Form No. A0101 Page 8 of 24 1002023758-0 201244571 至少 At least the second end 1211 of the guide post 121. The first drive shaft 1201 is mechanically coupled to the lower platen 1 220' for use in the first hydraulic unit pOO. The lower pressing plate 1220 is moved to move the at least one intermediate plate 1222 toward the upper pressing plate 22 to perform pressing. The number of the intermediate pressure plates 1 222 in this embodiment is one. The aperture of the guiding hole 124 of the lower pressing plate 122 is larger than the diameter of the guiding hole 124 of the intermediate pressing plate 1 222, and the diameter of the guiding hole 124 of the intermediate yoke 1222 is larger than the diameter of the guiding hole 124 of the upper pressing plate 1221. Thus, when the first hydraulic unit 120 is released, the lower platen 1220 and the intermediate platen 1222 are moved by gravity along the at least one guide post 21 toward the machine table 11. Specifically, the intermediate platen 1 222 stops moving before the diameter of the guide post 121 moves to match the diameter of the guide hole 12 4 , and then the lower plate 1220 moves to the diameter of the guide post 121 and the guide hole. The matching of the apertures of 124 also stops moving. [0013] The release film feed mechanism 13 is configured to transport the release liner into the plurality of press gaps 123. The release film feeding mechanism 13 includes a magazine 13{), a plurality of feeding rolls 131 and a plurality of reversing rollers 132 disposed on the rack 130. Ο The rack 130 can be fixed to the machine table 11. The number of the feed rolls 131 may be up to twice the number of the press gaps 123. In this embodiment, the number of the feed rolls 131 is four. The release film 101 is wound around the plurality of feed rolls i3i. The structure of the feed roll 131 is substantially the same as that of the conventional roll, except that the feed roll 131 is also provided with a structure such as a spiral spring to have an automatic rewind function. The plurality of reversing rollers 132 are located between the plurality of feeding reels 131 and the pressing mechanism 12, and the plurality of reversing rollers 132 are respectively fixed to the plurality of pressing plates. Referring to FIG. 1 and FIG. 3, the substrate feeding mechanism 14 is mechanically coupled to 100114145, No. A0101, page 9 / page 24, 1002023758-0 201244571, the pressing mechanism 12, the substrate _u The substrate is transported into the plurality of press-fit gaps 123. The substrate feeding mechanism 14 includes a plurality of substrate feeding magic 4G for placing a substrate and a plurality of substrate transfer crying & sand corresponding to the plurality of substrate feeding boxes 140. 141. The plurality of substrate feed boxes U0 and the plurality of press-fit gaps 123 are each used to transfer the substrate of the substrate feed (4) to the press-fit_123. The plurality of substrate feeding boxes 140 are in one-to-one correspondence with the plurality of pressing gaps 123, and each of the substrate feeding boxes 140 may be on the platen. In this embodiment, the number of the substrate feeding cassettes 140 is two substrate feeding cassettes 14 〇 fixed to the lower pressing plate 122G ′ - the substrate feeding cassette 14 〇 is fixed to the intermediate pressing plate 1 222. The substrate feeding cassette 140 includes a receiving groove 14gq, a plurality of elastic members 1401 disposed in the receiving groove 1400, and a tray 1402 mounted on the plurality of elastic members 1401. The substrate can be carried on the pallet 14〇2. The receiving groove 1400 is a rectangular parallelepiped container sealed at one end, and includes a connecting side wall 1403 and a bottom wall 1404. The plurality of elastic members 14〇1 are elastically connected between the bottom wall 1404 and the pallet 1402 for providing elastic force to the pallet 1402 when the substrate on the pallet 1402 is reduced to keep the farthest from the pallet 1402. The distance between one of the substrate and the substrate transferr 141 is within a certain range. Each substrate transfer unit 141 includes a connecting telescopic rod 141 〇 and a vacuum suction plate 1411. The telescopic rod 1410 can be disposed on the substrate feed cassette 140, and the telescopic rod 1410 can be extended and homed under driving. The vacuum suction plate 1411 can be coupled to a vacuuming device and has a plurality of suction holes 1412. The vacuum suction plate 1411 is opposed to the pallet 1402 when the telescopic rod 1410 is in the homing state, and can be evacuated to suck the substrate on the pallet 1402. The vacuum suction plate 1411 enters a pressing gap 123 when the telescopic rod 1410 is in an extended state, and is opposite to one surface of the pressure plate. 100114145 Form No. A0101 Page 10 / Total 24 pages 1002023758-0 201244571 [0016] [0018] [0018] A vacuum may be applied to release the substrate to transfer the substrate to the platen. The separation and receiving mechanism 15 includes a second lifting and lowering drive 150, at least one guiding rod 151, a plurality of adjusting rollers 152, a plurality of guiding wheels 153, a plurality of winding rolls 154 and a plurality of substrate receiving boxes 155. The second lift driver 150 is mechanically coupled to the plurality of substrate receiving cassettes 155 for driving the plurality of substrate receiving cassettes 155 to move synchronously with the plurality of platens. The second lift driver 150 has a second drive shaft 1500, and the second drive shaft 15 is coupled to the plurality of substrate receiving cassettes 155. [0019] The guide rod 151 is substantially the same in structure as the guide post 121, and its cross-sectional area gradually decreases from the vicinity of the machine table 11 toward the remote stage 11. The plurality of indexing rollers 152 are located between the pressing mechanism 12 and the plurality of windings 154. The plurality of steering rollers 152 can be respectively fixed to the plurality of pressure plates. The release film ιοί wound around each of the feed rolls 31 is sequentially stretched over at least one of the reversing rollers 132, at least one of the reversing rollers 152 and a corresponding roll of the reel 154. The plurality of guide wheels 153 may be respectively fixed to the plurality of platens. Each guide wheel 153 is located between a pressing gap ι 23 and a corresponding substrate receiving box 155. Each guiding wheel 153 is used to guide the substrate in the pressing gap 123 to the corresponding substrate. In the receiving box 155. It can be understood that the number of the guide wheels 153 between each press-fit gap 123 and a corresponding substrate receiving box 155 can be adapted according to actual needs and space. [0020] 100114145 The plurality of volume receiving rolls 154 and the plurality of feeding rolls 131 are in one-to-one correspondence Form No. Α0101 Page 11 / Total 24 pages 1002023758-0 201244571 'Each-volume receiving roll 154 is used for reeling The release film 1〇1 is used to separate the release film ιοί from the substrate. In this embodiment, corresponding to the plurality of feeding rolls m, the number of the roll receiving rolls 154 is also four, and two roll receiving rolls 154 are located in the substrate receiving box 155 close to the The other two roll receiving rolls 154 are located at the end of the substrate receiving box from the end of the platen. Of course, the separation includes a plurality of mechanical drives connected to the plurality of winding rolls 154_, and the plurality of winding drives are used to drive the plurality of winding rolls 154 to rotate to take up the release film. . [0021] The plurality of substrate receiving boxes 155 are paired with the plurality of pressing gaps 123, and the plurality of substrate receiving boxes 155 are used for collecting the substrate separated from the release 貘1〇1. The plurality of substrate receiving boxes 155 are sleeved on the guiding rod 151, and the substrate receiving box 155 closest to the machine table 11 is mechanically connected to the second driving shaft 1500. Each of the substrate receiving boxes 155 is provided with a guiding hole 1551 that cooperates with the guiding rod 151. In the adjacent two substrate receiving boxes 155, the aperture of the guiding hole 1551 of the substrate receiving box 155 close to the machine table 11 is larger than the aperture of the guiding hole 1551 of the substrate receiving box 155 which is away from the machine table 11. As such, when the second lifting driver 150 does not drive the substrate receiving cassette 155 to move, the plurality of substrate receiving boxes 155 can be carried at different degrees of the guiding rod 151, thereby being positioned with the plurality of pressing plates. Corresponding. [0022] Referring to FIG. 1 to FIG. 4 together, when the pressing device of the present invention is used to press the substrate, the following steps may be taken: [0023] First, a plurality of substrates 1 are provided to the substrate feeding mechanism 14. 2. The substrate feeding mechanism 14 transports a substrate 102 into each of the pressing gaps 123. In the present embodiment, the substrate 102 provided includes a cover film 100114145 which is bonded together. Form No. 1010101 Page 12/24 pages 1002023758-0 201244571 [0024] Ο [0026] 100114145 103 and the flexible circuit board 104 . The plurality of substrates 102 are placed in a plurality of substrate feed cassettes 140 of the substrate feeding mechanism 14. The telescopic rod 1410 of the substrate transfer device 141 is evacuated after the vacuum suction plate 1411 is vacuumed and sucks a substrate 102, so that the vacuum suction plate 1411 moves the substrate 1〇2 into a pressing gap 123. Thereafter, the vacuum suction plate 1411 breaks the vacuum to cause the substrate 1〇2 to fall to the surface of a fort, and the telescopic rod 1410 is returned to the ground. Then, the plurality of pressing plates are relatively moved along the guiding column 121 to be close to each other and pressed in the pressing gap 123. The substrate 1〇2. Specifically, the first hydraulic unit 1200 is pressurized, and the first driving shaft 1201 drives the lower pressing plate 1220 and drives the at least one intermediate pressure plate 1 222 to move closer to the upper pressing plate 1221 until they are closed to each other. The platen also heats the substrate 102 during pressing to facilitate curing of the cover film 1〇3. The hair is held in a state of being held for a while until the cover film 103 is completely cured. During the ascending process of the lower pressing plate 1220 and the at least one intermediate pressing plate 1222, the plurality of roll receiving rolls 154 and the plurality of substrate receiving boxes 155 rise synchronously with the lower pressing plate 1 220 and the at least one intermediate pressing plate 1222. The plurality of feed rolls 131 of the release film feeding mechanism 13 also delivers the separation type cassette 101 to accommodate the change in the distance between the plurality of reverse rollers 132 and the table π. When the lower pressing plate 1 220 and the at least one intermediate pressing plate 1222 are in the position, the plurality of feeding rolls 131 are automatically rewinded and released out of the partial separation type film 1〇1, thereby ensuring the stretching on the release film feeding. The release film 101 between the mechanism 13 and the separation and receiving mechanism 15 is always kept flat. Finally, the plurality of platens are returned to the position, and the release film 101 is taken up by the plurality of roll-up sheets to separate the release film 1〇1 from the substrate 1〇2, and the plurality of substrate receiving boxes 155 are utilized. The substrate form number after separation and separation film ίο Α 0101 Page 13 / Total 24 pages 1002023758-0 102. [0028] [0029] [0032] [0032] [0032] The plurality of roll receipt rolls 154 can be rotated by the roll and the actuator to reel the release film 101, at this time The film is separated from the substrate 102, and the substrate 1〇2 is guided into the substrate receiving cassette 155 by the guiding rollers 152 and the plurality of guiding wheels 153. It can be understood that the release film feed mechanism 154 also conveys the new release film 101 into the press gap 123 at the same time as the plurality of roll 154 rolls are taken away from the film m to facilitate the lower die. The pressing device of the technical solution has the following steps: the composite plate has a plurality of pressure plates, and the plurality of substrates are combined to save a large amount of heat energy and improve production efficiency; and the blood separation and receiving mechanism by the release film feeding mechanism and the substrate feeding mechanism can automatically The substrate and the release film are placed in the pressed space, and the pressed substrate and the separation _ are automatically separated, thereby realizing the safety of the pressing, eliminating the safety hazard of the manual operation; the 13⁄4 separation and receiving mechanism can conveniently separate the substrate and The release film' avoids damage to the substrate and greatly improves the press-fit yield. In summary, the invention has met the requirements of the invention patent and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to use this method to disclose the material (four) or change of the person who is familiar with the skill of the present invention. It is within the scope of the following patent application. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a plan view of a press device provided by the present technical solution. Figure 2 is a cross-sectional view of Figure 1 taken along the Π-ΙΙ line. Figure 3 is a partial cross-sectional view of Figure 1 taken along line - I - 111. 100114145 Form No. A0101 Page 14 of 24 1002023758-0 201244571 [0033] FIG. 4 is a schematic view showing the structure of a press-fitted circuit board using the above-mentioned press-fitting device [Key element symbol description] [0034] Press-fit device: 10 [0035] Machine: 11 [0036] Pressing mechanism: 12 [0037] First lifting drive: 120 [0038] First hydraulic unit: 1200 〇 [0039] First drive shaft: 12 01 [0040] Guide post: 121 [0041 First end: 121 0 [0042] Second end: 1211 [0043] Lower plate: 1220 [0044] Upper plate: 1221 U [0045] Intermediate plate: 1222 [0046] Pressing clearance: 123 [0047] Guide hole: 124 [0048] Release film feeding mechanism: 13 [0049] Rack: 130 [0050] Dispensing roll: 131 [0051] Reversing roller: 132 100114145 Form No. A0101 Page 15 of 24 1002023758- 0 201244571 [0052] Substrate feeding mechanism: 14 [0053] Substrate feeding box: 140 [0054] Storage groove: 1400 [0055] Elastic member: 1401 [0056] Pallet: 1402 [0057] Side wall: 1403 [0058] Bottom wall : 1404 [0059] Substrate Transferr: 141 [0060] Telescopic Rod: 1410 [0061] Vacuum Suction Plate: 1411 [0062] Pumping :1 4 1 2 [0063] Separate receiving mechanism: 15 [0064] Second lifting drive: 150 [0065] Second drive shaft: 1500 [0066] Guide rod: 151 [0067] Tilting wheel: 152 [0068] Guide wheel: 153 [0069] Roll receiving roll: 154 [0070] Substrate receiving box: 155 100114145 Form number A0101 Page 16 / Total 24 page 1002023758-0 201244571 [0071] [0072] [0073] [0074] 0075] Guide hole: 1551 Release film: 101 Substrate: 102 Cover film: 103 Flexible circuit board: 104 Ο 100114145 Form No. A0101 Page 17 / Total 24 1 1002023758-0