201242684 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明是關於用以在被加工構件形成孔（微細孔）的 穿孔方法及穿孔裝置。 【先前技術3 [〇〇〇2] 以往已知有各種用以在被加工構件形成微細孔的穿 孔裝置（例如參照專利文獻1)。 圖5是用以說明習知的穿孔裝置9〇〇而顯示之圖。圖 〇 5所示的習知的穿孔裝置900是以記載於專利文獻丨的發明 的習知技術而被揭示的穿孔裝置。 習知的穿孔裝置900如圖5所示具有：使衝頭 bunch)91〇下降及上升的衝頭驅動裝置92〇 ;具有模孔 (die hole)931的模（die)930 ;支揮模93〇的台支撐部 940 ;對衝頭91〇及模930施以放電加工（eleetric d. 1Scharge machining)之放電線（electrie j · ^charge wire)95〇。 〇 9l〇、如此構成的習知的穿孔裝置900是藉由對成為衝頭 、〇的原料的衝頭素材透過放電線950施以放電加工而形 需的衝碩910。而且藉由將放電電力（discharge 對兮）供給至該衝頭910與成為模930的原料的模素材並 電 、材進行放電加工而形成模孔931。然後，透過放 9 工對已消耗的衝頭910施以再放電加工，使該衝頭 工 10成為具有所需的精度的衝頭91〇，使用該已再放電加 孔，衝頭91〇，在被承載於模930的被加工構件960形成 件ίΓ〇二孔）。如此習知的穿孔裝置9〇0為使在被加工構 1011127〇产單编號成孔的衝頭與用以形成模孔931的衝頭成為 第3頁/共32頁 1013218622-0 201242684 同—個衝頭。 但是’不限於習知的穿孔裝置90〇，於在被加工構件 形成微細孔的穿孔裝置中，盡可能減小用以在被加工構 件形成孔的衝頭與模孔的餘隙（clearance)很重要。因 此’考慮為如習知的穿孔裝置9〇〇般，藉由令用以在被加 工構件形成孔的衝頭與用以形成模孔的衝頭成為同一個 衝頭，可盡可能減小衝頭與模孔的餘隙。 [專利文獻1]曰本國特開平卜274935號公報 【發明内容】 [0003] 但是’習知的穿孔裝置900由於是透過放電加工形成 所需的衝頭910及模孔931，故需要放電設備，有穿孔裝 置9〇〇成為大規模的裝置之問題。而且，習知的穿孔裝置 9〇〇於在被加工構件960形成孔時，需進行對衝頭施以再 放電加工並對衝頭再加工，使用已再加工的衝頭在被加 工構件形成孔之程序，也有作業程序多的問題。 因此，本發明的目的為提供一種穿孔方法及穿孔裝 置，可在被加工構件形成高精度的孔，且無須大規模的 «又備，並且可簡化用以在被加工構件形成孔的作業程序 〇 [1]、本發明的穿孔方法，是用以在被加工構件形成 孔，其特徵包含：透過可形成與形成於前述被加工構件的 孔同等的孔的衝頭，於在固定於印模（die plate)支撐 台的上端面的狀態下被支撐的印模形成模孔之第—程序 ;將被加I構件承載於藉由前述第_程序形成有模孔的 印模，藉由自前述被加工構件的上方側使衝頭下降以通 過前述被加工構件與模孔，在前述被加工構件形 101112701^單編號第4頁/共32頁 1013218622-0 201242684 第二程序。 、照本發明时孔方法，❹可職與應形成於被 加工構件的關等的孔崎頭，在印獅成模孔，使用 形成有該模孔的印模形成被加丄構件的孔。據此，可盡 可能減小於在被加工構件形成孔時使用的衝頭與模孔的 餘隙據此，可在被加工構件形成高精度的孔，特別是 可高精度地形成[_]單位的微細孔。而且，依照本發明 的穿孔方法’因無須對衝頭施以放電加工或進行再放電201242684 VI. Description of the Invention: [Technical Field] [0001] The present invention relates to a perforating method and a perforating device for forming a hole (fine pore) in a member to be processed. [Prior Art 3] Various perforating means for forming fine pores in a member to be processed have been known (see, for example, Patent Document 1). Fig. 5 is a view for explaining a conventional perforating device 9'. The conventional perforating device 900 shown in Fig. 5 is a perforating device disclosed in the prior art disclosed in the patent document. As shown in FIG. 5, the conventional perforating device 900 has a punch driving device 92 that lowers and raises a punch (bump) 91, a die 930 having a die hole 931, and a die 93. The table support portion 940 of the crucible; the discharge head 91〇 and the mold 930 are subjected to an electric discharge line (electtric j. ^charge wire) 95〇. The conventional perforating device 900 configured as described above is formed by applying electric discharge to the punch material which is a raw material of the punch and the crucible through the discharge wire 950. Further, a die hole 931 is formed by supplying discharge power (discharge) to the die material of the punch 910 and the material of the material of the mold 930, and electrically discharging the material. Then, the discharged punch 910 is subjected to re-discharge machining by the ejector, so that the punch 10 becomes the punch 91 具有 having the required precision, and the re-discharged hole is used, the punch 91 〇, A two-hole is formed in the member to be processed 960 that is carried on the mold 930. The conventional perforating device 9〇0 is such that the punch which is numbered into a hole in the processed structure 1011127 and the punch for forming the die hole 931 become the third page/total 32 pages 1013218622-0 201242684 the same - a punch. However, it is not limited to the conventional perforating device 90. In the perforating device in which the micropores are formed in the workpiece to be processed, the clearance of the punch and the die hole for forming the hole in the member to be processed is minimized. important. Therefore, it is considered that, as in the conventional perforating device, the punch can be made as small as possible by making the punch for forming the hole in the workpiece to be the same punch as the punch for forming the die hole. The clearance between the head and the die hole. [Patent Document 1] Japanese Laid-Open Patent Publication No. 274935 [Draft] [0003] However, the conventional perforating device 900 requires a discharge device by forming a required punch 910 and a die hole 931 by electrical discharge machining. There is a problem that the perforating device 9 becomes a large-scale device. Moreover, the conventional perforating device 9 is required to perform re-discharge machining on the punch and re-machining the punch when the hole is formed in the workpiece 960, and the hole is formed in the workpiece by using the reworked punch. There are also problems with many operating procedures. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a perforating method and a perforating apparatus which can form a high-precision hole in a member to be processed, and which does not require a large-scale preparation, and can simplify an operation procedure for forming a hole in a member to be processed. [1] The perforation method of the present invention is for forming a hole in a member to be processed, and is characterized in that the punch is passed through a punch which can form a hole equivalent to a hole formed in the member to be processed, and is fixed to the stamp ( Die plate) the first step of forming the die hole in the state in which the upper end surface of the support table is supported; the die to be loaded on the stamp having the die hole formed by the aforementioned first process, by the aforementioned The upper side of the machined member lowers the punch to pass the aforementioned machined member and the die hole, and the second process is described in the above-described workpiece shape 101112701^, single number 4th page/32 page 1013218622-0 201242684. According to the hole method of the present invention, the hole is formed in the hole of the workpiece to be processed, and the hole is formed in the lion, and the hole in which the mold is formed is formed using the stamp in which the hole is formed. According to this, it is possible to reduce as much as possible the clearance of the punch and the die hole used when forming the hole in the workpiece, whereby high-precision holes can be formed in the workpiece to be processed, in particular, can be formed with high precision [_] The micropores of the unit. Moreover, the perforating method according to the present invention does not require the electric discharge machining or the re-discharging of the punch.
加工之程序，故無須放電設備等的大規模的設備並且 可簡化作業程序。 [2] 、在本發明的穿孔方法中，在前述第一程序中用 以形成前料孔_頭，與在前述第二㈣巾於在前述 被加工構件形成孔時使用的衝頭為同一個衝頭較佳。 如此，藉由使用與在被加工構件形成孔的衝頭同一 個衝頭形成模孔，可使在被加工構件形成孔的衝頭與模 孔的餘隙幾乎成為零，據此，對被加工構件可具有所需 的精度，且可形成高品質的孔。 [3] 、在本發明的穿孔方法中，前述印模支撐台具有 用以使通過前述模孔的前述衝頭釋放到下方向的衝頭釋 放孔較佳。 藉由以這種構成，可大大地採取衝頭的衝程 (stroke)，可對被加工構件確實地形成孔。 [4]、在本發明的穿孔方法中，在使前述衝頭釋放孔 及前述模孔的各個的中心軸一致而將前述印模固定於前 述印模支撐台時，前述中心軸到前述衝頭釋放孔的緣部 的長度dl，與前述中心轴到前述模孔的緣部的長度d2被 10111270产单編號麵1 帛5貢/共32頁 1013218622-0 201242684 設定為dl2d2，且前 厚度以下較佳。 述dl與d2 的差被設定為前述印模的 小的關係為這種關係，成 小與核孔的開口的大 遍及該緣部的全周藉由^中的模孔的緣部的周邊 即使於在被加卫構件料支心支撑的狀態。據此， 的緊壓力施加於印模，“彳由衝頭產生的朝下方向 變形。 犯防止印換的緣部及緣部周邊 m、在本發明的穿孔方法中，前述 的中心軸與前述衝頭釋放孔的中心轴—被孔 述印模支撐台較佳。 饭固疋於月y …㈣史心轴與衝頭釋放孔的 — 致，而將印模固定於印模支揮台，成為印模— 緣部的周邊遍及該緣部的全周均等地被讀於印模= 台的《。據此’於在被加I構件形成孔時，即使衝: 之朝下方向的緊壓力施加於印模，也更能確實地防止印 模的緣部及緣部周邊變形。 [6]、在本㈣的穿孔方法中，在前述被加工構件的 上方侧設置有衝頭導板（punch guide pUte)，該衝頭 導板具有當作該衝頭下降及上升時的該衝頭的導引 (guide)的功能，並且具有當作在透過前述衝頭形成孔後 ，使該衝頭由前述被加工構件脫離的脫模具（stripper) 的功能較佳。 藉由配設這種衝頭導板’可防止衝頭下降及上升時 的衝頭的橫向搖擺，可高精度地進行衝頭的導引。因此 ，通過被加工構件的衝頭確實進入印模的模孔。藉由進 名單煸號A0101 第6頁/共32頁 101112701 1013218622-0 2〇1242684 行這種動作’可將具有高精度的直徑的高品質的孔形成 导皮Λη Δ. 、 工物。而且，因於在被加工構件形成孔後該衝頭 上升時，可限制被加工構件與衝頭一起上升至規定以上 的立署 I，故可容易由被加工構件使衝頭脫離。據此，可 圓滑地進行形成孔的程序。 ▲ [7]、在本發明的穿孔方法中，衝頭導板具有與前述 械孔相同直徑的衝頭通過孔較佳。The processing procedure eliminates the need for large-scale equipment such as discharge equipment and simplifies the operating procedures. [2] In the perforation method of the present invention, the front hole hole_head is formed in the first program, and is the same as the punch used in forming the hole in the second (four) towel in the aforementioned workpiece. The punch is better. Thus, by forming the die hole by using the same punch as the punch forming the hole in the workpiece, the clearance of the punch and the die hole forming the hole in the workpiece can be made almost zero, and accordingly, the pair is processed. The components can have the required precision and can form high quality holes. [3] In the piercing method of the present invention, the die support table preferably has a punch release hole for releasing the punch passing through the die hole to the lower direction. With this configuration, the stroke of the punch can be greatly taken, and the hole can be surely formed for the member to be processed. [4] In the piercing method of the present invention, the center axis to the punch is obtained by fixing the punch release hole and the central axis of each of the die holes to fix the stamp to the die support table. The length d1 of the edge portion of the release hole and the length d2 of the edge portion of the central axis to the die hole are set to dl2d2 by the number of the 10111270 single-numbered surface 1 帛5 tributary/32 pages 1013218622-0 201242684, and the thickness is lower than the front thickness. good. The difference between dl and d2 is set such that the small relationship of the stamp is such a relationship, and the opening of the opening of the core hole is small and the periphery of the edge of the die hole is evenly distributed over the entire circumference of the edge. In the state of being supported by the support member. According to this, the pressing force is applied to the stamp, "the cymbal is deformed downward by the punch. The edge portion and the edge portion m which prevent the printing are prevented. In the piercing method of the present invention, the aforementioned central axis and the aforementioned The central axis of the punch release hole - preferably the hole die support table. The rice solids are on the moon y ... (4) the history of the mandrel and the punch release hole - and the impression is fixed on the impression support table, become the impression The periphery of the rim portion is equally read over the entire circumference of the rim portion in the stamp = table. According to this, even when the hole is formed by the member, even the pressing force in the downward direction is applied to In the punching method of the present invention, the stamp guide pUte is provided on the upper side of the workpiece to be processed. [6] In the perforation method of the present invention, a punch guide pUte is provided on the upper side of the workpiece. The punch guide has a function as a guide for the punch when the punch is lowered and raised, and has a function of forming the hole through the punch to cause the punch to be The function of the stripper from which the processed member is detached is better. By providing such a punch guide 'It can prevent the lateral sway of the punch when the punch is lowered and raised, and the punch can be guided with high precision. Therefore, the punch of the workpiece is surely entered into the die hole of the stamp. A0101 Page 6 / Total 32 pages 101112701 1013218622-0 2〇 1242684 This kind of action 'can form a high-quality hole with a high-precision diameter to form a skin Λ Δ 、., and because of the workpiece When the punch is raised after the hole is formed, the workpiece 1 can be restricted from rising to a predetermined number or more together with the punch, so that the punch can be easily detached by the workpiece. Accordingly, the procedure for forming the hole can be smoothly performed. ▲ [7] In the piercing method of the present invention, it is preferred that the punch guide has a punch through hole of the same diameter as the aforementioned hole.
， 藉由具有這種衝頭通過孔，在衝頭下降及上升時， 衝碩100不會橫向搖擺而能高精度地導引衝頭。 ^ [8]、在本發明的穿孔方法中，前述衝頭導板在被固 定於前述印模支撐台的狀態下被設置較隹。 如此’藉由在衝頭導板被固定於印模支撑台的狀態 下破設置，可高精度地進行朗的導引，並且可更碎實 地進行由被加卫構件使衝頭脫離的動作。 、在本發明的穿孔方法中，前述衝頭導板為該衝 板的下端面與前述被加工構件的上端面的間隨成 為0<d3$3mm而被設置較佳。 藉由將衝頭導板的下端面與被加工構件的上端面的 —設定為這種間隔，於在被加卫構件形成孔時，可更 =地崎_物，據此，可_度地設定被 :工構件上的衝頭的抵接位置。而且，可更確實地進行 = .此外，間瞻定為 更小的值較佳，以1 mm以下更佳。 UG]、在本發_穿孔枝巾錢频加 頭==衝頭導板，該衝頭導板具有當作前述衝 咖⑽單編號I 時的=衝頁頭的導引的功能，並且與前述衝 弗’貝/共32頁 1013218622-0 201242684 頭一體地下降及上升較佳。 藉由配設這種衝頭導板，使得衝頭導板在衝頭下降 及上升時可始終導引衝頭。因此，可更確實地防止衝頭 下降及上升時的衝頭的橫向搖擺，可高精度地進行衝頭 的導引《因此，通過被加工構件的衝頭更確實進入印模 的模孔。藉由進行這種動作，可將具有更高精度的直徑 的高品質的孔形成於被加工構件。 [11] 、在本發明的穿孔方法巾，前述印模是以具有 比前述被加工構件還尚的剛性及硬度的構件較佳。 據此，於在被加工構件形成孔時，可確實地支撐被 加工構件，並且可使印模不容易變形。 [12] 、在本發明的穿孔方法巾，前述印模為不錄鋼 (stainless steel)材較佳。 藉由印模使用不錢鋼材，可當作财久性 (durability)及剛性佳的印模。據此，可減少印模的厚 度’可南精度地形成開π小的微細的模孔。而且，可藉 由以印模為不錄鋼材而使印模的價格變便宜。此外，為 了更提高印模的収性及剛性，也可以對印模施以塗膜 (coating)(例如鈦塗膜（川如⑽⑶州叩）、金剛石 塗膜（diamond coating)等）。 [13] 在本發明的穿孔方法中前述印模的厚度為 20μπι〜100#m較佳。 藉由將印模的厚度抑制到這種厚度，可高精度地形 成開口小的微細的模孔。 [14 ]在本發明的穿孔方法中，前述印模對前述印 模支撐台可拆卸地被固定較佳。 而·产單編號规〇1 帛8頁/共32頁 1013218622-0 201242684 如此，藉由使印模對印模支撐台可拆卸，可容易更 換印模。據此，例如每次進行規定次數的在被加工構件 形成孔的程序，可將印模更換成新的印模，可始終使用 敢佳的狀態的印模形成孔。據此，可對被加工構件始終 形成高精度的孔》 [15] 、在本發明的穿孔方法中，形成於前述被加工 構件的孔為該孔的開口的平面形狀為圓形的孔較佳。 依照本發明的穿孔方法，可高精度地形成開口的平 Q 面形狀為圓形的孔（也稱為圓形孔）。此外，可在本發明 的穿孔方法中形成的圓形孔的直徑假定為2〇〇em以下， 也可形成100 A m進而50私m左右的圓形孔》 [16] 、本發明的穿孔裝置，是在被加工構件形成孔 ，其特徵包含：使用可形成與形成於前述被加工構件的孔 同等的孔的衝頭形成有模孔之印模；由該印模的下端面 的側支撐該印模之印模支撐台；驅動前述衝頭之衝頭驅 動裝置，前述印模被固定於前述印模支撐台的上端面， 〇 别述衝頭驅動裝置藉由自被承載於在被固定於前述印模 支撐台的上端面的狀態下被支撐的前述印模的前述被加 工構件的上方側使衝頭下降，以貫通前述被加工構件與 月'J述模孔，在前述被加工構件形成孔。 依照本發明的穿孔裝置，可盡可能減小衝頭與模孔 的餘隙，據此，可在被加工構件形成高精度的孔，特別 是可高精度地形成[//ID]單位的微細孔。而且，因本發明 的穿孔裝置無須對衝頭施以放電加工或進行再放電加工 之程序，故無須放電設備等的大規模的設備，並且可簡 化作業程序。 1〇11127〇产單蝙號 Αοίοι 此外，在本發明的穿孔裝置中也具有記載 第9頁/共32頁 1013218622-0 201242684 於上述[2]~[15]的特徵較佳。 【實施方式】 [0004] 1〇1謂产單編號 以下，針對本發明的實施形態進行說明。 [實施形態一] 圖1是用以說明與實施形態一有關的穿孔裝置丨〇而顯 不之局部刮面圖。圖2是放大圖1所示的穿孔裝置1〇的主 要部分而顯示之圖。圖3是用以說明與實施形態一有關的 穿孔裝置10中的穿孔方法而顯示之圖。此外，在與實施 形態一有關的穿孔裝置10中，形成於被加工構件5〇〇的孔 510(參照圖3(f))為開口的平面形狀為圓形的圓形孔， 且設其直徑（設為Φ1)為2〇〇"m。此外，在圖1〜圖3的各 圖中，各構成要素依照需要被誇張地描繪，未必成為由 同一比率構成的縮尺。 與實施形態一有關的穿孔裝置1〇如圖1及圖2所示具 有：使用衝頭1 0 0形成有模孔21 〇之印模2 〇 〇 ;由該印模 200的下端面的侧支撐印模2〇〇之印模支撐台3〇〇 ;驅動 衝頭100之衝頭驅動裝置4〇〇 ;具有衝頭1〇〇下降及上升 時的衝頭100的導引功能，並且具有在透過衝頭100形成 孔後，使該衝頭1〇〇由被加工構件5〇〇脫離的脫模具功能 之衝頭導板600。 印模200與印模支撐台300、衝頭導板600與印模支 律台300、衝頭導板6〇〇與衝頭驅動裝置4〇〇及被加工構 件500與印模支撑台3〇〇分別透過定位手段進行彼此的平 面視方向的定位。 该定位手段可藉由例如配設於一方側的導引軸，與 配*又於他方侧的導引孔構成。亦即若以印模2〇〇與印模支 A0101 第10頁/共32頁 1013218622-0 201242684 撐台300為例說明的話，則在印模支撐台3〇〇配設複數個 導引軸，並且在印模2〇〇配設複數個卡合於印模支撐台 300的各導引軸的導引孔，使印模支撐台3〇〇的各導引軸 插入印模2 0 0的各導引孔而將印模2 〇 〇安裝於印模支樓台 300。因此，可將印模200與印模支撐台3〇〇定位。此外 ，定位手段不是限於這種構造。 被加工構件500未被特別限定，在與實施形態—有關 的穿孔裝置10中是以塑膠膜（Plastic filro)，其厚度（ 設為tl)以SO/zn^ioogm。此外，當作被加工構件5〇〇的 〇 塑膠膜為規定的大小的板狀的塑膠膜也可以，而且為被 捲繞成輥子（roll)狀的長條塑膠膜也可以。 當被加工構件5〇〇為被捲繞成輥子狀的長條塑膠膜時 ，與實施形態一有關的穿孔裝置10可當作具有如下之構 成的穿孔裝置：例如將被捲繞成輥子狀的長條塑膠膜（未 圖示）設置於供給輥子（未圖示），在由該供給輥子沿著運 送方向運送長條塑膠膜而去的途中進行了孔形成程序後 ，透過捲繞輥子（未圖示）捲繞。 〇 印模200以具有比被加工構件5〇〇高的剛性及硬度的 構件形成。而且，印模2〇〇以具有比衝頭1〇〇低的剛性及 硬度的構件形成。再者，印模200以具有與被加工構件 500同程度的厚度的構件形成。此外，藉由適宜選擇諸條 件，印模200以具有與衝頭1〇〇同程度以上的高的剛性及 硬度的構件形成也可以，以比被加工構件500薄的構件或 厚的構件形成也可以。 而且’在與實施形態一有關的穿孔裝置1 〇中，印模 200使用不銹鋼材，設厚度（設為t2)為50/2m。此外，印 10111270^^51 A〇101 第 11 頁 / 共 32 頁 1013218622-0 201242684 模200的厚度t2不限於5〇 # m，可使用依照模孔21 〇的直 J如在2〇#m〜7〇vm的範圍中最佳的厚度的不鎮鋼材 〇 而且，設形成於印模200的模孔210與應形成於被加 工構件5〇〇的孔510的直徑(1^(200""相同直徑用以 形成該模孔210的衝頭，與於在被加工構件500形成孔 510時使用的衝頭是使用同一個衝頭而構成。 衝碩驅動裝置400具有：沿著圖！中的z軸使衝頭1〇〇 僅下降及上升規定量之衝頭驅動部（未圖示）；防止衝頭 ι〇0下降及上升時衝頭100在xy平面上橫向搖擺，在高精 度地保持衝碩100的真直度（straightness)的狀態下可 下降及上升於垂直方向（沿著z轴的方向）之導引機構 (guide mechanisin)(未圖示）。 印模支撐台300具有用以使通過模孔21〇的衝頭1〇〇 釋放到下方向的衝頭釋放孔31〇。再者，使模孔21〇的中 、軸與衝頭釋放孔31〇的中心軸一致而使印模2〇〇被固定 於印模支揮台3GG。此外，分別以符號u示模孔21〇的中 心軸與衝頭釋放孔31〇的中心轴。 將印模2〇〇固定於印模支撐台3〇〇的固定構件是使用 膜狀的黏膠帶（adhesive tape)33〇。亦即，藉由跨過 印模200的上端面與印模支撐台3〇〇的上端面而貼附黏膠 帶’將印模2〇〇固定於印模支撑台3〇〇。如此，藉由使用 黏膠帶300當作固定印模2〇〇的固定構件而具有可容易更 換印模200的優點，並且可防止在將被加工構件承載 於印模200時被加工構件500損傷。 m 此外’印模200的固定手段當然也可以使用黏膠帶以 101112701*單編號A01〇l 第12頁/共32頁 1013218622-0 201242684 外者’惟可確實將印模200固定於印模支撐台300，並且 印模200的更換容易，且不會使被加工構件500損傷的固 定構件較佳。 印模支樓台3〇〇的衝頭釋放孔310如顯示於圖2的虛 線圓A内，具有比模孔21()的直徑Φ1稱微大的直徑（設為 φ 2)。此外，圖2的虛線圓Α是顯示由下端面側看印模支 撐台300的情形的衝頭釋放孔31〇與模孔21〇的關係。By having such a punch through hole, when the punch is lowered and raised, the punching 100 does not sway laterally and can guide the punch with high precision. [8] In the piercing method of the present invention, the punch guide is set to be relatively sturdy in a state of being fixed to the stamp support. Thus, by arranging the punch guide in a state where it is fixed to the die support table, the guidance can be performed with high precision, and the action of disengaging the punch by the assisted member can be performed more compactly. In the piercing method of the present invention, the punch guide is preferably provided such that a distance between a lower end surface of the punching plate and an upper end surface of the workpiece is 0 < d3 $3 mm. By setting the lower end surface of the punch guide and the upper end surface of the workpiece to be such an interval, when the hole is formed in the member to be guarded, the object can be more arbitrarily set. It is the abutment position of the punch on the workpiece. Moreover, it can be performed more surely =. In addition, the intermediate value is preferably smaller, preferably 1 mm or less. UG], in the hair _ piercing towel money frequency plus head == punch guide, the punch guide has the function of guiding the punch head as the single coffee number (10) single number I, and The aforementioned Chongfu 'Bei/32 pages 1013218622-0 201242684 heads are preferably lowered and raised integrally. By providing such a punch guide, the punch guide can always guide the punch when the punch is lowered and raised. Therefore, it is possible to more reliably prevent the lateral sway of the punch when the punch is lowered and raised, and the punch can be guided with high precision. Therefore, the punch of the workpiece is surely entered into the die hole of the stamp. By performing such an operation, a high-quality hole having a diameter with higher precision can be formed on the member to be processed. [11] In the perforated method towel of the present invention, the stamp is preferably a member having rigidity and hardness which are further than the member to be processed. According to this, when the hole is formed in the member to be processed, the member to be processed can be surely supported, and the stamp can be prevented from being easily deformed. [12] In the perforated method towel of the present invention, the stamp is preferably a stainless steel material. By using the mold without using the steel, it can be used as a stamp with good durability and rigidity. According to this, it is possible to reduce the thickness of the stamp, and to form a fine mold hole having a small opening of π with a high precision. Moreover, the price of the stamp can be made cheap by using the stamp as a non-recorded steel. Further, in order to further improve the retractability and rigidity of the stamp, it is also possible to apply a coating to the stamp (e.g., a titanium coating film (Chuan Ru (10) (3), a diamond coating, etc.). [13] In the piercing method of the present invention, the thickness of the stamp is preferably 20 μm to 100 #m. By suppressing the thickness of the stamp to such a thickness, it is possible to form a fine mold hole having a small opening with high precision. In the piercing method of the present invention, the stamp is detachably fixed to the stamp support. And the number of the order number is 1 帛 8 pages / a total of 32 pages 1013218622-0 201242684 Thus, by making the stamp detachable from the stamp support table, the stamp can be easily replaced. According to this, for example, each time a predetermined number of times of forming a hole in the member to be processed is performed, the stamp can be replaced with a new stamp, and the stamp can be formed using the stamping state in a dazzling state. According to this, it is possible to form a high-precision hole for the workpiece to be processed. [15] In the piercing method of the present invention, it is preferable that the hole formed in the hole of the workpiece to be the opening of the hole has a circular shape in plan view. . According to the perforating method of the present invention, it is possible to form a hole (also referred to as a circular hole) having a circular chevron shape having a circular shape with high precision. Further, the diameter of the circular hole which can be formed in the perforation method of the present invention is assumed to be 2 〇〇 or less, and a circular hole of about 100 Å m and then about 50 m can be formed. [16] The perforating device of the present invention Forming a hole in the member to be processed, the method comprising: forming a die having a die hole using a punch capable of forming a hole equivalent to a hole formed in the workpiece to be processed; supporting the side of the lower end surface of the stamp a stamping support table of the stamp; a punch driving device for driving the punch, the stamp is fixed to an upper end surface of the stamp supporting table, and the punch driving device is fixed by being self-supported The upper side of the workpiece to be processed of the stamp supported by the upper end surface of the stamp support is lowered by a punch to penetrate the workpiece and the mold hole, and the workpiece is formed. hole. According to the perforating apparatus of the present invention, the clearance of the punch and the die hole can be reduced as much as possible, whereby the high-precision hole can be formed in the member to be processed, and in particular, the fineness of [//ID] unit can be formed with high precision. hole. Further, since the punching device of the present invention does not require the process of performing electric discharge machining or re-discharging processing on the punch, it is not necessary to have a large-scale apparatus such as a discharge device, and the work program can be simplified. 1〇11127〇单单号号 Αοίοι In addition, the perforating apparatus of the present invention also has a description of page 9 of 32 pages 1013218622-0 201242684. The features of [2] to [15] above are preferred. [Embodiment] [0004] 1〇1 is referred to as a production order number. Hereinafter, an embodiment of the present invention will be described. [First Embodiment] Fig. 1 is a partial plan view showing a perforating apparatus according to a first embodiment. Fig. 2 is a view showing an enlarged view of a main portion of the punching device 1A shown in Fig. 1. Fig. 3 is a view for explaining the method of perforating in the perforating apparatus 10 according to the first embodiment. Further, in the punching device 10 according to the first embodiment, the hole 510 (see FIG. 3(f)) formed in the workpiece 5 is a circular hole having a circular planar shape and a diameter thereof. (set to Φ1) is 2〇〇"m. Further, in each of Figs. 1 to 3, each constituent element is drawn exaggerated as necessary, and does not necessarily have to be a scale composed of the same ratio. The punching device 1 according to the first embodiment has a stamp 2 formed with a punch hole 21 使用 using a punch 100; and a side support of the lower end surface of the stamp 200. a stamping support 3 of the stamp 2; a punch driving device for driving the punch 100; having a guiding function of the punch 100 when the punch 1 is lowered and raised, and having a transmission function After the punch 100 is formed into a hole, the punch 1 is detached from the punch guide 600 of the mold release function which is detached from the workpiece 5. The stamp 200 and the stamp support table 300, the punch guide 600 and the stamping station 300, the punch guide 6 and the punch driving device 4, and the workpiece 500 and the stamp supporting table 3 〇 Positioning in the plane view direction of each other by means of positioning means. The positioning means can be constituted by, for example, a guide shaft disposed on one side and a guide hole on the other side. That is, if the stamp 2 and the stamp A0101 page 10/32 page 1013218622-0 201242684 the stand 300 are taken as an example, a plurality of guide axes are arranged on the die support table 3〇〇. And a plurality of guiding holes that are engaged with the guiding shafts of the die supporting table 300 are disposed in the stamp 2, so that the guiding axes of the stamp supporting table 3〇〇 are inserted into the respective stamps 200 The stamp 2 is used to mount the stamp 2 to the stamp stand 300. Therefore, the stamp 200 can be positioned with the stamp support table 3''. Further, the positioning means is not limited to this configuration. The member to be processed 500 is not particularly limited, and in the perforating device 10 relating to the embodiment, a plastic film (Plastic filro) having a thickness (set to t1) of SO/zn^ioogm is used. Further, the 塑胶 plastic film as the workpiece 5〇〇 may be a plate-shaped plastic film having a predetermined size, and may be a long plastic film wound into a roll shape. When the member to be processed 5 is a long plastic film wound into a roll shape, the punching device 10 according to the first embodiment can be regarded as a punching device having the following configuration: for example, it will be wound into a roller shape. A long plastic film (not shown) is placed on a supply roller (not shown), and a hole forming process is performed while the long supply of the plastic film is carried by the supply roller in the transport direction, and then the winding roller is passed through (not shown). Figure) Winding. The stamp 200 is formed of a member having rigidity and hardness higher than that of the workpiece 5 to be processed. Further, the stamp 2 is formed of a member having rigidity and hardness lower than that of the punch 1 . Further, the stamp 200 is formed of a member having the same thickness as the workpiece 500 to be processed. Further, the stamp 200 may be formed of a member having a high rigidity and hardness equal to or higher than the punch 1 by appropriately selecting the conditions, and may be formed of a member thinner than the member to be processed 500 or a thick member. can. Further, in the punching device 1 according to the first embodiment, the stamp 200 is made of a stainless steel material and has a thickness (set to t2) of 50/2 m. In addition, the printing 10111270^^51 A〇101 page 11 / total 32 page 1013218622-0 201242684 The thickness t2 of the die 200 is not limited to 5 〇 # m, can be used according to the die hole 21 〇 straight J as in 2 〇 #m~ In the range of 7 〇 vm, the optimum thickness of the non-town steel 〇 is further set to the diameter of the die hole 210 formed in the stamp 200 and the hole 510 which should be formed in the workpiece 5 ( (1^(200"" The punch having the same diameter for forming the die hole 210 is formed using the same punch as the punch used to form the hole 510 in the workpiece 500. The drive device 400 has: along the figure! The z-axis causes the punch 1 to be lowered and raised by a predetermined amount of the punch driving portion (not shown); the punch 100 is prevented from falling laterally on the xy plane when the punch ι〇0 is lowered and raised, and is held with high precision. A guide mechanism (not shown) that can be lowered and raised in the vertical direction (direction along the z-axis) in the straightness state of the Chongshu 100. The die support table 300 has a The punch 1〇〇 passing through the die hole 21〇 is released to the punch release hole 31〇 in the lower direction. Further, the die hole 2 is made. The center axis of the 1〇 axis coincides with the central axis of the punch release hole 31〇, so that the stamp 2〇〇 is fixed to the stamp support table 3GG. Further, the central axis and the punch of the die hole 21〇 are respectively indicated by the symbol u. The central axis of the head release hole 31. The fixing member for fixing the stamp 2 to the stamp support table 3 is a film-like adhesive tape 33. That is, by crossing the stamp The upper end surface of the 200 and the upper end surface of the stamp support table 3 are attached with an adhesive tape 'fixing the stamp 2 to the stamp support table 3'. Thus, by using the adhesive tape 300 as a fixed impression The fixing member of 2 turns has an advantage that the stamp 200 can be easily replaced, and the workpiece 500 can be prevented from being damaged when the member to be processed is carried on the stamp 200. m Further, the fixing means of the stamp 200 can of course be used. The adhesive tape is 101112701* single number A01〇l page 12/32 page 1013218622-0 201242684 The outer person can only fix the stamp 200 to the die support table 300, and the replacement of the stamp 200 is easy and does not A fixing member that damages the member to be processed 500 is preferable. The release hole 310 is shown in the dotted circle A of Fig. 2, and has a diameter (referred to as φ 2) which is slightly larger than the diameter Φ1 of the die hole 21 (). Further, the dotted circle 图 of Fig. 2 is shown by the lower end side Looking at the relationship between the punch release hole 31A and the die hole 21A in the case of the stamp support table 300.
在與實施形態—有關的穿孔裝置10中，衝頭釋放孔 310的直徑Φ2如圖2所示，比模孔21〇的直徑φΐ大而被 設定，但未必需要比模孔210的直徑φ 1大而設定，也可 以設兩者為相同直複。In the perforating device 10 relating to the embodiment, the diameter Φ2 of the punch releasing hole 310 is set as shown in FIG. 2 and larger than the diameter φ of the die hole 21〇, but the diameter φ 1 of the die hole 210 is not necessarily required. Large and set, you can also set the two to be the same straight.
亦即如圊2所示，在使衝頭釋放孔31〇及模孔21〇的 各個的中心軸L一致而將印模20〇固定於印模支撐台3〇〇時 ，中心轴L到衝頭釋放孔310的緣部的長度“（以為①之的 1/2。），與中心軸L到模孔210的緣部的長度(12((12為(1)1 的1/2。）被設定為dl2d2。而且，當在中不是 dl = d2，而是dl>d2而設定時，被設定為以與们的差 成為印模的厚度t2以下。在與實施形態一有關的穿孔裝 置1〇中，因設印模200的厚度七2為5〇_，故Λι就會是 50#m以下，惟在與實施形態一有關的穿孔裝置1〇中，將 △ 1設定為更小的值，設△hSMm。 而且，設印模200的厚度t2與印模支樓台3〇〇的厚度 (設為t3)的關係為t2<t3。而且，印模支撐台3〇〇為硬 度比印模200高的材質較佳’但印模支撐台3〇〇的材質無 須特別使用超硬材料。 衝頭導板600使該衝頭導板6〇〇的下端面與被加工構 101腦产單编號删1 第13頁/共32頁 1013218622-0 201242684 件咖的上端面的間隔具有規定的間隔（設為⑻而被固定 於印模支撐台300。但是，可依照被加卫構件_的厚度 U及印模的厚以2調整衝頭導板6_固定位置，以 便與該被加工構件500的上端面的間隔成為d3。 此外，設衝頭導板_與被加工構件5〇〇的間隔心為 〇. 3咖〜3. 0随的範圍内較佳，但抑制到i .。測以下更佳 。在與實施形態-有關的穿孔裝置1Q中，使衝頭導板6〇〇 的下端面與被加工構件5〇〇的上端面的間隔d3成為i 〇職 ，而使衝頭導板600被固定於印模支撐台3〇() ^如此，可 藉由更減小衝頭導板600與被加工構件5〇〇的間隔们而更 高精度地進行衝頭100的導引，並且可盡可能減少被加工 構件500被拉起到上方向時的被加工構件5〇〇的移動量。 而且，在衝頭導板600具有衝頭1〇〇可通過的孔61〇( 稱為衝頭通過孔610)，設該衝頭通過孔61〇的直徑（設為 φ3)與衝頭1〇〇的直徑，亦即模孔21〇為相同直徑較佳。 藉由具有這種衝頭通過孔610，在衝頭1〇〇下降及上升時 ’衝頭100不會橫向搖擺而可高精度地導引衝頭10〇。 針對使用與實施形態一有關的穿孔裝置1 〇於在被加 工構件500形成孔510時的程序’參照圖3進行說明。首先 將當作印模200的不銹鋼材承載於印模支撐台300的上端 面，透過黏膠帶330固定（參照圖3(a))。如此，將印模 200固定於印模支撐台300的狀態，是將於在被加工構件 5〇〇形成孔510時使用的衝頭1〇〇安裝於衝頭驅動裝置400 ’使該衝頭1〇〇下降並在印模200形成模孔210(參照圖 3(b))。此時，因衝頭1〇〇透過衝頭驅動裝置400的衝頭 導引機構（未圖示）與衝頭導板600導引，故不會橫向搖擺 101112701^單編號Α0101 第14頁/共32頁 1013218622-0 201242684 而沿著ζ抽下降。 此外，因此處是設在被加工構件5〇〇形成直徑φ1( 〇l=200 "m)的孔，故衝頭1〇〇是用以形成直·φι的孔 的衝頭。然後，若用以在印模200形成模孔21〇的程序結 束，則衝頭100上升。 其次，將被加工構件500承載於被固定於印模支撐台 300的印模200(參照圖3(C))，再度使衝頭100下降並在 5亥被加工構件500形成具有200 的直徑Φ1的孔51〇(參 …、圖3(d))。此時衝頭log也因透過衝頭驅動裝置“ο的 衝頭導引機構（未圖示）與衝頭導板6〇〇導引，故不會橫向 搖擺而沿著z軸下降。據此，衝頭1〇〇於在被加工構件5〇〇 穿通孔510後通過印模200的模孔21〇，進入形成於印模 支撐台30 0的衝頭釋放孔31〇。 Ο 但是，於透過衝頭1〇〇在被加工構件5〇〇形成孔時， 也對印模200施加由衝頭1〇〇產生的朝下方向的緊壓力且 有印模200變形之虞，但因印模2〇〇透過印模支撐台3〇〇 被由下侧支撐，故可防止印模2〇0的變形。 此乃因設印模支撐台3〇〇的衝頭釋放孔31〇的直徑φ 2為比模孔210的直徑φΐ稍微大的程度。亦即，乃因在與 實施形態一有關的穿孔裝置1〇中，衝頭釋放孔31〇的中心 軸L到該衝頭釋放孔31〇的緣部的長度dl，與模孔21〇的 中心軸L到該模孔210的緣部的長度d2的差△ j成為—點點 的差（^1=5^111)。 如此，因dl與d2的差△1為5//111左右，故成為到接 近印模200的模孔210的緣部的位置為止存在印模支撐台 300的衝頭釋放孔310的緣部的狀態《據此，因即使對印 10111270^^ 1013218622-0 201242684 模200的模孔21 0的緣部與其周邊施加由衝頭1〇〇產生的 朝下方向的緊壓力，印模2〇〇的模孔21〇的緣部與其周邊 也透過印模支撐台300被由下侧支撐，故可使印模2〇〇不 變形。 然後，若用以在被加工構件5〇〇形成孔51〇的程序結 束，則衝頭100上升。此時，也有衝頭1〇〇不由被加工構 件500的孔510脫離而被衝頭1〇〇拉起且被加工構件5〇〇也 上升的情形。但是，因在被加工構件5〇〇的上方配置有衝 頭導板600，故成為被衝頭1〇〇拉起的被加工構件5〇〇透 過衝頭導板600限制更進一步的上升的狀態（參照圖 3(e))。據此，成為衝頭1〇〇由被加工構件5〇〇的孔Η。脫 離且僅衝頭1〇〇上升而去被加工構件㈣被返回到印模 200的上端面的狀態（參照圖3(f))。 可藉由圖3(a)〜圖3⑴所示的程序在被加工構件 500形成孔510。 如以上說明的，在與實施形態-有關的穿孔震置10 中，使用於在被加工構件500形成孔510時使用的衝頭 1〇0形成形成於印模2〇〇的模孔210。據此，因形成於印 模200的模孔210的直徑Φ1與應形成於被加工構件500的 成相同直’故模孔21G與衝頭1QG的餘隙幾乎成 為零。 一另-方面’因在衝頭1〇〇下降及上升時，透過配設於 衝頭獎動袈置400的導引機構（未圖示）及衝頭導板600， 衝頭1〇〇不會橫向搖擺而在衝頭⑽的真直度被保持的狀 I、下衝頭100下降及上升，故通過了被加工構件500的衝 頭100確實進入印模200的模孔210。 表單編號A0101 10111270广 第16頁/共32頁 1013218622-0 201242684 藉由進行這種動作，依照與實施形態一有關的穿孔 裝置ίο，可將具有所需的高精度的直徑的高品質的孔形 成於被加工構件500。一例為在以銅箔包覆塑膠膜的兩面 的3層的可撓性基板（flexibleboard)形成200 //m的直 徑的孔後，確認了在孔的緣部不產生毛邊（burr)等，可 形成具有高精度的直徑的高品質的孔。 而且在與實施形態一有關的穿孔裝置10中，因印模 200透過黏膠帶330被固定於印模支撐台300，故僅藉由 剝離黏膠帶330就能容易地卸下印模200。因此，可容易 更換印模200。即使在更換印模200的情形下，使用新的 印模200(模孔被形成前的印模200)進行圖3(3)~圖3(〇 所示的程序也可以。 如此，因可容易更換印模2 0 0，故例如每次進行規定 次數的對被加工構件500形成孔510的程序，將印模200 更換成新的印模200成為可能，可使用始終最佳的狀態的 印模200形成孔。據此，可對被加工構件500始終形成高 精度的孔。 [實施形態二] 圖4是用以說明與實施形態二有關的穿孔裝置20中的 穿孔方法而顯示之圖。 與實施形態一有關的穿孔裝置10如圖1〜圖3所示， 具有衝頭100下降及上升時的衝頭100的導引功能，並且 具有在透過衝頭100形成孔後，使該衝頭100由被加工構 件500脫離的脫模具功能之衝頭導板600被固定於印模支 撐台300。 相對於此，與實施形態二有關的穿孔裝置20為使具 1013218622-0 第17頁/共32頁 201242684 有衝頭100的導引功能的衝頭導板7⑽與衝頭⑽一體地 下降及上升而構成。 ，與實施形態二有關的穿孔裝置2〇如圖4所示具有：使 用山衝頭100形成有模孔21〇之印模200 ·，由該印模200的下 端面的側支#印模_之印模支轉台302 ;驅動衝頭100 之衝頭驅動裝置400 ;具有衝頭_下降及上升時的衝頭 100的導引功能’並且與該衝頭一體地下降及上升之 衝頭導板700 ;進行衝頭導板700下降及上升時的導引之 導引軸71 〇、71 〇。 與實施形態二有關的穿孔裝置2〇除了衝頭導板7〇〇 與衝頭100-體地下降及上升、具有導引軸71〇、71〇' 印模支撐台302保持導引軸71〇、71〇之外，其餘大致和 與實施形態-有關的穿孔裝置1Q的構造一樣。因此，衝 頭100 '印模200及被加工構件5〇〇與實施形態--樣被 使用。 針對使用與實施形態二有關的穿孔裝置2〇於在被加 工構件500形成孔51〇時的程序，參照圖4進行說明。首先 與實施形態一一樣，將當作印模2〇()的不銹鋼材承載於印 模支撐台302的上端面，與實施形態——樣透過黏膠帶 330固定（參照圖4(a))。 如此’將印模200固定於印模支撐台302的狀態，是 將於在被加工構件500形成孔510時使用的衝頭1〇〇安裝 於衝頭驅動裝置400，使該衝頭1〇〇、衝頭導板7〇〇及衝 頭驅動裝置400同時下降並在印模2〇〇形成模孔21 〇(參照 圖4(b)) 〇此時’衝頭導板7〇〇被複數個導引軸71〇、71〇 導引並下降。此時，因衝頭1〇〇透過衝頭驅動裝置4〇〇的 101112701^單編號A0101 第18頁/共32頁 1013218622-0 201242684 衝頭導引機構（未圖示）與衝頭導板700導引，故不會橫向 搖擺而沿著z軸下降。若用以在印模2〇〇形成模孔21〇的程 序結束，則衝頭1〇〇上升到圖4(a)的規定位置。 其次，將被加工構件500承載於被固定於印模支撐台 302的印模200(參照圖4(c))。此時被加工構件5〇〇在運 送方向中的穿孔裝置20的前後位置中，表面側的規定部 分透過按壓構件（未圖示）按壓。如此，再度使衝頭1〇〇下 降並在該被加工構件500形成具有2〇〇//m的直徑φι的孔 510(參照圖4(d))。此時衝頭1〇〇也因透過衝頭驅動裝置 4〇〇的衝頭導引機構（未圖示）與衝頭導板7〇〇導引，故不 會橫向搖擺而沿著ζ軸下降。據此，衝頭1〇〇於在被加工 構件500穿通孔51〇後通過印模2〇〇的模孔210 ,進入形成 於印模支撐台302的衝頭釋放孔312。 然後，若用以在被加工構件5〇〇形成孔51〇的程序結 束，則衝頭100上升〇此時，衝頭lQ〇不由被加工構件 500的孔510脫離而透過衝頭被加工構件5〇〇也想上升 。但是，因被加工構件500如上述，表面侧的規定部分透 過按壓構件按壓，故成為上升被限制的狀態（參照圖 4(e))。此外，用以限制被加工構件5〇〇的上升的手段也 可以是按壓構件以外，例如將被加工構件5〇〇暫時固定於 印模支撐台302的黏膠帶也可以。 然後，衝頭100更進一步上升，衝頭1〇〇由被加工構 件500的孔510脫離，在上升到圖4(a)所示的位置的狀態 下停止。此時，被加工構件5〇〇停在印模2〇〇的上端面（參 照圖4(f))。 lonmo产單編號A0101 可藉由圖4(a)〜圖4(f)所示的程序在被加工構件 第19頁/共32頁 1013218622-0 201242684 500形成孔510。 如以上說明的，在與實施形態二有關的穿孔裝置2〇 中，與實施形態--樣，因形成於印模200的模孔21〇的 直徑Φ1與應形成於被加工構件50〇的孔510成相同直徑， 故模孔210與衝頭100的餘隙幾乎成為零。That is, as shown in FIG. 2, when the center axis L of each of the punch release hole 31 and the die hole 21 is aligned to fix the stamp 20 to the stamp support table 3, the center axis L is rushed. The length of the edge portion of the head release hole 310 "(is 1/2 of 1), and the length from the central axis L to the edge of the die hole 210 (12 (12 is 1/2 of (1) 1). It is set to dl2d2. When it is not dl=d2 but dl>d2, the difference is set to be equal to or less than the thickness t2 of the stamp. The punching apparatus 1 according to the first embodiment In the case, since the thickness of the stamp 200 is set to 5 〇 _, the Λ ι is 50 # m or less, but in the punching device 1 有关 related to the first embodiment, Δ 1 is set to a smaller value. Further, ΔhSMm is set. Further, the relationship between the thickness t2 of the stamp 200 and the thickness (set to t3) of the stamp stand 3 (t3) is t2 < t3. Moreover, the stamp support table 3 is a hardness ratio stamp. The material with a height of 200 is better. 'But the material of the die support table 3无 does not need to use a super hard material. The punch guide 600 makes the lower end surface of the punch guide 6〇〇 and the processed body 101 No. 1 Page 13 of 32 page 1013218622-0 201242684 The interval between the upper end faces of the coffee beans has a predetermined interval (set to (8) and is fixed to the die support table 300. However, it can be in accordance with the thickness U of the member to be cured _ and The thickness of the die is adjusted by 2 to fix the position of the punch guide 6_ so that the distance from the upper end surface of the workpiece 500 becomes d3. Further, the gap between the punch guide _ and the workpiece 5 is set to 〇 3 is preferably in the range of 0 to 0, but is suppressed to i. It is more preferable to measure the following. In the perforating device 1Q relating to the embodiment, the lower end surface of the punch guide 6〇〇 is The interval d3 of the upper end surface of the machined member 5〇〇 becomes i 〇, and the punch guide 600 is fixed to the stamp support table 3〇(). Thus, the punch guide 600 and the quilt can be further reduced. The distance between the processing members 5〇〇 is guided by the punch 100 with higher precision, and the amount of movement of the workpiece 5〇〇 when the workpiece 500 is pulled up is minimized as much as possible. The punch guide 600 has a hole 61 〇〇 through which the punch 1 〇〇 passes (referred to as a punch through hole 610), and the punch is passed through The diameter of 61〇 (set to φ3) is preferably the same as the diameter of the punch 1〇〇, that is, the die hole 21〇 is the same diameter. By having such a punch through the hole 610, the punch 1 〇〇 drops and rises. When the punch 100 does not sway laterally, the punch 10 can be guided with high precision. The procedure for using the punching device 1 according to the first embodiment to form the hole 510 in the workpiece 500 is described with reference to FIG. First, the stainless steel material as the stamp 200 is first placed on the upper end surface of the stamp support table 300, and fixed by the adhesive tape 330 (refer to Fig. 3 (a)). As described above, in a state in which the stamp 200 is fixed to the stamp supporting table 300, the punch 1 used when the hole 510 is formed in the workpiece 5 is attached to the punch driving device 400'. The crucible is lowered and a die hole 210 is formed in the stamp 200 (refer to FIG. 3(b)). At this time, since the punch 1 is guided by the punch guiding mechanism (not shown) of the punch driving device 400 and the punch guide 600, it does not laterally sway 101112701^single number Α0101 page 14/total 32 pages 1013218622-0 201242684 and descending along the raft. Further, therefore, a hole having a diameter φ1 (〇1 = 200 " m) is formed in the workpiece 5, so that the punch 1 is a punch for forming a hole of straight φι. Then, if the program for forming the die hole 21〇 in the stamp 200 is completed, the punch 100 is raised. Next, the workpiece 500 is placed on the stamp 200 fixed to the stamp support table 300 (see Fig. 3(C)), and the punch 100 is again lowered and formed into a diameter Φ1 of 200 at the workpiece 5 The hole 51〇 (see..., Fig. 3(d)). At this time, the punch log is also guided by the punch guide mechanism (not shown) and the punch guide 6A through the punch driving device ο, so that it does not sway laterally and descends along the z-axis. The punch 1 passes through the die hole 21 of the stamp 200 after passing through the through hole 510, and enters the punch release hole 31〇 formed in the stamp support table 30 0. Ο However, When the punch 1 is formed into a hole in the workpiece 5, the stamp 200 is also applied with a pressing force in the downward direction by the punch 1 and the stamp 200 is deformed, but the stamp 2 is used. 〇〇 is supported by the lower side through the die support table 3, so deformation of the stamp 2〇0 can be prevented. This is because the diameter φ 2 of the punch release hole 31〇 of the stamp support table 3〇〇 is The diameter φ 比 of the die hole 210 is slightly larger. That is, in the punching device 1 有关 related to the first embodiment, the center axis L of the punch release hole 31 到 to the edge of the punch release hole 31 〇 The difference Δj between the length d1 of the portion and the central axis L of the die hole 21〇 to the length d2 of the edge of the die hole 210 becomes a difference of dots (^1=5^111). Thus, due to dl Since the difference Δ1 of d2 is about 5//111, the state of the edge of the punch release hole 310 of the stamp support table 300 is set to the position close to the edge of the die hole 210 of the stamp 200. Since the pressing force of the punch 1 〇〇 is applied to the edge of the die hole 21 0 of the die 10111270^^ 1013218622-0 201242684 die 200, the die hole 21 of the stamp 2〇〇 The edge portion and its periphery are also supported by the lower side through the stamp support table 300, so that the stamp 2 can be prevented from being deformed. Then, if the program for forming the hole 51 in the workpiece 5 is finished, the punch is punched. At this time, there is a case where the punch 1 is not pulled by the hole 510 of the workpiece 500 and is pulled up by the punch 1 and the workpiece 5 is also raised. However, due to the workpiece being processed When the punch guide 600 is disposed above the fifth turn, the workpiece 5 that is pulled up by the punch 1 is restricted from rising beyond the punch guide 600 (refer to FIG. 3(e). According to this, the punch 1 is turned into a hole by the workpiece 5, and the punch is lifted and only the punch 1 is raised. The workpiece (4) is returned to the upper end surface of the stamp 200 (see Fig. 3(f)). The hole 510 can be formed in the workpiece 500 by the procedure shown in Figs. 3(a) to 3(1). In the perforation vibrating body 10 relating to the embodiment, the punch 1〇0 used for forming the hole 510 in the workpiece 500 is formed into the die hole 210 formed in the stamp 2〇〇. Since the diameter Φ1 of the die hole 210 formed in the stamp 200 is the same as that which should be formed in the workpiece 500, the clearance of the die hole 21G and the punch 1QG becomes almost zero. In the other aspect, the punch 1 is not passed through the guide mechanism (not shown) and the punch guide 600 disposed in the punch jack 400 when the punch is lowered and raised. When the straightness of the punch (10) is maintained and the lower punch 100 is lowered and raised, the punch 100 that has passed through the workpiece 500 is surely entered into the die hole 210 of the stamp 200. Form No. A0101 10111270 Wide 16th page / Total 32 page 1013218622-0 201242684 By performing such an operation, according to the perforating device ίο related to the first embodiment, a high-quality hole having a desired high-precision diameter can be formed. The workpiece 500 is processed. In one example, after forming a hole having a diameter of 200 //m on a three-layer flexible board on both sides of a plastic film coated with a copper foil, it was confirmed that no burr or the like was generated at the edge of the hole. A high quality hole having a high precision diameter is formed. Further, in the punching device 10 according to the first embodiment, since the stamp 200 is fixed to the stamp supporting table 300 through the adhesive tape 330, the stamp 200 can be easily removed only by peeling off the adhesive tape 330. Therefore, the stamp 200 can be easily replaced. Even in the case of replacing the stamp 200, the new stamp 200 (the stamp 200 before the die hole is formed) is used to perform the procedure shown in Figs. 3(3) to 3 (〇). Since the stamp 200 is replaced, it is possible to replace the stamp 200 with a new stamp 200 by using a procedure for forming the hole 510 for the workpiece 500 every predetermined number of times, and it is possible to use the stamp which is always in the optimum state. According to this, a high-precision hole can be formed in the workpiece to be processed 500. [Embodiment 2] Fig. 4 is a view for explaining a perforation method in the punching device 20 according to the second embodiment. As shown in FIGS. 1 to 3, the perforating device 10 according to the first embodiment has a guiding function of the punch 100 when the punch 100 is lowered and raised, and has a punch 100 after the punch 100 is formed into a hole. The punch guide 600 of the mold release function, which is detached from the workpiece 500, is fixed to the stamp support table 300. On the other hand, the punching device 20 according to the second embodiment has a 1013218622-0 page 17 of 32 Page 201242684 Punch guide 7 (10) with the guiding function of the punch 100 The head (10) is integrally lowered and raised. The punching device 2 according to the second embodiment has a stamp 200 formed with a die hole 21 by using a mountain punch 100, and the stamp 200 is formed by the stamp 200. a side branch of the lower end face of the die_printer support plate 302; a punch drive device 400 for driving the punch 100; a guiding function of the punch 100 with a punch_down and ascending' and with the punch The punch guide 700 that is integrally lowered and raised; the guide shafts 71 71, 71 导引 for guiding the lower and the rising of the punch guide 700. The punching device 2 related to the second embodiment except the punch guide 7〇〇 and the punch 100 are physically lowered and raised, and have guide shafts 71〇, 71〇'. The die support table 302 holds the guide shafts 71〇, 71〇, and the rest is substantially related to the embodiment. The punching device 1Q has the same structure. Therefore, the punch 100' stamp 200 and the workpiece to be processed 5 are used in the same manner as the embodiment. The punching device 2 relating to the second embodiment is used in the workpiece 500. The procedure for forming the hole 51〇 will be described with reference to Fig. 4. First, with the first embodiment Similarly, the stainless steel material as the stamp 2 (() is carried on the upper end surface of the stamp support table 302, and is fixed to the embodiment-like sample through the adhesive tape 330 (refer to Fig. 4 (a)). The die 200 is fixed to the die support table 302, and the punch 1 used when the hole 510 is formed in the workpiece 500 is attached to the punch driving device 400, so that the punch 1 and the punch are guided. The plate 7 and the punch driving device 400 are simultaneously lowered and a die hole 21 is formed in the stamp 2 (refer to FIG. 4(b)). At this time, the punch guide 7 is guided by a plurality of guide shafts 71. 〇, 71〇 guide and drop. At this time, the punch guide mechanism (not shown) and the punch guide 700 are transmitted through the punch drive unit 4, 101112701, single number A0101, page 18, and 32 pages, 1013218622-0, 201242684. Guided, so it does not sway laterally and descends along the z-axis. When the procedure for forming the die hole 21〇 in the stamp 2 is completed, the punch 1〇〇 is raised to the predetermined position shown in Fig. 4(a). Next, the workpiece 500 is placed on the stamp 200 fixed to the stamp support table 302 (see Fig. 4(c)). At this time, the predetermined portion of the surface side is pressed by the pressing member (not shown) in the front and rear positions of the punching device 20 in the transport direction. In this way, the punch 1 is again lowered and a hole 510 having a diameter φ of 2 〇〇 / / m is formed in the workpiece 500 (see Fig. 4 (d)). At this time, the punch 1〇〇 is also guided by the punch guiding mechanism (not shown) passing through the punch driving device 4〇〇 and the punch guide 7〇〇, so that it does not sway laterally and descends along the cymbal axis. . According to this, the punch 1 passes through the die hole 210 of the stamp 2 after passing through the through hole 51 of the processed member 500, and enters the punch release hole 312 formed in the stamp support table 302. Then, when the program for forming the hole 51 in the workpiece 5 is completed, the punch 100 is raised. At this time, the punch lQ is not detached from the hole 510 of the workpiece 500 and passes through the punch member 5. I also want to rise. However, as described above, the predetermined portion on the surface side is pressed by the pressing member, so that the rising is restricted (see Fig. 4(e)). Further, the means for restricting the rise of the workpiece 5 may be an adhesive tape other than the pressing member, for example, the workpiece member 5 is temporarily fixed to the stamp support table 302. Then, the punch 100 is further raised, and the punch 1 is detached from the hole 510 of the workpiece 500, and is stopped in a state of rising to the position shown in Fig. 4(a). At this time, the workpiece 5 is stopped at the upper end surface of the stamp 2 (refer to Fig. 4 (f)). The lonmo order number A0101 can be formed by the program shown in Figs. 4(a) to 4(f) on the workpiece member page 19/32 page 1013218622-0 201242684 500. As described above, in the punching device 2 according to the second embodiment, the diameter Φ1 of the die hole 21〇 formed in the stamp 200 and the hole to be formed in the workpiece 50 are formed in the same manner as the embodiment. 510 is the same diameter, so that the clearance between the die hole 210 and the punch 100 becomes almost zero.
另一方面，因衝頭導板7〇〇在衝頭1〇〇下降及上升時 ，可始終導引衝頭100，故可更確實防止衝頭1〇〇下降及 上升時的衝頭100的橫向搖擺，可高精度地進行衝頭1〇〇 的導引。因此，通過了被加工構件500的衝頭1〇〇更確實 進入印模200的模孔210。藉由進行這種動作，可將具有 更高精度的直徑的高品質的孔形成於被加工構件5〇〇。 此外’本發明不限於上述實施形態，在不脫離本發 明的要旨的範圍種種變形實施為可能。例如如下所示的 變形實施也可能。 (1)、在與各實施形態有關的穿孔裝置10、2〇中， 雖然舉例說明了形成於被加工構件5GQ的孔51()的直徑以 200 /zm的情形，但本發明不被限定於此。本發明也能形 成更小的直徑的孔，例如也能形成具有1QMm進而^ 的直徑的孔。此情形’⑽比被加工構件_的厚度小( 孔也能容易形成。On the other hand, since the punch guide 7 can always guide the punch 100 when the punch 1 is lowered and raised, the punch 100 can be more reliably prevented from falling and rising. The horizontal sway can guide the punch 1高精度 with high precision. Therefore, the punch 1 that has passed through the workpiece 500 is more surely entered into the die hole 210 of the stamp 200. By performing such an operation, a high-quality hole having a diameter with higher precision can be formed on the workpiece 5〇〇. Further, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention. For example, a variant implementation as shown below is also possible. (1) In the perforating apparatuses 10 and 2 according to the respective embodiments, the diameter of the hole 51 () formed in the workpiece 5GQ is 200 / zm, but the present invention is not limited thereto. this. The present invention is also capable of forming pores of a smaller diameter, for example, holes having a diameter of 1 QMm and further can be formed. In this case, (10) is smaller than the thickness of the member to be processed (the hole can be easily formed.
而且’在接近這種小徑的孔的狀態下形成複數個時 ’在相鄰的孔彼此中的緣與緣的間隔比各孔的孔握小的 情形下也能容易形成該等各孔。 ⑺、在上述各實施形態中’雖然舉例說明了形成方 破加工構件500的孔51〇為開口的平面形狀為圓形的孔（0 1〇11127〇产單編號 ΑΟίοι ^孔）的情形，但本發明不被限定於i也能適用於例如 第20頁/共32頁 1013218622-0 201242684 開口的平面形狀形成橢圓形、矩形、三角形等種種的形 狀的孔的情形。 (3) 、在上述各實施形態中，雖然舉例說明了印模 200使用不銹鋼的情形，但本發明不被限定於此。例如對 該不銹鋼施以金剛石塗膜、鈦塗膜等的塗模也可以。而 且，若為具有比被加工構件500高的剛性及硬度且具有規 定的财久性的構件，則不限於不銹鋼。例如鋼及皱銅 (beryllium copper)也可以，進行了硬化熱處理 (hardening heat treatment)的不銹鋼、鋼及鈹銅也 ^ 能適用。也能使用其他的較硬質的金屬。 (4) 、顯示在各實施形態中所示的各部的尺寸的值為 一例，當然可適宜設定最佳的值。 (5) 、在各實施形態中’雖然被加工構件5〇〇舉例說 明了塑膠膜，但本發明不被限定於此。例如若為剛性及 硬度比印模2〇〇低的素材，則塑膠膜以外也可以。 (6) '在各實施形態中，雖然以黏膠帶將印模2〇〇固 q 定於印模支撐台300、302時，跨過印模200的上端面的 約略全體與印模支撐台300、302的上端面而貼附黏膠帶 ，但本發明不被限定於此》例如跨過僅靠近印模200的緣 部的上端面與印模支撐台300、302的上端面而貼附黏膠 帶也可以。此情形，若印模200具有遠比被加工構件500 大的外形而構成的話，則也能使被加工構件500的下端面 不接觸黏膠帶。 (7) 、在各實施形態中，雖然藉由跨過印模200的上 端面與印模支撐台300、302的上端面而貼附黏膠帶，將 印模200固定於印模支撐台30 0、302，佴本發明不被限 101112701^W A〇101 第 21 頁 / 共 32 頁 1〇13218622-〇 201242684 定於此。例如使用兩面黏膠帶當作黏膠帶，藉由使該兩 面黏膠帶介於印模2GG的下端面與印模支撐台3Q()、3〇2 的上端面之間而將印模2_定於印模支樓台咖、3〇2 也可以。 ⑻、與實施形態二有關的穿孔裝置2〇雖然是具有 衝頭100的導引功能的衝頭導板7〇〇與該衝頭1〇〇 —體地 下降及上升’但本發明不被限定於此。例如不使衝頭導 板700的下降及上升連動於衝頭100的下降及上升也可以 〇 例如由再度使衝頭100下降並在被加工構件500形成 孔510的狀態（相當於圖4⑷的程序）到成為衝頭⑽再度 上升到由被加工構件500的孔51〇脫出的位置的狀態（類似 圖4(f)的程序）之間，衝頭導板7〇〇將被加工構件的 表面緊壓於印模支撐台302側，或者在被加工構件5〇〇的 表面近旁位置使其停止也可以。藉由以這種構造，也能 無須如實施形態二般的按麋被加工構件5〇〇的表面側的按 壓構件。此情形因衝頭導板7〇〇緊壓被加工構件5〇〇的表 面或者在被加工構件5〇〇的表面近旁位置停止，故在衝頭 100下降並於被加工構件500形成孔51〇(相當於圖4(d)的 程序）時，以及在衝頭100上升並再度上升到由被加工構 件500的孔510脫出的位置（類似圖4(f)的程序）時，可防 止被加工構件500上下移動。因此，可形成具有更高精度 的直徑的高品質的孔。 (9)、在各實施形態中’雖然藉由衝頭導板600、 700導引的衝頭10〇的部分為形成印模2〇〇的模孔21〇，或 形成被加工構件5〇〇的孔51〇的頂端側部分，但本發明不 101112701^單編號A0101 帛22頁/共32百 1013218622-0 201242684 被限定於此。例如也可以為在衝頭1〇〇中在衝頭驅動裝置 400侧構成，直徑比上述的頂端侧部分大的徑大部。 (10 )、在各實施形態中，雖然在被加工構件5 〇 〇形 成孔510的程序（參照圖3(d)及圖4(d))被使用的衝頭 1 〇〇是使用在印模200形成模孔210的程序（參照圖3(b)及 圖4(b))被使用的衝頭1〇〇，但本發明不被限定於此。例 如在被加工構件500形成孔510的程序被使用的衝頌使用 與在印模200形成模孔210的程序被使用的衝頭1〇〇不同 的衝頭也可以。 ❹ [0005] C) [0006] 【圖式簡單說明】 圖1是用以說明與實施形態一有關的穿孔裝置1〇而顯 示之局部剖面圖。 圖2是放大圖1所示的穿孔裝置10的主要部分而顯示 之圖。 圖3是用以說明與實施形態一有關的穿孔裝置中的 穿孔方法而顯示之圖。 圖4是用以說明與實施形態二有關的穿孔装置2〇中的 穿孔方法而顯示之圖。 圖5是用以說明習知的穿孔裝置9〇〇而顯示之圖。 【主要元件符號說明】 10、20、900:穿孔裝置 100、910:衝頭 200:印模 210、931:模孔 300、302:印模支撑台 1013218622-0 第23頁/共32頁 201242684 310:衝頭釋放孔 330:黏膠帶 400 :衝頭驅動裝置 500、96(h被加工構件 510 :孔 600、700:衝頭導板 610:衝頭通過孔 710:導引軸 920:衝頭驅動裝置 ξ 930 :模 ' 940:台支撐部 9 5 0 :放電線 L:模孔210的中心軸與衝頭釋放孔310的中心軸 1〇ηι27〇ί^單編號 Α0ΗΠ 1013218622-0 第24頁/共32頁Further, when a plurality of holes are formed in a state close to the hole of such a small diameter, the holes can be easily formed in a case where the distance between the edges and the edges of the adjacent holes is smaller than the hole holding of the holes. (7) In the above-described respective embodiments, the case where the hole 51 形成 forming the square breaking member 500 is a circular hole having a circular shape (0 1〇11127〇 single number ΑΟίοι ^ hole) is exemplified, but The present invention is not limited to the case of i, and can be applied, for example, to the case where the planar shape of the opening forms a hole of various shapes such as an ellipse, a rectangle, or a triangle, for example, on page 20 of 32 pages. (3) In the above embodiments, the case where the stamp 200 is made of stainless steel is exemplified, but the present invention is not limited thereto. For example, a coating film such as a diamond coating film or a titanium coating film may be applied to the stainless steel. Further, the member is not limited to stainless steel because it has a rigidity and hardness higher than that of the workpiece 500 and has a predetermined richness. For example, steel and beryllium copper may be used, and stainless steel, steel, and beryllium copper which have been subjected to hardening heat treatment are also applicable. Other harder metals can also be used. (4) The values of the sizes of the respective portions shown in the respective embodiments are shown as an example. Of course, an optimum value can be appropriately set. (5) In the respective embodiments, the plastic film is exemplified by the member to be processed 5, but the present invention is not limited thereto. For example, if the material has a rigidity and a hardness lower than that of the stamp 2, the plastic film may be used. (6) 'In each of the embodiments, when the stamp 2 is fixed to the stamp supporting tables 300 and 302 by the adhesive tape, the approximate entire upper end surface of the stamp 200 and the stamp supporting table 300 are crossed. The adhesive tape is attached to the upper end surface of the 302, but the present invention is not limited thereto. For example, the adhesive tape is attached across the upper end surface of the edge portion of the stamp 200 and the upper end surface of the stamp support table 300, 302. Also. In this case, if the stamp 200 has a shape that is much larger than the shape of the workpiece 500, the lower end surface of the workpiece 500 can be prevented from contacting the adhesive tape. (7) In each of the embodiments, the stamp 200 is attached to the stamp support table 30 by attaching the adhesive tape across the upper end surface of the stamp 200 and the upper end faces of the stamp support tables 300 and 302. 302, 佴 The present invention is not limited to 101112701^WA〇101 Page 21 of 32 1〇13218622-〇201242684 is here. For example, a double-sided adhesive tape is used as the adhesive tape, and the stamp 2_ is set by placing the two-sided adhesive tape between the lower end surface of the stamp 2GG and the upper end surface of the stamp support table 3Q(), 3〇2. It is also possible to use the impression building desk coffee, 3〇2. (8) The punching device 2 according to the second embodiment is a punch guide 7 having a guiding function of the punch 100, and the punch 1 is lowered and raised integrally, but the present invention is not limited. herein. For example, the lowering and rising of the punch guide 700 without causing the lowering and the rising of the punch 100 may be performed, for example, by lowering the punch 100 again and forming the hole 510 in the workpiece 500 (corresponding to the procedure of FIG. 4 (4)). Between the state in which the punch (10) is again raised to the position where the hole 51 of the workpiece 500 is removed (similar to the procedure of FIG. 4(f)), the punch guide 7 is to be the surface of the member to be processed. It may be pressed against the side of the die support table 302 or may be stopped at a position near the surface of the workpiece 5〇〇. With this configuration, it is possible to eliminate the pressing member on the surface side of the workpiece member 5 according to the second embodiment. In this case, since the punch guide 7 is pressed against the surface of the workpiece 5 or is stopped at the vicinity of the surface of the workpiece 5, the punch 100 is lowered and the hole is formed in the workpiece 500. (corresponding to the procedure of FIG. 4(d)), and when the punch 100 rises and rises again to a position where it is released from the hole 510 of the workpiece 500 (similar to the procedure of FIG. 4(f)), it can be prevented from being The processing member 500 moves up and down. Therefore, a high-quality hole having a diameter with higher precision can be formed. (9) In each of the embodiments, the portion of the punch 10 that is guided by the punch guides 600, 700 is the die hole 21 of the stamp 2, or the workpiece is formed. The top side portion of the hole 51〇, but the present invention is not limited to 101112701^ single number A0101 帛 22 pages / total 32 hundred 1013218622-0 201242684 is limited thereto. For example, it may be formed on the side of the punch driving device 400 in the punch 1 , and the diameter may be larger than the above-described distal end portion. (10) In each of the embodiments, the punch 1 used in the process of forming the hole 510 in the workpiece 5 (see FIGS. 3(d) and 4(d)) is used in the stamp. The program for forming the die hole 210 (see FIGS. 3(b) and 4(b)) is used, but the present invention is not limited thereto. For example, a punch for forming a hole 510 in the workpiece 500 may be used with a punch different from the one used for forming the die 210 in the stamp 200. [0005] C) [0006] BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a partial cross-sectional view showing a perforating apparatus 1 according to a first embodiment. Fig. 2 is a view showing an enlarged main portion of the punching device 10 shown in Fig. 1. Fig. 3 is a view for explaining the method of perforating in the perforating apparatus according to the first embodiment. Fig. 4 is a view for explaining a method of perforating in the punching device 2 according to the second embodiment. Fig. 5 is a view for explaining a conventional perforating device 9'. [Main component symbol description] 10, 20, 900: punching device 100, 910: punch 200: stamp 210, 931: die hole 300, 302: die support table 1013218622-0 page 23 / total 32 pages 201242684 310 : Punch release hole 330: adhesive tape 400: punch driving device 500, 96 (h processed member 510: hole 600, 700: punch guide 610: punch through hole 710: guide shaft 920: punch drive Device 930 930 : Die ' 940 : Table support portion 9 5 0 : Discharge line L: Center axis of the die hole 210 and the center axis of the punch release hole 310 1〇ηι27〇ί^ Single number Α0ΗΠ 1013218622-0 Page 24/ Total 32 pages