201242499 六、發明說明： 【發明所屬之技術領域】 本發明係有關於一種系統環境之升溫裝置，尤其是一種可根 據系統環境當下的環境溫度，以決定是否加_祕環境的動離 升溫裝置。 〜 【先前技術】 現今電子農置的顧相當的廣泛，隨红作環_不同，電 子裝置所在的魏溫度也會有聽異。—般岭，#電腦處於低 溫的環境下’電腦有時無法正常啟動，或是啟動後無法正常運作。 因此，為了讓電腦能夠正常運作，習知遂有在電腦内部加設加熱 器’以使得位於電腦内部各元件的溫度能夠被提升至可以正常運 作的溫度，使得電腦可以正常開機。 不過，當加熱器啟動時，距離加熱器越近的元件溫度比較容 易升南，而距離加熱器越遠的元件則比較不容易被升溫。換言之， 加熱器的升溫範圍在電腦的主機板上形成一種溫度梯度分佈。如 此一來，加熱器很容易將距離其較近的元件過度加熱，反而降低 了元件的使用壽命。 有鑑於此，另有一種將預熱線路（Warm-up Circuit)埋入印刷 電路板（Printed Circuit Board ’ PCB )内，以均勻加熱印刷電路板 的做法。此種技術主要是將單層或多層線路預埋在印刷電路板 内。當施加電源時，電流會流經預熱線路，以使預熱線路產生熱 能，以對配置於其上的元件進行加熱。 201242499 然而’此種預埋預熱線路於印猶路板中以加熱電路板上元 件之做法，將-併造路㈣軸柄上升，以及製程步驟的 繁雜。其次’更需要額外的外加電源驅動預熱線路，進—步辦加 了整體電路的複雜度（c〇mplexity)。 曰 【發明内容】 、 x 祕—⑽、統環境之動態升溫裝置， 可在無須額外配置電源系統與馳線路的前提下，達到有效升溫 系統環境的目的，藉以解決習知存在的問題。 本_係有_-種系統環境之動態升溫裝置，包括：一严 度感測器、-微處理器與—預 " 測-，度，並輪— 於溫度感測器。微處理器接收該溫度感測訊號並血 較，以根據峨觸—_號,=2= 理器根==係響_致能訊號’，統環境進行力： x之實把例，其中該致能訊號係為-輪出電壓; 唬或一輸出電流訊號。 %^sfl 根據本發明之—實施例，其中 設溫度時，微處理器係停止輪出致能訊號:不=該預 或一重置訊號。 I五輸出一開機訊號 其中當預_置加㈣'統環境的時 係停止輸出致能訊號，並且輸出— 根據本發明之一實施例， 間達一預設時間時，微處理器 開機訊號或一重置訊號。 201242499 根據本月之—實施例’其中溫度感測器、微處理器與預熱 裝置可選擇性地整合為一系統單晶片（Sy_ 〇n物，s〇c )。 本發明另有關於-種系統環境之_升溫方法，包括以下步 驟偵則系'統環土兄之溫度；將該系統環境之溫度比較於一預設 溫度；以及當_統魏之溫度低於職溫度時，開始加熱該系 統環境。 根據本發明之一實施例，其中當該系統環境之溫度不低於預 又或者加熱s亥系統環境之時間達一預設時間時，停止加熱 齡統環境並_ —職域錢行祕重置。 本务月另有關於—種主機板系統，包括—電路板與—動態升 狐裝置’其巾電路板具有至少—統環境溫度。動態升溫裝置包 括/皿度感測器、一微處理器與一預熱裝置。溫度感測器用以债 測系’’先从溫度，並輸出—溫度制訊號。微處理器接收該溫度 感測訊號並與一預設溫度比較，以根據比較結果輸出-致能訊 5虎預熱裝置係響應於該致能訊號，以對系統環境進行加熱。 /疋以’本發賴n態升溫裝置與其動態升溫方法，可根 據系、麵^之溫度，域定是否加熱m環境至—預設溫度。 藉此’應用本發明之動態升溫裝置與其升溫方法於一電腦設備 時不僅可達到電腦在低溫環境下仍可正常開機之目的，更可有 效省部習知主機板之繁雜製程工序與製作成本。 〃 Μ上有關於本發明_容說明，與以下的實施方式係用以示 範與解釋本伽的精神與原理，並且提供本發賴專辦請範圍 201242499 更進步的解釋。有關本發明的特徵、實作與功效，兹配合圖式 作較佳實施例詳細說明如下。 【實施方式】 以下在實施方式巾詳細敘述本發明之詳細特㈣及優點，其 内容足以使任何熟習相職藝者了解本發明之技_容並據以實 施，且根據本綱書所揭露之内容、申請專利朗及圖式，任何 熟習細技藝者可料地轉本發明侧之目的及優點。 第1圖」係為根據本發明實施例之動態升溫方法的步驟流 程圖，此獅態升溫方法可翻於「第2圖」的祕升溫裝置， ^控制-主機祕（例如：電腦主機板）是否執行正常開機程序。 /「第3圖」係為根據「第2圖」的動態升溫裝置應用在一主機板 系統21㈣路方塊圖。根據本發明之-實細，此麵態升溫方 法包括以下步驟： 步驟Sl〇2 :偵測一系統環境之溫度； 步驟S104 :將該系統環境之溫度比較於一預設溫度； 步驟S106 :當該系統環境之溫度低於預設溫度時，加熱該系 統環境；以及 乂驟S1G8 m崎境之溫度不低於預設溫度時，輸出一 開機訊號或一重置訊號。 值件注意的是，本發明提出的動態升溫方法，並不以加熱「第 3圖」所7F之系統環境211為限。以下關於「第i圖」所示之方法 與「第9民I - /、 圖」所示之升溫裝置，二者的配合說明’僅作為解釋本 201242499 發明之技術内容示範之用。任何熟習此項技藝之人士，當可根據 本發明之發明内谷，自行應用於任何待加熱的系統環境中，以實 現本發明相關之目的及優點。 請一併參見「第2圖」與「第3圖」所示，動態升溫裝置。 包含有溫度感測器22卜微處理器222以及預熱裝置223。其中， 「第2圖」雖以各自獨立的電路方塊分別示意溫度感測器221、微 處理器222以及預熱裝置223，然而，三者亦可以選擇性地整合為 單一控制電路，進一步完成系統單晶片（System 〇n cWp，s〇c) 之目的。 .在一實施例中，温度感測器221係用以偵測系統環境211之 溫度，據以輸出一溫度感測訊號Vt (對應步驟sl〇2)。一般而言， 溫度感測器221可以是例如：雙極面結型晶體管（Bip〇lar Juncti〇n Transistor ’ BJT)、熱電偶、感溫晶片、或熱敏電阻等元件。因此， =溫度感測H 221鄰近設置於系統環境211之周圍時，溫度感測 器221即可有效偵測到系統環境211之環境溫度。 抑微處理1 222電性連接於溫度感測器221，並且接收溫度感測 器221輸出之溫度感測訊说VT。之後’微處理器222係將溫度感 測訊號％對應的溫度與一預設溫度進行比較，以根據比較的結果 ^出一致能訊號VD (對應步驟漏）。其中，致能減％可以 是但不限於輪出電壓訊號或是輸出電流訊號。 詳細而言，當微處理器222判斷系統環境211之溫度低於該 預設溫度時’微處理器222輸出致能訊號％予預熱裝置⑵。此 8 201242499 時’預熱裳置223係響應致能訊號Vd ’受到致能訊號VD的致動 (enable)，而開始升溫且加熱系統環境211 (對應步驟s⑽）。預 熱裳置223可以是任何能夠主動產生熱能的元件，包括：水泥電 阻、功率電阻、功率電晶體、或電熱風扇等等。藉由選擇致能訊 號Vd戶斤對應電壓δ孔號或電流訊號的大小，便可決定出預熱裝置 223生成熱能的功率產出。 因此，當系統核境211逐漸地被升溫到該預設溫度，意即微 處理器222判斷系統環境211之溫度不低於該預設溫度的時候， 微處理器222便停止輸出用以加熱系統環境211的致能訊號％， 而改為輸出-開機訊號Vb (對應步驟S108)。在一實施例中，開 機訊號VB亦可以是一重置訊號，以對系統環境211進行系統重置 (Reset)。 根據本發明之-實施例，此種動態升溫裝置22可應用在一電 :腦設備的主機板上，以形成一種主機板系統。如「第3圖」所示， 在一實施例中，主機板系統21包括有電路板（圖中未示）鱼= 升溫裝置22 ’動態升溫裝置22 _以加熱電路板的系統環姐 度’使得電路㈣系統觀溫度餅溫至域板祕Μ 機的溫度。至於’當系統環境溫度已經具有主機板系統Μ可:: 開機的溫度時，_升邮置22則停止加_ ^ 出一開機峨I在此情況下，t主機嶋2ι接收到= « %時，主機板系統21即可執行開機（b⑽）程序* 當開機訊號vB為系統重置訊號時，主機板系統2ι係在接^開 201242499 機訊號vB後，進行系統重置。由於此一關於主機板系統2ι如何 在接收到開機訊號VB後執行開機或系統重置的技術特徵，並非本 發明之發明核心，故在此並不贅述。 因此，根據本發明提出之動態升溫裂置，設計者當可預先設 定預設溫度駐機板系統21可執行開機的環境溫度(例如〇至_⑽ 度）。藉此’當系統環境211 -旦被加熱到預設溫度時，預熱裝置 223即可自動停止加熱，而此時，主機板系統21也可正常執制 機。 除此之外’「第4圖」係為根據本發明又—實施例之動態升溫 方法的步驟流程圖’在此實施例中，_升溫方法包括有： 步驟S102 :偵測一系統環境之溫度； 步驟S104 :將該系統環境之溫度比較於一預設溫度； 步驟S106 :當該系統環境之溫度低於預設溫度時，加熱該系 統環境； 、μ 步驟S108 :當該系統環境之溫度不低於預設溫度時，輸出一 開機訊號或一重置訊號；以及 步驟S110 :判斷加熱該系統環境的時間是否達一預設時間。 因此，當系統環境開始升溫後，微處理器222開始計時，並 且觸預熱裝置223加熱系統環境211的時間是否達一預設時 間’若是，則回到步驟龍停止加熱並輸出開機訊號（或重置訊 號）VB;若未達預設時間’則回到步驟·繼續加熱系統環境 211，直至系統環境211 _預設溫度，或是預熱裝置⑵加熱系 201242499 統環境211的時間到達預設時間為止。 是以，綜上所述，本發明提出之動 統環境的溫度，來決定㈣==由偵測系 開機的預設溫度。而在系統環境被升溫到該預設 溫農置即停止加熱，以令主機板系統可直接執行開機。奸 應用本發明提出之動態升溫裝置與其升溫方法 時，此種預熱機制不僅可透過微處理器主動控制預熱 額外_撼’更可讓電腦設備在低溫下仍可正常的 程序’有效達到動態升溫與降低功率損耗之優點。 ^ 次’相較於習知技術，本發明更具有省卻習知主機板之繁 雜製程工序與製作成本之優點。 ’、 雖然本發咖前述馳佳實_揭露如上，财並非用以限 定本發明，任何㈣相像技藝者，在不脫離本發明之精神盘範圍 内’當可作些許更動朗飾，批本剌之專利簡範圍須視本 說明書所附之”翻範_狀者鱗。 【圖式簡單說明】 幻圖係為根據本發明實施例之動態升溫方法的步驟流程圖。 第2圖係為根據本發明實施例之動態升溫裝置的系統架構示 意圖。 第3圖係為根據「第2圖」的動態升溫裝置應用在―主機板 系統的電路方塊圖。 第4圖係為根據本剌又—實細之轉升溫方法的步驟流 201242499 程圖。 【主要元件符號說明】 21 主機板系統 22 動態升溫裝置 211 系統環境 221 溫度感測器 222 微處理器 223 預熱裝置201242499 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a temperature rising device for a system environment, and more particularly to a moving and temperature increasing device that can determine whether or not to add an environment according to the current ambient temperature of the system environment. ~ [Prior Art] Today's electronic farms are quite extensive, and the temperature of the electronic device is different. —谷岭,#The computer is in a low temperature environment. The computer sometimes fails to start normally, or it does not work properly after startup. Therefore, in order to make the computer work properly, it is customary to add a heater inside the computer so that the temperature of each component inside the computer can be raised to a temperature at which the computer can operate normally, so that the computer can be turned on normally. However, when the heater is started, the temperature of the component closer to the heater is easier to rise, and the component farther from the heater is less likely to be warmed up. In other words, the warming range of the heater forms a temperature gradient across the motherboard of the computer. As a result, the heater can easily overheat the components closer to it, which in turn reduces the life of the components. In view of this, there is another method of embedding a Warm-up Circuit in a Printed Circuit Board (PCB) to uniformly heat the printed circuit board. This technique primarily pre-embeds single or multi-layer lines in a printed circuit board. When a power source is applied, current flows through the preheat line to cause the preheat line to generate thermal energy to heat the components disposed thereon. 201242499 However, this kind of pre-embedded preheating line is used to heat the components on the circuit board in the Inari board, and the circuit is raised (4), and the manufacturing process is complicated. Secondly, the additional external power supply is required to drive the preheating line, and the complexity of the overall circuit (c〇mplexity) is added.曰 【Contents】, x secret—(10), dynamic temperature heating device for the environment, can achieve the purpose of effectively heating the system environment without additional configuration of the power system and the line, so as to solve the problems existing. This _ system has a dynamic temperature heating device for the system environment, including: a severity sensor, - microprocessor and - pre-measurement -, degree, and wheel - temperature sensor. The microprocessor receives the temperature sensing signal and compares the blood to the force according to the touch-_ number, =2= processor root==system_signal_enable signal, and the environment is force: x real example, wherein The enable signal is - wheel voltage; 唬 or an output current signal. %^sfl According to an embodiment of the invention, wherein the temperature is set, the microprocessor stops the turn-off enable signal: no = the pre- or a reset signal. I5 outputs a power-on signal, wherein when the pre-setting (four) environment is stopped, the output enable signal is stopped, and the output is - according to an embodiment of the present invention, when the preset time is up, the microprocessor starts the signal or A reset signal. 201242499 According to this month's embodiment, the temperature sensor, microprocessor and preheating device can be selectively integrated into a single system (Sy_ 〇n, s〇c). The invention further relates to a method for warming up the system environment, comprising the following steps: detecting the temperature of the system; comparing the temperature of the system environment to a preset temperature; and when the temperature of the system is lower than At the job temperature, the system environment begins to heat up. According to an embodiment of the present invention, when the temperature of the system environment is not lower than the time of pre-heating or heating the system environment for a predetermined time, the heating of the aged environment is stopped and the reset is performed. This calendar month also has a system board system that includes a circuit board and a dynamic fox device. The towel board has at least an ambient temperature. The dynamic temperature increasing device includes a / degree sensor, a microprocessor and a preheating device. The temperature sensor is used to measure the temperature of the system and output the temperature signal. The microprocessor receives the temperature sensing signal and compares it with a predetermined temperature to output an enable signal according to the comparison result. The tiger preheating device is responsive to the enabling signal to heat the system environment. / 疋 ’ 本 本 n n n n state heating device and its dynamic heating method, according to the temperature of the system, surface, whether to heat m environment to - preset temperature. Therefore, the application of the dynamic temperature increasing device and the temperature rising method of the present invention to a computer device can not only achieve the purpose that the computer can be normally turned on in a low temperature environment, but also effectively solve the complicated process and manufacturing cost of the motherboard. 〃 有 有 有 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The features, implementations, and utilities of the present invention are described in detail with reference to the preferred embodiments. [Embodiment] Hereinafter, the detailed description (4) and advantages of the present invention will be described in detail in the embodiments, and the contents thereof are sufficient for any skilled practitioner to understand the technology of the present invention and implement it according to the present invention. The contents, the patent application, and the drawings are intended to be beneficial to those skilled in the art. Fig. 1 is a flow chart showing the steps of the dynamic temperature rising method according to the embodiment of the present invention. The lion temperature heating method can be turned over to the secret heating device of "Fig. 2", ^ control - host secret (for example, computer motherboard) Whether to perform the normal boot process. / "Fig. 3" is a block diagram of a motherboard system 21 (four) in accordance with the "dynamic heating device" according to "Fig. 2". According to the present invention, the surface temperature raising method comprises the following steps: Step S1〇2: detecting the temperature of a system environment; Step S104: comparing the temperature of the system environment to a preset temperature; Step S106: When When the temperature of the system environment is lower than the preset temperature, the system environment is heated; and when the temperature of the S1G8 m is not lower than the preset temperature, a power-on signal or a reset signal is output. It is noted that the dynamic heating method proposed by the present invention is not limited to the heating of the system environment 211 of 7F of "Fig. 3". The following is a description of the method shown in the "figure i" and the temperature-increasing device shown in the "ninth I- /, diagram", which is only used as an example to explain the technical content of the 201242499 invention. Any person skilled in the art, in accordance with the invention of the present invention, can be used in any system environment to be heated to achieve the objects and advantages of the present invention. Please refer to the "2nd picture" and "3rd picture" together for the dynamic temperature riser. A temperature sensor 22 includes a microprocessor 222 and a preheating device 223. The "second picture" shows the temperature sensor 221, the microprocessor 222 and the preheating device 223 in separate circuit blocks. However, the three can also be selectively integrated into a single control circuit to further complete the system. The purpose of a single chip (System 〇n cWp, s〇c). In one embodiment, the temperature sensor 221 is configured to detect the temperature of the system environment 211, thereby outputting a temperature sensing signal Vt (corresponding to step sl2). In general, the temperature sensor 221 may be, for example, a bipolar junction transistor (Bip〇lar Juncti〇n Transistor' BJT), a thermocouple, a temperature sensitive wafer, or a thermistor. Therefore, when the temperature sensing H 221 is disposed adjacent to the system environment 211, the temperature sensor 221 can effectively detect the ambient temperature of the system environment 211. The micro-processing 1 222 is electrically connected to the temperature sensor 221 and receives the temperature sensing speech VT outputted by the temperature sensor 221. Thereafter, the microprocessor 222 compares the temperature corresponding to the temperature sensing signal % with a preset temperature to output a uniform energy signal VD (corresponding to the step leakage) according to the comparison result. Among them, the % reduction can be, but is not limited to, the wheel voltage signal or the output current signal. In detail, when the microprocessor 222 determines that the temperature of the system environment 211 is lower than the preset temperature, the microprocessor 222 outputs the enable signal % to the preheating device (2). At the time of 201242499, the 'preheating skirt 223 system response enable signal Vd' is activated by the enable signal VD, and starts to heat up and heats the system environment 211 (corresponding to step s(10)). The preheating skirt 223 can be any component capable of actively generating thermal energy, including: cement resistors, power resistors, power transistors, or electric fans. By selecting the size of the corresponding voltage δ hole number or current signal of the enabling signal Vd, the power output of the thermal energy generated by the preheating device 223 can be determined. Therefore, when the system environment 211 is gradually warmed up to the preset temperature, that is, the microprocessor 222 determines that the temperature of the system environment 211 is not lower than the preset temperature, the microprocessor 222 stops outputting the heating system. The enable signal % of the environment 211 is changed to the output-start signal Vb (corresponding to step S108). In an embodiment, the power-on signal VB may also be a reset signal to perform a system reset on the system environment 211. In accordance with an embodiment of the present invention, such a dynamic warming device 22 can be applied to a motherboard of a brain device to form a motherboard system. As shown in FIG. 3, in an embodiment, the motherboard system 21 includes a circuit board (not shown). Fish = temperature increasing device 22 'dynamic heating device 22 _ system looping system for heating the circuit board' Make the circuit (4) system view the temperature of the cake to the temperature of the domain board. As for 'when the system ambient temperature already has the motherboard system:: When the temperature is turned on, the _ liter post 22 stops adding _ ^ out of the boot 峨 I in this case, the t host 嶋 2 ι receives = « % The motherboard system 21 can execute the boot (b(10)) program. * When the boot signal vB is the system reset signal, the motherboard system 2 ι is connected to the 201242499 machine signal vB to perform a system reset. Since this technical feature of how the motherboard system 2i performs booting or system reset after receiving the boot signal VB is not the core of the invention, it will not be described here. Therefore, in accordance with the dynamic temperature rise cracking proposed by the present invention, the designer can pre-set the ambient temperature at which the preset temperature parking plate system 21 can be turned on (e.g., 〇 to _(10) degrees). Thereby, when the system environment 211 is heated to the preset temperature, the preheating device 223 can automatically stop the heating, and at this time, the motherboard system 21 can also normally operate the machine. In addition, 'the fourth figure' is a flow chart of the steps of the dynamic temperature rising method according to the embodiment of the present invention. In this embodiment, the temperature increasing method includes: Step S102: detecting the temperature of a system environment Step S104: comparing the temperature of the system environment to a preset temperature; Step S106: heating the system environment when the temperature of the system environment is lower than the preset temperature; μ, step S108: when the temperature of the system environment is not When the temperature is lower than the preset temperature, a power-on signal or a reset signal is output; and step S110: determining whether the time for heating the system environment reaches a preset time. Therefore, when the system environment starts to heat up, the microprocessor 222 starts timing, and the time that the preheating device 223 heats the system environment 211 reaches a preset time. If yes, the step returns to the step to stop heating and output the power on signal (or Reset signal) VB; if the preset time is not reached, then return to the step · continue to heat the system environment 211 until the system environment 211 _ preset temperature, or the preheating device (2) heating system 201242499 system environment 211 time to reach the preset Time is up. Therefore, in summary, the temperature of the dynamic environment proposed by the present invention determines (4) == the preset temperature to be turned on by the detection system. When the system environment is warmed up to the preset temperature, the heating is stopped, so that the motherboard system can be directly turned on. When applying the dynamic temperature increasing device and the heating method thereof according to the present invention, the preheating mechanism can not only actively control the preheating by the microprocessor, but also allows the computer device to continue to operate normally at a low temperature. The advantages of warming up and reducing power loss. Compared with the prior art, the present invention has the advantages of eliminating the complicated manufacturing process and manufacturing cost of the conventional motherboard. 'Although the above-mentioned hairpin is exemplified above, the money is not intended to limit the invention, and any (4) similar artist can make some changes in the scope of the spirit of the invention. The scope of the patent is subject to the "scale" of the specification attached to the specification. [Simplified description of the drawing] The magic diagram is a flow chart of the steps of the dynamic heating method according to the embodiment of the present invention. A schematic diagram of a system architecture of a dynamic temperature increasing device according to an embodiment of the invention. Fig. 3 is a circuit block diagram of a dynamic temperature increasing device applied to a "board system" according to "Fig. 2". Figure 4 is a flow chart of the flow of the method according to the present and the actual heat transfer method 201242499. [Main component symbol description] 21 Motherboard system 22 Dynamic temperature riser 211 System environment 221 Temperature sensor 222 Microprocessor 223 Preheater