TWI332738B - Chip protecting system and electronic device and chip protecting method using the same - Google Patents

Description

1332738

达达号·· TW3807PA IX. Description of the Invention: [Technical Field] The present invention relates to a crystal moon protection system and an electronic device and a wafer protection method therefor, and in particular to a protection for a North Bridge • A wafer protection system for at least one of a wafer and a south bridge wafer and an electronic device and wafer protection method using the same. φ [Prior Art] Generally, a central processing unit (CPU), a north bridge chip, and a south bridge chip are provided on a computer motherboard. The central processor communicates with the surrounding components using the Northbridge and Southbridge wafers. Therefore, the North Bridge chip and the South Bridge chip are important components for the operation of the Shenyang processor. With the implementation of heavy-duty programs and the speed of data processing, the load on the central processor has increased relatively. In addition, some users will use φ overclocking or improve the operating voltage of the Northbridge and Southbridge wafers. As a result, when the load on the central processing unit is increased, the load on the north bridge chip and the south bridge wafer is correspondingly increased. At this time, the temperature of the north bridge wafer and the south bridge wafer will increase as the load increases. If the temperature of the Northbridge and Southbridge wafers cannot be properly reduced, the Northbridge and Southbridge wafers may burn out, making the computer system unable to continue to operate normally. 6 1332738

The invention relates to a wafer protection system and an electronic device and a wafer protection method thereof, which provide a protection mechanism for a north bridge wafer and a south bridge wafer to avoid the temperature of the north bridge wafer and the south bridge wafer due to temperature High and damaged. In this way, even if the user operates the north bridge wafer and the south bridge wafer in an overclocked operation mode or at a higher operating voltage, the present invention can effectively protect the north bridge wafer or the south bridge wafer according to the first aspect of the present invention, and propose a Wafer protection system. The wafer protection system is placed in the /electronic device. The electronic device includes a circuit board, a north bridge chip, and a south bridge chip. The board has an upper surface and a lower surface. The upper surface is opposite the lower surface. Both the north bridge wafer and the south bridge wafer are disposed on the upper surface. The wafer protection system includes a first temperature sensing component, a determination unit, and a protection circuit. The first temperature sensing component is disposed on a lower surface of the circuit board, and the first temperature metrology component is disposed under one of the north bridge wafer and the south bridge wafer to sense the temperature of one of the north bridge wafer and the south bridge wafer. The determining unit is electrically connected to the first temperature sensing element. The determining unit is configured to generate a temperature value according to the state of the first temperature sensing element and compare it with a predetermined value. When the temperature value is greater than the predetermined value, the judging unit rotates the coincidence signal. The protection circuit is electrically connected to the determination unit. When the protection circuit receives the enable signal, the protection circuit turns off the electronic device. According to a second aspect of the invention, an electronic device is presented. The electronic device includes a circuit board, a north bridge wafer, a south bridge wafer, and a wafer protection system. The circuit board has an upper surface and a lower surface. The upper surface is opposite to the lower surface. Both the north bridge wafer and the south bridge wafer are disposed on the upper surface of the circuit board. Crystal 7 1332738

Sanda number: TW3807PA The chip protection system includes a first temperature sensing component, a determining unit and a protection circuit. The first temperature sensing component is disposed on the lower surface of the circuit board, and the temperature sensing component is disposed below one of the north bridge wafer and the south bridge wafer to sense the temperature of one of the north bridge wafer and the south bridge wafer. The judging unit is electrically connected to the first temperature sensing 7G piece. The determining unit is configured to generate a temperature value according to the state of the first temperature sensing 7L piece and compare it with a predetermined value. When the temperature value is greater than the predetermined value, the judging unit outputs a uniform energy signal. The protection circuit is electrically connected to the determination unit. When the protection circuit receives the enable signal, the protection circuit turns off the electronic device. According to a third aspect of the invention, a wafer protection method is presented. The wafer protection method is applied to an electronic device. The electronic device includes a circuit board, a north bridge chip, and a south bridge chip. The board has an upper surface and a lower surface. The upper surface is opposite the lower surface. Both the north bridge wafer and the south bridge wafer are disposed on the upper surface. The wafer protection method includes the following steps. First, the _first temperature sense > component senses the temperature production of one of the North Bridge wafer and the South Bridge wafer. The first temperature sensing component is disposed on the lower surface of the circuit board, and the first temperature & expensive element is disposed below one of the north bridge wafer and the south bridge wafer. Next, the spear is used to generate a first temperature value based on the state of the first temperature sensing element. Then, the judging unit compares whether the first temperature value is greater than a predetermined value. Then, when the first temperature value is greater than the predetermined value, the determining unit outputs a first enable signal to a protection circuit. Then, when the first enable signal is received, the electronic device is turned off. In order to make the above-mentioned contents of the present invention more comprehensible, the following embodiments will be described in detail with reference to the following drawings: ' +交佳 8 1332738

达达编号号: TW3807PA [Embodiment] The present invention provides a wafer protection system and an electronic device and a wafer protection method therefor, which sense a north bridge wafer or a south bridge by a temperature sensing element disposed under a north bridge wafer or a south bridge wafer. The temperature of the wafer, and a determination unit is used to generate a temperature value based on the state of the temperature sensing element and compare it with a predetermined value. When the temperature value is greater than the predetermined value, the electronic device is turned off to prevent the north bridge wafer or the south bridge wafer from being damaged due to excessive temperature.

First Embodiment Referring to Figure 1A, there is shown a top view of an electronic device in accordance with a first embodiment of the present invention. This embodiment is described by taking the electronic device 2 as an example, and the electronic device 200 is, for example, a computer host. The electronic device 2 includes a circuit board 2W, a north bridge wafer 220, a south bridge wafer 23, and a wafer.

Protection system 240. The g-chip protection line 240 includes a first-temperature sensing element 24, a judging unit 245, and a protection circuit 247. The determining unit is electrically connected to the first temperature sensing element 241 and the protection circuit 247. Real

The components in the embodiments are omitted, and the components are shown in a more exaggerated manner to clearly show the technical features of the present invention. The arrangement of the above-mentioned circuit board 21 〇, north bridge wafer 220, south bridge wafer 23 〇 and first temperature sensing element 241 will be further described in the Fig. FIG. 1B is a side view of the electronic device of FIG. 1A. In order to clearly show the relative positions between the elements, Fig. 1B shows only a part of the elements. The circuit board 210 of the electronic device 200 has an upper surface 211 and a lower surface 212. The upper surface 211 of the circuit board 210 is opposite to the lower surface 212. 9 1332738

No. 3: TW3807PA North Bridge Wafer 220 and South Bridge Wafer 230 are disposed on the upper surface 211 of the circuit board 210. The first temperature sensing component 241 is disposed on the lower surface 212 of the circuit board 210. In this embodiment, the first temperature sensing component 241 is disposed under the north bridge wafer 220 to sense the temperature of the north bridge wafer 220. The judgment unit 245 of the 'other' Fig. 1A is for generating a temperature value based on the state of the first temperature sensing element 241 and comparing it with a predetermined value. When the temperature value is greater than the predetermined value, the judging unit 245 outputs the coincidence energy signal to the protection circuit 247. When the protection circuit 247 receives the enable signal, the protection circuit 247 causes the electronic device 200 to be turned off to protect the north bridge wafer 220 from damage due to excessive temperature. The wafer protection system of this embodiment will be further described as follows. Please refer to FIG. 2, which is a circuit block diagram of the electronic device of FIG. 1A. The first temperature sensing element 241 is, for example, a negative temperature coefficient thermistor, and the resistance value of the negative temperature coefficient thermistor decreases as the temperature rises. The φ wafer protection system 240 of the present embodiment further includes a resistor R0 in series with the first temperature sensing element 241. The determining unit 245 is coupled to the node P of the resistor R0 and the first temperature sensing component 241. Since the first temperature sensing element 241 of the present embodiment is for sensing the temperature of the north bridge wafer 220 (as shown in FIG. 1A), the first temperature sensing element 241 is when the temperature of the north bridge wafer 220 is raised. The resistance value of the (negative temperature coefficient thermistor) will decrease. In other words, the partial pressure of the voltage V0 obtained by the judging unit 245 at the node P is correspondingly decreased. The judging unit 245 calculates the temperature value based on the partial pressure to compare with the predetermined value. When the temperature value is greater than the predetermined value, it is judged (1) 2738.

Erda number · TW3807PA Single 245 rounds the enable signal Es to the protection circuit 247. The enable signal Es is for example a low voltage signal. As shown in FIG. 2, the protection circuit 247 includes a first resistor R1, a second resistor R2, a first transistor T1, and a second transistor T2. to

In the present embodiment, the first transistor T1 and the second transistor T2 are, for example, N-type Metal Oxide Semiconductor (NMOS). The gate of the first transistor T1 receives a first supply through the first resistor R1

The μ voltage VI is electrically connected to the judging unit. The pole of the first transistor τ 1 receives a second supply voltage V2, which is, for example, a ground voltage. The gate of the transistor T2 is transmitted through the first M ^ ^1 electric voltage I), and the voltage V3 is electrically connected to the first transistor τ: crystal T? + n ~ '久u 弟一电之之,原The pole receives a fourth supply voltage V4, and the fourth library is complimented: two:. Ground voltage. Therefore, when the protection circuit 247 receives the judgment unit 245 # & can signal Es, the first day of the day, we are poor, 5 rounds of the first electric day, the body is 1 The second transistor D4 supply voltage V4 is input to the south through the second transistor Τ2 to trigger the south bridge wafer 230 to control the electronic device 200 to turn off. Further, as shown in FIG. 2, the embodiment The south bridge chip 23 〇 and the right one overheat protection pin 231, and the electronic device 2 further includes a central processing hack 250. The central processing unit 25 and the protection circuit 247 can be electrically connected to the overheat protection pin 231 of the south bridge wafer 230. In other words, the two bridges 230 of the present invention can be shared with the central processing unit 25 of the electronic device 200 1332738

^ No.: TW3807PA The same pin (overheat protection pin 231), without the need to additionally add the pin of the south bridge wafer 230. Furthermore, the electronic device 200 of the embodiment further includes a Basic Input/Output System (BIOS) 260. The predetermined value is set in the basic output input system 260. In this embodiment, the setting of the predetermined value is, for example, set by the user to meet the needs of the user. After the protection circuit 247 turns off the electronic device 2 because the north bridge wafer 220 is overheated, the basic output input system 26A will display a warning message when the electronic device 200 is turned back on. In this way, the user can use the warning message to understand the reason for the previous shutdown of the electronic device 200 to moderately adjust the manner in which the electronic device 200 is operated. For example, the user can reduce the operating frequency of the computer system or reduce the operating voltage of the north bridge chip to reduce the probability of overheating of the north bridge wafer. The wafer protection method according to the first embodiment of the present invention will be described below using the wafer protection system 240 mentioned above and the electronic device 200 using the same. Please refer to FIG. 2 and FIG. 3 simultaneously. FIG. 3 is a flow chart showing a wafer protection method according to a first embodiment of the present invention. The wafer protection method of this embodiment includes the following steps. First, since the first temperature sensing element 241 of the present embodiment is disposed under the north bridge wafer 220 (as shown in FIG. 1B), in step 701, the north bridge wafer 220 is sensed by the first temperature sensing element 241. temperature. Next, in step 703, the determining unit 245 is utilized to generate a temperature value according to the state of the first temperature sensing element 241. Since the first temperature sensing element 241 of the embodiment is a negative temperature coefficient thermistor, it is judged 12 1332738

Sanda number: TW3807PA The breaking unit 245 calculates the corresponding temperature value by using the partial pressure obtained from the point P. Then, in step 705, the determination unit 245 compares whether the temperature value is greater than a predetermined value. In this embodiment, the predetermined value can be set by the user in the basic output input system 260 to meet the needs of the user. Next, in step 707, when the temperature value is greater than the predetermined value, the determining unit 245 outputs the enable signal Es to the protection circuit 247. Then, in step 709, when the protection circuit 247 receives the enable signal Es, the south bridge wafer 230 turns off the electronic device 200. After the enable signal Es is turned off the first transistor T1, the second transistor T2 will be turned on, so that the second transistor T2 is input to the fourth supply voltage V4 to the south bridge wafer 230 to trigger the south bridge wafer 230 to control the electronic device 200 to be turned off. Next, in step 711, when the electronic device 200 is turned back on, a warning message is displayed by the basic output input system 260. Moreover, in the present embodiment, the wafer protection method may optionally include the step of setting a predetermined value in the basic output input system 260 prior to step 701 to meet the needs of the user. The above is the wafer protection system according to the first embodiment of the present invention and the electronic device and wafer protection method therefor, which provide a mechanism for protecting the north bridge wafer to prevent the north bridge wafer from being burnt due to excessive temperature. In addition, in this embodiment, after the protection circuit is turned off due to overheating of the north bridge chip, when the electronic device is turned on, the basic output input system will display a warning message to let the user know the reason for the previous shutdown of the electronic device. . In this way, even if the user operates in an overclocked manner or works at a higher level 13 1332738

The three-numbered TW3807PA voltage is used to operate the north bridge wafer and the south bridge wafer. The wafer protection system of the present embodiment and the electronic device and wafer protection method using the same still provide a mechanism for protecting the north bridge wafer. Although the first temperature sensing element of the present embodiment is disposed under the north bridge wafer, it is well known to those skilled in the art that the first temperature sensing element can also be disposed under the south bridge wafer to provide a mechanism for protecting the south bridge wafer. . The second embodiment differs from the first embodiment in that the first embodiment senses the temperature of the north bridge wafer only by using the first temperature sensing element, and the first embodiment uses the first temperature sensing element and a second The temperature sensing components respectively sense the temperature of the north bridge wafer and the south bridge crystal moon to prevent the north bridge wafer and the south bridge wafer from being burnt due to temperature overshoot. Referring to Figure 4, there is shown a top view of an electronic device in accordance with a second embodiment of the present invention. The wafer protection system 340 of the electronic device 300 includes a first temperature sensing component 341, a second temperature sensing component 342, a determining unit 345, and a protection circuit 347. The first temperature sensing component 341 and the second temperature sensing component 342 are disposed on the lower surface of the circuit board 310, and the first temperature sensing component 341 and the second temperature sensing component 342 are respectively disposed on the north bridge chip 320 and the south bridge chip. Below 330, the temperature of the north bridge wafer 320 and the south bridge wafer 330 is sensed. In the embodiment, the determining unit 345 is electrically connected to the first temperature sensing element 341, the second temperature sensing element 342, and the protection circuit 347. 14 1332738

The third level number: TW3807PA determining unit 345 generates a first temperature value and a second temperature value according to the states of the first temperature sensing element 341 and the second temperature sensing element 342, respectively. When the first temperature value is greater than a predetermined value, the determining unit 345 outputs a first enable signal to the protection circuit 347, and when the second temperature value is greater than the predetermined value, the determining unit 345 outputs a second enable signal to Protection circuit 347. When the protection circuit 347 receives the first enable signal or the second enable signal, the protection circuit 347 turns off the electronic device 300 to protect the north bridge wafer 320 and the south bridge wafer 330 from being damaged due to excessive temperature. For the wafer protection method of the present embodiment, please refer to FIG. 5 at the same time. FIG. 5 is a flow chart showing a wafer protection method according to a second embodiment of the present invention. Steps 801a to 809a of FIG. 5 are processes for protecting the north bridge wafer 320 by using the first temperature sensing element 341, the determining unit 345, and the protection circuit 347, and the steps 801b to 809b are performed by using the second temperature sensing element 342. The unit 345 and the protection circuit 347 protect the flow of the south bridge wafer 330. When the electronic device 300 is turned on after the north bridge chip 320 or the south bridge chip 330 is turned off, the basic output input system (not shown) will display a warning message to remind the user of the reason for the previous shutdown of the electronic device 300. As a result, when the temperature of the north bridge chip 320 or the south bridge chip 330 is too high, the electronic device 300 can be turned off by the protection mechanism of the wafer protection system 340 of the embodiment to prevent the north bridge chip 320 and the south bridge wafer 330 from being burned. The wafer protection system and the electronic device and wafer protection method thereof disclosed in the above embodiments of the present invention are provided by a north bridge wafer or a south bridge wafer 15 1332738

The temperature of the Sanda number: TW3807PA' is used as the basis for shutting down the electronic device to protect the North Bridge chip and the South Bridge chip. In this way, even if the user operates the north bridge wafer and the south bridge wafer in an overclocked operation mode or at a higher operating voltage, the wafer protection system disclosed in the above embodiments and the electronic device and the wafer protection method using the same can be effectively Protect the North Bridge or South Bridge wafers to prevent the North Bridge and South Bridge wafers from burning due to excessive temperatures. In conclusion, the present invention has been disclosed in the above preferred embodiments, and is not intended to limit the present invention. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

16 1332738

3D TW3807PA [Simple Description of the Drawings] FIG. 1A is a top view of an electronic device according to a first embodiment of the present invention; FIG. 1B is a side view of the electronic device of FIG. 1A; 1 is a circuit block diagram of an electronic device; FIG. 3 is a flow chart of a wafer protection method according to a first embodiment of the present invention; and FIG. 4 is a diagram showing an electronic device according to a second embodiment of the present invention. FIG. 5 is a flow chart showing a wafer protection method according to a second embodiment of the present invention.

17 1332738

Sanda number: TW3807PA [Description of main component symbols] 200, 300: electronic device 210, 310: circuit board 211: upper surface 212: lower surface 220, 320: north bridge wafer 230, 330: south bridge wafer 240, 340: wafer protection system R0: resistors 241, 341: first temperature sensing elements 245, 345: determining units 247, 347: protection circuit T1 first transistor T2 second transistor R1 first resistor R2 second resistor 250: central processor 260: Basic output input system 342: second temperature sensing element Es · enable signal V0 voltage VI first supply voltage V2 second supply voltage V3 third supply voltage V4: fourth supply voltage

Claims (1)

1332738 Sanda number: TW3807PA X. Patent application scope: 1. A wafer protection system is provided in an electronic device, the electronic device comprising a circuit board, a north bridge chip and a south bridge chip, the circuit board having an upper surface and a lower a surface of the upper surface opposite to the lower surface, wherein the north bridge wafer and the south bridge wafer are disposed on the upper surface, the wafer protection system includes: a first temperature sensing component disposed on the lower surface of the circuit board, and The first temperature sensing component is disposed under the north bridge chip and one of the south bridge wafers to sense a temperature of one of the north bridge wafer and the south bridge wafer; a determining unit electrically coupled to the first temperature sensing component The determining unit is configured to generate a temperature value according to the state of the first temperature sensing component, and compare with a predetermined value. When the temperature value is greater than the predetermined value, the determining unit outputs a consistent energy signal; The protection circuit is electrically connected to the determining unit, and when the protection circuit receives the enable signal, the protection circuit turns off the electronic device . 2. The wafer protection system of claim 1, wherein the protection circuit comprises: a first resistor and a second resistor; a first transistor, the gate of which receives a first through the first resistor The supply voltage is electrically connected to the determining unit, the source of the first transistor receives a second supply voltage, and a second transistor whose gate receives a third supply voltage through the second resistor and is electrically Connecting to the first transistor of the first transistor, the source of the second transistor 1332738: the source of the TW3807PA receives a fourth supply voltage, and the second transistor is electrically connected to the south bridge wafer; When the protection circuit receives the enable signal, the first transistor is turned off, the second transistor is turned on, and the fourth supply voltage is input to the south bridge via the second transistor to trigger the south bridge chip. Control the electronic device to turn off. 3. The wafer protection system of claim 2, wherein the first transistor and the second transistor are N-type Metal Oxide Semiconductor (NMOS) transistors, the first The second supply voltage is a ground voltage, and the fourth supply voltage is a ground voltage. 4. The wafer protection system of claim 1, wherein the wafer protection system further comprises: a second temperature sensing element disposed on the lower surface of the circuit board, the second temperature sensing element being The North Bridge Crystal Moon and the other of the South Bridge wafers are below. 5. The wafer protection system of claim 1, wherein the first temperature sensing element is a negative temperature coefficient thermistor, and the wafer protection system further includes a resistor. The resistor is connected in series with the first temperature sensing component, and the determining unit is coupled to a node electrically connected to the first temperature sensing component. 6. The wafer protection system of claim 1, wherein the south bridge wafer has an overheat protection pin, the electronic device further comprising a central processing unit (Ci>u), the central processing unit and The protection circuit is electrically connected to the overheat protection pin of the south bridge chip. 20 1332738 No. 3 · TW3807PA 7. An electronic device comprising: a circuit board having an upper surface and a lower surface 'the upper surface is opposite to the lower surface; 'a north bridge wafer, which is provided on the circuit board The upper surface; a south bridge wafer disposed on the upper surface of the circuit board; and a wafer protection system comprising: a first temperature sensing element disposed on the lower surface φ of the circuit board and the first a temperature sensing component is disposed under the north bridge chip and one of the south bridge wafers to sense a temperature of one of the north bridge wafer and the south bridge wafer; - the determining unit is electrically connected to the first temperature sensing component The determining unit is configured to generate a temperature value according to the state of the first temperature sensing component, and compare with a predetermined value. When the temperature value is greater than the predetermined value, the determining unit outputs a consistent energy signal; and a protection circuit And electrically connected to the determining unit, the protection circuit turns off the electronic device when the protection circuit receives the enable signal. 8. The electronic device of claim 7, wherein the protection circuit comprises: a first resistor and a second resistor; (4) a ρ.' second crystal, the gate of which is received through the first resistor - the first Providing and electrically connecting to the judging unit, the source of the first transistor receives a second supply voltage; and the first transistor 'the gate thereof receives the 21st 332738 through the second resistor. The TW3807PA is electrically and electrically connected to the drain of the first transistor, the source of the second transistor receives a fourth supply voltage, and the drain of the second transistor is electrically connected to the south bridge wafer; When the protection circuit receives the enable signal, the first transistor is turned off, the second transistor is turned on, and the fourth supply voltage is input to the south bridge via the second transistor to trigger the south bridge to control the The electronic device is turned off. 9. The electronic device of claim 8, wherein the first transistor and the second transistor are N-type MOS transistors, and the second supply voltage is a ground voltage, the fourth The supply voltage is a ground voltage. 10. The electronic device of claim 7, wherein the electronic device further comprises: a basic input/output system (BIOS), after the protection circuit causes the electronic device to be turned off, when The basic output input system displays a warning message when the electronic device is turned back on. 11. The electronic device of claim 10, wherein the predetermined value is set in the basic output input system. 12. The electronic device of claim 7, wherein the south bridge chip has an overheat protection pin, the electronic device further comprising: a central processing unit, the central processor and the protection circuit are electrically connected to the The overheat protection pin of the south bridge chip. 13. The electronic device of claim 7, wherein the wafer protection system further comprises: 22 1332738 Sanda number: TW3807PA a second temperature sensing element disposed on the lower surface of the circuit board, the first The second temperature sensing element is below the other of the north bridge wafer and the south bridge wafer. 14. The electronic device of claim 7, wherein the first temperature sensing component is a negative temperature coefficient thermistor, the wafer protection system further comprising a resistor, the resistor and the first temperature sensing The component is connected in series, and the determining unit is coupled to one of the resistors electrically connected to the first temperature sensing component. 15. A wafer protection method for an electronic device, comprising: a circuit board, a north bridge wafer, and a south bridge wafer, the circuit board having an upper surface and a lower surface, the upper surface being opposite to the lower surface The north bridge chip and the south bridge wafer are disposed on the upper surface, and the wafer protection method comprises: sensing a temperature of one of the north bridge wafer and the south bridge wafer by using a first temperature sensing component, the first temperature sensing component setting a lower surface of the circuit board, and the first temperature sensing component is disposed under the north bridge wafer and the south bridge wafer; using a determining unit to generate a state according to the state of the first temperature sensing component a first temperature value; comparing, by the determining unit, whether the first temperature value is greater than a predetermined value; when the first temperature value is greater than the predetermined value, the determining unit outputs a first enable signal to a protection circuit; When the protection circuit receives the first enable signal, the electronic 23 13332738 r three-number: TW3807PA • device is turned off. 16. The wafer protection method of claim 15, wherein the protection circuit comprises a first resistor, a second resistor, a first electrical 'crystal, and a second transistor, the first transistor The gate receives a first supply voltage through the first electrical resistance and is electrically connected to the determining unit, the source of the first transistor receives a second supply voltage, and the gate of the second transistor transmits the first The second resistor receives a third supply voltage and is electrically connected to the drain of the first transistor, the source of the second transistor receives a fourth supply voltage, and the drain of the second transistor is electrically connected to The south bridge chip, when the protection circuit receives the first enable signal, the step of turning off the electronic device includes: when the protection circuit receives the first enable signal, turning off the first transistor, turning on the second And a transistor, wherein the fourth supply voltage is input to the south bridge wafer via the second transistor to trigger the south bridge wafer to control the electronic device to be turned off. The wafer protection method of claim 15, wherein the electronic device further comprises a basic output input system, after the protection circuit causes the electronic device to be turned off, the wafer protection method further comprises: when the electronic device When the device is turned on again, a warning message is displayed by the basic output input system. The wafer protection method of claim 17, wherein before the step of sensing the temperature by using the first temperature sensing element, the wafer protection method further comprises: setting the basic output input system Predetermined value. The wafer protection method of claim 15, wherein the wafer protection system further comprises a second temperature sensing element disposed on the lower surface of the circuit board, and The second temperature sensing component is located under the other of the north bridge wafer and the south bridge wafer. The wafer protection method further includes: sensing, by the second temperature sensing component, the other of the north bridge wafer and the south bridge wafer Temperature, using the determining unit to generate a second temperature value according to the state of the second temperature sensing component; using the determining unit to compare whether the second temperature value is greater than the predetermined value; when the second temperature value is greater than the predetermined value The determining unit outputs a second enable signal to the protection circuit; and when the protection circuit receives the second enable signal, the protection circuit causes the electronic device to be turned off. 25