200819957 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種溫度偵測系統及方法，更詳而古 t係關於依據對待測對象㈣測到的X作電流而相對取 仔-亥待測對象所〉肖耗的功率，並以該消耗功率作為該待測 對象的工作溫度，以在偵測到該1作溫度高於—預定值時 驅使散熱單元對該待測對象進行散熱的一種溫度偵測系 統及方法。 【先前技術】 隨著科技的發展，使各類電子設 諸如測量該電子嗖備之条试 , 4對k升 夕y 冤子0又備之糸統工作所產生的工作溫度，現行 :用溫度感測晶片（IC)實現對系統產生溫度的測量， r\，此類測溫方式，必須將該溫度感測晶片臨近設置於需 進仃溫度測量的對象，例如中 、 度感測晶片及其設置方式，*限於- , u此現仃測溫方式並不能針對 電子政備中的所有電子零件溫度作測量。 另者，此類測溫方式中所採用的溫 有固定的傳輸線規格，以便&曰片本身八 、、…，…P士 乂便透過该傳輸線對待測對象進行 :二1，故：測對象則須具備有與該傳輸㈣ 曰ί之：二’待測對象並不具備有與該溫度感測 2之傳輸線對應之連接線，因此，此類測溫方式亦受限 於/、该溫度感測晶片之傳輸線對應之連接線。 因此，如何設計一種溫度镇測系統，以克服 晶片設置位置需受限於彳㈣對象所在位^及溫1度=則、 19745 200819957 .具備可支援該溫度感測晶片之傳 '· 、、 、只為目鈾亟待解決之問題。 【發明内容】 ' 鑒於上述習知技術之問題，本發 -種溫度偵測系統及方法’用以解二 =於待測對象所在位置以及溫度魏理:片口 柄月之另一目的在於提供一種溫 單元之散熱效率盥該電子+依據政熱 料πΓ 耗功率的關係以控制 5亥放熱早謂能提供的散熱機制，藉以作爲電子設備在敫 體系統上的節能控制。 在正 本發明之再-目的在於提供一種溫度摘測系 量会’。用以偵測電子設備在整體系統上的功率消耗及熱量測 、為達上述所有目的及其它目的，本發明提供— 偵測系統及方法。本發明之溫度侦測系統係用以對—= 的待測對象進行工作溫度的偵測，且在偵測到工I >皿度而於-㈣值時驅使該電子設傷中的散熱單元㈣ 待測對象進行散熱，該溫度制系統包括：偵測模^ 用則貞測該待測對象的工作電流；轉換模組，係用兮 偵測模組所偵測到的工作電流轉換為數位信號並予°〆 出=及控制模組，係用以於接收到該轉換模組所輪出别 數位信號時’依據該數位信號進行運算來取得該待測對象 19745 6 200819957 •洚，、廿、力▲率而以该消耗功率作為該待測對象的工作溫 • ^待對應的1溫絲使該散熱單元對 對象：ί Γ明中，藉由該待測對象之消耗功率決定該待測 埶兮產纟之熱量，藉此使該控制模組依據散熱單元之散 測對象之消耗功率的關係以控制該散熱單元 m^. θ Μ政熱早凡係為風扇，當該待測對象 二產生的熱1過高時’該控制模組驅使風扇以全速進 =，以降低該待測對象所產生的熱量，且由於該電子設備 ^寺測對/象會因應電子設備的系統運作狀況而相對停 而π: ’故相對象在停止運作時並不會消耗任何功率， =二 ==使該風扇維持在低速運轉狀態，故可 有社制風扇在轉速變化時所產生的噪音。因此，本㈣ 系統即依據功率消耗所造成的溫度影響而;乍 為政熱機制的參考。 二 行本發明之散㈣ 声目, f中的待測對象進行工作溫 且在偵測到工作溫度高於一預定值 =中：傲熱單元對該待測對象進行散熱，該溫度镇測 方法係包括以下步驟：偵測該待測對象的工 摘測到的工作電流轉換為可供該電子設備讀取之=位作 以及依據該触㈣騎衫絲制_對㈣消 :=?:Γ消耗功率作為該待測對象的工作溫度，並 “ J以所對應的工作溫度驅使該散熱單元對該待 19745 7 200819957 測對象執行散熱。 相車乂於白知技術’本發明之溫度偵測系統及方法可有 放排除自知孤度感測晶片的設置需考慮待測對象所在位 =以及派度㈣處理上電子設備需對應具備可支援該溫 又感測晶片之傳輸線的問題，此外，由於依據待測對象實 除功率肩耗'!月形來執行散熱，故可有效控制噪音的產生， 且亦可免除恤度感測晶片的設置，因而降低電子設備的電 '、二 另方面，依據散熱單元之散熱效率與待測對象 S耗力率的_以控制該散熱單元之散熱效能，進而達 =電子設備之節能控制。再者，透過本發明之溫度_ 太^更可求得待測對象之消耗功率’並以此作為待測對象 二耗，或者是可求得電子設備整體系統所有的 二:=!:==的溫度影響而作為_ 的雷二 據電子設備的整體系統或局部 1力率來㈣該散熱單摘能發揮的 ==此作爲電子設備對於散熱上的節能控制。 以下藉由特定的具體實施例說明本發明 技藝之人士可由本說明書所揭示之 瞭解本發明之其他優點及功效。本發 ： 的具體實施例加以施行或應用，本說明書中=其他=同 可基於不同的觀點與應用，在不標離本發明之精:細即f 各種修飾與變更。 七_下進行 如弟1圖所示’係為本發明之溫度偵測系統！之基本 19745 8 200819957 :塊不意圖。該溫度谓測系統1係應用於電子設備; 的=直接内建於該電子設傷2中，以對該電子設備、 電子=':2°進t溫度感測’且於溫度感測後驅使該 ㈣的散熱單元21執行與該溫度感測結果對應 二：跡本實施例’該待測對象2〇例如咖，而該 測：果Α ?係例如風扇’該散熱機制例如包括當溫度感 ;』：=向溫’則電子設備2驅使風扇以全速運轉，以調 對象2〇的溫度。由於電子設備2内的電子元件 二:钱運作狀況㈣產生運作或停止運作的狀態，因 t在電子元件運作時將對應消耗功率，相對的，在電子元 件停止運料衫會祕任何功率，因此，本發明之溫度 ::ί丨統1即依據功率消耗所造成的溫度影響而作為散又 熱機制的參考。 月又 毛月之/里度偵測系統1係包括：偵測模組1 〇、轉換 =組11、控制模組12以及記憶體12G，以下即針對本發 明之溫度偵測系統1進行詳細説明。 " 一 °亥偵測杈組1 〇係用以偵測該待測對象20工作電产， 藉由，電流的❹j以取得對應的消耗功率，—般而言^200819957 IX. Description of the invention: [Technical field of the invention] The present invention relates to a temperature detecting system and method, and more detailed and related to the X measured according to the object to be measured (4) Measuring the power consumed by the object, and using the power consumption as the operating temperature of the object to be tested, to drive the heat dissipation unit to dissipate heat to the object to be tested when the temperature is detected to be higher than a predetermined value Temperature detection system and method. [Prior Art] With the development of science and technology, various types of electronic devices such as the measurement of the electronic equipment are tested, and the working temperature generated by the work of the four pairs of k-seven y 冤 0 0 , , , , , , , The sensing chip (IC) realizes the measurement of the temperature generated by the system, r\, such temperature measurement mode, the temperature sensing wafer must be disposed adjacent to the object to be measured for temperature measurement, such as a medium-sensitivity sensing chip and Setting method, * limited to - , u This current temperature measurement method can not measure the temperature of all electronic parts in the electronic government. In addition, the temperature adopted in this type of temperature measurement has a fixed transmission line specification, so that & 曰 曰 本身 八 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 It must be provided with the transmission (4) :ί: 2, the object to be tested does not have a connection line corresponding to the transmission line of the temperature sensing 2, therefore, such temperature measurement mode is also limited by /, the temperature sense Measure the connection line corresponding to the transmission line of the chip. Therefore, how to design a temperature measurement system to overcome the wafer placement position is limited by the location of the object (4) and temperature 1 degree = 19745 200819957. It has the ability to support the temperature sensing chip '· , , , It is only for the problem of uranium. SUMMARY OF THE INVENTION In view of the above-mentioned problems of the prior art, the present invention relates to a temperature detecting system and method for solving the problem of the position of the object to be tested and the temperature of the object: The heat dissipation efficiency of the temperature unit is based on the relationship between the power consumption of the electronic material and the power consumption of the π 政 以 控制 控制 控制 控制 控制 控制 控制 控制 控制 控制 控制 控制 控制 控制 5 5 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥A further object of the present invention is to provide a temperature measurement system. The present invention provides a detection system and method for detecting power consumption and heat measurement of an electronic device on an overall system for all of the above purposes and other purposes. The temperature detecting system of the present invention is used for detecting the working temperature of the object to be tested, and driving the heat dissipating unit in the electronic setting when detecting the value of the tool I > (4) The object to be tested performs heat dissipation, and the temperature system includes: detecting the operating mode to measure the working current of the object to be tested; and converting the operating current detected by the detecting module into a digital signal And the control module is used to obtain the object to be tested according to the digital signal when receiving the digit signal of the conversion module. 19745 6 200819957 •洚,廿, The power consumption rate is used as the operating temperature of the object to be tested, and the corresponding temperature of the object to be tested is determined by the power consumption of the object to be tested.热量 兮 纟 , , , , , , , , , , , , 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该When the heat 1 is too high, the control module drives the fan to Full speed input = to reduce the heat generated by the object to be tested, and because the electronic device ^ Temple test / image will be relatively stopped in response to the operating conditions of the electronic device system π: 'The phase object does not stop when operating It will consume any power, = two == to keep the fan at low speed, so there is noise generated by the social fan when the speed changes. Therefore, the (4) system is based on the temperature effects caused by power consumption; 乍 is the reference for the political heat mechanism. The second row of the present invention (four) sound, the object to be tested in f is working temperature and the detected working temperature is higher than a predetermined value = medium: the proud unit heats the object to be tested, the temperature measurement method The method includes the following steps: detecting that the working current measured by the work of the object to be tested is converted into a position that can be read by the electronic device, and according to the touch (four) jersey wire _ pair (four) elimination: =?: Γ The power consumption is taken as the working temperature of the object to be tested, and “J drives the heat dissipation unit to perform heat dissipation on the object to be tested by the corresponding operating temperature.” The vehicle is in the temperature detection system of the present invention. And the method can exclude the setting of the self-aware orphan sensing chip, and the position of the object to be tested needs to be considered = and the (4) processing electronic device needs to have a transmission line capable of supporting the temperature sensing chip, and According to the object to be tested, the shoulder power consumption is removed, and the heat dissipation is performed, so that the noise can be effectively controlled, and the setting of the sensing chip can be eliminated, thereby reducing the electric power of the electronic device and the other aspects. Heat dissipation The heat dissipation efficiency of the element and the power consumption rate of the object to be tested _ to control the heat dissipation performance of the heat dissipation unit, thereby reaching the energy-saving control of the electronic device. Furthermore, the temperature of the invention can be obtained by the temperature _ too ^ The power consumption is taken as the second consumption of the object to be tested, or the temperature of the entire system of the electronic device can be determined: the temperature of the whole system: ==:== The power rate can be used to understand the energy-saving control of the electronic device for heat dissipation. The following describes the other advantages of the present invention by those skilled in the art by the specific embodiments. And the specific embodiments of the present invention are implemented or applied. In the present specification, the other = the same can be based on different viewpoints and applications, without departing from the essence of the invention: fine, that is, various modifications and changes. According to the diagram shown in Figure 1, the system is the temperature detection system of the present invention! Basic 71974 8 200819957: Block is not intended. The temperature pre-measurement system 1 is applied to electronic equipment; = directly built in the electronic design 2, in the electronic device, electronic = ': 2 ° into t temperature sensing ' and after the temperature sensing drive the (four) of the heat dissipation unit 21 to perform the corresponding with the temperature sensing result: The object to be tested 2, for example, a coffee, and the measurement: for example, a fan, the heat dissipation mechanism includes, for example, a sense of temperature; 』: = to the temperature, the electronic device 2 drives the fan to operate at full speed to adjust the object 2 Temperature. Because the electronic component 2 in the electronic device 2: the operating state of the money (4) produces a state of operation or stop operation, because t will consume power when the electronic component operates, in contrast, any power in the electronic component stops the shirt. Therefore, the temperature of the present invention is a reference to the heat dissipation mechanism depending on the temperature influence caused by the power consumption. The monthly and monthly detection system 1 includes: detection module 1 转换, conversion=group 11, control module 12, and memory 12G. The following is a detailed description of the temperature detection system 1 of the present invention. . " A °H detection group 1 is used to detect the working power of the object to be tested 20, by the current ❹j to obtain the corresponding power consumption, in general ^
偵測杈組10係為電流偵測電路。本實施例中，待測對象X 20之工作電流決定其所消耗的功率，且由所消耗的 可確疋轉測對象2G所產生的熱量，並藉 對象的工作溫度。 巧z待測 轉換模、、且1 1係用以對該债測模組1 〇所偵測出工 作電流執行類比數位轉換（ADC)，以將該工作電流轉換為 19745 200819957 數位k號輪出。兮 組11所輸出的數位V// =用以於接收到該轉換模 單元21對該待測對^^依據該數位信號控制該散熱 控制模組12與轉換:模έ :仃相對之散熱機制。其中’該 線路達到數位信號的傳:處】係透過⑼或GPI。等傳輸 而言，二::二12例如該電子設備2的控制中心，舉例 控制模組：則二2,為里桌上型電腦或筆記型電腦’則該 伺服器，則二(cpu);若該電子，^ 記广㈣複數筆™^ 速及待測對象的❹數係指風扇的控制轉 耗功率相❹，如此广制轉速亦與預設的消 :的 沾田、&,、 数位“唬後，依據產生該數位信號 奐？η，：亦即该數位信號的最初產生源為該待測對 到的數位ΐ ::象，的阻值並將該阻值與所接收 …上 ）u 17 /爪經该待測對象的電流）進行運算，以 亍乂待測對象20所消耗的功率，使該控制模組12依據 :取得的待測對㈣之消耗功率自該記憶體12中取得與 ::對應之風扇控制轉速，進而驅使該散熱單元。依據取 知的風扇控制轉速進行散熱。 由上可知，该偵測模組10藉由偵測該待測對象20 所流經的電流’並由該轉換模組11對所測得的電流進行 數位轉換’以供該控龍組12依據所接收到的數位信號 19745 10 200819957 •與記憶It 120所預存的待測對象2〇 <阻值來取 .對㈣所消耗的功率，再以與該功率對應的風扇轉速來】 驅使該散熱單元執行散熱，因此，本發明之溫度 1係加入電流偵測電路（即偵測模組）並利用現有電= ::原有提供的類比數位轉換電路（即轉換模組）以及控 象=g卩可切待測料之祕功率独此作為待測對 的功饮=作:度’或者是可求得電子設備整體系統所有 機制的夫考功率消耗所造成的溫度影響而作為散熱 習知π 本發明之溫度_系統1即可有效排除 二;=的設置需考慮待測對象所在位置以及 曰：之值二理上電子設備需對應具備可支援該溫度感測 此外’由於依據待測對象實際功率 …、w麻末執仃放熱，可有效控制噪音的產生，且亦可免 二感測晶片的設置，因而降低電子設備的電源消耗， 耗功主1依據政熱單几21之散熱效率與待測對象之消 ==關係以控制該散熱單元21之散熱效能，進而二 到對電子設備2之節能控制。運 =過本發明之溫度_系統丨執行本發明之 ==程圖如第1圖所示，該方法包括以下實施步 令的待S2G1中’猎由偵測模組…貞測該電子設備2 中的=對象20的玉作電流。接著，進至步驟㈣。 所僅、、則二驟S202中’透過轉換模組11依據偵測模組10 、 虎。接著，進至步驟S203。 19745 11 200819957 於步驟S 2 〇 3中，兮如T在丨I指h Ί 0 •作於，運瞀屮H Μ工、、2依據所接收到的數位 H亥待測對象20所消耗的功率，使 =^=:-制散熱單元21來執行對繼機 、—在此肩祝明的疋，由於該控制模組12係盥 :數=作參數的記憶體120電性連接，其中該運作來： 轉才曰=的控制轉速及待測對象的阻值，且各風扇的控 ===的消耗功率相對應，例如，消耗功率越高則 轉換制模組12接收經該轉換模組u ==的數位信號(即流經該待測對象的電流)與 所消耗的功率，::值广以取得該待測對象20 作電屡取得方式包括待測對象的工 、乘以相對㈣玉作電流，或者待測對象的工作電 二象的方ί再乘以待測對象的阻值，於本實施例係以待測 々工作電流的平方後再細待測 率，使剩模組12依== 、^象20之消耗功率再取得與其對應之風扇控制轉 而驅使該散熱單元21依據取得的風扇控制轉速進 、才目較於習知技術，本發明之溫度偵測系統及方法，主 =過該偵測模組1(Μ貞測該待測對象Μ之工作電流， 〜工作電流轉換為數位錢以供電子設備Μ的控 對=12判讀，再經過消耗功率的運算方式取得該待測 1放熱早兀21之運作。因此，藉由本發明之溫 19745 12 200819957 度偵測系統及方法即可有效排除習知溫度感測曰曰… 考慮待測對象所在位置以及溫度偵測處理：：： t需:f具備可支援該溫度感測晶片之傳輸線的= 月由於依據待測對象實際功率消 二 ，，故可適時調整風扇運轉工作，例如，待測對象= =率達到南功率時才驅使風扇以全速方式運轉，否則， 右待測對象停止運作從而未有任何功率風 運轉或使該風扇維持在低速運轉狀態，因此，本== 統及方法亦可有效控制風扇在轉速變化時所產 【圖式簡單説明】 弟1圖所示係為本發明之溫度偵測系統之基本架構 方塊示意圖；以及 第2圖所示係為本發明之溫度偵測方法之基本流程 圖0 【主要元件符號說明】 1 溫度偵測系統 10 偵測模組 11 轉換模組 12 控制模組 2 電子設備 20 待測對象 21 散熱單元 S201-S203 步驟 13 19745The detection group 10 is a current detecting circuit. In this embodiment, the operating current of the object X 20 to be tested determines the power consumed by the object, and the heat generated by the object 2G can be confirmed by the consumed, and the operating temperature of the object is borrowed. The analog conversion mode is to be tested, and the 1 1 system is used to perform an analog-to-digital conversion (ADC) on the operating current detected by the debt measurement module 1 to convert the working current into the 19745 200819957 digital k-round . The digital V//= outputted by the group 11 is used to receive the conversion mode unit 21 to control the heat dissipation control module 12 and the conversion according to the digital signal according to the digital signal. . Among them, the transmission of the digital signal to the digital signal is transmitted through (9) or GPI. For the transmission, two:: two 12, for example, the control center of the electronic device 2, for example, the control module: then 2, for the desktop computer or the notebook computer, then the server, then the second (cpu); If the electronic, ^ remember wide (four) complex pen TM ^ speed and the number of objects to be measured refers to the fan's control power consumption is opposite, so the wide speed is also the default elimination: the smudge, & After the digit "唬", according to the generation of the digital signal 奂? η,: that is, the initial source of the digital signal is the resistance of the digital ΐ :: image to be tested and the resistance value is received The power of the object to be tested is calculated by the current of the object to be tested, so that the power consumption of the object to be tested 20 is obtained by the control module 12 according to the power consumption of the obtained pair (4) to be obtained from the memory 12 And obtaining the corresponding fan control speed, and driving the heat dissipating unit to dissipate heat according to the learned fan control speed. As can be seen, the detecting module 10 detects the flow of the object to be tested 20 The current 'and digitally converts the measured current by the conversion module 11' for the control group 12According to the received digital signal 19745 10 200819957 • With the object to be tested stored in the memory It 120 2 〇 < resistance to take the power consumed by (4), and then drive the fan speed corresponding to the power The heat dissipating unit performs heat dissipation. Therefore, the temperature 1 of the present invention is added to the current detecting circuit (ie, the detecting module) and utilizes the analog digital conversion circuit (ie, the conversion module) and the image control device provided by the existing electric device. =g卩 can cut the secret power of the material to be tested as the right to be tested = the degree: or the temperature effect caused by the power consumption of all the mechanisms of the electronic system as a whole can be obtained as a cooling Knowing π The temperature of the invention _ system 1 can effectively exclude two; = the setting needs to consider the location of the object to be tested and the value of 曰: the two electronic devices must be equipped to support the temperature sensing in addition to the The actual power of the object..., w, the heat of the hemp, can effectively control the generation of noise, and can also avoid the setting of the second sensing chip, thus reducing the power consumption of the electronic device, and consuming the main body 1 according to the political hot list 21 The relationship between the efficiency and the object to be tested is == to control the heat dissipation performance of the heat dissipation unit 21, and further to the energy saving control of the electronic device 2. The temperature of the present invention is _ 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨As shown in Fig. 1, the method includes the following steps of S2G1: the hunting detection module ... measures the current of the object 20 in the electronic device 2. Then, proceeds to step (4). Then, in step S202, the detection module 10 and the tiger are transmitted through the conversion module 11. Then, the process proceeds to step S203. 19745 11 200819957 In step S 2 〇3, for example, T is in the 丨I finger h Ί 0 • For the operation of H, 2, according to the power consumed by the received digital H object 20, the =^=:- heat dissipation unit 21 is used to execute the relay, the shoulder Zhu Ming's flaw, because the control module 12 is: the number = the memory 120 of the parameter is electrically connected, wherein the operation is: the control speed of the switch = the resistance of the object to be tested, and the fan The power consumption of the control === corresponds to, for example, the higher the power consumption, the conversion module 12 receives the number of the conversion module u == The signal (that is, the current flowing through the object to be tested) and the consumed power, the :: value is wide to obtain the object to be tested 20, and the method of obtaining the electric power repeatedly includes the work of the object to be tested, multiplied by the relative (four) jade current, or The square of the working electrical image of the object to be tested is multiplied by the resistance value of the object to be tested. In this embodiment, the square of the working current to be measured is used to finely measure the rate, so that the remaining module 12 is == ^ The power consumption of 20 is corresponding to the corresponding fan control, which in turn drives the heat dissipation unit 21 to control the rotation speed according to the obtained fan control speed. The temperature detection system and method of the present invention are mainly Detecting module 1 (measuring the working current of the object to be tested, the working current is converted into digital money for the control of the electronic device = = 12, and then the power consumption is calculated to obtain the heat release to be tested 1 As early as 21 operations. Therefore, the temperature detection system and method of the invention can effectively eliminate the conventional temperature sensing 曰曰... Consider the position of the object to be tested and the temperature detection processing::: t: f needs to support the The transmission line of the temperature sensing chip = month is adjusted according to the actual power of the object to be tested. Therefore, the fan operation can be adjusted in time. For example, when the object to be tested == the rate reaches the south power, the fan is driven to operate at full speed. Otherwise, The right object to be tested stops operating so that there is no power wind running or the fan is kept at a low speed. Therefore, the system can effectively control the fan when the speed changes. [Simple description] Brother 1 The figure shows the basic architecture block diagram of the temperature detecting system of the present invention; and FIG. 2 shows the basic flow chart of the temperature detecting method of the present invention. [Main component symbol description] 1 Temperature detecting system 10 Detection module 11 conversion module 12 control module 2 electronic device 20 object to be tested 21 heat dissipation unit S201-S203 step 13 19745