201240035 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種包含一基板及固定至該基板之一組件 之總成，且係關於一種在一基板上形成一組件之一總成之 方法。 【先前技術】 在一烊料連接中，將一第一物體（在本情況中其可為一 光學及/或電組件之組件）固定至一第二物體（目前稱為一基 板）（藉由在該二個物體之間提供一熔融焊料材料）。隨著該 焊料材料凝固，藉由將該焊料材料黏合至該兩個物體形成 一機械穩定連接。 本發明一方面係關於該基板上之一組件之精確放置及對 準，且另一方面係關於獲得該組件與該基板之間之良好熱 傳導。兩個方面在光學應用中（尤其其中該組件包括產生 需要耗散之熱之一光源）特別重要。 美國第6,709,898號描述一微電子封裝。在一自對準焊料 實施例t ’在散熱片上準確地放置—微電子晶粒，同時 提仏熱傳導。藉由對一晶圓之背表面應用一濕潤層在該晶 圓上形成第-複數個焊料凸塊。在該濕潤層上圖案化諸如 光阻之-可移除焊料壩。可藉由將_糊狀物網版印刷至 該光阻之開口中並將該糊狀物回流以形成焊料凸塊形成該 等焊料凸塊。同樣地’用一濕潤層及—可移除焊料壩在該 散熱片上料第二複數個焊料凸I接著在該散熱片上放 置該微電子晶粒。接著加熱該散熱片以回流該等焊料凸 159706.doc 201240035 束使仔。亥等凸塊之間之毛細管作用在該散熱片上對準該 晶粒。 【發明内容】 务月之目的係提供一基板上之一組件之一總成及一 種形成此-總成之方法，該總成料該組件之精確定位及 良好熱傳導兩者。 X目的係藉由根據技術方案丨之一總成及根據技術方案 10之一方法達成。附屬技術方案指本發明之較佳實施例。 ，、上安裝該組件之基板包括配置於其中安裝該組件之表 面上之至少兩個覆蓋層。可能提供僅具有此兩層之該基 板例如，直接在一基板材料上之一第一層及直接在該第 、層上之第一層，其中該第二層形成一經曝露之外層。 然而’如將瞭解，本發明並非嚴格限於此兩層結構；可能 在該第-覆蓋層與該第二覆蓋層下方、之間及，或頂部上 安置另外之層。 該第一覆蓋層及該第二覆蓋層兩者由金屬製成。該第一 下層係對於-焊料材料非濕潤，且該第二外層係自對於該 焊料材料濕潤之一材料製成。濕潤描述該焊料材料在經熔 融以接觸該等層之表面時之能力。對於可或不一定含有鉛 (Pb)且含有錫（Sn)、鋼（Cu)、銀（Ag)、鉍（Bi)、銦（in)、鋅 (Zn)及銻（Sb)之一或多者之較佳焊料材料，該第一層為濕 潤，使得該焊料材料在此層之表面上延展，而該第二層為 非濕潤，使得該焊料材料不在此表面上延展。用於該第二 層之此濕潤材料之實例係金（Au)及銀（Ag);用於該第一層 159706.doc -4- 201240035 之非濕潤材料之實例係鎳（Ni)、鈦（Ti)、鈦鎢合金（Tiw)、 鈀（Pb)及翻（Pt)。 在該第二層中形成-切口，使得形成曝露該非濕潤第— 層之一焊料壩，定界作為一焊接襯墊之該表面之一部分。 此一焊接襯墊可為任何期望形狀，諸如圓形、矩形等等。 在該焊接襯墊之邊緣處，該第二濕潤層不再覆蓋該第一非 濕潤層，使得焊料材料藉由黏合劑/黏著劑分子間力操縱 濕潤/非濕潤行為而侷限於該焊接襯塾。 藉由一焊接連接將一組件固定至該基板。在該焊接襯墊 上配置焊接材料且將該組件固定至該焊接襯墊，因此形成 一剛性機械連接。 因此形成之連接一方面具有該組件與該基板之間之良好 熱接觸之優點。該焊料材料及該等第一及第二覆蓋層係金 屬材料’使得良好熱傳導得以確保。 另一方面，該總成之結構容許一有效製造製程，同時獲 仟該組件在該基板上之位置及方向對準之高精密度。該組 件之對準可沿該焊接襯墊（即，藉由形成於該第二覆蓋層 中之切口）達成。 較佳地，接觸該基板之組件之下表面及接觸該組件之基 板之上表面兩者係平坦、平面之表面。在較佳實施例中， 该基板係-散熱片（即’由用於良好熱傳導之一金屬材料 (諸如鋁（A1)、銅（cu)等等）組成之一本體）且延伸超出用於 熱耗散之焊接襯塾。該散熱片可包括諸如冷卻片等等之熱 耗散結構。進-步較佳地，該組件包括至少—光學元件， I59706.doc 201240035 特别係一光源、反射器及/或—透鏡。對於此—光學元 件，精確對準可能至關緊要。特別對於一光源，尤其係一 發光二極體（LED)或雷射源，精確對準及良好熱接觸兩者 具有決定性優點。 較佳地’藉由首先提供一完整層且接著燒蝕該層以形成 切口而在該第二覆蓋層中形成該切口。雖然原則上用於 移除用於形成該焊料塌之第二層之不同方法係可能的，但 是特別較佳地使用-經引導光束來燒姓該第二層。此可為 -粒子光束（諸如’例如’一電子光束），但是較佳地使用 雷射韓射。可藉由光學構件依一極精確方式實現此一光束 (特別係-雷射光束）之方向。因此，該焊接概塾在該基板 之表面上之定位可容易用極高精密度達成。 在形成該焊接襯墊後’較佳地藉由回流焊接將該組件固 定至料接襯^在喊焊接中，在該燁接襯墊上配量焊 料材料且在頂部上放置該組件。接著加熱該焊接襯塾以溶 融該焊料㈣㈣成料接連接。㈣難地在該焊接概 塾上黎散地放置該組件，即，在該焊接襯塾及焊料材料上 設定該組件，而未將其固定於適當位置及定向。在回流焊 接期間1 ’加熱並炼融該谭料材料，該經鬆散地放^之 組件將在該焊料襯塾上藉由作用於該焊料材料與該組件之 間之分子間力自動對準自身。因此，該組件將自動地 相對於該焊接襯墊之邊界（即，該焊接壩）對準之一蛵界^ 之位置。依此方式，可達成―剛性機械連接，該剛性機: 連接之精密地主要取決於該焊接壩之精確二 14可相對 159706.doc -6 · 201240035 容易達成至一高精密度程度。 根據本發明之一較佳實施例，不僅在一單一焊接襯墊 處而且在複數個焊接襯墊處將該組件固定至該基板。較 佳地藉由如上所述在該第二濕潤覆蓋層令形成切口在該基 板之表面上形成該等焊接襯墊之各者使其等彼此相鄰。因 此，可藉由焊料壩分隔個別焊接襯墊。提供複數個焊接襯 塾可有助於該組件之精禮對準。進―步言之，為用焊接材 料均勾地覆蓋-較大表面，已證明將該表面之部分分隔為 不同的焊接襯墊以達成該焊料材料之之分佈之更好的均勻 系有利的特疋5之，較佳地在每一焊接襯墊上提供該 焊接襯墊之每單位表面之實質上相同量的焊料材料。在相 等大小表面之焊接襯墊之—較佳情況中，谭料材料量將因 此為至V實質上相等（其中應明白「實質上」#等意謂一 ”。疋焊接襯墊上之焊料材料量與相同組件之全部焊接概塾 上方之平均量相差將不會多於㈣，較佳地不多於㈣）。 該焊料材料之此㈣分佈最小化該組件相對絲板之表面 之可能傾斜量，這在光學應用中特別重要。 該組件之下表面（即，面對該等焊接襯塾之表面）將較佳 地包括具有對於該焊料材料之濕潤性質之—金屬材料。進 -步較佳地，在下組件表面上，形成一或多個焊接襯塾。 特別地較佳地，該組件上之定位襯墊之數目、大小及配置 對應於形成於該基板上之焊接襯墊之數目、大小及配置。 此用以提供精確定位。該組件之下表面上之個敎位概塾 可再人藉由曝露非濕潤材料（例如，該組件之陶究材料）之 159706.doc 201240035 焊料壩定界。 【實施方式】 將從較佳實施例之下列描述瞭解本發明之上述及其他目 的、特徵及優點。 圖1展示一散熱器，其作為對其上安裝一電鍍/光學組件 12(參見圖4)之一基板1〇。在一第一實施例中，該電鍍/光 學組件12係一 LED模組，其包括安裝在一陶瓷板16上之4 個高功率LED 14。 如圖2之截面圖中所示之基板1〇包括銅（Cu)或具良好熱 傳導之另一材料之一主體18，該主體以藉由一第一覆蓋層 2〇覆蓋，該第一覆蓋層2〇在本實例中係一錄層，在該第一 覆蓋層20之頂部上提供一第二覆蓋層22,該第二覆蓋層η 在本實例中係一金（Au)層。 應強調該等圖中展示之截面圖未按比例繪製。為闡釋性 目的’與遠本體18之厚度相比，此處該層厚度似乎比其實 :厚度大得多。可依複數種不同方式(諸如電解電錢或無 電極電鍵製程）在該本體18上提供該等覆蓋層2〇及&其 等之厚度一般而言將自料伞 •微未至1 〇微米之範圍變化。較 ^層亦將運作但成本增力方面提供料覆蓋層20 22 用於腐蝕保護。另一方面，如 20、22以將該組件12安裝至节 ^ 用遺等覆蓋層 將憑藉使用—焊料材料之坦上表面上。 連接。可使用若千X η ,绰枓連接製成至該組件12之 焊料材们Μ 材料(包含含紹以及不含船之 4材枓)。較佳焊料材料普物，。以上)係基於錫 159706.doc 201240035 (Τη) ’諸如例如基於sac之焊料、基於SnAg之焊料或基於 SnAu之焊料。 對於該等上文提及之材料，由鎳組成之第一層2〇為非濕 潤且由金組成之第二層22為濕潤，即，當焊料材料熔融時 該焊料材料將容易地接觸該第二金層（該表面上之液體材 料之一滴之小接觸角），而該第一鎳層將不容易被接觸（大 接觸角）。 如下文將解釋’此等性質引導熔融之焊料材料在其中涉 及濕潤及非濕潤表面兩者之組態中之流動。此處，該焊料 材料將跟隨該濕潤表面材料，且將不運行至非濕潤材料之 毗鄰表面區域中。為使用此效果，該第二層22必須比該第 一層20更濕潤，即，更容易地由該焊料材料接觸。 如下有利地使用該第一層20及該第二層22之此濕潤/非 濕潤性質.在該基板1 〇之表面上，藉由焊接塌26定界形成 焊接襯墊24 ^藉由部分移除該第二層22形成該等焊接壩26 而形成曝露該第一鎳層20之縱向凹槽26。該等因此形成之 焊接襯墊24具有包括該金層22之一表面且藉由該第一層2〇 之所曝露之鎳材料在全部側上毗鄰。 較佳地藉由用一雷射光束28之輻射而形成該等凹槽26， 其中已元整移除該第一層22之材料以曝露底下之第一層 2〇。應小心地控制該雷射輻射之強度及持續時間以在該等 凹槽26内安全地移除該第二層22。一般而言，將控制該製 程以在該等凹槽26内完整蒸發該第二層22，且亦蒸發該第 —層20之一部分。然而，該第一層2〇之至少一最小厚度將 § 159706.doc 201240035 留下。可使用藉由經合適地控制之光學器件引導之一高強 度雷射28使此處理容易地達成至一高精密度程度。此處， 可使用能夠燒蝕該層22之任何類型的雷射系統，較佳地， 採用基於短脈衝且匹配雷射光之頻率之一雷射系統。 需要在足以確保每一焊接襯墊24上提供之焊接材料將歸 因於該第一鎳層20之非濕潤性質而不延展超出該焊料壩之 一寬度中提供該等凹槽26。一般而言，此應藉由提供（例 如）3 0微米至500微米厚度之凹槽確保。 在因此形成該等焊料襯墊24後，接著將焊料材料3〇配量 至該等焊料襯墊24上（圖4、圓5)。在較佳實例中，如該等 圖中所示，形成4個相等大小的焊料襯墊24。而且，將約 相等量的焊料材料30配量至該等焊料襯墊24之各者上。可 .將該焊料材料3G應用作為數個斑點之焊料糊狀物或替代地 應用於一印刷製程中。 如圖4、圖6中所示，接著將該組件12放置在該因此製備 之基板ίο上。在該組件12之陶瓷板16下方形成定位襯墊 32,其等在大小、數目及配置上與形成於該基板ι〇之表面 上之4個焊料襯墊24相等。 如圖7中所示’將該組件12鬆散地放置在基板⑺之表面 上’接著在-回流焊接製程中被固定。該組件12之放置無 需精確。料料襯墊24與料^鮮32之間之一偏移 係可容忍的。 在後續回流焊接製程中，加熱整個總以㈣該焊料材 料3〇。歸因於濕潤/非濕潤性質，分子間力作用於該焊料 159706.doc 201240035 材料30與該等定位襯墊32之間以在焊接襯墊24上精確地對 準定位襯墊32，且因此將組件12極準確地對準至該基板1〇 之表面上（參見圖8)。因此，藉由該基板1〇之焊接襯墊24與 該組件12之定位襯墊32之間之最終焊接連接，形成一機械 穩定焊接連接以將該組件12固定至該基板1〇。歸因於所涉 及之金屬材料之良好的熱傳導性質，該組件12至該基板1〇 之熱接觸良好。而且’在該組件12之定位中達成之精密度 程度大部分對應於用燒蝕雷射28達成之精密度程度，使得 該組件12之位置準確度極高。 如圖7/圖8中圖解說明，作用於該焊料材料3〇與該等定 位襯墊32之間之分子間力將校正任何線性錯位以及該組件 12關於該基板1〇之一旋轉（只要初始定位足夠精密以具有 大部分重疊之定位襯墊32及焊接襯墊24，這應容易達 成）。藉由在每一焊接襯墊24上提供實質上相同量的焊料 材料3 0，形成4個均勻焊料連接，致使該組件丨2在未相對 於該基板10之表面傾斜之情況下精確對準。 可在不同的連接中使用上文描述之所形成之連接之方法 及類型。在上文第一實例中，電鍍光學組件12係安裝至一 散熱器10之一LED模組12。替代地，可將複數個此等LED 模組12安裝至相同的散熱器（較佳地並排在相同表面上）。 在此情況中，不僅對於一第一 LED模組12而且對於待安裝 之其他LED模組形成焊料襯墊24。接著可藉由一單一回流 焊接製程在相同時間將全部LED模組12固定至該散熱器 10。因此，可獲得多個LED光源之一模組，其中個別光源 159706.doc • 11 · 201240035 用高精密度對準且確保一良好熱接觸。 在-進-步實施例中’該基板___水冷卻器之一外表 面。在該基板ίο之表面上安裝複數個雷射模組來代替如上 文實例中所示之LED模組12。再次，該良好熱接觸容許藉 由該水冷卻H纽冷卻料雷射模組。額外地，極精確對 準容許在該總成前方形成—均勻雷射光帶。 在另-實施例中，該基板_—間隙器，包含用於雷射 模組之-群組之-平坦安裝表面以及用於微透鏡之一安裝 表面。兩者可藉由所描述之方法被固^至該間隙器，使得 達成極精確放置及因此良好光學對準。 雖然該等®式及前m w杜圖解說明並描述本發 明，但是此圖解說明及描述被視為闡釋性或例示性且非限 制性；本發明不限於該等所揭示之實施例。 舉例而言，可使用除金及鎳外之其他層材料，只要該第 一層22之濕潤度實質上比該第一層2〇之濕潤度更好。 在將一電組件12安裝至該基板1〇之全部情況中，該焊料 連接可使用作為一純機械接觸，但亦可用以作為一電接 觸，例如，用於對一 LED模組12提供操作功率。 該基板ίο可為一印刷電路板（MC_PCB)，較佳地一金屬 核心印刷電路板（PCB)，其中提供與該等金屬層20、22電 隔離之導電軌用於已安裝組件之電連接。 從對該等圖式、該揭示内容及隨附申請專利範圍之一研 究，熟習此項技術者在實踐主張之本發明時可明白且實現 對該等所揭示之實施例之其他變動。在該申請專利範圍 159706.doc S. -12- 201240035 中用θ「包括」並不排除装 - (「a… 不排除其他兀件’且不定冠詞「一」 」或 an」）並不排除福邀_ 同的附屬某些措施敘述在相互不 等粹事實並非指示不可有利地使用此 被言全釋為限制該料/專利1&圍中之任何參考符號不應 【圖式簡單說明】 圖1展示具有覆蓋層之一基板之一透視圖；201240035 VI. Description of the Invention: The present invention relates to an assembly comprising a substrate and a component fixed to the substrate, and a method for forming an assembly of a component on a substrate . [Prior Art] In a data connection, a first object (which in this case can be a component of an optical and/or electrical component) is fixed to a second object (currently referred to as a substrate) (by means of a substrate) A molten solder material is provided between the two objects). As the solder material solidifies, a mechanically stable connection is formed by bonding the solder material to the two objects. One aspect of the invention relates to the precise placement and alignment of one of the components on the substrate and, on the other hand, to achieving good thermal conduction between the component and the substrate. Both aspects are particularly important in optical applications (especially where the component includes one that produces heat that needs to be dissipated). U.S. Patent No. 6,709,898 describes a microelectronic package. In a self-aligned solder embodiment t' accurately placed on the heat sink - microelectronic grains while enhancing heat transfer. A plurality of solder bumps are formed on the wafer by applying a wetting layer to the back surface of a wafer. A photoresist-removable solder dam such as a photoresist is patterned on the wetting layer. The solder bumps can be formed by screen printing a paste into the opening of the photoresist and reflowing the paste to form solder bumps. Similarly, a second plurality of solder bumps I are applied to the heat sink by a wet layer and a removable solder dam, and the microelectronic grains are placed on the heat sink. The heat sink is then heated to reflow the solder bumps 159706.doc 201240035 bundles. The capillary between the bumps such as the hai is aligned on the heat sink to align the die. SUMMARY OF THE INVENTION The purpose of the present invention is to provide an assembly of one of the components on a substrate and a method of forming the assembly that combines the precise positioning of the assembly with good thermal conduction. The X objective is achieved by one of the technical solutions and one of the technical solutions. The subsidiary technical solution refers to a preferred embodiment of the present invention. The substrate on which the component is mounted includes at least two cover layers disposed on a surface on which the component is mounted. It is possible to provide the substrate having only two layers, for example, a first layer directly on a substrate material and a first layer directly on the first layer, wherein the second layer forms an exposed outer layer. However, as will be appreciated, the invention is not strictly limited to this two layer structure; additional layers may be placed under, between, or on top of the first cover layer and the second cover layer. Both the first cover layer and the second cover layer are made of metal. The first underlayer is non-wet to the solder material and the second outer layer is made from a material that wets the solder material. Wetting describes the ability of the solder material to be fused to contact the surface of the layers. For one or more of lead (Pb) and tin (Sn), steel (Cu), silver (Ag), bismuth (Bi), indium (in), zinc (Zn) and antimony (Sb) Preferably, the first layer is wet such that the solder material extends over the surface of the layer and the second layer is non-wet such that the solder material does not extend over the surface. Examples of such a wetting material for the second layer are gold (Au) and silver (Ag); examples of the non-wetting material used for the first layer 159706.doc -4- 201240035 are nickel (Ni), titanium ( Ti), titanium tungsten alloy (Tiw), palladium (Pb) and turn (Pt). A slit is formed in the second layer such that a solder dam exposing the non-wetting layer is formed to delimit a portion of the surface as a solder pad. This solder pad can be of any desired shape, such as circular, rectangular, and the like. At the edge of the solder pad, the second wetting layer no longer covers the first non-wetting layer, so that the solder material is limited to the solder pad by the intermolecular force of the adhesive/adhesive force to manipulate the wet/non-wetting behavior. . A component is secured to the substrate by a soldered connection. A solder material is disposed on the solder pad and the component is secured to the solder pad, thereby forming a rigid mechanical bond. The resulting connection thus has the advantage of having good thermal contact between the component and the substrate on the one hand. The solder material and the first and second capping layer metal materials' enable good heat transfer. On the other hand, the structure of the assembly allows for an efficient manufacturing process while achieving high precision in the position and orientation of the assembly on the substrate. The alignment of the assembly can be achieved along the solder pad (i.e., by the slit formed in the second cover layer). Preferably, both the lower surface of the component that contacts the substrate and the upper surface of the substrate that contacts the component are flat, planar surfaces. In a preferred embodiment, the substrate is a heat sink (ie, 'a body consisting of one metal material (such as aluminum (A1), copper (cu), etc.) for good heat conduction) and extends beyond the heat Dissipative welded lining. The heat sink may include a heat dissipation structure such as a cooling fin or the like. Preferably, the assembly comprises at least an optical component, and I59706.doc 201240035 is in particular a light source, reflector and/or lens. For this – optical component, precise alignment may be critical. Especially for a light source, especially a light emitting diode (LED) or a laser source, both precise alignment and good thermal contact have decisive advantages. Preferably, the slit is formed in the second cover layer by first providing a complete layer and then ablating the layer to form a slit. Although in principle it is possible to remove different methods for forming the second layer of the solder collapse, it is particularly preferred to use a guided beam to burn the second layer. This can be a -particle beam (such as 'for example an electron beam", but a laser shot is preferably used. The direction of the beam (especially the laser beam) can be achieved in an extremely precise manner by the optical member. Therefore, the positioning of the soldering pattern on the surface of the substrate can be easily achieved with extremely high precision. After forming the solder pad, the assembly is preferably secured to the splicer by reflow soldering, the solder material is dispensed onto the splicing pad and the assembly is placed on top. The soldering lining is then heated to dissolve the solder (4) (4) into a material connection. (d) Difficult to place the assembly on the soldering profile, i.e., set the component on the soldering pad and solder material without fixing it in place and orientation. Heating and smelting the tan material during reflow soldering, the loosely mounted component will automatically align itself on the solder pad by intermolecular forces acting between the solder material and the component . Thus, the assembly will automatically align with one of the boundaries of the weld pad (i.e., the weld dam). In this way, a rigid mechanical connection can be achieved, the rigid machine: the precision of the connection is mainly determined by the accuracy of the welding dam, which can be easily achieved to a high degree of precision relative to 159706.doc -6 · 201240035. In accordance with a preferred embodiment of the invention, the assembly is secured to the substrate not only at a single weld pad but also at a plurality of weld pads. Preferably, each of the solder pads is formed on the surface of the substrate such that they are adjacent to each other by forming a slit in the second wet cover layer as described above. Therefore, individual solder pads can be separated by solder dams. Providing a plurality of welded linings can aid in the aligning of the assembly. In the first step, in order to cover the larger surface with the solder material, it has been proved that the part of the surface is divided into different solder pads to achieve a better uniformity of the distribution of the solder material. Preferably, substantially the same amount of solder material per unit surface of the solder pad is provided on each solder pad. In the case of solder pads of equal size surfaces, the amount of tantalum material will therefore be substantially equal to V (where it is understood that "substantially" #, etc. means "a" solder material on the solder pad. The difference between the amount and the average amount over the entire soldering profile of the same component will not be more than (four), preferably no more than (4). The (4) distribution of the solder material minimizes the possible tilt of the component relative to the surface of the wire. This is particularly important in optical applications. The lower surface of the component (i.e., the surface facing the soldering lining) will preferably comprise a metallic material having a wetting property to the solder material. One or more soldering pads are formed on the surface of the lower component. Particularly preferably, the number, size and arrangement of the positioning pads on the component correspond to the number and size of solder pads formed on the substrate. And the configuration. This is used to provide precise positioning. The position on the lower surface of the component can be further reduced by exposure to non-wetting materials (for example, the ceramic material of the component) 159706.doc 201240035 solder dam BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features and advantages of the present invention will be understood from the following description of the preferred embodiments. Figure 1 shows a heat sink as an electroplating/optical assembly 12 mounted thereon (see Figure 4). A substrate 1A. In a first embodiment, the plating/optical assembly 12 is an LED module comprising four high power LEDs 14 mounted on a ceramic plate 16. Figure 2 is a cross-sectional view The substrate 1 shown therein comprises copper (Cu) or a body 18 of another material having good heat conduction, the body being covered by a first cover layer 2, which is in this example A recording layer is provided on top of the first cover layer 20 with a second cover layer 22, which in this example is a gold (Au) layer. The sections shown in the figures should be emphasized. The figures are not drawn to scale. For illustrative purposes 'the thickness of the layer here seems to be much larger than the thickness of the far body 18. The thickness can be varied in many different ways (such as electrolytic money or electrodeless key processing) Providing the cover layer 2 and the thickness of the cover layer 18 on the body 18. In general, it will vary from the range of the micro-objects to the micrometers. The layers will also operate but the cost-enhancing aspects of the material cover 20 22 are used for corrosion protection. On the other hand, such as 20, 22 The assembly 12 is mounted to the cover layer and the like. The solder layer is used on the surface of the solder material. It is a good solder material, and the above is based on tin 159706.doc 201240035 (Τη) 'such as, for example, sac-based solder, SnAg-based solder or SnAu-based solder. For the materials mentioned above, the first layer 2 of nickel consists of non-wet and the second layer 22 of gold is wet, ie the solder material will readily contact the solder material as it melts. The two gold layers (the small contact angle of one of the liquid materials on the surface), and the first nickel layer will not be easily contacted (large contact angle). As will be explained below, these properties direct the flow of molten solder material in configurations involving both wet and non-wet surfaces. Here, the solder material will follow the wetted surface material and will not travel into the adjacent surface area of the non-wet material. To use this effect, the second layer 22 must be more wet than the first layer 20, i.e., more easily contacted by the solder material. The wet/non-wet nature of the first layer 20 and the second layer 22 is advantageously used as follows. On the surface of the substrate 1 , a solder pad 24 is formed by soldering the bumps 26 by partial removal. The second layer 22 forms the weld dams 26 to form longitudinal grooves 26 that expose the first nickel layer 20. The thus formed solder pads 24 have a surface comprising one of the gold layers 22 and the exposed nickel material by the first layer 2 is adjacent on all sides. The grooves 26 are preferably formed by irradiation with a laser beam 28, wherein the material of the first layer 22 has been removed to expose the first layer 2 underneath. The intensity and duration of the laser radiation should be carefully controlled to safely remove the second layer 22 within the grooves 26. In general, the process will be controlled to completely evaporate the second layer 22 within the grooves 26 and also evaporate a portion of the first layer 20. However, at least a minimum thickness of the first layer 2〇 will be left by § 159706.doc 201240035. This process can be easily achieved to a high degree of precision by directing one of the high intensity lasers 28 by suitably controlled optics. Here, any type of laser system capable of ablating the layer 22 can be used, preferably one of the laser systems based on short pulses and matching the frequency of the laser light. It is desirable to provide the grooves 26 sufficient to ensure that the solder material provided on each of the solder pads 24 will be due to the non-wetting properties of the first nickel layer 20 without extending beyond a width of the solder dam. In general, this should be ensured by providing a groove of, for example, a thickness of 30 microns to 500 microns. After the solder pads 24 are thus formed, the solder material 3 is then dosed onto the solder pads 24 (Fig. 4, circle 5). In the preferred embodiment, as shown in the figures, four equally sized solder pads 24 are formed. Moreover, approximately equal amounts of solder material 30 are dosed to each of the solder pads 24. The solder material 3G can be applied as a solder paste of several spots or alternatively applied to a printing process. As shown in Figures 4 and 6, the assembly 12 is then placed on the thus prepared substrate ίο. Positioning pads 32 are formed under the ceramic plate 16 of the assembly 12, which are equal in size, number, and configuration to the four solder pads 24 formed on the surface of the substrate. The assembly 12 is loosely placed on the surface of the substrate (7) as shown in Figure 7 and then fixed in a reflow soldering process. The placement of the assembly 12 need not be precise. One of the offsets between the material liner 24 and the stock 32 is tolerable. In the subsequent reflow soldering process, the entire solder material is heated (4). Due to the wet/non-wetting properties, intermolecular forces act between the solder 159706.doc 201240035 material 30 and the positioning pads 32 to precisely align the positioning pads 32 on the solder pads 24, and thus will The assembly 12 is extremely accurately aligned onto the surface of the substrate 1 (see Figure 8). Thus, by the final solder joint between the solder pad 24 of the substrate 1 and the locating pad 32 of the assembly 12, a mechanically stable solder joint is formed to secure the assembly 12 to the substrate 1. The thermal contact of the assembly 12 to the substrate 1 is good due to the good thermal conductivity properties of the metal material involved. Moreover, the degree of precision achieved in the positioning of the assembly 12 largely corresponds to the degree of precision achieved by ablating the laser 28 such that the positional accuracy of the assembly 12 is extremely high. As illustrated in Figure 7/8, the intermolecular forces acting between the solder material 3 and the positioning pads 32 will correct for any linear misalignment and rotation of the assembly 12 with respect to one of the substrates 1 (as long as the initial Positioning is sufficiently precise to have a majority of overlapping positioning pads 32 and solder pads 24, which should be easily achieved). By providing substantially the same amount of solder material 30 on each solder pad 24, four uniform solder connections are formed, causing the assembly 丨2 to be precisely aligned without being tilted relative to the surface of the substrate 10. The method and type of connections formed as described above can be used in different connections. In the first example above, the plated optical assembly 12 is mounted to one of the LED modules 12 of a heat sink 10. Alternatively, a plurality of such LED modules 12 can be mounted to the same heat sink (preferably side by side on the same surface). In this case, the solder pad 24 is formed not only for a first LED module 12 but also for other LED modules to be mounted. All of the LED modules 12 can then be secured to the heat sink 10 at the same time by a single reflow soldering process. Therefore, a module of a plurality of LED light sources can be obtained, wherein the individual light sources 159706.doc • 11 · 201240035 are aligned with high precision and ensure a good thermal contact. In the -for-step embodiment, the outer surface of one of the substrate___ water coolers. A plurality of laser modules are mounted on the surface of the substrate ίο in place of the LED module 12 as shown in the example above. Again, this good thermal contact allows the H-coolant coolant module to be cooled by the water. Additionally, extremely precise alignment allows for the formation of a uniform laser strip in front of the assembly. In another embodiment, the substrate _-gap includes a flat mounting surface for the group of laser modules and a mounting surface for the microlens. Both can be secured to the gap by the methods described, such that extremely precise placement and thus good optical alignment is achieved. The present invention is to be construed as illustrative and not restrictive, and the invention is not limited to the disclosed embodiments. For example, other layers of material other than gold and nickel may be used as long as the wetness of the first layer 22 is substantially better than the wetness of the first layer. In all cases where an electrical component 12 is mounted to the substrate 1 , the solder connection can be used as a pure mechanical contact, but can also be used as an electrical contact, for example, to provide operational power to an LED module 12 . . The substrate ίο can be a printed circuit board (MC_PCB), preferably a metal core printed circuit board (PCB), wherein the conductive tracks electrically isolated from the metal layers 20, 22 are provided for electrical connection of the mounted components. Other variations to the disclosed embodiments can be understood and effected by those skilled in the <RTIgt; </RTI> <RTIgt; </ RTI> <RTIgt; The use of θ "include" in the scope of the patent application 159706.doc S. -12- 201240035 does not preclude the installation - ("a... does not exclude other conditions" and the indefinite article "a" or "an" does not exclude Inviting _ the same subsidiary certain measures are described in the unequal facts that are not indicative of the unfavorable use of this statement. All references to the material/patent 1& 1 should not be used [simplified illustration] Figure 1 Showing a perspective view of one of the substrates having a cover layer;
圖2、圖3展示具有沿線A 截面圖(未按比例)； 取-之截面之圖1之基板之 圖4展示基板上之-組件之放置之一透視圖； 圖5展示具有沿圖4中之線Α··Α取 ’ (未按比例冑面之-截面圖 圖6至圖8展示在具有沿圖4中之線Α...Α取得之截面之截 面圖（未按比例）中放置該組件之不同步驟。 截 【主要元件符號說明】 10 基板/散熱器 12 組件/電鍍光學組件/發光二 14 光學組件/高功率發光二極 16 陶瓷板 18 主體 20 第一鎳層/第一覆蓋層 22 金層/第二覆蓋層 24 焊接槪塾/焊料襯塾 26 焊料塌/切口 /凹槽/焊接壩 159706.doc -13- 201240035 28 雷射光束/雷射 30 焊料材料 32 定位襯墊 159706.doc -14-Figure 2 and Figure 3 show a cross-sectional view of the substrate of Figure 1 taken along line A (not to scale); taken from the section of Figure 1 showing a perspective view of the placement of the components on the substrate; Figure 5 is shown in Figure 4 Line Α··Α' (not drawn to scale - section view Figure 6 to Figure 8 shows a section (not to scale) in a section having a section taken along line 图... Different steps of the component. Cut [Main component symbol description] 10 Substrate/heat sink 12 component / electroplated optical component / light emitting diode 14 optical component / high power light emitting diode 16 ceramic plate 18 body 20 first nickel layer / first cover Layer 22 Gold/Second Overlay 24 Solder 槪塾/Solder lining 26 Solder collapse/cut/groove/weld dam 159706.doc -13- 201240035 28 Laser beam/laser 30 Solder material 32 Positioning pad 159706 .doc -14-