TW201237984A - Wafer machine regulator - Google Patents

Wafer machine regulator Download PDF

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Publication number
TW201237984A
TW201237984A TW100108323A TW100108323A TW201237984A TW 201237984 A TW201237984 A TW 201237984A TW 100108323 A TW100108323 A TW 100108323A TW 100108323 A TW100108323 A TW 100108323A TW 201237984 A TW201237984 A TW 201237984A
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TW
Taiwan
Prior art keywords
wafer
ϊϊγ
resisting
base
adjuster
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TW100108323A
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Chinese (zh)
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TWI451514B (en
Inventor
Yong-Jiu Huang
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Yong-Jiu Huang
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Priority to TW100108323A priority Critical patent/TW201237984A/en
Publication of TW201237984A publication Critical patent/TW201237984A/en
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Publication of TWI451514B publication Critical patent/TWI451514B/zh

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention relates to a wafer machine regulator, which mainly comprises a bearing body and a plurality of carriers proceed the balancing of the wafer in the reaction chamber via the balancing sheet, wherein the carrier defines a plane to support the balancing sheet and the balancing sheet is contacted with the wafer substrate in the reaction chamber. The plane also defines a vertical through-hole recessing the resisting column and the vertical through-hole is connected with an accommodation room. A resisting block, which can interact with the resisting column, is recessed in the accommodation room that also connects to a vertical through-hole. The vertical through-hole penetrates the rod assembled on the resisting block and the rotation adjustment set is mounted at the other end of the rod. The rod is driven to rotate and make the resisting block displaced when the rotation adjustment set performs the rotation, and even supports the resisting column to proceed with the lifting movement. That makes the wafer substrate able to be driven by the balancing sheet to achieve the wafer balance by the resisting column.

Description

201237984 六、發明說明: •【發明所屬之技術領域】 -本發明為提供-種晶圓機台調節E,尤指—種可迅速調整至 定位無須花費大量__整上,進而加速製程_,並且水 衡度準確度極高,更有效降個赃過度而發生職損制題, 置面ί貝斜設計,使其得以抵壓平衡板,而解決了 彈簧疲乏後所付生出之問題的晶圓機台調節器。 【先前技術】 曰ηΐ制H製程的技術已相當的純熟,也造就現今的晶圓王國,而 些機台進行製造,而以晶圓成形的部 内包括特殊的氣體’但因薄膜受限各種因素 2其 因此導致薄膜的厚度不一致,而常超出公差:U的速度不同, ==驗法槪約值範圍内即 成不易敵元全平衡狀態’瑕朗而產生 也 螺巾?鎖固過緊問題,俾使螺帽‘再:人 亦也造 員 抵 工 相 ^平衡板的彈簧產生疲乏現象時,亦會導致簧推力之問 與從事此行業之相:廠向發明之發明人 【發明内容】 方評估及考量,j多相,料,經由多 ^改,始設計出此種可迅速調整至水平定二斷試作及 !上’進,仏⑼恤“ 201237984 -帽損壞問題,另外,同時因承置體的承置面傾斜 .:圓機台調===者而解決了彈簧疲乏後, 未*n Γ圓進干衡而承載體之主要結構係包括一界定於預定 “传盘ft係界定有一供收容抵持柱之縱向穿孔,再該縱向 ίϋ'谷抵持塊之容置空間相連通,此容置空間又斑—界定於 向穿孔相連通,並橫向穿孔係穿設-桿體,其桿體二 轉調整組’其旋轉調整組係與該桿體背離組設該S 又,以提供桿體進行旋轉,並且旋轉調整組包括有-盥, n “ _座上係设有一齒盤座,該齒盤座頂面周圍係形成 2且齒盤座上、並被其界定有•部== 係故有一彈片;再者,該底座、齒盤座、齒盤及彈 i曰ίίίί 設1且旋轉套體係套接—握持體;藉此,當欲 可=ίϊϊΓίίίί'置放於承置體及承載體上之平衡板,即 二μ體為支撐鱗,予哺峽翻整組進行碰 ί:ίΐί:可手握握持體,此後即可轉動旋轉調整組,並於二1 ^即被轉動而使抵持塊因螺紋作動使其位移,並頂推抵 手 抵持柱了降,並進而帶動平衡板進行上升、ΐ降, ^進Γ平衡罐;藉由上述技術,可針對習用晶圓平衡 術人負於調整螺帽時大多依靠個人經驗 ,瑕朗而產生,再-問題即相關技術人員若因猶 過’俾使螺帽損壞,再者,抵持平衡板的彈箬產ίΐϊ 現象時,亦會導致平衡板失去彈簧推力關題點加 备時間’ it且水平平衡度準確度極高,更有 , 螺帽損制題’糾,同時縣置體的承置_斜設計 201237984 •壓平衡板,而解決了彈簣疲乏後所衍生出之問題之實用進步性。 _【實施方式】 為達成上述目的及功效,本發明所採用之技 圖就本發賴佳實關詳加綱其舰與魏如下 兹緣 ★請參閱第-圖、第二圖、第三圖、第四圖、第 解。 第五6圖所示,係為本發贿佳實關之立鋼―、 A圖及 5、二、實施示意圖、實施剖視示意圖及三點Si實3 圖中可清楚看出本發明係透過機台調㈣經由平 有^至8内的晶圓基板8 χ做角度調整,其機台調節器主要結構包括 一承置體1,係供抵壓該平衡板i 〇之一端處,且 平衡板所接觸面處係界定有呈傾斜態樣之承置面丄i .置體 右、柱3,係穿設該縱向穿孔2 2,且該抵持柱3-側係形成 有⑺槽31,並該滑槽3丄内係滑有一柱體32 ; 戌 觸,4,練容於該容置空間2 3内、並與抵持柱3相互抵 抵持柱3所接觸處係界定有呈傾斜態樣之抵持面4 1,再 曰协二=5,係穿設該橫向穿孔24、並—端與螺孔4 2相組接, ★向穿孔24内容設有數個得以與該桿體5相互作動之滚珠5 ,及 整組6,該旋轉調整組6係設於該承載體2 一側,且該 係'與鱗體5 f離組設該螺孔4 2之端處相接設,盆中 整組6係包括有-與該承載體2相顧之底座6 1,並該底 二桿體5所穿設;—環設於該底座61之旋轉開關6 2,該 疋#關6 2内係界定有至少一可與該底座61相抵觸之肋條6 21 201237984 :且該肋條6 21-端處係界定有一第 • 6 1上、並被桿體5所穿設之齒 於該底座 •形成有齒部6 3 1,_齒盤座6 3f 3=面周圍係 相抵固之抵固部6 3 2,該抵_6 3 i 得以與旋轉開關6 2互動之第二斜面6 3 3 ; 有- 、並被桿體5所穿設之齒盤6 4,該齒般 齒盤座6 3上 ^相嚙合之嚙合部6 4 1,並且齒盤;4上與:部6 ,相嵌固之孔洞6 4 2 ;-設於齒盤6 與下述 旱體5所穿設;—於表面界定有刻度之H6 ί定有容置空間6 6 1,係用於套麟底座6^轉=”;其内係 及彈片6 5 ’並該旋轉套體6 6内壁係以3、齒盤 體6 7,係套接於旋轉套體6 6上,以g ^ 6 2,-握持 :一 '二、分解圖-、二》=圖=== 、動作示意圖一^, h t —‘,,,占十衡之實轭不意圖 過財使用持=動=整組6進行调整,於調整 :透過旋轉套體6 明(亦 ⑵步性),此時 數個滾珠If 以對桿體5進行微調旋轉,同時 Ϊ11緩慢將抵持柱3進行升降:以此實施抵 被往上頂,抵持柱3即 部,抵持ΐ持柱3底即被滑移到抵持塊4斜面的最底 旋轉開關6 ?鏟!?2下降位’而後當晶圓8達解衡狀態時,即可將 轉開關62轉至鎖固狀態(即關閉狀態),其鎖固狀態時, 201237984 .6 3』推钭=片2广觸並交錯使齒盤座 .生固定效果,反之,若將嫌“:=套=,3 第-斜面6 2 2即與第二斜面6 3 3即相互:狀》== 盤6 4往-端頂推,使旋轉套體6 6得6 5將齒 為兩側支點,以形成-三角形細平㈤,#為第—支立點’承載體2 為傾斜態樣,因此使平衡板JL有更大的▲敕^置體1因承置面1 1 體2達同-平衡高度=,、= =:使承歷 的調整’以物理特性來說,當以承置體1==二= «1 omtLtt 是以,本發明之晶圓機台調節器為可改盖 ς 9平體]•達;三點“,亦達到㈣調整晶圓 9千衡之狀I、φ相-般制無法調到 :糊2上之抵持柱3、抵持塊4、桿體5、及旋二=過: 付可輕易並準確的調整晶圓9的平衡,因此 迅^ 平定位,無須花費大量時間於調整上,進而加 同時因承置^的承置面i i傾斜設計,使其得以板3,’ 而解決了彈簧疲乏後所衍生&之問綱制進步性者。、 惟,以上所述僅為本發明之較佳實施例 明之專利範圍,故舉凡運用本發明說明書及圖 綜上所述,本發明之晶圓機台調節器於使用時; 功效及目的’故本發明誠為—實用性優異之發明,為^日:卜 申請要件,爰依法提出申請,盼審委早日賜准發d = 人定當竭力配合,實感公便。 各;函扼不,發明 201237984 【圖式簡單說明】 第圖係為本發明較佳實施例之立體圖一。 第二圖係為本發明較佳實施例之分解圖一。 第三圖係為本發明較佳實施例之立體圖二。 第四圖係為本發明較佳實施例之分解圖二。 第五圖係為本發明較佳實施例之實施示意圖。 ,五A圖係為本發明較佳實施例之實施剖視示意圖。 第五B圖係為本發明三點平衡之實施示意圖。 第六圖係為本發明較佳實施例之動作示意圖一。 第七圖係為本發明較佳實施例之動作示意圖二。 第八圖係為本發明較佳實施例之動作示意圖三。 第九圖係為本發明較佳實施例之動作示意圖四。 【主要元件符號說明】 承置體·· • 1 平衡板·· •10 承置面·· •11 承載體·· •2 平面· · · •21 縱向穿孔· •22 容置空間· • 23 橫向穿孔· • 24 抵持柱·· •3 滑槽· · · •31 柱體· · · •32 抵持塊·· •4 抵持面·· •41 螺孔· · · •42 桿體· · · • 5 201237984 滾珠· · · · •51 •旋轉調整組· •6 底座· · · · •61 旋轉開關·· • 6 2 肋條· · · · •621 第一斜面·· •622 齒盤座· · · •63 齒部· · · · •631 抵固部· · · •632 第二斜面·· •633 齒盤···· •64 嚙合部· · · •641 孔洞· · · · •642 彈片· · · · •65 旋轉套體·· •66 容置空間·· •661 凸塊· · · · •662 握持體· · · •67 擔板···· •7 反應室··· •8 晶圓基板·· •81 晶圓· · · · •9 9201237984 VI. Description of the invention: • [Technical field to which the invention pertains] - The present invention provides an adjustment of the E-type wafer machine, in particular, the type can be quickly adjusted to the positioning without spending a large amount of __ integral, thereby accelerating the process _, And the accuracy of the water balance is extremely high, and it is more effective to reduce the excessive 而 而 发生 发生 发生 发生 发生 发生 发生 ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί Round machine adjuster. [Prior Art] The technology of the H process has been quite skillful, and it has also created the current wafer kingdom, and some machines are manufactured, and the wafer-formed part includes special gas's but due to various factors of film limitation. 2 Therefore, the thickness of the film is inconsistent, and often exceeds the tolerance: the speed of U is different, and the range of the value of the == is not easy to be fully balanced in the range of the value of the enemy. , 俾 螺 螺 ' 再 再 再 再 再 再 再 螺 螺 螺 螺 螺 螺 螺 螺 螺 螺 螺 螺 螺 螺 螺 螺 螺 螺 螺 螺 螺 螺 螺 螺 螺 螺 螺 螺 螺 螺 螺 螺 螺 螺 螺 螺 螺 螺 螺Party assessment and consideration, j multi-phase, material, through the multi-change, began to design this can be quickly adjusted to the level of the second break test and! On the 'in, 仏 (9) shirt "201237984 - cap damage problem, in addition, at the same time The bearing surface of the bearing body is inclined.: The round machine adjusts === and solves the problem that after the spring is fatigued, the main structure of the carrier body is defined as a predetermined "transfer ft system". Defining a longitudinal perforation for receiving the abutting column, The longitudinal ϋ 谷 谷 谷 抵 抵 抵 抵 谷 谷 谷 谷 谷 谷 谷 谷 谷 谷 谷 谷 谷 谷 谷 谷 谷 谷 谷 谷 谷 谷 谷 谷 谷 谷 谷 谷 谷 谷 谷 谷 谷 谷 谷 谷 谷 谷 谷 谷 谷 谷The group is disposed away from the rod body to provide the rod body for rotation, and the rotation adjustment group includes a 盥, n" _ seat is provided with a sprocket seat, and the top surface of the sprocket seat is formed 2 and the sprocket seat is defined by a part of it == There is a shrapnel; furthermore, the base, the sprocket holder, the sprocket wheel and the sprocket are set to 1 and the rotating sleeve system is sleeved - the grip body By this, when you want to = ί ϊϊΓ ϊϊΓ ϊϊΓ ϊϊΓ ϊϊΓ ϊϊΓ ϊϊΓ ϊϊΓ ϊϊΓ ϊϊΓ ϊϊΓ ϊϊΓ ϊϊΓ ϊϊΓ ϊϊΓ ϊϊΓ ϊϊΓ ϊϊΓ ϊϊΓ ϊϊΓ ϊϊΓ ϊϊΓ ϊϊΓ ϊϊΓ ϊϊΓ ϊϊΓ ϊϊΓ ϊϊΓ ϊϊΓ ϊϊΓ ϊϊΓ ϊϊΓ ϊϊΓ ϊϊΓ ϊϊΓ ϊϊΓ ϊϊΓ ϊϊΓ ϊϊΓ ϊϊΓ ϊϊΓ ϊϊΓ ϊϊΓ ϊϊΓ ϊϊΓ ϊϊΓ ϊϊΓ ϊϊΓ ϊϊΓ ϊϊΓ ϊϊΓ After that, the rotation adjustment group can be rotated, and is rotated at 2^^, so that the resisting block is displaced by the threading action, and the pushing-up hand reaches the column, and then the balance plate is driven to rise and fall. , ^Into the balance tank; with the above technology, can rely on the conventional wafer balancer to rely on the adjustment nut mostly rely on Personal experience, 瑕 而 , 再 再 再 再 再 再 再 - - - - - 相关 相关 相关 相关 相关 相关 相关 相关 相关 相关 相关 相关 相关 相关 相关 相关 相关 相关 相关 相关 相关 相关 相关 相关 相关 相关 相关 相关 相关 相关 相关 相关 相关 相关 相关The problem is added to the time 'it and the level balance accuracy is extremely high, more, the nut damage problem is 'corrected, and the county's body is placed _ oblique design 201237984 • pressure balance board, and solved the magazine fatigue Practical advancement of the problems derived _ [Embodiment] In order to achieve the above objectives and effects, the technical map adopted by the present invention is based on the fact that the ship and Wei are as follows: please refer to the figure - The second picture, the third picture, the fourth picture, the first solution. The fifth picture is shown in Fig. 6 , which is the schematic diagram of the implementation of the vertical steel, the A picture and the 5th and 2nd. And the three-point Si real 3 view clearly shows that the invention is adjusted by the machine (4) through the wafer substrate 8 in the flat to 8, the main structure of the machine adjuster includes a receiving body 1 , for pressing against one end of the balance plate i , and at the contact surface of the balance plate The bearing surface 丄i is defined as a slanted state. The right side of the body 3 is inserted through the longitudinal through hole 22, and the resisting column 3-side is formed with a (7) groove 31, and the sliding groove 3丄The inner system slides with a cylinder 32; the contact, 4, is accommodated in the accommodating space 2 3, and the contact with the resisting column 3 against the holding column 3 defines a slanting surface. 4, then 曰 二 2 = 5, the transverse perforation 24 is worn, and the end is connected with the screw hole 4 2 . ★ The ball 24 is provided with a plurality of balls 5 for interacting with the rod 5 . And the whole group 6, the rotation adjustment group 6 is disposed on the side of the carrier 2, and the system is connected with the scale 5f at the end of the screw hole 4 2, and the entire group 6 of the basin The base 6 1 with the carrier 2 is disposed, and the bottom rod 5 is disposed; the ring switch 6 is disposed on the base 61, and the 6#2 6 defines at least one a rib 6 21 201237984 that can be in contact with the base 61: and the end of the rib 6 21- defines a tooth that is placed on the shank 6 and is worn by the shank 5 to the base. The toothed portion 6 3 is formed. 1, _ sprocket seat 6 3f 3 = around the surface to resist a yoke 6 3 2 , the second slant 6 3 3 that interacts with the rotary switch 6 2 ; a sprocket 6 4 having a - and being pierced by the rod 5 The seat 6 6 is engaged with the meshing portion 641, and the sprocket wheel; 4 and the portion 6 are embedded with holes 6 4 2; - are disposed on the sprocket 6 and the following dry body 5; - H6 is defined on the surface with a scale. The space is 6 6 1, which is used for the base of the lining 6^ turn = "; the inner system and the elastic piece 6 5 ' and the inner wall of the rotating sleeve 6 6 is 3, The toothed disc body 67 is sleeved on the rotating sleeve body 66, with g ^ 6 2, - holding: a 'two, exploded view -, two" = figure ===, action schematic one ^, ht — ',,, the yoke of the ten balance is not intended to be used for the financial use. = move = the whole group of 6 to adjust, in the adjustment: through the rotating sleeve 6 Ming (also (2) step), at this time several balls If to the opposite pole The body 5 is finely rotated, and the cymbal 11 is slowly raised and lowered against the column 3: the yoke is pushed upward to abut the column 3, and the bottom of the holding column 3 is slid to the slant of the resisting block 4 The bottommost rotary switch 6 shovel!? 2 down position 'and then when the wafer 8 reaches the balance state, then The switch 62 is turned to the locked state (ie, the closed state), and when it is locked, 201237984 .6 3 』 钭 钭 = 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 = sleeve =, 3 first - inclined surface 6 2 2 and the second inclined surface 6 3 3 that is mutually: shape "== disk 6 4 to the end of the push, so that the rotating sleeve 6 6 get 6 5 to the teeth as the two sides of the fulcrum In order to form a triangular thin flat (five), # is the first - support point 'the carrier 2 is inclined, so that the balance plate JL has a larger ▲ 敕 ^ body 1 due to the bearing surface 1 1 body 2 - Balanced height =,, = =: The adjustment of the bearing 'in terms of physical properties, when the bearing body 1 == two = «1 omtLtt Yes, the wafer machine adjuster of the present invention is reversible ς 9 flat body] • up; three points “, also reached (four) adjust the wafer 9 thousand scales I, φ phase-like system can not be adjusted: paste 2 on the resisting column 3, resisting block 4, the rod body 5, and spin 2 = over: Pay can easily and accurately adjust the balance of the wafer 9, so the rapid positioning, no need to spend a lot of time on the adjustment, and at the same time due to the placement of the bearing surface ii inclined design, Make it possible to plate 3,' and solve the spring The lack of post-derived & Q outline of progressive were prepared. However, the above description is only the scope of the patents of the preferred embodiments of the present invention, and therefore, the use of the wafer machine adjuster of the present invention in use; efficacy and purpose The present invention is an invention that is excellent in practicality, and is an application for the day of the Japanese: the application for the application, and the application is made according to law, and the audit committee is expected to give an early appointment. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a preferred embodiment of the present invention. The second drawing is an exploded view of the preferred embodiment of the present invention. The third figure is a perspective view 2 of a preferred embodiment of the present invention. The fourth figure is an exploded view of the preferred embodiment of the present invention. The fifth drawing is a schematic view of the implementation of the preferred embodiment of the present invention. 5A is a schematic cross-sectional view showing a preferred embodiment of the present invention. The fifth B diagram is a schematic diagram of the implementation of the three-point balance of the present invention. Figure 6 is a schematic view of the operation of the preferred embodiment of the present invention. Figure 7 is a second schematic view of the operation of the preferred embodiment of the present invention. The eighth figure is a schematic diagram 3 of the action of the preferred embodiment of the present invention. The ninth drawing is a schematic view of the operation of the preferred embodiment of the present invention. [Description of main component symbols] Supporting body·· • 1 Balance plate···10 Mounting surface···11 Carrier ●··2 Plane · · · •21 Longitudinal perforation · 22 accommodating space · • 23 Landscape Perforation · 24 Retaining column ·· •3 chute · · · • 31 cylinder · · · • 32 resisting block ·· • 4 resisting surface ·· • 41 screw hole · · · • 42 rod body · · · • 5 201237984 Balls · · · · • 51 • Rotary adjustment group • • 6 base · · · · • 61 rotary switch ·· • 6 2 ribs · · · · •621 First bevel ·· •622 sprocket holder · · · • 63 Tooth · · · · • 631 Reinforcement · · · • 632 Second bevel ·· •633 sprocket ···· •64 meshing part · · · •641 hole · · · · • 642 · · · · • 65 Rotating sleeve ·· • 66 accommodating space ·· • 661 Bump · · · · • 662 Grip · · · • 67 slab ···· •7 Reaction chamber··· 8 Wafer Substrate··•81 Wafer · · · · • 9 9

Claims (1)

201237984 七 、申請專利範圍: 1 調f器’係透過機台調節器經由平衡板對反應室内 的曰曰®做角度調整,其機台調節器主要結構包括有: 供抵壓該平衡板之—端處,且該承置體與平衡板所 接觸面處係界定有呈傾斜態樣之承置面; 該承健—默祕界定有—供 倾-面,斜面上係界定有—縱向穿孔,再該縱向穿孔 ϋ橫$穿^間相連通,又該承載體—側界定有-與容置空間連 一抵持柱’係穿設該縱向穿孔; 塊,係收容於該容置空間内、並與抵持柱相互 抵持塊上係界定有一螺孔; 矛干體,係穿設該橫向穿孔、並一端與螺孔相組接;及 二,,,整組,該旋轉調餘係設於該承載體—側,雌旋轉調 正組係與該桿體背離組設該螺孔之端處相接設。 、ΪΓίίί1範圍第1項所述之晶圓機台調節器,其中該旋轉調整 一與該承載體相鎖固之底座,並該底座係被桿體所穿設; —環設於該底座之旋轉開關; ° ’ 二設於該底座上、並被桿體所穿設之趣座,該齒盤座頂面周圍 有齒部,而該齒盤座f面係界定有至少—與底座相抵固之 =於該赖座上、並被桿麟穿設之齒盤,_盤底面係界定 有與齒部相嚙合之嚙合部; —設於齒盤上之彈片,該彈片係被桿體所穿設; -於表面界定有刻度之旋轉套體,其内係界定有容置 於套設該底座、齒盤座、齒盤及彈片;及 ’’ 一握持體,係套接於旋轉套體上,以供使用者握持。 、^申請專利範圍第2項所述之晶圓機台調節器,其中該旋轉開關 係界定有至少-可與該底座相抵觸之肋條,且該肋條一端處係 10 201237984 界定有一第一斜面。 .4、如申請專利範圍第2項所述之晶圓機台調 •-預定位置處係界定有-得以與旋轉開關互^ ^該抵固部於 5、 如申請專利範圍第2項所述之晶圓機台調節_ 二斜面。 界定有至少一孔洞。 11 〃中該齒盤上係 6、 如申請專利範圍第2項所述之晶圓機台調節器 内壁係具有凸塊。 σ "中垓旋轉套體 7、 如申請專利範圍第!項所述之晶圓機台調節器, 側係形成有滑槽,並該滑槽内係滑有一柱體。一〜抵持杈一 8請專利範圍第1項所述之晶圓機台調節器,其中w 背離旋轉調整組之一側係設有一擋板。 具中該承載體於 9、如申請專利範圍第工項所述之晶圓機台調節器, 孔内縣設魏個滾珠,且·滾珠係得以與^魅=向穿 1 \ f中請專利範圍第1項所述之晶圓機台調節H中。 與抵持柱所接觸處係界定有呈傾斜態樣之抵持面/、甲趣持塊201237984 VII. Patent application scope: 1 The adjustment device adjusts the angle of the 曰曰® in the reaction chamber through the balance plate through the balance plate. The main structure of the machine adjuster includes: for pressing the balance plate— At the end, and the surface of the bearing body and the balance plate is defined with a slanted bearing surface; the bearing-silently defined - the inclined-face, the inclined surface is defined by - longitudinal perforation, And the longitudinal perforation 连通 $ $ 穿 穿 穿 穿 , , , , , , , 纵向 纵向 纵向 纵向 纵向 纵向 纵向 纵向 纵向 纵向 纵向 纵向 纵向 纵向 纵向 纵向 纵向 纵向 纵向 纵向 纵向 纵向 纵向 纵向 纵向 纵向 纵向 纵向 纵向 纵向 纵向And a screw hole is defined between the resisting column and the resisting block; the spear body is through the transverse perforation, and one end is connected with the screw hole; and two,,, the whole group, the rotating adjustment system On the side of the carrier, the female rotation adjustment group is connected to the end of the rod body away from the screw hole. The wafer table adjuster of the first aspect, wherein the rotation adjusts a base that is locked to the carrier, and the base is worn by the rod; the ring is rotated on the base The switch is disposed on the base and is placed by the rod body. The top surface of the sprocket seat has a tooth portion, and the sprocket seat has a surface defined at least - abutting against the base = the sprocket on the sling and which is pierced by the stalk, the bottom of the platter defines an engaging portion that meshes with the tooth portion; - the elastic piece provided on the sprocket, the elastic piece is worn by the rod - a rotating sleeve defining a scale on the surface, the inner portion of which is defined to be placed on the base, the toothed disc holder, the toothed disc and the elastic piece; and the ''one grip body is sleeved on the rotating sleeve body For the user to hold. The wafer stage adjuster of claim 2, wherein the rotary switch defines at least a rib that is contiguous with the base, and the rib has a first bevel at one end 10 201237984. .4, as described in the scope of claim 2, the facsimile machine adjustments - the predetermined position is defined - can be interchanged with the rotary switch ^ ^ the reinforcement is at 5, as described in claim 2 Wafer table adjustment _ two bevels. There is at least one hole defined. In the middle of the sprocket wheel, the inner wall of the wafer machine adjuster as described in claim 2 has a bump. σ " Lieutenant swivel sleeve 7, as claimed in the scope of patents! In the wafer table adjuster, the side system is formed with a sliding slot, and a sliding body is slid inside the sliding slot. The wafer stage adjuster of the first aspect of the patent scope, wherein w is disposed away from one side of the rotation adjustment group and is provided with a baffle. In the case of the carrier, the wafer machine adjuster as described in the application of the patent scope, the Wei County has a Wei ball, and the ball system can be patented with the charm. The wafer table adjustment H described in the first item of the range. The contact with the resisting column defines a resisting surface that is inclined.
TW100108323A 2011-03-11 2011-03-11 Wafer machine regulator TW201237984A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109029335A (en) * 2018-09-12 2018-12-18 江苏英锐半导体有限公司 A kind of wafer flow surface smoothness detection device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004128057A (en) * 2002-09-30 2004-04-22 Fuji Photo Film Co Ltd Light emitting device and its manufacturing method
WO2005091388A1 (en) * 2004-03-18 2005-09-29 Matsushita Electric Industrial Co., Ltd. Nitride based led with a p-type injection region
TWM377040U (en) * 2009-11-23 2010-03-21 Cheng Min Engine Co Ltd Platform height adjustment device for liquid optical adhesive laminator

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109029335A (en) * 2018-09-12 2018-12-18 江苏英锐半导体有限公司 A kind of wafer flow surface smoothness detection device

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