TW201230908A - Method for producing tape carrier package and method for producing flexible circuit board for tape carrier package - Google Patents

Abstract

One aspect of the present invention relates to a method for producing a tape carrier package which can firmly mount, with sufficient tear strength, electronic parts, having a length of 1.2mm or shorter on a short side thereof, onto connection terminals of a wiring pattern in a flexible circuit board for a tape carrier package. Another aspect of the present invention relates to a method for producing a flexible circuit board for the tape carrier package wherein pigment without any chlorine atom or bromine atom is adopted for coloring insulation films, and deterioration in inspection efficiency due to false detection can be restrained so as to reduce inspection failure rate, and wherein a process for inspecting the produced flexible circuit board for the tape carrier package by using optical automatic tester is included.

Description

201230908 VI. Description of the Invention: [Technical Field of the Invention] One aspect of the present invention relates to a method of manufacturing a transport tape package and to a flexible tape package (more specifically, a flexible tape package) The denatured polyurethane resin composition used for the insulating film of the circuit board). In particular, it is a method for manufacturing a transfer tape package in which an electronic component such as a micro semiconductor wafer having a short side length of 1.2 mm or less can be ideally mounted, and is suitable for use as an insulating film as a transfer tape package in such a manufacturing method. A denatured polyamine phthalate ester composition. Another aspect of the invention is a flexible circuit board for transporting a tape package, and a resin composition for a curable insulating film which is suitable as a flexible circuit board for a transfer tape package. In particular, the method for manufacturing a secondary circuit board includes a manufacturing process, and a flexible circuit board for inspection by an optical automatic inspection device: an insulating film coloring pigment system It does not contain a chlorine atom or a bromine; it is a resin composition for a hardenable insulating film for a transfer tape package circuit board in which the inspection method is used to reduce the efficiency of inspection by the rate measurement and to reduce the flexible circuit for the inspection body. First, as a technology, a package made of a heterogeneous metal-structured tape package, an I-age, wide-flex flexible circuit board (also called a conveyor belt for transporting ΤΑΒ cof). A circuit diagram of a metal structure is formed by forming a resin composition for a film such as a semiconductor wafer on a surface of a connecting terminal portion of a conductive sub-assembly, and a plurality of circuit pattern surfaces are coated on the insulating film. /, 夂 hardened to form an insulating film (insulation protective film) 201230908 With a seal can be expected to be in the New Zealand step and make #, that is, the power ίίί 上上 with a guide _ red circuit pattern will t彳t Circuit board At least the circuit pattern surface other than the terminal portion is coated with a smear-like tree test object, and the phase is heated at the hardened film (insulating film), and the silicon is transferred to the sturdy circuit board. In the connection of the circuit pattern, the electronic component such as a semiconductor wafer, and the gap injection layer filler of the 'infrared film mounted electronic component and the conductor wafer are hardened to fix the electronic component. Low Patent Documents 1 to 4 describe the use of denatured poly A curable resin composition of a urethane film, a second one of which is a polylactic acid ester of the genus, which is the above-mentioned denatured polyurea: formazan vinegar resin, and two patent documents 5: the use of polyaniline The oxygen hyacinth composition is used as a curable resin group for forming the above-mentioned insulating protective film. The reason why the denatured polyurethane resin composition or the quinone imine is known to be a composition is: hardenability, Insulation protective films such as electrical insulation, ship, low-hardening shrinkage, low (four), low-viscosity, chemical resistance, solder heat resistance, and adhesion to the underfill material are generally required to have excellent properties. 1<(1) [PRIOR ART DOCUMENT] [Patent Document 1] JP-A-2006-104462 [Patent Document 2] Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. [Patent Document 4] Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. In particular, the shape of the semi-conductive shape is as follows, and as described above, the connection terminal portion of the circuit pattern of the box having a rectangular shape on each side is ί : 2 [the gap of the flexible circuit board, usually will be noted The semiconductor wafer of the human NF is fixed by scratching. Further, the underfill is filled; the main part of the material ==== The ends of the film are directly connected. 々 之 , , , , , , , , , , , , , , , , , , , 逐 濩 濩 逐 逐 逐 逐 逐 逐 逐 逐 逐 逐 逐 逐 逐 逐 逐 逐 逐 逐 逐 逐 逐 逐 逐 逐 逐 逐 逐 逐 逐 逐 逐 逐 逐 逐 逐 逐 逐 逐 逐 逐 逐 逐The material can be fully edged === When the electronic component is installed, the electronic zero will occur and the flexible circuit board for the tape package will be green or blue. Due to the high environmental problems in recent years, the pigment used for coloring the insulating film of the circuit board is a pigment containing chlorine atoms and bromine atoms. The use of a flexible circuit for transporting tape packages in recent years has been progressing in fine pitch (fme pitch), but another = mounting, circuit board manufacturing steps, and second steps are required for process inspection. Use the nine-child automatic double check, but if you use the fresh automatic inspection device for process inspection, the visual inspection will not be considered to be different; the insulation "causes the problem of low inspection efficiency. The circuit between the following narrow parts will be easy" A defect sealing method is provided for the purpose of providing a manufacturing method for conveying tape sealing, which is capable of mounting an electronic poem such as a short side of a length of 201230908 or a small semiconductor W to be fully and securely mounted on a turn. Tape package body circuit = type: terminal part. The slave circuit pattern is connected to the (fourth) aspect of the present invention, and the object is to provide a method for manufacturing a circuit board, which comprises using an optical core inspection and packaging tape. In the case of a flexible circuit board, the pigment colored by the insulating film is free of chlorine atoms, and is used for reducing the inspection efficiency due to erroneous detection, and can suppress &lt;solving the problem> ^Keliang The various aspects of the present invention are as follows: &lt;First Aspect (Α)&gt; Α1· The manufacture of a transport tape package includes the following steps: 〃Characteristics: Circuitry is insulated The circuit of the conductive metal-shaped circuit pattern on the film is less flexible and less connected to the circuit pattern surface coating film other than the terminal portion, and the z-inspection product, and the heat treatment is performed to form a hardened πΐί4! The connection of the circuit pattern of the board is divided into two parts. The length of the short side of the board is 1. "The following electronic parts are connected to the underlying filler material after the gap between the mounted electronic parts, and then the heat treatment is performed to harden the underlying material.丝 憎 敝 敝 敝 contains: to the slow base and acid '(B). ~mgK〇H/g denatured polyamine phthalic acid vinegar resin (4); and method for producing curable tree-shaped poly-encapsulated enantiomers, in which it will be changed to epoxy: treated hardened film, impregnated with hole tree J3 The dimensional change rate of the guard is less than 6〇%. A method for manufacturing a transport tape package of A1 or Α2, wherein the tianzhang: accommodating polyamine lanthanum lysate composition is added and reduced to obtain a hardening 201230908. When the hardened layer filler is peeled off, at least partially cured film Cohesive failure occurred. The method for producing a transfer tape package according to any one of the above-mentioned items, wherein the denatured polyurethane resin composition comprises a denatured polyurethane resin having an acid value of 16 to 40 mgKOH/g ( A) and a curable resin, which is a compound of an acid/alcohol or a polybutadiene diol, and a octacarboxy-super compound (a3) obtain. A5. A method for producing a transfer tape package such as A4, wherein the bismuth citrate compound (4) is a diisocyanate brewing & 1. In the manufacture of the conveyor tape package of the A-1 to AS, the A-type polyamine phthalate resin (A) is in the main chain, jLg &# s % Amino phthalic acid resin. The method of manufacturing the adhesive tape package of the hard armor of the month of the month, 2, such as f~Α6, the manufacture of the transfer tape package, the middle of the 'curing resin (Β) is selected from the epoxy resin, the amine tree A group of two at least one base resin composed of a terminally-packed polyfunctional isocyanuric acid or cyanic acid lanthanum, which is characterized by comprising: (A); and a hard resin (8). mgKC> H/g, secret Polyurethane § The resin is a denatured polyamine A resin composition, which is used in the text, the short side length is 1.2mm or less, and you use it in &lt;2nd aspect (Part B)&gt; B1. The transmission tape package is characterized by: a manufacturing method for a conductive circuit board for a plate, comprising the following steps: preparing a conductive film on the insulating film A flexible resin circuit board having a circuit pattern formed of a sturdy metal, a circuit board formed of an inert metal, and at least a resin composition other than the terminal portion except the terminal portion, and a resin composition for a cold-separating insulating film, which is hardened by the second step === = 201230908 The flexible circuit board for the conveyor tape package will be inspected by an optical automatic inspection device. The resin composition for a curable insulating film contains a pigment (A) and is colored, and the pigment (A) contains at least an extender pigment (al) containing no gas atom and a bromine atom, and a pigment containing no chlorine atom and a desert atom ( A2) A method for producing a flexible wiring board for a transfer tape package according to B1, wherein the resin composition for a curable insulating film contains a pigment (A) and is colored green, and the pigment (A) contains no An organic pigment (al) of a chlorine atom and a bromine atom, a blue pigment (a3) not containing a chlorine atom and a bromine atom, and a yellow pigment (a4) not containing a chlorine atom and a bromine atom. B3. A transfer tape package such as B2 A method for producing a flexible circuit board, wherein a bulk pigment having a chlorine atom and a bromine atom (al) has a diameter of from 100 nm to 100 nm, and a blue pigment (a3) containing no chlorine atom or bromine atom The median diameter is 50 nm to 500 nm, and the yellow pigment (a4) which does not contain a chlorine atom and a bromine atom has a range of 50 nm to 500 nm. B4. A flexible circuit board for a transfer tape package according to any one of B1 to B3 The manufacturing method of the resin composition for a curable insulating film, comprising a denatured polyamine phthalic acid resin (B) 'The denatured polyamine phthalate resin <B) is at least a diisocyanate compound (bl) and a polyol compound (b2) containing a polycarbonate diol or a polybutadiene diol and a carboxyl group-containing The diol compound (b3) is obtained by a reaction. B5. A method for producing a flexible circuit board for a transfer tape package according to B4, wherein 'the body pigment (al) containing no chlorine atom and bromine atom is barium sulfate, and the pound is hard. In the resin composition for an insulating film, the content of the extender pigment (al) containing no chlorine atom or bromine atom is 10 parts by mass or more based on 1 part by mass of the solid content of the denatured polyamine phthalate resin (B). B6. A method for producing a flexible circuit board for a transfer tape package such as 34 or 35, wherein the 'diisocyanate compound (bl) is an alicyclic C7 having an alicyclic structure. For example, any one of B4 to: b6 A method for producing a flexible circuit 201230908 sheet for a transfer tape package, wherein the denatured polyamine phthalate resin (B) is in a main imine ring structure. The method for manufacturing a conductive tape for a transfer tape sealing body according to any one of the items B1 to B7, wherein the flexible circuit board has a circuit pattern including a portion having a circuit interval of 15 or less. B9. A resin composition for a curable film for a flexible wiring board for a transfer tape package, characterized in that the pigment (A) and the denatured polyurethane resin (B) are colored, and the pigment (A) Containing at least a chlorine atom and a bromine-based pigment (al) and a pigment (a2) containing no chlorine atom and a desert atom, the modified process is a compound (bl) and a polycarbonate or a butylene monool The 70th alcohol compound (b2) is obtained by reacting with a carboxyl group-containing diol compound (b3). π Λ . . . . . . . . . . . . . . 输送 输送 输送 输送 输送 输送 输送 输送 输送 输送 输送 输送 输送 输送 输送 输送 输送 输送 输送 . . 输送 . . . . . . . . . . . . . . . . . . (4)), containing no chlorine atom and if color (4), material containing (four) and _ sub-yellow pigment &lt; effect of invention &gt; manufacturing day and month - ", can provide a kind of body wafer for transport tape package The method of the extremely small semi-conductive adhesive strength below the electric mm is firmly mounted on the connecting terminal portion of the circuit pattern such as the needle, the +, and the flexible circuit board for the body. In the manufacturing method of the open tape: in the manufacturing method of the open tape, the underlying layer is filled with the wire (4), that is, the denatured polyurethane resin containing at least the chemical resin (B) 6-line 1 ^ - H g is used. (A) It is long with a hard short side; Λ,, a fragrant vinegar vinegar tree wax composition, by which, even if the installation of extremely small electronic parts of &amp; '', .2mm or less is implemented, 201230908 can Filling with the conventional bottom i has a sufficient separation strength. And 'Although (four) 硬 硬 硬 硬 硬 验 验 验 验 验 验 验 验 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 And the characteristics that are usually required for the adhesive film are not sturdy, and can provide a transfer tape for "manufacturing ί &amp;; it includes a step of using a flexible circuit board for optical automatic inspection device, wherein The system is low in efficiency, and can reduce inspection defects. 5 ί ί 高 高 高 高 高 高 高 高 高 高 高 高 高 高 高 高 高 高 高 高 高 高 高 高 高 高 高 高 高 高 高 高 高 高 高 高 高 高 高 高 高 高 高 高 高The form of the form A and the sample (hereinafter referred to as the invention) refer to the part described in the section: the present invention is generally described in the following. However, depending on the case, it may mean other (4) The inventions described in this section and the other parts (4) The inventions described in this section. In addition, Part A and Part B 2 refer to the inventions described in the section «ΑParts", as long as they are not contradictory. Combination. Manufacturing method, providing - reading - electronic wafer-like electrons with a package The following is a very small half mounted on the conveyor tape package for the purpose of the deflection. The connection pattern of the circuit pattern of the flexible circuit board 201230908, .P knife revealed that the transmission tape package The manufacturing method includes the following steps: preparing a flexible circuit board having a circuit pattern formed of a conductive metal on an insulating film, and coating a circuit pattern on at least a connection terminal portion of the flexible circuit board The amine is called a singer, and the money is heated to form a hardened film. The circuit diagram of the flexible circuit board for the transfer tape package is obtained. For the connection terminal part, an electronic component having a short side length of 1.2 mm or less is attached.绝 ί 经 经 经 经 安装 安装 安装 安装 经 经 经 经 经 经 经 经 经 经 经 经 经 经 经 经 经 经 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子变性 ϋ gK 〇 Wg denatured polyurethane resin (4); and the hardening tree τ ί ί , , 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘It is generally preferable to use a thickness of the polyimide film 5~8〇μιη.踗=When the insulating film is appropriately formed by removing a predetermined pattern such as a peak of a conductive metal such as a laminate or a conductive gold-plated adhesive which is laminated with a non-adhesive agent such as ore or (4), the copper is formed. The town can be a rolled copper box or an electrolytic copper drop. The thickness of the circuit pattern is about 2~8〇, 5~5〇〇_ ideal. (4) The width is about v. At least the connection of the flexible circuit board having such a circuit pattern from ii; the addition of the patterned surface coating denatured polyurethane resin composition into a cured film (insulation protection 臈). In order to obtain the winning streak of the electrical circuit of the package body board, the wafer-like electronic parts are heated by a known method, for example, using a human J semi-conductor part (semiconductor 8 201230908 gap injection of the underfill material, followed by heating Processing to manufacture the body of the belt. The filler is hardened. In this method, the length of the short-side installation is l 2mm or less, and the 2 green placard parts are sealed in the conveyor belt. ί Ξ ΐ ΐ 板 板 , ,, electronic parts The smallest dimension and the diameter of the connection surface of the circuit board. Usually, the shape of the connecting surface of the electronic component is a rectangle having a short side and a long length j. Therefore, the short side length of the lining refers to the short side length. Also, the electronic parts are in the wire (four), when, and the circuit surface rides

In the case of "for example, when the shape is elliptical", "the length of the short side" means that the underfill material of the bottom layer A is filled with a liquid or film-like epoxy resin underneath, but in the method, An epoxy resin underfill material is suitably used. The epoxy resin-based underfill material is not limited, and examples thereof include a CHIPCOAT series manufactured by Namic Co., Ltd., a liquid sealing material A CEL-C series manufactured by Hitachi Chemical Co., Ltd., and a UF series of an underlying filling film manufactured by Aoli Chemical Co., Ltd. . In particular, in the case of COF use, it is preferred that the viscosity or other characteristics are optimized, for example, it is preferably a liquid sealing material of CHIPCOAT 8462-2, 8462-96, 8462-220A, and a product of Nippon Chemical Co., Ltd. Cm·. The underfill material is usually injected (inserted) into the gap between the insulating film formed with the circuit pattern and the electronic component of the female 1, and thereafter, for example, about 6 〇 2 〇〇. The temperature of the crucible is hardened by heat treatment. In the method, a resin composition for forming a cured film (insulating protective film) on a circuit pattern other than at least a connection terminal portion of the flexible wiring board is a denatured polyamine vinegar resin composition, which comprises: at least A denatured polyamine phthalate resin (A) having a slow base and an acid value of 16 to 40 mgKOH/g; and a curable resin (B). The denatured polyurethane resin (a) is preferably an acid value of 22 to 34 mgKOH/g, more preferably 25 to 30 mgKOH/g. Denatured polyamine phthalate 13 201230908 resin (A) having at least a rebel base and having an acid value of 16 to 40 mg KOH/g, which can be obtained by a side chain or a terminal portion of a main chain in a main chain having a urethane bond It is ideally produced by introducing a carboxyl group by a known method described in Patent Documents 1 to 4. When the acid value is used to produce the denatured polyurethane resin (A), it can be easily adjusted by changing the use ratio of the component (usually a carboxyl group-containing component) used for introducing a carboxyl group. The carboxyl group can be cross-linked with the curable resin (B) contained in the denatured polyurethane resin composition, and thus the denatured polyamine phthalate resin composition has good hardenability and can be formed into excellent properties. Hardened film. The method uses at least a carboxyl group and has an acid value of 16 to 4 〇rng K 〇 H / g, preferably 22 to 34 mg KOH / g 'more preferably 25 to 30 mg KOH / g of denatured polyurethane resin (A) ' It is preferred to obtain at least a diisocyanate compound (al), a polyol compound (a2) containing a polycarbonate diol or a polybutadiene diol, and a dihydroxy compound (a3) having a mercapto group. The earth t diisocyanate compound (a 1) can be desirably used by a user when a polyurethane is usually produced. That is, it is possible to have two isocyanate groups in the i molecule, and preferably, for example, an aliphatic, alicyclic or aromatic polyisocyanate such as 2,4-indole phenyl diisocyanate, 2,6 _methylphenyl diisocyanate, iso-, diisocyanate, 1,6-hexamethylene diisocyanate, trimethylene diiso. Cyanate, 1,4-tetramethylene diisocyanate, 2, 2, 4 _Trimethylhexamethylene^isophthalic acid, 2,4,4-trimethylhexamethylene diisocyanate, 19-decane methylene diisocyanate, 1,1 〇 _ decyl fluorenyl Isocyanate, hydrazine, cyclohexane diisocyanate, 2,2,-diethyl ether diisocyanate, diphenyldecane-4,4,_diisophthalate, o-xylene diisocyanate, m-xylene diisocyanate, Xylene diisocyanate, methylene bis(cyclohexyl isocyanate), cyclohexane dimethylene isocyanate, cyclohexane-1,4-dimethylene diisocyanate, naphthalene diisocyanate, benzoic acid Diisocyanate, 3,3,-methylenedimethylexene = 4'-diisocyanate, 4,4,diphenyl ether diisocyanate, tetrachlorophenylene diester, acid ester, hail Diisocyanate, hydrogenated xylylene diisocyanate, 1,3-dihydro-1,4 vinegar diisocyanate, xylylene diisocyanate and the like. These may be used in combination of two or more kinds. 14 201230908 The diisocyanate compound (al) is preferably swelled or underfilled with an alicyclic structure from the viewpoint of good charge tolerance, wherein isophorone diisocyanate, phthalocyanate compound Bis(cyclohexyl isocyanate) is especially preferred. Further, as the hexane diisocyanate, it is also possible to use a blocked isocyanuric acid vinegar. In order to prevent moisture from causing loss of polycarbonate diol or polybutadiene _ &gt; is a polycarbonate diol or polybutadiene diacid compound (a2) ' may also contain _ etc. The polyolized human alcohol compound, if necessary, the diol compound (a2) does not contain a thiol group. In the present invention, the diol of the polyethylene carbonate is not particularly limited as long as it is in the main chain. It can be used ideally. 51 = diol compound A poly-carbon diol at the end of the base. Ship-style (1)

〇~0~ gentleman chemical formula (1) Take the mountain 攸 π such as aliphatic or square fragrant smoke base, n is an integer of 1~40 〇曰 one alcohol with a number average molecular weight ~ ^ to obtain the desired flexibility, and; Sometimes it is not easy, the average number of molecules in the right number is more than 10,000, sometimes II? 0 ^ ^

UH "I cattle such as Ube Industries Co., Ltd. ETERNAC0LL: I: UD series, uc series, UB series, industrial know-how pLACCEL series, Coke column, Asahi Kasei Chemicals Co., Ltd. (4) L series, etc. Ϊ, may be used singly or in combination of two or more. 、!* - 00^1, monool is not limited, but the number average molecular weight of the polyfunctional hydroxy terminal of the bifunctional hydroxyl group is 5QG~ (10) Preferably, the phase of the phase is good. If the number average molecular weight is less than 500 'times, it is not easy to be heart-hearted, 70-like' and if the number average molecular weight exceeds 10,000, sometimes 15 201230908 heat resistance or solvent solubility will deteriorate. The polybutadiene diol may have a double bond in the molecule or may be a bismuth in the molecule. However, if a double bond remains in the molecule, the crosslinking reaction sometimes loses flexibility, so it is particularly preferable. The static bond in the molecule is singularized. The polybutadiene diol used in the present invention is, in particular, preferably the G series, the GI series, the EIKO, and the chemistry of the company. )Company Poly bd series, Poly Φ series, EPOL series, KRASOL· series, three Poly tail Η series manufactured by Ryo Chemical Co., Ltd., etc.. Butadiene-nonanediol can be used alone or in combination of two or more. A light-based compound (a3) with a carboxyl group is substituted. The base di-based compound, if such a dibasic compound is used, the denatured polyamine phthalate resin will have a carboxyl group and can easily react with the curable resin (B). When the phthalic acid ester resin is crosslinked, it can be effectively crosslinked, and the heat resistance or solvent resistance of the obtained cured product increases. The dihydroxy compound (a3) having a carboxyl group is not particularly limited, and is preferably a carboxyl group. The carbon number of the base is from 1 to 30, and more preferably the dihydroxylated 2 cookware having a carbon number of 2 to 2 Å, such as 2,2_dimethylol is called 2,2·dimethylolbutanoic acid. , ^Double silk ethyl gan, take _ 勉 基 propyl propyl ship, etc. These can also be used in combination, more than one species. Among them, from the point of view of solvent / recombination, 2,2-dihydroxy fluorenyl Propionic acid, 2,2-dihydroxyindolyl butyric acid is especially preferred. And the method is used to test the shape of the test. _ touch (Α), more preferably the amine ring in the main chain of the polyamine tannic acid grease. An imine ring-alcoholic compound (IV), and a fluoro group "compound, _carboxy@ under-anhydride or diaster-acid mono-anhydride or an alcohol such as the following formula (2) and an oxime imine oligomer" Diisocyanate compound (6) reaction 8 16 201230908 Chemical formula 0 (wherein &amp; represents a divalent aliphatic or an aromatic or aromatic having a valence of 1 to 10, and a valence of 4 or more The base, Y represents an integer of 0 to 20 of the amino acid of the diamine.) The divalent base of the earthy spoon, m is a denatured polyamine tannic acid by using a quinone imine cyclic amine (4) in the main chain. The hardening of the composition of the fat composition === degree, heat resistance, insulation reliability, etc., so that it is an acid represented by the chemical formula (2)! ^+ t % 羟基 羟基 % % % It can be obtained from an (iv) acid component and an amine component composed of a diamine compound. In the formula, m represents ^ from 0 to 10, more preferably from 0 to 5. If m exceeds 2 〇, it sometimes becomes worse. Further, the term "alcoholic acid" is, for example, easily obtained in accordance with a known method of the Japanese Patent Application Laid-Open No. 2007-238818. That is, the denatured polyamine A to which the method is applied is a resin (A), preferably diisocyanate, compound (al), polycarbonate-containing diol or poly(butadiene) diterpene-quinone: (-: a dicarboxylic compound having a carboxyl group (IV), and, if necessary, a compound of a light amine ring, which is obtained by reacting a compound of a light amine ring into a ί (a4). (al) is the ratio between the other compounds (a2), (four), (four), and the number of moles of the compound (al), preferably $ 〇5~3 〇, preferably the right ί ί 佳 is the range of 〇.9~2.0. If the aforementioned molar ratio is too small, the solution sometimes becomes sticky, if the aforementioned molar ratio is too large, the denatured polyurethane lysate is divided into 17 201230908 The amount of the component may be lowered, and the heat resistance may be lowered. The amount of the dibasic compound (a3) used for the preparation of the denatured polyurethane resin (A) may be determined by the ratio of use thereof. The acid value of the urethane carboxylic acid resin is 16 to 40 mgKOH/g, preferably 22 to 34 mgKOH/g, more preferably 25 to 30 mgKOH/g. The use of the dithiol-based compound (a3) and polycarbonate-containing Glycol Polybutadiene diol diol compound (a2), molar ratio thereof [molar number of carboxyl group-containing dihydroxy compound (a3) / polycarboxylate-containing diol or polybutadiene diol The molar number of the alcohol compound (a2) is 'about 2. 2 to 6, preferably 〇 5 to 3. Using a light-based compound (a3) having a rim group, a polycarbonate-containing diol or a poly a diol compound (a2) of tetrabutenol, and a tetrabasic acid dianhydride, a tricarboxylic acid monohydride or an alcoholic hydroxyl terminated quinone imine oligomer 4 represented by the above chemical formula (2) for introduction In the case of the compound component (a4) of the imine ring, the molar ratio of the molar ratio of the compound (a3) of the compound (a3) to the diol compound of the polycarbonate diol or polybutadiene diol The total molar number of (a2) and the compound component for introducing the quinone ring is about 〇2 to 1 Torr, preferably 〇5 to 5. The denatured polyurethane resin ( A) production, more specifically, a diisocyanate compound (al), a compound (a2) containing a polycarbonate diol or a polybutadiene diol, a dioxin compound (4), and optionally Tetrahydrous acid anhydride The reaction of the acid monoanhydride or the compound component (IV) which is introduced into the acid imine ring, such as the alcoholic oligomer represented by the above chemical formula (2), can be carried out without a solvent or dissolved in an organic solvent. By hanging, to prevent the diisocyanate compound (al) from deactivating, you can change the diisocyanate &amp; (good) after the solution, and, in order to improve the solubility, etc., can be changed.詨Addition order.Reaction,;ra sore, s $ inflammation. m:~i8〇t:, reaction ~00c, preferably using a known amine A, /jr and 'catalyst can make the handle _ definitely reduced _, add alcohol as the end stop (§) 18 201230908

The solvent Z may be a nitrogen-containing solvent such as an amine, diethyl decylamine, a sulfonyl group, a 2 (4), a f-succinone, an N-methyl caprolactam or the like; :; = , : diethyl hydrazine, dimethyl sulfone, diethyl sulfone: a sulfuric acid solvent, such as _solvent", two 曱.. two; ^ = diethylene glycol dimethyl shout , ethylene glycol two (10), carbene::, propylene glycol methyl light acetic acid vinegar, propylene glycol (10) acetate, dipropylene oxime, diethylene glycol ethyl ether acetic acid S, methoxy methoxyacetic acid methyl vinegar, methoxy vinegar , ethoxypropionic acid A, ethoxypropionic acid, g-ethylene glycol = solvent acetone, acetophenone, phenylacetone, cyclohexanone, iso- ketone, etc.; Alcohol, II. Find, tetrahydrogen, etc.; γ·Τ_# of vinegar 糸^. It is especially good to use γ·τ_, diethylene glycol ethyl acetate, triethylene glycol, etc. The number average molecular weight of the denatured polyamine phthalate resin (Α) used in the method is not limited, and is preferably from 3,000 to 100,000, more preferably from 5 to 5 Å. Here, the average amount is good. The amount is changed by gel permeation chromatography (Gpc) 敎 (four) styrene If the number average molecular weight is less than the above range, the mechanical properties such as the elongation, flexibility, and strength of the cured film may be degraded. On the other hand, if it exceeds the above range, the viscosity may be added to the above. Sometimes the use is limited. The curable resin (B) which is an essential component of the denatured polyamine phthalate resin composition used in the method is a sigma compound which reacts with a carboxylic acid in a denatured polyurethane resin. The resin (9) is not particularly limited as long as it reacts with the acidity in the denatured polyamine phthalate resin, and is preferably an epoxy resin, an amine resin, a polyfunctional isocyanate, and a cyanic acid. g. Resin. Epoxy resin, for example, bisphenol A type epoxy resin, hydrogenated bisphenol A type epoxy resin, brominated bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenol resin Epoxy resin, phenolic phenolic resin epoxy resin, phenolic phenolic resin epoxy resin, alicyclic epoxy resin, N_epoxypropyl epoxy tree 19 201230908 Month: Qiao? A _ resin type Epoxy resin, chelating epoxy resin, B2 Amino-based epoxy resin, rubber-modified epoxy resin, bis-oxygen resin, fluorenone-modified epoxy resin, &amp;caprolactone denatured dinitrogen; diterpene* polybutadiene, etc. 2 or more epoxy groups, F = imaginary f. In particular, Ν epoxide-based epoxy resin, amine-containing ring olefin : and on the other hand ' alicyclic epoxy resin or epoxidized t Bei Shao' has good insulation reliability and can be used ideally. Flame retardant can use epoxy compounds that lead to atoms such as chlorine, methane or phosphorus in its structure. Imine: 匕? Type, imine type, ^urea, she l. Especially benzoguanamine resin due to excellent reliability of the edge is more than the isocyanate polyisocyanate compound isocyanic acid == bicyclic or aromatic The functional heterocarbon number is 2 to 30: == The latter is preferably an isocyanate-free group which does not contain an isocyanate group: a aryl isocyanate or a hydrazine, but is not limited, for example, hydrazine , 4-tetramethylene dihydrazide, 22:: mercapto diisocyanate, i,6-hexamethylene diisocyanate, L iso^" ίff5 methyl di^, lysine diisocyanate Diisocyanate ), 13: ^ Li: ^ base ¥ hexyl isophthalic acid vinegar (isophorone methane two to do 2 ΐ (different methyl) _ cyclohexane, 4,4,-dicyclohexyl isocyanate旨 Γ 曰 二 二 异 异 异 二 4 4 4 4 异 异 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 二 二 二 二 二 二 二 二 二 二 二 二 二The oxime ester group is blocked. Or the active methylene can be desirably used as a surface derivative "ratio derivative derivative" or "AZ; polyfunctional isocyanuric acid. In particular, it is preferred because of its high pyrazole property. Geochemical 5-blocked polyfunctional isocyanate due to the reaction 8 20 201230908 The denatured polyamine phthalate resin composition used in the method may optionally contain a pigment or a filler. As the pigment, a known pigment such as a blue pigment, a green pigment, or a yellow pigment may be used alone or in combination of plural kinds. Among them, 'preferably contains a blue pigment which does not contain a gas atom and a desert atom in a molecular structure, a yellow pigment which does not contain a chlorine atom and a bromine atom in a molecular structure, and an extender pigment which does not contain a chlorine atom and a bromine atom in a molecular structure. (i.e., an achromatic pigment) and the denatured polyamine phthalate resin composition is preferably green. When the composition contains a compound containing a chlorine atom and a bromine atom in the molecular structure, the product used therein may be harmful when it is incinerated, which is not preferable. A blue pigment which does not contain a chlorine atom or a bromine atom in the molecular structure, and may be exemplified by a copper scorpion large blue (CI pigment blue 15), a metal-free blue (CI pigment blue 16), a titanium phthalocyanine blue, and an iron flower. Blue blue, nickel phthalocyanine blue, aluminum phthalocyanine blue, tin phthalocyanine blue, alkaline blue (CI pigment blue 1, 2, 3, 10, 14, 18, 19, 24, 56, 57, 61) , deuterated CuPc (CI Pigment Blue 17), indigo (CI Pigment Blue 27), Ultramarine (C_I. Pigment Blue 29), Cobalt Blue (CI Pigment Blue 28), Sky Blue (CI Pigment Blue 35) 'Co (A Bu Cr ) 204 (CI Pigment Blue 36), bisazo (CI Pigment Blue 25, 26), Indanthrone (CI Pigment Blue 60), Indigo (CI Pigment Blue 63, 66), Cobalt Cyanine (CI) - Pigment Blue 75), etc., but is not particularly limited. Among them, it is preferable to use copper phthalocyanine blue from the cost side. A yellow pigment that does not contain a chlorine atom or a bromine atom in the molecular structure, such as monobutual gas (CI pigment yellow 1, 4, 5, 9, 65, 74), benzopyridinone (Benzimidazolone) yellow (CI pigment yellow 120, 151, 154, 175, 180, 181, 194), Flavanthrone yellow (CI Pigment Yellow 24), azomethyl yellow (CI pigment yellow m, i29), 蒽醌 yellow (ci pigment yellow) m, i47), isoindole full yellow (c丄 pigment yellow 139, 185), disazo yellow (cI pigment yellow 155), condensed polycyclic system (C, I. pigment yellow 148, 182, 192), oxidation Iron (CI Pigment Yellow 42), bisazomethine (CI Pigment Yellow 101), azo lake (CI Pigment Yellow 61, 62, 100, 104, 133, 168, 169), metal complex ( CI pigment yellow 150, 153, 17 holes 179), etc., but not particularly limited, from the cost side and safety. No 21 201230908 ^ sex, should be excluded "harmful azo pigments." Further, when the yellow pigment of the fluorine atom in the substructure is excellent in dispersibility, it is an extender pigment which does not contain a chlorine atom and a bromine atom in the molecular structure, for example, sulfur, (^丄 pigment white 21, 22), carbonic acid Calcium (CI Pigment White 18), etc., but the composition ratio of the above-mentioned pigments used in the denatured polyurethane resin composition is as long as the denatured polyamine phthalate resin composition can be colored in green, 2 minus J in the silk automatic inspection record error (four), consider * penetrating heart 4, eight improvement can ideally use body pigments. The blue pigment and the xanthine are preferably 0.01 to 5 mass parts per 100 parts by mass of the denatured polyurethane resin, more preferably 0.05 to 1 part by mass, and the body pigment is 1 part by mass relative to the fat-reduced mass part. It is preferably 10 parts by mass or more, and a known one is used for the tree or the filler. For example: oxidized chopped, titanium oxide, talc, guar, quartz powder and other inorganic particles, epoxy resin powder, tri-poly-polyamide resin powder, polyimine resin powder, rubber early, if etc. . The particle size (average particle diameter) is _plus (4)' and is easily detected by the automatic inspection device. Further, the citric acid coffee (A) is 1 GG parts by mass, and the "mussel injury" is preferably 5 to 100 parts by mass. The door method is used to change the polyamine vinegar vinegar tree composition. The second word 'can also be blended with (4) oxy-fired, fluorine-denatured polyoxymethane, ^, base compound, polyvinyl compound and other antifoaming agents, propyl Γ ;; yishen hindered compounds, (d) compounds, by: t amine 匕Various known additives such as a mouthpiece, an oxidizing agent, an ageing resin, etc. In the present invention, a denatured polyamine phthalate resin composition, a formic acid vinegar resin, is uniformly dissolved in an organic solvent, and the solution polyamine organic solvent is not limited, and can be used. Acetamine, NN _ 7 ^ J Magic 3 虱糸 each agent, such as N, N-dimercapto, ethyl acetamide, n, n-didecyl decylamine, N, N 2 22 8 201230908 基: Known amine, N-: ketone ketone, u·dimercapto group such as rice sulphate, sulphate, etc.; sulfur atomic solvent such as dimethyl sapphire, diethylene, 、, Dimethyl hydrazine, diethyl hydrazine, hexamethyl continuation amine, etc., containing hydrazine; dimethyl dimethyl ether solvent, monomethyl ether (chglyme), triethylene glycol dimethyl ether, In particular, it is preferred that each of the ketones of the ketones is, for example, methyl formate, n, n-diethyl amide, oxime, butyl vinegar, triethylene glycol A-, solvent. The organic denatured polyamine oxime used in the process of densifying poly- urethane _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The derogation of the rhythm is better than that of the rhythm. It is preferable to add a fossil of the aa fossil and the like. The composition of the resin is used for example, the surface shape of the pattern is used, and the circuit other than the terminal portion is Γ〇~=3, = (10) 5 == when ^ 1 is better for 15 minutes ~ 2 hours with hot air or infrared = ought to make the thief joint good (4). Membrane with 23 201230908, that is, the method will use the acid 僧 f The denatured polyamine f of the urethane resin is a cured film obtained by the treatment of ^40, K〇H/g, and is immersed in the JU composition to be heated to make the main component of the underfill material. It is better to use it for better age. Below, more preferably 15%~6^milk=when the change rate of the inch size is excellent for epoxy tree Lai. Wei Shejia 4 25%~53% ' At the time, it can be charged eight: two, the dimensional change rate of the film is less than 60%: the two-filled knife prevents the hardened film from filling the bottom layer, and the dimensional change rate of the cured film is 15%~6()%. The adhesion of the filler, from the denatured polyamine formic acid, due to the peeling of the backing material, has at least partially hardened to become a fully cohesive broken 8 characteristic, and the adhesion is particularly excellent in skin spreading (fortunately, the product is not, formic acid 酉1) A cured film composed of a resin composition, which is directly connected to an electronic component such as a semiconductor wafer, but is in contact with a structure. The underfill material is a 7-s true filler, and functions to fix the electronic component to the "package". . If the electronic parts are to be stripped, the structure should be the first to be destroyed near the filler and the cured film. The adhesion of the m-^ layer filler to the cured film will greatly affect the zero-peel strength of the electron. The towel can be formed by using a denatured polyamine vinegar vinegar tree composition having the above characteristics, thereby improving the underlying filler and the cured film, so even if the short side length of the women's wear is 12 mm In the following, it is preferably 0.3 mm to 1.2 mm, which is more preferably 〇.4ιηπι~1.1mm, which is a tiny electronic scalding machine, and it is also able to make the electronic sufficiency _ strength, the piece of material «$Β part" B part reveals It is an object of the invention to provide a method for manufacturing a flexible circuit board for a transfer tape package, comprising the step of inspecting a manufactured flexible circuit board for a transfer tape package using an optical automatic inspection device, wherein the insulating film is colored The pigment used is such that it does not contain a chlorine atom or a bromine atom, and it can suppress the deterioration of the inspection efficiency caused by erroneous detection and reduce the inspection failure rate. 8 24 201230908 The manufacturing method of the road board is related to a conductive electric tape package. The method includes the following steps: preparing a circuit board in an insulating film; forming a circuit pattern in a flexible circuit The flexible coating-curable insulating film is less connected to the circuit pattern surface other than the terminal portion and the obtained gutta-performed article is formed to be hardened to form an insulating crucible; device inspection; 1 tape package _ secret circuit _ wire type automatic The characteristics of the inspection were as follows: The original pigment (A) containing no chlorine (a2) was colored. The pigment of 3 rolled atoms and bromine atoms is not particularly limited, and a general insulating *t thermal film is preferably =. The circuit interval is i5 to 1 〇, m causes the optical automatic inspection device to have fine scattering of light, etc., and affects the flexible circuit board for the tape package. The circuit of the present invention is particularly suitable for use in circuits having such a circuit diagram. Pattern surface coating I: at least the connection terminal portion is cured to form an insulating film. And the resin composition's second use of the flexible circuit board is the use of the optical wheel to send the tape package (Qin _ _ automatic surface, touched the resin composition for the hardenable insulating film used by the parent method) It is characterized by the coloring of pigments (A) which are characterized by up to 25 201230908 soil-containing sag, which does not contain air atoms and bromine, atomic pigments (al) and pigments (A) which are not helium atoms and bromine atoms in the molecule. Refers to the so-called achromatic pigments, such as the non-secret rhyme blended when making cookware, which is small in composition and is transparent or translucent when the refractive index is almost the same when mixed with a varnish oil developer. The pigment (a2) is not an achromatic pigment, but a usual color pigment. ^ The extender pigment (al) used in the method, for example, can be used as a shell pigment of a cookware, and preferably contains no chlorine atom in the molecule and a bromine atom, for example: barium sulfate, calcium carbonate, kaolin, etc. The extender pigment (al) is preferably at least selected from barium sulfate (for example, CI·Pigment White 21, 22) and calcium carbonate (for example, cu. Pigment White 18). One type of body pigment, more preferably barium sulfate (for example, c丄 pigment white 21, 22) Further, the use of the extender pigment (al) adjusts the light characteristics of the formed cured film (insulating film), suppresses the detection efficiency of the optical automatic inspection apparatus from being erroneously detected, and improves the adhesion of the obtained hardened insulating film. The viewpoint of obtaining a lower viscosity (non-stickiness) is also preferable. Although not particularly limited, the positional diameter of the extender pigment (al) is 100 nm to 1000 nm, preferably '400 nm to 800 nm, more preferably 500 nm~ 700nm is especially good. When the median pigment (al) has a position below i〇〇〇nm, the optical uniformity of the cured film will be improved, which can reduce the false detection of the optical automatic inspection device. When it is above 100 nm, it hardens the insulation. The adhesive property of the film is improved to be better (non-stickiness). When the median diameter of the bulk pigment (al) is 400 nm to 800 nm, it is easier to disperse and can be dispersed to a particle size distribution close to the primary particle size, and optical uniformity can be obtained. The resin composition for a curable insulating film used in the method is colored by a pigment (a2) containing no chlorine atom or bromine atom in the molecule of the pigment (A). The pigment (a2) As long as it is chlorine-free and desert The present invention is not particularly limited, and conventionally known pigments can be used in consideration of dispersibility or economy. For example, color pigment soaps such as red pigments, blue pigments, yellow pigments, and green pigments should be used alone or in combination. The resin composition for a hardenable insulating film preferably contains a pigment (A) 26 8 201230908 and is colored green. The pigment (A) contains: an organic pigment (al) containing no chlorine atom and a desert atom in the molecule, and a molecule. a blue pigment (a3) which does not contain a gas atom and a bromine atom, and a yellow pigment (a4) which does not contain a gas atom and a bromine atom in a molecule. A blue pigment which does not contain a gas atom and a bromine atom in a molecular structure (a3) For example, copper-brown blue (CI pigment blue 15), metal-free blue-green (cl pigment blue 16), titanium-flowered blue, iron-orange blue, nickel-flowered blue, mint blue, tin Indigo blue, blue (CI pigment blue 1,2,3,10,14,18,19,24,56,57,61), stone weathered CuPc (CI pigment blue π)&quot;? Pigment Blue 2 &lt;7), Ultramarine (CI·Pigment Blue 29), Cobalt Blue (CI Pigment Blue 28), Sky Blue (CI Pigment Blue 35), Co(AL·Cr) 2 04 (CI Pigment Blue 36) Di-bisazo (CI Pigment Blue 25, 26), Indanthrone pndanthrone) (CI·Pigment Blue 60), Disperse Blue (CI Pigment Blue 63, 66), Cobalt Cyanine (CI) Pigment blue 75) or the like, but is not particularly limited. Among these, from the viewpoint of the cost side, it is preferable to use a copper sapphire blue. The blue pigment (&gt;3) which does not contain a chlorine atom and a bromine atom in the molecule is preferably in the range of 50 nm to 500 nm, more preferably 50 nm to 200 nm. When the position of the blue pigment (a3) is 500 nm or less, the optical uniformity of the cured film is improved, and the erroneous detection of the optical automatic inspection device can be further reduced. A yellow pigment (a4) which does not contain chlorine atoms and desert atoms in the molecular structure, such as monoazo yellow (CI pigment yellow 1, 4, 5, 9, 65, 74), benzimidazolone yellow (CI pigment) Yellow 120, 151, 154, 175, 180, 181, 194), Flavanthrone (CI Pigment Yellow 24), Azoyl Yellow (CI Pigment Yellow 117, 129), Yellow (CI Pigment Yellow) 123, 147), different sputum full yellow ((: 1. pigment yellow 139, 185), bisazo yellow ((: 1. pigment yellow 155), condensed polycyclic system (CI pigment yellow 148, 182, 192), iron oxide (CI Pigment Yellow 42), bisazo azokawa (CI Pigment Yellow 101), azolake (azo pigment 6 6 62, 100, 104, 133, 168, 169), metal The complex compound (CI Pigment Yellow 150, 153, 177, 179), etc., is not particularly limited, and it is preferable to exclude the "harmful-expressed even-* nitrogen-based pigment" from the viewpoints of cost, safety, and harmlessness. Further, when it is a yellow pigment containing a fluorine atom in its molecular structure, it is preferable from the viewpoint that the dispersibility is excellent in 27 201230908. Although it is not particularly limited, the yellow pigment which does not contain a gas atom and a bromine atom in the molecule is not particularly limited. (a4) The median diameter is preferably 50 nm to 500 nm, and more preferably 50 nm to 35 〇 nm. When the position of the di-yellow pigment (a4) is 500 nm or less, the optical uniformity of the hardened yttrium is 1&quot; Incorrect detection of the optical automatic inspection device. Also, the blue pigment (a3) containing no chlorine atom or bromine atom in the molecule, and the yellow pigment (a4) containing no chlorine atom or bromine atom in the molecule, as needed. It is preferable to prepare a resin composition for a curable insulating film by using a known pigment dispersant or the like in a bead mill, a ball mill or the like, and to prepare a resin composition for a curable insulating film. The blending ratio is such that the resin composition for the curable insulating film can be sufficiently colored to a desired color, but in order to reduce the false detection of the optical automatic inspection device, it is particularly preferable to consider the light transmittance. For example, the solid pigment (al) containing no chlorine atom or bromine atom is used in an amount of 10 parts by mass or more based on 1 part by mass of the solid content of the resin contained in the resin composition for a curable insulating film. Good, for 2 enamel: ε or more 2 More preferably, it is 00 parts by mass or less, more preferably 40 parts by mass or more and 12 parts by mass or less, and the pigment (a2) containing no gas atom or bromine atom is 100 parts by mass relative to the solid content of the resin, and is 1 to 5 parts by mass. Preferably, the resin composition for a curable insulating film used for forming an insulating film in the method is preferably a thermosetting or photocurable resin composition for a conventional insulating film. Any of them, but preferably as a patent document! The thermosetting resin composition containing the denatured polyurethane resin as described in ～4, or the thermosetting resin composition containing the polyfluorene oxyalkylene resin as described in Patent Document 5 §. In the method, the denatured polyurethane resin composition is preferably used as a resin composition for a curable insulating film, although it is not particularly limited. In this case, the extender (al) containing no chlorine atom and bromine atom is barium sulfate, and the content of the bulk pigment (al) is 1 part by mass relative to the solid content of the denatured polyurethane resin (B). The lower limit thereof is preferably 10 parts by mass or more, more preferably 2 parts by mass or more, still more preferably 40 parts by mass or more, and the upper limit thereof is preferably 2 parts by mass or less, more preferably 28 201230908 is 120 parts by mass or less. It is preferably 1 part by mass or less. In this case, when the content of the extender pigment (al) is less than 10 parts by mass relative to the denatured polyamine phthalate resin solids, the non-stickiness may be insufficient. The knife-denatured polyurethane resin composition usually contains a denatured polyamine phthalate (B) and a curable resin (c) as essential components. The hydrazine-denatured polyamine phthalate resin (B) is preferably, for example, at least a diisocyanate compound (bl), and a polycarbonate diol or a polybutadiene diol-containing polyol compound (b2) And a denatured polyamine phthalic acid S obtained by reacting with a carboxyl group-containing diol compound as 3) resin (B). The diisocyanate compound (b1) can be suitably used in the production of a conventional formic acid vinegar. That is, only one of the i molecules may have two isocyanate g groups, and may be an aliphatic, alicyclic or aromatic polyisocyanate, such as 2,4-indole phenyl diisocyanate, 2 , 6_曱 phenyl diisocyanate isophor = diisocyanate, hydrazine, 6-hexamethylene diisocyanate, hydrazine, 3 - tridecyl diisocyanate, 1,4-tetramethylene diisocyanate, 2,2,4_three=base two, cyanate, '2,4,4-tridecylhexamethylene diisocyanate ϋ壬' dimethylene, diisocyanate, u〇_+ fluorenylene diisocyanate, U-ring-burning two, cyanic acid vinegar, 2,2, _ two-domain diiso-acid cool, diphenyl-methyl γ-diisocyanide, S-, o-xylene diisocyanate g, m-xylene Isocyanate, · = toluene diisocyanate @, methylene bis (cyclohexyl isocyanate from the purpose), ring ^ burning H sub-acid vinegar, cyclohexane -1,4 - di-indenylene Bismuth diisocyanate, di-&quot;V&quot;&quot;/, cyanide § 对, p-phenylene diisocyanate, 3,3,_methylene dimethyl hydrazino-4,4'-diisocyanate 4,4,_diphenyl ether diisosa, : 2: bis-isocyanate §, 莰 莰 二 diisocyanate S, hydrogenation 1 3·^二曱^2^ Dimethylene diisocyanate and other diisocyanate. It can be used alone or in combination of two or more. This isocyanate-like acid ester compound (bl), from the point of good resistance to the filling of the layer, the swelling of the oxygen-protecting resin or the bottom methylene double (the rainbow-based 〇〇201230908

It is also possible to use a blocked polyol of diisocyanate, a polyol compound containing a polycarbonate diol or a polybutadiene diol (b2), which is a polycarbonate diol or a polybutadiene. A polyol compound of an alcohol, and if necessary, a polyol compound containing both of them. Further, in the present invention, the polyol compound (b2) does not contain a di-based compound having a carboxyl group. The polycarbonate diol is not particularly limited as long as it is a diol compound having a carbonate bond in the main chain, and T is preferably a bifunctional hydroxy terminal polycarbonate diol represented by the following chemical formula (1). Formula (1) (wherein R! represents a divalent aliphatic or aromatic hydrocarbon group, preferably a carbon number of 2 to 2 Å, a valence of one or a aliphatic or aromatic hydrocarbon group, and n is an integer of 1 to 4 Å. .) Polycarbonate diol is preferably a number average molecular weight of 5 〇〇 to 1 〇〇〇. If the number average molecular weight is smaller than the above, sometimes the degree of difficulty is 'or'. If the number average molecular weight exceeds the surface 0, the degree may be deteriorated. Polycarbonate diol used in the present invention, for example, eternac〇ll UD series, uc series, UB series, and 1 chemical industry (monthly) company PLACEL series manufactured by Ube Industries Co., Ltd.

t PCDL makes:: "; combined, 'use. Diene diol is preferred, and the amount is flat ~ &amp; ^ * secret end of the polybutyl surface ~ lion is better. ~ lQ_ is better, get the ideal Flexibility, and if less than 500 'times, it is not easy to heat or the agent will change; number; !^, over 1〇_, sometimes resistant to bonds, or intramolecular double bonds (four) can be * Ding 1 dilute alcohol It has a double cross-linking reaction in the molecule, and it is especially suitable for the double 201230908 bond in the molecule if the double bond is left in the molecule. The olefinic diol is specifically, for example, the G series, the GI series, the epoch oil company (Poly bd series, the Poly ip series, the Ep 〇 L series, the KRAS_OL series) manufactured by Sakamoto Soda Co., Ltd. The p〇lytaim series manufactured by Mitsubishi Chemical Corporation, etc. These polybutadiene diols may be used singly or in combination of two or more. The hydroxy group-containing dihydroxy compound (b3) having a carboxyl group as a substituent Dihydroxy compound, if such a hydroxy group-containing dihydroxy compound is used, the denatured polyamine formic acid _ lipid will be a sulphur group, energy (4) and hardenability _ (c) Reaction = also 'When the historical polyurethane resin is crosslinked, it can be effectively crosslinked, and the heat resistance or solvent resistance of the obtained cured product will increase. &amp; The dihydroxy compound having a carboxyl group (b3) is not In particular, it is preferably a carbon compound having a carboxyl group as a substituent, and more preferably a carbon number of 2 to 2 (). Specifically, for example, 2,2-dihydroxymethyl propyl hydrazine N,N-dihydroxyethylglycine, n,N-di-diyl-ethyl phthalate can be used alone or in combination of two or more kinds of solubility, 2,2-dihydroxymethyl, alkali, hydrazine ^ For example, 2,2-one says mercaptopropionic acid, 2,2_di-methylbutyric acid, or more than one species. Among them, from solvent, N,N-dihydroxyethylalanine, etc. More than 2 kinds of your field. Ganshi. Also 丨丄λ1,

(b2), together with a dihydroxy compound (b3) having a carboxyl group or a tricarboxylic acid monoanhydride or a g-stylene oligomer represented by, for example, the following chemical formula (2), and two different meanings. The alcohol 'with the end of the base of 0 μ long, the seed of the butadiene diol is polyolized, and the hydroxy group-containing dihydroxy compound (b3) - with the tetracarboxylic dianhydride and the monoisocyanate compound ( Bi) The reaction is easily obtained.

201230908 0 to 20 integer. The polyamine it I acid vinegar resin (8) is composed of denatured, mechanical strength, sex, and substance, which can be composed of an alcoholic hydroxyl terminated quinone imine oligomer compound in the primary bond. The dissolution of the substance and the monoamine vinegar resin having one hydroxyl group exceeds t0, and the denatured polyamine methylamine obtained is obtained. Further, it is easy to obtain, for example, a well-known method such as the Japanese Patent Publication No. 2007-238818. (5) Polyurethane vinegar resin (9) is preferably a diisocyanate vinegar with a few bases of the second alcohol polyf-fdiol compound _, 妒, 匕 mouth b3), and optionally tetracarboxylic acid The anhydride and the tricarboxylate are obtained by reacting the alkaloid phase of the alcoholic terminal group represented by the chemical formula (7) with the compound component (IV) of the artificially brewed imine ring. The diisocyanate compound (bl) and the 0 used are The molar ratio of the other compounds (b2), (b3), ϋ ^ ^ [the total of other compounds (b2), (b3), (Μ), the molar amount of the total molars /, the oxime ester compound (bl) ], preferably from 05 to 30, more preferably two. 0. ^ 2 ± 5 ' and more preferably in the range of 0 · 9 to 2.0. If the molar ratio is too small, the gluten solution k 曰 4 is viscous. If the molar ratio is too large, the molecular weight of the denatured polyurethane resin may be lowered, and heat resistance may be lowered. The modified polyamine f-ester resin (B) is prepared by using a compound having a carboxyl group as a compound, but the acid value of the phthalate resin obtained by the woven fabric is 16~4 〇mgK〇H. /g. &gt; At this time, the molar ratio of the di-based compound (b3) to the diol compound (b2) containing the polycarbonate diol or the polybutadiene diol (the second one with a carboxyl group) The molar number of the hydroxy compound (b3) / the molar number of the diol compound (b2) containing the polycarbonate diol or the polybutadiene diol, is about 〜2 to 6, preferably 〇5 to 3 8 32 The scope of 201230908. Using a diol compound (b2) having a thiol-based compound φ3), a polycarbonate diol or a polybutanol, and a tetracarboxylic dianhydride, a tricarboxylic acid monohydride or, for example, the aforementioned chemical formula (2) The molar ratio of the alcoholic hydroxyl terminated quinone imine oligomer or the like to the compound component (b4) of the quinone ring, and the molar ratio of the dihydroxy compound (b3) The diol compound (b2) containing a polycarbonate diol or a polybutadiene diol and the compound component for introducing a ruthenium ring are a total molar number of rhR, which is preferably about 0.2 to 10'. It is in the range of 0.5 to 5. The modified polyamine formic acid S is a resin (9), more specifically, a diol compound of a diisocyanate compound 盥carbonic acid diol or a polybutadiene diol which can be used in a solvent or dissolved in an organic solvent (b 乂 ^ a compound of an amine ring such as an amine ring of an alcoholic terminal group represented by a J compound (b3) and, if necessary, a serotonic acid, a scorpion, or a sulphuric acid (2) Reaction of other compounds such as components (Μ) into the reaction vessel, so that the dispersion is scooped, the crucible is started, and the stomatous material is loaded with v: after the hooking, it is preferable to add the diisocyanate compound (M). Further, in order to improve the solubility and the like, the order may be changed. The reaction temperature is usually 3 Torr. 〇 〜 2 〇〇. The acid ester can be used as a catalyst. A known amine amide grade 5 should be used to prevent isocyanide. _The purpose is to deactivate the water, and it is better to use it under nitrogen atmosphere 1S. In addition, I knife (4) Tianyou! In order to adjust the viscosity, alcohol can be added as a terminal stopper at the reaction mixing point. (4) No special duties Dimethyl ethanoamine, Ν ^ = with 3 atmospheres such as amine, hydrazine, hydrazine-diethyl ketone, amine , hydrazine, dimethyl ketone imidazolidinone, fluorene-methyl:: pyrrolidone, U_ dimethyl '2 · sapphire, - ethyl salt, amine, etc., sulfur atom solvent, such as dimethyl Oxygen-containing solvent, such as _ 娜 Na, methyl _ _ special; solvent of dimethena bisphenol, dimethyl sulphate; di glycerin butyl acetonide a private age-old acetate vinegar, propylene glycol ethyl acetate vinegar , 二丙二_ 33 201230908 酉曰, monoethyl alcohol B _ acetic acid vinegar, methoxy methoxyacetate, methoxy methoxyacetate, ethoxy propionate A, ethoxy propyl acetate , triethylene glycol dimethyl ketone, tetraglycol ruthenium, etc.; ketone solvent of acetone, acetophenone, phenylacetone, cyclohexanone, isophorone, etc., ether solvent, ethylene glycol, dioxane Γ-butyrolactone such as tetrahydrofuran or a vinegar-based solvent, etc. In particular, γ-butyrolactone, diethylene glycol ethyl acetate vinegar, triethylene glycol bis-fluorene or the like is preferably used. The number average molecular weight of the resin (B) is not limited, but is preferably 3000 to looooo, more preferably 5 to 5 Torr. Here, the number average molecular weight is determined by gel permeation chromatography (GPC). Polystyrene If the number average knife is lower than the above range, the mechanical properties such as elongation, flexibility, and strength of the cured film may be degraded. On the other hand, if it exceeds the above range, the viscosity will increase more than necessary. The use is limited. The curable resin used in the composition of the oxime polyamine phthalate resin is the compound of the (4) reaction in the resin. The sclerosing tree I /, f 疋 /, denatured polyurethane resin The carboxylic acid-reacting compound 艮 functional ΐΓΓ ΐΓΓ cyanide resin, amine-based resin, blocked 1 fresh ring resin 'such as fine A-type epoxy resin, hydrogenated double-type A ring|lipid 3 oxyphenol phenol resin, Bisphenol F type epoxy resin, phenolic phase oxygen tree: bismuth; ring ore = two = sex county resin, dicyclopentane bismuth

Polybutylene 4;::;=曰二己内 earned epoxy resin, ring 孽 In particular, N-epoxy propyl-type epoxy resin produced by more than one oxime. Good, and the other side, the amine-containing epoxy resin anti-fine I ί is used in the structure to guide people to be mad, indifferent, etc. 4. 34 201230908 π ^ί, the handle is better to use, for example, complete The alkylation type, the type, the imine group / the methyl type melamine fine, the urea = the base resin, and the like. In particular, the benzophenone resin is reliable from the insulation, and the blocked polyfunctional isocyanic acid is used. The polyfunctional isocyanate of the sulphuric acid sulphate on the k S can be suitably used. For example: aliphatic, alicyclic or aromatic; = heterofibrous end capped, preferably free of iso-di = fya f-naphthalene diisocyanate, tolidine diisocyanide ΐ ; ; 异 异 — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — The blocked polyfunctional pure product is a reaction-denatured polyamine phthalate resin composition, and may be further used in addition to other or other additives such as a tree insulating material (D). For example, a corrosive stone is used. , oxidized Shao, stone, glass powder, quartz powder and other inorganic residues, epoxy resin powder, Er 2 tree wax powder, urea resin powder, melamine (gamine) = Qin end, polyester resin powder, polyamine Organic fine particles such as resin powder, polyimine resin = rubber particles, and iron ketone powder. The particle diameter (median diameter) is 0.001. ~1, preferably, _5~〇.5μηι is better, 〇 〇1~〇 1μηι尤佳.

Spoon C 201230908 Its automatic recording and recording is prone to false detection. Further, 100 parts by mass of the "I-carbamic acid-based resin" is used, and usually 7 1 to 200 parts by mass, preferably 5 to 10 parts by mass. ^In the case of resin damage, it is also a resin composition 'in terms of other additives (6), polyfluorene, fluorine depolymerization, polyacrylic acid compound, hindered "chemical I, also foaming agent L贞 or tertiary amines Other known additives such as hardening contact 又 又 compound, lanthanide compounding agent, _ lipid, etc. ° 仏 仏 树 树 树 树 树 树 树 树 树 树 树 S S S S S S S S S S S S S S S S , N-diethylethylenedimethylacetamide, N-methyl-2-pyridinium N, N-methylformamide, diethylmethylhexylamine, etc. Contains ^, U II Methyl-2__Salt, N-mercaptomethyl stone, ί, 乙谷剂, such as dimercaptoarrene, diethyl hydrazine, two agents, such as 甲盼r^,:, ¥甲; Oxygenated solvents, etc.; oxygen-containing solvents such as dimethyl dimethyl ether (diglyme), ~: A, hun; di-glyme _ solvent such as diethyl dimethyl ether, etc., such as: alcohol _glyme ), tetraethylene glycol diphorone acetophenone benzene ^, stupid propylene feed, cyclohexyl amide, isobutyl endogenous, etc. tetraterpenoids such as γ-diethyl ί = carbamide , Ν, Ν-dimethyl _ _, ye _ keji connected with Bertar lactone, triethylene glycol dioxime ether, etc. In addition, the organic solvent used in the modification of the 4 ϊ 聚 poly urethane is also used. The solution viscosity of the printed imH resin composition, in order to obtain the ideal sec~5_a · se, c, the viscosity of the car rotary viscometer is usually his · The season is preferably 25Pa · sec~200Pa · sec. When forming a pattern with i, 'to suppress the bleed out', it is advisable to add fine filler such as sulphur dioxide to the Wei. §1 Resin composition represented by the resin composition, rim, _&amp; composition' can be made on the surface of the cured film by using a circuit blue film other than the connection terminal 8 201230908 of the flexible circuit board. The coating is applied to form a coating having a thickness of about 3 to 60 Å, and the solvent is removed at a low temperature, followed by 100 to 130. (:, , ^ at 60 to 2 ° C, preferably 80 to 15〇ϊ, preferably more preferably 30 minutes for 5 minutes to 5 hours, preferably 10 minutes to 3 hours, such as denatured arm face knives for 2 hours with hot air or infrared heat treatment to obtain hardening崎邮) and hard lion (Q cross-linking reaction, and containing up to two, it is hardenability For the resin composition for the film, a denatured polyurethane resin having a fat content of 16 to 4 〇 mg KOH/g of a hard acid and a di-acid is used: the denatured polyamine phthalate resin is used. Preferably, the cured film obtained by heat-treating the composition has sufficient cross-linking density, so that it has a low-level underfill and does not have excessive degree, and is ideally The amine/polyamine phthalate resin composition is heat treated, and the following s 1 has a dimensional change rate of preferably 60% when impregnated with the epoxy resin, and the epoxy resin Resistant, and in the case of the underlying filler, the hardened film of the arsenic polyurethane resin composition is peeled off. The less hardened film will partially (4) break (preferably the full cohesive hardening, at least the connecting terminal) The circuit pattern surface coating other than the part is coated with the 抖 ΐ 抖 抖 抖 组成 , , , , 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 挠性 挠性 挠性 挠性 挠性 挠性 挠性By using the precursor pigment such as pre-chlorine, the self-gas atom and the bromine atom (al) and the hardening insulation without the film resin &amp; the inclusion of the film: ^ Insulation _=·== == 201230908 Lowering the rate of the ancients can reduce the rate of inspection failure. As a result, it is possible to obtain a flexible circuit board for the conveyance tape of the county body. Moreover, the flexible circuit board of the material material of the t-feeding material can be ideally formed into a hardening insulating resin composition, and the environment is suitable for the method because the hard g-like filament property is high and the material contains chlorine Xuan Xuan Xuan. Obtaining the _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The heat treatment is performed to harden, and the carrier package is desirably obtained. Also, in the shape of the ^ and the ruler Ke mosquito. [Embodiment] Further, the present invention will be further described below by way of examples and comparative examples. The present invention is not limited to the following examples. Example of x «Α part The evaluation of each of the following examples was carried out in the following manner. [Solution viscosity] Solvent sri to viscometer to determine denatured polyamine formic acid solution [Solid composition] Derivatized polyamine formic acid resin solution

The hot air circulating oven was heated and heated for 2 hours to remove solids, and C was obtained from the mass of the residual component to obtain a knives (mass%) of the denatured polyamine formic acid. The solid of the resin solution is [acid value of the denatured polyurethane resin] The acid value of the amine resin is determined by potentiometric titration according to JIS K0070. Further, since the denatured polyamine of the present invention is warm and divisible, phenylhydrin is used as a solvent for dissolution. -曰3, θ due to human deficiencies

Acid value A (mgKOH/g)=[Bxfx5.6U]/S 38 201230908 B: 0.1N potassium hydroxide-ethanol solution (ml) f: 〇.IN potassium hydroxide-ethanol solution factor S: denaturation The amount of the polyamine phthalate resin (g) [wafer peel strength], and the composition of the denatured polyamine phthalate resin coated by screen printing on a polyimine film (UPILEX 35SGA manufactured by Ube Industries, Ltd.) It was carried out at 80 ° C for 30 minutes, followed by 120. (: A heat treatment film of about 10 μm thick was formed by heat treatment for 60 minutes. A dummy wafer having a short side of 1 mm to 2 mm was placed on the cured film on the polyimide film substrate, and a bisphenol F ring was dropped in the vicinity thereof. Oxygen resin as a main component = sold as a C〇F underfill material, and heat-treated at 150 ° C for 2.5 hours to prepare a test sample in which the underlying filler was sealed on the joint surface side of the dummy wafer. The table tester Ez_s is used to fix the sample which is not bonded to the polyimide film substrate and the dummy wafer, and the surface of the dummy wafer is fixed in the direction of the first side. The substrate is clamped to the surface of the mating surface of the dummy wafer, and the maximum thickness of the hardened film and the underfill material in the short-side peeling period of the simulated wafer is as follows. It is rated as χ (strength) less than 3 χ (strength is not [resistant to epoxy resin (size change rate)] 严 _ resin composition flow extends on the glass plate, so that hardening fo at 8G ° C for 3G minutes Second, followed by a thief The hardened film is peeled off from the glass plate, and then impregnated in the epoxy resin (JAPAN ΕΡΟχΥ side: length hardened 臈, Yangzhou ^ change rate, both seek for the size of the dip smashed after the money immersed in the German surname For the resistance of the epoxy resin (dimension change rate). Also, when ίίi ff is used to change the shape of the film, it is rated as X. Size cross-linking rate (°〇(la-Lb)/LbX100 39 201230908 LA: sample after impregnation Average length of 4 sides 値 lb: Average length of 4 sides of the sample before impregnation [resistance to the underfill (appearance)] Screen printing on polyimine film (Uhlex 35SG, Ubex 35SG, cloth denaturation). The polyurethane resin composition was heat-treated at 80 ° C for 30 minutes and then f 12 ° C for 60 minutes to form a cured film of about ΙΟμπι thick. The bisphenol was thinly coated on the tantalum cured film. A commercially available epoxy resin-based underfill agent containing F-type epoxy resin as a main component, which was heat-cured at 15 (TC for 2 hours). The test piece was evaluated without any abnormality. It was found to be swollen or wrinkled [with underfill material Adhesion (peeling pattern)] Screen printing on polyimine film (UHLEX 35SGA) The cloth denatured polyamine phthalate resin composition was subjected to heat treatment at 80 ° C for 1 = 120 C to form a cured film of about 1 〇 thick, using a mechanical pipette, and dripping with a double F type. Epoxy resin 20% knife commercially available epoxy resin based underfill material 3pL, at 15 〇. Indentation hardening. The hardened underfill material is peeled from the cured film '2 style. The peeling pattern is cohesive for the cured film. When the damage is judged, there is a hard tilt (four) damage and the hardened film and the underfill [solder heat] resin and the lighter cloth denatured polyurethane 酉1 coated with rosin titer into a thick and hardened film. In the cured film

, manufactured by Erhe Chemical Industry Co., Ltd.: SUNFLUX is contacted with a hardened film for 10 seconds with a solder bath of the same day. After that, the money is different (four). No abnormality_. , bulging, etc. [low warpage] The composition of the scorpion vinegar resin was applied to the scorpion imine film (UPILEX 35SGA), which was carried out at 80 ° C for 30 minutes, followed by 12〇. The heat treatment was carried out for 60 minutes to form a cured film of about ι〇μηη thick. The polyimine film and the cured layer of the cured film were cut into 5 cm&gt;&lt;5 cm, and the hardened film was loaded upward on the horizontal pedestal to obtain the height of the four corners from the horizontal plane (Juyia &; the bottom of the membrane). When the average height is less than 2 mm, it is rated as above, when it is less than 3 mm, it is rated as 〇, and when it is 3 mm or more, it is rated as X. [Flexibility] The denatured polyamine phthalate resin composition was applied by screen printing on a polyimide film (35SGA manufactured by Ube Industries, Ltd.), and heated at 80 ° C for 30 minutes, followed by heating at 120 ° C for 60 minutes. The treatment forms a cured film of about 10 μπ thick. The laminate of the polyimide film and the cured film was cut into a length of 2 cm x width lcm' and bent at the center in the longitudinal direction, and a weight of 5 Å was placed on the bent portion, and allowed to stand for 1 minute. The bent portion was observed by a microscope, and when it was found to be flawless when no abnormality was observed, it was evaluated as X when it was found to be cracked and whitened. [Non-adhesive] The composition of the denatured polyurethane resin was coated on a polyimide film (UPILEX 35SGA manufactured by Ube Industries, Ltd.) by screen printing at 8 ° C for 3 〇 minutes, followed by 120 C. Heat treatment for 60 minutes to form a hardened film of about ι〇μηη thick. The laminate of the polyimide and the cured film was cut into a width of 2 5 cni and a length of 5 cm. , making samples. The sample was placed on a hot plate heated to 160 ° C with the coating film facing up, and a SUS hammer (bottom area 2 cm x 5 cm, weight 500 g) was placed thereon for 30 seconds, which was evaluated as unattached at the time of lifting. ◎, it will be attached at 16〇, but it will be rated as 〇 when M〇C is not attached, and will be rated as X when it is attached at 140〇C. [Appearance observation] Using a screen printing machine (screen version SUS 150mesh), the denatured polyamine phthalic acid resin composition was printed on a polyimine film (Utsumatsu-made upiLEX 35SGA) on the 8th floor. 〇 minute, followed by 12〇t: heat treatment for 6 minutes to form a cured film. The cured film was an erect, Nikon ECLIPSE (CCD camera DS2Mv) manufactured by Nikon Co., Ltd., and the appearance was observed with reflected light. When there is no abnormality, it is rated as 0, and the maximum length of the cured film is confirmed to be 5 μιη or more. 201230908 = different = ΐΐ =, phase separation structure or void (the gradual reduction structure or phase separation structure, large gap of the gap, When the shot (maximum length) is greater than _, 'optical=丄杳展..., the legal area is a real foreign object or defect, so it is easy to detect by mistake. ~ [For the automatic inspection device] # ^ Screen printing machine (screen version) Polyurethane vinegar 220meSh), the denatured poly 贱 酉 酉 酉 酉 曰 曰 曰 曰 曰 曰 曰 ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES Flexible circuit board for package. The flexible circuit board for the transfer tape package was evaluated using the following inspection device. Camera: Piranha2 camera line made by DALSA 剞 8000 white 8000 pixels, ... 曰 Analytical ability: 6μιη / 昼素Light source: The metal halide 180W light source shoots the same part with the same amount of light, and the peak shape of the luminance histogram compares the contrast of the line/space boundary. When the peak width of the luminance histogram is narrow and contrasting Represents a square, a luminance histogram of the peak portion and a wide width when fresh contrast to X-. The following compounds were used in each Example are as follows. [Diisocyanate compound]

Desmodur W (HMDI): yttrium bis(cyclohexyl isocyanate) sulphate Bayer URETHANE Co., Ltd. IPDI: isophorone diisocyanate g Degussa Japan "shares" company [polycarbonate diol] UH-200: 1,6-hexahydrodiol-based polycarbonate diol UBE Xingsheng Co., Ltd. ETETNACOLL hydroxyvalence 57.2mgKOH/g C-1065N: 1,9-nonanediol, 2-methyl -1,8-octanediol-based polycarbonate diol (stock) company Kuraraypolyol hydroxy valence 42 201230908 112 mg KOH / g [glycol-containing diol compound]

Bis-MPA: 2,2-bis(hydroxyindenyl)propanoic acid, Glory PERSTORP (shares) DMBA: 2,2-dimethylolbutanoic acid, manufactured by Nippon Kasei Co., Ltd. [Alcohol] l-Pentanol: L-Pentanol and Wako Pure Chemicals Co., Ltd. [Solvent] ΒΙΧ)··γ-butyrolactone Mitsubishi Chemical Co., Ltd. CA: Diethanol acetoacetate g and Wako Pure Chemical Co., Ltd. [Epoxy] Resin] YH434: EPOTOTE, Epoxy Equivalent 121 [Ethyl Resin] manufactured by Dongdu Chemical Co., Ltd.

M136: benzoguanamine resin Japan CYTEC INDUSTRIES Co., Ltd. MYCOAT

[Blue pigment containing no gas atom and bromine atom in the molecular structure] PB15:3:CY pigment blue 15:3 copper phthalocyanine β-type flower blue blue G (NC) in laser diffraction/scattering particle size distribution In the measurement, the median diameter is 140 nm (using a BLO and a dispersant previously added as a solvent, and dispersed in a bead mill.) [Yellow pigment containing no chlorine atom and bromine atom in the molecular structure] PY180.CY Pigment Page 180 Condensed azo Novoperm yellow P-HG 'The laser diffraction/scattering particle size distribution is determined by a median diameter of 470 nm (using a BLO, a dispersant previously added as a solvent, and dispersed in a bead mill.) [Molecular structure does not contain Physicochemicals of chlorine and bromine atoms] PW21: CY pigment white 21 Settling barium sulphate BARIFINE B-54 with laser diffraction/scattering particle size distribution Determination of median diameter 64 〇 nm 43 201230908 (Use pre-added as solvent BL0, dispersant, disperser in the bead mill.) [Filler]

Aerosil50: Japan's Aerosil Corporation's average primary particle diameter 30nm [Other additives] FA600: Fluorine-denatured polyoxane Shin-Etsu Chemical Co., Ltd.

P410EF: Polyurethane-based compound DISPAR0N HF-1: phenol resin Minghe Chemical Co., Ltd. [Manufacture of sulphide oligomer diol solution] with nitrogen inlet tube, Dean_Stark Adding 2,3,3,,4,-biphenyltetrahydro acid to the 5 liter glass separable flask with the capacity of the receiver and cooling tube

1471 g of anhydride, 507 g of ethanol and 92 g of γ-butyrolactone were stirred at 9 (TC for 1 hour) under a nitrogen atmosphere. Next, 376 g of 3-aminopropanol and 426 g of isophoronediamine were added under a nitrogen atmosphere. The mixture was heated at 120 ° C for 2 hours and heated at 180 ° C for 2 hours, and the water produced by the hydrazine imidization reaction was removed by blowing nitrogen gas into the reaction solution. The solid content of the brewing imine oligomer diol solution 52.3% [Reference Example A1] [Manufacture of denatured polyurethane resin (PU_A1)] Polycarbonate diol ETERNACOLL UH- was added to a glass reaction vessel equipped with a scrambler, a thermometer, and a nitrogen introduction tube. 200 60.0g, solvent γ-butyrolactone (BLO) 17〇.5g, thiol-containing diol Bis-MPA 10. lg, 48.0g of ruthenium oligodiol diol solution synthesized in the above production method, After dissolving at 90 ° C, 33.7 g of a diisocyanate compound Desmodur W was added, and after stirring at 90 ° C for 1 hour, the temperature was raised to 1103⁄4, and 1-pentanol was added at a viscosity of 120 to 150 Pa · s, and then 13 Torr. Stir for 2 hours. Obtain a solid content of 40.5%, a viscosity of 97 Pa · s, and an acid value of 33 mg of the solid content of the denatured polyurethane resin. KOH/g denatured polyamine phthalate resin (PU-A1) solution [Reference Example A2 to A7] [Manufacture of denatured polyamine phthalic acid vinegar resin (PU-A2 to A7)] 44 201230908 Using Table A1 In the same manner as in Reference Example A1, a solution of a denatured polyamine phthalate resin (PU_A2 to A7) was obtained. Table A1 shows the acid value of the solid content, viscosity, and denatured polyamine quinone solid content. A8] [Manufacture of denatured polyamine phthalate resin (pu_A8)] In a glass reaction vessel equipped with a mixer, a thermometer, and a gas introduction tube, 11⁄4 acid ester alcohol Kuraraypoly〇lC-l〇651Si 83 90g was added. Resin-containing diol surface A 15.85g, solvent diethylene glycol ^ ^ acid 酉 150.15g, 9GC Lin 1 hour. After cooling to the thief, add diisocyanate compound Desmodur W 52.5g, stir for a few hours (8: stirring for 1 hour, stirring at 100 ° C for 2 hours. Obtaining a solid content of 5 〇 · 5%, a viscosity of 151 Pa·s, and an acid value of a solid content of the denatured polyamine phthalate resin of 41 mgKOH/g. Denatured polyamine phthalate resin (piJ_A8) solution [Example A1] [Preparation of composition and cured film] Obtained in Reference Example A1 Of (A) a solution of denatured polyamine Yue ester resin (pu_A1) in 'with respect to the resin solid content 100 parts by mass, adding Table A2 described in the (B) thermosetting resin and (E) other additives. Stir • mixing. Next, (C) pigment and (D) filler were added and mixed, and then kneaded using a 3-roller. The composition of the denatured polyamine phthalate resin was obtained by setting the viscosity of the mash to 20 to 60 Pa·s. For the hardening of the resin composition of the acceptor polyamine phthalate, the peel strength of the solder wafer, the epoxy resin red (dimension change rate), and the bottom layer filling (external underfill adhesion (peeling) Pattern), solder heat resistance: low lightness t it non-stickiness, appearance observation, correspondence with an optical automatic inspection device. The evaluation results of this 如 are shown in Table A2. [Examples A2 to A7, Comparative Examples A1 to A2] [ The composition of the composition and the hardened material were mixed as described in Example A1, and the composition of the female vinegar resin was applied to the denatured polyamine vinegar vinegar. The film was evaluated in the same manner as in Example A1. The results are shown in Table A2. 45 201230908 [Ιν·&lt;] PU-A8 52.5 83.9 15.9 τ~Η 50.5 1—^ PU-A7 22.5 60.0 _1 〇 — 48.0 148 40.9 PU-A6 28.6 60.0 r &lt; Ο Τ-Η 1 48.0 rH 40.3 芝 PU-A5 30.0 60.0 〇6 48.0 (N 〇〇40.1 00 (N PU-A4 31.9 60.0 10.1 36.0 (N 1—H 40.7 cn PU-A3 26.2 60.0 ο 1 48.0 CN mr—H 40.5 &lt;N (N PU-A2 30.0 60.0 ο 00 48.0 o inch 40.2 PU-A1 33.7 60.0 10.1 48.0 s; 40.5 mm denatured polyamine phthalate resin (A) diisocyanate compound (al) HMDI IPDI polycarbonate diol (a2) UH-200 C-1065N with carboxyl group Dihydroxy compound (a3) Bis-MPA DMBA Diet 7 4 姨澍 Ί Ί 婳荽 Solution viscosity (Pa*s) Solid content (% by mass) Acid value (mgKOH/g) 46 8 201230908 [(Nv^] Comparison Example A2 0 inch 0\ 〇〇s «λ (N 〇X 〇&lt;1 Ο ◎ 〇 ◎ 〇 Comparative Example A1 100 Vi d 〇2 ο cs CO Ν 〇 XXX ◎ Ο ◎ 〇 ◎ 〇 1 Example A7 〇 Rt ΓΛ 00 〇ο § sm Ό - 〇〇Os 〇〇Ο ◎ 〇 ◎ 〇 1 Example A6 100 00 &lt;Ν Ό a ο inchο S ο rs cn V&gt;&lt;s 〇〇5 〇◎ Ο ◎ 〇 ◎ 〇 1 Example A5 100 Ό ο ο ο ο SS Λ * & SS Ο ◎ ◎ ◎ 〇 1 Example A4 100 (Ν &lt;Ν甘ο 々ο os ΓΛ *Ti (N 〇〇»r&gt; 〇◎ Ο ◎ 〇◎ 〇1 Example A3 〇〇 &lt;s Ό w&gt; 兮ο inchο so rs r^j (S 〇〇&lt;s 〇◎ 〇◎ 〇◎ 〇1 Example A2 100 r- &lt;s σ\ 兮ο ο ov〇o fS m Vi &lt;N 〇0 〇◎ 〇◎ 〇◎ 〇0 Example A1 100 cn ts inch c&gt; Ganο § ro ir&gt; oi 〇〇00 m 〇◎ 〇◎ 0 ◎ 〇〇一雄婆婆 harmonic δ- Φί PU- A1 PU-A2 PU-A3 PU-A4 PU-A5 PU-A6 PU-A7 PU-A8 5 K o bo B Harmony δ- 铤ΥΗ434 ! M136 PB,15:3 Ρ.Υ. 180 PW 21 Aerosil 50 J -4PY FA600 P410EF 丄X ε &lt;N $ 〇§ truncated π &lt; think Mi m 苕3C &lt; for epoxy resin (size change rate %) S' 实钵/«-S δ &lt; t t t 焊料 焊料 solder heat resistance low flexibility 弩 弩 无 无 外观 对于 对于 对于 对于 1 Reference example Α 2 Reference example A3 Reference example 参考 4 Reference example Α 5 Reference example Α 6 Reference example Α7 Reference Example 8 Epoxy Resin Amine Resin Blue Pigment Yellow Pigment Body Pigment Ceria Acrylate Filler Fluorine Modified Polyoxane Polyethylene Group i phenol resin (Α) denatured urethane resin (B) thermosetting resin 1 (c) pigment (D) filler (E) other additives evaluation result s 47 201230908 Shu Shu, the denatured polyamine formic acid of the present invention A sclerosing composition of vinegar tree, which has a good material resistance, %, curvature, non-stickiness, uniformity (as an optically uniform hardened film) - also true to i The optical characteristics of the inspection device are good (the inspection efficiency is reduced due to erroneous detection, and the inspection failure rate can be reduced), and sufficient wafer peel strength is maintained even for wafers having a shortness of 1.2 mm or less.乂

«Example of the Β part" X The evaluation of each of the following examples was carried out in the following manner. [Solid viscosity], [solid content], [acid value of denatured polyurethane resin], [solder heat resistance], [low warpage], [bending property], [cover viscosity], [appearance observation [Response to the automatic inspection device], [Adhesion to the underfill material]' was evaluated by the method described in the example of Part A. [No halogen] 'The denatured polyamine phthalate resin composition was spread on a glass plate to a thickness of about 50 μm after hardening, 30 minutes at 80 ° C, and then heat treated at i2 ° C for 60 minutes. A cured film is formed. The gas and bromine in the cured film were quantified using an automatic elemental sulfur analysis system (SQ-1/HSU-35 + DIONEX ICS-2000 manufactured by YANACO). When the content of the gas and bromine in the cured film is less than 3 〇〇 ppm, it is evaluated as ◎, and when it is 300 ppm or more, when it is less than 900 ppm, it is evaluated as 〇, and when it is 900 ppm or more, it is evaluated as X. The compounds used in the following examples are as follows. [diisocyanate compound]

Desmodur W (HMDI): yttrium bis(cyclohexyl isocyanate) sulphate Bayer URETHANE Co., Ltd. IPDI: Isophoric diisocyanate Degussa Japan (polycarbonate diol) UH-200:1 , 6-hexanediol-based polycarbonate diol, Utopia COLL, manufactured by Ube Industries, Ltd., hydroxyl price 57.2 mgKOH/g C-1065N: 1,9-nonanediol, 2-mercapto-1,8- Octanediol-based polycarbonate 48 8 201230908 K diol cola cola Co., Ltd. Kuraraypolyol hydroxyl valence 112 mg KOH / g [glycol-containing diol compound]

Bis_MPA: 2,2-bis(hydroxyindenyl)propanoic acid, Glory PERSTORP (shares) DMBA: 2,2-dihydroxymercaptobutyric acid, manufactured by Nippon Kasei Co., Ltd. [Alcohol] l-Pentanol: l-戊-butyrolactone (M) Co., Ltd. [solvent] ΒΙΧ): γ-butyrolactone Mitsubishi Chemical Co., Ltd. CA: Diethylene glycol ethyl ether acetate and Kokon Pure Chemical Co., Ltd. [Epoxy resin] ΥΗ434: Dongdu Chemical Co., Ltd. Co., Ltd., epoxy equivalent 121 [Amine Resin]

Μ136: phenyl hydrazine resin Japan CYTEC INDUSTRIES (shares) company MYCOAT

[Blue pigment containing no chlorine atom and bromine atom in molecular structure] PB15.3.CY Pigment 15:3 Copper Ou Huaqing β-type sputum blue G (NC) in laser diffraction/scattering particle size distribution measurement The median diameter is I40nm (using BLO, a dispersant that is pre-added as a solvent, and dispersing it in a bead mill.) [Yellow pigment containing no chlorine or bromine atoms in the molecular structure]

PY180: CY Pigment Yellow 180 Condensed Azo Novoperm Yellow P-HG Laser diffraction/scattering particle size distribution has a median diameter of 470 nm (using a BLO, a dispersant previously added as a solvent, and a bead mill disperser). PY154: CY·Pigment Yellow 154 Benimidazolone Benzimidazolone Yellow H3 G The laser has a 320mm diameter in the laser diffraction/scattering particle size distribution. Add BLO as a solvent, dispersant, and disperse in a bead mill.) [External pigments containing no chlorine and bromine atoms in the molecular structure] RW.21: CY Pigment White 21 Settling Barium Sulfate BARIFINE B-54 The diffraction diameter of the diffraction/scattering particle size distribution is 64 〇nm [filler]

Aerosil 50: cerium oxide Japan Aerosil Corporation average primary particle diameter 30nm

Art Pearl J-4PY: Acrylic Beads on the Radar Diffraction/Scattering Particle Size Distribution Determination of 2.2μηη [Other Additives] FA600: Fluorine-denatured Polyoxane Shin-Etsu Chemical Industry ( Company system

P410EF··Polyvinyl compound, manufactured by Nanben Chemical Co., Ltd. DISPARON HF-1: phenol resin Minghe Chemical Co., Ltd. [Manufacture of yttrium oligodiol solution]

2,3,3,4,4-biphenyltetracarboxylic dianhydride 1471 g, ethanol 5〇7 g were added to a glass separable flask equipped with a nitrogen gas introduction tube, a Dean-Stark receiver, and a cooling tube with a capacity of 5 liters. 2092 g of γ-butyrolactone was stirred at 90 ° C for 1 hour under a nitrogen atmosphere. Next, 'add 3_aminopropanol 376g, isophoronediamine·426g' in U (rc heating for 2 hours, i8 (rc heating 2 卞, ' and will be produced by hydrazine imidization reaction) The water was removed by blowing nitrogen gas into the reaction solution. The solid content of the quinone imine oligomer diol solution was 52 3%. [Reference Example B1] [Denaturing Polyurethane Resin (PU-B1) Manufacture] Adding polycarbonate diol ETERNACOLL UH-200 60_0g, solvent γ-butyrolactone (BLO) 170.5g, carboxyl group-containing diol Bis in a glass reaction vessel equipped with a mixer, thermometer, and nitrogen inlet tube -MPA 1 〇.ig, 48.0 g of the quinone imine oligomer diol solution synthesized in the above production method was dissolved at 9 ° C, and then Desm〇dur w 33 7 g was added. At 9 〇. After that, the temperature was raised to 11 (rc, when the viscosity became 12〇15〇Pa·s, 8 50 201230908 points, '1-pentanol was added, and then 13 (rc was stirred for 2 hours, the solid content was 40.5%, and the viscosity was 97 Pa. s, a denatured polyamine phthalate resin (FU_B1) solution having a solid content of a denatured polyurethane resin having an acid value of 33 mgKOH/g [Reference Example B2 to B6] [Deformation The production of the aminic phthalate resin (PU_B2 to B6) was carried out in the same manner as in Reference Example B1 except that the raw materials shown in Table B1 were used, and a denatured polyurethane resin (PU-B2 to B6) solution was obtained. The solid content, viscosity, and acid value of the denatured polyamine phthalate solid component are shown. [Reference Example B 7] [Manufacture of denatured polyamine phthalate resin (pu-B 7)] equipped with a stirrer, a thermometer, a nitrogen introduction tube In a glass reaction vessel, Kuraraypolyol C-1065N 83.90 g &gt; DMBA 15.85 g, and diethylene glycol diethyl ether acetate 150.15 g were added, and the mixture was stirred at 90 ° C for 1 hour, and then cooled to 70 ° C after adding 'Desmodur W 52.5 g, and after 1 hour of scramble, mix at 80 C for 1 hour and stir at 2 °C for 2 hours. Obtain a solid content of 50.5%, a viscosity of 151 Pa·s, and the acid value of the solid content of the denatured polyamine phthalate resin is 41 mg KOH/g of denatured polyurethane resin (PU-B7) solution [Example B1] [Preparation of composition, and cured film] (A) Denatured polyamine phthalate resin obtained in Reference Example B1 ( In the PU_B1) solution, 'the curable resin and other additives described in the table are added to 100 parts by mass of the resin solid content, After the addition of the pigment, the filler, and the mixing, the mixture is mixed using a 3-roller. The viscosity of the composition is 20 to 60 Pa·s by diluting with γ-butyrolactone to obtain a denatured polyamine phthalate resin composition. . For the cured film of the denatured polyurethane resin composition, evaluation of heat resistance, low warpage, bending property, non-stick property, appearance observation, correspondence of the two-wind automatic inspection device, and underfill filling Synthetic (peeling style), no substance. The results of these evaluations are shown in Table B2. [Examples B2 to B12, Comparative Examples B1 to B2] [Preparation and hardening of the composition were carried out in accordance with the description of Table B2, except that the same procedure as in Example B1 was carried out. A phthalate resin composition. The cured film of the denatured composition of the denatured polyamine K-formate resin was the same as that of Example #1. The results of 兮 & etc. are shown in Table B2. °贝〇Λ 51 201230908 1 PU-B7 1 | 52.5 | 83.9 15.9 rH 50.5 T—Μ 1 PU-B6 | 28.6 | | 60.0 1 Li〇j__1 48.0 τ-Η 40.3 芝 PU-B5 30.0 | 60.0 1 〇ό 48.0 &lt;N 00 40.1 00 CN PU-B4 丨31.9 | 60.0 1 lo.i 1 36.0 126 40.7 &lt;η CO PU-A3 | 26.2 | 60.0 | ο vd 48.0 132 40.5 CN CN PU-B2 | 30.0 60.0 ο 〇〇 48.0 140 40.2 PU-B1 | 33.7 60.0 10.1 48.0 ON 40.5 cn m 奄am key B- diisocyanate compound (al) HMDI IPDI Ί 遛UH-200 C-1065N Dihydroxy compound with carboxyl group (a3) Bis-MPA DMBA Ν_^ 姨荽楚•Κ- *ΠΤΝ 醯imino oligomer diol solution A _ cd Pl, ♦1 φ 韬 酸 acid value (mgKOH / g) chemical composition of raw materials (g) characteristics 8 201230908 [s &lt; 〕Comparative example B2 100 〇 〇 〇 〇 〇 〇 & & & & B 〇 〇 〇 〇 t B B B B B B B B B B B B B B B B B B B B B B B B 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 XX 1 ◎ Example B12 100 卜&lt;N Os τί* ο inchο 100 ο cn CS 〇〇 ◎ 〇 1 1 ◎ Example B11 100 Ο ο ο ο s sm V-) CN 〇 ◎ 〇 ◎ 〇 1 1 ◎ Example B10 1 〇〇! 〇 ο ο ο 〇 ro ro ro ro ro ro ro ro ro ro ro ro ro ro ro O ◎ 〇 ◎ 〇 1 &lt; 1 ◎ Example B9 100 scoops · 00 rf Ο ττ ο S sm V) cs 〇 ◎ 〇 ◎ 〇 1 ◎ ◎ Example B8 100 1 〇〇 &lt;N Ό ο ο ο ο Ό o cs • n cs 〇 ◎ 〇 ◎ 〇 1 ◎ ◎ Example B7 〇〇r〇00 τΤ ο ό § sm (N o ◎ 〇 ◎ 〇! ◎ ◎ Example B6 〇 CS (N m inch ο inch ο S sm *r&gt; 〇 ◎ 〇 ◎ 〇 1 ◎ ◎ Example B5 〇〇〇 ο 寸 ο ο o vn fS 〇 ◎ 〇〇〇 1 ◎ ◎ Example B4 100 r- fS ο inch ο ο \〇o &lt N m ν Ί 〇 ◎ 〇 ◎ 〇 1 ◎ ◎ Example B3 100 r- (N inch ο inch · ο ο ν〇o N m VI cs 〇 ◎ 〇 ◎ 〇 1 ◎ ◎ Example B2 100 卜 &lt; N 〇 Inch ο ο S o cs CO (N 〇 ◎ 〇 ◎ 〇〇 ◎ Example B1 100 ro CN vs. ο ο S m oi 〇 ◎ 〇 ◎ ◎ ◎ Deformation of the sclerosing urethane resin hardening composition (parts by mass) PU-B1 PU-B2 PU-B3 PU-B4 PU -B5 PU-B6 PU-B7 I 5 K o Dan 5 Temperature ±1 m YH434 M136 Ρ.Β.15:3 Ρ.Υ. 180 Ρ.Υ. 154 PW 21 Aerosil 50 J-4PY FA600 P410EF d, P: Solder heat resistance low composition bending flexibility non-adhesive appearance observation Correspondence to the underfill of the optical automatic visual inspection device (peeling pattern) Halogen-free reference example B1 Reference example B2 Reference example B3 Reference example B4 Reference example B5 Reference Example B6 Reference Example B7 Epoxy Resin Amine Resin Blue Pigment Yellow Pigment Body Pigment Ceria Acrylate Filler Fluorine Modified Polyoxane Polyvinyl Compound Phenol Resin (B) Denatured Urethane Resin (C) Heat Curing tree (Α) pigment (D) filler (E) Evaluation results of other additives 53 201230908 [Industrial use] method, which can produce low tortuosity, robustness, and resistance. ^ 'Boundary, flexible, low-hardening shrinkage, filling the tank and other resistant ships, and the bottom layer will be reduced as the short side of the long slave county, and can be securely installed on the conveyor tape ^1 ^\Semiconductor wafer-like electronic zero-connect terminal part, so that the circuit of the strip circuit with the flexible circuit board is not used for the wiring of the circuit board of the flexible circuit board; The pigment is free of chlorine atoms and desert atoms. The inspection efficiency is lowered and the inspection failure rate can be reduced. Can suppress false detection [Simplified illustration] [Main component symbol description]

Claims (1)

201230908 VII. Shenqing Patent Range: 1. A manufacturing method of a conveyor tape package, comprising: the following steps: preparing a flexible circuit having a circuit pattern formed of a conductive metal on an insulating film, and then adding ==== == 〗 〖Blind silk, and the denatured polyurethane resin composition contains 4 〇 mg K 〇 H / g of denatured polyurethane urethane resin (4); and hardened to Μ ~ 2. As applied for fine 丨The method for producing the genus of the genus of the genus of the genus, the denatured polyamine, the sap of the sapphire, and the cured film which is subjected to heat treatment, and the dimensional change rate when the epoxy resin is smashed is 6 〇% or less. The method for manufacturing a transport tape package according to claim 1 or 2, wherein the hardened film peeling hardened by heat-treating the composition of the 5 亥 性 1 曱 曱 曱 曱 树脂 resin At least a portion of the cured film undergoes cohesive failure when the underfill is applied. 4. The method for producing a transfer tape package according to any one of claims 1 to 3, wherein the denatured polyamine phthalate resin composition comprises a denaturation of an acid value of from 16 to 4 〇 mg KO H/g. Polyamine niobic acid g resin (A) and curable resin (8); the denatured polyamine phthalate resin (A) is at least a diisocyanate compound (al) and a polycarbonate-containing diol or polybutanol The polyol compound (a2) and the dibasic compound (a3) having a slow group are obtained by a reaction. .55 201230908 5. The manufacturing method of the conveyor belt sealing body of the fourth paragraph of the patent scope, 詨 - the heterogeneous acid ester compound (al), the alicyclic structure of the alicyclic ring (4). ^ ^ ^ 2 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利- The product of the wheel-feeding tape package: 匕 where the hardening resin (9) is selected from the group consisting of epoxy resin, polyfunctional isocyanate, and acid ester resin.曰上] A kind of denatured polyurethane resin composition, which is 16, _g___(4), ^= denaturing decanoic acid § _, which is used in the text of the Umnm The material of the belt is packaged. The manufacturing method of the transportation body occupational board includes the following step board; the flexible circuit for preparing the circuit pattern formed of the conductive metal on the insulating film is inspected and obtained (4) the plastic reading body 甩 flexible circuit board The optical automatic inspection device is characterized by: (8) to the 峨 ( (4) Yu, the pigment indifferent to the atom 'only financial face (four) financial atom and 56 201230908 U j please = fine 1G item of the dance body female circuit board ! y and the blue atom of the desert atom, and the chlorine-free = 12 ΐΓ = the eleventh item of the _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The median diameter is Οηη^ Ι, without the money and the blue of the child = 55=:=: does not contain the chlorine atom and the yellow of the Xie, the middle of the ^ ^ / / 3 items of the towel - the delivery of the item The method of finely using the flexible j-board method, in which the bonding property is inspected by the tree-like polyaluminium-based resin (B), the denatured polyamine tannic acid is intended to be at least two acid vinegar. The compound (b1) is obtained by reacting a polyolized person (b2) containing a polycarbonate or a polybutylene glycol with a carboxyl group-containing diol compound (3). ° 14. For the application of the special method of the 13th article of the transmission tape package circuit board method ^ which 'the chlorine atom and bromine, atomic body f pigment (8) is sulfuric acid lock, the hardening turn Lin shouts a towel, which is divided into 1 part by mass with respect to the polyamine f_resin, and contains a body pigment (8) which does not contain a chlorine atom and an atom. 15. ί, 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利The method for producing a flexible circuit board for a tape transfer package according to any one of claims 13 to 15, wherein the denatured polyamine phthalate resin (B) is in the main chain 57 9 201230908 It has a quinone ring structure. The transport tape package of any one of the items 1 to 16 is a method for manufacturing a circuit board, and the circuit board of the same age has a circuit pattern including a portion of a circuit of 15 μm or less. a resin composition for a curable insulating film for a flexible wiring board for a transport tape package, characterized in that it comprises a pigment (Α) and a denatured polyurethane resin (著) and is colored; The pigment (Α) contains at least a pigment (a2) containing a chlorine atom and a bromine atom in an organic pigment disk containing no gas atom and a bromine atom; the denatured polyurethane resin (B) is at least a diisocyanate compound (b contains poly A polyol compound (b2) of a carbonate diol or a polybutadiene diol and a carboxy-containing diol compound (b3) are obtained by reacting. 19. The transfer tape package of claim 18 is scratched. The resin composition for a curable insulating film for a circuit board contains a pigment (A) and is colored green. (A) contains an extender (al) containing no chlorine atom and a bromine atom, and contains no gas atom and ^ Atomic blue pigment (a3), and yellow pigment (a4) containing no chlorine or bromine atoms.," 58 mm wide (S&gt;