TW201229151A - Fluorine-containing composition for forming coating-type insulating film, insulating film, and thin-film transistor - Google Patents

Fluorine-containing composition for forming coating-type insulating film, insulating film, and thin-film transistor Download PDF

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TW201229151A
TW201229151A TW100137730A TW100137730A TW201229151A TW 201229151 A TW201229151 A TW 201229151A TW 100137730 A TW100137730 A TW 100137730A TW 100137730 A TW100137730 A TW 100137730A TW 201229151 A TW201229151 A TW 201229151A
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fluorine
group
insulating film
bond
structural unit
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TW100137730A
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Tsuneo Yamashita
Tomohiro Yoshida
Hisashi Mitsuhashi
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Daikin Ind Ltd
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    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/02Polysilicates
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D127/00Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers
    • C09D127/02Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment
    • C09D127/12Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate
    • H01L21/02109Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02123Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
    • H01L21/02126Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate
    • H01L21/02109Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02205Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition
    • H01L21/02208Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate
    • H01L21/02109Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02205Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition
    • H01L21/02208Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si
    • H01L21/02214Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound comprising silicon and oxygen
    • H01L21/02216Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound comprising silicon and oxygen the compound being a molecule comprising at least one silicon-oxygen bond and the compound having hydrogen or an organic group attached to the silicon or oxygen, e.g. a siloxane
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate
    • H01L21/02225Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02282Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/22Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/24Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen halogen-containing groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/54Silicon-containing compounds
    • C08K5/541Silicon-containing compounds containing oxygen
    • C08K5/5415Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond

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  • Engineering & Computer Science (AREA)
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  • Computer Hardware Design (AREA)
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  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Formation Of Insulating Films (AREA)
  • Thin Film Transistor (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

The present invention provides a composition for forming a coating-type insulating film with which an insulating film having excellent high heat resistance, transparency in the visible light region, a low dielectric constant and flexibility can be formed. The present invention is a fluorine-containing composition for forming a coating-type insulating film, which is characterized by comprising an organic silicon compound (A), and a fluorine-containing polymer (B) having the structural units represented by formula (L). (In the formula, X1 and X2 are the same or different, and are H or F; X3 is H, F, CH3 or CF3; X4 and X5 are the same or different, and are H, F or CF3; Rf is a fluorine-containing hydrocarbon group with 1-40 carbons optionally having an amide linkage or urea linkage, or is a fluorine-containing hydrocarbon group having an ether linkage with 2 to 100 carbons, and optionally having an amide linkage, a carbonate linkage, a urethane linkage or a urea linkage, wherein 1 to 3 locations of the terminal structure are substituted by Y (Y is a monovalent organic group containing at least one hydrolyzable metal alkoxide region with 1 to 50 carbons on the terminal, or a monovalent organic group with 2 to 10 carbons having an ethylenic carbon-carbon double bond on the terminal); a is an integer from 0 to 3; b and c are the same or different, and are 0 or 1.)

Description

201229151 六、發明說明: 【發明所屬之技術領域】 本發明係有關塗佈型絕緣膜形成用含氟組成物、絕緣 膜、及薄膜電晶體。 【先前技術】 現今,大型液晶顯示裝置等所用的薄膜電晶體(TFT )’其主流爲反轉共平面(inverted coplanar)型,但是 這種TFT中,閘與通道間的絕緣層係藉由將TEOS或氮化 砂(SiN)以 CVD ( Chemical Vapor Deposition)或職鍍 製膜而形成。 但是因顯示裝置之大畫面化或價格競爭激烈,需要大 面積化、低價格化,因此,嘗試藉由塗佈型製膜法製造薄 膜電晶體之絕緣層。 塗佈型之絕緣膜形成用組成物,例如有使用聚矽氧烷 者。例如專利文獻1中記載一種聚矽氧烷組成物,其係含 有作爲形成可撓性高之絕緣膜用的聚矽氧烷組成物爲具有 特定重複單位之聚矽氧烷與藉由加熱產生酸及自由基之至 少一種的化合物。 專利文獻2中記載形成防反射膜用之硬化性含氟聚合 物,例如在末端鍵結有1〜3個具有乙烯性碳-碳雙鍵之碳 數2〜10之1價有機基之特定結構的硬化性含氟聚合物。 此外,專利文獻3中記載維持防眩性’且未發現因表面散 射造成「泛白」,且密著性優異具有實用之低反射性的層 -5- 201229151 合體用的材料’其係含有在末端具有至少含有1個碳數 1〜5 0之水解性金屬醇鹽部位之官能基的特定結構單位與末 端鍵結有1〜3個具有乙烯性碳-碳雙鍵之碳數2〜10之1價 有機基之特定結構的硬化性含氟聚合物。 〔先前技術文獻〕 〔專利文獻〕 〔專利文獻1〕特開平9 - 1 8 8 8 1 4號公報 〔專利文獻2〕國際公開第〇 2 / 1 8 4 5 7號說明書 〔專利文獻3〕國際公開第2006/027958號說明書 【發明內容】 〔發明槪要〕 〔發明欲解決的課題〕 但是如專利文獻1,由聚矽氧烷所形成之絕緣膜仍缺 乏可撓性,有時因彎曲造成龜裂,因此要求可形成可撓性 更優異絕緣膜的材料。又,爲了形成薄膜電晶體之閘極絕 緣膜時,需要更優異之高耐熱性、可見光區域之透明性、 低介電率。 本發明之目的係有鑑於上述現狀,提供可形成高耐熱 性、可見光區域之透明性、低介電率及可撓性優異之絕緣 膜的塗佈型絕緣膜形成用組成物。 〔解決課題的手段〕 -6 - 201229151 本發明人等精心檢討塗佈型絕緣膜形成用之組成物時 ’發現有機矽化合物使用以特定氟樹脂作爲黏結劑進行混 合的組成物時’可形成高耐熱性、可見光區域之透明性、 低介電率及可撓性優異的塗佈型絕緣膜。 換言之’本發明係一種塗佈型絕緣膜形成用含氟組成 物,其特徵係由: 有機矽化合物(A)、及具有下述式(l): [化1] —f CX^2—cx3^- ^ (L) CC X4 X 5 , 1-( C =*〇 ) b( —R f (式中’ X1及X2係相同或相異,爲H或F ; X3係H、F 、CH3或CF3; X4及X5係相同或相異,爲H、F或CF3; Rf係可具有醯胺鍵或脲鍵之碳數之含氟烴基、或可 具有醯胺鍵、碳酸酯鍵、胺基甲酸酯鍵或脲鍵之碳數 2〜1〇〇之具有醚鍵之含氟烴基之結構末端之卜3處被γ( Υ係末端至少含有1個碳數1〜5 0之水解性金屬烷氧化物 部位的1價有機基,或末端具有乙烯性碳-碳雙鍵之碳數 2〜10之1價有機基)取代之含氟烴基;a係〇〜3之整數; b及c係相同或相異,爲〇或1)表示之結構單位的含氟 聚合物(B )所構成。 有機矽化合物(A)較佳爲下述式(1): {Si(Ra)s(Rb)t(Rc)u(Rd)v(Re)w}n ( 1 ) (式中,、Rb、R。及Rd係相同或相異,爲氫、鹵素、 碳數1〜10之烷氧基、碳數1〇之胺蕋、碳數1〜10之烷 201229151 基、碳數6~10之芳基、碳數3〜l〇之烯丙基、或碳數 3〜1 〇之縮水甘油基。Re係相同或相異,爲_〇-、.1^.、_ C = C-、或矽烷鍵。s、t、u及v係相同或相異,爲〇或j ’ W係〇〜4之整數。η係1〜20,η爲1時,s + t + u + v係4, w爲0。n爲2-20時’ s + t + u + v係相同或相異,爲〇〜4,w 係相同或相異,爲0~4 ’w爲1以上之整數時,至少2個 Si係介於Re鍵結成直鏈、梯子型、環狀、或雜環狀)表 示的化合物(A 1 )。 有機矽化合物(A)較佳爲四烷氧基矽烷。 本發明之塗佈型絕緣膜形成用含氟組成物,其中相對 於有機矽化合物(A)與含氟聚合物(B)之合計質量,有 機矽化合物(A )較佳爲5 0質量%以上。 本發明之塗佈型絕緣膜形成用含氟組成物,較佳爲含 有有機溶劑。 本發明之塗佈型絕緣膜形成用含氟組成物,較佳爲薄 膜電晶體之閘極絕緣膜形成用。 本發明之絕緣膜,其係由上述塗佈型絕緣膜形成用含 氟組成物所形成。 本發明之薄膜電晶體,其特徵係依序層合半導體層、 上述絕緣膜、及閘極電極層者。 發明效果 本發明之塗佈型絕緣膜形成用含氟組成物係因具有上 述構成’因此可形成高耐熱性、可見光區域之透明性、低 -8 - 201229151 介電率及可撓性優異之塗佈型絕緣膜。本發明之絕緣膜係 由上述塗佈型絕緣膜形成用含氟組成物所形成者,因此耐 熱性、透明性、及可撓性優異。本發明之薄膜電晶體係由 上述絕緣膜所構成者,因此耐熱性、透明性、低介電率及 可撓性優異。 〔實施發明的形態〕 本發明之塗佈型絕緣膜形成用含氟組成物係由有機矽 化合物(A)所構成。有機矽化合物(A)係具有碳·矽鍵 者。上述有機矽化合物(A)較佳爲常溫(例如25 °C)下 爲液體。 上述有機矽化合物(A)例如有具有Si-H鍵之Si-H 化合物;胺基矽烷化合物、矽胺烷、甲矽烷基乙醯胺、甲 矽烷基咪唑等具有Si-N鍵之Si-N化合物;單烷氧基矽烷 、二烷氧基矽烷、三烷氧基矽烷、四烷氧基矽烷、矽氧烷 、甲矽烷基酯、矽烷醇等具有Si-Ο鍵之Si-0化合物:單 氯矽烷、二氯矽烷、三氯矽烷、四氯矽烷等具有Si-Cl鍵 之Si-Cl化合物等之鹵基矽烷、Si-(C)4化合物、具有Si-Si鍵之Si-Si化合物、乙烯基矽烷、烯丙基矽烷、乙炔基 矽烷等。換言之,有機矽化合物(A)較佳爲選自Si-H化 合物、Si-N化合物、Si-Ο化合物、鹵基矽烷、Si-(C)4化 合物、Si-Si化合物、乙烯基矽烷、烯丙基矽烷、及乙炔 基矽烷所成群之至少一種化合物。上述有機矽化合物更佳 爲Si上鍵結有選自氫、氧及鹵素所成群之至少一種原子 -9- 201229151 的化合物。 以下列舉上述化合物之具體例。 〔Si-H化合物〕 -10- 201229151 [化2] 'SiH(CH3)2 CH3CH3 I I; 3 CH3—C—Si-H CH^CH, aSiH(CH3)2 c CH3 CH3-CH. Cl[Technical Field] The present invention relates to a fluorine-containing composition for forming a coating-type insulating film, an insulating film, and a thin film transistor. [Prior Art] Nowadays, thin film transistors (TFTs) used in large liquid crystal display devices and the like are mainly in inverted coplanar type, but in this TFT, the insulating layer between the gate and the channel is TEOS or silicon nitride (SiN) is formed by CVD (Chemical Vapor Deposition) or occupational plating. However, due to the large screen size of the display device or the fierce price competition, it is required to have a large area and a low price. Therefore, an insulating layer of a thin film transistor has been tried by a coating type film forming method. The coating type insulating film forming composition is, for example, a polyoxyalkylene. For example, Patent Document 1 discloses a polyoxyalkylene composition containing a polysiloxane having a specific repeating unit as a polyoxyalkylene composition for forming a highly flexible insulating film and generating an acid by heating. And a compound of at least one of free radicals. Patent Document 2 describes a curable fluorine-containing polymer for forming an antireflection film, for example, a specific structure in which one to three monovalent organic groups having a carbon number of 2 to 10 having an ethylenic carbon-carbon double bond are bonded to a terminal. Hardening fluoropolymer. In addition, in the case of the patent document 3, the material which maintains the anti-glare property, and the "whitening" by the surface scattering is not found, and the adhesiveness is excellent and the practical low-reflection is used. The specific structural unit having a functional group having at least one hydrolyzable metal alkoxide moiety having 1 to 50 carbon atoms at the terminal and the terminal having 1 to 3 carbon atoms having an ethylenic carbon-carbon double bond bonded to the terminal are 2 to 10 A hardenable fluoropolymer having a specific structure of a monovalent organic group. [PRIOR ART DOCUMENT] [Patent Document 1] [Patent Document 1] Japanese Patent Publication No. 9 - 1 8 8 8 1 4 (Patent Document 2) International Publication No. 2 / 1 8 4 5 No. 7 (Patent Document 3) International [Invention Summary] [Problem to be Solved by the Invention] However, as disclosed in Patent Document 1, the insulating film formed of polyoxyalkylene still lacks flexibility and is sometimes caused by bending. Since it is cracked, it is required to form a material which is more flexible and more excellent. Further, in order to form a gate insulating film of a thin film transistor, it is required to have more excellent high heat resistance, transparency in a visible light region, and low dielectric constant. In view of the above-mentioned circumstances, the present invention provides a coating-type insulating film-forming composition which can form an insulating film having high heat resistance, transparency in a visible light region, and low dielectric constant and flexibility. [Means for Solving the Problem] -6 - 201229151 When the inventors of the present invention carefully review the composition for forming a coating-type insulating film, it is found that the organic bismuth compound is formed by using a composition in which a specific fluororesin is used as a binder. A coating-type insulating film excellent in heat resistance, transparency in a visible light region, low dielectric constant, and flexibility. In other words, the present invention is a fluorine-containing composition for forming a coating type insulating film, which is characterized by comprising: an organic cerium compound (A), and having the following formula (1): [Chemical Formula 1] - f CX^2 - cx3 ^- ^ (L) CC X4 X 5 , 1-( C =*〇) b( —R f (where X1 and X2 are the same or different, H or F; X3 is H, F, CH3 or CF3; X4 and X5 are the same or different and are H, F or CF3; Rf is a fluorine-containing hydrocarbon group which may have a carbon number of a guanamine bond or a urea bond, or may have a guanamine bond, a carbonate bond, an amine group The ester terminal or the urea bond has a carbon number of 2 to 1 〇〇. The terminal end of the structural group of the fluorine-containing hydrocarbon group having an ether bond is γ (the terminal of the lanthanoid system contains at least one hydrolyzable metal alkane having 1 to 50 carbon atoms) a fluorine-containing hydrocarbon group substituted with a monovalent organic group at the oxide site or a monovalent organic group having a carbon number of 2 to 10 at the terminal having an ethylenic carbon-carbon double bond; a is an integer of 〇~3; b and c are the same Or a fluoropolymer (B) which is a structural unit represented by hydrazine or 1). The organic hydrazine compound (A) is preferably the following formula (1): {Si(Ra)s(Rb)t (Rc)u(Rd)v(Re)w}n ( 1 ) (wherein, Rb, R, and Rd are the same or different, and are hydrogen or halogen , alkoxy group having a carbon number of 1 to 10, an amine hydrazine having a carbon number of 1 蕋, an alkyl group having a carbon number of 1 to 10, 201229151, an aryl group having a carbon number of 6 to 10, an allyl group having a carbon number of 3 to 10, or The glycidyl group having a carbon number of 3 to 1 。. The Re is the same or different and is _〇-, .1^., _ C = C-, or a decane bond. The s, t, u, and v are the same or different. , 〇 or j ' W 〇 4 4 4 。 。 。 η η η η η η η η η η η η η η η η η η η η η η η η η η η η η η η η η η η η η η η u + v are the same or different, 〇~4, w are the same or different, when 0~4 'w is an integer of 1 or more, at least 2 Si systems are connected by Re to form a straight chain, ladder type, The compound (A 1 ) represented by a cyclic or heterocyclic ring. The organic ruthenium compound (A) is preferably a tetraalkoxy decane. The fluorine-containing composition for forming a coating-type insulating film of the present invention, wherein The organic ruthenium compound (A) is preferably 50% by mass or more, based on the total mass of the ruthenium compound (A) and the fluoropolymer (B). The fluorine-containing composition for forming a coating-type insulating film of the present invention is preferably The organic solvent is contained. The fluorine-containing composition for forming a coating type insulating film of the present invention is more The insulating film of the present invention is formed of the fluorine-containing composition for forming a coating-type insulating film. The thin film transistor of the present invention is characterized by a sequential layer. In the semiconductor layer, the insulating film, and the gate electrode layer, the fluorine-containing composition for forming a coating-type insulating film of the present invention has the above-described configuration, so that high heat resistance and transparency in a visible light region can be formed. Low-8 - 201229151 Coating type insulating film with excellent dielectric constant and flexibility. The insulating film of the present invention is formed of the fluorine-containing composition for forming a coating-type insulating film, and is therefore excellent in heat resistance, transparency, and flexibility. Since the thin film electro-crystal system of the present invention is composed of the above-mentioned insulating film, it is excellent in heat resistance, transparency, low dielectric constant, and flexibility. [Mode for Carrying Out the Invention] The fluorine-containing composition for forming a coating-type insulating film of the present invention is composed of an organic ruthenium compound (A). The organic ruthenium compound (A) has a carbon ruthenium bond. The above organic hydrazine compound (A) is preferably a liquid at normal temperature (e.g., 25 ° C). The above organoindole compound (A) is, for example, a Si-H compound having a Si-H bond; an Si-N having a Si-N bond such as an aminodecane compound, a guanamine, a mercaptoacetamide or a mercapto imidazole. a compound; a monoalkoxy decane, a dialkoxy decane, a trialkoxy decane, a tetraalkoxy decane, a decane, a carbaryl, a stanol or the like having a Si-Ο bond: a single a halogenated decane, a Si-(C)4 compound such as a Si-Cl compound having a Si-Cl bond such as chlorodecane, dichlorodecane, trichlorodecane or tetrachloromethane; a Si-Si compound having a Si-Si bond, Vinyl decane, allyl decane, ethynyl decane, and the like. In other words, the organic ruthenium compound (A) is preferably selected from the group consisting of a Si-H compound, a Si-N compound, a Si-tellurium compound, a halodecane, a Si-(C)4 compound, a Si-Si compound, a vinyl decane, an alkene. At least one compound of a group consisting of propyl decane and ethynyl decane. More preferably, the above organic ruthenium compound is a compound having at least one atom selected from the group consisting of hydrogen, oxygen and halogen, -9-201229151. Specific examples of the above compounds are listed below. [Si-H compound] -10- 201229151 [Chemical 2] 'SiH(CH3)2 CH3CH3 I I; 3 CH3—C—Si-H CH^CH, aSiH(CH3)2 c CH3 CH3-CH. Cl

X CH3-OH Ή in3 ch3 Cl—SHH l GH3 CH3 ch3 CH3—C_SiH^'C_CH3 J I 2 I 3 ch3 ch3 ΟΗ3〇Η2—Sh-H Cl OCH2CH3 OCHjCH^ CH3CH2SiH2CH2CH3 邮jc丨X CH3-OH Ή in3 ch3 Cl—SHH l GH3 CH3 ch3 CH3—C_SiH^'C_CH3 J I 2 I 3 ch3 ch3 ΟΗ3〇Η2—Sh-H Cl OCH2CH3 OCHjCH^ CH3CH2SiH2CH2CH3 post jc丨

SiH(CH3)2 {CH^SilH一Si—SsH(CH3)2 SiH(GH3)2 .GH2CH3SiH(CH3)2 {CH^SilH-Si-SsH(CH3)2 SiH(GH3)2 .GH2CH3

、ch2ch3 GHa^r 、F3, ch2ch3 GHa^r, F3

-11 - 201229151 [化3] (CH2)3CH3-11 - 201229151 [化3] (CH2)3CH3

C H3 (C H2)3—Si—H HSiCI3C H3 (C H2)3—Si—H HSiCI3

-Si-H (CH2)3CH3 CH2CH3 CH3CH2-Si-H CH2CH3 〇ch2ch3 CHaGH20-SiH 0C H2C H3 (CH2)5CH3 CH3(CH2)5—甲卜H (CH2)5CH3 OCH, t CH3(>-SiH OCH3-Si-H (CH2)3CH3 CH2CH3 CH3CH2-Si-H CH2CH3 〇ch2ch3 CHaGH20-SiH 0C H2C H3 (CH2)5CH3 CH3(CH2)5-Abu H(CH2)5CH3 OCH, t CH3(>-SiH OCH3

OrOr

CH(CH3)2 (CH3)2CH-Si—H CH(CH3)2CH(CH3)2 (CH3)2CH-Si-H CH(CH3)2

Si(CH3)3 (CHaJsSi—SiHSi(CH3)3 (CHaJsSi-SiH

Si(CH3)3 〔Si-N化合物〕 [化4] rv ch3 CH2NI+-SH3H3 CHj \ CH3CH3 C H3一 N—Si^CHpCH^— CH3CH3 -Sh-A—ch3 ch3 iHs F\ F W ?Hv 一 ch3 ch3 I J p_^ 卜 N’ CH3—Si-N ^/=( CH3V -ch3 ch3 ^ch2ch3 、ch2ch3Si(CH3)3 [Si-N compound] [Chemical 4] rv ch3 CH2NI+-SH3H3 CHj \ CH3CH3 C H3-N-Si^CHpCH^-CH3CH3-Sh-A-ch3 ch3 iHs F\ FW ?Hv a ch3 ch3 IJ p_^ Bu N' CH3—Si-N ^/=( CH3V -ch3 ch3 ^ch2ch3 , ch2ch3

。"3、?H CH^ I 、CK3 CHa Q ,〇h3 GHa — Si—N ihU、gh3 -12- 201229151 [化5] CH3 ch3 CfCH2-SHNH-SHCH2CI ch3 ch3 ch3 ch3 Si—NH—Si CH3 Ch% CH3 CH3 CHa λ—Si-NH-Si-^ CHg CN3 ch3. "3,? H CH^ I , CK3 CHa Q , 〇h3 GHa — Si—N ihU, gh3 -12- 201229151 [Chemical 5] CH3 ch3 CfCH2-SHNH-SHCH2CI ch3 ch3 ch3 ch3 Si—NH—Si CH3 Ch% CH3 CH3 CHa λ —Si-NH-Si-^ CHg CN3 ch3

CH3 CH3 GH3—SHN K-SKCHg ch3 ch3 CH, CH,厂 CH3i ch3 ch3 ch3 I I CF3CH2CH2-Si-NH-fi-CH2CH2CF3 ch3 ch:3CH3 CH3 GH3—SHN K-SKCHg ch3 ch3 CH, CH, factory CH3i ch3 ch3 ch3 I I CF3CH2CH2-Si-NH-fi-CH2CH2CF3 ch3 ch:3

ch3 gh3 ch3 ch„ aCHH一ch3H〇h3 CH3CH3GH3 CH3^Skr$kCH3 CH, ch3 n—srCH^ CH3—Si一一N—s*r—CH3 CH3—sf 、NH chJ\ CH3 ηΛ .srCHa Cri3 ch3 ch3 -Si—N-CHaf!la CH3Ch3 gh3 ch3 ch„ aCHH-ch3H〇h3 CH3CH3GH3 CH3^Skr$kCH3 CH, ch3 n-srCH^CH3—Si—N—s*r—CH3 CH3—sf , NH chJ\ CH3 ηΛ .srCHa Cri3 ch3 ch3 - Si-N-CHaf!la CH3

Cl CHf GHa—Sh-M-Si—CH3 CHa—Si—N-Si—CH3 ^^StH-NH-SiH: CH3 、gh3 ch3-Cl CHf GHa—Sh-M-Si—CH3 CHa—Si—N—Si—CH3 ^^StH-NH-SiH: CH3, gh3 ch3-

CH3 CH3 CH3 -Si—NH—Si—CH3 + CH3nSi^QI ch3 ch3 ch3 ch3 ch=ch2 ;SL ΝΠ 〇H3 CH2=CH^SisN^Si''CH=CH2 201229151 [化6] CH3—Sh ch.-γ"* OH3 Sh-CH, CH, CH3 0-SHCH3 ch3 O CK3CH3CH3 CH3 CH3 -Si-NH-Si-CH3 + CH3nSi^QI ch3 ch3 ch3 ch3 ch=ch2 ;SL ΝΠ 〇H3 CH2=CH^SisN^Si''CH=CH2 201229151 [Chemical 6] CH3—Sh ch.- γ"* OH3 Sh-CH, CH, CH3 0-SHCH3 ch3 O CK3CH3

H3 〇 ch3 ch3 GF3-C-N—Si—C-CH3 CH3CH3CH3 ch3 CHg-^C^-N—SHCHg -CFjtCF^CFg —C—i|J·—Sr-CHa CH3^Si~·Ν·~ CN3 CH,H3 〇 ch3 ch3 GF3-C-N-Si-C-CH3 CH3CH3CH3 ch3 CHg-^C^-N-SHCHg -CFjtCF^CFg —C—i|J·—Sr-CHa CH3^Si~·Ν·~ CN3 CH,

CH 3 .OHsCH3 OHsCHsv O-SiH^ ,SiH-N=C[ VC;H2CH3 CH3CH/CH 3 .OHsCH3 OHsCHsv O-SiH^ , SiH-N=C[ VC; H2CH3 CH3CH/

Fa GH3—Si - CH3 II ch3 ch^^o- CKs CHa—SHCH-j1 ?η3 ch3#*^o—s 卜 ch3 CH3 shch3 ch3Fa GH3—Si - CH3 II ch3 ch^^o- CKs CHa—SHCH-j1 η3 ch3#*^o—s 卜 ch3 CH3 shch3 ch3

CH3 /、 I CH3, O-S1-CH3 JJ CF/^O—Si-CHi CH3 I -Si-i 1 CH, CH3 I. CH,一Si—CH-!CH3 /, I CH3, O-S1-CH3 JJ CF/^O-Si-CHi CH3 I -Si-i 1 CH, CH3 I. CH, a Si-CH-!

CH 3CH 3

CR ch3 1. CH3—Si—CH3CR ch3 1. CH3—Si—CH3

CH; 3 CH3 I. 0—Si—CH3 I 3 CH, gh3 CH^—0 卜 CH3 CH, CH3’ 〇—SMDHa心3 ch3 CH3—C—NhhSi—CH5 ch3CH; 3 CH3 I. 0—Si—CH3 I 3 CH, gh3 CH^—0 Bu CH3 CH, CH3’ 〇—SMDHa heart 3 ch3 CH3—C—NhhSi—CH5 ch3

U -14 - 201229151 [化7] CH, ώ3 ch3 t I ύ ch3 ch3U -14 - 201229151 [Chem.7] CH, ώ3 ch3 t I ύ ch3 ch3

CH3—Sh-CH3 ch3CH3—Sh-CH3 ch3

CHf Si—CH ch3CHf Si—CH ch3

CH^~Sh~ΌΗ3 ch3 ,gh3、η3 C H3—Si—CHgCHgC H3 ch3 -15- 201229151 [化8] ?h3 ch3 CH3—Si—N=C=N-Si—CH3 ch3 ch3 0H3 O OHa CH5—sr^N H^C^NH^sHCNa 6Ha CHaCH^~Sh~ΌΗ3 ch3 , gh3, η3 C H3—Si—CHgCHgC H3 ch3 -15- 201229151 [化8] ?h3 ch3 CH3—Si—N=C=N-Si—CH3 ch3 ch3 0H3 O OHa CH5— Sr^NH^C^NH^sHCNa 6Ha CHa

^n3^n3

叫〇、.人,_3 Si(CH3)3 CH3 ch3 ch3 CH3—Si—N—0—Si-CH3 CH, CH-,Called 〇, .人,_3 Si(CH3)3 CH3 ch3 ch3 CH3—Si—N—0—Si—CH3 CH, CH-,

NCS SCN-s|—NGS Acs CH3 ch3NCS SCN-s|—NGS Acs CH3 ch3

I I CH3—Si-NH-0 -Si-CH3 CH3 ch3I I CH3—Si-NH-0 -Si-CH3 CH3 ch3

I-I-

CFjSOj一 Si(CH3)3 -N-SO2CF3 ch3 CH3—Si*—NCO CH3 ch3 CH3*—SF—C 0 CH3 si—ch3 OSKCH^s (CH^SK 〔Si-0化合物 -16- 201229151 [化9]CFjSOj-Si(CH3)3-N-SO2CF3 ch3 CH3—Si*—NCO CH3 ch3 CH3*—SF—C 0 CH3 si—ch3 OSKCH^s (CH^SK [Si-0 compound-16- 201229151 [Chemical 9 ]

?h3 CH 2=C HC H2—O-Sf—DH3 ch3?h3 CH 2=C HC H2—O-Sf—DH3 ch3

0Si(CH3)3 CH3CH3 ( CH3-’ _ OC(CH3)3 CH3CH3 DSi(CH3)3 \ OSi(CH3)3 (CH3)3SiCT 、OSi(CH3)3 CH3 ch3 CH3'—C:—Si、 I 10 CH3 ch3j I ϋ CHf%~Γ^Ό02Η / 0CH3 0CH3 CH,0Si(CH3)3 CH3CH3 (CH3-' _ OC(CH3)3 CH3CH3 DSi(CH3)3 \ OSi(CH3)3 (CH3)3SiCT, OSi(CH3)3 CH3 ch3 CH3'—C:—Si, I 10 CH3 ch3j I ϋ CHf%~Γ^Ό02Η / 0CH3 0CH3 CH,

-NH-NH

-17- 201229151 [化 10] CH3 GH3CH20-Sf—CH=CH2 G ch3 c CH; H3 OCH3 ?H3 今 i—CHg ch2ch3 CH3CH2—Si-OCH2CH3 CH,CH^ ch3 ch3 CHi CH3—Si—0(CH2)2〇一Si—CH3 CH3—Si—S(CH2)2S—Si一CH。-17- 201229151 CH3 GH3CH20-Sf—CH=CH2 G ch3 c CH; H3 OCH3 ?H3 Ii-CHg ch2ch3 CH3CH2—Si-OCH2CH3 CH, CH^ ch3 ch3 CHi CH3—Si—0(CH2) 2〇Si—CH3 CH3—Si—S(CH 2 ) 2 S—Si—CH.

CH 3 CH, ch3 I CH, CH3 CH3 CH: CH/^C-O-Si—CH3 CH3〇-Si—CH3 〇H3 * CH3〇H^—1 och3 ch3 'Sl·—CHa ch3CH 3 CH, ch3 I CH, CH3 CH3 CH: CH/^C-O-Si—CH3 CH3〇-Si—CH3 〇H3 * CH3〇H^—1 och3 ch3 'Sl·—CHa ch3

C(CHg)3 〇Si(CH3)3 ch2=c—ch=ch-och3C(CHg)3 〇Si(CH3)3 ch2=c-ch=ch-och3

ch3 Si—och2ch3 gh3Ch3 Si-och2ch3 gh3

ch3 S—Si-CH3 CH3 ch3 O-SHCH, CH3 f £Η2〇^έΗί!Βυ CH?"iPh PhCh3 S—Si-CH3 CH3 ch3 O-SHCH, CH3 f £Η2〇^έΗί!Βυ CH?"iPh Ph

HOHO

〇e«[C{CH3)2]3 -18- 201229151 [化 11] CH3 〇Si(CH3)3 CH& CHa〇e«[C{CH3)2]3 -18- 201229151 [Chemistry 11] CH3 〇Si(CH3)3 CH&CHa

CH3CH20-Sh-CH^ CH2_CH_(l=CH2 GH^SpO^C=GH-C^OCH CH3 CH, ^^0-甲-CH3CJ CH3CH3CH20-Sh-CH^ CH2_CH_(l=CH2 GH^SpO^C=GH-C^OCH CH3 CH, ^^0-A-CH3CJ CH3

CHa Γ II O—Sh-CHa 卜。H3 ch3 ina ch3o ch3 CH2=C—C"OCH2CH2〇-Si-CH3 CH3CHa Γ II O—Sh-CHa Bu. H3 ch3 ina ch3o ch3 CH2=C—C"OCH2CH2〇-Si-CH3 CH3

(CH3)3SiO CH-,-C=CH-C-CH, CH3 I J CH2=CH—0一Si—CHj CH3 (CH^SK) < (ch^sk/ C=CH-OSi(CH353 -19- 201229151 [化 12] C5CH3 och2ch3 och3 H2NCH2CH2NH(CH2)i-S!—ΌΗ3 CH3—Si—(CH2)3NH2 dCH2CH2CHr-Si-CH3 OCH3 1 1 OCH2CH3 OCH-»(CH3)3SiO CH-,-C=CH-C-CH, CH3 IJ CH2=CH—0—Si—CHj CH3 (CH^SK) < (ch^sk/ C=CH-OSi(CH353 -19- 201229151 [Chemical 12] C5CH3 och2ch3 och3 H2NCH2CH2NH(CH2)iS!—ΌΗ3 CH3—Si—(CH2)3NH2 dCH2CH2CHr-Si-CH3 OCH3 1 1 OCH2CH3 OCH-»

〇ch3 •SHCH3 och3〇ch3 •SHCH3 och3

Ok^CHis^Η3 CH3OH2O一si—OCH2CH3 \Ok^CHis^Η3 CH3OH2O-si-OCH2CH3

?h3 CH.gO-'Si'—OCHg CH,?h3 CH.gO-'Si'-OCHg CH,

OOHzCHa H2〇(CH2)3-'Si—CH^ OCHzCHa OCH2CH3 CH3—SHCH=GH2 OCH2CH3 OCH2CH3 〇aH2CH3OOHzCHa H2〇(CH2)3-'Si-CH^ OCHzCHa OCH2CH3 CH3—SHCH=GH2 OCH2CH3 OCH2CH3 〇aH2CH3

Si - CH3 CH3—Si-H OCH2CH3 OCH2CH3Si - CH3 CH3—Si-H OCH2CH3 OCH2CH3

,. 〇ch3,.〇ch3

《卜 CH3 CH3—〒hH ^===/ 〇CH3 00 H3 och3 CH3一Si—CH—CHj 0CH3 0CH3 CH20(CH2)厂 p-CH3 V 〇CH3 OCHg, CHi-Si-(〇H2)aSH OCHx -20- 201229151 [化 13] OCH2CH3 CH3CH2〇-Si—CH2CH—CH2 och2ch3 och3 CH3O一Si_CH2CH—CHj OCH^ OCH2CH3 H2NCH2CH2CH2—Si-OCH3 H2NCH2CH2NH(CH2)3—fi-OCH2CH3 OCH2CH3 och2ch3 H2N—(C H2)^SHOCH2CH3 och2ch3 OCH, H2NCH2C;H2MH(CH2)3—S 卜 ogh3 OCH„ OCH3《卜CH3 CH3—〒hH ^===/ 〇CH3 00 H3 och3 CH3-Si—CH—CHj 0CH3 0CH3 CH20(CH2) Factory p-CH3 V 〇CH3 OCHg, CHi-Si-(〇H2)aSH OCHx - 20- 201229151 OCH2CH3 CH3CH2〇-Si-CH2CH-CH2 och2ch3 och3 CH3O-Si_CH2CH-CHj OCH^ OCH2CH3 H2NCH2CH2CH2—Si-OCH3 H2NCH2CH2NH(CH2)3—fi-OCH2CH3 OCH2CH3 och2ch3 H2N—(C H2)^SHOCH2CH3 Och2ch3 OCH, H2NCH2C; H2MH(CH2)3-S 卜og3 OCH„ OCH3

-Si-OC OCH3-Si-OC OCH3

och2ch3 CH2-Si—OCH2CH3 OCH2CH3 OCH3 OCH3 CH30-Si—CH2CH2-Si—OCH3 OCH3 OCH3 OCH3 I BrCH2CH2CH2—Si-OCH3 OCH3Och2ch3 CH2-Si-OCH2CH3 OCH2CH3 OCH3 OCH3 CH30-Si-CH2CH2-Si-OCH3 OCH3 OCH3 OCH3 I BrCH2CH2CH2—Si-OCH3 OCH3

Si(OCH2CH3)3Si(OCH2CH3)3

OCH 3 OCH1 CH30-〒一(CH2)3NH(CH2)3-Si-〇CH3 OCH3 OCH3 OCH2CH3 CICH2—Si—OCH2CH:3 OCH2CH3 OCH2CH3 CHaCH20-Si—CH2CH2CH2CI qch2ch3OCH 3 OCH1 CH30-〒一(CH2)3NH(CH2)3-Si-〇CH3 OCH3 OCH3 OCH2CH3 CICH2—Si—OCH2CH:3 OCH2CH3 OCH2CH3 CHaCH20-Si—CH2CH2CH2CI qch2ch3

〇ch2ch3 och3 GH3{CH2>ir^i-OCH2GH3 CH/CHAr^i-OCh 〇CH2CH3 OCH3〇ch2ch3 och3 GH3{CH2>ir^i-OCH2GH3 CH/CHAr^i-OCh 〇CH2CH3 OCH3

OCH3 CH2〇H2-4 卜 OCHs icH3 0CH3 CH3CH 厂 Si—〇CH3 OCH^OCH3 CH2〇H2-4 Bu OCHs icH3 0CH3 CH3CH Factory Si—〇CH3 OCH^

S -21 - 201229151 [化 14] och3 CH2〇(CH2)3—Si一OCH3 OCH^ och2ch3 CH3(CH2)5—Si—OCH2CH3 OCH2CH3S -21 - 201229151 [化 14] och3 CH2〇(CH2)3—Si—OCH3 OCH^ och2ch3 CH3(CH2)5—Si—OCH2CH3 OCH2CH3

OCH3 OCH2CH3 0CK3 卜OCH3 HS(CH2)厂f-〇CH2CH3 CH3C>-Si—(CH2)3SH OCH3 OCH2CH3 OCH3 OCH3 OCH2CH3 CH3iCH2>ir-SHOCH2CH3 CH3{CH2)1r-SHOCH3 GH3(CH2)r-Si"OCH2CHa <->CH2CH3 〇CH3 OCH2CH3 OOH2CH3 OCHzCH» 和-OCH2pHb CH3GH2-ii-OCH2CHa OOH2CH3 l-- - OCHgCHj CH, ΌΗ3 GH3、OCH3 OCH2CH3 0CK3 Bu OCH3 HS(CH2) Plant f-〇CH2CH3 CH3C>-Si-(CH2)3SH OCH3 OCH2CH3 OCH3 OCH3 OCH2CH3 CH3iCH2>ir-SHOCH2CH3 CH3{CH2)1r-SHOCH3 GH3(CH2)r-Si"OCH2CHa &lt ;->CH2CH3 〇CH3 OCH2CH3 OOH2CH3 OCHzCH» and -OCH2pHb CH3GH2-ii-OCH2CHa OOH2CH3 l-- - OCHgCHj CH, ΌΗ3 GH3,

〇ch2ch3 ch^-shoch2ch3 OCH2CH3 OCH2CH3· CH3CH20-SiH OCH2CH3 OCHgCHa och2 CH, CH3CH2〇-Si—CH^CHgCH^r-NCO cH2=C-C-〇(CH2)3-SI—OCH2CH3 0〇Η2〇Η3 OCH2CH3 Si—OCH2< OCH2CH3 CH. 3 0CH2CH3 OCH2CH3 -Si—CH=( OCH2CH3 CF3(CF2)&CH2CH2-Sp-〇CH2GH3 CH3CH2〇-Si-CH=CH2 GHaSKOCH土〇ch2ch3 ch^-shoch2ch3 OCH2CH3 OCH2CH3·CH3CH20-SiH OCH2CH3 OCHgCHa och2 CH, CH3CH2〇-Si—CH^CHgCH^r-NCO cH2=CC-〇(CH2)3-SI—OCH2CH3 0〇Η2〇Η3 OCH2CH3 Si— OCH2< OCH2CH3 CH. 3 0CH2CH3 OCH2CH3 -Si—CH=( OCH2CH3 CF3(CF2)&CH2CH2-Sp-〇CH2GH3 CH3CH2〇-Si-CH=CH2 GHaSKOCH

CCH3 NH(CH^3—Si~OOH3 OCH3CCH3 NH(CH^3—Si~OOH3 OCH3

〇〇H3 〇CH3〇〇H3 〇CH3

Si-OCH,& CH3(GH2)2—SHOCH2 UCHg -22- 201229151 [化 15]Si-OCH, & CH3(GH2)2—SHOCH2 UCHg -22- 201229151 [Chem. 15]

CH ,~~, 0<、~Οτϊ 9〇η3 och3 OCH, OCHa CH^O-SiH CH 00½ Ί3CH ,~~, 0<,~Οτϊ 9〇η3 och3 OCH, OCHa CH^O-SiH CH 001⁄2 Ί3

pCHa 〇CH3 CH3〇-SHCH2CH2CH2CI OCHa i? OCH3 I CH2=C-C-0(CH2)3-Si—OCH3 CH3 OCHipCHa 〇CH3 CH3〇-SHCH2CH2CH2CI OCHa i? OCH3 I CH2=C-C-0(CH2)3-Si-OCH3 CH3 OCHi

c CH 〉0: och3 I J CF3CH2CH2—SI-0CH3 0CH3 CH3 Ha Cl·c CH 〉0: och3 I J CF3CH2CH2—SI-0CH3 0CH3 CH3 Ha Cl·

(cW、05 哪(cW, 05 which?

□CH 3 CH30-Si(CH2)3NH(CH 仓 NHC H2〇□CH 3 CH30-Si(CH2)3NH(CH 仓 NHC H2〇

ch=ch2 HCI OCH3 I J GH2=CH-S 卜 OCHa OCH3 OCH2CH2OCH3 GHaOC HaPUgCnAi—CH=CH2 ΟΟΗ2〇Η2ΟΟΗ3 -23 201229151 [化 16] 0(CH2)3CH3 CH3(CH2)^0-Si™0(CH2)3CH3 0(GH2)3CH3 OC H2C H3 CHaCHaO-Sr-OC HSC H3 OCH2CH3 OCH(CH3)2 (CH3)2CHO-Si-OCH(CH3)2 OCH(CH3)2 〇CH(CF3)2 (CF3)2CHO-Si-OCH(CF3)2 OCH(CF3)2 OCKa GH3Osl—OCH3 OCKa OCH2CH2CH3 ch3gh2gh2o^ 卜 och2ch2ch3 ΟΟΗ2〇Η2〇Η3 -24- 201229151 CH3 GHg i^Si—0**Si—^ [化 17] 〇Si(CH3)3 (CH3)3SiO-Si—CH2CH=CH2 OSi(CH3)3 CHa CH3Ch=ch2 HCI OCH3 IJ GH2=CH-S 卜Ha OCH3 OCH2CH2OCH3 GHaOC HaPUgCnAi—CH=CH2 ΟΟΗ2〇Η2ΟΟΗ3 -23 201229151 [Chemical] 0(CH2)3CH3 CH3(CH2)^0-SiTM0(CH2)3CH3 0(GH2)3CH3 OC H2C H3 CHaCHaO-Sr-OC HSC H3 OCH2CH3 OCH(CH3)2 (CH3)2CHO-Si-OCH(CH3)2 OCH(CH3)2 〇CH(CF3)2 (CF3)2CHO-Si -OCH(CF3)2 OCH(CF3)2 OCKa GH3Osl-OCH3 OCKa OCH2CH2CH3 ch3gh2gh2o^ Bu och2ch2ch3 ΟΟΗ2〇Η2〇Η3 -24- 201229151 CH3 GHg i^Si—0**Si—^ [Chem. 17] 〇Si(CH3 )3 (CH3)3SiO-Si-CH2CH=CH2 OSi(CH3)3 CHa CH3

CiCH2— S卜O—S 卜 CH2GI CHj. CH3 H2N{CH2)3-Si-〇-Sp(CH2)3NH2 CH^ GHg, CH3 ch3CiCH2—SBu O—S 卜 CH2GI CHj. CH3 H2N{CH2)3-Si-〇-Sp(CH2)3NH2 CH^ GHg, CH3 ch3

I I HO(CH2)4-Si-0-Si-(CH2)4OH CH3 ch3I I HO(CH2)4-Si-0-Si-(CH2)4OH CH3 ch3

Ha CH3 CH3 GH3 CH3 CHa~SH0~Si-C>-Si-0--Si~CH3 CH3 CH^ ch3 ch3 b)2 GH{CH3)2 〇h3 ch3 ch3 {CH3)2HC GH{CH3)2 ch3 ch3Ha CH3 CH3 GH3 CH3 CHa~SH0~Si-C>-Si-0--Si~CH3 CH3 CH^ ch3 ch3 b)2 GH{CH3)2 〇h3 ch3 ch3 {CH3)2HC GH{CH3)2 ch3 ch3

Cl 一 Si~〇—分 Cl ch3 ch3Cl - Si ~ 〇 - points Cl ch3 ch3

a-sj—osj—O-sj—Cl Cl·-SHO-SHCI CI—ShO-Si-OI ch3 ch3 ch3 (C^2HC 1 …--.a-sj—osj—O-sj—Cl Cl·-SHO-SHCI CI—ShO-Si-OI ch3 ch3 ch3 (C^2HC 1 ...--.

ch3 ch3 f OSiH(OH3)2 《Hi-OSiH(CH3)2 OSiH(CH3)2Ch3 ch3 f OSiH(OH3)2 "Hi-OSiH(CH3)2 OSiH(CH3)2

CHi 〇Si(CH3)3 〇 CH3-Si-(CH2)3OCH2^J 〇Si(CH3)3 CH3 ch3 ch3 I. I. I. CH->一Si—0 ——SiH—0——Si—CH-i CH, -25- 201229151 [化 18] CH3 ch3 3 CH3—Si—O^Si—CH3 CH3 ch3CHi 〇Si(CH3)3 〇CH3-Si-(CH2)3OCH2^J 〇Si(CH3)3 CH3 ch3 ch3 III CH->-Si-0 ——SiH-0-Si-CH-i CH, -25- 201229151 [化18] CH3 ch3 3 CH3—Si—O^Si—CH3 CH3 ch3

H^iC、/OH。 :^Oc όό CH 疒 Sj 3, >SirCH3 β\—〇 X〇H3 1 CN3H^iC, /OH. :^Oc όό CH 疒 Sj 3, >SirCH3 β\—〇 X〇H3 1 CN3

ch3 ch3 ch3 C l·%—ShO-SHD-Sh-CH) (^H3 ihlg ^3 〇SiH(CH3)2Ch3 ch3 ch3 C l·%—ShO-SHD-Sh-CH) (^H3 ihlg ^3 〇SiH(CH3)2

I OH pLI (CH3)2HSi〇-Si-OSiH(CH3)2 3>iH-〇-SiHC: 3 OSiH(CH3)2 CHa CH3I OH pLI (CH3) 2HSi〇-Si-OSiH(CH3)2 3>iH-〇-SiHC: 3 OSiH(CH3)2 CHa CH3

-26- 201229151 [化 19] (CH3)3SiO. Ο Ο 〇Si(CH3)3 CH,-26- 201229151 [Chem. 19] (CH3)3SiO. Ο Ο 〇Si(CH3)3 CH,

CH3CH3 CF^sor-si—c-ch3 ch3ch3CH3CH3 CF^sor-si-c-ch3 ch3ch3

0 ?H2CH3 o CH(CH3)2 0 CHa CFj—S_0一Si—CH: 3 CF3-S一0—Si—CH(CH3)2 GHg*G*^^Sr^CH^j. CH2CH3 0 ch(ch3)2 ch3 1 F3 ^ Η3ΪΗ3 CISIC I o0 ?H2CH3 o CH(CH3)2 0 CHa CFj-S_0-Si-CH: 3 CF3-S-0-Si-CH(CH3)2 GHg*G*^^Sr^CH^j. CH2CH3 0 ch(ch3 ) 2 ch3 1 F3 ^ Η3ΪΗ3 CISIC I o

OMSMOOMSMO

n3 3C 3 H h H CISICN3 3C 3 H h H CISIC

o=IJ 3 h3) 3o=IJ 3 h3) 3

lor 3SILor 3SI

3 h3) (CH 27- 201229151 [化 20] CH3V ch3〆 CH^Ha, H—SHOH CH2CH33 h3) (CH 27- 201229151 [Chem. 20] CH3V ch3〆 CH^Ha, H-SHOH CH2CH3

CH2CH3 GHsCH^Sh-OH CH2CH3 CHa ch3—+卜 onh2 vH.3 〔鹵基矽烷〕 Si-Cl化合物:CH2CH3 GHsCH^Sh-OH CH2CH3 CHa ch3—+ Bu onh2 vH.3 [Halodecane] Si-Cl Compound:

-28- 201229151 [化 21] ch3 CHg^CHCHg—SHCI CH3 W CH3 9H3 ch3 ch3 i^-GI Cl—Si—CH2CH2—Si—Cl CH, CH, ch3 GHSi—CH2Br CH〇-28- 201229151 [Chem. 21] ch3 CHg^CHCHg—SHCI CH3 W CH3 9H3 ch3 ch3 i^-GI Cl—Si—CH2CH2-Si—Cl CH, CH, ch3 GHSi—CH2Br CH〇

h3c H3C_C—0—Si—Cl h3cH3c H3C_C—0—Si—Cl h3c

〒h3 0Η3(0Η^3-8Η0Ι CH3〒h3 0Η3(0Η^3-8Η0Ι CH3

CH3 CH3 Η^γ I CH3-G——SHCI H3C-C-Si—Cl II I I gh3 ch3 h3c 1 CH,CH3 CH3 Η^γ I CH3-G——SHCI H3C-C-Si-Cl II I I gh3 ch3 h3c 1 CH,

CHaCHa

ch3 0H3-CH GH3—CH’iH3 ,01 \Ch3 0H3-CH GH3—CH’iH3 , 01 \

CK3 H2GH2CH2-Sr-CI CHI, CH, CK3 GH3CH2CH2-Si-CI ch3 ch3 Cl—SMH l CH3 CH3CH3 ch3、 i j I j ^CH-C—Si—Cl CH〆 I I CH^CHoCK3 H2GH2CH2-Sr-CI CHI, CH, CK3 GH3CH2CH2-Si-CI ch3 ch3 Cl-SMH l CH3 CH3CH3 ch3, i j I j ^CH-C—Si—Cl CH〆 I I CH^CHo

CH 3CH 3

Gl—S|· —CH:=CH2 ch3 CH2CH3 I CH3CH2—Si—Cl CH,CH〇 ch3 t GK^-Si-CI ch3 ch3 GIGH2一Si—GliH3 ch3 NC-C h2ch2c SHCI ch3Gl—S|·—CH:=CH2 ch3 CH2CH3 I CH3CH2—Si—Cl CH, CH〇 ch3 t GK^-Si-CI ch3 ch3 GIGH2-Si-GliH3 ch3 NC-C h2ch2c SHCI ch3

Ch3 CH; CH3 ch3 Ch-Sl—OSi—OSi—Ci {CH3)2HC CH(CH3)2 Gh-ShO-SHCI ch3 ch3 ch3 (CH3)2HC CH{CH3)2 ch3 ch3 Cl—Si—Si—Cl i i ch3 ch3 -29- 201229151 [化 22] ΟCh3 CH; CH3 ch3 Ch-Sl—OSi—OSi—Ci {CH3)2HC CH(CH3)2 Gh-ShO-SHCI ch3 ch3 ch3 (CH3)2HC CH{CH3)2 ch3 ch3 Cl—Si—Si—Cl ii Ch3 ch3 -29- 201229151 [化22] Ο

c ch2ch3 ch3 ^H-Si-CI Cl—Si^CHaCHa 3 ch2ch3 ch3 CHa ^ V-shci 0H3 CH3 CH3(CH2h CH3 γ—去 HOI CH, CH3(CH2)c ch2ch3 ch3 ^H-Si-CI Cl-Si^CHaCHa 3 ch2ch3 ch3 CHa ^ V-shci 0H3 CH3 CH3(CH2h CH3 γ-to HOI CH, CH3(CH2)

ch(ch3)2 (CH3)2〇H—Si—Cl CH(CH3)2Ch(ch3)2 (CH3)2〇H—Si—Cl CH(CH3)2

-30- 201229151 [化 23] C Hgf—Si^C H^5I Cl-30- 201229151 [Chem. 23] C Hgf—Si^C H^5I Cl

Gl CH3*—Si—(C H2)^CI Cl H3p Cl CH5Gl CH3*—Si—(C H2)^CI Cl H3p Cl CH5

Ϊ l· JL H3C—C—Si—C~~CHa III H3C Cl CHgΪ l· JL H3C—C—Si—C~~CHa III H3C Cl CHg

Cl CH3(CH2)9-Si-CH3 ClCl CH3(CH2)9-Si-CH3 Cl

Cl ^&gt; Cl ch3(gh 土—〒卜 CH3〈 V-Si-CHg Cl '^ ClCl ^&gt; Cl ch3(gh soil-〒卜CH3< V-Si-CHg Cl '^ Cl

Gl H2CH3Gl H2CH3

ClCl

Cl GH3{CH2)5一Si—(CH^aCH^ ClCl GH3{CH2)5-Si-(CH^aCH^ Cl

?' ψ CH3-S1-CH3 CH3(CH山一 山CH3 C1 Cl?' ψ CH3-S1-CH3 CH3 (CH Shanyishan CH3 C1 Cl

Cl Cl ci CH/CHdn—i-CHs CH3CH2—SHH CH3(CH2)5-y-CH3Cl Cl ci CH/CHdn-i-CHs CH3CH2—SHH CH3(CH2)5-y-CH3

Cl Cl ClCl Cl Cl

Cl ClCl Cl

I I OH3—Si*-Si^OH3I I OH3—Si*-Si^OH3

II Cl CI -31 - 201229151 [化 24]II Cl CI -31 - 201229151 [Chem. 24]

Cl Cl ClCl Cl Cl

ClCl

Cl —Si—CH2CH=CH2 CI3Si—CsC—SiCI3 cHSh—CH^H^-Si—01 CH3(CH2)r-St-CI Cl Cl CICHaCHjCH^Cl —Si—CH2CH=CH2 CI3Si—CsC—SiCI3 cHSh—CH^H^-Si—01 CH3(CH2)r-St-CI Cl Cl CICHaCHjCH^

Cl ^HCICl ^HCI

SiCI3SiCI3

Cl CH3(CH2)^Si-CI CH3(CH2)1f-Si-CI Cl ClCl CH3(CH2)^Si-CI CH3(CH2)1f-Si-CI Cl Cl

Cl Cl -ch2ch3Cl Cl -ch2ch3

Cl Cl CH3 Cl γ1Cl Cl CH3 Cl γ1

G 卜sl-s!—Gl CHf ihl—CHrA卜 Cl CH.3{Ghy 广〒HCIG 卜sl-s!—Gl CHf ihl—CHrA Bu Cl CH.3{Ghy Hirose HCI

Cl Cl Cl ClCl Cl Cl Cl

SiO(3SiO (3

Cl ch3 I I 3 ,ch3 01—Si—C-〇K , I I 、ch3 Cl ch3Cl ch3 I I 3 ,ch3 01—Si—C—〇K , I I , ch3 Cl ch3

ClCl

I NCCH2CH2—Sh-CI ClI NCCH2CH2—Sh-CI Cl

Cl CF3(CF2)7CH2CH2-Si-CI ClCl CF3(CF2)7CH2CH2-Si-CI Cl

Cl I a—s 卜(ch2}5ch3Cl I a-s Bu (ch2}5ch3

Cl I CH^—Si—Cl ClCl I CH^—Si—Cl Cl

Cl Cl I t CHa{CH2)17^Si-CI Ch-Si—CH^HzOHs Cl Cl HSiCI3Cl Cl I t CHa{CH2)17^Si-CI Ch-Si—CH^HzOHs Cl Cl HSiCI3

ClCl

Cl CH3(CH2)13—Si-CI OF3(CF2)5CH2CH2-Si-CI CJ Cl GH2=CH—SiCI3Cl CH3(CH2)13-Si-CI OF3(CF2)5CH2CH2-Si-CI CJ Cl GH2=CH—SiCI3

SiCl4Si-CI化合物以外之鹵基矽烷: -32- 201229151 [化 25]Halogenated decane other than SiCl4Si-CI compound: -32- 201229151 [Chem. 25]

〔Si-(C)4化合物〕 -33- 201229151 [化 26] CH2—CHCH2一Si—CH2CI (CHjJjCH 一Si—CH2CH—CH2[Si-(C)4 compound] -33- 201229151 [Chem. 26] CH2-CHCH2-Si-CH2CI (CHjJjCH-Si-CH2CH-CH2

I CH3 ch3I CH3 ch3

I CH3-S1—CH2CH—CH2 ch3 CH(CH3)2 〇H(CH3)2 CH3OCH2 CHa CH2- έΗ3I CH3-S1—CH2CH—CH2 ch3 CH(CH3)2 〇H(CH3)2 CH3OCH2 CHa CH2- έΗ3

ch3 CH, C=C-Si(CH3)3Ch3 CH, C=C-Si(CH3)3

CH 3 CH〇 CH3_Si~C=C——C=C——Si — CH3CH 3 CH〇 CH3_Si~C=C——C=C——Si — CH3

C=C-Si(CH3)3 俨3 CH3 NH2 CH3 CHa Br CH3—Sh-CH2'~Sh-CHg OH3—Si —CH—S1-CH3 CH3— ch3 ch3 ch3 CH3 &amp; -34- 2 201229151 [化 27] 俨3 BrCH2CH2—Si 一 CH3 ch3 CK3 -Si—ChC=C-Si(CH3)3 俨3 CH3 NH2 CH3 CHa Br CH3—Sh-CH2'~Sh-CHg OH3—Si—CH—S1-CH3 CH3— ch3 ch3 ch3 CH3 &amp; -34- 2 201229151 27] 俨3 BrCH2CH2—Si—CH3 ch3 CK3 -Si—Ch

日rDay r

CHa-Sp-CHgBr gh3CHa-Sp-CHgBr gh3

Si(CH3)3 ch3 CHrS-G=CH2 CH3Si(CH3)3 ch3 CHrS-G=CH2 CH3

Si(CH3)3 CH^Si(CH3)3 CH^

CH 丨3 CH3—Si—ch2ch2och2ci Or shch2ci CH^ ch3 GH3 cich2—shch3 ch3 C H2CH—C Hg gh3—shch3 ch2ch=ch2CH 丨3 CH3—Si—ch2ch2och2ci Or shch2ci CH^ ch3 GH3 cich2—shch3 ch3 C H2CH—C Hg gh3—shch3 ch2ch=ch2

(CH3)3sr S, Si(CH3)3 ch3〇 OS02CF3(CH3)3sr S, Si(CH3)3 ch3〇 OS02CF3

OCH3OCH3

Si(CH3)3Si(CH3)3

ch3Ch3

Ol?hOl?h

Si-0H=CH2 ch3 CH^ I i? CH3—S'r-CsC-CH-C-〇CH2CH3 CH3—Si—CH2-C-OCH2CH3 CH, 35 201229151 [化 28]Si-0H=CH2 ch3 CH^ I i? CH3—S'r-CsC-CH-C-〇CH2CH3 CH3—Si—CH2-C-OCH2CH3 CH, 35 201229151 [Chem. 28]

CH3 gh3—sh—gh2i ch3 CH3 OS02CF3 c;^och3 OS02CF3Jx.Si(OH3)3 V OCH3CH3 gh3—sh—gh2i ch3 CH3 OS02CF3 c;^och3 OS02CF3Jx.Si(OH3)3 V OCH3

CHS I. CsC^Si^CHa I ch3CHS I. CsC^Si^CHa I ch3

ch3 〇 ——f—OS〇2CF3JL^Si{CH3)3 uCh3 〇 ——f—OS〇2CF3JL^Si{CH3)3 u

ONa CHg, 〇 -36- 201229151 [化 29] GHa ,ch3 ch3〆 〇H3 ch3 CH3 一 Si— C= C- (CH2)3CH3 _Sn— CH3 (CH2)3CH3ONa CHg, 〇 -36- 201229151 [Chem. 29] GHa, ch3 ch3〆 〇H3 ch3 CH3 a Si— C= C- (CH2)3CH3 _Sn— CH3 (CH2)3CH3

CH3_ Si- CH2 — Sn — (C H2)3 C H3 ch3 (ch2)3ch3 CH2CH3CH3_ Si- CH2 — Sn — (C H2)3 C H3 ch3 (ch2)3ch3 CH2CH3

CH3CH2—Si—C=CH ch2ch3 CH(CH3)2 (CH3)2CH-Si—C=Cl· CH(CH3)2 ch3 0CH3CH2—Si—C=CH ch2ch3 CH(CH3)2 (CH3)2CH-Si—C=Cl· CH(CH3)2 ch3 0

I. II CH3_Si—CH2—C—OH CH3 CH2CH3 CH3CH2—Si—CH-CH2 ch2ch3 CH(CH3)2 —Si—C=C—CH CH(CH3)2 ch3 I J CF3—Si—CH3 CH-,I. II CH3_Si—CH2—C—OH CH3 CH2CH3 CH3CH2—Si—CH-CH2 ch2ch3 CH(CH3)2—Si—C=C—CH CH(CH3)2 ch3 I J CF3—Si—CH3 CH—,

CHa CH3—Si—CSCH CH3—Si-Cs〇-CH-CH3 CHa 〇H3 GH3 CH3—Sh-c in,CHa CH3—Si—CSCH CH3—Si-Cs〇-CH-CH3 CHa 〇H3 GH3 CH3—Sh-c in,

CH3 CH3*-Sh-GHN2 ch3 H3 t—CHaiH3 CH3 CH3—S'r-OH2CH2OH ch3CH3 CH3*-Sh-GHN2 ch3 H3 t-CHaiH3 CH3 CH3—S'r-OH2CH2OH ch3

Cl' CH, ICH, -37- 201229151 [化 30]Cl' CH, ICH, -37- 201229151 [Chem. 30]

CH3 I. CH3一Si—CH2CH2ONH2 CH3 • HCICH3 I. CH3-Si-CH2CH2ONH2 CH3 • HCI

,_&gt; 1 CH3 / P-OH2CH2-Si-CH丨 CH,_&gt; 1 CH3 / P-OH2CH2-Si-CH丨 CH

3 CH3 I. CH3 —Si_C=C-CHi -I—BF^3 CH3 I. CH3 —Si_C=C-CHi -I—BF^

'N'N

Csc—Sr—OH3 ch3 CH, CH3 5? ch3 CH^Si-CH2SH CH3-Si-CH2OH Gh3— g - 〇〇Η2—^CH3 cn3 CH3 ch3 ch3 ch3 CH3—Si—CH2N3 CH3—Si—CH2MgCI CH3 〇HaCsc—Sr—OH3 ch3 CH, CH3 5? ch3 CH^Si-CH2SH CH3-Si-CH2OH Gh3— g - 〇〇Η2—^CH3 cn3 CH3 ch3 ch3 ch3 CH3—Si—CH2N3 CH3—Si—CH2MgCI CH3 〇Ha

0 II0 II

CH 3 CF3一S一OCHj一Si—CH〇 3 II 2 I 3 0 CH3CH 3 CF3 - S - OCHj - Si - CH〇 3 II 2 I 3 0 CH3

Si(CH3)3Si(CH3)3

OSO2CF3OSO2CF3

OSO2CF3 CH3 Si(CH3)3 ((?H33)3sr 'Ch3OSO2CF3 CH3 Si(CH3)3 ((?H33)3sr 'Ch3

B(OH)2B(OH)2

OSO2CF3OSO2CF3

-Si(CH3)3 CH3 C —CsCi~SHCH^. cha-Si(CH3)3 CH3 C —CsCi~SHCH^. cha

Si(CH3)3 ch3 CH 厂i卜 GsG”CH2〇H CHaSi(CH3)3 ch3 CH Factory i Bu GsG"CH2〇H CHa

\=J I ch3 1 CH,C=C-Si-CH3 CH3 Br_ a ch3 子卜ch3 ch3 -38 201229151 [化 31]\=J I ch3 1 CH,C=C-Si-CH3 CH3 Br_ a ch3 子卜ch3 ch3 -38 201229151 [化31]

〇η3 Si-CHa CH3〇η3 Si-CHa CH3

〔Si-Si化合物〕 -39- 201229151 [化 32] CH3 CH3 Ci一He I CH3 CHa[Si-Si compound] -39- 201229151 [Chem. 32] CH3 CH3 Ci-He I CH3 CHa

Cl Cl α -sl-s!—ci 1 1 Cl Cl CH3CH3 GH^—Si—Si-CH3 CHr&gt;CH^Cl Cl α -sl-s!—ci 1 1 Cl Cl CH3CH3 GH^—Si—Si—CH3 CHr>CH^

SiH{CH3)2 Si(CH3)3SiH{CH3)2 Si(CH3)3

SKCHa)» {CH^gSi—SiH Si(CH3)3 〔乙烯基矽烷、烯丙基矽烷、及乙炔基矽烷〕 -40- 201229151 [化 33] ch3 CH^-S1-G=CH2 CH3 CHa Br CH, ch3 ch3ch2 ^r-Si-NH—Si-^ CHa CH3 CH3 ch3 ch3 och3 ch3 GH产GH-〒卜予卜GH—GH2 GH各-▲卜GH3 ch3 ch3 ch3 〇Si(CH3)3 CH,=C—CH=CH-〇CH,SKCHa)» {CH^gSi—SiH Si(CH3)3 [vinyl decane, allyl decane, and ethynyl decane] -40- 201229151 [Chemical 33] ch3 CH^-S1-G=CH2 CH3 CHa Br CH , ch3 ch3ch2 ^r-Si-NH-Si-^ CHa CH3 CH3 ch3 ch3 och3 ch3 GH production GH-〒卜予卜 GH-GH2 GH each-▲ Bu GH3 ch3 ch3 ch3 〇Si(CH3)3 CH,=C —CH=CH-〇CH,

〇Si(CH3)3〇Si(CH3)3

Si-CH=CH2 CH2=CH—C=CH2 ch3 0 0CH3 II I CH2=C-C-0(CH2)3-Si—0CH3 ch3 och3 ch3Si-CH=CH2 CH2=CH—C=CH2 ch3 0 0CH3 II I CH2=C-C-0(CH2)3-Si—0CH3 ch3 och3 ch3

I CH2=CHCH厂Si—ch2ci ch3 CHa CH2=CHGH2—SHCI ch3 GH2=GHCH2*—〇—SS—CH3 CHaI CH2=CHCH plant Si-ch2ci ch3 CHa CH2=CHGH2—SHCI ch3 GH2=GHCH2*—〇—SS—CH3 CHa

ClCl

Cl—Si—ch2ch=ch2 Cl 0CH3Cl—Si—ch2ch=ch2 Cl 0CH3

I CH3〇-Si—CH2CH=CH2 0CH-, 〇Si(CH3)3 (CH3)3SiO-Si—OH2CH=CH2 0si(CH3)3 OCH2CH3 CH3CH2O一Si—CH2CH—CH2 OCH2CH3 CH3I CH3〇-Si-CH2CH=CH2 0CH-, 〇Si(CH3)3 (CH3)3SiO-Si-OH2CH=CH2 0si(CH3)3 OCH2CH3 CH3CH2O-Si-CH2CH-CH2 OCH2CH3 CH3

I CH3-Si—CH2CH-CH2 ch3 CHS]·~CH^CHj I 2 gh3 -41 - 201229151 [化 34] CH2CH!=CH2 OH3—Sr-CH3 cn2ch=ch2I CH3-Si-CH2CH-CH2 ch3 CHS]·~CH^CHj I 2 gh3 -41 - 201229151 [Chem. 34] CH2CH!=CH2 OH3—Sr-CH3 cn2ch=ch2

Cl CH2=CHCH2-Si-CH2CH=CH2 OCN2CH3 CH3—St-CH=CH2 OCH2CH3 CHa C H 3GH2 S G CH 2 0¾Cl CH2=CHCH2-Si-CH2CH=CH2 OCN2CH3 CH3—St-CH=CH2 OCH2CH3 CHa C H 3GH2 S G CH 2 03⁄4

CHCH

h3 CH2=CH—SiCI3 OCH2OH3 ΟΗ3ΟΗ2〇~3ϊ—CH=CH2 OCH2CH3 ch2ch3 CH3CH2_Si—CH—CH2 OH2CH3H3 CH2=CH—SiCI3 OCH2OH3 ΟΗ3ΟΗ2〇~3ϊ—CH=CH2 OCH2CH3 ch2ch3 CH3CH2_Si—CH—CH2 OH2CH3

〇CH3 GHgp^GH'~~OCHg OCH3 〇h3 CHiPChf-Sh-CHa ch3 och2ch2och3 CHaOCHgCH^O-Si—CH=CH2 OCH2GH2OCH3 -42- 201229151 [化 35] CH3 ch3 I. I. CH3—Si—C=C一Si~CH3 3 I I 3 ch3 ch3 ch3 ch3 I. I. CH3一Si-C=C一C=C—Si—CHi 3 I I 3 CH^ CH〇〇CH3 GHgp^GH'~~OCHg OCH3 〇h3 CHiPChf-Sh-CHa ch3 och2ch2och3 CHaOCHgCH^O-Si-CH=CH2 OCH2GH2OCH3 -42- 201229151 [Chemical 35] CH3 ch3 II CH3—Si—C=C—Si~ CH3 3 II 3 ch3 ch3 ch3 ch3 II CH3-Si-C=C-C=C-Si-CHi 3 II 3 CH^ CH〇

ch3 CH3-Sj—C5C-CH2Br ch3 CH, -Si—esc—ch-c-och2ch3 0¾ ?HSihsCh3 CH3-Sj—C5C-CH2Br ch3 CH, -Si—esc—ch-c-och2ch3 03⁄4 ?HSihs

CH 3 (CH2)3CH3 CH2CH3CH 3 (CH2)3CH3 CH2CH3

c h3~~ S i- C=C— S n— (C H2)3 C H3 CH3CH2—Si—C=CH ch3 (CH2)3CH3 I CH,CH〇 CH(CH3)2 (CH3)2CH—Si_C=CH CH(CH3)2 ch3 oh I . I CH3—Si-C=C—CH_CH3 ch3 〇H(CH3)2 (CH3)2〇H—Sj—C=C—CH3 CH(CH3)2 ch3 0¾ CH^~Sr~C=CH CH3 chMi_csc-卜肝4 ch3—⑽4!^c h3~~ S i- C=C— S n—(C H2)3 C H3 CH3CH2—Si—C=CH ch3 (CH2)3CH3 I CH,CH〇CH(CH3)2 (CH3)2CH—Si_C= CH CH(CH3)2 ch3 oh I . I CH3—Si-C=C—CH_CH3 ch3 〇H(CH3)2 (CH3)2〇H—Sj—C=C—CH3 CH(CH3)2 ch3 03⁄4 CH^ ~Sr~C=CH CH3 chMi_csc- Bu liver 4 ch3—(10)4!^

CH 3CH 3

Cl·%Cl·%

一3 H3I-CH3 CISIC C-Br· III c „2 CH3A 3 H3I-CH3 CISIC C-Br· III c „2 CH3

CHg—SfT-fC^C^GH2〇H ch3 上述有機矽化合物(a)更佳爲以下述式(1): {Si(Ra)s(Rb)t(Rc)u(Rd)v(Re)w}n (1) (式中,Ra、Rb、R。及Rd係相同或相異,爲氫、鹵素、 -43- 201229151 碳數1〜ίο之烷氧基、碳數1〜10之胺基、碳數1〜10之院 基、碳數6〜10之芳基、碳數3〜10之烯丙基' 或碳數 3〜丨〇之縮水甘油基,Re係相同或相異,爲-0-、-NH·、_ C = C-、或矽烷鍵。s、t、u及v係相同或相異,爲〇或1 ’ w係〇〜4之整數,n係1〜20。η爲1時,s + t + u + ν係4, w爲〇。η爲2~20時,s + t + u + v係相同或相異,爲〇〜4 , w 係相同或相異,爲〇〜4,w爲1以上之整數時,至少2個 Si係介於Re鍵結成直鏈、梯子型、環狀、或雜環狀)表 示的化合物(A1 ) 。Ra、Rb、Re、及Rd係與Si鍵結之! 價基團。Re係與2個S i鍵結之2價基團。 式(1 )中’ Ra、Rb、R。及Rd係相同或不同,至少一 個爲氫、鹵素、碳數1〜10之烷氧基、或碳數1〜1〇之芳基 ’其他爲碳數1〜10之烷基、碳數6〜10之芳基、碳數 3〜之烯丙基、或碳數3〜10之縮水甘油基較佳。η爲 2〜20時,s + t + u + v係相同或不同爲1〜3,w爲1〜3較佳。 式(1 )中,Ra、Rb、Rc及Rd更佳爲相同或不同,至 少一個爲碳數1〜6之烷氧基、或碳數1~6之芳基,其他爲 碳數1〜6之烷基、碳數6〜8之芳基。更佳爲至少一個爲碳 數1〜6之烷氧基’其他爲碳數1〜6之烷基、碳數6〜8之芳 基,換言之’化合物(A1)爲烷氧基矽烷。特佳爲相同或 不同,全部爲碳數1〜4之烷氧基。 上述Ra、Rb、Re及Rd中,烷基時,烷基之碳數較佳 爲1〜5«上述院基可爲鏈狀、環狀、分支。又,氫原子可 被氟原子等取代。烷基例如有甲基、乙基、丙基、丁基、 -44 - 201229151 戊基等,例如Ra、Rb、Rc或Rd分別爲甲基、乙基、丙基 或異丙基較佳。更佳爲甲基、乙基。 上述Ra、Rb、RC及Rd中之芳基,例如較佳爲苯基、 萘基、甲基苯基、乙基苯基或二甲基苯基。 上述Ra、Rb、Re及Rd中之鹵素,例如有氟、氯、溴 或碘較佳’更佳爲氯。 上述Ra、Rb、Rc及Rd中,烷氧基時,烷氧基之碳數 較佳爲1〜5»上述烷氧基可爲鏈狀、環狀、分支。又,氫 原子可被氟原子等取代。烷氧基例如有甲氧基、乙氧基、 丙氧基、或丁氧基,更佳爲甲氧基、或乙氧基。CHg—SfT-fC^C^GH2〇H ch3 The above organic ruthenium compound (a) is more preferably represented by the following formula (1): {Si(Ra)s(Rb)t(Rc)u(Rd)v(Re) w}n (1) (wherein, Ra, Rb, R, and Rd are the same or different, and are hydrogen, halogen, -43-201229151 carbon number 1 to ί alkoxy group, carbon number 1 to 10 amine a base having a carbon number of 1 to 10, an aryl group having a carbon number of 6 to 10, an allyl group having a carbon number of 3 to 10, or a glycidyl group having a carbon number of 3 to ,, the Re being the same or different, -0-, -NH·, _ C = C-, or a decane bond. s, t, u, and v are the same or different, and are an integer of 〇 or 1 'w 〇 4 4, and n is 1 to 20. When η is 1, s + t + u + ν is 4, w is 〇. When η is 2 to 20, s + t + u + v are the same or different, which is 〇~4, w is the same or different When it is 〇~4 and w is an integer of 1 or more, at least two Si systems are represented by a compound (A1) in which Re is bonded to a linear, ladder, cyclic or heterocyclic ring. Ra, Rb, Re, and Rd are bonded to Si! Price group. Re is a divalent group bonded to two Si groups. In the formula (1), 'Ra, Rb, R. And Rd are the same or different, at least one of hydrogen, halogen, alkoxy group having a carbon number of 1 to 10, or an aryl group having a carbon number of 1 to 1 Å, and other alkyl groups having a carbon number of 1 to 10, and a carbon number of 6 to An aryl group of 10, an allyl group having 3 to 10 carbon atoms, or a glycidyl group having 3 to 10 carbon atoms is preferred. When η is 2 to 20, s + t + u + v is the same or different from 1 to 3, and w is preferably 1 to 3. In the formula (1), Ra, Rb, Rc and Rd are more preferably the same or different, at least one of which is an alkoxy group having 1 to 6 carbon atoms or an aryl group having 1 to 6 carbon atoms, and the others are carbon numbers 1 to 6 An alkyl group or an aryl group having 6 to 8 carbon atoms. More preferably, at least one alkoxy group having a carbon number of 1 to 6 'others are an alkyl group having 1 to 6 carbon atoms and an aryl group having 6 to 8 carbon atoms, in other words, the compound (A1) is an alkoxydecane. Particularly preferred are the same or different, all of which are alkoxy groups having 1 to 4 carbon atoms. In the above-mentioned Ra, Rb, Re and Rd, in the case of an alkyl group, the carbon number of the alkyl group is preferably from 1 to 5 «The above-mentioned yard group may be a chain, a ring or a branch. Further, the hydrogen atom may be substituted by a fluorine atom or the like. The alkyl group is, for example, a methyl group, an ethyl group, a propyl group, a butyl group, a -44 - 201229151 pentyl group or the like. For example, Ra, Rb, Rc or Rd is preferably a methyl group, an ethyl group, a propyl group or an isopropyl group. More preferably, it is a methyl group or an ethyl group. The aryl group in the above Ra, Rb, RC and Rd is preferably, for example, a phenyl group, a naphthyl group, a methylphenyl group, an ethylphenyl group or a dimethylphenyl group. The halogen in the above Ra, Rb, Re and Rd, for example, fluorine, chlorine, bromine or iodine is preferably 'more preferably chlorine. In the above Ra, Rb, Rc and Rd, in the case of an alkoxy group, the alkoxy group preferably has a carbon number of 1 to 5». The alkoxy group may be a chain, a ring or a branch. Further, the hydrogen atom may be substituted by a fluorine atom or the like. The alkoxy group is, for example, a methoxy group, an ethoxy group, a propoxy group or a butoxy group, more preferably a methoxy group or an ethoxy group.

Re係相同或不同爲-0-、-NH-、-bC-、或矽烷鍵。Re 較佳爲-〇-、-NH-、或-C^C-。Re係與2個Si鍵結之2價 基團’藉由Re,2以上之矽原子介於Re,可鍵結成直鏈、 梯子型、環狀、或雜環狀。η爲2以上之整數時,矽原子 彼此可鍵結。 化合物(Α1)中,較佳爲四烷氧基矽烷。換言之,上 述式(1 )中’ η爲1,且Ra、Rb、Rc及Rd係相同或不同 爲碳數1〜10之烷氧基較佳。Ra、Rb、11。及Rd可相同或相 異。上述烷氧基可爲鏈狀、環狀、分支。又,氫原子可被 氟原子取代。上述烷氧基之碳數較佳爲1〜8,更佳爲1〜6 ’特佳爲1 ~4。 化合物(A1)例如有四甲氧基矽烷、四乙氧基矽烷、 四-η-丙氧基矽烷、四-iS0-丙氧基矽烷、·四-η-丁氧基矽烷 、四-sec-丁氧基矽烷、四-tert-丁氧基矽烷、四苯氧基矽 -45- 201229151 烷等,此等中,較佳爲選自四甲氧基矽烷及四乙氧基矽烷 所成群之至少一種化合物’從取得容易’且低價格’接近 玻璃之折射率的觀點,較佳爲四乙氧基矽烷(TE〇s)。 從提高交聯性的觀點,上述化合物(A 1 )較佳爲具有 碳數3〜5之烯丙基、碳數3〜5之縮水自由基、丙烯酸基、 或甲基丙烯酸基者。換言之,化合物(A1)中,Ra、Rb、 Re及Rd之至少一個爲碳數3〜5之烯丙基、碳數3〜5之縮 水自由基、丙烯酸基、或甲基丙烯酸基之較佳形態之一。 含氟聚合物(B)係具有下述式(L): [化 36] CXW—CX3卜 I &lt;L) (CX4X5)~i~fc=0) b(〇V-Rf (式中’X1及X2係相同或相異,爲H或F;X3係H、F 、CH3或CF3 ; X4及X5係相同或相異,爲η、F或CF3 ; Rf係可具有醯胺鍵或脲鍵之碳數1〜4〇之含氟烴基、或可 具有醯胺鍵、碳酸酯鍵、胺基甲酸酯鍵或脲鍵之碳數 2〜100之具有醚鍵之含氟烴基,結構末端之i~3處被γ( Υ係末端至少含有1個碳數idO之水解性金屬烷氧化物 部位的1價有機基’或末端具有乙烯性碳-碳雙鍵之碳數 2〜1 〇之1價有機基)取代之含氟烴基;&amp;係〇〜3之整數; b及c係相同或相異’爲〇或1 )表示之結構單位(以下 也稱爲「結構單位L」)。上述醚鍵係以·〇_表示之2價基 團。酿胺鍵係以-C0NH_表示之2價基團。碳酸酯鍵係以_ 〇_C〇〇_表示之2價基團。胺基甲酸酯鍵鍵係以-0-C0NH- -46 - 201229151 表示之2價基團。上述脲鍵鍵係以-NH_CONH-表示之2價 基團。 本說明書中,「烴基」係表示由烴所構成之有機基, 「含氟烴基」係表示烴基所具有之一部份或全部之氫原子 被氟原子取代者。 上述「烴基」例如有烷基、烯丙基、環狀烷基、不飽 和烷基等。「含氟烴基」例如有含氟烷基、含氟烯丙基、 含氟環狀烷基、含氟不飽和烷基等。 含氟聚合物(B)係因具有上述構成,因此化合物(A )例如爲Si-Ο化合物時等,由化合物(A )形成SiOx時 ,可與該SiOx適當交聯,可使形成之絕緣膜成爲可撓性 更優異者。該形成之絕緣膜係因由SiOx所構成者,因此 ,耐熱性及透明性更優異。 結構單位L中,較佳爲式(L 1 ): [化 37] —(-CXlX2—CX^— ί (L1) CCX4XB-H—Rf (式中,X1、X2、X3、X4、X5、Rf、a 及 c 係與式(L ) 相同)表示之結構單位L 1較佳。 含有此結構單位L1之含氣聚合物(B)在折射率低’ 且與各種基材之密著性佳,可提高密著耐久性的觀點,較 佳。又,可藉由熱、自由基或陽離子之接觸提高硬化反應 性的觀點,較佳。 結構單位L1之更佳具體例之一係來自式(L2 ): -47- 201229151 [化 38] —6CH2—CF-)— I (L2 ) CF2—O —R f (式中,Rf係與式(L)相同)表示之含氟乙烯性單體之 結構單位L2。 此結構單位L2係折射率低,且與各種基材之密著性 佳,可提高耐久性的觀點較優異,此外,與其他含氟乙烯 系單體之共聚合性良好’故較佳。又,不僅可提高近紅外 透明性,且可降低折射率,故較佳。Re is the same or different as -0-, -NH-, -bC-, or decane bond. Re is preferably -〇-, -NH-, or -C^C-. The Re-system and the two Si-bonded divalent groups 'by Re, 2 or more of the deuterium atoms are in Re, and may be bonded to a linear chain, a ladder type, a cyclic shape, or a heterocyclic ring shape. When η is an integer of 2 or more, the ruthenium atoms may be bonded to each other. Among the compounds (Α1), a tetraalkoxydecane is preferred. In other words, in the above formula (1), η is 1, and Ra, Rb, Rc and Rd are preferably the same or different alkoxy groups having 1 to 10 carbon atoms. Ra, Rb, 11. And Rd may be the same or different. The above alkoxy group may be a chain, a ring or a branch. Further, a hydrogen atom may be substituted by a fluorine atom. The alkoxy group preferably has 1 to 8 carbon atoms, more preferably 1 to 6 Å, particularly preferably 1 to 4 carbon atoms. The compound (A1) is, for example, tetramethoxydecane, tetraethoxydecane, tetra-n-propoxydecane, tetra-iS0-propoxydecane, tetra-n-butoxydecane, tetra-sec- Butoxy decane, tetra-tert-butoxy decane, tetraphenoxy fluorene-45-201229151 alkane, etc., among which, preferably selected from the group consisting of tetramethoxy decane and tetraethoxy decane At least one compound 'is preferably tetraethoxy decane (TE〇s) from the viewpoint of obtaining an easy and low price close to the refractive index of the glass. The compound (A 1 ) is preferably an allyl group having 3 to 5 carbon atoms, a water-reducing radical having 3 to 5 carbon atoms, an acrylic group, or a methacrylic group, from the viewpoint of improving crosslinkability. In other words, in the compound (A1), at least one of Ra, Rb, Re and Rd is preferably an allyl group having 3 to 5 carbon atoms, a water-reducing radical having 3 to 5 carbon atoms, an acrylic group or a methacryl group. One of the forms. The fluoropolymer (B) has the following formula (L): [Chem. 36] CXW-CX3 I I &lt; L) (CX4X5)~i~fc=0) b(〇V-Rf (wherein X1 And X2 is the same or different and is H or F; X3 is H, F, CH3 or CF3; X4 and X5 are the same or different and are η, F or CF3; Rf can have a guanamine bond or a urea bond a fluorine-containing hydrocarbon group having 1 to 4 carbon atoms, or a fluorine-containing hydrocarbon group having an ether bond of 2 to 100 carbon atoms which may have a guanamine bond, a carbonate bond, a urethane bond or a urea bond, and a terminal of the structure i ~3 is a valence of γ (a monovalent organic group containing at least one hydrolyzable metal alkoxide moiety of the carbon number iDO at the end of the lanthanoid end) or a carbon number of 2 to 1 末端 having an ethylenic carbon-carbon double bond at the end An organic group-substituted fluorine-containing hydrocarbon group; &lt;an integer of 〇~3; b and c are the same or different structural units represented by 〇 or 1) (hereinafter also referred to as "structural unit L"). The bond is a divalent group represented by 〇 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The acid ester bond is a divalent group represented by -0-C0NH- -46 - 201229151. The above urea bond is -NH_ In the present specification, the "hydrocarbon group" means an organic group composed of a hydrocarbon, and the "fluorine-containing hydrocarbon group" means that a part or all of a hydrogen atom of a hydrocarbon group is replaced by a fluorine atom. The "hydrocarbon group" may, for example, be an alkyl group, an allyl group, a cyclic alkyl group or an unsaturated alkyl group. The "fluorine-containing hydrocarbon group" may, for example, be a fluorine-containing alkyl group, a fluorine-containing allyl group or a fluorine-containing cyclic alkyl group. The fluorine-containing unsaturated alkyl group or the like. The fluorine-containing polymer (B) has the above-described configuration. Therefore, when the compound (A) is, for example, a Si-tellurium compound, when the compound (A) is formed into SiOx, it can be appropriately mixed with the SiOx. The insulating film formed can be made more excellent in flexibility. The insulating film formed is preferably composed of SiOx, and therefore has excellent heat resistance and transparency. In the structural unit L, a formula (L 1 is preferred) ): [-37] —(-CXlX2—CX^— ί (L1) CCX4XB-H—Rf (where X1, X2, X3, X4, X5, Rf, a, and c are the same as equation (L)) The structural unit L 1 is preferably represented. The gas-containing polymer (B) containing the structural unit L1 has a low refractive index and is adhered to various substrates. Preferably, it is preferable from the viewpoint of improving the durability of adhesion, and it is preferable to improve the curing reactivity by contact of heat, radical or cation. One of the more preferable examples of the structural unit L1 is derived from (L2): -47- 201229151 [Chem. 38] - 6CH2 - CF-) - I (L2) CF2 - O - R f (wherein Rf is the same as formula (L)) The structural unit L2. This structural unit L2 has a low refractive index, is excellent in adhesion to various substrates, is excellent in durability, and is excellent in copolymerizability with other fluorine-containing vinyl monomers. Further, it is preferable not only to improve the near-infrared transparency but also to lower the refractive index.

上述結構單位L2中,Rf係例如-(CF(CF3)CQ2-0)n-T (Q係相同或不同表示Η或F。T係-CH20-(C0)-CF = CH2 、或·CONH-R23-Si(OR2。)(OR21)(OR22)(R2()、R21及R22係 相同或相異,爲碳數1〜5之烷基。R23係氫原子之一部份 或全部可被氟原子取代之碳數1〜39之伸烷基)。11係0、 1或2)較佳之形態之一。 又,結構單位L1之另外之較佳的具體例係來自式( L3 ): [化 39] —fCF广CF^— 丨 (L3) Ο——R f (式中,Rf係與式(L )相同)表示之含氟乙烯性單體的 結構單位L3。 此結構單位L3係折射率低,且與各種基材之密著性 -48- 201229151 佳,可提高密著耐久性的觀點較優異,此外,與其他含氟 乙烯系單體之共聚合性良好,故較佳。又,不僅可提高近 紅外透明性,且可降低折射率,故較佳。 上述結構單位L、Ll、L2及L3所含之Rf係如上述 ,可具有醯胺鍵或脲鍵之碳數1~4 0之含氟烴基、或可具 有醯胺鍵、碳酸酯鍵、胺基甲酸酯鍵或脲鍵之碳數2〜100 之具有醚鍵之含氟烴基,結構末端之1〜3處被Y(Y係末 端至少含有1個碳數1~50之水解性金屬烷氧化物部位的1 價有機基,或末端具有乙烯性碳-碳雙鍵之碳數2〜10之1 價有機基)取代之含氟烴基。 可具有醯胺鍵或脲鍵之碳數1〜40之含氟烴基、或可 具有醯胺鍵、碳酸酯鍵、胺基甲酸酯鍵或脲鍵之碳數 2〜100之具有醚鍵之含氟烴基中,該含氟烴基之碳數之上 限較佳爲30,更佳爲20,特佳爲10 »In the above structural unit L2, Rf is, for example, -(CF(CF3)CQ2-0)nT (Q is the same or different, represents Η or F. T system -CH20-(C0)-CF = CH2, or ·CONH-R23- Si(OR2.)(OR21)(OR22)(R2(), R21 and R22 are the same or different and are an alkyl group having 1 to 5 carbon atoms. Part or all of the R23 hydrogen atom may be replaced by a fluorine atom. One of the preferred forms of the alkyl group having a carbon number of from 1 to 39. Further, another preferred specific example of the structural unit L1 is derived from the formula (L3): [39] - fCF wide CF^ - 丨 (L3) Ο - R f (wherein, the Rf system and the formula (L) The structural unit L3 of the fluorine-containing ethylenic monomer represented by the same). This structural unit L3 has a low refractive index and is excellent in adhesion to various substrates -48 to 201229151, and is excellent in adhesion durability, and has good copolymerizability with other fluorine-containing vinyl monomers. Therefore, it is better. Further, it is preferable because not only the near-infrared transparency but also the refractive index can be lowered. The Rf contained in the above structural units L, L1, L2, and L3 may have a fluorine-containing hydrocarbon group having a carbon number of 1 to 40, or may have a guanamine bond, a carbonate bond, or an amine, as described above. a fluorocarbon group having an ether bond of 2 to 100 carbon atoms in a urethane bond or a urea bond, and 1 to 3 at the end of the structure is Y (the terminal of the Y system contains at least one hydrolyzable metal alkane having 1 to 50 carbon atoms) A fluorine-containing hydrocarbon group substituted with a monovalent organic group at the oxide site or a monovalent organic group having a carbon number of 2 to 10 at the terminal having an ethylenic carbon-carbon double bond. a fluorine-containing hydrocarbon group having 1 to 40 carbon atoms which may have a guanamine bond or a urea bond, or an ether bond having a carbon number of 2 to 100 which may have a guanamine bond, a carbonate bond, a urethane bond or a urea bond In the fluorine-containing hydrocarbon group, the upper limit of the carbon number of the fluorine-containing hydrocarbon group is preferably 30, more preferably 20, and particularly preferably 10 »

Rf可爲RfC可具有醯胺鍵或脲鍵之碳數1〜40之含 氟烴基、或可具有醯胺鍵、碳酸酯鍵、胺基甲酸酯鍵或脲 鍵之碳數2〜100之具有醚鍵之含氟烴基,結構末端之1〜3 處被Y1(Y1係末端至少含有1個碳數1〜50之水解性金屬 烷氧化物部位的1價有機基)取代之含氟烴基)或Rf2 (可具有醯胺鍵或脲鍵之碳數1〜40之含氟烴基、或可具 有醯胺鍵、碳酸酯鍵、胺基甲酸酯鍵或脲鍵之碳數2〜100 之具有醚鍵之含氟烴基,結構末端之1〜3處被Y2(Y2係 末端含有乙烯性碳-碳雙鍵之碳數2〜10之1價有機基) 取代之含氟烴基)或Rf3(可具有醯胺鍵或脲鍵之碳數 -49- 201229151 1〜4 0之含氟烴基、或可具有醯胺鍵、碳酸酯鍵、胺基甲酸 酯鍵或脲鍵之碳數2〜100之具有醚鍵之含氟烴基,結構末 端之1~3處被Y1取代,結構末端之1〜2處被Y2取代之含 氟烴基)。從製造之容易度,Rf較佳爲Rf1或Rf2。 上述Rf係Rf1 (可具有醯胺鍵或脲鍵之碳數1〜40之 含氟烴基、或可具有醯胺鍵、碳酸酯鍵、胺基甲酸酯鍵或 脲鍵之碳數2〜100之具有醚鍵之含氟烴基,結構末端之 1〜3處被Y 1 ( Y 1係末端至少含有1個碳數1 ~5 0之水解性 金屬烷氧化物部位的1價有機基)取代之含氟烴基)爲 較佳形態之一。上述結構單位L之Rf爲Rf1的結構單位 ,以下稱爲結構單位Μ。此外,結構單位L 1、L2及L3中 ,Rf爲Rf1的結構單位,以下分別稱爲結構單位ΜΙ、M2 及M3。上述Rf1中,碳數1〜50之水解性金屬烷氧化物, 具有產生水解•聚合縮合反應的功能,因此,化合物(A )例如爲Si-Ο化合物時等,由化合物(A)形成SiOx時 ,與該SiOx交聯,可形成耐熱性、透明性、及可撓性優 異的絕緣膜。 較佳之Rf1例如有,式(Rf1 ): -D-Ry ( Rf1 ) [式中,-D-係式(D ): [化 40] -(O-RK 或—R-0&gt;-n (D) (式中,η係1 ~20之整數;R係氫氫原子之至少1個被氟 原子取代之碳數1~5之2價含氟伸烷基,η爲2以上時, -50- 201229151 可相同或相異)表示之含氟醚的單位;Ry係可具有醯胺 鍵或脲鍵,氫原子之一部份或全部可被氟原子取代之碳數 1~39之烴基,或可具有醯胺鍵、碳酸酯鍵、胺基甲酸酯鍵 或脲鍵,氫原子之一部份或全部可被氟原子取代之碳數 2〜99之具有醚鍵的烴基,結構末端之1〜3處被Y1 ( Y1係 與上述Rf1中之Y1相同)取代之烴基]表示之含氟烴基較 佳。 -R-係碳數1~5之2價含氟伸烷基,且具有至少1個 氟原子者,因此相較於以往具有不含氟之伸烷基者或具有 伸烷醚單位者,可使化合物之粘性更低粘性化,且有助於 提高耐熱性、折射率降低、提高對汎用溶劑之溶解性等。 -D-具體而言,例如有-(〇CF2CF2CF2 )-、-( CF2CF2CF2O ) - ' - ( OCFQ^Fz ) ( OCF2CFQ1 )- &gt; - (OCFQ2 ) -、- ( CFQ20 ) -、- ( 〇CH2CF2CF2 )-、-( OCF2CF2CH2 ) ( OCH2CH2CF2 ) ( OCF2CH2CH2 )(OCF2CF2CF2CF2 ) ( CFQ1CF2〇 )( CFQ'CH20 ) -、- ( CF2CF2CF2CF20 ) -、- ( 0CFQ2CH2 )-、-(CH2CFQ20) - ' - ( OCH ( CH3 ) CF2CF2 ) -、- ( CF ( cf3 ) CF2〇 ) -、- ( 〇CF2CF2CH ( ch3 ) ) -、- ( 〇cq32)-及-(CQ32〇 ) - ( Q1、Q2 係相同或相異,H、F 或 CF3 ; Q3 係CF3 )等,-D-較佳爲此等之1種或2種以上之重複單位 〇 其中-D-較佳爲選自-(OCFC^CFz) -、·( OCF2CF2CF2 )(OCH2CF2CF2 ) - ' - ( OCFQ2 ) - ' - ( OCQ32 )-、- -51 - 201229151 (CFQ'CFzO ) - ' - ( cfq'ch2〇 ) -、- ( CF2CF2CF20 )-、-(CH2CF2CF20 ) -、- ( cfq2o)-及-(cq32o) - ( Q1、 Q2係相同或相異,H、F或CF3; Q3係CF3)之1種或2 種以上之重複單位,更佳爲選自-(OCFQkFi)-、-( OCF2CF2CF2 ) - ' - ( OCH2CF2CF2 ) -、- ( CFC^CFzO )-、-(cfq'ch2o ) - ' - ( cf2cf2cf2o )-及-(CH2CF2CF20 )-(Q1係Η、F或CF3 )之1種或2種以上之重複單位, 更佳爲選自-(OCFC^CFz) -、- ( OCF2CF2CF2 ) ·、-( CFQ'CF2〇 ) -、- ( CFQ 1 CH20 )-及-(C F 2 C F 2 C F 2 Ο ) - ( Q1 係、H、F或CF3 )之1種或2種以上之重複單位。又,上 述Q1較佳爲CF3。其中-D-特佳爲- (CF(CF3)CF20)-、-(CF ( CF3 ) CH20 )-。 但是上述之含氟醚單位-D-中及前述Rf1中,不含以-〇〇-(具體而言,-R-O-O-R-、-0-0-R-及- R-0-0-等)表示 之結構單位。 式(Rf1 )中之Ry,更具體而言,較佳爲式(Ry ): -Ry1 ( Ry ) [式中,Ry1係式(Ry1 ): -(RU)q-(A)p-R12-(Yla)m ( Ry1 ) (式中,q係〇或l;p係〇或l;m係1〜3之整數;R11 係氫原子之一部份或全部可被氟原子取代之碳數1〜5之2 價烴基;A 係-〇·、-CONH…-O-COO-、-0-C0NH-或-NH-CONH- : R12係氫原子之一部份或全部可被氟原子取代之 碳數1〜3 8之2〜4價烴基、或氫原子之一部份或全部可被 -52- 201229151 氟原子取代之碳數2-98之具有醚鍵之2~4價烴基(但是 R12爲氫原子之一部份或全部可被氟原子取代之碳數1〜3 8 之2~4價烴基時,A係-CONH-或-NH-CONH-) ; 丫13係式 -[M1O(R29)a(R30)b(R31)c(R32)d]n-M2(R33)e(R34)f(R35)g(R36)h(R37)i (式中,Μ1及Μ2係相同或相異,爲2~6價之金屬原子; a、b、c及d係0或1,且a + b + C + d + 2相當於金屬原子Μ1 之價數;e、f、g、h及i係〇或1,e + f+g + h + i+l相當於 金屬原子 M2 之價數;R29、RW、R31、R32、R33、r34、 R35、R36及R37係相同或相異,式〇R38或R38 (式中, R3 8係氫原子、或氫原子之一部或全部可被氟原子取代之 碳數1〜10之烴基)表示之有機基,且r29、R30、r31、 R32、R33、r34、r35、r36 及 r37 之至少—個爲 〇r38 ; n = 之整數)表示之官能基)表示之有機_無機複合基] 表示之基團較佳。 結構單位Μ爲結構單位M2時,上述較佳爲_Ryl 〇 式(Ry1)中之- R12 -之具體例,例如有下述者。 -53- 201229151 [化 41] CF3Rf may be a fluorine-containing hydrocarbon group having a carbon number of 1 to 40 in which the RfC may have a guanamine bond or a urea bond, or a carbon number of 2 to 100 which may have a guanamine bond, a carbonate bond, a urethane bond or a urea bond. a fluorine-containing hydrocarbon group having an ether bond, and a fluorine-containing hydrocarbon group substituted at 1 to 3 of the terminal of the structure by Y1 (a monovalent organic group having at least one hydrolyzable metal alkoxide moiety having 1 to 50 carbon atoms at the terminal of the Y1 system) Or Rf2 (a fluorine-containing hydrocarbon group having a carbon number of 1 to 40 which may have a guanamine bond or a urea bond, or a carbon number of 2 to 100 which may have a guanamine bond, a carbonate bond, a urethane bond or a urea bond) a fluorine-containing hydrocarbon group of an ether bond, wherein 1 to 3 of the terminal of the structure is substituted by Y2 (a fluorine-containing hydrocarbon group substituted with a carbonic acid carbon-carbon double bond at the terminal end of the ethylene group having 2 to 10 carbon atoms) or Rf3 (may be a carbon number having a guanamine bond or a urea bond of -49 to 201229151 1 to 40, or a carbon number of 2 to 100 which may have a guanamine bond, a carbonate bond, a urethane bond or a urea bond A fluorine-containing hydrocarbon group having an ether bond, wherein 1 to 3 of the terminal of the structure is substituted by Y1, and a fluorine-containing hydrocarbon group substituted by Y2 at the end of the structure is 1 to 2. From the ease of manufacture, Rf is preferably Rf1 or Rf2. The above Rf-based Rf1 (a fluorine-containing hydrocarbon group having a carbon number of 1 to 40 which may have a guanamine bond or a urea bond, or a carbon number of 2 to 100 which may have a guanamine bond, a carbonate bond, a urethane bond or a urea bond) The fluorine-containing hydrocarbon group having an ether bond is substituted at 1 to 3 of the terminal of the structure by Y 1 (the Y 1 -terminal terminal contains at least one monovalent organic group having a hydrolyzable metal alkoxide moiety having 1 to 50 carbon atoms) A fluorine-containing hydrocarbon group is one of preferred forms. The Rf of the above structural unit L is a structural unit of Rf1, hereinafter referred to as a structural unit Μ. Further, among the structural units L 1 , L2 and L3 , Rf is a structural unit of Rf1, and hereinafter referred to as structural units ΜΙ, M2 and M3, respectively. In the above Rf1, the hydrolyzable metal alkoxide having a carbon number of 1 to 50 has a function of generating a hydrolysis/polymerization condensation reaction. Therefore, when the compound (A) is, for example, a Si-tellurium compound, when the compound (A) is formed into SiOx, By crosslinking with this SiOx, an insulating film excellent in heat resistance, transparency, and flexibility can be formed. Preferably, Rf1 is, for example, a formula (Rf1): -D-Ry (Rf1) [wherein, -D-system (D): [40] - (O-RK or -R-0&gt;-n (D (wherein η is an integer of 1 to 20; at least one of the R-based hydrogen-hydrogen atoms is substituted by a fluorine atom, and the divalent fluorine-containing alkyl group having 1 to 5 carbon atoms, and η is 2 or more, -50- 201229151 may be the same or different) expressed as a unit of a fluorine-containing ether; Ry may have a mercapto bond or a urea bond, and a part or all of a hydrogen atom may be substituted with a fluorine atom to have a hydrocarbon group of 1 to 39 carbon atoms, or a hydrocarbon group having an ether bond having a decyl bond, a carbonate bond, a urethane bond or a urea bond, a part or all of a hydrogen atom which may be substituted by a fluorine atom, and having a carbon number of 2 to 99, at the end of the structure 1~ The fluorine-containing hydrocarbon group represented by the hydrocarbon group substituted by Y1 (the Y1 is the same as the Y1 in the above Rf1) is preferred. The -R- is a divalent fluorine-containing alkyl group having 1 to 5 carbon atoms and has at least one Since the fluorine atom is used, the viscosity of the compound is lower and the viscosity is lower than that of the conventional one having a fluorine-free alkylene group or an alkylene ether unit, and the heat resistance, the refractive index decrease, and the improvement are improved. Solubility of general solvents, etc. -D- For example, -(〇CF2CF2CF2 )-, -( CF2CF2CF2O ) - ' - ( OCFQ^Fz ) ( OCF2CFQ1 )- &gt; - (OCFQ2 ) -, - ( CFQ20 ) -, - ( 〇CH2CF2CF2 )-, -( OCF2CF2CH2 ) ( OCH2CH2CF2 ) ( OCF2CH2CH2 ) ( OCF2CF2CF2CF2 ) ( CFQ1CF2〇 ) ( CFQ 'CH20 ) -, - ( CF2CF2CF2CF20 ) -, - ( 0CFQ2CH2 )-, -(CH2CFQ20) - ' - ( OCH ( CH3 ) CF2CF2 ) -, - ( CF ( cf3 ) CF2〇) -, - ( 〇 CF2CF2CH ( ch3 ) ) -, - ( 〇cq32)- and - (CQ32〇) - ( Q1, Q2 are the same or different, H, F or CF3; Q3 is a CF3) or the like, and -D- is preferably one or more repeating units of the above, wherein -D- is preferably selected from -(OCFC^CFz)-, (OCF2CF2CF2) (OCH2CF2CF2) ) - ' - ( OCFQ2 ) - ' - ( OCQ32 )-, - -51 - 201229151 (CFQ'CFzO ) - ' - ( cfq'ch2〇) -, - ( CF2CF2CF20 )-, -(CH2CF2CF20 ) -, - ( Cfq2o)- and -(cq32o) - (Q1, Q2 are the same or different, H, F or CF3; Q3 is CF3) One or more repeating units, more preferably selected from -(OCFQkFi)- , -( OCF2CF2CF2 ) - ' - ( OCH2CF2CF2 ) -, - ( CFC^CFzO )-, -(cfq'ch2o ) - ' - ( cf2cf2cf2o )- and -(CH2CF2CF20 )-(Q1 One or more repeating units of hydrazine, F or CF3), more preferably selected from -(OCFC^CFz) -, -( OCF2CF2CF2 ) ·, -( CFQ'CF2〇) -, - ( CFQ 1 CH20 -- and -(CF 2 CF 2 CF 2 Ο ) - (Q1 system, H, F or CF3) One or more repeating units. Further, the above Q1 is preferably CF3. Wherein -D-te is -(CF(CF3)CF20)-, -(CF(CF3)CH20)-. However, the above-mentioned fluorine-containing ether unit -D- and the aforementioned Rf1 are not represented by -〇〇- (specifically, -ROOR-, -0-0-R-, and -R-0-0-, etc.) The structural unit. Ry in the formula (Rf1), more specifically, preferably the formula (Ry): -Ry1 (Ry) [wherein, Ry1 is a formula (Ry1): -(RU)q-(A)p-R12- (Yla)m ( Ry1 ) (wherein q is 〇 or l; p is 〇 or l; m is an integer from 1 to 3; R11 is a carbon atom which is partially or wholly replaced by a fluorine atom. ~5 of 2 valent hydrocarbon group; A system - 〇 ·, -CONH...-O-COO-, -0-C0NH- or -NH-CONH-: part or all of the R12 hydrogen atom may be replaced by a fluorine atom a 2 to 4 valent hydrocarbon group having a carbon number of 1 to 3 8 to 4 or 4 or a part or all of a hydrogen atom which may be substituted by a -52-201229151 fluorine atom and having a carbon number of 2 to 98 and having an ether bond (but R12) When a part or all of a hydrogen atom is substituted by a fluorine atom and a carbon number of 1 to 3 8 to 4 is a hydrocarbon group, the A system is -CONH- or -NH-CONH-); 丫13 is a formula - [M1O ( R29)a(R30)b(R31)c(R32)d]n-M2(R33)e(R34)f(R35)g(R36)h(R37)i (wherein Μ1 and Μ2 are the same or phase Different, is a metal atom of 2 to 6; a, b, c, and d are 0 or 1, and a + b + C + d + 2 is equivalent to the valence of the metal atom ;1; e, f, g, h and i system 〇 or 1, e + f + g + h + i + l corresponds to the valence of the metal atom M2; R29, RW, R31, R3 2. R33, r34, R35, R36 and R37 are the same or different, and have the formula R38 or R38 (wherein R3 8 is a hydrogen atom, or a carbon number of one or all of the hydrogen atoms may be replaced by a fluorine atom 1~ The hydrocarbon group represented by 10) and the at least one of r29, R30, r31, R32, R33, r34, r35, r36 and r37 are 〇r38; the functional group represented by n = an integer) The group represented by the composite group is preferred. When the structural unit Μ is the structural unit M2, the above-mentioned preferable example of _Ryl - (Ry1) - R12 - is, for example, the following. -53- 201229151 [Chem. 41] CF3

I F2)nriCH2-)-n » —(C F 2 C F)-;„-(CH2^)-5-» -(CH2CF2)Tn^CH2)Tp, CF3I F2) nriCH2-)-n » —(C F 2 C F)-;„-(CH2^)-5-» -(CH2CF2)Tn^CH2)Tp, CF3

I -{CH2&gt;-n C- (以上、m : 0〜1 0、n : 0〜5、m+n=l〜1I -{CH2&gt;-n C- (above, m: 0~1 0, n: 0~5, m+n=l~1

I CF3 cf3I CF3 cf3

I -4CF2CF2fHCF2CFhr4CH2h-, -(CF2CF2h-(CH2CF2)1H-fCH2&gt;ir, CF3 cf3I -4CF2CF2fHCF2CFhr4CH2h-, -(CF2CF2h-(CH2CF2)1H-fCH2&gt;ir, CF3 cf3

I II I

-(:CF2hrC- . -(CH2CF2h-eCF2CF&gt;5r-(CH2&gt;ir&gt; I cf3 (以上、l:l〜10、m:l〜10、n:0〜5〉 -4CFCF2〇MCF2〇MCX3,2CF2CF2〇MCX32MCF)t(CH2)t X33 或 -&lt;CF2CF〇MCF2〇MCF2CF2CX312〇hCF2(CFMCH2^ X30 χ33 (以上、X3。、X33係 F或 CF3;XH、χ32 係11或1?: o + P + Q係 1 〜30:r係0 或 1;S、t 係0 或 1) 2-所成 ΠΑ族 有B、 IVB族 -R12-較佳爲例如選自-(CH2 ) 3 -、及·( CH2 ) 群之至少1種。-(:CF2hrC-. -(CH2CF2h-eCF2CF&gt;5r-(CH2&gt;ir&gt; I cf3 (above, l:l~10, m:l~10, n:0~5> -4CFCF2〇MCF2〇MCX3,2CF2CF2 〇MCX32MCF)t(CH2)t X33 or -&lt;CF2CF〇MCF2〇MCF2CF2CX312〇hCF2(CFMCH2^ X30 χ33 (above, X3., X33 F or CF3; XH, χ32 system 11 or 1?: o + P + Q series 1 to 30: r is 0 or 1; S, t is 0 or 1) 2- is formed by a group of B, and group IVB - R12 - is preferably selected, for example, from -(CH2) 3 -, and CH2) At least one of the groups.

Yla中之金屬M1及M2,其中IB族例如有&amp; ; 例如有Ca、Sr、Ba ; ΠΒ族例如有zn ; liIA族例如 Al、Ga ; IIIB族例如有γ ; IVA族例如有Si、Ge ; -54- 201229151 例如有P b ; V A族例如有p、s b ; v B族例如有v ' T a ; VIB族例如有w ;鑭族元素例如有[a ' Nd。 特別是Y1 a ’其中IV A族中,較佳爲s i,特別是_ Si(OCH3)3、-Si(OC2H5)3、-SiCH3(〇C2H5)2 等在水解•聚合 縮合後’與具有羥基之基材之良好的密著性及密著耐久性 的觀點’較佳,此外,-[Si〇(〇CH3)2]n-Si(OCH3)3、_ [SiO(OC2H5)2]n-Si(OC2H5)3(n 係 1〜11 之整數)等在水解 •聚合縮合後,與具有羥基之基材之良好的密著性及密著 耐久性外,提高表面硬度的觀點,較佳。 此等當中,Yla特佳爲選自-Si(OCH3)3、-Si(OC2H5)3 、及- SiCH3(OC2H5)2所成群之至少1種。 IVA族以外之金屬的具體例,Yla例如 ΠΑ 族爲 Ca: -Ca(OR39),較佳具體例爲-Ca(OCH3); IIB 族爲 Zn : -Zn(OR39),較佳具體例爲-Zn(OC2H5); ΠΙΑ 族爲 B: -B(OR39)2,較佳具體例爲- B(OCH3)2; ΠΙΒ 族爲 Y : -Y(OR39)2,較佳具體例爲- y(〇c4h9)2 ; IVB 族爲 Pb : -Pb(OR39)3,較佳具體例爲- Pb(OC4H9)3Metals M1 and M2 in Yla, wherein IB group has, for example, &amp;; for example, Ca, Sr, Ba; lanthanum such as zn; liIA group such as Al, Ga; group IIIB, for example, γ; group IVA, for example, Si, Ge -54- 201229151 For example, there is P b ; the VA group has, for example, p, sb; the v group B has, for example, v 'T a ; the VIB group has, for example, w; the lanthanum element has, for example, [a ' Nd. In particular, Y1 a 'wherein Group IV A, preferably si, especially _Si(OCH3)3, -Si(OC2H5)3, -SiCH3(〇C2H5)2, etc. after hydrolysis, polymerization condensation, and having a hydroxyl group The viewpoint of good adhesion and adhesion durability of the substrate is preferable, and -[Si〇(〇CH3)2]n-Si(OCH3)3, _[SiO(OC2H5)2]n- Si (OC2H5) 3 (integral of n-number 1 to 11) is preferably a viewpoint of improving surface hardness in addition to good adhesion and adhesion durability to a substrate having a hydroxyl group after hydrolysis, polymerization and condensation. Among these, Yla is preferably at least one selected from the group consisting of -Si(OCH3)3, -Si(OC2H5)3, and -SiCH3(OC2H5)2. Specific examples of the metal other than the IVA group, Yla such as lanthanum is Ca: -Ca(OR39), preferably a specific example is -Ca(OCH3); Group IIB is Zn:-Zn(OR39), and a preferred specific example is - Zn(OC2H5); ΠΙΑ family is B: -B(OR39)2, preferably a specific example is -B(OCH3)2; ΠΙΒ family is Y: -Y(OR39)2, preferably a specific example is -y(〇 C4h9)2; IVB family is Pb: -Pb(OR39)3, preferably a specific example is - Pb(OC4H9)3

I VB 族爲 Ta: -Ta(OR39)4’ 較佳具體例爲-Ta(OC3H7)4 VIB 族爲 W ·· -W(OR39)5,較佳具體例爲-w(oc2h5)5 鑭族元素爲La : -La(OR39)2 ’較佳具體例爲·Ι^(0(:3Η7)2 (式中,R39係氫原子之一部或全部可被氟原子取代之碳 -55- 201229151 數1〜1 0之烴基)等。 此等各種金屬不限於相同者,也可組合不同種者。 結構單位Μ較佳爲結構單位Μ 1,而結構單位Μ 1更 佳爲結構單位M2或結構單位M3。其中,-Rf1以- D- Ry表 示時,式(2-2 ): [化 42] -(CX*X2-CX3) - (2-2) (CX4XS) a (0=0) b (〇) c —D —Ry (式中,χΐ、X2、X3、X4 ' X5、D、Ry、a、b 及 c 係與式 (L )或式(Rf1 )相同)表示之結構單位,從與基材之密 著耐久性、更低粘性化或耐熱性優異的觀點,較佳。 具體而言,式(2-2)之結構單位Ml較佳爲 -56 - 201229151 [化 43] -(CF2CF)- I D-Ry (CH2CF)-I VB is Ta: -Ta(OR39)4'. A preferred specific example is -Ta(OC3H7)4 VIB is W ·· -W(OR39)5, and a preferred example is -w(oc2h5)5 A preferred example of the element La: -La(OR39)2' is Ι^(0(:3Η7)2 (wherein, one or all of the hydrogen atoms of the R39-based hydrogen atom may be replaced by a fluorine atom-55-201229151 The number of the various metals is not limited to the same, and different types may be combined. The structural unit Μ is preferably the structural unit Μ 1, and the structural unit Μ 1 is more preferably the structural unit M2 or the structure. In the unit M3, where -Rf1 is represented by -D-Ry, the formula (2-2): [Chem. 42] - (CX*X2-CX3) - (2-2) (CX4XS) a (0=0) b (〇) c — D — Ry (wherein χΐ, X2, X3, X4 'X5, D, Ry, a, b, and c are the same as the formula (L) or (Rf1)), and It is preferable from the viewpoint of excellent adhesion durability, lower viscosity, and heat resistance of the substrate. Specifically, the structural unit M1 of the formula (2-2) is preferably -56 - 201229151 [Chem. 43] - ( CF2CF)- I D-Ry (CH2CF)-

I CF2-D-RyI CF2-D-Ry

(CF,CF)-I CFZ-D-Ry(CF,CF)-I CFZ-D-Ry

-(CH2CH)-I CH2 — D — Ry -(CH2CH)-! D-Ry -(CH2CF)--(CH2CH)-I CH2 — D — Ry -(CH2CH)-! D-Ry -(CH2CF)-

I CF20-D-Ry 、一(CF2CF) -I CF20-D-Ry, one (CF2CF) -

I 0 —D-R y -(CF2CF)-I 0 —D-R y —(CF2CF)-

I CF20-D-Ry (CH2CH)-I CF20-D-Ry (CH2CH)-

I CI-I20-D-RyI CI-I20-D-Ry

v - (CHZCH)-I O-D-R y (CF,CF) CFiCFj — D — Ryv - (CHZCH)-I O-D-R y (CF,CF) CFiCFj — D — Ry

&lt;CF2CF)-I CH2-D-Ry&lt;CF2CF)-I CH2-D-Ry

&gt; -(CH2CH)-I&gt; -(CH2CH)-I

CF2-D -Ry -(CH,CF)- 、一(CH2CH〉一 CH, -(CH2C) - CO~D — R yCF2-D -Ry -(CH,CF)- , one (CH2CH>-CH, -(CH2C) - CO~D - R y

II o C 0 — D — R yII o C 0 — D — R y

II o CO-D-RyII o CO-D-Ry

IIII

O (CH,CF) (CH2CH) C-D-Ry IIo C — D — R y IIoO (CH,CF) (CH2CH) C-D-Ry IIo C — D — R y IIo

ch3 -(CHjC)- I C-D-Ry II O cf3Ch3 -(CHjC)- I C-D-Ry II O cf3

I -(CH,C)- C-D-RyI -(CH,C)- C-D-Ry

IIII

O cf3O cf3

I (CHjC)- CO-D-RyI (CHjC)- CO-D-Ry

II O 等 其中式(2-2)之結構單位係式(2 -57- 201229151 [化 44] -(CXlX2-CX3) - (2-3) (CX4X5) a (O) C-D-RyII O, etc. The structural unit formula of the formula (2-2) (2 -57- 201229151 [Chemical 44] -(CXlX2-CX3) - (2-3) (CX4X5) a (O) C-D-Ry

(式中,X1、X2、X3、X4、X5、D、Ry、a 及 c 係與式(L )或式(Rf1 )相同)表示之結構單位,從耐熱性及耐藥 品性優異的觀點,較佳。 式(2-3 )之結構單位更具體而言,較佳爲 [化 45] -(CH2CF)- , | -(CF2CF)- 、 I CF2 — D — Ry 1 D —R y -(CFZCF)- 、 -(CH2CH) - 、_ (CH2CH)-、 | | 1 CF2-D — Ry CH2-D-Ry D-Ry -(CH2CF)- 、一(CF2CF) — 、 | | CF20-D-Ry 〇—D—Ry 一(CF2CF) - 、一(CH2CH〉一 、 - (CH2CH)-| | CF20-D-Ry CH20 — D—Ry O-D-Ry 等,其中特別是 [化 46] -(CH2CF)- 1 、一(CF2CF〉一 、 I CF2-D-Ry 1 D-Ry -(CH2CF)- 、一(CF2CF)- CF2〇-D-Ry O-D-Ry 之結構單位,在耐熱性及耐藥品性方面更佳。 上述Rf爲Rf2時也爲較佳形態之一。Y2中之碳-碳雙 -58- 201229151 鍵具有產生聚合縮合反應等的能力,可提供硬化(交聯) 體者。詳細而言,例如藉由自由基或陽離子之接觸,在含 氟聚合物分子間或化合物(A )與必要時添加之硬化(交 聯)劑之間,產生聚合合反応或縮合反應,也可提供硬化 (交聯)物者。 上述結構單位L之Rf爲Rf2 (可具有醯胺鍵或脲鍵之 碳數1〜4 0之含氟烴基、或可具有醯胺鍵、碳酸酯鍵、胺 基甲酸酯鍵或脲鍵之碳數2〜100之具有醚鍵的含氟烴基, 結構末端之1〜3處被Y2 ( Y2係末端具有乙烯性碳-碳雙鍵 之碳數2〜10之1價有機基)取代之含氟烴基)的結構單 位,以下也稱爲結構單位N。又,結構單位L1、L2、及 L3中,Rf爲Rf2的結構單位分別稱爲結構單位Nl、N2、 及N3。 較佳之Rf2,例如有式(Rf2 ): -D-Ry2 ( Rf2 ) [式中,-D-係與式(Rf1 )相同》Ry2係可具有醯胺鍵或脲 鍵,氫原子之一部份或全部可被氟原子取代之碳數1〜39 之烴基,或可具有醯胺鍵、碳酸酯鍵、胺基甲酸酯鍵或脲 鍵,氫原子之一部份或全部可被氟原子取代之碳數2〜9 9 之具有醚鍵的烴基,結構末端之丨〜3處被γ2 ( Y2係與上 述Rf2中之Y2相同)取代之烴基]取代之烴基]表示之含氟 烴基較佳。-D-Ry2之較佳形態,例如有上述-D-Ry例示之 較佳形態中,將Ry變更爲Ry2者。 較佳之Y2之第1係 -59- 201229151 [化 47] —(-04—a~~( C =〇 &gt;- e γ2« (式中,Y2a係末端具有乙烯性碳-碳雙鍵之碳數2〜5之烯 基或含氣嫌基;d及e係相同或相異’爲〇或1)。 較佳之Y2a係 -CX6=CX7X8 (式中,X6係H、F、CH3或CF3; X7及X8係相同或相異 ,爲Η或F),此基團係藉由自由基或陽離子接觸所造成 之硬化反應性高,故爲較佳者。 較佳之Y2a的具體例有 [化 48] CH3(wherein, X1, X2, X3, X4, X5, D, Ry, a and c are the same structural units as those of the formula (L) or the formula (Rf1)), and from the viewpoint of excellent heat resistance and chemical resistance, Preferably. More specifically, the structural unit of the formula (2-3) is preferably [Chem. 45] -(CH2CF)-, | -(CF2CF)-, I CF2 - D - Ry 1 D - R y -(CFZCF)- , -(CH2CH) - , _ (CH2CH)-, | | 1 CF2-D — Ry CH2-D-Ry D-Ry -(CH2CF)- , one (CF2CF) — , | | CF20-D-Ry 〇— D-Ry-(CF2CF)-, one (CH2CH>-, -(CH2CH)-| | CF20-D-Ry CH20-D-Ry OD-Ry, etc., especially [Chem. 46] -(CH2CF)-1 , a structural unit of (CF2CF>I, I CF2-D-Ry 1 D-Ry -(CH2CF)-, one (CF2CF)-CF2〇-D-Ry OD-Ry, in terms of heat resistance and chemical resistance Preferably, when Rf is Rf2, the carbon-carbon bis-58-201229151 bond in Y2 has the ability to generate a polymerization condensation reaction or the like, and can provide a hardened (crosslinked) body. For example, by contact of a radical or a cation, a polymerization reaction or a condensation reaction may be generated between the fluoropolymer molecules or the compound (A) and, if necessary, a hardening (crosslinking) agent, which may also provide hardening (crossing). The above structural unit L has an Rf of Rf2 (may have a guanamine bond or a urea bond) a fluorine-containing hydrocarbon group having 1 to 40 carbon atoms, or a fluorine-containing hydrocarbon group having an ether bond of 2 to 100 carbon atoms which may have a guanamine bond, a carbonate bond, a urethane bond or a urea bond, and a terminal of the structure ~3 structural units of a fluorine-containing hydrocarbon group substituted by Y2 (a fluorine-containing hydrocarbon group substituted with a carbon number of 2 to 10 of an ethylene carbon-carbon double bond at the end of the Y2 system), hereinafter also referred to as a structural unit N. Further, the structure In the units L1, L2, and L3, the structural units in which Rf is Rf2 are respectively referred to as structural units N1, N2, and N3. Preferably, Rf2, for example, has the formula (Rf2): -D-Ry2 (Rf2) [wherein, - The D-line is the same as the formula (Rf1). The Ry2 system may have a guanamine bond or a urea bond, and a part or all of a hydrogen atom may be substituted with a fluorine atom to have a hydrocarbon group having 1 to 39 carbon atoms, or may have a guanamine bond. a carbonate bond, a urethane bond or a urea bond, a hydrocarbon group having a carbon number of 2 to 9 9 or a part of a hydrogen atom which may be substituted by a fluorine atom, and a 末端 2 at the end of the structure is γ 2 (The Y2 is the same as the Y2 in the above Rf2), and the substituted hydrocarbyl group is preferably a fluorine-containing hydrocarbon group. The preferred form of the -D-Ry2 is, for example, the above-exemplified by -D-Ry. In the form, Ry is changed to Ry2. The preferred Y2 is the first system-59-201229151 [Chem. 47] - (-04-a~~( C =〇&gt;- e γ2« (wherein the Y2a end An alkenyl group having a carbon number of 2 to 5 having an ethylenic carbon-carbon double bond or a gas-containing susceptibility; d and e being the same or different 'is 〇 or 1). Preferably, Y2a is -CX6=CX7X8 (wherein X6 is H, F, CH3 or CF3; X7 and X8 are the same or different and are Η or F), and the group is caused by contact with free radicals or cations. It is preferred because it has high hardening reactivity. A specific example of a preferred Y2a is [Chem. 48] CH3

I -ch=ch2、—cf=ch2、—c=ch2、_cf=cf2 等。 更佳之Y2係 -0(C = 0)CX6 = CX7X8 (式中,X6係Η、F、CH3或CF3 ; x7及x8係相同或相異 ,爲Η或F),此基團係藉由自由基接觸所造成之硬化反 應性高,故較佳,且藉由光硬化等容易得到硬化物,故較 佳。 上述更佳之Y2之具體例’例如有 -60- 201229151 [化 49]I -ch=ch2, -cf=ch2, -c=ch2, _cf=cf2, and so on. Better Y2 series - 0 (C = 0) CX6 = CX7X8 (wherein X6 is Η, F, CH3 or CF3; x7 and x8 are the same or different, Η or F), this group is free Since the hardening reactivity by the base contact is high, it is preferable, and it is preferable to obtain a cured product by photohardening or the like. A specific example of the above-described Y2 is as follows - for example, -60 - 201229151 [Chem. 49]

CHSCHS

II

-oc —ch=ch2、一oc-c=ch2、一oc-cf=ch2、 II II II O 0 0 cf3-oc —ch=ch2, an oc-c=ch2, an oc-cf=ch2, II II II O 0 0 cf3

I -oc —c=ch2、一oc-cf=cf2I -oc —c=ch2, an oc-cf=cf2

II II o o 其他較佳之Y2之具體例有 [化 50] -ch=ch2、一ch2ch=ch2、-OCH2CH=CH2、 -och=ch2、_ocf=cf2、 -c-och=ch2、一c-och2ch=ch2、II II oo Other preferred examples of Y2 are [Chem. 50] -ch=ch2, one ch2ch=ch2, -OCH2CH=CH2, -och=ch2, _ocf=cf2, -c-och=ch2, one c-och2ch =ch2

II II 0 oII II 0 o

XX

I -ch-ch2oc-c=ch2 (x:h、f、ch3)、I -ch-ch2oc-c=ch2 (x:h, f, ch3),

1 II1 II

OH O 〇 !l -ch-ch2occx=ch2 (x:h、f、ch3)、OH O 〇 !l -ch-ch2occx=ch2 (x:h, f, ch3),

I 0CCX=CH, II ^ oI 0CCX=CH, II ^ o

-chch2och2ch=ch2 、 -CHCH2OCH2CH=CH2 I I OH OCH2CH=CH2 等。 Y2之中,具有-〇(c=o)cf=ch2之結構者,可提高近 紅外線透明性,且硬化(交聯)反應性特別高,可有效得 -61 - 201229151 到硬化物,故較佳。 前述側鏈中具有碳-碳雙鍵之有機基Y2可導入聚合物 主鏈末端。 本發明用的含氟聚合物中,結構單位N、N1、N2及 N3所含之-Rf2-(前述Rf2中去除γ2之基團)係可具有醯 胺鍵或脲鍵之碳數1〜40之2價含氟烴基、或可具有醯胺 鍵、碳酸酯鍵、胺基甲酸酯鍵或脲鍵之碳數2〜100之具有 醚鍵的含氟烴基較佳。此-Rf2-基只要是所含之碳原子上有 氟原子鍵結即可,一般爲碳原子上鍵結有氟原子與氫原子 或氯原子之2價含氟烴基、具有醚鍵之2價含氟烴基,但 是較佳爲含有更多氟原子(含氟率高)者,更佳爲全氟伸 烷基或具有醚鍵之2價全氟烴基。含氟聚合物中之含氟率 爲25質量%以上,較佳爲40質量%以上。藉此不僅可提 高含氟聚合物(B )之近紅外線透明性,且可降低折射率 ’特別是爲了提高絕緣膜之耐熱性或彈性率,即使提高硬 化度(交聯密度),也可維持較高的近紅外線透明性,或 維持低折射率性,故較佳。 -Rf2-基之碳數太大時,2價含氟烴基的情形,有時對 溶劑之溶解性會降低’或透明性會降低,而具有醚鍵之2 價含氟烴基時’會降低聚合物本身或其硬化物的硬度或機 械特性’故不佳。該2價含氟烴基之碳數較佳爲1~20,更 佳爲1~10。該具有醚鍵之2價含氟烴基的碳數較佳爲 2〜30,更佳爲2〜20。 -Rf2-之較佳的具體例,例如有 -62- 201229151 [化 51] cf3-chch2och2ch=ch2, -CHCH2OCH2CH=CH2 I I OH OCH2CH=CH2, etc. Among Y2, those having a structure of -〇(c=o)cf=ch2 can improve the near-infrared transparency and have high reactivity (hardening), and can effectively obtain -61 - 201229151 to hardened materials, so good. The organic group Y2 having a carbon-carbon double bond in the aforementioned side chain can be introduced into the end of the polymer main chain. In the fluoropolymer used in the present invention, -Rf2- contained in the structural units N, N1, N2 and N3 (the group in which γ2 is removed in the above Rf2) may have a carbon number of 1 to 40 of a guanamine bond or a urea bond. The divalent fluorine-containing hydrocarbon group or a fluorine-containing hydrocarbon group having an ether bond having a carbon number of 2 to 100 which may have a guanamine bond, a carbonate bond, a urethane bond or a urea bond is preferred. The -Rf2- group may be a fluorine atom bonded to a carbon atom contained therein, and is generally a divalent fluorine-containing hydrocarbon group having a fluorine atom bonded to a hydrogen atom or a chlorine atom at a carbon atom, and an ether bond The fluorine-containing hydrocarbon group is preferably a fluorine atom (high fluorine content), more preferably a perfluoroalkylene group or a divalent perfluoroalkyl group having an ether bond. The fluorine content in the fluoropolymer is 25% by mass or more, preferably 40% by mass or more. Thereby, not only the near-infrared transparency of the fluoropolymer (B) but also the refractive index can be lowered, in particular, in order to improve the heat resistance or the elastic modulus of the insulating film, even if the degree of hardening (crosslinking density) is increased, it can be maintained. It is preferred to have a high near-infrared transparency or to maintain a low refractive index. When the carbon number of the -Rf2- group is too large, in the case of a divalent fluorine-containing hydrocarbon group, the solubility in a solvent may be lowered or the transparency may be lowered, and in the case of a 2-valent fluorine-containing hydrocarbon group having an ether bond, the polymerization may be lowered. The hardness or mechanical properties of the object itself or its hardened material are not good. The carbon number of the divalent fluorine-containing hydrocarbon group is preferably from 1 to 20, more preferably from 1 to 10. The carbon number of the divalent fluorine-containing hydrocarbon group having an ether bond is preferably from 2 to 30, more preferably from 2 to 20. A preferred specific example of -Rf2-, for example, -62- 201229151 [Chem. 51] cf3

I -fCF^CHihr , -(CFaCF^CH^ , -fCH2CFjh^CH^, cf3I -fCF^CHihr , -(CFaCF^CH^ , -fCH2CFjh^CH^, cf3

I ~4CH2hC— (以上、m : 0〜1 0、n : 0〜5)、I ~4CH2hC— (above, m: 0~1 0, n: 0~5),

I cf3 •(C F 2 C F 2&gt;T~f C F 2 c Fhrf C H 2h-、 -fCFiCFa^CHaCFj^CH^, cf3 cf3I cf3 •(C F 2 C F 2&gt;T~f C F 2 c Fhrf C H 2h-, -fCFiCFa^CHaCFj^CH^, cf3 cf3

I I -fCF2^-C- . -fCH2CF2h-fCF2CFhr-(CH2^-,I I -fCF2^-C- . -fCH2CF2h-fCF2CFhr-(CH2^-,

I CF3 (以上、1 : 1〜10、m: 1〜10、η: 0〜5)I CF3 (above, 1: 1 to 10, m: 1 to 10, η: 0 to 5)

4CFCF2〇MCF2〇MCX3S2CF2CF20&gt;T(CX36MCFh&lt;CH2-)T X34 X37 或 -(CF2CF〇h&lt;CF20&gt;7&lt;CF2CF2CX3s20&gt;-qCF2(CFMCH2-)-r X37 X34 似上、X34、X37係F或CF3;X3S、X36係Η或F; Ο + Ρ + Q係1〜3 0 ; r係0 或 1 : s、t係 0 或 1) 等。 本發明用之構成含氟聚合物之結構單位N,較佳爲結 構單位N1,而結構單位N 1更佳爲結構單位N2或結構單 位N3。其次說明結構單位N2及結構單位N3之具體例。 構成結構單位N2之單體,其較佳具體例,例如有 -63- 201229151 [化 52] CH2=CFCF2OCF-Y2 、CH2=CFCF2OCFCH2 —Y2、4CFCF2〇MCF2〇MCX3S2CF2CF20&gt;T(CX36MCFh&lt;CH2-)T X34 X37 or -(CF2CF〇h&lt;CF20&gt;7&lt;CF2CF2CX3s20&gt;-qCF2(CFMCH2-)-r X37 X34 is similar, X34, X37 is F or CF3; X3S, X36 system or F; Ο + Ρ + Q system 1~3 0; r system 0 or 1: s, t system 0 or 1). The structural unit N constituting the fluoropolymer used in the present invention is preferably a structural unit N1, and the structural unit N 1 is more preferably a structural unit N2 or a structural unit N3. Next, specific examples of the structural unit N2 and the structural unit N3 will be described. Preferred examples of the monomer constituting the structural unit N2 are, for example, -63-201229151 [Chem. 52] CH2=CFCF2OCF-Y2, CH2=CFCF2OCFCH2-Y2.

I I cf3 cf3 ch2=cfcf2ocfch2o-y2、I I cf3 cf3 ch2=cfcf2ocfch2o-y2

I cf3 CH2=CFCF2CKCFCF20)-nCF-Y2、I cf3 CH2=CFCF2CKCFCF20)-nCF-Y2

I I cf3 cf3 CH2=CFCF20(CFCF20)7iCFCH2-Y2 、I I cf3 cf3 CH2=CFCF20(CFCF20)7iCFCH2-Y2,

I I CF3 cf3 CH2=CFCF20(CFCF20&gt;t;CFCH20CH2CHCH2-Y2,I I CF3 cf3 CH2=CFCF20(CFCF20&gt;t; CFCH20CH2CHCH2-Y2,

I I cf3 cf3 CH2 = CFCF20-(CF2CF20&gt;7,CF2-Y2 , 0H2 = CFCF2O-(CF2CF2〇HCF2CH2-Y2 , CH2 = CFCF2CHCF2CF2CF2〇hCF2CF2-Y2、 CH2 = CFCF2(MCF2CF2CF2〇)TiCF2CF2CH2 — Y2、 CH2 = CFCF2O^CH2CF2CF20)liCH2CF2-Y24 ch2=cfcf2o-&lt;ch2cf2cf2o^ch2cf2ch2-y2 « CH2=CFCF2O^CF2CF2&gt;-nY2 &gt; cf3II cf3 cf3 CH2 = CFCF20-(CF2CF20&gt;7, CF2-Y2, 0H2 = CFCF2O-(CF2CF2〇HCF2CH2-Y2, CH2 = CFCF2CHCF2CF2CF2〇hCF2CF2-Y2, CH2 = CFCF2(MCF2CF2CF2〇)TiCF2CF2CH2 — Y2, CH2 = CFCF2O^ CH2CF2CF20)liCH2CF2-Y24 ch2=cfcf2o-&lt;ch2cf2cf2o^ch2cf2ch2-y2 « CH2=CFCF2O^CF2CF2&gt;-nY2 &gt; cf3

I CH2 = CFCF20(CF2CFf-nCH2-Y2 (以上,n係1〜30之整數:Y2係與上述Rf2中之γ2相同 更詳細而言,例如有 -64 - )0 201229151 [化 53] CH2=CFCF2〇-fCFCF2〇hCFCH2OCCX=CH2 ,I CH2 = CFCF20 (CF2CFf-nCH2-Y2 (above, n is an integer from 1 to 30: Y2 is the same as γ2 in the above Rf2. More specifically, for example, -64 - ) 0 201229151 [Chem. 53] CH2=CFCF2 〇-fCFCF2〇hCFCH2OCCX=CH2 ,

1 i II cf3 cf3 o CH2=CFCF20-(CFCF20hCFCH20CH2CHCHz0CCX=CH2 ,1 i II cf3 cf3 o CH2=CFCF20-(CFCF20hCFCH20CH2CHCHz0CCX=CH2 ,

I i II cf3 cf3 o occx=ch2I i II cf3 cf3 o occx=ch2

II o CH2 = CFCF20-fCFCF20hCFCH20CH=CH2 ,II o CH2 = CFCF20-fCFCF20hCFCH20CH=CH2 ,

I I cf3 cf3 CH2=CFCF20-fCFCF20&gt;7rCFCH20CH2CH0CH=CH2 ,I I cf3 cf3 CH2=CFCF20-fCFCF20&gt;7rCFCH20CH2CH0CH=CH2 ,

I I I cf3 cf3 och=ch2 CH2=CFCF2〇4CFCF2〇hCF = CF2 &gt;I I I cf3 cf3 och=ch2 CH2=CFCF2〇4CFCF2〇hCF = CF2 &gt;

I cf3 CH2=CFCF2〇-(CFCF2〇hCFCOOCH=CH2 ,I cf3 CH2=CFCF2〇-(CFCF2〇hCFCOOCH=CH2 ,

I I cf3 cf3 CH2=CFCF2〇-(CFCF2〇hCFCH2OCH2CH=CH2 ,I I cf3 cf3 CH2=CFCF2〇-(CFCF2〇hCFCH2OCH2CH=CH2 ,

I I cf3 cf3 CH2=CFCF20-(CFCF20hCFCH20CH2CHCH20CH2CH=CH2 ,I I cf3 cf3 CH2=CFCF20-(CFCF20hCFCH20CH2CHCH20CH2CH=CH2,

I I I cf3 cf3 och2ch=ch2 /Rf7 CH2=CFCF2CKCFCF2〇hCFC ——OCCX=CH2、I I I cf3 cf3 och2ch=ch2 /Rf7 CH2=CFCF2CKCFCF2〇hCFC ——OCCX=CH2

I I \Rfe II cf3 cf3 Kt o ch2ch=ch2 CH2=CFCF204CFCF2〇h;CF-C-〇CCX=CH2I I \Rfe II cf3 cf3 Kt o ch2ch=ch2 CH2=CFCF204CFCF2〇h; CF-C-〇CCX=CH2

I I II cf3 cf3 o ch2ch==ch2 (以上,Rf7、Rf8係碳數1〜5之全氟烷基’ n係0〜30之整 數;X 係 H、CH3、F 或 CF3)等。 構成結構單位N 3之單體’其較佳具體例’例如有 -65- 201229151 [化 54] CF2 = CFOCF2CF2-Y2、CF2 = CFOCF2CF2CH2-Y2、 CF2 = CFOCF2CF2CH2OCH2CHCH2-Y2、I I II cf3 cf3 o ch2ch==ch2 (The above, Rf7, Rf8 are perfluoroalkyl groups having a carbon number of 1 to 5, n is an integer of 0 to 30; X is H, CH3, F or CF3). The preferred embodiment of the monomer constituting the structural unit N 3 is, for example, -65 - 201229151 CF2 = CFOCF2CF2-Y2, CF2 = CFOCF2CF2CH2-Y2, CF2 = CFOCF2CF2CH2OCH2CHCH2-Y2

II

Yz CF^CFO-^CF^F^Y2,Yz CF^CFO-^CF^F^Y2,

I cf3 CFj^CFCHCFaCFOhCFzCFaCHa-Y2、I cf3 CFj^CFCHCFaCFOhCFzCFaCHa-Y2

I CF3 CF2=CF〇4CF2CFO)-sCF2CF2CH2OCH2CHCHz-Y2 ,I CF3 CF2=CF〇4CF2CFO)-sCF2CF2CH2OCH2CHCHz-Y2 ,

I I cf3 y2 CF2 = CF〇4CF2^iY2 , CF2 = CF(XCF六CH2-Y2、 CF2=CFOCF2CF2OCF2-Y2, cf2=cfocf2cf2ocf2ch2-y2, cf2=cfocf2cf2ocf2ch2och2chch2-y2、I I cf3 y2 CF2 = CF〇4CF2^iY2 , CF2 = CF (XCF six CH2-Y2, CF2=CFOCF2CF2OCF2-Y2, cf2=cfocf2cf2ocf2ch2-y2, cf2=cfocf2cf2ocf2ch2och2chch2-y2

I Y2 CF2 = CFOCF2CF2CH2OCF2CF2-Y2 , CF2 = CFOCF2CF2CH2OCF2CF2CH2-Y2 (以上,Y2係與上述Rf2中之Y2相同;n係1~30之整數 )等。 更詳細而言,例如有 -66 - 201229151 [化 55] CF2=CFO(CF2CF〇MCFih;CH2OCCX = CH2,I Y2 CF2 = CFOCF2CF2CH2OCF2CF2-Y2 , CF2 = CFOCF2CF2CH2OCF2CF2CH2-Y2 (The above Y2 is the same as Y2 in the above Rf2; n is an integer from 1 to 30). In more detail, for example, -66 - 201229151 [Chemical 55] CF2=CFO (CF2CF〇MCFih; CH2OCCX = CH2,

I II cf3 〇 CF,=CFO(CF2CF〇MCF2&gt;irCH2OCH2CHCH2OCCX = CH2.I II cf3 〇 CF,=CFO(CF2CF〇MCF2&gt;irCH2OCH2CHCH2OCCX = CH2.

I II cf3 〇 occx=ch2I II cf3 〇 occx=ch2

II o CF2=CFO-(CF2CF〇MCF2^CH2OCH=CH2,II o CF2=CFO-(CF2CF〇MCF2^CH2OCH=CH2,

I cf3 CFfCFCKCFsCFOMCF^CHzOCHaCHOCHcCHuI cf3 CFfCFCKCFsCFOMCF^CHzOCHaCHOCHcCHu

I I cf3 och=ch2 CF2=CF(XCF2CFO&gt;irfCF2^COOCH=CH2vI I cf3 och=ch2 CF2=CF(XCF2CFO&gt;irfCF2^COOCH=CH2v

I cf3 CF2=CFCHCF2CF〇Hr&lt;CF2fH-CH2OCH2CH = CH2,I cf3 CF2=CFCHCF2CF〇Hr&lt;CF2fH-CH2OCH2CH = CH2,

I CF3 cf2=cfo^-cf2cf〇mcf2^ch2och2chch2och2ch=ch2,I CF3 cf2=cfo^-cf2cf〇mcf2^ch2och2chch2och2ch=ch2,

I I cf3 och2ch=ch2 R f 9 t CF2=CF〇-&lt;CF2CF〇h^CF2&gt;7C-〇CCX=CH2 , CF3 〇I I cf3 och2ch=ch2 R f 9 t CF2=CF〇-&lt;CF2CF〇h^CF2&gt;7C-〇CCX=CH2 , CF3 〇

Rf 10 CH2CH = CH2Rf 10 CH2CH = CH2

I CF2=CF〇-(CF2CFO&gt;7^CF2&gt;1rC-〇CCX=CH2I CF2=CF〇-(CF2CFO&gt;7^CF2&gt;1rC-〇CCX=CH2

I II cf3 o ch2ch=ch2 (以上,Rf9、Rf1G係碳數1〜5之全氟烷基;m係0〜30之 整數;η係1〜3之整數;X係H、CH3、F或CF3)等。 此等之結構單位N2及N3以外,構成含氟聚合物之 結構單位N之單體之較佳的具體例,例如有I II cf3 o ch2ch=ch2 (The above, Rf9, Rf1G are perfluoroalkyl groups having 1 to 5 carbon atoms; m is an integer of 0 to 30; η is an integer of 1 to 3; X is H, CH3, F or CF3 )Wait. Preferred specific examples of the monomer constituting the structural unit N of the fluoropolymer other than the structural units N2 and N3, for example,

S -67- 201229151 [化 56] CF2=CFCF2-〇-Rf2-Y2、CF2=CFCF2〇-R f2-CH2CHCH2-Y2、S -67- 201229151 CF2=CFCF2-〇-Rf2-Y2, CF2=CFCF2〇-R f2-CH2CHCH2-Y2

I Y2 CF2 = CF-R f 2-Y2, cf2 = cf-r f 2-ch2chch2-y2.I Y2 CF2 = CF-R f 2-Y2, cf2 = cf-r f 2-ch2chch2-y2.

I Y2 CH2 = CH-R f 2-Y2、CH2 = CH-R f 2-ch2chch2-y2、I Y2 CH2 = CH-R f 2-Y2, CH2 = CH-R f 2-ch2chch2-y2

I Y2 CH2 = CHO-R f 2-y2, ch2 = cho-r f 2-ch2chch2-y2 Y2 (以上,Y2及Rf2係與前述例相同)等。 更具體而言,例如有 -68- 201229151 [化 57] CF2=CFCF2OCF2CF2CF2-Y2、 CF2=CFCF2OCF2CFzCF2CH2-Y2, cf2=cfcf2ocf2cf-y2» cf2=cfcf2ocf2cfch2-y2、I Y2 CH2 = CHO-R f 2-y2, ch2 = cho-r f 2-ch2chch2-y2 Y2 (the above, Y2 and Rf2 are the same as the above examples) and the like. More specifically, for example, -68- 201229151 CF2=CFCF2OCF2CF2CF2-Y2, CF2=CFCF2OCF2CFzCF2CH2-Y2, cf2=cfcf2ocf2cf-y2»cf2=cfcf2ocf2cfch2-y2

I I cf3 cf3 cf2=cfcf2ocf2cfch2och2chch2-y2 ,I I cf3 cf3 cf2=cfcf2ocf2cfch2och2chch2-y2 ,

I I CF3 Y2 CF2=CFCF2-Y2、CF2 = CFCF2CH2-Y2、 CF2=CFCF2CH2OCHzCHCH2-Y2 . Ϋ2 CH2=CHCF2CF2CH2CH2-Y2 1 CH2=CHCF2CF2-Y2、 CH2=CHCF2CF2CH2-Y2、CH2=CHCF2CF2CF2CF2-Y2、 CH2=CHCF2CF2CF2CF2CH2-Y2、 CH2=CHCF2CF2CF2CF2CH2OCH2CHCH2-Y2 , CH2=CHOCH2CF2CF2-Y2 , CH2=CHOCH2CF2CF2CH2-Y2 (以上,Y2係與上述Rf2中之Y2相同)等。 含氟聚合物(B)更可由結構單位A所構成者。結構 單位A可爲來自可與提供以式(L)表示之結構單位L之 含氟乙烯性單體共聚合之單體的結構單位即可。結構單位 A係任意成分,可與提供結構單位L之含氟乙烯性單體共 聚合的單體時,即無特別限定,可依目的之含氟聚合物或 其硬化物之用途、要求特性等適當選擇即可。 結構單位A,例如有以下的結構單位。 (A 1 )由具有官能基之含氟乙烯性單體所衍生之結構 單位 -69- 201229151 此結構單位A1係於賦予含氟聚合物及其硬化物對基 材之密著性或對溶劑、特別是汎用溶劑之溶解性的觀點, 較佳,此外可賦予交聯性等之機能的觀點,較佳。 具有官能基之較佳之含氟乙烯性單體的結構單位A1 係式(A1 ): [化 58] —^CXUX12—CX13^— I (Al) (CX142^-Tr-^〇^i—Rf^Z1 (式中,Xn、X12及X13係相同或相異,爲H或F;X14 係Η、F、CF3 ; h係0〜2之整數;i係〇或1 ; Rf4係碳數 1〜40之2價含氟伸烷基或碳數2〜100之具有醚鍵之2價 含氟伸烷基;Z1係選自-OH、-CH2〇H、-COOH、羧酸衍生 物、-S03 Η、磺酸衍生物、環氧基及氰基所成群之官能基 )表示之結構單位,其中較佳爲 CH2 = CFCF2〇Rf4-Z1 (式中’ Rf4及Z1係與前述相同)所衍生之式(A1-1): [化 59] —eCH2-CF·)— 丨 (A1-1) CF2〇-R f 4-Z! (式中’ R f4及Z 1係與式(A 1 )相同)表示之結構單位。 更具體而言,例如有 -70- 201229151 [化 60] ch2=cfcf2ocf-z1 , ch2=cfcf2ocfcf2ocf-zII CF3 Y2 CF2=CFCF2-Y2, CF2 = CFCF2CH2-Y2, CF2=CFCF2CH2OCHzCHCH2-Y2 . Ϋ2 CH2=CHCF2CF2CH2CH2-Y2 1 CH2=CHCF2CF2-Y2, CH2=CHCF2CF2CH2-Y2, CH2=CHCF2CF2CF2CF2-Y2, CH2=CHCF2CF2CF2CF2CH2- Y2, CH2=CHCF2CF2CF2CF2CH2OCH2CHCH2-Y2, CH2=CHOCH2CF2CF2-Y2, CH2=CHOCH2CF2CF2CH2-Y2 (above, Y2 is the same as Y2 in the above Rf2) and the like. The fluoropolymer (B) can be further composed of structural unit A. The structural unit A may be a structural unit derived from a monomer copolymerizable with a fluorine-containing ethylenic monomer which provides the structural unit L represented by the formula (L). When the structural unit A is an optional component and can be copolymerized with a fluorine-containing ethylenic monomer which provides the structural unit L, it is not particularly limited, and the intended use of the fluoropolymer or the cured product thereof, the required properties, etc. Just choose it. The structural unit A has, for example, the following structural unit. (A 1 ) Structural unit derived from a fluorine-containing ethylenic monomer having a functional group - 69 - 201229151 This structural unit A1 is used to impart adhesion to a substrate to a fluoropolymer and a cured product thereof, or to a solvent, In particular, a viewpoint of solubility of a general-purpose solvent is preferred, and a viewpoint of imparting cross-linking properties or the like is preferable. Structural unit A1 of a preferred fluorine-containing ethylenic monomer having a functional group (A1): [Chem. 58] - ^ CXUX12 - CX13^ - I (Al) (CX142^-Tr-^〇^i-Rf^ Z1 (wherein Xn, X12 and X13 are the same or different and are H or F; X14 is Η, F, CF3; h is an integer of 0~2; i is 〇 or 1; Rf4 is carbon number 1~40 a divalent fluorine-containing alkyl group or a divalent fluorine-containing alkyl group having an ether bond of 2 to 100 carbon atoms; Z1 is selected from the group consisting of -OH, -CH2〇H, -COOH, a carboxylic acid derivative, -S03 Η a structural unit represented by a group of a sulfonic acid derivative, an epoxy group and a cyano group, wherein preferably CH2 = CFCF2〇Rf4-Z1 (wherein Rf4 and Z1 are the same as described above) Formula (A1-1): [Chem. 59] —eCH2-CF·)—丨(A1-1) CF2〇-R f 4-Z! (wherein R f4 and Z 1 are the same as formula (A 1 ) ) indicates the structural unit. More specifically, for example, -70- 201229151 [化60] ch2=cfcf2ocf-z1 , ch2=cfcf2ocfcf2ocf-z

I I I cf3 cf3 cf3 CH2 = CFCF204CFCF2〇hCF-Z,,I I I cf3 cf3 cf3 CH2 = CFCF204CFCF2〇hCF-Z,,

I I cf3 cf3 ch2=cfcf2och2cf2-z1 , CH^CFCFjOCHgCF^FjOCF-Z1,I I cf3 cf3 ch2=cfcf2och2cf2-z1 , CH^CFCFjOCHgCF^FjOCF-Z1,

I cf3 ch2=cfcf2ocf2cf2ocf2-z1, CH2 = CFCF204CF2CF2〇hCF2-Z1 單體所 (以上’ Z1係與式(A1 )相同)等之含氟乙烯性 衍生的結構單位較佳。 此外,較佳爲 CF2 = CFORf4-Z1 (A1-2 (式中’ Rf4及Z1係與式(A1)相同)所衍生之贫 [化 61] -f CF,-CF&gt; I O-R ίΑ-Ζι(式中,Rf4及Ζ1係與式(A1 )相同 更具體而言,例如有 (A 1 — 2) 表示之結構 單位。 -71 - 201229151 [化 62] CF2=CFOCF2CF2-Zl , CF^CFOCFgCF^Hz-Z1、 CF2=CFOCF2CFOCF2CF2 —Z1 CF3 、 CF2=CFOCF2CFOCF2CF2CH2-Zl cf3 、 CF^CFO-iCF^Z1 » CF2=CF04CF2^CH2-Z1 , CF^CFOCF^FzOCFg-Z1» CF2=CFOCF2CF2OCF2CH2-Z\ cf2=cfocf2cf2ch2ocf2cf2-z1 , CF2 = CFOCF2CF2CH2OCF2CF2CH2-Zl (以上,z1係與式(A1 )相同)等之單體所衍生之結構 單位。 其他,含有官能基之含氟乙烯性單體’例如有 CF2 = CFCF2-0-Rf2-Z1 ' CF2 = CF-Rf2-Z' ' CH2 = CH-Rf2-Z' ' CH2 = CHO-Rf2-Z' (以上,-Rf2-係與前述之-Rf2-相同;Z1係與式(A1 )相 同)等,更具體而言,例如有 -72- 201229151 [化 63] CF2=CFCF2OCF2CF2CF2-Z1、 cf2=cfcf2ocf2cf2cf2ch2-z\ cf2=cfcf2ocf2cf-z1 , CF2=CFCF2OCF2CF-CH2-Zl ,I cf3 ch2 = cfcf2ocf2cf2ocf2-z1, CH2 = CFCF204CF2CF2 〇 hCF2-Z1 The structural unit of the fluorine-containing ethylenic acid derived from the monomer (the above - Z1 is the same as the formula (A1)) is preferable. Further, it is preferable that CF2 = CFORf4-Z1 (A1-2 (where Rf4 and Z1 are the same as the formula (A1)) depleted [Chem. 61] -f CF, -CF&gt; I OR ίΑ-Ζι( In the formula, Rf4 and Ζ1 are the same as the formula (A1), and more specifically, for example, there is a structural unit represented by (A 1 - 2). -71 - 201229151 [Chem. 62] CF2 = CFOCF2CF2-Zl , CF^CFOCFgCF^Hz -Z1, CF2=CFOCF2CFOCF2CF2 —Z1 CF3 , CF2=CFOCF2CFOCF2CF2CH2-Zl cf3 , CF^CFO-iCF^Z1 » CF2=CF04CF2^CH2-Z1 , CF^CFOCF^FzOCFg-Z1» CF2=CFOCF2CF2OCF2CH2-Z\ cf2=cfocf2cf2ch2ocf2cf2 -z1 , CF2 = structural unit derived from a monomer such as CFOCF2CF2CH2OCF2CF2CH2-Zl (above, z1 is the same as formula (A1)). Other, fluorine-containing ethylenic monomer having a functional group 'for example, CF2 = CFCF2-0 -Rf2-Z1 ' CF2 = CF-Rf2-Z' ' CH2 = CH-Rf2-Z' ' CH2 = CHO-Rf2-Z' (The above, -Rf2- is the same as -Rf2- described above; Z1 is the same as (A1) the same), etc., more specifically, for example, -72-201229151 [Chem. 63] CF2=CFCF2OCF2CF2CF2-Z1, cf2=cfcf2ocf2cf2cf2ch2-z\cf2=cfcf2ocf2cf-z1, CF2=CFCF2OCF2CF-CH2-Zl,

I I CF3 cf3 CF^CFCFj-Z1 , CF^CFCFaCH^Z1 , CH2=CHCF2CF2CH2CH2-Zl , ch2=chcf2cf2-z1 , CH2=CHCF2CF2CH2-Zl , CH^CHCFgCFjjCF^F^Z1 . CH2=CHCF2CF2CF2CF2CH2-Z1 , CH2=CHO-CH2CF2CFz-Z,, ch2=choch2cf2cf2ch2-z1 (以上,z1係與式(A1 )相同)等。 (A2)由不含官能基之含氟乙烯性單體所衍生之結構 單位 此結構單位A2可維持較低之含氟聚合物或其硬化物 之折射率,及可更低折射率化的觀點,較佳。藉由選擇單 體,可調整聚合物之機械特性或玻璃轉化溫度等,特別是 與結構單位L共聚合可提高玻璃轉化點,故爲較佳者。 此含氟乙烯性單體之結構單位(A2 ),例如有式( A2 ): [化 64] —(CX15X16—CX17^— I (A2) (CX182^nH-〇VfRf s^_Z2 (式中,X15、X16及X18係相同或相異,爲H或F ; X17 係Η、F或CF3 ; hi、il及j係相同或相異,爲0或1 ; Z2 係H、F、C1或碳數1〜16之直鏈狀或支鏈狀全氟烷基; -73- 201229151II CF3 cf3 CF^CFCFj-Z1 , CF^CFCFaCH^Z1 , CH2=CHCF2CF2CH2CH2-Zl , ch2=chcf2cf2-z1 , CH2=CHCF2CF2CH2-Zl , CH^CHCFgCFjjCF^F^Z1 . CH2=CHCF2CF2CF2CF2CH2-Z1 , CH2=CHO -CH2CF2CFz-Z,, ch2=choch2cf2cf2ch2-z1 (above, z1 is the same as formula (A1)) and the like. (A2) A structural unit derived from a fluorine-free ethylenic monomer having no functional group. The structural unit A2 can maintain a lower refractive index of a fluoropolymer or a cured product thereof, and a viewpoint of lower refractive index. , preferably. By selecting the monomer, the mechanical properties of the polymer, the glass transition temperature, and the like can be adjusted, and in particular, copolymerization with the structural unit L can increase the glass transition point, which is preferable. The structural unit (A2) of the fluorine-containing ethylenic monomer, for example, has the formula (A2): [C64] (CX15X16-CX17^-I (A2) (CX182^nH-〇VfRf s^_Z2 (wherein X15, X16 and X18 are the same or different and are H or F; X17 is Η, F or CF3; hi, il and j are the same or different, 0 or 1; Z2 is H, F, C1 or carbon number a linear or branched perfluoroalkyl group of 1 to 16; -73- 201229151

Rf5係碳數1〜20之2價含氟伸烷基或碳數2-100 鍵之2價含氟伸烷基)表示者較佳。 具體例較佳爲例如有, [化 65] cf2=cf2、cf2=ch2、cf2=cfci、cf2 = cfcf3 c f3 CF2 = C &lt;&quot; , CF2 = CFO(CF2)nF . CH2 = C(CF3)2 CF3 (n : 1〜5) cf2=cfh、cf2=cci2、cf2=cfocf2cfo-c3fRf5 is preferably a divalent fluorine-containing alkyl group having 1 to 20 carbon atoms or a divalent fluorine-containing alkyl group having 2 to 100 carbon atoms. The specific example is preferably, for example, [Chem. 65] cf2 = cf2, cf2 = ch2, cf2 = cfci, cf2 = cfcf3 c f3 CF2 = C &lt;&quot; , CF2 = CFO(CF2)nF . CH2 = C(CF3 ) 2 CF3 (n : 1~5) cf2=cfh, cf2=cci2, cf2=cfocf2cfo-c3f

I cf3 CH2 = CF4CF^Z2 (Z2係式(A2)相同、n : 1〜1 0)、 CH2 = CHOCHr&lt;CF2&gt;1IZ2 (Z2 係式(A 2 &gt; 相同、n : 1 〜1 等之單體所衍生之結構單位。 特別是此等可維持低的硬化性含氟聚合物或 的折射率的觀點,較佳爲來自選自由四氟乙烯、 、氯三氟烯及六氟丙烯所成群之至少1種單體的 〇 (A3)具有氟之脂肪族環狀的結構單位 導入此結構單位A3時’可提高透明性,可 璃轉化溫度的含氟聚合物’對於硬化物可期待更 ,故較佳。 含氟脂肪族環狀之結構單位A3 ’例如有式( 之具有醚 0) 其硬化物 偏氟乙烯 結構單位 得到高玻 高硬度化 A3 ): -74- 201229151 [化 66] (CX23 X 24)n2 -{(CX,9X20)nlCX21 CX22(CX25X26)n3}~ (A3)I cf3 CH2 = CF4CF^Z2 (Z2 is the same as (A2), n: 1~1 0), CH2 = CHOCHr&lt;CF2&gt;1IZ2 (Z2 system (A 2 &gt; identical, n : 1 to 1 etc.) The structural unit derived from the body. In particular, the viewpoint of maintaining the refractive index of the hard curable fluoropolymer or the like is preferably from a group selected from the group consisting of tetrafluoroethylene, chlorotrifluoroene and hexafluoropropylene. When at least one monomer of ruthenium (A3) has a fluorine-containing aliphatic cyclic structural unit, when the structural unit A3 is introduced, 'the transparency can be improved, and the fluoropolymer of the glass transition temperature can be expected for the cured product. Preferably, the fluorinated aliphatic cyclic structural unit A3 ' has, for example, a formula (having an ether 0), and the hardened material of a vinylidene fluoride structural unit is obtained by high glass hardness and hardness A3): -74- 201229151 [Chem. 66] CX23 X 24)n2 -{(CX,9X20)nlCX21 CX22(CX25X26)n3}~ (A3)

I I (0)n4 (〇)n5I I (0)n4 (〇)n5

Rf6 異, cf3 醚鍵 係相 (式中,X19、X2Q、X23、X24、X25及X26係相同或相 爲H或F ; X21及X22係相同或相異,爲Η、F、Cl或 ;Rf6係碳數1〜1〇之含氟伸烷基或碳數2〜10之具有 之含氟伸垸基;n2係0〜3之整數;nl、n3、n4及n5 同或相異,爲〇或1之整數)表示者較佳。 例如有 [化 67] CX21 — CX22)-Rf6 is different, cf3 ether bond phase (wherein X19, X2Q, X23, X24, X25 and X26 are the same or phase H or F; X21 and X22 are the same or different and are Η, F, Cl or Rf6; a fluorine-containing alkyl group having 1 to 1 carbon atom or a fluorine-containing stretching group having 2 to 10 carbon atoms; n2 is an integer of 0 to 3; nl, n3, n4 and n5 are the same or different and are 〇 Or an integer of 1) is preferred. For example, there is [Chem. 67] CX21 — CX22)-

I I 〇 〇 \ /I I 〇 〇 \ /

Rf6 結構 (式中,Rf6、X21及X22係與式(A3 )相同)表示之 單位。 具體而言,例如有 -75- 201229151 [化 68] -fCF-CFf-I I 〇 〇 -fCF-CF&gt;-I I ο οX cf3 cf3 -fCF-CF &gt;-I I O OX F CF, -(-CF-CF^- i I , o o cf2ci cf2ci +CH-CH户I I o oX CF3 CF,The Rf6 structure (wherein Rf6, X21, and X22 are the same as the formula (A3)) represents the unit. Specifically, for example, there is -75-201229151 [Chem. 68] -fCF-CFf-I I 〇〇-fCF-CF>-II ο οX cf3 cf3 -fCF-CF &gt;-IIO OX F CF, -(-CF -CF^- i I , oo cf2ci cf2ci +CH-CH household II o oX CF3 CF,

-fCH-CH)-I I O OX F F 卜 3 1 xo/ F-:1¾ CICIOV c-fCH-CH)-I I O OX F F Bu 3 1 xo/ F-:13⁄4 CICIOV c

Cl -fCF-C 卜 I I Ο οX cf3cf3Cl -fCF-C Bu I I Ο οX cf3cf3

-fCF2-CF-CF-CF2)- 〇 CF2 \ / CFZ cf2/ \ -f CF2CF CFf-I I 〇 cf2 CX23XM/ \ -fCFCF CF)-\ / O-CF, cf2 CF2—o cf2 _ζ.αχ.9χ2〇_〇ρ CF — CF2- 0-fCF2-CF-CF-CF2)- 〇CF2 \ / CFZ cf2/ \ -f CF2CF CFf-I I 〇cf2 CX23XM/ \ -fCFCF CF)-\ / O-CF, cf2 CF2-o cf2 _ζ.αχ. 9χ2〇_〇ρ CF — CF2- 0

-(-CX,9X20CF-CFC F2&gt;-I-(-CX,9X20CF-CFC F2&gt;-I

O ocf3 -4CF-C^- I I o 〇 -^CF-CF&gt;- 〇 cf2-cfO ocf3 -4CF-C^- I I o 〇 -^CF-CF&gt;- 〇 cf2-cf

I CF, (式中,X19、X2Q、X23及X24係與式(A3 )相同)等 其他之含氟脂肪族環狀結構單位,例如有 -76- 201229151 [化 69]I CF, (wherein, X19, X2Q, X23 and X24 are the same as formula (A3)), etc., and other fluorine-containing aliphatic cyclic structural units, for example, -76- 201229151 [Chem. 69]

oo

CF,-CF CF, 等。 (A4)由不含氟之乙烯性單體所衍生之結構單位 藉由導入結構單位A4,可提高對汎用溶劑之溶解性 ,或可改善與添加劑,例如光觸媒或必要時添加之硬化劑 的相溶性。 非氟系乙烯性單體之具體例,例如有 α-烯烴類: 乙烯、丙烯、丁烯、氯化乙烯、偏氯乙烯等 乙烯基醚系或乙烯基酯系單體: CH2 = CHOR、CH2 = CHOCOR10 ( R10 :碳數 1 〜20 之烴 基)等 烯丙基系單體: CH2 = CHCH2C1、CH2 = CHCH2OH、CH2 = CHCH2COOH、 CH2 = CHCH2Br等烯丙基醚系單體: CH2 = CHCH2OR10 ( R10 :碳數 1〜20 之烴基)、 CH2 = CHCH2OCH2CH2COOH、 -77- 201229151 [化 70] CH2 = CHCH2OCH2CHCH2、CF, -CF CF, and so on. (A4) The structural unit derived from the fluorine-free ethylenic monomer can improve the solubility in a general-purpose solvent by introducing the structural unit A4, or can improve the phase with an additive such as a photocatalyst or, if necessary, a hardener added. Solubility. Specific examples of the non-fluorine-based ethylenic monomer include α-olefins: vinyl ether or vinyl ester monomers such as ethylene, propylene, butylene, vinyl chloride, and vinylidene chloride: CH2 = CHOR, CH2 = Allyl monomer such as CHOCOR10 (R10: hydrocarbon group of carbon number 1 to 20): CH2 = CHCH2C1, CH2 = CHCH2OH, CH2 = CHCH2COOH, CH2 = allyl ether monomer such as CHCH2Br: CH2 = CHCH2OR10 (R10 : a hydrocarbon group having a carbon number of 1 to 20), CH2 = CHCH2OCH2CH2COOH, -77- 201229151 [Chem. 70] CH2 = CHCH2OCH2CHCH2

ο CH2 = CHCH2OCH2CHCH2 等ο CH2 = CHCH2OCH2CHCH2, etc.

I II I

OH OH 丙烯酸系或甲基丙烯酸系單體:例如有 丙烯酸系或甲基丙烯酸、甲基丙烯酸、甲基丙烯酸酯 類及馬來酸酐、馬來酸、馬來酸酯類等。 此等非氟系乙烯性單體之氫原子之一部份或全部被重 氫原子取代者’在透明性方面’更佳。 (A5 )由脂環式單體所衍生之結構單位 結構單位Μ、N之共聚合成分,更佳爲除了結構單位 Μ、N與前述含氟乙烯性單體或非氟乙烯性單體(前述之 A3、A4 )的結構單位’及導入作爲第3成分之脂環式單 體結構單位A5 ’藉此達成高玻璃轉化溫度化或高硬度化 〇 脂環式單體A5之具體例,例如有 -78- 201229151 [化 71]OH OH Acrylic or methacrylic monomers: for example, acrylic or methacrylic acid, methacrylic acid, methacrylic acid esters, maleic anhydride, maleic acid, maleic acid esters and the like. Some or all of the hydrogen atoms of these non-fluorine-based ethylenic monomers are more preferably replaced by a heavy hydrogen atom. (A5) a structural unit unit derived from an alicyclic monomer, a copolymerization component of N, more preferably a structural unit Μ, N and the above-mentioned fluorine-containing ethylenic monomer or non-fluoroethylenic monomer (previously Specific examples of the structural unit ' of A3 and A4) and the introduction of the alicyclic monomer structural unit A5' as the third component to achieve high glass transition temperature or high hardness of the scorpion ring monomer A5, for example -78- 201229151 [化71]

ABCD (m係0〜3之整數;A、B、C及D係相同或相異,爲η、 F、Cl、COOH、CH2OH或碳數 1〜5之全氟烷基等)表示 之降莰烯衍生物、 [化 72] G-0·0-0·0-© 等之脂環式單體或將取代基導入此等中之衍生物等。 含氟聚合物(B )可僅由結構單位L所構成之聚合物 或由結構單位L與結構單位A所構成之共聚合物。又,結 構單位L可僅爲結構單位Μ或僅爲結構單位N,而含氟聚 合物(Β )係結構單位Μ與結構單位Ν兩者可包含於含氟 聚合物(Β )中。又,也可爲由結構單位Μ、結構單位Ν 、及結構單位Α所構成之共聚合物。 含氟聚合物僅由結構單位L所構成時,從可賦予與基 材之密著耐久性的機能及可賦予被膜之高硬度化的觀點, 較使。 含氟聚合物爲共聚合物時,結構單位L係相對於構成 -79- 201229151 含氟聚合物(B)之全結構單位,只要是〇1莫耳%以上即 可’但是爲了藉由硬化(交聯”辱到高硬度且耐摩耗性、 耐擦傷性優異、耐藥品性、耐溶劑性優異的硬化物時,爲 2莫耳/〇以上,較佳爲5莫耳%以上,更佳爲1 〇莫耳。以 上。 特別是在必須形成耐熱性、透明性、低吸水性優異的 絕緣膜的用途時,含有1 〇莫耳%以上,較佳爲含有20莫 耳°/。以上’更佳爲含有30莫耳%以上,特佳爲含有4〇莫 耳%以上。結構單位L·係相對於構成含氟聚合物(β)之 全結構單位,較佳爲未達1 〇 〇莫耳。/。。 含氟聚合物(Β)之分子量,例如數平均分子量可選 自500〜1,〇〇〇,〇〇〇的範圍,較佳爲選自1000~500 000的 範圍,特佳爲選自2,000~200,〇〇〇的範圍。 分子量太低時,即使硬化後,機械物性也容易不足, 特別是絕緣膜容易變脆,強度不足。分子量太高時,溶劑 溶解性變差,或特別是薄膜形成時,成膜性或平坦性容易 變差,又含氟聚合物(Β)之貯存安定性容易不安定。最 佳爲數平均分子量爲選自5,000〜1 00,000之範圍者。 數平均分子量係依據聚苯乙烯測定的値,可藉由後述 之實施例中實施之測定方法來測定。 含氟聚合物(Β )係例如由結構單位L所構成’必要 時,可再由結構單位Α所構成,也可爲相對於構成含氟聚 合物之全結構單位時,結構單位L含有〇· 1〜1 00莫耳%、 及結構單位A含有0〜9 9·9莫耳%之數平均分子量爲500〜 -80 - 201229151 1,000,000的含氟聚合物。此時,結構單位L可爲結構單 位Μ爲0.1~1 00莫耳% ’結構單位N爲〇〜99.9莫耳% ’或 結構單位Ν爲0. 1〜1 〇〇莫耳% ’結構單位Μ爲〇~99.9莫 耳%。 此外,含氟聚合物(Β )可由結構單位L所構成’必 要時可再由結構單位A1及結構單位A2所構成,也可爲 相對於構成含氟聚合物(B )之全結構單位時,結構單位 L爲0.1〜90莫耳%、結構單位A1爲0〜99.9莫耳%及結構 單位A2爲〇〜9 9.9莫耳%,且結構單位A1與結構單位A2 之合計爲10〜99.9莫耳%,數平均分子量爲500〜1,000,000 者之較佳形態之一。 含氟聚合物(B)中之結構單位L之含量係相對於構 成含氟聚合物之全結構單位,只要是0.1莫耳%以上即可 ,但是爲了藉由硬化(交聯)可得到高硬度,且耐摩耗性 、耐擦傷性優異,耐藥品性、耐溶劑性優異的硬化物時, 爲2莫耳%以上,較佳爲5莫耳%以上,更佳爲1 〇莫耳〇/〇 以上。特別是必須形成耐熱性、透明性、低吸水性優異的 硬化被膜的用途時’含有1〇莫耳%以上,較佳爲含有20 莫耳%以上,更佳爲含有50莫耳%以上。上限爲未達100 莫耳%。 結構單位A 1及A 2之含量均爲9 9.9莫耳%以下。 A1+A2之合計莫耳%爲ι〇~99 9莫耳%。未達莫耳%時 ,無法維持低的折射率,且硬化後之被膜硬度有變低的傾 向,故不佳。更佳的A 1 + A 2之合計莫耳%爲2 〇莫耳%以 -81 - 201229151 上’更佳爲30莫耳%以上’且6〇莫耳%以下,更佳爲50 莫耳%以下。又’可爲9 0莫耳%以下,或8 0莫耳%以下, 或5 0莫耳%以下。 含氟聚合物(B)中,結構單位l〔結構單位M(M1 、M2、及M3)與結構單位n(N1、N2、及N3)〕與結 構單位A ( A 1及A2 )之組合或組成比率係結構單位μ與 結構單位Ν與結構單位Α之組合如上述所例示,可依據 目的之用途、物性(特別是玻璃轉化溫度、硬度等)、機 能(透明性)等進行各種選擇即可。 含氟聚合物(B)之分子量,例如數平均分子量可選 自500〜1,000,000的範圍,較佳爲選自!,〇〇〇〜500,000的 範圍,特佳爲選自2,〇〇〇〜200,0〇〇的範圍。 分子量太低時,即使硬化後,機械物性也容易不足, 特別是硬化物及硬化膜容易變脆,強度不足。分子量太高 時,溶劑溶解性變差,或特別是薄膜形成時,成膜性或平 坦性容易變差,又含氟聚合物之貯存安定性容易不安定。 最佳爲數平均分子量爲選自5,000〜1 00,000之範圍者。 含氟聚合物(B )可溶於汎用溶劑者較佳,可溶於例 如酮系溶劑、乙酸酯系溶劑、醇系溶劑、芳香族系溶劑之 至少1種或含有至少一種汎用溶劑的混合溶劑者較佳。 可溶於汎用溶劑係特別是在形成被膜之製程中,必要 形成3 μπι以下,例如約0. 1 μηι程度之薄膜時,成膜性、均 質性優異,故較佳,也有利於生產性方面。 上述含氟聚合物(Β)可採用以下任一方法, -82- 201229151 (1) 預先合成具有Rf之單體進行聚 (2) —旦合成具有其他官能基之聚 藉由高分子反應,進行官能基轉換,導入 法 (3) 採用(1)與(2)兩種的方法 〇 此等方法中,(3)的方法,基於不 側鎖末端之碳一碳雙鍵產生硬化反應,可 有水解性金屬烷氧化物部位之硬化性氟聚 3 )的方法較佳。 上述含氟聚合物(B)例如可藉 02/18457號說明書、特開2006-027958號 法來製造。 聚合方法例如有自由基聚合法、陰離 子聚合法等,爲了得到具有水解性金屬烷 合物所例示的單體,從組成或分子量等之 觀點或工業化容易的觀點,特佳爲自由基 提供結構單位L之含氟乙烯性單體係 [化 73] CX^^CX4ABCD (m is an integer of 0 to 3; A, B, C, and D are the same or different, and are η, F, Cl, COOH, CH2OH, or a C 1 to 5 perfluoroalkyl group, etc.) An alicyclic monomer, an alicyclic monomer such as G-0·0-0·0-©, or a derivative thereof is introduced into such a derivative or the like. The fluoropolymer (B) may be a polymer composed only of the structural unit L or a copolymer composed of the structural unit L and the structural unit A. Further, the structural unit L may be only a structural unit Μ or only a structural unit N, and both the fluoropolymer (Β) structural unit Μ and the structural unit 可 may be contained in the fluoropolymer (Β). Further, it may be a copolymer composed of a structural unit Μ, a structural unit Ν, and a structural unit Α. When the fluoropolymer is composed only of the structural unit L, it is more effective from the viewpoint of imparting the durability of adhesion to the substrate and imparting high hardness to the film. When the fluoropolymer is a copolymer, the structural unit L is a unit of the total structure of the fluoropolymer (B) constituting -79 to 201229151, and may be 〇1 mol% or more, but in order to be cured ( Crosslinking is in the case of a cured product having high hardness, excellent abrasion resistance, excellent scratch resistance, chemical resistance, and solvent resistance, and is 2 mol/〇 or more, preferably 5 mol% or more, more preferably In particular, when it is necessary to form an insulating film having excellent heat resistance, transparency, and low water absorbability, it contains 1% by mole or more, preferably 20% by mole or more. Preferably, it contains 30 mol% or more, particularly preferably 4 mol% or more. The structural unit L· is relative to the total structural unit constituting the fluoropolymer (β), preferably less than 1 mol. The molecular weight of the fluoropolymer (Β), for example, the number average molecular weight may be selected from the range of 500 to 1, 〇〇〇, 〇〇〇, preferably from the range of 1000 to 500 000, particularly preferably It is selected from the range of 2,000 to 200, 〇〇〇. When the molecular weight is too low, mechanical properties are easy even after hardening. Insufficient, in particular, the insulating film is liable to become brittle and insufficient in strength. When the molecular weight is too high, solvent solubility is deteriorated, or film formation or flatness is likely to be deteriorated particularly when a film is formed, and a fluoropolymer (Β) is used. The storage stability is not stable. The optimum number average molecular weight is selected from the range of 5,000 to 10,000,000. The number average molecular weight is determined by polystyrene, and can be determined by the measurement method carried out in the examples described later. The fluoropolymer (Β) is composed of, for example, a structural unit L. If necessary, it may be composed of a structural unit or may be a structural unit L with respect to the entire structural unit constituting the fluoropolymer. · 1 to 100% of the mole %, and the structural unit A contains 0 to 9 9 · 9 mole % of the fluoropolymer having an average molecular weight of 500 to -80 - 201229151 1,000,000. At this time, the structural unit L may be a structure The unit Μ is 0.1~1 00 mol% 'The structural unit N is 〇~99.9 mol%' or the structural unit Ν is 0. 1~1 〇〇莫耳% 'Structural unit Μ is 〇~99.9 mol%. , fluoropolymer (Β) can be made up of structural units L The configuration may be composed of the structural unit A1 and the structural unit A2 as necessary, or may be a structural unit L of 0.1 to 90 mol%, and the structural unit A1 with respect to the entire structural unit constituting the fluoropolymer (B). 0 to 99.9 mol% and the structural unit A2 is 〇~9 9.9 mol%, and the total of the structural unit A1 and the structural unit A2 is 10 to 99.9 mol%, and the number average molecular weight is 500 to 1,000,000. The content of the structural unit L in the fluoropolymer (B) is preferably 0.1 mol% or more with respect to the total structural unit constituting the fluoropolymer, but is hardened (crosslinked). When the cured product is excellent in abrasion resistance and scratch resistance and is excellent in chemical resistance and solvent resistance, it is 2 mol% or more, preferably 5 mol% or more, and more preferably 1 〇. Moore / 〇 above. In particular, when it is necessary to form a cured film having excellent heat resistance, transparency, and low water absorbability, it is contained in an amount of 1% by mole or more, preferably 20% by mole or more, and more preferably 50% by mole or more. The upper limit is less than 100% of the mole. The content of the structural units A 1 and A 2 is 9 9.9 mol% or less. The total molar percentage of A1+A2 is ι〇~99 9 mol%. When the molar percentage is less than 5%, the low refractive index cannot be maintained, and the hardness of the film after hardening is lowered, which is not preferable. More preferably, the total molar amount of A 1 + A 2 is 2 〇 mol % to -81 - 201229151, 'more preferably 30 mol% or more' and 6 〇 mol% or less, more preferably 50 mol% the following. Further, it may be 90% or less, or 80% or less, or 50% or less. In the fluoropolymer (B), the structural unit l [structural unit M (M1, M2, and M3) and the structural unit n (N1, N2, and N3)] and the structural unit A (A 1 and A2 ) or The composition ratio of the structural unit μ and the combination of the structural unit Ν and the structural unit 如 can be exemplified as described above, and various options can be selected depending on the intended use, physical properties (especially glass transition temperature, hardness, etc.), function (transparency), and the like. . The molecular weight of the fluoropolymer (B), for example, the number average molecular weight may be selected from the range of 500 to 1,000,000, preferably selected from! The range of 〇〇〇~500,000 is particularly preferably selected from the range of 2, 〇〇〇~200,0〇〇. When the molecular weight is too low, the mechanical properties are liable to be insufficient even after hardening, and in particular, the cured product and the cured film are liable to become brittle and the strength is insufficient. When the molecular weight is too high, the solubility of the solvent is deteriorated, or particularly when the film is formed, the film formability or the flatness is liable to be deteriorated, and the storage stability of the fluoropolymer is liable to be unstable. The optimum number average molecular weight is selected from the range of 5,000 to 10,000,000. The fluoropolymer (B) is preferably dissolved in a general solvent, and is soluble in, for example, a ketone solvent, an acetate solvent, an alcohol solvent, an aromatic solvent, or a mixture containing at least one general solvent. Solvents are preferred. In the process of forming a film, it is necessary to form a film having a thickness of 3 μm or less, for example, about 0.1 μm, which is excellent in film formability and homogeneity, and is therefore preferable in terms of productivity. . The above fluoropolymer (Β) may be subjected to any of the following methods, -82-201229151 (1) pre-synthesis of a monomer having Rf for poly(2)-synthesis of a poly(polymer) having another functional group by a polymer reaction Functional group conversion, introduction method (3) Two methods (1) and (2) are used. Among these methods, the method of (3) is based on a carbon-carbon double bond at the side of the side lock to generate a hardening reaction. A method of hardening fluoropolymerization of a hydrolyzable metal alkoxide portion is preferred. The fluoropolymer (B) can be produced, for example, by the method of No. 02/18457 and JP-A-2006-027958. In the polymerization method, for example, a radical polymerization method, an anion polymerization method, or the like, in order to obtain a monomer exemplified as the hydrolyzable metal alkene, it is preferable to provide a structural unit for a radical from the viewpoint of composition, molecular weight, etc., or industrialization. L fluorine-containing ethylenic single system [Chem. 73] CX^^CX4

I &lt;&lt;:χ4χ5Η—~fc=0) „(04^—Rf (式中,X1及X2係相同或相異,爲Η或 、(:Η3或CF3 ; X4及χ5係相同或相異,赁 Rf係與上述相同。a係〇〜3之整數;b及 合而得的方法 合物,該聚合物 官能基Rf的方 進行導入的方法 會使含氟聚合物 得到本發明之具 合物的觀點,( 由國際公開第 公報所記載的方 子聚合法、陽離 氧化物部位之聚 品質控制容易的 聚合法 。 下述式: F ; X3 係 Η、F H、F 或 CF3 ; c係相同或相異 -83- 201229151 ,爲〇或1)表示之單體。上述單體中,χ^χΐχΐχ4 、X5、a、b、C、及Rf中之較佳形態係與式(L )相同。 本發明之塗佈型絕緣膜形成用含氟組成物係相對於化 合物(A)與含氟聚合物(B)之合計質量時,較佳爲化合 物(A )爲50質量%以上。更佳爲化合物(A )爲60質量 %以上,更佳爲8 0質量%以上。化合物(A )太少時,耐 熱性或透明性可能變差。又,相對於化合物(A)與含氟 聚合物(B)之合計質量時,含氟聚合物(B)較佳爲〇」 質量%以上,更佳爲0·5質量%以上。含氟聚合物(B )太 少時,介電率變高,可撓性可能變差。 塗佈型絕緣膜形成用含氟組成物除化合物(Α)及含 氟聚合物(Β)以外’較佳爲含有有機溶劑。有機溶劑較 佳爲可溶解上述含氟聚合物(Β)者。 有機溶劑例如有甲基溶纖素、乙基溶纖素、甲基溶纖 素乙酸醋、乙基溶纖素乙酸酯等之溶纖素系溶劑;草酸二 乙醒、丙酮酸乙酯、乙基_2·羥基丁酸酯、乙基乙醯乙酸酯 、乙酸丁酯、乙酸戊酯、丁酸乙酯、丁酸丁酯 '乳酸甲酯 、乳酸乙酯、3 -甲氧基丙酸甲酯、3 -甲氧基丙酸乙酯、2_ 經基異丁酸甲酯、2-羥基異丁酸乙酯等之酯系溶劑; 丙二醇單甲基醚、丙二醇單乙基醚、丙二醇單丁基醚 、丙二醇單甲基醚乙酸酯、丙二醇單乙基醚乙酸酯、丙二 醇單丁基醚乙酸酯、二丙二醇二甲基醚等之丙二醇系溶劑 ;2-己酮、環己酮、甲基戊酮、2_庚酮、甲基異丁基酮等 酮系溶劑;甲醇、乙醇、丙醇、異丙醇、丁醇等醇系溶劑 -84- 201229151 :甲苯、二甲苯等之芳香族烴類或此等之2種以上之混合 溶劑等。 爲了提高含氟聚合物(B )之溶解性,必要時也可使 用氟系溶劑。 氟系溶劑例如有 CH3CC12F ( HCFC-141b )、 CF3CF2CHCI2/CCIF2CF2CHCIF 混合物(HCFC-225 )、全 氟己烷、全氟(2-丁基四氫呋喃)、甲氧基-九氟丁烷、1 ,3-雙三氟甲基苯等外,尙有 [化 74] H(CF2CF2hCH2〇H (n : 1 〜3之整數)、 F(CF2^CHzOH (11:1〜5之整數)、 CF3CH (CF3) oh 等之氟系醇類; 苯並三氟化物、全氟苯、全氟(三丁基胺)、 C1CF2CFC1CF2CFC12 等。 此等氟系溶劑可以單獨或氟系溶劑彼此、非氟系與氟 系之1種以上之混合溶劑形態使用。 此等中’較佳爲選自由酮系溶劑、乙酸酯系溶劑、醇 系溶劑、及芳香族系溶劑所成群之至少1種溶劑,更具體 而言’從塗裝性、塗佈之生產性等的方面,較佳爲選自由 甲基異丁酮、丙二醇甲醚乙酸酯(PGMEA) 、2•庚酮( ΜAK )及乳酸酯所成群之至少1種溶劑。 本發明之塗佈型絕緣膜形成用含氟組成物較佳爲再含 有硬化起始劑。特別是上述γ爲末端具有乙烯性碳-碳雙 鍵之碳數2〜10之1價有機基的Υ2時,含有硬化起始劑較 -85- 201229151 佳。 本發明之塗佈型絕緣膜形成用含氟組成物之硬化起始 劑,例如有光自由基產生劑、熱自由基產生劑等。例如除 了活性能量線硬化起始劑外,可使用加熱硬化或常溫2液 硬化系之硬化劑。從可較低溫硬化反應的觀點,較佳爲能 量線硬化起始劑。基於上述Y之種類(自由基反應性或陽 離子(酸)反應性)、使用之活性能量線之種類(波長範 圍等)與照射強度等來適當選擇。 活性能量線硬化起始劑係藉由照射例如3 50nm以下之 波長範圍之電磁波、即紫外線、電子線、X射線、γ射線 等之活性能量線,開始產生自由基或陽離子(酸)等,作 爲含氟聚合物(Β )之交聯基(例如有碳-碳雙鍵)開始硬 化(交聯反應)的觸媒作用者,通常使用以紫外線產生自 由基或陽離子(酸)者,特別是使用產生自由基者。 上述Υ爲末端具有乙烯性碳-碳雙鍵之碳數2〜10之1 價有機基時’本發明之塗佈型絕緣膜形成用含氟組成物, 藉由前述活性能量線容易開始硬化反應,故較佳。 使用紫外線範圍之活性能量線硬化時,硬化起始劑例 如有下述例示者。 本乙酮系例如有苯乙酮、氯苯乙酮、二乙氧基苯乙酮 、經基苯乙酮、α_胺基苯乙酮等。 苯ί禹因系例如有苯偶因、苯偶因甲醚、苯偶因乙醚、 本偶因異丙醚、苯偶因異丁醚、苄基二甲基縮酮等。 二苯甲嗣系例如有二苯甲酮、苯甲醯基苯甲酸、苯甲 -86- 201229151 醯基苯甲酸甲酯、4-苯基二苯甲酮、羥基二苯甲酮、羥基-丙基二苯甲酮、丙烯酸化二苯甲酮、米希拉酮等。 噻噸酮類例如有唾噸酮、氯噻噸酮、甲基噻噸酮、二 乙基噻噸酮、二甲基噻噸酮等。 其他,例如有聯苯醯' α-醯基肟酯、醯基膦氧化物、 甘醇酸酯、3-酮香豆素、2-乙基蒽醌、樟腦醌、蒽醌等。 必要時可添加胺類、颯類、锍化物(Sul fine )類等之 光起始助劑。 陽離子(酸)反應性之起始劑(光酸產生劑),例如 有下述例示者。 鑰鹽例如有碘鐵鹽、鏟鹽、錢鹽、重氮鑰鹽、銨鹽、 吡啶鑰鹽等。 颯合物例如有β-酮酯、P-磺醯基碾與此等之α·重氮化 合物等。 磺酸酯類例如有烷基磺酸酯、鹵烷基磺酸酯、芳基磺 酸酯、亞胺基磺酸酯等。 其他例如有磺醯亞胺化合物類、重氮甲烷化合物類等. 〇 本發明之塗佈型絕緣膜形成用含氟組成物中’硬化起 始劑之添加量係含氟聚合物(Β)中之交聯基之含量、化 合物(Α)具有交聯性基時’基於交聯性基之含量、即使 用之硬化起始劑、活性能量線之種類或照射能量量(強度 與時間等)來適當選擇。例如硬化起始劑係相對於化合物 (Α)及含氟聚合物(Β)之合計100質量份’較佳爲 -87- 201229151 〇.〇1~30質量份。更佳爲〇.〇5~20質量份,更佳爲0.1〜10 質量份。 本發明之塗佈型絕緣膜形成用含氟組成物較佳爲含有 硬化劑。特別是上述Y爲末端具有乙烯性碳-碳雙鍵之碳 數2〜1 0之1價有機基時,含有硬化劑較佳。 硬化劑較佳爲具有1個以上之碳-碳不飽和鍵,且可 以自由基或酸聚合者,具體而言,例如有丙烯酸系單體等 之自由基聚合性的單體、乙烯基醚系單體等之陽離子聚合 性的單體。此等單體可爲具有1個碳-碳雙鍵之單官能或 具有2個以上之碳-碳雙鍵之多官能的單體。 此等具有碳-碳不飽和鍵之所謂的硬化劑係以本發明 之組成物中之活性能量線硬化起始劑與光等之活性能量線 之反應產失之自由基或陽離子進行反應,可藉由與本發明 之組成物中之含氟聚合物(B)之側鏈之碳-碳雙鍵共聚合 而交聯者。 單官能之丙烯酸系單體例如有丙烯酸、丙烯酸酯類、 甲基丙烯酸、甲基丙烯酸酯類、α-氟丙烯酸、α-氟丙烯酸 酯類、馬來酸、馬來酸酐、馬來酸酯類及具有環氧基、羥 基、羧基等之(甲基)丙烯酸酯類等。 其中爲了維持硬化物之低折射率,較佳爲具有氟烷基 之丙烯酸酯系單體,例如具有一般式: [化 75]I &lt;&lt;:χ4χ5Η—~fc=0) „(04^—Rf (where X1 and X2 are the same or different, Η or , (:Η3 or CF3; X4 and χ5 are the same or different) , Rf is the same as above. a is an integer of 〇~3; b and a combined method, and the method of introducing the polymer functional group Rf enables the fluoropolymer to obtain the compound of the present invention. (a method of polymerization which is easy to control the polymerization quality of the cation oxide site by the square polymerization method described in the International Publication No. 2). The following formula: F; X3 system, FH, F or CF3; Or a different -83-201229151, which is a monomer represented by hydrazine or 1). Among the above monomers, preferred ones of χ^χΐχΐχ4, X5, a, b, C, and Rf are the same as those of the formula (L). When the fluorine-containing composition for forming a coating-type insulating film of the present invention is based on the total mass of the compound (A) and the fluoropolymer (B), the compound (A) is preferably 50% by mass or more. More preferably, The compound (A) is 60% by mass or more, more preferably 80% by mass or more. When the compound (A) is too small, heat resistance or transparency may be deteriorated. When the total mass of the compound (A) and the fluoropolymer (B) is used, the fluoropolymer (B) is preferably 〇% by mass or more, more preferably 0.5% by mass or more. Fluoropolymer (B) When the amount is too small, the dielectric constant is high, and the flexibility may be deteriorated. The fluorine-containing composition for forming a coating-type insulating film is preferably an organic solvent other than the compound (fluorene) and the fluoropolymer (Β). The organic solvent is preferably one which dissolves the above fluoropolymer. The organic solvent is, for example, methyl cellosolve, ethyl cellosolve, methyl cellosolve acetate, and ethyl cellosolve acetate. Solvent-based solvent; oxalic acid diacetate, ethyl pyruvate, ethyl 2 · hydroxybutyrate, ethyl acetonitrile acetate, butyl acetate, amyl acetate, ethyl butyrate, butyl Butyl butyl ester 'methyl lactate, ethyl lactate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, 2-methylisobutyric acid methyl ester, ethyl 2-hydroxyisobutyrate, etc. Ester solvent; propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monobutyl ether, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, C a propylene glycol solvent such as alcohol monobutyl ether acetate or dipropylene glycol dimethyl ether; a ketone solvent such as 2-hexanone, cyclohexanone, methylpentanone, 2-heptanone or methyl isobutyl ketone An alcohol solvent such as methanol, ethanol, propanol, isopropanol or butanol-84-201229151: an aromatic hydrocarbon such as toluene or xylene, or a mixed solvent of two or more thereof. The solubility of the substance (B) may be a fluorine-based solvent if necessary. Examples of the fluorine-based solvent include CH3CC12F (HCFC-141b), CF3CF2CHCI2/CCIF2CF2CHCIF mixture (HCFC-225), perfluorohexane, and perfluoro(2-butyl). In addition to tetrahydrofuran), methoxy-nonafluorobutane, 1, 3-bis-trifluoromethylbenzene, etc., there are [chemical 74] H (CF2CF2hCH2〇H (n: an integer of 1 to 3), F (CF2 ^CHzOH (integer of 11:1 to 5), a fluorine-based alcohol such as CF3CH (CF3) oh; benzotrifluoride, perfluorobenzene, perfluoro(tributylamine), C1CF2CFC1CF2CFC12, and the like. These fluorine-based solvents may be used singly or in the form of a mixed solvent of one or more of a fluorine-based solvent and a non-fluorine-based or fluorine-based solvent. In the above, it is preferably selected from at least one solvent selected from the group consisting of a ketone solvent, an acetate solvent, an alcohol solvent, and an aromatic solvent, and more specifically, 'coating property and coating. In terms of productivity, etc., at least one solvent selected from the group consisting of methyl isobutyl ketone, propylene glycol methyl ether acetate (PGMEA), 2 • heptanone (ΜAK), and lactic acid ester is preferable. The fluorine-containing composition for forming a coating-type insulating film of the present invention preferably further contains a curing initiator. In particular, when γ is Υ2 having a monovalent organic group having 2 to 10 carbon atoms and having an ethylenic carbon-carbon double bond at the end, the curing initiator is preferably more preferred than -85 to 201229151. The curing initiator for the fluorine-containing composition for forming a coating-type insulating film of the present invention may, for example, be a photoradical generator, a thermal radical generator or the like. For example, in addition to the active energy ray hardening initiator, a heat hardening or a room temperature 2 liquid hardening type hardener may be used. From the viewpoint of a lower temperature hardening reaction, an energy line hardening initiator is preferred. The type of Y (free radical reactivity or cation (acid) reactivity), the type of active energy ray used (wavelength range, etc.), the irradiation intensity, and the like are appropriately selected. The active energy ray hardening initiator starts to generate radicals or cations (acids) by irradiating an electromagnetic wave such as an ultraviolet ray, an electron beam, an X-ray, a gamma ray or the like in a wavelength range of, for example, 3 50 nm or less. A catalyst for the crosslinking of a fluoropolymer (Β) (for example, having a carbon-carbon double bond) to start hardening (crosslinking reaction), usually using ultraviolet rays to generate radicals or cations (acids), especially Produce free radicals. When the oxime is a monovalent organic group having a carbon number of 2 to 10 at the terminal having an ethylenic carbon-carbon double bond, the fluorine-containing composition for forming a coating-type insulating film of the present invention can easily start a hardening reaction by the aforementioned active energy ray. Therefore, it is better. When the active energy ray is used in the ultraviolet range, the hardening initiator is exemplified as follows. The ethyl ketone is, for example, acetophenone, chloroacetophenone, diethoxyacetophenone, acetophenone or α-aminoacetophenone. The benzoquinone is, for example, a benzoin, a benzoin methyl ether, a benzoin ether, a quinone isopropyl ether, a benzoin isobutyl ether, a benzyl dimethyl ketal or the like. The benzophenone series is, for example, benzophenone, benzhydrylbenzoic acid, benzo-methyl-86-201229151 methyl benzoyl benzoate, 4-phenyl benzophenone, hydroxybenzophenone, hydroxy-propyl Benzobenzophenone, benzoated benzophenone, mirasolone, and the like. The thioxanthones are, for example, sevotonone, chlorothioxanthone, methylthioxanthone, diethylthioxanthone, dimethylthioxanthone and the like. Other examples include biphenyl hydrazine 'α-mercapto decyl ester, decyl phosphine oxide, glycolate, 3-ketocoumarin, 2-ethyl hydrazine, camphorquinone, hydrazine and the like. A photoinitiator such as an amine, an anthracene or a sul fine may be added as necessary. The initiator (photoacid generator) for cationic (acid) reactivity is, for example, the following exemplified. The key salt may, for example, be an iron iodide salt, a shovel salt, a money salt, a diazo salt, an ammonium salt, a pyridyl salt or the like. The chelating compound may, for example, be a β-ketoester, a P-sulfonyl group, or the like, an α·diazonium compound or the like. The sulfonic acid esters are, for example, an alkylsulfonate, a haloalkylsulfonate, an arylsulfonate or an imidosulfonate. Other examples include a sulfonium imine compound, a diazomethane compound, etc. The content of the hardening initiator in the fluorine-containing composition for forming a coating type insulating film of the present invention is a fluorine-containing polymer (Β). When the content of the crosslinking group and the compound (Α) have a crosslinkable group, 'based on the content of the crosslinking group, that is, the curing initiator used, the type of active energy ray, or the amount of irradiation energy (strength and time, etc.) Appropriate choice. For example, the curing initiator is preferably 100 parts by mass of the compound (Α) and the fluoropolymer (Β), preferably -87 to 201229151 〇.〇1 to 30 parts by mass. More preferably, it is 5 to 20 parts by mass, more preferably 0.1 to 10 parts by mass. The fluorine-containing composition for forming a coating-type insulating film of the present invention preferably contains a curing agent. In particular, when Y is a monovalent organic group having a carbon number of 2 to 10 carbon atoms having an ethylenic carbon-carbon double bond at the terminal, it is preferred to contain a curing agent. The curing agent preferably has one or more carbon-carbon unsaturated bonds and can be polymerized by a radical or an acid. Specifically, for example, a radical polymerizable monomer such as an acrylic monomer or a vinyl ether is used. A cationically polymerizable monomer such as a monomer. These monomers may be monofunctional having one carbon-carbon double bond or a polyfunctional monomer having two or more carbon-carbon double bonds. These so-called hardeners having a carbon-carbon unsaturated bond are reacted by a radical or cation which is produced by the reaction of an active energy ray-hardening initiator in the composition of the present invention with an active energy ray of light or the like. The crosslinker is obtained by copolymerization with a carbon-carbon double bond of a side chain of the fluoropolymer (B) in the composition of the present invention. Monofunctional acrylic monomers such as acrylic acid, acrylates, methacrylic acid, methacrylic acid esters, α-fluoroacrylic acid, α-fluoroacrylates, maleic acid, maleic anhydride, maleic acid esters And a (meth) acrylate having an epoxy group, a hydroxyl group, a carboxyl group or the like. In order to maintain the low refractive index of the cured product, an acrylate-based monomer having a fluoroalkyl group is preferred, for example, having the general formula:

X CH2=C-COOR f a (X係Η、CH3或F,Rfa係碳數2~4〇之含氟铸基或碳數 -88- 201229151 2〜100之具有醚鍵之含氟烷基)表示之化合物較佳。 具體而言,例如有 [化 76]X CH2=C-COOR fa (X system Η, CH3 or F, Rfa is a fluorine-containing casting base having a carbon number of 2 to 4 Å or a carbon number-88-201229151 2 to 100 fluoroalkyl group having an ether bond) The compound is preferred. Specifically, for example, there is [Chem. 76]

X XX X

I I CH2=C-COOCH2CH2-fCF2h-F, CH2=CCOOCH2CH2-&lt;CF2&gt;tF,I I CH2=C-COOCH2CH2-fCF2h-F, CH2=CCOOCH2CH2-&lt;CF2&gt;tF,

X XX X

I I CH2=C-COOCH2-(CF2h-H , CH2=CCOOCH2CF3、I I CH2=C-COOCH2-(CF2h-H, CH2=CCOOCH2CF3,

X XX X

I I CH2=C-COOCH24CF2&gt;tH、CH2=CCOOCH2(CF2)6H、 x cf3 X cf3 II II ch2=c-cooch 、CH2=C-COOC-CF3、I I CH2=C-COOCH24CF2&gt;tH, CH2=CCOOCH2(CF2)6H, x cf3 X cf3 II II ch2=c-cooch, CH2=C-COOC-CF3,

I I cf3 cf3 X cf3I I cf3 cf3 X cf3

I I ch2=c-cooch2-(cf2&gt;tcf 、I I ch2=c-cooch2-(cf2&gt;tcf,

I cf3 等。 多官能丙烯酸系單體,一般而言例如有將二醇、三醇 、四醇等之多元醇類之羥基基取代成丙烯酸酯基、甲基丙 烯酸酯基、α-氟丙烯酸酯基的化合物。 具體而言,例如有將1,3-丁二醇、1,4-丁二醇、1,6-己二醇、二乙二醇、三丙二醇、新戊二醇、三羥甲基丙烷 、季戊四醇、二季戊四醇等之各自的多元醇類之2個以上 的羥基取代成丙烯酸酯基、甲基丙烯酸酯基、ct-氟丙烯酸 酯基之任一基團的化合物。 此外,也可使用將含氟烷基、含有醚鍵之含氟烷基、 -89- 201229151 含氟伸烷基或含有醚鍵之含氟伸烷基之多元醇類之2個以 上的羥基取代成丙烯酸酯基、甲基丙烯酸酯基、α·氟丙烯 酸酯基之多官能丙烯酸系單體,特別是可降低硬化物之折 射率的觀點,較佳。 具體例,例如有 [化 77]I cf3 and so on. The polyfunctional acrylic monomer is, for example, a compound obtained by substituting a hydroxyl group of a polyhydric alcohol such as a diol, a triol or a tetraol with an acrylate group, a methacrylate group or an α-fluoroacrylate group. Specifically, for example, 1,3-butanediol, 1,4-butanediol, 1,6-hexanediol, diethylene glycol, tripropylene glycol, neopentyl glycol, trimethylolpropane, A compound in which two or more hydroxyl groups of each of the polyols such as pentaerythritol and dipentaerythritol are substituted with any one of an acrylate group, a methacrylate group, and a ct-fluoroacrylate group. Further, it is also possible to use two or more hydroxyl groups substituted with a fluorine-containing alkyl group, a fluorine-containing alkyl group having an ether bond, a -89-201229151 fluorine-containing alkylene group or a fluorine-containing alkyl group-containing polyol having an ether bond. The polyfunctional acrylic monomer which is an acrylate group, a methacrylate group or an α·fluoroacrylate group is particularly preferable from the viewpoint of lowering the refractive index of the cured product. Specific examples, for example, [Chem. 77]

Rf-CH-CH2OH、 Rf-CH2OCH-CH-CH2〇HRf-CH-CH2OH, Rf-CH2OCH-CH-CH2〇H

I II I

OH OH (Rf係碳數1〜40之含氟烷基)、OH OH (Rf is a fluorine-containing alkyl group having 1 to 40 carbon atoms),

RR

I HOCH2C-COOCH2CH-R f ch2oh oh (Rf係碳數1〜40之含氟烷基或含醚鍵之含氟烷基、 R係Η或碳數1〜3之烷基)、 H〇-CH2-R f '-CHoOH、I HOCH2C-COOCH2CH-R f ch2oh oh (Rf is a fluorine-containing alkyl group having 1 to 40 carbon atoms or a fluorine-containing alkyl group having an ether bond, R-form fluorene or an alkyl group having 1 to 3 carbon atoms), H〇-CH2 -R f '-CHoOH,

H〇-CH2CH-CH2-R f ,-CH2-CHCH2OH、 OH OH R I cch2oh I ch2ohH〇-CH2CH-CH2-R f , -CH2-CHCH2OH, OH OH R I cch2oh I ch2oh

RR

I H〇-CH2C-COOCH2CH-R f ,-CHCH,OC ——I H〇-CH2C-COOCH2CH-R f , -CHCH, OC ——

I I I II ch2oh oh oh o (Rf’係碳數1〜40之含氟烷基或含醚鍵之含氟烷基、 R係聰碳數卜3之烷基) 等之一般式表示之含氟多元醇類之2個以上的羥基取代成 丙烯酸酯基、甲基丙烯酸酯基、α -氟丙烯酸酯基之結構這 較佳。 又,此等例示之單官能、多官能丙烯酸系單體作爲硬 -90- 201229151 化劑,用於本發明之組成物時,其中特別是氟丙烯酸酯 化合物,硬化反應性良好,故較佳。 本發明之組成物中,活性能量線硬化起始劑之添加量 係因含氟聚合物(Β)中之碳-碳雙鍵之含量、上述硬化劑 之使用之有無或硬化劑之使用量及使用之硬化起始劑、活 性能量線之種類或照射能量量(強度與時間等)來適當選 擇,但是未使用硬化劑時,相對於含氟聚合物(Β) 100 重量份,較佳爲〇.〇1〜30重量份,更佳爲0.05~20重量份 ,最佳爲0.1〜10重量份。 更詳細而言,例如有含氟聚合物(Β)中所含之碳-碳 雙鍵之含量(莫耳數),較佳爲0.05〜50莫耳%,更佳爲 0.1〜2 0莫耳%,最佳爲0.5〜1 0莫耳%。 使用硬化劑時,相對於含氟聚合物(Β )中所含之碳-碳雙鍵之含量(莫耳數)與硬化劑之碳-碳不飽和鍵之莫 耳數之合計莫耳數,較佳爲 0.05〜50莫耳%,更佳爲 0.1〜20莫耳%,最佳爲0.5〜10莫耳%。 使用硬化劑時,硬化劑之使用量係因目的之硬度或折 射率、硬化劑之種類、使用之硬化性含氟聚合物之硬化性 基的含量等來適當選擇,較佳爲相對於硬化性含氟聚合物 ’一般爲1〜80重量%,較佳爲5〜70重量%,更佳爲 1 〇〜5 0重量%。硬化劑之添加量過多時,有折射率變高的 傾向,故不佳。 本發明之塗佈型絕緣膜形成用含氟組成物除上述者外 ,必要時也可爲含有各種添加劑者。 -91 - 201229151 添加劑例如有矽烷偶合劑、可塑劑、變色防止劑、氧 化防止劑、無機塡充劑、平坦劑、黏度調整劑、光安定劑 、水分吸收劑、顔料、染料、補強劑等。 又’本發明之塗佈型絕緣膜形成用含氟組成物爲了提 高絕緣膜之硬度’或控制折射率,可爲含有無機化合物之 微粒子或超微粒子者。 無機化合物微粒子無特別限定,較佳爲折射率爲丨.5 以下的化合物。具體而言,較佳爲氟化鎂(折射率丨· 3 8 ) 、氧化矽(折射率1 · 4 6 )、氟化鋁(折射率1 · 3 3〜1 . 3 9 ) 、氟化鈣(折射率1 .4 4 )、氟化鋰(折射率1 . 3 6〜1 . 3 7 ) 、氟化鈉(折射率 1 · 3 2 ~ 1 . 3 4 )、氟化钍(折射率 1.4 5〜1 . 5 0 )等的微粒子。微粒子之粒徑,爲了確保低折射 率材料之透明性時,較佳爲比可見光波長更小者。具體而 言爲300nm以下,特佳爲i〇〇nm以下。 可藉由無機化合物之微粒子或超微粒子形成空隙。換 言之,本發明之組成物中含有無機化合物之微粒子或超微 粒子的被膜係利用此空隙,可形成比被膜單體之折射率更 低的低折射率。 使用無機化合物微粒子時,爲了避免組成物中之分散 安定性、低折射率材料中之密著性等降低,較佳爲以預先 分散於有機分散媒中之有機溶膠的形態來使用。此外,組 成物中,爲了提高無機化合物微粒子之分散安定性、低折 射率材料中之密著性等,可預先將無機微粒子化合物之表 面使用各種偶合劑等進行改質。各種偶合劑,例如有有機 -92- 201229151 取代之矽化合物:鋁、鈦、鉻、銻或此等之混合物等的金 屬烷氧化物;有機酸之鹽;與配位性化合物結合的配位化 合物等。 本發明之塗佈型絕緣膜形成用含氟組成物係對於有機 溶劑,含氟聚合物(B )或添加物可爲分散狀者或溶液狀 者,從形成均勻薄膜的觀點,可以較低溫成膜,且爲均勻 的溶液狀較佳。 · 本發明之塗佈型絕緣膜形成用含氟組成物係爲了形成 的膜成爲1~5μιη時,較佳爲適合的黏度,即1〜i〇Cp程度 者。因此,相對於本發明之塗佈型絕緣膜形成用含氟組成 物全質量’化合物(A)及含氟聚合物(B)之質量合計較 佳爲10〜100質量%。更佳爲20〜50質量%。 本發明之塗佈型絕緣膜形成用含氟組成物,可藉由例 如在液體之化合物(A)中添加含氟聚合物(B)、即必要 時添加硬化起始劑、交聯劑、其他添加劑,必要時藉由攪 拌混合來製造。 塗佈本發明之塗佈型絕緣膜形成用含氟組成物的方法 ’可採用公知的塗佈方法。例如有將塗佈型絕緣膜形成用 含氟組成物塗佈於基材,經乾燥後,必要時進行燒成的方 法等。塗佈方法具體而言,可採用例如輥塗佈法、凹版塗 佈法、微凹版塗佈法、流塗佈法、棒塗佈法、噴霧塗佈法 、模塗佈法、旋轉塗佈法、浸漬塗佈法、縫塗佈法等,可 考慮基材的種類、形狀、生產性、膜厚的控制性等來選擇 。形成薄膜電晶體之閘極絕緣膜時,較佳爲藉由縫塗佈法 -93- 'ϊ=Γ 201229151 塗佈塗佈型絕緣膜形成用含氟組成物。 本發明之塗佈型絕緣膜形成用含氟組成物可藉由交聯 、例如熱交聯或光交聯形成絕緣膜。絕緣膜係藉由將本發 明之塗佈型絕緣膜形成用含氟組成物塗佈於基材,經乾燥 後’燒成進行交聯,或藉由照射紫外線、電子線或放射線 等之活性能量線,進行光硬化來形成。 本發明之塗佈型絕緣膜形成用含氟組成物可用於各種 用途’特別適合作爲形成大面積之絕緣膜的用途、形成使 用於必須可撓性之用途之絕緣膜的材料。例如藉由本發明 之組成物所得之絕緣膜的用途,例如有多層印刷配線基板 層間絕緣膜、發光二極體元件絕緣膜、多層晶片層間絕緣 膜等。又’適合作爲半導體元件用之絕緣膜,例如有層間 絕緣膜、鈍化膜、薄膜電晶體之閘極絕緣膜等。又,低介 電率且可見光區域之透明性高,因此特別適合作爲形成薄 膜電晶體之閘極絕緣膜的材料。 本發明之絕緣膜係由上述塗佈型絕緣膜形成用含氟組 成物所形成者。由上述塗佈型絕緣膜形成用含氟組成物所 形成者,因此,此絕緣膜係可撓性優異。此外,耐熱性、 低介電率及透明性也優異。 本發明之塗佈型絕緣膜形成用含氟組成物可形成絕緣 膜,但是低介電率及透明性也優異,因此特別適合作爲形 成半導體元件用的絕緣膜形成用組成物。 本發明之塗佈型絕緣膜形成用含氟組成物較佳爲薄膜 電晶體之閘極絕緣膜形成用。本發明之塗佈型絕緣膜形成 -94- 201229151 用含氟組成物係高耐熱性、可見光區域之透明性、低介電 率及可撓性優異,且爲汎用溶劑可溶性,因此可用於形成 薄膜電晶體之閘極絕緣膜的情形,且爲塗佈型,因此可達 成低成本化,及容易製作大面積的膜。 薄膜電晶體之閘極絕緣膜形成用時,本發明之塗佈型 絕緣膜形成用含氟組成物之更佳的構成,例如有下述者, 但是本發明不限於此等。 【實施方式】 (例I) 有機矽化合物(A )成分:水解縮合性矽烷化合物 含氟聚合物(B)成分:由側鏈具有矽烷偶合基之結 構單位L2所構成之均聚合物、或由結構單位L2、結構單 位Μ、及結構單位N所構成之共聚合物(例如具有(L2 )- (Μ) - (Ν)之結構的共聚合物) 溶劑:酮系溶劑、乙酸酯系溶劑、醇系溶劑、含氟醇 系溶劑、或芳香族系溶劑。 組成比例係相對於(A )成分1 〇〇質量份(固形分) ,(B)成分爲1〜50質量份。 溶劑:必要之適量 (例 II) 有機矽化合物(A )成分:水解縮合性矽烷化合物 含氟聚合物(B)成分:由側鏈具有自由基聚合性基 -95- 201229151 之L2的均聚合物、或由結構單位l2、結構單位M、及結 構單位N所構成之共聚合物(例如具有(l2) _(M) _( N)之結構的共聚合物) 硬化劑(交聯劑):具有自由基性交聯基與水解性砂 院偶合基的化合物 硬化起始劑:紫外線自由基產生劑。 溶劑:酮系溶劑、乙酸酯系溶劑、醇系溶劑、含氟醇 系溶劑 '或芳香族系溶劑。 組成比例係相對於(A )成分1 〇〇質量份(固形分) ’ (B)成分爲1〜50質量份、交聯劑爲0.1〜10質量份, 起始劑爲0.01 ~0.5質量份,溶劑爲必要的適量。 本發明之薄膜電晶體係依半導體層、上述閘極絕緣膜 、及閘極電極層之順序進行層合者。本發明之薄膜電晶體 係使用上述閘極絕緣膜者,因此可撓性優異及耐熱性、及 透明性也優異。 上述薄膜電晶體適合作爲例如液晶顯示裝置、有機電 致發光顯示裝置等之顯示裝置用的薄膜電晶體。 又,可撓性優異,因此可作爲例如使用撓性基板之顯 示裝置等所用的薄膜電晶體使用。 圖1係表示反轉共平面型之薄膜電晶體之一例。圖1 所示之薄膜電晶體1係於閘極電極層1 0上依序形成閘極 絕緣膜11、半導體層13,而源極•汲極電極14爲夾著氧 化膜1 5而形成。源極•漏極電極1 4上形成有鈍化膜1 2。 本發明之薄膜電晶體不限於這種背閘極(Back Gate -96- 201229151 )型之薄膜電晶體者’可爲頂閘極型的薄膜電晶體。 上述半導體層係成爲薄膜電晶體之活性層的層,由半 導體所構成者。上述半導體可爲矽、鍺等之IV族半導體 ,也可爲鎵砷、鎵氮化物等之III-V族化合物半導體或氧 化鋅等之π-νι族化合物半導體等。也可爲並五苯、噻吩 等之有機半導體。從實用的觀點,較佳爲矽。半導體層可 使用單結晶、多結晶、非晶質等之各種半導體》 形成閘極電極層的材料無特別限定,可使用通常之形 成閘極電極層的材料。例如可使用銅、鋁、金等的金屬。 又,本發明之絕緣膜係因透明性高,因此可作爲LED 元件中之絕緣膜使用。 〔實施例〕 其次依據合成例、製造例及實施例等說明本發明,但 是本發明不限於此等實施例。物性評價所使用的裝置及測 定條件如下述。 (1 ) NMR : BRUKER 公司製 ^H-NMR測定條件:3 00MHz (四甲基矽烷=0ppm ) 19F-NMR測定條件:282MHz (三氯氟甲苯=0ppm )III II ch2oh oh o (Rf' is a fluorine-containing polybasic represented by a general formula of a fluorine-containing alkyl group having 1 to 40 carbon atoms or a fluorine-containing alkyl group having an ether bond, an alkyl group having a R-based carbon number of 3) It is preferred that the two or more hydroxyl groups of the alcohol are substituted with an acrylate group, a methacrylate group, or an α-fluoroacrylate group. Further, the above-exemplified monofunctional or polyfunctional acrylic monomers are preferably used as the hard-90-201229151 agent in the composition of the present invention, and among them, particularly a fluoroacrylate compound, since the curing reactivity is good, it is preferred. In the composition of the present invention, the amount of the active energy ray hardening initiator is added by the content of the carbon-carbon double bond in the fluoropolymer (Β), the presence or absence of the above-mentioned curing agent, or the amount of the curing agent used. The curing initiator, the type of active energy ray, or the amount of irradiation energy (strength and time) are appropriately selected. However, when no curing agent is used, it is preferably 〇 with respect to 100 parts by weight of the fluoropolymer (Β). The 〇 1 to 30 parts by weight, more preferably 0.05 to 20 parts by weight, most preferably 0.1 to 10 parts by weight. More specifically, for example, the content of the carbon-carbon double bond (molar number) contained in the fluoropolymer (Β) is preferably 0.05 to 50 mol%, more preferably 0.1 to 2 mol. %, optimally 0.5 to 1 0% by mole. When the hardener is used, the total number of moles of the carbon-carbon double bond content (molar number) contained in the fluoropolymer (Β) and the molar number of the carbon-carbon unsaturated bond of the hardener, It is preferably 0.05 to 50 mol%, more preferably 0.1 to 20 mol%, most preferably 0.5 to 10 mol%. When the curing agent is used, the amount of the curing agent to be used is appropriately selected depending on the hardness and refractive index of the object, the kind of the curing agent, the content of the curable group of the curable fluorine-containing polymer to be used, and the like, and is preferably relative to the curability. The fluoropolymer is generally from 1 to 80% by weight, preferably from 5 to 70% by weight, more preferably from 1 to 50% by weight. When the amount of the hardener added is too large, the refractive index tends to be high, which is not preferable. In addition to the above, the fluorine-containing composition for forming a coating-type insulating film of the present invention may contain various additives as necessary. -91 - 201229151 Additives include, for example, decane coupling agents, plasticizers, discoloration inhibitors, oxidation inhibitors, inorganic chelating agents, flat agents, viscosity modifiers, photosensitizers, moisture absorbers, pigments, dyes, reinforcing agents, and the like. Further, the fluorine-containing composition for forming a coating-type insulating film of the present invention may be a fine particle or an ultrafine particle containing an inorganic compound in order to increase the hardness of the insulating film or to control the refractive index. The inorganic compound fine particles are not particularly limited, and are preferably a compound having a refractive index of 丨.5 or less. Specifically, magnesium fluoride (refractive index 丨·3 8 ), cerium oxide (refractive index 1 · 4 6 ), aluminum fluoride (refractive index 1 · 3 3 to 1.39), calcium fluoride is preferred. (refractive index 1.44), lithium fluoride (refractive index 1.36 to 1.37), sodium fluoride (refractive index 1 · 3 2 ~ 1.34), cesium fluoride (refractive index 1.4) 5~1 . 5 0 ) and other fine particles. The particle diameter of the fine particles is preferably smaller than the wavelength of visible light in order to secure the transparency of the low refractive index material. Specifically, it is 300 nm or less, and particularly preferably i 〇〇 nm or less. The voids may be formed by fine particles or ultrafine particles of an inorganic compound. In other words, the film containing the inorganic compound or the ultrafine particles in the composition of the present invention can form a low refractive index lower than the refractive index of the film monomer by using the void. When the inorganic compound fine particles are used, it is preferably used in the form of an organosol which is dispersed in the organic dispersion medium in order to avoid dispersion stability in the composition and adhesion in the low refractive index material. In addition, in order to improve the dispersion stability of the inorganic compound fine particles and the adhesion in the low refractive index material, the surface of the inorganic fine particle compound may be modified with various coupling agents or the like in advance. Various coupling agents, for example, organic-92-201229151 substituted oxime compounds: aluminum, titanium, chromium, ruthenium or the like, metal alkoxides; salts of organic acids; coordination compounds combined with coordination compounds Wait. The fluorine-containing composition for forming a coating-type insulating film of the present invention may be a dispersion or a solution of a fluorine-containing polymer (B) or an additive in an organic solvent, and may have a lower temperature from the viewpoint of forming a uniform film. The film is preferably in the form of a homogeneous solution. When the fluorine-containing composition for forming a coating-type insulating film of the present invention is formed to have a film thickness of 1 to 5 μm, it is preferably a suitable viscosity, that is, a degree of 1 to i 〇 Cp. Therefore, the total mass of the fluorine-containing composition for forming a coating-type insulating film of the present invention is preferably from 10 to 100% by mass based on the total mass of the compound (A) and the fluoropolymer (B). More preferably 20 to 50% by mass. In the fluorine-containing composition for forming a coating-type insulating film of the present invention, for example, a fluorine-containing polymer (B) may be added to the liquid compound (A), that is, a curing initiator, a crosslinking agent, and the like may be added as necessary. The additive is produced by stirring and mixing as necessary. A method of applying the fluorine-containing composition for forming a coating-type insulating film of the present invention can be carried out by a known coating method. For example, there is a method in which a fluorine-containing composition for forming a coating-type insulating film is applied to a substrate, dried, and then baked if necessary. Specific examples of the coating method include a roll coating method, a gravure coating method, a micro gravure coating method, a flow coating method, a bar coating method, a spray coating method, a die coating method, and a spin coating method. The dip coating method, the slit coating method, and the like can be selected in consideration of the type, shape, productivity, controllability of the film thickness, and the like of the substrate. In the case of forming a gate insulating film of a thin film transistor, it is preferable to apply a fluorine-containing composition for coating a coating type insulating film by a slit coating method of -93-'ϊ=Γ 201229151. The fluorine-containing composition for forming a coating type insulating film of the present invention can be formed into an insulating film by crosslinking, for example, thermal crosslinking or photocrosslinking. The insulating film is applied to a substrate by applying a fluorine-containing composition for forming a coating-type insulating film of the present invention, and after drying, it is "fired and cross-linked, or irradiated with active energy such as ultraviolet rays, electron beams or radiation. The line is formed by photohardening. The fluorine-containing composition for forming a coating-type insulating film of the present invention can be used for various purposes. It is particularly suitable as a material for forming a large-area insulating film and forming an insulating film for use in applications requiring flexibility. For example, the use of the insulating film obtained by the composition of the present invention includes, for example, a multilayer printed wiring board interlayer insulating film, a light emitting diode element insulating film, a multilayer wafer interlayer insulating film, and the like. Further, it is suitable as an insulating film for a semiconductor element, and examples thereof include an interlayer insulating film, a passivation film, and a gate insulating film of a thin film transistor. Further, since the dielectric constant is low and the transparency in the visible light region is high, it is particularly suitable as a material for forming a gate insulating film of a thin film transistor. The insulating film of the present invention is formed of the above-described fluorine-containing composition for forming a coating-type insulating film. Since the fluorine-containing composition for forming a coating-type insulating film is formed, the insulating film is excellent in flexibility. In addition, heat resistance, low dielectric constant, and transparency are also excellent. The fluorine-containing composition for forming a coating-type insulating film of the present invention can form an insulating film, but is also excellent in low dielectric constant and transparency. Therefore, it is particularly suitable as a composition for forming an insulating film for forming a semiconductor element. The fluorine-containing composition for forming a coating-type insulating film of the present invention is preferably used for forming a gate insulating film of a thin film transistor. The coating type insulating film of the present invention is formed into a film having a high heat resistance, a transparency in a visible light region, a low dielectric constant and flexibility, and is a solvent for general use, and can be used for forming a film. In the case of a gate insulating film of a transistor, and being of a coating type, it is possible to achieve cost reduction and to easily produce a film having a large area. In the case of forming a gate insulating film for a thin film transistor, a more preferable configuration of the fluorine-containing composition for forming a coating-type insulating film of the present invention is as follows, but the present invention is not limited thereto. [Examples] (Example I) Organoquinone compound (A) component: Hydrolyzable condensed decane compound Fluoropolymer (B) component: a homopolymer composed of a structural unit L2 having a decane coupling group in a side chain, or a copolymer composed of a structural unit L2, a structural unit Μ, and a structural unit N (for example, a copolymer having a structure of (L2)-(Μ)-(Ν)) Solvent: a ketone solvent, an acetate solvent An alcohol solvent, a fluorine-containing alcohol solvent, or an aromatic solvent. The composition ratio is 1 part by mass (solid content) with respect to the component (A), and the component (B) is 1 to 50 parts by mass. Solvent: Appropriate amount (Example II) Organoquinone compound (A) Component: Hydrolyzed condensed decane compound Fluoropolymer (B) Component: H2 homopolymer having a radical polymerizable group -95- 201229151 from the side chain Or a copolymer composed of structural unit l2, structural unit M, and structural unit N (for example, a copolymer having a structure of (l2) _(M) _(N)) hardener (crosslinking agent): A compound hardening initiator having a radical crosslinkable group and a hydrolyzable sand chamber coupling group: an ultraviolet radical generating agent. Solvent: a ketone solvent, an acetate solvent, an alcohol solvent, a fluorine-containing alcohol solvent, or an aromatic solvent. The composition ratio is 1 part by mass to the (A) component (solid content)' (B) component is 1 to 50 parts by mass, the crosslinking agent is 0.1 to 10 parts by mass, and the initiator is 0.01 to 0.5 part by mass. The solvent is the necessary amount. The thin film electro-crystal system of the present invention is laminated in the order of the semiconductor layer, the gate insulating film, and the gate electrode layer. Since the above-mentioned gate insulating film is used for the thin film transistor of the present invention, it is excellent in flexibility, heat resistance, and transparency. The above-mentioned thin film transistor is suitable as a thin film transistor for a display device such as a liquid crystal display device or an organic electroluminescence display device. Moreover, since it is excellent in flexibility, it can be used as a thin film transistor used for, for example, a display device using a flexible substrate. Fig. 1 is a view showing an example of a reverse coplanar type thin film transistor. The thin film transistor 1 shown in Fig. 1 is formed by sequentially forming a gate insulating film 11 and a semiconductor layer 13 on a gate electrode layer 10, and a source/drain electrode 14 is formed sandwiching the oxide film 15. A passivation film 12 is formed on the source/drain electrodes 14. The thin film transistor of the present invention is not limited to such a back gate (Back Gate-96-201229151) type thin film transistor, and may be a top gate type thin film transistor. The semiconductor layer is a layer of an active layer of a thin film transistor and is composed of a semiconductor. The semiconductor may be a Group IV semiconductor such as ruthenium or iridium, or may be a III-V compound semiconductor such as gallium arsenide or gallium nitride or a π-νι compound semiconductor such as zinc oxide. It may also be an organic semiconductor such as pentacene or thiophene. From a practical point of view, it is preferably 矽. The semiconductor layer may be any of various semiconductors such as a single crystal, a polycrystal, or an amorphous material. The material for forming the gate electrode layer is not particularly limited, and a material which normally forms a gate electrode layer can be used. For example, a metal such as copper, aluminum, or gold can be used. Moreover, since the insulating film of the present invention has high transparency, it can be used as an insulating film in an LED element. [Examples] Next, the present invention will be described based on Synthesis Examples, Production Examples, Examples, and the like, but the present invention is not limited to the examples. The apparatus and measurement conditions used for physical property evaluation are as follows. (1) NMR: manufactured by BRUKER Co., Ltd. ^H-NMR measurement conditions: 300 MHz (tetramethyl decane = 0 ppm) 19F-NMR measurement conditions: 282 MHz (trichlorofluorotoluene = 0 ppm)

(2 ) IR 分析:PERKIN ELMER 公司製之 FT-IR SPECTROMETER 1 760X (3)重量平均分子量Mw及數平均分子量Μη: 藉由凝膠滲透色譜(GPC )測定。使用昭和電工(股 )製之Shodex GPC-104,使用Shodex公司製之管柱(將 -97- 201229151 GPC KF-604 1 支、GPC KF-603 1 支、GPC KF-602 2 支以 直列連接),使溶劑四氫呋喃(THF)以流速0.5ml/分鐘 流通,經測定後的數據計算得到。 合成例1(具有OH基之含氟烯丙基醚之均聚合物之合成 在具備有攪拌裝置及溫度計之l〇〇mL之玻璃製四口燒 瓶中,加入全氟(1,1,9,9-四氫-2,5-雙三氟甲基-3,6-二氧 雜壬烯醇) [化 78] ip. ch2=cfcf2ocfcf2ocfch2oh(2) IR analysis: FT-IR SPECTROMETER 1 760X manufactured by PERKIN ELMER Co., Ltd. (3) Weight average molecular weight Mw and number average molecular weight Μη: Determined by gel permeation chromatography (GPC). Shodex GPC-104 manufactured by Showa Denko Co., Ltd., using a pipe column made of Shodex (1 -97-201229151 GPC KF-604, 1 GPC KF-603, GPC KF-602 2 in-line) The solvent tetrahydrofuran (THF) was passed at a flow rate of 0.5 ml/min, and was calculated from the measured data. Synthesis Example 1 Synthesis of a homopolymer of a fluorine-containing allyl ether having an OH group In a glass four-necked flask equipped with a stirrer and a thermometer, perfluorogen (1, 1, 9, 9-tetrahydro-2,5-bistrifluoromethyl-3,6-dioxononenol) [78] ip. ch2=cfcf2ocfcf2ocfch2oh

C F 20g、[H- ( CF2CF2 ) 3-COO-]2 之8.0質量%全氟己烷溶液21.2g,充分進行氮取代後,氮 氣流下以2 0 °C攪拌2 4小時,生成高黏度的固體。將所得 之固體溶解於二乙醚者注入全氟己烷中,經分離、真空乾 燥得到聚合物17.6g。將此聚合物藉由19F-NMR、W-NMR 分析、IR分析,得知僅由上述含氟烯丙基醚之結構單位所 構成,且側鏈末端具有羥基的含氟聚合物。又,藉由使用 四氫呋喃(THF )溶劑之GPC分析測定的數平均分子量爲 9000,重量平均分子量爲22000。 合成例2 (具有α-氟丙烯醯基之含氟硬化性聚合物之合成 ) 在具備有迴流冷却器 '溫度§十、携伴裝置、滴下漏斗 -98- 201229151 之200mL的四口燒瓶中,投入二乙醚80mL'合成例1製 得之含有羥基含氟烯丙基醚之單獨聚合物5_〇g及吡啶 1.0 g,冰冷至5 °C以下。氮氣流下進行攪拌’同時以約3 0 分鐘滴加將α-氟丙烯酸氟化物:CH2 = CFCOF之1.2g溶解 於二乙醚20mL者。滴下終了後’使溫度返回至室溫,再 繼續攪拌4 · 0小時。將反應後之醚溶液置入分液漏斗中, 重複水洗、2%鹽酸水洗淨、5%NaCl水洗淨、水洗後,使 用無水硫酸鎂乾燥,將醚溶液以過濾分離。此醚溶液藉由 l9F-NMR分析得知含有含-〇〇CCF = CH2基之含氟烯丙基醚/ 含有OH基之含氟烯丙基醚=5 0/50莫耳%的共聚合物。又 ,塗佈於NaCl板,以室溫形成鑄膜(cast)者經由IR分 析,在1661(^^1觀測到碳-碳雙鍵之吸收,在1 770CHT1觀 測到C = 0基之吸收。所得之具有α-氟丙烯醯基之含氟硬 化性聚合物(醚溶液)中添加甲基異丁酮(MIBK )後, 藉由蒸發器餾除醚,調整爲固形分濃度15.0質量%。 合成例3(具有三乙氧基矽烷基之含氟硬化性聚合物之合 成) 在具備有溫度計、攪拌裝置、滴下漏斗之300mL的四 口燒瓶中,投入MIBK150mL、合成例1製得之含有羥基 含氟烯丙基醚之單獨聚合物20.0g及異氰酸酯丙基三乙氧 基矽烷17.4g ’冰冷至5°C以下。氮氣流下進行攪拌,再添 加月桂基二丁基錫18mg後,使溫度返回至室溫,再繼續 攪拌4.0小時。塗佈於NaCl板,以室溫形成鑄膜(cast) -99- 201229151 者經由IR分析’確認羥基之吸收消失,反應完成。反應 物不需純化,直接用於組成物。 [化 79] —(CH2CF)n I cf3 ?F3 i? CF2OCFCF2OCFCH2OCNH(CH2)3Si(OEt)3 實施例1 ( 40wt%四乙氧基矽烷(TEOS ) /合成例3聚合物 = 9/1之MIBK溶液之調製) 在合成例3之聚合物MIBK溶液20g中添加TEOS36g 、MIBK5 4g經充分攪拌調製熱水解型絕緣膜材料溶液。 實施例2(20wt%四乙氧基矽烷(TEOS) /合成例3聚合物 = 9/1之MIBK溶液之調製) 將合成例3之聚合物MIBK溶液10g、TEOS18g、 MIBK72g與實施例1同樣調製上述溶液。 實施例3 ( 40wt%四乙氧基矽烷(TEOS ) /合成例3聚合物 = 4/1之MIBK溶液之調製) 合成例3之聚合物MIBK溶液40g、TEOS32g、 ΜIBK2 8 g與實施例1同樣調製上述溶液。 實施例4 ( 20wt%四乙氧基矽烷(TEOS ) /合成例3聚合物 = 4/1之MIBK溶液之調製) 將合成例3之聚合物MIBK溶液20g、TEOS16g、 -100- 201229151 MIBK64g與實施例1同樣調製上述溶液。 實施例5 ( 20wt%四乙氧基矽烷(TEOS ) /合成例2聚合物 = 9/1之MIBK溶液之調製) 合成例 2之聚合物 MIBK溶液13.3g中添加 TEOS17.5g、三丙氧基丙基甲基丙烯酸酯0.5g、聚合起始 劑 Irgacure 907 (Ciba Specialty Chemicals Inc 公司製) O.lg、MIBK6 8.7g,以室溫充分攪拌調製紫外熱水解型絕 緣膜材料溶液。 實施例6 ( 20wt%四乙氧基矽烷(TEOS ) /合成例2聚合物 = 4/1之MIBK溶液之調製) 將合成例2之聚合物MIBK溶液26.7g、TEOS 15.5g 、三丙氧基丙基甲基丙烯酸酯〇.5g、聚合起始劑irgacure21.2 g of a 8.0% by mass perfluorocarbon solution of CF 20 g and [H-(CF2CF2 ) 3-COO-]2, which was sufficiently substituted with nitrogen, and then stirred at 20 ° C for 24 hours under a nitrogen stream to form a solid having a high viscosity. . The obtained solid was dissolved in diethyl ether and poured into perfluorohexane, and separated and vacuum dried to obtain 17.6 g of a polymer. The polymer was subjected to 19F-NMR, W-NMR analysis, and IR analysis to obtain a fluoropolymer having only a structural unit of the above-mentioned fluorine-containing allyl ether and having a hydroxyl group at the terminal of the side chain. Further, the number average molecular weight measured by GPC analysis using a tetrahydrofuran (THF) solvent was 9000, and the weight average molecular weight was 22,000. Synthesis Example 2 (Synthesis of fluorine-containing curable polymer having α-fluoropropenyl group) In a 200 mL four-necked flask equipped with a reflux cooler 'temperature § ten, a carrying device, and a dropping funnel-98-201229151, Separately, diethyl ether (80 mL) of the individual polymer 5_〇g and pyridine 1.0 g containing the hydroxyfluorinated allyl ether obtained in Synthesis Example 1 was ice-cooled to 5 ° C or lower. The mixture was stirred under a nitrogen stream. At the same time, 1.2 g of α-fluoroacrylic acid fluoride:CH 2 =CFCOF was dissolved in 20 mL of diethyl ether dropwise at about 30 minutes. After the end of the dropping, the temperature was returned to room temperature, and stirring was continued for 4 hours. The ether solution after the reaction was placed in a separatory funnel, washed with water, washed with 2% aqueous hydrochloric acid, washed with 5% NaCl water, washed with water, and dried over anhydrous magnesium sulfate. The ether solution was found to contain a fluorinated allyl ether containing -CCF = CH2 group / a fluorine-containing allyl ether containing OH group = 5 0 / 50 mol% of a copolymer by l9F-NMR analysis. . Further, when it was applied to a NaCl plate and a cast film was formed at room temperature, the absorption of the carbon-carbon double bond was observed at 1661 (1), and the absorption of C = 0 group was observed at 1 770 CHT1. After adding methyl isobutyl ketone (MIBK) to the obtained fluorine-containing curable polymer (ether solution) having an α-fluoropropenyl group, the ether was distilled off by an evaporator to adjust the solid content concentration to 15.0% by mass. Example 3 (Synthesis of a fluorine-containing curable polymer having a triethoxydecyl group) 150 mL of MIBK was placed in a 300 mL four-necked flask equipped with a thermometer, a stirring device, and a dropping funnel, and the hydroxyl group contained in Synthesis Example 1 was contained. 20.0 g of a fluoroallyl ether alone polymer and 17.4 g of isocyanate propyl triethoxy decane 'cooled to 5 ° C or less. Stirring under a nitrogen stream, and adding 18 mg of dibutyltin lauryl, the temperature was returned to room temperature. Stirring was continued for another 4.0 hours. It was applied to a NaCl plate and cast at room temperature (cast) -99-201229151. It was confirmed by IR analysis that the absorption of the hydroxyl group disappeared and the reaction was completed. The reactant was directly used for the composition without purification. [79] -(CH2CF)n I cf3 ?F 3 i? CF2OCFCF2OCFCH2OCNH(CH2)3Si(OEt)3 Example 1 (Preparation of 40 wt% tetraethoxydecane (TEOS) / Synthesis Example 3 Polymer = 9/1 MIBK solution) Polymer MIBK of Synthesis Example 3. To 20 g of the solution, TEOS 36 g and MIBK 5 4 g were added to prepare a solution of the thermal hydrolysis type insulating film material with sufficient stirring. Example 2 (Preparation of 20 wt% tetraethoxy decane (TEOS) / Synthesis Example 3 polymer = 9/1 MIBK solution The above solution was prepared in the same manner as in Example 1 except that 10 g of the polymer MIBK solution of Synthesis Example 3, TEOS 18g, and MIBK72g were used. Example 3 (40 wt% tetraethoxy decane (TEOS) / Synthesis Example 3 Polymer = 4/1 MIBK Preparation of Solution) 40 g of the polymer MIBK solution of Synthesis Example 3, TEOS32g, and ΜIBK2 8 g The above solution was prepared in the same manner as in Example 1. Example 4 (20 wt% tetraethoxydecane (TEOS) / Synthesis Example 3 Polymer = 4 Preparation of MIBK solution of /1) 20 g of the polymer MIBK solution of Synthesis Example 3, TEOS 16 g, -100-201229151 MIBK64g were prepared in the same manner as in Example 1. Example 5 (20 wt% tetraethoxydecane (TEOS) / Synthesis Example 2 Polymer = 9/1 Preparation of MIBK Solution) Polymer MIBK solution of Synthesis Example 2 To 13.3 g, TEOS 17.5 g, tripropoxypropyl methacrylate 0.5 g, polymerization initiator Irgacure 907 (manufactured by Ciba Specialty Chemicals Inc.), O.lg, MIBK6 8.7 g, were added, and the mixture was stirred at room temperature to prepare ultraviolet rays. Thermal hydrolysis type insulating film material solution. Example 6 (Preparation of 20 wt% tetraethoxy decane (TEOS) / Synthesis Example 2 Polymer = 4/1 MIBK solution) 26.7 g of polymer MIBK solution of Synthesis Example 2, TEOS 15.5 g, tripropoxy group Propyl methacrylate 〇.5g, polymerization initiator irgacure

907 (Ciba Specialty Chemicals Inc 公司製)〇.lg、MIBK 5 7 · 3 g與實施例5同樣調製上述溶液。 試驗例1 對於實施例1〜6各自所得之聚合物,測定玻璃轉化溫 度(Tg )及熱分解溫度(Td )。結果如表1所示。 玻璃轉化溫度(Tg): 使用差式掃描熱量計(SEIKO公司製、RtG220 ), 以l〇°C/分鐘之條件使由30°C~6 00°C之溫度範圍進行昇溫_ 降溫-昇溫(第2次之昇溫稱爲第2回)所得之第2回之 -101 - 201229151 吸熱曲線的中間點作爲T g ( °c )。 熱分解溫度(Td ): l〇°C/分鐘之 使用島津製作所製TGA-50型熱天秤,以 昇溫速度測定1 %質量減少開始的溫度。 試驗例2 橢圓測厚儀 消衰係數) 對於實施例1〜6各自所得之聚合物,使用 (Ellipsometer)藉由以下方法測定透過率( 及折射率。結果如表1所示。 試料之製作: ,塗佈實施 使晶圓旋轉 佈,經乾燥 使用旋轉塗佈器,在8吋之矽晶圓基板上 例1〜6各自所得之各組成物,首先以3 00rpm 3秒,接著以4000rpm使晶圓轉20秒同時塗 後調整成爲1〜2 μπι之膜厚,同時形成被膜。 折射率之測定: 製之 VASE )、折射率 使用分光橢圓測厚儀(J.A.Woollam公司 ellipsometer)測定各波長光之k値(消衰係數 及膜厚。 -102- 201229151 〔表1〕 玻璃轉化溫度 (Tg ' °c) 熱分解溫度 (Td &gt; °C ) 膜厚 (μηι) k値 折射率 實施例1 無法觀測 310 0.8 0.000 1.418 實施例2 無法觀測 311 1.5 0.000 1.413 實施例3 無法觀測 310 1.2 0.000 「1.402 實施例4 無法觀測 315 1.9 0.000 1.399 實施例5 無法觀測 310 1.3 0.002 1.420 實施例6 無法觀測 307 1.5 0.005 1.406 〔產業上之可利用性〕 本發明之組成物係可形成塗佈型之絕緣膜者,可適用 的用途、 。又,適 成薄膜電 於各種用途。特別適合作爲形成大面積之絕緣膜 形成使用於必須有可撓性之用途之絕緣膜的材料 合作爲半導體元件用之絕緣膜,特別適合作胃$ 晶體之閘極絕緣膜的材料。 【圖式簡單說明】 〔圖1〕圖1係表不反轉共平面型之薄 符肤萆晶體 例的截面模式圖。 &lt; 【主要元件符號說明】 1 =薄膜電晶體 1 0 :閘極電極層 1 1 :閘極絕緣膜 1 2 :鈍化膜 13 :半導體層 -103- 201229151 1 4 :源極•汲極電極 1 5 :氧化膜 -104-907 (manufactured by Ciba Specialty Chemicals Inc.) lg.lg, MIBK 5 7 · 3 g The above solution was prepared in the same manner as in Example 5. Test Example 1 The glass transition temperature (Tg) and the thermal decomposition temperature (Td) of the polymers obtained in each of Examples 1 to 6 were measured. The results are shown in Table 1. Glass transition temperature (Tg): Using a differential scanning calorimeter (manufactured by SEIKO Co., Ltd., RtG220), the temperature is raised from 30 ° C to 600 ° C under conditions of 〇 ° C / min _ cooling - temperature rise ( The second temperature rise is called the second back. The second point of the -101 - 201229151 is the intermediate point of the endothermic curve as T g ( °c ). Thermal decomposition temperature (Td): l 〇 ° C / min Using a TGA-50 type thermal scale manufactured by Shimadzu Corporation, the temperature at which the mass reduction starts at 1% is measured at the temperature increase rate. Test Example 2 Decay coefficient of elliptical thickness gauge) For each of the polymers obtained in each of Examples 1 to 6, the transmittance (and the refractive index) were measured by the following method using an (Ellipsometer). The results are shown in Table 1. Preparation of the sample: The coating is performed by rotating the wafer, drying and using a spin coater, and the respective compositions obtained in Examples 1 to 6 on the wafer substrate after 8 ,, firstly at 300 rpm for 3 seconds, followed by 4,000 rpm. After rounding for 20 seconds, the coating was adjusted to a film thickness of 1 to 2 μm, and a film was formed at the same time. The refractive index was measured: VASE was prepared, and the refractive index was measured using a spectroscopic elliptical thickness gauge (JAWoollam ellipsometer). k値 (deactivation coefficient and film thickness. -102- 201229151 [Table 1] Glass transition temperature (Tg ' °c) Thermal decomposition temperature (Td &gt; °C) Film thickness (μηι) k値 refractive index Example 1 Observation 310 0.8 0.000 1.418 Example 2 Unable to observe 311 1.5 0.000 1.413 Example 3 Unable to observe 310 1.2 0.000 "1.402 Example 4 Unable to observe 315 1.9 0.000 1.399 Example 5 Unable to observe 310 1.3 0.002 1.420 Example 6 Observation 307 1.5 0.005 1.406 [Industrial Applicability] The composition of the present invention can form a coating type insulating film, and can be applied, and is suitable for use in various applications. The insulating film of the area is formed of an insulating film for use in applications requiring flexibility, and is an insulating film for a semiconductor element, and is particularly suitable as a material for a gate insulating film of a stomach. [Simplified illustration] 1] Fig. 1 is a cross-sectional schematic view showing an example of a thin-grained skin of a coplanar type. [Main component symbol description] 1 = thin film transistor 1 0: gate electrode layer 1 1 : gate insulating film 1 2: passivation film 13: semiconductor layer -103 - 201229151 1 4 : source • drain electrode 1 5 : oxide film -104-

Claims (1)

201229151 七、申請專利範圍: 1 . 一種塗佈型絕緣膜形成用含氟組成物,其特徵係由 有機矽化合物(A)、及具有下述式(L): [化1 ] —f CX^^—CX3·)— 1 (L) (CX4X5K~fC;0) (式中,X1及X2係相同或相異’爲H或F ; X3係H、F 、CH3或CF3 ; X4及x5係相同或相異,爲Η、F或CF3 ; Rf係可具有醯胺鍵或脲鍵之碳數1〜40之含氟烴基、或可 具有醯胺鍵、碳酸酯鍵、胺基甲酸酯鍵或脲鍵之碳數 2〜100之具有醚鍵之含氟烴基之結構末端之1~3處被Y( γ係末端至少含有1個碳數1〜50之水解性金屬烷氧化物 部位的1價有機基,或末端具有乙烯性碳-碳雙鍵之碳數 2〜10之1價有機基)取代之含氟烴基;a係0〜3之整數; b及c係相同或相異,爲〇或1)表示之結構單位的含氟 聚合物(B )所構成。 2·如申請專利範圍第1項之塗佈型絕緣膜形成用含氟 組成物,其中有機矽化合物(A )係下述式(1 ): {Si(Ra)s(Rb)«(Rc)u(Rd)v(Re)w}n ( 1 ) (式中,Ra、Rb、Rc及Rd係相同或相異,爲氫、鹵素、 碳數1~1〇之烷氧基、碳數1〜10之胺基、碳數1〜10之烷 基、碳數6~10之芳基、碳數3〜10之稀丙基、或碳數 3〜10之縮水甘油基,Re係相同或相異,爲-〇-、-NH-、- -105- 201229151 C = C-、或矽烷鍵,s、t、u&amp; V係相同或相異’爲〇或1 ’ w係〇〜4之整數,η係1〜20,η爲1時’ s + t + u + v係4, w爲0’ η爲2~20時,s + t + u + v係相同或相異,爲〇〜4,w 係相同或相異,爲〇〜4,w爲1以上之整數時’至少2個 Si係介於Re鍵結成直鏈、梯子型、環狀、或雜環狀)表 示的化合物(A 1 )。 3 ·如申請專利範圍第1或2項之塗佈型絕緣膜形成用 含氟組成物,其中有機矽化合物(A)係四烷氧基矽烷。 4. 如申請專利範圍第1、2、或3項之塗佈型絕緣膜形 成用含氟組成物,其中相對於有機矽化合物(A)與含氟 聚合物(B)之合計質量,有機矽化合物(A)爲50質量 %以上。 5. 如申請專利範圍第1、2、3或4項之塗佈型絕緣膜 形成用含氟組成物,其係含有有機溶劑。 6. 如申請專利範圍第1、2、3、4或5項之塗佈型絕 緣膜形成用含氟組成物’其係薄膜電晶體之閘極絕緣膜形 成用。 7. —種絕緣膜’其特徵係由如申請專利範圍第1、2、 3、4 ' 5或6項之塗佈型絕緣膜形成用含氟組成物所形成 〇 8. —種薄膜電晶體’其特徵係依序層合半導體層、如 申請專利範圍第7項之絕緣膜、及閘極電極層° -106-201229151 VII. Patent application scope: 1. A fluorine-containing composition for forming a coating type insulating film, which is characterized by an organic cerium compound (A) and having the following formula (L): [Chemical Formula 1] - f CX^ ^—CX3·)— 1 (L) (CX4X5K~fC;0) (wherein X1 and X2 are the same or different from each other as H or F; X3 is H, F, CH3 or CF3; X4 and x5 are the same Or different, Η, F or CF3; Rf may have a fluorinated hydrocarbon group having a carbon number of 1 to 40 of a guanamine bond or a urea bond, or may have a guanamine bond, a carbonate bond, a urethane bond or 1 to 3 of the structural terminal of the fluorine-containing hydrocarbon group having an ether bond of 2 to 100 carbon atoms of the urea bond, Y (the γ-based terminal contains at least one monovalent of a hydrolyzable metal alkoxide moiety having 1 to 50 carbon atoms) a fluorine-containing hydrocarbon group substituted with an organic group or a monovalent organic group having a carbon number of 2 to 10 at the terminal having an ethylenic carbon-carbon double bond; a is an integer of 0 to 3; b and c are the same or different, and are 〇 Or 1) the structural unit of the fluoropolymer (B). 2. The fluorine-containing composition for forming a coating type insulating film according to the first aspect of the invention, wherein the organic cerium compound (A) is represented by the following formula (1): {Si(Ra)s(Rb)«(Rc) u(Rd)v(Re)w}n ( 1 ) (wherein, Ra, Rb, Rc and Rd are the same or different, and are hydrogen, halogen, alkoxy group having 1 to 1 carbon number, carbon number 1 An amino group of ~10, an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, a propyl group having 3 to 10 carbon atoms, or a glycidyl group having 3 to 10 carbon atoms, and the Re is the same or phase. Iso, -〇-, -NH-, - -105- 201229151 C = C-, or decane bond, s, t, u &amp; V is the same or different 'is 〇 or 1 ' w system 〇 ~ 4 integer η is 1 to 20, when η is 1, 's + t + u + v is 4, w is 0', and when η is 2 to 20, s + t + u + v are the same or different, which is 〇~4 ,w is the same or different, is 〇~4, w is a compound of 1 or more, and at least 2 Si systems are represented by Re bonds in a linear, ladder, cyclic, or heterocyclic form (A) 1 ). The fluorine-containing composition for forming a coating type insulating film according to the first or second aspect of the invention, wherein the organic ruthenium compound (A) is a tetraalkoxy decane. 4. The fluorine-containing composition for forming a coating-type insulating film according to the first, second, or third aspect of the invention, wherein the organic ruthenium is based on the total mass of the organic ruthenium compound (A) and the fluoropolymer (B). The compound (A) is 50% by mass or more. 5. The fluorine-containing composition for forming a coating-type insulating film according to claim 1, 2, 3 or 4 of the patent application, which contains an organic solvent. 6. The fluorine-containing composition for forming a coating type insulating film according to the first, second, third, fourth or fifth aspect of the patent application is used for forming a gate insulating film of a thin film transistor. 7. An insulating film 'characterized by a fluorine-containing composition for forming a coating type insulating film as disclosed in claim 1, 2, 3, 4' 5 or 6 of the patent application. 'The characteristic is to sequentially laminate the semiconductor layer, such as the insulating film of the seventh item of the patent application, and the gate electrode layer ° -106-
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