201226827 六、發明說明： 【發明所屬之技術領域】 本發明係有關一種散熱模組，特別是一種適用於高功率電子元 件的散熱模組。 【先前技術】 電子業界常採用散熱模組來對較大功耗電子元件進行散熱，目 前最基本的散熱模組，是基於熱傳導的原理所設計鰭片式結構，散 ® 熱模組與電子元件相接觸，以接收電子元件工作時散發的熱量，將 熱量傳遞到鰭片組，由鰭片組將熱量散發到空氣中。鰭片與空氣接 觸的面積及數量影響著散熱模組的散熱效率，然而受限於現有技術 的問題，這種最基本的散熱模組結構，僅能實現功率約100W以内的 電子元件的散熱，對於更大功率的電子元件，散熱模組就需要增設 如風扇或其他的輔助結構，通過增加空氣流動速度，或採用其他熱 傳導方式來提高散熱效果，以實現大功率電子元件的散熱。然而， ® 對於某些電子元件如LED來說，風扇的使用壽命會遠遠短於這些電 子元器件的使用壽命，因此風扇式的散熱模組，往往在電子元件仍 正常工作的時候，風扇就已損壞，使得不能夠與電子元件的工作壽 命合理的配合，以達到合格的使用效果。而針對基本結構的大功率 散熱模組的合理設計，一直是產業界研究的重點與難點。 201226827 , 【發明内容】 為解決非風扇式散熱模組散熱效率不足的問題’本發明提 供了一種高效率的散熱模組。 本發明為解決上述問題所採用的技術方案是： 一種用於對發熱元件進行散熱的大功率散熱模組’包括： 一熱交換元件，在内部具密閉内腔，内腔内設有粉末燒結結構 及氣、液兩相變化的工作液，龙在外部具有一放置發熱元件的平整 部，以及相對設置於所述平整部後部的固定結構，這種熱交換元件 • 相當於熱傳導元件裡的超導體，當發熱元件與散熱模組邊緣溫差較 大時，就能夠立即將熱源的熱立即分散至散熱模組上； 一非鰭片式散熱模組，具有一安裝所述固定結構的中心結構， * 以及圍繞該中心結構設置的至少一空氣通道，籍由發熱元件所產生 的熱量經過所述熱交換元件傳遞到非鰭片式散熱模組，能夠通過煙 _效應在所述空氣通道中產生氣流，進而快速散發出發熱元件所產 生的熱量。 • 上述的中心結構外側設置有若干朝外發散的葉片，每兩相鄰葉 另相互連接，並與中心結構的週邊形成一空氣通道，以葉片作為導 熱結構而與空氣接觸。 上述葉片依次由外壁連接在一起，形成圍繞於中心結構的筒狀 週邊'。構’所述外壁及其相連的兩葉月’與中心結構的外側形成所 述二氣通道’進一步可將外壁作為導熱結構’以增加與空氣的樓 面積。 201226827 .在本發明的一實施例中，所述外壁為平面壁狀，所述週邊結構 為若干外壁依次連接組成具備棱角的多邊形筒，所述葉片連接於多 邊形筒的内側棱角處，有效利用與空氣的接觸面積。 在本發明的一實施例中’所述外壁為爭面壁狀，所述週邊結構 為若干外壁依次連接組成正多邊形筒，所述葉片連接於正多邊形筒 的内側轉角處，以有效利用與空氣的接觸面積。 在本發明的一實施例中，外壁為弧面狀’所述週邊結構為外壁 依次連接組成的圓形筒，所述葉片連接於圓形筒的内側，以有效增 加與空氣的接觸面積。 在本發明的一種實施例中’所述熱交換元件為均熱板，具有一 中段作為所述平整部，以及經壓制成型而對稱於中段兩端，且與中 段垂直的兩插入段作為所述固定結構；所述非鰭片式散熱模組的中 心結構為一對應插裝所述兩插入段的插孔，通過均熱板良好的導熱 性能’達到需要的散熱效果。 ^ 上述的均熱板的每一插入段的橫截面分別呈現朝外凸起的圓弧 形，使兩插入段整體組合為一具有對稱缺口的圓環形，相應的，所 述非鰭片式散熱模組的插孔為分別與兩插入段形狀相配的兩弧形 孔’得以較好的固定及導熱能力。 上述均熱板的平整部與其兩端的插入段之間具有向中心收縮的 過渡段。非鰭片式散熱模組的端面上設有凹入的容置腔，用以容置 定位所述均熱板的過渡段，所述插孔由容置腔内部開設。並且，所 201226827 述插入段可與插孔焊接固定。 在本發明的一種實施例中，所述熱交換元件為熱柱，具有一端 面作為所述平整部，以及柱體部分作為所述固定結構；所述非鰭片 式散熱模組的中心結構為一對應插裝所述熱柱的柱體的插孔，利用 熱柱的良好導熱性及其形狀特性，達到較好的固定及導熱能力。並 且，柱體可與插孔焊接固定。 上述的熱交換元件的内腔内設置有支撐結構，以支撐其外形。 上述的非鰭片式散熱模組為一體成型結構或分體式結構。 ® 本發明所提供的散熱模組，通過熱交換元件直接安裝發熱元 件，可將熱量的快速傳遞到非鰭片式散熱模組，並由非鰭片式散熱 模組所設的空氣通道，因熱量而產生煙囪效應，以實現空氣快速的 自然對流，形成熱交換而將熱量散發，可見其良好的散熱效果，相 比傳統的散熱模組，在不使用風扇及其他冷卻系統的情況下，本發 明就能夠直接應用於100W以上的發熱元件，因此尤其適合於大功率 發熱元件的散熱。 【實施方式】 本發明所提供的一種大功率散熱模組，可用於對發熱元件3進 行散熱，結構包括一熱交換元件1及一非鰭片式散熱模組2。 如圖1、圖5、圖6，及圖7圖9、圖10，該熱交換元件1具備 一平整部11用於放置發熱元件3,在平整部11後側設有固定結構12 以進行安裝固定，如圖3及圖8所示，該熱交換元件1並具有密閉 201226827 内腔101，在該内腔101内填充有工作液，且内腔101的壁上附著有 粉末燒結部102，並如圖3所示，還可在内腔101内設有支撐整體強 度的支撐結構103，熱交換元件1内部的工作液具有液-氣兩相變化 功能，因此相當於一熱傳導元件裏的超導體，在所放置的發熱元件 發熱後，工作液昇華成為氣體而吸收熱量，在流到其他部位凝固而 散發熱量，達到熱傳導的功能。 如圖1、圖4及圖7所述，該非鰭片式散熱模組2具有一中心孔 部21，用於插入安裝上述的固定結構12，以固定住熱交換元件1， ® 並且保證所固定熱交換元件1的平整部11略凸起於中心孔部21之 外，以使其位於整個非鰭片式散熱模組2的端面處，用以安裝固定 發熱元件3 ;圍繞非鰭片式散熱模組2的中心孔部21，則設置有空 ' 氣通道22，空氣通道22能夠產生煙囪效應，在發熱元件3發熱過程 * 中，熱量傳遞到熱交換元件1，當發熱交換元件1與非鰭片式散熱模 組2溫差較大時，就能夠立即將發熱元件3的熱立即分散至非鰭片 式散熱模組2上，由内而外傳導出去，一方面非鰭片式散熱模組2 φ 的週邊部分與空氣接觸而對熱量產生熱輻射作用以散出多餘熱量， 另一方面其空氣通道22因熱量可產生空氣流，空氣流通過空氣通道 22，能夠將多餘熱量帶走，形成空氣對流現象。 本發明的熱交換元件1根據實際情況，具有兩種典型的實施例， 在此分別進行說明。 參照圖1〜圖4，該實施例中，熱交換元件1為一均熱板，其内 部結構如前所述，具有含粉末燒結部102及工作液的密閉内腔101， 201226827 、'a加支標結構103 ’提高整體強度；該均熱板的外部中段留 作平整部 1 ’而對稱於該中段兩側’則分別經壓制成型為兩垂直 於中段的插入段，該插入段即為固定結構12 ;相應的，非鰭片式散 熱模”且2的中心處，設置有插孔，用於插裝固定插入段，該插孔即 為中孔邛2丨，插孔式中心孔部2在插入均熱板，内壁與插入段貼 合，使得設置於平整部n的發熱元件3，工作時的熱量能夠迅速、 順暢、’·!由插入I又傳導到非韓片式散熱模組2，其中作為較優實施方 案，插入段與插孔在裝配過程中，可以採用貼片焊接方式，即在插 Φ人段或插孔丄敷焊膏，再進行回爐力。熱，使得熱交換元件1與非歸 片式散熱模組2焊接固定，採用該方案，在加熱工程中，固定結構 12因熱脹冷縮而具有-膨脹作用’因此可以和非縛片式散熱模組2 - &中心孔部2緊密貼合在—起’達到良好散熱效果。 . 為得以最好的散熱效率’作為優選的方案，均熱板熱交換元件！ 雨侧的插人翻定結構12,其_面分別呈現朝外凸起的圓孤形， 使兩插入段整體組合為-類似圓環形的筒狀，一般情況下僅是兩者 籲互不接觸，令圓筒形狀分成了兩半而不完整，在兩側具有_對對稱 的缺口 ’如圖11所示，相應的非鳍片式散熱模組2的插孔式中心孔 部21為與兩插入段形狀相配的兩弧形孔；且優選的兩弧形孔相互連 通，並通過孤形面過渡，使得熱量不會朝非縛片式散熱模組2的中 心部位傳導而造成熱量積累’且在具體連接時中空部分可以用於發 熱元件的走線；當然’為了保證所固定的均熱板不會轉動或動搖， 插孔之間可採用部分連通，即應該保證插孔仍具有限位固定的插入 201226827 段孔型，以保證固定功能。 、 另外作為優選的方案’均熱板在裝配於非鰭片式散熱模組2時 選擇沒入安裝式為宜’以得到熱量的充分傳導，因此本發明的較優 選方案為，均熱板的平整部11與其兩端的插入段固定結構12之間 具有向中心收縮的過渡段13，為使得壓制方便，可設計為逐漸收口 過渡的結構，兩過渡段13接近平整部11的一側較寬，接近插入段 固定結構12的一側則較窄’因此可以作為一限位於非鰭片式散熱模 組2的結構；相應的如圖中所示的，非鰭片式散熱模組2靠近中心 ® 孔部21，其端面上設有一容置腔210，該容置腔210大小適宜於與 兩過渡段13組成的寬度相適宜，同時，將中心孔部21的插孔開設 於容置腔210的槽底部，在裝配均熱板時，平整部11及兩過渡段13 正好可以裝入容置腔210内’同時插入段固定結構12可以經容置腔 210插入插孔進行固定，並保證容置腔210對兩過渡段π的限位。 貫際結構中’還可優選方案為：插孔設計為通孔，由非韓片式散熱 ^ 模組2的容置腔210的槽底，貫通至另一側的端面，使得非鰭片式 散熱模組2整體具備中空通孔，利於散熱，並且，可配合平整部η 略凸起於中心部位21端面的結構，以在平整部π側邊留有連通至 容置腔210及插孔的縫隙，可用於發熱元件的走線。 參照圖5及圖6 ’本發明所應用的發熱元件3，可以為led、 CPU、GPU ( Graphic Processor IJnit )、晶片組、功率半導體或集成有 電子元件的電路板’均可採用直接貼在設平整段U上’並採用貼片 式固定，如圖中所示，應用晶片的實施方式，可在非鰭片式 9 201226827 散熱模組2的中心部位21圍繞發熱元件3安裝一蓋板41，可採用螺 釘與非鰭片式散熱模組2固定連接，並在上方配合密封圈42安裝一 帶透鏡的上蓋43，整體形成密封防水結構，其中LED晶片的走線可 以從兩平整段n之間連到非鰭 >；式散熱模組2的後部，再引出。 參照圖7〜圖9，為本發明的第二種實施例，其中熱交換元件1 採用熱柱（Heat Column / vapor chamber )的結構，熱柱成體呈一圓 柱形，圓柱形的一端面作為平整部Η，而柱體部分則作為所述固定 結構12，如圖8中，熱柱的内部，和均熱板類似，具有含粉末燒結 籲部102及工作液的密閉的内腔101，實現氣-液兩相變化而熱傳遞， 而由於其本身尺寸，在其内腔内壁均可附著粉末燒結部102，且 約有-半空間填充工作液，留另一半為真空；相應的，非縛片式散 熱核組2的中心孔部2卜則可設計為-對應插裝柱體式固定結構12 的插孔’且為達到較好的固定效果，可採用貼片焊接方式，即在柱 體或插孔塗數煜备 貧’再進行回爐加熱，使得熱交換元件1與非鰭片 φ式政’、、、模組2焊接固定，採用該方案，在加熱工程中，固定結構12 因熱脹冷縮而具有一膨脹作用，因此可以和非韓片式散熱模組2的 中心孔部2緊密貼合在—起，達到良好散熱效果。 本貝把例相對結構更為方便設置，如圖9及圖10，其所應用的 發熱 το 件 3 ’ 同樣可以為 lEE)、cpu、GPU ( Graphic Processor Unit)、 B曰片組、功率半導體或集成有電子元件的電路板，均可採用直接貼 在°又平整段11上’並採用貼片式蚊，如圖中所示，應用於LED晶 #的式’可在非㈣式散熱模組2的中心、部位21圍繞發熱元 10 201226827 件3安裝一蓋板41，可採用螺釘與非鰭片式散熱模組2固定連接， 並在上方配合密封圈42安裝一帶透鏡的上蓋43，整體形成密封防水 結構。 本發明的非鰭月式散熱模組2採用空氣通道22式的結構，其空 氣通道22可以由設置於中心孔部21外側的葉片221組成，每兩相 鄰葉片221之間相互在外側連接形成閉合結構，並結合中心孔部21 的週邊，即成為了 一個空氣通道22，因此圍繞中心孔部21，就可以 由若干葉片221形成一類似圓筒的形狀，空氣通道22均沿其周向分 ® 佈，並且每一空氣通道22的方向均和中心孔部21的軸向相同。具 體的，在中心孔部21外圍繞形成一筒狀週邊結構，該筒狀週邊結構 是由連接葉片221外側的外壁23組成的，亦由葉片221與中心孔部 * 21形成連接關係。 • 下面給出幾種空氣通道22較優的實現方式： 如圖11所示，該實施例中，外壁23為平面壁狀，週邊結構由 外壁23依次連接，組成一具備棱角的多邊形筒狀，其中，每一棱角 ^ 均由一葉片221連接至中心孔部21，這樣由兩相鄰葉片221及一外 壁23即形成一空氣通道22。該結構在使用過程中，外壁23、葉片 221均與空氣接觸，可向空氣輻射熱量，且在空氣流過相應空氣通道 22時，就能夠實現熱交換。 如圖12所示，該實施例中，外壁23為平面壁狀，週邊結構為 若干外壁23依次連接組成正多邊形筒狀，與前一實施例相比，沒有 突出的棱角，其中，週邊結構的每一轉角處均由一葉片221連接至 201226827 中心孔部21，這樣由兩相鄰葉片221及一外壁23即形成一空氣通道 22。該結構外壁23、葉片221均與空氣接觸，在空氣流過相應空氣 通道22時，就能夠實現熱交換，-S·能夠保證週邊結構具備較大的散 熱面積，熱量輻射滿足要求。 如圖13所示，該實施例中’外壁23為弧面狀，週邊結構為外 壁23依次連接組成的圓形筒狀’此結構下，葉片可平均分佈至週邊 結構及中心孔部21之間，以實現兩者連接。該結構的外壁23、葉片 221均與空氣接觸，在空氣流過相應空氣通道22時，就能夠實現熱 ® 交換’且能夠保證週邊結構具備較大的散熱面積，熱量輻射滿足要 求。 上述幾個實施例中，非鰭另式散熱模組2均優選為金屬材料的 體成型式結構，當然也可以為为體式由多個分離結構拼接虹成， 材料可採用鋁或其他具備良好導熱性的物質。201226827 VI. Description of the Invention: [Technical Field] The present invention relates to a heat dissipation module, and more particularly to a heat dissipation module suitable for high power electronic components. [Prior Art] The electronics industry often uses thermal modules to dissipate heat from large-capacity electronic components. The most basic thermal modules are based on the principle of thermal conduction. Fin-type thermal modules and electronic components In contact with each other, the heat radiated from the operation of the electronic component is transmitted to the fin group, and the heat is radiated into the air by the fin group. The area and quantity of the fins in contact with the air affects the heat dissipation efficiency of the heat dissipation module. However, due to the problems of the prior art, the most basic heat dissipation module structure can only achieve heat dissipation of electronic components within a power of about 100 W. For more powerful electronic components, the heat dissipation module needs to add a fan or other auxiliary structure to increase the heat dissipation effect by increasing the air flow speed or using other heat conduction methods to achieve heat dissipation of high-power electronic components. However, for some electronic components such as LEDs, the life of the fan is much shorter than the life of these electronic components. Therefore, the fan-type cooling module often uses the fan when the electronic components are still working normally. It has been damaged, so that it can not be properly matched with the working life of the electronic components to achieve a qualified use effect. The rational design of high-power cooling modules for basic structures has always been the focus and difficulty of industry research. 201226827, SUMMARY OF THE INVENTION In order to solve the problem of insufficient heat dissipation efficiency of the non-fan type heat dissipation module, the present invention provides a high efficiency heat dissipation module. The technical solution adopted by the present invention to solve the above problems is as follows: A high-power heat dissipation module for dissipating heat from a heating element includes: a heat exchange element having a sealed inner cavity therein and a powder sintered structure in the inner cavity And a working fluid in which the gas and the liquid change in two phases, the dragon has a flat portion on the outside of the heating element, and a fixed structure disposed opposite to the rear portion of the flat portion, the heat exchange element is equivalent to the superconductor in the heat conduction element, When the temperature difference between the heating element and the edge of the heat dissipation module is large, the heat of the heat source can be immediately dispersed to the heat dissipation module; a non-fin type heat dissipation module has a central structure for mounting the fixed structure, * and At least one air passage disposed around the central structure, heat generated by the heat generating component is transmitted to the non-fin fin heat dissipating module through the heat exchange element, and an air flow can be generated in the air passage by the smoke effect. Quickly dissipates the heat generated by the heating element. • The outer side of the central structure is provided with a plurality of outwardly diverging blades, and each two adjacent leaves are connected to each other and form an air passage with the periphery of the central structure to contact the air with the blades as a heat conducting structure. The blades are in turn joined together by outer walls to form a cylindrical periphery ' around the central structure'. The outer wall and its associated two-leaf months and the outer side of the central structure form the two-gas passages, and the outer wall can be used as a heat-conducting structure to increase the floor area with air. 201226827. In an embodiment of the present invention, the outer wall is a planar wall shape, and the peripheral structure is a plurality of outer walls sequentially connected to form a polygonal cylinder having an angular shape, and the blade is connected to an inner corner of the polygonal cylinder, and the utility model is effectively utilized. The contact area of the air. In an embodiment of the invention, the outer wall is in the shape of a wall, and the peripheral structure is a plurality of outer walls which are sequentially connected to form a regular polygonal cylinder, and the blades are connected to the inner corner of the regular polygonal cylinder to effectively utilize the air. Contact area. In an embodiment of the invention, the outer wall is arcuate. The peripheral structure is a circular cylinder in which the outer walls are sequentially connected, and the blades are connected to the inner side of the circular cylinder to effectively increase the contact area with air. In one embodiment of the present invention, the heat exchange element is a heat equalizing plate having a middle portion as the flat portion, and two insert segments that are press-formed symmetrically at both ends of the middle portion and perpendicular to the middle portion as the The fixing structure; the central structure of the non-fin type heat dissipating module is a corresponding jack for inserting the two insertion sections, and the required heat dissipation effect is achieved by the good thermal conductivity of the soaking plate. ^ The cross-section of each of the insertion sections of the above-mentioned heat equalizing plate respectively has a circular arc shape which is convex outward, so that the two insertion sections are integrally combined into a circular ring having a symmetrical notch, and correspondingly, the non-fin type The jacks of the heat dissipation module are two arc-shaped holes respectively matched with the shapes of the two insertion segments, which are better fixed and heat-conductive. The flat portion of the above-mentioned heat equalizing plate has a transition portion which is contracted toward the center between the insertion portions at both ends thereof. The end surface of the non-fin fin type heat dissipating module is provided with a concave receiving cavity for accommodating a transition portion for positioning the heat equalizing plate, and the jack is opened by the inside of the accommodating cavity. Moreover, the insertion section of 201226827 can be welded and fixed to the jack. In an embodiment of the present invention, the heat exchange element is a hot column having an end surface as the flat portion, and a column portion as the fixed structure; the central structure of the non-fin fin type heat dissipation module is A jack corresponding to the column of the hot column is inserted, and the good thermal conductivity and shape characteristics of the hot column are utilized to achieve better fixing and heat conduction capability. Moreover, the cylinder can be welded and fixed to the socket. The inner cavity of the heat exchange element described above is provided with a support structure to support its outer shape. The non-fin type heat dissipation module described above is an integrally formed structure or a split structure. The heat dissipation module provided by the invention directly installs the heating element through the heat exchange component, and can quickly transfer heat to the non-fin type heat dissipation module, and the air passage provided by the non-fin type heat dissipation module is The heat generates a chimney effect to achieve rapid natural convection of the air, forming heat exchange and dissipating heat, which shows good heat dissipation effect. Compared with the conventional heat dissipation module, without using a fan and other cooling systems, The invention can be directly applied to a heating element of 100 W or more, and is therefore particularly suitable for heat dissipation of a high-power heating element. [Embodiment] A high-power heat dissipation module provided by the present invention can be used for dissipating heat from the heat-generating component 3. The structure includes a heat exchange component 1 and a non-fin-chip heat dissipation module 2. As shown in FIG. 1, FIG. 5, FIG. 6, and FIG. 7, FIG. 9, FIG. 10, the heat exchange element 1 is provided with a flat portion 11 for placing the heat generating component 3, and a fixing structure 12 is provided on the rear side of the flat portion 11 for mounting. As shown in FIG. 3 and FIG. 8 , the heat exchange element 1 has a sealed inner cavity 101 , which is filled with a working fluid, and a powder sintered portion 102 is adhered to the wall of the inner cavity 101 , and As shown in FIG. 3, a support structure 103 supporting the overall strength may be disposed in the inner cavity 101. The working fluid inside the heat exchange element 1 has a liquid-gas two-phase change function, and thus corresponds to a superconductor in a heat conduction element. After the heat generating element is heated, the working fluid sublimes into a gas to absorb heat, and is solidified to flow to other parts to dissipate heat to achieve heat conduction. As shown in FIG. 1 , FIG. 4 and FIG. 7 , the non-fin type heat dissipation module 2 has a central hole portion 21 for inserting and installing the above-mentioned fixing structure 12 to fix the heat exchange element 1 , and to ensure the fixing. The flat portion 11 of the heat exchange element 1 is slightly protruded from the center hole portion 21 so as to be located at the end surface of the entire non-fin fin type heat dissipating module 2 for mounting and fixing the heat generating component 3; The central hole portion 21 of the module 2 is provided with an air passage 22, and the air passage 22 can generate a chimney effect. In the heating process of the heat generating component 3, heat is transferred to the heat exchange element 1, and when the heat exchange element 1 is non- When the temperature difference of the fin type heat dissipation module 2 is large, the heat of the heat generating component 3 can be immediately dispersed to the non-fin type heat dissipation module 2, and conducted out from the inside and the outside. On the one hand, the non-fin type heat dissipation module The peripheral portion of 2 φ is in contact with air to generate heat radiation to dissipate excess heat. On the other hand, the air passage 22 generates air flow due to heat, and the air flows through the air passage 22 to remove excess heat. Air convection. The heat exchange element 1 of the present invention has two typical embodiments depending on the actual situation, and will be separately described herein. Referring to FIG. 1 to FIG. 4, in this embodiment, the heat exchange element 1 is a soaking plate having an internal structure as described above, and has a sealed inner cavity 101 containing a powder sintered portion 102 and a working fluid, 201226827, 'a plus The support structure 103' increases the overall strength; the outer middle section of the heat equalizing plate is left as the flat portion 1' and the two sides of the middle section are respectively press-formed into two insertion sections perpendicular to the middle section, and the insertion section is fixed Structure 12; corresponding, non-fin fin type heat sink" and at the center of 2, there is a jack for inserting a fixed insertion section, the jack is a middle hole 邛 2 丨, the jack type center hole part 2 When the heat equalizing plate is inserted, the inner wall is attached to the insertion section, so that the heat generating component 3 disposed in the flat portion n can be quickly and smoothly operated, and is transferred from the insertion I to the non-Korean heat dissipation module 2 As a preferred embodiment, the insertion section and the insertion hole may be in the process of assembly, that is, the patch welding method may be adopted, that is, the soldering paste is applied to the Φ segment or the socket, and then the furnace is pressed back. The heat is exchanged. 1 is soldered and fixed to the non-returnable heat dissipation module 2, using the square In the heating process, the fixed structure 12 has a -expansion effect due to thermal expansion and contraction, so that it can be closely attached to the non-bonded chip heat dissipation module 2 - & central hole portion 2 to achieve a good heat dissipation effect. In order to obtain the best heat dissipation efficiency, as a preferred solution, the heat transfer plate heat exchange element! The rain side inserting and resolving structure 12, the _ surface thereof respectively presents a circular orphan which is convex outward, so that the two insertion sections are integral The combination is a cylinder like a circular ring. In general, only the two are not in contact with each other, so that the cylindrical shape is divided into two halves and is not complete, and there are _ pairs of symmetric notches on both sides as shown in FIG. The jack-type central hole portion 21 of the corresponding non-fin fin type heat dissipation module 2 is a two-arc hole corresponding to the shape of the two insertion segments; and the preferably two arc-shaped holes communicate with each other and through the solitary surface transition, so that The heat will not be transferred to the central portion of the non-bonded chip heat dissipating module 2 to cause heat accumulation' and the hollow portion can be used for the wiring of the heating element when specifically connected; of course, 'to ensure that the fixed soaking plate does not rotate Or shake, a partial connection between the jacks That is, it should be ensured that the jack still has a fixed position for inserting the 201226827 segment hole type to ensure the fixing function. Also, as a preferred solution, the soaking plate is selected to be immersed when assembled in the non-fin fin type heat dissipating module 2. In order to obtain sufficient heat transfer, a more preferred embodiment of the present invention is that the flat portion 11 of the heat equalizing plate has a transition portion 13 which is contracted toward the center between the insertion portion fixing structure 12 at both ends thereof, so that the pressing is convenient. The structure can be designed as a gradual closing transition. The two transition sections 13 are wider on one side of the flat portion 11 and narrower on the side close to the insertion section fixing structure 12. Therefore, the second transition section can be used as a limit on the non-fin type heat dissipation module 2 As shown in the figure, the non-fin type heat dissipation module 2 is adjacent to the center hole portion 21, and an end surface thereof is provided with a receiving cavity 210, and the receiving cavity 210 is sized to be compatible with the two transition segments 13 The width of the composition is suitable. At the same time, the insertion hole of the central hole portion 21 is opened at the bottom of the groove of the accommodating cavity 210. When the heat equalizing plate is assembled, the flat portion 11 and the two transition portions 13 can be just inserted into the accommodating cavity 210. 'At the same time insert paragraph The fixing structure 12 can be inserted into the insertion hole through the accommodating cavity 210 for fixing, and the position of the accommodating cavity 210 to the two transition segments π is ensured. In the continuous structure, it is also preferable that the jack is designed as a through hole, and the bottom of the accommodating cavity 210 of the non-Korean heat sink module 2 penetrates to the end surface of the other side, so that the non-fin type The heat dissipation module 2 is integrally provided with a hollow through hole for facilitating heat dissipation, and can be matched with a structure in which the flat portion η is slightly protruded from the end surface of the central portion 21, so as to leave a connection to the accommodating cavity 210 and the jack at the side of the flat portion π. A gap that can be used for routing of heating elements. Referring to FIG. 5 and FIG. 6 'the heating element 3 to which the present invention is applied may be a LED, a CPU, a GPU (Graphic Processor IJnit), a chip set, a power semiconductor, or a circuit board integrated with electronic components. Flattening the section U and using a patch-type fixing, as shown in the figure, in the embodiment of the application chip, a cover plate 41 can be mounted around the heating element 3 at the central portion 21 of the non-fin sheet 9 201226827 heat-dissipating module 2, The screw can be fixedly connected with the non-fin fin type heat dissipating module 2, and a lens-attached upper cover 43 is mounted on the upper sealing ring 42 to form a sealed waterproof structure. The wiring of the LED chip can be connected from two flat sections n. To the rear of the non-fin type heat-dissipating module 2, and then lead. Referring to FIG. 7 to FIG. 9, a second embodiment of the present invention, wherein the heat exchange element 1 adopts a structure of a heat column (vapor column), the hot column is formed into a cylindrical shape, and a cylindrical end surface is used as a The flat portion is used as the fixed structure 12, and as shown in FIG. 8, the inside of the hot column is similar to the soaking plate, and has a sealed inner cavity 101 containing a powder sintering portion 102 and a working fluid. The gas-liquid two-phase change and heat transfer, and due to its own size, the powder sintered portion 102 can be attached to the inner wall of the inner cavity, and about half space is filled with the working liquid, and the other half is vacuum; correspondingly, non-binding The central hole portion 2 of the chip heat dissipating core group 2 can be designed to correspond to the jack of the cartridge-mounted fixing structure 12, and for better fixing effect, the patch welding method can be used, that is, in the column or The number of holes in the jack is reduced, and then the furnace is heated, so that the heat exchange element 1 and the non-fin sheet φ-style, ', and the module 2 are welded and fixed. With this scheme, in the heating process, the fixed structure 12 is inflated due to thermal expansion. Cold shrinking has a swelling effect, so it can be Chip module 2 heat dissipation portion of the central hole 2 in close contact - on, to achieve good cooling effect. Benbe is more convenient to set up the relative structure, as shown in Figure 9 and Figure 10, the applied heat το 3 ' can also be lEE), cpu, GPU (Graphic Processor Unit), B-chip group, power semiconductor or The circuit board integrated with electronic components can be directly attached to the ° and flat section 11' and uses patch-type mosquitoes. As shown in the figure, the type used in the LED crystal # can be used in the non-four-type thermal module. The center and the portion 21 of the 2 are mounted around the heating element 10 201226827. A cover 41 is fixedly connected by a screw and a non-fin fin type heat dissipating module 2, and a capped upper cover 43 is mounted on the upper sealing ring 42 to form an overall body. Sealed waterproof structure. The non-fin-month heat dissipation module 2 of the present invention adopts an air passage 22 type structure, and the air passage 22 may be composed of blades 221 disposed outside the center hole portion 21, and each two adjacent blades 221 are connected to each other on the outer side. The closed structure is combined with the periphery of the central hole portion 21 to become an air passage 22, so that around the central hole portion 21, a shape similar to a cylinder can be formed by the plurality of blades 221, and the air passages 22 are all divided along the circumferential direction thereof. ® cloth, and the direction of each air passage 22 is the same as the axial direction of the center hole portion 21. Specifically, a cylindrical peripheral structure is formed around the center hole portion 21, and the cylindrical peripheral structure is composed of the outer wall 23 connecting the outer side of the blade 221, and the blade 221 is also connected to the center hole portion *21. The following is a preferred implementation of several air passages 22: As shown in FIG. 11, in this embodiment, the outer wall 23 is a planar wall, and the peripheral structure is sequentially connected by the outer wall 23 to form a polygonal cylindrical shape with an angular shape. Each of the corners is connected to the central hole portion 21 by a blade 221, so that an air passage 22 is formed by the two adjacent blades 221 and an outer wall 23. During use of the structure, the outer wall 23 and the vane 221 are in contact with air to radiate heat to the air, and heat exchange can be achieved when the air flows through the corresponding air passage 22. As shown in FIG. 12, in the embodiment, the outer wall 23 has a planar wall shape, and the peripheral structure has a plurality of outer walls 23 connected in sequence to form a regular polygonal cylinder shape. Compared with the previous embodiment, there are no protruding corners, wherein the peripheral structure Each corner is connected by a blade 221 to the central hole portion 21 of 201226827, so that an air passage 22 is formed by two adjacent blades 221 and an outer wall 23. The outer wall 23 and the vane 221 of the structure are in contact with the air, and when the air flows through the corresponding air passage 22, heat exchange can be realized, and the -S· can ensure a large heat dissipation area of the peripheral structure, and the heat radiation satisfies the requirements. As shown in FIG. 13, in the embodiment, the outer wall 23 has a curved shape, and the peripheral structure is a circular cylindrical shape in which the outer wall 23 is sequentially connected. In this structure, the blades are evenly distributed between the peripheral structure and the central hole portion 21. To achieve the connection between the two. The outer wall 23 and the vane 221 of the structure are in contact with the air, and when the air flows through the corresponding air passage 22, the heat exchange can be realized and the peripheral structure can have a large heat dissipation area, and the heat radiation satisfies the requirements. In the above embodiments, the non-fin dual heat dissipation modules 2 are preferably formed into a body-formed structure of a metal material. Of course, the body may be formed by a plurality of separate structures, and the material may be made of aluminum or the like. Sexual substance.
經驗證採用本發明所提供的技術’相同功率的發熱元件，工作 時溫度可以降低HTC以上’可見其良好的散熱效果。 當然’針對某些發熱元件，本發明還可以配合風扇或者其他冷 卻裝置來使用，例如將風扇或散熱冷卻裝置裝配在散熱轉片組W 一端（圖中未示出），以大大提高散熱效率。 當然，應注意的是，上述只是閣述了本發明較優的實施方式， 因此並不視為本發明唯-的保護範圍，惟應瞭解的是在不脫離本發 明的保護内，對於本發明所屬技術領域中具有通常知識者而 言’仍得有許多變化及似。㈣，树縣㈣制於所揭 12 201226827 施例，而是以權利要求的保護範圍記載為准，即不偏離本發明申請 專利範圍所為之均等變化與修飾，應仍屬本發明之涵蓋範圍。 【圖式簡單說明】 下面結合附圖和具體實施方式進行進一步的說明： 圖1為本發明第一種實施例的拆分結構示意圖； 圖2為本發明第一種實施例中熱交換元件的拆分結構示意圖； 圖3為本發明第一種實施例中熱交換元件的内部結構示意圖； 圖4為本發明第一種實施例中非鯖片式散熱模組的結構示意圖； • 圖5為本發明第一中實施例用於發熱元件的拆分結構示意圖； 圖6為本發明第一種實施例用於發熱元件的結構示意圖； 圖7為本發明第二種實施例的拆分結構示意圖； • 圖8為本發明第二種實施例中熱交換元件的内部結構示意圖； . 圖9為本發明第二中實施例用於發熱元件的拆分結構示意圖； 圖10為本發明第二種實施例用於發熱元件的結構示意圖； 圖11為本發明中非鰭片式散熱模組的第一種實施例的結構示意 Φ 圖； 圖12為本發明中非鰭片式散熱模組的第二種實施例的結構示意 圖； 圖13為本發明中非鰭片式散熱模組的第三種實施例的結構示意 圖。 13 201226827 【主要元件符號說明】 1 熱交換元件 2 非鰭片式散熱模組 3 發熱元件 11 熱交換元件平整部 12 熱交換元件插入段 13 熱交換元件過渡段 21 散熱模組中心孔部 22 散熱模組空氣通道 23 散熱模組外壁 41 蓋板 42 密封圈 43 上蓋 101 熱交換元件密閉内腔 102 熱交換元件燒結部 103 熱交換元件支撐結構 210 容置腔 221 散熱模組葉片It has been verified that the heating element of the same power can be used in the technology of the present invention, and the operating temperature can be lowered above HTC to show that it has a good heat dissipation effect. Of course, for certain heating elements, the present invention can also be used with a fan or other cooling device, such as a fan or a heat sink cooling device mounted on one end of the heat-dissipating rotor set W (not shown) to greatly improve heat dissipation efficiency. Of course, it should be noted that the foregoing is merely a preferred embodiment of the present invention, and thus is not considered to be a scope of protection of the present invention, but it should be understood that the present invention is not deviated from the protection of the present invention. There are still many variations and similarities in the art to those of ordinary skill in the art. (4) The tree county (4) is based on the disclosure of the 2012 20122727 example, and is subject to the scope of the claims, that is, the equivalent changes and modifications without departing from the scope of the invention, should still be covered by the invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of a split structure according to a first embodiment of the present invention; FIG. 2 is a schematic view of a heat exchange element according to a first embodiment of the present invention; FIG. 3 is a schematic view showing the internal structure of a heat exchange element according to a first embodiment of the present invention; FIG. 4 is a schematic structural view of a non-strip type heat dissipation module according to a first embodiment of the present invention; FIG. 6 is a schematic structural view of a first embodiment of the present invention for a heating element; FIG. 7 is a schematic structural view of a first embodiment of the present invention; 8 is a schematic view showing the internal structure of a heat exchange element according to a second embodiment of the present invention; and FIG. 9 is a schematic view showing a split structure of a heat generating element according to a second embodiment of the present invention; FIG. 11 is a schematic structural view of a first embodiment of a non-fin type heat dissipation module according to the present invention; FIG. 12 is a schematic view of a non-fin type heat dissipation module according to the present invention; A schematic configuration diagram of an embodiment of the seed; FIG. 13 Africa third fin heat exchange module of a schematic structure view of an embodiment of the present invention. 13 201226827 [Description of main component symbols] 1 Heat exchange element 2 Non-fin type heat dissipation module 3 Heating element 11 Heat exchange element flat part 12 Heat exchange element insertion section 13 Heat exchange element transition section 21 Heat dissipation module center hole part 22 Heat dissipation Module air channel 23 heat dissipation module outer wall 41 cover 42 sealing ring 43 upper cover 101 heat exchange element sealed inner cavity 102 heat exchange element sintering part 103 heat exchange element support structure 210 accommodating cavity 221 heat dissipation module blade
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