201226163 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及壓合技術，特別涉及一種壓合裝置及使用該 壓合裝置之電路板壓合方法。 【先前彳支術】 [0002] 隨著電子產業之飛速發展，作為電子產品基本構件之電 路板之製作技術顯得愈來愈重要。電路板一般由覆銅基 板經裁切、鑽孔、鑛銅、曝光、顯影、钮刻、壓合、印 刷、成型等一系列製程製作而成。具體可參閱C.H. Steer等人在Proceedings of the IEEE, Vol. 39， No. 2 (2002年8 月）中發表之 “Dielectric charac-ter i zat i on of printed circuit board substratesw 一文。 [0003] 其中，壓合係電路板製作之重要製程，其主要使用壓合 裝置將覆蓋膜壓合至電路板表面以形成絕緣保護層。該 覆蓋膜包括絕緣層（例如聚醯亞胺薄膜）與膠層，壓合 Q 時，壓合裝置產生高溫高壓使膠層軟化呈熔融狀態並填 充到電路板表面從而使絕緣層黏貼到電路板作為絕緣保 護層。先前之壓合裝置主要利用上電熱盤壓板與下電熱 盤壓板進行壓合，其先將上電熱盤壓板放下與下電熱盤 壓板接觸，然後利用上電熱盤壓板與下電熱盤壓板内之 電熱盤對覆蓋膜進行加熱，並利用頂靠在下電熱壓盤壓 板之液壓活塞施加壓力進行壓合。然而，由於該液壓活 塞與下電熱盤壓板之接觸範圍僅為下電熱盤壓板之中心 區域，使得該中心區域承受之壓力較大，而下電熱盤壓 099146455 表單編號A0101 第5頁/共26頁 0992079868-0 201226163 板之周邊區域承受之壓力自遠離中心區域之方向不斷衰 減，從而對受壓之電路板施加之壓力不均。由於覆蓋膜 之膠層軟化呈熔融狀態後會由壓力大之區域向壓力小之 區域串流集中，從而使得膠層之厚度分佈不均勻，覆蓋 膜之絕緣層亦隨之產生凹陷，造成電路板之絕緣保護層 在外觀上呈不規則之斑塊狀色差。並且，由於覆蓋膜之 絕緣層發生凹陷，使得壓力無法通過絕緣層上墊設之壓 合墊材傳遞到電路板之線路密集區域，從而使得該線路 密集區域形成氣泡並導致覆蓋膜之壓合不緊密。再者， 原先存在於覆蓋膜與電路板導電線路之間之空氣會由於 壓力差之原因逃逸到壓力小之區域，由於該壓力小之區 域為熔融之膠集中之區域，從而導致該部分空氣很可能 被熔融之膠包圍住而無法有效散逸出電路板外，使得空 氣殘留在膠層内形成氣泡，氣泡之大量存在會造成壓合 不良並且容易使得絕緣保護層脫落。 [0004] 有鑑於此，針對上述問題，提供一種可提供較為均勻之 壓力並有效減少殘留在壓合後之電路板内之氣泡從而提 升電路板之壓合品質之壓合裝置及使用該壓合裝置之電 路板壓合方法實屬必要。 【發明内容】 [0005] 下面將以具體實施例說明一種壓合裝置及使用該壓合裝 置之電路板壓合方法。 [0006] —種壓合裝置，包括基座、第一壓板、第二壓板、升降 機構、加熱單元、電磁元件與控制單元。該第一壓板、 第二壓板與升降機構均設置於基座。該第一壓板與第二 099146455 表單編號A0101 第6頁/共26頁 0992079868-0 201226163 壓板相對，用於共同壓合放置於第一壓板與第二壓板間 之工件。該升降機構用於驅動第二壓板相對第一壓板移 動。該加熱單元至少設置於第一壓板或第二壓板中之一 ，用於加熱第一壓板或第二壓板，從而加熱第一壓板與 第二壓板間之工件。該第二壓板包括磁性材料。該電磁 元件設置於第一壓板，用於產生與第二壓板相互吸引之 磁力。該控制單元用於控制電磁元件之磁力。 [0007] Ο ο [0008] 一種壓合裝置，包括基座、第一壓板、第二壓板、升降 機構、加熱單元、電磁元件與控制單元。該第一壓板、 第二壓板與升降機構均設置於基座。該第一壓板與第二 壓板相對，用於共同壓合放置於第一壓板與第二壓板之 間工件。該升降機構用於驅動第二壓板相對第一壓板移 動。該加熱單元至少設置於第一壓板或第二壓板中之一 ，用於加熱第一壓板或第二壓板，從而加熱第一壓板與 第二壓板間之工件。該第一壓板包括磁性材料。該電磁 元件設置於第二壓板，用於產生與第一壓板相互吸引之 磁力。該控制單元用於控制電磁元件之磁力。 一種歷合裝置，包括基座、第一壓板、第二壓板、升降 機構、.加熱單元、控制單元與兩個電磁元件。該第一壓 板、第二壓板與升降機構均設置於基座。該第一壓板與 第二壓板相對，用於共同壓合放置於第一壓板與第二壓 板間之工件。該升降機構用於驅動第二壓板相對第一壓 板移動。該加熱單元至少設置於第一壓板或第二壓板中 之一，用於加熱第一壓板或第二壓板，從而加熱第一壓 板與第二壓板間之工件。該兩個電磁元件分別設置於第 099146455 表單編號Α0101 第7頁/共26頁 0992079868-0 201226163 一壓板與第二壓板，用於使第一壓板與第二壓板之間產 生相互吸引之磁力。該控制單元用於控制該兩個電磁元 件之磁力。 [0009] 一種電路板壓合方法，包括步驟：提供如上所述之任意 一種壓合裝置；利用升降機構驅動第二壓板移動以遠離 第一壓板；將待壓合之電路板、覆蓋膜以及壓合墊材依 次放置在第一壓板表面，其中，該覆蓋膜包括膠層；利 用升降機構驅動第二壓板移動以靠近第一壓板，直至第 二壓板與壓合墊材貼合；加熱單元加熱待壓合之電路板 與覆蓋膜，並使覆蓋膜之膠層軟化；控制單元控制電磁 元件之通入電流，以使得第一壓板與第二壓板之間產生 相互吸引之磁力，以壓合電路板與覆蓋膜預定時間，從 而將覆蓋膜結合於電路板表面，·控制單元控制電磁元件 之通入電流逐漸減少至零；以及升降機構驅動第二壓板 移動以遠離第一壓板，從而取出結合有覆蓋膜之電路板 〇 [0010] 相較於先前技術，本技術方案之壓合裝置及使用該壓合 裝置之電路板壓合方法，其利用電磁元件在第一壓板與 第二壓板之間產生相互吸引之磁力以對電路板進行壓合 ，從而第一壓板與第二壓板之間可產生較為均勻之壓力 對電路板進行壓合，使覆蓋膜之膠層在壓合後之厚度分 佈較為均勻，且可有效減少殘留在壓合後之電路板内之 氣泡，使得覆蓋膜在壓合後不容易鬆動脫落，提升電路 板之壓合品質。 【實施方式】 099146455 表單編號A0101 第8頁/共26頁 0992079868-0 201226163 []下面將結合附圖與實施例對本技術方案之壓合裝置及電 路板壓合方法作進一步詳細說明。 [0012] 凊參閱圖1及圖2 ,本技術方案提供一種壓合裝置1〇，用 於對電路板進行壓合。該壓合裝置1〇包括基座丨丨、第一 壓板12、第二壓板13、升降機構14、加熱單元15、電磁 元件16與控制單元17。該第一壓板12、第二壓板13與升 降機構14均設置於基座π。該第一壓板12與第二壓板13 相對，用於共同|合放置於第一壓板12與第二壓板I〗間 0 之工件。該升降機構14用於驅動第二壓板13相對第一壓 板12移動。該加熱單元15至少設置於第一壓板12或第二 壓板u中之一，用於加熱第一壓巍u讓第二壓板13，從 而加熱第一壓板12與第二壓板13間之工件。該第二壓板 13包括磁性材料，該電磁元件16設置於第一壓板12，用 於產生與第二壓板13相互吸引之磁力。該控制單元I?用 於控制電磁元件16之磁力。 [0013] 具體地，該基座11包括底座111與固定在該底座111表面 Ο 之支撐平臺112。該底座111用於承載該支撐平臺112以 及安裝設置在該支擇平臺112上之其他元件。該支標平臺 112具有遠離該底座111之支撑平面1122。 [0014] 該第一壓板12固定設置在該支撐平臺112之支撐平面 1122上。該第一壓板12具有一個有效壓合區域125。其 中，該第一壓板12之有效壓合區域125係指用於放置待壓 合之電路板進行壓合之區域。具體地，該第一壓板12具 有與該支撐平面1122接觸固定之第一表面1201以及與該 第一表面1201相對之第二表面1202。該第二表面1202為 099146455 表單編號A0101 第9頁/共26頁 0992079868-0 201226163 第-壓板12與第二壓板13相對之第一壓合面。該第一歷 合面用於與第：|板13接觸以壓合工件。該有效壓合區 域125位於該第二表面1 202之中間區域。該第—壓板K 還具有連接於該第一表面120丨與第二表面12〇2之間之第 一侧面1 203與第二侧面1 204。言亥第„側面12〇3與第二側 面1 204平行相對。第一壓板12開設有第一空腔ΐ2ι與第 二空腔122。該第一空腔121靠近該基座u，其位於靠近 第一表面1201之一側。該第二空腔122遠離該基座u， 其位於靠近第二表面1202之一側，即，該第二空腔122位 於該第一空腔121與該第二表面1202之間。優選地，該第 一壓板12還具有一設置在該第一空腔121與第二空腔丨22 之間之隔熱板123。該隔熱板123用於阻隔第一空腔121 與第二空腔122之間之熱量傳遞。 [0015] 該第二壓板13與該第一壓板12相對設置。該第二壓板13 具有第三表面1301以及與該第三表面丨30丨相對之第四表 面1 302。該第三表面ι301為該第二壓板13與第一壓合面 相對之第二壓合面，該第一壓合面與第二壓合面用於壓 合工件。該第二壓板〗3還具有連接於該第三表面13〇1與 第四表面1302之間之第三侧面丨303與第四侧面13〇4。該 第三側面1 303與第四側面1 304平行相對。該第三側面 1303與第一侧面1203位於同一侧，該第四侧面13〇4與第 二側面1204位於同一側。該第三表面13〇1與該第二表面 1202正對並用於配合以對工件進行壓合。該第二壓板13 開設有第三空腔131。該第三空腔131靠近該第一壓板12 ’其位於靠近第三表面1 3 〇 1之一側。 099146455 表單編號A0101 第10頁/共26頁 0992079868-0 201226163 [〇〇16]該升降機構14連接在第-壓板12與第二壓板13之間，以 使第—壓板13可相對該第一壓板a升高或降低。本實施 例中，该升降機構14為兩個，每一升降機構14包括一固 定端141與一可相對該固定端141做伸縮運動之伸縮端 142 °其中’一升降機構14之固定端141固定在該第一壓 板12之第一側面1203，伸縮端142固定在第二壓板13之 第二側面1303 ;另一升降機構丨4之固定端丨41固定在第 一壓板12之第二側面12〇4，伸縮端142固定在第二壓板 13之第四側面1304。優選地，該升降機構14可為氣壓桿 C3 ，氣壓桿之氣缸部分作為固定端141 ’氣壓桿之活塞部分 作為伸縮端142。當然，該升降機構丨4亦可設置在第二壓 板13上方’以驅動第二壓板过相對第一壓板ί2移動。 [0017]該加熱單元15包括第一加熱單元151與第二加熱單元ι52 。該第一加熱單元151設置在第一壓板丨2之第二空腔122 内。該第二加熱單元152設置在第二壓板13之第三空腔 131内。該第一加熱單元151可將熱量傳遞至第一壓板12 Q 之第二表面1202，該第二加熱單元152可將熱量傳遞至第 二壓板13之第三表面1301 ’從而該第一加熱單元151與 第二加熱單元152共同將放置在該第二表面丨2〇2與第三表 面13 01之間之工件進行加熱。當然，該加熱單元15亦可 僅為一個，該一個加熱單元15可設置在第一壓板12之第 二空腔122内，此時第二壓板13可不需開設第三空腔131 :或者，該一個加熱單元1 5可設置在第二壓板1 3之第三 空腔131内，此時第一壓板12可不需開設第二空腔丨22， 亦可不設置隔熱板123。 099146455 表單編號A0I01 第Π頁/共26頁 0992079868-0 201226163 [0018] [0019] [0020] 該電磁元件16設置在第一空腔121内。該電磁元件16具有 一個磁吸面165。該磁吸面165與第一壓板丨2之有效壓合 區域125對應以提供均勻之磁力吸附第二壓板13。從而’ 该均勻之磁力可使得第一壓板12與第二壓板13之間產生 一個預定大小之均句壓力以壓合放置在第一壓板12與第 —壓板1 3之間之工件。 本實施例中’該電磁元件16包括呈矩陣排列之複數電磁 單元160。每一電磁單元160包括工字型鐵芯161以及環 繞该工字型鐵芯1 61之線圈1 6 2。該工字型鐵芯1 61包括 第一芯板1611、第二芯板1612以及垂直連接在該第一芯 板1611與第二芯板1612之間之芯柱1613。該第一芯板 1611、第二芯板1612與芯柱1613共同形成一 “工，，字型 結構。該第一芯板1611與第二芯板161 2平行相對。該第 一芯板1611靠近該第一壓板12之第二表面12〇2，該第二 芯板1612靠近該第一壓板12之第一表面1201。該第一芯 板1611具有靠近該第二表面12〇2之第一磁面16〇1，該第 二芯板1612具有靠近該第表面1201之第二磁面1602。 該磁吸面165由該複數電磁單元16〇之第一芯板1611之第 一磁面1601共同構成。優選地，該磁吸面ι65之面積大小 與該有效壓合區域125之面積大小相等。每一電磁單元 160之線圈162之纏繞圈數與纏繞密度相同。 該控制單元17安裝在該基座11之支撐平臺112並用於控制 該電磁元件16之磁力。具體地，該控制單元17控制該電 磁元件16之線圈162之通電或斷電，以使該電磁元件16之 磁力產生或消失；該控制單元丨7控制該電磁元件16之線 099146455 表單編號A0101 第12頁/共26頁 0992079868-0 201226163 圈162中通入之電流之大小，以使該電磁元件Μ產生之磁 力增大或減小。優選地，該控制單元17可集成更多之控 制功能，例如，該控制單以7可用於控制該升降機㈣ 驅動第二魏13相對第-壓板12移動；此外該控制單 元Π還可詩控❹熱單元⑽^騎加熱或停止加 埶。 * »»> [0021] Ο [0022]201226163 VI. Description of the Invention: [Technical Field] The present invention relates to a press-fitting technique, and more particularly to a press-fit apparatus and a circuit board press-fitting method using the same. [Previous sputum support] [0002] With the rapid development of the electronics industry, the production technology of circuit boards, which are the basic components of electronic products, is becoming more and more important. The circuit board is generally made up of a series of processes such as cutting, drilling, copper, exposure, development, button engraving, pressing, printing, molding, etc. of the copper-clad substrate. For details, see "Dielectric charac-ter i zat i on of printed circuit board substratesw" by CH Steer et al., Proceedings of the IEEE, Vol. 39, No. 2 (August 2002). [0003] An important process for the fabrication of a laminated circuit board, which mainly uses a pressing device to press a cover film onto the surface of the circuit board to form an insulating protective layer. The cover film includes an insulating layer (for example, a polyimide film) and a rubber layer, and is pressed. When Q is combined, the pressing device generates high temperature and high pressure to soften and melt the adhesive layer and fill it to the surface of the circuit board so that the insulating layer adheres to the circuit board as an insulating protective layer. The previous pressing device mainly uses the hot plate and the electric heating plate. The plate pressing plate is pressed, and the upper electric heating plate pressing plate is first placed in contact with the lower electric heating plate pressing plate, and then the heating film is heated by the electric heating plate in the lower electric heating plate pressing plate and the lower electric heating plate pressing plate, and the electric heating plate is pressed against the lower electric heating plate. The hydraulic piston of the pressure plate applies pressure to press. However, since the contact between the hydraulic piston and the lower electric plate is only the center of the lower plate The area, so that the central area is under greater pressure, and the lower electric coil pressure 099146455 Form No. A0101 Page 5 / Total 26 Page 0992079868-0 201226163 The pressure on the peripheral area of the board is continuously attenuated away from the central area, thus The pressure applied by the pressed circuit board is uneven. Since the rubber layer of the cover film is softened and melted, the pressure region is concentrated and concentrated to a small pressure region, so that the thickness distribution of the rubber layer is uneven, and the film is covered. The insulating layer also has a depression, which causes the insulating protective layer of the circuit board to have irregular plaque chromatic aberration in appearance. Moreover, since the insulating layer of the covering film is recessed, the pressure cannot be pressed through the insulating layer. The mat is transferred to the line-dense area of the circuit board, so that the dense area of the line forms bubbles and the film is not tightly pressed. Moreover, the air originally existing between the cover film and the circuit board of the circuit board may be due to the pressure difference. The reason for the escape to the area where the pressure is small, because the area where the pressure is small is the area where the molten glue is concentrated, thereby causing the part The air is likely to be surrounded by molten glue and cannot be effectively dissipated outside the circuit board, so that air remains in the glue layer to form bubbles. The presence of a large amount of air bubbles may cause poor press-fit and easily cause the insulating protective layer to fall off. [0004] Therefore, in view of the above problems, a pressing device capable of providing a relatively uniform pressure and effectively reducing air bubbles remaining in a laminated circuit board to improve the bonding quality of the circuit board and a circuit board using the pressing device are provided. The method is practical. [0005] A press-fit device and a circuit board press-fitting method using the same will be described below with reference to specific embodiments. [0006] A press-fit device includes a base, a first platen, a second platen, a lifting mechanism, a heating unit, an electromagnetic element, and a control unit. The first pressure plate, the second pressure plate and the lifting mechanism are both disposed on the base. The first platen is opposite to the second 099146455 Form No. A0101, page 6 of 26, 0992079868-0 201226163, for co-pressing the workpiece placed between the first platen and the second platen. The lifting mechanism is for driving the second platen to move relative to the first platen. The heating unit is disposed at least in one of the first platen or the second platen for heating the first platen or the second platen to heat the workpiece between the first platen and the second platen. The second platen comprises a magnetic material. The electromagnetic element is disposed on the first pressure plate for generating a magnetic force that is attracted to the second pressure plate. The control unit is used to control the magnetic force of the electromagnetic element. [0007] A pressing device includes a base, a first pressure plate, a second pressure plate, a lifting mechanism, a heating unit, an electromagnetic element, and a control unit. The first pressure plate, the second pressure plate and the lifting mechanism are both disposed on the base. The first pressure plate is opposite to the second pressure plate for co-pressing the workpiece placed between the first pressure plate and the second pressure plate. The lifting mechanism is for driving the second platen to move relative to the first platen. The heating unit is disposed at least in one of the first platen or the second platen for heating the first platen or the second platen to heat the workpiece between the first platen and the second platen. The first platen comprises a magnetic material. The electromagnetic element is disposed on the second pressure plate for generating a magnetic force that is attracted to the first pressure plate. The control unit is used to control the magnetic force of the electromagnetic element. A calendar device comprising a base, a first pressure plate, a second pressure plate, a lifting mechanism, a heating unit, a control unit and two electromagnetic components. The first pressure plate, the second pressure plate and the lifting mechanism are all disposed on the base. The first pressure plate is opposite to the second pressure plate for collectively pressing a workpiece placed between the first pressure plate and the second pressure plate. The lifting mechanism is for driving the second platen to move relative to the first platen. The heating unit is disposed at least in one of the first platen or the second platen for heating the first platen or the second platen to heat the workpiece between the first platen and the second platen. The two electromagnetic components are respectively set at 099146455 Form No. 1010101 Page 7 of 26 0992079868-0 201226163 A pressure plate and a second pressure plate are used to generate mutual attraction magnetic force between the first pressure plate and the second pressure plate. The control unit is used to control the magnetic force of the two electromagnetic elements. [0009] A circuit board pressing method comprising the steps of: providing any one of the pressing devices as described above; driving the second pressure plate to move away from the first pressure plate by using the lifting mechanism; and the circuit board, the cover film and the pressure to be pressed The mat is placed on the surface of the first platen in sequence, wherein the cover film comprises a glue layer; the second platen is driven to move closer to the first platen by the lifting mechanism until the second platen is adhered to the press-fit mat; the heating unit is heated to be Pressing the circuit board and the cover film, and softening the adhesive layer of the cover film; the control unit controls the current of the electromagnetic element to cause mutual attraction between the first pressure plate and the second pressure plate to press the circuit board And the cover film for a predetermined time, thereby bonding the cover film to the surface of the circuit board, the control unit controls the input current of the electromagnetic element to gradually decrease to zero; and the lifting mechanism drives the second pressure plate to move away from the first pressure plate, thereby taking out the combined cover Circuit board of film [0010] Compared with the prior art, the pressing device of the present invention and the circuit board pressing method using the same The utility model utilizes an electromagnetic element to generate a mutually attracting magnetic force between the first pressure plate and the second pressure plate to press the circuit board, so that a relatively uniform pressure can be generated between the first pressure plate and the second pressure plate to press the circuit board. The thickness distribution of the rubber layer of the cover film is relatively uniform after pressing, and the air bubbles remaining in the pressed circuit board can be effectively reduced, so that the cover film does not easily loosen and fall after pressing, and the press-fit of the circuit board is improved. quality. [Embodiment] 099146455 Form No. A0101 Page 8 of 26 0992079868-0 201226163 [The pressing device and the circuit board pressing method of the present technical solution will be further described in detail below with reference to the accompanying drawings and embodiments. [0012] Referring to FIG. 1 and FIG. 2, the technical solution provides a pressing device 1〇 for pressing a circuit board. The pressing device 1 includes a base cymbal, a first pressure plate 12, a second pressure plate 13, a lifting mechanism 14, a heating unit 15, an electromagnetic element 16, and a control unit 17. The first pressure plate 12, the second pressure plate 13, and the lifting mechanism 14 are both disposed on the base π. The first pressure plate 12 is opposite to the second pressure plate 13 for collectively engaging a workpiece placed between the first pressure plate 12 and the second pressure plate I. The lifting mechanism 14 is for driving the second platen 13 to move relative to the first platen 12. The heating unit 15 is disposed at least in one of the first platen 12 or the second platen u for heating the first platen u to the second platen 13, thereby heating the workpiece between the first platen 12 and the second platen 13. The second pressure plate 13 includes a magnetic material, and the electromagnetic element 16 is disposed on the first pressure plate 12 for generating a magnetic force that is attracted to the second pressure plate 13. The control unit I? is used to control the magnetic force of the electromagnetic element 16. [0013] Specifically, the base 11 includes a base 111 and a support platform 112 fixed to a surface of the base 111. The base 111 is used to carry the support platform 112 and to mount other components disposed on the support platform 112. The support platform 112 has a support plane 1122 that is remote from the base 111. [0014] The first pressure plate 12 is fixedly disposed on the support plane 1122 of the support platform 112. The first platen 12 has an effective nip area 125. The effective nip area 125 of the first pressure plate 12 refers to the area where the circuit board to be pressed is placed for pressing. Specifically, the first pressing plate 12 has a first surface 1201 fixed in contact with the supporting plane 1122 and a second surface 1202 opposite to the first surface 1201. The second surface 1202 is 099146455 Form No. A0101 Page 9 of 26 0992079868-0 201226163 The first pressing plate 12 is opposite to the first pressing plate 13 by the first pressing surface. The first mating face is used to contact the :: plate 13 to press the workpiece. The effective nip region 125 is located in the middle of the second surface 1 202. The first platen K further has a first side 1 203 and a second side 1 204 connected between the first surface 120 丨 and the second surface 12 〇 2 . The first side 12 〇 3 is parallel to the second side 1 204. The first pressure plate 12 is provided with a first cavity ΐ2ι and a second cavity 122. The first cavity 121 is adjacent to the pedestal u, which is located close to One side of the first surface 1201. The second cavity 122 is away from the base u, and is located on a side close to the second surface 1202, that is, the second cavity 122 is located in the first cavity 121 and the second Preferably, the first pressure plate 12 further has a heat insulation plate 123 disposed between the first cavity 121 and the second cavity 22. The heat insulation plate 123 is used to block the first space. The heat transfer between the cavity 121 and the second cavity 122. [0015] The second platen 13 is disposed opposite the first platen 12. The second platen 13 has a third surface 1301 and a third surface 丨30丨The fourth surface ι 301 is a second pressing surface of the second pressing plate 13 opposite to the first pressing surface, and the first pressing surface and the second pressing surface are used for pressing the workpiece The second platen 3 further has a third side 丨 303 and a fourth side 13 〇 4 connected between the third surface 13〇1 and the fourth surface 1302. The third side 1 303 is parallel to the fourth side 1304. The third side 1303 is on the same side as the first side 1203, and the fourth side 13〇4 is on the same side as the second side 1204. The third surface 13〇 1 is opposite to the second surface 1202 and is used for cooperation to press the workpiece. The second pressure plate 13 is provided with a third cavity 131. The third cavity 131 is adjacent to the first pressure plate 12' which is located near the third One side of the surface 1 3 〇1. 099146455 Form No. A0101 Page 10 of 26 Page 0992079868-0 201226163 [〇〇16] The lifting mechanism 14 is connected between the first platen 12 and the second platen 13 so that The pressure plate 13 can be raised or lowered relative to the first pressure plate a. In the embodiment, the lifting mechanism 14 is two, and each lifting mechanism 14 includes a fixed end 141 and a telescopic movement relative to the fixed end 141. The telescopic end 142 ° is fixed to the first side 1203 of the first pressure plate 12, and the telescopic end 142 is fixed to the second side surface 1303 of the second pressure plate 13; The end turn 41 is fixed to the second side 12〇4 of the first pressure plate 12, and extends The end 142 is fixed to the fourth side 1304 of the second pressure plate 13. Preferably, the lifting mechanism 14 can be a gas pressure rod C3, and the cylinder portion of the gas pressure rod serves as a fixed end 141 'the piston portion of the gas pressure rod as the telescopic end 142. Of course, The lifting mechanism 丨4 may also be disposed above the second pressure plate 13 to drive the second pressure plate to move relative to the first pressure plate ί2. [0017] The heating unit 15 includes a first heating unit 151 and a second heating unit ι52. The first heating unit 151 is disposed in the second cavity 122 of the first platen 丨2. The second heating unit 152 is disposed in the third cavity 131 of the second pressure plate 13. The first heating unit 151 can transfer heat to the second surface 1202 of the first platen 12 Q, and the second heating unit 152 can transfer heat to the third surface 1301 ′ of the second platen 13 such that the first heating unit 151 The workpiece placed between the second surface 丨2〇2 and the third surface 1300 is heated together with the second heating unit 152. Of course, the heating unit 15 may also be only one. The one heating unit 15 may be disposed in the second cavity 122 of the first pressure plate 12, and the second pressure plate 13 may not need to open the third cavity 131: A heating unit 15 can be disposed in the third cavity 131 of the second pressure plate 13 . In this case, the first pressure plate 12 does not need to open the second cavity 22 or the heat insulation plate 123. 099146455 Form No. A0I01 Page 26 of 26 0992079868-0 201226163 [0020] [0020] The electromagnetic element 16 is disposed within the first cavity 121. The electromagnetic element 16 has a magnetic surface 165. The magnetic absorbing surface 165 corresponds to the effective nip region 125 of the first platen 丨2 to provide a uniform magnetic attraction to the second platen 13. Thus, the uniform magnetic force causes a predetermined magnitude of uniform pressure between the first platen 12 and the second platen 13 to press the workpiece placed between the first platen 12 and the first platen 13. In the present embodiment, the electromagnetic element 16 includes a plurality of electromagnetic units 160 arranged in a matrix. Each of the electromagnetic units 160 includes an I-shaped core 161 and a coil 162 that surrounds the I-shaped core 1 61. The I-shaped core 1 61 includes a first core plate 1611, a second core plate 1612, and a stem 1613 vertically connected between the first core plate 1611 and the second core plate 1612. The first core plate 1611, the second core plate 1612 and the stem 1613 together form a "work," font structure. The first core plate 1611 is parallel to the second core plate 1612. The first core plate 1611 is adjacent to The second surface 1212 of the first pressure plate 12 is adjacent to the first surface 1201 of the first pressure plate 12. The first core plate 1611 has a first magnetic surface adjacent to the second surface 12〇2. The second core plate 1612 has a second magnetic surface 1602 adjacent to the first surface 1201. The magnetic surface 165 is formed by the first magnetic surface 1601 of the first core plate 1611 of the plurality of electromagnetic units 16 Preferably, the size of the area of the magnetic absorbing surface ι65 is equal to the area of the effective nip area 125. The number of windings of the coil 162 of each electromagnetic unit 160 is the same as the winding density. The control unit 17 is mounted on the pedestal. The support platform 112 of 11 is used to control the magnetic force of the electromagnetic component 16. Specifically, the control unit 17 controls the energization or de-energization of the coil 162 of the electromagnetic component 16 to cause the magnetic force of the electromagnetic component 16 to be generated or disappeared; Unit 丨7 controls the line of the electromagnetic element 16 099146455 form No. A0101 Page 12 of 26 0992079868-0 201226163 The magnitude of the current flowing in the circle 162 is such that the magnetic force generated by the electromagnetic element 增大 is increased or decreased. Preferably, the control unit 17 can integrate more The control function, for example, the control unit 7 can be used to control the elevator (4) to drive the second Wei 13 to move relative to the first platen 12; in addition, the control unit can also heat or stop the twisting of the heating unit (10). »»> [0021] Ο [0022]
[0023] G 此外，該虔合裝置10還可包括一壓合區外㈣。該壓合 區外罩18用於收容包圍該第一壓板12、第二壓板13與升 降機構14。 此外，在上述之壓合裝置10之第一種替代方式中，亦可 使該第一壓板12包括磁性材轉，而將讓電磁元件丨6設置 於第二壓板13，用於產生與第__壓板12相互吸引之磁力 ，該控制單元17用於控制該電磁元件16之磁力，以使得 第一壓板12與第二壓板13同樣可藉由磁力壓合第一壓板 12與第二壓板13間之工件。 另外，在上述之壓合裝置10之第▲種替代方式中，亦可 使該壓合裝置1 0還包括控制單元17與兩個電磁元件16， 該兩個電磁元件16分別設置於第一壓板12與第二壓板13 ，用於使第一壓板12與第二壓板13之間產生相互吸引之 磁力，該控制單元17用於控制該兩個電磁元件16之磁力 ’其亦可利用磁力壓合第一壓板12與第二壓板13間之工 件。 請進一步參閱圖3 ’本技術方案實施例提供一種利用上述 之壓合裝置10對電路板進行壓合之電路板壓合方法，其 099146455 表單編號A0101 第13頁/共26頁 0992079868-0 [0024] 201226163 [0025] [0026] [0027] [0028] [0029] [0030] 099146455 包括以下步驟： 步驟101 ’升降機構14驅動第二壓板13移動以遠離第一屋 板1 2。 具體地’該升降機構14可利用手動之方式開啟以驅動第 二壓板13向遠離第一壓板12之方向移動’亦可利用控制 單元17開啟以驅動第二壓板13向遠離第一壓板Η之方向 移動。此時，該升降機構14之伸縮端142伸長，從而使第 二壓板13移動至與第一壓板12之間之_達到預定距離 。並且，該升降機構14可將該第二壓板13支撐在預定之 位置。 步驟102，將待壓合之電路板、覆蓋膜以及壓合墊材依次 放置在第-壓板12表面，其中’該覆蓋膜包括膠層。 具體如下：首先，將待壓合之電路板放置在第一壓板12 之第二表面1202之有效壓合區域丨25内。其次，再將覆蓋 膜放置在該電路板之表面，該覆蓋膜包括絕緣層與膠層 。然後，將壓合墊材放置在該覆蓋膜之表面。其中，= 壓合墊材可選擇覆形性較好之材料，例如，聚丙烯薄膜 、牛皮紙或者矽橡膠片等等。壓合墊材可相對減少被壓 合之電路板之收縮變形，還可起到散熱作用。 步驟103 ’升降機構14驅動第二壓板13移動以靠近第一壓 板12，直至第二壓板13與壓合墊材貼合。 具體地，該升降機構14可利用手動之方式開啟以驅動第 二壓板13向靠近第-壓板12之方向移動，亦可利用控制 單兀17開啟以驅動第二壓板13向靠近第—壓板12之方向 表單編號A0101 第14頁/共26頁 0992079868-0 201226163 [0031] [0032] Ο [0033] [0034][0023] In addition, the kneading device 10 may further include a nip (4). The nip outer cover 18 is for accommodating the first pressure plate 12, the second pressure plate 13, and the lift mechanism 14. In addition, in the first alternative of the above-mentioned pressing device 10, the first pressing plate 12 may be made to include a magnetic material, and the electromagnetic element 6 may be disposed on the second pressing plate 13 for generating and The magnetic force of the pressure plate 12 is mutually attracted, and the control unit 17 is used for controlling the magnetic force of the electromagnetic element 16 so that the first pressure plate 12 and the second pressure plate 13 can be pressed by the magnetic force between the first pressure plate 12 and the second pressure plate 13 The workpiece. In addition, in the ▲ alternative of the above-mentioned pressing device 10, the pressing device 10 may further include a control unit 17 and two electromagnetic elements 16, which are respectively disposed on the first pressure plate. 12 and a second pressure plate 13 for generating a mutual attraction magnetic force between the first pressure plate 12 and the second pressure plate 13, the control unit 17 is for controlling the magnetic force of the two electromagnetic elements 16, which can also be pressed by magnetic force a workpiece between the first platen 12 and the second platen 13. Please refer to FIG. 3 'The embodiment of the present invention provides a circuit board pressing method for pressing a circuit board by using the above-mentioned pressing device 10, which is 099146455 Form No. A0101 Page 13 / Total 26 Page 0992079868-0 [0024 [0028] [0028] [0030] [0030] 099146455 includes the following steps: Step 101 'The lifting mechanism 14 drives the second platen 13 to move away from the first roof panel 12. Specifically, the lifting mechanism 14 can be manually opened to drive the second pressure plate 13 to move away from the first pressure plate 12. The control unit 17 can also be opened to drive the second pressure plate 13 away from the first pressure plate. mobile. At this time, the telescopic end 142 of the elevating mechanism 14 is elongated, so that the second platen 13 is moved to a predetermined distance from the first platen 12. And, the lifting mechanism 14 can support the second pressure plate 13 at a predetermined position. In step 102, the circuit board, the cover film and the press-fit mat to be pressed are sequentially placed on the surface of the first platen 12, wherein the cover film comprises a glue layer. Specifically, as follows: First, the circuit board to be pressed is placed in the effective nip area 25 of the second surface 1202 of the first pressure plate 12. Next, a cover film is placed on the surface of the circuit board, and the cover film includes an insulating layer and a glue layer. The pressed mat is then placed on the surface of the cover film. Among them, = press-fit mat material can choose a material with better shape, such as polypropylene film, kraft paper or enamel rubber sheet. The press-fit mat can reduce the shrinkage deformation of the pressed circuit board and also provide heat dissipation. Step 103' The elevating mechanism 14 drives the second platen 13 to move closer to the first platen 12 until the second platen 13 is fitted to the press pad. Specifically, the lifting mechanism 14 can be manually opened to drive the second pressure plate 13 to move toward the first platen 12, or can be opened by the control unit 17 to drive the second platen 13 toward the first platen 12. Direction Form No. A0101 Page 14 of 26 Page 0992079868-0 201226163 [0031] [0033] [0034]
移動。此時，該升降機構14之伸縮端142收縮，從而使第 二壓板13向靠近第一壓板12之方向移動直至與第一壓板 12貼合。該待壓合之電路板、覆蓋膜以及壓合墊材被壓 緊在第一壓板12與第二壓板13之間。此時，該升降機構 14鬆開，不再支撐第二壓板13。 步驟104，加熱單元加熱待壓合之電路板與覆蓋膜，並使 覆蓋膜之膠層軟化。 具體地，可利用手動之方式或者控制單元17控制加熱單 元15對待加熱之電路板與覆蓋膜進行加熱，該加熱時之 溫度應使得覆蓋膜之膠層軟化並可能呈熔融狀態。 步驟1 0 5，控制單元17控制電磁元件16通入之電流，以使 得第一壓板12與第二壓板13之間產生相互吸引之磁力， 以壓合電路板與覆蓋膜預定時間，從而將覆蓋膜結合於 電路板表面。 具體地，利用控制單元17控制電源給電磁元件16之每一 電磁單元160之線圈162通電，通入到每一線圈162之電 流大小相等。然後，使每一線圈162中通入之電流逐漸同 步增大，直至電磁元件16產生之磁力達到一預設值。其 中，該預設值之大小應使得第一壓板12與第二壓板13產 生之壓力可將覆蓋膜緊密壓合至電路板。此時，在一預 定時間内維持該第一壓板1 2與第二壓板1 3之間之壓力大 小。由於在壓合時，該覆蓋膜之膠層在軟化呈熔融狀態 後在有效壓合區域125内受到之壓力大小基本一致，因此 可使得壓合後膠層之厚度較為均勻。並且，第一壓板12 099146455 表單編號Α0101 第15頁/共26頁 0992079868-0 201226163 與第二壓板13產生之均勻壓力亦可通過壓合墊材有效傳 遞到電路板之線路密集區域，使得熔融狀態之膠層有效 填充到該線路密集區域之間隙中，有效避免形成氣泡。 [0035] 步驟1 0 6，控制單元1 7控制電磁元件1 6之通入電流逐漸減 少至零。 [0036] 具體地，在壓合時間達到預定時間後，利用控制單元1 7 控制電源逐漸減少通入各個線圈162之電流，直至各個線 圈162中之電流為零。此時，電磁元件對第二壓板13之磁 吸力亦會逐漸減少，直至最後減少至零為止。 [0037] 步驟107，升降機構14驅動第二壓板13移動以遠離第一壓 板12，從而取出結合有覆蓋膜之電路板。 [0038] 在壓合覆蓋膜後之電路板冷卻後，該覆蓋膜之絕緣層便 成為該電路板之絕緣保護層。 [0039] 相較於先前技術，本技術方案之壓合裝置及使用該壓合 裝置之電路板壓合方法，其利用電磁元件在第一壓板與 第二壓板之間產生相互吸引之磁力以對電路板進行壓合 ，從而第一壓板與第二壓板之間可產生一個較為均勻之 壓力對電路板進行壓合，使覆蓋膜之膠層在壓合後之厚 度分佈較為均勻，且可有效減少殘留在壓合後之電路板 内之氣泡，使得覆蓋膜在壓合後不容易鬆動脫落，提升 電路板之壓合品質。 [0040] 综上所述，本發明確已符合發明專利之要件，遂依法提 出專利申請。先前技術，以上所述者僅為本發明之較佳 實施方式，自不能以此限制本案之申請專利範圍。舉凡 099146455 表單編號A0101 第16頁/共26頁 0992079868-0 201226163 熟悉本案技藝之人士援依本發明之精神所作之等效修飾 或變化，皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 [0041] 圖1是本技術方案實施例提供之壓合裝置之示意圖。 [0042] 圖2是圖1之壓合裝置之電磁元件之示意圖。 [0043] 圖3是本技術方案實施例提供之電路板壓合方法之流程圖mobile. At this time, the telescopic end 142 of the elevating mechanism 14 is contracted, so that the second pressure plate 13 is moved toward the first pressure plate 12 until it is fitted to the first pressure plate 12. The circuit board to be pressed, the cover film, and the press-fit mat are pressed between the first pressure plate 12 and the second pressure plate 13. At this time, the elevating mechanism 14 is loosened, and the second platen 13 is no longer supported. In step 104, the heating unit heats the circuit board and the cover film to be pressed, and softens the adhesive layer of the cover film. Specifically, the heating plate 15 and the cover film may be heated by a manual means or by the control unit 17 at a temperature such that the adhesive layer of the cover film softens and may be in a molten state. In step 105, the control unit 17 controls the current flowing through the electromagnetic element 16 so that a mutual attraction magnetic force is generated between the first pressure plate 12 and the second pressure plate 13 to press the circuit board and the cover film for a predetermined time, thereby covering The film is bonded to the surface of the board. Specifically, the control unit 17 is used to control the power supply to energize the coil 162 of each of the electromagnetic units 160 of the electromagnetic element 16, and the current flowing into each of the coils 162 is equal in magnitude. Then, the current flowing in each coil 162 is gradually increased in synchronism until the magnetic force generated by the electromagnetic element 16 reaches a predetermined value. Here, the preset value is sized such that the pressure generated by the first platen 12 and the second platen 13 can tightly press the cover film to the circuit board. At this time, the pressure between the first platen 1 2 and the second platen 13 is maintained for a predetermined time. Since the pressure of the rubber layer of the cover film is substantially uniform in the effective nip region 125 after being softened and melted at the time of pressing, the thickness of the rubber layer after pressing can be made uniform. And, the first pressure plate 12 099146455 Form No. Α 0101 Page 15 / Total 26 Page 0992079868-0 201226163 The uniform pressure generated by the second pressure plate 13 can also be effectively transmitted to the circuit-dense area of the circuit board through the pressing pad, so that the molten state The glue layer is effectively filled into the gap of the dense area of the line, effectively avoiding the formation of air bubbles. [0035] Step 106, the control unit 17 controls the input current of the electromagnetic element 16 to gradually decrease to zero. [0036] Specifically, after the pressing time reaches a predetermined time, the control unit 17 is used to control the power supply to gradually reduce the current flowing into the respective coils 162 until the current in each coil 162 is zero. At this time, the magnetic attraction of the electromagnetic element to the second platen 13 is also gradually reduced until it is finally reduced to zero. [0037] Step 107, the lifting mechanism 14 drives the second pressure plate 13 to move away from the first pressure plate 12, thereby taking out the circuit board combined with the cover film. [0038] After the circuit board after pressing the cover film is cooled, the insulating layer of the cover film becomes an insulating protective layer of the circuit board. [0039] Compared with the prior art, the pressing device of the present invention and the circuit board pressing method using the same use electromagnetic elements to generate mutual attraction magnetic force between the first pressure plate and the second pressure plate. The circuit board is pressed, so that a relatively uniform pressure can be generated between the first pressure plate and the second pressure plate to press the circuit board, so that the thickness of the rubber layer of the cover film is relatively uniform after pressing, and can be effectively reduced. The air bubbles remaining in the pressed circuit board make the cover film not easy to loosen after pressing, and improve the pressing quality of the circuit board. [0040] In summary, the present invention has indeed met the requirements of the invention patent, and the patent application is filed according to law. In the prior art, the above description is only a preferred embodiment of the present invention, and the scope of the patent application of the present invention cannot be limited thereby. 。凡 099146455 Form No. A0101 Page 16 of 26 0992079868-0 201226163 Equivalent modifications or variations made by those skilled in the art in light of the spirit of the present invention are intended to be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0041] FIG. 1 is a schematic view of a press-fit apparatus provided by an embodiment of the present technical solution. 2 is a schematic view of an electromagnetic component of the press-fit apparatus of FIG. 1. 3 is a flow chart of a circuit board pressing method provided by an embodiment of the present technical solution.
[0044] 【主要元件符號說明】 壓合裝置：10 [0045] 基座：11 [0046] 第一壓板： 12 [0047] 第二壓板： 13 [0048] 升降機構： 14 [0049] 加熱單元： 15 [0050] 電磁元件. 16 [0051] 控制單元： 17 [0052] 壓合區外罩 :18 [0053] 底座：111 [0054] 支撐平臺： 112 [0055] 支撑'平面： 1122 [0056] 第一表面： 1201 099146455 表單編號A0101 第17頁/共26頁 0992079868-0 201226163 [0057] 第二表面 ：1202 [0058] 第一側面 ：1203 [0059] 第二側面 ：1204 [0060] 第一空腔 ：121 [0061] 第二空腔 ：122 [0062] 隔熱板· 123 [0063] 有效壓合區域：125 [0064] 第三表面 ：1301 [0065] 第四表面 ：1302 [0066] 第三側面 ：1303 [0067] 第四侧面 :1304 [0068] 第三空腔 ：131 [0069] 固定端： 141 [0070] 伸縮端： 142 [0071] 第一加熱單元：1 51 [0072] 第二加熱單元：152 [0073] 電磁單元 ：160 [0074] 工字型鐵 芯：161 [0075] 線圈：162 099146455 表單編號A0101 第18頁/共26頁 0992079868-0 201226163 [0076] [0077] [0078] [0079] [0080] [0081] ❹ 第一芯板：1 611 第二芯板：1612 芯柱：1613 第一磁面：1601 第二磁面：1602 磁吸面：1 6 5 ❹ 099146455 表單編號A0101 第19頁/共26頁 0992079868-0[Description of main component symbols] Pressing device: 10 [0045] Base: 11 [0046] First platen: 12 [0047] Second platen: 13 [0048] Lifting mechanism: 14 [0049] Heating unit: 15 [0050] Electromagnetic element. 16 [0051] Control unit: 17 [0052] Pressing area cover: 18 [0053] Base: 111 [0054] Supporting platform: 112 [0055] Support 'plane: 1122 [0056] Surface: 1201 099146455 Form No. A0101 Page 17 of 26 0992079868-0 201226163 [0057] Second Surface: 1202 [0058] First Side: 1203 [0059] Second Side: 1204 [0060] First Cavity: 121 [0061] Second cavity: 122 [0062] Thermal insulation plate · 123 [0063] Effective nip area: 125 [0064] Third surface: 1301 [0065] Fourth surface: 1302 [0066] Third side: 1303 [0067] Fourth side: 1304 [0068] Third cavity: 131 [0069] Fixed end: 141 [0070] Telescopic end: 142 [0071] First heating unit: 1 51 [0072] Second heating unit: 152 [0073] Electromagnetic unit: 160 [0074] I-shaped core: 161 [0075] Coil: 162 099146455 Form No. A0101 Page 18 of 26 Page 0992079868-0 201226163 [0078] [0078] [0081] ❹ First core board: 1 611 Second core board: 1612 Core column: 1613 A magnetic surface: 1601 Second magnetic surface: 1602 Magnetic surface: 1 6 5 ❹ 099146455 Form number A0101 Page 19 / Total 26 0992079868-0