201225832 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種電子裝置，特別是關於一種電磁 遮罩模組。 【先前技術】 。由於電子電力的特性，幾乎所有的電子產品於運作過 私中都會產生電磁干擾（Electromagnetic Interference, EMI) 的2題。電磁干擾EMI會造成其他電If設備工作中斷、不 正#關機、維護增加、串擾以及系統延遲。另外電磁波輻 射也會造成人體之傷害，因此先進國家對於電子產品的 E]M[C Ο ^ 弓立法予以規範。因此於規劃設計就必須針 EM^b的電磁問題，予以排除。若沒有在設計初期計算 -並針對整個產品從外殼、插槽、孔徑等外部裝置到 1 7L件排列及材料做精密設計，當後期無法通過E M c測 试時’所耗費的成本將遠大於當初的預估。 本上，電磁干擾是電流通過電場移動的電荷或電場 雷磁缸而引起。最常見的是包含尖銳邊緣的電氣傳輸產生 5射，例如資料、時脈、位址及控制信號等。 目前，一種常見應用於電路板上的電子遮罩，是以支 ^與遮蔽蓋兩件式部品進行組合。在組裝過程中，先將支 =焊接於電路板上，再將遮蔽蓋組裝於支架上。然而，當 工丨維修時還必須將遮蔽蓋拆除，拆除過程既耗時又耗 而且越靠近支架内緣之零件越不易維修。另一種電子 遮罩’是以單件式部品直接焊接於電路板板上。然而同樣 201225832 工，而且易於損壞 【發明内容】 電磁知技術之問題，本發明之—技術樣態是一種 先將複數個各自獨立的卡扣先固定於電 將電磁遮罩“於'電:】:遮 且不易取下電磁遮罩’相當利於維修，而 實模組包含蓋 且接觸部朗祕板之祕祕。每 電路， 與卡合部。固定部固定至電路板。卡含固定部 合部卡合接觸部於卡合部與電路板之7 了破㈣’使卡 【實施方式】 將以圖式揭露本發明之複數個實施方式，為_ 說明起見’許多實務上的細節將在以下敘:為月球 :而，到，這些實務上的細節不應用以限:=。 也就疋說，在本發明部分實施方式中，這些 X月" 是非必要的。此外，為簡化圖式起見，一：上的細《 構與元件在圖式中將以簡單示意的方式繪^之。°慣用的每 本發明之-技術態樣是—種電磁遮罩模級。更具體而 201225832 言，其主要可先將複數個各自獨立的卡扣先固定於電路板 上，再藉由卡扣將電磁遮罩固定至電路板上，並不需將電 磁遮罩焊接於電路板上。在維修時，僅需將卡扣反方向扭 轉即可輕易取下電磁遮罩，相當利於維修，而且不會損壞 電磁遮罩。 請參照第1A圖與第1B圖。第1A圖為繪示依照本發 明一實施方式之電磁遮罩模組2的立體視圖，其中蓋體20 尚未固定至電路板1。第1B圖為繪示第1A圖中之電磁遮 罩模組2的立體視圖，其中蓋體20已固定至電路板1。 如第1A圖與第1B圖所示，本實施方式之電磁遮罩模 組2可應用於一般常見的電路板1。電磁遮罩模組2可包 含有蓋體20以及複數個卡扣22。蓋體20可具有接觸部 200。如第1A圖與第1B圖所示，蓋體20之接觸部200可 以由蓋體20之邊緣平行延伸而出，以配合平貼於電路板1 上。由於第1A圖與第1B圖所示之蓋體20為四方形，因 此蓋體20之接觸部200即環繞蓋體20之四個邊形成，但 並不以本實施方式為限，應視實際應用中之蓋體外型而彈 性地變化。藉此，蓋體20即可覆蓋於電路板1上，且接觸 部200可接觸電路板1之接地線路，由於接地線路覆蓋於 蓋體20下並與接觸部200接觸，因此於第1A圖與第1B 圖中並未繪示，進而達到防止電磁干擾造成電路板1上重 要電子零件損害的功能。 如第1A圖所示，上述之複數個卡扣22可以沿著接觸 部200之周邊設置於電路板1上。其中，每一卡扣22皆包 含有固定部220以及卡合部222。藉此，卡扣22即可藉由 201225832 固定部220固定至電路板1而設置於電路板1上。至於卡 扣22沿著接觸部200之周邊設置於電路板1上的位置並不 設限，可依照設計上之需要與製造上之限制而彈性地變化。 如第1B圖所示，每一卡扣22之卡合部222皆可被扭 轉（亦即，相對固定部220被扭轉至蓋體20之接觸部200 的上方），藉此卡合部222即可將蓋體20之接觸部200卡 合於卡扣22之卡合部222與電路板1之間，進而將蓋體 20固定於電路板1上。 請參照第2圖，其為繪示第1A圖中之蓋體20的局部 放大圖。如第2圖所示，蓋體20之接觸部200具有凸緣 200a，電路板具有凹部，由於凹部覆蓋於蓋體20下並與接 觸部200之凸緣200a接觸，因此於第1A圖與第1B圖中 並未繪示。藉此，卡合部222卡合接觸部200於卡合部222 與電路板1之間時，蓋體20之接觸部200即可以凸緣200a 緊貼電路板1之凹部。 如第2圖所示，蓋體20之接觸部200於凸緣200a之 背面還可具有溝槽200b。被扭轉至接觸部200上方之卡合 部222可卡合於接觸部200之溝槽200b，如第1B圖所示。 藉由於接觸部200上設置凸緣200a以緊貼電路板1上之線 路，以及於接觸部200上設置溝槽200b以供卡扣22之卡 合部222進行卡合，更可增加接觸部200與電路板1之間 之接觸效果，並使得本實施方式之電磁遮罩模組2的遮蔽 效果更佳。 請參照第3圖，其為繪示第1A圖中之卡扣22的局部 放大圖。如第3圖所示，本實施方式之卡扣22其固定部 201225832 220可以進一步具有貼合部220a與直立部220b。固定部 220之貼合部220a可用來貼合並固定於電路板1。固定部 220之直立部220b可連接貼合部220a與卡合部222。於本 實施方式中，上述之直立部220b可以垂直於貼合部220a， 但並不以此為限。於另一實施方式中，上述之直立部220b 與貼合部220a之間之夾角可以是銳角，使得蓋體20在覆 蓋於電路板1的過程中，每一卡扣22之直立部220b皆具 有導引蓋體20之接觸部200順暢地朝下移動至接觸電路板 1的功能。 此外，如第3圖所示，卡合部222之一端又可與固定 部220之直立部220b連接，進而使得卡合部222可相對固 定部220之直立部220b被扭轉，如第1B圖所示。 於本實施方式中，卡扣22之卡合部222能夠相對固定 部220之直立部220b沿垂直貼合部220a之軸向L被扭轉。 藉此，卡扣22之卡合部222即可被扭轉至接觸部200上 方，並與接觸部200之溝槽200b相互卡合，但並不以此為 限。於另一實施方式中，若為了使卡扣22之卡合部222能 夠更緊密地與接觸部200之溝槽200b相互卡合，上述之軸 向L亦可不與固定部220之貼合部220a垂直，使得卡扣 22之卡合部222沿軸向L被扭轉至接觸部200上方的過程 中產生過干涉現象，進而使得卡扣22之卡合部222卡合至 接觸部200之溝槽200b時會有更緊密之效果。 於本實施方式中，上述每一卡扣22之貼合部220a皆 可沿蓋體20之接觸部200的周邊固定至電路板1，進而使 得電路板1上所有卡扣22之直立部220b能夠限制蓋體20 201225832 相對電路板1沿任何方向水平地移動，如第1A圖與第IB 圖所示。 於本實施方式中，上述之固定部220上的貼合部220a 可以具有孔洞220c，以供焊錫固定於電路板1，進而使卡 扣22更穩固地固定於電路板1上。孔洞220c之數目與位 置並不受限，可依照設計上之需要與製造上之限制而彈性 地變化，如第3圖所示。 同樣示於第3圖，於本實施方式中，上述卡扣22上的 卡合部222還可以具有孔洞222a以提供卡合部222被扭轉 的彈性，孔洞222a用以容許卡合部222相對固定部220被 扭轉時之變形，亦即，提升卡合部222之變形能力。孔洞 222a之數目與位置並不受限，可依照設計上之需要與製造 上之限制而彈性地變化。 於一實施方式中，上述之卡扣22的材質可以包含不鏽 鋼，但並不以此為限，只要是具有延展性之材質，皆可依 照設計上之需要與製造上之限制而彈性地包含於卡扣22 中〇 於一實施方式中，上述之卡扣22的表面可以鍵鎳和錫 以供焊接，但並不以此為限，只要是具有提升卡扣22之延 展性或焊接性的材質，皆可依照設計上之需要與製造上之 限制而彈性鍍於卡扣22之表面。 由以上對於本發明之具體實施例之詳述，可以明顯地 看出，本發明之電磁遮罩模組主要可先將複數個各自獨立 的卡扣先固定於電路板上，再藉由卡扣將電磁遮罩固定至 電路板上，並不需將電磁遮罩焊接於電路板上。再者，在 201225832 ，修時，僅需將卡扣之卡合部反方向相對固定部扭轉即可 $易=電磁遮罩，相當利於維修，而且不會損壞電磁遮 罩。換句話說’為了將電磁遮罩固定至電路板上 之電磁遮罩模組所提出之複數個卡扣其結構單純，各^ 狀之電磁遮罩皆可輕易配合使用。相較於以往必須丄 種形狀之電磁料再設計各別焊接部位 罩模組即可節省其所耗費的工時。 發月之電磁遽 雖然本發明已以實施方式揭露如上，然其並非用以限 何熟習此技藝者’在不脫離本發明之精神和 I巳圍内，#可作各種之更動與潤飾，因此本發明之保 圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 為讓本發明之上述和其他目的、特徵、優點與實施例 能更明顯易懂，所附圖式之說明如下：201225832 VI. Description of the Invention: [Technical Field] The present invention relates to an electronic device, and more particularly to an electromagnetic mask module. [Prior Art]. Due to the characteristics of electronic power, almost all electronic products generate two problems of Electromagnetic Interference (EMI) in operation. Electromagnetic interference EMI can cause other power If equipment to work interrupted, incorrect # shutdown, maintenance increase, crosstalk and system delay. In addition, electromagnetic radiation can also cause harm to the human body. Therefore, advanced countries have standardized the E]M[C Ο ^ bow legislation for electronic products. Therefore, in the planning and design, the electromagnetic problem of the EM^b must be eliminated. If it is not calculated at the beginning of the design - and the precision design of the entire product from the outer casing, slot, aperture and other external devices to the 7 7L parts and materials, when the EM c test cannot be passed later, the cost will be much greater than the original Estimate. Originally, electromagnetic interference is caused by a charge or an electric field demagnetizing cylinder that a current moves through an electric field. The most common is the electrical transmission of sharp edges, such as data, clock, address and control signals. At present, an electronic mask commonly used on circuit boards is combined with a two-piece part of a cover. During the assembly process, the support is first soldered to the board, and the cover is assembled to the bracket. However, when the work is repaired, the cover must be removed. The removal process is time consuming and expensive and the parts that are closer to the inner edge of the bracket are less prone to repair. Another type of electronic mask' is soldered directly to the board board in a single piece. However, it is also 201225832, and it is easy to damage. [Inventive content] The problem of the electromagnetic technology is that the first aspect of the present invention is to first fix a plurality of independent buckles to the electric electromagnetic shielding device. : Covering and not easy to remove the electromagnetic mask 'is quite conducive to maintenance, and the real module contains the cover and the secret of the contact part of the secret board. Each circuit, with the snap part. The fixed part is fixed to the circuit board. The card contains the fixed part The engaging portion of the engaging portion is broken at the engaging portion and the circuit board. The embodiment of the present invention will be disclosed in the drawings. For the sake of explanation, 'many practical details will be The following is a description of the moon: and, by the way, the details of these practices are not limited to: =. In other words, in some embodiments of the present invention, these X months are not necessary. In addition, to simplify the schema For the first time, the details of the structure and components in the drawings will be drawn in a simple and schematic manner. The technical aspects of each of the conventional inventions are electromagnetic shielding masks. More specifically, 201225832 Words, the main ones are The independent buckle is first fixed on the circuit board, and the electromagnetic mask is fixed to the circuit board by the buckle, and the electromagnetic mask is not required to be soldered to the circuit board. In the repair, only the buckle is reversed. The electromagnetic mask can be easily removed by twisting, which is quite convenient for maintenance, and does not damage the electromagnetic mask. Please refer to FIG. 1A and FIG. 1B. FIG. 1A is a diagram showing an electromagnetic mask module according to an embodiment of the present invention. A perspective view of 2, wherein the cover 20 is not yet fixed to the circuit board 1. Fig. 1B is a perspective view showing the electromagnetic mask module 2 of Fig. 1A, wherein the cover 20 has been fixed to the circuit board 1. 1A and 1B, the electromagnetic mask module 2 of the present embodiment can be applied to a common circuit board 1. The electromagnetic mask module 2 can include a cover 20 and a plurality of buckles 22. The cover 20 There may be a contact portion 200. As shown in Figs. 1A and 1B, the contact portion 200 of the cover 20 may extend in parallel from the edge of the cover 20 to fit on the circuit board 1. As shown in Figure 1A The cover 20 shown in FIG. 1B is square, so the contact portion 200 of the cover 20 is a surrounding cover. The four sides of the 20 are formed, but are not limited to the embodiment, and should be elastically changed depending on the outer cover type in the actual application. Thereby, the cover 20 can be covered on the circuit board 1 and the contact portion 200 The grounding circuit of the circuit board 1 can be contacted. Since the grounding line covers the cover body 20 and is in contact with the contact portion 200, it is not shown in FIG. 1A and FIG. 1B, thereby preventing electromagnetic interference from being caused on the circuit board 1. The function of the damage of the important electronic components. As shown in FIG. 1A, the plurality of the buckles 22 can be disposed on the circuit board 1 along the periphery of the contact portion 200. Each of the buckles 22 includes a fixing portion 220 and The engaging portion 222 can thereby be disposed on the circuit board 1 by the fixing portion 220 of the 201225832 fixed to the circuit board 1. The position at which the buckle 22 is disposed on the circuit board 1 along the periphery of the contact portion 200 is not limited, and can be elastically changed in accordance with design requirements and manufacturing limitations. As shown in FIG. 1B, the engaging portion 222 of each buckle 22 can be twisted (that is, the fixed portion 220 is twisted to the upper side of the contact portion 200 of the cover 20), whereby the engaging portion 222 is The contact portion 200 of the cover 20 can be engaged between the engaging portion 222 of the buckle 22 and the circuit board 1, and the cover 20 can be fixed to the circuit board 1. Please refer to Fig. 2, which is a partially enlarged view showing the cover 20 in Fig. 1A. As shown in Fig. 2, the contact portion 200 of the cover body 20 has a flange 200a, and the circuit board has a recessed portion. Since the recessed portion covers the cover body 20 and is in contact with the flange 200a of the contact portion 200, the first FIG. It is not shown in Figure 1B. Thereby, when the engaging portion 222 engages the contact portion 200 between the engaging portion 222 and the circuit board 1, the contact portion 200 of the cover 20 can be brought into close contact with the recess of the circuit board 1 by the flange 200a. As shown in Fig. 2, the contact portion 200 of the cover 20 may have a groove 200b on the back surface of the flange 200a. The engaging portion 222 that is twisted to the upper portion of the contact portion 200 can be engaged with the groove 200b of the contact portion 200 as shown in Fig. 1B. The contact portion 200 can be further increased by providing the flange 200a on the contact portion 200 to abut the circuit on the circuit board 1 and providing the groove 200b on the contact portion 200 for engaging the engaging portion 222 of the buckle 22. The contact effect with the circuit board 1 makes the shielding effect of the electromagnetic mask module 2 of the present embodiment better. Please refer to Fig. 3, which is a partially enlarged view showing the buckle 22 of Fig. 1A. As shown in Fig. 3, the fixing portion 201225832 220 of the buckle 22 of the present embodiment may further have a bonding portion 220a and an upright portion 220b. The bonding portion 220a of the fixing portion 220 can be used for attaching and fixing to the circuit board 1. The upright portion 220b of the fixing portion 220 can connect the bonding portion 220a and the engaging portion 222. In the embodiment, the upright portion 220b may be perpendicular to the bonding portion 220a, but is not limited thereto. In another embodiment, the angle between the upright portion 220b and the abutting portion 220a may be an acute angle, so that the cover body 20 has the upright portion 220b of each buckle 22 during the process of covering the circuit board 1. The contact portion 200 of the guide cover 20 is smoothly moved downward to the function of contacting the circuit board 1. In addition, as shown in FIG. 3, one end of the engaging portion 222 can be connected to the upright portion 220b of the fixing portion 220, so that the engaging portion 222 can be twisted relative to the upright portion 220b of the fixing portion 220, as shown in FIG. 1B. Show. In the present embodiment, the engaging portion 222 of the buckle 22 can be twisted in the axial direction L of the vertical bonding portion 220a with respect to the upright portion 220b of the fixing portion 220. Thereby, the engaging portion 222 of the buckle 22 can be twisted to the upper side of the contact portion 200 and engaged with the groove 200b of the contact portion 200, but is not limited thereto. In another embodiment, if the engaging portion 222 of the buckle 22 can be more closely engaged with the groove 200b of the contact portion 200, the axial direction L may not be the fitting portion 220a of the fixing portion 220. Vertically, the engaging portion 222 of the buckle 22 is twisted to the upper side of the contact portion 200 in the axial direction L, and the engaging portion 222 of the buckle 22 is engaged to the groove 200b of the contact portion 200. There will be a tighter effect. In the embodiment, the bonding portion 220a of each of the buckles 22 can be fixed to the circuit board 1 along the periphery of the contact portion 200 of the cover 20, thereby enabling the upright portions 220b of all the buckles 22 on the circuit board 1 to be Limiting the cover 20 201225832 moves horizontally relative to the board 1 in any direction, as shown in Figures 1A and IB. In the present embodiment, the bonding portion 220a on the fixing portion 220 may have a hole 220c for soldering to the circuit board 1, and the buckle 22 may be more firmly fixed to the circuit board 1. The number and location of the holes 220c are not limited and can be elastically varied in accordance with design requirements and manufacturing constraints, as shown in Fig. 3. Also shown in FIG. 3, in the present embodiment, the engaging portion 222 of the buckle 22 may further have a hole 222a to provide elasticity for the engaging portion 222 to be twisted, and the hole 222a is for allowing the engaging portion 222 to be relatively fixed. The deformation of the portion 220 when twisted, that is, the deformation ability of the engaging portion 222. The number and location of the holes 222a are not limited and may vary elastically in accordance with design requirements and manufacturing constraints. In one embodiment, the material of the buckle 22 may include stainless steel, but not limited thereto, as long as it is a malleable material, it can be elastically included according to design requirements and manufacturing constraints. In the embodiment of the buckle 22, the surface of the buckle 22 may be nickel and tin for welding, but not limited thereto, as long as it has the ductility or weldability of the lifting buckle 22. They can be elastically plated on the surface of the buckle 22 according to design requirements and manufacturing limitations. From the above detailed description of the specific embodiments of the present invention, it can be clearly seen that the electromagnetic mask module of the present invention can firstly fix a plurality of independent buckles to the circuit board first, and then by snapping. The electromagnetic mask is fixed to the circuit board without soldering the electromagnetic mask to the circuit board. Furthermore, in 201225832, when repairing, it is only necessary to twist the snap-fit portion in the opposite direction relative to the fixed portion. The easy-to-electromagnetic mask is quite convenient for maintenance and does not damage the electromagnetic shield. In other words, the plurality of snaps proposed by the electromagnetic mask module for fixing the electromagnetic mask to the circuit board are simple in structure, and the electromagnetic masks of the various shapes can be easily used together. Compared with the electromagnetic materials that have to be shaped in the past, redesigning the respective welding part cover module can save the labor time. Although the present invention has been disclosed in the above embodiments, it is not intended to limit the skilled person to the present invention, and various modifications and retouchings may be made without departing from the spirit and scope of the present invention. The scope of the patent application of the present invention is defined by the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features, advantages and embodiments of the present invention will become more apparent and understood.
第1A圖鱗祕照本發明—實施方式之電磁遮罩模 組的立體視圖，其中蓋體尚未固定至電路板。 、 圖， 第1B+圖為繪示第1A时之電磁遮罩模組的立體視 其中蓋體已固定至電路板。 第2圖為繪示帛1A圖中之蓋體的局部放大圖。 第3圖為繪示第1A圖中之卡扣的局部放大圖。 2 :電磁遮罩模組 200 :接觸部 【主要元件符號說明】 1 ·電路板 20 :蓋體 201225832 200a 22 : 220a 220c 222a :凸緣 卡扣 :貼合部 :孔洞 :孔洞 200b :溝槽 220 :固定部 220b :直立部 222 :卡合部 L :袖向1A is a perspective view of an electromagnetic mask module of the present invention, wherein the cover is not yet fixed to the circuit board. Fig. 1B+ is a perspective view showing the electromagnetic mask module at the 1st A, in which the cover is fixed to the circuit board. Fig. 2 is a partially enlarged view showing the cover of Fig. 1A. Fig. 3 is a partially enlarged view showing the buckle in Fig. 1A. 2: Electromagnetic mask module 200: Contact portion [Description of main components] 1 · Circuit board 20: Cover 201225832 200a 22 : 220a 220c 222a : Flange snap: Fitting: Hole: Hole 200b: Groove 220 : fixing portion 220b : upright portion 222 : engaging portion L : sleeve orientation