TW201224080A - Curable composition for inkjet applications, and process for manufacturing electronic component - Google Patents

Curable composition for inkjet applications, and process for manufacturing electronic component Download PDF

Info

Publication number
TW201224080A
TW201224080A TW100135074A TW100135074A TW201224080A TW 201224080 A TW201224080 A TW 201224080A TW 100135074 A TW100135074 A TW 100135074A TW 100135074 A TW100135074 A TW 100135074A TW 201224080 A TW201224080 A TW 201224080A
Authority
TW
Taiwan
Prior art keywords
compound
curable composition
inkjet
group
meth
Prior art date
Application number
TW100135074A
Other languages
Chinese (zh)
Other versions
TWI610990B (en
Inventor
Michihisa Ueda
Takashi Watanabe
Shigeru Nakamura
Shuuji Kage
Toshio Takahashi
Takanori Inoue
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of TW201224080A publication Critical patent/TW201224080A/en
Application granted granted Critical
Publication of TWI610990B publication Critical patent/TWI610990B/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M7/00After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock
    • B41M7/0045After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock using protective coatings or film forming compositions cured by mechanical wave energy, e.g. ultrasonics, cured by electromagnetic radiation or waves, e.g. ultraviolet radiation, electron beams, or cured by magnetic or electric fields, e.g. electric discharge, plasma
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/02Printing inks
    • C09D11/10Printing inks based on artificial resins
    • C09D11/101Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/30Inkjet printing inks
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/285Permanent coating compositions
    • H05K3/287Photosensitive compositions
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0104Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013Inkjet printing, e.g. for printing insulating material or resist

Abstract

Provided is a curable composition for inkjet applications, which can be cured into a cured film having improved uniformity and can be cured into a cured product having improved heat resistance. The present invention relates to a curable composition for inkjet applications, which can be applied in an inkjet mode and can be cured by the irradiation with light and the application of heat. This curable composition for inkjet applications comprises: a (meth)acryloyl-group-containing compound which has a (meth)acryloyl group, and which has an aromatic backbone or has such an alicyclic backbone that an unsaturated double bond is contained in an alicyclic backbone; a cyclic-ether-group-containing compound which has at least two cyclic ether groups and has an aromatic backbone; a photoreactive compound which is different from the (meth)acryloyl-group-containing compound; a photopolymerization initiator; and a latent curing agent.

Description

201224080 六、發明說明: 【發明所屬之技術領域】 本發明係關於一種藉由喷墨方式塗佈之喷墨用硬化性組 合物,且關於一種適宜用於在基板上形成抗蝕圖案等硬化 物層之喷墨用硬化性組合物、及具有由該喷墨用硬化性組 合物所形成之硬化物層之電子零件之製造方法。 【先前技術】 先前較多使用於上表面設置有配線之基板上,形成有作 為圖案狀之阻焊膜之阻焊圖案的印刷配線板。隨著電子機 器之小型化及咼密度化,業界對於印刷配線板要求進一步 微細之阻焊圖案。 作為形成微細之阻焊圖案之方法,提出有藉由喷墨方式 塗佈阻焊隸合物之方法。喷墨方式錢由網版印刷方式 形成阻焊圖案之情形相&,步驟數減少。因此,藉由噴墨 方式可容易且有效率地形成阻焊圖案。 於藉由噴墨方式塗佈阻焊用組合物之情形時,要求塗佈 時之黏度為某程度較低值。 因此,下述專利文獻丨中揭示有可藉由喷墨方式塗佈之 阻焊用組合物。下述專利文獻1中揭示有含有具有(曱基)丙 婦酿基與熱硬化性官能基之單體、重量平均分子量為_ 以下之光反應性稀釋劑、及光聚合起始劑之喷墨用硬化性 ,,且口物μ噴墨用硬化性組合物於25<Jc下之黏度為⑽ mPa.s以下。 [先前技術文獻]201224080 6. TECHNOLOGICAL FIELD OF THE INVENTION The present invention relates to a curable composition for inkjet coating by an inkjet method, and to a cured product suitable for forming a resist pattern on a substrate. A layered curable composition for inkjet, and a method of producing an electronic component having a cured layer formed of the curable composition for inkjet. [Prior Art] A printed wiring board having a solder resist pattern as a pattern-like solder resist film is often used on a substrate on which wiring is provided on the upper surface. With the miniaturization and density of electronic devices, the industry has demanded further fine solder resist patterns for printed wiring boards. As a method of forming a fine solder resist pattern, a method of applying a solder resist by ink jet method has been proposed. In the case of the inkjet method, the number of steps is reduced by the screen printing method to form the solder resist pattern. Therefore, the solder resist pattern can be formed easily and efficiently by the ink jet method. In the case where the composition for solder resist is applied by an ink jet method, the viscosity at the time of coating is required to be a certain low value. Therefore, the following patent document discloses a composition for solder resist which can be applied by an ink jet method. Patent Document 1 listed below discloses an inkjet film containing a monomer having a (fluorenyl) acrylonitrile group and a thermosetting functional group, a photoreactive diluent having a weight average molecular weight of _ or less, and a photopolymerization initiator. The curability of the curable composition for inkjet using the curable composition at 25 < Jc is (10) mPa.s or less. [Previous Technical Literature]

S 159117.doc 201224080 [專利文獻] [專利文獻 1] WO 2004/099272A1 【發明内容】 [發明所欲解決$問題] 專利文獻1所記載之喷墨用硬化性組合物之黏度相對較 低。因此,專利文獻1所記載之喷墨用硬化性組合物可藉 由喷墨方式塗佈於基板上。 然而,專利文獻1所記載之喷墨用硬化性組合物存在硬 化後之硬化物之耐熱性變低之問題。因此,於使用專利文 獻1所記載之喷墨用硬化性組合物於基板上形成阻焊圖 案,獲得印刷配線板之情形時,阻焊圖案之耐熱性較低, 因而無法長期使用印刷配線板,或印刷配線板之可靠性較 低。 進而,於使用專利文獻1所記載之喷墨用硬化性組合物 之阻焊圖案中,有時經光硬化之光硬化成分與經熱硬化之 熱硬化成分會分離。因此,存在阻焊圖案變得不均勻之問 題。 本發明之目的在於提供一種噴墨用硬化性組合物、及使 用該喷墨用硬化性組合物之電子零件之製造方法,該噴墨 用硬化性組合物係藉由噴墨方式塗佈之硬化性組合物,其 可提高硬化後之硬化物膜之均勻性,並且可提高硬化物之 耐熱性。 [解決問題之技術手段] 根據本發明之較廣之態樣,提供一種喷墨用硬化性組合 159117.doc 201224080 物’其係藉由喷墨方式進行塗佈,且藉由照射光與賦予熱 而硬化者,其含有:含(甲基)丙婦酿基之化合物,立具有 (甲基)丙稀酿基,且具有芳香族骨架或具有於脂環式骨架 内含有不飽和雙鍵之脂環式骨架;含環狀轉基之化合物, 其具有兩個以上之環狀趟基,且具有芳香族骨架;上述含 (甲基)丙賴基之化合物以外之光反應性化合物;光聚合 起始劑;及潛伏性硬化劑。 於本發明之喷墨用硬化性組合物中,依據m κ·而 測定之25t;下之黏度較佳為刚必謂上,酬以 下。 於本發明之喷墨用硬化性組合物之某一特定態樣中於 上述含(甲基)丙烯醯基之化合物、上述含環狀醚基之化合 物與上述光反應性化合物之合計1〇〇重量%中上述含(甲 基)丙烯醯基之化合物之含量為1〇重量%以上。 於本發明之喷墨用硬化性組合物之另一特定態樣中,上 述潛伏性硬化劑為二氰基二醯胺粒子,或使二氰基二醯胺 與具有可與該二氰基二醯胺反應之官能基的含官能基之化 合物反應而成之反應黏稠物。上述潛伏性硬化劑較佳為使 二氰基二醯胺與具有可與該二氰基二醯胺反應之官能基的 含官能基之化合物反應而成之反應黏稠物。 上述光聚合起始劑較佳為α-胺基烷基苯酮型光自由基聚 合起始劑。上述光聚合起始劑更佳為具有二曱胺基之α-胺 基烷基笨酮型光自由基聚合起始劑。[Patent Document 1] [Patent Document 1] WO 2004/099272 A1 [Problem to be solved by the invention] The viscosity of the curable composition for inkjet described in Patent Document 1 is relatively low. Therefore, the curable composition for inkjet described in Patent Document 1 can be applied onto a substrate by an inkjet method. However, the curable composition for inkjet described in Patent Document 1 has a problem that the heat resistance of the cured product after hardening is lowered. Therefore, when the solder resist pattern is formed on the substrate by using the curable composition for inkjet described in Patent Document 1, and the printed wiring board is obtained, the heat resistance of the solder resist pattern is low, so that the printed wiring board cannot be used for a long period of time. Or the reliability of printed wiring boards is low. Further, in the solder resist pattern of the curable composition for inkjet described in Patent Document 1, the photocured component which is photocured may be separated from the thermally hardened component which is thermally cured. Therefore, there is a problem that the solder resist pattern becomes uneven. An object of the present invention is to provide a curable composition for inkjet, and a method for producing an electronic component using the curable composition for inkjet, which is hardened by an inkjet method A composition which improves the uniformity of the cured film after hardening and which improves the heat resistance of the cured product. [Technical means for solving the problem] According to a broader aspect of the present invention, a curable composition for inkjet 159117.doc 201224080 is provided, which is coated by an inkjet method, and is irradiated with light and imparted heat. And a hardener, which contains: a compound containing a (meth) propylene sulphate group, having a (meth) propylene-based base, and having an aromatic skeleton or having a lipid having an unsaturated double bond in an alicyclic skeleton a cyclic skeleton; a compound having a cyclic transyl group having two or more cyclic mercapto groups and having an aromatic skeleton; a photoreactive compound other than the above (meth)propylidene-containing compound; photopolymerization Starting agent; and latent hardener. In the curable composition for inkjet according to the present invention, 25t is measured in accordance with m κ·; the viscosity underneath is preferably as follows. In a specific aspect of the curable composition for inkjet according to the present invention, the total of the (meth)acrylonitrile group-containing compound, the cyclic ether group-containing compound and the photoreactive compound is 1 〇〇. The content of the (meth)acrylonitrile group-containing compound in the % by weight is 1% by weight or more. In another specific aspect of the curable composition for inkjet according to the present invention, the latent curing agent is dicyanodiamide particles, or dicyanodiamide is provided with the dicyano group A reactive viscous compound obtained by reacting a functional group-containing compound of a functional group of a guanamine reaction. The latent curing agent is preferably a reactive viscous material obtained by reacting dicyanodiamine with a functional group-containing compound having a functional group reactive with the dicyanodiamine. The above photopolymerization initiator is preferably an α-aminoalkylphenone type photoradical polymerization initiator. The above photopolymerization initiator is more preferably an α-aminoalkyl ketone type photoradical polymerization initiator having a diammonium group.

於本發明之噴墨用硬化性組合物之另一特定態樣中,上 1591n,〇c S 201224080 述光反應性化合物含有具有多環骨架,且具有兩個以上之 (甲基)丙烯醯基之多官能化合物。 於本發明之喷墨用硬化性組合物之又一特定態樣中上 述光反應性化合物含有具有多環骨架,且具有一個(〒基) 丙烯醯基之單官能化合物。 於本發明之喷墨用硬化性組合物之另一特定態樣中,上 述光反應性化合物含有具有多環骨架且具有兩個以上之 (甲基)丙烯醯基之多官能化合物、與具有多環骨架且具有 一個(甲基)丙烯醯基之單官能化合物兩者。 又,根據本發明之較廣之態樣,可提供一種電子零件之 製造方法’其具備如下步驟:藉由噴墨方式塗佈依據本發 明而構成之噴墨用硬化性組合物,並繪製成圖案狀之步 驟;對繪製成圖案狀之上述喷墨用硬化性組合物照射光及 賦予熱,使其硬化,而形成硬化物層之步驟。 於本發明之電子零件之製造方法之某一特定態樣中,其 係作為具有抗蝕圖案之電子零件的印刷配線板之製造方 法,並且藉由喷墨方式塗佈上述噴墨用硬化性組合物,繪 製成圖案狀,並對繪製成圖案狀之上述喷墨用硬化性組合 物照射光及賦予熱,使其硬化,而形成抗蝕圖案。 [發明之效果] 本發明之喷墨用硬化性組合物由於含有:含(甲基)丙烯 醯基之化合物,其具有(甲基)丙烯醯基,且具有芳香族骨 架或具有於脂環式骨架内含有不飽和雙鍵之脂環式骨架; 含環狀醚基之化合物,其具有兩個以上之環狀醚基,且具 159117.doc 201224080 有芳香族骨架;光反應性化合物;光聚合起始劑;潛伏性 硬化劑’故而可藉由照射光及職予熱而硬化。進而,採用 本發明之喷墨用硬化性組合物時,可提高硬化後之硬化物 之耐熱性。又,採用本發明之喷墨用硬化性組合物時,亦 可提高硬化後之硬化物膜之均勻性。 【實施方式】 以下,說明本發明之詳情。 (喷墨用硬化性組合物) 本發明之喷墨用硬化性組合物含有:含(曱基)丙烯酿基 之化合物(A)、含環狀醚基之化合物(B)、光反應性化合物 (C)、光聚合起始劑(D)、潛伏性硬化劑(E)。含(甲基)丙烯 醯基之化合物(A)具有(甲基)丙烯醯基,且具有芳香族骨架 或具有於知環式骨架内含有不飽和雙鍵之脂環式骨架。含 %狀醚基之化合物(B)具有兩個以上之環狀醚基,且具有 芳香族骨架。光反應性化合物(〇為含(甲基)㈣醯基^化 合物(A)以外之光反應性化合物。上述「(甲基)丙烯醯基」 之用語表示丙烯醯基與曱基丙烯醯基。 本發明之噴墨用硬化性組合物由於含有含(甲基)丙稀酿 基之化合物(A)、光反應性化合物(c)及光聚合起始劑(d), 故而可藉由照射光而硬化。本發明之喷墨用硬化性組合物 由於含有含環狀醚基之化合物(B)與潛伏性硬化劑⑺),故 亦可藉由賦予熱而硬化。因此,本發明之噴墨用硬化性 σ物可藉由照射光與賦予熱而硬化,係喷墨用光及熱硬 化性組合物。本發明之喷墨用硬化性組合物可於藉由照射In another specific aspect of the curable composition for inkjet according to the present invention, the above-mentioned 1591n, 〇c S 201224080, the photoreactive compound contains a polycyclic skeleton and has two or more (meth) acrylonitrile groups. a polyfunctional compound. In still another specific aspect of the curable composition for inkjet according to the present invention, the photoreactive compound contains a monofunctional compound having a polycyclic skeleton and having one (fluorenyl) acrylonitrile group. In another specific aspect of the curable composition for inkjet according to the present invention, the photoreactive compound contains a polyfunctional compound having a polycyclic skeleton and having two or more (meth)acrylonium groups, and has a plurality of Both ring skeletons and monofunctional compounds having one (meth)acryl fluorenyl group. Moreover, according to a broad aspect of the present invention, a method for producing an electronic component can be provided, which comprises the steps of: applying a curable composition for inkjet according to the present invention by an inkjet method, and drawing a step of patterning; a step of forming a cured layer by irradiating light and imparting heat to the curable composition for inkjet which is drawn in a pattern. In a specific aspect of the method of manufacturing an electronic component of the present invention, the method of manufacturing a printed wiring board having an electronic component having a resist pattern, and applying the above-described hardenable combination for inkjet by an inkjet method The object is drawn into a pattern, and the inkjet curable composition drawn in a pattern is irradiated with light and heat is applied to be cured to form a resist pattern. [Effects of the Invention] The curable composition for inkjet according to the present invention contains a (meth)acrylonitrile group-containing compound having a (meth)acryl fluorenyl group and having an aromatic skeleton or having an alicyclic group. An alicyclic skeleton containing an unsaturated double bond in the skeleton; a cyclic ether group-containing compound having two or more cyclic ether groups and having an aromatic skeleton; 159117.doc 201224080; photoreactive compound; photopolymerization The initiator; the latent hardener' can be hardened by irradiation of light and heat. Further, when the curable composition for inkjet according to the present invention is used, the heat resistance of the cured product after curing can be improved. Further, when the curable composition for inkjet according to the present invention is used, the uniformity of the cured film after curing can be improved. [Embodiment] Hereinafter, the details of the present invention will be described. (Curable composition for inkjet) The curable composition for inkjet according to the present invention contains a compound (A) containing a (fluorenyl) acryl group, a compound (B) containing a cyclic ether group, and a photoreactive compound. (C), photopolymerization initiator (D), latent curing agent (E). The (meth) propylene fluorenyl group-containing compound (A) has a (meth) acrylonitrile group and has an aromatic skeleton or an alicyclic skeleton having an unsaturated double bond in a ring-like skeleton. The compound (B) having a % ether group has two or more cyclic ether groups and has an aromatic skeleton. The photoreactive compound (〇 is a photoreactive compound other than the (meth)(tetra)fluorenyl compound (A). The term "(meth)acryloyl) means an acryloyl group and a mercaptopropenyl group. The curable composition for inkjet according to the present invention contains a (meth)acrylic acid-containing compound (A), a photoreactive compound (c), and a photopolymerization initiator (d), so that it can be irradiated with light. Further, since the curable composition for inkjet according to the present invention contains the cyclic ether group-containing compound (B) and the latent curing agent (7), it can be cured by imparting heat. Therefore, the curable σ material for inkjet according to the present invention can be cured by irradiation with light and heat, and is an inkjet light and a thermosetting composition. The curable composition for inkjet according to the present invention can be irradiated by irradiation

S 159117.doc 201224080 光而獲得一次硬化物後,藉由對一次硬化物賦予熱而使其 正式硬化’獲得抗蝕圖案等硬化物層。如此,藉由照射光 而進行一次硬化,可抑制塗佈於基板等塗佈對象構件上之 喷墨用硬化性組合物之濕潤擴散。因此,可高精度地形成 微細之抗蝕圖案等硬化物層。 進而,本發明之噴墨用硬化性組合物具有含有(A)〜(E) 成分之特定組成,尤其是含(甲基)丙烯醯基之化合物(A)具 有芳香族骨架或具有於脂環式骨架内含有不飽和雙鍵之脂 環式骨架,且含環狀醚基之化合物(B)具有芳香族骨架, 因此可提高硬化物之耐熱性。因此,可長期使用利用本發 明之喷墨用硬化性組合物之電子零件,且可提高該電子焚 件之可罪性。又,可長期使用利用本發明之喷墨用硬化性 組合物之印刷配線板,並且可提高該印刷配線板之可靠 性。 進而,於本發明之喷墨用硬化性組合物中,具有含有 (A)〜(E)成分之特定組成,尤其是含(甲基)丙烯醯基之化合 物(A)具有芳香族骨架或具有於脂環式骨架内含有不飽和 雙鍵之脂環式骨架,且含環狀醚基之化合物⑺)具有芳香 族骨架,因此亦可提高硬化後之硬化物膜之均勾性。例如 藉由喷墨方式於塗佈對象構件上塗佈喷墨用硬化性組合 物,並藉由照射光及賦予熱,使組合物硬化,藉此可庐得 均勻之抗蝕圖案等硬化物層。具體而言,例如可抑制經光 硬化之光硬化成分與經熱硬化之熱硬化成分之分離,可使 抗钮圖案等硬化物膜上難以產生不均。 159117.doc 201224080 以下,對本發明之喷墨用硬化性組合物所含有之各成分 之詳情進行說明。 [含(甲基)丙烯醯基之化合物(A)] 含(甲基)丙烯醯基之化合物⑷具有(曱基)丙烯醯基,且 具有芳香族骨架或具有於脂環式骨架内含有不飽和雙鍵之 .月旨環式骨架。含(甲基)丙稀酿基之化合物⑷由於具有(甲 基)丙烯醯基,故而藉由照射光而進行聚合並硬化。因 此,藉由於塗佈硬化性組合物後照射光,可使硬化進行, 可保持所塗佈之形狀,可有效地抑制照射光之硬化性組合 物之一次硬化物及硬化物過度地濕潤擴散。含(曱基)丙^ 醯基之化合物(A)可僅使用一種,亦可併用兩種以上。 作為含(曱基)丙烯醯基之化合物(A),可使用具有(甲基) 丙烯醯基且具有芳香族骨架之化合物(A1)、與具有(甲基) 丙烯醯基且具有於脂環式骨架内含有不飽和雙鍵之脂環式 骨架之化合物(A2)中之任一者。 化合物(A1)中,作為具有一個(甲基)丙烯醯基之單官能 化合物,可列舉:(甲基)丙烯酸节酯、(甲基)丙烯酸苯氧 基乙酯及(甲基)丙烯酸烷氧基化笨酯等。 作為化合物(A1)中具有兩個以上之(甲基)丙烯醯基之多 官能化合物,可列舉:對雙酚型環氧化合物等加成(甲基) 丙烯酸而成之環氧(甲基)丙烯酸酯類、(曱基)丙烯酸芳香 族胺基曱酸酯類、芳香族聚酯(曱基)丙烯酸酯類、環氧化 雙盼A型二(甲基)丙稀酸醋類及丙氧化雙齡a型二(曱基)丙 烯酸酯類等。 159117.doc 201224080 作為化合物(A2)之具體例,可列舉(甲基)丙烯酸二環戊 烯酯及(甲基)丙烯酸二環戊烯基氧基乙g旨等。 含(甲基)丙烯醯基之化合物(A)之調配量係以藉由照射光 及賦予熱而適度地硬化之方式適當調整,並無特別限定。 若揭示含(甲基)丙烯醯基之化合物之調配量之一例,則 於噴墨用硬化性組合物100重量%中’含(甲基)丙稀醯基之 化合物(A)之含量較佳為1 〇重量。/。以上、8〇重量%以下。於 喷墨用硬化性組合物100重量%中’含(曱基)丙烯醯基之化 合物(A)之含量之上限係根據成分(B)〜斤)及其他成分之含 量等而適當調整。 又,含(甲基)丙稀醯基之化合物(A)、含環狀鱗基之化合 物(B)及光反應性化合物(C)之合計1 〇〇重量%中,含(曱基) 丙烯醯基之化合物(A)之含量較佳為丨0重量%以上。於該情 形時,硬化物之耐熱性及硬化物膜之均勻性進一步提高。 [含環狀醚基之化合物(B)] 含環狀醚基之化合物(B)具有兩個以上之環狀醚基,且 具有芳香族骨架。本發明之喷墨用硬化性組合物由於含有 含環狀醚基之化合物(B),故而可藉由賦予熱而硬化。藉 由使用含環狀醚基之化合物(B),可於藉由照射光使喷墨 用硬化性組合物一次硬化而獲得一次硬化物後,藉由賦予 熱使一次硬化物更有效率地硬化《因此,藉由使用含環狀 醚基之化合物(B)’可有效率地且高精度地形成抗蝕圖 案,進而可提高硬化物之耐熱性及絕緣可靠性。含環狀趟 基之化合物(B)可僅使用一種,亦可併用兩種以上。 159117.doc -10- 201224080 含環狀醚基之化合物(B)具有芳香族骨架。作為該芳香 族骨架,可列舉:苯環骨架、萘環骨架、蒽環骨架、菲環 骨架、稠四苯環骨架、筷環骨架、聯伸三苯環骨架、苯并 [a]惠環骨架、環骨架、稠五苯環骨架、㈣骨架及花環 骨架等。就使硬化性組合物之熱硬化性適度,且進一步提 高硬化物之耐熱性之觀點而言,上料㈣骨純佳為苯 環骨架、萘環骨架或蒽環骨架。 作為含環狀醚基之化合物(Β)中之環狀醚基,可列舉環 氧基及氧雜環Τ基等。其中,就獲得提高熱硬化性且耐敛 性進-步優異之硬化物之觀點而言,上述環狀縣較佳為 環氧基。 料具有環氧基之化合物之具體例,可列舉··㈣㈣ 環氧化合物、鄰苯二甲酸> 甲毆一縮水甘油酯化合物、異氰尿酸 三縮水甘油料雜環式環氧化合物、聯二甲㈣型環氧化 合物 '聯㈣型環氧化合物、四縮水甘油基二甲苯酿基乙 烷化σ物雙酚八型裱氧化合物、氫化雙酚a型環氧化合 物、雙=型環氧化合物、雙紛AD型環氧化合物、演化雙 紛A型環氧化合物、苯盼 @ ^ ^ /月厚型%氧化合物、甲酚酚 酸 漆型ί衣氧化合物、脂療_p * 如衣式裱氧化合物、雙酚Α之酚醛 /月漆型環氧化合物、整合物刑芦〆 物i %:虱化合物、乙二酿型環氧 化合物、含胺基之環氧化人 ^ 軋化σ物、橡膠改性環氧化合物、二 %戊二烯酚型環氧化合 ^ , 來石夕氧改性環氧化合物及ε-己 内酯改性環氧化合物等。直 ,,.Λ Ύ 對於本發明之噴墨用硬化 性組合物,可選擇使 上迷具有環氧基之化合物中之具有S 159117.doc 201224080 After obtaining a cured product by light, it is hardened by applying heat to the primary cured material to obtain a cured layer such as a resist pattern. By performing the primary curing by the irradiation of the light, it is possible to suppress the wet diffusion of the curable composition for inkjet applied to the member to be coated such as the substrate. Therefore, a cured layer such as a fine resist pattern can be formed with high precision. Further, the curable composition for inkjet according to the present invention has a specific composition containing the components (A) to (E), and particularly the compound (A) having a (meth) acrylonitrile group has an aromatic skeleton or has an alicyclic ring. The alicyclic skeleton having an unsaturated double bond in the skeleton and the cyclic ether group-containing compound (B) have an aromatic skeleton, so that the heat resistance of the cured product can be improved. Therefore, the electronic component using the curable composition for inkjet of the present invention can be used for a long period of time, and the sin of the electron incinerator can be improved. Further, the printed wiring board using the curable composition for inkjet according to the present invention can be used for a long period of time, and the reliability of the printed wiring board can be improved. Further, the curable composition for inkjet according to the present invention has a specific composition containing the components (A) to (E), and particularly the compound (A) having a (meth) acrylonitrile group has an aromatic skeleton or has The alicyclic skeleton containing an unsaturated double bond in the alicyclic skeleton and the cyclic ether group-containing compound (7)) have an aromatic skeleton, so that the uniformity of the cured film after hardening can be improved. For example, a curable composition for inkjet is applied onto a member to be coated by an inkjet method, and the composition is cured by irradiation with light and heat, whereby a cured layer such as a uniform resist pattern can be obtained. . Specifically, for example, separation between the photocured photocurable component and the thermally hardened thermosetting component can be suppressed, and unevenness in the cured film such as the button pattern can be prevented from occurring. 159117.doc 201224080 Hereinafter, details of each component contained in the curable composition for inkjet according to the present invention will be described. [(meth)acryloyl group-containing compound (A)] The (meth)acrylonitrile group-containing compound (4) has a (fluorenyl) acrylonitrile group and has an aromatic skeleton or has no alicyclic skeleton. Saturated double bond. The moon is a ring skeleton. Since the (meth) propylene-containing compound (4) has a (meth) acrylonitrile group, it is polymerized and hardened by irradiation with light. Therefore, by applying light after applying the curable composition, curing can be performed, and the applied shape can be maintained, and the primary cured product and the cured product of the curable composition which is irradiated with light can be effectively prevented from being excessively wet-diffused. The compound (A) containing a (fluorenyl) propyl group may be used singly or in combination of two or more. As the compound (A) having a (fluorenyl) acrylonitrile group, a compound (A1) having a (meth) acryl fluorenyl group and having an aromatic skeleton, and having a (meth) acryl fluorenyl group and having an alicyclic ring can be used. Any one of the compounds (A2) having an alicyclic skeleton of an unsaturated double bond in the skeleton. In the compound (A1), examples of the monofunctional compound having one (meth)acryl fluorenyl group include (meth)acrylic acid sulfonate, phenoxyethyl (meth)acrylate, and alkoxylate (meth)acrylate. Basic esters and the like. The polyfunctional compound having two or more (meth) acrylonitrile groups in the compound (A1) may, for example, be an epoxy (methyl) compound obtained by adding (meth)acrylic acid to a bisphenol epoxy compound or the like. Acrylates, (mercapto)acrylic aromatic aryl phthalates, aromatic polyesters (alkyl) acrylates, epoxidized double-president A-type (di) (meth) acrylates and propylene oxides Age a type of bis(indenyl) acrylates. 159117.doc 201224080 Specific examples of the compound (A2) include dicyclopentenyl (meth)acrylate and dicyclopentenyloxyethyl (meth)acrylate. The compounding amount of the (meth)acrylonitrile group-containing compound (A) is appropriately adjusted so as to be moderately hardened by irradiation with light and heat, and is not particularly limited. When an example of the compounding amount of the (meth)acrylonitrile group-containing compound is disclosed, the content of the (meth)acrylic acid group-containing compound (A) is preferably 100% by weight of the inkjet curable composition. It is 1 〇 weight. /. Above, 8〇% by weight or less. The upper limit of the content of the compound (A) containing a (fluorenyl) acrylonitrile group in 100% by weight of the curable composition for inkjet is appropriately adjusted depending on the content of the component (B) to the amount of the other component. Further, the (meth)acrylic acid group-containing compound (A), the cyclic scaly group-containing compound (B), and the photoreactive compound (C) are contained in an amount of 1% by weight, and the (fluorenyl) propylene is contained. The content of the thiol compound (A) is preferably 丨0% by weight or more. In this case, the heat resistance of the cured product and the uniformity of the cured film are further improved. [The cyclic ether group-containing compound (B)] The cyclic ether group-containing compound (B) has two or more cyclic ether groups and has an aromatic skeleton. Since the curable composition for inkjet according to the present invention contains the cyclic ether group-containing compound (B), it can be cured by imparting heat. By using the cyclic ether group-containing compound (B), the hardenable composition for inkjet can be cured once by irradiation to obtain a primary cured product, and the primary cured product can be hardened more efficiently by imparting heat. Therefore, the resist pattern can be formed efficiently and with high precision by using the cyclic ether group-containing compound (B), and the heat resistance and insulation reliability of the cured product can be improved. The compound (B) having a cyclic thiol group may be used singly or in combination of two or more. 159117.doc -10- 201224080 The compound (B) containing a cyclic ether group has an aromatic skeleton. Examples of the aromatic skeleton include a benzene ring skeleton, a naphthalene ring skeleton, an anthracene ring skeleton, a phenanthrene ring skeleton, a condensed tetraphenyl ring skeleton, a chopstick ring skeleton, a linked triphenyl ring skeleton, and a benzo[a] ring skeleton. Ring skeleton, thick pentacene ring skeleton, (four) skeleton and garland skeleton. The filler (4) is preferably a benzene ring skeleton, a naphthalene ring skeleton or an anthracene ring skeleton from the viewpoint of making the thermosetting property of the curable composition moderate and further improving the heat resistance of the cured product. The cyclic ether group in the cyclic ether group-containing compound (oxime) may, for example, be an epoxy group or an oxetanyl group. Among them, the ring-shaped county is preferably an epoxy group from the viewpoint of obtaining a cured product excellent in thermosetting property and excellent in shrinkage resistance. Specific examples of the compound having an epoxy group include (4) (iv) epoxy compound, phthalic acid> methyl hydrazine monoglycidyl ester compound, isocyanuric acid triglycidyl compound heterocyclic epoxy compound, and two A (four) type epoxy compound 'tetra(4) type epoxy compound, tetraglycidyl xylene, acetylated sigma bisphenol octadecyl oxy compound, hydrogenated bisphenol a type epoxy compound, bis = type epoxy compound , double AD type epoxy compound, evolution double A type epoxy compound, benzene hope @ ^ ^ / month thick type oxygen compound, cresy phenolic acid type ε, oxygen therapy, fat therapy _p * Oxide compound, bisphenol phenolic/monthly lacquer epoxy compound, integrator reed sputum i %: bismuth compound, ethoxylated epoxy compound, amine-containing epoxidized person, rolled σ, A rubber-modified epoxy compound, a bis-pentadiene phenol-type epoxidized compound, a ruthenium-oxygen-modified epoxy compound, and an ε-caprolactone-modified epoxy compound. Straight, and. Λ Ύ For the curable composition for inkjet of the present invention, it is optional to have a compound having an epoxy group.

159117.doc S 201224080 芳香族骨架之環氧化合物。 具有氧雜環丁基之化合物例如於日本專利第3074086號 公報中有例示。其中,於本發明之喷墨用硬化性組合物 中,可使用具有芳香族骨架之具有氧雜環丁基之化合物。 上述含環狀醚基之化合物(B)具有芳香族骨架。藉由使 用具有芳香族骨架及環狀醚基之化合物,上述硬化性組合 物之保管時及喷出時之熱穩定性進一步變得良好,於上述 硬化性組合物之保管時變得難以發生凝膠化。又,由於具 有芳香族骨架及環狀醚基之化合物與不具有芳香族骨架且 具有環狀醚基之化合物相比,與含(甲基)丙烯醯基之化合 物(A)、光反應性化合物(C)及潛伏性硬化劑(E)之相溶性優 異,故而絕緣可靠性進一步變得良好。 上述含環狀趟基之化合物(B)較佳為於25°C下為液狀。 含環狀醚基之化合物(B)於25°C下之黏度較佳為超過3〇〇 mPa’s。含環狀醚基之化合物(b)於25〇c下之黏度較佳為 150 Pa.s以下,更佳為80 Pa.s以下。若含環狀醚基之化合 物(B)之黏度為上述下限以上,則形成硬化物層時之解像 度進一步變得良好。若含環狀醚基之化合物(B)之黏度為 上述上限以下’則上述硬化性組合物之喷出性進一步變得 良好,且含環狀醚基之化合物(B)與其他成分之相溶性進 一步提高,絕緣可靠性進一步提高。 含環狀醚基之化合物(B)之調配量係以藉由賦予熱而適 度地硬化之方式適當調整,並無特別限定。噴墨用硬化性 組合物100重量%中,含環狀醚基之化合物(B)之含量較佳 159117.doc -12- 201224080 為3重量%以上、6〇重量%以下。喷墨用硬化性組合物⑽ 重量%中,含環狀醚基之化合物(B)之含量更佳為5重量% 以上,更佳為50重量%以下。若含環狀醚基之化合物^)之 含量為上述下限以上,則可藉由賦予熱而更有效地使硬化 性組合物硬化。若含環狀醚基之化合物(B)之含量為上述 上限以下,則硬化物之耐熱性進一步提高,可進一步抑制 藉由噴墨方式塗佈之喷墨用硬化性組合物濕潤擴散。 [光反應性化合物 光反應性化合物(C)為含(f基)丙烯醯基之化合物(a)以 外之光反應性化合4勿。光反應性化合物(c)較佳為不具有 芳香族骨架’且不具有於脂環式骨架内含有不飽和雙鍵之 脂環式骨架。光反應性化合物(c)可僅使用一種,亦可併 用兩種以上。 作為光反應性化合物(C),可列舉具有兩個以上之(曱基) 丙稀醯基之多官能化合物及具有一個(甲基)丙稀醯基之單 官能化合物等。 作為上述多官能化合物,可列舉:多元醇之(甲基)丙稀 酸加成物、多元醇之環氧烷改性物之(曱基)丙烯酸加成 物、(甲基)丙稀酸胺基曱酸輯類、及聚醋(甲基)丙稀酸酯 類等。作為上述多元醇,可列舉:二乙二醇、三乙二醇、 聚乙二醇、二丙二醇、三丙二醇、聚丙二醇、三羥曱基丙 烧、ί哀己院二甲醇、三環錢二甲醇及季戊四醇等。 作為光反應性化合物(c)中之多官能化合物之具體例, 可列舉:三乙二醇二(曱基)丙烯酸酯及三環癸烷二曱醇二159117.doc S 201224080 Epoxy compound of aromatic skeleton. A compound having an oxetanyl group is exemplified, for example, in Japanese Patent No. 3074086. In the curable composition for inkjet according to the present invention, a compound having an oxetanyl group having an aromatic skeleton can be used. The cyclic ether group-containing compound (B) has an aromatic skeleton. By using a compound having an aromatic skeleton and a cyclic ether group, the curable composition is further improved in heat storage during storage and at the time of discharge, and it becomes difficult to coagulate during storage of the curable composition. Gelatinized. Further, since the compound having an aromatic skeleton and a cyclic ether group is compared with a compound having no aromatic skeleton and having a cyclic ether group, the compound (A) containing a (meth) acrylonitrile group and a photoreactive compound Since the compatibility between the (C) and the latent curing agent (E) is excellent, the insulation reliability is further improved. The above cyclic fluorenyl group-containing compound (B) is preferably liquid at 25 °C. The cyclic ether group-containing compound (B) preferably has a viscosity at 25 ° C of more than 3 〇〇 mPa's. The viscosity of the cyclic ether group-containing compound (b) at 25 ° C is preferably 150 Pa·s or less, more preferably 80 Pa·s or less. When the viscosity of the cyclic ether group-containing compound (B) is at least the above lower limit, the resolution at the time of forming the cured layer is further improved. When the viscosity of the cyclic ether group-containing compound (B) is not more than the above upper limit, the discharge property of the curable composition is further improved, and the compatibility of the cyclic ether group-containing compound (B) with other components is further improved. Further improvement, insulation reliability is further improved. The compounding amount of the cyclic ether group-containing compound (B) is appropriately adjusted so as to be moderately hardened by imparting heat, and is not particularly limited. The content of the cyclic ether group-containing compound (B) in 100% by weight of the curable composition for inkjet is preferably 159117.doc -12 - 201224080 is 3% by weight or more and 6% by weight or less. The content of the cyclic ether group-containing compound (B) in the curable composition for inkjet (10) is more preferably 5% by weight or more, and still more preferably 50% by weight or less. When the content of the cyclic ether group-containing compound () is at least the above lower limit, the curable composition can be more effectively cured by imparting heat. When the content of the cyclic ether group-containing compound (B) is at most the above upper limit, the heat resistance of the cured product is further improved, and the wettability of the inkjet curable composition applied by the ink jet method can be further suppressed. [Photoreactive compound The photoreactive compound (C) is a photoreactive compound 4 which is a compound containing (f-group) acrylonitrile group (a). The photoreactive compound (c) is preferably an alicyclic skeleton which does not have an aromatic skeleton and does not have an unsaturated double bond in the alicyclic skeleton. The photoreactive compound (c) may be used alone or in combination of two or more. The photoreactive compound (C) may, for example, be a polyfunctional compound having two or more (fluorenyl) acrylonitrile groups and a monofunctional compound having one (meth) acrylonitrile group. Examples of the polyfunctional compound include a (meth)acrylic acid addition product of a polyhydric alcohol, an (alkyl)acrylic acid adduct of an alkylene oxide modified product of a polyhydric alcohol, and (meth)acrylic acid amine. Based on acid, and polyester (meth) acrylate. Examples of the polyhydric alcohol include diethylene glycol, triethylene glycol, polyethylene glycol, dipropylene glycol, tripropylene glycol, polypropylene glycol, trishydroxypropyl propyl ketone, sorrow dolphin dimethanol, and tricyclohexan Methanol and pentaerythritol. Specific examples of the polyfunctional compound in the photoreactive compound (c) include triethylene glycol bis(indenyl) acrylate and tricyclodecane dinonanol.

159117.doc S 201224080 (甲基)丙烯酸醋等。 作為光反應性化合物(c)中之單官能化合物之具體例, 可列舉.(曱基)丙烯酸異冰片酯及(曱基)丙烯酸環戊酯 等。 光反應性化合物(c)較佳為含有具有多環骨架且具有(曱 基)丙烯醯基之化合物(C1)。藉由使用該化合物,可提 高上述喷墨用硬化性組合物之硬化物之耐濕熱性。因此, 可長期使用利用本發明之喷墨用硬化性組合物之印刷配線 板等電子零件,可提高該電子零件之可靠性。 上述化σ物(C1)較佳為具有多環骨架且具有兩個以上之 (曱基)丙婦酿基之多官能化合物(C1 ])。因此,光反應性 化合物(C)較佳為含有具有多環骨架且具有兩個以上之(甲 基)丙烯醯基之多官能化合物(CU)。上述化合物(C1)亦較 佳為具有多環骨架且具有一個(甲基)丙烯醯基之單官能化 合物(C1-2)。因此,光反應性化合物(c)較佳為含有具有多 環骨架且具有一個(甲基)丙烯醯基之單官能化合物 (C1-2)。其中,就進一步提高硬化物之耐濕熱性之觀點而 言,較佳為具有多環骨架且具有兩個以上之(甲基)丙稀酿 基之多官能化合物(C1 _ 1)。 進而,光反應性化合物(C)更佳為含有具有多環骨架且 具有兩個以上之(甲基)丙烯醯基之多官能化合物(d-D、 與具有多m骨架2具有一個(甲基)丙婦酿基之單官能化合 物(d-2)兩者。於該等情形時,上述喷墨用硬化性組合^ 之硬化物之耐濕熱性變得相當高。因此,可更長期地使用 1591I7.doc 201224080 利用本發明之噴墨料化性組合物之特配線板等電子零 件’且該電子零件之可靠性進-步提I X,藉由使用單 官能化合物(C1-2),不僅硬化物之耐濕熱性提高,而且硬 化性組合物之噴出性亦提高。再者,於使用具有多環骨架 且具有一個(曱基)丙烯醯基之單官能化合物((:ι·2)之情形 時,與使用不具有多環骨架且具有一個(曱基)丙烯醯基之 單官能化合物之情形相比,硬化物之耐濕熱性提高。 多官能化合物(C1-1)只要具有多環骨架,且具有兩個以 上之(甲基)丙烯醯基,則並無特別限定。可使用具有多環 骨架且具有兩個以上之(曱基)丙烯醯基之先前公知之多官 能化合物作為多官能化合物(Cl-ι)。由於多官能化合物 (C1 1)具有兩個以上之(甲基)丙稀醯基,故而藉由照射光 進行聚合而硬化。多官能化合物(C1-1)可僅使用一種,亦 可併用兩種以上。 作為夕g忐化合物(C1 _ 1),可列舉:多元醇之(甲基)丙 烯鲅加成物、多元醇之環氧烷改性物之(甲基)丙烯酸加成 物、(甲基)丙烯酸胺基曱酸酯類、及聚酯(甲基)丙烯酸酯 類等。作為上述多元醇’可列舉:二乙二醇、三乙二醇、 ΛΚ乙一醇、二丙二醇、三丙二醇、聚丙二醇、三羥曱基丙 燒及季戊四醇等。 作為多官能化合物(CU)之具體例,可列舉:三環癸烷 一甲醇甲基)丙烯酸酯及異冰片二甲醇二(甲基)丙烯酸 曰等其中’就進一步提高硬化物之耐濕熱性之觀點而 ° 夕目月巨化合物(C1-1)較佳為三環癸烧二甲醇二(曱基)159117.doc S 201224080 (meth)acrylic acid vinegar, etc. Specific examples of the monofunctional compound in the photoreactive compound (c) include isobornyl (meth)acrylate and cyclopentyl (meth)acrylate. The photoreactive compound (c) is preferably a compound (C1) having a polycyclic skeleton and having a (fluorenyl) acrylonitrile group. By using this compound, the heat resistance of the cured product of the above-mentioned curable composition for inkjet can be improved. Therefore, electronic components such as printed wiring boards using the curable composition for inkjet according to the present invention can be used for a long period of time, and the reliability of the electronic components can be improved. The above-mentioned yttrium compound (C1) is preferably a polyfunctional compound (C1) having a polycyclic skeleton and having two or more (fluorenyl) propylene groups. Therefore, the photoreactive compound (C) is preferably a polyfunctional compound (CU) having a polycyclic skeleton and having two or more (meth)acrylonium groups. The above compound (C1) is also preferably a monofunctional compound (C1-2) having a polycyclic skeleton and having one (meth)acrylinyl group. Therefore, the photoreactive compound (c) is preferably a monofunctional compound (C1-2) having a polycyclic skeleton and having one (meth)acryl fluorenyl group. Among them, a polyfunctional compound (C1 _ 1) having a polycyclic skeleton and having two or more (meth) acrylonitrile groups is preferred from the viewpoint of further improving the heat and humidity resistance of the cured product. Further, the photoreactive compound (C) is more preferably a polyfunctional compound having a polycyclic skeleton and having two or more (meth)acryl fluorenyl groups (dD, and having a polym skeleton 2 having one (meth) propyl group In the case of the above-mentioned monofunctional compound (d-2), the heat resistance of the cured product of the above-mentioned inkjet hardenable composition becomes relatively high. Therefore, the 1591I7 can be used for a longer period of time. Doc 201224080 The electronic component such as a special wiring board of the ink jet material composition of the present invention is used, and the reliability of the electronic component is further advanced by using IX, by using a monofunctional compound (C1-2), not only a cured product The heat-resistance is improved, and the squeezing property of the curable composition is also improved. Further, when a monofunctional compound having a polycyclic skeleton and having one (fluorenyl) acrylonitrile group ((: ι·2) is used, The heat resistance of the cured product is improved as compared with the case of using a monofunctional compound having no polycyclic skeleton and having one (fluorenyl) acrylonitrile group. The polyfunctional compound (C1-1) has a polycyclic skeleton and has More than two The acrylonitrile group is not particularly limited. A previously known polyfunctional compound having a polycyclic skeleton and having two or more (fluorenyl) acrylonitrile groups can be used as the polyfunctional compound (Cl-I). (C1 1) has two or more (meth) acrylonitrile groups and is hardened by polymerization by irradiation with light. The polyfunctional compound (C1-1) may be used alone or in combination of two or more. The g忐 compound (C1 _ 1) may, for example, be a (meth)acryl oxime adduct of a polyhydric alcohol, an alkylene oxide adduct of a polyalkylene oxide modified product, or an (meth)acrylic acid amine. Examples of the above polyols include diethylene glycol, triethylene glycol, decyl alcohol, dipropylene glycol, tripropylene glycol, polypropylene glycol, and the like. Examples of the polyfunctional compound (CU) include tricyclodecane-methanol methyl acrylate and isobornyl dimethanol di(meth)acrylic acid hydrazide. Further improve the heat resistance of the hardened material From the point of view of the nature, the compound (C1-1) is preferably tricyclic terbene dimethanol (mercapto).

S 159117.doc 15 201224080 丙歸酸S旨。{·祕「γ 、 ^ (甲基)丙婦酸酯」之用語表示丙烯酸酯 與甲基丙烯酸酯。 上述單官能化合物(C1_2)只要具有多環骨架,且具有一 個(甲基)丙婦酿基’則並無特別限定。可使用具有多環骨 架且具有一個(曱基)丙烯醯基之先前公知之單官能化合物 作為單s能化合物(C1_2)。單官能化合物(ci_2)可僅使用 一種,亦可併用兩種以上。 作為上述單官能化合物(C1_2)之具體例,可列舉:(甲 基)丙稀k異冰片g旨、(甲基)丙烯酸二羥基環戊二烯酯及 (甲基)丙稀酸一環戊自旨等。其中,就進一步提高硬化物之 对濕熱性之觀點而言,單官能化合物(ci2)較佳為選自由 (甲基)丙烯酸異冰片醋、(甲基)丙烯酸二經基環戊二烯 酉曰及(甲基)丙烯酸二環戊酯所組成之群中之至少一種。 化。物(C1)中之上述「多環骨架」表示連續具有複數個 環狀骨架之結構。作為化合物(C1)令之上述多環骨架分 別可列舉多環脂環式骨架等。 作為上述多環脂環式骨架,可列舉:雙環燒烴骨架、三 環烷烴骨架、四環烷烴骨架及異冰片基骨架等。 光反應性化合物(C)之調配量係以藉由照射光而適度地 硬化之方式適當調整’並無特別限定。於噴墨用硬化性植 合物爾量%中’光反應性化合物(c)之含量較佳為3重量 以上、8〇重量%以下。於噴墨用硬化性組合物ι〇〇重量% 中’光反應性化合物(C)之含量更佳為5重量%以上,更佳 為70重量%以下。若光反應性化合物(c)之含量為上述下限 159117.doc -16- 201224080 以上’則藉由照射光,可更有效地使硬化性組合物硬化。 若光反應性化合物(c)之含量為上述上限以上,則有時於 熱硬化時產生不均。 於喷墨用硬化性組合物100重量%中,化合物(C1)之含量 較佳為5重量%以上,更佳為丨〇重量%以上,進而較佳為2〇 重量%以上,較佳為80重量%以下,更佳為7〇重量。/〇以 下,進而較佳為60重量。/〇以下。於喷墨用硬化性組合物 100重里/ί»中’化合物(Cl_i)及化合物(ci_2)之各自含量較 佳為5重量%以上,更佳為1〇重量%以上,進而較佳為2〇重 量%以上,較佳為80重量%以下,更佳為7〇重量%以下, 進而較佳為6〇重量%以下,尤佳為重量%以下。若化合 物(C1)、化合物(C1-1)及化合物(C1_2)之各自含量為上述 下限以上,則硬化物之耐濕熱性進一步提高。若化合物 (C1)、化合物(C1-1)及化合物(C1_2)之各自含量為上述上 限以下,則藉由照射光及賦予熱,可更有效地使硬化性組 合物硬化。 [光聚合起始劑(D)] 為了藉由照射光而使硬化性組合物硬化,本發明之喷墨 用硬化性組合物含有光聚合起始劑(D)。作為光聚合起始 劑(D) ’可列舉光自由基聚合起始劑及光陽離子聚合起始 劑等。光聚合起始劑(D)較佳為光自由基聚合起始劑。光 聚合起始劑(D)可僅使用一種,亦可併用兩種以上。 上述光自由基聚合起始劑並無特別限定。上述光自由基 聚合起始劑係用以藉由照射光而產生自由基,並開始自由S 159117.doc 15 201224080 A. {· Secret "γ, ^ (methyl) propionate" means acrylate and methacrylate. The monofunctional compound (C1_2) is not particularly limited as long as it has a polycyclic skeleton and has one (meth) propylene base. A previously known monofunctional compound having a polycyclic skeleton and having one (fluorenyl) acrylonitrile group can be used as the single s-energy compound (C1_2). The monofunctional compound (ci_2) may be used alone or in combination of two or more. Specific examples of the monofunctional compound (C1_2) include (meth)acrylic acid ketone, dihydroxycyclopentadienyl (meth)acrylate, and (cyclo)pentamethyl (meth) acrylate. Purpose. Among them, the monofunctional compound (ci2) is preferably selected from the group consisting of isobornyl (meth)acrylate and dicyclopentadienyl (meth)acrylate from the viewpoint of further improving the moist heat of the cured product. And at least one of the group consisting of dicyclopentanyl (meth)acrylate. Chemical. The above "polycyclic skeleton" in the substance (C1) means a structure having a plurality of cyclic skeletons in succession. The polycyclic skeleton represented by the compound (C1) may, for example, be a polycyclic alicyclic skeleton or the like. Examples of the polycyclic alicyclic skeleton include a bicyclic hydrocarbon skeleton, a tricycloalkane skeleton, a tetracycloalkane skeleton, and an isobornyl skeleton. The blending amount of the photoreactive compound (C) is appropriately adjusted so as to be moderately hardened by irradiation with light, and is not particularly limited. The content of the photoreactive compound (c) in the amount of the curable composition for inkjet is preferably 3 or more and 8% by weight or less. The content of the photoreactive compound (C) in the weight % of the curable composition for inkjet is more preferably 5% by weight or more, still more preferably 70% by weight or less. When the content of the photoreactive compound (c) is the above lower limit 159117.doc -16 - 201224080 or more, the curable composition can be more effectively cured by irradiation with light. When the content of the photoreactive compound (c) is at least the above upper limit, unevenness may occur during thermal curing. The content of the compound (C1) is preferably 5% by weight or more, more preferably 丨〇% by weight or more, still more preferably 2% by weight or more, and preferably 80% by weight based on 100% by weight of the curable composition for inkjet. The weight % or less is more preferably 7 〇 by weight. It is preferably at least 60 weights. /〇The following. The content of each of the 'compound (Cl_i) and the compound (ci_2) in the curable composition for inkjet is preferably 5% by weight or more, more preferably 1% by weight or more, and still more preferably 2 Å. The weight% or more is preferably 80% by weight or less, more preferably 7% by weight or less, still more preferably 6% by weight or less, and still more preferably 8% by weight or less. When the content of each of the compound (C1), the compound (C1-1) and the compound (C1_2) is at least the above lower limit, the moist heat resistance of the cured product is further improved. When the content of each of the compound (C1), the compound (C1-1) and the compound (C1_2) is at most the above upper limit, the curable composition can be more effectively cured by irradiation with light and heat. [Photopolymerization initiator (D)] The curable composition for inkjet according to the present invention contains a photopolymerization initiator (D) in order to cure the curable composition by irradiation with light. Examples of the photopolymerization initiator (D)' include a photoradical polymerization initiator, a photocationic polymerization initiator, and the like. The photopolymerization initiator (D) is preferably a photoradical polymerization initiator. The photopolymerization initiator (D) may be used alone or in combination of two or more. The photoradical polymerization initiator is not particularly limited. The above photoradical polymerization initiator is used to generate free radicals by irradiating light and to start free

S 159H7.doc •17· 201224080 基聚合反應之化合物。作為上述光自由基聚合起始劑之具 體例例如可列舉:安息香、安息香烷基醚類、苯乙酮 類、胺基苯乙酮類、蒽醌類、硫雜蒽酮類、縮酮類、 2,4’5-二芳基咪唑二聚物、核黃素四丁酸酯、硫醇化合 物、2,4,6-三均三畊、有機自素化合物、二苯甲酮類、氧 雜蒽酮類及2,4,6_三节基苯甲醯基二笨基氧化膦等。上述 光自由基聚合起始劑可僅使用一種,亦可併用兩種以上。 作為上述安息香烷基醚類,可列舉安息香甲醚、安息香 乙醚及女息香異丙醚等。作為上述苯乙酮類,可列舉苯乙 酮2,2_—曱氧基-2-苯基苯乙酮、2,2-二乙氧基-2-苯基苯 乙酮及1,1-二氯苯乙酮孝。作為上述胺基苯乙酮類,可列 舉2_甲基-1-[4-(甲硫基)苯基]_2_嗎啉基丙烷 < 酮、2_苄基_ 2_一甲胺基-1-(4_嗎啉基苯基)-丁烷-1-酮及N,N-二曱基胺 土笨乙_等。作為上述蒽g昆類,可列舉曱基蒽酿、乙 基二醌' 2-第二丁基蒽醌及丨_氯蒽醌等。作為上述硫雜蒽 酮類’可列舉2,4-二甲基硫雜蒽酮、2,4_二乙基硫雜蒽 鲷、2-氯硫雜蒽8同及2,4•二異丙基硫雜蒽酮等。作為上述 縮酮類’可列舉苯乙酮二甲基縮酮及苯偶醯二曱基縮酮 等。作為上述硫醇化合物,可列舉2•疏基苯并^坐、2疏 基苯并W及2·㈣苯并㈣等。作為上述有㈣素化合 物’可列舉2,2,2-三溴乙醇及三漠甲基苯基石風等。作為上 述二苯甲酮類,可列舉二苯f酮及4,4,-雙(二乙基胺基)二 苯甲酮等。 上述光自由基聚合起始劑較佳為α-胺基烷基苯酮型光自 159117.doc 201224080 由基聚合起始劑,更佳為具有二曱胺基之α_胺基烷基苯酮 型光自由基聚合起始劑。藉由使用該特定之光自由基聚合 起始劑,即便曝光量較少,亦可有效率地使喷墨用硬化性 組合物光硬化。因此,藉由照射光,可有效地抑制被塗佈 之喷墨用硬化性組合物濕潤擴散,可高精度地形成微細之 抗蝕圖案。進而,於上述光自由基聚合起始劑為具有二曱 胺基之α-胺基烧基苯_型光聚合起始劑之情形時,可使熱 硬化速度加快,並可使組合物之光照射物之熱硬化性變得 良好。 本發明者等人發現:藉由使用具有二曱胺基之α_胺基烷 基笨酮型光自由基聚合起始劑,不僅可使光硬化性變得良 好,亦可使熱硬化性變得良好。上述具有二曱胺基之心胺 基烧基苯酮型光自由基聚合起始劑為極大地有助於提高熱 硬化性之成分。進而,藉由使用具有二甲胺基之α_胺基烷 基笨酮型光自由基聚合起始劑,可提高硬化物之耐熱性及 絕緣可靠性。若絕緣可靠性優異,則具有由本發明之喷墨 用硬化性組合物所形成之抗蝕圖案的印刷配線板等電子零 件即便於高濕度之條件下長期使用,絕緣電阻亦充分地維 持為較高值。 作為上述cx-胺基烷基苯酮型光自由基聚合起始劑之具體 例’可列舉:BASF公司製造之IRGACURE 907 ' IRGACURE 369、IRGACURE 379 及 IRGACURE 379EG 等。亦可使該等以外之α-胺基烷基苯酮型光聚合起始劑。 其中’就使喷墨用硬化性組合物之光硬化性與藉由硬化物S 159H7.doc •17· 201224080 Compounds based on polymerization. Specific examples of the photoradical polymerization initiator include benzoin, benzoin alkyl ether, acetophenone, aminoacetophenone, anthraquinone, thioxanthone, and ketal. 2,4'5-diarylimidazole dimer, riboflavin tetrabutyrate, thiol compound, 2,4,6-three-average three-plough, organic compound, benzophenone, oxygen Anthrone and 2,4,6-trisylbenzimidyl diphenylphosphine oxide, and the like. These photoradical polymerization initiators may be used alone or in combination of two or more. Examples of the benzoin alkyl ethers include benzoin methyl ether, benzoin ethyl ether, and female isopropyl ether. Examples of the acetophenones include acetophenone 2,2-methoxycarbonyl-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, and 1,1-di Chloroacetophenone filial. Examples of the above aminoacetophenones include 2-methyl-1-[4-(methylthio)phenyl]_2-morpholinopropane < ketone, 2-benzyl-2-methylamino 1-(4-morpholinylphenyl)-butan-1-one and N,N-didecylamine tert-ethyl _ and the like. Examples of the above-mentioned oxime-types include thiol-based brewing, ethyl quinone-'2-t-butyl fluorene, and hydrazine-chloropurine. Examples of the above thioxanthones include 2,4-dimethylthiaxanthone, 2,4-diethylthiazepine, 2-chlorothiazepine 8 and 2,4•diisopropyl. Pyrithione and the like. Examples of the ketal's include acetophenone dimethyl ketal and benzoin decyl ketal. Examples of the thiol compound include 2, thiophene benzoate, 2 sulfobenzone, and 2 (tetra) benzo (tetra). Examples of the above-mentioned (tetra)-based compound include 2,2,2-tribromoethanol and Sanmomethylphenyl stone. Examples of the benzophenones include diphenyl f-ketone and 4,4,-bis(diethylamino)benzophenone. The above photoradical polymerization initiator is preferably an α-aminoalkylphenone type light from 159117.doc 201224080 from a base polymerization initiator, more preferably an amidino group α-aminoalkylphenone Type photoradical polymerization initiator. By using this specific photoradical polymerization initiator, the curable composition for inkjet can be efficiently photocured even when the amount of exposure is small. Therefore, by irradiating light, it is possible to effectively suppress the wet diffusion of the applied curable composition for inkjet, and to form a fine resist pattern with high precision. Further, in the case where the photoradical polymerization initiator is an α-aminoalkylbenzophenone type photopolymerization initiator having a diammonium group, the heat hardening rate can be accelerated, and the light of the composition can be made. The thermosetting property of the irradiated material is good. The present inventors have found that by using an α-aminoalkyl ketone type photoradical polymerization initiator having a diammonium group, not only photocurability can be improved, but also thermosetting property can be changed. Good. The above-mentioned cardiamine ketone type photoradical polymerization initiator having a diammonium group is a component which greatly contributes to the improvement of thermosetting property. Further, by using an α-aminoalkyl ketone type photoradical polymerization initiator having a dimethylamino group, heat resistance and insulation reliability of the cured product can be improved. When the insulation reliability is excellent, electronic components such as a printed wiring board having a resist pattern formed of the curable composition for inkjet according to the present invention are used for a long period of time under high humidity conditions, and the insulation resistance is sufficiently maintained high. value. Specific examples of the above-mentioned cx-aminoalkylphenone type photoradical polymerization initiator include IRGACURE 907 'IGGACURE 369, IRGACURE 379 and IRGACURE 379EG manufactured by BASF Corporation. It is also possible to use an α-aminoalkylphenone type photopolymerization initiator other than the above. Wherein 'the photocurability of the curable composition for inkjet and the hardened matter

S 159117.doc -19 201224080 而之絕緣可靠性進一步變得良好之觀點而言,較佳為2_节 基-2-二甲胺基嗎啉基苯基)·丁酮_1(IRGacure 或2-(二甲胺基)-2-[(4-曱基笨基)曱基]-l-[4-(4-嗎啉基)苯 基]-1-T_(IRGACURE 379 或 IRGACURE 379EG)。該等係 具有二甲胺基之α-胺基烷基苯酮型光自由基聚合起始劑。 亦將上述光自由基聚合起始劑與光聚合起始助劑併用。 作為該光聚合起始助劑,可列舉:Ν,Ν-二甲基胺基笨甲酸 乙酯、Ν,Ν-二甲基胺基苯甲酸異戊酯、4_二甲基胺基苯甲 酸戊酯、三乙胺及三乙醇胺等。亦可使用該等以外之光聚 合起始助劑。上述光聚合起始助劑可僅使用一種,亦可併 用兩種以上。 又,亦可將於可見光區域具有吸收之(:(}1_784等(汽巴精 化公司製造)二茂鈦化合物等用於促進光反應。 作為上述光陽離子聚合起始劑,並無特別限定,例如可 列舉疏鹽、鐵鹽、二茂金屬化合物及安息香甲苯確酸醋 等。上述光陽離子聚合起始劑可僅使用一種,亦可併用兩 種以上。 相對於含(曱基)丙稀醯基之化合物(Α)與光反應性化合物 (〇曰之合計_重量份’光聚合起始劑⑼之含量較佳為〇] 重!份以上’更佳為!重量份以上,進而較佳為3重量份以 上’較佳為3〇重量份以下,更佳為15重量份以下,進而較 佳為10重I伤以下。若光聚合起始劑⑼之含量為上述下 限以上及上述上限以下’則藉由照射光,硬化性組合物進 一步有效地硬化。 159117.doc 201224080 [潛伏性硬化劑(E)] 為了可藉由賦予熱而有效率地硬化,本發明之噴墨用硬 化性組合物含有潛伏性硬化劑(E)。潛伏性硬化劑並無 特別限定。可使用先前公知之潛伏性硬化劑作為潛伏性硬 化劑(E)«>潛伏性硬化劑(E)可僅使用一種,亦可併用兩種 以上。 作為潛伏性硬化劑(E),可列舉:二氰基二醯胺粒子、 醯肼系化合物、利用由(甲基)丙烯酸甲酯樹脂或苯乙烯樹 月曰等所形成之外殼包覆三苯基膦(熱硬化劑)而成之潛伏性 硬化劑(例如可列舉日本化藥公司製造之「EpcAT_p」及 「EPCAT-PS」)、利用由聚脲系聚合物或自由基聚合物所 形成之外殼包覆胺等熱硬化劑而成之潛伏性硬化劑(日本 專利第3隨97號公极及日本專利第3199818號公報所記 載)、藉由將改性味唑等熱硬化劑分散、封入環氧樹脂中 並進行粉碎而獲得之潛伏性硬化劑(ASAm kasei & mATERIALS 公司製造之「N〇vacure hxA3792」及 「HXA3932HP」)、使硬化劑分散並含有於熱塑性高分子 内而成之潛伏性硬化劑(日本專利第3〇9隨號公報所記 載)、及利用四苯酚類化合物等進行包覆之咪唑潛伏性硬 化劑(例如日本曹達製造之「tEP_2E4MZ」及「HIPa 2E4MZ」)等。亦可使用該等以外之潛伏性硬化劑。 就進-步減小加溫時之黏度變化,线―步延長適用期 之觀點而言’潛伏性硬化劑⑻較佳為二氰基二醯胺1 更進一步減小加溫時之黏度轡 鄱没支化,且更進一步延長適用期 159117.doc S. 201224080 之觀點而二’潛伏性硬化劑⑻較佳為二氰基二酿胺粒 :、或使:鼠基二酿胺與具有可與該二氰基二酿胺反應之 S月b 土的3 g此基之化合物反應而成之反應黏稠物(E1)。 作為上述反應黏稠物(D)之較佳—例,可列舉使具有環狀 謎基之化合物之環㈣基與:氰基二ϋ胺之活性氫之一部 分反應而成之反應物。 為了防止二氰基二醯胺粒子之沈澱或噴嘴堵塞,亦可預 先使二氰基二醯胺與具有環狀喊之化合物反應,並溶解 於組合物中。於該情料,組合物之適用期亦I好。潛伏 性硬化劑(Ε)尤佳為使二氰基二醯胺與具有可與該二氰基 二醯胺反應之官能基的含官能基之化合物反應而成之反應 黏稠物(Ε1)。藉由使用此種反應黏稠物(Ε1),可提高由硬 化物產生之絕緣可靠性。進而,上述硬化性組合物即便加 /m至50C以上’黏度亦變得難以變化,適用期延長。 再者’只要上述反應黏稠物(E1)在用於喷墨用硬化性組 合物之前’反應黏稠物(E1)單獨具有黏稠之性狀即可,於 嘴墨用硬化性組合物中亦可不黏稠。又,自喷墨用硬化性 組合物取出上述反應黏稠物(E1)時’該反應黏稠物(E1)亦 可黏稠。 常溫(23°C)下為固體之二氰基二醯胺(二氰基二醯胺粒 子)由於在液狀成分中以固體形式存在,故而具有於保管 中沈澱、或引起喷墨喷頭之喷嘴堵塞之可能性。為了消除 此種問題’較佳為預先使二氰基二醯胺與具有可與該二氰 基二醯胺反應之官能基的含官能基之化合物反應,製作反 159117.doc -22· 201224080 應黏稠物(E1) ’再添加至組合物中。即,於本發明之嘴墨 用硬化性組合物中’較佳為將使二氰基二醯胺與具有可與 該二氰基二醯胺反應之官能基的含官能基之化合物反應而 成之反應黏稍物(E1)用作潛伏性硬化劑(e)。若使用該反應 黏稠物(E1 ),則組合物之適用期及藉由硬化物之絕緣可靠 性變得良好。 對於調配於上述喷墨用硬化性組合物中之前之上述反應 黏稠物(E1)’較佳為未調配於有機溶劑中,或調配於有機 溶劑中且相對於上述反應黏稠物(E1)1 〇〇重量份,所調配 之有機溶劑之量為100重量份以下。於上述反應黏稠物 (E1)調配於有機溶劑中之情形時,相對於上述反應黏稠物 (El)100重量份’所調配之有機溶劑之量較佳為5〇重量份 以下’更佳為20重置份以下’進而較佳為1〇重量份以下, 尤佳為1重量份以下。 上述反應黏稠物(E1)較佳為使上述含官能基之化合物與 二氰基二醯胺之活性氫之一部分反應而成之反應物。上述 含官能基之化合物之可與二氰基二醯胺反應之官能基一般 與二氰基二醯胺之活性氫之一部分反應。 與上述含官能基之化合物反應之上述二氰基二醯胺較佳 為粉末狀。藉由使粉末狀之二氰基二醯胺與上述含官能基 之化合物反應’可獲得並非粉末狀而是黏稠之上述反應黏 稠物(E1)。 就容易地合成上述反應黏稠物(E1 ),進而獲得適用期較 長之硬化性組合物之觀點而言,與上述二氰基二醯胺反應S 159117.doc -19 201224080 From the viewpoint of further improving the insulation reliability, it is preferably 2_benzyl-2-dimethylaminomorpholinylphenyl)butanone-1 (IRGacure or 2) -(Dimethylamino)-2-[(4-indolyl)indolyl]-l-[4-(4-morpholinyl)phenyl]-1-T_ (IRGACURE 379 or IRGACURE 379 EG). These are dimethylamino-based α-aminoalkylphenone type photoradical polymerization initiators. The above photoradical polymerization initiators are also used in combination with a photopolymerization starter. The starting agent can be exemplified by hydrazine, hydrazine-dimethylamino benzoic acid ethyl ester, hydrazine, hydrazine-dimethylaminobenzoic acid isoamyl ester, 4-dimethylaminobenzoic acid amyl ester, triethyl ethane. An amine, a triethanolamine, etc. The photopolymerization initiation aid other than the above may be used. The photopolymerization initiation aid may be used alone or in combination of two or more. (1), etc. (manufactured by Ciba Specialty Chemicals Co., Ltd.), a titanocene compound or the like is used to promote the photoreaction. The photocationic polymerization initiator is not particularly limited, and examples thereof include salt and iron salts. The metallocene compound and the benzoin toluene acid vinegar, etc. The above photocationic polymerization initiator may be used singly or in combination of two or more. The photoreactivity with respect to the compound (fluorene) containing fluorenyl fluorenyl group The compound (the total amount of hydrazine - the part by weight of the photopolymerization initiator (9) is preferably 〇] by weight or more, more preferably more than 5% by weight, more preferably 3 parts by weight or more, preferably 3 Å. It is more preferably 15 parts by weight or less, further preferably 10 parts by weight or less. When the content of the photopolymerization initiator (9) is at least the above lower limit and lower than the above upper limit, the curable composition is irradiated with light. Further effective hardening. 159117.doc 201224080 [Latent hardener (E)] The curable composition for inkjet according to the present invention contains a latent curing agent (E) in order to be efficiently cured by imparting heat. The curing agent is not particularly limited, and a conventionally known latent curing agent can be used as the latent curing agent (E) «> The latent curing agent (E) may be used alone or in combination of two or more. Hardener (E) The dicyanoguanamine particles and the lanthanoid compound may be coated with a triphenylphosphine (thermosetting agent) coated with an outer shell formed of a methyl (meth) acrylate resin or a styrene tree. The latent curing agent (for example, "EpcAT_p" and "EPCAT-PS" manufactured by Nippon Kayaku Co., Ltd.), and a thermosetting agent such as an amine coated with a shell formed of a polyurea polymer or a radical polymer. The latent curing agent (Japanese Patent No. 3, No. 97, and Japanese Patent No. 3199818) is obtained by dispersing and sealing a thermosetting agent such as modified oxazole into an epoxy resin. Latent hardener ("N〇vacure hxA3792" and "HXA3932HP" manufactured by MASm Kasei & mATERIALS), a latent hardener which disperses a hardener and is contained in a thermoplastic polymer (Japanese Patent No. 3) (9), an imidazole latent curing agent coated with a tetraphenol compound or the like (for example, "tEP_2E4MZ" and "HIPa 2E4MZ" manufactured by Soda, Japan). Latent hardeners other than those may also be used. In terms of step-by-step reduction of the viscosity change during heating, the term "step latent hardener (8) is preferably dicyanodiamine 1 to further reduce the viscosity at the time of warming. Not branched, and further extended the application period 159117.doc S. 201224080 and the second 'latent hardener (8) is preferably dicyandiamine: or: The reaction viscous material (E1) is obtained by reacting 3 g of the compound of the base of the S-b soil of the dicyanodiamine reaction. As a preferable example of the above reaction dope (D), a reaction product obtained by reacting a ring (tetra) group of a compound having a cyclical engraving group with a part of active hydrogen of cyanodiamine can be mentioned. In order to prevent precipitation of the dicyanodiamide particles or clogging of the nozzle, the dicyanodiamine may be preliminarily reacted with the compound having a ring-shaped squeaking and dissolved in the composition. In this case, the pot life of the composition is also good. The latent hardener (Ε) is particularly preferably a reaction viscous material (Ε1) obtained by reacting dicyanodiamine with a functional group-containing compound having a functional group reactive with the dicyanodiamine. By using such a reactive dope (Ε1), the insulation reliability by the carbide can be improved. Further, the curable composition is difficult to change even when the viscosity is from /m to 50C or more, and the pot life is prolonged. Further, the reactive viscous material (E1) may have a viscous property as long as it is used in the curable composition for inkjet, and may not be viscous in the curable composition for nozzle ink. Further, when the reaction viscous material (E1) is taken out from the curable composition for inkjet, the reaction viscous material (E1) can also be viscous. The dicyanodiamine (dicyanodicimide particle) which is solid at normal temperature (23 ° C) has a solid form in the liquid component, so it precipitates during storage or causes an ink jet head. The possibility of nozzle clogging. In order to eliminate such a problem, it is preferred to react dicyanodiamine with a functional group-containing compound having a functional group reactive with the dicyanodiamine to prepare a counter 159117.doc -22·201224080. The viscous material (E1)' is added to the composition. That is, in the curable composition for mouth ink of the present invention, it is preferred to react dicyanodiamine with a functional group-containing compound having a functional group reactive with the dicyanodiamine. The reaction viscous material (E1) is used as a latent hardener (e). When the reactive dope (E1) is used, the pot life of the composition and the insulation reliability by the cured product become good. The reaction dope (E1)' before being formulated in the above-mentioned inkjet curable composition is preferably not formulated in an organic solvent or formulated in an organic solvent and is relative to the above-mentioned reactive dope (E1)1. The amount of the organic solvent to be blended is 100 parts by weight or less based on the parts by weight. When the reaction viscous material (E1) is blended in an organic solvent, the amount of the organic solvent to be formulated with respect to 100 parts by weight of the reaction viscous material (El) is preferably 5 Å or less by weight, more preferably 20 The replacement portion is further preferably 1 part by weight or less, and more preferably 1 part by weight or less. The reaction dope (E1) is preferably a reaction product obtained by reacting the functional group-containing compound with one of the active hydrogens of dicyanodiamine. The functional group of the above functional group-containing compound which can be reacted with dicyanodiamine is generally reacted with a part of the active hydrogen of dicyanodiamine. The above dicyanoguanamine which is reacted with the above functional group-containing compound is preferably in the form of a powder. By reacting the powdery dicyanodiamine with the above-mentioned functional group-containing compound, the above reaction viscous (E1) which is not powdery but viscous can be obtained. The above reaction viscous material (E1) is easily synthesized to obtain a sclerosing composition having a long pot life, and is reacted with the above dicyandiamide.

S 159117.doc -23- 201224080 之上述含官能基之化合物較佳為具有選自由羥基、環狀醚 基、叛基及異氰酸醋基所組成之群_之至少一種官能基。 就容易地合成上述反應黏稠物(Ei),進而獲得適用期較 長之硬化性組合物之觀點而言,與上述二氰基二醯胺反應 之上述含官能基之化合物較佳為具有環狀醚基之化合物。 與二氰基二醯胺反應之該具有環狀醚基之化合物較佳為具 有一個壞狀謎基之化合物。 就容易地合成上述反應黏稠物(E1),進而獲得適用期較 長之硬化性組合物之觀點而言,與上述二氰基二醯胺反應 之上述含官能基之化合物較佳為具有環氧基之化合物。與 二氰基二醯胺反應之該具有環氧基之化合物較佳為具有一 個環氧基之化合物。 就容易地合成上述反應黏稠物(E1),進而獲得適用期較 長之喷墨用硬化性組合物之觀點而言,進而就進—步提高 硬化性組合物之硬化物之耐熱性之觀點而言,與上述二氰 基二醯胺反應之含官能基之化合物較佳為具有芳香族骨 架’更佳為具有芳香族骨架與環狀醚基之化合物,尤佳為 具有芳香族骨架與環氡基之化合物。 作為上述含官能基之化合物之具體例,可列舉:笨基縮 水甘油醚、丁基縮水甘油醚、鄰甲苯基縮水甘油醚、間曱 苯基縮水甘油醚、對曱苯基縮水甘油醚、烯丙基縮水甘油 醚、對第三丁基苯基縮水甘油醚等縮水甘油醚類,或(甲 基)丙烯酸縮水甘油酯、及(甲基)丙烯酸_3,4_環氧環己基曱 酯等。 159117.doc -24- 201224080 就進一步提高硬化物之耐熱性之觀點而言,上述含官能 基之化合物較佳為具有芳香環之苯基縮水甘油醚、鄰甲苯 基縮水甘油醚、間甲苯基縮水甘油醚、對甲苯基縮水甘油 驗或對第三丁基苯基縮水甘油醚。 於上述一氰基一酸胺與上述含官能基之化合物之反應 中,理想的是相對於二氰基二醯胺丨莫耳,使較佳為〇·2莫 耳乂上更佳為1莫耳以上,較佳為4莫耳以下,更佳為3 莫耳以下之上述含官能基之化合物與其反應。即,上述反 應黏稠物(Ε1)理想的是相對於上述二氰基二醯胺1莫耳, 使較佳為0.2莫耳以上,更佳為丨莫耳以上,較佳為4莫耳 以下,更佳為3莫耳以下之上述含官能基之化合物與其反 應而成之反應黏稠物。就獲得適用期進一步優異之硬化性 組合物之觀點而言,上述反應黏稠物(E1)尤為理想的是相 對於上述二氰基二醯胺丨莫耳,使丨莫耳以上、3莫耳以下 之上述含官能基之化合物與其反應而成之反應黏稠物。若 上述含官能基之化合物之使用量未達上述下限,則有未反 應之二氰基二醯胺析出之虞。若上述含官能基之化合物之 使用量超過上述上限’則有上述反應黏稠物之活性氫全部 失去活性’無法使含環狀醚基之化合物(B)硬化之虞。再 者,於該反應中,較佳為視需要於溶劑或反應促進劑之存 在下,自60°C至140°C下反應。 於上述二氰基二醯胺與上述含官能基之化合物之反應 時’亦可使用溶劑來溶解二氰基二醯胺。該溶劑為可溶解 二氰基二醯胺之溶劑即可。作為可使用之溶劑,可列舉:The above functional group-containing compound of S 159117.doc -23-201224080 preferably has at least one functional group selected from the group consisting of a hydroxyl group, a cyclic ether group, a thiol group and an isocyanate group. From the viewpoint of easily synthesizing the above-mentioned reactive dope (Ei) to obtain a curable composition having a long pot life, the functional group-containing compound which is reacted with the above dicyanodiamine is preferably a ring-shaped compound. An ether-based compound. The compound having a cyclic ether group which is reacted with dicyanodiamine is preferably a compound having a bad mystery. From the viewpoint of easily synthesizing the above reaction dope (E1) to obtain a curable composition having a long pot life, the above functional group-containing compound which is reacted with the above dicyanodiamine is preferably an epoxy group. Base compound. The epoxy group-containing compound which is reacted with dicyanodiamine is preferably a compound having an epoxy group. From the viewpoint of easily synthesizing the above reaction dope (E1) and further obtaining a curable composition for inkjet having a long pot life, further improving the heat resistance of the cured product of the curable composition. The functional group-containing compound which reacts with the above dicyanodiamine is preferably a compound having an aromatic skeleton, more preferably an aromatic skeleton and a cyclic ether group, and particularly preferably having an aromatic skeleton and a cyclic oxime. Base compound. Specific examples of the functional group-containing compound include strepto glycidyl ether, butyl glycidyl ether, o-tolyl glycidyl ether, m-phenyl phenyl glycidyl ether, p-phenyl phenyl glycidyl ether, and alkene. a glycidyl ether such as propyl glycidyl ether or p-tert-butylphenyl glycidyl ether, or glycidyl (meth)acrylate, and _3,4-epoxycyclohexyl decyl (meth)acrylate . 159117.doc -24- 201224080 From the viewpoint of further improving the heat resistance of the cured product, the above functional group-containing compound is preferably a phenyl glycidyl ether having an aromatic ring, o-tolyl glycidyl ether, and m-tolyl shrinkage. Glycerol ether, p-tolyl glycidol or p-tert-butylphenyl glycidyl ether. In the reaction of the above-mentioned monocyanoic acid amine with the above functional group-containing compound, it is preferred to use 〇·2 moray to be more preferably 1 mol with respect to dicyandiamine. Above the ear, preferably less than 4 moles, more preferably less than 3 moles of the above functional group-containing compound is reacted therewith. That is, the reaction viscous material (Ε1) is preferably 0.2 mol or more, more preferably 丨 mol or more, and more preferably 4 mol or less, based on 1 mol of the dicyanodiamine. More preferably, it is a reaction viscous compound obtained by reacting the above functional group-containing compound of 3 mol or less. From the viewpoint of obtaining a curable composition which is further excellent in pot life, the above-mentioned reactive dope (E1) is particularly preferably in an amount of more than 3 moles per mole of the above-mentioned dicyandiamide. The reaction viscous compound obtained by reacting the above functional group-containing compound with it. If the amount of the functional group-containing compound used is less than the above lower limit, there is an unreacted dicyanodiamine which precipitates. When the amount of the functional group-containing compound used exceeds the above upper limit, all of the active hydrogens of the above reaction dope are deactivated. The compound (B) containing the cyclic ether group cannot be cured. Further, in the reaction, it is preferred to carry out the reaction from 60 ° C to 140 ° C in the presence of a solvent or a reaction accelerator. When the above dicyanoguanamine is reacted with the above functional group-containing compound, a solvent may be used to dissolve the dicyanoguanamine. The solvent is a solvent which can dissolve dicyanodiamine. As a solvent which can be used, for example,

S 159117.doc -25· 201224080 丙網、曱基乙基酮、二曱基曱酿胺及甲基溶纖劑等。 為了促進上述二氰基二醯胺與上述含官能基之化合物之 反應’亦可使用反應促進劑。作為反應促進劑,可使用苯 紛類、胺類、咪唑類及三苯基膦等公知慣用之反應促進 劑。 就抑制適用期之降低,且抑制硬化不均之觀點而言,於 本發明之喷墨用硬化性組合物中,較佳為上述反應黏稠物 (E1)與含環狀醚基之化合物(B)相溶’較佳為與含(甲基)丙 烯醯基之化合物(A)相溶,較佳為與光反應性化合物(C)相 溶’較佳為進而溶解於硬化性組合物中。 較佳為上述反應黏稠物(E1)可與含環狀醚基之化合物(B) 相溶’較佳為可與含(曱基)丙烯醯基之化合物(A)相溶,較 佳為可與光反應性化合物(C)相溶。 上述反應黏稠物(E1)例如為藉由粉末狀之二氰基二醯胺 與上述含官能基之化合物之反應而獲得之非粉末狀之反應 黏稠物。就進一步提高喷墨喷出性之觀點而言,較佳為上 述反應黏稠物(E1)並非固體’較佳為並非結晶,較佳為並 非結晶性固體。較佳為上述反應黏稠物(E1)為液狀或半固 體狀。 較佳為上述反應黏稠物(E1)為透明或半透明。上述反應 黏稍物(E1)是否為透明或半透明可根據經由厚度為5 mm之 上述反應黏稠物(E1)觀察物體時是否可見該物體而判斷。 含環狀醚基之化合物(B)與潛伏性硬化劑(E)之調配比率 並無特別限疋。相對於含環狀喊基之化合物(B) 1 〇〇重量 159117.doc •26- 201224080 份’潛伏性硬化劑(E)之含量較佳為丨重量份以上,更佳為 3重量份以上’較佳為5〇重量份以下,更佳為4〇重量份以 下。 [其他成分] 本發明之喷墨用硬化性組合物亦可一併含有潛伏性硬化 劑(E)與潛伏性硬化劑(E)以外之熱硬化劑。進而,本發明 之噴墨用硬化性組合物亦可含有硬化促進劑。 作為上述熱硬化劑之具體例,可列舉:有機酸、胺化合 物、醯胺化合物、醯肼化合物、咪唑化合物、咪唑啉化合 物、苯酚化合物、脲化合物、多硫化物化合物及酸酐等。 亦可使用胺-環氧加合物等改性聚胺化合物作為上述熱硬 化劑。 作為上述硬化促進劑,可列舉:三級胺、咪唑、四級銨 鹽、四級鱗鹽、有機金屬鹽、磷化合物及脲系化合物等。 本發明之喷墨用硬化性組合物亦可基於調整黏度之目的 等而視需要含有溶劑。作為該溶劑,較佳為不與硬化性組 合物中之成分反應之溶劑。較佳為揮發性之溶劑,其原因 在於可於進行硬化性組合物之硬化反應之前藉由利用烘箱 或加熱板之加熱及減壓室内之減壓而乾燥去除。又,本發 明之喷墨用硬化性組合物若為少量,則亦可含有有機溶 劑。 本發明之噴墨用硬化性組合物中亦可於不妨礙本發明之 目的之範圍内調配各種添加劑。作為該添加劑,並無特別 限定,可列舉:著色劑、聚合抑制劑、消泡:、均:劑及S 159117.doc -25· 201224080 Propane net, mercapto ethyl ketone, dimercapto aryl amine and methyl cellosolve. A reaction accelerator may also be used in order to promote the reaction of the above dicyanodiamine with the above functional group-containing compound. As the reaction accelerator, a conventionally known reaction accelerator such as benzene, an amine, an imidazole or triphenylphosphine can be used. The reactive thickener (E1) and the cyclic ether group-containing compound (B) are preferably used in the curable composition for inkjet according to the present invention in terms of suppressing the decrease in the pot life and suppressing the unevenness in hardening. The "compatibility" is preferably compatible with the (meth)acryloyl group-containing compound (A), preferably with the photoreactive compound (C), and is preferably dissolved in the curable composition. Preferably, the reactive viscous material (E1) is compatible with the cyclic ether group-containing compound (B). Preferably, it is compatible with the (fluorenyl) acrylonitrile-containing compound (A), preferably Compatible with the photoreactive compound (C). The above reactive viscous material (E1) is, for example, a non-powder-like reaction viscous material obtained by a reaction of a powdery dicyanodiamine with a functional group-containing compound. From the viewpoint of further improving the ink jet ejectability, it is preferred that the above reaction dope (E1) is not a solid', and it is preferably not a crystal, and is preferably a non-crystalline solid. Preferably, the above reaction dope (E1) is in the form of a liquid or a semisolid. Preferably, the reactive viscous material (E1) is transparent or translucent. Whether or not the above-mentioned reaction viscous substance (E1) is transparent or translucent can be judged based on whether or not the object is visible when the object is observed through the reaction viscous substance (E1) having a thickness of 5 mm. The blending ratio of the cyclic ether group-containing compound (B) to the latent hardener (E) is not particularly limited. The content of the latent curing agent (E) is preferably 丨 by weight or more, more preferably 3 parts by weight or more with respect to the compound (B) containing a ring-shaped base. 〇〇 159117.doc • 26- 201224080 parts It is preferably 5 parts by weight or less, more preferably 4 parts by weight or less. [Other components] The curable composition for inkjet according to the present invention may further contain a latent curing agent (E) and a thermal curing agent other than the latent curing agent (E). Further, the curable composition for inkjet according to the present invention may further contain a curing accelerator. Specific examples of the above-mentioned thermosetting agent include an organic acid, an amine compound, a guanamine compound, an anthraquinone compound, an imidazole compound, an imidazoline compound, a phenol compound, a urea compound, a polysulfide compound, and an acid anhydride. A modified polyamine compound such as an amine-epoxy adduct may also be used as the above-mentioned hot hardening agent. Examples of the curing accelerator include a tertiary amine, an imidazole, a quaternary ammonium salt, a quaternary phosphonium salt, an organic metal salt, a phosphorus compound, and a urea compound. The curable composition for inkjet according to the present invention may contain a solvent as needed depending on the purpose of adjusting the viscosity and the like. As the solvent, a solvent which does not react with a component in the curable composition is preferred. The solvent which is volatile is preferred because it can be dried and removed by heating in an oven or a hot plate and decompression in a reduced pressure chamber before the hardening reaction of the curable composition. Further, the curable composition for inkjet according to the present invention may contain an organic solvent if it is a small amount. The curable composition for inkjet according to the present invention may be formulated with various additives within a range not inhibiting the object of the present invention. The additive is not particularly limited, and examples thereof include a coloring agent, a polymerization inhibitor, defoaming, and a solvent:

S 159117.doc -27- 201224080 费接性賦予劑等。 作為上述著色劑,可. + ·酞箐藍、酞菁綠、碘綠、二 虱汽、〜晶紫、氧化鈦、碳里 抑制劑,可列舉··對笨二:,、、!等。作為上述聚合 盼、對本一紛單甲驗、第三丁其 兒余酚、鄰笨三酚及酚噻。 土 叙. 專。作為上述消泡劑,可歹 舉:聚矽氧系消泡劑'氟系 a 齓糸岣泡劑及尚分子系消泡劑等。 作為上述均化劑,可列摄.取& p ^ _ 了歹滹.聚矽氧系均化劑、氟系均化劑 及^刀子系均化劑等。作為上述密接性賦予劑,可列舉: 咪唑系密接性賦予劑、噻唑系密接性賦予劑、三唑系密接 性賦予劑及矽烷偶合劑。 、於本發明之喷墨用硬化性組合#中,依據m K2283而 測疋之25C下之黏度較佳為16G mpa s以上、丨·峨⑽ 下。若噴墨用硬化性組合物之黏度為上述下限以上及上述 上限以下’則可自喷.墨喷頭容易且精度良好地喷出喷墨用 硬化性組合物。進而,即便嘴墨用硬化性組合物加溫至 5代以上,亦可自喷墨喷頭容以精度良好地^該組合 物。 上述黏度更佳為1000 mPa.s以下,進而較佳為5〇〇 mPas 以下。若上述黏度滿足較佳之上述上限,則於自嘴頭連續 噴出上述硬化性組合物時,喷出性進一步變得良好。又, 就進一步抑制上述硬化性組合物之濕潤擴散,進—步提高 形成硬化物層時之解像度之觀點而言,上述黏度較佳為Z 過 500 mPa.s。 本發明之喷墨用硬化性組合物較佳為不含有機溶劑或 159117.doc -28 - 201224080 含有機溶劑且上述硬化性組合物1〇〇重量%中之上述有機 溶劑之含量為50重量%以下。上述硬化性組合物⑽重量% 中,上述有機溶劑之含量更佳為2〇重量%以下,進而較佳 ㈣重量%以下’尤佳為㊉量%以下。上述有機溶劑之含 量越少,形成硬化物層時之解像度越變得良好。 本發明之喷墨用硬化性組合物較佳為不含有機溶劑,或 含有機溶劑且相對於上述反應黏稠物(E1)1〇〇重量份,上 述有機溶劑之含量為5G重量份以下。相對於上述反應黏祠 物(E 1)1〇〇重量份,上述有機溶劑之含量更佳為重量份 以下,進而較佳為10重量份以下,尤佳為1重量份以下。 上述有機溶劑之含量越少,形成硬化物層時之解像度越變 得良好。 (電子零件之製造方法) 其次’對本發明之電子零件之製造方法進行說明。 本發明之電子零件之製造方法之特徵在於使用上述噴墨 用硬化性組合物。即,於本發明之電子零件之製造方法 中,首先藉由喷墨方式塗佈上述喷墨用硬化性組合物,繪 製圖案。此時,尤佳為直接繪製上述喷墨用硬化性組合 物 直接纟會製」思指不使用遮罩而繪製。作為上述電子 零件,可列舉印刷配線板及觸控面板零件等。上述電子零 件較佳為配線板,更佳為印刷配線板。 上述喷墨用硬化性組合物之塗佈可使用喷墨列印機。該 喷墨列印機具有噴墨噴頭。喷墨喷頭具有噴嘴。噴墨裝置 較佳為具備用以將噴墨裝置内或噴墨噴頭内之溫度加溫至S 159117.doc -27- 201224080 Charge-providing agent, etc. As the above-mentioned coloring agent, it is possible to smear the indigo, the phthalocyanine green, the iodine green, the bismuth vapor, the crystal violet, the titanium oxide, and the carbon inhibitor. Wait. As the above-mentioned polymerization, it is a single test, a third dinol, a phenol, and a phenol thiophene. Tu Xuan. Special. As the antifoaming agent, a polyfluorene-based defoaming agent, a fluorine-based a foaming agent, and a molecular antifoaming agent can be mentioned. As the above-mentioned leveling agent, it is possible to take a sample of & p ^ _ 歹滹. a polyfluorene-based leveling agent, a fluorine-based leveling agent, and a knife-based homogenizing agent. Examples of the adhesion imparting agent include an imidazole-based adhesion imparting agent, a thiazole-based adhesion imparting agent, a triazole-based adhesion imparting agent, and a decane coupling agent. In the curable composition # for inkjet according to the present invention, the viscosity at 25C measured according to m K2283 is preferably 16 G mpa s or more and 丨·峨 (10). When the viscosity of the curable composition for inkjet is not less than the above lower limit and not more than the above upper limit, it is possible to eject the inkjet curable composition from the ink jet head easily and with high precision. Further, even if the curable composition for mouth ink is heated to 5 or more generations, the composition can be accurately received from the ink jet head. The above viscosity is more preferably 1000 mPa·s or less, and further preferably 5 〇〇 mPas or less. When the viscosity is more than the above-mentioned upper limit, the discharge property is further improved when the curable composition is continuously discharged from the mouth. Further, from the viewpoint of further suppressing the wet diffusion of the curable composition and further improving the resolution at the time of forming the cured layer, the viscosity is preferably Z over 500 mPa·s. The curable composition for inkjet according to the present invention preferably contains no organic solvent or 159117.doc -28 - 201224080 contains an organic solvent and the content of the above organic solvent in the above curable composition is 1% by weight is 50% by weight. the following. In the weight percent of the curable composition (10), the content of the organic solvent is more preferably 2% by weight or less, further preferably (4% by weight or less), and particularly preferably 10,000% by weight or less. The smaller the content of the above organic solvent, the better the resolution at the time of forming the cured layer. The curable composition for inkjet according to the present invention preferably contains no organic solvent or contains an organic solvent, and the content of the above organic solvent is 5 parts by weight or less based on 1 part by weight of the reactive thickener (E1). The content of the organic solvent is more preferably not more than 1 part by weight, more preferably 10 parts by weight or less, even more preferably 1 part by weight or less, based on 1 part by weight of the above-mentioned reaction adhesive (E1). The smaller the content of the above organic solvent, the better the resolution at the time of forming the cured layer. (Manufacturing Method of Electronic Component) Next, a method of manufacturing the electronic component of the present invention will be described. The method for producing an electronic component of the present invention is characterized in that the above-mentioned curable composition for inkjet is used. That is, in the method of producing an electronic component of the present invention, first, the curable composition for inkjet is applied by an inkjet method, and a pattern is drawn. In this case, it is particularly preferable to directly draw the above-mentioned curable composition for inkjet, and draw it directly without thinking of using a mask. Examples of the electronic component include a printed wiring board and a touch panel component. The above electronic component is preferably a wiring board, more preferably a printed wiring board. An ink jet printer can be used for the application of the above-mentioned curable composition for inkjet. The ink jet printer has an ink jet head. The ink jet head has a nozzle. The ink jet device is preferably provided to warm the temperature in the ink jet device or in the ink jet head to

S 159117.doc -29- 201224080 5(TC以上之加溫部。上述嘴墨用硬化性組合物較佳為塗佈 於塗佈對象構件上。作為上述塗佈對象構件,可列舉基板 等。作為該基板,可列舉上表面設有配線等之基板等。上 述喷墨用硬化性組合物較佳為塗佈於印刷基板上。 又,亦可藉由本發明之電子零件之製造方法,將基板換 為以玻璃為主體之構件,而製作液晶顯示裝置等顯示裝置 用之玻璃板。*體而言,亦可於玻璃上m鑛等方法 而設置ITOdndiumTinOxides,氧化銦錫)等之導電圖案, 於該導電圖案上藉由本發明之電子零件之製造方法,以喷 墨方式形成硬化物層。若於該硬化物層上利用導電油墨等 α置圖案,則硬化物層成為絕緣膜,於玻璃上之導電圖案 中’於特定之圖案間獲得電性連接。 其次,對繪製成圖案狀之喷墨用硬化性組合物照射光及 賦予熱,使其硬化,形成硬化物層。如此,可獲得具有硬 化物層之電子零件。該硬化物層可為絕緣膜,亦可為抗蝕 圖案。該絕緣膜亦可為圖案狀之絕緣膜。該硬化物層較佳 為抗蝕圖案。上述抗蝕圖案較佳為阻焊圖案。 較佳為本發明之電子零件之製造方法係具有抗蝕圖案之 印刷配線板之製造方法。較佳為藉由喷墨方式塗佈上述噴 墨用硬化性組合物,繪製成圖案狀,並對緣製成圖案狀之 上述喷墨用硬化性組合物照射光及賦予熱,使其硬化,而 形成抗餘圖案。 亦可藉由對繪製成圖案狀之上述嘴墨用硬化性組合物照 射光’使其-次硬化,獲得—次硬化物。藉此,可抑制所 159117.doc 201224080 緣製之喷墨用硬化性組合物之濕潤擴散,可形成高精度之 抗蝕圖案。又’於藉由照射光而獲得一次硬化物之情形 時,亦可藉由對一次硬化物賦予熱而使其正式硬化,獲得 硬化物’形成抗蝕圖案。本發明之喷墨用硬化性組合物可 藉由照射光及賦予熱而硬化。於併用光硬化與熱硬化之情 形時’可形成耐熱性進—步優異之抗#@案^藉由職予熱 而硬化時之加熱溫度較佳為⑽。。以±,更佳為120。。以 上,較佳為250。(:以下,更佳為2〇〇<^以下。. 述光之照射可於緣製後進行,亦可與繪製同時進行。 例如亦可與硬化性組合物之噴出同時或於噴出後立刻照 射光為了如此於繪製之同時照射光,亦可以光照射部分 位於由噴墨噴頭決定之繪製位置之方式配置光源。 用以照射光之光源係根據照射之光而適當選擇。作為該 =源可列舉· Uv_LED(ultra vi〇let Light e偷㈣心心, 备、外線-發光二極體)、低壓水銀燈、中壓水銀燈、高壓水 銀燈、超高壓水錢、氤氣燈及金屬i素燈P照射之光 一般為紫外線’亦可為電子束、α射線、β射線、γ射線、X 射線及中子射線等。 塗佈喷墨用硬化性組合物時之溫度只要為喷墨用硬化性 ^合物成為可自噴墨喷頭喷出之黏度的溫度,則無特別限 疋塗佈噴墨用硬化性組合物時之溫度較佳為5〇〇C以上, 更佳為6〇C以上’較佳為100。。以下。塗佈時之噴墨用硬 化1且σ物之黏度只要為可自喷墨噴頭喷出之範圍,則無 特別限定eS 159117.doc -29-201224080 5 (The heating unit for the above-mentioned nozzle ink is preferably applied to the member to be coated. The substrate to be coated is, for example, a substrate. The substrate may be a substrate provided with wiring or the like on the upper surface, etc. The above-mentioned inkjet curable composition is preferably applied onto a printed substrate. Further, the substrate may be replaced by the method for producing an electronic component of the present invention. A glass plate for a display device such as a liquid crystal display device is used as a member mainly composed of glass. The body may be provided with a conductive pattern such as ITOdndium Tin Oxides or indium tin oxide on a glass or the like. On the conductive pattern, a cured layer is formed by an inkjet method by the method for producing an electronic component of the present invention. When a patterned pattern of a conductive ink or the like is used on the cured layer, the cured layer becomes an insulating film, and electrical connection is made between the specific patterns in the conductive pattern on the glass. Then, the inkjet curable composition drawn in a pattern is irradiated with light and heat is applied to be cured to form a cured layer. Thus, an electronic component having a hard layer can be obtained. The cured layer may be an insulating film or a resist pattern. The insulating film may also be a patterned insulating film. The cured layer is preferably a resist pattern. The above resist pattern is preferably a solder resist pattern. Preferably, the method of manufacturing an electronic component of the present invention is a method of manufacturing a printed wiring board having a resist pattern. It is preferable that the curable composition for inkjet is applied by an inkjet method, and the pattern is formed into a pattern, and the inkjet curable composition having a pattern of the edge is irradiated with light and heat is applied thereto to be cured. And form an anti-residual pattern. It is also possible to obtain a secondary cured product by irradiating light to the curable composition for the nozzle ink drawn in a pattern to be hardened. Thereby, the wet diffusion of the inkjet curable composition manufactured by 159117.doc 201224080 can be suppressed, and a highly precise resist pattern can be formed. Further, when a cured product is obtained by irradiation with light, it is also possible to form a resist pattern by applying heat to the primary cured product to form a cured product. The curable composition for inkjet according to the present invention can be cured by irradiating light and imparting heat. When the photohardening and the heat hardening are used together, the heat resistance can be formed to be excellent (10). . It is ±, more preferably 120. . More preferably, it is 250. (: The following is more preferably 2 〇〇 < ^ below. The irradiation of the light may be performed after the edge, or may be performed simultaneously with the drawing. For example, it may be simultaneously with the ejection of the curable composition or immediately after the ejection. In order to illuminate the light at the same time as the drawing, the light source may be disposed such that the light source is located at a drawing position determined by the ink jet head. The light source for illuminating the light is appropriately selected according to the light to be irradiated. List · Uv_LED (ultra vi〇let Light e steal (four) heart, standby, external line - light emitting diode), low pressure mercury lamp, medium pressure mercury lamp, high pressure mercury lamp, ultra high pressure water money, xenon lamp and metal i lamp P The light is generally ultraviolet ray, and may be an electron beam, an α ray, a β ray, a γ ray, an X ray, a neutron beam, or the like. The temperature at which the curable composition for inkjet is applied is only a curable composition for inkjet. The temperature at which the viscosity can be ejected from the ink jet head is not particularly limited, and the temperature at which the curable composition for inkjet is applied is preferably 5 〇〇 C or more, more preferably 6 〇 C or more. 100%. The spray at the time of coating Was used and the viscosity of the σ hardening from the range of 1 as long as it can discharge the ink jet head is not particularly limited e

S 159117.doc -31 - 201224080 又’亦有於印刷時冷卻基板之方法。若冷卻基板,則噴 附時硬化性組合物之黏度提高,解像度變得良好。此時, 較佳為使冷卻止於不發生冷凝之程度,或以不發生冷凝之 方式將裱境空氣除濕。又,由於基板因冷卻而收縮,故而 亦可修正尺寸精度。 本發明之喷墨用硬化性組合物由於含有潛伏性硬化劑 (E) ’故而即便於例如於喷墨喷頭中加熱噴墨用硬化性組 合物之情形時’喷墨用硬化性組合物之適用期亦充分較 長’可實現穩定之噴出。進而,由於可將喷墨用硬化性組 合物加熱直至適於藉由噴墨方式之塗佈之黏度,故而藉由 使用本發明之喷墨用硬化性組合物’可適宜地製造印刷配 線板等電子零件。 以下,列舉實施例及比較例,具體地說明本發明。本發 明並不僅限定於以下之實施例。 (合成例1) 於具備攪拌器、溫度計、滴液漏斗之三口燒瓶中添加甲 基溶纖劑50 g'二氰基二醯胺15 g、及2,4-二胺基-6-[2'-十 一烷基咪唑-(1’)]乙基均三11井1 g,並加熱至lOOt:,使二氰 基二醯胺溶解。溶解後,自滴液漏斗用2〇分鐘滴加丁基縮 水甘油醚130 g,反應1小時。其後,使溫度下降至6〇它, 進行減壓’去除溶劑,獲得黃色及半透明之反應黏稠物。 所獲得之反應黏稠物不含溶劑。 (合成例2) 於具備攪拌器、溫度計、滴液漏斗之三口燒瓶中添加甲 159117.doc -32· 201224080 基溶纖劑50 g、二氰基二醯胺15 g、及2,4-二胺基-6-[2'-十 一烷基咪唑-(Γ)]乙基均三畊1 g,並加熱至l〇〇°C,使二氰 基二醯胺溶解。溶解後,自滴液漏斗用20分鐘滴加鄰曱苯 基縮水甘油醚40 g,反應1小時。其後,使溫度下降至 60°C,進行減壓,去除溶劑,獲得黃色及半透明之反應黏 稠物。所獲得之反應黏稍物不含溶劑。 (合成例3) 除將鄰曱苯基縮水甘油醚之滴加量自40 g變更為95 g以 外,以與合成例2相同之方式獲得黃色及半透明之反應黏 稍物。所獲得之反應黏稍物不含溶劑。 又,準備下述光聚合起始劑(C)。S 159117.doc -31 - 201224080 Also, there is a method of cooling the substrate during printing. When the substrate is cooled, the viscosity of the curable composition at the time of spraying is improved, and the resolution is improved. In this case, it is preferred that the cooling is stopped to the extent that condensation does not occur, or that the ambient air is dehumidified in such a manner that condensation does not occur. Further, since the substrate shrinks due to cooling, the dimensional accuracy can be corrected. In the case where the curable composition for inkjet contains the latent curing agent (E), the curable composition for inkjet is used, for example, when the curable composition for inkjet is heated in an inkjet head. The pot life is also long enough to achieve a stable spray. Further, since the curable composition for inkjet can be heated until it is suitable for application by the inkjet method, a printed wiring board or the like can be suitably produced by using the curable composition for inkjet of the present invention. Electronic parts. Hereinafter, the present invention will be specifically described by way of examples and comparative examples. The present invention is not limited to the following embodiments. (Synthesis Example 1) Methyl cellosolve 50 g 'dicyanodiamine 15 g and 2,4-diamino-6-[2] were added to a three-necked flask equipped with a stirrer, a thermometer, and a dropping funnel. '-undecyl imidazole-(1')] ethyl 1 3 well 1 g, and heated to 100 tons: to dissolve dicyanodiamine. After the dissolution, 130 g of butyl glycidyl ether was added dropwise from the dropping funnel over 2 minutes, and the mixture was reacted for 1 hour. Thereafter, the temperature was lowered to 6 Torr, and the pressure was removed to remove the solvent to obtain a yellow and translucent reaction viscous material. The reaction dope obtained is solvent free. (Synthesis Example 2) A 159117.doc-32·201224080-based cellosolve 50 g, dicyanodiamine 15 g, and 2,4-di were added to a three-necked flask equipped with a stirrer, a thermometer, and a dropping funnel. The amino-6-[2'-undecylimidazolium-(oxime)]ethyl group was triturated to 1 g, and heated to 10 ° C to dissolve the dicyanodiamine. After the dissolution, 40 g of o-phenyl phenyl glycidyl ether was added dropwise from the dropping funnel over 20 minutes, and the mixture was reacted for 1 hour. Thereafter, the temperature was lowered to 60 ° C, the pressure was reduced, and the solvent was removed to obtain a yellow and translucent reaction viscous material. The reaction viscous obtained is solvent free. (Synthesis Example 3) A yellow and translucent reaction viscous substance was obtained in the same manner as in Synthesis Example 2 except that the dropwise addition amount of o-phenylphenyl glycidyl ether was changed from 40 g to 95 g. The reaction viscous obtained is solvent free. Further, the following photopolymerization initiator (C) was prepared.

Irgacure 9〇7(BASF Japan公司製造):不具有二曱胺基之 α-胺基烷基苯酮型光自由基聚合起始劑Irgacure 9〇7 (manufactured by BASF Japan): α-Aminoalkylphenone type photoradical polymerization initiator without diammonium group

Irgacure 309(BASF Japan公司製造):具有二曱胺基之α-胺基烷基苯酮型光自由基聚合起始劑Irgacure 309 (manufactured by BASF Japan): α-aminoalkylphenone type photoradical polymerization initiator having diammonium group

Irgacure 379EG(BASF Japan公司製造):具有二甲胺基 之α-胺基烷基苯酮型光自由基聚合起始劑 TPO(BASF Japan公司製造):醯基氧化膦型光自由基聚 合起始劑Irgacure 379EG (manufactured by BASF Japan Co., Ltd.): α-Aminoalkylphenone type photoradical polymerization initiator TPO (manufactured by BASF Japan Co., Ltd.) having a dimethylamino group: starting of fluorenylphosphine oxide type photoradical polymerization Agent

Irgacure 184(BASF Japan公司製造):α-羥基烷基笨酮型 光自由基聚合起始劑 (實施例1) 將如下成分混合:相當於含(曱基)丙烯醯基之化合物(Α) 之雙紛Α型環氧化合物之環氧丙烯酸醋(Daicel-Cytec公司 μ 159117.doc -33· 201224080 製造之「EBECRYL 3700」)25重量份及丙烯酸二環戊烯g| (曰立化成公司製造「FA-5 11 AS」)30重量份、相當於含環 狀謎基之化合物(B)之雙紛A型環氧化合物(三菱化學公司 製造「jER828」)15重量份、相當於光反應性化合物(c)之 二乙一醇一丙稀酸醋10重量份及丙稀酸異冰片醋is重量 份、相當於光聚合起始劑(D)之Irgacure 907(α-胺基笨乙綱 型光自由基聚合起始劑’ BASF Jap an公司製造)4重量份、 相當於潛伏性硬化劑(E)之二氰基二醯胺(二氰基二醯胺粒 子,中值粒徑:3 μιη,三菱化學公司製造之「DICY7」η 重量份,獲得喷墨用硬化性組合物。 (實施例2〜30及比較例1〜3) 將調配成分之種類及調配量變更為下述表1〜4所示,除 此以外,以與實施例1相同之方式獲得噴墨用硬化性組合 物。 再者,於實施例18〜30所獲得之喷墨用硬化性組合物 中,上述反應黏稠物與含(曱基)丙烯醯基之化合物相溶, 與光反應性化合物相溶,且與含環狀醚基之化合物相溶, 進而溶解於硬化性組合物中。 (評價) (1)黏度 依據JIS K2283,使用黏度計(東機產業公司製造之 TVE22L j )測疋所獲得之喷墨用硬化性組合物於25 下之黏度。根據下述判定基準狀喷墨用硬化性組合物之 黏度。 159117.doc •34- 201224080 [黏度之判定基準] A : 黏度超過1200 mPa-s B : 黏度超過lOOOmPa-s, 為1200 mPa.s以下 C : 黏度超過500 mPa-s, 為1000 mPa.s以下 D : 黏度為160 mPa.s以上 ,500 mPa s以下 E : 黏度未達160 mPa-s (2)喷出性 準備上表面設有銅線之玻璃環氧樹脂基板(100 mmxl00 mm)。將喷墨用硬化性組合物自附帶紫外線照射裝置之壓 電方式喷墨列印機之噴墨喷頭喷出至該基板上,繪製成圖 案狀。再者,於黏度為500 mPa·s以下之喷墨用硬化性組合 物之喷出試驗時,將喷頭溫度設為8(rc,於黏度超過5〇〇 mPa.s之喷墨用硬化性組合物之喷出試驗時,將喷頭溫度 設為95°C。 [喷出性之判定基準] 〇〇.可自喷頭連續〗〇小時以上喷出硬化性組合物 〇.可自喷頭連續1〇小時以上喷出硬化性組合物但 小時之連續喷出期間稍有產生噴出不均 △可自喷頭連續噴出硬化性組合物,但無法連續1 〇小 時以上進行連續喷出 ;噴出之初期階段便無法自噴頭喷出硬化性組合物 (3)濕潤擴散Irgacure 184 (manufactured by BASF Japan Co., Ltd.): α-hydroxyalkyl ketone type photoradical polymerization initiator (Example 1) The following components were mixed: a compound corresponding to a (fluorenyl) acrylonitrile group (Α) Epoxy acrylate vinegar of double bismuth type epoxy compound ("EBECRYL 3700" manufactured by Daicel-Cytec Corporation 159117.doc -33·201224080) 25 parts by weight and dicyclopentene acrylate g| (Manufactured by 曰立化成公司) FA-5 11 AS") 30 parts by weight, equivalent to a ring-shaped A-type epoxy compound ("JER828" manufactured by Mitsubishi Chemical Corporation), which is equivalent to a photoreactive compound (c) 10 parts by weight of diethyl acrylate-acrylic acid vinegar and isopropyl acetonide vinegar is part by weight, Irgacure 907 equivalent to photopolymerization initiator (D) (α-amino group Base polymerization initiator 'Manufactured by BASF Jap an Inc.) 4 parts by weight of dicyanodiamide (latin dicyanamide particles equivalent to latent hardener (E), median diameter: 3 μιη, Mitsubishi "DICY7" η by weight of the chemical company, and obtained a curable composition for inkjet. Examples 2 to 30 and Comparative Examples 1 to 3) A curing combination for inkjet was obtained in the same manner as in Example 1 except that the type and the amount of the compounding component were changed to those shown in Tables 1 to 4 below. Further, in the curable composition for inkjet obtained in Examples 18 to 30, the reactive dope is compatible with a compound containing a (fluorenyl) acrylonitrile group, and is compatible with a photoreactive compound, and It is compatible with the compound containing a cyclic ether group, and is further dissolved in the curable composition. (Evaluation) (1) Viscosity According to JIS K2283, a spray obtained by measuring a sputum using a viscometer (TVE22L j manufactured by Toki Sangyo Co., Ltd.) The viscosity of the curable composition for ink at 25° C. The viscosity of the reference inkjet curable composition is determined as follows. 159117.doc •34- 201224080 [Standard for viscosity determination] A : Viscosity exceeding 1200 mPa-s B : Viscosity exceeds 1000mPa-s, below 1200 mPa.s C: Viscosity exceeds 500 mPa-s, below 1000 mPa.s D: Viscosity is above 160 mPa.s, below 500 mPa s E: Viscosity is less than 160 mPa- s (2) Spraying preparation of glass ring with copper wire on the upper surface Resin substrate (100 mm x 100 mm). The curable composition for inkjet was ejected onto the substrate from an inkjet head of a piezoelectric inkjet printer equipped with an ultraviolet irradiation device, and patterned into a pattern. In the discharge test of the curable composition for inkjet having a viscosity of 500 mPa·s or less, the head temperature is 8 (rc), and the curable composition for inkjet having a viscosity of more than 5 μmPa·s is used. In the discharge test, the nozzle temperature was set to 95 °C. [Criteria for Judging the Ejection] 〇〇. The curable composition can be ejected continuously from the nozzle for more than 〇 hours. The curable composition can be ejected from the nozzle for more than 1 hour, but the continuous ejection period is small. Slightly discharge unevenness △ can continuously eject the curable composition from the nozzle, but can not be continuously ejected continuously for more than 1 hour; in the initial stage of the ejection, the curable composition cannot be ejected from the nozzle (3)

; 表面叹有鋼線之破璃環氧樹脂基板(100 mmxlOO mm)。將噴墨用硬 注、、且合物自附帶紫外線照射裝置之壓The surface is smashed with a broken glass epoxy substrate (100 mm x 100 mm). Hard injection of inkjet, and the pressure of the compound from the ultraviolet irradiation device

S 159117.doc •35· 201224080 ,方式嘴墨列印機之噴墨喷頭喷出並塗佈至該基板上,繪 製成線(噴出部之寬度為8〇㈣與其間之間隙(寬度為 P )圖案狀。再者,於黏度為500 mpa.sw下之喷墨用硬 化性組合物之嘴出試驗時,將噴頭溫度設為喊,於黏度 超過50GmPat喷墨用硬化性組合物之喷出試驗時,將喷 頭溫度設為95。(:。 對塗佈於基板上之喷墨用硬化性組合物(厚度為 ㈣,以照射能成為1000 mJ/cm2之方式照射波長為365 nm 之紫外線。 照射紫外線5分鐘後,藉由目測觀察圖案之濕潤擴散, 根據下述基準判定濕潤擴散。 [濕〉聞擴散之判定基準] 〇〇:濕潤擴散之狀態為目標線寬+4() μιη以下 〇:濕潤擴散之狀態為超過目標線寬+4〇 μιη、75 μιη以下 Χ :組合物層自繪製部分濕潤擴散,線間之間隔消失, 或濕潤擴散之狀態為超過目標線寬+75 μίη (4)儲存穩定性(適用期之長度) 使用5 μιη之薄膜過濾器來過濾所獲得之喷墨用硬化性組 合物,將過濾之喷墨用硬化性組合物於8〇它下加熱12小 時。 準備上表面.貼附有銅箔之附帶銅箔之Fr_4基板。嘗試將 喷墨用硬化性組合物自附帶紫外線照射裝置之壓電方式嘴 墨列印機之喷墨喷頭以線寬成為μπι且線間之間隔成為 80 μιη之方式噴出並塗佈至基板上之銅箔上,繪製成圖案 159117.doc • 36 - 201224080 狀根據此時自噴墨喷頭之喷出性,根據下述判定基準判 定儲存穩定性。再者,於黏度為5〇〇mPa.w下之噴墨用硬 化杜組合物之喷出試驗時,將喷頭溫度設為帆,於黏度 超L 〇 mpa s之噴墨用硬化性組合物之喷出試驗時,將喷 頭溫度設為9 5。〇。 [儲存穩定性之判定基準] 〇:可自噴墨噴頭喷出組合物 △.於喷出前組合物正在硬化,或組合物之黏度上升, 未能自喷墨噴頭喷出組合物 x :組合物相當硬化 (5)硬化物膜之不均 準備上表面貼附有鋼箔之附帶銅箔之^尺“基板。將該基 板加溫至8 0 C,將喷墨用硬化性組合物自附帶紫外線照射 裝置之壓電方式喷墨列印機之噴墨噴頭以線寬成為丨 線間之間隔成為1 mm之方式噴出並塗佈至基板上,繪製成 圖案狀。再者’於黏度為500 mPa.s以下之嗔墨用硬化性組 合物之喷出試驗時,將喷頭溫度設為8〇〇c,於黏度超過 500 mPa.s之噴墨用硬化性組合物之噴出試驗時,將喷頭溫 度設為95°C。 對繪製成圖案狀之喷墨用硬化性組合物(厚度為2〇 μιη),以照射能成為500 mJ/cm2之方式照射波長為365 nm 之紫外線’繼而於150°C下加熱1小時,使其正式硬化,形 成作為硬化物之抗蚀圖案(硬化物膜)。 目測觀察所獲得之硬化物膜之表面,評價硬化物膜是否 ς 159117.doc -37· 201224080 存在不均。根據下述判定基準判定硬化物膜之不均 [硬化物膜之不均之判定基準] 〇〇:硬化物膜之表面均勻,且表面平滑 〇:硬化物膜之表面雖稍有不均勻之部分 丨刀但硬化物膜 之表面之大部分均勻 x:於硬化物膜上可見分離 (6)财熱性 準備上表面設置有銅線之玻璃環氧樹脂基板 mmxlOO mm)〇將該基板加溫至8(rc,將噴墨用硬化性組 合物自附帶紫外線照射裝置之壓電方式噴墨列印機之喷墨 喷頭喷出至基板上’塗佈於整個面上。再者,於黏度為 500 mPa.s以下之喷墨用硬化性組合物之喷出試驗時,將噴 頭溫度設為80°C ’於黏度超過500 mPa.s之喷墨用硬化性組 合物之喷出試驗時,將喷頭溫度設為95°c。 對塗佈於基板上之喷墨用硬化性組合物(厚度為2〇 μιη) ’以照射能成為1〇〇〇 mj/cm2之方式照射波長為365 之紫外線,繼而於180〇C下加熱1小時,使其正式硬化,形 成作為硬化物之抗蝕圖案,獲得試驗體。 將所獲得之試驗體於270°C之條件下放置5分鐘。其後, 藉由方格試驗(Cross-cut tape test)(JIS 5400 6.15)確認硬化 物對基板之密著性’根據下述判定基準判定耐熱性。利用 100格之方格§式驗刀’以1 mm間隔於硬化物上刻劃,繼而 於具有刻劃部分之硬化物上充分地貼附透明膠帶(jIS Z1522) ’以45度之角度強力剝離膠帶之一端,確認剝離狀 態。 159117.doc -38- 201224080 [耐熱性之判定基準] 〇〇:無硬化物之剝離 〇··硬化物之一部分剝離 x:硬化物全部剝離 (7)絕緣可靠性(抗遷移性) 準備IPC-B-25之梳型測試圖案b。將該梳型測試圖案6加 溫至80。(:,以覆蓋梳型測試圖案3之整個表面之方式將喷 墨用硬化性組合物自附帶紫外線照射裝置之壓電方式喷墨 列印機之喷墨喷頭喷出並塗佈。再者,於黏度為50()mpas x下之喷墨用硬化性組合物之喷出試驗時,將喷頭溫度設 為80 C,於黏度超過5〇〇 mpa.s之喷墨用硬化性組合物之喷 出試驗時,將喷頭溫度設為95°C。 使用高壓水銀燈,對塗佈之喷墨用硬化性組合物(厚度 為20 μηι) ’以照射能成為丨〇〇〇瓜〗/〇瓜2之方式照射波長為 365 nm之紫外線。繼而,於15〇£»c下將一次硬化物加熱6〇 /刀鐘’使其正式硬化,形成作為硬化物之抗蝕圖案,獲得 試樣。 將所獲得之試樣於85°C、相對濕度85%及施加直流50 V 之條件下’進行加濕試驗500小時。測定加濕試驗後之絕 緣電阻,根據下述基準判定絕緣可靠性。 [絕緣可靠性之判定基準] 〇:絕緣電阻為3 X1 〇10 ω以上 △.絕緣電阻為1 X 1 〇9 Ω以上,未達3 χ i 〇 1 〇 Ω Χ :絕緣電阻未達1χ1〇9 Ω 將結果示於下述表丨〜4。 S. 159117.doc -39- 201224080 [表i] 實施例1 實施例2 實施例3 實施例4 實施例5 實施例6 實施例7 比較例1 比較例2 比較例3 調 配 成 量 成分(A) EBECRYL 3700(DaicelCytec公司製造) 雙酚A型環氧化合物之環氧丙烯酸酯 25 25 25 20 20 25 25 25 25 FA-511 AS(曰立化成公司製造) 丙烯酸二環戊烯酯 30 30 15 20 50 55 30 30 丙烯酸苄酯 30 成分(B) jER828(三菱化學公司製造) 型環氧化合物 15 15 15 15 10 9 40 jER806(三菱化學公司製造) 雙盼F型環氧化合物 15 成分(C) 三乙二酵二丙烯酸眭 10 10 10 20 20 5 3 10 10 兩烯酸異冰片酯 15 15 15 25 20 5 3 60 15 15 三環癸烷二甲醉二丙烯酸酯 其他成分 ST-3000(新曰鐵化學公句製造) 氩化雙酚A型環氡化合物 15 15 成分(D) Irgacure 907(BASF Japan公司製造) 4 4 4 4 4 4 4 4 4 4 Irgacure 369(BASF Japan公司製造) Irgacure 379EG(BASF Japan 公司製造) TPO(BASF Japan 公司製造) Irgacure 184(BASF Japan公司製造) 成分¢) DICY7(三菱化學公司製造) 二乳基二趄胺 1 1 1 1 1 1 1 2 1 合成例1所獲得之反應黏稠物 合成例2所獲得之反應黏稠物 合成例3所獲得之反應黏稠物 其他成分 2Ε4ΜΖ(四國化成公司製造) 2-乙基·4·甲基咪唑 1 成分(A)、成分B及成分(C)之合計100重量%中之成分(A)之含 1(重量%) 58 58 58 37 42 79 84 0 69 69 ⑴黏度 D D D D D D D D D D (2)嘖出性 △ △ Δ △ △ △ △ Δ Λ 〇〇 (3)濕潤擴散 〇 0 〇 0 〇 〇 〇 0 〇 〇 (4}拥存穩定性(適用期之長度) 0 〇 0 0 〇 〇 〇 〇 〇 X (5)硬化物膜之不均 〇〇 〇〇 〇〇 0 〇〇 〇〇 00 X 〇〇 〇〇 (6)耐熱性 〇〇 〇〇 00 〇〇 〇〇 〇〇 〇 〇〇 X X (7)絕緣可靠性 △ △ △ Δ △ Δ △ △ △ Δ 40- 159117.doc 201224080 [表2] 實施例8 實施例9 實施例10 實铱例11 實施例12 賞施例13 實施例Μ 實芘例15 賞铯例16 實施例Π 調 61 成 分 t 量 份 成分(A) EBECRYL 3700(Da!cel-Cytec公司製造) 雙盼A型環氧化合物之環軋丙烯酸酯 25 25 25 20 20 25 25 25 25 25 FA-S丨1 AS( B立化成公司製造) 丙烯酸二環戊烯曲 30 30 15 20 50 55 30 30 30 丙烯酸苄6S 30 成分(B) 丨ER828(三菱化學公司製造) 雙》A型環氧化合物 1S 15 15 15 10 9 15 15 15 丨ER806(三菱化學公司製造) 雙型環氧化合物 15 成分<c) 三乙二醉二两烯酸ά§ 10 10 10 20 20 S 3 10 10 10 丙烯酸異冰片酯 15 15 15 25 20 5 3 15 15 15 三環癸烷二甲畔二丙烯酸曲 其他成分 ST-3000(斩日鐵化學公司製造) 氪化雙酚八茧環氧化合物 成分(D) Irgacure 907(BASF Japan 公司製造) Irgacure 369(BASF Japan公司製造) 4 4 4 4 4 4 4 Irgacure 379EG(BASF Japan公司製造) 4 rPOfBASF Japan 公司製造) 4 Irgacure 184(BASF Japan公司炎造) 4 成分(E) DICY7(三菱化学公司製造) 二氰基二醢胺 1 1 1 1 1 1 1 1 1 1 合成例1所獲得之反應拉销物 合成例2所獲得之反應黏铕物 合成例3所獲得之反應黏稠物 其他成分 ΣΕ4ΜΖ(四國化成公司敢造) 2-乙基甲基咪喳 成分(A)、成分B及成分(C)之合計100重量%中之成分(A)之含量 C*t%) S8 58 58 37 42 79 84 58 58 58 〔1)粒度 D D D D D D D D D D [2)噴出性 Δ Δ △ △ △ Δ Δ Δ Δ △ (3)溫潤擴散 0 〇 〇 0 0 〇 0 0 〇 0 〔4)«存穩定性(遶用期之長度) 0 〇 〇 〇 〇 〇 〇 〇 0 〇 〔5)攻化物骐之不均 〇〇 〇〇 〇〇 〇 〇〇 〇〇 〇〇 〇〇 00 〇〇 〔6)时熱性 〇〇 〇〇 〇〇 00 〇〇 〇〇 〇 〇〇 00 〇〇 (7)%缘可靠性 〇 〇 〇 〇 〇 〇 〇 〇 Δ Δ S. -41 - 159117.doc 201224080 [表3] 實施例18 實施例19 實施例20 實施例21 實施例22 實施例23 實施例24 實施例25 實施例26 調 配 成 分 量 成分(A) EBECRYL 公司製造) 雙轮A型環氧化合物之環氡丙烯酸酯 25 25 25 20 20 25 25 25 25 FA-5丨1 AS(曰立化成公司製造) 丙烯酸二環戊烯酯 30 30 15 20 50 55 30 30 丙烯酸苄醏 30 成分(B) jER828(三菱化學公司製造) 雙6&A型環氧化合物 15 15 15 15 10 9 15 15 丨ER806(三菱化學公司製造) 雙酚F型環氧化合物 15 成分(C) 三乙二酵二丙烯酸酯 10 10 10 20 20 5 3 10 10 丙烯酸異冰片酯 15 15 15 25 20 5 3 15 15 三環癸烷二甲酵二丙烯酸酯 其他成分 ST-3000(新日鐵化學公司製造) 氩化雙酚A型環氧化合物 成分(D) Irgacure 907(BASF Japan 公司製造) 4 4 4 4 4 4 4 4 4 Irgacure 369(BASF Japan公司製造) Irgacure 379EG(BASF Japan 公司製造) TPO(BASF Japan 公司製造) Irgacure 184(BASF Japan公司製造) 成分(E) DICY7(三菱化學公司製造) 二氱基二醢胺 合成例1所獲得之反應黏稠物 1 1 1 1 1 1 1 合成例2所獲得之反應黏稠物 1 合成例3所獲得之反應黏稠物 1 其他成分 2E4MZ(四國化成公司製造) 2-乙基冰甲基咪唑 成分(A)、成分B及成分(C)之合計100重量%中之成分(A)之含 量(重量%) 58 58 58 37 42 79 84 58 58 ί ⑴點度 D D D D D D D D D 〔2)喷出性 〇〇 〇〇 〇〇 〇〇 〇〇 〇〇 〇〇 〇〇 〇〇 (3)濕潤擴散 〇 0 〇 〇 〇 〇 〇 0 〇 (4)储存穩定性(適用期之長度) 〇 〇 〇 〇 〇 〇 〇 〇 〇 (5)^化物骐之不均 〇〇 〇〇 〇〇 〇 〇〇 〇〇 〇〇 X 〇〇 (6)耐熱性 〇〇 〇〇 〇〇 〇〇 〇〇 〇〇 〇 〇〇 X 〔7)絕緣可靠性 〇 〇 〇 〇 〇 〇 〇 〇 〇 42- 159117.doc 201224080 [表4] 實施例27 實施例28 實施例29 實施例30 EBECRYL 3700(Daicel-Cytec 公司製造) 雙酚A型環氧化合物之環氧丙烯酸酯 25 35 30 25 成分(A) FA-511 AS(曰立化成公司製造) 丙烯酸二環戊烯酯 30 20 25 30 丙烯酸苄酯 成分(B) jER828(三菱化學公司製造) 雙盼A型環氧化合物 15 15 15 15 jER806(三菱化學公司製造) 雙酚F型環氧化合物 三乙二醇二丙烯酸酯 10 10 10 成分(C) 丙烯酸異冰片酯 15 15 15 15 調 配 成 分 三環癸烷二曱醇二两烯酸酯 10 其他成分 ST-3000(新日鐵化學公司製造) 氫化雙酚A型環氧化合物 量 Irgacure 907(BASF Japan公司製造) Irgacure 369(BASF Japan公司製造) 4 4 4 4 成分(D) Irgacure 379EG(BASF Japan公司製造) TPO(BASF Japan 公司製造) Irgacure 184(BASF Japan公司製造) DICY7(三菱化學公司製造) 二11基二醯胺 成分(E) 合成例1所獲得之反應黏稠物 1 1 1 1 合成例2所獲得之反應黏稠物 合成例3所獲得之反應黏稠物 其他成分 2E4MZ(四國化成公司製造) 2-乙基-4·甲基咪唑 成分(A)、成分B及成分(C)之合計100重量%中之成分(A)之含 量(重量%) 58 58 58 65 (1)黏度 D B C D (2)喷出性 〇〇 △ 〇 〇〇 (3)濕潤擴散 〇 〇〇 〇〇 〇 (4)儲存穩定性(適用期之長度) 0 〇 〇 0 (5)硬化物膜之不均 〇〇 〇〇 〇〇 00 (6)耐熱性 00 〇〇 〇〇 〇〇 (7)絕緣可靠性 〇 〇 〇 〇 s -43- 159117.doc 201224080 再者,使用α·胺基笨乙酮型光聚合起始劑之實施例 卜15、18〜30之硬化性組合物與使用α•胺基苯乙酮型光聚 合起始劑以外之光聚合起始劑之實施例16、17之硬化性組 合物相比,光照射後且熱硬化前之一次硬化物之表面之黏 著較少,熱硬化時之熱硬化性亦優異,進而絕緣可靠性之 評價結果亦良好。 又’於使用不具有二甲胺基之α—胺基烷基苯酮型光自由 基聚合起始劑之實施例1〜7,與使用α_胺基烷基苯酮型光 自由基聚合起始劑以外之光自由基聚合起始劑之實施例 16、17中,絕緣可靠性之評價結果均為「△」,但使用不 具有二曱胺基之α-胺基烧基苯酮型光自由基聚合起始劑之 實施例1〜7之絕緣電阻之值高於使用α_胺基烷基苯酮型光 自由基聚合起始劑以外之光自由基聚合起始劑之實施例 16、17中之絕緣電阻之值。 再者,於實施例8、18、27中,絕緣可靠性(抗遷移性) 之評價結果均為「〇」,但實施例27之絕緣電阻之值高於 實施例8之絕緣電阻之值,進而高於實施例18之絕緣電阻 之值。 又’於實施例中,實施下述耐濕熱性(耐熱性及耐濕性) 之評價。 (8)耐濕熱性(耐熱性及耐濕性) 準備上表面設有銅線之玻璃壞氧樹脂基板(100 mmx 100 mm)。將噴墨用硬化性組合物自附帶紫外線照射裝置之壓 電方式噴墨列印機之喷墨噴頭喷出至該基板上,而塗佈於 159117.doc • 44 · 201224080 整個面上。再者,於黏度為500 mpa.s以下之硬化性組合物 之噴出試驗時,將喷頭溫度設為8〇〇c,於黏度超過5〇〇 mPa.s之硬化性組合物之喷出試驗時,將喷頭溫度設為 95〇C。 對塗佈於基板上之喷墨用硬化性組合物(厚度為2〇 μηι),以照射能成為1000 mJ/cm2之方式照射波長為365 之紫外線’繼而於1 80°C下加熱1小時,獲得硬化物(厚度 為 20 μηι)。 將所獲得之基板與硬化物之積層體於j3〇〇c及相對濕度 為85% RH之條件下放置24小時。其後,藉由方格試驗(JIS 5400 6.15)確認硬化物對基板之密著性。利用1〇〇格之方格 試驗刀’以1 mm間隔於硬化物上刻劃,繼而於具有刻劃部 分之硬化物上充分地貼附透明膠帶(JIS Z1522),以45度之 角度強力剝離膠帶之一端,確認剝離狀態。 其結果為’於含有具有多環骨架且具有兩個以上之(甲 基)丙烯酿基之多官能化合物(C1 -1)的實施例3 〇之硬化性組 合物之情形時,剝離膠帶時硬化物未剝離。於不含具有多 環骨架且具有兩個以上之(曱基)丙烯醯基之多官能化合物 (C1 -1)之實施例1〜29之硬化性組合物之情形時,剝離膠帶 時硬化物之一部分或全部剝離。其中,於實施例丨〜29之硬 化性組合物之情形時’剝離膠帶前硬化物未剝離。 S. 159117.doc -45-S 159117.doc •35· 201224080 , the inkjet nozzle of the nozzle ink printer is sprayed and applied to the substrate, and drawn into a line (the width of the ejection portion is 8 〇 (4) and the gap between them (width P) In the mouth test of the curable composition for inkjet at a viscosity of 500 mpa.sw, the temperature of the head is set to squeak, and the viscosity of the curable composition for inkjet is more than 50 GmPat. In the test, the temperature of the head was set to 95. (:: The curable composition for inkjet applied to the substrate (thickness (4) was irradiated with ultraviolet rays having a wavelength of 365 nm so that the irradiation energy was 1000 mJ/cm2. After 5 minutes of ultraviolet irradiation, the wet diffusion of the pattern was visually observed, and the wet diffusion was determined according to the following criteria. [Determination of the wetness and diffusion] 〇〇: The state of the wet diffusion is the target line width + 4 () μιη or less. 〇: The state of wet diffusion is more than the target line width +4 〇μιη, 75 μηη or less Χ: the composition layer is wet-diffused from the drawn portion, the interval between the lines disappears, or the state of the wet diffusion exceeds the target line width +75 μίη ( 4) Storage stability (applicable period) Length) The obtained inkjet hardenable composition was filtered using a 5 μm thin film filter, and the filtered inkjet hardenable composition was heated under 8 Torr for 12 hours. The upper surface was prepared. The copper foil was attached. The Fr_4 substrate with a copper foil is attached. The inkjet head for the inkjet paste is applied to the ink jet head of the piezoelectric inkjet printer with the ultraviolet irradiation device, and the line width is μπι and the interval between the lines is 80 μm. The method is sprayed and applied to the copper foil on the substrate, and patterned into a pattern of 159117.doc • 36 - 201224080. According to the discharge property of the ink jet head at this time, the storage stability is determined according to the following criteria. In the discharge test of the hardening composition for inkjet using a viscosity of 5 〇〇 mPa.w, the nozzle temperature was set as a sail, and the inkjet hardenable composition of the viscosity exceeding L 〇mpa s was ejected. During the test, the temperature of the head is set to 9.5. [The criterion for determining the storage stability] 〇: The composition can be ejected from the ink jet head △. The composition is hardening before the ejection, or the viscosity of the composition is increased. , failed to eject the composition from the inkjet nozzle x: combination Slightly hardened (5) unevenness of the cured film. The substrate with the copper foil attached to the upper surface is attached to the surface. The substrate is heated to 80 ° C, and the curable composition for inkjet is supplied with ultraviolet rays. The ink jet head of the piezoelectric type ink jet printer of the irradiation device is ejected and applied to the substrate so that the line width becomes 1 mm, and the pattern is drawn into a pattern. Further, the viscosity is 500 mPa. In the discharge test of the curable composition for inks below s., the nozzle temperature is 8 〇〇c, and when the inkjet curable composition is tested for a viscosity of more than 500 mPa·s, the spray is sprayed. The head temperature was set to 95 °C. The inkjet curable composition (having a thickness of 2 μm) drawn in a pattern was irradiated with ultraviolet rays having a wavelength of 365 nm so that the irradiation energy was 500 mJ/cm 2 and then heated at 150 ° C for 1 hour. It is formally hardened to form a resist pattern (hardened film) as a cured product. The surface of the obtained cured film was visually observed to evaluate whether or not the cured film was ς 159117.doc -37· 201224080. Determining the unevenness of the cured film according to the following criteria [Determination of the unevenness of the cured film] 〇〇: The surface of the cured film is uniform and the surface is smooth: the surface of the cured film is slightly uneven. The sickle but the majority of the surface of the cured film is uniform x: visible on the cured film (6) The heat-prepared glass epoxy resin substrate with the copper wire on the upper surface is mmxlOO mm)) The substrate is heated to 8 (rc, ejecting the curable composition for inkjet onto the substrate from the inkjet head of the piezoelectric inkjet printer equipped with the ultraviolet irradiation device) is applied to the entire surface. Further, the viscosity is 500. In the discharge test of the curable composition for inkjet below mPa.s, the nozzle temperature is 80 ° C. When the inkjet curable composition of the viscosity exceeds 500 mPa·s, the spray test is performed. The head temperature is set to 95° C. The ultraviolet curable composition (thickness: 2 μm ηη) coated on the substrate is irradiated with ultraviolet light having a wavelength of 365 so that the irradiation energy is 1 μm/cm 2 . Then heated at 180 ° C for 1 hour, which was officially hardened and formed as The resist pattern of the compound was obtained to obtain a test body. The obtained test body was allowed to stand at 270 ° C for 5 minutes, and thereafter, the cured product was confirmed by a cross-cut tape test (JIS 5400 6.15). The adhesion to the substrate was determined based on the following criteria. The heat resistance was determined by using a square of 100 squares, and the knives were scribed on the cured material at intervals of 1 mm, and then fully cured on the cured portion having the scribed portion. Scotch tape (jIS Z1522) is attached. 'One end of the tape is peeled off strongly at an angle of 45 degrees to confirm the peeling state. 159117.doc -38- 201224080 [Standard for heat resistance] 〇〇: peeling without hardening 〇··hardening Partial peeling of the object x: Total peeling of the cured product (7) Insulation reliability (anti-migration property) The comb type test pattern b of IPC-B-25 was prepared. The comb type test pattern 6 was heated to 80. (:, The inkjet curable composition is ejected and applied from an inkjet head of a piezoelectric inkjet printer equipped with an ultraviolet irradiation device so as to cover the entire surface of the comb-shaped test pattern 3. Further, the viscosity is 50 () mpas x under the ejection of the curable composition for inkjet At the time of the test, the nozzle temperature was set to 80 C, and the ejection temperature of the inkjet hardenable composition at a viscosity exceeding 5 〇〇 mPa.s was set to 95 ° C. Using a high pressure mercury lamp, The applied curable composition for inkjet (thickness: 20 μm) is irradiated with ultraviolet rays having a wavelength of 365 nm so that the irradiation can be a melon and a melon 2. Then, under 15 »£»c The primary cured product was heated to 6 〇/knife clock to be completely hardened to form a resist pattern as a cured product, and a sample was obtained. The obtained sample was subjected to 85 ° C, a relative humidity of 85%, and a direct current of 50 V. Under the conditions, the humidification test was carried out for 500 hours. The insulation resistance after the humidification test was measured, and the insulation reliability was determined based on the following criteria. [Determination of insulation reliability] 〇: Insulation resistance is 3 X1 〇10 ω or more △. Insulation resistance is 1 X 1 〇9 Ω or more, less than 3 χ i 〇1 〇Ω Χ : Insulation resistance is less than 1χ1〇9 Ω The results are shown in Table 丨~4 below. S. 159117.doc -39- 201224080 [Table i] Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 Comparative Example 1 Comparative Example 2 Comparative Example 3 Formulated into a quantity (A) EBECRYL 3700 (manufactured by DaicelCytec) Epoxy acrylate of bisphenol A type epoxy compound 25 25 25 20 20 25 25 25 25 FA-511 AS (manufactured by 曰立化成公司) Dicyclopentenyl acrylate 30 30 15 20 50 55 30 30 Benzyl acrylate 30 Ingredients (B) jER828 (manufactured by Mitsubishi Chemical Corporation) Epoxy compound 15 15 15 15 10 9 40 jER806 (manufactured by Mitsubishi Chemical Corporation) Spontaneous F-epoxy compound 15 Ingredient (C) Tri-B Diethanol diacetate 10 10 10 20 20 5 3 10 10 Isobornyl isobornyl 15 15 15 25 20 5 3 60 15 15 Tricyclodecane dimethyl diacetate other components ST-3000 (Xinyi Iron Chemical Manufactured by the public sentence) Argonated bisphenol A type cyclic oxime compound 15 15 Component (D) Irgacure 907 (manufactured by BASF Japan) 4 4 4 4 4 4 4 4 4 4 Irgacure 369 (manufactured by BASF Japan) Irgacure 379EG (BASF Japan) Made by the company) TPO (manufactured by BASF Japan Co., Ltd.) Irgacure 184 (manufactured by BASF Japan Co., Ltd.) ¢) DICY7 (manufactured by Mitsubishi Chemical Corporation) Dilacyldiamine A 1 1 1 1 1 1 1 2 1 Synthesis of reactive viscous compound obtained in Synthesis Example 1. Reaction Resin obtained in Example 2, the reaction viscous material obtained in Synthesis Example 3, other components 2Ε4ΜΖ (manufactured by Shikoku Chemical Co., Ltd.) 2-ethyl·4·methylimidazole 1 component (A), component B, and component (C) The total content of the component (A) in 100% by weight (1% by weight) 58 58 58 37 42 79 84 0 69 69 (1) Viscosity DDDDDDDDDD (2) Outlet Δ Δ Δ △ △ △ Δ Δ Λ 〇〇 (3 ) Wet diffusion 〇0 〇0 〇〇〇0 〇〇(4}Standing stability (length of pot life) 0 〇0 0 〇〇〇〇〇X (5) Unevenity of hardened film 〇0 〇〇〇〇00 X 〇〇〇〇(6) Heat resistance 〇〇〇〇00 〇〇〇〇〇〇〇〇〇XX (7)Insulation reliability △ △ △ Δ Δ Δ △ △ △ Δ 40- 159117.doc 201224080 [Table 2] Example 8 Implementation 9 Example 10 Example 11 Example 12 Appreciation Example 13 Example 芘 Example 15 Reward Example 16 Example 调 Adjustment 61 Component t Component (A) EBECRYL 3700 (manufactured by Da! cel-Cytec) Ring-rolled acrylate of double-type A epoxy compound 25 25 25 20 20 25 25 25 25 25 FA-S丨1 AS (manufactured by B Lihuacheng Co., Ltd.) Dicyclopentene acrylate 30 30 15 20 50 55 30 30 30 Benzyl acrylate 6S 30 component (B) 丨ER828 (manufactured by Mitsubishi Chemical Corporation) Double "A type epoxy compound 1S 15 15 15 10 9 15 15 15 丨ER806 (manufactured by Mitsubishi Chemical Corporation) Double type epoxy compound 15 component <c Triethylene dihydrodienoate § 10 10 10 20 20 S 3 10 10 10 Isobornyl acrylate 15 15 15 25 20 5 3 15 15 15 Tricyclodecane dimethicone Dimethacrylate Other ingredients ST-3000 (manufactured by Nippon Iron Chemical Co., Ltd.) Deuterated bisphenol octadecene epoxy compound component (D) Irgacure 907 (manufactured by BASF Japan) Irgacure 369 (manufactured by BASF Japan) 4 4 4 4 4 4 4 Irgacure 379EG (BASF Japan Manufacturing) 4 rPOfBASF Japan Manufactured by the company 4 Irgacure 184 (made by BASF Japan) 4 Ingredients (E) DICY7 (manufactured by Mitsubishi Chemical Corporation) Dicyanodiamine 1 1 1 1 1 1 1 1 1 1 Reaction pull pin obtained in Synthesis Example 1. The reaction viscous material obtained in Synthesis Example 2 was synthesized in the same manner as the other components of the reaction viscous material ΣΕ4ΜΖ (Siguohuacheng Co., Ltd.) 2-ethylmethyl oxime component (A), component B and component (C) (Total content of component (A) in 100% by weight C*t%) S8 58 58 37 42 79 84 58 58 58 [1] Particle size DDDDDDDDDD [2] Sprayability Δ Δ △ △ Δ Δ Δ Δ Δ △ ( 3) Warm diffusion 0 〇〇0 0 〇0 0 〇0 〔4) «Storage stability (length of the bypass period) 0 〇〇〇〇〇〇〇0 〇[5) Uneven 攻〇〇〇〇〇〇〇〇〇〇〇〇00 〇〇[6)Hot 〇〇〇〇〇〇00 〇〇〇〇〇〇〇00 〇〇(7)% edge reliability〇〇〇〇〇〇 〇〇Δ Δ S. -41 - 159117.doc 201224080 [Table 3] Example 18 Example 19 Example 20 Example 21 Example 22 Example 23 Example 24 Example 25 Example 26 Formulation component amount Component (A) EBECRYL company) Two-wheel type A epoxy compound oxime acrylate 25 25 25 20 20 25 25 25 25 FA-5丨1 AS (manufactured by 曰立化成公司) Dicyclopentenyl acrylate 30 30 15 20 50 55 30 30 Benzene acrylate 30 Ingredients (B) jER828 (manufactured by Mitsubishi Chemical Corporation) Double 6 & A ring Oxygen compound 15 15 15 15 10 9 15 15 丨ER806 (manufactured by Mitsubishi Chemical Corporation) Bisphenol F-type epoxy compound 15 Ingredient (C) Triethylene glycol diacrylate 10 10 10 20 20 5 3 10 10 Isobornyl acrylate 15 15 15 25 20 5 3 15 15 Tricyclodecane dimethyl alcohol diacrylate Other components ST-3000 (manufactured by Nippon Steel Chemical Co., Ltd.) Argon bisphenol A type epoxy compound component (D) Irgacure 907 (BASF Japan Manufactured by the company 4 4 4 4 4 4 4 4 4 Irgacure 369 (manufactured by BASF Japan) Irgacure 379EG (manufactured by BASF Japan) TPO (manufactured by BASF Japan) Irgacure 184 (manufactured by BASF Japan) (E) DICY7 (manufactured by Mitsubishi Chemical Corporation) Reaction viscous material obtained by synthesizing dimercaptodiamine synthesis 1 1 1 1 1 1 1 Reaction viscous material obtained in Synthesis Example 2 Synthetic Example 3 Reaction Viscous 1 Other components 2E4MZ (manufactured by Shikoku Chemical Co., Ltd.) Content of the component (A) in 100% by weight of the total of 2-ethyl glacial methyl imidazole component (A), component B and component (C) (% by weight) ) 58 58 58 37 42 79 84 58 58 ί (1) DDDDDDDDD [2) Ejection 〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇 (3) Wet diffusion 〇 0 〇〇〇〇 〇0 〇(4) Storage stability (length of pot life) 〇〇〇〇〇〇〇〇〇(5)^Inhomogeneity 骐X 〇〇( 6) Heat resistance 〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇X [7) Insulation reliability 〇〇〇〇〇〇〇〇〇 42- 159117.doc 201224080 [Table 4] Example 27 Example 28 Example 29 Example 30 EBECRYL 3700 (Daicel-Cytec Corporation Manufactured epoxy acrylate of bisphenol A type epoxy compound 25 35 30 25 Ingredients (A) FA-511 AS (manufactured by 曰立化成公司) Dicyclopentenyl acrylate 30 20 25 30 benzyl acrylate component (B) jER828 (manufactured by Mitsubishi Chemical Corporation) Double-anti-type epoxy compound 15 15 15 15 jER806 (manufactured by Mitsubishi Chemical Corporation) Bisphenol F-type epoxy compound triethylene glycol diacrylate 10 10 10 Ingredient (C) Isobornyl acrylate 15 15 15 15 Formulation of tricyclodecanedioxane dienoate 10 Other components ST-3000 (manufactured by Nippon Steel Chemical Co., Ltd.) Hydrogenated bisphenol A type epoxy compound Irgacure 907 (manufactured by BASF Japan) Irgacure 369 (manufactured by BASF Japan) 4 4 4 4 Ingredients (D) Irgacure 379EG (manufactured by BASF Japan) TPO (manufactured by BASF Japan) Irgacure 184 (manufactured by BASF Japan) DICY7 (manufactured by Mitsubishi Chemical Corporation) Amine component (E) Reaction dope obtained in Synthesis Example 1 1 1 1 Reaction of the reaction dope obtained in Synthesis Example 2 Synthesis Example 3 Other components of the viscous material 2E4MZ (manufactured by Shikoku Chemical Co., Ltd.) The content of the component (A) in 100% by weight of the total of 2-ethyl-4·methylimidazole component (A), component B and component (C) (% by weight) 58 58 58 65 (1) Viscosity DBCD (2) Ejection 〇〇 △ 〇〇〇 (3) Wet diffusion 〇〇〇〇〇〇 (4) Storage stability (length of pot life) 0 〇〇 0 ( 5) Unevenness of hardened film 〇〇〇〇〇〇 00 (6) Heat resistance 00 〇〇〇〇〇〇 (7) Insulation reliability 〇〇〇〇s -43- 159117.doc 201224080 Furthermore, use α ·Example of an amine-based acetophenone type photopolymerization initiator; implementation of a photo-polymerization initiator other than the photo-polymerization initiator of 15,18 to 30, and a photopolymerization initiator other than an α-aminoacetophenone type photopolymerization initiator In the hardenable compositions of Examples 16 and 17, the surface of the primary cured product after light irradiation and before the heat hardening was less adhered, and the thermosetting property at the time of heat curing was also excellent, and the evaluation result of the insulation reliability was also good. Further, Examples 1 to 7 using an α-aminoalkylphenone type photoradical polymerization initiator having no dimethylamino group, and photo-radical polymerization using α-aminoalkylphenone type In Examples 16 and 17 of the photoradical polymerization initiator other than the initiator, the evaluation results of the insulation reliability were all "Δ", but the α-aminobenzophenone type light having no diammonium group was used. Examples of the radical polymerization initiators of Examples 1 to 7 have higher values than those of the photoradical polymerization initiator other than the α-aminoalkylphenone type photoradical polymerization initiator. The value of the insulation resistance in 17. Further, in Examples 8, 18, and 27, the evaluation results of the insulation reliability (anti-migration property) were all "〇", but the value of the insulation resistance of Example 27 was higher than the value of the insulation resistance of Example 8. Further, it is higher than the value of the insulation resistance of Example 18. Further, in the examples, the following evaluations of moist heat resistance (heat resistance and moisture resistance) were carried out. (8) Moisture and heat resistance (heat resistance and moisture resistance) A glass epoxy resin substrate (100 mm x 100 mm) having a copper wire on its upper surface was prepared. The inkjet curable composition was ejected from the inkjet head of a piezoelectric inkjet printer equipped with an ultraviolet irradiation device onto the substrate, and applied to the entire surface of 159117.doc • 44 · 201224080. Further, in the discharge test of the curable composition having a viscosity of 500 mpa.s or less, the spray head temperature was set to 8 〇〇c, and the squeezing test of the sclerosing composition having a viscosity exceeding 5 〇〇 mPa.s was used. When the nozzle temperature is set to 95 〇C. The inkjet curable composition (having a thickness of 2 μm) coated on a substrate was irradiated with ultraviolet rays having a wavelength of 365 so that the irradiation energy was 1000 mJ/cm 2 , and then heated at 180 ° C for 1 hour. A hardened material (thickness 20 μηι) was obtained. The obtained laminate of the substrate and the cured product was allowed to stand under the conditions of j3〇〇c and a relative humidity of 85% RH for 24 hours. Thereafter, the adhesion of the cured product to the substrate was confirmed by a checker test (JIS 5400 6.15). The plaque was smeared on the hardened material at a spacing of 1 mm using a 1 〇〇 grid test knives, and then a scotch tape (JIS Z1522) was sufficiently attached to the cured portion having the scribed portion to be strongly peeled off at an angle of 45 degrees. One end of the tape confirms the peeling state. The result is 'in the case of the hardening composition of Example 3 containing a polyfunctional compound (C1-1) having a polycyclic skeleton and having two or more (meth)acryloyl groups, hardening when peeling off the tape The material was not peeled off. In the case of the hardening composition of Examples 1 to 29 which does not contain a polyfunctional compound (C1-1) having a polycyclic skeleton and having two or more (fluorenyl) acrylonitrile groups, the cured product is peeled off when the tape is peeled off. Part or all of it peeled off. In the case of the hardening composition of Examples 丨 to 29, the cured product before peeling off the tape was not peeled off. S. 159117.doc -45-

Claims (1)

201224080 七、申請專利範圍: 1· 一種喷墨用硬化性組合物,其係藉由喷墨方式進行塗 佈,且藉由照射光與軾予熱而硬化者,其含有: 含(甲基)丙稀酿基之化合物,·其具有(甲基)丙稀酿 基’且具有芳香族骨架或具有於脂環式骨架内含有不飽 和雙鍵之脂環式骨架; 含環狀醚基之化合物,其具有兩個以上之環狀醚基, 且具有芳香族骨架; 上述含(甲基)丙烯醯基之化合物以外之光反應性化合 物; 光聚合起始劑;及 潛伏性硬化劑。 2·如請求項1之喷墨用硬化性組合物,其依據Jis艮2283而 測定之25 C下之黏度為1〇〇 mpa.s以上、12〇〇 mpa s以 下。 3. 如°月求項1之喷墨用硬化性組合物,其中於上述含(甲基) 丙烯醯基之化合物、上述含環狀醚基之化合物與上述光 反應性化合物之合計100重量%中,上述含(甲基)丙烯醯 基之化合物之含量為1 〇重量%以上。 4. 如叫求項1之喷墨用硬化性組合物,其中上述潛伏性硬 化劑為二氣基二酿胺粒子,或使二氰基二酿胺與具有可 與該二氰基二醯胺反應之官能基的含官能基之化合物反 應而成之反應黏稠物。 5. 如请求項1之喷墨用硬化性組合物,其中上述潛伏性硬 159117.doc t 201224080 化劑係使二氰基二醯胺與具有可與該二氰基二醯胺反應 之官能基的含官能基之化合物反應而成之反應黏稠物。 6.如請求項1至5中任一項之噴墨用硬化性組合物,其中上 述光聚合起始劑為α_胺基烷基苯酮型光自由基聚合起始 劑0 如請求項1至5中任一項之喷墨用硬化性組合物,其中上 述光聚合起始劑為具有二甲胺基之α_胺基烷基苯酮型光 自由基聚合起始劑。 8. 如凊求項1至5中任一項之噴墨用硬化性組合物,其中上 述光反應性化合物含,有具有多環骨架’且具有兩個以上 之(甲基)丙烯醯基之多官能化合物。 9. 如請求項1至5中任一項之喷墨用硬化性組合物其中上 述光反應性化合物含有具有多環骨架,且具有一個(甲 基)丙烯醯基之單官能化合物。 10.如請求項1至5中任一項之喷墨用硬化性組合物,其中上 述光反應性化合物含有具有多環骨架且具有兩個以上之 (曱基)丙烯酿基之多官能化合物、與具有多環骨架且具 有一個(甲基)丙烯醯基之單官能化合物兩者。 、 11. 一種電子零件之製造方法,其具備如下步驟: 藉由喷墨方式塗佈如請求項丨至10中任一項之噴墨用 硬化性組合物,並繪製成圖案狀之步驟; 對繪製成圖案狀之上述喷墨用硬化性組合物照射光及 賦予熱,使其硬化,而形成硬化物層之步驟。 12. 如請求項11之電子零件之製造方法,i /、係具有抗姓圖案 159117.doc 201224080 之電子零件的印刷配線板之製造方法,並且 藉由喷墨方式塗佈上述噴墨用硬化性組合物,並繪製 成圖案狀,對繪製成圖案狀之上述喷墨用硬化性組合物 照射光及賦予熱,使其硬化,而形成抗姓圖案。 S 159117.doc 201224080 四、指定代表圖: (一) 本案指定代表圖為:(無) (二) 本代表圖之元件符號簡單說明: 五、本案若有化學式時,請揭示最能顯示發明特徵的化學式: (無) 159117.doc201224080 VII. Patent application scope: 1. A curable composition for inkjet which is applied by an inkjet method and hardened by irradiation of light and heat, and contains: (meth)-containing a thin base compound, which has a (meth) propylene group and has an aromatic skeleton or an alicyclic skeleton having an unsaturated double bond in an alicyclic skeleton; a compound having a cyclic ether group, It has two or more cyclic ether groups and has an aromatic skeleton; a photoreactive compound other than the above (meth)acryloyl group-containing compound; a photopolymerization initiator; and a latent curing agent. 2. The curable composition for inkjet according to claim 1, wherein the viscosity at 25 C measured according to Jis 2283 is 1 〇〇 mpa.s or more and 12 〇〇 mpa s or less. 3. The curable composition for inkjet according to Item 1, wherein 100% by weight of the total of the (meth)acrylonitrile-containing compound, the cyclic ether-containing compound, and the photoreactive compound are 100% by weight. The content of the (meth)acrylonitrile group-containing compound is 1% by weight or more. 4. The curable composition for inkjet according to claim 1, wherein the latent hardener is a di- nitro-functional amine particle, or the dicyanodiamine has a dicyandiamide A reaction viscous compound obtained by reacting a functional group-containing compound of a functional group. 5. The curable composition for inkjet according to claim 1, wherein the latent hard 159117.doc t 201224080 is a phthalocyanamine having a functional group reactive with the dicyanodiamine A reactive viscous compound obtained by reacting a functional group-containing compound. 6. The curable composition for inkjet according to any one of claims 1 to 5, wherein the photopolymerization initiator is an α-aminoalkylphenone type photoradical polymerization initiator 0 as in claim 1 The curable composition for inkjet according to any one of 5, wherein the photopolymerization initiator is an α-aminoalkylphenone type photoradical polymerization initiator having a dimethylamino group. 8. The curable composition for inkjet according to any one of the items 1 to 5, wherein the photoreactive compound contains a polycyclic skeleton and has two or more (meth)acrylonitrile groups. Polyfunctional compound. 9. The curable composition for inkjet according to any one of claims 1 to 5, wherein the photoreactive compound contains a monofunctional compound having a polycyclic skeleton and having one (meth)acrylonitrile group. The curable composition for inkjet according to any one of claims 1 to 5, wherein the photoreactive compound contains a polyfunctional compound having a polycyclic skeleton and having two or more (fluorenyl) propylene-based groups, Both with a monofunctional compound having a polycyclic backbone and having one (meth) acrylonitrile group. 11. A method of producing an electronic component, comprising the steps of: applying a curable composition for inkjet according to any one of claims 1 to 10 by an inkjet method, and drawing the pattern into a pattern; The step of forming the cured layer of the inkjet curable composition in which the pattern is formed is irradiated with light and heat is applied to form a cured layer. 12. The method of manufacturing an electronic component according to claim 11, i /, a method of manufacturing a printed wiring board having an electronic component resistant to surname 159117.doc 201224080, and applying the above-described inkjet hardenability by an inkjet method The composition is drawn into a pattern, and the inkjet curable composition drawn in a pattern is irradiated with light and heat is applied to be cured to form an anti-surname pattern. S 159117.doc 201224080 IV. Designation of representative drawings: (1) The representative representative of the case is: (none) (2) The symbol of the symbol of the representative figure is simple: 5. If there is a chemical formula in this case, please reveal the characteristics that can best show the invention. Chemical formula: (none) 159117.doc
TW100135074A 2010-09-28 2011-09-28 Curable composition for inkjet and method for producing electronic component TWI610990B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010217748 2010-09-28

Publications (2)

Publication Number Publication Date
TW201224080A true TW201224080A (en) 2012-06-16
TWI610990B TWI610990B (en) 2018-01-11

Family

ID=45892917

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100135074A TWI610990B (en) 2010-09-28 2011-09-28 Curable composition for inkjet and method for producing electronic component

Country Status (3)

Country Link
JP (1) JP6066559B2 (en)
TW (1) TWI610990B (en)
WO (1) WO2012043473A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5880228B2 (en) * 2012-04-05 2016-03-08 コニカミノルタ株式会社 Actinic ray curable inkjet ink and image forming method using the same
JP2019104811A (en) * 2017-12-12 2019-06-27 株式会社T&K Toka Latent curing agent composition and one-component curable epoxide composition including the same

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59126428A (en) * 1983-01-06 1984-07-21 Dai Ichi Kogyo Seiyaku Co Ltd Curing agent for epoxy resin
JPH0655806B2 (en) * 1987-02-23 1994-07-27 株式会社日立製作所 Curing agent for epoxy resin
JPH02283718A (en) * 1989-04-25 1990-11-21 Dainippon Ink & Chem Inc Epoxy resin composition, prepreg and laminate
JPH0578454A (en) * 1991-09-25 1993-03-30 Hitachi Ltd Curing agent for epoxy resin
JP2000239418A (en) * 1999-02-19 2000-09-05 Hitachi Chem Co Ltd Prepreg for printed wiring board, and laminate made by using it
JP3893833B2 (en) * 2000-02-09 2007-03-14 ブラザー工業株式会社 Energy ray curable composition for ink jet recording system
JP4290510B2 (en) * 2003-08-22 2009-07-08 太陽インキ製造株式会社 Photocurable / thermosetting composition for inkjet and printed wiring board using the same
CN101283061B (en) * 2005-08-31 2012-01-25 普林塔有限公司 Uv curable hybridcuring ink jet ink composition and solder mask using the same
JP2010059299A (en) * 2008-09-03 2010-03-18 Chisso Corp Inkjet ink, and cured film obtained from the same
JP5315932B2 (en) * 2008-11-04 2013-10-16 Jnc株式会社 Inkjet ink
JP2010143982A (en) * 2008-12-17 2010-07-01 Chisso Corp Photo-curable ink for inkjet
JP2011021079A (en) * 2009-07-14 2011-02-03 Chisso Corp Inkjet ink
JP5617201B2 (en) * 2009-07-23 2014-11-05 Jnc株式会社 Photo-curable ink-jet ink

Also Published As

Publication number Publication date
WO2012043473A1 (en) 2012-04-05
TWI610990B (en) 2018-01-11
JPWO2012043473A1 (en) 2014-02-06
JP6066559B2 (en) 2017-01-25

Similar Documents

Publication Publication Date Title
TWI577751B (en) A hardening composition for inkjet and a method for manufacturing an electronic component
TWI518105B (en) A hardening composition for inkjet and a method for manufacturing an electronic component
TWI357434B (en)
TWI567141B (en) Curable composition for inkjet and method for producing electronic component
JP2012092312A (en) Curable composition for inkjet and method for producing electronic component
JP5799144B2 (en) Curable composition for inkjet and method for producing electronic component
JP2012087298A (en) Inkjet curable composition and method of manufacturing electronic part
TWI331489B (en)
TWI598412B (en) Curable composition for inkjet, and method of manufacturing electronic parts
TW201224080A (en) Curable composition for inkjet applications, and process for manufacturing electronic component
JP2012167268A (en) Curable composition for inkjet and method for producing electronic component
JP2012001671A (en) Photo- and moisture-curable composition
JP2014055288A (en) Curable composition for ink-jet and method for producing electronic component
JP2021161204A (en) Low-viscosity photocurable composition, cured product and electronic component
KR20210141923A (en) coating composition