TW201219204A - Precursor for an electrically conductive material and electrically conductive material - Google Patents

Abstract

This invention provides a precursor for an electrically conductive material having a supporting member and at least an active energy ray bonding force reducing type resin layer easy bonding layer and a metal portion disposed sequentially on the supporting member, the active energy ray bonding force reducing type resin containing an active ray hardening type polymeric compound having a mass average molecular weight of 15000 or more and having an unsaturated double bond.

Description

[2012] The invention relates to a conductive material precursor for use in the manufacture of various antenna materials such as a circuit board for a flexible printed circuit board and a mobile phone, and the like. In particular, a conductive material precursor which is preferably used for forming a circuit or an antenna on a substrate having a curved shape, and a conductive material produced using the same. [Prior Art] In recent years, an antenna for an automobile or an antenna for a mobile phone or the like is required to form a metal portion such as an antenna on a molded article having a curved surface. However, it is very difficult to form a fine metal part on the curved surface. A method of producing a flexible conductive material by forming a pattern of a metal portion on a flexible resin support has been proposed, and various methods such as a subtractive method, a printing method, and a photographic method have been proposed. A flexible conductive material is bonded to the curved surface to form a metal portion on the curved surface. When the conductive material is bonded to the curved surface, the softer the conductive material is, the more difficult it is to float when it is bonded, and so on. In addition, in the manufacture of the conductive material, the rigidity becomes more and more, and the enemy is less likely to be generated during manufacture. Therefore, a conductive material precursor which can obtain a conductive material which is high in rigidity at the manufacturing stage and which is low in rigidity at the time of bonding is obtained. For example, in the patent document, a rigid metal foil-bonding carrier film is attached, followed by half-cutting, and the patterned metal portion and the carrier film are entirely peeled off together to form a pattern. However, in this method, for example, a complicated pattern such as a loop antenna may cause a portion that cannot be peeled off. Further, when the peeling method of the third drawing of Patent Document 1 is used, it is feared that the metal is cut at the time of peeling. 3 323512 201219204 • To prevent this, it is necessary to thicken the thickness of the metal foil, but it also has difficulty in the processing of the curved surface. The problem. /h is not the processing of the curved surface. For example, in Patent Document 2 and Patent Document 3 f, the metal case is bonded to the support body, and the metal V white is named by a known method, and after being patterned, the transfer is carried out. The method of printing has also been proposed. However, in the transfer method, the support and the metal foil are bonded before the patterning, but if the strength of the paste is too strong, when the metal foil is peeled off, a portion which cannot be peeled off is formed, or if the strength is Too weak, in the step before the transfer, there is a problem that the metal foil is completely peeled off, and the like, so that the adhesive strength of the paste is difficult to adjust. Moreover, depending on the shape or size of the pattern to be separated, the grainability of the separation is different, and therefore the pattern according to the pattern may not be smoothly transferred. ^ Patent Document 4, Patent Document 5, etc., is a bonding support and metal, a mooring active energy ray-adhesive-disappearing adhesive, and an active energy Ί 着 力 # 失 失 失 失 失 失 失 失 失 失The adhesion of the line and the paste disappears, so the strength of the paste is easily adjusted. However, when the metal portion is patterned, the adhesive layer is located on the surface, so that the adhesive may contaminate the step, or the transfer body may be damaged by the adhesive or the like by the adhesive. Further, at the time of transfer, the metal portion is transferred to the adherend using an adhesive or the like, but at this time, the hardened active moon 罝 line adhesion force is also followed by the adhesive, so that the transfer may not be smoothly performed. . Patent Document 6 proposes a method in which a metal mesh produced by a silver salt photographic transfer method is subjected to enzymatic treatment for separation. Alternatively, a method of manufacturing a metal mesh monomer has also been proposed in Patent Document 7. The method of peeling off the pattern from the substrate to the pattern creation 323512 4 201219204 does not exist, and the pattern of ‘people’ shouting can be easily produced. However, if the mesh and the map are still in the vicinity of the building, the array antennas are zero at the time of the stripping, and therefore do not become a solution to the processing problems such as array antennas. For example, in the insert molding method, a transfer coating is used in the insert molding to form a hard coat layer on the transfer film, and after the insert is formed, the hard coat layer is photohardened to form a metal portion, and then transferred. The method of peeling off the film is known. However, there has not been a proposal that the hard coat layer is firmly adhered to the metal portion, and the metal portion is prevented from being peeled off or deformed from the transfer of the crucible. [Patent Document 1] Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. SUMMARY OF THE INVENTION [Problem to be Solved by the Invention] Therefore, an object of the present invention is to provide a conductive material precursor which is high in manufacturing, low in yield, low in w, and "refractive" When the precursor of the conductive material is peeled off at least, the conductive material of the genus portion and the (4) layer can be uniformly and easily peeled off. 323512 5 201219204 Further, it is to provide a conductive material which can form a fine metal portion on a curved surface. (Means for Solving the Problem) The present invention has been achieved by the following invention. (1) A kind of conductive material precursor' is attached to the support at least sequentially. The active double-bond containing the average molecular weight of 15000 or more has an unsaturated double bond. The adhesion-reducing resin layer, the easy-adhesion layer, and the metal portion. (2) The conductive material precursor according to the above (1), wherein the active energy ray-reducing-reducing resin layer contains 40% by mass or more of the total solid content of the resin layer, and the mass average molecular weight is ι 5 〇〇〇 or more. The active energy ray-curable polymer compound having an unsaturated double bond contains 8% by mass or more of an epoxy compound based on the total solid content of the resin layer. (3) The conductive material precursor according to the above (1) or (2), wherein the active energy ray-reducing resin layer further contains a thermal cation polymerization initiator. (4) The conductive material precursor according to any one of the above items (1) to (3), wherein the symplectic content is 50 to 90% by mass based on the total solid content of the active energy ray-reducing resin layer. An active energy ray-curable polymer compound having an unsaturated double bond having a mass average molecular weight of 1⁄5 Å or more. (5) The conductive material precursor according to any one of the above items (1) to (4), wherein the total solid content of the active energy ray-reducing resin layer is 60 to 70% by mass. An active energy ray-curable polymer compound having an unsaturated double bond having an average molecular weight of 15,000 or more. (6) The conductive material precursor of any one of the above-mentioned items (2) to (5), which contains 10 to 30 with respect to one of the aforementioned active energy ray-reducing resin layers. % by mass of epoxy compound. (7) The conductive material precursor of any one of the above items (2) to (6), which contains 15 to 25% by mass of the epoxy compound in the shirt of the active energy ray-reducing resin layer. (8) A conductive material produced by irradiating an active energy ray to a precursor of a conductive material as described in the above (1) to (7), and then supporting a material having a free layer and a metal portion. (9) A conductive material which is obtained by irradiating an active energy ray to the precursor of the conductive material as described in (1) to (7) above, and attaching a protective film to the side of the metal portion of the precursor, and how much food is peeled off from the support It is made of a material having an adhesive layer, a metal portion, and the above protective film. (Effect of the Invention) According to the present invention, a precursor of a conductive material can be provided, which is not!

At least "disturbing" and peeling from the conductive material precursor = when there is a metal portion and an easy-to-adhere layer of conductive material, J-lead _ again, can provide a kind of micro-scale can be formed on the curved surface Sexual material. [Embodiment] [Electrical Material Precursor > Conductive Material Precursor> The predecessor of the electric conductor of the present invention has a mass average molecular weight of 15 or more and has at least a double bond-based active energy. The activity of the linear curable polymer compound is not saturated. 323512 7 201219204 . · Easy adhesion layer, metal part. The support system used for the guide of the present invention is not particularly limited as long as it is a material penetrating the active energy ray, but it is particularly preferably a support having a total light transmittance of more than 5%. Further, it is preferably a support having a total light transmittance of 継 or more. = This is a miscellaneous substance, such as p-phenylene (tetra) ethylene glycol, diethyl (tetra) resin, triacetic acid vinegar resin, acrylic resin, polycarbonate, polyvinyl chloride, polyimide resin, polydisperse Resin film such as fluoroethylene, conf. (five), and celluloid (four) lulQid). These slabs should be rigid, easy to handle, and provide good release properties. Further, in order to easily peel off the conductive material, the release layer may be provided between the support body and the active energy ray-reducing resin layer. In the present invention, the release layer may be used alone or in combination with waxes such as carnauba wax or polyethylene, acrylic, melamine, epoxy, aliphatic vinegar, olefin, and poly stone. The resin such as oxime resin or sapphire may also contain a surfactant or the like. Further, a known functional layer such as an antistatic layer may be provided on the opposite side of the branch (4). The active energy ray-reducing type resin layer of the conductive material precursor used in the present invention contains an active energy ray-curable polymer compound having a mass average molecular weight of 15 Å or more and having an unsaturated double bond. The active energy ray-curable polymer compound may, for example, be a polymer compound having a molecular weight (10) or more having an active hydrogen such as a thiol group, a slow group, an audition group, a thiol group or a amide group, for example, polyvinyl alcohol or poly. Vinyl butyral _ and other polyethylene shrink resin 'polyallylamine, or acrylic acid, acrylic acid vinegar and other acrylic vinegar, propyl acetophenone, propyl mother, methyl propylene 323512 8 201219204 酉夂, methyl Acrylic acid polymerization of a copolymer obtained by polymerization of a monomer such as a methacrylic acid vinegar such as an acrylic acid, a methyl propylamine or a methyl acrylonitrile or a homopolymer of a monomer or a polymerization of two or more of these monomers a poly-synthesis compound containing an epoxy group, such as a propylene oxide propyl ether, or a polymerizable unsaturated compound containing an isocyanate group, such as a mercapto propylene oxyethyl group. The polymer compound obtained by a method in which an addition reaction is carried out by a compound having a group reactive with an active hydrogen and an unsaturated double bond, and (2) as described in International Publication No. 2 /87831 manual contains %: oxygen The acrylic polymer with an unsaturated acid addition betray. The reaction of a method known method for synthesizing a polymer compound obtained. Among these, it is preferable that the polymer compound of the acrylic polymer and the unsaturated compound is reacted to obtain good releasability. The active energy ray-curable polymer compound having an unsaturated double bond having a mass average molecular weight of 15,000 or more synthesized by such a method may be used alone or in combination of plural kinds. Commercially available products can also be used as the active 忐K-line curable polymer compound having an unsaturated double bond having a mass average molecular weight of 15,000 or more. Commercially available JJital〇id (average molecular weight 50000) of Hitachi Chemical Industry Co., Ltd. is available. The active energy entanglement-reducing resin layer of the present invention preferably contains a light absorbing agent. As the photopolymerization initiator, those generally known can be used. Specific examples thereof include benzoin, benzophenone, benzoin ethyl ether, benzoin isopropyl ether, 2,2-dimethoxy-2-phenyl acetophenone, and hydroxycyclohexyl. Phenyl_, 2~hydroxy-2-indolyl-1-phenylpropane__丨-ketone, azobisisobutyronitrile, benzene 323512 9 201219204 • Mercapto peroxide or the like, but is not limited thereto. These photopolymerization initiators may be used singly or in combination of two or more kinds. 01至二十质量质量优选优选为1至10质量质量。 The active energy ray-curable polymer compound having a mass average of 15000 or more having an unsaturated double bond, the photopolymerization initiator preferably contains 0.1 to 20% by mass, more preferably 1 to 10% by mass. . In addition to the photopolymerization initiator, at least one of the above-mentioned photosensitizers may be added as needed to control the hardening time or the hardened state. The photosensitizer may be selected from the group consisting of an amine compound, a phosphorus compound, a nitrile compound, a benzoin compound, a carbonyl compound, a sulfur compound, a naphthalene compound, a condensed aromatic hydrocarbon, a metal salt, and the like. Specific examples thereof include an amine compound such as triethylamine, diethylaminoethyl methacrylate, and N-mercaptodiethanolamine, a phosphorus compound such as fluorenylphosphine oxide or tributylphosphine, and 5-nitroguanidine ( 5-nitroacenaphthene), such as nitrile compound, 4-dimethylaminoethyl benzoate, 4-dimethylaminoisovalerate, benzoin, benzoin fluorenyl, benzoin B Base bond, benzoin isobutyl scale, benzoin octyl scale and other benzoin compounds 'diethoxyacetophenone, 2-carbyl-2-mercaptopropiophenone, 4'-isopropyl- 2-hydroxy-2-mercaptopropiophenone, mercaptopurine, acetophenone, benzophenone, decyl decyl decanoate, benzyldidecyl ketal, p-cyclohexyl phenyl ketone, 2 a carbonyl compound such as mercapto-1-(4-(decylthio)phenyl)_2-morpholinyl)-propene-1,2,2-dimethoxy-2-phenyl acetophenone, A thiodisulfide compound such as phenyl disulfide or dithiocarbamate, a condensed aromatic hydrocarbon such as a naphthalene compound such as 3—a gas-based tea, or a metal salt such as vaporized iron. These photosensitizers can be used singly or in combination of two or more types. The activity of the unsaturated double bond with respect to the mass average molecular weight of 15000 or more is 323512 10 201219204 The energy ray hardening polymer compound, the content of the photosensitizer is preferably 〇. 1 to 5 mass%, more preferably 0.5 to 3 mass. %. Further, the active energy ray-reducing resin layer of the present invention preferably contains a thermal cationic polymerization initiator. The thermal cationic polymerization initiator is a compound which generates a cationic species or a Lewis acid by heating, and examples thereof include a phenyl sulfonium sulphate salt, a thiophenium sulphate, and a tetrahydro sulphur sulphide. a thiolanium salt, a benzylammonium salt, a pyridine rust salt, a hydrazine wrong salt, a carboxylic acid ester, a sulfonate, an amine imine or the like. These thermal cationic polymerization initiators are commercially available, and any of them may be, for example, a commercial name.

Adeka Opton CP77 (Adeka, ADEKA) -aid SI-80L and San-aid SI-100L (above, Sanshin Chemical Industry Co., Ltd.), etc. These compounds may be used alone or in combination of two or more. The solid content of the initiator relative to the crosslinking agent is preferably from 0.5 to 1% by mass, more preferably from J to 5% by mass. The active energy ray-reducing resin layer of the present invention has a mass average molecular weight of 15 GGG or more. The active energy ray-curing property of the unsaturated double bond is the same as that of the molecular compound. When combined with a high score which does not have an unsaturated double bond, the strength and flexibility at the time of peeling can be improved to prevent cracking or bending of the material. For the use of a saturated gemini compound, the same knife-forming σ system for producing a conductive bond in the stripping step may, for example, be various kinds of * acetamidine resin such as polyvinyl alcohol, polyvinyl butyric acid or polyglycolic acid, acrylic acid, acrylic vinegar Such as propylene 13th class, propylene, _ nitrile, methyl Ethyl acid, mercapto propylene, simmering, etc., methyl propyl sulphate, methacrylamide, methyl propyl amide, etc. 11 323512 201219204 Any monomeric homopolymer or more than two An acrylic polymer such as a copolymer obtained by polymerization of a monomer, polystyrene, polyvinyl chloride, polyvinylidene fluoride, polyvinylidene fluoride, polytetrafluoroethylene, polyepoxybutene, polyepoxybutane, Polystyrene vinyl acid, polyethylene η piroxone, polyamine citrate, etc. Further, a plurality of such polymer compounds having no unsaturated double bond may be used. The present invention is preferably adjusted by using a close force. The polyvinyl acetal resin is preferably a Tg (glass transfer point) of 6 〇 ° C or higher, and more preferably a Tg 80 to 15 (TC polyvinyl acetal resin. The active energy of the conductive material precursor of the present invention) 1至40质量百分比。 The linear adhesion reducing resin layer containing the polymer compound having no unsaturated double bond with respect to the total solid content of the resin layer is preferably 5% by mass or less, more preferably 0.1 to 40% by mass. Active energy line adhesion of conductive material precursors used in the invention The low-type resin layer preferably contains a crosslinking agent in addition to the resin component. When a polymer compound other than the active energy ray-curable polymer compound having an unsaturated double bond having a mass average molecular weight of 15,000 or more is contained, it is preferred to use a crosslinking agent. For crosslinking, the crosslinking agent may be an aldehyde compound, an epoxy compound, an isocyanate compound, a carbodiimide compound, an aziridine compound, an oxazoline compound, an active compound, and at least two ethylene. And a total amount of the resin component is preferably 0.1 or more by mass of the total amount of the resin component. In addition, a compound having an unsaturated double bond having a mass average molecular weight of 15 or less, such as an acrylic monomer or an acrylic oligomer, may be contained. However, the amount of the total resin component of the active energy ray-reducing resin layer is formed by the amount. It is preferably 5 mass% or less, and does not cause clogging or the like. 323512 12 201219204 In the present invention, it is preferred that the hexa-linked compound in the molecule is an epoxy compound. The epoxy compound is a monomer of an oxy group, and the oxy group is more preferably a combination of two or more cyclized compounds. Usable examples include a polymer compound and a low molecular weight ether, glycerol diepoxide % oxypropyl hydrazine, ethylene glycol diglycidyl glycol digoxypropyl group, 2, polyglycerol poly propylene glycol (IV), Polyethyl epoxide propylene, sorbitol, propylene dimethacrylate, neopentyl alcohol polymer, 丨 2 / poly methoxy propyl ether, vinyl cyclohexene dioxy 3 4 : oxy: t a gas-based carboxylic acid ester, a bis(3 4 -epoxycyclohexanedicarboxylate, having an epoxy group, a propyloxy group, a methoxy group, a methoxy group, an epoxy group, etc. A well-known epoxy compound such as an anthracycline coupling agent, a cyclable resin or a two-shot epoxy resin, an oxy basic resin, an oxy-acid resin, and an isophthalic resin. Κ In the present invention, the total solid content of the active energy ray-reducing resin layer with respect to the resin layer is preferably 5 to 1% by mass of an active energy having an unsaturated double bond having a mass average molecular weight of 15,000 or more. The linear curable polymer compound contains 40% by mass or more of an active energy ray-curable polymer compound having an unsaturated double bond having a mass average molecular weight of 1,500 or more, and contains 8 for the total solid content of the resin layer. When the epoxy compound is more than 5% by mass, even if the conductive material precursor is not immediately peeled off from the conductive material precursor, the conductive material and the metal portion are separated, and the conductive material can be stabilized for a long time. It is more preferable to easily peel off such a conductive material. Moreover, it is more preferable to process the curved surface easily. 323512 13 201219204 = the total solid content of the living-hardening polymer compound having an unsaturated double bond having an average molecular weight of 15 or more with respect to the total solid content of the resin layer, ^ 3 having 5 〇 to 9 〇 mass % 'especially containing 60 to 70 quality%. Further, the emulsified hydrate is more preferably contained in an amount of from 1 Torr to 3 Å in terms of the total solid content of the resin layer: especially in the case of 3 and 15 to 25% by mass. By irradiating the conductive material with a small amount of the active energy ray and having the metal material and the easy-adhesion layer, the detachment can be more uniformly and easily peeled off. 1 JL 8g/米 '最宜为i The total solid content of the active energy ray-reducing resin layer of the conductive material precursor used in the present invention is preferably Q. lg / m 2 or more, and more preferably 0. 1 JL 8g / m 'optimally i Up to 5g/m2. The resin component contained in the active energy ray-reducing resin layer is preferably at least Q.2 g/m2 or more. The active energy ray-reducing resin layer of the conductive material precursor used in the present invention may contain an antistatic sword, a surfactant, a matting agent, a filler, a lubricant, and an ultraviolet absorber in addition to the above components. Wait. <Easy Adhesive Layer> The conductive material precursor used in the present invention has an easy-adhesion layer on the active energy ray-reducing-lowering resin layer. The easy-adhesion layer is preferably changed in shape by the method for producing the metal portion provided thereon. However, when the easy-to-adhere layer is provided, the active energy-line adhesion-reducing resin layer is not dissolved, and it is preferable to apply the water-based coating. The solution is applied. Hereinafter, the method of providing a metal portion on the easy-adhesion layer of the conductive material precursor in the present invention is preferably a method using a silver salt diffusion transfer method. First, a method of forming a preferred easy-adhesion layer and a metal portion for this method will be described. Further, the formation of the easy-adhesion layer and the metal portion is a silver salt expansion. In addition to the bulk transfer method, it is also preferable to use a screen printing method to print a conductive ink such as silver paste, or to form an electroless electric clock or the like. a method of forming a conductive layer made of a metal such as copper, or forming a conductive layer by vapor deposition or sputtering on an easy-adhesion layer, forming a photoresist film thereon, and performing exposure, development, etching, and removal of the photoresist layer. The method of obtaining the method or the like. The easy-adhesion layer should contain various polymer latexes. Among them, from the viewpoint of weather resistance, it is preferably an aqueous dispersion containing a polyester latex, an acrylic latex, and an amine phthalate latex, and further preferably an amine phthalate latex from the viewpoint of adhesion to various materials. Particularly preferred is a non-yellowing type amine phthalate polycarbonate latex having high weather resistance. The average particle size of the polymer latex is preferably from 0.01 to 0.3%, more preferably from 0.02 to 0.1/zm. Further, the polymer latex may be used by mixing a plurality of types of latex, but the polyester latex or the acrylic latex or the amine phthalate latex is preferably 30% by mass or more of the resin component in the easy-adhesion layer, more preferably 50% by mass or more. Further, the easy-adhesion layer preferably further contains a water-soluble polymer compound and an easy-adhesion layer which is crosslinked by a crosslinking agent. Examples of such a water-soluble polymer compound include polyacrylic acid, polypropylene decylamine, polyvinyl alcohol, polyvinylpyrrolidone, a copolymer of maleic anhydride and styrene, and the like, and examples thereof include gelatin and albumin. Proteins such as casein and polylysine, mucopolysaccharides such as carrageenan and hyaluronic acid, and the chemical reaction of polymers (Daheyuan believes in 1972, issued by Chemical Corporation). 6. Aminated cellulose, polyethyleneimine, polyallylamine, polydiallylamine, copolymer of allylamine and diallylamine, diallylamine and horse Copolymer of phthalic anhydride, copolymer of diallylamine and sulfur dioxide, 15 323512 201219204 copolymer, and the like. It is also preferred to use a protein among such water-soluble polymer compounds. The water-soluble polymer compound is preferably 60% by mass or less, more preferably 2 to 40% by mass, based on the resin component in the easy-adhesion layer. Further, when the amount of the resin component used in the easy-adhesion layer is 100 mg/m2 or more, no damage such as breakage occurs, and therefore, the upper limit is preferably 2,500 mg/m2. More preferably, it is 200 to 2000 mg/m2, and most preferably 300 to 1000 mg/m2. The crosslinking agent may also contain an inorganic compound such as chrome tanning, an aldehyde such as formaldehyde, glyoxal, malealdehyde or glutaraldehyde, an N-sulfenyl compound such as urea or ethylene urea, and a mucochloric acid. Acid), 2, 3-di-based-1,4-diastionic acid equivalent, 2, 4-dichloro-6-radio-s-three-till, or 2, 4- a compound having an active halogen of dihydroxy-6-chloro-three-till salt, divinyl sulfone, divinyl ketone, or N, N, N-tripropylene decyl hexahydrotrin, having two or more active members a compound of a vinylimine group having two or more epoxy groups in a molecule, such as sorbitol polyepoxypropyl ether or polyglycerol polyepoxypropyl ether, diglycerol polyepoxypropyl group Ether, glycerol polyepoxypropyl ether, polyethylene glycol diepoxypropyl ether, polypropylene glycol diglycidyl ether, etc., or other "chemical reactions of polymers" (Daheyuan believes in 1972, Chemistry A well-known polymer crosslinking agent such as a crosslinking agent described in Chapters 2.7, 5.2, and 9.3 of the company. Among them, a water-soluble crosslinking agent having two or more epoxy groups in the molecule or a vinyl-based crosslinking agent is preferred. The vinyl anthracene crosslinking agent is a compound having at least two vinylsulfonyl groups in the molecule, and is a compound represented by the following formula I or the following formula. 16 323512 201219204 R1 q|^2= CH—S〇2—L1—CON—S〇2—CH~ CH2

In the formula I, L1 and L2 each represent a divalent linking group which may or may not be present. When present, it preferably represents a substituted alkyl group having 1 to 5 carbon atoms, an extended aryl group, an amine aryl group, an amine followed by a base oxygen, a sulfur, an imine group, etc., which may also be combined. . R1 represents a hydrogen atom, an alkyl group having 1 to 5 carbon atoms which may be substituted, and an aryl group such as benzene or naphthalene which may be substituted, and preferably a hydrogen atom.

(CH2=CHS〇2)mL

In the formulae, L is a group having at least one m-valent group via the group, and m is from 2 to 4. In the general formula, L is, for example, a 2- to 4-valent acyclic hydrocarbon group having 1 to 10 carbon atoms, a heterocyclic group having 5 or 6 members of a nitrogen atom, an oxygen atom and/or a sulfur atom, 5 or A cyclic hydrocarbon group of 6 members or a cyclic alkyl group having 7 to 10 carbon atoms. The acyclic hydrocarbon group is preferably an alkylene group having a carbon number of 1 to 8. Each of the groups represented by L may have a substituent or may be bonded to each other via a hetero atom (e.g., a nitrogen atom, an oxygen atom and/or a sulfur atom), a sulfhydryl group or an amine carbonate group. L-type may be substituted with one or more kinds of alkoxy groups having a carbon number of 1 to 4, such as a halogen atom or a halogen atom such as a chlorine atom or a desert atom. Specific examples of the compound of the above formula I are shown below, but are not limited thereto. 17 323512 201219204

(VS-1) (VS-2) (VS-3) (VS-4) (VS-5) (VS-6) (VS-7) Specific examples of the compound of the above formula II are shown below, but It is not limited to this. 18 323512 201219204

Gh2= chso2ch2· ghch2so2ch= ch2 OH (VS8)

CH2= CHSO2GH2· GH- GHGH2S〇2CH= CH2 OH OH gh2= ghso2ch2· ghgh2- ghgh2so2gh= ch2 OH OH (VS9) (VS10)

CH2= CHSO2GH2· CH- CH2COCH2GHGH2S〇2CH= CH2 (vsil) OH OH

Ch3 oh GH2= CHSO2CH2·CHCH2- C— CH2GHCH2S02CH= CH2 (VS12) OH CH2CHCH2S〇2CH=CH2 OH

GH2= GHSO2CH2· GHCH2O- GH2CHGH2S〇2GH= gh2 OH OH (VS13)

CH2= GHSO2CH2· CHGH2NH- CH2CHCH2S〇2GH= CH2 (V514) OH OH

CH2=CHS〇2CH2GH- OH

CHGH2S02CH=CH2 (VS15) OH

GH2==GHS〇2CH2-GH

OH CHCH2S02CH-CH2

OH (VS16) GH-CH2S02CH=CH2

The amount of the crosslinking agent to be added to the OH-adhesive layer is preferably from 1 to 20% by mass, more preferably from 3 to 15% by mass, based on the total of the resin component in the easy-to-adhere layer. 19 323512 201219204 The progress of the easy-adhesive layer may include a matting agent such as a dioxide dioxide, a slip agent, a pigment, a dye, an interface, a UV absorber, and the like. In the present invention, a metal clever method is provided on the easy-adhesion layer of the conductive material precursor. The best method is to use the (4) diffusion transfer method, and it is preferable to have a physical image nucleus in the middle 3. The physical imaging nucleus can be uniformly distributed in the easy-adhesion layer by the coating liquid contained in the easy-contact layer, or can be distributed by coating the liquid containing the physical imaging nucleus after the easy-adhesion layer is applied. On the surface of the basin. 8. The physical development nucleus used in the present invention may use a microparticle composed of a heavy metal or a sulphide (a particle size of 丨 to several tens (10), and a metal colloid such as gold or silver may be mixed, a water-soluble salt such as zinc or a metal sulfide of the compound, etc. The content of the physical image nucleus in the easy-adhesion layer is preferably about 11 to lOrng/m2. <Porous easy-adhesion layer> In the present invention, a method of providing a metal portion on the easy-adhesion layer of the conductive material precursor may be a method using a conductive or ink such as an inkjet method (four) nano silver ink. It is preferably a porous easy-adhesive layer composed of fine particles and a resin=agent. Further, it may have a porous layer composed of fine particles and a resin binder, which is easily composed as a main component. The interparticle (4) bonding layer is a layer containing fine particles and a resin binder with respect to micro-mass or less by mass%. The microparticles of strontium carbonate used are known as the particles. For example, light carbon _, heavy Bow, rabbit, strong, strong, Talc, sulfuric acid, barium sulfate, dioxygen 323512 20 201219204 titanium, oxidation, sulfuric acid, zinc carbonate, satin white (satinwhit0, aluminum citrate, diatomaceous earth, calcium citrate, magnesium citrate, amorphous Synthesis of inorganic fine particles such as bismuth hydride, colloidal cerium oxide, alumina, colloidal alumina, alumina hydrate, lith〇P〇ne, zeolite, hydrated halloysite, magnesium hydroxide, etc. , acrylic or methacrylic resin, vaporized vinyl resin, vinyl acetate resin, polyester resin, styrene/acrylic resin, styrene/butadiene resin, styrene/isoprene Resin, decyl methacrylate/mercapto butyl acrylate resin, polycarbonate resin, polyoxyn resin, urea resin, melamine resin, epoxy resin, phenol resin, diene Propyl decanoic acid = true spherical or non-porous non-porous or porous organic fine particles composed of at least one resin such as a resin, etc. Of course, it is also possible to mix the above-mentioned inorganic fine particles and ruthenium Above organic particles In the above, it is preferable to use inorganic fine particles from the viewpoint of absorption, and it is more preferable to be an enamel carbonate dance, "carbon_, carbon_, kaolin, talc, amorphous" synthetic cerium oxide, aluminum oxide, aluminum oxide. The hydrate is particularly preferably amorphous: dioxane, oxidized, oxidized, and preferably oxidized. The average particle size of the inorganic particles is preferably 4 5G (10) or less, more preferably 3 to 4 〇 nm, the average secondary particle diameter of the inorganic fine particles is preferably 5 〇〇 以 下 下 下 下 下 更 。 。 。 。 。 。 。 。 。 。 氧化 氧化 氧化 氧化 氧化 氧化 氧化 氧化 氧化 氧化 氧化 氧化 氧化 氧化 氧化 氧化 氧化Further, here, the average-subgranular (four) microparticles of the present invention are observed by electron microscopy, and the average particle diameter is determined as the lightness of the circle equal to the area of the MHHH having a certain area of a certain area. In addition, the average secondary particle size can be obtained by photographing 323512 21 201219204 type electron microscope, but it is easy to use a laser scattering type particle size distribution meter (for example, LA 910, manufactured by Horiba, Ltd.). Intermediate diameter. The content of the fine particles in the easy-adhesion layer is preferably from 5 to 2 g/m2, more preferably from 2 to 15 g/m2. Examples of the resin binder which can be used together with the fine particles constituting the porous easy-adhesion layer include various modified polyvinyl alcohols such as polyvinyl alcohol, decyl alcohol-modified polyvinyl alcohol, and fluorenyl-modified polyethylene, and oxidized starch. Further, a cellulose derivative such as a phosphatide powder, a carboxymethyl cellulose or a hydroxyethyl cellulose, and a protein such as casein, gelatin or soy protein, a styrene-butadiene copolymer, methyl propyl _ Functionally modified polymer latex, melamine resin, urea obtained from a conjugated di-copolymer latex such as a dimethyl-butadiene copolymer or a functional group-containing monomer of such a polymer An aqueous adhesive such as a thermosetting synthetic resin such as a resin, polymethyl methacrylate, melamine, unsaturated polyester, and vinyl chloride -

The range is particularly preferably in the range of 10 to 40% by mass.

邑围. Coating amount of resin binder 2 323512 22 201219204 . In the porous easy-to-attach layer of the present invention, the above-mentioned tree ruthenium binder and a hardener as needed may be used together. Specific examples of the hardener are acid compounds of decanoic acid, glutaraldehyde, ketone compounds of diethyl hydrazine, gas pentanedione, bis(2-chloroethyl) urea, 2-hydroxy-4,6-dichloro -1,3,5-three-plowing, a reactive self-priming compound described in U.S. Patent No. 3,288,775, a compound having a reactive olefin as described in U.S. Patent No. 3,536,718, and a compound of the U.S. Patent No. 316 U.S. Patent No. 3,103,437, the disclosure of which is incorporated herein by reference in its entirety, U.S. Patent No. 3, the entire disclosure of U.S. Patent No. 3, s. An amine compound, and an epoxy compound described in Japanese Patent No. 3 (10) 1537, such as Erqi 2 of the second recording; bio-, boron; ε), an acid crosslinking agent of a caustic acid or a rotten acid salt, These may be used alone or in combination of two or more. The amount of the hardener used in the present invention is not particularly limited, but it is preferably less than or equal to the mass of the resin binder, and is preferably less than or equal to the mass of the resin binder. 〇% by mass or less, particularly preferably 1 to 30% by mass. <Fixed Easy Adhesive Layer> The resin is preferably a resin of 65 mass% or more, preferably a resin of a quality of more than 25% by weight. In the resin, a kind of water can be planted, and the various organic solvents are soluble in the molecular emulsion to form a repudiation resin. The fixed easy-to-layer layer formed by forming a tree layer can also be formed on the porous layer, and the fixed easy-to-attach layer can have numerous fine pores. The water-soluble polymer compound of the solid-adhesive layer can be widely used 323512 23 201219204. Water-soluble cellulose such as methyl cellulose, ethyl cellulose, and two-base cellulose, gelatin, acid-treated gelatin, and treatment Gelatin such as gelatin and enzymatic gelatin, polyvinyl alcohol, stanol modified polyvinyl alcohol, dibenzopyrene propylene with amine modified polyethylene glycol and other polyethylene glycols, carrageenan, gum arabic, etc. . The water-soluble polymer compound to be used may be used in an i type or more. The mass average molecular number of the water-soluble polymer compound is preferably 15 or more, more preferably 5 Å or more. When a water-soluble m compound is used, it is preferred to contain water in an ink or a slurry containing metal ultrafine particles. The polymer latex used in the fixed easy-adhesion layer can be widely selected and self-dispersed with acrylic resin, styrene-acrylic resin, ethyl acetate resin, ethylene-acetic acid, ethylene glycol, polyethylene Olefin resin, chlorinated polyolefin resin, ethylene vinegar-acrylic acid and other multi-resin, SBR, occupation, occupation, enemy sbr, rebel foot, bismuth bismuth, ethylene-based t-resin, gas ethoxy resin, partial An emulsion of a conventionally known resin such as a vinyl chloride resin, an amine phthalate resin, a mercapto acrylic resin, a methyl methacrylate resin, or an epoxy resin. The organic solvent-soluble resin used in the fixed easy-adhesion layer can widely use the resin contained in the emulsion contained in the upper and lower layers. Further, a polystyrene resin, a polyacetal resin, a nylon resin or the like can also be used. Organic solvent A solvent which can dissolve a resin to be used, such as ethanol, ethyl acetate, mercaptoethyl ketone or toluene, can be widely used. The organic solvent-soluble resin to be used may be used in one type or in combination of two or more types. The mass average molecular weight of the organic solvent-soluble resin is preferably 15 Å or more. In this way, various kinds of leaking resins can be used in the layer, but 24 323512 201219204 is easy to use, and is preferably a water-soluble polymer compound or a polymer latex, from the viewpoint of adhesion, a water-soluble polymer compound. More preferably polyvinyl alcohol, gelatin, polysaccharide, polymer latex is more preferably acrylic resin, styrene-acrylic resin, vinyl acetate-acrylic resin, ethylene-vinyl chloride resin, with acrylic or vinyl A monomer unit resin having an amine phthalate-bonded amine phthalate resin. To the water-soluble polymer compound, the polymer latex, and the organic solvent-soluble resin, water, an organic solvent, a leveling agent, a surfactant, and the like are added, and the like is adjusted to form a fixed adhesive layer containing a resin as a main component. Apply liquid. The solid content of the adhesive layer is preferably from 0.01 to 5 g/m2, more preferably from 0.05 to lg/m2, and less than 0.1 g/m2, sometimes the adhesion of the metal portion is insufficient. When it exceeds 5 g/m2, the ink absorbability of the porous easy-adhesion layer may be lowered. In the present invention, a metal portion is provided on the upper surface of the easy-adhesion layer of the conductive material precursor, and a metal foil such as a copper foil is attached, and a photoresist film is further formed thereon to expose, develop, etch, and remove light. In the case of a barrier layer, a known epoxy adhesive, an amine phthalate adhesive, an ultraviolet curable adhesive, a hot melt adhesive such as EVA or acrylic can be used as the easy-adhesion layer. In the present invention, a method of forming a metal portion on the upper layer of the conductive material precursor can be used: a method using a silver salt photosensitive material; using the same method, electroless plating is further performed on the obtained silver image or a method of electrolytic plating; a method of printing a conductive ink such as a silver paste by a screen printing method; a method of printing a conductive ink such as a silver ink by an inkjet method; and forming a metal consisting of a metal plating method without 25 323512 201219204 Conductive method is formed on the easy-adhesion layer by evaporation or sputtering; or photoresist film, exposure, development, _, removal of photoresist layer = upper formation: upper: _ book's step-by-step formation of photoresist Membrane::: Method: Image, _, method of removing the photoresist layer, etc. It is known that the thickness of the metal part to be produced can be thinned, and the silver of the extremely fine metal part can be easily obtained in the step-by-step manner. * The method for producing the metal portion of the easy-to-distribute transfer method can be, for example, a method proposed in Japanese Patent Publication No. 2003-77350. <Active Energy Ray Irradiation Step> The conductive material of the present invention irradiates the conductive material precursor with an active entanglement line to crosslink the active energy ray-reducing resin layer, thereby reducing the adhesion of the support body and the active energy ray. The adhesion of the resin layer is produced by peeling off a conductive material containing at least an easy-contact layer and a metal portion from the support. Visible light rays, ultraviolet rays (uv), and electron beams (EB) can be used as the active energy ray system. However, from the viewpoint of safety, it is preferred to use visible light or ultraviolet light. When using visible light or ultraviolet light, the light source should be used, for example, low-pressure mercury, medium-pressure mercury lamp, high-pressure mercury lamp, ultra-high pressure mercury lamp, mercury lamp, gas, recording lamp, metal halide lamp, quartz halogen lamp, tungsten lamp, ultraviolet light. It is in the mountains and has a 'Xenon arc lamp, an electrodeless microwave mode UV lamp, and the like. The irradiation of the active energy and the line is preferably prevented from being caused by the metal portion, and is preferably irradiated from the side of the support of the conductive material precursor. The amount of light to be irradiated is preferably from the photopolymerization initiator to the sensitization, but is 50 to 5000 mJ/cm2. Further, the peeling of the separation step after the irradiation of the active energy ray is facilitated so as not to cause the surface temperature of the conductive material precursor to be 100 ° C or higher, and it is preferable to prevent exposure to 60 ° C or higher. Further, the irradiation of the active energy ray may be either before or after the bonding step of the protective film described later, but it is preferably before the bonding step of the protective film. As described above, according to the active energy ray irradiation step of the present invention, the adhesion force when the conductive material containing the metal portion and the easy-adhesion layer is peeled off from the conductive material precursor changes. 001至0. lN/25毫米。 In the present invention, the adhesion between the support and the conductive material is preferably 0. 5N / 25mm or less, more preferably 0. 001 to 0. lN / 25mm. Further, the adhesion force between the support and the conductive material before the active energy ray irradiation is preferably more than 0.5 N / 25 mm, more preferably 1 N / 25 mm or more. <Peeling Step> In the present invention, the conductive material containing the easy-to-adhere layer and the metal portion is peeled off from the conductive material precursor irradiated with the active energy ray. Thus, in one of the objects of the present invention, it is possible to produce a conductive material which has high rigidity during production and which has a low rigidity when the support is peeled off. The conductive material of the present invention is peeled off from the support as described above, and the rigidity is relatively lowered. Therefore, it sometimes curls when peeled off, or sometimes it is difficult to handle. In order to prevent this, it is preferable to adhere the protective film to the metal portion side of the conductive material precursor before peeling off, and the conductive material is peeled off together with the protective film. A protective film may be used, and a commercially available one having an ethylene-vinyl acetate copolymer layer or an acrylic adhesive layer is provided on a support having low rigidity composed of polyethylene, polypropylene, polyvinyl chloride or the like, but is bonded to The adhesion of the conductive material precursor must be stronger than when the conductive material containing the metal portion and the easy-to-adhere layer is peeled off from the support of the conductive material precursor, and the film is called a film. Because the right squat is too strong, it is difficult to peel off from the conductive material. The adhesion of the good film is changed according to the active energy line adhesion layer, but it is better to choose G genus to Q. , the leader. Examples of the commercially available product of such a preferred protective film include, for example, pyien DCQ42 manufactured by Yokohama, K.K., and E2G35 manufactured by Sumiron, Ε203, E~C625, 622, and 650 manufactured by Sekisui Chemical Industry Co., Ltd. The thickness of the protective film is 30 to h. In order to bond the protective film to the conductive material precursor A, a well-known layering method such as a d-layer or a heating layer is used. In particular, it is a shadow of thermal expansion in a resin portion such as a genus genus and an easy-to-attach layer, and it is preferable to enter the (four) layer at a normal temperature of 60 ° C or less. a When the protective film is used, the conductive material may be removed from the support together with the second, and then the protective film may be peeled off from the conductive material. The peeling film of the film can also be sheet-fed from the conductive material, or it can be rolled to a light-discriminating conductive material in accordance with the (four) film, or the conductive material can be taken off while peeling off the protective film. The protective film is peeled off from the conductive material. For example, if the material is placed, the conductive material is attached to the protective film or the like, or the protective film can be directly peeled off from the conductive material. (Example) The examples of this and the month are shown below. Also, the percentage stated in the record is a quality basis only if there is no special statement. (Example 1) As for the branch body, the product name Tetoron HLY which is easy to be processed on the one side of the Teijin DuPont (thickness 1 〇〇 #mpET, total light transmittance (10), single-sided easy to follow m stomach The body-surface-effect water-based treatment, another unprocessed surface of 323512 28 201219204, which is untreated, was prepared and coated with the active energy enthalpy of the following prescription, and the reduced-reducing resin layer coating liquid 1 'dryed at 701 for 5 minutes. . The thickness of the active energy ray-reducing-reducing resin layer was calculated by measuring the thickness of the Tetoron HLY film before and after the formation of the active energy ray-reducing resin layer. This result is shown in Table 1. _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Product name "Irgacure 819" (Ciba-Geigy photopolymerization initiator) 0.29g Trade name "S-Lec KS1" (Polyvinyl acetal manufactured by Sekisui Chemical Co., Ltd. Mass average molecular weight 27000. Tg = 107 °C) 0.8g Product name "Denacol EX 512" (Nagase ChemteX epoxy crosslinking agent) 0. lg Then 'a palladium sulfide sol solution was prepared as follows. <Preparation of palladium sulphide sol> A liquid chlorination 5 g hydrochloric acid 40 ml steamed crane water 1000 ml B liquid sodium sulfide 8. 6 g steamed crane water 1000 ml While stirring the liquid A and the B liquid, the column is filled with ion exchange resin after 30 minutes. A palladium sulfide sol is obtained. Then, the easy-adhesive layer coating liquid 1 was prepared by the following formulation, and was applied to a layer 29 of the performance-type line adhesion-reducing resin layer, and dried at 5 ° C for 10 minutes. After drying, it was heat-treated at 50 ° C for 24 hours. <Easy to apply layer 1 solution per lm2> Product name "Hydran WLS 210" (DIC polycarbonate amide phthalate latex, 300mg 50rag lmg 9mg 4mg 0. 4mg Average particle size 0. 05/zm, solid Product name "Nonion OT 221" (Non-ion OT 221) (trade name: "EX 313" (Nagase chemteX epoxy curing agent) Trade name "Hymicron L271" (Zhongjing Grease slip agent) Palladium Sol (Palladium Sulfide) The thickness of the easily-adhesive layer obtained by measuring a confocal microscope (manufactured by Lasertec) under the trade name "Optelics C120" was 〇. Then, from the vicinity of the support, the intermediate layer i having the following composition, the silver halide emulsion layer 1, and the outermost layer 1 are sequentially applied to the above-mentioned easy-adhesion layer. Further, the back coat layer 1 was applied on the side opposite to the side of the active energy ray-reducing resin layer of the support. The silver halide emulsion is produced by a general dual jet mixing process for photographic silver halide emulsions. The S-silver emulsion was prepared by a silver chloride 95 mol% and a silver bromide 5 mol% to have an average particle diameter of 〇·15 vm. The solubilized silver emulsion obtained in this manner is subjected to gold sulfur sensitization using sodium thiosulfate and gasified gold acid according to a usual method. The toothed silver emulsion obtained in this manner contains 〇. 5 g of gelatin per lg of silver. <intermediate layer 1 composition / per lm2> gelatin 0.5g surfactant (S-1, having the following chemical formula) 5mg 30 323512 201219204 <silver halide emulsion layer 1 composition / per lm2> gelatin silver halide emulsion equivalent to 3. Og Silver 1-phenyl-5-hydrothiotetrazole surfactant (S-1, with the following chemical formula) <outermost layer 1 composition per lm2> gelatin amorphous amorphous cerium oxide matting agent (average particle size 3. 5 # m) Surfactant (S-1, with the following chemical formula) <Backcoat 1 composition / per lm2> Gelatin amorphous cerium oxide matting agent (average particle size 5 / / m) Dye 1 (with The chemical formula) (S-1, having the following chemical formula) 〇.5g 3mg 20rag lg lOmg lOmg 2g 20mg 200mg 400mg

323512 201219204 Then, a close-packed printer with a mercury lamp as a light source, a resin filter film that intercepts the following light, and has a mesh pattern with a fine line width of 2 〇am and a grid spacing of 250 /zm and no pattern. The portion of the positive manuscript is densely exposed and exposed at an exposure of 2 meg j/cm 2 . Thereafter, after immersing in a diffusion transfer developing solution of the following composition at 15 C for 90 seconds, the silver halide emulsion layer 1, the intermediate layer, the outermost layer, and the back coat layer 1 were then subjected to 4 (TC). After the warm water was washed with water, it was dried to obtain a conductive material precursor 1. Thus, a metal portion having a fine line width of 2 Å and a lattice interval of 25 μm was formed on the easy-adhesion layer.

1/z米。 The thickness of the metal portion of the Ptelics C 120" was measured by a laser. <Diffusion transfer imaging liquid composition> 25g 18g 2g 80g 15g 1. 2g 虱 虱 醌 醌 -3- 笨 笨 -3- -3- -3- -3- -3- -3- -3- -3- -3- -3- -3- N N N N N N N N N N N N N N N 2。 The total amount of the liquid composition was added to 1000ml of water, adjusted to a pH of 12. 2 with a 85% by mass aqueous phosphoric acid solution. a For the obtained conductive material precursor 1, the active energy ray was irradiated, and the measurement of Clark rigidity and the measurement of the adhesion were carried out from the test. The Clark rigidity was measured in accordance with JIS-P8143. Measurement of the adhesion force 32 323512 201219204 The non-metallic part of the conductive material precursor 1 (corresponding to the portion of the positive-type penetrating original that has no pattern and the portion where the metal portion is not formed) is attached to the Masking Tape No 241 for Nichiban vehicles. It is cut to a width of 25 mm, and the product name "IPT 200-5N" made by imada is used as 180. The peeling method measures the adhesion. Also, it was visually observed where peeling occurred. The results are shown in Table 1. Further, in Table 1, in the case where the metal portion and the active energy ray-reducing-reducing resin layer were not peeled off at all, the metal portion or the active energy ray-reducing resin layer was observed to have a slight peeling of X.曰 照射 曰 m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m Active energy line of /cm2. Then, a product name C 625" (protective film having a thickness of 60/zm) manufactured by Sumir〇n (8) was bonded to the surface side of the next layer and the metal portion. In addition, the protective film is bonded to gold, and the active energy ray-reducing force of the resin layer before the dose line irradiation is not P (phase w is not in the pattern of the positive-type penetrating original, and the gold mouth is not formed ^ Divided into 25 mm wide, and the product name "IPT" made by Imada was used, and the adhesion force was measured as 〇5 ν by the Γ peeling method. The precursors of the conductive materials after the illuminating energy lines were examined as follows. The result is a non-metallic part that penetrates the precursor of the two electrical materials (corresponding to the part of the positive type which has no pattern, and the part which does not form a metal part) is attached to the Masking Tape No of 1C lban vehicle. π &amp; iapeNo241' is then cut into 25mm. See the trade name "IFr?nn π method, mesh, |α20〇-5Ν" made by Imada, and the peeling effect is 180 〇. The ancient 〖 生 里 里 线 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 Easy to follow the brand name of Sumiron (share) a support of the conductive material precursor 1 of 阢625" (6 〇vm thick § vine film), from which the metal body and the easy-adhesion layer and the active energy ray-reducing resin layer are electrically conductive The material is peeled off together with the protective film to obtain the conductive material 1. The protective film is peeled off from the conductive material 1, and the thickness of the metal portion is 7. 2 &quot; m, the thickness of the non-metal portion after the thickness is measured by a gauge. 7. 1 ym The Clarke rigidity of the conductive material 1 obtained as described above was measured in accordance with JIS-P8143. Further, a spherical surface test was carried out by the following method. The results are shown in Table 1. <Spherical follow-up test 〉 Using the trade name “L〇ctiteU_30 FL” (amine phthalate adhesive) manufactured by Henkel Japan Co., Ltd., the conductive material i is bonded to an acrylic ball having an outer diameter of 3 mm and 2 mm. After a minute, the protective film of the product name and C 625" was peeled off, and a conductive material such as wrinkles, cracks, and the like was obtained, and one having a good peeling surface was evaluated as 〇, and the conductive material was creased or broken. The evaluation is X. 〇c is also made to be high Before the active mercury lamp is irradiated by the mercury lamp, the conductive material precursor 1 is heated to the temperature of 1 day, and the heated conductive material is driven by the same as the unheated conductive material precursor i. After the irradiation of the active energy ray, the measurement of the adhesion force and the measurement of Clark and the peeling obtained by the 180 peeling method were evaluated. The results are shown in Table 1. (Example 2) The product name "S-Lec" was obtained. KS10" (Shuishui Chemical Industry flat acid resin, mass average molecular weight 17000 'containing 25 % hydroxyl group) 15 g dissolved in dioxapentane (Di〇x〇lane) to methyl ethyl _ In the solvent 85g', the product name "KarA〇! (2-hydroxypropenyl isocyanate made by Showa Electric Co., Ltd.) was added dropwise at a temperature of 40 °C, and H was given at 4{rc. Adding ethyl celecoxib to the obtained resin solution (et^

Cell〇S〇lve), a modified polyethylene secret resin solution having a solid concentration (10) was obtained. In addition to using the modified polyethylene secret resin solution Hitaloid 7975 prepared above (so that the coating solid content per lm 2 is the same), the pot residue system is the same as that of the actual shutdown 1 'making the conductive material bismuth 2 of Example 2 It is evaluated in the same way as Shiguan. The results are shown in Table i, where the material strength after the irradiation of the active energy ray was slightly higher, and the peeling property was slightly lowered, but the same results as in Example 1 were obtained. (Comparative Example 1) The coating solid content per lm2 was changed except that the product name "UA 340P" (manufactured by Shin-Nakamura Chemical Industry Co., Ltd. urethane acrylate vinegar oligomer mass average molecular weight 13 〇〇〇) was used instead of Hitaloid 7975. The same procedure as in Example 1 was carried out to prepare a conductive material precursor of a comparative example, which was to be evaluated. However, after the protective energy is applied to the active energy ray, the conductive material containing the metal portion and the easy-to-adhere layer and the active energy ray-reducing resin layer is peeled off from the support, but the protective film cannot be peeled off. 201219204 (Comparative Example 2) In this comparative example, a conductive material having a high Clarke rigidity was not able to form a fine metal portion on a curved surface. The conductive material precursors of the parent example 2 were prepared and evaluated in the same manner as in the example except that the active energy ray-reducing resin layer was not applied. In addition, in the spherical surface test system, there is no bonding step of the active energy ray irradiation step and the protective film, and the peeling step of the protective film, and the acrylic ball having an outer diameter of 3 mm and 2 mm is used as a trade name of Henkel Japan. "LoctHe u-3〇FL" (urethane binder) is bonded to the acrylic ball by a support body surface to which a conductive material is bonded. The results are shown in Table 1. (Comparative Example 3) The same procedure as in Example 1 was carried out, except that the physical development core coating liquid of the following formulation was applied to the active energy ray-reducing-reducing resin layer instead of the easy-adhesion layer of Example 1. The precursor of the conductive material of Comparative Example 3 was prepared and evaluated. However, in the stripping step, the conductive material cannot be smoothly produced, and the conductive material is broken in the middle. The items that can be evaluated are shown in Table 1. <Physical development nuclear coating solution 1 per Irn2> Trade name "Nonion OT221" (Nippon oil nonionic surfactant) 1 mg The palladium sulfide sol (palladium sulfide) used in Example 1 Q 4 (Example 3 In the first embodiment, the same procedure as in the first embodiment was carried out except that the active energy ray-reducing resin layer coating liquid 2 was used instead of the active energy ray-reducing-reducing resin layer 323512 36 201219204 coating liquid 1 . The conductive material precursor 3 of Example 3 was produced and evaluated in the same manner as in Example 1. The results are shown in Table 1. <Active energy line adhesion reducing type resin layer coating liquid 2 prescription per lm2> Product name "Hitaloid 7975" (Hitachi Chemical Industry Acrylic Acrylic vinegar resin solution. Mass average molecular weight 50000. Solid content) &amp; 〇8g Trade name " Irgacure 819" (Ciba-Geigy photopolymerization initiator) 〇. 23g Trade name "S-Lec KS1" (Polyvinyl acetal manufactured by Sekisui Chemical Co., Ltd. Mass average molecular weight 27000. Tg = 107 °C) 〇. 91g Trade name "Denacol EX 512" (epoxy cross-linking agent manufactured by Nagase ChemteX) 1. 82g Trade name "San-aidSI-60L" (Sanshin Chemical Industry Co., Ltd. cation polymerization 〇. 063g initiator) (Example 4) In the first embodiment, the same procedure as in Example 1 was carried out except that the active energy ray-reducing-reducing resin layer coating liquid 3 was used instead of the active energy ray-reducing-reducing resin layer coating liquid 1. The conductive material precursor 4 of 4 was evaluated in the same manner as in Example 1. The results are shown in Table 1. <Active energy line adhesion reducing type resin layer coating liquid 3 prescription per lm2> Product name "Hitaloid 7975" (Hitachi Chemical Co., Ltd. acrylic acrylate resin solution. Mass average molecular weight 50000. Solid content) n 2. 67〇 Trade name "Irgacure 819" (Ciba-Geigy photopolymerization initiator) 〇 trade name rS-Lec KS1" (polyvinyl acetal produced by Sekisui Chemical Co., Ltd. mass average g 323512 37 201219204 molecular weight 27 〇〇〇. Tg = l〇7 °C) Trade name "Denacol EX 512" Trade name "San-aidSI-60L" starter) (Example 5) 0. 40g (Nagase ChemteX epoxy crosslinker) 0· 80g (Second Chemical Industry ( 0) g28g The same procedure as in Example 2 was carried out to obtain a modified poly-j resin solution having a solid concentration of 1% by weight. In addition to using the modified polyethylene stalked tree, 乂 replaced Hitaloid 7975 (The conductive solid material of Example 5 was produced in the same manner as in Example 4 except that the coating solid content per 1 m 2 was the same), and the same was evaluated in the same manner as in Example 1. The results are shown in the table. 1 in. after irradiation with active energy rays The adhesion was slightly higher, and the peeling property was slightly lowered'. However, the same results as in Example 4 were obtained. (Comparative Example 4) An amine phthalate acrylate oligomer was produced under the trade name "UA 340P" (New Nakamura Chemical Industry Co., Ltd.) The mass average molecular weight of 13 〇〇〇) was substituted for Hital 〇ld 7975 (the coating solid content per y was the same), and the conductive material precursor of Comparative Example 4 was prepared in the same manner as in Example 4. However, after the protective energy is applied to the active energy ray, the conductive material having the metal layer and the adhesive layer and the active energy ray adhesion-reducing resin layer is peeled off together with the protective film, but the peeling is not possible. (Comparative Example 5) Except for the use of the trade name "A-DPH" (manufactured by Shin-Nakamura Chemical Industry Co., Ltd.), the mass average molecular weight of 578 was substituted for Hital〇id 38 323512 201219204 7975 (for every 1 The coating solid content of m2 was the same), and the conductive material precursor of Comparative Example 5 was prepared in the same manner as in Example 4, and was evaluated. However, the active energy ray was irradiated and the protective film was attached. (Example 6) In addition to the production of the active energy ray-reducing-reducing resin layer coating liquid 4 in place of the active energy ray-reducing-resistance-reducing resin layer coating liquid 3, the following methods are used. In the same manner as in Example 4, the conductive material precursor 6 of Example 6 was produced and evaluated in the same manner as in Example 1. The results are shown in Table j. <Reactive energy ray-reducing-reducing resin layer coating liquid 4 prescription/per 1 m2〉 Product name "Hitaloid 7975" (Yinli Chemical Industry Acrylic Acrylic Resin Solution). The mass average molecular weight is 50,000. Solid product) 2 Product name "Irgacure 819" (Ciba-Geigy photopolymerization initiator) 〇. 1 (^ Product name "S-Lec KS1" (Polyvinyl acetal manufactured by Sekisui Chemical Co., Ltd.. Mass average molecular weight 27000. Tg =107 C) 〇88g Trade name "Denacol EX 512" (Nagase ChemteX epoxy cross-linking agent) 〇· 32g Trade name "San-aidSI-60L" (Sanshin Chemical Industry Co., Ltd.)剂 〇 g g g g g g g 实施 g g g g g g g g g g g g g g g g g g 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施'Preparation of the conductive material of Example 7 before 323512 39 201219204 Drive 7' was ashamed in the same manner as in Example 1. The results are shown in the table 活性 <Active energy line adhesion reducing type resin layer coating liquid 5 prescription / per... Product name "HitalQid 7975" (Hybrid acrylic acid acrylic resin solution manufactured by Hitachi Chemical Co., Ltd. Mass average molecular weight 50000. Solid content) 2 Product name "irgacure 819" Coffee core photopolymerization initiator) 〇.· = Trade name "S-Lec KS1" (Polyethylene acid produced by Sekisui Chemical Industry. The average molecular weight of f is 27,000. Tg = l〇7 °C) Λ 0. 8〇g Trade name "Denacol EX 512" (Nagase ChemteX epoxy crosslinker) 0. 40g (thermal) cationic polymerization 0. 014g trade name "San-aidSI-60L" (Sanshin Chemical Initiator) (Example 8) In addition to the production of the following active energy line adhesion reducing resin The conductive material precursor 8 of Example 8 was produced in the same manner as in Example 4 except that the layer coating liquid 6 was used instead of the active energy ray-reducing resin layer coating liquid 3, and evaluated in the same manner as in Example 1. The results are shown in Table i, <Reactive Energy Line Adhesion Reduced Resin Layer Coating Solution 6 per lm2> Product Name "Hitaloid 7975" (Hitachi Chemical Co., Ltd. Acrylic acrylate resin solution. Mass average molecular weight 50000. Solid content 2 68g Product name "Irgacure 819" (Ciba-Geigy photopolymerization initiator) 〇. 1〇g Trade name "S-Lec KS1" (Polyvinyl acetal produced by Sekisui Chemical Industry Co., Ltd. mass average 0. 60g Molecular weight 27000 Tg=107°C) 323512 40 201219204 Product name "Denacol EX 512" (Nagase ChemteX epoxy cross-linking agent) 0. 60g Trade name "San-aidSI-6GL" (Sanshin Chemical Industry Co., Ltd. thermo-cationic poly-starter) 0.021g ( [Example 9] Example 9 was produced in the same manner as in Example 4 except that the active energy ray-reducing-reducing resin layer coating liquid 7 was used instead of the active energy ray-reducing-reducing resin layer coating liquid 3. The conductive material precursor 9 was evaluated in the same manner as in Example 1. The results are represented in the table work. <Active energy line adhesion reducing resin layer coating solution 7 per lm2> Product name "Hitaloid 7975" (Hitachi Chemical Co., Ltd. acrylic acrylate resin solution. Mass average molecular weight 5 〇〇〇〇. Solid content), Ίδτ 〇 〇7g mouth name "Irgacure 819" (Ciba-Geigy luminescence polymerization initiator) 〇 trade name "S-Lec KS1" (polyethylene acetal produced by Sekisui Chemical Industry Co., Ltd. mass flat g molecular weight 27000. Tg = 107t:) Λ = 龙〇. 2〇g Product name "Dermcol EX 512" (Nagase ChemteX epoxy cross-linking agent) Long 1.0〇g Trade name "San-aidSI-60L" (Sanshin Chemical Industry Co., Ltd.) Initiator) 1 in 1 ηλ °* 〇35g l Example 10) δ In addition to the production of the active energy ray-reducing resin layer coating liquid 8 instead of the active energy ray-reducing resin layer coating liquid 3 In the same manner as in Example 4, the conductive material of Example 1 was produced; 323512 41 201219204 The drive 10 was evaluated in the same manner as in Example 1. The results are shown in Table 1. 活性<Active energy line adhesion reducing resin layer coating solution 8 per lm2> Product name "Hitaloid 7975" (Hitachi Chemical Industry Co., Ltd. Acryl acrylate resin solution. Mass average molecular weight 50000 2.6〇g Product name "Irgacure 819" photopolymerization initiator) 〇1〇g Trade name "S-Lec KS1" (Polyvinyl acetal produced by Sekisui Chemical Co., Ltd.. Mass average molecular weight 27000 °Tg=107° C) 〇〇6g Product name "Denacol EX 512" (Nagase ChemteX epoxy cross-linking agent) 1. 20g Trade name "San-aidSI-60L" (Sanshin Chemical Industry Co., Ltd. thermo-cationic polymerization initiator) 2. 042g (Example 11) The same procedure as in Example 4 was carried out except that the active energy ray-reducing-reducing resin layer coating liquid 9 was used instead of the active energy ray-reducing-reducing resin layer coating liquid 3. The conductive material precursor 11 of Example 11 was evaluated in the same manner as in Example 1. The results are shown in Table i. <Active energy line adhesion reducing resin layer coating solution 9 per lm2> Product name "Hitaloid 7975" (Hitachi Chemical Co., Ltd. acrylic acrylate resin solution. Mass average molecular weight 50000. Solid content) 2. 69g Product name "Irgacure 819" (Ciba-Geigy photopolymerization initiator) 〇. i〇g trade name "S-Lec KS1" (polyvinyl acetal produced by Sekisui Chemical Co., Ltd. mass average molecular weight 27000 °Tg = 107 °C) 〇.qs 〇· 42 323512 201219204 Trade name: Denacol EX 512" (Nagase ChemteX ring gas cross-linking agent) 0· 25g Trade name "San-aidSI-60L" (Sanshin Chemical Industry Co., Ltd.) Thermal cationic polymerization initiator (9) In the same manner as in Example 4 except that the active energy ray-reducing-reducing resin layer coating liquid 10 was used instead of the active energy ray-reducing-reducing resin layer coating liquid 3, the production was carried out in the same manner as in Example 4. The conductive material precursor 12 of Example 12 was evaluated in the same manner as in Example 1. The results are shown in Table i. <Active energy line adhesion reducing resin layer coating solution 1 / per lm2> Product name "Hitaloid 7975" (Hitachi Chemical Co., Ltd. acrylic acrylate resin solution. Mass average molecular weight 50000. Solid content) 2 4〇g Trade name "Irgacure 819" (Ciba-Geigy photopolymerization initiator) 〇. 10g Trade name "S-Lec KS1" (Polysulfate acid produced by Sekisui Chemical Industry Co., Ltd. mass average molecular weight 27000 〇Tg=107°C) 〇67g Product name "Denacol EX 512" (Nagase ChemteX epoxy cross-linking agent) 〇.80g Trade name "San-aidSI-60L" (Sanshin Chemical Industry Co., Ltd.) Thermal cationic polymerization

Starting agent) 0. 028gQ (Example 13) The same procedure as in Example 4 except that the active energy ray-reducing-reducing resin layer coating liquid 11 was used instead of the active energy ray-reducing-reducing resin layer coating liquid 3 In the same way, the conductive material of Example 13 was fabricated before 323512 43 201219204, and 13 was evaluated in the same manner as the real 丨. The knot is shown in the middle of the 〇 <Active energy line adhesion reducing resin layer coating solution η prescription per lm2> Product name "Hitaloid 7975" (Hitachi Chemical Industry Acrylic Acrylic vinegar resin solution. Mass average molecular weight 50000. Solid content 2 〇〇§ Trade name "Irgacure 819" (Ciba-Geigy photopolymerization initiator) 〇. 1〇g Trade name "S-Lec KS1" (Polyvinyl acetal manufactured by Sekisui Chemical Co., Ltd.) Mass average molecular weight 27,000. Tg=107°C) ! Λ7 1· 07g Product name "Denacol EX 512" (Nagase ChemteX epoxy cross-linking agent) 0.80g Trade name "San-aidSI-60L" (Sanshin Chemical Industry Co., Ltd.) Polymerization 0. 028 g of the initiator (Example 14) The following examples and examples were carried out except that the active energy ray-reducing resin layer coating liquid 12 was used instead of the active energy ray-reducing resin layer coating liquid 3; 4 In the same manner, the conductive material precursor 14' of the example μ was produced and evaluated in the same manner as in the first embodiment. The results are shown in Table i. <Active energy line adhesion reducing type resin layer coating liquid 12 prescription per lm2> Product name "Hitaloid 7975" (Hitachi Chemical Industry Acrylic Acrylic Acetate Resin Solution. Mass average molecular weight 50000. Solid content) i 6()g Product name "Irgacure 819" (Ciba-Geigy photopolymerization initiator) 〇1〇g Trade name "S-Lec KS1" (Shoushui Chemical Industry Polyethylene succinic acid. Mass average 1.47g Molecular weight 27000. Tg=107 °C) 323512 44 201219204 Trade name "Denacol EX 512" (Nagase ChemteX epoxy crosslinker) 0. 80g Trade name "San-aidSI-60L" (Sanshin Chemical Industry Co., Ltd.) Thermal cationic polymerization initiator (Example 15) 0.028 g In the same manner as in Example 4 except that the active energy ray-reducing-reducing resin layer coating liquid 13 was used instead of the active energy ray-reducing-reducing resin layer coating liquid 3, the production was carried out. The conductive material precursor 15 of Example 15 was evaluated in the same manner as in Example 1. The results are shown in Table 1. <Reactive energy line adhesion reducing resin layer coating liquid 13 prescription per lm2> Product name "Hitaloid 7975" (Hitachi Chemical Co., Ltd. acrylic acrylate resin solution. Mass average molecular weight 50000. Solid content) 丨57g Trade name "Irgacure 819 (Ciba-Geigy photopolymerization initiator) 〇1〇g Trade name "S-Lec KS1" (Polyvinyl acetal manufactured by Sekisui Chemical Co., Ltd. Mass average molecular weight 27000 °Tg = 107 °C) 2 〇〇g "Denacol EX 512" (Nagase ChemteX epoxy cross-linking agent) 〇. 8〇g Trade name "San-aidSI-60L" (Sanshin Chemical Industry Co., Ltd. cation polymerization 〇. 〇28g initiator) (Example 16) Example 16 was produced in the same manner as in Example 4 except that the active energy ray-reducing-reducing resin layer coating liquid 14 was used instead of the active energy ray-reducing-reducing resin layer coating liquid 4. The conductive material was evaluated in the same manner as in Example 1 in the first 45 323512 201219204. Make the result 矣 - in.衣 Μ 〈 〈 〈 〈 〈 〈 〈 〈 〈 〈 〈 〈 〈 〈 〈 〈 〈 〈 〈 〈 〈 〈 〈 〈 〈 〈 〈 〈 〈 〈 〈 〈 〈 〈 〈 〈 〈 "Irgacure 819" (Ciba-Geigy photopolymerization initiator) 〇'g trade name "S-Lec KS1" (Polyvinyl acetal produced by Sekisui Chemical Co., Ltd.. Quality flat 1〇g 〇. 40g Molecular weight 27000. Tg=107t ) Product name "Denacol EX 512" (epoxy cross-linking agent manufactured by Nagase ChemteX) 〇·8lg (Example 17) Nitric acid (2.5 parts) and alumina hydrate (average primary particle size 15nm) were added to water. An inorganic fine particle dispersion having a solid concentration of 30% by mass was obtained using a zea-type disperser. The average secondary particle diameter of the alumina hydrate dispersed in the inorganic fine particle knife solution was 16 〇 nm. Using the inorganic fine particle dispersion liquid, a porous easy-adhesive layer coating liquid 2 having the following composition was produced. _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The ionic surfactant (polyoxyethylene alkyl ether) 〇.3g was adjusted to a solid content concentration of 16% by mass with water. 46 323512 201219204 In the same manner as in the first embodiment, the active energy ray-reducing resin layer coating liquid enamel is applied to the support in the same I as in the example j, and the porous easy-adhesion layer coating liquid 2 is applied thereon. The solid content of the alumina hydrate was 7. 5 g/m, and it was coated by a slide bead method, and dried by a dryer. The thickness of the porous layer formed on the support is about 1 Torr, and the gap capacity measured by a mercury poometer is 5.75 ml/m2. A 2 liter stainless steel beaker was added with a burnt-boiled dextrin having a mass average molecular weight of about 30,000 (the product name "Dextrin No. Bu. 4g and pure water 860g manufactured by Nityo Chemical Co., Ltd., stirred for about 30 minutes. Thereafter, The silver nitrate "131. 8g" was further stirred for about 3 minutes, and it was completely dissolved. The solution was prepared by dissolving 60. 9 g of potassium hydroxide in a solution of pure water 83. 9 g, and stirring the number of rotations of 40 〇 rPm. The reduction reaction was carried out for 6 minutes. In this way, the silver ultrafine particle dispersion of the original reaction was adjusted to pH = 5 6 with acetic acid, and then 200 mg of the enzyme "Bi0zyme F10S D" (manufactured by Amano Enzy) was added to 45. (: stirring for 1 hour to lower the residual dextrin to obtain a silvery ultrafine particle dispersion of 7 mass%. Then, in the purification step of the obtained silver ultrafine particle dispersion, centrifugation is performed to make silver The ultrafine particles are separated from the supernatant, the supernatant is discarded, the remaining silver ultrafine particles are redispersed, the centrifugation is repeated, and the supernatant is discarded. Thereafter, pure water is added and redispersed to obtain a silver concentration of 47.2. % of silver super Particle dispersion l (110g) Extract silver ultrafine particle dispersion l (3g), add active agent (trade name "Taip〇1 NLES_227" made by Taiguang Oil Chemical Industry Co., Ltd.) 〇. 〇ig, as a 323512 47 201219204 Latex's first industrial pharmaceutical product name "Superflex 15〇HS" (polyamine phthalate latex 'average particle size 0. 11 # m, solid content 38% by mass) 〇 · 64g, sodium chloride concentration 2 mass The % aqueous solution 142 § is adjusted with pure water to obtain a silver "20% by mass", a polymer latex solid content concentration of 3.43% by mass, and a water-soluble tooth mass of a molar concentration of 〇〇9〇. a composition containing silver ultrafine particles of m〇1/kg. As described above, a dry film photoresist having a thickness of 15# m is laminated on a support having a porous easy-to-attach layer (product of Asahi Kasei) The name "SUNFORT series SPG" is a step-by-step process in which a close-packed printer with a mercury lamp as a light source does not block the resin film of light below 400 nm, and the thin line width is 20 &quot; m and the grid spacing is 250 _ The mesh type negative type penetrates the manuscript with a exposure of 100mJ/cm2 The exposure is carried out, and the mass of the sodium carbonate is in the surface of the water. The side is shaken and the side is imaged for 40 seconds. The second is used on the dry film photoresist, which will contain silver ultrafine particles. : The thickness of the cloth into silver becomes G.2 after drying, with 12 (J = 0 匕 clock. Thereafter, by spraying 4 吖 3 (4) = electro-hydraulic with a sprayer, peeling off and removing the dry film photoresist, washing with water Drying, making a conductive material precursor 17. The conductive material precursor Π is the same as in Example 1 and is shown in Table 1. X, which is the same as the actual compensation 1. The non-metallic part of the conductive material is 17.1_. Thickness metal 4 is 323512 48 201219204 [Table 1]

Spherical test 2 ΟΟπιη XXX 〇〇〇〇〇〇〇X 〇〇〇X 〇XIXIII 3 0 0_ 〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇o 〇IXIII Name si P蝤 Clark rigid (αη3/ 1〇〇) 1 I 0) 〇0) d 0) d CD 6 〇) 6 0) 6 σ&gt; 6 0) o I 0) 6 0) 6 O) o I σ> 6 II \ III Stripping XX 〇〇 〇O 〇〇〇〇X 〇〇〇XOXXIIXX adhesion; (N/25im); _I cannot be peeled off and cannot be peeled off τ- Ο 6 CO od r- 〇d 10 6 CO 6 0, 03 CO od 10 o 6 Cannot peel off CO o 6 CO 6 inch 6 can not be peeled off LO 6 can not be peeled off can not be peeled I can not be peeled off can not be peeled off active energy line after peeling test Clarke rigidity (cni3/1〇〇) 0) 〇Ο) 6 Ο) 6 σ> 6 〇) o 0) o σ&gt; 6 O) 6 φ o σ&gt; 6 Ο) 6 σ&gt; 6 0) 6 ο 6 σ&gt; 6 σ&gt; o &lt;M inch eg I 66. 45 II system 〇0 〇〇〇〇〇 〇〇O 〇〇〇〇〇〇〇XXXXX Tightness (N/25mn) CO 〇6 | 0. 05 I τ- Ο ό CO o 6 to 〇d ΙΩ O OJ d CO od CO od 1 0.05 I in 6 CO〇d CJ 6 6 ιο d τ- Ο ω ο d can not be peeled off, can not be peeled, f cannot be measured, I cannot peel, can not be peeled off, active energy ray, before peeling, peeling test, peeling 〇〇〇〇〇〇〇〇〇〇〇〇〇〇ο 〇〇 〇〇o 〇〇 着 (N/2&amp;nm) inch CSI inch oi inch CsJ inch oi inch oi oi inch (NJ inch CSJ inch OJ cvi &lt;N inch CSJ csi 守 csi OJ 00 inch CM csi eg (Μ CSI Clarke rigidity (anVIOO) | 66. 45 | in 呀ω (0 to 呀ω CO | 66. 45 I | 66. 45 | | 66. 45 | | 66. 45 | in inch CO CO 6 6. 45 | 45 1 m inch (d CO 10 inch CO (D in inch CD CD in CD CD 66. 45 I 66. 45 I Ι Ω inch CO in inch &lt; 0 CD I 66. 45 | 66. 45 II 66. 45 I In inch CO to 柳^ 璀绰E 5 Ύ— f— 卜 ' CO OJ CO CSJ CO ca CO CSJ CO CO &lt;N CO CSJ CO CSJ CO W CO OJ CO CD CO (M CO r~ 〆τ- 〇 r~ CsJ CO OJ CO Conductive Material|Example 1 | |Example 2 II Example 3 |Example 4 |Example 5 | |Example 6 1 |Example 7 |Example 8 | |Example 9 1 |Example 1 〇| |Example 1 1 |Example 1 2 I | Example 1 3 1 |Example 1 4 I |Example 1 5 |Example 1 6 II Example 1 7 I 1 I \〇Mm2 II imm3 I \mm^ i II 49 323512 201219204 (Example 18) In the example of the easy-to-adhesive layer coating solution of Example i, an easy-to-layer coating liquid was prepared in accordance with the formulation of the easy-adhesion layer coating liquid 3, and a conductive material was obtained in the same manner as in Example 1 except for coating. The same results as in Example 1. ~π 〈easy layer coating solution 3 per im2> ester urethane forage 3 〇〇mg trade name "HydraiiWLS210" (DIC polycarbonate, average particle size 〇.〇5#m, solid) gelatin 5〇mg oil nonionic surfactant) Product name "Nonion 0T 221" (day lmg 1 〇mg 4mg 〇 · 4mg Product name "VS-3" (Fuji photo film hardener) Product name "Hymicron L27i" ( Zhongjing Grease slipper) Palladium sulphide sol (palladium sulfide) used in Example 1 (Example 19) A burnt dextrin having a mass average molecular weight of about 15,000 was added to a 10 liter stainless steel beaker (Nitto Chemical Co., Ltd.) The product name "^加议3" 272g and 4300g of pure water were stirred for about 3 minutes and dissolved. Thereafter, 659g of silver acid was added and dissolved for half a minute for about 30 minutes. This solution was made in an ice bath. Cooling to about 5 ° C 'Addition of potassium argon oxide 30. 5g dissolved in pure water 419. 5g of 1 (TC liquid, while stirring in an ice bath, carry out a reduction reaction of 丄 hours. Add the solution obtained Acetic acid, adjusted to pH=5.6, add the enzyme name "BiQzyme SD" (Tianye (4) Then, lg is used for 1 hour. Then, the obtained silver ultrafine particles 323512 50 201219204 • The sub-dispersion is refined by centrifugal separation, and then pure water is added to make the silver concentration 45 mass pure to be redispersed. The silver ultrafine particle dispersion 2 (the average particle diameter of the silver ultrafine particles contained in the paste ☆ is 2Gnm, and the yield is continued. <Preparation of the composition 2 containing silver ultrafine particles> Take the silver ultrafine particle dispersion 2 ( 200g), the product name "u(10)t uws_l45" manufactured by Eryang Chemical Industry Co., Ltd. (polymerized by polyurethane, average particle size G.G2^m, solid content 35 mass, progress' added Surfactant, pure water, ethylene glycol, silver concentration, mass %, surface tension 3_ / m, viscosity of silver ultrafine particles containing composition 2 - active energy of the conductive material precursor prepared in Example 4 The line also focuses on reducing the resin layer, so that the composition containing the silver ultrafine particles is printed by flexographic printing to a line width of 5 M m, and a line spacing of 5 〇M m in the form of a mesh 3, = warm air drying, dipping Crushed to 8 (rc 3N_ sodium chloride aqueous solution as a second, into In the printing process, the active energy ray-reducing resin layer has no adhesiveness between the printing steps, so that no trouble occurs during printing. Then, in the same manner as in the fourth embodiment, The high-pressure mercury lamp is irradiated from the side opposite to the linear adhesion-reducing resin layer of the active material b of the conductive material #, and the active energy ray-reducing resin layer of the conductive material precursor is peeled off. Even in this peeling step, there is no Any problems can be stripped. (Comparative Example 6) 90 parts by mass of butyl acrylate, 10 parts by mass of acrylic acid, and 0.2 part by mass of azobisisobutyronitrile were dissolved in 3 parts by mass of ethyl acetate, and heated to 80 ° C under a nitrogen atmosphere to carry out a total of Polymerization, synthesis of acrylic acid 323512 51 201219204 polymer solution having a carboxylic acid group. Next, in the obtained citrate solution, methyl acetoacetate epoxy propyl vinegar is added to the internal solvent 埽酉夂b °c' to make the cyano group and the methyl group (tetra) in the polymer. The oxypropyl group reacts to obtain a solution having a mirror base and a methyl group as an acid group: an acid polymer solution, and then adding two parts of diisocyanate to the obtained acrylic polymer solution having a base group and an acrylic acid group. Peach (2, ethoxylated) phenyl (2 rhyme | . 5 mascara, to prepare an adhesive solution. The above-obtained adhesive solution was applied to the same support as the user of Example 4. , by 7 (Γ (: dry # force-disappearing adhesive film. Cl ^ 5 ^, making UV adhesion == Example 19 similarly - want to UV offset adhesion type adhesion ttn microparticle composition 2 by flexographic printing It is separated into ___ eyes-shaped but the adhesive layer is attached to the flexo plate (7 brush plate, it can not be printed smoothly. The result of the · clearly shows that the pure molecular weight of the diterpene of at least the order of the cut body is 15_ The above activity of the active k-reading molecular compound having an unsaturated double bond ==, easy adhesion layer, conductive material of the metal part If the precursor is peeled off from the conductive material, no damage is generated. (4) 'When the conductive material is peeled off from the conductive material precursor, the material does not appear to be sensitive when folded. And it can be easily [simple description] 323512 52 201219204 益Μ», [Main component symbol description]

Claims (1)

201219204 VII. Patent application scope: 1. A conductive material precursor which is provided on a support at least in order to contain an active energy ray-curable polymer compound having an unsaturated double bond having a mass average molecular weight of 15,000 or more. The active energy line is dense. The force-reducing resin layer, the easy-adhesion layer, and the metal portion are emphasized. 2. The conductive material precursor according to claim 1, wherein the 'the active energy ray-reducing-reducing resin layer contains 40% by mass or more and the mass average molecular weight is 15 with respect to the total solid content of the resin layer. The active energy ray-curable polymer compound having an unsaturated double bond is contained in an amount of 8% by mass or more based on the total solid content of the resin layer. 3. The conductive material precursor according to claim 1 or 2, wherein the active energy ray-reducing resin layer further contains a thermal cationic polymerization initiator. 4. The conductive material precursor according to any one of claims 1 to 3, wherein the total solid content of the active energy ray-reducing resin layer is 50 to 90% by mass. An active energy ray-curable polymer compound having an unsaturated double bond having a mass average molecular weight of 15,000 or more. 5. The conductive material precursor according to any one of claims 1 to 4, wherein the total solid content of the active energy ray-reducing resin layer is 60 to 70 mass. An active energy ray-curable polymer compound having an unsaturated double bond having a mass average molecular weight of 15,000 or more. The conductive material precursor according to any one of the items 2 to 5, wherein the total solid content of the active energy ray-reducing resin layer is 10%. To 30% by mass of the epoxy compound. 7. The conductive material precursor according to any one of claims 2 to 6, wherein the total solid content of the active energy ray-reducing resin layer is 15 to 25 mass. % of epoxy compound. 8. A conductive material which, after irradiating an active energy ray to a conductive material precursor according to any one of claims 1 to 7, is exfoliated from the support and contains at least an easy-to-layer layer and Made of metal parts. A conductive material which is irradiated with an active energy ray by a conductive material precursor according to any one of claims 1 to 7, after the metal portion side of the conductive material precursor The protective film is bonded and produced by peeling off a material containing at least an easy-to-adhere layer, a metal portion, and the above protective film from the support. 2 323512 201219204 • IV. Designated representative map: * (1) The representative representative map of this case is: (). (There is no picture in this case) ^ (2) Simple description of the symbol of the representative figure: (none) 5. If there is a chemical formula in this case, please disclose the chemical formula that best shows the characteristics of the invention: The chemical formula in the specification is only an additive, not enough On behalf of the case, the case is not represented by the chemical formula 2 323512