JPH10145080A - Electromagnetic shield tape and electromagentically shielded wire - Google Patents
Electromagnetic shield tape and electromagentically shielded wireInfo
- Publication number
- JPH10145080A JPH10145080A JP8313094A JP31309496A JPH10145080A JP H10145080 A JPH10145080 A JP H10145080A JP 8313094 A JP8313094 A JP 8313094A JP 31309496 A JP31309496 A JP 31309496A JP H10145080 A JPH10145080 A JP H10145080A
- Authority
- JP
- Japan
- Prior art keywords
- electromagnetic shield
- layer
- metal
- conductive adhesive
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は電磁シ−ルドテ−プ
及びその電磁シ−ルドテ−プでシ−ルドした電線に関す
るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electromagnetic shield tape and an electric wire shielded by the electromagnetic shield tape.
【0002】[0002]
【従来の技術】近来、OA機器の普及やLANの発達に
伴い多用されている電線やフラットケ−ブル等において
は、電磁気妨害(EMI)対策が必要である。而して、
フラットケ−ブル等を電磁シ−ルドテ−プで包囲してフ
ラットケ−ブル等自体に電磁シ−ルド機能を付与するこ
とが知られている。金属層による電磁シ−ルド効果SE
は、電磁波が金属層中を伝播する経路で熱損失として吸
収される吸収損失、電磁波の伝播経路に異なる媒質が存
在するときに反射により生じる反射損失及び金属層の両
端境界面での反射の繰返しによって生じる多重反射損失
の総和であり、吸収損失Aは、金属層の厚みをt、導電
率をδ、透磁率をμ、周波数をfとすれば、 A∝t√(fδμ) で与えられる。従来、電磁シ−ルドテ−プとして、プラ
スチック支持フィルムの片面に金属蒸着層を設け、この
金属蒸着層上に接着剤層を設けたもの、プラスチック支
持フィルムの片面に金属箔を接着し、この金属箔上に接
着剤層を設けたもの等が知られている。2. Description of the Related Art Electromagnetic interference (EMI) is required for electric wires, flat cables, and the like, which have been widely used with the spread of OA equipment and the development of LANs. Thus,
It is known that a flat cable or the like is surrounded by an electromagnetic shield tape to provide an electromagnetic shield function to the flat cable or the like itself. Electromagnetic shield effect SE by metal layer
Are the absorption loss that is absorbed as heat loss in the path through which the electromagnetic wave propagates through the metal layer, the reflection loss caused by reflection when a different medium is present in the propagation path of the electromagnetic wave, and the repetition of reflection at both ends of the metal layer The absorption loss A is given by A∝t√ (fδμ) where t is the thickness of the metal layer, δ is the conductivity, μ is the magnetic permeability, and f is the frequency. Conventionally, an electromagnetic shield tape in which a metal deposition layer is provided on one side of a plastic support film and an adhesive layer is provided on the metal deposition layer, a metal foil is adhered to one side of the plastic support film, There are known those in which an adhesive layer is provided on a foil.
【0003】[0003]
【発明が解決しようとする課題】これらの電磁シ−ルド
テ−プの電磁シ−ルド効果は、主に吸収損失により奏さ
れ、上記式から明らかな通り、金属層の厚さtを大き
くするほど、また、導電率δを高くするほど、電磁シ−
ルド効果が増大する。而るに、通常、金属箔の厚さ(通
常、数μm〜数10μm)が金属蒸着層の厚さ(通常、
1μm以下)に較べて著しく厚く、しかも、金属箔の導
電率が金属蒸着層の導電率に較べて相当に高い(金属蒸
着層は、蒸発した金属分子間が隙間を介して結合された
多孔質体であり、緻密質の金属箔に較べ導電率が低い)
ために、金属層に金属箔を用いた電磁シ−ルドテ−プ
は、金属層に金属蒸着層を用いた電磁シ−ルドテ−プよ
りも、上記した吸収損失Aが大きく、電磁シ−ルド効果
が高い。The electromagnetic shielding effect of these electromagnetic shielding tapes is mainly exerted by absorption loss, and as is apparent from the above equation, the greater the thickness t of the metal layer, the greater the thickness. Also, as the conductivity δ increases, the electromagnetic
Field effect increases. Generally, the thickness of the metal foil (usually several μm to several tens of μm) depends on the thickness of the metal deposition layer (usually,
1 μm or less, and the conductivity of the metal foil is considerably higher than the conductivity of the metal-deposited layer (the metal-deposited layer is a porous material in which evaporated metal molecules are bonded through gaps). Body, which has lower conductivity than dense metal foil)
Therefore, an electromagnetic shield tape using a metal foil for the metal layer has a larger absorption loss A than the electromagnetic shield tape using a metal deposition layer for the metal layer, and has an electromagnetic shield effect. Is high.
【0004】しかしながら、緻密質の金属箔は多孔質の
金属蒸着層に較べ、剛性が高く、金属層に金属箔を用い
た電磁シ−ルドテ−プでフラットケ−ブル等の電磁シ−
ルド層を形成すると、フラットケ−ブル等の繰返し屈曲
により、金属箔にクラックが発生して電磁シ−ルド効果
の著しい低下が懸念される。一方、金属層に金属蒸着層
を用いた電磁シ−ルドテ−プでフラットケ−ブル等の電
磁シ−ルド層を形成すると、上記したクラックの発生に
よる電磁シ−ルド効果の低下は排除できるが、初期電磁
シ−ルド効果が低く、満足な電磁シ−ルドを保証し難
い。However, a dense metal foil has a higher rigidity than a porous metal vapor-deposited layer, and is an electromagnetic shield tape using a metal foil for the metal layer, such as a flat cable or the like.
When the shield layer is formed, cracks are generated in the metal foil due to repeated bending of a flat cable or the like, and there is a concern that the electromagnetic shielding effect is significantly reduced. On the other hand, if an electromagnetic shield layer such as a flat cable is formed by an electromagnetic shield tape using a metal vapor-deposited layer as the metal layer, the decrease in the electromagnetic shield effect due to the generation of cracks described above can be eliminated. The initial electromagnetic shield effect is low, and it is difficult to guarantee a satisfactory electromagnetic shield.
【0005】本発明の目的は、フラットケ−ブル等を充
分に高い初期電磁シ−ルド効果で、しかもフラットケ−
ブルの繰返し屈曲のもとでも、その初期電磁シ−ルド効
果を安定に保持できる電磁シ−ルドテ−プを提供するこ
とにある。An object of the present invention is to provide a flat cable or the like with a sufficiently high initial electromagnetic shielding effect and a flat cable.
An object of the present invention is to provide an electromagnetic shield tape capable of stably maintaining its initial electromagnetic shield effect even under repeated bending of a cable.
【0006】[0006]
【課題を解決するための手段】本発明に係る電磁シ−ル
ドテ−プは、支持フィルムの片面に金属蒸着層を設け、
該金属蒸着層上に金属粉末添加の導電性接着剤層を設け
たことを特徴とする構成である。本発明に係る電磁シ−
ルド電線は、電線の絶縁層を、請求項1記載の電磁シ−
ルドテ−プで、該テ−プの導電性接着剤層面を内側に向
けて包囲し、その導電性接着剤層を上記絶縁層に接着し
たことを特徴とする構成である。An electromagnetic shield tape according to the present invention is provided with a metal deposition layer on one side of a support film.
The present invention is characterized in that a conductive adhesive layer to which metal powder is added is provided on the metal deposition layer. The electromagnetic shield according to the present invention
The electromagnetic shield according to claim 1, wherein the shielded electric wire comprises an insulating layer of the electric wire.
The tape is formed by surrounding the conductive adhesive layer surface of the tape inward with a tape, and bonding the conductive adhesive layer to the insulating layer.
【0007】[0007]
【発明の実施の形態】以下、図面を参照しつつ本発明の
実施の形態について説明する。図1は本発明に係る電磁
シ−ルドテ−プの一例を示している。図1において、1
は支持フィルムであり、フラットケ−ブル等への接着作
業に適した適度の剛性を有するものであれば、適宜のも
のを使用でき、プラスチックフィルムを使用することが
好ましい。例えば、ポリエチレンテレフタレ−ト、ポリ
ブチレンテレフタレ−ト等のポリエステル、ポリイミ
ド、ポリエ−テルスルホン、ポリエ−テルエ−テルケト
ン、ポリフェニレンサルファイド、ポリアリレ−ト等の
フィルムであって、厚み10〜150μmのものを好適
に使用できる。2はプラスチック支持フィルム1の片面
に設けた金属蒸着層であり、例えば、アルミニウム、
銅、金等の金属の真空蒸着により設けることができ、そ
の厚みは、通常1μm以下(1000Åm以下)であ
る。この金属蒸着層はプラスチック支持フィルムの両面
に設けることも可能である。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows an example of an electromagnetic shield tape according to the present invention. In FIG. 1, 1
Is a supporting film, and any suitable film can be used as long as it has appropriate rigidity suitable for bonding to a flat cable or the like, and it is preferable to use a plastic film. For example, films such as polyesters such as polyethylene terephthalate and polybutylene terephthalate, polyimides, polyethersulfone, polyetheretheroketone, polyphenylene sulfide, and polyarylate having a thickness of 10 to 150 μm. It can be suitably used. Reference numeral 2 denotes a metal deposition layer provided on one side of the plastic support film 1, for example, aluminum,
It can be provided by vacuum deposition of a metal such as copper or gold, and its thickness is usually 1 μm or less (1000 μm or less). This metal deposition layer can be provided on both sides of the plastic support film.
【0008】3はプラスチック支持フィルム片面の金属
蒸着層2上に設けた金属粉末添加の導電性接着剤層であ
り、金属粉末、例えば、ニッケル、銅、アルミニウム、
銀等の粉末を添加した粘着剤やホットメルト系接着剤等
を使用でき、特に、熱可塑性ポリエステルを主成分とす
るものを使用することが好ましく、また、酸化防止剤、
充填剤、粘着付与剤、架橋促進剤等を適量添加すること
もできる。上記の熱可塑性ポリエステルは、少なくとも
1種のジカルボン酸と少なくとも1種のジオ−ル(グリ
コ−ル)との共重合体であり、ジカルボン酸としては、
テレフタル酸、イソフタル酸、ヘキサヒドロフタル酸、
アジピン酸等が挙げられ、ジオ−ルとしては、エチレン
グリコ−ル、ジエチレングリコ−ル、プロピレングリコ
−ル、オキシテトラメチレングリコ−ル、ネオペンチグ
リコ−ル、ブタンジオ−ル、ヘキサンジオ−ル等が挙げ
られる。図1において、4は導電性接着剤層3に仮着し
た剥離紙である。Reference numeral 3 denotes a conductive adhesive layer provided with a metal powder and provided on the metal deposition layer 2 on one side of the plastic supporting film, and includes a metal powder such as nickel, copper, aluminum, and the like.
An adhesive or a hot-melt adhesive to which a powder such as silver is added can be used, and in particular, it is preferable to use a thermoplastic polyester-based adhesive as a main component, and also an antioxidant,
An appropriate amount of a filler, a tackifier, a crosslinking accelerator and the like can be added. The thermoplastic polyester is a copolymer of at least one dicarboxylic acid and at least one diol (glycol).
Terephthalic acid, isophthalic acid, hexahydrophthalic acid,
Adipic acid; and diols such as ethylene glycol, diethylene glycol, propylene glycol, oxytetramethylene glycol, neopentyglycol, butanediol, and hexanediol. Can be In FIG. 1, reference numeral 4 denotes a release paper temporarily attached to the conductive adhesive layer 3.
【0009】図2は本発明に係る電磁シ−ルドテ−プで
シ−ルドした電線の一例を示している。図2において、
Bはフラットケ−ブル本体を示し、複数本の並行導体
5,…を上下のプラスチックフィルム6,6で挾み、こ
れらを一体化してある。Cは電磁シ−ルド層を示し、フ
ラットケ−ブル本体Bの上下面に上記の電磁シ−ルドテ
−プAを導電性接着剤層3を内側にして配し、導電性接
着剤層3がホットメルトタイプの場合は加熱加圧によ
り、また導電性接着剤層3が粘着層の場合は加圧によ
り、各電磁シ−ルドテ−プAとケ−ブル絶縁層6との間
及び電磁シ−ルドテ−プA,A相互間を接着してある。
なお、電線本体には断面円形のものも使用でき、この場
合、電磁シ−ルドテ−プの縦沿えにより電磁シ−ルド層
を形成することもできる(従って、電磁シ−ルドテ−プ
は巾の両端が重ね合わされる)。FIG. 2 shows an example of an electric wire shielded by an electromagnetic shield tape according to the present invention. In FIG.
B denotes a flat cable main body, in which a plurality of parallel conductors 5,... Are sandwiched between upper and lower plastic films 6, 6, and these are integrated. C denotes an electromagnetic shield layer. The above-mentioned electromagnetic shield tape A is disposed on the upper and lower surfaces of the flat cable main body B with the conductive adhesive layer 3 inside, and the conductive adhesive layer 3 is hot. By applying heat and pressure in the case of the melt type, and by applying pressure in the case where the conductive adhesive layer 3 is an adhesive layer, by applying pressure between each electromagnetic shield tape A and the cable insulating layer 6 and by applying electromagnetic pressure. -A and A are bonded to each other.
The electric wire body may have a circular cross section. In this case, an electromagnetic shield layer may be formed along the length of the electromagnetic shield tape (accordingly, the electromagnetic shield tape has a wide width). Both ends overlap).
【0010】[0010]
〔実施例〕厚さ25μmのポリエチレンテレフタレ−ト
フィルムの片面にアルミニウムを厚さ300Åmで真空
蒸着した。この金属蒸着層上に、熱可塑性ポリエステル
樹脂溶液(ノガワケミカル社製、商品名ダイアボンドD
A−3080B)100重量部,架橋剤(ノガワケミカ
ル社製、商品名ダイアボンドHFE)1重量部,ニッケ
ル粉末(福田金属箔粉社製、商品名カ−ボニルニッケ
ル)100重量部から成る導電性接着剤Aを塗布し、温
度130℃×1分間加熱により厚さ40μmの導電性接
着剤層を形成して電磁シ−ルドテ−プを得た。更に、こ
の電磁シ−ルドテ−プを厚さ1.0mmのプラスチック
絶縁フラットケ−ブルの両面に配し、150℃で30秒
加熱加圧して図2に示す構成の電磁シ−ルドフラットケ
−ブルを作成した。EXAMPLE Aluminum was vacuum-deposited on one side of a 25 μm thick polyethylene terephthalate film to a thickness of 300 μm. On this metallized layer, a thermoplastic polyester resin solution (Diabond D manufactured by Nogawa Chemical Co., Ltd.)
A-3080B) 100 parts by weight, 1 part by weight of a crosslinking agent (Diabond HFE, trade name, manufactured by Nogawa Chemical Co., Ltd.), and 100 parts by weight of nickel powder (carbonyl nickel, trade name, manufactured by Fukuda Metal Foil Powder Co., Ltd.) The adhesive A was applied, and a 40 μm-thick conductive adhesive layer was formed by heating at 130 ° C. for 1 minute to obtain an electromagnetic shield tape. Further, the electromagnetic shield tape was placed on both sides of a plastic insulated flat cable having a thickness of 1.0 mm, and heated and pressed at 150 ° C. for 30 seconds to produce an electromagnetic shield flat cable having the structure shown in FIG. did.
【0011】〔比較例1〕厚さ25μmのポリエチレン
テレフタレ−トフィルムの片面に、熱可塑性ポリエステ
ル樹脂溶液(ノガワケミカル社製、商品名ダイアボンド
DA−3080B)100重量部,架橋剤(ノガワケミ
カル社製、商品名ダイアボンドHFE)1重量部から成
る接着剤Bを塗布し、温度130℃×1分間加熱により
厚さ10μmの接着剤層を形成し、この接着剤層に厚さ
5μmのアルミ箔を150℃×30秒の加熱加圧で貼り
合わせた。このアルミ箔層上に、上記の接着剤Bを塗布
し、温度130℃×1分間加熱により厚さ40μmの接
着剤層を形成して電磁シ−ルドテ−プを得た。更に、こ
の電磁シ−ルドテ−プを上記したプラスチック絶縁フラ
ットケ−ブルの両面に配し、150℃で30秒加熱加圧
して図2に示す構成の電磁シ−ルドフラットケ−ブルを
作成した。 〔比較例2〕比較例1に対し、アルミ箔上の接着剤層を
接着剤Bで形成することに代え、実施例で使用した導電
性接着剤Aを用いて導電性接着剤層を形成した以外、比
較例1に同じとした。Comparative Example 1 100 parts by weight of a thermoplastic polyester resin solution (manufactured by Nogawa Chemical Co., trade name: Diabond DA-3080B) and a cross-linking agent (Nogawa Chemical Co., Ltd.) were placed on one side of a 25 μm-thick polyethylene terephthalate film. Adhesive B consisting of 1 part by weight (trade name, Diabond HFE) is applied, and an adhesive layer having a thickness of 10 μm is formed by heating at a temperature of 130 ° C. × 1 minute. Were bonded by heating and pressing at 150 ° C. × 30 seconds. The adhesive B was applied on the aluminum foil layer and heated at a temperature of 130 ° C. for 1 minute to form an adhesive layer having a thickness of 40 μm, thereby obtaining an electromagnetic shield tape. Further, this electromagnetic shield tape was placed on both sides of the above-mentioned plastic insulated flat cable, and heated and pressurized at 150 ° C. for 30 seconds to produce an electromagnetic shield flat cable having the structure shown in FIG. [Comparative Example 2] A conductive adhesive layer was formed by using the conductive adhesive A used in the example instead of forming the adhesive layer on the aluminum foil with the adhesive B in comparison with the comparative example 1. Except for this, it was the same as Comparative Example 1.
【0012】これらの実施例及び比較例の電磁シ−ルド
フラットケ−ブルについて、繰返し屈曲試験(フラット
ケ−ブルを20mmφの金属円柱の半周に沿わせU形と
した状態で往復走行させることを1万回繰り返す)を行
った後、電磁シ−ルドテ−プを剥離し金属層でのクラッ
クの発生を調べたところ、比較例1及び2のフラットケ
−ブルではクラックの発生が認められたのに対し、実施
例のフラットケ−ブルでのクラックの発生は皆無であっ
た。また、繰返し屈曲試験後の電磁シ−ルドテ−プにつ
いて、シ−ルド材評価装置(タケダ理研工業社製 SP
ECTRUM ANALYZER TR17301)を
用い、周波数500MHZのもとでの電磁シ−ルド効果を
測定したところ、実施例のものでは10dB以上で良好
な結果であったが、比較例1及び2のものでは共に10
dB以下であった。With respect to the electromagnetic shielded flat cables of these Examples and Comparative Examples, a repetitive bending test (reciprocating traveling of the flat cable in a U-shape along a half circumference of a 20 mmφ metal cylinder was performed 10,000 times) (Repeated), the electromagnetic shield tape was peeled off, and the occurrence of cracks in the metal layer was examined. In the flat cables of Comparative Examples 1 and 2, cracks were observed. No cracking occurred in the example flat cable. Further, regarding the electromagnetic shield tape after the repeated bending test, a shield material evaluation device (SP, manufactured by Takeda Riken Kogyo KK)
When the electromagnetic shielding effect at a frequency of 500 MHz was measured using ECTRUM ANALYZER TR17301), good results were obtained at 10 dB or more in the example, but 10% or more in Comparative Examples 1 and 2.
dB or less.
【0013】実施例において、電磁シ−ルドテ−プの金
属層に金属蒸着層を使用しているにもかかわらず、良好
な電磁シ−ルド効果が得られる理由は、金属蒸着層面の
接着剤層に金属粉を添加し、接着剤層にも電磁シ−ルド
効果を付与して全体の電磁シ−ルド効果を高め、この高
い電磁シ−ルド効果が繰返し屈曲のもとでも金属蒸着層
のクラックの発生なく安定に保持し得るからである。比
較例2では、アルミ箔上の接着剤層を導電性接着剤層と
しているにもかかわらず、満足な電磁シ−ルド効果が得
られなかった理由は、繰返し屈曲によるアルミ箔のクラ
ックの発生のために、アルミ箔本来の優れた電磁シ−ル
ド効果が発揮されなかったものと推定される。In the embodiment, despite the use of a metal deposition layer as the metal layer of the electromagnetic shield tape, a good electromagnetic shielding effect can be obtained because of the adhesive layer on the metal deposition layer surface. Metal powder is added to the adhesive layer to provide an electromagnetic shielding effect to the adhesive layer to enhance the overall electromagnetic shielding effect. This high electromagnetic shielding effect causes cracks in the metal deposition layer even under repeated bending. This is because it can be stably maintained without occurrence of the occurrence. In Comparative Example 2, despite the fact that the adhesive layer on the aluminum foil was a conductive adhesive layer, no satisfactory electromagnetic shielding effect was obtained because of the occurrence of cracks in the aluminum foil due to repeated bending. Therefore, it is presumed that the excellent electromagnetic shielding effect inherent to the aluminum foil was not exhibited.
【0014】[0014]
【発明の効果】本発明に係る電磁シ−ルドテ−プで電線
に電磁シ−ルド層を形成すれば、金属蒸着層自体の電磁
シ−ルド効果が低くても導電性接着剤層により電磁シ−
ルド効果を高めて電磁シ−ルドの初期値を高くでき、電
線の繰返し屈曲のもとでも金属蒸着層及び導電性接着剤
層の安定性のために、その高い初期電磁シ−ルド効果を
保持できる。従って、本発明によれば、電線に高く、か
つ安定な電磁シ−ルド効果を付与できる。According to the present invention, when an electromagnetic shield layer is formed on an electric wire using the electromagnetic shield tape according to the present invention, even if the metal shield layer has a low electromagnetic shield effect, the electromagnetic shield layer can be formed by the conductive adhesive layer. −
The initial value of the electromagnetic shield can be increased by increasing the shielding effect, and the high initial electromagnetic shielding effect is maintained even under repeated bending of the wire due to the stability of the metal deposition layer and the conductive adhesive layer. it can. Therefore, according to the present invention, a high and stable electromagnetic shielding effect can be imparted to the electric wire.
【図1】本発明に係る電磁シ−ルドテ−プを示す図面で
ある。FIG. 1 is a view showing an electromagnetic shield tape according to the present invention.
【図2】本発明に係る電磁シ−ルド電線を示す図面であ
る。FIG. 2 is a view showing an electromagnetic shielded electric wire according to the present invention.
1 支持フィルム 2 金属蒸着層 3 導電性接着剤層 A 電磁シ−ルドテ−プ B 電線本体 DESCRIPTION OF SYMBOLS 1 Support film 2 Metal deposition layer 3 Conductive adhesive layer A Electromagnetic shield tape B Electric wire main body
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 FI H01B 11/06 H01B 11/06 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 6 Identification code FI H01B 11/06 H01B 11/06
Claims (2)
該金属蒸着層上に金属粉末添加の導電性接着剤層を設け
たことを特徴とする電磁シ−ルドテ−プ。(1) providing a metal deposition layer on one side of a support film;
An electromagnetic shield tape comprising a metal powder-added conductive adhesive layer provided on the metal deposition layer.
ルドテ−プで、該テ−プの導電性接着剤層面を内側に向
けて包囲し、その導電性接着剤層を上記絶縁層に接着し
たことを特徴とする電磁シ−ルド電線。2. The electromagnetic shield according to claim 1, wherein the insulation layer of the electric wire is provided.
An electromagnetic shielded electric wire, wherein the conductive adhesive layer surface of the tape is surrounded by a tape and the conductive adhesive layer is adhered to the insulating layer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8313094A JPH10145080A (en) | 1996-11-08 | 1996-11-08 | Electromagnetic shield tape and electromagentically shielded wire |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8313094A JPH10145080A (en) | 1996-11-08 | 1996-11-08 | Electromagnetic shield tape and electromagentically shielded wire |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH10145080A true JPH10145080A (en) | 1998-05-29 |
Family
ID=18037101
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8313094A Pending JPH10145080A (en) | 1996-11-08 | 1996-11-08 | Electromagnetic shield tape and electromagentically shielded wire |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH10145080A (en) |
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GB2360228A (en) * | 2000-03-14 | 2001-09-19 | 3M Innovative Properties Co | Conductive adhesive tape |
JP2002329423A (en) * | 2001-04-27 | 2002-11-15 | Dainippon Printing Co Ltd | Shielding material for flat cable and flat cable with shield |
JP2003110279A (en) * | 2001-09-28 | 2003-04-11 | Dainippon Printing Co Ltd | Electromagnetic wave shield material and flat cable with the electromagnetic wave shield |
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1996
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JP2002329423A (en) * | 2001-04-27 | 2002-11-15 | Dainippon Printing Co Ltd | Shielding material for flat cable and flat cable with shield |
JP2003110279A (en) * | 2001-09-28 | 2003-04-11 | Dainippon Printing Co Ltd | Electromagnetic wave shield material and flat cable with the electromagnetic wave shield |
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CN106952678B (en) * | 2017-04-28 | 2019-05-10 | 南昌联能科技有限公司 | A kind of electromagnetic shielding film for cable |
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