201218937 六、發明說明： 【發明所屬之技術領域】 本發明關於-種背光模組’且特别是有關於用於背光模 組的一種散熱組件。 【先前技術】 圖4為一習知背光模組的示意圖。如圖4所示，背光模組 100包含一導光板102、一發光二極體燈條1〇4、一背板1〇6及 一膠框108。背板106設置於導光板1〇2的底侧，且膠框1〇8扣 接至背板106以固定導光板1〇2、發光二極體燈條1〇4等元 件。背板106具有一彎折部l〇6a並且形成一l字型的截面外 形，發光二極體燈條104貼附於彎折部106a的一側。於此一習 知設計中，當膠框108扣接至背板1〇6後，膠框1〇8會覆蓋背 板106的彎折部i〇6a，使彎折部106a無法直接接觸空氣，導致 發光二極體燈條104產生的熱能不易散逸，且背板106的彎折 設計使背光模組100整體的厚度增加因此難以薄型化。另 外’例如台灣專利公開第200801674號、第200743872號、台 灣專利公告第M294189號及美國專利公告第US7591578號均 揭露相關於光源固定件上設置散熱鰭片以提高散熱效果的 設計’但這些設計無法有效降低整體的組裝厚度且其散熱效 果仍需進一步提昇。 201218937 【發明内容】 本發明提供一種具有良好散熱效果及低組裝厚度的散 熱組件及背光模組。 又 本發明的其他目的和優點可以從本發明所揭露的技術 特徵中得到進一步的了解。 鍵上述之-或部份或全部目的或是其他目的本發明 之一實施例提供-種散熱組件，包含—背板、—第—散熱結 • 構及一第二散熱結構。第一散熱結構包含一基部與一側部， 侧部貼附一發光元件，基部與侧部夹一角度且基部具有相對 的一第一表面及一第二表面，第一表面面向背板且第二表面 月向岸板，其中月板登合部分第一表面且侧部疊合部分第二 表面。第二散熱結構設置於未疊合背板的部分第一表面上。 本發明之另一實施例提供一種背光模組，包含一導光 板、一發光元件、一背板、一第一散熱結構、一第二散熱結 ^ 構及一膠框。導光板具有一入光面，發光元件設置於鄰近入 光面位置處’且背板設置於導光板的一底侧。第一散熱結構 包^ 基部與一側部’側部貼附一發光元件，基部與側部夾 一角度且基部具有相對的一第一表面及一第二表面，第一表 面面向背板且第二表面背向背板，其中背板疊合部分第一表 面且側部疊合部分第二表面。第二散熱結構設置於未疊合背 板的部分第一表面上，膠框固定於背板上並覆蓋部分第一散 熱結構，且膠框暴露第二散熱結構。 201218937 於一實施例中，第二散熱結構背向第一散熱結構的一側 面實質上平齊背板背向第一散熱結構的一側面。 於一實施例中，第二散熱結構包含複數散熱鰭片且發光 元件為至少一發光二極體燈條，散熱鰭片相對基部的第一表 面的高度與背板的厚度實質上相同，且散熱鰭片的長軸方向 與發光二極體燈條的長軸方向實質上平行。 於一實施例中，第一散熱結構及第二散熱結構為一鋁擠201218937 VI. Description of the Invention: [Technical Field] The present invention relates to a backlight module and particularly relates to a heat dissipating assembly for a backlight module. [Prior Art] FIG. 4 is a schematic diagram of a conventional backlight module. As shown in FIG. 4, the backlight module 100 includes a light guide plate 102, a light-emitting diode light bar 1〇4, a back plate 1〇6, and a plastic frame 108. The back plate 106 is disposed on the bottom side of the light guide plate 1〇2, and the plastic frame 1〇8 is fastened to the back plate 106 to fix the light guide plate 1〇2, the light-emitting diode light bar 1〇4 and the like. The back plate 106 has a bent portion 16a and forms an i-shaped cross-sectional shape, and the light-emitting diode strip 104 is attached to one side of the bent portion 106a. In this conventional design, after the plastic frame 108 is fastened to the back plate 1〇6, the plastic frame 1〇8 covers the bent portion i〇6a of the back plate 106, so that the bent portion 106a cannot directly contact the air. The heat generated by the light-emitting diode strip 104 is not easily dissipated, and the bending design of the back sheet 106 increases the thickness of the entire backlight module 100, so that it is difficult to be thinned. In addition, for example, Taiwan Patent Publication No. 200801674, No. 200743872, Taiwan Patent Publication No. M294189, and U.S. Patent Publication No. US7591578 disclose a design relating to providing heat dissipating fins on a light source fixing member to improve heat dissipation effect. Effectively reduce the overall assembly thickness and its heat dissipation effect needs to be further improved. 201218937 SUMMARY OF THE INVENTION The present invention provides a heat dissipation component and a backlight module having a good heat dissipation effect and a low assembly thickness. Still further objects and advantages of the present invention will become apparent from the technical features disclosed herein. The above-mentioned or some or all of the objects or other objects of the present invention provide a heat dissipating component comprising a backing plate, a first heat dissipating structure and a second heat dissipating structure. The first heat dissipation structure includes a base portion and a side portion, the side portion is attached with a light-emitting element, the base portion and the side portion are at an angle, and the base portion has a first surface and a second surface opposite to each other, the first surface facing the back plate and the first surface A two-surface moon-to-shore panel, wherein the moonboard is joined to a portion of the first surface and the side portion is overlapped with a portion of the second surface. The second heat dissipation structure is disposed on a portion of the first surface of the unfolded backplane. Another embodiment of the present invention provides a backlight module including a light guide plate, a light-emitting element, a back plate, a first heat dissipation structure, a second heat dissipation structure, and a plastic frame. The light guide plate has a light incident surface, the light emitting element is disposed adjacent to the light incident surface, and the back plate is disposed on a bottom side of the light guide plate. The first heat dissipation structure includes a light-emitting element attached to the side of the base portion and the side portion, the base portion and the side portion are at an angle, and the base portion has a first surface and a second surface opposite to each other, the first surface facing the back plate and the first surface The two surfaces face away from the backing plate, wherein the backing plate overlaps a portion of the first surface and the side portions overlap a portion of the second surface. The second heat dissipation structure is disposed on a portion of the first surface of the unfolded back plate, the plastic frame is fixed on the back plate and covers a portion of the first heat dissipation structure, and the plastic frame exposes the second heat dissipation structure. In an embodiment, the side of the second heat dissipation structure facing away from the first heat dissipation structure is substantially flush with the back plate facing away from a side of the first heat dissipation structure. In one embodiment, the second heat dissipation structure includes a plurality of heat dissipation fins and the light emitting element is at least one light emitting diode light strip. The height of the heat dissipation fin relative to the first surface of the base is substantially the same as the thickness of the back plate, and the heat dissipation The long axis direction of the fin is substantially parallel to the long axis direction of the light emitting diode strip. In one embodiment, the first heat dissipation structure and the second heat dissipation structure are an aluminum extrusion
型材料所構成，且背板係由一鋁擠型材料及一鋼材的至少其 中之一所構成。 於-實施例中，第-散熱結構的基部的厚度與導光板的 厚度實質上相同。 綜上所述’本發明之實施例的散熱組件及背光模組 至少具有下列其中一個優點： 因第二散熱結構係設置於第一散熱結構的基部與背板 界定出的-容置空_，且第二散熱結構的高度可與背板實 質上相同，故背板、第-散熱結構及第二散熱結構組裝後可 獲得一具魏好平整度辭缝散她件，脅因設置散熱 件而額外增加厚度’使縣顧整料於_化。再者，因 背光模她裝彳娜框暴絲二散熱結構，因此第二散熱結構 可直接與空氣接觸喊得良好的散熱效果。 本 =的其他目的和優點可以從本發明所揭露的技術 特徵中件到進-步的了解。為讓本發明之上述和其他目的、 £ 201218937 特徵和優點月匕更明顯易懂，下文特舉實施例並配合所附圖 式’作洋細說明如下。 【實施方式】 有關本發明之前述及其他技術魄、特點與功效，在以 下配合參相叙實施_詳細酬巾，將可清楚的呈現。 以下實施例中所提到的方向用語，例如：上下、左、右、 • 前或後等’僅是參考附加圖式的方向。因此，使用的方向用 語是用來說明並非用來限制本發明。 圖1為依本發明一實施例之背光模組的示意圖。於圖^ 中為清楚顯示背板與散熱結構的型態及連接關係，導光板係 以虛線表示°如圖1所示，背光模組1G包含-導光板12、 -發光元件14、—背板16、—第—散減構18及一第二散 熱、，..構22。導光板u具有一入光面以，且發光元件^設 # 置於鄰近入光面12a位置處。背板I6設置於導光板U的一 底側。第-散熱結構18包含一基部18a與一側部⑽，側部 18b貼附發光元件14 ’基部⑻與侧部⑽夹一角度且具有 相對的-第-表面P及—第二表面Q。第—表面^向錄 W且第二表面Q #向背板10，倾16疊合部分第—表面p 且側部18b疊合部分第二表面Q。第二散熱結構η設置於 未疊合背板16的部分第-表面P上。圖2為依本發明一實 施例之散熱組件的示意圖，散熱組件包含背板16、第—散貝熱 201218937 結構18及第一散熱結構22，且於圖2中為清楚顯示第一散 熱結構18及第二散熱結構22的型態，背板16係以虛線表 示。如圖2所示’第^一散熱結構22可設置於第一散熱結構 基部18a與背板16所界定的一階梯狀容置空間内，且當第二 散熱結構22置入後，第二散熱結構22背向第一散熱結構18 的一側面R可與背板16背向第一散熱結構18的一侧面8實The material is composed of a material, and the back sheet is composed of at least one of an aluminum extruded material and a steel material. In the embodiment, the thickness of the base of the first heat dissipating structure is substantially the same as the thickness of the light guide plate. In summary, the heat dissipating component and the backlight module of the embodiment of the present invention have at least one of the following advantages: the second heat dissipating structure is disposed on the base portion of the first heat dissipating structure and the backing plate defines a space _ The height of the second heat dissipation structure can be substantially the same as that of the back plate. Therefore, after the back plate, the first heat dissipation structure and the second heat dissipation structure are assembled, a piece of Wei's flatness can be obtained, and the heat dissipation member is disposed. The extra thickness is added to make the county's ingredients more _. Moreover, because of the backlight mode, she installed the two-frame heat-dissipating structure, so that the second heat-dissipating structure can directly contact the air and shout a good heat-dissipating effect. Other objects and advantages of this = can be understood from the technical features disclosed in the present invention. In order to make the above and other objects of the present invention, the features and advantages of the present invention, more readily apparent, the following detailed description of the embodiments and the accompanying drawings are as follows. [Embodiment] The foregoing and other technical features, features, and effects of the present invention will be clearly described in conjunction with the implementation of the detailed description. The directional terms mentioned in the following embodiments, for example, up and down, left, right, • front or back, etc. are merely directions referring to the additional drawings. Therefore, the directional term used is used to describe that it is not intended to limit the invention. FIG. 1 is a schematic diagram of a backlight module according to an embodiment of the invention. In FIG. 2, the type and connection relationship between the back plate and the heat dissipation structure are clearly shown, and the light guide plate is indicated by a broken line. As shown in FIG. 1 , the backlight module 1G includes a light guide plate 12, a light-emitting element 14, and a back plate. 16, - the first - attenuation structure 18 and a second heat dissipation, .. structure 22. The light guide plate u has a light incident surface, and the light emitting element is disposed at a position adjacent to the light incident surface 12a. The back plate I6 is disposed on a bottom side of the light guide plate U. The first heat dissipating structure 18 includes a base portion 18a and a side portion (10), and the side portion 18b is attached to the light-emitting element 14'. The base portion (8) is at an angle to the side portion (10) and has an opposite - the first surface P and the second surface Q. The first surface is recorded and the second surface Q# is directed toward the backing plate 10, and the portion 16 is overlapped with the first surface p and the side portion 18b is overlapped with the second surface Q. The second heat dissipation structure η is disposed on a portion of the first surface P of the unfolded back plate 16. 2 is a schematic diagram of a heat dissipating component according to an embodiment of the present invention. The heat dissipating component includes a backing plate 16, a first-dehydration heat 201218937 structure 18, and a first heat dissipation structure 22, and the first heat dissipation structure 18 is clearly shown in FIG. And the type of the second heat dissipation structure 22, the back plate 16 is indicated by a broken line. As shown in FIG. 2, the first heat dissipation structure 22 can be disposed in a stepped accommodating space defined by the first heat dissipation structure base 18a and the back plate 16, and when the second heat dissipation structure 22 is placed, the second heat dissipation A side surface R of the structure 22 facing away from the first heat dissipation structure 18 and the back surface 16 facing away from a side surface 8 of the first heat dissipation structure 18
質上平齊，因此當背板16、第一散熱結構18及第二散熱結 構22組裝後可獲得一具有良好平整度的平面狀散熱組件， 故可有效減少組裝厚度並利於薄型化。於一實施例中，第二 散熱結構22可包含複數散熱鰭片，且散熱鰭片相對基部 的第一表面P的高度可與背板16的厚度實質上相同，且如 圖1所示，第一散熱結構基部18a的厚度可與導光板12的厚 度實質上相同’如此可使背光模組1()整體更有效地薄型化。 再者’如圖3所示，背光模組1()可包含—膠框24 (陰影線部 幻，膠框24固定於背板16上且覆蓋部分第—散熱結構Μ， 勝框24還暴露第二散熱結構22，因此例如散熱則構成的 第二散熱結構22可直接與空氣接_獲得良好的散敎效果。 另外’第一散熱結構18及第二散熱結構22例如可由散 熱特性良好的轉型材料構成，歸板16例如可由崎型 材料或鋼材所構成。於一實施例中，發光元件Μ可為至少 :發光二極體燈條，且第二散熱結構22的各個㈣片二 長軸方向可與發光二極體燈條的長轴方向實質上平行以便 201218937 於加工。依發明人的實際量測結果，發光二極體燈條表面溫 度可降至53°C，且第二散熱結構22的表面溫度可降至45 °c，故於上述各個實施例中，由背板16、第一散熱結構18 及第二散熱結構22組裝構成的散熱組件可提供良好的散熱 效果。 綜上所述，本發明之實施例的散熱組件及背光模組 至少具有下列其中一個優點： 第一散熱結構係設置於第一散熱結構的基部與背板界 定出的一容置空間内，且第二散熱結構的高度可與背板實質 上相同，故背板、第一散熱結構及第二散熱結構組裝後可獲 得一具有良好平整度的平面狀散熱組件，不會因設置散熱件 而額外增加厚度，使背光模組整體易於薄型化。再者，因背 光模組組裝後膠框暴露第二散熱結構，因此第二散熱結構可 直接與空氣接觸而獲得良好的散熱效果。 惟以上所述者，僅為本利之較佳實施_已，當不能 以此限定本發明實施之範圍，即大凡依本發明巾請專利範圍 及發明·内容所作之簡單的等效變化與修飾，皆仍屬本發 明專利涵蓋之範_ 4外本發明的任—實施例或中請專利 範圍不須達成本發明所揭露之全部目的或優點或特點。此 外，摘要部分和標題僅是用來辅助專利文件搜尋之用並非 用來限制本發明之權利範圍。 201218937 【圖式簡單說明】 圖1為依本發明一實施例之背光模組的示意圖。 圖2為依本發明一實施例之散熱組件的示意圖。 圖3為依本發明另一實施例之背光模組的示意圖。 圖4為一習知背光模組的示意圖。 【主要元件符號說明】Since the back plate 16, the first heat dissipation structure 18 and the second heat dissipation structure 22 are assembled, a planar heat dissipation component having a good flatness can be obtained, so that the assembly thickness can be effectively reduced and the thickness can be reduced. In an embodiment, the second heat dissipation structure 22 may include a plurality of heat dissipation fins, and the height of the heat dissipation fins relative to the first surface P of the base may be substantially the same as the thickness of the back plate 16, and as shown in FIG. The thickness of the heat dissipation structure base portion 18a can be substantially the same as the thickness of the light guide plate 12. Thus, the entire backlight module 1 can be made thinner and more effectively. Furthermore, as shown in FIG. 3, the backlight module 1 () may include a plastic frame 24 (the hatched portion is phantom, the plastic frame 24 is fixed on the back plate 16 and covers a portion of the heat dissipation structure Μ, and the win frame 24 is also exposed. The second heat dissipation structure 22, for example, the second heat dissipation structure 22 formed by heat dissipation can be directly connected to the air to obtain a good heat dissipation effect. Further, the first heat dissipation structure 18 and the second heat dissipation structure 22 can be transformed by, for example, good heat dissipation characteristics. In the embodiment, the illuminating element Μ can be at least: a light-emitting diode light bar, and each of the second heat-dissipating structures 22 has a long axis direction. It can be substantially parallel with the long axis direction of the LED strip for 201218937. According to the actual measurement results of the inventor, the surface temperature of the LED strip can be reduced to 53 ° C, and the second heat dissipation structure 22 The surface temperature can be reduced to 45 ° C. Therefore, in the above embodiments, the heat dissipating component assembled by the back plate 16, the first heat dissipation structure 18 and the second heat dissipation structure 22 can provide a good heat dissipation effect. , an embodiment of the invention The heat dissipating component and the backlight module have at least one of the following advantages: the first heat dissipating structure is disposed in an accommodating space defined by the base and the back plate of the first heat dissipating structure, and the height of the second heat dissipating structure and the back plate substantially The same is true, so that the back plate, the first heat dissipation structure and the second heat dissipation structure are assembled to obtain a planar heat dissipation component with good flatness, and the thickness is not increased by providing the heat dissipation member, so that the backlight module as a whole is easy to be thinned. Furthermore, since the plastic frame exposes the second heat dissipation structure after the backlight module is assembled, the second heat dissipation structure can directly contact the air to obtain a good heat dissipation effect. However, the above is only a preferred implementation of the present invention. The scope of the present invention is not limited thereto, that is, the simple equivalent changes and modifications made by the patent scope and the invention and contents of the invention are still covered by the invention. The entire scope of the invention or the claims are not required to achieve all of the objects or advantages or features disclosed herein. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic diagram of a backlight module according to an embodiment of the invention. FIG. 2 is a schematic diagram of a heat dissipation assembly according to an embodiment of the invention. Figure 3 is a schematic diagram of a backlight module according to another embodiment of the present invention. Figure 4 is a schematic diagram of a conventional backlight module.
10 背光模組 100 背光模組 12 導光板 102 導光板 12a 導光板入光面 104 發光二極體燈條 14 發光元件 106 背板 16 背板 106a 背板彎折部 18 第一散熱結構 108 .膠框 18a 第一散熱結構基部 P 基部第一表面 18b 第一散熱結構侧部 Q 基部第二表面 22 第二散熱結構 R 第二散熱結構侧面 24 膠框 S 背板侧面10 backlight module 100 backlight module 12 light guide plate 102 light guide plate 12a light guide plate light-incident surface 104 light-emitting diode light bar 14 light-emitting element 106 back plate 16 back plate 106a back plate bent portion 18 first heat-dissipating structure 108. Frame 18a first heat dissipation structure base P base first surface 18b first heat dissipation structure side Q base second surface 22 second heat dissipation structure R second heat dissipation structure side 24 plastic frame S back plate side