JP5449273B2 - Light emitting device - Google Patents
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- JP5449273B2 JP5449273B2 JP2011181644A JP2011181644A JP5449273B2 JP 5449273 B2 JP5449273 B2 JP 5449273B2 JP 2011181644 A JP2011181644 A JP 2011181644A JP 2011181644 A JP2011181644 A JP 2011181644A JP 5449273 B2 JP5449273 B2 JP 5449273B2
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- 230000000630 rising effect Effects 0.000 claims description 10
- 239000000463 material Substances 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 238000005286 illumination Methods 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000004378 air conditioning Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 235000012489 doughnuts Nutrition 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Description
この発明は、発光ダイオード（ＬＥＤ）を使用した発光装置に関するものである。 The present invention relates to a light emitting device using a light emitting diode (LED).
従来のＬＥＤ（発光ダイオード）を用いた照明では、例えば特許文献１のように放熱板に固定されたＬＥＤと、放熱板を設置する設置板とから成っている。また、システム天井のグリッド照明では、ＬＥＤモジュールの基板部に直接触れることができないよう、リフレクタと光の拡散効果を兼ねた意匠板が、放熱板、設置板とは別部材として必要となる。 Conventional illumination using LEDs (light emitting diodes) includes, for example, an LED fixed to a heat sink as in Patent Document 1 and an installation plate on which the heat sink is installed. In addition, in the grid lighting on the system ceiling, a design plate that serves as a reflector and a light diffusion effect is required as a separate member from the heat radiating plate and the installation plate so that the board part of the LED module cannot be directly touched.
上記で述べた意匠板は、金属（アルミや鋼板）で構成されるのが一般的であり、熱を伝える部材として優れているにもかかわらず、従来の照明装置では、放熱板とは、別部材、別部品として構成されているため、意匠板に熱が伝わらず、放熱要素として機能していなかった。 The design plate described above is generally made of metal (aluminum or steel plate), and is excellent as a member that conducts heat. Since it is configured as a member or a separate part, heat was not transmitted to the design plate and did not function as a heat dissipation element.
また、ＬＥＤは熱を背面（実装基板側）へ発する特徴があるため、ＬＥＤモジュールの前面につける意匠板に熱を伝えるのは困難であるという課題があった。 In addition, since the LED has a feature of generating heat to the back surface (mounting substrate side), there is a problem that it is difficult to transfer heat to the design plate attached to the front surface of the LED module.
そこで本発明は、放熱板と意匠板とを一体に同一材料で形成することで、意匠板に放熱機能を持たせることを目的とする。 Then, this invention aims at giving a heat dissipation function to a design board by integrally forming a heat sink and a design board with the same material.
この発明の発光装置は、
ＬＥＤが実装される実装面と、前記実装面の反対側となる裏面とを有する基板と、
熱伝導性を有する放熱板であって、前記基板の前記裏面と密着する平坦領域が形成された平坦部と、前記平坦部から引き続いて形成され、前記裏面から前記実装面の方向に向かって前記平坦部から起立する起立部と、前記起立部から引き続いて形成され、前記実装面から前記裏面に向かう前記実装面の法線の方向から前記実装面の方向を見た場合に、前記基板の周辺を覆い隠す意匠板部とを有し、前記基板の前記裏面から前記平坦領域を介して伝わった熱を放熱する放熱板と
を備えたことを特徴とする。
The light emitting device of the present invention is
A substrate having a mounting surface on which the LED is mounted and a back surface opposite to the mounting surface;
A heat radiating plate having thermal conductivity, a flat portion formed with a flat region in close contact with the back surface of the substrate, formed continuously from the flat portion, and from the back surface toward the mounting surface When the direction of the mounting surface is seen from the direction of the normal of the mounting surface, which is formed continuously from the rising portion and rising from the flat portion, and extends from the mounting surface to the back surface, the periphery of the substrate And a heat radiating plate that radiates heat transmitted from the back surface of the substrate through the flat region.
この発明の発光装置によれば、今まで放熱部材として用いていなかった意匠板を、放熱板と一体に同一部材で形成したので、意匠板からもＬＥＤの発生熱を放熱することができるため、放熱効果を高めることができる。 According to the light emitting device of the present invention, since the design plate that has not been used as a heat radiating member until now is formed of the same member integrally with the heat radiating plate, the generated heat of the LED can be radiated from the design plate, The heat dissipation effect can be enhanced.
実施の形態１．
以下、図１〜図７に基づいて、実施の形態１の照明装置１００（発光装置）を説明する。照明装置１００の特徴の一つは、ＬＥＤの発生熱を放熱する放熱板が、意匠板の機能も兼用することである。
Embodiment 1 FIG.
Hereinafter, based on FIGS. 1-7, the illuminating device 100 (light-emitting device) of Embodiment 1 is demonstrated. One of the features of the lighting device 100 is that the heat radiating plate that radiates the heat generated by the LED also functions as a design plate.
＜照明装置１００の構成＞
図１は、照明装置１００の斜視図であり、後述のフィン１２１−Ａ〜１２１−Ｇは省略している。
図２は、図１のＸ方向矢視を示す図である。
図３は、図１のＹ方向矢視を示す図であり、後述の通気孔１３１−Ａ、１３１−Ｂを示した。照明装置１００は、天井設置型の照明装置であり、図１のＸ方向が天井方向である。
<Configuration of lighting apparatus 100>
FIG. 1 is a perspective view of the lighting device 100, and fins 121-A to 121-G described later are omitted.
FIG. 2 is a view showing the X direction arrow of FIG.
FIG. 3 is a view showing the direction of the arrow Y in FIG. 1 and shows air holes 131-A and 131-B described later. The lighting device 100 is a ceiling-mounted lighting device, and the X direction in FIG. 1 is the ceiling direction.
図４は、ＬＥＤモジュール１１０の意匠板付き放熱板１２０（放熱板）への取り付けを示す図である。
図５は、照明装置１００をＸ方向（図１）から見た図であり、簡単のために筐体１３０と、意匠板付き放熱板１２０の意匠板部１２０Ａを除いて示している。
図６は、図５のＡ−Ａ断面図である。
図７は、筐体１３０に設置された、ＬＥＤモジュール１１０と意匠板付き放熱板１２０とを、Ｗ方向（図５）から見た状態を示す図である。図７は、Ｚ方向におけるＬＥＤと、開口（フィン）との位置関係を示すための図である。
FIG. 4 is a diagram illustrating attachment of the LED module 110 to the heat sink 120 with a design plate (heat sink).
FIG. 5 is a view of the lighting device 100 as viewed from the X direction (FIG. 1), and shows the housing 130 and the design plate portion 120A of the heat sink 120 with a design plate for simplicity.
6 is a cross-sectional view taken along the line AA in FIG.
FIG. 7 is a diagram illustrating a state in which the LED module 110 and the heat sink 120 with a design plate installed in the housing 130 are viewed from the W direction (FIG. 5). FIG. 7 is a diagram for illustrating a positional relationship between the LED in the Z direction and the opening (fin).
照明装置１００は、図１あるいは図６に示すように、ＬＥＤモジュール１１０と、意匠板付き放熱板１２０と、筐体１３０とを備える。照明装置１００は、図１、図４に示すように、ＬＥＤモジュール１１０が意匠板付き放熱板１２０に収納され、ＬＥＤモジュール１１０を収納した意匠板付き放熱板１２０が、筐体１３０に収納される。ＬＥＤ基板１１２（基板）が、意匠板付き放熱板１２０の平坦部１２３（底面に相当）に密着するように、ＬＥＤ基板１１２と意匠板付き放熱板１２０との間には、シリコーングリスなどの熱伝達率の高い樹脂が塗られ、ＬＥＤ基板１１２と意匠板付き放熱板１２０との密着性を高めている。 As illustrated in FIG. 1 or FIG. 6, the lighting device 100 includes an LED module 110, a heat sink 120 with a design plate, and a housing 130. As shown in FIGS. 1 and 4, the lighting device 100 includes an LED module 110 housed in a heat sink 120 with a design plate, and a heat sink 120 with a design plate that houses the LED module 110 in a housing 130. . Heat such as silicone grease is provided between the LED substrate 112 and the heat sink 120 with the design plate so that the LED substrate 112 (substrate) is in close contact with the flat portion 123 (corresponding to the bottom surface) of the heat sink 120 with the design plate. Resin having a high transmission rate is applied to enhance the adhesion between the LED substrate 112 and the heat sink 120 with a design plate.
（ＬＥＤモジュール１１０）
ＬＥＤモジュール１１０は、図４（ｂ）に示すように、複数のＬＥＤ１１１（この例では６個）と、複数のＬＥＤ１１１を実装するＬＥＤ基板１１２と、ＬＥＤ１１１の光を拡散するリフレクタ１１３とを備えている。
（１）ＬＥＤ基板１１２は、図６に示すように、ＬＥＤ１１１が実装される実装面１１２Ａと、実装面１１２Ａの反対側となる裏面１１２Ｂとを有する。
（２）リフレクタ１１３（反射部）は、図５、図６に示すように、ＬＥＤ１１１の周囲を囲みつつＬＥＤ基板１１２の実装面１１２Ａから壁面状に起立する反射面１１３ＢをＬＥＤ１１１ごとに有すると共に、裏面１１２Ｂから実装面１１２Ａに向かうＹ方向（図６）の実装面の法線方向の高さＨが所定の高さである。
(LED module 110)
As shown in FIG. 4B, the LED module 110 includes a plurality of LEDs 111 (six in this example), an LED substrate 112 on which the plurality of LEDs 111 are mounted, and a reflector 113 that diffuses the light from the LEDs 111. Yes.
(1) As shown in FIG. 6, the LED substrate 112 has a mounting surface 112A on which the LED 111 is mounted and a back surface 112B on the opposite side of the mounting surface 112A.
(2) As shown in FIG. 5 and FIG. 6, the reflector 113 (reflecting part) has a reflecting surface 113B that stands up in a wall shape from the mounting surface 112A of the LED substrate 112 for each LED 111 while surrounding the LED 111, The height H in the normal direction of the mounting surface in the Y direction (FIG. 6) from the back surface 112B toward the mounting surface 112A is a predetermined height.
（意匠板付き放熱板１２０）
＜材質＞
図４（ａ）等に示す意匠板付き放熱板１２０は、熱伝導性を有する薄板材で形成されている。意匠板付き放熱板１２０は、全体がＬＥＤ１１１の熱を逃がす放熱板であり、ＬＥＤ基板１１２を直接触ることができないように、また視認できないようにする目的のための意匠板部１２０Ａが、その一部に形成されている。意匠板付き放熱板１２０は、意匠板部１２０Ａを含んで、全体が同一材料で一体に形成されている。意匠板付き放熱板１２０は、鋼板やアルミ、あるいは、熱伝達性の高い樹脂で構成される。
(Heat sink 120 with design plate)
<Material>
The heat sink 120 with a design plate shown in FIG. 4A and the like is formed of a thin plate material having thermal conductivity. The heat sink 120 with a design plate is a heat sink that releases the heat of the LED 111 as a whole, and a design plate portion 120A for the purpose of preventing the LED substrate 112 from being in direct contact and invisible. It is formed in the part. The heat sink 120 with a design plate includes the design plate portion 120A, and the whole is integrally formed of the same material. The heat sink 120 with a design plate is made of a steel plate, aluminum, or a resin having high heat transfer properties.
＜意匠板付き放熱板１２０構成＞
意匠板付き放熱板１２０は、図４（ａ）、図６に示すように、
（１）ＬＥＤ基板１１２の裏面１１２Ｂと密着する平坦領域（ＬＥＤ基板１１２の裏面１１２Ｂと接触する面）が形成された平坦部１２３と、
（２）平坦部１２３から引き続いて形成され、裏面１１２Ｂから実装面１１２Ａに向かう方向（Ｙ方向）に向かって平坦部１２３から起立する起立部である第１の壁部１２４Ａ及び第２の壁部１２４Ｂと、
（３）起立部である第１の壁部１２４Ａ及び第２の壁部１２４Ｂから引き続いて形成され、実装面１１２Ａから裏面１１２Ｂに向かう実装面１１２Ａの法線の方向（図６の反Ｙ方向）から実装面１１２Ａ方向を見た場合に、ＬＥＤ基板１１２の周辺を覆い隠す意匠板部１２０Ａと
を有する。
（４）意匠板付き放熱板１２０は、ＬＥＤ基板１１２の裏面１１２Ｂから平坦領域を介して伝わった熱を、意匠板部１２０Ａを含め全体で放熱する。
<Configuration of heat sink 120 with design plate>
As shown in FIG. 4A and FIG.
(1) a flat portion 123 formed with a flat region (a surface in contact with the back surface 112B of the LED substrate 112) in close contact with the back surface 112B of the LED substrate 112;
(2) The first wall portion 124A and the second wall portion, which are formed continuously from the flat portion 123, and stand up from the flat portion 123 in the direction (Y direction) from the back surface 112B toward the mounting surface 112A. 124B,
(3) The direction of the normal line of the mounting surface 112A that is formed subsequent to the first wall portion 124A and the second wall portion 124B, which are upright portions, and that faces the back surface 112B from the mounting surface 112A (the anti-Y direction in FIG. 6). When viewed from the direction of the mounting surface 112A, a design plate portion 120A that covers the periphery of the LED substrate 112 is provided.
(4) The heat sink 120 with the design plate dissipates the heat transmitted from the back surface 112B of the LED substrate 112 through the flat region including the design plate portion 120A as a whole.
（フィン）
図４（ａ）に示すように、意匠板付き放熱板１２０のＬＥＤモジュール側である第２の壁部１２４Ｂには、意匠板付き放熱板１２０の材料である薄板材に切り込みを入れて、切り込みを曲げ成型してなるフィン１２１が立っており、もとのフィン１２１の箇所は開口１２２となっている。つまり、第２の壁部１２４Ｂ（起立部）には、フィン１２１−Ａ〜フィン１２１−Ｇが、薄板材である意匠板付き放熱板１２０の第２の壁部１２４Ｂに入れられた切り込みの残余の薄板材の部分が引き起こされて形成されている。なお、図４では第２の壁部１２４Ｂにのみフィンを示しているが、第１の壁部１２４Ａにも、同様にフィンが形成されている。第１の壁部１２４Ａのフィンは、図５、図６に示した。
(fin)
As shown to Fig.4 (a), in the 2nd wall part 124B which is the LED module side of the heat sink 120 with a design board, it cuts into the thin plate material which is the material of the heat sink 120 with a design board, and cuts The fin 121 formed by bending is standing, and the location of the original fin 121 is an opening 122. That is, in the second wall portion 124B (standing portion), the remainder of the cuts in which the fins 121-A to 121-G are put in the second wall portion 124B of the heat sink 120 with a design plate that is a thin plate material. Part of the thin plate material is caused and formed. In FIG. 4, fins are shown only on the second wall portion 124B, but fins are similarly formed on the first wall portion 124A. The fins of the first wall portion 124A are shown in FIGS.
図４（ｂ）、図５、図６等に示すように、ＬＥＤ基板１１２は、略長方形の形状をなすと共に、長手方向（図４（ｂ）のＺ方向）に沿って、ＬＥＤ１１１が実装面１１２Ａに複数実装されている。また、意匠板付き放熱板１２０の起立部は、略長方形の形状をなすＬＥＤ基板１１２のそれぞれの長辺１１２Ｃ、１１２Ｄ（図４（ｂ））の箇所で平坦部１２３から実装面１１２Ａに起き上がる方向に折り曲がることで、平坦部１２３から起立する壁となる長辺１１２Ｃ側の第１の壁部１２４Ａと他方の長辺１１２Ｄ側の第２の壁部１２４Ｂとを有する。図４（ａ）に示すように、複数のフィン１２１−Ａ〜１２１−Ｇは、第２の壁部１２４Ｂに、ＬＥＤ基板１１２の長手方向（Ｚ方向）に沿って形成されている。図４（ａ）の場合には図示は省略したが、第１の壁部１２４Ａにも、第２の壁部１２４Ｂと同様に複数のフィン１２１−Ａ〜１２１−Ｇが形成されている。なお、複数のフィン１２１−Ａ〜１２１−Ｇは両方の壁部に形成された方が好ましいが、一方の壁部に形成されても構わない。 As shown in FIG. 4B, FIG. 5, FIG. 6, etc., the LED substrate 112 has a substantially rectangular shape, and the LED 111 is mounted on the mounting surface along the longitudinal direction (Z direction in FIG. 4B). A plurality of them are mounted on 112A. In addition, the rising portion of the heat sink 120 with a design plate is a direction in which it rises from the flat portion 123 to the mounting surface 112A at each of the long sides 112C and 112D (FIG. 4B) of the LED substrate 112 having a substantially rectangular shape. The first wall 124 </ b> A on the long side 112 </ b> C and the second wall 124 </ b> B on the other long side 112 </ b> D, which are walls rising from the flat part 123, are formed. As shown in FIG. 4A, the plurality of fins 121-A to 121-G are formed on the second wall portion 124B along the longitudinal direction (Z direction) of the LED substrate 112. Although not shown in the case of FIG. 4A, a plurality of fins 121-A to 121-G are formed on the first wall portion 124A as well as the second wall portion 124B. The plurality of fins 121-A to 121-G are preferably formed on both wall portions, but may be formed on one wall portion.
（フィン高さ）
フィン１２１、開口１２２の高さは、図６に示すように、リフレクタ１１３の高さ以下であるとする。リフレクタの高さ以下とすることで、光源の光が横から漏れることなく、正面側へと効率よく照射されるようになる。つまり、図６に示すように、裏面１１２Ｂから実装面１１２Ａに向かうＹ方向の実装面１１２Ａの法線方向を高さ方向とした場合に、各フィン１２１は、最も高い部位の高さが、リフレクタ１１３の最も高い部位の高さ以下である。つまり、図６において、各フィン１２１のＹ方向に最も高い箇所は、リフレクタ１１３の上面１１３Ａ（図４、図６）よりも低い。
(Fin height)
The height of the fin 121 and the opening 122 is assumed to be equal to or lower than the height of the reflector 113 as shown in FIG. By setting the height to the height of the reflector or less, light from the light source is efficiently emitted to the front side without leaking from the side. That is, as shown in FIG. 6, when the normal direction of the mounting surface 112A in the Y direction from the back surface 112B toward the mounting surface 112A is the height direction, each fin 121 has a height at the highest part. It is below the height of the highest part of 113. That is, in FIG. 6, the highest portion in the Y direction of each fin 121 is lower than the upper surface 113 </ b> A (FIG. 4, FIG. 6) of the reflector 113.
（長手方向における開口とＬＥＤとの位置関係）
図７は、長手方向（Ｚ方向）における開口とＬＥＤとの位置関係を示している。図７に示すように、開口１２２は、ＬＥＤ１１１の側部に位置しないように、実装されているＬＥＤ１１１のピッチ内の幅で、ＬＥＤ１１１と交互に配置される。つまり、複数の開口１２２−Ａ〜１２２−Ｇの各開口は、図５のＷ方向から見た場合、実装面１１２Ａに実装されたどのＬＥＤとも、長手方向（Ｚ方向）において重なることのない位置に形成されている。この意味をさらに詳しく説明する。図５において、フィンを引き起こすことで形成された開口１２２は、ＬＥＤ間であれば範囲Ｂ１に形成され、左端では範囲Ｂ２に形成され、右端では範囲Ｂ３に形成される。これらの内容は、図７にも現れている。図７は、図５のＷ方向から見た場合を示しているが、図７によれば、ＬＥＤ基板１１２の長手方向（Ｚ方向）の一本の直線と、実装面１１２Ａの法線のうち長手方向の前記一本の直線と交わる法線とで張られる面の法線方向（Ｗ方向）から見た場合、複数の開口１２２−Ａ〜１２２−Ｇの各開口は、実装面１１２Ａに実装されたどのＬＥＤ１１１とも、ＬＥＤ基板１１２の長手方向（Ｚ方向）において重なることのない位置に形成されている。熱の伝達は、意匠板付き放熱板１２０を通して行われるため、開口があるとその部分に熱は伝達しない。熱源はＬＥＤであるため、Ｗ矢視でのＬＥＤの側部には、意匠板付き放熱板１２０の部材が存在するように（開口が側部に存在しないように）構成する。
(Positional relationship between opening and LED in the longitudinal direction)
FIG. 7 shows the positional relationship between the opening and the LED in the longitudinal direction (Z direction). As shown in FIG. 7, the openings 122 are alternately arranged with the LEDs 111 with a width within the pitch of the mounted LEDs 111 so as not to be positioned on the side portions of the LEDs 111. That is, each opening of the plurality of openings 122-A to 122-G does not overlap with any LED mounted on the mounting surface 112A in the longitudinal direction (Z direction) when viewed from the W direction in FIG. Is formed. This meaning will be described in more detail. In FIG. 5, the opening 122 formed by causing the fin is formed in a range B <b> 1 between LEDs, formed in a range B <b> 2 at the left end, and formed in a range B <b> 3 at the right end. These contents also appear in FIG. FIG. 7 shows a case when viewed from the W direction of FIG. 5, but according to FIG. 7, one straight line of the LED substrate 112 (Z direction) and a normal line of the mounting surface 112 </ b> A When viewed from the normal direction (W direction) of the surface stretched by the normal line intersecting with the one straight line in the longitudinal direction, each of the plurality of openings 122-A to 122-G is mounted on the mounting surface 112A. Each of the LEDs 111 formed is formed at a position that does not overlap in the longitudinal direction (Z direction) of the LED substrate 112. Since heat is transmitted through the heat sink 120 with the design plate, heat is not transmitted to the portion if there is an opening. Since the heat source is an LED, it is configured such that a member of the heat sink 120 with a design plate is present on the side portion of the LED as viewed in the direction of the arrow W (no opening is present on the side portion).
（意匠板の内側塗装）
また、意匠板部１２０Ａに光を拡散させる効果を持たせるため、意匠板付き放熱板１２０の意匠板部１２０Ａの内側１２０Ｂ（図６）は、白色に塗装する。白色に塗装することで指向性の強いＬＥＤの光を柔らかく拡散させ、照明として空間を照らす効果がある。
(Inside coating of design board)
Moreover, in order to give the effect which diffuses light to the design board part 120A, the inner side 120B (FIG. 6) of the design board part 120A of the heat sink 120 with a design board is painted white. By painting in white, the light of LED with strong directivity is diffused softly, and there is an effect of illuminating the space as illumination.
（筐体の空調リターン）
意匠板付き放熱板１２０を囲う筐体１３０は、図１、図３等に示すように、空気の流れを通過させる通気孔１３１−Ａ〜１３１−Ｄ（空調リターン）が形成されている。図１には通気孔１３１−Ｄを示したが、通気孔１３１−Ｄの形成されている反対側の側面にも、通気孔１３１−Ｄと同様の通気孔１３１−Ｃが形成されている。これらの通気孔は、上昇気流の流れによって、天井裏へ熱を逃がす効果がある。暖かい空気は上に行くため、特にファン等を設けることなく、熱を逃がすことができる。
(Case air conditioning return)
As shown in FIGS. 1, 3, and the like, the housing 130 that surrounds the heat sink 120 with the design plate is formed with air holes 131 -A to 131 -D (air conditioning returns) that allow the air flow to pass therethrough. Although the vent hole 131-D is shown in FIG. 1, a vent hole 131-C similar to the vent hole 131-D is formed on the opposite side surface where the vent hole 131-D is formed. These vent holes have an effect of releasing heat to the back of the ceiling by the flow of the updraft. Since warm air goes upward, heat can be released without providing a fan or the like.
実施の形態１の照明装置１００によれば、従来では放熱部材として用いられていなかった意匠板を、放熱板と一体に、同一部材で形成した。このため、意匠板にもＬＥＤの発生した熱を伝えることができるようになり、意匠板からも放熱することができる。また、ＬＥＤは背面に熱を発するため背面の熱を正面へ逃がしにくいという課題があったが、前面の意匠板へ熱を伝え、また起立部にフィンを設けたので、意匠板とフィンとにより、背面の熱の放熱効果を高める効果がある。 According to the lighting device 100 of the first embodiment, a design plate that has not been conventionally used as a heat radiating member is formed integrally with the heat radiating plate using the same member. For this reason, it becomes possible to transmit the heat generated by the LED to the design plate, and to dissipate heat from the design plate. In addition, since LED emits heat to the back side, there was a problem that it was difficult to release the heat of the back side to the front side, but because heat was transmitted to the front design plate and fins were provided on the standing part, the design plate and fins This has the effect of increasing the heat dissipation effect of the back heat.
実施の形態２．
図８〜図１０を参照して実施の形態２を説明する。実施の形態２は、円形の照明装置１００−２（発光装置）に関する。
図８は、照明装置１００−２の斜視図である。
図９は、図８のＸ方向矢視である。
図１０は、図９のＡ−Ａ断面図である。
Embodiment 2. FIG.
The second embodiment will be described with reference to FIGS. The second embodiment relates to a circular illumination device 100-2 (light emitting device).
FIG. 8 is a perspective view of the lighting device 100-2.
FIG. 9 is a view in the X direction of FIG.
FIG. 10 is a cross-sectional view taken along the line AA of FIG.
実施の形態１では、箱型の筐体１３０に収納される照明装置１００を示したが、実施の形態２の照明装置１００−２は円形である。 In Embodiment 1, the lighting device 100 housed in the box-shaped housing 130 is shown, but the lighting device 100-2 of Embodiment 2 is circular.
照明装置１００−２は、４個（複数）のＬＥＤが実装されるＬＥＤ基板１１２−２と、意匠板付き放熱板１２０−２とを備えている。意匠板付き放熱板１２０−２は、意匠板付き放熱板１２０と同様に熱伝導性を有する薄板材で形成されており、また意匠板部１２０−２Ａを含んで形成されている。ＬＥＤ基板１１２−２は、図１０に示すように、ＬＥＤ１１１が実装される実装面１１２Ａと、実装面１１２Ａの反対側となる裏面１１２Ｂとを有する。 The illumination device 100-2 includes an LED substrate 112-2 on which four (plural) LEDs are mounted, and a heat sink 120-2 with a design plate. The heat sink 120-2 with a design plate is formed of a thin plate material having thermal conductivity similarly to the heat sink 120 with a design plate, and includes the design plate portion 120-2A. As shown in FIG. 10, the LED substrate 112-2 has a mounting surface 112A on which the LED 111 is mounted and a back surface 112B on the opposite side of the mounting surface 112A.
意匠板付き放熱板１２０−２は、図１０に示すように、平坦部１２３−２と、起立部１２４−２と、意匠板部１２０−２Ａとを備えている。
（１）平坦部１２３−２は、ＬＥＤ基板１１２−２の裏面１１２Ｂと密着する平坦領域が形成されている。
（２）起立部１２４−２は、平坦部１２３−２から引き続いて形成され、裏面１１２Ｂから実装面１１２Ａの方向に向かって平坦部１２３−２から起立する。
（３）意匠板部１２０−２Ａは、起立部１２４−２から引き続いて形成され、実装面１１２Ａから裏面１１２Ｂに向かう実装面１１２Ａの法線の方向（図８のＸ方向）から実装面１１２Ａの方向を見た場合に（図９に相当）、ＬＥＤ基板１１２−２の周辺を覆い隠す。図９、図１０に示すように、意匠板部１２０−２Ａは、図１０に示す破線で示す範囲１２５を覆い隠す。図１０は断面であるので、実際の範囲１２５は、ドーナッツ形状（図９）である。
As shown in FIG. 10, the heat sink 120-2 with a design plate includes a flat portion 123-2, an upright portion 124-2, and a design plate portion 120-2A.
(1) The flat part 123-2 is formed with a flat region in close contact with the back surface 112B of the LED substrate 112-2.
(2) The standing portion 124-2 is formed following the flat portion 123-2 and rises from the flat portion 123-2 toward the mounting surface 112A from the back surface 112B.
(3) The design plate portion 120-2A is formed continuously from the standing portion 124-2, and extends from the mounting surface 112A normal direction (X direction in FIG. 8) of the mounting surface 112A toward the back surface 112B from the mounting surface 112A. When the direction is viewed (corresponding to FIG. 9), the periphery of the LED board 112-2 is covered. As illustrated in FIGS. 9 and 10, the design plate portion 120-2 </ b> A covers a range 125 indicated by a broken line illustrated in FIG. 10. Since FIG. 10 is a cross section, the actual range 125 is a donut shape (FIG. 9).
また意匠板付き放熱板１２０−２は、部分的に円筒形状である平坦部１２３−２には、意匠板付き放熱板１２０と同様のフィン１２１が形成されている。フィン１２１は、図９に示すように、半径方向で、ＬＥＤどうしの間に形成される。これは実施の形態１でＬＥＤの側部に開口を配置しないのと同じ理由である。 Moreover, the heat sink 120-2 with a design board has the fin 121 similar to the heat sink 120 with a design board formed in the flat part 123-2 which is partially cylindrical shape. As shown in FIG. 9, the fins 121 are formed between the LEDs in the radial direction. This is the same reason that the opening is not arranged on the side of the LED in the first embodiment.
実施の形態２の照明装置１００−２によれば、ＬＥＤの発生した熱を意匠板部１２０−２Ａからも放熱できるので、放熱の効果が向上する。 According to the illumination device 100-2 of the second embodiment, the heat generated by the LEDs can be dissipated from the design plate portion 120-2A, so that the effect of heat dissipation is improved.
１００，１００−２ 照明装置、１１０ ＬＥＤモジュール、１１１ ＬＥＤ、１１２Ａ 実装面、１１２Ｂ 裏面、１１２Ｃ，１１２Ｄ 長辺、１１２ ＬＥＤ基板、１１３ リフレクタ、１１３Ａ 上面、１１３Ｂ 反射面、１２０，１２０−２ 意匠板付き放熱板、１２０Ａ，１２０−２Ａ 意匠板部、１２１，１２１−Ａ〜１２１−Ｇ フィン、１２２，１２２−Ａ〜１２２−Ｇ 開口、１２３，１２３−２ 平坦部、１２４Ａ 第１の壁部、１２４Ｂ 第２の壁部、１２４−２ 起立部、１３０ 筐体、１３１−Ａ〜１３１−Ｄ 通気孔、１４０ 空気の流れ。 100, 100-2 Illumination device, 110 LED module, 111 LED, 112A mounting surface, 112B back surface, 112C, 112D long side, 112 LED substrate, 113 reflector, 113A top surface, 113B reflecting surface, 120, 120-2 with design plate Heat sink, 120A, 120-2A Design plate part, 121, 121-A to 121-G fin, 122, 122-A to 122-G opening, 123, 123-2 flat part, 124A first wall part, 124B 2nd wall part, 124-2 standing part, 130 housing | casing, 131-A-131-D ventilation hole, 140 Flow of air.
Claims (2)
熱伝導性を有する放熱板であって、前記基板の前記裏面と密着する平坦領域が形成された平坦部と、前記平坦部から引き続いて形成され、前記裏面から前記実装面の方向に向かって前記平坦部から起立する起立部と、前記起立部から引き続いて形成され、前記実装面から前記裏面に向かう前記実装面の法線の方向から前記実装面の方向を見た場合に、前記基板の周辺を覆い隠す意匠板部とを有し、前記基板の前記裏面から前記平坦領域を介して伝わった熱を放熱する放熱板と
を備え、
前記放熱板は、
前記起立部に、フィンを有し、
前記フィンは、
前記放熱板の前記起立部に入れられた切り込みの残余の部分が引き起こされて形成され、
前記基板は、
略長方形の形状をなすと共に、長手方向に沿ってＬＥＤが前記実装面に複数実装され、
前記起立部は、
略長方形の形状をなす前記基板のそれぞれの長辺の箇所で前記平坦部から前記実装面側に起き上がる方向に折り曲がることで、前記平坦部から起立する壁となる一方の長辺側の第１の壁部と他方の長辺側の第２の壁部とを有すると共に、複数の前記フィンを有し、
前記複数のフィンは、
前記第１の壁部と前記第２の壁部との少なくともいずれかの壁部に前記基板の前記長手方向に沿って形成され、
前記放熱板は、
前記残余の部分が引き起こされることで、各フィンに対応する複数の開口が前記起立部に形成され、
前記複数の開口の各開口は、
前記基板の前記長手方向の一本の直線と、前記実装面の法線のうち前記長手方向の前記一本の直線と交わる法線とで張られる面の法線方向から見た場合に、前記実装面に実装されたどのＬＥＤとも、前記基板の前記長手方向において重なることのない位置に形成されていることを特徴とする発光装置。 A substrate having a mounting surface on which the LED is mounted and a back surface opposite to the mounting surface;
A heat radiating plate having thermal conductivity, a flat portion formed with a flat region in close contact with the back surface of the substrate, formed continuously from the flat portion, and from the back surface toward the mounting surface When the direction of the mounting surface is seen from the direction of the normal of the mounting surface, which is formed continuously from the rising portion and rising from the flat portion, and extends from the mounting surface to the back surface, the periphery of the substrate And a design plate portion that covers the surface, and a heat radiating plate that radiates heat transmitted from the back surface of the substrate through the flat region ,
The heat sink is
The upright portion has fins,
The fin is
The remaining part of the notch put into the upright portion of the heat sink is caused and formed,
The substrate is
A plurality of LEDs are mounted on the mounting surface along the longitudinal direction while forming a substantially rectangular shape,
The upright portion is
The first side of one long side that becomes a wall standing up from the flat portion is bent at a position of each long side of the substrate having a substantially rectangular shape in a direction rising from the flat portion to the mounting surface side. And a plurality of the fins, and a second wall portion on the other long side.
The plurality of fins are:
Formed along the longitudinal direction of the substrate on at least one of the first wall and the second wall;
The heat sink is
A plurality of openings corresponding to the fins are formed in the upright portion by causing the remaining portion to be caused,
Each opening of the plurality of openings is
When viewed from the normal direction of the surface stretched between the one straight line in the longitudinal direction of the substrate and the normal line intersecting the one straight line in the longitudinal direction among the normal lines of the mounting surface, A light-emitting device characterized in that any LED mounted on a mounting surface is formed at a position that does not overlap in the longitudinal direction of the substrate.
熱伝導性を有する放熱板であって、前記基板の前記裏面と密着する平坦領域が形成された平坦部と、前記平坦部から引き続いて形成され、前記裏面から前記実装面の方向に向かって前記平坦部から起立する起立部と、前記起立部から引き続いて形成され、前記実装面から前記裏面に向かう前記実装面の法線の方向から前記実装面の方向を見た場合に、前記基板の周辺を覆い隠す意匠板部とを有し、前記基板の前記裏面から前記平坦領域を介して伝わった熱を放熱する放熱板と
を備えた発光装置であって、
前記放熱板は、
前記起立部に、フィンを有し、
前記フィンは、
前記放熱板の前記起立部に入れられた切り込みの残余の部分が引き起こされて形成され、
前記基板は、
略長方形の形状をなすと共に、長手方向に沿ってＬＥＤが前記実装面に複数実装され、
前記起立部は、
略長方形の形状をなす前記基板のそれぞれの長辺の箇所で前記平坦部から前記実装面側に起き上がる方向に折り曲がることで、前記平坦部から起立する壁となる一方の長辺側の第１の壁部と他方の長辺側の第２の壁部とを有すると共に、複数の前記フィンを有し、
前記複数のフィンは、
前記第１の壁部と前記第２の壁部との少なくともいずれかの壁部に前記基板の前記長手方向に沿って形成され、
前記発光装置は、さらに、
前記ＬＥＤの周囲を囲みつつ前記基板の前記実装面から壁面状に起立する反射面を前記ＬＥＤごとに有すると共に、前記裏面から前記実装面に向かう方向の前記実装面の法線方向の高さが所定の高さである反射部を備え、
前記フィンは、
前記裏面から前記実装面に向かう方向の前記実装面の法線方向を高さ方向とした場合に、最も高い部位の高さが前記反射部の最も高い部位の高さ以下であることを特徴とする発光装置。 A substrate having a mounting surface on which the LED is mounted and a back surface opposite to the mounting surface;
A heat radiating plate having thermal conductivity, a flat portion formed with a flat region in close contact with the back surface of the substrate, formed continuously from the flat portion, and from the back surface toward the mounting surface When the direction of the mounting surface is seen from the direction of the normal of the mounting surface, which is formed continuously from the rising portion and rising from the flat portion, and extends from the mounting surface to the back surface, the periphery of the substrate A light emitting device including a design plate portion that covers the substrate, and a heat radiating plate that radiates heat transmitted from the back surface of the substrate through the flat region ,
The heat sink is
The upright portion has fins,
The fin is
The remaining part of the notch put into the upright portion of the heat sink is caused and formed,
The substrate is
A plurality of LEDs are mounted on the mounting surface along the longitudinal direction while forming a substantially rectangular shape,
The upright portion is
The first side of one long side that becomes a wall standing up from the flat portion is bent at a position of each long side of the substrate having a substantially rectangular shape in a direction rising from the flat portion to the mounting surface side. And a plurality of the fins, and a second wall portion on the other long side.
The plurality of fins are:
Formed along the longitudinal direction of the substrate on at least one of the first wall and the second wall;
The light emitting device further includes:
Each of the LEDs has a reflecting surface that surrounds the periphery of the LED and rises in a wall shape from the mounting surface of the substrate, and a height in a normal direction of the mounting surface in a direction from the back surface to the mounting surface. A reflection portion having a predetermined height;
The fin is
When the normal direction of the mounting surface in the direction from the back surface toward the mounting surface is the height direction, the height of the highest portion is equal to or less than the height of the highest portion of the reflecting portion. Light-emitting device.
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| JP5233351B2 (en) * | 2008-03-21 | 2013-07-10 | 日亜化学工業株式会社 | LED lighting unit, LED lighting device, and LED lighting unit connector |
| JP2010198828A (en) * | 2009-02-24 | 2010-09-09 | Shihen Tech Corp | Lighting device |
| JP5375340B2 (en) * | 2009-05-29 | 2013-12-25 | 東芝ライテック株式会社 | Electrical equipment and lighting equipment |
| JP5526622B2 (en) * | 2009-06-29 | 2014-06-18 | 日亜化学工業株式会社 | Flexible substrate for backlight unit and backlight unit using the same |
| JP5500971B2 (en) * | 2009-12-21 | 2014-05-21 | 三菱電機株式会社 | Light source module and lighting device |
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