JP5399964B2 - lighting equipment - Google Patents

Description

  The present invention relates to a lighting fixture that uses a light emitting element such as a light emitting diode as a light source.

  Conventionally, a downlight (lighting fixture) using a light emitting diode (hereinafter referred to as “LED”) embedded in a ceiling as a light source is known, and is disclosed in, for example, Patent Document 1. The downlight described in Patent Literature 1 includes a metal device main body, a light source substrate on which a plurality of LEDs are mounted, a power supply device that controls a current required for lighting the LEDs, and a reflection that distributes light from the LEDs. It has a body and a baffle. The light source substrate is attached in surface contact with the bottom wall of the apparatus main body. Thus, the heat generated when the LED is lit is released into the atmosphere through the light source substrate and the apparatus main body, thereby preventing an increase in the ambient temperature around the LED. In addition, a plurality of radiating fins are provided on the outer surface of the apparatus main body, and by increasing the surface area of the outer surface of the apparatus main body with the radiating fins, the heat radiating effect is enhanced without increasing the size of the apparatus main body.

JP 2010-16003 A

  By the way, in recent years, higher output of LEDs has been promoted, and a light output equivalent to that of a conventional lighting fixture using a large number of LEDs can be obtained with a small number of LEDs. For this reason, since the space required for disposing the LED is reduced as compared with the conventional case, the fixture body of the lighting fixture can be downsized. On the other hand, even if the number of LEDs constituting the light source is reduced, the amount of heat generated when lighting is increased with a high-power LED, so the amount of heat is equal to or greater than that of a conventional lighting fixture using a large number of LEDs. Occurs when lit.

  Here, when the instrument body is downsized, the heat dissipating fins as in the above-described conventional example are also downsized, so that a sufficient heat dissipation effect cannot be obtained. Therefore, in order to make it easy to dissipate heat by convection of heat generated by the LED, it is necessary to provide a heat dissipation space between the LED and an entrance through which light emitted from the LED is incident. For this reason, it has been necessary to provide a certain distance between the LED and the entrance.

  However, if the distance between the LED and the incident port is increased, the light from the LED diffuses before reaching the incident port, and the amount of light passing through the incident port is reduced to obtain a sufficient illumination effect. There was a problem that I could not.

  The present invention has been made in view of the above points, and an object of the present invention is to provide a lighting fixture capable of obtaining a sufficient lighting effect while securing a heat radiation space necessary for heat radiation.

  The lighting fixture of the present invention includes a light emitting diode, a lighting device that supplies lighting power to the light emitting diode, and a bottomed cylindrical fixture main body that houses at least the light emitting diode, and the fixture main body is provided at the bottom thereof. A base made of a heat-dissipating material that allows the light emitting diode to be attached and releases heat generated by the light emitting diode to the outside through itself, an incident port through which light from the light emitting diode is incident, and an incident from the incident port A cylindrical frame body having an exit for emitting outward light, and the entrance is closed by a translucent member made of a material having translucency, and the light emitting diode, the entrance, A heat dissipation space for dissipating heat radiated from the light emitting diodes to the outside through the base is provided between the base and the periphery of the entrance. Selfish with rises, characterized in that the reflecting member is provided with a reflecting surface for reflecting light from the light emitting diode on the inner peripheral surface thereof.

  In this lighting apparatus, it is preferable that the frame body portion is made of a material having heat dissipation properties.

  In this lighting fixture, it is preferable that the reflecting member is made of a material having heat dissipation properties.

  In the present invention, since the light diffused from the light emitting diode until reaching the entrance can be reflected by the reflecting member, the light can be collected at the entrance, so that the amount of light passing through the entrance can be increased. . Therefore, it is possible to obtain a sufficient lighting effect while securing a heat radiation space necessary for heat radiation.

It is a figure which shows embodiment of the lighting fixture which concerns on this invention, (a) is a disassembled perspective view of a frame part, (b) is sectional drawing of a fixture main body. (A) is a whole perspective view same as the above, (b) is a top view same as the above. It is a figure which shows the LED module same as the above, and a thermal radiation base part, (a) is a disassembled perspective view, (b) is a whole perspective view. It is a figure which shows a base part same as the above, (a) is a perspective view, (b) is a bottom view. It is sectional drawing which shows the state embedded and arrange | positioned at the ceiling same as the above.

  Hereinafter, embodiments of a lighting apparatus according to the present invention will be described with reference to the drawings. In the present embodiment, the LED module 1 is embedded in a ceiling and includes a substrate 12 on which an LED chip 10 (light emitting diode) is mounted, as shown in FIGS. And a bottomed cylindrical instrument body 2 formed by combining the base 3 and the frame body 4. Further, as shown in FIGS. 2A and 2B, a power line (not shown) that connects between the lighting device A that supplies lighting power to the LED chip 10 and a commercial power source (not shown). And a terminal block B that relays AC power from a commercial power source to the lighting device A. In addition, since the lighting device A and the terminal block B are conventionally well-known, detailed description is abbreviate | omitted here.

  As shown in FIGS. 3A and 3B, the LED module 1 is a rectangular plate-shaped LED chip 10 that emits blue light and a disk-shaped seal that seals the LED chip 10 made of a translucent resin material. A sealing member 11 and a substrate 12 on which the LED chip 10 is mounted are provided. Further, a square cover 13 made of a resin material that covers the LED chip 10 and the sealing member 11 is attached to the substrate 12. A circular opening 13a is provided at the center of the cover 13, and light from the LED chip 10 passes through the opening 13a.

  The sealing member 11 is mixed with a yellow phosphor (not shown) that emits yellow light that is excited by blue light emitted from the LED chip 10 and has a complementary color relationship with the blue light. Thus, the LED module 1 emits white light through the opening 13 a of the cover 13. The LED module 1 only needs to emit white light, and the configuration of emitting white light is not limited to the combination of the LED chip 10 emitting blue light and the yellow phosphor. .

  As shown in FIG. 3A, the substrate 12 is formed in a rectangular plate shape from an insulating resin material, and semicircular cutouts 12a are provided at both ends in the longitudinal direction. . By attaching and fixing the substrate 12 to the heat radiating base portion 5 to be described later, the heat generated by the LED chip 10 is conducted to the heat radiating base portion 5 through the substrate 12. The substrate 12 may be, for example, a metal base substrate whose back surface is formed of a metal material having heat dissipation properties. In this case, the heat generated by the LED chip 10 can be efficiently conducted to the heat dissipation base 5 by bringing the surface made of the metal material into close contact with the heat dissipation base 5. Note that “having heat dissipation” means “higher thermal conductivity than other materials”.

  As shown in FIG. 3A, the heat radiating base 5 is formed in a rectangular parallelepiped shape from a material having high thermal conductivity and insulating properties, and both end portions in the longitudinal direction are processed into a triangular shape. ing. In the present embodiment, the heat radiation base 5 is made of fine ceramics (for example, aluminum nitride) in view of easy processing into a smooth flat surface with small flatness and high adhesion to the substrate 12. Yes. Circular base mounting holes 5c are provided at both ends in the longitudinal direction of the heat dissipation base 5 respectively. The heat-dissipating base 5 is fixed to the base 3 by inserting the fixing screw S2 into each base mounting hole 5c and tightening it to a pair of female threads (not shown) provided in the base 3. 4 (b)). Thus, the heat generated by the LED chip 10 is conducted to the base 3 via the substrate 12 and the heat radiating base 5 and further transmitted to the atmosphere from the base 3 to be radiated to the outside. .

  As shown in FIG. 3A, a pair of circular substrate attachment holes 5 a for attaching the substrate 12 are provided in the central portion of the heat dissipation base portion 5. Also, in the vicinity of each substrate mounting hole 5a, a pair of circular lead wires through which a pair of lead wires (not shown) connected to each electrode of the LED chip 10 on the substrate 12 are inserted, are inserted. A hole 5b is provided. Thus, the screw 12 is inserted into each board mounting hole 5a and each notch 12a of the board 12 and the nut N1 is tightened, whereby the board 12 is fixed to the heat radiating base 5. Further, notches 5d for hooking a pair of hook claws 13c (one in the figure) provided on the cover 13 are provided on both side edges of the upper surface of the heat dissipation base 5 in the short direction. . Thus, as shown in FIG. 3B, the cover 13 is fixed to the heat radiating base portion 5 by hooking each hooking claw 13 c of the cover 13 to each notch 5 d of the heat radiating base portion 5. Note that the pair of circular round holes 13b provided in the cover 13 is a confirmation hole for visually recognizing the nut N1.

  As shown in FIG. 4A, the base 3 is formed in a cylindrical shape from a metal material having heat dissipation properties, and is made of aluminum die casting in the present embodiment. On the upper surface of the base portion 3, a plurality of rectangular plate-shaped heat radiation fins 31 projecting upward are provided at regular intervals along one direction. In addition, the outer peripheral wall of the base portion 3 includes a plurality of radiating fins 30 protruding outward in the radial direction as a set, and a plurality of sets (three sets in the present embodiment) at regular intervals along the circumferential direction. Is provided. By providing the radiation fins 30 and 31 in this manner, the surface area of the outer surface of the base 3 is increased to increase the efficiency of heat transfer from the base 3 to the atmosphere, and the heat dissipation effect of the heat generated by the LED chip 10 is enhanced. .

  As shown in FIG. 4A, a pair of frustoconical bosses 33 projecting upward are integrally formed on the upper surface of the base 3, and each boss 33 has a fixing screw S4. Is provided with a female screw portion (not shown). Thus, the top plate 7 is fixed to the base 3 by inserting the fixing screws S4 into a pair of insertion holes (not shown) provided in the top plate 7 and tightening the female screws of the boss portions 33. (See FIGS. 2A and 2B). In addition, a pair of semicircular protrusions 34 projecting radially outward are integrally formed on the outer peripheral wall of the base 3, and each of the protrusions 34 has a circular frame body mounting hole. 34a is provided.

  As shown in FIG. 1B, a first recess 32 that is recessed upward is provided at the lower portion of the base portion 3, and the LED module 1 is mounted on the inner bottom portion of the first recess 32. It is attached and fixed via the base part 5. Further, as shown in FIG. 4B, a plurality of heat radiation fins 32a projecting radially inward are provided on the inner peripheral wall of the first recess 32 along the circumferential direction.

  As shown in FIG. 1A, the frame part 4 is formed in a cylindrical shape from a metal material having heat dissipation properties, and is made of aluminum die casting in this embodiment. The upper part of the frame body part 4 is provided with a second concave part 42 that is recessed downward, and a circular incident port through which light from the LED chip 10 enters the inner bottom part of the second concave part 42. 40 is open. A disk-shaped translucent panel 44 (translucent member) made of a resin material having diffuse translucency (in this embodiment, polycarbonate) is placed on the upper side of the entrance 40 through an annular packing 45. The Thus, the entrance 40 is closed by the translucent panel 44, and the first recess 32 and the second recess 42 constitute a heat dissipation space for convection of heat from the LED chip 10.

  As shown in FIG. 1B, the lower opening of the frame body portion 4 is a circular exit port 41 that emits light incident from the entrance port 40 outward. 41 is a curved surface that expands in the radial direction from the entrance port 40 toward the exit port 41. This curved surface is painted white with, for example, a paint such as an acrylic paint, and constitutes a reflection portion 4a that reflects light from the LED chip 10. Thus, as shown in FIG. 5, the light from the LED chip 10 is reflected by the reflecting portion 4 a and is emitted substantially vertically downward from the emission port 41.

  As shown in FIG. 1A, a plurality of radiating fins 42b projecting inward in the radial direction are provided on the inner peripheral wall of the second recess 42 along the circumferential direction. The upper end portion of the radiating fins 42b and the lower end portion of the radiating fin 32a of the base portion 3 face each other and come into contact with each other when the base portion 3 and the frame body portion 4 are coupled. A pair (one in the figure) of female screw portions 42a for mounting and fixing an annular reflector 6 (reflecting member), which will be described later, is provided on the inner bottom of the second recess 42 so as to sandwich the entrance 40. It has been.

  As shown in FIG. 1 (a), the annular reflector 6 is formed in an annular shape from a metal material having heat dissipation properties such as aluminum, for example. The standing part 60 which protrudes (toward) is provided over the circumferential direction. The inner peripheral surface of the upright portion 60 is a reflection surface that reflects light from the LED chip 10. In addition, a pair of semicircular cutouts 6 a are provided on the outer peripheral edge of the annular reflector 6 so as to sandwich the inner opening. The annular reflecting plate 6 is attached and fixed to the inner bottom portion of the second recess 42 by inserting the fixing screw S6 into each of the notches 6a and tightening it to the female screw 42a of the second recess 42 of the frame body portion 4. . By providing the annular reflecting plate 6, the light from the LED chip 10 is reflected by the inner peripheral surface of the upright portion 60 and condensed at the incident port 40.

  As shown in FIG. 1A, a flange 43 protruding outward in the radial direction is integrally formed in the lower end portion of the frame body portion 4 in the circumferential direction. In addition, the outer peripheral wall of the frame body portion 4 includes a plurality of radiating fins 46 protruding outward in the radial direction as a set, and a plurality of sets (in the present embodiment, 3 sets at certain intervals). Set) is provided. By providing the radiation fins 46 in this manner, the surface area of the outer surface of the frame body portion 4 is increased to increase the efficiency of heat transfer from the frame body portion 4 to the atmosphere, and the heat radiation effect of the heat generated by the LED chip 10 is enhanced. ing. Further, a pair of truncated cone-shaped boss portions 48 projecting upward from the flange 43 are integrally formed on the outer peripheral wall of the frame body portion 4, and a fixing screw S <b> 3 is fastened to each boss portion 48. An internal thread portion (not shown) is provided. These bosses 48 and the projections 34 of the base 3 are brought into contact with each other, and the fixing screw S3 is inserted into the frame body mounting hole 34a and tightened to the female thread part, whereby the base 3 and the frame body 4 are mechanically connected. And thermally coupled.

  Further, as shown in FIG. 1A, a spring mounting portion 47 for mounting and fixing a mounting spring 49, which will be described later, is provided on the outer peripheral wall of the frame body portion 4 at a certain interval along the circumferential direction. One is provided. The attachment spring 49 is formed, for example, by bending one end of a rectangular plate-shaped stainless steel plate in the longitudinal direction into a V shape, and the one end is attached and fixed to the spring attachment portion 47. As shown in FIG. 2A, a curved portion 49a that curves outward is provided at the center of the mounting spring 49. The attachment spring 49 is urged outward in a state of being attached and fixed to the spring attachment portion 47, and is between a position where it contacts the outer surface of the instrument body 2 and a position away from the outer surface of the instrument body 2. It can be bent freely.

  As shown in FIGS. 2A and 2B, the lighting device A and the terminal block B are attached and fixed to a mounting plate 8 provided separately from the instrument body 2. The attachment plate 8 is connected to the top plate 7 attached and fixed to the upper part of the base 3 of the instrument body 2. The top plate 7 is formed in a rectangular plate shape from a metal material, and a pair of rectangular side pieces 70 projecting downward are integrally formed at one end in the longitudinal direction so as to face each other. Has been.

  As shown in FIG. 2A, the mounting plate 8 is formed by bending a rectangular plate-shaped member made of a metal material into a cross-sectional shape, and the lighting device A is provided on the lower surface of one end portion in the longitudinal direction. The terminal block B is fixedly attached to the lower surface of the other end while being fixedly attached. A pair of rectangular attachment pieces 80 projecting downward are integrally formed at the other end of the attachment plate 8 so as to face each other. The mounting piece 80 and each side piece 70 of the top plate 7 are connected to each other by tightening a fixing screw S5 in an insertion hole (not shown) provided in each part. The mounting plate 8 is rotatable with respect to the top plate 7 about the axis of the fixing screw S5. As described above, since the mounting plate 8 is configured to be rotatable with respect to the top plate 7, the embedding provided in the ceiling 7 is provided when the present embodiment is embedded in the ceiling C described later. It is easy to insert into the hole C1. In the present embodiment, the top plate 7 and the mounting plate 8 are each made of a galvanized steel plate.

  When this embodiment is embedded in the ceiling C, as shown in FIG. 5, first, the mounting plate 8 to which the lighting device A and the terminal block B are mounted and fixed is embedded in the ceiling C. To pass through. Thereafter, the instrument body 2 is inserted into the embedding hole C <b> 1 with the attachment springs 49 being in contact with the outer surface of the instrument body 2. When the instrument body 2 is inserted until the flange 43 of the instrument body 2 comes into contact with the peripheral edge of the embedded hole C1, each attachment spring 49 returns to a position away from the outer surface of the instrument body 2. The ceiling C is sandwiched between the curved portion 49 a and the flange 43. Thus, the present embodiment is embedded between the ceiling C and the heat insulating material D provided on the back of the ceiling.

  Hereinafter, the flow of heat generated by the LED chip 10 in the present embodiment will be described with reference to the drawings. As shown in FIG. 1B, heat generated by the LED chip 10 is conducted to the base 3 via the substrate 12 and the heat radiating base 5 and is transmitted from the outer surface of the base 3 to the atmosphere to be radiated. A part of heat is conducted to the frame body part 4 through the contact part between the base part 3 and the frame body part 4, and is transmitted to the atmosphere from the outer surface of the frame body part 4 and the reflection part 4a to be radiated. . Here, by providing the radiation fins 30, 31, and 46 on the outer surface of the base 3 and the outer surface of the frame body part 4, respectively, the surface area of the outer surface of each part is increased to enhance the heat radiation effect. Moreover, since the reflection part 4a of the frame part 4 faces the indoor space whose atmospheric temperature is lower than the space surrounded by the ceiling C and the heat insulating material D, the convection heat of the indoor space is used as the base 3 and the frame part. 4 can be efficiently transmitted to the contact area. For this reason, since the temperature of the contact part of the base part 3 and the frame part 4 falls, the heat dissipation effect by the instrument main body 2 can be improved more.

  On the other hand, as shown in FIG. 1B, heat radiated from the LED chip 10 is convected in the heat radiation space composed of the first recess 32 and the second recess 42 and transferred to the base 3 and the frame body 4. Then, it is transmitted to the atmosphere from the outer surface of the base 3 and the frame body part 4 and the reflection part 4a to be dissipated. Here, by providing the radiation fins 32a and 42b on the inner surface of the first recess 32 and the inner surface of the second recess 42, respectively, the surface area of the inner surface of the base portion 3 and the frame body portion 4 in the heat dissipation space is increased, and the heat dissipation effect. Is increasing.

  Here, in this embodiment, in order to obtain a sufficient heat dissipation effect, a certain distance is provided between the LED chip 10 and the entrance 40 in the heat dissipation space. Therefore, if the annular reflector 6 is not provided, light having a large diffusion angle among the light from the LED chip 10 does not reach the entrance 40 as shown by the broken line a in FIG. For this reason, a sufficient illumination effect cannot be obtained by reducing the amount of light passing through the entrance 40. On the other hand, in the present embodiment, as described above, the annular reflector 6 is provided in the heat dissipation space composed of the first recess 32 and the second recess 42, and light from the LED chip 10 is transmitted to the annular reflector 6. The light is reflected by the inner peripheral surface of the upright portion 60 and condensed at the entrance 40. That is, as indicated by the solid line a in FIG. 1B, light having a large diffusion angle out of the light from the LED chip 10 is also reflected by the inner peripheral surface of the upright portion 60 and reaches the entrance 40. Yes.

  As described above, in the present embodiment, the light diffused from the LED chip 10 until it reaches the entrance 40 can be condensed at the entrance 40 by being reflected by the standing portion 60 of the annular reflector 6. The amount of light passing through the entrance 40 can be increased. Therefore, it is possible to obtain a sufficient lighting effect while securing a heat radiation space necessary for heat radiation.

  By the way, when the standing part 60 of the annular reflecting plate 6 is formed so as to stand upright along the vertical direction, most of the light reflected by the inner peripheral surface of the standing part 60 is further reflected by the reflecting part 4 a of the frame body part 4. After that, the light is emitted from the emission port 41. In this case, the brightness in the reflection part 4a of the frame body part 4 is increased, and there is a possibility that a person looking up at the ceiling may feel dazzling. Therefore, in the present embodiment, as shown in FIG. 1B, the standing portion 60 of the annular reflecting plate 6 is formed so as to be inclined inward in the radial direction from the lower opening toward the upper opening. ing. Therefore, most of the light reflected by the inner peripheral surface of the upright portion 60 is directly emitted from the emission port 41 without being reflected by the reflection portion 4a of the frame body portion 4, so that the luminance at the reflection portion 4a can be reduced. It is possible to prevent the person looking up at the ceiling from feeling dazzling.

  In this embodiment, since the frame part 4 is formed from a metal material having heat dissipation, the heat generated by the LED chip 10 is transmitted to the atmosphere not only through the base part 3 but also through the frame part 4, The heat dissipation effect can be further enhanced. Furthermore, in this embodiment, since the annular reflecting plate 6 is formed from a metal material having heat dissipation, the heat generated by the LED chip 10 is transmitted to the annular reflecting plate 6 and the heat dissipation effect can be further enhanced. The frame body 4 and the annular reflector 6 do not have to be formed of a material having a heat dissipation property, but are preferably formed of a material having a heat dissipation property for the above reasons.

10 LED chip (light emitting diode)
2 Instrument body 3 Base 32 First recess (heat radiation space)
4 Frame body 40 Incident port 41 Ejection port 42 Second recess (heat radiation space)
44 Translucent panel (translucent member)
6 Annular reflector (reflective member)
A lighting device

Claims (3)

  A light-emitting diode, a lighting device that supplies lighting power to the light-emitting diode, and a bottomed cylindrical instrument body that houses at least the light-emitting diode, the instrument body having the light-emitting diode attached to the bottom thereof A base made of a heat-dissipating material that releases heat generated by the light emitting diode to the outside through itself, an incident port through which light from the light emitting diode is incident, and light incident from the incident port is emitted outward The incident port is closed by a translucent member made of a translucent material, and the light emitting diode is interposed between the light emitting diode and the incident port. A heat dissipation space for dissipating the heat radiated from the diode to the outside through the base is provided, and the peripheral edge of the incident port rises toward the base Moni, lighting equipment, wherein a reflective member is provided with a reflecting surface for reflecting light from the light emitting diode on the inner peripheral surface thereof.   The lighting device according to claim 1, wherein the frame body portion is made of a material having heat dissipation properties.   The lighting apparatus according to claim 1, wherein the reflecting member is made of a material having heat dissipation properties.

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