JP5399964B2 - lighting equipment - Google Patents

lighting equipment Download PDF

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JP5399964B2
JP5399964B2 JP2010078657A JP2010078657A JP5399964B2 JP 5399964 B2 JP5399964 B2 JP 5399964B2 JP 2010078657 A JP2010078657 A JP 2010078657A JP 2010078657 A JP2010078657 A JP 2010078657A JP 5399964 B2 JP5399964 B2 JP 5399964B2
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light
emitting diode
base
heat
heat dissipation
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JP2011210621A (en
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俊治 山口
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00Lighting devices intended for fixed installation
    • F21S8/02Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V21/00Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
    • F21V21/02Wall, ceiling, or floor bases; Fixing pendants or arms to the bases
    • F21V21/04Recessed bases
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/02Arrangement of electric circuit elements in or on lighting devices the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Description

本発明は、発光ダイオード等の発光素子を光源とする照明器具に関する。   The present invention relates to a lighting fixture that uses a light emitting element such as a light emitting diode as a light source.

従来から、天井に埋込配設される発光ダイオード(以下、「LED」と呼ぶ)を光源とするダウンライト(照明器具)が知られており、例えば特許文献1に開示されている。特許文献1に記載のダウンライトは、金属製の装置本体と、複数のLEDを実装した光源基板と、LEDの点灯に必要な電流を制御する電源装置と、LEDからの光を配光する反射体及びバッフルとを備えている。光源基板は、装置本体の底壁に面接触する形で取り付けられている。而して、LEDが点灯する際に発する熱を光源基板及び装置本体を介して大気中に放出することで、LED周辺の雰囲気温度の上昇を防いでいる。また、装置本体の外面には複数の放熱フィンが設けられており、当該放熱フィンによって装置本体の外面の表面積を大きくすることで、装置本体を大型化することなく放熱効果を高めている。   Conventionally, a downlight (lighting fixture) using a light emitting diode (hereinafter referred to as “LED”) embedded in a ceiling as a light source is known, and is disclosed in, for example, Patent Document 1. The downlight described in Patent Literature 1 includes a metal device main body, a light source substrate on which a plurality of LEDs are mounted, a power supply device that controls a current required for lighting the LEDs, and a reflection that distributes light from the LEDs. It has a body and a baffle. The light source substrate is attached in surface contact with the bottom wall of the apparatus main body. Thus, the heat generated when the LED is lit is released into the atmosphere through the light source substrate and the apparatus main body, thereby preventing an increase in the ambient temperature around the LED. In addition, a plurality of radiating fins are provided on the outer surface of the apparatus main body, and by increasing the surface area of the outer surface of the apparatus main body with the radiating fins, the heat radiating effect is enhanced without increasing the size of the apparatus main body.

特開2010−16003号公報JP 2010-16003 A

ところで、近年ではLEDの高出力化が促進されており、少数のLEDで従来の多数のLEDを用いた照明器具と同等の光出力を得ることができるようになっている。このため、従来と比較してLEDを配設するために必要なスペースが低減されるため、照明器具の器具本体の小型化を図ることができる。一方、光源を成すLEDの数が減少しても、高出力型のLEDでは点灯時の発熱量も大きくなるため、従来の多数のLEDを用いた照明器具と同等、若しくはそれ以上の熱量がLEDの点灯時に生じる。   By the way, in recent years, higher output of LEDs has been promoted, and a light output equivalent to that of a conventional lighting fixture using a large number of LEDs can be obtained with a small number of LEDs. For this reason, since the space required for disposing the LED is reduced as compared with the conventional case, the fixture body of the lighting fixture can be downsized. On the other hand, even if the number of LEDs constituting the light source is reduced, the amount of heat generated when lighting is increased with a high-power LED, so the amount of heat is equal to or greater than that of a conventional lighting fixture using a large number of LEDs. Occurs when lit.

ここで、器具本体を小型化すると、上記従来例のような放熱フィンも小型化されるため、十分な放熱効果を得ることができない。そこで、LEDが発する熱を対流させて放熱し易くするために、LEDとLEDが発する光が入射する入射口との間に放熱空間を設ける必要がある。このため、LEDと入射口との間に一定の距離を空ける必要があった。   Here, when the instrument body is downsized, the heat dissipating fins as in the above-described conventional example are also downsized, so that a sufficient heat dissipation effect cannot be obtained. Therefore, in order to make it easy to dissipate heat by convection of heat generated by the LED, it is necessary to provide a heat dissipation space between the LED and an entrance through which light emitted from the LED is incident. For this reason, it has been necessary to provide a certain distance between the LED and the entrance.

しかしながら、LEDと入射口との間の距離を空けると、LEDからの光が入射口に到達するまでに拡散してしまい、入射口を通過する光の量が減ることで十分な照明効果を得ることができないという問題があった。   However, if the distance between the LED and the incident port is increased, the light from the LED diffuses before reaching the incident port, and the amount of light passing through the incident port is reduced to obtain a sufficient illumination effect. There was a problem that I could not.

本発明は、上記の点に鑑みて為されたもので、放熱に必要な放熱空間を確保しつつ十分な照明効果を得ることができる照明器具を提供することを目的とする。   The present invention has been made in view of the above points, and an object of the present invention is to provide a lighting fixture capable of obtaining a sufficient lighting effect while securing a heat radiation space necessary for heat radiation.

本発明の照明器具は、発光ダイオードと、前記発光ダイオードに点灯電力を給電する点灯装置と、少なくとも前記発光ダイオードを収納する有底筒状の器具本体とを備え、前記器具本体は、その底部に前記発光ダイオードが取り付けられるとともに前記発光ダイオードが発する熱を自身を介して外部に放出させる放熱性を有する材料から成る基部と、前記発光ダイオードからの光が入射する入射口、及び前記入射口から入射した光を外方へ出射する出射口を有する筒状の枠体部とから成り、前記入射口は、透光性を有する材料から成る透光部材によって閉塞され、前記発光ダイオードと前記入射口との間には、前記発光ダイオードから放射される熱を前記基部を介して外部へ放熱する放熱空間が設けられ、前記入射口の周縁には、前記基部に向かって立ち上がるとともに、その内周面に前記発光ダイオードからの光を反射させる反射面を有する反射部材が設けられたことを特徴とする。   The lighting fixture of the present invention includes a light emitting diode, a lighting device that supplies lighting power to the light emitting diode, and a bottomed cylindrical fixture main body that houses at least the light emitting diode, and the fixture main body is provided at the bottom thereof. A base made of a heat-dissipating material that allows the light emitting diode to be attached and releases heat generated by the light emitting diode to the outside through itself, an incident port through which light from the light emitting diode is incident, and an incident from the incident port A cylindrical frame body having an exit for emitting outward light, and the entrance is closed by a translucent member made of a material having translucency, and the light emitting diode, the entrance, A heat dissipation space for dissipating heat radiated from the light emitting diodes to the outside through the base is provided between the base and the periphery of the entrance. Selfish with rises, characterized in that the reflecting member is provided with a reflecting surface for reflecting light from the light emitting diode on the inner peripheral surface thereof.

この照明器具において、前記枠体部は、放熱性を有する材料から成ることが好ましい。   In this lighting apparatus, it is preferable that the frame body portion is made of a material having heat dissipation properties.

この照明器具において、前記反射部材は、放熱性を有する材料から成ることが好ましい。   In this lighting fixture, it is preferable that the reflecting member is made of a material having heat dissipation properties.

本発明は、発光ダイオードから入射口に到達するまでに拡散する光を反射部材で反射させることで入射口に集光することができるので、入射口を通過する光の量を増大させることができる。したがって、放熱に必要な放熱空間を確保しつつ十分な照明効果を得ることができる。   In the present invention, since the light diffused from the light emitting diode until reaching the entrance can be reflected by the reflecting member, the light can be collected at the entrance, so that the amount of light passing through the entrance can be increased. . Therefore, it is possible to obtain a sufficient lighting effect while securing a heat radiation space necessary for heat radiation.

本発明に係る照明器具の実施形態を示す図で、(a)は枠体部の分解斜視図で、(b)は器具本体の断面図である。It is a figure which shows embodiment of the lighting fixture which concerns on this invention, (a) is a disassembled perspective view of a frame part, (b) is sectional drawing of a fixture main body. (a)は同上の全体斜視図で、(b)は同上の上面図である。(A) is a whole perspective view same as the above, (b) is a top view same as the above. 同上のLEDモジュール及び放熱基台部を示す図で、(a)は分解斜視図で、(b)は全体斜視図である。It is a figure which shows the LED module same as the above, and a thermal radiation base part, (a) is a disassembled perspective view, (b) is a whole perspective view. 同上の基部を示す図で、(a)は斜視図で、(b)は下面図である。It is a figure which shows a base part same as the above, (a) is a perspective view, (b) is a bottom view. 同上の天井に埋込配設した状態を示す断面図である。It is sectional drawing which shows the state embedded and arrange | positioned at the ceiling same as the above.

以下、本発明に係る照明器具の実施形態について図面を用いて説明する。本実施形態は、天井に埋込配設されるものであって、図1(a),(b)に示すように、LEDチップ10(発光ダイオード)が実装された基板12を有するLEDモジュール1と、基部3及び枠体部4を結合して成る有底筒状の器具本体2とを備える。また、図2(a),(b)に示すように、LEDチップ10に点灯電力を給電する点灯装置Aと、商用電源(図示せず)との間を繋ぐ電源線(図示せず)が接続されるとともに、商用電源からの交流電力を点灯装置Aに中継する端子台Bとを備える。尚、点灯装置A及び端子台Bは従来周知であるので、ここでは詳細な説明を省略する。   Hereinafter, embodiments of a lighting apparatus according to the present invention will be described with reference to the drawings. In the present embodiment, the LED module 1 is embedded in a ceiling and includes a substrate 12 on which an LED chip 10 (light emitting diode) is mounted, as shown in FIGS. And a bottomed cylindrical instrument body 2 formed by combining the base 3 and the frame body 4. Further, as shown in FIGS. 2A and 2B, a power line (not shown) that connects between the lighting device A that supplies lighting power to the LED chip 10 and a commercial power source (not shown). And a terminal block B that relays AC power from a commercial power source to the lighting device A. In addition, since the lighting device A and the terminal block B are conventionally well-known, detailed description is abbreviate | omitted here.

LEDモジュール1は、図3(a),(b)に示すように、青色発光する矩形板状のLEDチップ10と、透光性を有する樹脂材料から成りLEDチップ10を封止する円盤状の封止部材11と、LEDチップ10が実装される基板12とを備える。また、基板12には、LEDチップ10及び封止部材11を覆う樹脂材料から成る正方形状のカバー13が取り付けられている。このカバー13の中央部には、円形状の開口部13aが設けられており、当該開口部13aをLEDチップ10からの光が通過するようになっている。   As shown in FIGS. 3A and 3B, the LED module 1 is a rectangular plate-shaped LED chip 10 that emits blue light and a disk-shaped seal that seals the LED chip 10 made of a translucent resin material. A sealing member 11 and a substrate 12 on which the LED chip 10 is mounted are provided. Further, a square cover 13 made of a resin material that covers the LED chip 10 and the sealing member 11 is attached to the substrate 12. A circular opening 13a is provided at the center of the cover 13, and light from the LED chip 10 passes through the opening 13a.

封止部材11には、LEDチップ10が発する青色光によって励起され、青色光に対して補色の関係にある黄色光を放射する黄色の蛍光体(図示せず)が混入されている。而して、LEDモジュール1は、カバー13の開口部13aを通して白色光を放射するようになっている。尚、LEDモジュール1は白色光を放射するものであればよく、白色光を放射する構成としては、上記の青色光を発するLEDチップ10と黄色の蛍光体との組み合わせに限定されるものではない。   The sealing member 11 is mixed with a yellow phosphor (not shown) that emits yellow light that is excited by blue light emitted from the LED chip 10 and has a complementary color relationship with the blue light. Thus, the LED module 1 emits white light through the opening 13 a of the cover 13. The LED module 1 only needs to emit white light, and the configuration of emitting white light is not limited to the combination of the LED chip 10 emitting blue light and the yellow phosphor. .

基板12は、図3(a)に示すように、絶縁性を有する樹脂材料から矩形板状に形成され、その長手方向における両端部には、それぞれ半円形状の切り欠き12aが設けられている。この基板12を後述する放熱基台部5に取付固定することで、LEDチップ10が発する熱が基板12を介して放熱基台部5に伝導するようになっている。尚、基板12は、例えばその裏面が放熱性を有する金属材料で形成された金属ベース基板であってもよい。この場合、金属材料から成る面を放熱基台部5に密着させることで、LEDチップ10が発する熱を効率良く放熱基台部5に伝導させることができる。尚、「放熱性を有する」とは、「他の材料と比較して熱伝導率が高い」ことを意味する。   As shown in FIG. 3A, the substrate 12 is formed in a rectangular plate shape from an insulating resin material, and semicircular cutouts 12a are provided at both ends in the longitudinal direction. . By attaching and fixing the substrate 12 to the heat radiating base portion 5 to be described later, the heat generated by the LED chip 10 is conducted to the heat radiating base portion 5 through the substrate 12. The substrate 12 may be, for example, a metal base substrate whose back surface is formed of a metal material having heat dissipation properties. In this case, the heat generated by the LED chip 10 can be efficiently conducted to the heat dissipation base 5 by bringing the surface made of the metal material into close contact with the heat dissipation base 5. Note that “having heat dissipation” means “higher thermal conductivity than other materials”.

放熱基台部5は、図3(a)に示すように、高い熱伝導率を有し、且つ絶縁性を有する材料から直方体状に形成され、その長手方向の両端部は三角形状に加工されている。尚、本実施形態では、平面度の小さい滑らかな平面に加工し易く、基板12との密着性が高い点に鑑みて、放熱基台部5はファインセラミックス(例えば、窒化アルミニウム)から形成されている。放熱基台部5の長手方向の両端部には、それぞれ円形状の基部取付孔5cが設けられている。この各基部取付孔5cに固定ねじS2を挿入させ、基部3に設けられた1対の雌ねじ部(図示せず)にそれぞれ締め付けることで、放熱基台部5が基部3に固定される(図4(b)参照)。而して、LEDチップ10が発する熱は、基板12及び放熱基台部5を介して基部3に伝導し、更に基部3から大気中に伝達することで外部へ放熱されるようになっている。   As shown in FIG. 3A, the heat radiating base 5 is formed in a rectangular parallelepiped shape from a material having high thermal conductivity and insulating properties, and both end portions in the longitudinal direction are processed into a triangular shape. ing. In the present embodiment, the heat radiation base 5 is made of fine ceramics (for example, aluminum nitride) in view of easy processing into a smooth flat surface with small flatness and high adhesion to the substrate 12. Yes. Circular base mounting holes 5c are provided at both ends in the longitudinal direction of the heat dissipation base 5 respectively. The heat-dissipating base 5 is fixed to the base 3 by inserting the fixing screw S2 into each base mounting hole 5c and tightening it to a pair of female threads (not shown) provided in the base 3. 4 (b)). Thus, the heat generated by the LED chip 10 is conducted to the base 3 via the substrate 12 and the heat radiating base 5 and further transmitted to the atmosphere from the base 3 to be radiated to the outside. .

放熱基台部5の中央部には、図3(a)に示すように、基板12を取り付けるための円形状の1対の基板取付孔5aが設けられている。また、各基板取付孔5aの近傍には、基板12上のLEDチップ10の各電極に接続される1対のリード線(図示せず)が各々挿通される円形状の1対のリード線挿通孔5bが設けられている。而して、各基板取付孔5aと基板12の各切り欠き12aとにビスS1を挿入させ、ナットN1を締め付けることで、基板12が放熱基台部5に固定される。また、放熱基台部5上面の短手方向における両側縁には、カバー13に設けられた1対(図示では1つ)の引掛爪13cを各々引っ掛けるための切り欠き5dが各々設けられている。而して、図3(b)に示すように、カバー13の各引掛爪13cを放熱基台部5の各切り欠き5dに引っ掛けることで、カバー13が放熱基台部5に固定される。尚、カバー13に設けられている1対の円形状の丸孔13bは、ナットN1を視認するための確認用の孔となっている。   As shown in FIG. 3A, a pair of circular substrate attachment holes 5 a for attaching the substrate 12 are provided in the central portion of the heat dissipation base portion 5. Also, in the vicinity of each substrate mounting hole 5a, a pair of circular lead wires through which a pair of lead wires (not shown) connected to each electrode of the LED chip 10 on the substrate 12 are inserted, are inserted. A hole 5b is provided. Thus, the screw 12 is inserted into each board mounting hole 5a and each notch 12a of the board 12 and the nut N1 is tightened, whereby the board 12 is fixed to the heat radiating base 5. Further, notches 5d for hooking a pair of hook claws 13c (one in the figure) provided on the cover 13 are provided on both side edges of the upper surface of the heat dissipation base 5 in the short direction. . Thus, as shown in FIG. 3B, the cover 13 is fixed to the heat radiating base portion 5 by hooking each hooking claw 13 c of the cover 13 to each notch 5 d of the heat radiating base portion 5. Note that the pair of circular round holes 13b provided in the cover 13 is a confirmation hole for visually recognizing the nut N1.

基部3は、図4(a)に示すように、放熱性を有する金属材料から円柱状に形成され、本実施形態ではアルミダイカスト製である。基部3の上面には、上方に向かって突出する複数の矩形板状の放熱フィン31が一方向に沿って互いに一定の間隔を空けて設けられている。また、基部3の外周壁には、径方向の外向きに突出する複数の放熱フィン30を1組として、周方向に沿って一定の間隔を空けて複数組(本実施形態では、3組)設けられている。このように放熱フィン30,31を設けることで、基部3の外面の表面積を大きくして基部3から大気中への熱伝達の効率を高め、LEDチップ10が発する熱の放熱効果を高めている。   As shown in FIG. 4A, the base 3 is formed in a cylindrical shape from a metal material having heat dissipation properties, and is made of aluminum die casting in the present embodiment. On the upper surface of the base portion 3, a plurality of rectangular plate-shaped heat radiation fins 31 projecting upward are provided at regular intervals along one direction. In addition, the outer peripheral wall of the base portion 3 includes a plurality of radiating fins 30 protruding outward in the radial direction as a set, and a plurality of sets (three sets in the present embodiment) at regular intervals along the circumferential direction. Is provided. By providing the radiation fins 30 and 31 in this manner, the surface area of the outer surface of the base 3 is increased to increase the efficiency of heat transfer from the base 3 to the atmosphere, and the heat dissipation effect of the heat generated by the LED chip 10 is enhanced. .

基部3の上面には、図4(a)に示すように、上方に向かって突出する1対の円錐台状のボス部33が一体に形成されており、各ボス部33には固定ねじS4が締め付けられる雌ねじ部(図示せず)が設けられている。而して、天板7に設けられた1対の挿入孔(図示せず)にそれぞれ固定ねじS4を挿入させ、各ボス部33の雌ねじ部に締め付けることで、天板7が基部3に固定される(図2(a),(b)参照)。また、基部3の外周壁には、径方向の外向きに突出する1対の半円形状の突部34が一体に形成されており、各突部34には円形状の枠体部取付孔34aがそれぞれ設けられている。   As shown in FIG. 4A, a pair of frustoconical bosses 33 projecting upward are integrally formed on the upper surface of the base 3, and each boss 33 has a fixing screw S4. Is provided with a female screw portion (not shown). Thus, the top plate 7 is fixed to the base 3 by inserting the fixing screws S4 into a pair of insertion holes (not shown) provided in the top plate 7 and tightening the female screws of the boss portions 33. (See FIGS. 2A and 2B). In addition, a pair of semicircular protrusions 34 projecting radially outward are integrally formed on the outer peripheral wall of the base 3, and each of the protrusions 34 has a circular frame body mounting hole. 34a is provided.

基部3の下部には、図1(b)に示すように、上方に向かって窪んだ第1の凹部32が設けられており、この第1の凹部32の内底部にLEDモジュール1が放熱基台部5を介して取付固定される。また、第1の凹部32の内周壁には、図4(b)に示すように、径方向の内向きに突出する複数の放熱フィン32aが周方向に沿って設けられている。   As shown in FIG. 1B, a first recess 32 that is recessed upward is provided at the lower portion of the base portion 3, and the LED module 1 is mounted on the inner bottom portion of the first recess 32. It is attached and fixed via the base part 5. Further, as shown in FIG. 4B, a plurality of heat radiation fins 32a projecting radially inward are provided on the inner peripheral wall of the first recess 32 along the circumferential direction.

枠体部4は、図1(a)に示すように、放熱性を有する金属材料から円筒状に形成され、本実施形態ではアルミダイカスト製である。枠体部4の上部には、下方に向かって窪んだ第2の凹部42が設けられており、この第2の凹部42の内底部にLEDチップ10からの光が入射する円形状の入射口40が開口している。入射口40の上側には、拡散透光性を有する樹脂材料(本実施形態では、ポリカーボネート)から成る円盤状の透光パネル44(透光部材)が円環状のパッキン45を介して載置される。而して、透光パネル44によって入射口40が閉塞され、上記の第1の凹部32及び第2の凹部42によってLEDチップ10からの熱を対流させる放熱空間が構成される。   As shown in FIG. 1A, the frame part 4 is formed in a cylindrical shape from a metal material having heat dissipation properties, and is made of aluminum die casting in this embodiment. The upper part of the frame body part 4 is provided with a second concave part 42 that is recessed downward, and a circular incident port through which light from the LED chip 10 enters the inner bottom part of the second concave part 42. 40 is open. A disk-shaped translucent panel 44 (translucent member) made of a resin material having diffuse translucency (in this embodiment, polycarbonate) is placed on the upper side of the entrance 40 through an annular packing 45. The Thus, the entrance 40 is closed by the translucent panel 44, and the first recess 32 and the second recess 42 constitute a heat dissipation space for convection of heat from the LED chip 10.

枠体部4の下部の開口は、図1(b)に示すように、入射口40から入射した光を外方へ出射する円形状の出射口41となっており、入射口40と出射口41との間の内周面は、入射口40から出射口41に向かうにつれて径方向に広がる曲面となっている。この曲面は、例えばアクリル塗料等の塗料で白色に塗装されており、LEDチップ10からの光を反射する反射部4aを構成している。而して、図5に示すように、LEDチップ10からの光が反射部4aで反射し、出射口41からほぼ鉛直下方に出射されるようになっている。   As shown in FIG. 1B, the lower opening of the frame body portion 4 is a circular exit port 41 that emits light incident from the entrance port 40 outward. 41 is a curved surface that expands in the radial direction from the entrance port 40 toward the exit port 41. This curved surface is painted white with, for example, a paint such as an acrylic paint, and constitutes a reflection portion 4a that reflects light from the LED chip 10. Thus, as shown in FIG. 5, the light from the LED chip 10 is reflected by the reflecting portion 4 a and is emitted substantially vertically downward from the emission port 41.

第2の凹部42の内周壁には、図1(a)に示すように、径方向の内向きに突出する複数の放熱フィン42bが周方向に沿って設けられている。これら放熱フィン42bの上端部と、基部3の放熱フィン32aの下端部とは、基部3及び枠体部4を結合した際に互いに対向し且つ接触するようになっている。また、第2の凹部42の内底部には、後述する環状反射板6(反射部材)を取付固定するための1対(図示では1つ)の雌ねじ部42aが入射口40を挟む形で設けられている。   As shown in FIG. 1A, a plurality of radiating fins 42b projecting inward in the radial direction are provided on the inner peripheral wall of the second recess 42 along the circumferential direction. The upper end portion of the radiating fins 42b and the lower end portion of the radiating fin 32a of the base portion 3 face each other and come into contact with each other when the base portion 3 and the frame body portion 4 are coupled. A pair (one in the figure) of female screw portions 42a for mounting and fixing an annular reflector 6 (reflecting member), which will be described later, is provided on the inner bottom of the second recess 42 so as to sandwich the entrance 40. It has been.

環状反射板6は、図1(a)に示すように、例えばアルミニウム等の放熱性を有する金属材料から円環状に形成され、その内側の開口周縁には、上方に向かって(即ち、基部3に向かって)突出する起立部60が周方向に亘って設けられている。この起立部60の内周面は、LEDチップ10からの光を反射する反射面となっている。また、環状反射板6の外周縁には、内側の開口を挟む形で1対の半円形状の切り欠き6aが設けられている。これら各切り欠き6aに固定ねじS6を挿入し、枠体部4の第2の凹部42の雌ねじ部42aに締め付けることで、環状反射板6が第2の凹部42の内底部に取付固定される。この環状反射板6を設けることで、LEDチップ10からの光を起立部60の内周面で反射させて、入射口40に集光させるようになっている。   As shown in FIG. 1 (a), the annular reflector 6 is formed in an annular shape from a metal material having heat dissipation properties such as aluminum, for example. The standing part 60 which protrudes (toward) is provided over the circumferential direction. The inner peripheral surface of the upright portion 60 is a reflection surface that reflects light from the LED chip 10. In addition, a pair of semicircular cutouts 6 a are provided on the outer peripheral edge of the annular reflector 6 so as to sandwich the inner opening. The annular reflecting plate 6 is attached and fixed to the inner bottom portion of the second recess 42 by inserting the fixing screw S6 into each of the notches 6a and tightening it to the female screw 42a of the second recess 42 of the frame body portion 4. . By providing the annular reflecting plate 6, the light from the LED chip 10 is reflected by the inner peripheral surface of the upright portion 60 and condensed at the incident port 40.

枠体部4の下端部には、図1(a)に示すように、径方向の外向きに突出するフランジ43が周方向に亘って一体に形成されている。また、枠体部4の外周壁には、径方向の外向きに突出する複数の放熱フィン46を1組として、周方向に沿って一定の間隔を空けて複数組(本実施形態では、3組)設けられている。このように放熱フィン46を設けることで、枠体部4の外面の表面積を大きくして枠体部4から大気中への熱伝達の効率を高め、LEDチップ10が発する熱の放熱効果を高めている。また、枠体部4の外周壁には、フランジ43から上方に向かって突出する1対の円錐台状のボス部48が一体に形成されており、各ボス部48には固定ねじS3が締め付けられる雌ねじ部(図示せず)が設けられている。これら各ボス部48と基部3の各突部34とを互いに突き合わせ、固定ねじS3を枠体部取付孔34aに挿入して雌ねじ部に締め付けることで、基部3と枠体部4とが機械的且つ熱的に結合される。   As shown in FIG. 1A, a flange 43 protruding outward in the radial direction is integrally formed in the lower end portion of the frame body portion 4 in the circumferential direction. In addition, the outer peripheral wall of the frame body portion 4 includes a plurality of radiating fins 46 protruding outward in the radial direction as a set, and a plurality of sets (in the present embodiment, 3 sets at certain intervals). Set) is provided. By providing the radiation fins 46 in this manner, the surface area of the outer surface of the frame body portion 4 is increased to increase the efficiency of heat transfer from the frame body portion 4 to the atmosphere, and the heat radiation effect of the heat generated by the LED chip 10 is enhanced. ing. Further, a pair of truncated cone-shaped boss portions 48 projecting upward from the flange 43 are integrally formed on the outer peripheral wall of the frame body portion 4, and a fixing screw S <b> 3 is fastened to each boss portion 48. An internal thread portion (not shown) is provided. These bosses 48 and the projections 34 of the base 3 are brought into contact with each other, and the fixing screw S3 is inserted into the frame body mounting hole 34a and tightened to the female thread part, whereby the base 3 and the frame body 4 are mechanically connected. And thermally coupled.

また、枠体部4の外周壁には、図1(a)に示すように、後述する取付ばね49を取付固定するためのばね取付部47が周方向に沿って一定の間隔を空けて3つ設けられている。取付ばね49は、例えば矩形板状のステンレス鋼板の長手方向の一端部をV字状に折曲してなり、当該一端部がばね取付部47に取付固定される。取付ばね49の中央部には、図2(a)に示すように、外向きに湾曲した湾曲部49aが設けられている。また、取付ばね49は、ばね取付部47に取付固定された状態で外向きに付勢されており、器具本体2の外面と当接する位置と、器具本体2の外面から離れた位置との間で撓み自在となっている。   Further, as shown in FIG. 1A, a spring mounting portion 47 for mounting and fixing a mounting spring 49, which will be described later, is provided on the outer peripheral wall of the frame body portion 4 at a certain interval along the circumferential direction. One is provided. The attachment spring 49 is formed, for example, by bending one end of a rectangular plate-shaped stainless steel plate in the longitudinal direction into a V shape, and the one end is attached and fixed to the spring attachment portion 47. As shown in FIG. 2A, a curved portion 49a that curves outward is provided at the center of the mounting spring 49. The attachment spring 49 is urged outward in a state of being attached and fixed to the spring attachment portion 47, and is between a position where it contacts the outer surface of the instrument body 2 and a position away from the outer surface of the instrument body 2. It can be bent freely.

点灯装置A及び端子台Bは、図2(a),(b)に示すように、器具本体2とは別体に設けられた取付板8に取付固定される。そして、取付板8は、器具本体2の基部3の上部に取付固定された天板7と互いに連結される。天板7は、金属材料から矩形板状に形成されており、その長手方向の一端部には、下方に向かって突出する1対の矩形状の側片70が互いに対向する形で一体に形成されている。   As shown in FIGS. 2A and 2B, the lighting device A and the terminal block B are attached and fixed to a mounting plate 8 provided separately from the instrument body 2. The attachment plate 8 is connected to the top plate 7 attached and fixed to the upper part of the base 3 of the instrument body 2. The top plate 7 is formed in a rectangular plate shape from a metal material, and a pair of rectangular side pieces 70 projecting downward are integrally formed at one end in the longitudinal direction so as to face each other. Has been.

取付板8は、図2(a)に示すように、金属材料から成る矩形板状の部材を断面へ字状に折曲して形成され、その長手方向の一端部の下面に点灯装置Aが取付固定されるとともに、他端部の下面に端子台Bが取付固定される。また、取付板8の前記他端部には、下方に向かって突出する1対の矩形状の取付片80が互いに対向する形で一体に形成されている。これら取付片80と天板7の各側片70とは、各部に設けられた挿入孔(図示せず)に固定ねじS5を締め付けることで互いに連結される。そして、取付板8は、天板7に対して固定ねじS5の軸を中心として回動自在となっている。このように、取付板8が天板7に対して回動自在に構成されていることから、後述する天井Cに本実施形態を埋込配設する際に、天井7に設けられた埋込孔C1に挿入し易くなっている。尚、本実施形態では、天板7及び取付板8は、何れも亜鉛めっき鋼板から成る。   As shown in FIG. 2A, the mounting plate 8 is formed by bending a rectangular plate-shaped member made of a metal material into a cross-sectional shape, and the lighting device A is provided on the lower surface of one end portion in the longitudinal direction. The terminal block B is fixedly attached to the lower surface of the other end while being fixedly attached. A pair of rectangular attachment pieces 80 projecting downward are integrally formed at the other end of the attachment plate 8 so as to face each other. The mounting piece 80 and each side piece 70 of the top plate 7 are connected to each other by tightening a fixing screw S5 in an insertion hole (not shown) provided in each part. The mounting plate 8 is rotatable with respect to the top plate 7 about the axis of the fixing screw S5. As described above, since the mounting plate 8 is configured to be rotatable with respect to the top plate 7, the embedding provided in the ceiling 7 is provided when the present embodiment is embedded in the ceiling C described later. It is easy to insert into the hole C1. In the present embodiment, the top plate 7 and the mounting plate 8 are each made of a galvanized steel plate.

本実施形態を天井Cに埋込配設する場合には、図5に示すように、先ず点灯装置A及び端子台Bが取付固定された取付板8を天井Cに設けられた埋込孔C1に通過させる。その後、器具本体2の外面に各取付ばね49を当接させた状態で、器具本体2を埋込孔C1に挿入する。そして、器具本体2のフランジ43が埋込孔C1の周縁に当接するまで器具本体2を挿入すると、各取付ばね49が器具本体2の外面から離れた位置に復帰するため、各取付ばね49の湾曲部49aとフランジ43との間で天井Cが挟持される。而して、本実施形態が天井Cと天井裏に設けられた断熱材Dとの間に埋込配設される。   When this embodiment is embedded in the ceiling C, as shown in FIG. 5, first, the mounting plate 8 to which the lighting device A and the terminal block B are mounted and fixed is embedded in the ceiling C. To pass through. Thereafter, the instrument body 2 is inserted into the embedding hole C <b> 1 with the attachment springs 49 being in contact with the outer surface of the instrument body 2. When the instrument body 2 is inserted until the flange 43 of the instrument body 2 comes into contact with the peripheral edge of the embedded hole C1, each attachment spring 49 returns to a position away from the outer surface of the instrument body 2. The ceiling C is sandwiched between the curved portion 49 a and the flange 43. Thus, the present embodiment is embedded between the ceiling C and the heat insulating material D provided on the back of the ceiling.

以下、本実施形態におけるLEDチップ10が発する熱の流れについて図面を用いて説明する。LEDチップ10が発する熱は、図1(b)に示すように、基板12及び放熱基台部5を介して基部3に伝導し、基部3の外面から大気中に伝達して放熱される。また、一部の熱は基部3と枠体部4との接触部を介して枠体部4に伝導し、枠体部4の外面、及び反射部4aから大気中に伝達して放熱される。ここで、基部3の外面及び枠体部4の外面にそれぞれ放熱フィン30,31,46を設けることで、各部の外面の表面積を大きくして放熱効果を高めている。また、枠体部4の反射部4aは、天井Cと断熱材Dで囲まれた空間よりも雰囲気温度が低い室内空間に面しているので、室内空間の対流熱を基部3と枠体部4との接触部位に効率良く伝達することができる。このため、基部3と枠体部4との接触部位の温度が低下するため、器具本体2による放熱効果をより高めることができる。   Hereinafter, the flow of heat generated by the LED chip 10 in the present embodiment will be described with reference to the drawings. As shown in FIG. 1B, heat generated by the LED chip 10 is conducted to the base 3 via the substrate 12 and the heat radiating base 5 and is transmitted from the outer surface of the base 3 to the atmosphere to be radiated. A part of heat is conducted to the frame body part 4 through the contact part between the base part 3 and the frame body part 4, and is transmitted to the atmosphere from the outer surface of the frame body part 4 and the reflection part 4a to be radiated. . Here, by providing the radiation fins 30, 31, and 46 on the outer surface of the base 3 and the outer surface of the frame body part 4, respectively, the surface area of the outer surface of each part is increased to enhance the heat radiation effect. Moreover, since the reflection part 4a of the frame part 4 faces the indoor space whose atmospheric temperature is lower than the space surrounded by the ceiling C and the heat insulating material D, the convection heat of the indoor space is used as the base 3 and the frame part. 4 can be efficiently transmitted to the contact area. For this reason, since the temperature of the contact part of the base part 3 and the frame part 4 falls, the heat dissipation effect by the instrument main body 2 can be improved more.

一方、LEDチップ10から輻射される熱は、図1(b)に示すように、第1の凹部32及び第2の凹部42から成る放熱空間で対流して基部3及び枠体部4に伝達し、基部3及び枠体部4の外面、並びに反射部4aから大気中に伝達して放熱される。ここで、第1の凹部32の内面及び第2の凹部42の内面にそれぞれ放熱フィン32a,42bを設けることで、放熱空間における基部3及び枠体部4の内面の表面積を大きくして放熱効果を高めている。   On the other hand, as shown in FIG. 1B, heat radiated from the LED chip 10 is convected in the heat radiation space composed of the first recess 32 and the second recess 42 and transferred to the base 3 and the frame body 4. Then, it is transmitted to the atmosphere from the outer surface of the base 3 and the frame body part 4 and the reflection part 4a to be dissipated. Here, by providing the radiation fins 32a and 42b on the inner surface of the first recess 32 and the inner surface of the second recess 42, respectively, the surface area of the inner surface of the base portion 3 and the frame body portion 4 in the heat dissipation space is increased, and the heat dissipation effect. Is increasing.

ここで、本実施形態では、十分な放熱効果を得るために放熱空間におけるLEDチップ10から入射口40までの間に一定の距離を空けている。したがって、仮に環状反射板6を設けていない場合、図1(b)の破線イに示すように、LEDチップ10からの光のうち拡散角度の大きい光は入射口40に到達しない。このため、入射口40を通過する光の量が減ることで十分な照明効果を得ることができない。これに対して、本実施形態では、上述のように第1の凹部32及び第2の凹部42から成る放熱空間に環状反射板6を設けており、LEDチップ10からの光を環状反射板6の起立部60の内周面で反射させて、入射口40に集光させるようになっている。即ち、図1(b)の実線アに示すように、LEDチップ10からの光のうち拡散角度の大きい光も起立部60の内周面で反射して入射口40に到達するようになっている。   Here, in this embodiment, in order to obtain a sufficient heat dissipation effect, a certain distance is provided between the LED chip 10 and the entrance 40 in the heat dissipation space. Therefore, if the annular reflector 6 is not provided, light having a large diffusion angle among the light from the LED chip 10 does not reach the entrance 40 as shown by the broken line a in FIG. For this reason, a sufficient illumination effect cannot be obtained by reducing the amount of light passing through the entrance 40. On the other hand, in the present embodiment, as described above, the annular reflector 6 is provided in the heat dissipation space composed of the first recess 32 and the second recess 42, and light from the LED chip 10 is transmitted to the annular reflector 6. The light is reflected by the inner peripheral surface of the upright portion 60 and condensed at the entrance 40. That is, as indicated by the solid line a in FIG. 1B, light having a large diffusion angle out of the light from the LED chip 10 is also reflected by the inner peripheral surface of the upright portion 60 and reaches the entrance 40. Yes.

上述のように、本実施形態では、LEDチップ10から入射口40に到達するまでに拡散する光を環状反射板6の起立部60で反射させることで入射口40に集光することができるので、入射口40を通過する光の量を増大させることができる。したがって、放熱に必要な放熱空間を確保しつつ十分な照明効果を得ることができる。   As described above, in the present embodiment, the light diffused from the LED chip 10 until it reaches the entrance 40 can be condensed at the entrance 40 by being reflected by the standing portion 60 of the annular reflector 6. The amount of light passing through the entrance 40 can be increased. Therefore, it is possible to obtain a sufficient lighting effect while securing a heat radiation space necessary for heat radiation.

ところで、環状反射板6の起立部60を鉛直方向に沿って直立するように形成した場合、起立部60の内周面で反射した光の多くが、枠体部4の反射部4aで更に反射した後に出射口41から出射される。この場合、枠体部4の反射部4aにおける輝度が大きくなってしまい、天井を見上げた人が眩しさを感じてしまう虞がある。そこで、本実施形態では、図1(b)に示すように、環状反射板6の起立部60は、下側の開口から上側の開口に向かうにつれて径方向の内向きに傾斜するように形成されている。したがって、起立部60の内周面で反射した光の多くは、枠体部4の反射部4aで反射することなく直接出射口41から出射されるため、反射部4aにおける輝度を小さくすることができ、天井を見上げる人が眩しさを感じることがないようにすることができる。   By the way, when the standing part 60 of the annular reflecting plate 6 is formed so as to stand upright along the vertical direction, most of the light reflected by the inner peripheral surface of the standing part 60 is further reflected by the reflecting part 4 a of the frame body part 4. After that, the light is emitted from the emission port 41. In this case, the brightness in the reflection part 4a of the frame body part 4 is increased, and there is a possibility that a person looking up at the ceiling may feel dazzling. Therefore, in the present embodiment, as shown in FIG. 1B, the standing portion 60 of the annular reflecting plate 6 is formed so as to be inclined inward in the radial direction from the lower opening toward the upper opening. ing. Therefore, most of the light reflected by the inner peripheral surface of the upright portion 60 is directly emitted from the emission port 41 without being reflected by the reflection portion 4a of the frame body portion 4, so that the luminance at the reflection portion 4a can be reduced. It is possible to prevent the person looking up at the ceiling from feeling dazzling.

尚、本実施形態では、枠体部4が放熱性を有する金属材料から形成されているので、LEDチップ10が発する熱が基部3のみならず枠体部4も介して大気中に伝達され、放熱効果をより高めることができる。更に、本実施形態では、環状反射板6が放熱性を有する金属材料から形成されているので、LEDチップ10が発する熱が環状反射板6に伝達され、放熱効果をより高めることができる。尚、枠体部4及び環状反射板6は放熱性を有する材料で形成する必要はないが、上記の理由から放熱性を有する材料で形成するのが望ましい。   In this embodiment, since the frame part 4 is formed from a metal material having heat dissipation, the heat generated by the LED chip 10 is transmitted to the atmosphere not only through the base part 3 but also through the frame part 4, The heat dissipation effect can be further enhanced. Furthermore, in this embodiment, since the annular reflecting plate 6 is formed from a metal material having heat dissipation, the heat generated by the LED chip 10 is transmitted to the annular reflecting plate 6 and the heat dissipation effect can be further enhanced. The frame body 4 and the annular reflector 6 do not have to be formed of a material having a heat dissipation property, but are preferably formed of a material having a heat dissipation property for the above reasons.

10 LEDチップ(発光ダイオード)
2 器具本体
3 基部
32 第1の凹部(放熱空間)
4 枠体部
40 入射口
41 出射口
42 第2の凹部(放熱空間)
44 透光パネル(透光部材)
6 環状反射板(反射部材)
A 点灯装置
10 LED chip (light emitting diode)
2 Instrument body 3 Base 32 First recess (heat radiation space)
4 Frame body 40 Incident port 41 Ejection port 42 Second recess (heat radiation space)
44 Translucent panel (translucent member)
6 Annular reflector (reflective member)
A lighting device

Claims (3)

発光ダイオードと、前記発光ダイオードに点灯電力を給電する点灯装置と、少なくとも前記発光ダイオードを収納する有底筒状の器具本体とを備え、前記器具本体は、その底部に前記発光ダイオードが取り付けられるとともに前記発光ダイオードが発する熱を自身を介して外部に放出させる放熱性を有する材料から成る基部と、前記発光ダイオードからの光が入射する入射口、及び前記入射口から入射した光を外方へ出射する出射口を有する筒状の枠体部とから成り、前記入射口は、透光性を有する材料から成る透光部材によって閉塞され、前記発光ダイオードと前記入射口との間には、前記発光ダイオードから放射される熱を前記基部を介して外部へ放熱する放熱空間が設けられ、前記入射口の周縁には、前記基部に向かって立ち上がるとともに、その内周面に前記発光ダイオードからの光を反射させる反射面を有する反射部材が設けられたことを特徴とする照明器具。   A light-emitting diode, a lighting device that supplies lighting power to the light-emitting diode, and a bottomed cylindrical instrument body that houses at least the light-emitting diode, the instrument body having the light-emitting diode attached to the bottom thereof A base made of a heat-dissipating material that releases heat generated by the light emitting diode to the outside through itself, an incident port through which light from the light emitting diode is incident, and light incident from the incident port is emitted outward The incident port is closed by a translucent member made of a translucent material, and the light emitting diode is interposed between the light emitting diode and the incident port. A heat dissipation space for dissipating the heat radiated from the diode to the outside through the base is provided, and the peripheral edge of the incident port rises toward the base Moni, lighting equipment, wherein a reflective member is provided with a reflecting surface for reflecting light from the light emitting diode on the inner peripheral surface thereof. 前記枠体部は、放熱性を有する材料から成ることを特徴とする請求項1記載の照明器具。   The lighting device according to claim 1, wherein the frame body portion is made of a material having heat dissipation properties. 前記反射部材は、放熱性を有する材料から成ることを特徴とする請求項1又は2記載の照明器具。   The lighting apparatus according to claim 1, wherein the reflecting member is made of a material having heat dissipation properties.
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