TW201217557A - Sintered material for zno-mgo-based sputtering target - Google Patents

Sintered material for zno-mgo-based sputtering target Download PDF

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TW201217557A
TW201217557A TW100125370A TW100125370A TW201217557A TW 201217557 A TW201217557 A TW 201217557A TW 100125370 A TW100125370 A TW 100125370A TW 100125370 A TW100125370 A TW 100125370A TW 201217557 A TW201217557 A TW 201217557A
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mgo
zno
sintered body
phase
powder
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TW100125370A
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TWI513835B (en
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Hideo Takami
Masaru Sakamoto
Hiroyoshi Yamamoto
Tomoya Tamura
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Jx Nippon Mining & Metals Corp
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/3407Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
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    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/453Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zinc, tin, or bismuth oxides or solid solutions thereof with other oxides, e.g. zincates, stannates or bismuthates
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    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/626Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
    • C04B35/62605Treating the starting powders individually or as mixtures
    • C04B35/6261Milling
    • C04B35/62615High energy or reactive ball milling
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    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/626Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
    • C04B35/62605Treating the starting powders individually or as mixtures
    • C04B35/62695Granulation or pelletising
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    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3205Alkaline earth oxides or oxide forming salts thereof, e.g. beryllium oxide
    • C04B2235/3206Magnesium oxides or oxide-forming salts thereof
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    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3284Zinc oxides, zincates, cadmium oxides, cadmiates, mercury oxides, mercurates or oxide forming salts thereof
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    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/74Physical characteristics
    • C04B2235/78Grain sizes and shapes, product microstructures, e.g. acicular grains, equiaxed grains, platelet-structures
    • C04B2235/785Submicron sized grains, i.e. from 0,1 to 1 micron

Abstract

A sintered material for a ZnO-MgO-based sputtering target, which comprises ZnO and MgO, and which is characterized in that Mg is contained in an amount of 3-50 mol% in terms of MgO, an MgO phase (containing an MgO-rich solid solution phase) has the largest crystal particle diameter of 10 μm or less, and the sintered material has a homogeneously dispersed structure. The purpose of the present invention is to provide a sintered material for a ZnO-MgO-based sputtering target, which rarely undergoes the formation of nodules or particles even when the sputtering is carried out for a long period, and which enables the production of a film of which the film composition has excellent in-plane uniformity.

Description

201217557 六、發明說明: 【發明所屬之技術領域】 本發明係關於一種用以形成Cu—In—Ga—Se (以 稱為cms)系太陽電池之窗層材料的Zn〇_Mg:系=無 用燒結體。 【先前技術】 近年來’高轉換效率之CIGS系太陽電池作為薄膜太陽 電池的技術開發不斷發展,已知有將Zn作為主成分之氧化 物半導體作為該太陽電池之窗層材料。 於專利文獻1中,揭示有利用磁控濺鍍法對Zn〇或 (Zn,Mg) 〇等濺鍍靶進行濺鍍,從而形成成為窗層之= 膜的方法。 ' 然而,關於影響濺鍍特性之濺鍍靶之組織、密度等特 性則完全未清楚交代。 又’於專利文獻2中揭示有使用由Zn〇或ZnMg〇等〇 型半導體所構成之半導體膜作為太陽電池之〇形窗層。 然而’關於製作該ΖηΟ膜或ZnMg0膜之方法完全未作 清楚交代。 又,於專利文獻3中揭示有利用濺鍍法形成由含有 與0之氧化物所構成之層作為太陽電池之窗層。又,記栽 有藉由改變濺鍍靶之組成而可容易控制該層之組成。 然而’記載有該氧化層係使用Zn〇乾、Mg〇把、 靶而形成,並非藉由ΖηΟ — MgO系合金靶而形成。又,關 於該組織等完全沒有記載。 201217557 於專利文獻4中,記載有於將氧化鋅作為主成分並且 含有鎂之氧化物燒結體靶中,藉由使鎂含量以(Zn + Mg)原子數比計為0.02〜〇.3〇,而獲得對於酸、鹼之耐化 學品性高、且低電阻之氧化鋅系透明導電膜。 然而,該氧化物燒結體較佳為複合氧化物]^^(}32〇4相 及複合氧化物MgAl2〇4相儘量少者,最佳為完全不含有該 等而僅觀察到氧化鋅之相者’但於使用具有此種組織之乾 的情形時,實際上無法充分抑制電弧(arcing )。 又,於專利文獻5中揭示有一種氧化辞薄膜形成用滅 鍍靶,係將氧化鋅作為主成分,其特徵在於:含有具有作 為元素種類之鋅(Zn)及氧(〇)以外之至少i種以上之元 素種類的添加元素’且上述添加元素為於乾中不含有氧之 化合物。 氧之添加元素易成 然而,如上所述於靶中存在不含有 為產生電弧之原因。 專利文獻1 :日本特開2008 — 11〇911號公報 專利文獻2 :國際公開第2005/ 069386號 專利文獻3 :日本特開2〇〇4_ 281938號公報 專利文獻4 :國際公開第2007/ 141994號 專利文獻5 ··日本特開2〇〇9— 2637〇9號公報 本發明之課題在於提供一種 顆粒(pa—)產生少” η λ —e)或 座生夕之Zn0—Mg〇系濺鍍靶。 為解決上述課題,本發明人等進行努力研究,結果發 4 201217557 現:可藉由調整原料粉末製作時 不表作矸之粉碎與燒結時之燒結溫 度,來製造Mg〇相(富Mg0固溶相)之結晶粒徑細微之 Zn〇-MgO系㈣!^燒結體。並且,於使用此錄之情 形時,濺料結球或顆粒之產生少,從而完成本發明。 即’本發明提供 1. 一種ZnO-MgO系濺鍍靶用燒結體,含有Zn〇與 MgO’其特徵在於:Mg以Mg〇換算含有3〜5〇m〇i%,Mg〇 相(包含富MgO固溶相)之最大結晶粒徑為丨〇〆m以下, 具有均勻分散之組織。 2. 如上述1之ZnO — MgO系濺鍍靶用燒結體,其中,201217557 VI. Description of the Invention: [Technical Field] The present invention relates to a Zn〇_Mg for forming a window material of a Cu-In-Ga-Se (referred to as cms) solar cell: system = useless Sintered body. [Prior Art] In recent years, the development of technology for thin-film solar cells of a CIGS-based solar cell having high conversion efficiency has been progressing, and an oxide semiconductor containing Zn as a main component is known as a window layer material of the solar cell. Patent Document 1 discloses a method of forming a film of a window layer by sputtering a sputtering target such as Zn 〇 or (Zn, Mg) 磁 by a magnetron sputtering method. However, the characteristics of the structure, density, etc. of the sputtering target that affect the sputtering characteristics are not clearly explained. Further, Patent Document 2 discloses that a semiconductor film made of a 〇-type semiconductor such as Zn〇 or ZnMg〇 is used as a dome-shaped window layer of a solar cell. However, the method for producing the ΖηΟ film or the ZnMg0 film is not completely explained. Further, Patent Document 3 discloses that a layer composed of an oxide containing 0 and an oxide of 0 is formed as a window layer of a solar cell by sputtering. Further, it is possible to easily control the composition of the layer by changing the composition of the sputtering target. However, it is described that the oxide layer is formed using Zn 〇 dry, Mg 〇, and a target, and is not formed by a ΖηΟ-MgO alloy target. Also, there is no record at all about the organization. In Patent Document 4, it is described that in the sintered body target containing magnesium oxide as a main component and containing magnesium, the magnesium content is 0.02 to 〇.3 以 in terms of (Zn + Mg) atomic ratio. Further, a zinc oxide-based transparent conductive film having high chemical resistance to acids and bases and low electrical resistance is obtained. However, it is preferable that the oxide sintered body has a composite oxide as long as the composite phase oxide and the composite oxide MgAl2〇4 phase are as small as possible, and it is preferable that only the zinc oxide phase is observed. However, in the case where the dryness of such a structure is used, the arcing is not sufficiently suppressed. Further, Patent Document 5 discloses a target for forming a ruthenium film, which uses zinc oxide as a main component. The component is characterized by containing an additive element having at least one or more element types other than zinc (Zn) and oxygen (〇) as an element type, and the additive element is a compound which does not contain oxygen in the dry. However, as described above, there is a possibility that the target is not contained in the target to generate an electric arc. Patent Document 1: Japanese Laid-Open Patent Publication No. 2008-11-11 pp. Patent Document 2: International Publication No. 2005/069386 Patent Document 3: Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. 2007/141994. Production In order to solve the above problems, the inventors of the present invention have made an effort to study the results, and the results of the invention are as follows: 2012, 2012, the current raw material powder can be produced by adjusting the raw material powder. As a sintering temperature at the time of pulverization and sintering, a Zn〇-MgO system (4) sintered body having a fine crystal grain size of Mg 〇 phase (Mg0 solid solution phase) is produced, and, when using this recording, The present invention is completed by the present invention. The present invention provides a sintered body for a ZnO-MgO-based sputtering target, which contains Zn〇 and MgO', and is characterized in that Mg contains 3 in terms of Mg〇. ~5〇m〇i%, the maximum crystal grain size of the Mg〇 phase (including the MgO-rich solid solution phase) is 丨〇〆m or less, and has a uniformly dispersed structure. 2. The ZnO-MgO-based sputtering target as described above Using a sintered body, wherein

MgO相(包含富Mg0固溶相)之最大結晶粒徑為功以 下。 3. 如上述1之ZnO —MgO系濺鐘乾用燒結體,其中,The maximum crystal grain size of the MgO phase (including the MgO-rich solid solution phase) is below the work. 3. The sintered body of ZnO-MgO sputtering clock according to the above 1, wherein

Mg〇相(包含富MgO固溶相)之最大結晶粒徑為2 # m以 下。 4. 如上述1至3中任一項之ZnO-MgO系濺鍍靶用燒 結體’其中,於將相當於MgO相(200 )之X射線繞射峰 之最大強度設為11,將相當於ΖηΟ相(101 )之X射線繞 射峰之最大強度設為12之情形時,11/12為0.02以下。 5 ·如上述4之ΖηΟ — MgO系濺鍍靶用燒結體,其相對 密度為95%以上。 本發明之ΖηΟ — MgO系濺鍍靶具有即使長時間進行機 錄亦幾乎不會產生結球或顆粒,進而可製造膜組成之面内 均勻性優異之膜的優異效果。 201217557 【實施方式】 本發明之Zn〇~Mg〇系濺鍍靶用燒結體之The Mg 〇 phase (including the MgO-rich solid solution phase) has a maximum crystal grain size of 2 # m or less. 4. The sintered body for a ZnO-MgO sputtering target according to any one of the above 1 to 3, wherein the maximum intensity of the X-ray diffraction peak corresponding to the MgO phase (200) is 11 and corresponds to ΖηΟ When the maximum intensity of the X-ray diffraction peak of the phase (101) is 12, 11/12 is 0.02 or less. 5. The sintered body for a MgO-based sputtering target having a relative density of 95% or more as described above. The ΖηΟ-MgO-based sputtering target of the present invention has an excellent effect of producing a film excellent in in-plane uniformity of a film composition, even if it is produced for a long period of time without causing formation of particles or particles. 201217557 [Embodiment] The sintered body for a Zn〇~Mg〇 sputtering target of the present invention

MgO 換算為 3 〜50 mol。/。。 、其原因m Mg含量以Mg()換算未達3则1%或超 過50 mol%,則&法發揮作為太陽電池之窗層材料的充分功 能。 再者,所謂Mg〇換算意指利用原料粉末之Mg〇粉末進 行調配。 本發明之Zn〇— Mg〇系濺鍍靶用燒結體之重要的—點 為.將MgO相(包含富Mg〇固溶相)之最大結晶粒徑設為 1〇以m以下,較佳為5 V m以下,更佳為2以m以下。 右最大結晶粒徑過大,則於表面易產生大凹凸,由此 產生異常放電’因而易增加顆粒之產生。 為了縮小Mg〇相(包含富Mg〇固溶相)之結晶粒徑, 必需於製作經適當粉碎之原料粉末後,於適當之溫度進行 燒結。 再者’結晶粒徑係將採集自燒結體任意部位的樣本表 面加以研磨後,利用電子探針微量分析器(Electron Probe MicroAnalyser :以下,稱為EpMA)之面分析,對Mg〇相 (包含富MgO固溶相)之大小進行測定。 又,對於異常放電等狀況,可藉由將燒結體加工成例 如直彳坐6吋、厚度6 mm,以銦等作為焊料貼附於支持板而 對其進行濺鍍’藉此實際調查其狀況。 本發明之Zn〇— MgO系濺鍍靶用燒結體之重要的一點 6 201217557 係使Mg〇相(包含富MgO固溶相)為均勻分散之組織。 其原因在於:若MgO相(包含富Mg〇固溶相)局部凝 聚’則由於會造成異常放電或膜組成偏差等問題,故而不 佳。 本發明之ZnO—Mg0系濺鍍靶用燒結體之重要的一點 係於將相當於MgO相(200 )之X射線繞射峰之最大強度 設為11,將相當於ZnO相(101)之X射線繞射峰之最大 強度設為12之情形時,丨丨/ 12為〇.〇2以下。 再者,X射線繞射峰之強度係利用χ射線繞射法(X —The MgO is converted to 3 to 50 mol. /. . The reason why the m Mg content is less than 3% or more than 50% by mol in terms of Mg(), the & method functions as a window layer material for a solar cell. Further, the term "Mg" conversion means that the powder of the raw material powder is used for blending. An important point of the sintered body for a Zn〇-Mg-based sputtering target of the present invention is that the maximum crystal grain size of the MgO phase (including the Mg-rich solid solution phase) is 1 m or less, preferably 5 V m or less, more preferably 2 or less m. If the right maximum crystal grain size is too large, large irregularities are likely to occur on the surface, thereby causing abnormal discharge, which tends to increase the generation of particles. In order to reduce the crystal grain size of the Mg 〇 phase (including the Mg-rich solid solution phase), it is necessary to form a suitably pulverized raw material powder and then sinter at a suitable temperature. In addition, the crystal grain size is obtained by grinding the surface of the sample collected from any part of the sintered body, and then analyzing the surface of the sample by using an electron probe microanalyzer (Electron Probe MicroAnalyser: hereinafter, referred to as EpMA). The size of the MgO solid solution phase was measured. In addition, in the case of abnormal discharge or the like, the sintered body can be processed into, for example, a straight cymbal and a thickness of 6 mm, and indium or the like is attached as a solder to the support plate to be sputtered. . An important point of the sintered body for a Zn〇-MgO-based sputtering target of the present invention is 6 201217557, which is a structure in which a Mg 〇 phase (including a MgO-rich solid solution phase) is uniformly dispersed. The reason for this is that if the MgO phase (including the Mg-rich solid solution phase) is locally agglomerated, it is not preferable because it causes problems such as abnormal discharge or film composition deviation. An important point of the sintered body for a ZnO-MgO sputtering target of the present invention is that the maximum intensity of the X-ray diffraction peak corresponding to the MgO phase (200) is 11 and the X-ray corresponding to the ZnO phase (101) is used. When the maximum intensity of the diffraction peak is set to 12, 丨丨/12 is 〇.〇2 or less. Furthermore, the intensity of the X-ray diffraction peak is based on the X-ray diffraction method (X-

RayDifraction:以下,稱為XRD),對採集自燒結體任意部 位之樣本表面進行測定。 若強度比11/12超過〇_〇2,則由於會造成長時間濺鍍 時之結球或異常放電、膜組成偏差等問題,故而不佳。 本發明之ZnO — MgO系濺鍍靶用燒結體之更重要的一 點係使燒結體之相對密度為95%以上。 再者,相對密度係將以阿基米德法測定燒 際的絕對密度除以該組成之Μ理論密度而得之^=實 靶之相對役度低意指靶中存在很多内部孔隙,因此於 濺鑛過程中露出内部孔隙時,容易發生以孔隙周邊為起點 的濺出(Wash)或異常放電。因此’膜上顆粒產生數辦加, 且表面之凹凸化會提前進行,而容易引起以表面突起曰(結 球)為起點的異常放電等。此係CIGS太陽電池之轉換效率 下降的原因之一。 實施例 201217557 繼而’對本發明之實施例及比較例進行說明。再者, 以下之實施例只不過表示代表性之例,本發明無需限制於 該等之實施例,應於說明書記載之技術思想的範圍内作解 釋。 (實施例1 ) 準備純度4 N且平均粒徑丨# m之Zn〇粉末、純度3 n 且平均粒徑1 // m之Mg〇粉末,以97 mol%之ZnO粉末、3 mol%之MgO粉末進行調配。 利用濕式球磨機將兩粉末加以混合,使其均勻分散 後,不進行預燒而利用濕式球磨機對粉末進行約2〇小時以 上之微粉碎,製作粒徑丨“爪以下之漿體。 利用喷霧乾燥機對該漿體進行造粒乾燥,填充至規定 形狀之2GG0金屬模具進行冷成形,並於大氣中進行常壓译 結。此時’燒結溫度為12〇(rc,將燒結保持時間設為5 : 時。燒結較理想於⑶代〜i 5Q(rc進行。其原因在於若 在該溫度範圍外則密度難以提高。尤其於燒結溫度低之情 形時,MgO相易於在凝聚之狀態下存在。 所得之ZnO-Mg◦燒結體的最大結晶粒徑為$χ 射線繞射強度波峰強度比11/12為〇 〇1 99.5%。 X 兩 將該燒結體加工成直徑6忖、厚度6酿之圓板狀,並 ^成錢㈣,從而進行R F濺鍵H力率為5 q q w,環产 氣體為氬氣,|[體片見 虱轧亂體流量為50SCCm,⑽時壓力為RayDifraction: Hereinafter, referred to as XRD), the surface of the sample collected from any portion of the sintered body was measured. If the strength ratio exceeds 11/12 by 〇_〇2, it is not preferable because it causes problems such as balling or abnormal discharge during long-time sputtering and variations in film composition. A more important point of the sintered body for a ZnO-MgO-based sputtering target of the present invention is that the relative density of the sintered body is 95% or more. Furthermore, the relative density is obtained by dividing the absolute density of the burned by the Archimedes method by the theoretical density of the composition. The relative degree of the relative target of the target is low, meaning that there are many internal pores in the target, so When the internal pores are exposed during the splashing process, it is easy to cause a spray or abnormal discharge starting from the periphery of the pore. Therefore, the number of particles on the film is increased, and the surface roughness is advanced in advance, and abnormal discharge or the like starting from the surface protrusion 结 (ball) is likely to occur. This is one of the reasons for the decline in conversion efficiency of CIGS solar cells. EXAMPLES 201217557 Next, examples and comparative examples of the present invention will be described. In addition, the following examples are merely representative examples, and the present invention is not limited to the embodiments, and should be construed as being within the scope of the technical idea described in the specification. (Example 1) A Zn 〇 powder having a purity of 4 N and an average particle diameter of m# m, a Mg 〇 powder having a purity of 3 n and an average particle diameter of 1 // m, 97 mol% of ZnO powder, and 3 mol% of MgO were prepared. The powder is formulated. After the two powders were mixed by a wet ball mill and uniformly dispersed, the powder was finely pulverized by a wet ball mill for about 2 hrs or more without performing calcination to prepare a slurry having a particle diameter of "claw or less." The slurry is granulated and dried by a mist dryer, filled into a 2GG0 metal mold of a predetermined shape, and cold-formed, and subjected to atmospheric pressure in the atmosphere. At this time, the sintering temperature is 12 〇 (rc, the sintering retention time is set. When it is 5: sintering is preferable to (3) generation to i5Q (rc). The reason is that if the temperature is outside the temperature range, the density is difficult to increase. Especially in the case where the sintering temperature is low, the MgO phase tends to exist in a state of agglomeration. The obtained ZnO-Mg ◦ sintered body has a maximum crystal grain size of χ ray diffraction intensity peak intensity ratio 11/12 of 〇〇1 99.5%. X The sintered body is processed into a diameter of 6 忖 and a thickness of 6 Circular plate shape, and ^ into money (four), so that the RF splash bond H force rate is 5 qqw, the ring gas is argon, | [body film see rolling volume flow is 50SCCm, (10) when the pressure is

連續進行韻直至㈣週期成為15 kwh,_數於H 8 201217557 面產生之突起物(結球)之個數,結果為1.2個/ cm2。 靶之特性及進行濺鍍評價之結果示於表1。 [表1] 靶組成 MgO相之最 大結晶粒徑 βτη XRD 波峰強度 11/12 密度 % 結球 個/cm2 ZnO (mol%) MgO (mol% ) 實施例1 97 3 5 0.01 99.5 1.2 實施例2 80 20 2 0.02 97.5 1.7 — 實施例3 80 20 <0.5 <0.005 98.2 0.5 實施例4 65 35 <0.5 <0.005 96.8 0.8 實施例5 50 50 10 0.05 95 4.8 比較例1 80 20 15 0.08 95.5 6.3 比較例2 80 20 20 0.1 94 11.3 比較例3 97 3 10 0.06 94.5 6.4 比較例4 65 35 10 0.05 93 15.3 (實施例2) 準備純度4 N且平均粒徑! " m之Zn〇粉末 '純度3 n 且平均粒徑之Mg0粉末,以8〇m〇1%之Zn〇粉末、 20 mol%之MgO粉末進行調配。 利用濕式球磨機將兩粉末加以混合,使其均勻分散 後,於iioot進行預燒。預燒較理想於1〇〇(rc〜i3〇〇〇c進 行。其原因在於’若溫度過低,則幾乎無預燒之效果,另 一方面,若溫度過高,則粉碎會變得困難。 利用濕式球磨機對經預燒之粉末進行約Μ小時以上之 微粉碎,製作粒徑1 # m以下之漿體。 利用喷霧乾燦機對該浆體進行造粒乾燥 形狀之2000金屬模具進行冷 、兄至規疋 ^ 並於大氣中進行常壓燒 201217557 結。此時,燒結溫度為125(rc, 時。 將燒結保持時間設為The rhyme is continuously performed until the (four) period becomes 15 kwh, and the number of protrusions (balls) generated by the surface of H 8 201217557 is 1.2 pieces/cm2. The characteristics of the target and the results of the evaluation of the sputtering are shown in Table 1. [Table 1] Maximum crystal grain size of the target composition MgO phase βτη XRD Peak intensity 11/12 Density % Balls/cm 2 ZnO (mol%) MgO (mol%) Example 1 97 3 5 0.01 99.5 1.2 Example 2 80 20 2 0.02 97.5 1.7 - Example 3 80 20 <0.5 <0.005 98.2 0.5 Example 4 65 35 <0.5 < 0.005 96.8 0.8 Example 5 50 50 10 0.05 95 4.8 Comparative Example 1 80 20 15 0.08 95.5 6.3 Comparison Example 2 80 20 20 0.1 94 11.3 Comparative Example 3 97 3 10 0.06 94.5 6.4 Comparative Example 4 65 35 10 0.05 93 15.3 (Example 2) Preparation of purity 4 N and average particle diameter! " m Zn 〇 powder 'Mg0 powder of pure 3 n and average particle size, formulated with 8 〇 m 〇 1% Zn 〇 powder, 20 mol% of MgO powder. The two powders were mixed by a wet ball mill to be uniformly dispersed, and then calcined at iioot. The calcination is preferably carried out at 1 〇〇 (rc~i3〇〇〇c.) The reason is that if the temperature is too low, there is almost no effect of calcination. On the other hand, if the temperature is too high, the pulverization becomes difficult. The pre-calcined powder is finely pulverized by a wet ball mill for about several hours or more to prepare a slurry having a particle diameter of 1 # m or less. The slurry is subjected to granulation and drying of the shape of the 2000 metal mold by a spray dryer. Perform cold, brother to 疋^ and carry out atmospheric pressure burning 201217557 in the atmosphere. At this time, the sintering temperature is 125 (rc, when. Set the sintering hold time to

晶粒徑為2 a m,x 〇·〇2,相對密度為 所得之Zn〇 — MgO燒結體之最大結 射線繞射強度波峰強度比11/12為 97.5%。 關於所得之Ζη〇-吨〇燒結體之組織,㈣影像示於 圖1,ΕΡΜΑ影像示於圖2。於兩影像中可知:粒狀之部分 為Mg〇相(包含富Mg〇固溶相),其最大結晶粒徑為 m以下,且均勻分散於靶面内。 於與實施例1相同之條件下,加工燒結體,並製成滅 鍵乾’從而進行灯濺鑛,計數於乾表面產生之突起物(社 球)的個數,為非常少之"個為良好之結果。’。 (實施例3) 準備純度4 N且平均粒徑^ m之Z n 〇粉末、純度3 N 且平均粒徑Um之Mg〇粉末…〇 _1%之Zn〇粉末、 20 mol%之MgO粉末進行調配。 利用濕式球磨機將兩粉末加以混合,使其均勻分散 後’於1100。。進行預燒。利用濕式球磨機對經預燒之粉末 進+日寺以上之微粉碎,製作粒徑im以下之聚體。 利用喷霧乾燥機對該漿體進行造粒乾燥,填充至規定 形狀之2GG0金屬模具進行冷成形,並於大氣中進行常壓燒 結。此時,燒結溫度為⑴代,將燒結保持時間設為5小 時。 所得之ZnO—Mg〇燒結體之最大結晶粒徑未達〇.5以 201217557 m,X射線繞射強度波峰強度比U/i2未達〇 〇〇5,相對密 度為98.2%。 於與實施例1相同之條件下,加工燒結體,並製成濺 鍍靶,從而進行RF濺鍍,計數於靶表面產生之突起物(結 球)的個數,為非常少之0.5個/cm2,為良好之結果。 (實施例4 ) 準備純度4N且平均粒徑^爪之Zn〇粉末、純度3n 且平均粒徑Um之Mg0粉末,以65m〇i%之Zn〇粉末、 3 5 mol%之MgO粉末進行調配。 利用濕式球磨機將兩粉末加以混合,使其均勻分散 後’於llOOt進行預燒。利用濕式球磨機對經預燒之粉末 進行約20小時以上之微粉碎,製作粒徑^爪以下之毁體。 利用喷霧乾燥機對該毅體進行造粒&燥’夫真充至規定 形狀之金屬模具進行冷成形,並於大氣中進行常壓燒The crystal grain size is 2 a m, x 〇·〇2, and the relative density is the maximum entangled diffraction intensity peak intensity ratio of the obtained Zn〇-MgO sintered body of 97.5%. Regarding the structure of the obtained Ζη〇-ton 〇 sintered body, (4) images are shown in Fig. 1, and ΕΡΜΑ images are shown in Fig. 2. It can be seen from the two images that the granular portion is a Mg 〇 phase (including a Mg-rich solid solution phase), and the maximum crystal grain size is m or less, and is uniformly dispersed in the target surface. Under the same conditions as in Example 1, the sintered body was processed, and the bond was dried to conduct lamp spattering, and the number of protrusions (both balls) generated on the dry surface was counted, which was very small. Good results. ’. (Example 3) A Z n 〇 powder having a purity of 4 N and an average particle diameter of m, a Mg 〇 powder having a purity of 3 N and an average particle diameter Um, 〇_1% of Zn 〇 powder, and 20 mol% of MgO powder were prepared. Provisioning. The two powders were mixed using a wet ball mill to uniformly disperse them at 1100. . Pre-burning. The pre-fired powder was finely pulverized by a wet ball mill into a temple of a size of i or less to prepare a polymer having a particle diameter of i or less. The slurry was granulated and dried by a spray dryer, and filled into a 2GG0 metal mold having a predetermined shape to be cold-formed, and subjected to atmospheric pressure sintering in the air. At this time, the sintering temperature was (1) generation, and the sintering holding time was set to 5 hours. The maximum crystal grain size of the obtained ZnO-Mg〇 sintered body is less than 17.5 to 201217557 m, and the X-ray diffraction intensity peak intensity ratio U/i2 is less than 〇 〇〇5, and the relative density is 98.2%. Under the same conditions as in Example 1, the sintered body was processed and a sputtering target was formed to perform RF sputtering, and the number of protrusions (balls) generated on the surface of the target was counted to be very small, 0.5/cm 2 . For good results. (Example 4) A Zn 〇 powder having a purity of 4 N and an average particle diameter of ?, a MgO powder having a purity of 3 n and an average particle diameter Um was prepared, and the mixture was blended with 65 m〇i% of Zn〇 powder and 35 mol% of MgO powder. The two powders were mixed by a wet ball mill to be uniformly dispersed, and then calcined at llOOt. The calcined powder was subjected to fine pulverization for about 20 hours or more by a wet ball mill to prepare a pulverized body having a particle diameter of less than or equal to the claw. The granules are granulated and dried by a spray dryer to a metal mold of a predetermined shape, which is cold-formed and subjected to atmospheric pressure in the atmosphere.

結。此時’燒結溫度為135n:,將燒結保持時間設 時。 J 之最大結晶粒徑未達〇. 5从 11/12未達〇·〇〇5,相對密 所得之ZnO — MgO燒結體 m,X射線繞射強度波峰強度比 度為96.8%。 相同之條件下,加工燒結體 於興實施例 - 口祖-业眾成濟 鍵把,從而進行RF濺鍍,計數 t數於靶表面產生之突起物(社 球)的個數,為非常少之〇 8 ^ 2 ' α 吊夕之〇·8個八m,為良好之結果。 (實施例5) 準備純度4 N且平约雜僻! 十均粒佐1/zm之Zn0粉末、純度3n 201217557 且平均粒徑之Mg0粉末,以5〇111〇丨%之Zn〇粉末、 5 0 mol%之MgO粉末進行調配。 利用濕式球磨機將兩粉末加以混合,使其均勻分散 後’不進行預燒而利用濕式球磨機對粉末進行約2Q小^ 上之微粉碎,製作粒徑1 V m以下之毁體。 利用喷霧乾燥機對該漿體進行造粒乾燥,填充至規定 形狀之20M金屬模具進行冷成形,並於大氣中進行常壓燒 結。此時’燒結溫度為150(rc,將燒結保持時間設為5小 時。 所得之Zn〇-Mg0燒結體之最大結晶粒徑為…m,x 射線繞射強度波峰強度比11/12為〇 〇5,相對密度為95%。 於與實施例1相同之條件下,加工燒結體,並製成藏 餘,從而進行RF_,計數於㈣面產生之突起物(結 球)的個數,少至4·8個八m2,為良好之結果。 (比較例1 ) 準備純度4 N且平均粒徑1以m之ZnO粉末、純度3 且平均粒徑Um之Mg〇粉末,以8〇111〇1%之Zn〇 /末 2(^〇1%之Mg〇粉末進行調配。 n 、以乾式混合兩粉末,使其均勻分散後,不進行預燒而 以乾式對粉末進行約20小時以上之微粉碎,製作以 下之粉末。 ,將°亥私末填充至規定形狀之200多金屬模具進行冷成 形’並於大氣中進行常壓燒結。此時,燒結溫度為1200〇c, 將燒結保持時間設為5小時。 201217557 95.5% 所得之Zn〇〜Mg〇燒結體之最大結晶粒徑為15/zm,x 射線繞射強度波峰強度比11 / 12為G.G8,相對密度為 於與實施例1相同之條件下,加工燒結體,並製成機 鍵乾從而進订RF賤鐘,計數於乾表面產生之突起物(結 球)的個數’增多為6.3個/ cm2。 (比較例2) 準備純度4N且平均粒徑之Zn〇粉末、純度3n 且平均粒徑2 // m之Mg〇粉末,以8〇m〇1%之Zn〇粉末、 20m〇l%之Mg0粉末進行調配。 、以乾式混合兩粉末,使其均勻分散後,不進行預燒而 乂乾式對粉末進仃約2〇小時以上之微粉碎,製作^扪以 下之粉末。 將該粉末填充至規定形狀之200 0金屬模具進行冷成 形’並於大氣中進行常壓燒結。此時,燒結溫度為"赃, 將燒結保持時間設為5小時。 所付之ZnO-MgO燒結體之最大結晶粒徑為2〇〆m,x 射線繞射強度波峰強度比1…2為〇1,相對密度為㈣。 於與實施例1相同之條件下,加工燒結體,並製成藏 又乾 >(足而進行rF濺鍍,計數於乾表面產生之突起物(結 球)的個數,增多為113個八m2。 (比較例3) 、,準備純度4 N且平均粒徑j " m之Zn〇粉末、純度3 N 且平均粒徑一之吣0粉末,以97 mol%之ZnO粉末、3 201217557 mol%之Mg〇粉末進行調配。 利用濕式球磨機將兩粉末加以混人 σ 使其均勻分散 後,不進行預燒而以濕式球磨機對粉末進行約 、 之微粉碎,製作粒徑丨# m以下之漿體。】夺、上 填充至規定 進行常壓燒 間設為5小 利用噴霧乾燥機對該漿體進行造粒乾燥, 形狀之200 0金屬模具進行冷成形,並於大氣中 結。此時,燒結溫度為1〇〇(rc,將燒結保持時 時。 晶粒徑為10// m,X 〇·〇6 ’相對密度為 所得之ZnO—Mg〇燒結體之最大結 射線繞射強度波峰強度比1 1 / 12為 94.5%。 關於所得之ZnO—Mg〇燒結體之組織,_影像示方 圖3,ΕΡΜΑ影像示於圖4。於兩影像中可知:粒狀之部> 為Mg0相(包含富Mg〇固溶相),亦有其最大結晶粒:: 過l〇Wm者,且一部分於靶面内凝聚。 於與實施例1相同之條件下,加工燒結體,並製成淨 鍍靶,從而進行RF濺鍍,蚪叙於知主;^ x 数於靶表面產生之突起物(矣 球)的個數’增多為6.4個/ Cm2。 (比較例4) 準備純度4 N且平均教彳;^ 1 , j 工1以m之Zn〇粉末、純度3 , 且平均粒徑1 /z m之Mg〇耠* 〜 ln/ a s 物末’以65 mol%之ZnO粉末, 3 5 mol%之MgO粉末進行調配。 利用濕式球磨機混合兩粉古 w构·末使其均勻分散後,不進不 預燒而以濕式球磨機對粉龙推〜^ ^ J 不進仃約20小時以上之微粉碎,Knot. At this time, the sintering temperature was 135 n: and the sintering holding time was set. The maximum crystal grain size of J is less than 〇. 5 from 11/12 is less than 〇·〇〇5, and the relatively dense ZnO-MgO sintered body m has an X-ray diffraction intensity peak intensity ratio of 96.8%. Under the same conditions, the sintered body is processed in the embodiment - the ancestor - the public key, so as to carry out RF sputtering, and count the number of protrusions (both balls) generated on the target surface, which is very small. After 8 ^ 2 ' α 夕 夕 夕 · 8 八 m, is a good result. (Example 5) Preparation of purity 4 N and flatness! The ten-averaged 1/zm Zn0 powder, the purity 3n 201217557 and the average particle size of the Mg0 powder were formulated with 5〇111〇丨% of Zn〇 powder and 50% by mole of MgO powder. The two powders were mixed by a wet ball mill to be uniformly dispersed, and the powder was finely pulverized by a wet ball mill for about 2Q to prepare a pulverized body having a particle diameter of 1 Vm or less. The slurry was granulated and dried by a spray dryer, filled into a 20 M metal mold of a predetermined shape, cold-formed, and subjected to atmospheric pressure sintering in the air. At this time, the sintering temperature was 150 (rc, and the sintering holding time was set to 5 hours. The maximum crystal grain size of the obtained Zn〇-Mg0 sintered body was ... m, and the x-ray diffraction intensity peak intensity ratio was 11/12. 5, the relative density is 95%. Under the same conditions as in the first embodiment, the sintered body is processed and made into a residue, thereby performing RF_, counting the number of protrusions (balls) generated on the (four) plane, as little as 4· 8 八 m2, which is a good result. (Comparative Example 1) A ZnO powder having a purity of 4 N and an average particle diameter of 1 m, a Mg 〇 powder having a purity of 3 and an average particle diameter Um, of 8 〇 111 〇 1% was prepared. Zn〇/2 (1% of Mg 〇 powder is blended. n) The two powders are dry-mixed and uniformly dispersed, and the powder is pulverized in a dry manner for about 20 hours or more without calcination. The following powders are filled into a 200-mold metal mold of a predetermined shape and subjected to cold-forming at atmospheric pressure. At this time, the sintering temperature is 1200 〇c, and the sintering holding time is set to 5 hours. 201217557 95.5% The obtained Zn〇~Mg〇 sintered body has a maximum crystal grain size of 15/zm, x-ray The diffraction intensity peak intensity ratio 11 / 12 is G.G8, and the relative density is the same as in the case of Example 1, the sintered body is processed, and the machine is dried to prepare the RF clock, and the protrusion generated on the dry surface is counted. The number of objects (balls) increased to 6.3/cm2. (Comparative Example 2) A Zn 〇 powder having a purity of 4 N and an average particle diameter, a Mg 〇 powder having a purity of 3 n and an average particle diameter of 2 // m was prepared at 8 〇. M〇1% of Zn〇 powder and 20m〇% of Mg0 powder are blended. After mixing the two powders in a dry manner, the powder is uniformly dispersed, and the powder is dried without drying for about 2 hours or more. The pulverization is carried out to produce a powder of the following shape: The powder is filled into a 200 mm metal mold of a predetermined shape to be cold-formed and subjected to atmospheric pressure sintering in the atmosphere. At this time, the sintering temperature is "赃, and the sintering holding time is set to 5 hours. The maximum crystal grain size of the ZnO-MgO sintered body was 2 〇〆 m, the x-ray diffraction intensity peak intensity ratio 1...2 was 〇1, and the relative density was (4). The same conditions as in Example 1. Next, processing the sintered body, and making it dry and dry > (foot and rF sputtering, counting The number of protrusions (balls) produced on the dry surface increased to 113 octels. (Comparative Example 3), Zn 〇 powder with a purity of 4 N and an average particle diameter of j " m, purity 3 N and average The particle size of 吣0 powder is formulated with 97 mol% of ZnO powder and 3 201217557 mol% of Mg 〇 powder. The two powders are mixed by σ to form a uniform dispersion by a wet ball mill, and then pre-burned without The wet ball mill grinds and pulverizes the powder to prepare a slurry having a particle diameter of m# m or less. The filling and the filling were carried out until the normal pressure was set to 5, and the slurry was granulated and dried by a spray dryer, and the shape of the 200 0 metal mold was cold-formed and kneaded in the atmosphere. At this time, the sintering temperature is 1 〇〇 (rc, when the sintering is maintained. The crystal grain size is 10 / / m, and the relative density of X 〇 · 〇 6 ' is the maximum junction ray diffraction of the obtained ZnO-Mg 〇 sintered body. The intensity peak intensity ratio of 1 1 / 12 is 94.5%. Regarding the structure of the obtained ZnO-Mg 〇 sintered body, the image is shown in Fig. 3, and the ΕΡΜΑ image is shown in Fig. 4. It can be seen from the two images that the granular portion is The Mg0 phase (including the Mg-rich solid solution phase) also has its largest crystal grain:: over l〇Wm, and a part of it is agglomerated in the target surface. Under the same conditions as in Example 1, the sintered body is processed and made. The net plating target is used for RF sputtering, and the number of protrusions (矣 balls) generated on the target surface is increased to 6.4/cm2. (Comparative Example 4) Preparation of purity 4 N And the average teaching; ^ 1 , j workers 1 in Zn 〇 powder, purity 3, and the average particle size of 1 / zm of Mg 〇耠 * ~ ln / as end of the ' with 65 mol% of ZnO powder, 3 5 The mol% of the MgO powder is blended. The wet ball mill is used to mix the two powders and the whole structure is evenly dispersed, and then the wet ball mill is used to push the powder to the dragon. ^ J does not enter the micro-grinding for about 20 hours or more.

CN 201217557 製作粒徑1 "m以下之衆體。 利用喷霧乾燥機對該毁體進行造粒乾燥,填充至規定 形狀之200卢金屬模具進行冷成形,並於大氣中進行常壓燒 結。此時,燒結溫度為ll00〇c,將燒結保持時間設為5小 時。 所得之ZnO—MgO燒結體之最大結晶粒徑為1〇"m,x 射線繞射強度波峰強度比U/丨2為〇.〇5,相對密度為93%。 於與實施例1相同之條件下’加工燒結體,並製成濺 鍍靶,從而進行RF濺鍍,計數於靶表面產生之突起物(結 球)的個數,增多為15.3個/cm2。 [產業上之可利用性] 根據本發明而獲得之Zn0_ Mg〇系濺鍍靶由於Mg〇相 (包含富Mg0固溶相)之最大結晶粒徑& 1〇心以下,故 具有以下之優異效果:於藉由使用其進行丨次之濺鍍形成 膜時’即使長時間錢亦幾乎無異常放電,且可獲得膜組 成之面内均句性優異之膜。尤其適用作為薄臈太陽電池之 先吸收層材、CIGS四㈣太陽電池之窗層材料。 【圖式簡單說明】 圖1,係本發明之實施例2之靶 J心祀表面的SEM影像。 圖2,係比較例i之靶表面的SEM影像。 圖3,係本發明之實施例2 <粑表面的ΕΡΜΑ影像 圖4 ’係比較例!之乾表面的ΕρΜΑ影像。 【主要元件符號說明】 無 15CN 201217557 Produce a particle size of 1 "m or less. The ruined body was granulated and dried by a spray dryer, and filled into a 200-m metal mold of a predetermined shape to be cold-formed, and subjected to atmospheric pressure sintering in the atmosphere. At this time, the sintering temperature was ll00 〇 c, and the sintering holding time was set to 5 hours. The obtained ZnO-MgO sintered body has a maximum crystal grain size of 1 〇 " m, and the x-ray diffraction intensity peak intensity ratio U/丨2 is 〇.〇5, and the relative density is 93%. The sintered body was processed under the same conditions as in Example 1 to form a sputtering target, and RF sputtering was performed, and the number of projections (balls) generated on the surface of the target was counted and increased to 15.3 / cm 2 . [Industrial Applicability] The Zn0_Mg-based sputtering target obtained by the present invention has the following excellent properties because the Mg 〇 phase (including the Mg-rich solid solution phase) has a maximum crystal grain size & Effect: When a film is formed by sputtering using this time, there is almost no abnormal discharge even after a long period of time, and a film having excellent in-plane uniformity of the film composition can be obtained. It is especially suitable as the first absorbent layer for thin solar cells and the window layer material for CIGS four (four) solar cells. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an SEM image of a surface of a target J heart of Example 2 of the present invention. Figure 2 is an SEM image of the target surface of Comparative Example i. Fig. 3 is a second embodiment of the present invention <ΕΡΜΑ image of the surface of the crucible Fig. 4' is a comparative example! The image of the dry surface. [Main component symbol description] None 15

Claims (1)

201217557 七、申請專利範圍: 1. 一種ZnO—MgO系濺鍍靶用燒結體,含有Zn〇與 MgO,其特徵在於: Mg以MgO換算含有3〜5〇 m〇l%,MgO相(包含富 Mg0固溶相)之最大結晶粒徑為1 0 μ m以下,具有均勻分 散之組織。 2·如申請專利範圍第1項之Zn〇 — Mg〇系濺鍍靶用燒 結體’其中,Mg〇相(包含富Mg〇固溶相)之最大結晶粒 徑為5以rn以下。 3.如申請專利範圍第1項之ZnO— MgO系濺鍍靶用燒 結體’其中,MgO相(包含富MgO固溶相)之最大結晶粒 徑為2以m以下。 4·如申請專利範圍第1至3項中任一項之ZnO — MgO 系濺鑛靶用燒結體,其中,於將相當於MgO相(200 )之X 射線繞射峰之最大強度設為11,將相當於ZnO相(101 )之 X射線繞射峰之最大強度設為12之情形時,11/12為〇.〇2 以下。 5 ·如申請專利範圍第4項之ZnO — MgO系滅鍵乾用燒 結體’其相對密度為95%以上。201217557 VII. Patent application scope: 1. A sintered body for ZnO-MgO sputtering target containing Zn〇 and MgO, characterized in that Mg contains 3~5〇m〇l% in MgO conversion, and MgO phase (including rich The Mg0 solid solution phase has a maximum crystal grain size of 10 μm or less and has a uniformly dispersed structure. 2. The Zn 〇 - Mg 〇 sputtering target sintered body of claim 1 wherein the Mg 〇 phase (including the Mg-rich solid solution phase) has a maximum crystal grain size of 5 or less. 3. The sintered body for a ZnO-MgO-based sputtering target according to the first aspect of the patent application, wherein the MgO phase (including the MgO-rich solid solution phase) has a maximum crystal grain size of 2 or less. 4. The sintered body for a ZnO-MgO-based sputtering target according to any one of claims 1 to 3, wherein the maximum intensity of the X-ray diffraction peak corresponding to the MgO phase (200) is set to 11, When the maximum intensity of the X-ray diffraction peak corresponding to the ZnO phase (101) is 12, 11/12 is 〇.〇2 or less. 5. The ZnO-MgO-based bond dry sintered body of the fourth application of the patent application has a relative density of 95% or more.
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