201216131 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種具遮蔽亮點的橋接式電極佈設方法 與其結構，特別是利用一導電對應層於導電層的一側，用 以遮蔽該導電層所產生亮點的佈設方法與結構。 【先前技術】 於習知技術中，在電容式觸控面板的製程中，係於基 板上形成兩個不同軸向的電極，並且在其中之一軸向的電 極上再次形成絕緣層，用以提供另一轴向的電極透過該絕 緣層上所設置的金屬導線進行電連接。然而，傳統上由於 設置於絕緣層上的金屬導線係有可能因為在後續的製程 中，造成該金屬導線的損壞，使得無法導通，進而造成電 容式觸控面板製作良率的下降。 故於一些技術中，可再藉由橋接式溝槽的技術將該金 屬導線設置於該橋接式溝槽，其可避免該金屬導線遭到損 壞。然而，解決該金屬導線可避免遭到損壞的疑慮後，該 金屬導線在組裝完成該電容式觸控面板後，於該觸控面板 產生複數亮點，如第1圖所示，對於顯示造成了困擾。 故有必要提供一種新的結構，除可有效率的提升該電 容式觸控面板良率的提升外，更可提供避免該等亮點的產 生。 【發明内容】 本發明的一目的係提供一種具遮蔽亮點的橋接式電 201216131 極佈設方法，係利用導電對應層用以遮蔽該導電層，用 以達到無亮點產生的目的。 本發明的另一目的係提供一種具遮蔽亮點的橋接式 電極結構，係設置導電對應層於該導電層的一側，用以 遮蔽該導電層所產生的亮點。 為達上述目的及其它目的，本發明係提供一種具遮 蔽亮點的橋接式電極佈設方法，其方法步驟包含：提供 基板；形成透明導電層於該基板上，且該透明導電層係 具有複數圖樣區塊彼此相鄰設置；形成配向膜層於該基 板上，且該配向膜層具有複數橋接式溝槽用以橫跨在該 等圖樣區塊之間；形成導電層於該基板上，且該導電層 具有複數電導線分別對應設置於該等橋接式溝槽上；形 成導電對應層係設置於該導電層的一側，用以遮蔽該等 電導線；以及形成保護層於該基板上，用以增加光學透 光率與保護該基板、該透明導電層、該配向膜層與該導 電層。 為達上述目的及其它目的，本發明係提供一種具遮 蔽亮點的橋接式電極結構，係用於電容式觸控板，其包 含基板、複數第一電極區塊、複數第二電極區塊、橋接 絕緣單元與複數電極對應區塊。其中，該等第一電極區 塊係設置於該基板且透過第一導線進行串聯電連接；該 等第二電極區塊係設置於該基板且該等第二電極區塊係 201216131 刀別地a又置於該第一導線的兩侧；該橋接絕緣單元係垂 直地設置於該第一導線，且該橋接絕緣單元具有橋接式 溝槽，而該橋接式溝槽的高度係低於該橋接絕緣單元的 高度；以及該等電極對應區塊係遮蔽該等第一電極區塊 及/或該等第二電極區塊。其中，該等第二電極區塊係藉 由具有第一導線的該橋接絕緣單元進行串聯電連接。 為達上述目的及其它目的，本發明係提供—種具遮蔽亮點201216131 VI. Description of the Invention: [Technical Field] The present invention relates to a bridge electrode placement method with a shielding spot and a structure thereof, in particular, a conductive corresponding layer is disposed on one side of a conductive layer for shielding the conductive layer The layout method and structure of the generated bright spots. [Prior Art] In the prior art, in the process of the capacitive touch panel, two electrodes of different axial directions are formed on the substrate, and an insulating layer is formed again on one of the axial electrodes for Another axial electrode is provided for electrical connection through a metal wire provided on the insulating layer. However, conventionally, the metal wire disposed on the insulating layer may be damaged due to damage of the metal wire in a subsequent process, thereby causing the conductivity of the capacitive touch panel to decrease. Therefore, in some techniques, the metal wire can be placed in the bridged trench by the technique of a bridge trench, which can prevent the metal wire from being damaged. However, after solving the problem that the metal wire can be damaged, the metal wire generates a plurality of bright spots on the touch panel after assembling the capacitive touch panel, as shown in FIG. 1 , which causes trouble for display. . Therefore, it is necessary to provide a new structure which, in addition to improving the yield of the capacitive touch panel, can also provide the avoidance of such bright spots. SUMMARY OF THE INVENTION An object of the present invention is to provide a bridged electrical 201216131 pole layout method with shielding bright spots, which utilizes a conductive corresponding layer for shielding the conductive layer for the purpose of generating no bright spots. Another object of the present invention is to provide a bridge electrode structure with a shielding spot, which is provided with a conductive corresponding layer on one side of the conductive layer for shielding bright spots generated by the conductive layer. To achieve the above and other objects, the present invention provides a bridge electrode placement method with a bright spot, the method step of: providing a substrate; forming a transparent conductive layer on the substrate, and the transparent conductive layer has a plurality of pattern regions The blocks are disposed adjacent to each other; an alignment film layer is formed on the substrate, and the alignment film layer has a plurality of bridged trenches for spanning between the pattern blocks; forming a conductive layer on the substrate, and the conductive layer The layer has a plurality of electrical wires respectively disposed on the bridged trenches; a conductive corresponding layer is disposed on one side of the conductive layer for shielding the electrical wires; and a protective layer is formed on the substrate for The optical transmittance is increased and the substrate, the transparent conductive layer, the alignment film layer and the conductive layer are protected. To achieve the above and other objects, the present invention provides a bridged electrode structure with a bright spot, which is used in a capacitive touch panel, comprising a substrate, a plurality of first electrode blocks, a plurality of second electrode blocks, and a bridge The insulating unit and the plurality of electrodes correspond to the block. The first electrode blocks are disposed on the substrate and are electrically connected in series through the first wires; the second electrode blocks are disposed on the substrate and the second electrode blocks are 201216131 And disposed on both sides of the first wire; the bridge insulation unit is vertically disposed on the first wire, and the bridge insulation unit has a bridge groove, and the height of the bridge groove is lower than the bridge insulation The height of the unit; and the corresponding blocks of the electrodes shield the first electrode blocks and/or the second electrode blocks. Wherein the second electrode blocks are electrically connected in series by the bridge insulating unit having the first wire. In order to achieve the above and other objects, the present invention provides a masking highlight
的橋接式電極結構，其包含基板層、透明導電層、配向膜層、 導電層與導電對應層。其中，該透明導電層係設置於該基板 至少一側；該配向膜層係設置於該基板層的一側；該導電層係 鄰接没置於該配向膜層的一側；以及該導電對應層係設置於 該導電層的一側，用以遮蔽該導電層。此外，具遮蔽亮 點的該橋接式電極結構進—步包含在該橋接式電極結構的至 少一側設置一保護層。 與習知技術相較，本發明的具遮蔽亮點的.橋接式電極的 佈設方法及其結構’絲可有效地提高製减率外，可再藉由 導電對應層遮蔽該導電層，用以達成在電容式觸控板9上 無任何亮點產生’且於其一實施财，特別係可導電層 的光阻不額⑽ip)的情況下，仍可達成在電容式觸控 板遮蔽亮點的目的。 【實施方式】 為充分瞭解本發明的目的、特徵及功效，兹藉由下述具體 201216131 實施例，並配合所附圖式，對本發明做一詳細說日月，說明如後： 參考第2至5圖’係本發明具遮蔽亮點的橋接式電極佈 設方法的流程示意圖。於第2圖中，橋接式電極的佈設方法的 步驟起始於倾S1，係提供基板；接著步驟％，係形成透明 導電層於絲板上，頭透科電層係具有複數嶋區塊彼此 相鄰设置，又接者步驟S3，係形成配向膜層於絲板上，且該 配向膜層具有概橋接式職肋橫跨在鱗圖驗塊之間； 再接著步驟S4 ’係形鱗電層於該基板上，·導電層呈有複 數電導線分珊應設置於該等橋接式溝槽上。其中，於另一實 施例中1¾導電層的該等電導線係藉由光學補償式光 罩，配合過度以或者過度顯影的至少其-所形成；再 接著乂驟S5細成導電對應層^設置於該導電層的— 側’用以遮蔽該等電導線；以及再一步驟S6，係形成保護 層於該基板上’㈣增加絲透光率與職職板、該透明 導電層、該配向膜層與該導電層。 再者，於第3圖係上述步驟S3的更詳細的步驟其該配向 膜層形成的步驟進-步包含，起始於步·丨，係塗覆光阻於 該基板上；躲步驟队2，係提供具有赚的鮮或具有半色 調網點(馳咖)圖樣的光罩，並且藉由上述光罩用以將該圖樣 或該半色調網點圖樣曝光於該光阻上；接著步驟⑸，係顯影 該圖樣或辭㈣醜賴於觀阻上，肋縣具有橫跨^ 該等圖樣區塊之_該等橋接式溝槽；以及，接著步驟叫， 201216131 ' 烘烤該光阻。 值得注意的是，上述具有該半色調網點圖樣的該光罩的形 成步驟包含提供於該光罩的表面之不透光區域的線徑大於該半 色周網點圖樣的線徑或形成複數孔洞（例如該等孔洞可為圓 形、矩形或任意形狀）’且平均地設置於該光罩的表面，以及經 由曝光時光線對於該半色調網點圖樣所造成的干涉與繞射作 用，使得該橋接式溝槽的光阻在顯影後該橋接式溝槽低於該橋 # 接絕緣單元的高度。 第4圖係上述步驟S4的詳細步驟，其該導電層形成的步驟 進一步包含，起始於步驟S4_;i，係濺鍍導電材料於該基板上； 接著步驟S4_2 ’係塗覆光阻於絲板上；再接著步驟S4_3，係 提供具有縣學補償式光罩，且透職光學娜式光罩將對應 該等電導線之電導線圖樣過度曝光於該光阻上；而接著步驟 S4_4，係顯影該電導線圖樣，用以形成具有彼此相鄰的該等圖 鲁 樣區塊’且該電導線圖樣係利用過度曝光與過度顯影而產生。 第5圖係上述步驟S5的詳細步驟，其該導電對應層的形 成步驟進一步包含，起始於步驟S5_l，係濺鍍導電材料於 該基板上；接著步驟S5_2，係塗覆光阻於該基板上丨接 者步驟S5_3 ’係提供具有該光學補償式料，且透過該 光學補償式光罩形成對應該等電導線之對應電導線圖樣 過度曝光於該総上；収’接著㈣叫，係顯影與 剝膜該對應電導線圖樣’並再塗覆另—光阻並利用電導 201216131 線之光罩用以形成遮蔽該電導線圖樣的導電對應層圖 樣。 曰 第6圖係上述步驟S5的另一詳細步驟，其該導電對應層 的形成步驟進一步包含，起始於步驟S5，_i，係濺鍍導 電材料於該基板上；接著步驟S5，-2，係塗覆有色光阻 於該基板上；接著步驟S5，_3，係提供具有該光學補償 式光罩，且透過該光學補償式光罩形成對應該等電導線 之對應電導線圖樣過度曝光於該‘阻上；以及再接著步 驟S5’-4，係顯影與不對該有色光阻進行該對應電導線 圖樣的剝膜（strip)，用以形成遮蔽該電導線圖樣的導電 對應層圖樣。 第7圖係上述步驟S5的又一詳細步驟’其中該導電對應 層的形成步驟進一步包含，步驟，係透過具有對 應該電導線圖樣的網印或光罩（與形成導電層的製程相 S )’塗覆該有色.光阻於該電導線圖樣上，用以形成遮蔽 該電導線圖樣的導電對應層圖樣。 第8圖係上述步驟S6的詳細步驟，其進一步包含起始於步 驟S64，塗覆一光阻、濺鍍一光阻或有機物的至少其一於該基 板上；接著步驟36_2 ’ #烤該光喊該有機物，以形成硬式保 護膜。 參考第9a至9d圖’係本發明具遮蔽亮點的橋接式電極結 構的示意®。於本實施财，本刺雜供—_接式電極結 201216131 構’係用於電容式觸控板’其包含基板10、複數第一電極區塊 12、複數第二電極區塊14與橋接絕緣單元16 ^該基板ι〇的材 質係可為玻璃材質’亦即玻璃基板。其中，該等第一電極區塊 12係設置於該基板10且透過第一導線18進行串聯電連接。該 等第二Ί：極區塊14係設置於該基板1〇且該等第二電極區塊14 係分別地設置於該第-導線18的兩側，而該等第二電極區塊 14上係設置有第二導線24。該橋接崎單元16麵直地設置 於該第-轉18上，且該橋舰緣單元16具有橋接式溝槽 2〇，而該橋接式溝槽20的高度係低於該橋接絕緣單元16的高 度。值得注意的是，於第9c圖中，複數電極對應區塊22Z 遮蔽該等第一電極區塊12上的該第—導線18及/或該等 第二電極區塊14上的該第二導線24。其中，該等電極 區塊12、14所對應的電極對應區塊2 2係可重疊於該等 ^一電極區塊12 ’亦或者該等電極對應區塊22係可完 王地復蓋對應於該等第一電極區塊12及該等第 區塊14，例如，該等電極對應區塊22係為有色光阻。 參考第10a至10d圖，係本發明具遮蔽亮 結構的垂认一 —接式電極 垂直韻不思圖。於本實施例中，具遮蔽亮點的 結構係用於電容式觸控板’其包含基板層s、二 2電層bCl、配向膜層PI、導電層透月 至小PL。㈣料電層ECL係、設置*該基板層§ 夕側。該配向膜層pI係設置於該基板層S的一側。 9 201216131 該導電層CL係鄰接設置於該配向膜層PI的一側，且該 導電層CL係可為係鉬(MO)-鋁(AL)4目(MO)的結構。該導電 對應層SL係設置於該導電層CL的一側，用以遮蔽該導 電層CL，亦即該導電對應層SL係可設置於該導電層 ECL與該保護層PL之間。於一實施例中，可參考第1〇a 圖，導電對應層SL係設置於該導電層CL與該配向膜層 PI之間，值得注意的是，為使該導電層CL與該透明導 電層ECL連接，該導電層CL的長度係長於該導電對應 層SL ;於另一實施例中，可參考第i〇c圖，導電對應層 SL係設置於該導電層CL 一側；此外，第1 〇b圖與第1 〇d 圖係分別地對應第10a圖與第l〇c圖之簡化製程之後的 具遮蔽党點的橋接式電極結構。故本發明係以包含標準掣 矛王簡化衣私與改良製私下的具遮敝受點的橋接式電極結構。 此外，上述中的該橋接式電極結構係於至少一側設 置保護層PL，於一實施例中，該導電對應層SL係可設 置於該導電層ECL與該保護層pl之間。例如，該保護 層PL係可為有機物層、光阻物層、抗反射層 (anti-reflection，AR)、抗眩光層（antj_giare Α〇)或上述 的組合。熟悉該項技術領域者應當可以了解到，該保護 層PL亦可忽略，而各層的排列製程順序亦可隨需求改 變。 與習知技術相較，本發明具遮蔽亮點的橋接式電極佈設 201216131 方法及其結構’除可有效地提高製程良率外，可再藉由導電對 應層遮蔽該導電層，用以達成在電容式觸控板上無任何 亮點產生，且於其-實施例中’可導電層的光阻在不剝 膜㈣P)的情況下’亦可達成在電容式觸控板遮蔽亮點 的目的。 本發明在上文中已以較佳實施例揭露，然熟f本項技術者 應理解的是’該實施例侧於贿本發明，而不應解讀為限制 • 本發明的範圍。應注意的是，舉凡與該實施例等效的變化與置 換’均應設為涵蓋於本發明的範疇内。因此，本發明的保護範 圍當以下文的申請專利範圍所界定者為準。 【圖式簡單說明】 第1圖係傳統電容式觸控板示意圖； 第2至8圖係具遮蔽亮點的橋接式電極佈設方法的流 、程示意圖； • 第如至9d圖係具遮蔽亮點的橋接式電極結構的示意圖； 以及 第10a至1 〇d圖係具遮敝梵點的橋接式電極結構的垂 直剖面示意圖。 【主要元件符號說明】 10 基板 12 第一電極區塊 14 第二電極區塊 201216131 16 橋接絕緣單元 18 第一導線 20 橋接式溝槽 22 電極對應區塊 24 第二導線 PL 保護層 ECL 透明導電層 S 基板層 PI 配向膜層 CL 導電層 SL 導電對應層 12The bridge electrode structure comprises a substrate layer, a transparent conductive layer, an alignment film layer, a conductive layer and a conductive corresponding layer. The transparent conductive layer is disposed on at least one side of the substrate; the alignment film layer is disposed on one side of the substrate layer; the conductive layer is adjacent to a side not disposed on the alignment film layer; and the conductive corresponding layer The system is disposed on one side of the conductive layer to shield the conductive layer. In addition, the bridging electrode structure with shielding highlights further includes providing a protective layer on at least one side of the bridge electrode structure. Compared with the prior art, the method for arranging the bridged electrode with the bright spot of the present invention and the structure thereof can effectively improve the reduction rate, and the conductive layer can be shielded by the conductive corresponding layer to achieve In the case where there is no bright spot on the capacitive touch panel 9 and in one implementation, especially if the photoresist of the conductive layer is not (10) ip, the purpose of shielding the bright spot on the capacitive touch panel can still be achieved. [Embodiment] In order to fully understand the object, features and effects of the present invention, the present invention will be described in detail by the following specific examples of 201216131, and with reference to the accompanying drawings. 5 is a schematic flow chart of a method for laying a bridge electrode with a bright spot. In FIG. 2, the step of the method of arranging the bridge electrodes starts from tilting S1 to provide a substrate; then, in step %, a transparent conductive layer is formed on the silk plate, and the head through the electrical layer has a plurality of blocks. Adjacent setting, in addition to step S3, forming an alignment film layer on the wire plate, and the alignment film layer has a bridging type of service rib spanning between the scale inspection blocks; and then step S4 'systematic scales The layer is on the substrate, and the conductive layer is provided with a plurality of electrical wires disposed on the bridged trenches. Wherein, in another embodiment, the electrical conductors of the conductive layer are formed by an optically compensated reticle with at least one of over- or over-developed; and then step S5 is formed into a conductive corresponding layer. The side of the conductive layer is used to shield the electric wires; and in a further step S6, a protective layer is formed on the substrate. (4) increasing the transmittance of the wire and the occupational board, the transparent conductive layer, the alignment film a layer and the conductive layer. Furthermore, in the third step of the above step S3, the step of forming the alignment film layer further comprises, starting from step 丨, coating the photoresist on the substrate; hiding step 2 Providing a photomask having a fresh or halftone dot pattern, and exposing the pattern or the halftone dot pattern to the photoresist by the photomask; and then step (5) Developing the pattern or remarking (4) ugly on the obstruction, the rib county has _ such bridged trenches across the pattern blocks; and, the next step is called 201216131 'bake the photoresist. It should be noted that the step of forming the reticle having the halftone dot pattern includes the line diameter of the opaque region provided on the surface of the reticle being larger than the wire diameter of the half-color perimeter dot pattern or forming a plurality of holes ( For example, the holes may be circular, rectangular or of any shape) and are disposed evenly on the surface of the reticle, and the interference and diffraction caused by the light during exposure to the halftone dot pattern, such that the bridge The photoresist of the trench is lower than the height of the bridge to the insulating unit after development. Figure 4 is a detailed step of the above step S4, the step of forming the conductive layer further comprises: starting from step S4_; i, sputtering a conductive material on the substrate; and then step S4_2 'coating the photoresist to the wire On the board; and then in step S4_3, a reticle with a county-level compensation is provided, and the transmissive optical reticle overexposes the electrical lead pattern corresponding to the isoelectric conductor over the photoresist; and then step S4_4 The electrical lead pattern is developed to form the plurality of Tulu-like blocks adjacent to each other and the electrical lead pattern is produced by overexposure and overexposure. Figure 5 is a detailed step of the above step S5, wherein the step of forming the conductive corresponding layer further comprises: starting in step S5_1, sputtering a conductive material on the substrate; and then step S5_2, applying a photoresist to the substrate The upper splicer step S5_3' is provided with the optical compensation material, and the corresponding electric wire pattern corresponding to the electric conductor is formed to be overexposed on the cymbal through the optical compensation reticle; The photo-shield of the corresponding electrical conductor pattern is stripped and coated with another photoresist and the conductive mask of the 201216131 line is used to form a conductive corresponding layer pattern for shielding the electrical conductor pattern. Figure 6 is another detailed step of the above step S5, wherein the step of forming the conductive corresponding layer further comprises starting the step S5, _i, sputtering the conductive material on the substrate; and then following steps S5, -2, Applying a colored photoresist to the substrate; then, steps S5, _3, providing the optically compensated reticle, and forming, by the optically compensated reticle, a corresponding electrical lead pattern corresponding to the electrical conductor to be overexposed 'Resist; and then step S5'-4, developing and not stripping the corresponding electrical pattern of the colored photoresist to form a conductive corresponding layer pattern that shields the electrical trace pattern. Figure 7 is still another detailed step of the above step S5, wherein the step of forming the conductive corresponding layer further comprises the step of transmitting a screen or mask (corresponding to the process phase S forming the conductive layer) having a corresponding electrical conductor pattern 'Coating the colored. The photoresist is on the electrical conductor pattern to form a conductive corresponding layer pattern that shields the electrical conductor pattern. Figure 8 is a detailed step of the above step S6, further comprising starting at step S64, applying at least one of a photoresist, a photoresist or an organic substance on the substrate; and then stepping the light Shout the organic matter to form a hard protective film. Referring to Figures 9a through 9d, a schematic representation of a bridged electrode structure with a bright spot in the present invention is shown. In the present implementation, the splicing electrode junction 201216131 is used for a capacitive touch panel, which comprises a substrate 10, a plurality of first electrode blocks 12, a plurality of second electrode blocks 14 and a bridge insulation. Unit 16 ^ The material of the substrate ι can be a glass material, that is, a glass substrate. The first electrode blocks 12 are disposed on the substrate 10 and are electrically connected in series through the first wires 18. The second electrode: the pole block 14 is disposed on the substrate 1 and the second electrode blocks 14 are respectively disposed on two sides of the first wire 18, and the second electrode block 14 is disposed on the second electrode block 14 A second wire 24 is provided. The bridge junction unit 16 is disposed directly on the first turn 18 , and the bridge edge unit 16 has a bridge groove 2 , and the height of the bridge groove 20 is lower than the bridge insulation unit 16 height. It is to be noted that, in FIG. 9c, the plurality of electrode corresponding blocks 22Z shield the first wires 18 on the first electrode blocks 12 and/or the second wires on the second electrode blocks 14 twenty four. The electrode corresponding block 2 2 corresponding to the electrode blocks 12 and 14 can be overlapped with the electrode block 12 ′ or the corresponding electrode block 22 can be completely covered. The first electrode block 12 and the first block 14 are, for example, colored electrode resists. Referring to Figures 10a to 10d, the vertical and vertical electrodes of the present invention having a shielded bright structure are not considered to be vertical. In the present embodiment, the structure with shielding bright spots is used for the capacitive touch panel' which includes the substrate layer s, the two electric layers bCl, the alignment film layer PI, and the conductive layer through the moon to the small PL. (4) Electrical layer ECL system, setting * The substrate layer § 夕 side. The alignment film layer pI is provided on one side of the substrate layer S. 9 201216131 The conductive layer CL is adjacent to one side of the alignment film layer PI, and the conductive layer CL may be molybdenum (MO)-aluminum (AL) 4 mesh (MO). The conductive corresponding layer SL is disposed on one side of the conductive layer CL for shielding the conductive layer CL, that is, the conductive corresponding layer SL may be disposed between the conductive layer ECL and the protective layer PL. In an embodiment, reference may be made to FIG. 1A, the conductive corresponding layer SL is disposed between the conductive layer CL and the alignment film layer PI, and it is noted that the conductive layer CL and the transparent conductive layer are In the ECL connection, the length of the conductive layer CL is longer than the conductive corresponding layer SL; in another embodiment, referring to the first embodiment, the conductive corresponding layer SL is disposed on the side of the conductive layer CL; The 〇b diagram and the 1st 〇d diagram respectively correspond to the bridged electrode structure with the shielding point after the simplified process of the 10a and l〇c diagrams. Therefore, the present invention is a bridging electrode structure having concealing points in a private state and a modified system including a standard snail. In addition, the bridge electrode structure described above is provided with a protective layer PL on at least one side. In an embodiment, the conductive corresponding layer SL may be disposed between the conductive layer ECL and the protective layer pl. For example, the protective layer PL may be an organic layer, a photoresist layer, an anti-reflection layer (AR), an anti-glare layer (antj_giare Α〇), or a combination thereof. Those skilled in the art should be able to understand that the protection layer PL can also be ignored, and the order of the layers can be changed as needed. Compared with the prior art, the bridged electrode disposed with the bright spot of the present invention has a 201216131 method and its structure'. In addition to effectively improving the process yield, the conductive layer can be shielded by the conductive corresponding layer to achieve the capacitance. There is no bright spot on the touch panel, and in the embodiment - the photoresist of the conductive layer can not achieve the purpose of shielding the bright spot on the capacitive touch panel without stripping the film (4) P). The present invention has been disclosed in the above preferred embodiments, and it should be understood that the present invention is not to be construed as limiting the scope of the invention. It should be noted that variations and modifications equivalent to the embodiment are intended to be included within the scope of the present invention. Therefore, the scope of protection of the present invention is defined by the scope of the following claims. [Simple diagram of the figure] Fig. 1 is a schematic diagram of a conventional capacitive touch panel; Figures 2 to 8 are schematic diagrams showing the flow and path of a bridge electrode arrangement method for shielding bright spots; • as shown in Fig. 9d, with a masking bright spot A schematic diagram of a bridged electrode structure; and a vertical cross-sectional view of the bridged electrode structure with a concealing van Gogh point from the 10th to the 1st. [Main component symbol description] 10 substrate 12 First electrode block 14 Second electrode block 201216131 16 Bridge insulation unit 18 First wire 20 Bridge groove 22 Electrode corresponding block 24 Second wire PL Protective layer ECL Transparent conductive layer S substrate layer PI alignment film layer CL conductive layer SL conductive corresponding layer 12