201215859 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種溫度感測器，特別是指數位式的溫 度傳訊器。 【先前技術】 習知溫度偵測器依量測原理分為膨脹式、電阻式、熱 電偶式及熱敏電阻式等，分別運用在不同量測領域，例如 偵測下水道的水管溫度、空調設備的冷卻水溫度、原料輸 送管線的液體溫度或漁塭養殖業的水溫等。 其中’膨脹式溫度偵測器例如雙金屬溫度計或填充式 溫度計，分別為利用金屬或液體在不同溫度下具有不同的 體積，以體積大小來取得量測溫度；而電阻式溫度偵測器 是利用金屬材質因溫度變化而產生電阻的變化，由電阻的 變化取得量測溫度；熱電偶式溫度偵測器則是使用兩種不 同材質接點受熱時會產生電壓信號，當所量測的溫度產生 後:化時，熱電偶溫度偵測器會發生電壓變化，藉以取得量 測溫度；而熱敏電阻式溫度偵測器則是利用半導體其電阻 值因溫度上升而下降’由電阻值變化可量測到微小的溫度 變化。 無淪是電阻式或膨脹式溫度偵測器，其溫度的量測皆 以類比訊號取得’因此，具有量測反紐及*夠精準的缺 點0 【發明内容】 本發明提供-種溫度傳訊器，以數位式訊號輸出待測 3/18 201215859 物的溫度’可提升量測的精準度，減少量測誤差，並達到 快速地取得量測溫度。 為了達成上述目的’根據本發明的其中一項技術方案 ，批:供一種溫度傳訊器，用以量測一待測物，溫度傳訊器 包括一殼體及一數位溫度偵測模組，其中殼體具有一密閉 空間，數位溫度偵測模組設置在此密閉空間内，藉由數位 溫度偵測模組彳貞測殼體外部的溫度’感測一數位溫度訊號 ’並將此數位溫度訊號經過處理後輸出一溫度偵測訊號。 藉此’達到快速並精確地量測待測溫度的效果。 所述的數位溫度偵測模組包括一數位溫度偵測晶片、 一第一§孔號傳輸介面及一訊號處理單元。其中，數位溫度 债測晶片用以偵測殼體外部的溫度，並根據偵測結果輸 出上述之數位溫度訊號；訊號處理單元分別與數位溫度 備測晶片及第一訊號傳輸介面電性連接，訊號處理單元 用以根據數位溫度訊號產生上述之溫度偵測訊號，並透 過第一訊號傳輸介面輸出溫度偵測訊號。 此外’上述之殼體包括一上殼體及一下殼體，下殼體 可為一金屬導熱鞘管或一金屬導熱盤，用以傳導熱能並保 護數位溫度偵測晶片。 為了達成上述目的，根據本發明的另一項技術方案， 提供一種溫度監測系統，用以監測複數區域的待測溫度 ’此溫度監測系統包括複數上述之溫度傳訊器及一主機 ’其中’主機與多個溫度傳訊器可互相通訊來取得不同 區域的待測溫度。 所述的多個溫度傳訊器用以分別偵測多個區域的 待測溫度’並根據偵測結果輸出溫度偵測訊號；主機包 201215859 ,—α丨矛铷"囬，此第二訊现1寻衔介面用以接收 來自多個溫度傳訊器的第一訊號傳輸介面之多個严 偵測訊號。 ϋ 一所述的主機根據多個溫度偵測訊號顯示—溫度監 測資訊，當多個溫度傳訊器中的一個輸出一異常日^ 主機輸出一控制訊號至一電氣負載，以控制此電氣負 載執行一溫度控制程序，以調整多個區域的待測溫度。' 關於本發明之技術手段的詳細說明，請參閱以下的實 施方式，並配合所附圖式一併參照。 ' 【實施方式】 /本發明係為了讓使用者更精確地且快速地得知待測物 的待測溫度’喊供—魏位式的溫度傳訊器，以下將配 合圖式分概明本發明之溫度傳訊器及_此溫度傳訊器 的溫度監測系統的實施方式及其原理。201215859 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a temperature sensor, particularly an index-type temperature transmitter. [Prior Art] Conventional temperature detectors are classified into expansion type, resistance type, thermocouple type and thermistor type according to the measurement principle, which are used in different measurement fields, for example, detecting the water temperature of the sewer, and the air conditioning equipment. The temperature of the cooling water, the liquid temperature of the raw material transfer line, or the water temperature of the fish farming industry. The 'expansion type temperature detectors such as bimetal thermometers or filled thermometers respectively use different volumes of metal or liquid at different temperatures to obtain the measured temperature by volume; and the resistive temperature detector utilizes The metal material changes in resistance due to temperature changes, and the temperature is measured by the change of the resistance; the thermocouple type temperature detector generates a voltage signal when the two different materials are heated, when the measured temperature is generated. After: when the thermocouple temperature detector changes voltage, in order to obtain the measured temperature; while the thermistor temperature detector uses the semiconductor's resistance value to decrease due to temperature rise' A small temperature change was detected. Innocent is a resistive or expansion type temperature detector, and its temperature measurement is obtained by analog signal. Therefore, it has the disadvantages of measuring the inverse and being accurate enough. [Invention] The present invention provides a temperature transmitter. The digital signal output to be tested 3/18 201215859 The temperature of the object can improve the accuracy of the measurement, reduce the measurement error, and achieve the measurement temperature quickly. In order to achieve the above object, in accordance with one of the technical solutions of the present invention, a batch temperature sensor is provided for measuring a test object, and the temperature transmitter includes a casing and a digital temperature detecting module, wherein the casing The body has a confined space, and the digital temperature detecting module is disposed in the confined space. The digital temperature detecting module detects the temperature outside the housing and senses a digital temperature signal and passes the digital temperature signal. After processing, a temperature detection signal is output. Thereby, the effect of measuring the temperature to be measured quickly and accurately is achieved. The digital temperature detecting module comprises a digital temperature detecting chip, a first § hole number transmission interface and a signal processing unit. The digital temperature debt measuring chip is configured to detect the temperature outside the casing, and output the digital temperature signal according to the detection result; the signal processing unit is electrically connected to the digital temperature detecting chip and the first signal transmission interface, respectively. The processing unit is configured to generate the temperature detection signal according to the digital temperature signal and output the temperature detection signal through the first signal transmission interface. Further, the housing includes an upper housing and a lower housing. The lower housing can be a metal thermally conductive sheath or a metal thermal pad for conducting thermal energy and protecting the digital temperature detecting wafer. In order to achieve the above object, according to another aspect of the present invention, a temperature monitoring system for monitoring a temperature to be measured in a plurality of regions is provided. The temperature monitoring system includes a plurality of temperature transmitters and a host 'in which the host and the host Multiple temperature transmitters can communicate with each other to obtain the temperature to be measured in different areas. The plurality of temperature transmitters are configured to respectively detect the temperature to be tested of the plurality of regions and output a temperature detection signal according to the detection result; the host package 201215859, -α丨丨铷"back, the second message is now 1 The search interface is configured to receive a plurality of severe detection signals from the first signal transmission interface of the plurality of temperature transmitters. ϋ The host according to the plurality of temperature detection signals display-temperature monitoring information, when one of the plurality of temperature transmitters outputs an abnormal day ^ the host outputs a control signal to an electrical load to control the electrical load to perform a Temperature control program to adjust the temperature to be measured in multiple areas. For a detailed description of the technical means of the present invention, refer to the following embodiments, and refer to the accompanying drawings. [Embodiment] / The present invention is to make the user more accurately and quickly know the temperature to be tested of the object to be tested, and to provide a temperature transmitter of the Wei position type. The temperature transmitter and the embodiment of the temperature monitoring system of the temperature transmitter and its principle.
，參考第-Α圖’第-Α圖顯示了本發明的一種溫度 的第-實施例的示意圖。如第—A圖所示，待測物 為水^溫度傳訊器丨可與水管2互相接合，藉由溫度傳 訊器1 1财管2 _賴溫度，以供❹者參考。 其：’溫度傳訊器丨包括—殼體1Q及—數位溫度_ 模組(圖未示）’殼體u包括一上殼體13及一下殼體n，上 :又體13 ^下威體u形成—軸空間，數位溫度偵測模組 «•又置在此在、閉空間内，水官2包括—凹槽2卜凹槽Μ用以 容置下殼體11 ’同時髓殼體u不受外部壓力壓迫及化學 物質腐蝕。 在本實施例中，下殼體11為-金屬導熱鞘管，其材料 5/18 201215859 可為鋁、銅或不繡鋼等剛性材質，以保護數位溫度偵測模 組中的數位溫度偵測晶片（圖未示），下殼體11的外觀近似 一探針。殼體】〗具有一開口端111及一密封端113，在開 口端U1設置有一鎖固單元12，此鎖固單元12與凹槽2] 互相鎖合；密封端]13與凹槽21抵觸。 貫際實施時’鎖固單元12可為一中空的六腳雙牙固定 螺栓，包括一上螺紋121及一下螺蚊123，其中，上螺紋 121與上殼體13接合，下螺紋123與凹槽21接合，同時， 在上殼體13具有一第一螺母135與上螺紋12ι相對應，而 凹槽21具有一第二螺母211與下螺紋123相對應。本;發明 的鎖固單元12的結構不限於此’其他可分別與上殼體η 及凹槽21互相鎖合的結構皆可以作為鎖固單元丨2。 本發明的技術特點在於’溫度傳訊器1具有數位溫度 偵測晶片設置在下殼體11内，用以偵測水管2内的溫度， 並根據偵測結果輸出一數位溫度訊號，透過一訊號傳輸線 152傳輸此數位溫度訊號至一訊號處理單元(圖未示）。其中 ’訊號傳輸線152是穿過中空的鎖固單元12來連接數位溫 度偵測晶片與訊號處理單元，訊號處理單元設置在一電路 板Π上，而電路板17是設置在上殼體13内。在一實施例 中，數位溫度偵測晶片與訊號處理單元之間的傳輸協定為 内部整合電路（Inner Integrate Circuit，I2C )的通訊協定，也 就疋數位溫度僧測晶片與訊號處理單元之間是透過兩條訊 號傳輸線152來互相溝通。 在本實施例中’上殼體13包括一蓋板131及一本體133 ，其中，電路板17透過螺絲(圖未示)或黏膠(圖未示)固定地 設置在本體133内側；第一螺母135設置在本體133下緣 201215859 的内側’本體]33的上緣與蓋板⑶互相接合， 用以防正外部灰塵或雨水進入核133 Θ而損 上的電子元件。本體133上設置有_連接部137，用 路板17的輸出訊號傳輸線(圖未示)通過。 =BRIEF DESCRIPTION OF THE DRAWINGS A first embodiment of a temperature of the present invention is shown with reference to a first-figure diagram. As shown in Figure-A, the object to be tested is a water temperature transmitter 丨 which can be joined to the water pipe 2, and the temperature is communicated by the temperature transmitter 1 1 for reference. It: 'temperature transmitter 丨 includes - housing 1Q and - digital temperature _ module (not shown) 'housing u includes an upper housing 13 and a lower housing n, upper: body 13 ^ lower body u Forming a shaft space, the digital temperature detecting module «• is placed in the closed space, the water officer 2 includes a groove 2 groove Μ for accommodating the lower casing 11 ' while the medullary shell u does not Compressed by external pressure and chemical substances. In this embodiment, the lower casing 11 is a metal heat conducting sheath tube, and the material 5/18 201215859 can be a rigid material such as aluminum, copper or stainless steel to protect the digital temperature detection in the digital temperature detecting module. A wafer (not shown), the lower casing 11 has an appearance similar to a probe. The housing has an open end 111 and a sealed end 113. A locking unit 12 is disposed at the opening end U1. The locking unit 12 and the recess 2] are interlocked with each other; and the sealing end 13 is in contact with the recess 21. The locking unit 12 can be a hollow six-legged double-fixing bolt, including an upper thread 121 and a lower screw 123, wherein the upper thread 121 is engaged with the upper casing 13, and the lower thread 123 and the groove 21 is engaged, and at the same time, the upper casing 13 has a first nut 135 corresponding to the upper thread 12ι, and the recess 21 has a second nut 211 corresponding to the lower thread 123. The structure of the locking unit 12 of the present invention is not limited to this. Other structures that can be interlocked with the upper casing η and the groove 21, respectively, can be used as the locking unit 丨2. The technical feature of the present invention is that the temperature sensor 1 has a digital temperature detecting chip disposed in the lower casing 11 for detecting the temperature in the water pipe 2, and outputting a digital temperature signal according to the detection result through a signal transmission line 152. The digital temperature signal is transmitted to a signal processing unit (not shown). The signal transmission line 152 is connected to the digital temperature detecting chip and the signal processing unit through the hollow locking unit 12, the signal processing unit is disposed on a circuit board, and the circuit board 17 is disposed in the upper casing 13. In one embodiment, the transmission protocol between the digital temperature detecting chip and the signal processing unit is a communication protocol of an Inner Integrate Circuit (I2C), that is, between the digital temperature sensing chip and the signal processing unit. Communicate with each other through two signal transmission lines 152. In the present embodiment, the upper housing 13 includes a cover plate 131 and a body 133, wherein the circuit board 17 is fixedly disposed inside the body 133 via a screw (not shown) or an adhesive (not shown); The nut 135 is disposed at the upper edge of the inner 'body' 33 of the lower edge of the lower edge of the body 133, 201215859, and the cover plate (3) is engaged with each other to prevent external dust or rain from entering the core 133 Θ to damage the electronic components. The body 133 is provided with a _ connecting portion 137 which is passed through an output signal transmission line (not shown) of the board 17. =
此外，為了使下殼體u的密封端113與凹槽2 侧壁確實地簡，實際實_，位於下殼體〗i 與鎖固單元12之間設置有-接觸觸器元件(圖未此 接觸調節器元件用以使下殼㈣的開口端⑴在鎖固單元 U内可小範圍地伸縮，舉例來說，接觸調節器元件可為彈 簧等彈性元件。也就是說，下殼體u與鎖固單元12是活 動地接合，上殼體η與鎖固單元u是固定地接合，=此 ，以適應不同深度的凹槽21，讓下殼體n的密封端η3θ牢 固地與凹槽21底部牢固地接觸。 。接著，請配合參考第一 B圖，為本發明的—種溫度傳 訊器的第一實施例的内部部分示意圖。如第一 B圖所示， 下/V又體11的密封端113内設置有上述之數位溫度偵測晶片 151，在數位溫度偵測晶片151外部設有一絕緣層141，此 絕緣層141用以隔絕數位溫度偵測晶片151與下殼體n， 避免數位溫度偵測晶片151與具有導電性的殼體n内側壁 互相電性導通’而影響數位溫度侧晶4⑸制的精綠 度。實際實施時，此絕緣層141可為一熱縮套管，具有特 疋的熱膨脹係數，可緊密地包覆住數位溫度偵測晶片151 此外，下殼體11内還包括一導熱層143,此導熱層143 填充滿下殼體11的内側壁，並包覆住絕緣層141以及與數 位溫度偵測晶片151連接的訊號傳輸線152。此導熱層143 7/18 201215859 用以均勻地傳導下殼體11的金屬殼體上所具有的熱能，使 數位溫度偵測晶片151所偵測的溫度更為準確。實際實施 時’此導熱層143的材質可為氧化鎂粉等熱傳導性佳的化 合物。 在本實施例中，在下殼體11的開口端111内側具有一 隔水層145,此防水層145用以封住下殼體11的開口端111 ’來預防殼體10外部的水滲透進下殼體11内，或是因殼 體10内外溫度差過大而造成下殼體11内部結露，而影響 數位溫度偵測晶片151的偵測。實際實施時，防水層〗45 可為一環氧樹脂等塑膠材料。 ® 請參考第二圖，第二圖顯示了本發明的一種溫度傳訊 器的第二實施例的示意圖。如第二圖所示，溫度傳訊器r 與第一實施例的溫度傳訊器1大致相同，其差異在於，第 二實施例的殼體10’所包括的下殼體11’為一金屬導熱盤，由 上殼體13'與下殼體1Γ互相鎖合或接合以形成一密閉空間 ’而此密閉空間内不需填充任何絕緣層或導熱層；溫度傳 訊器Γ可設置在室内之天花板或電器產品，或室外溫度量 測站等，溫度傳訊器Γ用以偵測周圍環境的氣體溫度，例籲 如室内或室外的氣體溫度等。另一個差異在於，電路板17， 是設置在下殼體11’内側底部，而數位溫度偵測模組15設 置在電路板17’上。 在本實施例中’電路板17'透過一導熱膠147固定在下 殼體1Γ内側底部，導熱膠147同時用以均勻地傳導下殼體 11'所具有的熱能。另外’電路板17,還可透過螺絲(圖未示） 來與下殼體1Γ鎖合’以固定地設置在下殼體11’内，預防電 路板17’脫落後，造成數位溫度偵測模組15因碰撞而損壞 8/18 η 201215859 接下來將說明溫度傳訊器的第一實施例與第二實施例 中的數位溫度偵測模組的操作原理。請參考第三圖’為本 發明的溫度傳訊器的數位溫度偵測模組的第一實施例之功 能方塊圖。如第三圖所示，數位溫度偵測模組15a包括訊 號處理單元150、數位溫度偵測晶片151、一第一訊號傳輸 介面153及一記憶單元155。其中，訊號處理單元ι5〇分別In addition, in order to make the sealing end 113 of the lower casing u and the side wall of the groove 2 surely simple, the actual contact is provided between the lower casing 〗 i and the locking unit 12 with a contact contact element (not shown) The contact adjuster element is configured to extend the open end (1) of the lower casing (4) within a small range in the locking unit U. For example, the contact adjuster element may be an elastic element such as a spring. That is, the lower casing u and The locking unit 12 is movably engaged, and the upper casing η is fixedly engaged with the locking unit u, thereby, to accommodate the grooves 21 of different depths, so that the sealing end η3θ of the lower casing n is firmly with the groove 21 The bottom is firmly in contact. Next, please refer to the first B diagram, which is a schematic diagram of the internal part of the first embodiment of the temperature transmitter of the present invention. As shown in the first B diagram, the lower /V body 11 The digital temperature detecting wafer 151 is disposed in the sealing end 113, and an insulating layer 141 is disposed outside the digital temperature detecting wafer 151. The insulating layer 141 is used for isolating the digital temperature detecting wafer 151 and the lower casing n to avoid digits. The temperature detecting wafer 151 and the inner side wall of the housing n having conductivity are mutually Electrical conduction' affects the fine greenness of the digital temperature side crystal 4(5). In actual implementation, the insulating layer 141 can be a heat shrinkable sleeve with a special thermal expansion coefficient, which can closely cover the digital temperature detection. The 151 further includes a heat conductive layer 143 which fills the inner sidewall of the casing 11 and covers the insulating layer 141 and the signal transmission line 152 connected to the digital temperature detecting wafer 151. The heat conducting layer 143 7/18 201215859 is used to uniformly conduct the heat energy on the metal casing of the lower casing 11, so that the temperature detected by the digital temperature detecting wafer 151 is more accurate. Actually, this heat conduction The material of the layer 143 may be a compound having good thermal conductivity such as magnesium oxide powder. In the present embodiment, a water-repellent layer 145 is provided inside the open end 111 of the lower casing 11, and the waterproof layer 145 is used to seal the lower casing 11 The open end 111' prevents the water outside the casing 10 from penetrating into the lower casing 11, or causes condensation inside the lower casing 11 due to excessive temperature difference between the inside and the outside of the casing 10, thereby affecting the detection of the digital temperature detecting wafer 151. Test. In actual implementation, waterproof layer 〖45 can be a plastic material such as epoxy resin. ® Please refer to the second figure, the second figure shows a schematic diagram of a second embodiment of a temperature transmitter of the present invention. As shown in the second figure, the temperature transmitter r The difference is the same as that of the temperature transmitter 1 of the first embodiment, except that the lower case 11' included in the housing 10' of the second embodiment is a metal heat conducting plate, and the upper case 13' and the lower case are 1Γ interlocking or joining to form a closed space', and this sealed space does not need to be filled with any insulating layer or heat conductive layer; temperature transmitter Γ can be set in indoor ceiling or electrical products, or outdoor temperature measuring station, etc., temperature The transmitter is used to detect the temperature of the surrounding environment, such as the temperature of the gas inside or outside. Another difference is that the circuit board 17 is disposed at the inner bottom of the lower casing 11', and the digital temperature detecting module 15 is disposed on the circuit board 17'. In the present embodiment, the circuit board 17' is fixed to the inner bottom portion of the lower casing 1 through a thermal conductive adhesive 147, and the thermal conductive adhesive 147 is simultaneously used to uniformly conduct the thermal energy of the lower casing 11'. In addition, the circuit board 17 can also be fixedly disposed in the lower casing 11' by screws (not shown) to be fixedly mounted in the lower casing 11' to prevent the circuit board 17' from falling off, thereby causing the digital temperature detecting module. 15 Damage due to collision 8/18 η 201215859 Next, the operation principle of the digital temperature detecting module in the first embodiment of the temperature transmitter and the second embodiment will be explained. Please refer to the third figure as a functional block diagram of the first embodiment of the digital temperature detecting module of the temperature transmitter of the present invention. As shown in the third figure, the digital temperature detecting module 15a includes a signal processing unit 150, a digital temperature detecting chip 151, a first signal transmission interface 153, and a memory unit 155. Among them, the signal processing unit ι5〇 respectively
與數位溫度偵測晶片151、第一訊號傳輸介面153及記憶單 元155電性連接。 数位溫度偵測晶片151用以偵測殼體1〇、1〇,外部的溫 度，並根據偵測結果輸出一數位溫度訊號；訊號處理單元 150用以接收此數位溫度訊號，並根據數位溫度訊號產生一 溫度偵測訊號，此溫度偵測訊號可單純包含數位溫度訊號 丄或具有一身份識別碼，其中，此身分識別碼儲存在記憶 早几155。當訊號處理單元15〇定時地輸出溫度偵測訊號同 時二’將身分識別碼整合在溫度偵測訊號的封包内，透過第 -訊號傳輸介面153傳輸至溫度傳訊器][、Γ外。 在本實施例中，記憶單元⑸還儲存一參考溫度值， 當訊號處理單元15G接位溫度職後，贿位溫度訊 號與參考溫度值相比較’當數位溫度訊號超過此參考溫产 值時’訊號處理單幻5G透過第—訊賴輸介面M3輸= 號。實際實施時，轉考溫度值可由使用者設定 内建，若由使用者設定，則數_測模組15a 示單元(圖未示)及一操作單元(圖未示)，以提供 γ。而訊麵理單元15()可依實際需求參設不同 〇 ’第-種模式為當訊號處理單元15G _數位溫度訊 201215859 ' » 號高於參考溫度值時，則輸出異常訊號；第二種模式為當 訊號處理M 15G躺触溫度城餅參考a度值時^ 則輸出異常訊號。 接著，請參考第四圖，為本發明的溫度監測系統的第 一實施例之方塊圖。如第四圖所示，溫度監測系統5包括 一主機51及複數個溫度傳訊器至]a。，其中，n 為1〜256中的任一整數，多個溫度傳訊器lai、la2至lan 分別設置在不同區域，用以監測多個區域内的待測溫度。 且多個溫度傳訊器lai、Us至lan串在同一條傳輸線上，並 透過此傳輸線與主機51互相通訊。其中，主機51可為一 行動式電子裝置、電腦或伺服器。 在本實施例中’多個溫度傳訊器lai、laz至可依實 際量測種類配置為溫度傳訊器1或溫度傳訊器Γ，即待測 溫度為一液體溫度或一氣體溫度。其中，多個溫度傳訊器 la!、la2至lan分別包括數位溫度偵測模組15a，多個溫度 傳訊器la,、la?至lan透過個別的第一訊號傳輸介面153與 主機51中的第二訊號傳輸介面（圖未示)互相通訊，其中， 每一個第一訊號傳輸介面153與第二訊號傳輸介面分別為 RS-485或RS-232等有線訊號傳輸介面。在一較佳的實施例 中’每一個第一訊號傳輸介面153與第二訊號傳輸介面為 RS-485介面’兩者互相進行半雙工傳輸，即一問一答地輪 流傳送與接收，藉此，主機51可依序地對多個溫度傳訊器 la,、la2至lan進行輪詢(polling)。而主機51與多個溫度傳 訊器lai、la2至lan之間的訊號傳輸協定可為一傳輸控制/ 網路通訊協定（Transmission Control Protocol/Internet Protocol ; TCP/IP)或一儀錄通訊協定（ModBus-RTU) 〇 201215859 舉例來說，主機51透過第二訊號傳輸介面定時地發出 一輪詢訊號(Polly signal)至多個溫度傳訊器^ ，母一個訊號處理單元150接收到輪詢訊號後，輸出溫度 偵測訊號至主機51，其中，溫度偵測訊號分別包括多個溫 度傳訊器la]、la2至lan的其中一個身分識別碼。當多個溫 度傳汛器lai、la2至lan中的一個訊號處理單元15〇判斷數 位溫度訊號為異常溫度時，則即時輸出異常訊號至主機51 ，或由多個溫度傳訊器la,、1&2至lan中偵測到異常溫度的 • 一個發出警示訊號，其中’警示訊號可由設置在多個溫度 傳Λ器la】、la2至lan上的蜂鳴器或喇0八發出。 虽主機51接收到異常訊號時，主機根據發出異常 讯唬所具有的身分識別碼來判斷發生異常溫度的位置，並 輸出-通知訊號至使用者。通知訊號如文字簡訊或語音廣 播；或是由主機51輸出-控制訊號至相關的電氣負載執行 一溫度控制程序，以控制待測物的周圍溫度，例如控制空 調設備的啟動或灑水設備的啟動。 • 請參考第五圖，為本發明之數位溫度制模組之第二 實施例之功能方塊圖，並配合參考六圓，為本發明之溫度 監測系統的第二實施例之示意圖。數位溫度偵測模組⑼ 與第-實施例之數位溫度制模組15a大致相同，其差異 在於，數位溫度谓測模組15b具有一無線傳輸介面153，與 訊號處理單元150,電性連接，取代了第一訊號傳輸介面⑼ ;另-個差異在於’數位溫度偵測模組15b更包括一定位 單元W與訊號處理單幻5〇，電性連接。而數位溫度偵測 晶片⑸’與記憶料155，的操作原理皆與第一實施例相同 201215859 在本實施例中，定位單元157可為GPS、GPRS或AGPS 等，用以接收一衛星訊號並根據衛星訊號輸出一定位訊號 至訊號處理單元150’，訊號處理單元15〇,輸出溫度偵測訊 號時，同時將定位訊號整合在溫度偵測訊號的封包内，透 過無線傳輸介面153’無線輸出溫度偵測訊號。 溫度監測系統5’與第一實施例的溫度監測系統大致相 同，其差異在於，主機51，外接複數個無線傳輸模組53bi、 53t>2至53bm，多個無線傳輸模組53bi、53t>2至53bm與主機 5Γ作有線傳輸’而與多個溫度傳訊器lbi、lb2至作無 線傳輸，其中，多個溫度傳訊器1b〗、ib2至lbm分別包括 數位溫度偵測模組15b。實際實施時，多個無線傳輸模組 53b!、53b2至53bm與多個溫度傳訊器lbi、丨匕至之間 的通訊協定為Zigbee或RF等無線傳輸。其中，m為i〜256 中的任一個整數，多個無線傳輸模組53bi、兄卜至53bm與 多個溫度傳訊器lb,、It»2至lbm的個數可相同或不同。 多個溫度傳訊器lb!、lb>2至lbm中的每一個可選擇地 與多個無線傳輸模組53b!、53¾至53bm中最近的一個互相 通訊，多個無線傳輸模組53b,、53¾至53bm分別暫時地儲 存多個溫度傳訊器lb,、lb2至11^所輸出的溫度偵測訊號 ’並當多個無線傳輸模組53b】、53b2至53bm接收到主機51， 的輪詢訊號後，將溫度偵測訊號回傳至主機51，。藉此，溫 度監測系統5*利用無線傳輸可使多個溫度傳訊器ibi、ib2 至lbm設置的位置更加具有彈性，並擴大了溫度偵測的區 域範圍。 綜合上述’已揭露了本發明所提供的溫度傳訊器及具 有數位溫度傳訊器之溫度監測系統所使用的技術手段，利 201215859 用數U偏彳晶；：{量測精確的溫度值後，_有限或無 線的傳輸介Φ贿健度減輸$，以提供㈣者掌握正 確的溫度值。並且_主機遠端通知或控制電氣負載以排 除發生溫度異常的情況，藉此，有效監控多個區域内的待 測物的溫度。 准以上所述者，僅為本發明之較佳實施例而已，當不 能以此限定本發明實施之範圍’即大驗本發明申請專利 範圍及發明說_容所作之簡單的等效變化與修飾，皆仍 屬本發明專利涵蓋之範圍内。 【圖式簡單說明】 第一 A圖：本發明的一種溫度傳訊器的第一實施例之 示意圖； 第一 B圖：本發明的一種溫度傳訊器的第一實施例之 部分示意圖； 第二圖：本發明的一種溫度傳訊器的第二實施例之示 意圖； 第三圖：本發明的-種溫度傳訊器之數位溫度偵測模 組的第一實施例之方塊圖； ' 第四圖：本發明的一種溫度監測系統的第一實施例之 方塊圖； 第五圖：本發明的-種溫度傳訊器之數位溫度偵測模 組的第二實施例之方塊圖；及 第六圖：本發_-種溫度監測系統的第二實施例之 方塊圖。 13/18 201215859 【主要元件符號說明】 5、5丨：溫度監測系統 51、5Γ :主機 53b!、53b2、53bm :無線傳輸模組 1、Γ、la,、la2、lan、lb】、lb2、lbm :溫度傳訊器 10、1(T :殼體 11、1Γ :下殼體 111 :開口端 113 :密封端 13、13\上殼體 131 :蓋板 133 :本體 135 :第一螺母 137 :連接部 12 :鎖固單元 121 :上螺紋 123 :下螺紋 15、15a、15b :數位溫度偵測模組 150、 150':訊號處理單元 151、 15Γ :數位溫度偵測晶片 152 :訊號傳輸線 153 :第一訊號傳輸介面 153':無線傳輸介面 155、155':記憶單元 157 :定位單元 17、17’ ：電路板 14/18 201215859 141 :絕緣層 143 :導熱層 145 :防水層 147 :導熱膠 2 :水管 21 :凹槽 211 :第二螺母It is electrically connected to the digital temperature detecting chip 151, the first signal transmission interface 153, and the memory unit 155. The digital temperature detecting chip 151 is configured to detect the external temperature of the casing 1 , 1 , and output a digital temperature signal according to the detection result; the signal processing unit 150 is configured to receive the digital temperature signal and according to the digital temperature signal A temperature detection signal is generated, and the temperature detection signal can simply include a digital temperature signal or have an identification code, wherein the identity identification code is stored in the memory 155. When the signal processing unit 15 periodically outputs the temperature detection signal, the identity identification code is integrated into the packet of the temperature detection signal, and transmitted to the temperature transmitter through the first signal transmission interface 153. In this embodiment, the memory unit (5) also stores a reference temperature value. When the signal processing unit 15G is in contact with the temperature, the bribe temperature signal is compared with the reference temperature value. 'When the digital temperature signal exceeds the reference temperature output value' signal Handle the single magic 5G through the first - newsletter interface M3 lose = number. In actual implementation, the transfer temperature value can be set by the user. If set by the user, the digital test module 15a shows a unit (not shown) and an operation unit (not shown) to provide γ. The information processing unit 15() can be configured according to actual needs. The first mode is when the signal processing unit 15G_digit temperature signal 201215859 ' is higher than the reference temperature value, the abnormal signal is output; The mode is to output an abnormal signal when the signal processing M 15G is lying on the temperature cake reference a degree value. Next, please refer to the fourth figure, which is a block diagram of a first embodiment of the temperature monitoring system of the present invention. As shown in the fourth figure, the temperature monitoring system 5 includes a host 51 and a plurality of temperature transmitters to] a. Where n is any integer from 1 to 256, and a plurality of temperature transmitters lai, la2 to lan are respectively disposed in different regions for monitoring the temperature to be measured in the plurality of regions. And a plurality of temperature transmitters lai, Us to lan are serially connected on the same transmission line, and communicate with the host 51 through the transmission line. The host 51 can be a mobile electronic device, a computer or a server. In the present embodiment, the plurality of temperature transmitters lai, laz can be configured as temperature transmitter 1 or temperature transmitter 依 according to the actual measurement type, that is, the temperature to be measured is a liquid temperature or a gas temperature. The plurality of temperature transmitters la!, la2 to lan respectively include a digital temperature detecting module 15a, and the plurality of temperature transmitters la, la? to lan pass through the first first signal transmitting interface 153 and the first in the host 51. The two signal transmission interfaces (not shown) communicate with each other, wherein each of the first signal transmission interface 153 and the second signal transmission interface are respectively wired signal transmission interfaces such as RS-485 or RS-232. In a preferred embodiment, 'each of the first signal transmission interface 153 and the second signal transmission interface is an RS-485 interface' for half-duplex transmission, that is, one-to-one transmission and reception in turn, borrowing Thus, the host 51 can poll the plurality of temperature transmitters la, la2 to lan sequentially. The signal transmission protocol between the host 51 and the plurality of temperature transmitters lai, la2 to lan may be a Transmission Control Protocol/Internet Protocol (TCP/IP) or an instrumentation protocol (ModBus). -RTU) 〇201215859 For example, the host 51 periodically sends a polling signal to the plurality of temperature transmitters through the second signal transmission interface, and the mother signal processing unit 150 receives the polling signal and outputs the temperature detector. The test signal is sent to the host 51, wherein the temperature detection signals respectively comprise one of the plurality of temperature transmitters la], la2 to lan. When a signal processing unit 15 of the plurality of temperature transmitters lai, la2 to lan determines that the digital temperature signal is abnormal temperature, the abnormal signal is immediately output to the host 51, or by a plurality of temperature transmitters la, 1& 2 to lan detected abnormal temperature • A warning signal, where 'alert signal can be set by multiple temperature transmitters la}, la2 to lan buzzer or rao 08. When the host 51 receives the abnormal signal, the host determines the location where the abnormal temperature occurs based on the identity identifier of the abnormality signal, and outputs a notification signal to the user. The notification signal is a text message or a voice broadcast; or the host 51 outputs a control signal to the associated electrical load to perform a temperature control program to control the ambient temperature of the object to be tested, for example, to control the activation of the air conditioner or the startup of the sprinkler device. . Please refer to the fifth figure, which is a functional block diagram of a second embodiment of the digital temperature module of the present invention, and with reference to the six circles, which is a schematic diagram of a second embodiment of the temperature monitoring system of the present invention. The digital temperature detection module (9) is substantially the same as the digital temperature module 15a of the first embodiment. The difference is that the digital temperature measurement module 15b has a wireless transmission interface 153 and is electrically connected to the signal processing unit 150. The first signal transmission interface (9) is replaced. The other difference is that the digital temperature detection module 15b further includes a positioning unit W and a signal processing unit. The operating principle of the digital temperature detecting chip (5)' and the memory material 155 is the same as that of the first embodiment. 201215859 In this embodiment, the positioning unit 157 can be GPS, GPRS or AGPS, etc., for receiving a satellite signal and according to The satellite signal outputs a positioning signal to the signal processing unit 150', and the signal processing unit 15 〇 outputs the temperature detecting signal, and simultaneously integrates the positioning signal into the temperature detecting signal packet, and wirelessly outputs the temperature detecting through the wireless transmission interface 153'. Test signal. The temperature monitoring system 5' is substantially the same as the temperature monitoring system of the first embodiment, except that the host 51 is externally connected to a plurality of wireless transmission modules 53bi, 53t > 2 to 53bm, and a plurality of wireless transmission modules 53bi, 53t > The plurality of temperature transmitters 1b, ib2 to lbm respectively include the digital temperature detecting module 15b. In actual implementation, the communication protocol between the plurality of wireless transmission modules 53b!, 53b2 to 53bm and the plurality of temperature transmitters 1bi and 丨匕 is wireless transmission such as Zigbee or RF. Wherein, m is any one of i to 256, and the number of the plurality of wireless transmission modules 53bi, siblings 53bm and the plurality of temperature transmitters lb, It»2 to lbm may be the same or different. Each of the plurality of temperature transmitters lb!, lb> 2 to lbm selectively communicates with a nearest one of the plurality of wireless transmission modules 53b!, 533⁄4 to 53bm, and the plurality of wireless transmission modules 53b, 533⁄4 Temporarily storing a plurality of temperature transmitters lb, lb2 to 11^ output temperature detection signals to 53bm and receiving the polling signals of the host 51 after the plurality of wireless transmission modules 53b, 53b2 to 53bm respectively The temperature detection signal is transmitted back to the host 51. Thereby, the temperature monitoring system 5* can make the positions of the plurality of temperature transmitters ibi, ib2 to lbm more flexible by wireless transmission, and expand the area range of temperature detection. In combination with the above-mentioned technical means for using the temperature transmitter and the temperature monitoring system with digital temperature transmitter provided by the present invention, the 201215859 uses a number of U-biased crystals;: {measuring the accurate temperature value, _ Limited or wireless transmission Φ Bribery minus $ to provide (4) the correct temperature value. And _ the host remotely notifies or controls the electrical load to eliminate the occurrence of temperature anomalies, thereby effectively monitoring the temperature of the object to be tested in a plurality of areas. The above is only the preferred embodiment of the present invention, and the scope of the present invention cannot be limited thereto. All remain within the scope of the invention patent. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A is a schematic view showing a first embodiment of a temperature transmitter of the present invention; FIG. 1B is a partial schematic view showing a first embodiment of a temperature transmitter of the present invention; A schematic diagram of a second embodiment of a temperature transmitter of the present invention; FIG. 3 is a block diagram of a first embodiment of a digital temperature detecting module of the temperature transmitter of the present invention; A block diagram of a first embodiment of a temperature monitoring system of the invention; a fifth diagram: a block diagram of a second embodiment of a digital temperature detecting module of the temperature transmitter of the present invention; and a sixth drawing: the present invention A block diagram of a second embodiment of a temperature monitoring system. 13/18 201215859 [Explanation of main component symbols] 5, 5丨: Temperature monitoring system 51, 5Γ: Host 53b!, 53b2, 53bm: wireless transmission module 1, Γ, la, la2, lan, lb], lb2 Lbm : temperature transmitter 10, 1 (T: housing 11, 1 Γ: lower housing 111: open end 113: sealed end 13, 13\ upper housing 131: cover 133: body 135: first nut 137: connection Part 12: Locking unit 121: Upper thread 123: Lower thread 15, 15a, 15b: Digital temperature detecting module 150, 150': Signal processing unit 151, 15Γ: Digital temperature detecting chip 152: Signal transmission line 153: A signal transmission interface 153': wireless transmission interface 155, 155': memory unit 157: positioning unit 17, 17': circuit board 14/18 201215859 141: insulation layer 143: heat conduction layer 145: waterproof layer 147: thermal paste 2: Water pipe 21: groove 211: second nut
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