201212782 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種殼體及其製作方法，尤其涉及一種<發 光的殼體及該殼體的製作方法。 【先前技術】 [0002] 隨著消費水準的提高，消費者對電子產品的殻體要求不 僅注重其品質，對其表面的裝飾效果也愈來愈關注’具 有時尚、絢麗外觀及發光功能的殼體產品在笊場中#常 具競爭力。 [0003] 習知的製作發光殼體的方法有印刷或喷塗，即將螢光材 料直接加入到一般油墨或塗料中混合均句，製成，絲 刷用的油墨或喷塗用塗料，將該油墨或塗料印刷或喷蜜 於殼體上形成一可發光的油墨層或塗料層，而製得發光 殼體。然而，由於螢光材料在所述油墨或塗料中難以均 勻分散，致使發光不均勻，且該未均勻分散的螢光材料 在發光時還存在光的散射、反射及吸收等造成的光強損 失，使得發光強度減弱。另外由於螢光材料的添加量有 限，也會導致發光強度弱的問題。除此之外，該方法不 環保。 [〇〇〇4] 目前也有提出以濺鍍、蒸鍍或離子鍍的方式直接將螢光 材料鍍覆於殼體表面形成發光層。然而，由於殼體本身 所含有的某些金屬元素如鐵等，容易向發光層中擴散而 導致發光層發光失效。另外，目前通常在發光層表面喷 塗一油漆層以防止發光層被磨損，但係該油漆層的耐磨 性有限’難以對發光層進行較好的保護，且該油漆層的 099130425 表單編號A0101 第4頁/共12頁 0992053383-0 201212782 [0005] [0006] [0007] 外觀欠佳。 【發明内容】 鑒於此，有必要提供一種環保的且發光不易失效的殼體201212782 VI. Description of the Invention: [Technical Field] The present invention relates to a housing and a method of fabricating the same, and more particularly to a housing that emits light and a method of fabricating the same. [Prior Art] [0002] With the improvement of the consumption level, the consumer's shell requirements for electronic products not only pay attention to its quality, but also pay more attention to the decorative effect of its surface. 'The shell with fashionable, beautiful appearance and luminous function. Body products are often competitive in the market. [0003] A conventional method for manufacturing a light-emitting casing is printing or spraying, that is, directly adding a fluorescent material to a general ink or a paint, and preparing the ink for a silk brush or a paint for spraying, The ink or paint is printed or sprayed onto the casing to form a luminescent ink layer or paint layer to produce a light-emitting casing. However, since the fluorescent material is difficult to be uniformly dispersed in the ink or the coating material, the light emission is uneven, and the unevenly dispersed fluorescent material has a light intensity loss caused by scattering, reflection, and absorption of light during light emission. The luminescence intensity is reduced. In addition, since the amount of the fluorescent material added is limited, the problem of weak luminous intensity is also caused. Apart from this, the method is not environmentally friendly. [〇〇〇4] It has also been proposed to directly deposit a fluorescent material on the surface of the casing by sputtering, vapor deposition or ion plating to form a light-emitting layer. However, some metal elements such as iron contained in the casing itself easily diffuse into the light-emitting layer to cause the light-emitting layer to fail to emit light. In addition, a paint layer is usually sprayed on the surface of the light-emitting layer to prevent the light-emitting layer from being worn, but the wear resistance of the paint layer is limited. It is difficult to protect the light-emitting layer, and the paint layer is 099130425 Form No. A0101 Page 4 of 12 0992053383-0 201212782 [0005] [0006] [0007] The appearance is not good. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide an environmentally friendly and light-emitting housing that is not easy to fail.
[0008] [0009] [0010] [0011] 另外，還有必要提供一種上述殼體的製作方法。 一種殼體，其包括一金屬基體及依次形成於該金屬基體 表面的一阻擋層、一發光層及一保護層，所述阻擋層為 一鈦膜層，所述發光層為一稀土鋁酸鹽膜層，所述保護 層為一二氧化梦膜層。 一種殼體的製作方法，其包括如下步驟：[0010] In addition, it is also necessary to provide a method of fabricating the above described housing. A casing comprising a metal substrate and a barrier layer, a light-emitting layer and a protective layer, which are sequentially formed on the surface of the metal substrate, the barrier layer is a titanium film layer, and the light-emitting layer is a rare earth aluminate a film layer, the protective layer being a dioxide dioxide dream film layer. A method of manufacturing a housing, comprising the steps of:
[0012] [0013] 採用真空濺鍍法在該金屬基體的一表面沉積一阻擋層， 該阻擋層為一鈦膜層； 採用真空蒸鍍法在該阻擋層的表面沉積一發光層，該發 光層為一稀土銘酸鹽膜層； 採用真空蒸鍍法在該發光層的表面沉積一保護層，該保 護層為一二氧化Α夕膜層。 售ί 相較於習知技術，所述殼體的阻擋層可阻擋金屬基體中 的某些金屬或合金元素向發光層中的擴散，從而可避免 該金屬或合金元素與發光層中的稀土元素競爭電子而導 致發光層的發光失效。所述以真空蒸鍍法形成的二氧化 矽保護層具有很強的耐磨性，可以對發光層起到較好的 保護作用，同時該二氧化矽膜層具有更加高雅的外觀。 099130425 表單編號Α0101 第5頁/共12頁 0992053383-0 201212782 【實施方式】 [0014] 請參閱圖1，本發明一較佳實施方式的殼體10包括金屬基 體11及依次形成於金屬基體11表面的阻擋層13、發光層 15及保護層17。 [0015] 金屬基體11的材質可為不銹鋼或其他鐵基合金。 [0016] 阻擋層13可為一鈦膜層。該阻擋層13可以真空濺鍍的方 法形成，其厚度可為100-200nm。 [0017] 發光層15可為一稀土鋁酸鹽膜層，其可以真空蒸鍍的方 式形成，厚度在5-10 ywm之間。所述的稀土銘酸鹽可為紹 酸錄銪、銘酸認鏑、紹酸4弓銪及.紹酸妈銷中的一種或幾 種的組合。 [00181 所述發光層15在光照下吸收光能，使發光層15中的稀土 元素銪或鏑的電子由低能態激發至不穩定的高能態，當 光照消失時，處於該不穩定的高能態的電子重新回到低 能態，同時以光能的形式釋放能量，而使發光層15發光 。而金屬基體11的金屬或合金元素如鐵等，易於向發光 層15中擴散，該鐵原子可與所述高能態的電子競爭電子 ，導致發光失效。因此本較佳實施例中於所述金屬基體 11與發光層15之間設置一阻擋層13，以較好的阻擋金屬 基體11中的某些金屬或合金元素向發光層15的擴散，從 而可避免發光層15的發光失效問題。 [0019] 保護層17可為一透明的二氧化矽膜層。該保護層17可以 真空蒸鍍的方式形成，其厚度可為1 00-500nm。該保護 層17具有很強的耐磨性，可較好的保護所述發光層15免 099130425 表單編號A0101 第6頁/共12頁 0992053383-0 201212782 受磨損。同時，該保護層17相較於油漆層透明度更高、 外觀更美觀。 [0020] [0021] Ο [0022] Ο [0023] [0024] 本發明一較佳實施方式的製作上述殼體10的方法包括如 下步驟： 提供一金屬基體11，並對該金屬基體11進行前處理。該 前處理可為將金屬基體11放入盛裝有乙醇及/或丙酮溶液 的超聲波清洗器中進行超聲波清洗，以除去金屬基體11 表面的雜質和油污等。 將經上述前處理後的金屬基體11放入一真空濺鍍機（圖 未示）的鍍膜室中，抽真空該鍍膜室至真空度約4.0χ10_ 3Pa，向鍍膜室内通入純度為99. 999%的氬氣（工作氣體 )，並於所述金屬基體11上施加-200 — 800V的偏壓，對 金屬基體11表面進行氬氣等離子體清洗，以進一步去除 金屬基體11表面的油污，以及改善金屬基體11表面與後 續塗層的結合力。所述氬氣等離子體清洗的時間約為 3~1Omiη ° 在所述氬氣等離子體清洗完成後，調節所述氬氣的流量 為20~150sccm (標準狀態毫升/分鐘），加熱所述鍍膜 室至100〜200°C (即濺鍍溫度為100〜200°C)，開啟已置 於所述鍍膜室中的一鈦靶的電源，並設定其功率為2〜4kw ，並於金屬基體11上施加-1 00 — 300V的偏壓，於金屬基 體11表面濺鍍所述阻擋層13。濺鍍該阻擋層13的時間為 20~40miη。 將形成有阻擋層13的金屬基體11放入一真空蒸鍍機（圖 099130425 表單編號Α0101 第7頁/共12頁 0992053383-0 201212782 未不）的洛鍍室中，抽真空該蒸鍍室至真空度約5. 3x1 〇_ 3Pa，以鋁酸鰓銪、鋁酸勰鏑、鋁酸鈣銪及鋁酸鈣鏑中的 一種或幾種的組合形成的塊體作為蒸料，採用電子束加 熱，將所述蒸料蒸發沉積至阻擋層13的表面，形成所述 發光層15。蒸發沉積的速率可為3_1〇埃/秒。蒸鍍該發光 層15的同時，可以900_1 500瓦（w)的離子束（可由一 離子束搶發射）對阻擋層13的表面進行轟擊，以增強所 述發光層15與阻擋層13間的結合力。 [0〇25 ]在發光層1 5的表面繼續以蒸鑛的方式沉積所述保護層^ 7 。沉積該保護層17以二氧化矽塊體作為蒸料，採用電子 束加熱。蒸發沉積該保護層17的速率可為3_1〇埃/秒。 [6]可以理解的，蒸鍍该保護層1 7的同時，也可以9 〇 〇 — 1 5 〇 〇 瓦（W)的離子束對發光層15的表面進行轟擊以增強所 述保護層17與發光層15間的結合力。 相較於習知技術，所述殼體1〇的;阻指層13可阻擔金屬基 體11中的某些金屬或合金元素向畚光層15中的擴散，從 而可避免該金屬或合金元素輿發光層15中的稀土元素如 销、鎖等競爭電子而導致發光層15的發光失效。所述以 真空蒸鑛法形成的二氧切保護層丨7具妹強的财磨性 ’可以對發光層15起到較好的保護作用，同時該二氧化 石夕膜層具有更加南雅的外觀。 【圖式簡單說明】 [_圖1係本發明-較佳實施方式的殼體的剖視示意圖。 【主要元件符號說明】 099130425 表單編號A0101 第8頁/共12頁 0992053383-0 201212782 [0029]殼體：10 [0030] [0031] [0032] [0033] 金屬基體：11 阻擋層：13 發光層：15 保護層：17[0013] a barrier layer is deposited on a surface of the metal substrate by a vacuum sputtering method, the barrier layer is a titanium film layer; a light-emitting layer is deposited on the surface of the barrier layer by vacuum evaporation. The layer is a rare earth crystal film layer; a protective layer is deposited on the surface of the light emitting layer by vacuum evaporation, and the protective layer is a cerium oxide layer. Compared with the prior art, the barrier layer of the casing can block the diffusion of certain metals or alloying elements in the metal matrix into the luminescent layer, thereby avoiding the rare earth elements in the metal or alloying elements and the luminescent layer. Competing for electrons causes the luminescence of the luminescent layer to fail. The ruthenium dioxide protective layer formed by the vacuum evaporation method has a strong abrasion resistance and can provide a good protection for the luminescent layer, and the ruthenium dioxide film layer has a more elegant appearance. 099130425 Form No. 1010101 Page 5 of 12 0992053383-0 201212782 [Embodiment] Referring to FIG. 1, a housing 10 according to a preferred embodiment of the present invention includes a metal substrate 11 and is sequentially formed on the surface of the metal substrate 11. The barrier layer 13, the light-emitting layer 15, and the protective layer 17. [0015] The material of the metal base 11 may be stainless steel or other iron-based alloy. [0016] The barrier layer 13 can be a titanium film layer. The barrier layer 13 can be formed by vacuum sputtering and can have a thickness of 100 to 200 nm. [0017] The light-emitting layer 15 may be a rare earth aluminate film layer which can be formed by vacuum evaporation and has a thickness of between 5 and 10 yWm. The rare earth acid salt may be a combination of one or more of sulphuric acid, sulphuric acid, sulphuric acid, and sauer. [00181] The luminescent layer 15 absorbs light energy under illumination, so that the electrons of the rare earth element lanthanum or cerium in the luminescent layer 15 are excited from a low energy state to an unstable high energy state, and when the light disappears, the unstable high energy state is present. The electrons return to the low energy state while releasing energy in the form of light energy, causing the light emitting layer 15 to emit light. On the other hand, a metal or alloying element of the metal substrate 11 such as iron or the like is apt to diffuse into the light-emitting layer 15, and the iron atom can compete with the electron of the high-energy state for electrons, resulting in failure of light emission. Therefore, in the preferred embodiment, a barrier layer 13 is disposed between the metal substrate 11 and the light-emitting layer 15 to better block the diffusion of certain metal or alloy elements in the metal substrate 11 to the light-emitting layer 15 . The problem of illuminating failure of the luminescent layer 15 is avoided. [0019] The protective layer 17 may be a transparent ceria film layer. The protective layer 17 can be formed by vacuum evaporation and has a thickness of from 100 to 500 nm. The protective layer 17 has strong abrasion resistance and can better protect the luminescent layer 15 from 099130425 Form No. A0101 Page 6 / Total 12 Page 0992053383-0 201212782 Subject to wear. At the same time, the protective layer 17 is more transparent and more aesthetically pleasing than the paint layer. [0022] [0024] A method of fabricating the above-described housing 10 according to a preferred embodiment of the present invention includes the steps of: providing a metal substrate 11 and performing the front of the metal substrate 11 deal with. This pretreatment may be performed by ultrasonically cleaning the metal substrate 11 in an ultrasonic cleaner containing an ethanol and/or acetone solution to remove impurities, oil stains, and the like on the surface of the metal substrate 11. The immersed metal substrate 11 is placed in a coating chamber of a vacuum sputtering machine (not shown), and the vacuum chamber is evacuated to a vacuum of about 4.0 χ 10 _ 3 Pa, and the purity of the coating chamber is 99.999. % argon gas (working gas), and applying a bias voltage of -200 - 800 V on the metal substrate 11, argon plasma cleaning the surface of the metal substrate 11 to further remove oil stain on the surface of the metal substrate 11, and improve The bonding force of the surface of the metal substrate 11 with the subsequent coating. The argon plasma cleaning time is about 3~1Omiη °. After the argon plasma cleaning is completed, the flow rate of the argon gas is adjusted to 20~150sccm (standard state cc/min), and the coating chamber is heated. Up to 100 to 200 ° C (ie, a sputtering temperature of 100 to 200 ° C), turning on a power source of a titanium target placed in the coating chamber, and setting the power to 2 to 4 kw, and on the metal substrate 11 The barrier layer 13 is sputtered on the surface of the metal substrate 11 by applying a bias voltage of -100 to 300V. The time for sputtering the barrier layer 13 is 20 to 40 mi?. The metal substrate 11 on which the barrier layer 13 is formed is placed in a vacuum plating chamber of a vacuum evaporation machine (Fig. 099130425, Form No. 1010101, page 7/12 pages 0992053383-0 201212782), and the evaporation chamber is evacuated to a vacuum of about 5. 3x1 〇 _ 3Pa, a block formed by a combination of one or more of barium aluminate, barium aluminate, calcium aluminate strontium and calcium aluminate strontium as a steaming material, using electron beam heating The evaporated material is evaporated to the surface of the barrier layer 13 to form the light-emitting layer 15. The rate of evaporative deposition can be 3_1 angstroms per second. While vapor-depositing the light-emitting layer 15, the surface of the barrier layer 13 may be bombarded with an ion beam of 900_1 500 watts (w), which may enhance the bonding between the light-emitting layer 15 and the barrier layer 13. force. [0〇25] The protective layer 7 is continuously deposited on the surface of the light-emitting layer 15 by vapor deposition. The protective layer 17 is deposited by using a ceria block as a vapor and heating by electron beam. The rate at which the protective layer 17 is deposited by evaporation may be 3_1 Å/sec. [6] It can be understood that while the protective layer 17 is vapor-deposited, the surface of the light-emitting layer 15 can also be bombarded with an ion beam of 9 〇〇 - 15 〇〇W (W) to enhance the protective layer 17 and The bonding force between the light-emitting layers 15. Compared with the prior art, the resistive layer 13 can block the diffusion of certain metals or alloying elements in the metal substrate 11 into the phosphor layer 15, thereby avoiding the metal or alloying elements. The rare earth elements in the luminescent layer 15 such as pins, locks, and the like compete for electrons, causing the luminescent layer 15 to fail to emit light. The dioxy-cut protective layer 丨7 formed by the vacuum steaming method has a strong grindability of 'sweetness', and can protect the luminescent layer 15 better, and the cerium dioxide layer has a more southerly Exterior. BRIEF DESCRIPTION OF THE DRAWINGS [FIG. 1 is a cross-sectional view of a casing of the present invention - a preferred embodiment. [Main component symbol description] 099130425 Form No. A0101 Page 8 / Total 12 Page 0992053383-0 201212782 [0029] Housing: 10 [0030] [0032] [0033] Metal substrate: 11 Barrier layer: 13 Light-emitting layer :15 Protective layer: 17
〇 099130425 表單編號A0101 第9頁/共12頁 0992053383-0〇 099130425 Form No. A0101 Page 9 of 12 0992053383-0