201212311 六、發明說明： 【發明所屬之技術領域】 [0001] 本案係關於一種壓電致動模組之製造方法，尤指一種壓 電致動模組及其所適用之壓電噴墨頭之製造方法。 【先前技術】 [0002] 隨著噴墨技術的進步’噴墨技術不再只是應用在傳統列 印市場上’近年更應用於平面顯示器以及半導體產業的 製程技術中’然而’為了降低成本以及節省製程時間， 紛紛尋求新的喷墨技術，這之中最被廣為應用的，就是 壓電式喷墨技術。 : . :.201212311 VI. Description of the Invention: [Technical Field of the Invention] [0001] The present invention relates to a method of manufacturing a piezoelectric actuator module, and more particularly to a piezoelectric actuator module and a piezoelectric inkjet head thereof. Production method. [Prior Art] [0002] With the advancement of inkjet technology, 'inkjet technology is no longer only used in the traditional printing market'. In recent years, it has been applied to the process technology of flat panel display and semiconductor industry. However, in order to reduce cost and save Process time, the search for new inkjet technology, the most widely used is piezoelectric inkjet technology. : . :.
[〇〇〇3] —般的壓電噴墨頭結構主要由噴嘴片、蓋板以及壓電致 動模組所組成。請參閱第一圖A，其係為習知壓電喷墨頭 之壓電致動模組之結構示意圖。如圖所示，習知的壓電 致動模組1主要由上壓電晶片10、下壓電晶片n以及電極 12所形成’其中上壓電晶片1〇及下壓電晶片丨丨分別具有 一電極12，且在上壓電晶片10及下壓電晶片丨丨之兩電極 12之間更具有一導電層13 ’該導電層13係可由一導電膠 所形成，但不以此為限，用以接合兩電極丨2。以及，習 知之壓電致動模組1更具有複數個流道14，該複數個流道 14係自上壓電晶片1〇向下延伸至下壓電晶片11，且該複 數個流道之開口 140均設置於上壓電晶片1〇上》 [0004]於第一圖A所示之壓電致動模組i中，其製造方法係為先 分別製成上壓電晶片10及下壓電晶片u，並在上壓電晶 片10及下壓電晶片11的一表面形成電極12 ,其後再透過 導電層13將上壓電晶片10及下壓電晶片11接合於一起。 099130549 表單編號A0101 第4頁/共31頁 0992053607-0 201212311 最後’透過一切割工具，自上壓電晶片1〇依一定間隔向 下進行切割’以形成複數個固定大小之流道14，且如圖 所示’該複數個流道14的開口 140均設置於上壓電晶片1〇 的同一表面上。 [0005] Ο [0006]Ο 請參閱第一圖Β ’其係為習知壓電致動模組之作動示意圖 。如圖所示’當壓電致動模組1進行作動時，即透過電極 12以產生一電場’進而使上壓電晶片1〇及下壓電晶片u 依據不同之正負電壓而產生形變，如圖所示，當流道142 因兩侧上壓電晶片1〇及下壓電晶片U之正負電壓不同而 產生擴張情形時，則設置於流道142兩側的流道141及流 道143因而會受到擠壓，進而則可，使流.炎及流道143 中的墨液（未圖示）自一噴墨孔（未圖示）流出，反之，因 流道142係處於擴張之狀態，因而可使墨液（未圖示）流入 流道142中’藉此正負電壓之交替轉換，以控制墨液自不 同之流道14及喷墨孔（未圖示）流出。 然而，在習知的壓電致動模組1中，如第一圖Α及第一圖β 所示，由於複數假流道14均自上壓電晶片1〇向下延伸至 下壓電晶片11所形成，且流道14之開口 140均設置於上壓 電晶片1 0上’因此，設置每一流道14之間的下壓電晶片 11的基部110結構較為脆弱’尤其當壓電致動模組1進行 作動時，流道14會產生擴張或被擠壓的情形，往往更會 影響到流道14旁邊的基部110，使基部11〇在多次的形變 擠壓之後易產生破裂的情形，進而影響到壓電致動模組i 之效能，並導致壓電喷墨頭可能出現損壞之情形。 [0007] 有鑑於此，如何發展一種結構強度較高、不易產生損壞 099130549 表單編號A0101 第5頁/共31頁 0992053607-0 201212311 之壓電致動模組及其所適用之壓電喷墨頭之製造方法， 以解決習知技術之缺失，實為相關技術領域者目前所迫 切需要解決之問題。 【發明内容】 [0008] 本案之目的在於提供一種壓電致動模組及其所適用之壓 電喷墨頭之製造方法，其係藉由壓電致動模組内具有上 下開口交錯設置之流道，俾解決習知壓電致動模組之結 構脆弱，易導致壓電喷墨頭可能出現損壞情形之缺失。 [0009] . 為達上述目的，本案之一較廣義實施態樣為提供一種壓 電致動模組之製造方法，其係包括下列步驟：（a)形成一 上壓電晶片及一下壓電晶片，該上壓電晶片及該下壓電 晶片之第一表面係分別具有一第一電極及一第二電極； (b)透過一導電層將該第一電極及該第二電極相互接合， 以使該上廢電晶片與該下Μ電晶片對應組接，（c)對該上 壓電晶片之一第二表面進行等間距切割；（d)對該下壓電 晶片之一第二表面進行與該上壓電晶片之一第二表面等 間距切割錯位之切割，以形成複數個開口上下交錯之流 道，俾形成一壓電致動模組。 [0010] 為達上述目的，本案之另一較廣義實施態樣為提供一種 壓電喷墨頭之製造方法，其係包括下列步驟：（a )形成一 上壓電晶片及一下壓電晶片，該上壓電晶片及該下壓電 晶片之第一表面係分別具有一第一電極及一第二電極； (b)透過一導電層將該第一電極及該第二電極相互接合， 以使該上Μ電晶片與該下壓電晶片對應組接，（c)對該上 壓電晶片之一第二表面進行等間距切割；（d)對該下壓電 099130549 表單編號A0101 第6頁/共31頁 0992053607-0 201212311 晶片之一第二表面進行與該上壓電晶片之一第二表面等 間距切割錯位之切割，以形成複數個開口上下交錯之流 道，俾形成一壓電致動模組；（e)於該壓電致動模組之該 上壓電晶片及該下壓電晶片之該第二表面上分別設置一 上蓋板及一下蓋板；（f)於該壓電致動模組之一第一侧面 設置一密封層，俾封閉該複數個流道之末端；（g)於該壓 電致動模組之一第二側面設置一喷嘴片，該喷嘴片上具 有複數個喷墨孔，其係與該複數個流道相連通。 〇 [0011] 【實施方式】 體現本案特徵與優點的一些典型實施例將在後段的說明 中詳細敘述。應理解的是本案能夠在不同的態樣上具有 各種的變化，其皆不脫離本案的範圍，且其中的說明及 圖示在本質上係當作說明之用，而非用以限制本案。 [0012] Ο 請同時參閱第二圖及第三圖A，第二圖係為本案較佳實施 例之壓電致動模組之製造方法流龌圖，第三圖A則為本案 較佳實施例之壓電致動模組之分解結構示意圖。如第三 圖A所示，本案之壓電致動模組23主要由上壓電晶片231 、下壓電晶片232、第一電極233、第二電極234以及導 電層235所形成。於本實施例中，如第二圖之步驟S30所 示’形成上壓電晶片231及下壓電晶片232之方式係為先 提供—壓電材料，例如：高d31的鉛鈦酸鉛壓電材料 CPZT-5H) ’但不以此為限，將該壓電材料透過一模具及 液虔式機器，於適當壓力的作用下將該壓電材料壓制為 片狀結構，以形成上壓電晶片231及下壓電晶片232。且 其係可透過一雙面研磨機器將該上壓電晶片231及下壓電 099130549[〇〇〇3] The general piezoelectric ink jet head structure is mainly composed of a nozzle piece, a cover plate, and a piezoelectric actuator module. Please refer to FIG. A, which is a schematic structural view of a piezoelectric actuator module of a conventional piezoelectric inkjet head. As shown in the figure, the conventional piezoelectric actuator module 1 is mainly formed by the upper piezoelectric wafer 10, the lower piezoelectric wafer n and the electrode 12, wherein the upper piezoelectric wafer 1 and the lower piezoelectric wafer have respectively An electrode 12, and a conductive layer 13 between the upper electrode 12 and the lower electrode 12 of the lower piezoelectric wafer 12, the conductive layer 13 can be formed by a conductive adhesive, but not limited thereto. Used to join the two electrodes 丨2. Moreover, the conventional piezoelectric actuator module 1 further has a plurality of flow channels 14 extending downward from the upper piezoelectric wafer 1 to the lower piezoelectric wafer 11, and the plurality of flow channels are The openings 140 are all disposed on the upper piezoelectric wafer 1" in the piezoelectric actuator module i shown in FIG. A, which is manufactured by separately forming the upper piezoelectric wafer 10 and pressing down. The electric wafer u is formed with electrodes 12 on one surface of the upper piezoelectric wafer 10 and the lower piezoelectric wafer 11, and then the upper piezoelectric wafer 10 and the lower piezoelectric wafer 11 are bonded together through the conductive layer 13. 099130549 Form No. A0101 Page 4 / Total 31 Page 0992053607-0 201212311 Finally 'through a cutting tool, cut from the upper piezoelectric wafer 1 at a certain interval to form a plurality of fixed-size flow channels 14 and as The openings 140 of the plurality of flow channels 14 are disposed on the same surface of the upper piezoelectric wafer 1''. [0005] Ο [0006] Ο Refer to the first figure ′′, which is a schematic diagram of the operation of a conventional piezoelectric actuator module. As shown in the figure 'When the piezoelectric actuator module 1 is actuated, that is, through the electrode 12 to generate an electric field', the upper piezoelectric wafer 1 and the lower piezoelectric wafer u are deformed according to different positive and negative voltages, such as As shown in the figure, when the flow path 142 is expanded due to the difference between the positive and negative voltages of the piezoelectric wafer 1〇 and the lower piezoelectric wafer U on both sides, the flow path 141 and the flow path 143 disposed on both sides of the flow path 142 are thus If it is squeezed, the ink (not shown) in the flow, inflammation, and flow path 143 may flow out from an ink ejection orifice (not shown). Conversely, the flow passage 142 is in an expanded state. Therefore, ink (not shown) can be caused to flow into the flow path 142 to alternately convert the positive and negative voltages to control the flow of ink from the different flow paths 14 and the ink ejection holes (not shown). However, in the conventional piezoelectric actuator module 1, as shown in the first figure and the first figure β, since the plurality of dummy flow paths 14 extend downward from the upper piezoelectric wafer 1 to the lower piezoelectric wafer 11 is formed, and the openings 140 of the flow path 14 are all disposed on the upper piezoelectric wafer 110. Therefore, the base 110 of the lower piezoelectric wafer 11 disposed between each flow path 14 is relatively fragile, especially when piezoelectrically actuated. When the module 1 is actuated, the flow passage 14 may be expanded or squeezed, and the base portion 110 besides the flow passage 14 may be affected more, so that the base portion 11 is susceptible to cracking after multiple deformations. , which in turn affects the performance of the piezoelectric actuator module i and causes damage to the piezoelectric inkjet head. [0007] In view of this, how to develop a piezoelectric actuator module having a high structural strength and being less susceptible to damage 099130549 Form No. A0101 Page 5 / Total 31 Page 0992053607-0 201212311 The manufacturing method to solve the lack of the prior art is an urgent problem that the related technical field currently needs to solve. SUMMARY OF THE INVENTION [0008] The purpose of the present invention is to provide a piezoelectric actuator module and a piezoelectric inkjet head manufacturing method therefor, which are arranged by means of a vertical opening in a piezoelectric actuator module. The flow path, which solves the problem of the fragile structure of the conventional piezoelectric actuator module, is liable to cause a loss of damage to the piezoelectric inkjet head. [0009] In order to achieve the above object, a broader aspect of the present invention provides a method of fabricating a piezoelectric actuator module comprising the steps of: (a) forming an upper piezoelectric wafer and a lower piezoelectric wafer. The first surface of the upper piezoelectric wafer and the lower piezoelectric wafer respectively have a first electrode and a second electrode; (b) the first electrode and the second electrode are bonded to each other through a conductive layer, Correspondingly, the upper waste electric wafer is assembled with the lower electric wafer, (c) equally spacing the second surface of one of the upper piezoelectric wafers; (d) performing the second surface of one of the lower piezoelectric wafers And cutting a misaligned cut with the second surface of one of the upper piezoelectric wafers to form a plurality of openings and upper and lower staggered flow paths, and forming a piezoelectric actuator module. [0010] In order to achieve the above object, another generalized embodiment of the present invention provides a method of manufacturing a piezoelectric inkjet head, which comprises the steps of: (a) forming an upper piezoelectric wafer and a lower piezoelectric wafer, The first surface of the upper piezoelectric wafer and the lower piezoelectric wafer respectively have a first electrode and a second electrode; (b) the first electrode and the second electrode are bonded to each other through a conductive layer, so that The upper silicon wafer is correspondingly assembled with the lower piezoelectric wafer, (c) the second surface of one of the upper piezoelectric wafers is equally spaced; (d) the lower piezoelectric 099130549, the form number A0101, page 6 / A total of 31 pages 0992053607-0 201212311 one of the second surfaces of the wafer is cut at the same distance from the second surface of the upper piezoelectric wafer, so as to form a plurality of openings in which the openings are vertically staggered, and a piezoelectric actuator is formed. a module (e) an upper cover and a lower cover respectively disposed on the second surface of the upper piezoelectric wafer and the lower piezoelectric wafer of the piezoelectric actuator module; (f) the piezoelectric a sealing layer is disposed on the first side of one of the actuation modules, and the plural is closed The end of the flow path; (g) a nozzle piece disposed on a second side of the piezoelectric actuator module, the nozzle piece having a plurality of ink ejection holes communicating with the plurality of flow paths. [Embodiment] Some exemplary embodiments embodying the features and advantages of the present invention will be described in detail in the following description. It is to be understood that the present invention is capable of various modifications in various aspects, and the description and illustration are in the nature of [0012] Please refer to the second figure and the third figure A at the same time. The second figure is a flow chart of the manufacturing method of the piezoelectric actuator module of the preferred embodiment of the present invention, and the third figure A is a preferred embodiment of the present invention. A schematic diagram of an exploded structure of a piezoelectric actuator module. As shown in FIG. A, the piezoelectric actuator module 23 of the present invention is mainly formed by the upper piezoelectric wafer 231, the lower piezoelectric wafer 232, the first electrode 233, the second electrode 234, and the conductive layer 235. In the present embodiment, as shown in step S30 of the second figure, the method of forming the upper piezoelectric wafer 231 and the lower piezoelectric wafer 232 is first provided as a piezoelectric material, for example, a high lead d33 lead titanate piezoelectric. Material CPZT-5H) 'But not limited to this, the piezoelectric material is pressed into a sheet structure under appropriate pressure through a mold and a liquid helium machine to form an upper piezoelectric wafer. 231 and lower piezoelectric wafer 232. And the upper piezoelectric wafer 231 and the lower piezoelectric 099130549 can be passed through a double-sided grinding machine.
表單編號A010I 第7頁/共31頁 0992053607-0 201212311 晶片232研磨為所需要之厚度，於一些實施例中，上壓電 晶片231及下壓電晶片232之厚度係以500 μπι為較佳，但 不以此為限。 [0013] 請再參閱第二圖及第三圖A，如步驟S31所示，當形成上 壓電晶片231及下壓電晶片232後，隨後即於上壓電晶片 231及下壓電晶片232的第一表面231a及232a上分別形成 第一電極233及第二電極234。於一些實施例中，形成第 一電極233及第二電極234的製程中，更包含先形成一暫 時性之電極，但不以此為限，該作法係為先將一電極材 料，例如：單劑型高溫銀鈀膠，但不以此為限，塗附於 上壓電晶片231及下壓電晶片232的第一表面231a及232a 上，其後再透過高溫燒製，例如：6〇〇°C之高溫，以及送 入高溫絕緣矽油槽中，並施以電壓，例如：3V/#m之電 壓，以進行10分鐘之極化作用，進而於上壓電晶片231及 下壓電晶片232的第一表面231a及232a上形成一暫時性 之電極（未圖示），接著，再將此暫時性之電極以研磨之 方式去除。然後，再以金屬掀除技術（lift off )將另一 電極材料，例如：金鉻（Au/Cr )材料，但不以此為限，以 蒸鍍的方式形成於上壓電晶片231及下壓電晶片232的第 一表面231a及232a上，藉此以形成第一電極233及第二 電極234。 [0014] 於另一些實施例中，可再透過一切割儀器，例如：晶圓 切割刀，但不以此為限，將具有第一電極233及第二電極 234的上壓電晶片231及下壓電晶片232切割為所需之特 定尺寸。且該尺寸係以711111^2〇111111/0.5111111為較佳，但不以 099130549 表單編號A0101 第8頁/共31頁 0992053607-0 201212311 此為限，其係可依實際施作情形而任施變化。當上壓電 晶片231及下壓電晶片232已切割為特定尺寸後，則如步 驟S32所示，可透過導電層235將設置於上壓電晶片231 及下壓電晶片232之第一表面231 a及232a的第一電極233 及第二電極234相互接合，且於一些實施例中，係透過一 網版印刷技術將該導電層235與第一電極233及第二電極 234相互接合，但不以此為限，藉此以使上壓電晶片231 及下壓電晶片23 2可對應組接，並形成如第三圖B所示之 上下壓電晶片231、232之紐·舍結構。以及，於本實施 例中導電層235係可為一導電膠，但不以此為限。 剛冑同時參閱第二圖及第三圖c，第三圖€係為本案較佳實 施例之壓電致動模組之上壓電晶片切割後y結構示意圖 ,如第—圖所示，當完成將上、下壓電晶片231、232進 行對應組接之步驟後，其後則如步驟所示透過一切 割儀器，例如：晶圓切割刀，但不以此為限對上壓電 晶片231的第二表面231b進行切割’且其切割方式係為以 〇 肖定距離進行固定寬度及深度之等間距切割，進而形成 自上壓電晶片231向下延伸至下廢電晶片232之複數個流 道M〇a，且該複數個流道230a的開口 230b係設置於上壓 電晶片231的第二表面231b上。 [0016]接著，則再如第二圖之步驟S34所示，將上、下壓電晶片 231、232的組合結構進行翻轉，並對下壓電晶片232的 第二表面232b進行與上壓電晶片231之第二表面2311)等 間距切割錯位的第二次切割’其切割卫具及切割方式均 與前述實施方式相仿，故不再贅述。透過第二次切割後 099130549 表單編號ΑΟίοι 第9頁/共、31頁 0992053607-0 201212311 ，則可形成自下壓電晶片232延伸至上壓電晶片23之複數 個流道230c，且該複數個流道230c的開口 230d係設置於 下壓電晶片232的第二表面232b上。如此一來，透過此二 次切割’則可使壓電致動模組23具有如第三圖D所示之複 數個開口 230b、230d上下交錯設置之流道230，且由於 流道230之開口 230b、230d係分別交錯設置於上壓電晶 片231及下壓電晶片232的第二表面231b、232b上，而非 設置於同一壓電晶片上，因而對於每一流道230來說，其 兩侧皆具有足以支撐的柱體結構，故具有較強的結構強 度。且由於此結構的強凌較高，使得設計上可縮短每一 流道230之間的距離’由此可見，，此具有上下交錯的流道 230之壓電致動模組23除了結構強度高，可避免於加工時 產生破裂的情形，更可節省製作壓電致動模組23之材料 成本。 [00Γ7] 請參閱第四圖’其係為應用本案;較佳實施例之壓電致動 模組之壓電喷墨頭之製造方法流^酗。心第四圖所示， 本案之壓電喷墨頭於製造時，:¾透過如步驟S4〇~s44所述 之步驟，以製成一壓電致動模組23 ,由於此製程中的步 驟、材料及所需儀器等均與前述實施例相同，故不再贅 述。當形成壓電致動模組23之後，則可如步驟S45所述， 於壓電致動模組23之上壓電晶片231及下壓電晶片232之 第二表面231b、232b上分別設置上蓋板21及下蓋板22( 如第五圖所示）’於一些實施例中，當上壓電晶片231及 下壓電晶片232要與上蓋板21及下蓋板22接合時，亦可透 過一導電膠（未圖示）將之接合，但不以此為限，如此一 099130549 表單編號；A0101 第10頁/共31頁 0992053607-0 201212311 來，則可藉由該導電膠（未圖示）將上壓電晶片231及下壓 電晶片232的第一電極233及第二電極234分別引出至上 蓋板21及下蓋板22。 [0018] Ο ο [0019] 請同時參閱第四圖第五圖，當上蓋板21及下蓋板22與壓 電致動模組23對應組裝之後’則可如步驟S46所述，在壓 電致動模組之第一側面236處設置密封層25，當該密封層 25對應設置於第一側面236時’則可將壓電致動模組23上 的流道230末端加以密封，進而防止墨液滲漏。於一些實 施例中，密封層25係可為一密封膠’例如：矽膠，但不 以此為限。接著，再如步驟S47所示，於屋電致動模組23 的第二側面237處設置喷嘴片J4(如第五^所示），且在喷 嘴片24上具有複數個喷墨孔240.，；當喰嘴片24要與壓電致 動模組23對應組接時，係將複數個喷墨孔240對應於壓電 致動模組23上的複數個流道而組接，於本實施例中，係 透過一黏著介質，例如：結構膝，但不以此為限，將喷 嘴片24對應黏接於虔電致動模組23之上，藉此以形成如 第六圖所示之壓電喷聲頭之組合結構。 请同時參閱第五圖及第六圖，其係分別為應用本案較佳 實施例之壓電致動模組之壓電噴墨頭之分解結構示意圖 及組合結構示意@。如圖所示，本案之壓㈣墨頭2主要 由上蓋板21、下蓋板22、屬電致動模組23、喷嘴片24以 及密封層25所組成。其中，上蓋板21及下蓋板22係分別 對應於壓電致動模組23之上壤電晶片231之第二表面 議及下壓1晶片232之第二表面232b而設置，且上蓋 板21及下蓋板22分別具有第三表面2H、220及第四表面 099130549 表單編號A0101 第11頁/共31 0992053607-0 201212311 211、 221，且在第三表面210、220上分別具有入墨孔 212、 222，在第四表面211、221上則分別具有墨液導流 歧道213、223。入墨孔212及222之一端係分別與入墨流 道26、27連接，另一端則與墨液導流歧道213、223連接 。s壓電喷墨頭2要噴出墨液時，係由入墨流道2 6、2 7將 墨液導入上、下蓋板21 ' 22内，由上、下蓋板21、22之 入墨孔212、222而流至墨液導流歧道213、223，再由墨 液導流歧道213、223將墨液均勻地導流至壓電致動模組 23上之流道230内’並順沿流道230而流至噴墨孔240， 再透過壓電致動模組23之致翁，以挂制墨液由特定之喷 墨孔2 4 0喷出。 [0020]請同時參閱第七圖A、B，其分別係為應用本案較佳實施 例之壓電致動模組之壓電喷墨頭剖面結構示意圖以及其 作動示意圖。如第七圖A所示’其中壓電致動模組23之流 道230a之開口 230b係為設置於上壓電晶片231之上，且 流道230a係與開口 230d設置於下壓電晶片232之流道 230c交錯設置，因此，如圖所示，每一流道230無論在其 位於上壓電晶片231的基部230e，或是位於下壓電晶片 232的基部2 30f處，均可獲得良好的支撐。如此一來，當 壓電喷墨頭2之上、下壓電晶片231及232上的第一電極 233及第二電極234產生一電場時，係可使流道230兩側 的側牆上產生不同正、負電壓值，藉由此不同的正、負 電壓值，則可進而使流道230產生不同的形變。舉例來說 ，如第七圖B所示，當設置於中央的流道230c之左右兩侧 係分別具有一正、負電壓值’因而促使流道230c產生形 099130549 表單編號A0101 第12頁/共31頁 0992053607-0 201212311 變而擴張，並擠壓到其兩側之流道230a，由於流道230a 的另一側係為接地端’該接地端側並未產生形變，而鄰 近於擴張流道230c之一側則受到擠壓’故流道230a會因 該擠壓之形變而促使其中之墨液自流道230a末端的喷墨 孔240而噴出。至於產生擴張形變的流道230c，則因擴張 形變之吸引力，會促使墨液自墨液導流歧道223(如第五 圖所示）流入流道230c中。由此可見，壓電喷墨頭2係可 ' 透過壓電致動模組23之電場變化’進而使複數個流道230 產生形變或是不變，以控制墨液喷出喷墨孔240之外或是 〇 填入通道230之中’以完成壓電噴墨頭2之喷墨作業。 [0021] 綜上所述，本案之壓電致動模組及其所適用之壓電喷墨 頭之製造方法主要係藉由於壓電致動模組進行上、下二 次錯位之等間距切割，以形成複數個上下開口交錯設置 之流道，故可增強壓電致動模組之結構強度，且由於其 結構支撐力較高，使得流道設計上更可縮減流道之間的 距離’進而可減少慶電致動模組之體積及所需之材料， Q 俾具有可節省成本、且結構較為穩固、不易破裂等優點 。由於上述優點係為習知技術所不及者，故本案之壓電 致動模組及其所適用之壓電喷墨頭之製造方法極具產業 價值，爱依法提出申請。 [0022] 本案得由熟習此技術之人士任施匠思而為諸般修飾，然 皆不脫如附申請專利範圍所欲保護者。 【圖式簡單說明】 [0023] 第一圖A :其係為習知壓電喷墨頭之壓電致動模組之結構 示意圖。 099130549 表單編號A0101 第13頁/共31頁 0992053607-0 201212311 [0024] 第一圖B :其係為習知壓電致動模組之作動示意圖。 [0025] 第二圖：其係為本案較佳實施例之壓電致動模組之製造 方法流程圖。 [0026] 第三圖A :其係為本案較佳實施例之壓電致動模組之分解 結構示意圖。 [0027] 第三圖B :其係為本案較佳實施例之壓電致動模組之組合 結構示意圖。 [0028] 第三圖C :其係為本案較佳實施例之壓電致動模組之上壓 電晶片切割後之結構示意圖。 [0029] 第三圖D :其係為本案較佳實施例之壓電致動模組之上、 下壓電晶片切割後之結構示意圖。 [0030] 第四圖：其係為應用本案較佳實施例之壓電致動模組之 壓電喷墨頭之製造方法流程圖。 [0031] 第五圖：其係分別為應用本案較佳實施例之壓電致動模 組之壓電喷墨頭之分解結構示意圖。 [0032] 第六圖：其係分別為應用本案較佳實施例之壓電致動模 組之壓電喷墨頭之組合結構示意圖。 [0033] 第七圖A ··其分別係為應用本案較佳實施例之壓電致動模 組之壓電喷墨頭剖面結構示意圖。 [0034] 第七圖B :其分別係為應用本案較佳實施例之壓電致動模 組之壓電喷墨頭之作動示意圖。 【主要元件符號說明】 099130549 表單編號A0101 第14頁/共31頁 0992053607-0 201212311Form No. A010I Page 7 of 31 0992053607-0 201212311 The wafer 232 is ground to a desired thickness. In some embodiments, the thickness of the upper piezoelectric wafer 231 and the lower piezoelectric wafer 232 is preferably 500 μm. But not limited to this. [0013] Referring to FIG. 2 and FIG. 3A again, as shown in step S31, after the upper piezoelectric wafer 231 and the lower piezoelectric wafer 232 are formed, the upper piezoelectric wafer 231 and the lower piezoelectric wafer 232 are subsequently formed. A first electrode 233 and a second electrode 234 are formed on the first surfaces 231a and 232a, respectively. In some embodiments, the process of forming the first electrode 233 and the second electrode 234 further includes forming a temporary electrode, but not limited thereto. The method is to firstly apply an electrode material, for example, a single The high-temperature silver-palladium adhesive is applied to the first surface 231a and 232a of the upper piezoelectric wafer 231 and the lower piezoelectric wafer 232, and then fired through a high temperature, for example, 6〇〇°. The high temperature of C is sent to the high temperature insulating oil sump, and a voltage, for example, a voltage of 3 V/#m is applied to perform polarization for 10 minutes, and further to the upper piezoelectric wafer 231 and the lower piezoelectric wafer 232. A temporary electrode (not shown) is formed on the first surfaces 231a and 232a, and then the temporary electrode is removed by grinding. Then, another electrode material, for example, a gold chromium (Au/Cr) material, is lifted off by metal, but not limited thereto, and is formed on the upper piezoelectric wafer 231 and under the vapor deposition. The first surfaces 231a and 232a of the piezoelectric wafer 232 are formed thereon to form the first electrode 233 and the second electrode 234. [0014] In other embodiments, a cutting instrument, such as a wafer dicing blade, may be re-transmitted, but not limited thereto, the upper piezoelectric wafer 231 having the first electrode 233 and the second electrode 234 and the lower portion Piezoelectric wafer 232 is cut to the specific dimensions required. The size is preferably 711111^2〇111111/0.5111111, but not limited to 099130549 Form No. A0101 Page 8/31 Page 0992053607-0 201212311, which can be changed according to the actual application situation. . After the upper piezoelectric wafer 231 and the lower piezoelectric wafer 232 have been cut into a specific size, the first surface 231 disposed on the upper piezoelectric wafer 231 and the lower piezoelectric wafer 232 can be transmitted through the conductive layer 235 as shown in step S32. The first electrode 233 and the second electrode 234 of a and 232a are bonded to each other, and in some embodiments, the conductive layer 235 is bonded to the first electrode 233 and the second electrode 234 by a screen printing technique, but not To this end, the upper piezoelectric wafer 231 and the lower piezoelectric wafer 23 2 can be associated with each other, and a neon structure of the upper and lower piezoelectric wafers 231 and 232 as shown in FIG. Moreover, in the embodiment, the conductive layer 235 can be a conductive paste, but is not limited thereto. Referring to the second figure and the third figure c at the same time, the third figure is a schematic diagram of the y structure after the piezoelectric wafer is cut on the piezoelectric actuator module of the preferred embodiment of the present invention, as shown in the first figure. After the steps of correspondingly connecting the upper and lower piezoelectric wafers 231 and 232 are completed, the cutting device is passed through, for example, a wafer cutting blade, but the upper piezoelectric wafer 231 is not limited thereto. The second surface 231b is cut '' and cut in a manner such that the fixed width and depth are equally spaced at a distance of the ,, and the plurality of streams extending from the upper piezoelectric wafer 231 to the lower waste wafer 232 are formed. The track M〇a, and the opening 230b of the plurality of flow paths 230a is disposed on the second surface 231b of the upper piezoelectric wafer 231. [0016] Next, as shown in step S34 of the second figure, the combined structure of the upper and lower piezoelectric wafers 231, 232 is reversed, and the second surface 232b of the lower piezoelectric wafer 232 is subjected to upper piezoelectric. The second surface 2311 of the wafer 231 is equally spaced and the second cutting of the misalignment is cut. The cutting fixture and the cutting method are similar to those of the previous embodiment, and therefore will not be described again. After the second cutting, 099130549, the form number ΑΟίοι page 9 / 31, 0992053607-0 201212311, a plurality of flow channels 230c extending from the lower piezoelectric wafer 232 to the upper piezoelectric wafer 23 may be formed, and the plurality of flows The opening 230d of the track 230c is disposed on the second surface 232b of the lower piezoelectric wafer 232. In this way, the piezoelectric actuation module 23 can have the flow passages 230 arranged in a plurality of openings 230b and 230d arranged in a vertical direction as shown in FIG. D, and the openings of the flow passages 230. 230b, 230d are respectively staggered on the second surfaces 231b, 232b of the upper piezoelectric wafer 231 and the lower piezoelectric wafer 232, instead of being disposed on the same piezoelectric wafer, so that for each flow channel 230, both sides thereof They all have a cylindrical structure enough to support, so they have strong structural strength. Moreover, due to the high strength of the structure, the distance between each flow channel 230 can be shortened by design. Thus, the piezoelectric actuator module 23 having the flow channels 230 staggered up and down has high structural strength. The situation of cracking during processing can be avoided, and the material cost of fabricating the piezoelectric actuator module 23 can be saved. [00Γ7] Please refer to the fourth figure' which is the application of the present invention; the manufacturing method of the piezoelectric ink-jet head of the piezoelectric actuator module of the preferred embodiment. As shown in the fourth figure of the heart, the piezoelectric ink jet head of the present invention is manufactured by: 3⁄4 through the steps as described in steps S4 to s44 to form a piezoelectric actuator module 23, due to the steps in the process. The materials, the required instruments, and the like are the same as those of the foregoing embodiments, and therefore will not be described again. After the piezoelectric actuator module 23 is formed, the second surface 231b, 232b of the piezoelectric wafer 231 and the lower piezoelectric wafer 232 are respectively disposed on the piezoelectric actuator module 23 as described in step S45. The cover plate 21 and the lower cover 22 (as shown in FIG. 5) are, in some embodiments, when the upper piezoelectric wafer 231 and the lower piezoelectric wafer 232 are to be joined to the upper cover 21 and the lower cover 22, It can be joined by a conductive adhesive (not shown), but not limited to this, such a 099130549 form number; A0101 page 10 / total 31 page 0992053607-0 201212311, then by the conductive adhesive (not The first electrode 233 and the second electrode 234 of the upper piezoelectric wafer 231 and the lower piezoelectric wafer 232 are respectively led out to the upper cover 21 and the lower cover 22 . [0018] Please refer to the fifth figure of the fourth figure at the same time, after the upper cover 21 and the lower cover 22 are assembled correspondingly to the piezoelectric actuation module 23, then the pressure can be as described in step S46. A sealing layer 25 is disposed on the first side 236 of the electrically actuated module. When the sealing layer 25 is disposed on the first side 236, the end of the flow channel 230 on the piezoelectric actuator module 23 can be sealed. Prevent ink leakage. In some embodiments, the sealing layer 25 can be a sealant, such as silicone, but is not limited thereto. Then, as shown in step S47, a nozzle piece J4 is disposed at the second side surface 237 of the house electric actuation module 23 (as shown in FIG. 5), and a plurality of ink ejection holes 240 are formed on the nozzle piece 24. When the nozzle piece 24 is to be associated with the piezoelectric actuator module 23, a plurality of ink ejection holes 240 are assembled corresponding to the plurality of flow channels on the piezoelectric actuator module 23, In the embodiment, the nozzle piece 24 is correspondingly bonded to the electric actuation module 23 through an adhesive medium, such as a structural knee, but not limited thereto, thereby forming a sixth embodiment as shown in FIG. The combined structure of the piezoelectric blast head. Please refer to FIG. 5 and FIG. 6 simultaneously, which are schematic diagrams of the exploded structure of the piezoelectric inkjet head and the combined structure of the piezoelectric actuator module of the preferred embodiment of the present invention. As shown in the figure, the pressure (4) ink head 2 of the present invention is mainly composed of an upper cover 21, a lower cover 22, an electric actuation module 23, a nozzle piece 24, and a sealing layer 25. The upper cover 21 and the lower cover 22 are respectively disposed corresponding to the second surface of the ferroelectric wafer 231 on the piezoelectric actuator module 23 and the second surface 232b of the wafer 232. The plate 21 and the lower cover 22 respectively have a third surface 2H, 220 and a fourth surface 099130549 Form No. A0101 Page 11 / 31 0992053607-0 201212311 211, 221, and have ink inlet holes on the third surface 210, 220 respectively 212, 222, on the fourth surface 211, 221 respectively have ink guiding channels 213, 223. One end of the ink inlet holes 212 and 222 is connected to the ink feed channels 26, 27, respectively, and the other end is connected to the ink flow guiding channels 213, 223. When the s piezoelectric inkjet head 2 is to eject ink, the ink is introduced into the upper and lower covers 21'22 by the ink feed channels 26, 27, and the ink inlet holes 212 of the upper and lower covers 21, 22 are provided. And 222 flows to the ink flow guiding channels 213, 223, and then the ink guiding channels 213, 223 uniformly conduct the ink into the flow channel 230 on the piezoelectric actuator module 23. The flow path 230 flows to the ink ejection orifice 240, and then passes through the piezoelectric actuator module 23 to eject the ink from the specific ink ejection orifice 240. [0020] Please also refer to the seventh embodiment A and B, which are respectively a schematic cross-sectional structural view of a piezoelectric inkjet head using the piezoelectric actuator module of the preferred embodiment of the present invention and an actuation diagram thereof. As shown in FIG. 7A, the opening 230b of the flow channel 230a of the piezoelectric actuator module 23 is disposed on the upper piezoelectric wafer 231, and the flow channel 230a and the opening 230d are disposed on the lower piezoelectric wafer 232. The flow paths 230c are staggered, and therefore, as shown, each flow path 230 can be obtained either at its base 230e on the upper piezoelectric wafer 231 or at the base 2 30f of the lower piezoelectric wafer 232. support. In this way, when the first electrode 233 and the second electrode 234 on the piezoelectric inkjet head 2 and the lower piezoelectric wafers 231 and 232 generate an electric field, the side walls on both sides of the flow channel 230 can be generated. Different positive and negative voltage values, by which different positive and negative voltage values, can further cause different deformation of the flow channel 230. For example, as shown in FIG. 7B, when the left and right sides of the flow path 230c disposed at the center have a positive and negative voltage value respectively, respectively, the flow path 230c is caused to generate a shape of 099130549. Form No. A0101 Page 12 / Total Page 31 0992053607-0 201212311 expands and expands to the flow channel 230a on both sides thereof, since the other side of the flow channel 230a is the ground end 'the ground end side is not deformed, but adjacent to the expansion flow channel One side of the 230c is pressed. Therefore, the flow path 230a causes the ink therein to be ejected from the ink ejection hole 240 at the end of the flow path 230a due to the deformation of the extrusion. As for the flow path 230c which causes the expansion deformation, the ink is caused to flow into the flow path 230c from the ink flow guiding channel 223 (as shown in Fig. 5) due to the attraction force of the expansion deformation. It can be seen that the piezoelectric inkjet head 2 can 'transform the electric field of the piezoelectric actuator module 23' to further deform or change the plurality of flow channels 230 to control the ink to be ejected from the ink ejection orifice 240. Alternatively, the crucible is filled in the channel 230 to complete the inkjet operation of the piezoelectric inkjet head 2. [0021] In summary, the piezoelectric actuator module of the present invention and the method for manufacturing the piezoelectric inkjet head thereof are mainly used for the equal-distance cutting of the upper and lower secondary displacements by the piezoelectric actuator module. In order to form a plurality of flow passages which are alternately arranged in the upper and lower openings, the structural strength of the piezoelectric actuation module can be enhanced, and the distance between the flow passages can be reduced by the flow passage design due to the high structural support force. In addition, the volume and the required materials of the Qingdian actuation module can be reduced, and the Q 俾 has the advantages of cost saving, relatively stable structure and not easy to be broken. Since the above advantages are not in the prior art, the piezoelectric actuator module of the present invention and the manufacturing method of the piezoelectric inkjet head to which it is applied are of great industrial value, and the application is made according to law. [0022] The present invention has been modified by those skilled in the art, and is not intended to be protected as claimed. BRIEF DESCRIPTION OF THE DRAWINGS [0023] Fig. A is a schematic view showing the structure of a piezoelectric actuator module of a conventional piezoelectric ink jet head. 099130549 Form No. A0101 Page 13 of 31 0992053607-0 201212311 [0024] Figure B is a schematic diagram of the operation of a conventional piezoelectric actuator module. [0025] Figure 2 is a flow chart showing the manufacturing method of the piezoelectric actuator module of the preferred embodiment of the present invention. FIG. 3 is a schematic exploded view of the piezoelectric actuator module of the preferred embodiment of the present invention. [0027] FIG. B is a schematic view showing the combined structure of the piezoelectric actuator module of the preferred embodiment of the present invention. [0028] FIG. C is a schematic structural view of the piezoelectric actuator module of the preferred embodiment of the present invention after the piezoelectric wafer is cut. [0029] FIG. D is a schematic structural view of the piezoelectric actuator module of the preferred embodiment of the present invention after the piezoelectric wafer is cut. [0030] FIG. 4 is a flow chart showing a method of manufacturing a piezoelectric ink jet head using the piezoelectric actuator module of the preferred embodiment of the present invention. [0031] Fig. 5 is a schematic exploded view showing the piezoelectric ink jet head of the piezoelectric actuator module of the preferred embodiment of the present invention. [0032] Fig. 6 is a schematic view showing the combined structure of piezoelectric ink jet heads of piezoelectric actuator modules of the preferred embodiment of the present invention. [0033] Fig. 7A is a schematic cross-sectional view showing a piezoelectric ink jet head of a piezoelectric actuator module of the preferred embodiment of the present invention. [0034] FIG. 7B is a schematic view showing the operation of the piezoelectric inkjet head of the piezoelectric actuator module of the preferred embodiment of the present invention. [Main component symbol description] 099130549 Form number A0101 Page 14 of 31 0992053607-0 201212311
LUU«jt)J 習知壓電致動模組：1 上壓電晶片：10、231 下壓電晶片：11、232 基部：110、230e、230f 電極：12 導電層：13、235 流道：14、141、142、143、230、230a、230c 開口 ： 140、230b、230d 壓電噴墨頭結構： 上蓋板：21 第三表面：210、220 第四表面：211、221 入墨孔：212、222 墨液導流歧道：213、223 下蓋板：22 壓電致動模組：23 第一表面：231a、232a ❹ 第二表面：231b、232b 第一電極：233 第二電極：234 第一側面：236 第二側面：237 喷嘴片：24 喷墨孔：240 密封層：25 入墨流道：2 6、2 7 099130549 表單編號A0101 第15頁/共31頁 0992053607-0 201212311 壓電致動模組之製造步驟：S30〜S34 壓電喷墨頭之製造步驟：S40-S46 099130549 表單編號A0101 第16頁/共31頁 0992053607-0LUU«jt)J Conventional Piezo Actuating Module: 1 Upper Piezo: 10, 231 Lower Piezo: 11, 232 Base: 110, 230e, 230f Electrode: 12 Conductive Layer: 13, 235 Flow Path: 14, 141, 142, 143, 230, 230a, 230c Opening: 140, 230b, 230d Piezoelectric inkjet head structure: Upper cover: 21 Third surface: 210, 220 Fourth surface: 211, 221 Ink hole: 212 222 ink guiding manifold: 213, 223 lower cover: 22 piezoelectric actuator module: 23 first surface: 231a, 232a ❹ second surface: 231b, 232b first electrode: 233 second electrode: 234 First side: 236 Second side: 237 Nozzle piece: 24 Ink hole: 240 Sealing layer: 25 Ink flow path: 2 6, 2 7 099130549 Form number A0101 Page 15 / Total 31 page 0992053607-0 201212311 Piezoelectric Manufacturing steps of the movable module: S30~S34 Piezoelectric inkjet head manufacturing steps: S40-S46 099130549 Form No. A0101 Page 16 of 31 0992053607-0