201211875 六、發明說明： 【發明所屬之技術領域】 本發明係有關於一種電阻式觸控面板導電薄膜與導 電元件的結合結構與製造方法，尤指一種利用雙面膠框配 合二次熱加壓之方式來進行導電薄膜與導電元件之膠合 的結構與製造方法者。 【先前技術】 # 按，電阻式觸控面板的設計，是在兩層鍍有導電能力 的導電薄膜l(ITO Film)之間，或是一層導電薄膜 l(ITO Film)與一片塗有導電材料的導電玻璃基板χΙΤ〇 Glass)的中間有微型點支撐而產生空氣間隙。當手指（或 筆尖）將兩片傳導層壓在一起時，藉由手指或觸控筆去觸 碰導電薄膜l(ITO Film)形成凹陷然後與下層的導電 玻璃基板2 (ITOGlass)接觸而產生電壓的變化，再經由 A/D控制器轉為數位訊號讓電腦做運算處理取得^^^抽 • 位置，進而達到定位的目地。目前有4線、5線、6線和 8線的版本，可將資料傳輸至微控制器來執行。 前段所述之電阻式觸控面板的製造，習用技術主要在 於將上層之導電薄膜l(IT〇 Film)與下層之導電玻璃 基板2 (ITOGlass)接合前，分別在其周緣塗佈設置一層 黏膠框11、21 (如囷一 B所示）後再進行接合作業，但 因點膠框11、21本體為水溶性，故須在設置黏穋框u、 21後，需再進行烘烤作業（如圖一 c所示）將其表面固 化成半凝固狀態以增加其黏著力，直到其黏著力到達一定 201211875 程度之後再進行膠合固定的工作（如圖一D所示）。但因 該黏膠框11、21在前段之加工烘烤過程中，有部分之黏 膠框11、21會因為烘烤製程中產生局部完全固化現象， 以致造成在上層之導電薄膜l(ITO Film)與下層之導 電玻璃基板2 (ITO Glass)接合後，在先前烘烤製程中已 經產生局部完全固化現象之黏膠框會出現接合處有脫開 之情形發生’導致上層之導電薄膜l(IT〇 Film)與下層 之導電玻璃基板2 (或是導電薄膜）之間無法完全密合， 以致原本做為空氣間隙的空氣由該未完全密合處流失，進 一步使得該空氣間隙無法有效維持上層導電薄膜 l(ITO Film)與下層之導電玻璃基板2 (或是導電薄膜） 間一定的間隔距離，以致造成產品出現不良現象，而導致 增加製造成本。 【發明内容】 本發明之主要目的，係在於提供一種電阻式觸控面板 導電薄膜與導電元件的結合結構，藉由利用雙面膠框來取 代傳統水性黏謬框，藉以大幅提升導電薄膜與導電元件結 合之平整與良率者。 本發明之次要目的，係在於提供一種電阻式觸控面板 導電薄膜與導電元件的結合結構與製造方法，藉由針對已 經結合完成之導電薄膜與導電元件進行第二次的加熱加 壓，可以增加其二者結合之密合性者。 本發明之再一目的，係在於提供一種電阻式觸控面板 導電薄膜與導電元件的結合結構與製造方法，其中藉由針 201211875 對已經結合完成之導電薄膜與導電元件進行烘烤，可將位 於導電薄膜與導電元件中的空氣層，因為高溫而將上層導 電元件（導電薄膜）往四周邊緣掩壓，進而獲得整平之效 果者。 【實施方式】 為了能更清楚地描述本發明所提出之電阻式觸控面 板導電薄膜與導電元件的結合結構與製造方法，以下將配 _ 合圖示詳細說明之。請參閱圖一所示，其係為本發明電阻 式觸控面板導電薄膜與導電元件的結合結構的立體外觀 圖。本發明係提供一種電阻式觸控面板導電薄膜與導電元 件的結合結構與製造方法，其結構係由導電薄膜3、導電 元件4及一雙面固態膝框5所組成，其中該導電薄膜1 之一側設有導電電極31 ;而導電元件4係設置於導電薄 膜3上設有導電電極31之一側，且於該導電元件4靠近 導電薄膜3之一側設有導電電極41;另外雙面固態膠框5 • 係設於導電薄膜3與導電元件4之間，藉以達到將導電薄 膜3與導電元件4二者膠合固定之目的者》 藉由前段所述之設計，本發明直接利用雙面固態 膠框5直接膠合導電薄膜3與導電元件4，取代傳統以水 性黏膠先分別塗佈於導電薄膜1與導電玻璃基板2上再經 過烘烤步驟令其上黏膠框11、21的黏膠乾燥到具有一定 的黏著程度之後再進行貼合的步驟，不僅快速方便，且可 以有效解決因為水性黏膠在烘烤過程中難以保持烘乾效 果的一致性所產生局部完全固化導致接合效果不佳之缺 201211875 失者。 本發明於前述之結構中，該雙面固態膠框5係為一雙 面膠者。 前述之結構中’該導電薄膜3與導電元件4隨著 各家製造商家的不同以及產品的不同而會有所差異，其中 位於上層負責提供使用者觸壓之導電薄膜3，係為具有導 電電極31之導電薄膜3 »而下層導電元件4，除了可以是 表面設有導電電極41之導電玻璃基板之外，其也可以是 底下利用光學膠（OCA)貼有強化玻璃基板或塑膠基板 之導電薄膜者。 請繼續參閱圖三及圖四’其係為本發明電阻式觸控面 板導電薄膜與導電元件的結合結構之製造方法的流程示 意圊及外觀示意囷，該方法主要係先將一具有至少一個貫 穿孔61的塑膠片61固定於真空機台7上吸附固定（步称 81)，然後將導電薄膜3放置於塑膠片6的上方，令真空 機台7可以透過塑膠片6上的貫穿孔61將該導電薄膜3 吸附固定於其上，同時令該導電薄膜3貼著塑膠片6上的 貫穿孔61下凹形成一凹面32 (步驟82)(如囷七所示）。 接著將雙面固態膝框5固定於導電薄膜3凹面32外緣之 表面（步驟83)，然後將導電元件4放置於設有雙面固態 膠框5之導電薄膜3上加壓（步驟84)完成膠合之工作， 令導電薄膜3(ITO Film)與導電元件4之間可以藉由密封 於其内之空氣形成一空氣層藉以維持該二者間一定的間 隔距離，最後將膠合完成後之導電薄膜3與導電元件4 針對兩者之谬合處進行加熱加壓（步驟85)即告完成。 201211875 前段所述之方法中，該而導電元件4,除了可以是表 面設有導電電極之導電玻璃基板之外，其也可以是同樣設 有電極的導電薄膜或底下設有塑膠基板之導電薄膜。另外 該步驟81上所提供塑膠# 6上之貫穿孔61，其大小係為 該面板所預設之有效螢幕尺寸者。 本發明於前述之方法中，該步驟85之加熱加壓步驟 更包括以下之步驟，提供一加熱加堡機台(步驟86), 將一其上具有至少一貫穿孔91之耐熱緩衝墊9放置於加 熱加壓機台10上（步驟87)(如圓五及圖六所示），將璆 合完成後之導電薄膜3與導電元件4以導電薄膜3朝下之 方式放置於該耐熱緩衝塾9上（步称88)然後進行加熱 加壓（步驟89)者。 前段所述之耐熱緩衝墊9，其係由一具有耐熱之緩衝 材料製成，藉以提供該導電薄膜3與導電元件4在加熱加 壓的過程中可以有良好的包覆與支撐，且該耐熱緩衝墊9 上所設置之貫穿孔91’其大小與步驟81中塑膠板6上所 設的貫穿孔61大小相同，但耐熱緩衝墊9的厚度，則是 大於步称81中塑膠板6之厚度，令該膠合完成後之導電 薄膜3與導電元件4以導電薄膜3朝下之方式放置於該耐 熱緩衝塾9上時，只會針對其外圍設有雙面固態膠框5 的部份進行加熱與加壓的工作，透過加熱可使勝層軟化， 同時藉由耐熱緩衝墊9所提供良好的彈性與支撐能力，可 以令導電薄膜3與導電元件4間固態膠框5上的膠分布更 為均勻，獲得更佳的密合效果。 又本發明於前段所述之耐熱緩衝墊9進一步可以先 7 201211875 固定在一塑膠片η上（如圖八所示），然後透過加熱加壓 機台ίο上的真空吸附裝置予以吸附固定，透過前述塑膠 片ίο的設置可以令耐熱緩衝墊9放置於加熱加壓機台ίο 上時的位置更加精準且不易變形者。 又本發明於前段所述之耐熱緩衝墊9，其係以導熱橡 膠材質製成為較佳，藉由該導熱橡膠之高導熱特性，令操 作者可以更容易控制加熱之溫度，同時也可以用更省電環 保的方式進行加熱加壓的工作者。 又本發明於前述之方法中，當導電元件4為導電薄膜 時，其在與另一導電薄膜膠合固定後，可以利用光學膠 (OCA)與強化玻璃作一結合固定者。 又本發明於前述之方法中，在經過二次加熱加壓的過 程（步驟85)令導電薄膜3與導電元件4更加緊密結合 之後，再將其進行烘烤（步驟90)(如圖九所示），藉由 該烘烤的步驟使位於導電薄膜3與導電元件4間的空氣層 受熱而向四周均勻擴散掛靨，藉以獲得更平整之表面者 以上所述係利用較佳實施例詳細說明本發明，而非限 制本發明之範圍》大凡熟知此類技藝人士皆能明瞭，適當 而作些微的改變及調整，例如:導電薄膜與導電元件本身 材質之變化等等，仍將不失本發明之要義所在，亦不脫離 本發明之精神和範圍。 綜上所述，本發明藉由提供一種直接利用雙面固態膠 框直接膠合上、下二個導電元件，取代傳統以水性黏膠先 分別塗佈上、下二個導電元件上再經過烘烤步驟令其上的 黏膠乾燥到具有一定的黏著程度之後再進行貼合的繁複 201211875 步驟，不僅更為快速方便，且可以有效解決因為水性黏膠 在烘烤過程中難以保持烘乾效果的一致性所產生局部完 全固化導致接合效果不佳之缺失’另一方面透過二次加熱 加壓的步驟以及使用導熱橡膝做為加壓緩衝墊的方式，可 以讓已經膠合固定的上、下二個導電元件間的結合更為緊 密。同時透過烘烤的步驟則可以讓其獲得更為平整之效果 者。 • 【圓式簡單說明】 圖一 A〜D係習用觸控面板中導電薄膜與導電玻璃基 板膠合過程之外觀示意圖❶ 圖二係本發明之立體外觀分解示意圓。 圖三係本發明電阻式觸控面板導電薄膜與導電元件 的結合結構之製造方法的流程示意圖。 囷四係本發明電阻式觸控面板導電薄膜與導電元件 的結合結構與機台之外觀示意圖。 • 圖五係囷三步驟（e)中之更進一步的製造流程示意 圖。 囷六係本發明於進行二次加熱加壓之外觀示意囫。 圖七係本發明於進行初次吸附加壓之剖面示意囷。 圊八係本發明於進行二次加熱加麼另一實施例之剖 面示意圓。 圖九係本發明進一步包括烘烤步驟之流程示意囫。 201211875 【主要元件符號說明】 1〜導電薄膜 11〜黏膠框 2〜導電玻璃基板 21〜黏膠框 3〜導電薄膜 31〜導電電極 32〜凹面 4〜導電元件 41〜導電電極 5〜雙面固態膠框 6-塑膠片 61〜貫穿孔 7〜真空機台 81〜89本發明之製造流程 9〜耐熱緩衝墊 91〜貫穿孔 10-加熱加壓機台 11〜塑膠片201211875 VI. Description of the Invention: [Technical Field] The present invention relates to a combined structure and manufacturing method of a conductive touch panel conductive film and a conductive member, and more particularly to a double-sided plastic frame combined with secondary heat pressurization The structure and manufacturing method for bonding the conductive film and the conductive member. [Prior Art] # Press, the design of the resistive touch panel is between two layers of conductive film 1 (ITO film), or a layer of conductive film l (ITO film) and a piece of conductive material In the middle of the conductive glass substrate χΙΤ〇Glass) there is a micro point support to create an air gap. When a finger (or a pen tip) laminates two pieces of conductive together, a finger or a stylus touches the conductive film 1 (ITO film) to form a recess and then contacts the underlying conductive glass substrate 2 (ITOGlass) to generate a voltage. The change is then converted to a digital signal by the A/D controller, allowing the computer to perform arithmetic processing to obtain the location of the ^^^ pumping, thereby achieving the purpose of positioning. There are currently 4-wire, 5-wire, 6-wire and 8-wire versions that can be transferred to the microcontroller for execution. In the manufacture of the resistive touch panel described in the preceding paragraph, the conventional technique is mainly to apply a layer of adhesive on the periphery of the conductive film 1 (IT〇Film) of the upper layer and the conductive glass substrate 2 (ITOGlass) of the lower layer. After the frame 11 and 21 (as shown in Fig. 1B), the bonding operation is performed. However, since the bodies of the dispensing frames 11 and 21 are water-soluble, it is necessary to perform the baking operation after the adhesive frames u and 21 are disposed ( As shown in Figure 1c, the surface is solidified into a semi-solidified state to increase its adhesion until the adhesion reaches a certain degree of 201211875 and then the glue is fixed (as shown in Figure 1D). However, during the processing and baking process of the adhesive frames 11, 21, some of the adhesive frames 11, 21 may be partially solidified due to the baking process, resulting in the conductive film l (ITO film) in the upper layer. After bonding with the underlying conductive glass substrate 2 (ITO Glass), the adhesive frame which has been partially cured in the previous baking process may be disengaged at the joint, resulting in the upper conductive film l (IT) 〇Film) and the underlying conductive glass substrate 2 (or conductive film) cannot be completely adhered together, so that the air originally used as the air gap is lost by the incomplete adhesion, further making the air gap unable to effectively maintain the upper layer conductive A certain distance between the ITO film and the underlying conductive glass substrate 2 (or the conductive film) causes a defect in the product, resulting in an increase in manufacturing cost. SUMMARY OF THE INVENTION The main object of the present invention is to provide a combination structure of a conductive touch panel conductive film and a conductive member, thereby replacing the conventional water-based adhesive frame with a double-sided plastic frame, thereby greatly improving the conductive film and the conductive film. The combination of component flatness and yield. A secondary object of the present invention is to provide a bonding structure and a manufacturing method of a conductive film of a resistive touch panel and a conductive element, which can be heated and pressurized for the second time by the conductive film and the conductive element which have been combined. Increase the closeness of the combination of the two. A further object of the present invention is to provide a bonding structure and a manufacturing method of a conductive film of a resistive touch panel and a conductive member, wherein the conductive film and the conductive member which have been combined can be baked by the needle 201211875, and can be located The conductive film and the air layer in the conductive element, because of the high temperature, the upper conductive member (conductive film) is masked to the peripheral edges, thereby obtaining the effect of leveling. [Embodiment] In order to more clearly describe the combined structure and manufacturing method of the conductive touch panel conductive film and the conductive member proposed by the present invention, a detailed description will be given below. Referring to FIG. 1, it is a perspective view showing a combination structure of a conductive film of a resistive touch panel and a conductive member of the present invention. The invention provides a bonding structure and a manufacturing method of a conductive film of a resistive touch panel and a conductive component, wherein the structure is composed of a conductive film 3, a conductive component 4 and a double-sided solid knee frame 5, wherein the conductive film 1 The conductive electrode 4 is disposed on one side of the conductive film 3, and one side of the conductive electrode 31 is disposed on the conductive film 3, and the conductive electrode 41 is disposed on one side of the conductive element 4 near the conductive film 3; The solid frame 5 is disposed between the conductive film 3 and the conductive member 4, thereby achieving the purpose of bonding and fixing the conductive film 3 and the conductive member 4. With the design described in the preceding paragraph, the present invention directly utilizes the double-sided The solid plastic frame 5 directly bonds the conductive film 3 and the conductive member 4, instead of the conventional water-based adhesive, first coated on the conductive film 1 and the conductive glass substrate 2, and then subjected to a baking step to bond the adhesive frames 11, 21 thereon. The step of drying the glue to a certain degree of adhesion and then laminating is not only quick and convenient, but also can effectively solve the problem that the water-based adhesive is difficult to maintain the consistency of the drying effect during the baking process. Complete curing of the part leads to poor joint effect 201211875 Lost. In the above structure, the double-sided solid plastic frame 5 is a double-sided glue. In the foregoing structure, the conductive film 3 and the conductive member 4 may differ depending on the manufacturer and the product, and the conductive film 3 located on the upper layer for providing the user's touch pressure has a conductive electrode. The conductive film 3 of 31 and the lower conductive member 4 may be a conductive glass substrate having a conductive electrode 41 on its surface, or an conductive film with a reinforced glass substrate or a plastic substrate under the optical adhesive (OCA). By. Please refer to FIG. 3 and FIG. 4 ' which are schematic diagrams and schematic diagrams of the manufacturing method of the combined structure of the conductive film and the conductive component of the resistive touch panel of the present invention. The method mainly has at least one through The plastic sheet 61 of the hole 61 is fixed to the vacuum machine table 7 for adsorption and fixing (step 81), and then the conductive film 3 is placed above the plastic sheet 6, so that the vacuum machine table 7 can pass through the through hole 61 in the plastic sheet 6. The conductive film 3 is adsorbed and fixed thereon, and the conductive film 3 is recessed against the through hole 61 of the plastic sheet 6 to form a concave surface 32 (step 82) (as shown in FIG. 7). Next, the double-sided solid knee frame 5 is fixed on the surface of the outer edge of the concave surface 32 of the conductive film 3 (step 83), and then the conductive member 4 is placed on the conductive film 3 provided with the double-sided solid plastic frame 5 (step 84). The bonding work is completed, so that an air layer can be formed between the conductive film 3 and the conductive member 4 by the air sealed therein to maintain a certain distance between the two, and finally the conductive after the bonding is completed. The film 3 and the conductive member 4 are heated and pressurized (step 85) for the fusion of the two. In the method described in the preceding paragraph of 201211875, the conductive member 4 may be a conductive film having an electrode or a conductive film provided with a plastic substrate, in addition to a conductive glass substrate having a conductive electrode on its surface. In addition, the through hole 61 on the plastic #6 provided in the step 81 is sized to be the effective screen size preset by the panel. In the foregoing method, the heating and pressurizing step of the step 85 further comprises the steps of: providing a heating station (step 86), placing a heat-resistant cushion 9 having at least a uniform perforation 91 thereon. The heating press table 10 is heated (step 87) (as shown in FIG. 5 and FIG. 6), and the conductive film 3 and the conductive member 4 after the bonding is completed are placed on the heat-resistant buffer 朝 9 with the conductive film 3 facing downward. The upper (step 88) is then heated and pressurized (step 89). The heat-resistant cushion 9 described in the preceding paragraph is made of a heat-resistant cushioning material, so that the conductive film 3 and the conductive member 4 can be well coated and supported during heating and pressing, and the heat resistance is good. The through hole 91' provided on the cushion 9 has the same size as the through hole 61 provided in the plastic plate 6 in the step 81, but the thickness of the heat resistant cushion 9 is larger than the thickness of the plastic plate 6 in the step 81. When the conductive film 3 and the conductive member 4 after the completion of the bonding are placed on the heat-resistant buffer 9 with the conductive film 3 facing downward, only the portion of the double-sided solid frame 5 having the double-sided solid frame 5 is heated. With the work of pressurization, the win layer can be softened by heating, and the adhesive distribution on the solid frame 5 between the conductive film 3 and the conductive member 4 can be further improved by the good elasticity and support ability provided by the heat-resistant cushion 9. Evenly, for better adhesion. Further, the heat-resistant cushion 9 of the present invention can be further fixed on a plastic sheet η (shown in FIG. 8) by 7 201211875, and then adsorbed and fixed through a vacuum adsorption device on the heating and pressing machine ίο. The arrangement of the aforementioned plastic sheet ίο can make the position of the heat-resistant cushion 9 on the heating and pressing machine ίο more precise and less deformable. Further, the heat-resistant cushion 9 of the present invention is preferably made of a heat-conductive rubber material. The high thermal conductivity of the heat-conductive rubber makes it easier for the operator to control the heating temperature, and can also be used more. A person who performs heating and pressurization in a way that saves electricity and is environmentally friendly. Further, in the above method, when the conductive member 4 is a conductive film, after being bonded and fixed to another conductive film, the optical adhesive (OCA) and the tempered glass can be used as a bonding fixture. Further, in the above method, in the process of secondary heating and pressing (step 85), the conductive film 3 is more closely bonded to the conductive member 4, and then baked (step 90) (Fig. 9) In the step of baking, the air layer between the conductive film 3 and the conductive member 4 is heated to uniformly spread the hanging layer to the periphery, so as to obtain a more flat surface, the above embodiment is described in detail by using the preferred embodiment. The present invention, without being limited to the scope of the present invention, will be apparent to those skilled in the art, and modifications and adjustments may be made as appropriate, such as changes in the conductive film and the material of the conductive element itself, etc., without departing from the invention. The essence of the invention is not deviated from the spirit and scope of the invention. In summary, the present invention provides a direct use of a double-sided solid plastic frame to directly bond the upper and lower conductive members, instead of conventionally applying the upper and lower conductive members to the aqueous adhesive, and then baking them. The step of ordering the glue on the adhesive to a certain degree of adhesion and then laminating is not only faster and more convenient, but also can effectively solve the problem that the water-based adhesive is difficult to maintain the drying effect during the baking process. Partial complete curing caused by the lack of joint effect is not good. On the other hand, through the step of secondary heating and pressing, and using the thermal rubber knee as a pressure cushion, the upper and lower conductive materials that have been glued and fixed can be fixed. The combination between components is more compact. At the same time, through the baking step, you can get a more even effect. • [Circular Simple Description] Figure 1 A to D is a schematic view of the appearance of the process of bonding the conductive film to the conductive glass substrate in the conventional touch panel. Figure 2 is a schematic exploded perspective view of the present invention. Fig. 3 is a flow chart showing a manufacturing method of a structure in which a conductive film of a resistive touch panel of the present invention and a conductive member are combined. The fourth embodiment is a schematic diagram of the combined structure of the conductive film and the conductive member of the resistive touch panel of the present invention and the appearance of the machine. • Figure 5 is a schematic diagram of a further manufacturing process in step (e). The sixth embodiment of the present invention is shown in the appearance of secondary heating and pressurization. Figure 7 is a schematic illustration of the cross-section of the present invention for initial adsorption and pressurization. The present invention is a cross-sectional schematic circle of another embodiment for performing secondary heating. Figure 9 is a schematic flow diagram of the present invention further including a baking step. 201211875 [Description of main component symbols] 1 to conductive film 11 to adhesive frame 2 to conductive glass substrate 21 to adhesive frame 3 to conductive film 31 to conductive electrode 32 to concave surface 4 to conductive member 41 to conductive electrode 5 to double-sided solid state Plastic frame 6 - plastic sheet 61 ~ through hole 7 ~ vacuum table 81 - 89 manufacturing process of the present invention 9 ~ heat resistant cushion 91 ~ through hole 10 - heating press table 11 ~ plastic sheet