201210832 六、發明說明： 【發明所屬之技術領域】 本發明侧於-種金屬塑膠複合結構，特別是關於一種利用雷 射製程所形成的金屬塑膠複合結構。 【先前技術】 在電腦、汽車、家電、醫療用品或其他輕工業或重工業領域中， 常須將不同材質組合在-起，以形紅種元件或模組。例如，鍵盤 中的金屬鍵帽’其必須由下方的塑膠升降支撐裝置所支樓，因此兩 者之間需要有適當的結合技術，以提供更穩_—體化物件。習知 金屬鍵帽中_膠和金屬多_黏合劑的方式來結合，例如利用常 溫固化或者加油化_合劑。但使_合劑需要額外的黏合步 ，’較為麻煩’且不同材質_合劑所能承受的強度也不盡相同， 常造成產品結構上的缺失，加上採_合劑不糾低鍵帽厚度，不 利於鍵盤薄型化，因此業界都致力研究毋需黏合劑的接合方式。 例如，美國專利us 20_274889公開了一種在紹合金上直接形 成熱塑性樹脂的方式。此方法的特徵在於先以化學侧的方式在金 屬的表面上形成凹凸不均自的孔穴(⑽，接著使帛—樹脂材料 配合射出成型㈣ection molding)的條件下滲入(inflltrate)凹凸不均勻 201210832 的孔穴中，滲人之後樹赌料隨即結晶化(erystaUizatiQn)，於是樹脂 材料便可與金屬表面直接結合，而不需要黏合劑的輔助。 然而，上述形成金職賴合材料的方式，也有若干問題需要克 服。首先’在金屬表面上形成的凹凸孔六，其直徑約在1〇〜8〇⑽之 間，孔穴相當狹小，因此所使用的樹脂材料必須是限制在高流動性 的材質’例如’聚醯胺(P〇lyamideresin)，才可能與金屬表面結合。 但目前聚酿胺的價格偏高’因此製程的成本也隨之升高。此外，習 知方法需㈣化學_，較林保’而且由於此方法係在金屬表二 上化學侧，因此僅能在表面處理步驟(例如陽極處理)之前操作， 否則會破壞其表面處理的外觀，故無形中_ 了製程步驟的彈性。 【發明内容】 本發明於是提供了-種金屬歸複合結構與其製作方法，適用 於各種樹脂材質，料任意搭配表面處理的步驟，而能製作出^固 而不需黏合劑的金屬塑膠複合結構。 “ 於本發明之-實施例中，係提供了一種金屬塑膠複合結構，其 包含有-金屬基材以及-樹脂層。金屬基材包含一第—表面與相對 第一表面的一第二表面，其中金屬基材上設有複數個穿孔，貫穿該 金屬基材，並連通第一表面及第二表面。樹脂層設於第一表面或第 二表面之至少-者’並且填入複數個穿孔，使樹脂層牢固的與金屬 201210832 基材結合。 於本發明之一實施例中’提供了另一種金屬塑膠複合結構，其 包含有一金屬基材以及一樹脂層。金屬基材包含一第一表面與相對 第一表面的一第二表面，其中金屬基材的第一表面上設有至少一凹 穴，以及複數個穿孔，位於該凹穴的底部。樹脂層設於第一表面或 第二表面之至少一者，並且填入凹穴及複數個穿孔，使樹脂層牢固 的與金屬基材結合。 於本發明又一實施例中，提供了一種金屬塑膠複合鍵帽結構， 其包含有一金屬基材以及一樹脂槽件。金屬基材包含一外表面與一 内表面’其巾金躲材上設有複數個穿孔，貫穿金屬紐，並連通 外表面及内表面，脂槽件設於内表面，且樹脂槽件包含有複數個 鉚合部位於複數個穿孔巾’使得樹賴件牢_與金屬基材結合。 本發明所提出之金屬塑膠複合結合以及其製造方法，係利用雷 射製程以在金祕材上形成穿孔，的大小可以視後續射出成型 之需求而作調整，並可搭配各種不同實施例的穿孔結構，使得射出 成型的樹脂層能牢固地形成在金屬基材上。 ▲為讓本發明之上述目的、特徵及優點能更明顯易懂，下文特舉 車又佳實知方式’並配合所關式，作詳細賴如下。細如下之較 佳實施方式期式僅供參考與說_，並非时對本㈣加以限制 201210832 者。 【實施方式】 凊參考第1圖至第3圖’其為依據本發明第一實施例所繪示 製作金屬_複合結構的步驟示意圖。如第1圖所示，首先提供— 金屬基材300。金屬基材3⑻具有—第—表面3G2以及—相對 -表，3〇2的第二表面3〇4。根據本發明第一實施例，金屬基材_ 可以是厚度約介於〇.lmm至2_之間的金屬薄板或金屬片，其材 質可以包含各種金屬材質，例如紹、鎂、鈦、銅、不鏽鋼、上述之 合金或上述之組合，但並不以此為限。 第2圖所示’進行一雷射製程，以在金屬基材300上形 成複數個穿孔。各個穿孔會貫穿金屬基材·，並連通第一 表面3〇2以及第二表面3〇4’且其孔徑大體上介於_職至〇.lmm 實把例中’穿孔3〇8具有一漸縮剖面輪廓’也就是穿孔 :於第-表面302上的開口大小和穿孔細位於第二表㈣ ^口大小不同’第2圖所例示為穿孔彻在第一表面迎之開 穿第二表面304之開孔較大。而於本發明較佳實施例中， 缩的幅度大體上相同，而成為一錐狀穿孔。當然，藉由 =雷，的能量’穿孔姻也可以具有不同的結構，例如是圓 實議^至示具有弧度的其敝體形料。而於本發明另一 貫施例中，亦可以調整雷射製程的角度，使得各穿孔細和第一表 201210832 面302或第二表面3〇4之間具有一傾斜角度，而得到「傾斜」的圓 柱穿孔或角柱穿孔。此外，各穿孔308之間也可以具有相同的結構， 或者視製程的需要而具有不同的結構，例如部份的穿孔3〇8為錐狀 穿孔，而部份穿孔308為圓柱穿孔’以增加後續樹脂層與金屬基材 的結合力。 接著如第3圖所示，進行一射出成型步驟，例如膜内成型(insert molding)，以形成一樹脂層312於第一表面3〇2或第二表面3〇4之 至乂一者。其中，樹脂層312可以是位於鍵盤鍵帽内面的塑膠機構 或元件。於本發明較佳實施例中，樹脂層312形成於穿孔3〇8開口 較小之一側，以第3圖為例，樹脂層312形成於第一表面3〇2上。 如此一來，藉由穿孔308之漸縮輪廓，可提供樹脂層312更穩固接 合於金屬基材3GG上。當,然’於其它實施例中，樹脂層312亦可形 成於第二表面304並填滿穿孔3〇8中，或者於另一實施例中，樹脂 層312可同時形成於第一表面3〇2以及第二表面3〇4，且填入於穿 孔308中。第3 ®僅繪示了本發明穿孔的其中_種實施方式， 本領域技藝人士應可了解’這種以射出成型來形成樹脂層312的方 式，亦可搭配上述各種穿孔3〇8的實施方式。 由於本發明的穿孔3〇8或盲孔係由雷射所形成，其孔徑較習知 以'丁、米膜塑技術(nano-molding technology，NMT)形成的孔穴孔徑更 大’因此树脂層；312可直接射出成型於金屬基材3〇〇上，即可牢固 的與該金屬基材結合，毋需透過額外的黏合膠。另—優點是，樹脂 201210832 層312不限於咼流動性的樹脂材料，而可以是任何樹脂材料或工裎 塑膠，於本發明較佳實施例中，樹脂層312可以是聚縮醛 (polyoxymethylene ’簡稱POM)樹脂、丙烯腈丁二稀_苯乙烯 (acrylonitrile butadiene styrene，簡稱 ABS)樹脂及聚碳酸酯 (polycarbonate ’簡稱PC)樹脂。樹脂層312可以是位於鍵盤鍵帽内 面的塑膠機構或元件。 請參考第4圖至第6圖，其為依據本發明第二實施例所繪示的 製作金屬瓣複合結構的步驟示意圖。如第4圖所示，首先提供— 金屬基材400。金屬聽400具有一第一表面4〇2以及一相對於第 -表面02的第二表面404。金屬基材彻的厚度大致上介於〇 ι_ 至2mm之間’其材質可以包含各種金屬材質，例如紹、鎮、欽、鋼、 不鏽鋼、上述之合金或上狀組合，但並砂此為限。 、如第5圖所示，進行一第一雷射製程，以在金屬基材上形 成至少一盲孔408。盲孔408並不會貫穿金屬基材4〇0，而會位於第 -表面402或第二表面4〇4其中至少一者，第5圖例示盲孔儀僅 形成第";表面.上。盲孔顿的孔徑大體上介於議_至〇.lmm 之間。藉著調控雷射製程的能量，盲孔可以具有不同的結構， 例如圓柱狀、角柱狀或者「傾斜」的盲孔，或者，各個盲孔姻之 間的結構也可相同或者不同。 •接者，如第6圖所示，進行一射出成型步驟，例如膜内成型， 201210832 以形成-樹脂層412於具有盲孔⑽之第—表面.上。其中，樹 脂層412可以是位於鍵盤鍵帽内面的塑膠機構或元件。 明參考第7圖至第9圖，其為依據本發明第三實施例所繪示的 製作金屬塑膠複合結構的步驟示意圖。 金屬基請。金屬基㈣具有—第_表績以及_相先=第 -表面502㈣二表面5G4。金屬基材通的厚度大致上介於〇 ι_ 至2晒之間，其材質可以包含各種金屬材質，例如銘、鎮、欽、銅、 不錄鋼、上述之合金或上述之組合，但並不以此為限。 如第8圖所示’進行一第一雷射製程，以在金屬基材500上形 成至少孔顺歧少―f孔麵。訊驗會打金屬基材 5〇〇 ’並連通第-表面502以及第二表面5〇4 ;而盲孔篇並不貫 穿金屬基材500，而會位於第一表面502或第二表面504其中至少 者。各穿孔508a與各盲孔508b的孔徑大體上介於〇 〇1_至 籲0.1mm之間。與本實施例中，穿孔顺和盲孔$眺會與第一表面 5〇2或第二表面5G4之間具有—傾斜角度，且視產品的需求，各穿 孔508a和目孔5〇8b之間的傾斜角度可以相同也可以不同，較佳者， 各穿，508a和盲孔508b #與樹脂層512之中心處呈現對稱圖案(可 >考第9圖）’以增加樹脂層512與金屬基材之貼合程度。當秋， 藉著調控雷射製程的能量，穿孔篇或盲孔獅可以和搭配前述 幻而"有不同的立體結構，例如圓柱狀、角柱狀等。 201210832 …最後如第9圖所示，進行—射出成齡驟，例如膜内成型，以 形成-樹脂層512於具有穿孔撕以及盲孔鷄之第一表面$⑽ 上。 _ β月參考第10圖至第13 _，其為依據本發明之第四實施例所繪 不的製作金屬_複合結構的步驟示意圖。如第1G圖所示，首先提 供-金屬基材600。金屬基材_具有一第一表面6〇2以及一相對 於第-表面602的第二表面_。金屬基材_的厚度大致上介於 〇.1_至2_之間’其材質可以包含各種金屬材質，例如紹、鎮、 鈦、銅、不脑、上叙合金或上狀組合，但並不以此為限。 如第11圖所示，進行-第一雷射製程，以在金屬基材之第 一表面602上形成一凹穴6σ^當然，凹穴6〇7不一定要是以雷射 製程形成，也可以是以其他方式形成，例如蝕刻。 接著，如第12圖所示，進行一第二雷射製程，以在凹穴6〇7 之底部607a形成複數個穿孔608，其中各穿孔6〇8會連通凹穴607 以及第二表面604。穿孔608的孔徑大體上介於0 01mm至〇 lmm 之間。穿孔608的實施方式和前述大致相同，在此不加以贅述。值 得’主意的是’本貫施例的並不限於先形成凹穴607再形成穿孔608， 於本發明另一實施例中，亦可先形成穿孔6〇8 ,然後再形成凹穴 607。或者，於同一雷射製程中，同時形成凹穴607以及穿孔6〇8。 而於另一實施例中，穿孔608並不限於全部形成於凹穴之底部， 201210832 而可以部份的穿孔608形成於凹穴6〇7底 ^ &#，而部份的穿孔608形 成於凹穴607以外之處而貫穿第一表面6〇2和第二表面⑼*。 接著，如第13圖所示，進行一射出成型步驟，例如膜内成型， 以形成-樹脂層612於第-表面602或第二表面6〇4之至少一者。 其中’樹脂層612可以是位於鍵盤鍵帽内面的塑膠 本發明較佳實施例中，樹脂層612形成於第—表面_上且填入 鲁於凹穴607以及穿孔608中。而於本發明另一實施例中，樹脂層612 亦可形成於第二表面604上並填滿穿孔_以及凹穴6〇7中。或者， 於另-實施例中，樹脂層612可同時形成於第一表面以及第二 表面604 ’且同時填入凹穴607以及穿孔6〇8中。 本發明形成金屬塑膠複合材料的步驟中，還可選擇性的加入一 陽極處理步驟，藉以形成-陽極處理層。請參考第14圖與第16圖， 所繪示為本發明之第五實施例中製作金屬塑膠複合結構的步驟示意 鲁圖。如S 14圖所示，首先提供一金屬基板7〇〇。金屬基板7〇〇的實 施方式於前述相同，在此不加以贅述。接著，在金屬基材7〇〇之第 一表面702或第二表面704上形成一陽極處理層716，例如是一金 屬氧化膜。 然後’如第15圖所示’進行一雷射製程，以形成穿孔708，穿 孔708的實施方式如前所述，在此不重複說明。本發明由於使用雷 射製程706來形成穿孔708，因此基本上並不會破壞穿孔7〇8以外 11 201210832 的陽極處理層716。當然，本發明亦可以選擇先進行雷射製程，形 成穿孔’然後再進行陽極處理。 最後，如第圖所示，在陽極處理層716上形成樹脂層712。 其中，樹脂層712可以是位於鍵盤鍵帽内面的娜機構或元件。陽 極處理層6不僅能提供金屬基材7〇〇第_表面搬或第二表面剔 適當的保護’且由於陽極處理層716的表面_，使得樹脂層π 更能牢固的與金屬基材7〇〇結合。 本發明之一特徵在於使用雷射製程观來形成穿孔观，故不 會破壞穿孔708以外的陽極處理層716。因此，陽極處理層716可 以在穿孔708之前形成。或者’於另一實施例中，也可在穿孔观 之後形成。她於習知以化學_的方式，其化學細彳製程必須在 表面處理或陽極處理之前進行，本發明提供了更有彈性的製程選擇。 本發明亦提供了-齡；|_複合㈣之結構，其結構特徵分 別描述在第3、6、9、13圖卜例如，如第3圖所示，本實施例的 金屬塑膠複合結構314包含有—金屬基材勘以及一樹脂層312。 金屬基材300包含-第一表面3〇2與相對第一表面3〇2的一第二表 面304，且金屬基材300之厚度大致上介於〇1_至2咖之間。 金屬材料300的材質包含有銘、_、欽、銅、不鏽鋼或其合金，但 並不以此為限。金屬基材3〇〇±設有複數個穿孔3〇8，貫穿金屬基 材300，並連通第一表面312及第二表面3〇4。於本發明之一實施例 201210832 中’穿孔308為雷射穿孔’具有漸縮剖面輪靡，較佳為具有錐狀結 構，且其孔徑大致上介於〇 lmm至2mm之間。樹脂層M2設於第 一表面302或第二表面3〇4之至少一者，並且填入複數個穿孔3〇8 中，使樹脂層312牢固的與金屬基材3〇〇結合。本實施例的金屬塑 膠複合結構314亦可辦性的設置有-雜處理層⑽未示），設置 於金屬基材300與樹脂層312之間。 此外，如第6圖所示，本實施例的金屬塑膠複合結構414包含 有一金屬基材400以及一樹脂層412。金屬基材4〇〇包含一第一表 面402與相對第一表面402的一第二表面4〇4，且金屬基材4〇〇之 厚度大致上介於〇.lmm至2mm之間。金屬材料4〇〇的材質包含有 鋁、鎂、鈦、銅、不鏽鋼或其合金，但並不以此為限。金屬基材4〇〇 的第一表面402上設有至少一盲孔408。於本發明之一實施例中， 盲孔408為雷射盲孔，可以具有漸縮剖面輪廊，較佳為具有錐狀結 構’且其孔徑大致上介於(Umm至2mm之間。樹脂層412設於金 屬基材400上並填入盲孔408中，使樹脂層412牢固的與金屬基材 4〇〇結合。本實施例的金屬塑膠複合結構414亦可選擇性的設置有 一陽極處理層（圖未示），設置於金屬基材400與樹脂層412之間。 此外，如第9圖所示，本實施例的金屬塑膠複合結構514包含 有一金屬基材500以及一樹脂層512。金屬基材5〇〇包含一第一表 =502與相對第一表面5〇2的一第二表面5〇4，且金屬基材5〇〇之 厚度大致上介於〇.lmm至2mm之間。金屬材料5〇〇的材質包含有 13 201210832 鋁、鎂、鈦、鋼、不鏽鋼或其合金，但並不以此為限。金屬基材5〇〇 的第一表面502上設有至少一盲孔508b以及一貫穿孔508a。於本 發明之一實施例中，盲孔508b為雷射盲孔，貫穿孔5〇如為雷射貫 穿孔，且兩者和第一表面502或第二表面504之間具有傾斜角度， 且其孔徑大致上介於0.1mm至2mm之間。樹脂層512設於金屬基 材500上並填入盲孔508b與貫穿孔508a中，使樹脂層512牢固的 與金屬基材500結合。本實施例的金屬塑膠複合結構514亦可選擇 性的設置有一陽極處理層（圖未示），設置於金屬基材5〇〇與樹脂層 512之間。 如第13圖所示’本實施例的金屬塑膠複合結構614包含有一金 屬基材600以及一樹脂層612。金屬基材6〇〇包含一第一表面6〇2 與相對第-表面602的-第二表面604，且金屬基材_之厚度大 致上介於0.1mm至2mm之間。金屬材料600的材質包含有鋁、鎂、 鈦、銅、不細或其合金，但並不以此為限。金屬基材㈣的第一 表面602上設有至少一凹穴607，以及複數個穿孔6〇8，位於凹穴 607的底部607a。於此實施例中，穿孔_為雷射穿孔，具有漸縮 剖面輪靡，較佳為具有錐狀結構，且其孔徑大致上介於〇1_至 2mm之間。樹脂層612設於之第一表面6〇2或第二表面綱之至少 -者’並且填入凹穴6〇7以及穿孔_中，使樹脂層612牢固的與 金屬基材_結合。本實施例的金厲塑膠複合結構614亦可選擇性 的設置有-陽極處理層(圖未示)，設置於金屬基材_與樹脂層⑽ 201210832 本發明金屬塑膠複合材料結構及形成金屬塑膠複合材料之步 驟’可應用於各種領域’例如鍵盤按鍵之鍵帽。請參考第17圖，所 繪示為本發明金屬塑膠複合鍵帽結構之示意圖。如第17圖所示，按 鍵820包含一底板822、一鍵帽800以及一升降支撐裝置824。升降 支撐裝置824設置於鍵帽800與底板822之間，用以支撐鍵帽8〇〇， 其中升降支撐裝置824包含一樹脂槽件812，用以和鍵帽8〇〇接合。 於本貫施例中，鍵帽800為一金屬基材，其包含一外表面8〇2與一 内表面804。鍵帽8〇〇的厚度大致上介於〇 lmm至2mm之間，且 其材質包含有鋁、鎂、鈦、銅、不鏽鋼或其合金，但並不以此為限。 鍵帽800上設有複數個穿孔8〇8’其貫穿鍵帽8〇〇並連通外表面8〇2 及内表面804。於本發明之一實施例中，穿孔8〇8為雷射穿孔具 有漸縮剖面輪廓’較佳為具有錐狀結構，且其孔徑大致上介K〇imm 至2mm之間。樹脂槽件812設於内表面804上。樹脂槽件812包含 有複數個斜P合部位犯職的嵌入於複數個穿孔8〇8巾，使樹脂槽 件812牢固的與鍵帽800結合。 +綜上而言，本發明金屬塑膠複合結構以及其製造方法，係利用 射製私以在金屬基材上形成穿孔，故穿孔的大小可以視後續射出 =型之需求而作調整’並可搭配各種不同的穿孔結構，使得射出成 ^•的祕m牢固緊密地與金屬基材結合。她於習知技術，樹脂 a，材質k擇更有彈性，重要的是，可以配合低流動性且價格較低 的樹脂駐程歸。祕制f㈣程，鼠表錢理或陽極處理 15 201210832 可、'擇n的在雷射製程之前進行或雷射製程之後進行，増加製程的 彈生’同時在外觀上鱗陽轉理層的^整。此外，由於採 衣保的雷射製程’故能夠將對於魏的污染及衝擊降至最低。 乂上所述僅為本發明之較佳實施例，凡依本發明申請專利範圍 所做之均轉化與修飾，皆應屬本發明之涵蓋範圍。 【圖式簡單說明】 第1圖至第3圖所繪示為本發明第一實施例中製作金屬塑膠複合結 構的步驟示意圖。 ° 第4圖至第6圖所繪示為本發明第二實施例中製作金屬塑人牡 構的步驟示意圖。 σ 第7圖至第9 ®所繪示為本發明第三實施例巾製作金屬轉複合結 構的步驟示意圖。 第10圖至第13圖所繪示為本發明第四實施例帽作金屬塑膠複合 結構的步驟示意圖。 第14圖至第16圖所繪示為本發明第五實施例中製作金屬塑膠複合 結構的步驟示意圖。 第Π圖所繪示為本發明金屬塑膠複合鍵帽結構之示意圖。 【主要元件符號說明】 201210832 300, 400, 500, 600. 700 金屬基板 702 外表面 302, 402, 502,602, 702 第一表面 704 内表面 304, 404, 504, 604, 704 第二表面 712 樹脂槽件 308, 508a, 608, 708, 708 穿孔 713 鉚合部位 312,412,512,612, 712 樹脂層 720 按鍵 314,414,514,612 金屬塑膠複 合結構 722 底板 408, 508b 盲孔 724 升降支撐裝置 507 507a 凹六 底部 700 鍵帽201210832 VI. Description of the Invention: [Technical Field of the Invention] The present invention is directed to a metal-plastic composite structure, and more particularly to a metal-plastic composite structure formed by a laser process. [Prior Art] In the field of computers, automobiles, home appliances, medical supplies, or other light industry or heavy industry, it is often necessary to combine different materials to form red components or modules. For example, the metal keycap in the keyboard must be supported by the underlying plastic lifting support, so proper bonding techniques are needed between the two to provide a more stable _-body. Conventional metal keycaps are combined in a manner such as a gel and a metal-based adhesive, for example, using a room temperature curing or a refueling agent. However, the _ mixture requires an additional bonding step, 'more troublesome' and different materials _ mixture can withstand the same strength, often resulting in a lack of product structure, plus mining _ mixture does not correct the thickness of the key cap, unfavorable As the keyboard is thinner, the industry is striving to study the way in which bonding is required. For example, U.S. Pat. The method is characterized in that a hole which is uneven in unevenness is formed on the surface of the metal by a chemical side ((10), and then the unevenness of the unevenness is infiltrated under the condition of the bismuth-resin material. In the hole, after the infiltration, the tree material is crystallized (erystaUizatiQn), so that the resin material can be directly bonded to the metal surface without the aid of the binder. However, there are a number of issues that need to be overcome in the way of forming the gold-based materials. First of all, the concave-convex hole 6 formed on the metal surface has a diameter of about 1 〇 to 8 〇 (10), and the hole is relatively narrow. Therefore, the resin material used must be limited to a high fluidity material such as polyamine. (P〇lyamideresin), it is possible to combine with the metal surface. However, the current price of polyamine is too high, so the cost of the process is also increasing. In addition, the conventional method requires (4) Chemistry _, which is better than Lin Bao' and since this method is on the chemical side of the metal watch 2, it can only be operated before the surface treatment step (for example, anodizing), otherwise the appearance of the surface treatment is destroyed. Therefore, the flexibility of the process steps is invisible. SUMMARY OF THE INVENTION The present invention provides a metal-recombination structure and a method for fabricating the same, which are applicable to various resin materials and can be arbitrarily matched with surface treatment steps, and can be used to produce a metal-plastic composite structure without a binder. [In the present invention - an embodiment provides a metal plastic composite structure comprising a -metal substrate and a resin layer. The metal substrate comprises a first surface and a second surface opposite the first surface, Wherein the metal substrate is provided with a plurality of perforations extending through the metal substrate and communicating with the first surface and the second surface. The resin layer is disposed on at least one of the first surface or the second surface and is filled with a plurality of perforations. The resin layer is firmly bonded to the metal 201210832 substrate. In an embodiment of the invention, another metal-plastic composite structure is provided, comprising a metal substrate and a resin layer. The metal substrate comprises a first surface and a second surface opposite to the first surface, wherein the first surface of the metal substrate is provided with at least one recess, and a plurality of perforations are located at the bottom of the recess. The resin layer is disposed on the first surface or the second surface At least one, and filling the recess and the plurality of perforations, the resin layer is firmly bonded to the metal substrate. In still another embodiment of the present invention, a metal-plastic composite keycap structure is provided. The utility model comprises a metal substrate and a resin groove member. The metal substrate comprises an outer surface and an inner surface. The towel material is provided with a plurality of perforations, penetrates the metal button, and communicates with the outer surface and the inner surface, and the grease groove The component is disposed on the inner surface, and the resin groove member comprises a plurality of rivet portions located in the plurality of piercing towels ′ so that the tree splicing member is firmly bonded to the metal substrate. The metal-plastic composite combination and the manufacturing method thereof provided by the invention are The laser process is used to form perforations on the gold secret material, and the size can be adjusted according to the requirements of subsequent injection molding, and can be matched with the perforation structure of various embodiments, so that the injection-molded resin layer can be firmly formed on the metal base. In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the following is a detailed description of the preferred embodiment of the vehicle, and the following is a detailed description of the preferred embodiment. The formula is for reference only and _, and is not limited to this (4) 201210832. [Embodiment] 凊 Referring to Figures 1 to 3, which are depicted in accordance with the first embodiment of the present invention A schematic diagram of the steps of the metal-composite structure. As shown in Fig. 1, first, a metal substrate 300 is provided. The metal substrate 3 (8) has a first surface 3G2 and a relative surface, and a second surface 3〇4 of 3〇2. According to the first embodiment of the present invention, the metal substrate _ may be a metal thin plate or a metal sheet having a thickness of about l.lmm to 2_, and the material thereof may include various metal materials such as Shao, magnesium, titanium, copper, Stainless steel, the above alloy or a combination thereof, but not limited thereto. Fig. 2 shows a laser process for forming a plurality of perforations on the metal substrate 300. Each of the perforations penetrates the metal substrate. And connecting the first surface 3〇2 and the second surface 3〇4' and the aperture thereof is substantially between _ position to 〇.lmm. In the example, the perforation 3〇8 has a tapered profile profile, that is, the perforation: The size of the opening on the first surface 302 and the fineness of the perforation are located in the second table (4). The size of the opening is different. The second figure illustrates that the opening of the second surface 304 is larger at the first surface. In the preferred embodiment of the invention, the extent of the constriction is substantially the same and becomes a tapered perforation. Of course, the energy of the perforation can also have a different structure by = Ray, for example, a round-robin to the scorpion-shaped material having a curvature. In another embodiment of the present invention, the angle of the laser process can also be adjusted so that each of the perforation lines has an inclination angle between the face 102108108 or the second surface 3〇4 of the first watch, and is “tilted”. Cylindrical perforations or corner posts. In addition, each of the perforations 308 may have the same structure, or have different structures depending on the needs of the process. For example, a part of the perforations 3〇8 are tapered perforations, and a part of the perforations 308 are cylindrical perforations to increase subsequent The bonding force between the resin layer and the metal substrate. Next, as shown in Fig. 3, an injection molding step, such as insert molding, is performed to form a resin layer 312 on the first surface 3〇2 or the second surface 3〇4. The resin layer 312 may be a plastic mechanism or component located on the inner surface of the keyboard keycap. In the preferred embodiment of the present invention, the resin layer 312 is formed on one side of the smaller opening of the perforation 3〇8. In the third embodiment, the resin layer 312 is formed on the first surface 3〇2. As a result, the resin layer 312 can be more firmly bonded to the metal substrate 3GG by the tapered profile of the perforations 308. In other embodiments, the resin layer 312 may also be formed on the second surface 304 and fill the perforations 3〇8, or in another embodiment, the resin layer 312 may be simultaneously formed on the first surface 3〇 2 and the second surface 3〇4 are filled in the perforations 308. The third embodiment shows only one of the embodiments of the perforation of the present invention, and those skilled in the art should understand that the method of forming the resin layer 312 by injection molding can also be combined with the above embodiments of the various perforations 3〇8. . Since the perforation 3〇8 or the blind hole of the present invention is formed by laser, the pore diameter is larger than that of the pore formed by the 'nano-molding technology (NMT)', so the resin layer; The 312 can be directly molded onto the metal substrate 3, and can be firmly bonded to the metal substrate without the need for additional adhesive. Another advantage is that the resin 201210832 layer 312 is not limited to a flowable resin material, but may be any resin material or process plastic. In a preferred embodiment of the invention, the resin layer 312 may be polyacetal (polyoxymethylene) POM) resin, acrylonitrile butadiene styrene (ABS) resin and polycarbonate (PC) resin. The resin layer 312 may be a plastic mechanism or component located inside the keyboard keycap. Please refer to FIG. 4 to FIG. 6 , which are schematic diagrams showing the steps of fabricating a metal valve composite structure according to a second embodiment of the present invention. As shown in Fig. 4, a metal substrate 400 is first provided. The metal listener 400 has a first surface 4〇2 and a second surface 404 with respect to the first surface 02. The thickness of the metal substrate is roughly between 〇ι_ and 2mm. The material may contain various metal materials, such as Shao, Zhen, Qin, steel, stainless steel, the above alloy or the upper combination, but the sand is limited. . As shown in Fig. 5, a first laser process is performed to form at least one blind via 408 on the metal substrate. The blind hole 408 does not penetrate the metal substrate 4〇0, but may be located at least one of the first surface 402 or the second surface 4〇4, and the fifth figure illustrates that the blind hole meter only forms the "surface. The aperture of the blind hole is generally between _ and 〇.lmm. By regulating the energy of the laser process, the blind holes can have different structures, such as cylindrical, angular column or "tilted" blind holes, or the structures between the blind holes can be the same or different. • As shown in Fig. 6, an injection molding step, such as in-film molding, 201210832 is formed to form a resin layer 412 on the first surface having the blind holes (10). The resin layer 412 may be a plastic mechanism or component located on the inner surface of the keyboard keycap. Referring to Figures 7 through 9, a schematic view of the steps of fabricating a metal-plastic composite structure in accordance with a third embodiment of the present invention is shown. Metal base please. The metal base (4) has - the first appearance and the first phase - the first surface 502 (four) two surfaces 5G4. The thickness of the metal substrate is substantially between 〇ι_ and 2, and the material may include various metal materials, such as Ming, Zhen, Qin, copper, non-recorded steel, the above alloys or combinations thereof, but not This is limited to this. As shown in Fig. 8, a first laser process is performed to form at least a hole-refining-f hole surface on the metal substrate 500. The test will strike the metal substrate 5〇〇' and connect the first surface 502 and the second surface 5〇4; and the blind hole does not penetrate the metal substrate 500, but will be located on the first surface 502 or the second surface 504. At least. The apertures of each of the perforations 508a and the blind holes 508b are generally between 〇1_ to 0.1mm. In this embodiment, the perforation and the blind hole 眺 will have an inclination angle with the first surface 5〇2 or the second surface 5G4, and depending on the requirements of the product, between the perforations 508a and the mesh holes 5〇8b. The inclination angles may be the same or different. Preferably, each of the wearable, 508a and blind holes 508b # and the center of the resin layer 512 exhibit a symmetrical pattern (can be referred to in FIG. 9) to increase the resin layer 512 and the metal substrate. The degree of fit. In the autumn, by regulating the energy of the laser process, the perforated or blind-hole lions can be combined with the aforementioned illusion and have different three-dimensional structures, such as cylindrical and angular columns. 201210832 ... Finally, as shown in Fig. 9, performing - ejecting a aging step, such as in-film forming, to form a resin layer 512 on the first surface $(10) having perforated tears and blind-hole chickens. _ β month refers to Figs. 10 to 13 _, which are schematic diagrams showing the steps of fabricating a metal-composite structure according to the fourth embodiment of the present invention. As shown in Fig. 1G, a metal substrate 600 is first provided. The metal substrate_ has a first surface 6〇2 and a second surface _ relative to the first surface 602. The thickness of the metal substrate _ is substantially between 〇.1_ to 2_'. The material may include various metal materials, such as Shao, Zhen, Titanium, Copper, No Brain, Upper Alloy or Upper Combination, but Not limited to this. As shown in FIG. 11, the first laser process is performed to form a recess 6σ on the first surface 602 of the metal substrate. Of course, the recess 6〇7 is not necessarily formed by a laser process, and may also be formed. It is formed in other ways, such as etching. Next, as shown in Fig. 12, a second laser process is performed to form a plurality of perforations 608 at the bottom 607a of the recesses 6〇7, wherein each of the perforations 6〇8 communicates with the recess 607 and the second surface 604. The aperture of the perforation 608 is generally between 0 01 mm and 〇 1 mm. The embodiment of the through hole 608 is substantially the same as the foregoing, and will not be described herein. It is to be understood that the present embodiment is not limited to forming the recess 607 first and then forming the through hole 608. In another embodiment of the present invention, the through hole 6〇8 may be formed first, and then the recess 607 may be formed. Alternatively, in the same laser process, the pockets 607 and the perforations 6〇8 are simultaneously formed. In another embodiment, the perforations 608 are not limited to being formed entirely at the bottom of the recess, and the portion of the perforations 608 may be formed at the bottom of the recess 6〇7, and the partial perforations 608 are formed in The first surface 6〇2 and the second surface (9)* are penetrated beyond the pocket 607. Next, as shown in Fig. 13, an injection molding step, such as in-film molding, is performed to form at least one of the -resin layer 612 on the first surface 602 or the second surface 6?4. Wherein the resin layer 612 may be a plastic on the inner surface of the keyboard keycap. In a preferred embodiment of the invention, a resin layer 612 is formed on the first surface and filled in the recess 607 and the perforations 608. In another embodiment of the present invention, the resin layer 612 may also be formed on the second surface 604 and filled in the perforations and the recesses 6〇7. Alternatively, in another embodiment, the resin layer 612 may be simultaneously formed on the first surface and the second surface 604' while filling the recess 607 and the through hole 6〇8. In the step of forming the metal-plastic composite material of the present invention, an anodizing step may be optionally added to form an anodized layer. Referring to Figures 14 and 16, there is shown a schematic diagram of the steps of fabricating a metal-plastic composite structure in a fifth embodiment of the present invention. As shown in Fig. 14, a metal substrate 7 is first provided. The embodiment of the metal substrate 7 is the same as described above, and will not be described herein. Next, an anodized layer 716, such as a metal oxide film, is formed on the first surface 702 or the second surface 704 of the metal substrate 7A. Then, a laser process is performed as shown in Fig. 15 to form a perforation 708. The embodiment of the perforation 708 is as described above, and the description will not be repeated here. The present invention utilizes the laser process 706 to form the perforations 708 so that the anodized layer 716 other than the perforations 7〇8 is substantially not destroyed. Of course, the present invention may also optionally perform a laser process to form a perforation and then perform an anodization. Finally, as shown in the figure, a resin layer 712 is formed on the anodized layer 716. Wherein, the resin layer 712 may be a Na mechanism or an element located on the inner surface of the keyboard keycap. The anodized layer 6 can provide not only the metal substrate 7 〇〇 surface or the second surface, but also the surface _ of the anodized layer 716, so that the resin layer π is more firmly bonded to the metal substrate 7 〇 combine. One feature of the present invention is the use of a laser process view to form a perforated view so that the anodized layer 716 other than the perforations 708 is not destroyed. Thus, the anodized layer 716 can be formed prior to the perforations 708. Alternatively, in another embodiment, it may be formed after the perforation view. She is known in the chemical mode, and its chemical fines process must be carried out prior to surface treatment or anodizing. The present invention provides a more flexible process choice. The present invention also provides a structure of - age; |_composite (four), the structural features of which are described in Figures 3, 6, 9, and 13, respectively. For example, as shown in FIG. 3, the metal-plastic composite structure 314 of the present embodiment includes There is a metal substrate and a resin layer 312. The metal substrate 300 includes a first surface 3〇2 and a second surface 304 opposite the first surface 3〇2, and the metal substrate 300 has a thickness substantially between 〇1_2. The material of the metal material 300 includes Ming, _, Qin, copper, stainless steel or alloys thereof, but is not limited thereto. The metal substrate 3 is provided with a plurality of perforations 3〇8 extending through the metal substrate 300 and communicating with the first surface 312 and the second surface 3〇4. In one embodiment of the invention 201210832, 'perforation 308 is a laser perforation' having a tapered profile rim, preferably having a tapered configuration, and having a bore diameter substantially between 〇 1 mm and 2 mm. The resin layer M2 is provided on at least one of the first surface 302 or the second surface 3〇4, and is filled in a plurality of perforations 3〇8 so that the resin layer 312 is firmly bonded to the metal substrate 3〇〇. The metal plastic composite structure 314 of the present embodiment is also provided with a miscellaneous treatment layer (10), and is disposed between the metal substrate 300 and the resin layer 312. Further, as shown in Fig. 6, the metal-plastic composite structure 414 of the present embodiment comprises a metal substrate 400 and a resin layer 412. The metal substrate 4A includes a first surface 402 and a second surface 4〇4 opposite to the first surface 402, and the thickness of the metal substrate 4 is substantially between 〇.1 mm and 2 mm. The material of the metal material 4 包含 includes aluminum, magnesium, titanium, copper, stainless steel or an alloy thereof, but is not limited thereto. At least one blind hole 408 is provided on the first surface 402 of the metal substrate 4A. In an embodiment of the present invention, the blind hole 408 is a laser blind hole, and may have a tapered cross-section porch, preferably having a tapered structure and having a diameter substantially between (Umm to 2 mm). The 412 is disposed on the metal substrate 400 and filled in the blind hole 408, so that the resin layer 412 is firmly bonded to the metal substrate 4. The metal-plastic composite structure 414 of the embodiment can also be selectively provided with an anodized layer. (not shown), disposed between the metal substrate 400 and the resin layer 412. Further, as shown in Fig. 9, the metal-plastic composite structure 514 of the present embodiment includes a metal substrate 500 and a resin layer 512. The substrate 5A includes a first surface=502 and a second surface 5〇4 opposite to the first surface 5〇2, and the thickness of the metal substrate 5〇〇 is substantially between 〇.1 mm and 2 mm. The material of the metal material 5 包含 includes 13 201210832 aluminum, magnesium, titanium, steel, stainless steel or alloy thereof, but not limited thereto. The first surface 502 of the metal substrate 5 设有 is provided with at least one blind hole 508b and consistent perforation 508a. In one embodiment of the invention, blind hole 508b is laser blind The through hole 5 is, for example, a laser through hole, and has an inclined angle between the two and the first surface 502 or the second surface 504, and the aperture thereof is substantially between 0.1 mm and 2 mm. The resin layer 512 is disposed at The metal substrate 500 is filled in the blind hole 508b and the through hole 508a, so that the resin layer 512 is firmly bonded to the metal substrate 500. The metal plastic composite structure 514 of the embodiment can also be selectively provided with an anodized layer ( The metal substrate composite structure 614 of the present embodiment includes a metal substrate 600 and a resin layer 612. The metal base is disposed between the metal substrate 5 and the resin layer 512. The material 6〇〇 includes a first surface 6〇2 and a second surface 604 opposite to the first surface 602, and the thickness of the metal substrate _ is substantially between 0.1 mm and 2 mm. The material of the metal material 600 includes Aluminum, magnesium, titanium, copper, non-fine or alloy thereof, but not limited thereto. The first surface 602 of the metal substrate (4) is provided with at least one recess 607, and a plurality of perforations 6〇8, located in the concave The bottom 607a of the hole 607. In this embodiment, the perforation _ is a laser perforation with a gradual The reduced profile rim preferably has a tapered structure and has a diameter substantially between 〇1_ and 2 mm. The resin layer 612 is disposed on the first surface 6〇2 or the second surface of the at least one of the ' And filling the recess 6〇7 and the through hole_, the resin layer 612 is firmly bonded to the metal substrate_. The Jinli plastic composite structure 614 of the embodiment can also be selectively provided with an anodized layer (Fig. Illustrated), disposed on the metal substrate _ and the resin layer (10) 201210832 The metal-plastic composite structure of the present invention and the step of forming the metal-plastic composite material can be applied to various fields such as a keycap of a keyboard button. Please refer to Fig. 17, which is a schematic view showing the structure of the metal-plastic composite keycap of the present invention. As shown in Fig. 17, the button 820 includes a bottom plate 822, a keycap 800, and a lifting support device 824. The lifting support device 824 is disposed between the keycap 800 and the bottom plate 822 for supporting the keycap 8'', wherein the lifting support device 824 includes a resin groove member 812 for engaging with the keycap 8'. In the present embodiment, the keycap 800 is a metal substrate comprising an outer surface 8〇2 and an inner surface 804. The thickness of the key cap 8 大致 is substantially between 〇 1 mm and 2 mm, and the material thereof includes aluminum, magnesium, titanium, copper, stainless steel or an alloy thereof, but is not limited thereto. The keycap 800 is provided with a plurality of perforations 8〇8' which extend through the keycap 8〇〇 and communicate with the outer surface 8〇2 and the inner surface 804. In one embodiment of the invention, the perforations 8〇8 are laser perforated with a tapered cross-sectional profile' preferably having a tapered configuration and having a pore size substantially between K〇imm and 2 mm. A resin channel member 812 is provided on the inner surface 804. The resin tank member 812 includes a plurality of perforated 8 〇 8 towels which are engaged in a plurality of oblique P joint portions, so that the resin tank 812 is firmly bonded to the key cap 800. + In summary, the metal-plastic composite structure of the present invention and the manufacturing method thereof use the private film to form a perforation on the metal substrate, so the size of the perforation can be adjusted according to the demand of the subsequent injection type= A variety of different perforated structures allow the injection of the secret m to be firmly and tightly bonded to the metal substrate. She uses the known technology, resin a, material k to be more flexible, and importantly, it can be matched with low-flow and low-cost resin. The secret f (four) process, the mouse table money or the anode treatment 15 201210832 can, 'select n before the laser process or after the laser process, add the process of the missile' at the same time in the appearance of the scales of the yang layer ^ whole. In addition, the pollution and impact on Wei can be minimized due to the laser manufacturing process. The above description is only the preferred embodiment of the present invention, and all transformations and modifications made by the scope of the present invention should be within the scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 to Fig. 3 are schematic views showing the steps of fabricating a metal-plastic composite structure in the first embodiment of the present invention. ° Fig. 4 to Fig. 6 are schematic views showing the steps of fabricating a metal plastic human body in the second embodiment of the present invention. σ Figures 7 to 9 show a schematic diagram of the steps of fabricating a metal-transferred composite structure in accordance with a third embodiment of the present invention. 10 to 13 are schematic views showing the steps of the metal-plastic composite structure of the cap according to the fourth embodiment of the present invention. 14 to 16 are schematic views showing the steps of fabricating a metal-plastic composite structure in a fifth embodiment of the present invention. The figure is a schematic view of the metal-plastic composite keycap structure of the present invention. [Description of main component symbols] 201210832 300, 400, 500, 600. 700 Metal substrate 702 External surface 302, 402, 502, 602, 702 First surface 704 Inner surface 304, 404, 504, 604, 704 Second surface 712 Resin channel 308, 508a, 608, 708, 708 Perforation 713 Riveting parts 312, 412, 512, 612, 712 Resin layer 720 Buttons 314, 414, 514, 612 Metal-plastic composite structure 722 Base plate 408, 508b Blind hole 724 Lifting support device 507 507a Concave six bottom 700 key cap
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