201210010 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種光收發器及其製造方法，尤其涉及一種 光學元件與透鏡精確對位元的光收發器製造方法。 【先前技術】 [0002] 光通訊逐漸成為一項新興且具有發展潛力的技術，正被 人們普遍使用’其主要借由光纖傳輸資料，可以達到更 快速且足夠大的通訊頻寬，同時也能保持傳輸的品質。 通常’光通訊主要利用光收發器將光纖線路中的光訊號 與電子設備中的電訊號進行相互轉換，挺而完成資料的 快速傳輸。可見，光收發器性能的好壞直接決定資料傳 輸的品質。然而’光收發器中“射元件與漆鏡的對位元 精確度是判定其性能好壞的一個重要因素。 [0003] 因此，如何實現光收發器中鐳射元件與透鏡的精確對位 成為光收發器設計的一大課題 【發明内容】 • ； ·：'.. ,ν [0004] 有鑑於此’需提供一種光收發器，其中，错射元件與透 鏡具有較高的對位精准度。 [0005] 此外’還需提供一種光收發器製造方法，利用簡單的制 程實現鐳射晶片之發光元件與透鏡的精確對位。 [0006] 本發明實施方式中一種光收發器，用於進行光電訊號轉 換，包括基板、複數鐳射晶片 '支架以及複數透鏡。所 述基板包括複數透光孔、複數收容槽及複數固定孔，每 一個收容槽的半徑大於每一個透光孔的半徑，每一個透 099128370 表單編號Α0101 0992049825-0 201210010 光孔與每-個收容槽連通並同軸。鐘射晶片分別設置於 所述收容槽内，用於收發所述光電訊號。支架包括〆對 側壁’每-個侧壁包括外表面、固定自、通孔及固定枉 ，所述固定面與所述基板相對並粘貼於所述基板，所述 通孔貫穿於所述固定面與所述外表面之間，所述固定枉 與所述固定孔配合以加強所述支架與所述基板之間速接 的穩定性。透鏡安裝於所述支架並位於所述侧壁之間， 且與所述透光孔對應設置，用於接收所述晶片發出 的訊號。 Ο [0007] Ο 本發明實施方式中的一種光收發器製造方法，包括提供 基板，所述基板包括複數透光孔、複數收容槽及複數固 定孔，其中，每一個收容槽的半徑大於每一個透光孔的 半徑，每一個透光孔與每一個收容槽連通並同軸。將鐳 射晶片焊接於所述收容槽内。將驅動晶片焊接於所述基 板，用於驅動所述鐳射晶片。提供支架，所述支架包括 一對側壁，每一個側壁包括 >卜|面、固定面、通孔及固 定柱，所述固定面與所述基板相對並粘貼於所述基板， ρ ί 钠—叶〆、亡私;;. 所述通孔貫穿於所述固定面與所述外表面之間，所述固 定柱與所述固定孔配合以加強所述支架與所述基板之間 連接的穩定性°安襞複數透鏡於所述支架上，所述透鏡 位於所述側壁之間’且與所述透光孔對應設置，用於接 收所述鐳射晶片發出的訊號。將所述固定面進行點膠。 將固定柱安裝於所述固定孔内，並透過熱固化制程將所 述支架粘貼定位於所述基板。 [0008] 本發明的光收發器透過所述通孔的設置使得支架在很短 099128370 表單編號Α0101 第5頁/共18頁 0992049825-0 201210010 的時間内被固定於基板，從而防止在熱固定制程過程中 ’支架相對基板的位置漂移，進而實現透鏡與鐳射晶片 之間精確對位元，實現高精度的封裝技術。同時，固定 才主與固定孔的配合加強了支架與基板之間的連接的穩定 性’當基板發生變形時，固定柱與固定孔的配合能夠有 效防止支架與基板分離，提高產品良率。 【實施方式】 [0009] [0010] 圖1所示為本發明光收發器200結構的示意圖。本實施方 式令’光收發器200用於進行光電訊號轉換，其包括基板 、複數錯射晶片3务、媒動乘片60、東架40以及複數透 鏡 5〇 〇 圖2所示為本發明光收發器之^基板20的結構示意圖。基板 2〇包括第一表面22、與第一表面22相對的第二表面23、 複數透光孔24、複數收容槽26及複數固定孔28。所述固 定孔28包圍所收容槽26，参對稱分佈於所述基板2〇上。 每一個收容槽26的半徑大於每一個透光孔24的半徑，每 —個透光孔24與每一個收容槽么6連通並同軸設計。每一 個收容槽26從第一表面22向第二表面23凹設，用於收容 相應的錯射晶片30。每一個透光孔24貫穿第二表面23。 每—個鐳射晶片30均包括一個發光元件301，所述發光元 件301位於相應的鐳射晶片3〇的中心位置，並與所述透光 孔24相對。每一個發光元件301發出的光穿過相應的透光 孔24照射至相應的透鏡50用於接收或發射光電訊號。在 本實施方式中，每一個透光孔24和每一個收容槽26透過 同軸鑽孔或精確蝕刻而成。所述固定孔28的數量為兩個 099128370 表單編號A0101 第6頁/共18頁 0992049825-0 201210010 [0011] [0012] ο ❹ 099128370 ，所述收容槽26排列成一行，並位於所述固定孔之間 〇 鐳射晶片30透過焊墊29焊接於基板20之收容槽26内用於 收發光電訊號。驅動晶片60透過打線方式焊接於基板2〇 之第二表面23，用於驅動鐳射晶片30 (如圖3所示）。 請參閱圖4，支架40包括主體41與一對側壁42，所述侧壁 42形成於主體41兩端。在兩個側壁42之間安裝有複數透 鏡50 ’所述透鏡50具有與鐳射晶片30相同的數目，且二 者一一對應。每一個側壁42包括外表面423、固定面424 及通孔420 ’所述固定面424與基板20相對並透過塗膝枯 貼於所述基板20，所述通孔42貫穿於所述固定面424與所 述外表面423之間《組裝支架40至基板20上時，先將固定 面424進行點勝’本實施方式中’將固袁面;424塗光敏勝 (UV膠），透過熱固化制程將支架40賴貼定位於基板2〇 。所述通孔420的設置使得、固定®《24與支架外表面423 相通’增加固定面424與外界接觸面積，從而加速光敏膠 (UV膠）固化。使得支架4》每板短，的時間内被固定於基 板20，從而防止在熱固定制程過程中，支架40相對基板 20的位置漂移，即防止透鏡50相對鐳射晶片30的位置漂 移，進而實現透鏡50與鐳射晶片30之間精確對位，實現 高精度的封裝技術。本實施方式中，所述通孔420垂直於 所述基板20，使得外界空氣快速到達所述固定面424，以 加速UV膠的固化。 每一個側壁42包括固定柱422，固定柱422與所述固定孔 28一 相對設置。每一個固定柱622從相應側壁42的固定 表單編號Α0101 第7頁/共18頁 0992049825-0 [0013] 201210010 面424向基板20方向延伸。組裝時，每一個固定柱422插 入相應的固定孔28，以將支架40定位於基板2〇。固定柱 422與固定孔28的配合加強了支架40與基板20之間的連 接的穩定性’當基板20發生變形導致固定面424與基板20 之間的UV膠失效時，固定柱422與固定孔28的配合能夠有 效防止支架40與基板20分離，提高產品良率。 [0014] 本發明還提供一種光收發器200的製造方法，步驟如下。 [0015] 步驟1 :提供基板20，並對基板20進行精確蝕刻形成複數 透光孔24、複數收容槽26及複軚固定孔28。其它實施方 式中，也可以透過同軸鑽孔的方式製造所述透光孔24、 收容槽26及固定孔28。其中，基板2〇包括第一表面22、 與第一表面22相對的第二表面23 »每一姻收容槽26的半 徑大於每一個透光孔24的半徑，每一個透光孔24與每一 個收容槽26連通並同軸設計》每一個收容槽26從第一表 面22向第二表弗23凹設。 [0016] 步驟2 :於所述收容槽26内設置焊墊29，其中每個收容槽 26内設置兩個焊塑*29，並將鐳射晶片30焊接於收容槽26 内。其中’每一個鐳射晶片30均包括一個發光元件3〇1， 所述發光元件301位置相應的鐳射晶片3〇的中心位置，並 與所述透光孔24相對。 [0017] 步驟3 .將驅動晶片60透過打線方式焊接於基板2〇之第二 表面2 3 ’用於驅動鐳射晶片3 〇。 [0018] 步驟4 :提供支架40，其包括主體41與一對侧壁42，所述 側壁42形成於主體41兩端。在兩個側壁42之間安裝有複 099128370 表單编號A0101 第8頁/共18頁 0992049825-0 201210010 [0019] 〇 [0020] [0021] [0022] 數透鏡50 ’所述透鏡50具有與錄射晶片30相同的數目’ 且二者一一對應。每一個侧璧42包括外表面423、固定面 424及通孔420，所述固定面424用於與所述基板20配合 以將所述支架40並透過塗膠粘貼於所述基板20 ’所述通 孔42貫穿於所述固定面424與所述外表面423之間》 步驟5 :安裝複數透鏡50於所述支架40上，所述透鏡50位 於所述侧壁42之間，且與所述透光孔24對應設置，用於 接收所述鐳射晶片30發出的訊號。 步驟6 :將固定面424進行點膠，本實施方式中，將固定 面424塗光敏膠（UV膠）。 步驟7 :將固定柱422安裝於固定孔28内，並使固定面 424貼合於基板20，從而實現將支架40安裝於基板20， 並透過熱固化制程將支架40粘貼定位於基板20。 透過上述方法製成的光收發器200，透過所述通孔420的 設置使得固定面424與文架:i卜4義士"423相遠，增加固定面 4 2 4與外界接觸面秦’极而加展光敏膠（U V膠）固化。使 1 ‘ f ί 得支架40在很短的時間内‘固定於基板2〇，從而防止在 熱固定制程過程中’支架40相對基板20的位置漂移，即 防止透鏡50相對錯射晶片30的位置漂移，進而實現透鏡 50與鐳射晶片30之間精確對位，實現高精度的封裝技術 。同時，固定柱422與固定孔28的配合加強了支架4〇與基 板20之間的連接的穩定性，當基板2〇發生變形導致固定 面424與基板20之間的UV谬失效時，固定柱422與固定孔 28的配合能夠有效防止支架4〇與基板2〇分離，提高產品 099128370 表單編珑Α0101 第9頁/共18頁 0992049825-0 201210010 良率。 [0023] 綜上所述，本發明符合發明專利要件，爰依法提出專利 申請。惟，以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案技藝之人士，在爰依本案發明精神所作之等效 修飾或變化，皆應包含於以下之申請專利範圍内。 【圖式簡單說明】 [0024] 圖1所示為本發明光收發器的結構示意圖。 [0025] 圖2所示為本發明光收發器之基板的結構示意圖。 [0026] 圖3所示為本發明光收發器之設置鐳射晶片與驅動晶片的 基板的示意圖。 [0027] 圖4所示為本發明光收發器之設置鐳射晶片與驅動晶片的 基板與支架的分解示意圖。 【主要元件符號說明】 [0028] 光收發器 200 [0029] 基板 20 [0030] 第一表面 22 [0031] 第二表面 23 [0032] 透光孔 24 [0033] 收容槽 26 [0034] 固定孔 28 [0035] 焊墊 29 099128370 表單編號A0101 第10頁/共18頁 0992049825-0 201210010 [0036] 鐳射晶片 30 [0037] 發光元件 301 [0038] 支架 40 [0039] 主體 41 [0040] 侧壁 42 [0041] 通孔 420 [0042] 固定柱 422 [0043] 外表面 423 [0044] 固定面 424 [0045] 透鏡 50 [0046] 驅動晶片 60 099128370 表單編號A0101201210010 VI. Description of the Invention: [Technical Field] [0001] The present invention relates to an optical transceiver and a method of fabricating the same, and more particularly to a method of fabricating an optical transceiver for an optical component and a precise alignment of a lens. [Prior Art] [0002] Optical communication has gradually become an emerging and promising technology, which is being widely used. 'It mainly uses optical fiber to transmit data, which can achieve faster and larger communication bandwidth, and also Maintain the quality of the transmission. Usually, optical communication mainly uses an optical transceiver to convert optical signals in an optical fiber line with electrical signals in an electronic device, thereby completing the rapid transmission of data. It can be seen that the performance of the optical transceiver directly determines the quality of data transmission. However, the alignment accuracy of the "emission element" and the paint mirror in the optical transceiver is an important factor in determining its performance. [0003] Therefore, how to achieve accurate alignment of the laser element and the lens in the optical transceiver becomes light. A major issue in transceiver design [Invention] 】:: '.. , ν [0004] In view of this, it is necessary to provide an optical transceiver in which the erroneous component and the lens have high alignment accuracy. [0005] In addition, there is still a need to provide an optical transceiver manufacturing method for accurately aligning a light-emitting element of a laser wafer with a lens by a simple process. [0006] An optical transceiver for performing an optical signal in an embodiment of the present invention The conversion includes a substrate, a plurality of laser wafers, a bracket and a plurality of lenses. The substrate comprises a plurality of light-transmissive holes, a plurality of receiving grooves and a plurality of fixing holes, and each of the receiving grooves has a radius larger than a radius of each of the light-transmissive holes, each of which is transparent to 099128370 Form No. 1010101 0992049825-0 201210010 The light hole is connected and coaxial with each of the receiving slots. The clock-emitting wafers are respectively disposed in the receiving slots for transmitting and receiving the light. The bracket includes a pair of side walls 'each side wall includes an outer surface, a fixed self, a through hole and a fixed cymbal, the fixing surface is opposite to the substrate and is adhered to the substrate, the through hole penetrating through the substrate Between the fixing surface and the outer surface, the fixing jaw cooperates with the fixing hole to enhance the stability of the speed connection between the bracket and the substrate. The lens is mounted on the bracket and located on the side wall And corresponding to the transparent hole for receiving a signal emitted by the wafer. [0007] A method for fabricating an optical transceiver according to an embodiment of the present invention, comprising providing a substrate, the substrate including a plurality a transparent hole, a plurality of receiving slots, and a plurality of fixing holes, wherein each of the receiving slots has a radius larger than a radius of each of the light transmitting holes, and each of the light transmitting holes is coaxial with each of the receiving slots and coaxial. The laser wafer is soldered to the Inside the receiving slot, a driving wafer is soldered to the substrate for driving the laser wafer. A bracket is provided, the bracket includes a pair of side walls, each side wall including a surface, a fixing surface, a through hole and a solid Fixing a column, the fixing surface is opposite to the substrate and pasted on the substrate, and the through hole is penetrated between the fixing surface and the outer surface. The fixing post cooperates with the fixing hole to enhance the stability of the connection between the bracket and the substrate. The ampoule lens is mounted on the bracket, and the lens is located between the sidewalls Correspondingly, the light hole is configured to receive the signal from the laser chip, and the fixing surface is dispensed. The fixing column is installed in the fixing hole, and the bracket is pasted and positioned by the heat curing process. [0008] The optical transceiver of the present invention is fixed to the substrate by the arrangement of the through holes so that the bracket is fixed on the substrate in a short time of 099128370 Form No. Α0101, Page 5 / 18 pages 0992049825-0 201210010, thereby preventing heat. During the fixed process, the position of the bracket relative to the substrate drifts, and the precise alignment between the lens and the laser wafer is realized, realizing high-precision packaging technology. At the same time, the cooperation of the fixing main body and the fixing hole enhances the stability of the connection between the bracket and the substrate. When the substrate is deformed, the cooperation of the fixing post and the fixing hole can effectively prevent the separation of the bracket from the substrate and improve the product yield. Embodiments [0009] FIG. 1 is a schematic diagram showing the structure of an optical transceiver 200 of the present invention. In the embodiment, the optical transceiver 200 is used for performing photoelectric signal conversion, and includes a substrate, a plurality of reflective wafers, a medium carrier 60, an east frame 40, and a plurality of lenses. FIG. 2 shows the light of the present invention. Schematic diagram of the substrate 20 of the transceiver. The substrate 2 includes a first surface 22, a second surface 23 opposite to the first surface 22, a plurality of light-transmissive holes 24, a plurality of receiving grooves 26, and a plurality of fixing holes 28. The fixing hole 28 surrounds the receiving groove 26, and the reference is symmetrically distributed on the substrate 2〇. The radius of each of the receiving grooves 26 is larger than the radius of each of the light-transmitting holes 24, and each of the light-transmitting holes 24 communicates with each of the receiving grooves 6 and is coaxially designed. Each of the receiving slots 26 is recessed from the first surface 22 to the second surface 23 for receiving the corresponding misaligned wafer 30. Each of the light transmission holes 24 penetrates the second surface 23. Each of the laser wafers 30 includes a light-emitting element 301 located at a center of the corresponding laser wafer 3'' and opposed to the light-transmissive aperture 24. Light emitted by each of the light-emitting elements 301 is radiated through the corresponding light-transmissive holes 24 to the corresponding lenses 50 for receiving or transmitting photoelectric signals. In the present embodiment, each of the light transmission holes 24 and each of the receiving grooves 26 are formed by coaxial drilling or precision etching. The number of the fixing holes 28 is two 099128370 Form No. A0101 Page 6 / 18 pages 0992049825-0 201210010 [0011] [0012] ο ❹ 099128370, the receiving slots 26 are arranged in a row and located in the fixing hole The laser wafer 30 is soldered to the receiving groove 26 of the substrate 20 through the bonding pad 29 for transmitting and receiving photoelectric signals. The drive wafer 60 is soldered to the second surface 23 of the substrate 2A for driving the laser wafer 30 (shown in Figure 3). Referring to FIG. 4, the bracket 40 includes a main body 41 and a pair of side walls 42 formed at both ends of the main body 41. A plurality of lenses 50 are mounted between the two side walls 42. The lenses 50 have the same number as the laser wafer 30, and the two are in one-to-one correspondence. Each of the side walls 42 includes an outer surface 423 , a fixing surface 424 , and a through hole 420 ′. The fixing surface 424 is opposite to the substrate 20 and is pasted to the substrate 20 through a knee coating. The through hole 42 extends through the fixing surface 424 . Between the outer surface 423 and the outer surface 423, when the bracket 40 is assembled onto the substrate 20, the fixing surface 424 is firstly smashed. In the present embodiment, the solid surface is 420; the 424 is coated with a photosensitive paste (UV glue), and the heat curing process is performed. The holder 40 is positioned on the substrate 2〇. The through hole 420 is disposed such that the fixing "24 communicates with the outer surface 423 of the bracket" increases the contact area of the fixing surface 424 with the outside, thereby accelerating the curing of the photosensitive glue (UV adhesive). The bracket 4 is fixed to the substrate 20 in a short period of time, thereby preventing the position of the bracket 40 from drifting relative to the substrate 20 during the heat fixing process, that is, preventing the position of the lens 50 from drifting relative to the laser wafer 30, thereby realizing the lens. The precise alignment between the 50 and the laser wafer 30 enables high-precision packaging technology. In this embodiment, the through hole 420 is perpendicular to the substrate 20 such that the outside air quickly reaches the fixing surface 424 to accelerate the curing of the UV glue. Each of the side walls 42 includes a fixing post 422, and the fixing post 422 is disposed opposite to the fixing hole 28. Each of the fixing posts 622 extends from the corresponding side wall 42 by the form number Α0101, page 7 of 18, 0992049825-0 [0013] 201210010, the face 424 extends toward the substrate 20. When assembled, each of the fixing posts 422 is inserted into a corresponding fixing hole 28 to position the bracket 40 to the substrate 2''. The cooperation of the fixing post 422 and the fixing hole 28 enhances the stability of the connection between the bracket 40 and the substrate 20. When the substrate 20 is deformed to cause the UV glue between the fixing surface 424 and the substrate 20 to fail, the fixing post 422 and the fixing hole The cooperation of 28 can effectively prevent the bracket 40 from being separated from the substrate 20 and improve the product yield. [0014] The present invention also provides a method of manufacturing the optical transceiver 200, the steps are as follows. [0015] Step 1: The substrate 20 is provided, and the substrate 20 is precisely etched to form a plurality of transparent holes 24, a plurality of receiving grooves 26, and a tamping fixing hole 28. In other embodiments, the light-transmitting holes 24, the receiving grooves 26, and the fixing holes 28 may be manufactured by coaxial drilling. The substrate 2 includes a first surface 22 and a second surface 23 opposite to the first surface 22. The radius of each of the receiving grooves 26 is larger than the radius of each of the transparent holes 24, and each of the transparent holes 24 and each of the holes The receiving slots 26 are connected and coaxially designed. Each of the receiving slots 26 is recessed from the first surface 22 to the second surface 23 . [0016] Step 2: A solder pad 29 is disposed in the receiving slot 26, wherein two soldering holes *29 are disposed in each of the receiving slots 26, and the laser wafer 30 is soldered into the receiving slot 26. Wherein each of the laser wafers 30 includes a light-emitting element 301 which is positioned at a center position of the corresponding laser wafer 3 and opposed to the light-transmitting hole 24. [0017] Step 3. The driving wafer 60 is soldered to the second surface 2 3 ' of the substrate 2 by wire bonding for driving the laser wafer 3 . [0018] Step 4: A bracket 40 is provided which includes a main body 41 and a pair of side walls 42 formed at both ends of the main body 41. Between the two side walls 42 is mounted a complex 099128370 Form No. A0101 Page 8 / 18 pages 0992049825-0 201210010 [0019] [0021] [0022] The lens 50' has the lens 50 The same number of shots 30 are taken' and the two correspond one-to-one. Each of the side sills 42 includes an outer surface 423, a fixing surface 424, and a through hole 420, and the fixing surface 424 is configured to cooperate with the substrate 20 to adhere the bracket 40 to the substrate 20 through a glue coating. a through hole 42 is formed between the fixing surface 424 and the outer surface 423. Step 5: mounting a plurality of lenses 50 on the bracket 40, the lens 50 being located between the side walls 42 and The light transmission holes 24 are correspondingly disposed for receiving signals emitted by the laser wafer 30. Step 6: Dispensing the fixing surface 424. In the embodiment, the fixing surface 424 is coated with a photosensitive glue (UV glue). Step 7: The fixing post 422 is mounted in the fixing hole 28, and the fixing surface 424 is attached to the substrate 20, so that the bracket 40 is mounted on the substrate 20, and the bracket 40 is pasted and positioned on the substrate 20 through a thermal curing process. The optical transceiver 200 manufactured by the above method is disposed through the through hole 420 such that the fixing surface 424 is far away from the frame: i Bu 4 士 士 423, and the fixing surface 4 2 4 is externally contacted with the surface The addition of photosensitive glue (UV glue) is cured. The holder 40 is fixed to the substrate 2 in a short period of time to prevent the position of the holder 40 from drifting relative to the substrate 20 during the heat-fixing process, i.e., preventing the position of the lens 50 from being misaligned with the wafer 30. Drifting, in turn, achieves accurate alignment between the lens 50 and the laser wafer 30, enabling high-precision packaging techniques. At the same time, the cooperation of the fixing post 422 and the fixing hole 28 enhances the stability of the connection between the bracket 4 〇 and the substrate 20, and when the substrate 2 变形 deforms to cause the UV 之间 between the fixing surface 424 and the substrate 20 to fail, the fixing column The cooperation of the 422 and the fixing hole 28 can effectively prevent the bracket 4〇 from being separated from the substrate 2, and improve the yield of the product 099128370 Form Compilation 0101 Page 9/18 Page 0992049825-0 201210010. [0023] In summary, the present invention complies with the requirements of the invention patent, and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0024] FIG. 1 is a schematic structural view of an optical transceiver of the present invention. 2 is a schematic structural view of a substrate of an optical transceiver of the present invention. 3 is a schematic view showing a substrate for mounting a laser wafer and a driving wafer of the optical transceiver of the present invention. 4 is an exploded perspective view showing a substrate and a holder for mounting a laser wafer and a driving wafer of the optical transceiver of the present invention. [Main Component Symbol Description] [0028] Optical Transceiver 200 [0029] Substrate 20 [0030] First Surface 22 [0031] Second Surface 23 [0032] Light Transmission Hole 24 [0033] Storage Groove 26 [0034] Fixed Hole 28 [0035] Solder Pad 29 099128370 Form No. A0101 Page 10 / Total 18 Page 0992049825-0 201210010 [0036] Laser Wafer 30 [0037] Light Emitting Element 301 [0038] Bracket 40 [0039] Main Body 41 [0040] Side Wall 42 [0041] Through Hole 420 [0042] Mounting Post 422 [0043] Outer Surface 423 [0044] Mounting Face 424 [0045] Lens 50 [0046] Drive Wafer 60 099128370 Form No. A0101
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