TW201208137A - Method for manufacturing ceramic substrate and semiconductor package using the ceramic substrate - Google Patents

Abstract

Disclosed herein is a method of manufacturing a ceramic substrate for a semiconductor package which can prevent interface separation and can exhibit high reflectivity. The method includes the steps of: preparing an upper ceramic substrate which a cavity having an inside wall is formed through, wherein the inside wall is inclined by a predetermined angle to a lower ceramic substrate; coating the inside wall of the cavity with a ceramic material to form a reflecting layer; disposing a molded body on the lower ceramic substrate, wherein the molded body comprises the upper ceramic substrate and the reflecting layer; and heating-treating the lower ceramic substrate and the molded body to integrate the lower ceramic substrate and the molded body.

Description

201208137, the invention description: [Technical field to which the invention pertains] The present invention relates to a method for manufacturing a semiconductor light-emitting diode (LED), i: a green plate, using a neon light-emitting diode as a light-emitting elementary cow. A ceramic substrate is used as the semiconductor package. [Prior Art] A polar body (hereinafter referred to as "LED") is a semiconductor element which is composed of a composite semi-conductive material, for example, _, (4), and 22, which are combined with each other to form a second material. λ, 'And (4) to achieve a variety of colors. Currently, this semiconductor component! $ is used in package form for electronic components. Figure 1 is a side cross-sectional view of a transmission and packaging package. Referring to Fig. 1, the seal f includes two ceramic substrates 1 and 12, each of which is formed by a thin sheet. In the two pottery bases, 0'V: T is placed with the spokes 16 of the electrodes 14 spaced apart from each other. The lower pottery base area is used to mount the LED l8. Disposed on the electrode 6: The second lead 2 is bonded to the electrode M. Electrodes 14 and 16 are the bottom of the extension 1 . In the upper ceramic substrate 12, a cavity is formed therein, and the cavity is surrounded by the mounting area of the coffee maker 18. In the t text, the cavity is formed by stamping or cutting, as shown in Fig. 0. The cross section of the μ-shi ceramic substrate 12 is always perpendicular to the lower ceramic substrate. The reason is that it is difficult to form a reflective layer of a high-quality f on the upper substrate 12, unlike the package formed by the ruthenium. v Therefore, in order to form a high-quality reflective layer, as shown in Fig. 2, a concave substrate 12 is metallized by the bevel of the upper ceramic substrate 12, followed by silver (Ag) on the chain. Figure 2 shows a 4/22

S 201208137 A reflective layer 22 formed of silver enamel. Therefore, compared to the LED seal in Figure 1, the efficiency of the package. As shown in Fig. 2, since the inclined surface of the substrate 12 is metallized, the reflective layer 22 in Fig. 2 may be unevenly cut, and the upper surface of the substrate 12 must be slanted. 'Second (Ag), however the plating is not uniform. For this reason, the optical package of m is not as good as that of the mixture of the Wei material and the epoxy material in the cavity of the substrate 12 . In this production form, the refractory layer is based on the epoxy resin contained in the disc layer and the dichroic layer contained in the reflective layer: the difference between the phosphor layer and the reflective layer 22 is based on this. And the reflective layer 22 can be mutually mutually [invention] Therefore, the present invention is to solve the above problems, and the present invention provides a method for manufacturing a ceramic coffee, which can be electroplated; The highly reflective material of the material forms a reflective layer that increases light efficiency. Another object of the present invention is to provide a high quality semiconducting 1 with a learning efficiency and to solve the problem of lowering the material in the same nature. : The above object, the present invention provides a method for making a shovel of the terracotta. 4 . Preparing a cavity having an inner wall penetrating through the vertical substrate, wherein the inner wall is inclined at an angle of a shape. The substrate is tilted 5/22 201208137 oblique; coating the inner wall of the cavity with a material to form a reflective layer; disposing a molded body (_ded bQdy) on the underlying substrate, wherein the molding system includes a substrate and a reflective layer; and heat treating the substrate The underlying substrate and the core body are combined to bond the lower substrate and the simplified body. The financial method may further include coating the ceramic material on the upper surface of the upper substrate, but does not include the area in which the molded body is disposed. Another aspect of the present invention provides a method of manufacturing a ceramic substrate, comprising: filling a cavity with a ceramic material, the cavity being formed through a substrate of a package body, wherein the substrate is located The bottom of the silk plate P is made of a ceramic material and is inwardly directed in a direction perpendicular to the cavity, and the ceramic material filled in the cavity is removed by an air suction device to form a reflective layer. The reflective layer is a ceramic material remaining on the inner wall of the cavity and is a side of the upper surface of the support; a molded body is disposed on the lower ceramic substrate, and the (four) body includes the upper substrate and the reflection a layer; and heat treating the lower ceramic substrate and the molded body to bond the lower ceramic substrate and the tantalum body. Here, the reflective layer can have an inwardly curved surface. The upper ceramic substrate and the lower ceramic substrate may be made of the same ceramic material (e.g., 〇w temperature c〇fired (10) 匕, LTCC). The ceramic material may be a mixture of ceramic powder and at least one selected from the group consisting of free titanium dioxide (Τι〇2), zirconium dioxide (Zr〇2) and zinc oxide (Zn〇). According to still another aspect of the present invention, there is provided a method of manufacturing a ceramic substrate, comprising: preparing an upper ceramic substrate having a cavity having an inner wall formed therein, wherein the inner wall is inclined downward toward the ceramic substrate at a predetermined angle. The upper ceramic substrate is disposed on the ceramic substrate under the sea; and the upper ceramic substrate and the lower ceramic substrate are heat treated to bond the lower ceramic substrate and the upper ceramic substrate 6/22

S 201208137 board 'where the shouting and the shouting substrate are made of reflective Taoman material. The reflecting pottery (four) material is selected from the group consisting of shouting powder, free dioxins, mono-oxidation and zinc oxide. a mixture of at least one of them. The present invention provides a semiconductor package comprising: a cavity having an inner wall through which a dummy substrate is formed, wherein the inner wall is inclined at a predetermined angle toward a bottom surface of the substrate; a light-emitting element mounted in the cavity; And a ceramic material coated on the inner wall. The D-semiconductor package can further include a ceramic material coated on the bottom surface of the cavity. Another aspect of the present invention provides a semiconductor package having a cavity δ having a cavity extending through a ceramic substrate formed therein, wherein the inner wall 仏 is perpendicular to a bottom surface of the H substrate; and the light is mounted on the cavity The bull and the reflective layer are made of Tauman material and formed on the bottom surface of the cavity, and cover the mounting area of the light-emitting element and the area outside the wire bonding area. & Here, the mixture is based on (iv) t powder, and at least a mixture of free titanium dioxide, and zinc and zinc oxide. The shot layer can have an inwardly curved surface. The scoop of the present invention is to provide a guide member, and the vertical cavity is formed in the cavity, wherein the predetermined angle of the shaft is inclined to the bottom surface of the shouting substrate, and is mounted on The U-shaped member of the mounting portion of the light-emitting component of the cavity, wherein the handle is entirely made of reflective ceramic: a new material, and at least one of the last and free-dioxide m storage μ (10) Tao Jing powder. 7/22 201208137 selected from the group consisting of zinc. [Embodiment] The above and other objects, features and advantages of the present invention will become more apparent from the accompanying drawings. Hereinafter, the preferred embodiment of the present invention will be described in detail. 3 to 6 show a method of manufacturing a ceramic substrate according to a first embodiment of the present invention, and a substrate manufactured by the method of the fourth embodiment. In the following description of the method for manufacturing a ceramic substrate, a process for manufacturing a single Tauman substrate will be described. [In general, since a plurality of shouting substrates are simultaneously produced, such a method of manufacturing a substrate is not limited to a manufacturing sheet. - (d) the process of the substrate. Further, in the present method, the Tauman substrate is formed by performing a single heat treatment. Specifically, the material constituting the substrate has a soft property 'until the process described in FIG. 6 below is completed, in other words, before the heat is performed, and the heat treatment* of the woven fabric of FIG. 6 is hardened, That is, after the molded body is attached to the lower ceramic substrate 38. Referring to Fig. 3 'first', a cavity having an inner wall 45 is formed to form a substrate thereon. (4) 45 is inclined to the bottom surface of the shouting substrate by a predetermined period. On the present day, the angle of the inner wall 45 can be varied depending on the desired angle of reflection. The upper ceramic substrate 44 is perforated to form a cavity. The upper ceramic substrate 44 may be formed by stacking a plurality of side sheets, or may be formed of a ceramic sheet having a predetermined thickness. . As shown in Fig. 3, the upper substrate 44 can be formed in each unit area of a large board. The cell area is the smallest area required to fabricate a ceramic substrate, and may include a minimum area in which the upper and lower (four) substrates can be stacked and then separated from each other by cutting. 8/22

S 201208137 Referring to Fig. 4', the inner wall of the upper ceramic substrate 44 is coated with a ceramic material to form a molded body having the reflective layer 46. The ceramic material may be composed of the same ceramic material as that of the upper ceramic substrate 44. Thus, for example, the reflectivity of the reflective layer 46 can be increased by the addition of a predetermined reflective material (e.g., low temperature co-fired ceramic (LTCC)) to the ceramic powder. The pre-reflected reflective material may comprise at least one selected from the group consisting of free titanium dioxide, dioxins, and zinc oxide. The weight ratio of the reflective material to the ceramic powder can be set to about 15%. In the following tests, the weight ratio of the reflective material to the ceramic powder used in the reflective layer 46 was also about 15%. However, the composition of the reflective material is not limited thereto. By forming the molded body, the homogeneous molded body having the reflective layer 46 can be easily formed by a process of coating the highly reflective ceramic material, thereby increasing the yield. The process of forming a molded body in the present invention has additional advantages. Since all of the formed molded bodies usually comprise a ceramic material, they can be formed into a ceramic substrate by a single heat treatment of subsequent entanglement, thereby interposing between the reflective crucible 46 and the upper ceramic substrate 44, and the reflective layer 46 and under the heat treatment. The interface separation between the ceramic substrates 38 is minimized and the integrity between the above is maximized. Referring to Figures 5 and 6, the molded body is disposed on the flat lower ceramic substrate 38. After the processes of Figures 5 and 6, each cell area is cut and then heat treated. After the heat treatment is completed, the ceramic substrate has a structure as shown in Fig. 6. In other words, the molded body is disposed on the lower ceramic substrate 38, and the mother cell regions are each cut to form a plurality of ceramic substrates, and the plurality of ceramic 9/22 201208137 substrates are placed in a supply box or the like. At the base level, each pottery material and each other;; 峨 及 及 反射 及 及 及 及 麦 麦 麦 麦 麦 麦 麦 麦 麦 麦 麦 麦 麦 麦 麦 麦 麦 麦 麦 麦 麦 麦 麦 麦 麦 麦 麦 麦 麦 麦 麦 麦 麦 麦 麦 麦(4) The substrate produced by 阙 can be a combination = competition substrate. Therefore, even if the semiconductor component is produced by filling a tantalum-filled material (such as a transparent stone material or the like) on a ceramic substrate, the interface separation between materials can be minimized. 8 and 7 are side cross-sectional views of another ceramic tile substrate according to a modified embodiment of the first embodiment of the present invention. Figure 7 is a side cross-sectional view of a ceramic substrate which is additionally coated with a ceramic material of the reflective layer 48 except for the upper substrate 44 and the reflective layer 46 (a). The process of the surface of the substrate is made of a reflective layer 48 made of a ceramic material, and the area corresponding to the cavity of the surface of the substrate is coated with a ceramic material. The coating of the surface of the substrate can be carried out between disposing the molded body on the lower ceramic substrate 38 and performing heat treatment. The reflectance of the semiconductor package can be improved by the formation of the reflective layer formed on the lower ceramic substrate 38 after the formation of the semiconductor package is completed by the later Annon light-emitting element and filling of the light-distributing layer. Fig. 8 is a view showing a semiconductor county side view of a ceramic substrate manufactured by using the first embodiment of the present invention. Figure Transparent stone eve material (four) is filled with silk. Referring to Fig. 8', electrodes which are not shown in the sixth and seventh figures are formed on the upper and lower surfaces of the lower ceramic substrate 38. Electrode 5〇a and through the system 10/22

S 201208137 is connected to the light emitting element 52 by its upper surface, and is electrically connected to the mounting semiconductor package (not shown) via its lower surface. The reflective layer 48 may be applied to the surface of the underlying substrate 38, but does not include the connection electrodes 50a# 5〇b and the region in which the ceramic substrate 44 is disposed. However, the reflective layer 48 can be formed and covered by the height of the control electrodes 5a and 5b to cover the electrode 50b, but not covering the electrode 5a. Fig. 9 through Fig. 13 show a method of manufacturing a ceramic substrate according to a second embodiment of the present invention, and a ceramic substrate produced by the method. The upper Tauman substrate was prepared by referring to A? and Fig. 9'. The upper ceramic substrate includes a cavity 3〇 and a support 30b. The cavity has a vertical wall surface 30a. Referring to the upper side surface of FIG. 9, the vertical wall surface 30a may be separated from the support body 30b. However, as shown in FIG. 9, the upper ceramic substrate 3 is permeable to simultaneously manufacture a plurality of ceramic substrates and cut each of the regions. Made in the way. The cavity is formed through the upper ceramic substrate 30. The upper ceramic substrate 30 may be formed by stacking a plurality of ceramic sheets, or may be formed of a ceramic sheet having a predetermined thickness. The cavity can be formed vertically by stamping or cutting. The support body 30b is formed on the bottom surface of the vertical wall surface 30a of the upper ceramic substrate 30 so as to protrude inward. Both the vertical wall surface 30a and the support body 30b can be made of a ceramic material such as low temperature co-fired ceramic (LTCC). As shown in Figure 9. The upper ceramic substrate 30 can be formed one by one in each cell region of a large ceramic plate. The cell area is the minimum area required to fabricate a ceramic substrate, and may include a minimum area in which the upper ceramic substrate and the lower ceramic substrate are laminated and separated from each other by cutting. Refer to Figure 10. A photomask 32 having a hole pattern is placed over the vertical wall surface 30a of the upper ceramic substrate 30. In this case 11/22 201208137, 'the reticle 32 can be installed so that it does not cover the opening of the cavity of the upper Tauman base, and then the high-reflection pottery material 36 is filled with the squeegee 34 (squeegee) The cavity formed in the upper ceramic substrate 3 is inserted. That is, the highly reflective Tauman material 36 is filled in the cavity by a printing process using the squeegee 34. The highly reflective material 36 may comprise the same ceramic material as the vertical wall surface 30a and the support body 30b constituting the upper substrate i. Thus, for example, the reflectivity of a ceramic recording plate can be improved by adding a predetermined reflective material (e.g., low temperature co-fired ceramic (LTCC)) to the end of the earth. The description of this process is the same as that of the first embodiment shown in Figs. Refer to Figure η. The reticle 32 is removed, and then the pottery: is the material 36 which is closely attached to the inner side of the vertical wall and the upper side of the branch. In other words, the central portion of the two-filled ceramic material 36 is sucked to discharge the middle portion. Therefore, as shown in Fig. 7, the ceramic material 36 remains only on the inner side of the vertical surface (the inner wall of the concave cavity) and the upper side of the support body: the ceramic material 36 will become the curved reflection layer %. The substrate 3G including the curved reflective layer 36 is manufactured by the process of FIGS. 9 to n, and is referred to as a molded body. u The molded body according to the second embodiment of the present invention can be easily formed by a highly reflective filling and suction process due to the molded body containing the curved reflective layer, as compared with the conventional === Forming process for forming a molded body: In addition, since all the formed molded bodies usually contain tantalum and are formed by a single heat treatment to form a ceramic substrate, the vertical wall surface 3〇a and the heat treatment process are performed. The ceramic material 36, as well as the interface separation between the support 12/22 201208137 body 30b and the vertical wall 30a, is minimized. See Figure 12. The molded body is placed on the flat substrate of the flattened substrate. As described above, the reticle 32 is removed in the process of FIG. 11, but the reticle 32 can be removed after the process of FIG. 12, if necessary. After the process of Figure 12, each cell area is cut and heat treated. After the heat treatment is completed, the ceramic substrate has a structure as shown in FIG. In other words, the molded body is mounted on the lower ceramic substrate 38, and each of the unit regions is cut to form a plurality of H substrates, and the plurality of ceramic substrates are placed in an oven or the like. Next, when the plurality of ceramic substrates are subjected to heat treatment, each of the ceramic substrates forms a ceramic substrate including an upper ceramic substrate 30, which includes a vertical wall surface 30a and an upper side surface of the support body 30b, a lower ceramic substrate 38 and a reflective layer, which are mutually Combine. The reflective layer 4 is a ceramic material layer which is cured by heat treatment of the ceramic material 38. The ceramic substrate after heat treatment of FIG. 13 has a ceramic substrate manufactured by the second embodiment of the present invention because the upper ceramic substrate 30' and the reflective layer 4G both contain the same ceramic material. Ceramic bonded substrate. Therefore, even if the semiconductor package is filled with a Taman substrate with a filler such as a transparent material or the like, there is an advantage that the interface separation between materials is minimized. Figure 15 to Figure 15 are side cross-sectional views showing a semiconductor package using a Tauman substrate manufactured in accordance with a second embodiment of the present invention. Refer to Figure 14. The light-emitting element 52 is mounted on a light-emitting element mounting region of the ceramic substrate, which includes an upper ceramic substrate 3, a lower ceramic substrate 38, and a reflective layer 40. The light-emitting element 52 can be a light-emitting diode (LED), but the invention is not limited thereto. 13/22 201208137 The mounting area refers to an area in which the light-emitting elements 52 are mounted. The electrode 5a of the gallery, which is originally to the light-emitting element, may be present in the mounting area. Further, the other electrode 50b is disposed on a portion of the lower ceramic substrate 38. In all embodiments of the present invention, the lower ceramic substrate 38 has a plurality of via holes formed thereon to connect the electrodes 50a and 50b with a substrate (not shown) on which the semiconductor package is mounted, and the electrodes 50a and 5b It is formed in the through hole. The light-emitting element & ^ is connected to the electrode cell and the electrification by direct contact or wire bonding. The reflective layer 40 has an inwardly rounded curved surface. However, the shape of the layer 40 can be changed to various shapes by the suction method or heat treatment of (4) (four) 36. The reverse direction of the semiconductor package having a shape different from that of the above-mentioned (four) circular surface (four) 15° fifteenth-thickness has a reflective layer 42 different in shape from the half-shaped member of FIG. The reflective layer 42 in Fig. 15 has a medium = 3: curved surface, i.e., a convex curved surface. Thus, the semi-conducting of the light-emitting elements of FIG. 14 and FIG. 15 and the second embodiment of the present invention shown in FIG. 15 may additionally include a side or color filler in the semiconductor. The package is a combination of ceramic and ceramic. As described above, the method of manufacturing the ceramic board by the intermediate interface can reduce the package of the body package, and the side view of the semiconductor package of the ceramic substrate made by the method (4); Soil 14/22 201208137 Referring to Figures 16 to 18', the method of manufacturing a ceramic substrate according to a third embodiment of the present invention is characterized in that both the upper ceramic substrate 56 and the lower ceramic substrate 48 are made of the same reflective ceramic material. It is made and has no reflective layer as compared with the reflective layers 40, 42 and 46 of the first and second embodiments of the present invention. That is, the third embodiment of the present invention is characterized in that both the upper ceramic substrate 56 and the lower ceramic substrate 48 are made of the highly reflective ceramic material of the first and second embodiments of the present invention. ^ First, as shown in Figures 16 and 17, providing - a ceramic substrate 56 made of a highly reflective ceramic material, and a ceramic substrate 48 comprising the same material, stacked and heat treated to produce as shown in Figure 18. The ceramic substrate shown. Therefore, when the upper ceramic substrate and the lower ceramic substrate are provided so as to contain the highly reflective material from the beginning, the highly reflective ceramic substrate can be manufactured by a simple process which does not require the formation of the reflective layer. S ^ Refer to Figure 19. Since both the upper and lower ceramic substrates are made of a highly reflective ceramic material, a reflective layer formed in a region excluding the mounting of the light-emitting element and the wire bonding region as shown in Figs. 7 and 8 may not be necessary. Therefore, the semiconductor package can also be manufactured through a simple process. The semiconductor package manufactured in this manner is also mounted with an LED chip 52 as a light-emitting element. In this case, led

The electrode 5〇a is discharged and wire-bonded to the other electrode 5 (Fig. 2A is a comparison diagram of the effect of the semiconductor package using the high-reflection ceramic substrate in the conventional embodiment. Referring to Fig. 20, the first conventional substrate 1 is a ceramic substrate of a female semiconductor package which has been confirmed to have a tilted reflective layer. The second conventional substrate 2 is a semiconductor package substrate which is formed by 15/22 201208137 Ceramic substrate, which is then fabricated by filling the ceramic substrate with a highly reflective material to form a curved reflective layer. Comparing a conventional semiconductor package to produce a conventional semiconductor package fabricated using the first and second substrates 100 and 200 The performance of a semiconductor package using a highly reflective ceramic substrate 300 fabricated in accordance with an embodiment of the present invention. First, in terms of average total luminosity flux (average TLF), compared to conventional semiconductor packages The semiconductor package of the present invention exhibits improved performance. Therefore, it can be found that the semiconductor package of the present invention is compared to a conventional semiconductor package. Has dramatically improved optical efficiency. Next 'the CCT (Correlated color temperature, CCT) aspect of the present invention, a semiconductor package of a conventional semiconductor package with several

No difference. Therefore, the same color can be realized, and a light-emitting package having improved light-emitting efficiency can be provided. X As shown in FIG. 20, when the substrate 3 is fabricated using a highly reflective ceramic material, the ceramic substrate 300 is then applied to a light emitting semiconductor package which exhibits high optical efficiency when performing the same function. . Therefore, a large amount of light can be emitted through a relatively small number of semiconductor packages. Figure 21 is a graph comparing the wavelength of a conventional substrate with the wavelength of a ceramic substrate according to an embodiment of the present invention. (Refer to reference numeral 11 is a diagram illustrating the reflectance of the panel. Reference numeral 31 is a graph illustrating the reflectance of the ceramic substrate according to the embodiment of the present invention.) Referring to FIG. 21, it can be found that In the conventional substrate, the reflectivity of the ceramic substrate in the present invention has been greatly improved. Comparing the reflectance of the conventional substrate with the ceramic 16/22 201208137 porcelain substrate of the present invention in a region having a wavelength of 800 nm, it can be found that the reflectance of the conventional substrate is 85%, and the reflectance of the ceramic substrate of the present invention is 95%. . In particular, in the reflectance measurement of the region having a wavelength of 800 nm in Fig. 21, a ceramic substrate having a reflective layer composed of an oxidation fault as a highly reflective material was used. However, the reflectance of the ceramic substrate of the present invention is still affected by titanium dioxide or the like as long as the substance is a substance which can be contained in the above-mentioned highly reflective ceramic material. As described above, according to the present invention, since the high reflectance ceramic material adheres to the inner wall of the upper ceramic substrate to form the inner curved reflecting layer, the ceramic substrate can be manufactured extremely conveniently in a short time without performing the metal plating process. In addition, since metal plating is not required, optical deviation can be eliminated. Further, since a bonding substrate including a ceramic material as a main component can be manufactured, even when a phosphor layer is formed, the adhesion between the phosphor layer and the reflective layer becomes very high, thereby avoiding phosphorescence. The interface between the layer and the reflective layer is separated. The above description of the preferred embodiments of the present invention has been disclosed for the purpose of illustrating the preferred embodiments of the present invention. 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a side cross-sectional view showing a conventional LED package; FIG. 2 is another side sectional view showing a conventional LED package; FIG. 3 to FIG. 6 are diagrams showing the manufacture of a ceramic according to a first embodiment of the present invention. /22 201208137 A method of a porcelain substrate, and a ceramic substrate produced by the method; FIG. 7 is a side cross-sectional view of another ceramic substrate according to a modified embodiment of the first embodiment of the present invention; A side cross-sectional view of a semiconductor article of a ceramic substrate manufactured by a first embodiment of the present invention; and FIGS. 9 to 13 show a method of manufacturing a ceramic substrate according to a second embodiment of the present invention and a method of manufacturing the same using the method FIG. 14 to FIG. b are cross-sectional views showing a semiconductor element using a ceramic board manufactured according to a second embodiment of the present invention; FIGS. 16 to 19 are not according to the third aspect of the present invention. A method for manufacturing a Tauman substrate of an embodiment, a Tauman substrate manufactured by the method, and a side cross-sectional view of a semiconductor article using the ceramic plate; FIG. 20 is a conventional semiconductor package A comparison of a package with a semiconductor package using a highly reflective ceramic substrate of an embodiment of the present invention; and Fig. 21 is a comparison chart of wavelengths of a conventional substrate and a wavelength of a ceramic substrate according to an embodiment of the present invention. [Main component symbol description] 10 lower ceramic substrate 12 upper ceramic substrate 14 electrode 16 electrode 18 light emitting diode (LEr) 18/22

S 201208137 20 lead 22 reflective layer 30 upper pottery substrate 30a vertical wall 30b support 32 photomask 34 squeegee 36 highly reflective ceramic material 38 lower ceramic substrate 40 reflective layer 42 reflective layer 44 upper ceramic substrate 45 inner wall 46 reflective layer 48 Reflective layer 50a electrode 50b electrode 52 light-emitting element 56 on the substrate 19/22

Claims (1)

201208137 VII 1. Patent application scope: A method for manufacturing a ceramic substrate, comprising: preparing a cavity having an inner wall through which an inner wall system is formed, and the substrate scale is downwardly projected at a predetermined angle, The ceramic material is coated with the inner cavity of the cavity to form a reflective layer; the molded body is disposed on the lower substrate, the ceramic substrate and the reflective layer are formed by the towel; and the τ, including the upper ceramic = the lower (four) substrate domain body (10) Combine _ riding and molding ^SL 2. If you apply for a patent scope! The method of the method further comprising: coating the material on the upper surface of the lower ceramic recording board, but excluding the area in which the mold body is disposed. A method of manufacturing a ceramic substrate, comprising: filling a cavity with a ceramic material, the cavity being formed in a Tauman substrate including a support body, wherein the branch system at the bottom of the upper substrate Made of shouting material and protruding inwardly from the inner wall of the cavity, the scavenging material filled in the concave (four) is removed by an air suction device to form a reflective layer, wherein the radiation layer remains on the inner wall of the cavity And the upper side of the support; the molded body is disposed on the underarm ceramic substrate, wherein the molded body comprises the upper ceramic substrate and the reflective layer; and the heat-changing ceramic plate and the molded body are combined to bond the lower portion Shout the substrate and the molded body. 4. The method of claim 3, wherein the reflective layer has an inwardly curved surface. 20/22 S 201208137 5·If you apply for the scope of the patent, the jth or the sixth pottery is made up of the same ceramic surface: from the end, and free titanium dioxide, dioxide, and ί: = At least a mixture of the groups that make up the group. , a method for manufacturing a ceramic substrate, comprising: a cavity having an inner wall penetrating through an upper ceramic substrate formed in the middle, wherein the inner wall is inclined with a predetermined crucible; Providing the upper ceramic substrate on the lower ceramic substrate; and heat treating the upper (5) substrate and the lower substrate to bond the upper ceramic substrate; the lower door base, wherein the upper ceramic plate and the lower jaw (9) The substrate is made of: the reflective ceramic: the fine system is a mixture of a ceramic ship, and at least one selected from the group consisting of free = titanium-cerium oxide and zinc oxide. & 8. A semiconductor sealing member, comprising: a cavity having an inner wall penetrating through a substrate formed on a napkin thereof, wherein the inner wall is inclined at a predetermined angle toward a bottom surface of the ceramic plate; " mounted on the a light-emitting element in the cavity; a ceramic material coated on the inner wall; 10. wherein the porcelain material is a mixture of ceramic powder and at least one selected from the group consisting of free titanium dioxide, two gasification, and oxidation . For example, the semiconductor package of claim 8 of the patent scope is further coated with a Tauman material on the bottom surface of the 4 cavity. A semiconductor package comprising: 21/22 201208137 a cavity having an inner wall penetrating through a ceramic substrate formed therein, wherein the inner wall is perpendicular to a bottom surface of the ceramic substrate; a light-emitting element mounted on the cavity; and a reflective layer, It is made of a ceramic material and is formed on the inner and bottom surfaces of the cavity and covers a region other than the mounting region and the wire bonding region of the light-emitting element. 11. The semiconductor package of claim 10, wherein the ceramic material is a mixture of ceramic powder and at least one selected from the group consisting of free titanium dioxide, ceria, and zinc oxide. 12. The semiconductor package of claim 10, wherein the reflective layer has an inwardly curved surface. 13. A semiconductor package comprising: a ceramic substrate having an inner wall through which a ceramic substrate is formed, wherein the inner wall is inclined at a predetermined angle toward a bottom surface of the ceramic substrate; and a light emitting element mounted to the cavity a light-emitting element of the mounting area; wherein the ceramic substrate is entirely made of a reflective ceramic material, which is a ceramic powder, and at least one selected from the group consisting of free titanium dioxide, dioxins, and zinc oxide. mixture. 22/22 S