201207034 * 六、發明說明: 【韻~明所屬戈^ #支冬奸領^^】 技術領域 本發明係有關於光硬化性組成物及表面具有微細圖案 之成形體之製造方法。 背景技術 在光學構件、記錄媒體、半導體裝置等之製造中,以 紐時間形成微細圖案的方法已知有,將表面具有該微細圖 案之翻轉圖案的模具按壓至配置於基板表面之光硬化性組 成物,然後對該光硬化性組成物照射光,使該光硬化性組 • 成物硬化’而在基板表面形成微細圖案的方法(奈米壓印 法)(參照專利文獻1、2)。 Λ 然而’該方法中,由於光硬化性組成物之硬化物密接 於模具,故難以將硬化物與模具分離。因此,必須在模具 表面塗佈脫模劑。但是,由於脫模劑本身的膜厚、脫模劑 的塗布不均等,使精密地轉印模具的翻轉圖案變得困難。 作為可形成脫模性佳之硬化物的光硬化性組成物,已 有下述之提案。 ^ 0)活性能量射線硬化性組成物:包含有於分子中具有 氟化燒基與極性基之乾界面活性劑(專利文獻3 )。 松(2)光硬化性組成物:包含有含氟單體、不含氟單體、 氟界面活性劑或含氟聚合物、及聚合起始劑(專利文獻^。 然而’(1)、(2)之光硬化性組成物中有下述問題。 201207034 (i)氟界面活性劑為提升脫模性,常有將來自全氟辛燒 石黃酸之化合物作為原料使用、或微量地混入的情形。但來 自全氟辛烷磺酸之化合物受到了環境殘留性或生物蓄積 性的質疑,而其使用正受到限制。 (H)當氟界面活性劑具有末端甲基之聚(氧乙烯)結 構,且模具為具有複雜之微細圖案的模具、具有密集之微 細圖案的模具、微細圖案之區域面積廣大的模具時,將會 使該模具與光硬化性組成物之硬化物的脫模性不充分、戈 光硬化性組成物無法完全地填充於該模具之微細圖案。 (111)當未控制氟界面活性劑之分子量或組成時,因硬 化物表面之組成會不均勻,於硬化物之表面狀態生成不規 則物,而有下述情形產生:於作為永久膜使用時耐候性下 降、或於作為光阻使用時產生蝕刻速度之面内變化、咬於 作為複製模具使用時被轉印體之一部分接著其上。 先行技術文獻 專利文獻 ’ 專利文獻1 :美國專利第6696220號說明書 專利文獻2 :曰本專利特開20〇4_〇71934號公報 專利文獻3 :日本專利特開2001-106710號公報 專利文獻4:國際公開第2006/114958號手冊 【發明内容3 發明概要 發明欲解決之課題 本發明係提供一種光硬化性組成物,其不需使用以來 201207034 自全氟辛烷磺酸之化合物作為原料的氟界面活性劑,即可 形成脫模性優異之硬化物,且與氟界面活性劑與其他成分 之相溶性優異;及一種可製造於表面具有精密地轉印有模 具之翻轉圖案的微細圖案且表面組成均勻之成形體的方 法。 用以解決課題之手段 本發明之壓印用光硬化性組成物係下述壓印用光硬化 性組成物。 一種壓印用光硬化性組成物,係以具有1個以上之丙烯 醯氧基或曱基丙烯醯氧基的化合物(以下,亦稱化合物(X)) 作為主成分者,該壓印用光硬化性組成物係下述化合物(A) 與下述化合物(B)及下述化合物(C)之共聚物,且相對於下述 化合物(A)之單元與下述化合物(B)之單元及下述化合物(c) 之單元的總量,下述化合物(A)之單元的比例為20〜45質量 %,下述化合物(B)之單元的比例為2〇〜65質量%,下述化人 物(C)之單元的比例為5〜40質量%,且該壓印用光硬化性組 成物包含質量平均分子量為1000〜5000之聚合物(D); 化合物(A):以下式(1)所表示之化合物, CH2=C(Rn)-C(0)0-Q.Rf ...(1) 但,R11係氫原子或曱基’ Q係單鍵或不含氟原子之2 價結合基,Rf係主鏈之碳數為丨〜6且碳原子間亦可具有醚性 氧原子之多氟烷基; 化合物(B):以下式(2)表示’且數平均分子量為35〇以 下之化合物, 201207034 CH2=C(R21)-C(0)0-(CH2CH(R22)0)n.H ...(2) 但,R係氫原子或曱基,R22係氫原子或碳數1〜4之烧 基’ η係3〜6,且1分子中的η個R22可分別相同亦可分別相異; 化合物(C) ·以下式(3)所表示之化合物, CH2=C(R31)-C(0)0-R32 ...(3) 但,R31係氫原子或甲基,r32係碳數卜^之丨價脂肪族 烴基。 本發明之壓印用光硬化性組成物係以前述化合物(X) 作為主成分之組成物,通常含有光聚合起始劑(G)。又,前 述化合物(X)似種以上選自於由下述化合物所構成之群者 所構成者:具#個丙烯醯氧基或曱基丙稀酿氧基之化合物 (以下,亦稱化合物⑺)、及具有2個以上之丙烯醯氧基或甲 基丙稀醯氧基的化合物(H)。 本發明中’將化合物(Y)分成具有氟原子之化合物(E) 與不具有氟原子之化合物(F)2種。#本發明之級化性組成 物包3化合物(Y)時’該化合物(γ)係由選自於由化合物(E) 及化合物(F)所構紅群之至少丨制構成。本發明之光硬化 組成物以包含化合物⑺為佳。換言之,前述化合物(X)之 至^ °卩分’以包含1種以上選自於由化合物(Ε)及化合物(F) 所構成之群者為佳。更佳者是,包含化合物(ε)及化合物⑺ 兩者。 此外,本發明之光硬化性組成物以包含化合物(Η)為 佳。 本發月之光硬化性組成物中,相對於光硬化性組成 201207034 物,前述聚合物(D)之含有比例以〇 〇1〜5質量%為佳。又, 相對於光硬化性組成物,光聚合起始劑(G)之含有比例以 1〜12質量%為佳。 本發明之光硬化性組成物包含前述化合物(E)、化合物 (F)及化合物(H)之至少任-者’且相對於光硬化性組成物之 各化合物的含有比例,以下述之比例為佳。 化合物(E) : 5〜40質量〇/〇 化合物(F): 10〜55質量% 化合物(H): 10〜75質量% 本發明中,光硬化性組成物係意指不含溶劑之組成 物。進行光硬化之組成物係實f上不含溶劑之組成物。然 而,使其硬A前之組成物亦可含有溶劑。換言<,本發明 之壓印用光硬化性組成物為了進行塗布等處理,可於含有 溶劑之溶液狀態下進行硬化前之操作。前述各成分之比例 係意指以不含溶劑之光硬化性組成物(或,當為含有溶劑之 組成物時去除溶劑後成分之總量)作為基礎之各成分的比 例。又’於同樣意義下,本發明之壓印用光硬化性組成物 在25C之黏度以3〜200mPa.s為佳。 本發明之表面具有微細圖案之成形體之製造方法,具 有下述步驟:使本發明之壓Μ光硬化性組成物接觸模具 之具有翻轉圖案之表面的步驟,該模具之表面具有前述微 細圖案之_圖案;於使前述光硬化餘祕接觸前述模 具之表面的狀態下,將光照射至前述光硬化性組成物,使 前述光硬化性組成物硬化而成為硬化物的步驟;及將前述 201207034 模具自前述硬化物分離’得到表面具有微細圖案之成形體 的步驟。 本發明之表面具有微細圖案之成形體之製造方法,具 有下述步驟:將本發明之壓印用光硬化性組成物配置於基 板表面上的步驟;將表面具有前述微細圖案之翻轉圖案的 模具按壓至前述光硬化性組成物,使該模具之翻轉圖案與 前述光硬化性組成物相接的步驟;於將前述模具按壓至前 述光硬化性組成物之狀態下’將光照射至前述光硬化性組 成物,使前述光硬化性組成物硬化而成為硬化物的步驟; 及將刖述模具、或前述基板及前述模具自前述硬化物分 離,得到表面具有微細圖案之成形體的步驟。 本發明之表面具有微細圖案之成形體之製造方法,具 有下述步驟:將本發明之壓印用光硬化性組成物配置於模 具之具有翻轉圖案之表面的步驟,該模具之表面具有前述 微細圖案之翻轉圖案;將基板按壓至前述光硬化性組成物 的步驟;於將前述基板按壓至前述光硬化性組成物之狀態 下,將光照射至前述光硬化性組成物,使前述光硬化性組 成物硬化而成為硬化物的步驟;及將前述模具、或前述基 板及前述模具自前述硬化物分離,得到表面具有微細圖案 之成形體的步驟。 本發明之表面具有微細圖案之成形體之製造方法,具 有下述步驟:將基板與表面具有前賴細目案之翻轉圖案 的模v、X «亥模具之翻轉圖案位於前述基板側的方式接近或 接觸的步驟;將本發明之壓印用光硬化陳成物填充於前 201207034 述基板與前述模具之間的步驟;於前述基板與前述模具接 近或接觸之狀態下,將光照射至前述光硬化性組成物,使 前述光硬化性組成物硬化而成為硬化物的步驟;及將前述 模具、或前述基板及前述模具自前述硬化物分離,得到表 面具有微細圖案之成形體的步驟。 前述微細圖案亦可為光阻圖案,於前述表面具有微細 圖案之成形體亦可為壓印用之複製模具或電鑄用之複製模 具。 發明效果 本發明之光硬化性組成物不需使用以來自全氟辛烷磺 酸之化合物作為原料的氟界面活性劑,而可形成脫模性優 異之硬化物,且與氟界面活性劑與其他成分之相溶性優 異。 依據本發明之表面具有微細圖案之成形體之製造方 法,可製造於表面具有經精密地轉印模具之翻轉圖案的微 細圖案且表面組成均勻之成形體。 圖式簡單說明 第1圖係顯示表面具有微細圖案之成形體之製造方法 之一例的截面圖。 第2圖係顯示表面具有微細圖案之成形體之製造方法 之其他例的截面圖。 第3圖係顯示表面具有微細圖案之成形體之一例的截 面圖。 第4圖係顯示表面具有微細圖案之成形體之其他例的 201207034 截面圖。 【實施方式j 用以實施發明之形態 本說明書中,(甲基)丙烯醯氧基係意㈣烯職氧 基丙稀醯氧基。又,本說明書中,(甲基)丙稀酸=甲 烯酸酯或曱基丙稀酸酯。 ’、心s丙 〈光硬化性組成物> 本發明之壓㈣光硬化性組成物(以下,稱光 成物。)係以具有1個以上之丙烯醯氧基或甲㈣_^且 的化合物(即化合物(X))作為主成分之組成物,4 基 硬化性通常包含光聚合起始劑(G卜又,本發=予光 =物包含作為必須成分之聚合物(D)。此外,亦= ,述添加劑⑴等成分。如前述,本發明之光硬化 成物係意料含㈣之料物L於 、、且 時可使用包含於光硬化時於域物巾= =體 液(即,光硬化性組祕之料卜 ^劑的溶 化合物(X)係具有“固以上之(甲基)丙稀酿氧 物,本發明中,可分成(甲基)丙職氧 土 & :化合物(即’化合物⑺)與㈣_:數具量= 合物(E)與化合物(F)。 ⑼(Y)係分成化 個恤氧基之化合物為更佳:化合物(Η):= 10 201207034 , 醯氧基均為丙烯醯氧基為更佳。 本發明之光硬化性組成物(不含溶劑之組成物)中,化合 物(X)係必須且主要之成分。本發明之光硬化性組成物包含 選自於由化合物(E)、化合物(F)及化合物(H)所構成之群之 至少1種,且該等之總量係成為光硬化性組成物之主成分 (大於50質量%之成分)。本發明之光硬化性組成物中,相對 於光硬化性組成物(不含溶劑之組成物)’化合物(X)之含有 比例以60質量%以上為佳,以80質量°/〇以上為更佳。 本發明之光硬化性組成物所含之化合物(X)亦可僅由 選自於由化合物(E)、化合物(F)及化合物(H)之1種所構成, 此時之化合物(X)以化合物(H)為佳。光硬化性組成物中所 含之化合物(X)更佳係由化合物(E)及化合物(F)之至少任_ 者與化合物(H)所構成。最佳者是化合物(X)係由化合物 • (E)、化合物(F)及化合物(H)3者所構成。另,本發明之光硬 化性組成物亦可視需要,含有化合物(X)以外之光聚合性化 合物。 本發明之光硬化性組成物(不含溶劑之組成物)於25。〇 下之黏度以3〜200mPa.s為佳,以5〜lOOmPa.s為更佳。當光 硬化性組成物之黏度於該範圍時,即使不進行特別之操作 (例如,將光硬化性組成物加熱至高溫使其低黏度化之操作 等),仍可輕易地進行光硬化性組成物與模具之具有翻轉圖 案之表面的接觸。 本發明之光硬化性組成物係硬化時實質上不含溶劑之 組成物,此外,於處理硬化前之塗布等之光硬化性組成物 201207034 時’亦以實質上不含溶劑的組成物為佳。當光硬化性組成 物實質上不含溶劑時’即使不進行除了光照射以外之特別 操作(例如’將光硬化性組成物加熱至高溫以去除溶媒之操 作等)’仍可輕易地進行光硬化性組成物之硬化。 /谷劑係指具有可使聚合物(D)、化合物(E)、化合物(F)、 光* &起始劑(g)、化合物(H)及添加劑之任一者溶解之能 力的化合物,且係常壓下之沸點為16(TC以下之化合物。 實質上不含溶劑之光硬化性組成物係意指相對於光硬 化性組成物,光硬化性組成物所含有之溶劑的量為1質量% 以下。本發明中,亦可含有於調製光硬化性組成物時使用 的浴劑當作殘存溶劑,但殘存溶劑以盡力去除者為佳,相 對於光硬化性組成物,殘存溶劑等溶劑之含有量以〇 7質量 %以下為更佳。 «聚合物(D) >> 聚合物(D)係化合物(A)與化合物(B)及化合物(c)之共 聚物’且其質量平均分子量為1000〜5_之聚合物,而相對 於化合物(A)之單元與化合物(B)之單元及化合物(c)之單元 的總量,化合物(A)之單元的比例為2〇〜45質量%、化合物(= 之單元的比例為2G〜65質量% ’化合物(c)之單元的比例為 5〜40質量°/〇。 化合物(A).以下式(1)所表示之化合物。 ch2=c(r丨丨)-c(o)o-Q-Rf · ·.⑴。 R11係氫原子或曱基。 Q係單鍵或不含或氟原子之2價結合基。2價結合基可舉 12 201207034 例如:碳數丨〜1〇之直鏈狀或分支狀之伸烷基、碳數2〜ι〇之 直鏈狀或分支狀之伸烯基、以式(CrHhMs表示的氧伸烷2 (但’式中的r係2〜6之整數、s係i〜i 〇之數,且該氧伸燒基; 為直鏈結構,亦可為分支結構)、2價之6員環芳香族 價之4〜6員環的飽和或不飽和的脂肪族基、2價之5 :班2 、 〇貝七^的 雜環基、或以下式⑷所表示之2價結合基。2價結合基可 組合2種以上者,亦可為縮合有環者,亦可為具有取代美 者。再者,Q係以原子量合計3〇〇以下的結合基為佳 -Y-Z- · · · (4) 〇 Η但,Υ係碳數W0之直鏈狀或分支狀之伸燒基、2價。 員%方香族基、2價之4〜6員環的飽和或不飽和的脂肪族 基、2價之5〜6員環的雜環基、或縮合有該等之環、 -〇-、-S…CO-、-C(0)〇_、_C(0)S-、_N(R)…s〇2 ⑹=係 -N(R)-C(0)0- 、-N(R)-C(0)- 、-N(R).S〇2_ 、 ·' ~N(R)-P〇(〇r)_,r係氫原子或碳數i〜3之燒基。 〆 Q係以單鍵、碳數1〜1〇之直鏈狀或分支狀之伸俨義、 下式(5)所表示之基、或該等基之組合為佳, ' 彼n乙 ' Η2)ρ·(但, ρ係0〜6之整數,當Ρ為〇時表示單鍵)為特佳。 -Υ -Ζ1 - · · · (5)。 但’ Υ1係碳數1〜10之直鏈狀或分支狀之伸燒爲。 價之6員環芳香族基,ζ1係-N(R)-、-S〇2_、或七(1^8或2 R係虱原子或碳數1〜3之烧基。 R係主鍵之碳數為1〜6且碳原子間亦可i有峻^ 子之多氟烷基。Q與Rf的邊界定為使Rf之碳數成為最,丨氣= 13 201207034 況。 多氟烷基係意指主鏈之碳數(不含側鏈之碳數)為1〜6之 炫·基的氫原子有2個以上被氟原子取代的基。又,主鏈係意 指於直鍵狀時為該直鍵,於分支狀時為最長之碳键。側鍵 係意指構成分支狀之多氣烧基的碳鏈中,主鏈以外之碳 鏈。側鏈係由烷基、單氟烷基或多氟烷基所構成。 多氟烧基可舉例如:對應於直鏈狀或分支狀之烷基(甲 基、乙基、丙基、丁基、戊基、己基)的部分氟取代烷基、 或全氟取代烷基。 碳原子間具有醚性氧原子之多氟烷基,以多氟(烷氧基 烷基)基或多氟(聚氧伸烷基烷醚)基為佳,可舉例如:多氟 (2-乙氧乙基)基、多氟(2_曱氧丙基)基、多氟(聚氧乙烯甲醚) 基、多氟(聚氧丙烯甲醚)基等。 R以直鏈狀者為佳。當Rf為分支狀者時,以分支部分 儘量存在於靠近1^之末端的部分為佳。201207034 * VI. Description of the Invention: [Technical Field] The present invention relates to a photocurable composition and a method for producing a molded body having a fine pattern on its surface. 2. Description of the Related Art In a method of forming a fine pattern by a bonding time in the manufacture of an optical member, a recording medium, a semiconductor device, or the like, it is known that a mold having a reverse pattern of the fine pattern on the surface is pressed to a photocurable composition disposed on a surface of the substrate. Then, the photocurable composition is irradiated with light to cure the photocurable composition, and a fine pattern is formed on the surface of the substrate (nanoimprint method) (see Patent Documents 1 and 2). However, in this method, since the cured product of the photocurable composition is in close contact with the mold, it is difficult to separate the cured product from the mold. Therefore, it is necessary to apply a release agent to the surface of the mold. However, it is difficult to precisely transfer the reverse pattern of the mold due to the film thickness of the release agent itself and uneven coating of the release agent. As a photocurable composition which can form a cured product excellent in mold release property, the following proposals have been made. ^ 0) Active energy ray-curable composition: a dry surfactant having a fluorinated group and a polar group in a molecule (Patent Document 3). Pine (2) photocurable composition: contains a fluorine-containing monomer, a fluorine-free monomer, a fluorine surfactant or a fluorine-containing polymer, and a polymerization initiator (Patent Document ^. However '(1), 2) The photocurable composition has the following problems: 201207034 (i) Fluoride surfactant is used to improve the mold release property, and it is often used as a raw material or a trace amount of a compound derived from perfluorooctyl lithospermic acid. However, compounds derived from PFOS are questioned by environmental residues or bioaccumulation, and their use is being limited. (H) When the fluorosurfactant has a terminal methyl group (oxyethylene) structure When the mold is a mold having a complicated fine pattern, a mold having a dense fine pattern, or a mold having a large area of a fine pattern, the mold release property of the mold and the cured product of the photocurable composition is insufficient. The Go light hardening composition cannot be completely filled in the fine pattern of the mold. (111) When the molecular weight or composition of the fluorine surfactant is not controlled, the composition of the surface of the cured material may be uneven, and the surface state of the cured product may be generate Irregularities, which are caused by a decrease in weather resistance when used as a permanent film, or an in-plane change in etching rate when used as a photoresist, and a part of a transfer body when used as a replica mold. Patent Document 1: Patent Document 1: Patent Document No. 6696220 Patent Document 2: Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. Hei. No. 2001-106710. Document 4: International Publication No. 2006/114958 [Invention Summary] SUMMARY OF THE INVENTION Problem to be Solved by the Invention The present invention provides a photocurable composition which is used as a raw material from 201207034 from a perfluorooctane sulfonic acid compound since it is not used. The fluorosurfactant can form a cured product excellent in mold release property, and is excellent in compatibility with a fluorine surfactant and other components; and a fine pattern which can be manufactured on a surface having a reverse pattern in which a mold is precisely transferred And a method of forming a molded body having a uniform surface. Means for Solving the Problem The photocurable composition for imprint of the present invention is the following pressure A photocurable composition for use as a photocurable composition for imprinting, which has a compound having one or more acryloxy groups or a mercapto acryloxy group (hereinafter, also referred to as a compound (X)) as a main component The photocurable composition for imprinting is a copolymer of the following compound (A) and the following compound (B) and the following compound (C), and the unit of the following compound (A) is as follows: The ratio of the unit of the compound (B) and the unit of the following compound (c), the ratio of the unit of the following compound (A) is 20 to 45% by mass, and the ratio of the unit of the following compound (B) is 2 〇~ 65% by mass, the ratio of the unit of the following person (C) is 5 to 40% by mass, and the photocurable composition for imprinting contains a polymer (D) having a mass average molecular weight of 1000 to 5000; ): a compound represented by the following formula (1), CH2=C(Rn)-C(0)0-Q.Rf (1) However, R11 is a hydrogen atom or a fluorenyl group 'Q system single bond or not a divalent bonded group of a fluorine-containing atom, a polyfluoroalkyl group in which the carbon number of the Rf-based main chain is 丨6 and an etheric oxygen atom may be present between the carbon atoms; and the compound (B): the following formula (2) represents 'and number a compound having a molecular weight of 35 Å or less, 201207034 CH2=C(R21)-C(0)0-(CH2CH(R22)0)nH (2) However, R is a hydrogen atom or a ruthenium group, and R22 is a hydrogen group. The atom or the alkyl group having a carbon number of 1 to 4 η is 3 to 6, and the η R22 in one molecule may be the same or different, respectively; Compound (C) · Compound represented by the following formula (3), CH 2 =C(R31)-C(0)0-R32 (3) However, R31 is a hydrogen atom or a methyl group, and r32 is a hydrazone aliphatic hydrocarbon group. The photocurable composition for imprint of the present invention is a composition containing the compound (X) as a main component, and usually contains a photopolymerization initiator (G). Further, the compound (X) is a compound selected from the group consisting of the following compounds: a compound having a propylene oxy group or a mercapto propylene oxide group (hereinafter, also referred to as a compound (7) And a compound (H) having two or more acryloxy or methacryloxy groups. In the present invention, the compound (Y) is classified into two types of a compound (E) having a fluorine atom and a compound (F) having no fluorine atom. When the compound (Y) of the present invention is composed of the compound (E), the compound (γ) is composed of at least one selected from the group consisting of the compound (E) and the compound (F). The photohardenable composition of the present invention preferably contains the compound (7). In other words, it is preferred that the compound (X) is at least one selected from the group consisting of the compound (Ε) and the compound (F). More preferably, both the compound (ε) and the compound (7) are contained. Further, the photocurable composition of the present invention preferably contains a compound (Η). In the photocurable composition of the present month, the content of the polymer (D) is preferably from 1 to 5% by mass based on the photocurable composition 201207034. Further, the photopolymerization initiator (G) is preferably contained in an amount of from 1 to 12% by mass based on the photocurable composition. The photocurable composition of the present invention contains at least any one of the compound (E), the compound (F) and the compound (H), and the content ratio of each compound to the photocurable composition, in the following ratio good. Compound (E): 5 to 40 mass 〇/〇 compound (F): 10 to 55 mass% Compound (H): 10 to 75 mass% In the present invention, the photocurable composition means a solvent-free composition . The composition subjected to photohardening is a composition containing no solvent. However, the composition before the hard A can also contain a solvent. In other words, the photocurable composition for imprint of the present invention can be subjected to a pre-curing operation in a state in which a solution containing a solvent is used for the treatment such as coating. The ratio of the above-mentioned respective components means the ratio of each component based on the photocurable composition containing no solvent (or the total amount of the component after removing the solvent when it is a composition containing a solvent). Further, in the same sense, the photocurable composition for imprint of the present invention preferably has a viscosity at 25 C of 3 to 200 mPa·s. A method for producing a molded body having a fine pattern on the surface of the present invention, comprising the steps of: contacting the compacted photohardenable composition of the present invention with a surface of a mold having a reverse pattern, the surface of the mold having the aforementioned fine pattern a pattern in which the photocurable composition is irradiated onto the surface of the mold, and the photocurable composition is cured to form a cured product; and the aforementioned 201207034 mold is used. The step of separating the molded body having a fine pattern on the surface from the hardened material. A method for producing a molded body having a fine pattern on the surface of the present invention, comprising the steps of: disposing the photocurable composition for imprinting of the present invention on a surface of a substrate; and forming a mold having a reverse pattern of the fine pattern on the surface thereof a step of pressing the photocurable composition to the inversion pattern of the mold and the photocurable composition; and irradiating the light to the photohardening state while pressing the mold to the photocurable composition The step of curing the photocurable composition to form a cured product, and the step of separating the mold or the substrate and the mold from the cured product to obtain a molded body having a fine pattern on the surface. A method for producing a molded body having a fine pattern on the surface of the present invention, comprising the step of disposing the photocurable composition for imprint of the present invention on a surface of a mold having a reverse pattern, the surface of the mold having the aforementioned fine a step of inverting the pattern; a step of pressing the substrate to the photocurable composition; and applying the light to the photocurable composition while pressing the substrate to the photocurable composition to cause the photocurability a step of curing the composition to form a cured product; and a step of separating the mold or the substrate and the mold from the cured product to obtain a molded body having a fine pattern on the surface. A method for producing a molded body having a fine pattern on a surface of the present invention, comprising the steps of: a mode in which a substrate and a surface have a pattern of reversal of a pattern of reversal, and an inversion pattern of X «Hail mold is located on the substrate side or a step of contacting; filling the photohardenable composition for imprinting of the present invention with a step between the substrate of the previous 201207034 and the mold; and irradiating the light to the photohardening in a state where the substrate is in close contact with or in contact with the mold The step of curing the photocurable composition to form a cured product, and the step of separating the mold or the substrate and the mold from the cured product to obtain a molded body having a fine pattern on the surface. The fine pattern may be a photoresist pattern, and the molded body having a fine pattern on the surface may be a replica mold for imprint or a replica mold for electroforming. Advantageous Effects of Invention The photocurable composition of the present invention does not require the use of a fluorosurfactant using a compound derived from perfluorooctane sulfonic acid as a raw material, and can form a cured product excellent in mold release property, and is compatible with a fluorine surfactant and other The composition is excellent in compatibility. According to the method for producing a molded body having a fine pattern on the surface of the present invention, it is possible to manufacture a molded body having a fine pattern on the surface of which the reverse pattern of the mold is precisely transferred and having a uniform surface composition. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing an example of a method of producing a molded body having a fine pattern on its surface. Fig. 2 is a cross-sectional view showing another example of a method of producing a molded body having a fine pattern on its surface. Fig. 3 is a cross-sectional view showing an example of a molded body having a fine pattern on its surface. Fig. 4 is a cross-sectional view showing another example of a molded body having a fine pattern on its surface. [Embodiment j] Form for carrying out the invention In the present specification, a (meth)acryloxy group is a (tetra) ethionyl allysyloxy group. Further, in the present specification, (meth)acrylic acid = a methacrylate or a mercapto acrylate. ', heart s-acrylic light-curable composition> The pressure-sensitive (four) photocurable composition (hereinafter referred to as a photo-formed product) of the present invention is a compound having one or more acryloxy groups or a (tetra) ketone (i.e., the compound (X)) is a composition of a main component, and the 4-base hardening property usually includes a photopolymerization initiator (G, and the present invention = pre-light = the product contains the polymer (D) as an essential component. Also, the additive (1) and the like are as described above. As described above, the photohardening product of the present invention is intended to contain (4) the material L, and can be used in the case of photohardening in the field towel = = body fluid (ie, light) The soluble compound (X) of the sclerosing group has a "solid" (meth) propylene oxide oxygen, and in the present invention, it can be classified into (meth) propyl oxychloride & compound: That is, 'compound (7)) and (iv) _: number of compounds = compound (E) and compound (F). (9) (Y) is a compound which is divided into a thiopheneoxy group: more preferably: compound (Η): = 10 201207034 , 醯The oxy group is preferably an acryloxy group. Among the photocurable compositions (solvent-free compositions) of the present invention, the compound (X) is essential and mainly The photocurable composition of the present invention contains at least one selected from the group consisting of the compound (E), the compound (F), and the compound (H), and the total amount thereof becomes a photocurable composition. In the photocurable composition of the present invention, the content ratio of the compound (X) to the photocurable composition (the composition containing no solvent) is 60% by mass. The above is preferable, and it is more preferably 80 mass% / 〇 or more. The compound (X) contained in the photocurable composition of the present invention may be selected only from the compound (E), the compound (F) and the compound ( The compound (H) is preferably a compound (H). The compound (X) contained in the photocurable composition is more preferably a compound (E) or a compound (F). It is preferably composed of at least one of the compounds (H). The most preferred compound (X) is composed of the compound (E), the compound (F) and the compound (H) 3. Further, the photocurability of the present invention The composition may contain a photopolymerizable compound other than the compound (X) as needed. The photocurable composition of the present invention (without dissolution) The composition of the agent is at 25. The viscosity of the underarm is preferably 3 to 200 mPa.s, more preferably 5 to 100 mPa.s. When the viscosity of the photocurable composition is within this range, even if no special operation is performed (For example, the operation of heating the photocurable composition to a high temperature to make it low in viscosity, etc.), the contact of the photocurable composition with the surface of the mold having the reverse pattern can be easily performed. The photohardenability composition of the present invention. When the system is cured, the composition is substantially free of a solvent, and the photocurable composition 201207034, such as a coating before curing, is preferably a composition containing substantially no solvent. When the photocurable composition is used When the solvent is substantially not contained, the curing of the photocurable composition can be easily performed even if a special operation other than light irradiation (for example, 'heating of the photocurable composition to a high temperature to remove the solvent, etc.) is not performed. / gluten means a compound having the ability to dissolve any of polymer (D), compound (E), compound (F), light * & starter (g), compound (H) and additives And a compound having a boiling point of 16 (TC or less) under normal pressure. The photocurable composition which does not substantially contain a solvent means that the amount of the solvent contained in the photocurable composition is relative to the photocurable composition. In the present invention, the bath agent used in the preparation of the photocurable composition may be used as a residual solvent, but it is preferred that the residual solvent is removed as much as possible, and the solvent remains after the photocurable composition. The content of the solvent is preferably 7% by mass or less. «Polymer (D) >> The polymer (D) is a copolymer of the compound (A) and the compound (B) and the compound (c) and The polymer having a mass average molecular weight of 1000 to 5 mm, and the ratio of the unit of the compound (A) to the unit of the compound (B) and the unit of the compound (c), the ratio of the unit of the compound (A) is 2〇. ~45 mass%, the ratio of the compound (= unit to 2G to 65 mass% 'unit of compound (c) The ratio is 5 to 40% by mass. The compound (A) is a compound represented by the following formula (1): ch2 = c(r丨丨) - c(o)oQ-Rf · (1) R11 hydrogen atom Or a fluorenyl group. Q is a single bond or a divalent bond which does not contain a fluorine atom. The divalent bond may be 12 201207034 For example: a linear or branched alkyl group having a carbon number of 丨~1〇, a carbon number a straight-chain or branched alkenyl group of 2 to ι〇, an oxygen-exane 2 represented by the formula (CrHhMs (but an integer of the formula 2 to 6 in the formula, s is i~i 〇, and The oxygen-extension base; a linear structure, which may also be a branched structure), a 6-membered ring of a 6-membered ring, a saturated or unsaturated aliphatic group of 4 to 6 member rings, and a 2 price of 5: Class 2 And a heterocyclic group of the cockroach, or a divalent bond represented by the following formula (4). The divalent bond group may be used in combination of two or more kinds, and may be a condensed ring or a substituted mer. In addition, it is preferable that the Q-based combination of the atomic weight of 3 〇〇 or less is preferably -YZ- · · · (4) 〇Η However, the linear or branched extension of the lanthanoid carbon number W0 is two-valent. a saturated or unsaturated lipid of 4 to 6 membered rings of 2 squares a heterocyclic group of a 5 or 6-membered ring of a divalent group, or a ring having such a condensation, -〇-, -S...CO-, -C(0)〇_, _C(0)S-, _N (R)...s〇2 (6)=System-N(R)-C(0)0-, -N(R)-C(0)-, -N(R).S〇2_, ·' ~N( R)-P〇(〇r)_, r is a hydrogen atom or a carbon number i~3. The 〆Q system has a single bond, a linear or branched carbon number of 1 to 1 、, The group represented by the following formula (5), or a combination of the groups, is preferable, ' 彼 乙 ' Η 2) ρ · (however, ρ is an integer of 0 to 6, when Ρ is 〇 represents a single bond) good. -Υ -Ζ1 - · · · (5). However, the Υ1 series is a linear or branched shape having a carbon number of 1 to 10. 6-membered ring aromatic group, ζ1 series -N(R)-, -S〇2_, or 7 (1^8 or 2 R 虱 atom or a carbon number 1 to 3 alkyl group. R series primary bond carbon The number is 1 to 6 and the polyfluoroalkyl group of the carbon atom may also have a fluorocarbon group. The boundary between Q and Rf is such that the carbon number of Rf is the highest, and helium = 13 201207034. Polyfluoroalkyl The number of carbon atoms in the main chain (excluding the carbon number of the side chain) is 1 to 6 and the hydrogen atom of the base has two or more groups substituted with fluorine atoms. Further, the main chain means that when it is a straight bond The direct bond is the longest carbon bond in the branched form. The side bond means the carbon chain other than the main chain in the carbon chain constituting the branched polygas group. The side chain is composed of an alkyl group or a monofluoroalkyl group. Or a polyfluoroalkyl group. The polyfluoroalkyl group may, for example, be a partially fluorine-substituted alkane corresponding to a linear or branched alkyl group (methyl, ethyl, propyl, butyl, pentyl, hexyl). a polyfluoroalkyl group having an etheric oxygen atom between carbon atoms, preferably a polyfluoro(alkoxyalkyl) group or a polyfluoro(polyoxyalkylene alkyl ether) group. For example, polyfluoro(2-ethoxyethyl) group, polyfluoro(2-methoxypropyl) group Polyfluoro(polyoxyethylene methyl ether) group, polyfluoro(polyoxypropylene methyl ether) group, etc. R is preferably a linear one. When Rf is a branch, the branch portion exists as close as possible to 1^ The end portion is preferred.
Rf以多氟烷基為佳,以全部氫原子實質上被氟原子所 取代之全氟烷基為更佳,以直鏈狀之全氟烷基為尤佳,由 環境殘留性或生物或生物蓄積性低,且脫模性高之點來 看,以碳數4〜6之直鏈狀的全氟烷基為特佳,而以碳數6之 直鏈狀的全氟烷基為最佳。 化合物(A)以下述式(6)所表示之化合物(A_1}為佳。 CH2=C(R")-C(0)0-(CH2)p-RF . . .(6)〇 但,R11係氫原子或曱基’ p係0〜6之整數,rF係碳數卜6 之直鏈狀之全氟烷基。 201207034 化合物(A-l)之具體例可舉下述化合物為例。 CH2=CH-C(0)0-(CH2)2-(CF2)6F > ch2=ch-c(o)o-(ch2)2-(cf2)4f、 ch2=ch-c(o)o-(ch2)2-(cf2)2f、 ch2=ch-c(o)o-(ch2)2-cf3、 CH尸C(CH3 )-C(0)0-(CH2)2 -(CF2)6 F、 CH2=C(CH3 )-C(0)0-(CH2)2 -(CF2)4 F、 ch2=c(ch3 )-c(o)o-(ch2)2 -(CF2)2 F、 CH2=CH-C(0)0-CH2-(CF2)2F ' ch2=ch-c(o)o-ch2-cf3 等。 化合物(A)可單獨使用1種,亦可併用2種以上。換言 之’聚合物(D)亦可具有2種以上化合物(A)之單元。 相對於化合物(A)之單元〜化合物(C)之單元的總量,聚 合物(D)中化合物(A)之單元的比例為20〜45質量%。當化合 物(A)之單元的比例為20質量%以上時,光硬化性組成物之 硬化物的脫模性即呈良好。當化合物(A)之單元的比例為45 質量°/〇以下時,聚合物(D)與其他成分將均勻地相溶。 (化合物(B)) 化合物(B)係以下式(2)所表示之數平均分子量為350以 下的化合物。 CH2=C(R21)-C(0)0-(CH2 CH(R22)0)n -Η · · · (2)。 R21係氫原子或甲基。 R22係氫原子或碳數1〜4之烷基。 但,1分子中的η個R22可分別相同,亦可分別相異。 15 201207034 η係意指製造化合物(B)時所加成之伸烷基氧化物的加 成莫耳數,以平均值表示。η係3〜6 ’以3.5〜5.5為佳。當n 於該範圍時’聚合物(D)與其他成分將均勻地相溶。 化合物(B)之數平均分子量係350以下,以3〇〇以下為 佳。當化合物(B)之數平均分子量為350以下時,聚合物(D) 與其他成分將均勻地相溶。 化合物(B)之數平均分子量係以依據n(平均值)來計算 求得。 藉由化合物(Β)具有羥基,光硬化性組成物中之氟成分 會容易朝向表面’使該組成物之硬化物的脫模性呈良好。 具體而言,因化合物(Β)具有極性基之羥基,而賦予聚 合物(D)極性。藉此,聚合物(D)成為兩親媒性 (amphiphilic) ’而容易與光硬化性組成物中之各成分混合。 因此,隨著來自於化合物(A)之單元的氟烧基跑出表面,光 硬化性組成物中之含有氟之成分將變得容易跑出至表面, 故可認為該組成物之硬化物的脫模性將變得良好。 化合物(B)之具體例可舉下述化合物為例。 CH2=C(CH3)-C(0)0-(CH2CH20)n-H、 CH2=CH-C(0)0-(CH2CH20)n-H、 CH2=C(CH3)-C(0)0-(CH2CH(CH3)0)n-H、 CH2=CH-C(0)0-(CH2CH(CH3 )0)„-H、 CH2=C(CH3)-C(0)0-(CH2CH20)nl-(CH2CH(CH3)0)n2-H ' CH2=CH-C(0)0-(CH2CH20)nl-(CH2CH(CH3)0)n2-H 等。 但,n係3〜6,nl+n2係3〜6 ° 16 201207034 之 化合物⑻可單獨使用1種,亦可併用2種以上。換士 聚合物(D)亦可具有2種以上化合物⑼之單元。、° 相對於化合物⑷之單元〜化合物(c)之單元的總量 合物⑼中之化合物⑻之單元的比例為2Q〜65質量%_化 合_之單元的比例為2〇質量%以上時,聚合物①声盆他 成分將均勾地相溶。當化合物⑻之比例為65質量%以下 時,光硬化性組成物之硬化物的脫模性即呈良好。 (化合物(C)) 化合物(C)係以下式(3)所表示之化合物。 CH2=C(R31)-C(0)0-R32 . . ,(3)〇 R31係氫原子或曱基。 R32係碳數2〜15之1價脂肪族烴基。當丨價脂肪族烴基之 碳數於該範圍時,聚合物(D)與其他成分將均勻地相溶。丄 價脂肪族烴基可舉例如:烷基 '烯基、炔基。脂肪族烴基 可為直鏈狀,亦可為分支狀,亦可為環狀。 R32以烧基為佳’以碳數4〜12之烧基為更佳。 化合物(C)之具體例可舉下述化合物為例。 ch2=c(ch3)-c(o)o-c4h9、 CH2=C(CH3)-C(0)0-CH2CH(CH3)2 ' CH2=C(CH3)-C(0)0-C6H,3 ' CH2=C(CH3)-C(0)0-Cy > ch2=c(ch3)-c(o)o-ch(ch3)c2h5、 ch2=c(ch3)-c(o)o-ch2ch(c2h5 )C4H9、 ch2=c(ch3)_c(o)o-c12h25、 17 201207034 ch2=ch-c(o)o-c4h9、 CH2=CH-C(0)0-CH2CH(CH3)2、 CH2=CH-C(0)0-C6H|3 ' CH2=CH-C(0)0-Cy、 ch2=ch-c(o)o-ch(ch3)c2h5、 ch2=ch-c(o)o-ch2ch(c2h5)c4h9、 CH2=CH-C(0)0-C12H25 等。 但,Cy係環己基。 化合物(C)可單獨使用1種,亦可併用2種以上。換言 之’聚合物(D)亦可具有2種以上化合物(〇之單元。 相對於化合物(A)之單元〜化合物(C)之單元的總量,聚 合物(D)中之化合物(〇之單元的比例為5〜4〇質量%。當化合 物(C)之單元的比例於該範圍時,光硬化性組成物之硬化物 的脫模性即呈良好。 (第四成分) 於聚合化合物(A)之單元〜化合物(c)時,亦可添加可與 化合物(A)之單元〜化合物(c)共聚合的第四成分。 第四成分可舉具有1個以上之碳_碳不飽和雙鍵的化合 物(但,化合物(A)〜化合物(〇除外)為例,具體而言,可舉 例如:含有矽氧烷基之(甲基)丙烯酸酯、馬來酸酐、含有磷 酸基之(曱基)丙烯酸酯等。 第四成分可單獨使用1種,亦可併用2種以上。 相對於化合物(A)之單元〜化合物(c)之單元及第四成 分之單元的總量(即,聚合物(D)中之全部單元),聚合物⑼ 201207034 中之第四成分之單元(於第四成分之單元為複數存在時其 全部量)的比例以20質量%以下為佳。當第四成分之單元大 於20質量%時,有光硬化性組成物之硬化物的脫模性下降 的情形。 (聚合物(D)) 聚合物(D)係化合物(A)與化合物出)與化合物、及視 需要與第四成分共聚合而得者。 本發明之光硬化性組成物藉含有作為非離子系故界面 活性劑之聚合物(D) ’可提升壓印時重要之脫模性。 聚合物(D)之質量平均分子量係1000〜5000。當聚合物 ⑼之質量平均分子量為_以上時,光硬化性組成物之硬 化物的脫模性即呈良好。當聚合物(D)之質量平均分子量為 5_以下時,聚合物(D)與其他成分將均勻地相溶,硬化物 表面之組變得的。聚合物(D)之質量平均分子量以在 2500〜5000為佳。 聚合形態可舉例如:無規聚合、嵌段聚合、接枝聚合 等,以無規聚合為佳。 聚合之種類可舉例如:自由基聚合、陰離子聚合、陽 離子聚合等。 4合方法以於聚合起始劑之存在下,於溶劑中使化合 (A)與化合物(B)糾合物⑹«合㈣《合法為佳。 溶劑以可溶解聚合起始劑、化合物⑷〜化合物(C)者即 =可舉水、有機溶劑、氟系溶劑等為例,由溶解性之點 ’以有機溶劑為佳。有機溶劑可舉例如:丙_、甲醇、 201207034 乙醇、2-丙醇、莖二丁缺 -. 弟一-丁%、乙酸乙酯、乙酸曱酯、乙酸丁 酉曰、甲笨、四氫。夫喃等。 聚合起始劑可舉過氧化物、偶氮化合物等為例。 易度之點來看’聚合溫度以G〜15G°C為佳,由 ’、聚口起始劑之分解活性化能量相關之點來看以3〇〜9〇 °C較佳。 聚〇物(D)可單獨使用1種,亦可併用2種以 上。換言 之,光硬化性組成物亦可使用2種以上聚合物(D)。 相對於光硬化性組成物(含有聚合物(D)之組成物),聚 σ物(D)之比例以〇〇1〜5質量%為佳,以〇」〜2質量%為更 佳。當聚合物(D)為G.G1質量。/。以上時,光硬化性組成物之 硬化物的脫模性即呈良好。當聚合物(D)為5質量%以下時, 聚合物(D)與其他成分將均勻地相溶,硬化物表面之組成將 變得均勻》 «化合物(X)» 化合物(XM系具有_以上之(曱基)丙烯醯氧基的化合 物,本發明中,可分成(甲基)丙烯醯氧基之數量為具有鴻 的化合物(即,化合物〇〇)與(甲基)丙烯醯氧基之數量為具 有2個以上的化合物(即,化合物(H))。化合物(γ)係分成^ 合物(E)與化合物(F)。 由容易光聚合之點來看’化合物(χ)以具有丙稀酿氧基 之化合物為更佳。換言<,化合物⑻與化合物(f)以具有1 個丙烯醯氧基之化合物為更佳,化合物(H)以其(甲基j丙烯 醯氧基均為丙烯醯氧基為更佳。 1 20 201207034 - (化合物(E)) 化合物(E)係具有M子,且具有⑽(甲基)丙稀酸氣基 之化合物。當本發明之光硬化性組成物包含化合物⑹時, 該光硬化性組成物之硬化物與模具的脫模將變得容易。 化合物⑹以前述化學式⑴所表示之化合物(Α)為佳。 又,該化料中R"亦可為氟原子。此外,由相溶性及環户 特性之點來看,以前述化學式(6)所表示之化合物且 R11為氫原子之化合物作為化合物(Ε)為更佳。 化合物(Ε)除了作為刖述化合物(Α_ 1)之具體例所舉 化合物以外,可舉例如下述化合物。 CH2=CH-C(0)0-CH2CH(0H)CH2-CF2CF2CF(CF3)2、 ch2=ch-c(o)o-ch(cf3)2、 ’ ch2=ch-c(o)o-ch2 -(CF2)6F、 CH2=C(CH3)-C(0)0-CH2 -(CF2)6F、 ch2=ch-c(o)o-ch2-cf2cf2h、 CH2=CH-C(0)0-CH2-(CF2CF2)2H ' ch2=c(ch3)-c(o)o-ch2-cf2cf2h、 ch2=c(ch3)-c(o)o-ch2-(cf2cf2)2h、 CH2=CH-C(0)0-CH2 -cf2ocf2cf2ocf3 > ch2=ch-c(o)o-ch2 -cf2o(cf2cf2o)3cf3、 CH2=C(CH3)-C(0)0-CH2-CF2 OCF2 CF2 OCF3 'Rf is preferably a polyfluoroalkyl group, and a perfluoroalkyl group in which all hydrogen atoms are substantially substituted by a fluorine atom is more preferable, and a linear perfluoroalkyl group is particularly preferred, which is environmentally residual or biologically or biologically. In view of low accumulation and high mold release property, a linear perfluoroalkyl group having 4 to 6 carbon atoms is particularly preferred, and a linear perfluoroalkyl group having 6 carbon atoms is preferred. . The compound (A) is preferably a compound (A_1) represented by the following formula (6): CH2=C(R")-C(0)0-(CH2)p-RF . . . (6) 〇, R11 The hydrogen atom or the fluorenyl group 'p is an integer of 0 to 6, and the rF is a linear perfluoroalkyl group having a carbon number of 6. The specific compound of the compound (Al) is exemplified by the following compounds: CH2=CH -C(0)0-(CH2)2-(CF2)6F > ch2=ch-c(o)o-(ch2)2-(cf2)4f, ch2=ch-c(o)o-(ch2 )2-(cf2)2f, ch2=ch-c(o)o-(ch2)2-cf3, CH corpse C(CH3)-C(0)0-(CH2)2 -(CF2)6 F, CH2 =C(CH3 )-C(0)0-(CH2)2 -(CF2)4 F, ch2=c(ch3 )-c(o)o-(ch2)2 -(CF2)2 F, CH2=CH -C(0)0-CH2-(CF2)2F 'ch2=ch-c(o)o-ch2-cf3, etc. The compound (A) may be used singly or in combination of two or more. In other words, 'polymer (D) A unit having two or more kinds of the compound (A). The ratio of the unit of the compound (A) in the polymer (D) to the total amount of the unit to the compound (C) of the compound (A) is When the ratio of the unit of the compound (A) is 20% by mass or more, the mold release property of the cured product of the photocurable composition is good. When the ratio of the unit of the compound (A) is 45 When the amount is not more than 〇, the polymer (D) and the other components are uniformly dissolved. (Compound (B)) The compound (B) is a compound having a number average molecular weight of 350 or less represented by the following formula (2). =C(R21)-C(0)0-(CH2CH(R22)0)n -Η · · · (2) R21 is a hydrogen atom or a methyl group. R22 is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. However, η R22 in one molecule may be the same or different, respectively. 15 201207034 η is the addition mole number of the alkylene oxide added to the compound (B). The average value indicates that the η system 3 to 6 ' is preferably 3.5 to 5.5. When n is in the range, the polymer (D) and the other components are uniformly dissolved. The number average molecular weight of the compound (B) is 350 or less. It is preferably 3 Å or less. When the number average molecular weight of the compound (B) is 350 or less, the polymer (D) and the other components are uniformly dissolved. The number average molecular weight of the compound (B) is based on n (average The compound (Β) has a hydroxyl group, and the fluorine component in the photocurable composition tends to be easily directed toward the surface to make the mold release property of the cured product of the composition good. Specifically, since the compound (Β) has a hydroxyl group of a polar group, it imparts polarity to the polymer (D). Thereby, the polymer (D) is amphiphilic and easily mixed with each component in the photocurable composition. Therefore, as the fluoroalkyl group derived from the unit of the compound (A) runs out of the surface, the fluorine-containing component in the photocurable composition becomes easy to escape to the surface, so that the cured product of the composition can be considered The release property will become good. Specific examples of the compound (B) include the following compounds. CH2=C(CH3)-C(0)0-(CH2CH20)nH, CH2=CH-C(0)0-(CH2CH20)nH, CH2=C(CH3)-C(0)0-(CH2CH(CH3) )0)nH, CH2=CH-C(0)0-(CH2CH(CH3)0)„-H, CH2=C(CH3)-C(0)0-(CH2CH20)nl-(CH2CH(CH3)0 n2-H 'CH2=CH-C(0)0-(CH2CH20)nl-(CH2CH(CH3)0)n2-H, etc. However, n is 3~6, nl+n2 is 3~6 ° 16 201207034 The compound (8) may be used alone or in combination of two or more. The resin polymer (D) may have two or more units of the compound (9), and the unit of the compound (4) to the unit (c). When the ratio of the unit of the compound (8) in the total composition (9) is 2Q to 65 mass%, and the ratio of the unit of the compound_ to 2% by mass or more, the composition of the polymer 1 will be uniformly soluble. When the ratio of (8) is 65% by mass or less, the mold release property of the cured product of the photocurable composition is good. (Compound (C)) The compound (C) is a compound represented by the following formula (3). CH2=C (R31)-C(0)0-R32 . . , (3) 〇R31 is a hydrogen atom or a fluorenyl group. R32 is a monovalent aliphatic hydrocarbon group having a carbon number of 2 to 15. When the carbon number of the fluorene aliphatic hydrocarbon group is In this range, polymer (D) and The other components are uniformly miscible. The valence aliphatic hydrocarbon group may, for example, be an alkyl 'alkenyl group or an alkynyl group. The aliphatic hydrocarbon group may be linear or branched or may be cyclic. The base is preferably 'the base having a carbon number of 4 to 12 is more preferred. Specific examples of the compound (C) include the following compounds: ch2 = c(ch3) - c(o)o - c4h9, CH2 = C (CH3)-C(0)0-CH2CH(CH3)2 'CH2=C(CH3)-C(0)0-C6H,3 'CH2=C(CH3)-C(0)0-Cy > ch2 =c(ch3)-c(o)o-ch(ch3)c2h5, ch2=c(ch3)-c(o)o-ch2ch(c2h5)C4H9, ch2=c(ch3)_c(o)o-c12h25 , 17 201207034 ch2=ch-c(o)o-c4h9, CH2=CH-C(0)0-CH2CH(CH3)2, CH2=CH-C(0)0-C6H|3 'CH2=CH-C (0)0-Cy, ch2=ch-c(o)o-ch(ch3)c2h5, ch2=ch-c(o)o-ch2ch(c2h5)c4h9, CH2=CH-C(0)0-C12H25 Wait. However, Cy is a cyclohexyl group. The compound (C) may be used alone or in combination of two or more. In other words, the polymer (D) may have two or more kinds of compounds (units of hydrazine. The total amount of units of the unit (A) to the compound (C), and the compound of the polymer (D) (unit of hydrazine) The ratio of the unit of the compound (C) is in this range, and the mold release property of the cured product of the photocurable composition is good. (Fourth component) in the polymer compound (A) When the unit is a compound (c), a fourth component which can be copolymerized with the unit to the compound (c) of the compound (A) may be added. The fourth component may have one or more carbon-carbon unsaturated double bonds. The compound (however, the compound (A) to the compound (except for hydrazine) is exemplified, and specific examples thereof include a (meth) acrylate containing a decyloxy group, maleic anhydride, and a thiol group. The acryl or the like. The fourth component may be used singly or in combination of two or more kinds thereof. The total amount of the unit to the unit of the compound (A) to the unit of the compound (c) and the unit of the fourth component (that is, the polymer) All units in (D), the unit of the fourth component of the polymer (9) 201207034 ( The ratio of the total amount of the unit of the fourth component to the total amount is preferably 20% by mass or less. When the unit of the fourth component is more than 20% by mass, the mold release property of the cured product having the photocurable composition is lowered. (Polymer (D)) The polymer (D) compound (A) and the compound are obtained by copolymerization with a compound and, if necessary, a fourth component. The photocurable composition of the present invention is contained. The polymer (D) as a nonionic surfactant can enhance the release property which is important at the time of imprinting. The mass average molecular weight of the polymer (D) is 1000 to 5000. When the mass average molecular weight of the polymer (9) is _ In the above, the release property of the cured product of the photocurable composition is good. When the mass average molecular weight of the polymer (D) is 5 or less, the polymer (D) and the other components are uniformly dissolved and hardened. The mass of the polymer (D) is preferably from 2,500 to 5,000. The polymerization form may be, for example, random polymerization, block polymerization, graft polymerization, etc., and random polymerization is preferred. The type of polymerization may be, for example, radical polymerization or cation. Ionic polymerization, cationic polymerization, etc. 4-combination method In the presence of a polymerization initiator, it is preferred to combine the compound (A) with the compound (B) in the presence of a polymerization initiator (4). The initiator, the compound (4) to the compound (C) are exemplified by water, an organic solvent, a fluorine-based solvent, and the like, and the organic solvent is preferably used as the solvent. The organic solvent may, for example, be propylene or methanol. 201207034 Ethanol, 2-propanol, stems and diced -. Dimethoate-butyl, ethyl acetate, decyl acetate, butyl hydrazine, methyl bromide, tetrahydrofuran, and others. The polymerization initiator can be oxidized. Examples of the azo compound, etc. From the point of view of the ease of polymerization, the polymerization temperature is preferably from G to 15 G ° C, and that from the point of decomposition of the activation energy of the poly-portion initiator is 3 〇 9 〇°C is preferred. The polybenzate (D) may be used alone or in combination of two or more. In other words, two or more kinds of polymers (D) may be used as the photocurable composition. The ratio of the poly σ (D) to the photocurable composition (the composition containing the polymer (D)) is preferably 〇〇1 to 5 mass%, more preferably 〇2 to 2 mass%. When the polymer (D) is G.G1 mass. /. In the above, the release property of the cured product of the photocurable composition is good. When the polymer (D) is 5% by mass or less, the polymer (D) and the other components will be uniformly dissolved, and the composition of the surface of the cured product will become uniform. «Compound (X)» compound (XM system has _ or more The (mercapto) acryloxy compound, in the present invention, may be classified into a compound having a (meth) propylene fluorenyloxy group (ie, a compound hydrazine) and a (meth) propylene fluorenyloxy group. The amount is two or more compounds (i.e., compound (H)). The compound (γ) is divided into the compound (E) and the compound (F). From the point of easy photopolymerization, the compound (χ) has The compound of the acryloxy group is more preferably. In other words, the compound (8) and the compound (f) are more preferably a compound having one propylene methoxy group, and the compound (H) is (meth) propylene oxy group. More preferably, it is a propylene oxime group. 1 20 201207034 - (Compound (E)) The compound (E) is a compound having M group and having a (10) (meth) acrylic acid gas group. When the photohardening of the present invention When the compound (6) is contained in the composition, the mold of the photocurable composition and the mold are easily released. The compound (6) is preferably a compound represented by the above formula (1). Further, in the compound, R" may be a fluorine atom. Further, from the viewpoint of compatibility and ring-shaped characteristics, the above chemical formula (6) The compound represented by the compound and wherein R11 is a hydrogen atom is more preferably used as the compound (Ε). The compound (Ε) may, for example, be a compound exemplified as a specific example of the compound (Α-1). For example, the following compound may be mentioned. CH2=CH -C(0)0-CH2CH(0H)CH2-CF2CF2CF(CF3)2, ch2=ch-c(o)o-ch(cf3)2, 'ch2=ch-c(o)o-ch2 -(CF2 6F, CH2=C(CH3)-C(0)0-CH2 -(CF2)6F, ch2=ch-c(o)o-ch2-cf2cf2h, CH2=CH-C(0)0-CH2-( CF2CF2)2H ' ch2=c(ch3)-c(o)o-ch2-cf2cf2h, ch2=c(ch3)-c(o)o-ch2-(cf2cf2)2h, CH2=CH-C(0)0 -CH2 -cf2ocf2cf2ocf3 > ch2=ch-c(o)o-ch2 -cf2o(cf2cf2o)3cf3, CH2=C(CH3)-C(0)0-CH2-CF2 OCF2 CF2 OCF3 '
ch2=c(ch3)-c(o)o_ch2-cf2o(cf2cf2o)3cf3、 ch2=ch-c(o)o-ch2-cf(cf3)ocf2cf(cf3)o(cf2)3F、 ch2=ch-c(o)o-ch2-cf(cf3)o(cf2cf(cf3)o)2(cf2)3F 21 201207034 CH2=C(CH3)-C(〇)〇-CH2-CF(CF3)OCF2CF(CF3)〇(CF2)3 F、Ch2=c(ch3)-c(o)o_ch2-cf2o(cf2cf2o)3cf3, ch2=ch-c(o)o-ch2-cf(cf3)ocf2cf(cf3)o(cf2)3F, ch2=ch-c (o)o-ch2-cf(cf3)o(cf2cf(cf3)o)2(cf2)3F 21 201207034 CH2=C(CH3)-C(〇)〇-CH2-CF(CF3)OCF2CF(CF3)〇 (CF2)3 F,
CH2=C(CH3)-C(〇)〇-CH2-CF(CF3)0(CF2CF(CF3)〇)2(CF 2)3F。 本發明之光硬化性組成物以含有化合物(E)為佳。此 時,光硬化性組成物所含之化合物(E)可為丨種,亦可為2種 以上。當光硬化性組成物含有化合物(E)時,相對於光硬化 性組成物(含有化合物(E)之組成物),化合物(£)之比例以 5〜40質量%為佳,以1〇〜25質量%為更佳。當化合物(E)為5 質量%以上時,可得脫模性優異之硬化物,且可抑制光硬 化性組成物之發泡。由於可抑制光硬化性組成物之發泡, 於調製時變得容易過濾,並可避免於奈米壓印時因氣泡之 混入造成圖案形狀之缺陷。當化合物(E)為4〇質量%以下 時,因可均勻地混合,故可得機械強度優異之硬化物。 又,藉由使用化合物(E),可提高硬化物之透明性。此 外,化合物(E)因有助於光硬化性組成物之黏度下降或表面 能量下降,故於將硬化物作為光阻使用時,對於解像度之 提升、或減低殘膜(residual layer)是有用的。 (化合物(F)) 化合物(F)係具有1個(曱基)丙烯醯氧基之化合物(但, 化合物(E)除外)。 化合物(F)係使其他成分溶解之成分,當本發明之光硬 化性組成物包含化合物(F)時,可提升聚合物(D)與化合物(E) 及化合物(Η)之相浴性。聚合物①)與化合物(E)及化合物(H) 22 201207034 之相溶性若良好,則可抑制光硬化性組成物在調製時發 /包’且.薆得容易通過過渡器等,使光硬化性組成物的今周製 變得容易,又,可得到均勻的光硬化性組成物。此外,由 於可得到均質的硬化物,而可充分地發揮脫模性、機械性 強度。 化合物(F)在25。〇之黏度以〇卜蠢爪]^為佳。當化人 物(F)之黏度於該範圍時,可輕易地調低光硬化性組成物之 黏度。此外,於將硬化物作為光阻使用時,對於解像度之 提升、或減低殘膜(residual layer)是有用的。 化合物(F)可舉例如:單羥化合物之(甲基)丙烯酸酯、 多羥化合物之單(甲基)丙烯酸酯等,以單羥化合物之(甲基) 丙稀_、特別是單經化合物之丙稀_為佳。單經化^ 物,特別是以烷基部分之碳數4〜2〇之烷醇、具有單環縮 合多環或交聯環之脂環族單㈣、多(或單)伸烧基二醇(或 芳基)鱗為佳。特佳之單經化合物係碳數6〜2G之院醇與具 有交聯環之脂環族單元醇。χ,於將硬化物作為光阻使用 時,隨刻耐性提升,故以使用具有交聯環之脂環族單元 醇為佳。 化合物(F)可舉下述化合物為例。 本乳基乙基(甲基)丙歸酸@旨HI苯氧基丙基(甲基) 丙烯W日$氧基—乙二醇(甲基)丙稀酸醋、(甲基)丙婦酸 苯甲酯、甲氧基三乙二醇(甲基)丙稀酸醋、甲氧基聚乙二醇 (甲基)丙烯酸S旨、2·(甲基)丙_氧乙基六氫鄰苯二甲酸 醋、(甲基)丙稀酸二十H(甲基)丙稀醯氧乙基琥王白酸 23 201207034 乙酯、(甲基)丙烯酸十八酯、(曱基)丙烯酸異十八酯、(甲基) 丙烯酸異十二酯、(曱基)丙烯酸2-乙基己酯、(曱基)丙烯酸 3-(三曱氧基矽)丙酯、(甲基)丙烯酸丁酯、(曱基)丙烯酸乙 氧基乙酯、(曱基)丙烯酸甲氧基乙酯、(甲基)丙烯酸環氧丙 酯、四氫糠基(曱基)丙烯酸酯、(甲基)丙烯酸2-羥乙酯 '(甲 基)丙烯酸2-羥丙酯、(甲基)丙烯酸ν,Ν-二乙胺乙酯、(曱基) 丙烯酸Ν,Ν-二曱胺乙酯、(甲基)丙烯酸二甲胺乙酯、(曱基) 丙烯酸2-曱基-2-金剛酯、(曱基)丙烯酸2-乙基-2-金剛酯、(甲 基)丙烯酸3-羥-1-金剛酯、(曱基)丙烯酸卜金剛酯、(甲基) 丙烯酸異冰片酯、(甲基)丙烯酸2-羧乙酯、(甲基)丙烯酸辛 醋、(曱基)丙烯酸癸酯、(甲基)丙烯酸2-(三級丁胺)乙酯、 1,2,2,6,6-五曱基-4-α底D定(曱基)丙稀酸@旨、(曱基)丙稀酸正丁 醋、(曱基)丙烯酸三級丁酯、4-三級丁基環己基(甲基)丙烯 酸酯等。 本發明之光硬化性組成物以包含化合物(F)為佳。此 時,光硬化性組成物所包含之化合物(F)可為1種,亦可為2 種以上。當光硬化性組成物包含化合物(F)時,相對於光硬 化性組成物(包含化合物(F)之組成物),化合物(F)之比例以 10〜55質量%為佳,以15〜45質量%為更佳。當化合物(F)為 1〇質量%以上時,可調低光硬化性組成物之黏度,且聚合 物(D)與化合物(E)及化合物(H)之相溶性將變得良好。當化 合物(F)為55質量%以下時,因感度變得良好、交聯密度亦 提升,而可得機械強度優異之硬化物。 (化合物(H)) 24 201207034 化合物(Η)係具有2個以上之(曱基)丙烯醯氧基的化合 物。化合物(Η)亦可為具有氟原子之化合物,但通常係不具 有氟原子之化合物。 化合物(Η)係可使光硬化性組成物之感度提升的成 分。又’依據化合物(Η)之種類,可調整光硬化性組成物之 硬化物的乾式蝕刻耐性、濕式蝕刻耐性、透明性、黏度、 折射率、硬度、機械強度、柔軟性、與基板之密接性等諸 物理性質。 化合物(Η)中之(曱基)丙烯醯氧基之數量以2〜10為適 & ’以2〜6為佳。當(曱基)丙烯醯氧基之數量過多時,有硬 化物變知脆弱的疑慮。然而,只要為少量的話,亦可使用(甲 基)丙烯醯氧基之數量特別多的化合物。 <匕合物(Η)係多經化合物之多(甲基)丙烯酸醋 ,只要(甲 基)丙稀自!氧基之數量為2個以上的話,亦可具有經基。多 羥化&物可舉例如:院多元醇 '烧多元醇之伸烧基氧化物 加成# 4伸燒二醇、多元盼或多元胺等具有,以上可加 成伸烷基氧化物之官能基之化合物的伸烷基氧化物加成 物、聚碳酸酯多元醇、聚酯多元醇等 。又,化合物(Η)係具 有夕红化合物之多(甲基)丙烯酸酯結構的化合物 ,亦可為胺 甲S夂乙S日(甲基)丙稀酸§旨。胺甲酸乙醋(曱基)丙烯酸醋係 &於4工化合物中使異氰酸醋烧基(甲基)丙雜醋反應所 得之H於多經化合物中使聚異氰酸s旨化合物與含有 I基之基)丙烯_旨反應所得的化合物等之具有胺甲酸 乙酉曰鍵之化D物。胺甲酸乙酉旨(曱基)丙稀義之原料的多經 25 201207034 化合物,以烧多元醇之伸烧基氧化物加成物、聚伸烧二醇、 多元酚之伸炫基氧化物加成物等聚醚多元醇為佳,聚異氰 酸酯化合物以無黃變型之聚異氰酸酯化合物為佳。 化合物(H)較佳為,選自於由烷多元醇、烷多元醇之伸 烷基氧化物加成物、聚伸烷二醇及多元酚之伸烷基氧化物 加成物所構成之群之多羥化合物的多(曱基)丙烯酸酯,以及 使用聚醚多元醇所得之胺曱酸乙酯(甲基)丙烯酸酯。 化合物(H)可舉下述化合物為例。 雙酚A二(甲基)丙烯酸酯、雙酚A伸烷基氧化物加成物 之二(曱基)丙烯酸酯(乙氧化雙酚A二(甲基)丙稀酸酯、丙氧 化雙酚A二(曱基)丙烯酸酯、丙氧化乙氧化雙酚A二(甲基) 丙烯酸酯、雙酚A甘油酯二(曱基)丙烯酸酯、雙酚A丙氧化 物甘油酯二(曱基)丙烯酸酯等)、乙氧化雙酚F二(甲基)丙稀 酸酯、三環癸烷二甲醇二(曱基)丙烯酸酯、苐二(曱基)丙烯 酸酯、三環癸烷二甲醇二(曱基)丙烯酸酯、乙二醇二(甲基) 丙烯酸酯、二丙二醇二(甲基)丙烯酸酯、1,3-丁二醇二(甲基) 丙烯酸酯、1,4-丁二醇二(甲基)丙烯酸酯、甘油1,3-.二甘油 酯二(曱基)丙烯酸酯、1,6-己二醇乙氧基二(甲基)丙烯酸 酯、1,6-己二醇丙氧化物二(甲基)丙烯酸酯、1,6-己二醇二 (甲基)丙烯酸酯、3-羥-2,2-二丙酸甲酯二(曱基)丙烯酸酯、 1,9-壬二醇二(曱基)丙烯酸酯、1,1〇-癸二醇二(甲基)丙烯酸 酯 '二乙二醇二(甲基)丙烯酸酯、新戊二醇二(曱基)丙烯酸 酯、新戊二醇丙氧化物二(曱基)丙烯酸酯、聚乙二醇二(甲 基)丙烯酸酯、丙二醇二(曱基)丙烯酸酯、甘油二(甲基)丙烯 26 201207034 酸酯、丙二醇甘油酯二(曱基)丙烯酸酯、聚丙二醇二(曱基) 丙烯酸酯、聚乙二醇二(甲基)丙烯酸酯、三丙二醇二(甲基) 丙烯酸酯、三乙二醇二(曱基)丙烯酸酯、四乙二醇二(甲基) 丙烯酸酯、三丙二醇甘油酯二(甲基)丙烯酸酯、2-羥-3-丙烯 醯氧基丙基(甲基)丙烯酸酯、2-甲基-1,3-丙二醇二丙烯酸 酯、三羥甲基丙烷苯曱酸二(曱基)丙烯酸酯、新戊四醇二(曱 基)丙烯酸酯單硬酯酸酯、三羥甲基丙烷乙氧基曱醚二(甲基) 丙烯酸酯、具有2個以上之胺曱酸乙酯鍵的二(曱基)丙烯酸 酯(新中村化學工業社製之UA-4200,二胺甲酸乙酯二(曱基) 丙烯酸酯等)、具有葬骨架之二(曱基)丙烯酸酯、1,3-雙(3-甲基丙烯醯氧基丙基)-1,1,3,3-四甲基二矽氧烷、三羥甲基 丙烷三(甲基)丙烯酸酯、三羥曱基丙烷乙氧三(曱基)丙烯酸 酯、聚醚三元醇三(曱基)丙烯酸酯、甘油丙氧三(甲基)丙烯 酸酯、新戊四醇三(曱基)丙烯酸酯、乙氧化異三聚氰酸三丙 烯酸酯、乙氧化三羥甲基丙烷三丙烯酸酯、丙氧化三羥曱 基丙烷三丙烯酸酯、新戊四醇四(甲基)丙烯酸酯、新戊四醇 乙氧基四(曱基)丙烯酸酯、貳三羥曱基丙烷四(曱基)丙烯酸 酯、丙氧化新戊四醇四丙烯酸酯、二新戊四醇六(甲基)丙烯 酸酯、使用聚醚二醇所得之胺曱酸乙酯二(甲基)丙烯酸酯、 使用聚醚三元醇所得之胺曱酸乙酯三(甲基)丙烯酸酯、使用 聚醚四元醇所得之胺曱酸乙酯四(甲基)丙烯酸酯、使用聚醚 六元醇所得之胺曱酸乙酯六(甲基)丙烯酸酯等。 本發明之光硬化性組成物以包含化合物(H)為佳。此 時,光硬化性組成物所包含之化合物(H)可為1種,亦可為2 27 201207034 種以上。當光硬化性組成物包含化合物(Η)時’相對於光硬 化性组成物(包含化合物(Η)之組成物),化合物(Η)之比例以 10〜75質量%為佳,以30〜55質量%為更佳。當化合物(Η)為 10成τ里%以上時,可提升光硬化性組成物之感度。當化合 物(Η)為75質量%以下時,可得到各成分均勻地相溶之光硬 化性組成物。 (光聚合起始劑(G)) 光聚合起始劑(G)可舉例如:苯乙酮系光聚合起始劑、 苯偶姻系光聚合起始劑、二苯基酮系光聚合起始劑、噻吨 銅系光聚合起始劑、α—胺酮系光聚合起始劑、…羥酮系光 聚合起始劑、α-醯基肟酯(acyl〇xhnester)、苯甲基_(鄰乙氧 緩基)-α-單聘、醯基膦氧化物(acryi ph〇Sphine oxide)、乙齡 酸醋、3-香豆素酮(ketoc〇umarin)、2_乙基蒽醌(ethyl anthraquinone)、樟腦酿(camphoroquinone)、硫化四甲鐘、 偶氮二異丁腈、過氧化苯曱醯、二烧基過氧化物、過氧異 丁酸二級丁酯等,由感度及相溶性之點來看,以苯乙_系 光聚合起始劑、苯偶姻系光聚合起始劑、α_胺酮系光聚合 起始劑或一笨基酮系光聚合起始劑為佳。 苯乙酮系光聚合起始劑可舉下述化合物為例。 苯乙_、對(三級丁基三氣苯乙酮、氯苯乙_、 2’,2’-一乙氧苯乙酮、羥苯乙g同、2,2_二曱氧_2’_苯基笨乙 酮、2-胺笨乙酮、二烷基胺苯乙_等。 苯偶姻系光聚合起始劑可舉下述化合物為例。 苯曱基、苯偶姻、苯偶姻甲醚、苯偶姻乙醚、苯偶姻 28 201207034 备環己苯剩、2_經-2-甲基-1-苯CH2=C(CH3)-C(〇)〇-CH2-CF(CF3)0(CF2CF(CF3)〇)2(CF 2)3F. The photocurable composition of the present invention preferably contains the compound (E). In this case, the compound (E) contained in the photocurable composition may be in the form of two or more kinds. When the photocurable composition contains the compound (E), the ratio of the compound (£) to the photocurable composition (the composition containing the compound (E)) is preferably 5 to 40% by mass, preferably 1 〇. 25% by mass is more preferred. When the compound (E) is 5% by mass or more, a cured product excellent in mold release property can be obtained, and foaming of the photohardenable composition can be suppressed. Since the foaming of the photocurable composition can be suppressed, it becomes easy to be filtered at the time of preparation, and the defects of the pattern shape due to the incorporation of bubbles at the time of nanoimprinting can be avoided. When the compound (E) is 4% by mass or less, since it can be uniformly mixed, a cured product excellent in mechanical strength can be obtained. Further, by using the compound (E), the transparency of the cured product can be improved. Further, since the compound (E) contributes to a decrease in the viscosity of the photocurable composition or a decrease in the surface energy, it is useful for improving the resolution or reducing the residual layer when the cured product is used as a photoresist. . (Compound (F)) The compound (F) is a compound having one (fluorenyl) acryloxy group (except for the compound (E)). The compound (F) is a component which dissolves other components. When the photohardenable composition of the present invention contains the compound (F), the phase bath property of the polymer (D) and the compound (E) and the compound (Η) can be improved. When the compatibility of the polymer 1) with the compound (E) and the compound (H) 22 201207034 is good, it is possible to suppress the photocurable composition from being formed/packed during preparation, and it is easy to pass through a transition device or the like to harden the light. The current composition of the composition becomes easy, and a uniform photocurable composition can be obtained. Further, since a homogeneous cured product can be obtained, the mold release property and the mechanical strength can be sufficiently exhibited. Compound (F) is at 25. The viscosity of the sputum is better than the scorpion. When the viscosity of the human (F) is within this range, the viscosity of the photocurable composition can be easily lowered. Further, when the cured product is used as a photoresist, it is useful for improving the resolution or reducing the residual layer. The compound (F) may, for example, be a (meth) acrylate of a monohydroxy compound, a mono(meth) acrylate of a polyhydroxy compound, or the like, and a (meth) propyl group of a monohydroxy compound, particularly a mono-peripheral compound. The propylene is better. a monochemical compound, particularly an alkanol having 4 to 2 carbon atoms in the alkyl moiety, an alicyclic mono(tetra), poly (or mono) alkyl diol having a monocyclic condensed polycyclic or crosslinked ring (or aryl) scales are preferred. A particularly preferred single-pass compound is a municipal alcohol having a carbon number of 6 to 2 G and an alicyclic unit alcohol having a crosslinked ring. That is, when the cured product is used as a photoresist, the resistance is improved as it is, and it is preferred to use an alicyclic unit alcohol having a crosslinked ring. The compound (F) is exemplified by the following compounds. The presently-based ethyl (meth)propanoic acid @ HI phenoxypropyl (methyl) propylene W day oxy-ethylene glycol (meth) acrylate vinegar, (methyl) propylene glycol Benzyl methacrylate, methoxytriethylene glycol (meth) acrylate vinegar, methoxy polyethylene glycol (meth) acrylate S, 2 · (methyl) propyl oxyethyl hexahydro phthalate Dicarboxylic acid vinegar, (meth) acrylic acid, twenty H (methyl) propylene sulfonium oxyethyl sulphate 23 201207034 ethyl ester, octadecyl (meth) acrylate, (decyl) acrylate Ester, isodecyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, 3-(trimethoxydecyl)propyl (meth)acrylate, butyl (meth)acrylate, Ethyl ethoxide, ethoxyethyl acrylate, methoxyethyl (meth) acrylate, glycidyl (meth) acrylate, tetrahydroindenyl (mercapto) acrylate, 2-hydroxy (meth) acrylate Ethyl ester '2-hydroxypropyl (meth)acrylate, ν, Ν-diethylamine ethyl (meth)acrylate, ruthenium (decyl) ruthenium, ruthenium diamine, ethyl (meth) acrylate Methylaminoethyl, (mercapto) acrylic acid 2-mercapto-2-adamantate, 2-ethyl-2-adamantyl (meth)acrylate, 3-hydroxy-1-adamantyl (meth)acrylate, ortho-(meth)acrylate, (A) Base) isobornyl acrylate, 2-carboxyethyl (meth)acrylate, octyl methacrylate, decyl methacrylate, 2-(tributylamine)ethyl (meth)acrylate, 1,2,2,6,6-pentamethyl-4-α-based D-(indene)-acrylic acid@-, (mercapto)-acrylic acid n-butyl vinegar, (mercapto)acrylic acid tert-butyl acrylate , 4-tertiary butylcyclohexyl (meth) acrylate, and the like. The photocurable composition of the present invention preferably contains the compound (F). In this case, the compound (F) contained in the photocurable composition may be one type or two or more types. When the photocurable composition contains the compound (F), the ratio of the compound (F) to the photocurable composition (including the composition of the compound (F)) is preferably 10 to 55 mass%, preferably 15 to 45. The mass % is better. When the compound (F) is at most 1% by mass, the viscosity of the low light curable composition can be adjusted, and the compatibility of the polymer (D) with the compound (E) and the compound (H) will be good. When the compound (F) is 55% by mass or less, the sensitivity is improved and the crosslinking density is also improved, whereby a cured product excellent in mechanical strength can be obtained. (Compound (H)) 24 201207034 The compound (Η) is a compound having two or more (fluorenyl) acryloxy groups. The compound (oxime) may also be a compound having a fluorine atom, but is usually a compound having no fluorine atom. The compound (Η) is a component which enhances the sensitivity of the photocurable composition. Further, according to the type of the compound (Η), the dry etching resistance, wet etching resistance, transparency, viscosity, refractive index, hardness, mechanical strength, flexibility, and adhesion to the substrate of the cured product of the photocurable composition can be adjusted. Physical properties such as sex. The amount of the (fluorenyl)propenyloxy group in the compound (Η) is preferably from 2 to 10, and is preferably from 2 to 6. When the amount of the (fluorenyl) acryloxy group is too large, there is a concern that the hardening becomes weak. However, as long as it is a small amount, a compound having a particularly large amount of (meth)acryloxy group can also be used. <The compound (Η) is a poly(meth)acrylic acid vinegar of a multi-permeate compound, as long as it is (meth) propylene! When the number of the oxy groups is two or more, it may have a mercapto group. The polyhydroxyl group can be, for example, a polyhydric alcohol of a polyhydric alcohol, a calcined base oxide of a polyhydric alcohol, or a polyamine, or a polyamine, which can be added to an alkylene oxide. Alkyl oxide adducts of functional group compounds, polycarbonate polyols, polyester polyols, and the like. Further, the compound (Η) is a compound having a poly (meth) acrylate structure of a compound of ruthenium, and may be an amine sulfonate S-methyl (meth) acrylate. Ethyl acetoacetate (mercapto) acrylic acid vinegar & E obtained by reacting isocyanate with methacrylic acid (meth) propyl vinegar in a compound of 4 in a poly-compound to make a polyisocyanate A group D having a urethane formate bond, such as a compound containing a group I, is a compound obtained by the reaction. A compound of urethane for the production of a raw material of a sulfonate, which is a thiol-based oxide adduct of a polyhydric alcohol, a condensed diol, and a polyphenol. Preferably, the polyether polyol is preferred, and the polyisocyanate compound is preferably a polyisocyanate compound having no yellowing property. The compound (H) is preferably selected from the group consisting of an alkylene oxide adduct of an alkyl polyol, an alkylene oxide adduct of an alkyl polyol, a polyalkylene glycol, and a polyhydric phenol. The poly(indenyl) acrylate of the polyhydroxy compound, and the ethyl phthalate (meth) acrylate obtained by using the polyether polyol. The compound (H) can be exemplified by the following compounds. Bis(A) bis(meth) acrylate, bisphenol A alkylene oxide adduct bis(indenyl) acrylate (ethoxylated bisphenol A di(methyl) acrylate, propoxy bisphenol A bis(indenyl) acrylate, ethoxylated ethoxylated bisphenol A di(meth) acrylate, bisphenol A glyceride di(indenyl) acrylate, bisphenol A propoxy glyceride di(indenyl) Acrylate, etc., ethoxylated bisphenol F di(methyl) acrylate, tricyclodecane dimethanol bis(indenyl) acrylate, decyl (decyl) acrylate, tricyclodecane dimethanol (fluorenyl) acrylate, ethylene glycol di(meth) acrylate, dipropylene glycol di(meth) acrylate, 1,3-butylene glycol di(meth) acrylate, 1,4-butanediol Di(meth) acrylate, glycerol 1,3-. diglyceride bis(indenyl) acrylate, 1,6-hexanediol ethoxy di(meth) acrylate, 1,6-hexanediol Propoxide di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, methyl 3-hydroxy-2,2-dipropionate di(indenyl)acrylate, 1,9 - decanediol II ( Mercapto) acrylate, 1,1 - decanediol di(meth) acrylate 'diethylene glycol di(meth) acrylate, neopentyl glycol bis(indenyl) acrylate, neopentyl glycol Propoxide bis(indenyl) acrylate, polyethylene glycol di(meth) acrylate, propylene glycol di(mercapto) acrylate, glycerol di(meth) propylene 26 201207034 acid ester, propylene glycol glyceride di(曱Acrylate, polypropylene glycol bis(indenyl) acrylate, polyethylene glycol di(meth) acrylate, tripropylene glycol di(meth) acrylate, triethylene glycol bis(indenyl) acrylate, four Ethylene glycol di(meth) acrylate, tripropylene glycol glyceride di(meth) acrylate, 2-hydroxy-3-propenyl methoxypropyl (meth) acrylate, 2-methyl-1,3 -propylene glycol diacrylate, trimethylolpropane benzoic acid bis(indenyl) acrylate, pentaerythritol bis(indenyl) acrylate monostearate, trimethylolpropane ethoxylated ether (Meth) acrylate, bis(indenyl) acrylate having two or more amine decanoate linkages UA-4200, ethyl urethane di(indenyl) acrylate, manufactured by Shin-Nakamura Chemical Industry Co., Ltd., bis(indenyl) acrylate with burial skeleton, 1,3-bis(3-methylpropene oxime) Oxypropyl)-1,1,3,3-tetramethyldioxane, trimethylolpropane tri(meth)acrylate, trishydroxypropylpropane ethoxytris(decyl)acrylate, Polyether triol tris(mercapto) acrylate, glycerol propoxy tri(meth) acrylate, neopentyl alcohol tris(decyl) acrylate, ethoxylated isomeric cyanuric acid triacrylate, ethoxylated three Hydroxymethylpropane triacrylate, trihydrocarbyl propane triacrylate, neopentyltetrakis(meth)acrylate, pentaerythritol ethoxytetrakis(meth)acrylate, ruthenium tris Propane tetra(indenyl) acrylate, propofol neopentyl tetraacrylate, dipentaerythritol hexa(meth) acrylate, ethyl citrate di(methyl) obtained using polyether diol Acrylate, ethyl citrate tri(meth) acrylate obtained by using polyether triol, amine hydrazine obtained by using polyether tetraol Ethyl tetra (meth) acrylate, the use of polyether alcohols obtained from six yuan Yue ethyl amine hexa (meth) acrylate. The photocurable composition of the present invention preferably contains the compound (H). In this case, the compound (H) contained in the photocurable composition may be one type or 2 27 201207034 or more. When the photocurable composition contains the compound (Η), the ratio of the compound (Η) is preferably 10 to 75 mass%, and 30 to 55, relative to the photocurable composition (the composition containing the compound). The mass % is better. When the compound (Η) is 10% by volume or more, the sensitivity of the photocurable composition can be improved. When the compound (Η) is 75% by mass or less, a light-hardening composition in which each component is uniformly dissolved can be obtained. (Photopolymerization initiator (G)) The photopolymerization initiator (G) may, for example, be an acetophenone photopolymerization initiator, a benzoin photopolymerization initiator, or a diphenyl ketone photopolymerization. Starting agent, thioxanthene photopolymerization initiator, α-amine ketone photopolymerization initiator, hydroxyketone photopolymerization initiator, α-mercaptopurine (acyl〇xhnester), benzyl _ (o-ethoxy ethoxy group)-α-single, acyl phosphine oxide (acryi ph〇Sphine oxide), ethyl vinegar, 3-ketolone (ketoc〇umarin), 2_ethyl hydrazine ( Ethyl anthraquinone), camphoroquinone, tetramethyl sulfonate, azobisisobutyronitrile, benzoquinone peroxide, dialkyl peroxide, secondary butyl peroxyisobutyrate, etc., by sensitivity and phase From the viewpoint of solubility, it is preferred to use a phenethyl photopolymerization initiator, a benzoin photopolymerization initiator, an α-amine ketone photopolymerization initiator or a ketone ketone photopolymerization initiator. . The acetophenone-based photopolymerization initiator can be exemplified by the following compounds. Benzene _, p-(tertiary butyl tri-o-acetophenone, chlorophenylethyl _, 2', 2'- acetophenone, hydroxyphenyl ethoxylate, 2,2 dioxin 2' _Phenyl acetophenone, 2-amine acetophenone, dialkylamine phenylethyl _, etc. The benzoin-based photopolymerization initiator may be exemplified by the following compounds: benzoin, benzoin, benzo Margin methyl ether, benzoin ethyl ether, benzoin 28 201207034 Cyclohexylbenzene remaining, 2_ -2-methyl-1-benzene
異丙醚、苯偶姻異丁峻、 -2 甲基二甲縮酮等βIsopropyl ether, benzoin, isobutyl, -2 methyl ketal, etc.
•二f胺-1-(4-嗎啉基苯)_ 丁酮_丨、2_甲基 甲硫基)苯]·2_嗎琳基丙烧小嗣等。 二苯基綱系光聚合起始劑可舉下述化合物為例。 二苯基_、苯甲醯苯甲酸、苯▼醯苯甲酸甲酯、鄰苯 甲醯苯甲酸甲酯、4_苯二与 苯基酮、丙烯酸二苯基酮、 二苯基酮、羥二苯基酮、羥丙基二 酮、4,4,-雙(二甲胺)二苯基酮等。 本發明之光硬化性組成物通常包含化合物(G),此時, 光硬化性組成物所包含之化合物(G)可為丨種,亦可為2種以 上。相對於光硬化性組成物(包含光聚合起始劑之組成 物),光聚合起始劑((3)之比例以1〜12質量%為佳,以4〜10 質量%為更佳。當光聚合起始劑((^為丨質量%以上時,不用 進行加熱等操作,即可輕易地得到硬化物。當光聚合起始 劑(G)為12質量%以下時,可均勻地混合,故硬化物中殘存 之光聚合起始劑(〇)變少’而抑制硬化物之物理性質的降 低。 <<其他成分》 光硬化性組成物亦可含有聚合物(D)、化合物(E)、化合 物(F)、光聚合起始劑及化合物(H)以外之其他成分。其 他成分可舉例如:聚合物(D)以外之界面活性劑(亦可為氟系 界面活性劑)、化合物(E)、化合物(F)及化合物(H)以外的光 29 201207034 聚σ社化σ物、光敏劑、樹脂、金屬氧化物微粒子、碳化 合物、金射姨子、魏有機化合物等。本發明之光硬化 !·生、,且成物並未特職需要聚合物⑼以外之界面活性劑或 才()化合物(F)及化合物(印以外之光聚合性化合 物另彳面,光敏劑、樹脂、金屬氧化物微粒子、碳化 口物、金屬顺子等(以下,總稱該等為添加細)可視目的 包含於本發明之光硬化性組成物中。 光敏劑可舉例如:正丁胺、二正丁胺、三正丁膦、婦 丙硫腺s-苯甲基異硫脲_對甲苯亞石黃酸酷、三乙胺、甲基 丙烯酸二乙胺?舻、一占 -曰一伸四乙胺、4,4,-雙(二烷胺)二苯基酮 荨胺化合物。 樹月曰可舉例如:敗樹脂、聚醋、聚醋寡聚物、聚碳酸 8曰、聚(甲基)丙烯酸酯等。 金屬氧化物微粒子可舉例如:氧化鈦、氧化石夕、氧化 錯等。 碳化合物可舉例如:奈米碳管、 富勒稀(fullerene)等。 金屬微粒子可舉銅、鉑等為例。 其他有機化合物可舉例如 :卟琳、金属内包卟琳 '離 子性液體(1·己基_3_曱基咪唑氣化物等)、色素等。 當光硬化性組成物含有上述其他成分(特別是含有添 加劑(I))時’相對於光硬化性組成物(包含其他成分之組成 物)’其他成分之總量的比例以2〇質量%以下為佳。當添加 劑⑴為20質量%以下時,可均勻地混合光硬化性組成物, 得到均質之光硬化性組成物。 30 201207034 關於以上説明之本發明之光硬化性組成物,因將含有 以特定之比例將特定之化合物(A)〜(C)共聚合後所得之較 低分子量的聚合物(D)’作為非離子系氟界面活性劑,故不 需將來自全氟辛炫續酸之化合物作為原料使用,即可形成 脫模性優異之硬化物’且與氟界面活性劑與其他成分的相 溶性優異。 <表面具有微細圖案之成形體之製造方法> 本發明之表面具有微細圖案之成形體之製造方法具有 下述(1)〜(3)之步驟。 (1) 使本發明之光硬化性組成物接觸模具之具有翻轉圖 案之表面的步驟’該模具之表面具有前述微細圖案之翻轉 圖案。 (2) 於使光硬化性組成物接觸模具之表面的狀態下,將 光照射至光硬化性組成物,使光硬化性組成物硬化而成為 硬化物之步驟。 (3) 將模具自硬化物分離,得到表面具有微細圖案之成 形體的步驟。 本發月之表面具有微細圖案之成形體之製造方法,更 具體而。’可舉下述⑷〜⑷之方法為例。 ⑷方去·具有下述步驟(a-l)〜(a-4)之方法。 園所不’將光硬化性組成物20配置於基板30 之表面的步驟。 (a2)如第1圖所示,將模具1〇按壓至光硬化性組成物 2〇 ’使4模具1G之翻轉圖案12與光硬化性組成物20相接的 31 201207034 步驟。 (a-3)於將模具10按壓至光硬化性組成物20之狀態下, 將光照射至光硬化性組成物20,使光硬化性組成物2〇硬化 而成為硬化物的步驟。 (a-4)將模具10、或基板30及模具10自硬化物分離,得 到表面具有微細圖案之成形體的步驟。 (b) 方法:具有下述步驟(b-Ι)〜(b-4)之方法。 (b-Ι)如第2圖所示,將光硬化性組成物20配置於模具1〇 之翻轉圖案12之表面的步驟。 (b-2)如第2圖所示,將基板30按壓至模具1〇之表面之光 硬化性組成物20的步驟。 (b-3)於將基板3 0按壓至光硬化性組成物2〇之狀態下, 將光照射至光硬化性組成物20,使光硬化性組成物2〇硬化 而成為硬化物的步驟。 (b-4)將模具10、或基板30及模具1〇自硬化物分離,得 到表面具有微細圖案之成形體的步驟。 (c) 方法:具有下述步驟(c_i)〜(c_4)之方法。 (c-1)如第1圖所示,將基板3〇與模具1〇以模具1〇之翻轉 圖案12位於基板30側之方式接近或接觸的步驟。 (c-2)如第1圖所示’將光硬化性組成物2〇填充於基板3〇 與模具10之間的步驟。 (c-3)於基板30與模具1〇接近或接觸之狀態下,將光照 射至光硬化性組成物20,使光硬化性組成物2〇硬化而成為 硬化物的步驟。 32 201207034 (c_4)將模具ι〇 '或基板3〇及模具1〇自硬化物分離,得 到表面具有微細圖案之成形體的步驟。 基板可舉無機材料製基板或有機材料製基板為例。 無機材料可舉例如:矽晶圓、玻璃、石英玻璃、金屬 (鋁、鎳、銅等。)、金屬氧化物(氧化鋁等)、氮化矽、氮化 紹、鈮酸鐘(lithium niobate)等。 有機材料可舉例如:氟樹脂、矽氧樹脂、丙烯酸樹脂、 聚碳酸_、聚醋(聚對笨二甲酸乙二g旨等)、聚醯亞胺、聚丙 烯、聚乙烯 '尼龍樹脂(nyl〇n resin)、聚苯硫鱗(p〇iyph邮_ sulfide)、環狀聚烯烴等。 由與光硬化性組成物之密接性優異的點來看,基板亦 可使用經表面處理的基板。表面處理可舉例如:底漆塗布 處理 '臭氧處理、電㈣刻處理等。使用在底漆塗布處理 的底漆可舉:聚(甲基)丙稀酸曱醋、錢偶合劑、石夕氮烧 (silazane)等為例。 模具可舉非透光材料製模具或透光材料製模具為例。 非透光材料可舉例如:⑪晶圓、鎳、銅、不鏽鋼、欽、 SiC、雲母等。 透光材料可舉例如:石英、玻璃、 環狀聚稀烴、聚碳酸酯 脂等。 聚二甲基矽氧烷、 聚對苯二甲酸乙二g旨、透明說樹 基板及模具中之至少-者係作成可透過光聚合起始劑 (G)所作用之波長的光4〇〇/。以上之材料。 模具係於表面具有翻轉圖案。翻轉圖案係對應於成形 33 201207034 體表面之微細圖案的翻轉圖案。 翻轉圖案具有微細之凸部及/或凹部。 凸部可舉例如:延伸於模具表面之長條狀凸條、散布 於表面之突起等。 凹部可舉例如:延伸於模具表面之長條狀溝、散布於 表面之孔等。 凸條或溝的形狀可舉例如:直線、曲線、彎曲形狀等。 凸條或溝亦可魏平行地存在而構成條紋狀。 凸條或溝的與長度方向垂直之方向的截面形狀可舉例 如:長方形、梯形、三角形、半圓形等。 大起或孔之形狀可舉例如:三角柱、四角柱、六角柱、 圓柱、二角錐、四角錐、六角錐、圓錐、半球、多面體等。 凸條或溝的寬度’平均係以lnm〜500μιη為佳,以 10nm〜ΙΟΟμιη為更佳,以15ηιη〜1〇μπι尤佳。凸條的寬度係意 指’與長度方向垂直之方向的截面中的底邊長度。溝的寬 度係意指’與長度方向垂直之方向的截面中的上邊長度。 突起或孔的寬度,平均係以lmn〜5〇〇μϊη為佳,以 10nm〜ΙΟΟμηι更佳,以15ηιη〜1〇μπι尤佳。突起的寬度係意 指’當底面為細長時,與長度方向垂直之方向的截面中的 底邊長度;並非如此時,則意指突起之底面中的最大長度。 孔的寬度係意指’當開口部為細長時,與長度方向垂直之 方向的截面中的上邊長度;並非如此時,則意指孔之開口 部中的最大長度。 凸部的高度,平均係以lnm〜500μπι為佳,以 34 201207034 - l〇nm〜l〇〇pm更佳,以15nm〜ΙΟμηι尤佳。 凹部的深度’平均係以lnm〜5〇〇μΓη為佳,以 l〇nm〜ΙΟΟμητ更佳,以 l5nm〜1〇|Llm尤佳。 於翻轉圖案密集之區域中,鄰接之凸部(或凹部)間的間 隔,平均以lnm〜50〇μηι為佳,以匕爪〜刈叫更佳。鄰接之凸 部間的間隔係意指,由凸部之截面的底邊終端至鄰接之凸 部之截面的底邊終端之距離。鄰接之凹部間的間隔係意 指’由凹部之載面的上邊終端至鄰接之凹部之戴面的上端 始端之距離。 凸部之最小尺寸以Inm〜50μηι為佳,以lnm~500nm更 佳’以lnm〜50nm特佳。最小尺寸係意指凸部之寬度、長度 及南度中最小的尺寸。 蜃 凹部之最小尺寸以lnrn〜50μηι為佳,以lnm〜5〇Onm更 • 佳,以1nm〜50nm特佳。最小尺寸係意指四部之寬度、長度 及深度_最小的尺寸。 步驟(a-Ι): 光硬化性組成物之配置方法可舉例如:喷墨法、灌模 法(potting method)、旋轉塗布法、滾筒盡布法、鑄塗法、 浸塗法、模壓口塗布法、蘭幕爾-布羅吉法 (Langmuir-Blodgett method)、真空蒸锻法等。 光硬化性組成物可配置於基板之整面,亦可配置於基 板表面之一部分。 步驟(a-2): 將模具按壓至光硬化性組成物時的力0壓力(計示壓)係 35 201207034 以大於G〜1GMPa以下為佳,魏1〜警a更佳。將模具按壓 至光硬化性組成物時的溫度係以〇〜1〇〇〇c為佳,以丨〇〜 更佳。 步驟(b-Ι): 光硬化性組成物之配置方法可舉例如:噴墨法、灌模 法、旋轉塗布法、滾筒塗布法、铸塗法、浸塗法、模壓口 塗布法、蘭幕爾-布羅吉法、真空蒸鑛法等。 光硬化性組成物可配置於模具之翻轉圖案的整面,亦 可配置於翻轉圖案之一部分,以配置於翻轉圖案之整面為 佳。 步驟(b-2): 將基板按壓至光硬化性組成物時的加壓力(計示壓)係 以大於0〜lOMPa以下為佳,以o.^sMPa更佳。將基板按壓 至光硬化性組成物時的溫度係以〇〜1 〇〇°C為佳,以1 〇〜6〇。匚 更佳。 步驟(c-2): 將光硬化性組成物填充於基板與模具之間的方法可舉 藉由毛細現象將光硬化性組成物吸引至空隙的方法為例。 填充光硬化性組成物時的溫度係以〇〜1〇〇〇C為佳,以 10〜60°C更佳。 步驟(a-3)、(b-3)、(c-3): 照射光的方法可舉例如:使用透光材料製模具由該模 具側照射光的方法、使用透光材料製基板由該基板側照射 光的方法。光的波長以200〜500nm為佳。於照射光時,亦 36 201207034 - 可將光硬化性組成物加熱來促進硬化。 照射光時的溫度係以〇〜1 〇〇°C為佳,且以1 〇〜6〇°c更佳。 步驟(a-4)、(b-4)、(c-4): 將模具、或基板及模具自硬化物分離時的溫度以〇〜1〇〇 。(:為佳,以10〜60°C更佳。 將基板及模具自硬化物分離後,如第3圖所示,可得僅 由具有轉印有模具之翻轉圖案之表面的硬化物42所構成, 且於表面具有微細圖案44之成形體40。 當僅將模具自硬化物分離時,如第4圖所示,得到僅由 具有轉印有模具之翻轉圖案之表面的硬化物42與基板30所 構成’且表面具有微細圖案44之成形體4〇(積層體)。 表面具有微細圖案之成形體可舉下述物品為例。 光學元件:微透鏡陣列、光波導元件、光開關元件(栅 ' 極偏光元件、波長板等。)、夫瑞奈波帶片(Fresenel zone plate) 元件、二元元件、銅焊接元件(blazed element)、光子晶體 等。 防反射構件:AR(抗反射)塗布構件等。 晶片類:生物晶片、μ-TAS(微型全分析系統)用晶片、 微型晶片等。 其他:紀錄媒體、顯示器材料、觸媒之載體、濾器、 感測器構件、半導體裝置(包含MEMS。)之製造所使用的光 阻、電鑄用之複製模具(母模具)、壓印用之複製模具(子模 具;daughter mold)等。 作為光阻使用時,可藉由將具有該微細圖案之成形體 37 201207034 作為光罩來_基板在基板形成 微細圖案。 作為電鋒用之複製模具使用時,於具有該微細圖案之 成形體的表面藉由無電解電鍍或金屬蒸鍍形成導電層後, 以鎳電解電鍍將鎳析出至該導電層之表面,藉此可^作鎳 電鑄模具。隨成形體之表面的脫模性優異,故容易將製 作之鎳電鑄模具自該成形體分離。 又,具有該微細圖案之成形體因具有高透明性,且具 有高脫模性,故亦可作為壓印用之複製模具使用。特別是, 於使用透光材料作為該成形體之基材時,可作為光奈米壓 印用之複製模具使用。 以上說明之本發明的表面具有微細圖案之成形體之製 造方法中,由於使用本發明之光硬化性組成物,其可形成 脫膜性優異之硬化物,且與氟界面活性劑與其他成分之相 溶性優異,故可製造表面具有精密地轉印有模具之翻轉圖 案的微細圖案且表面組成均勻之成形體。 實施例 以下例舉實施例說明本發明,但本發明並未受該等實 施例所限定。 例1、5〜7、10、12、13、17〜32、37〜46係實施例,例 2〜4、8、9、U、14〜16、33〜36係比較例。 (質量平均分子量) 聚合物(D)之質量平均分子量係使用G P C分析裝置(昭 和電工社製,GPC-101型版)測定。具體而言,使用昭和電 38 201207034 工社製管柱(KF801、KF802、KF803) ’於洗提液中使用四 氫呋喃使其分離,益以聚甲基丙烯酸甲酯作為標準物質求 出質量平均分子量。 (黏度) 光硬化性組成物在25°C下的黏度,係使用黏度計(東機 產業社製、TV-20)測定。該黏度計係以標準液(JS50(在25 °C下為33.17mPa.S))校正完成者。對黏度在300mPa.S以下 者,判斷為良好。 (感度) 光硬化性組成物之感度係如下述求得。 以旋轉塗布法將光硬化性組成物塗布於基材之表面, 使其厚度成為約1.5μπι,此處照射來自高壓水銀燈(在 1.5〜2.0kHz中,於255、315、及365nm具有主波長的光源) 的光,求出直到完全硬化為止的累計光量,並令其為感度。 光硬化性組成物是否完全硬化,係測定汛光譜,根據丙烯 基部分之烯烴吸收的有無來作判斷。對感度為5〇〇mJ/cm2 以下者,判斷為良好。 (接觸角) 硬化物對水之接觸角係如下述測定。 將光硬化性組成物滴下至聚對苯三甲酸乙二醋(以 T’gPETmm(東洋纺社製,商品名• Di-f-amine-1-(4-morpholinylbenzene)-butanone 丨, 2-methylmethylthio) benzene]·2_ 琳 基 丙 丙 丙 。 。 。. The diphenyl type photopolymerization initiator may be exemplified by the following compounds. Diphenyl _, benzamidine benzoic acid, benzyl phthalic acid methyl ester, methyl phthalic acid benzoate, 4-benzene benzene ketone, diphenyl ketone, diphenyl ketone, hydroxy two Phenyl ketone, hydroxypropyl diketone, 4,4,-bis(dimethylamine) diphenyl ketone, and the like. The photocurable composition of the present invention usually contains the compound (G). In this case, the compound (G) contained in the photocurable composition may be in the form of two or more kinds. The ratio of the photopolymerization initiator (the composition of the photopolymerization initiator) to the photopolymerization initiator ((3) is preferably 1 to 12% by mass, more preferably 4 to 10% by mass. When the photopolymerization initiator (G) is not more than 5% by mass, the cured product can be easily obtained. When the photopolymerization initiator (G) is 12% by mass or less, it can be uniformly mixed. Therefore, the photopolymerization initiator (〇) remaining in the hardened material is reduced, and the physical properties of the cured product are suppressed from being lowered. <<Other components" The photocurable composition may also contain the polymer (D) and the compound ( E), a compound (F), a photopolymerization initiator, and other components other than the compound (H), and other components may be, for example, a surfactant other than the polymer (D) (may be a fluorine-based surfactant), Light other than the compound (E), the compound (F) and the compound (H) 29 201207034 σ σ 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 The light hardening of the invention! · Health, and the product does not require special tasks other than the polymer (9) The active agent or the compound (F) and the compound (the photopolymerizable compound other than the imprinted surface, the photosensitizer, the resin, the metal oxide fine particles, the carbonized mouth, the metal straight, etc. (hereinafter, collectively referred to as the addition) The fine purpose is included in the photocurable composition of the present invention. The photosensitizer may, for example, be n-butylamine, di-n-butylamine, tri-n-butylphosphine, or dithio-s-phenylmethylisothiourea. Toluene sulphate, triethylamine, diethylamine methacrylate, oxime, oxime, tetraethylamine, 4,4,-bis(dialkylamine)diphenyl ketone oxime compound. For example, a resin, a polyacetate, a polyacetate oligomer, a polycarbonate, or a poly(meth)acrylate may be mentioned. Examples of the metal oxide fine particles include titanium oxide, oxidized oxide, and oxidization. Examples of the carbon compound include a carbon nanotube, a fullerene, etc. Examples of the metal fine particles include copper, platinum, and the like. Other organic compounds include, for example, 卟琳, metal inclusion 卟琳' ionic liquid (1 · hexyl _3_ decyl imidazole vapor, etc.), pigments, etc. when photocurability When the product contains the above-mentioned other components (particularly, the additive (I) is contained), the ratio of 'the photocurable composition (the composition containing the other components)' to the total amount of the other components is preferably 2% by mass or less. When the amount of the additive (1) is 20% by mass or less, the photocurable composition can be uniformly mixed to obtain a homogeneous photocurable composition. 30 201207034 The photocurable composition of the present invention described above is contained in a specific ratio. The lower molecular weight polymer (D)' obtained by copolymerizing the specific compounds (A) to (C) is used as a nonionic fluorosurfactant, so that a compound derived from perfluorooctyl acid is not required to be used as a raw material. It is possible to form a cured product excellent in mold release property and is excellent in compatibility with a fluorine surfactant and other components. <Manufacturing method of a molded article having a fine pattern on the surface> The method for producing a molded article having a fine pattern on the surface of the present invention has the following steps (1) to (3). (1) A step of bringing the photocurable composition of the present invention into contact with a surface of a mold having an inverted pattern. The surface of the mold has a reverse pattern of the aforementioned fine pattern. (2) A step of applying light to the photocurable composition and curing the photocurable composition to form a cured product in a state where the photocurable composition is brought into contact with the surface of the mold. (3) A step of separating the mold from the cured product to obtain a molded body having a fine pattern on the surface. The method for producing a molded body having a fine pattern on the surface of the present month is more specific. The following methods (4) to (4) can be exemplified. (4) The method of the following steps (a-1) to (a-4). The garden does not have a step of disposing the photocurable composition 20 on the surface of the substrate 30. (a2) As shown in Fig. 1, a step of pressing the mold 1〇 to the photocurable composition 2〇' to bring the inversion pattern 12 of the 4th mold 1G into contact with the photocurable composition 20 is 201207034. (a-3) A step of applying light to the photocurable composition 20 and curing the photocurable composition 2 to form a cured product in a state where the mold 10 is pressed against the photocurable composition 20. (a-4) A step of separating the mold 10, the substrate 30, and the mold 10 from the cured product to obtain a molded body having a fine pattern on the surface. (b) Method: A method having the following steps (b-Ι) to (b-4). (b-Ι) As shown in Fig. 2, the photocurable composition 20 is placed on the surface of the reverse pattern 12 of the mold 1〇. (b-2) The step of pressing the substrate 30 against the photo-curable composition 20 on the surface of the mold 1 as shown in Fig. 2 . (b-3) A step of applying light to the photocurable composition 20 in a state where the substrate 30 is pressed to the photocurable composition 2, and curing the photocurable composition 2 to be a cured product. (b-4) A step of separating the mold 10, the substrate 30, and the mold 1 from the cured product to obtain a molded body having a fine pattern on the surface. (c) Method: A method having the following steps (c_i) to (c_4). (c-1) As shown in Fig. 1, the substrate 3 is brought into close contact with or in contact with the mold 1 in such a manner that the reverse pattern 12 of the mold 1 is located on the side of the substrate 30. (c-2) The step of filling the photocurable composition 2〇 between the substrate 3〇 and the mold 10 as shown in Fig. 1 . (c-3) A step of curing the photocurable composition 20 and curing the photocurable composition 2 into a cured product in a state where the substrate 30 is in close contact with or in contact with the mold 1A. 32 201207034 (c_4) A step of separating the mold 〇 or 'the substrate 3' and the mold 1 from the cured product to obtain a molded body having a fine pattern on the surface. The substrate may be exemplified by a substrate made of an inorganic material or a substrate made of an organic material. Examples of the inorganic material include ruthenium wafer, glass, quartz glass, metal (aluminum, nickel, copper, etc.), metal oxide (alumina, etc.), tantalum nitride, nitriding, and lithium niobate. Wait. The organic material may, for example, be a fluororesin, a fluorinated resin, an acrylic resin, a polycarbonate, a polyacetate (poly(p-diphenyldicarboxylate), a polyimine, a polypropylene, a polyethylene 'nylon resin (nyl) 〇n resin), polyphenylene sulfide scale (p〇iyph mail_ sulfide), cyclic polyolefin, and the like. A surface-treated substrate can also be used as the substrate from the viewpoint of excellent adhesion to the photocurable composition. The surface treatment may, for example, be a primer coating treatment 'ozone treatment, electric (four) engraving treatment, or the like. The primer used in the primer coating treatment may be exemplified by poly(methyl)acrylic acid vinegar, money coupling agent, silazane or the like. The mold may be exemplified by a mold made of a non-transparent material or a mold made of a light-transmitting material. Examples of the non-translucent material include 11 wafers, nickel, copper, stainless steel, chin, SiC, mica, and the like. The light-transmitting material may, for example, be quartz, glass, cyclic polycarbonate or polycarbonate. At least one of polydimethylsiloxane, polyethylene terephthalate, transparent tree substrate and mold is made to pass light of a wavelength at which the photopolymerization initiator (G) acts. /. The above materials. The mold has a flip pattern on the surface. The flip pattern corresponds to the flip pattern of the fine pattern of the body surface of the forming 33 201207034. The flip pattern has fine protrusions and/or recesses. The convex portion may be, for example, a long strip extending from the surface of the mold, a protrusion scattered on the surface, or the like. The concave portion may be, for example, a long groove extending over the surface of the mold, a hole scattered on the surface, or the like. The shape of the ridge or groove may be, for example, a straight line, a curved line, a curved shape or the like. The ridges or grooves may also exist in parallel to form a stripe shape. The cross-sectional shape of the ridge or groove perpendicular to the longitudinal direction may be, for example, a rectangle, a trapezoid, a triangle, a semicircle or the like. The shape of the large rise or the hole may be, for example, a triangular prism, a quadrangular prism, a hexagonal column, a cylinder, a double pyramid, a quadrangular pyramid, a hexagonal cone, a cone, a hemisphere, a polyhedron, or the like. The width or width of the ridges or grooves is preferably from 1 nm to 500 μm, more preferably from 10 nm to ΙΟΟμηη, and even more preferably from 15 ηηη to 1 〇μπι. The width of the ridges means the length of the base in the section perpendicular to the longitudinal direction. The width of the groove means the length of the upper side in the section perpendicular to the longitudinal direction. The width of the protrusions or holes is preferably lmn~5〇〇μϊη, more preferably 10nm~ΙΟΟμηι, and 15ηιη~1〇μπι. The width of the protrusion means the length of the bottom side in the section perpendicular to the longitudinal direction when the bottom surface is elongated; otherwise, it means the maximum length of the bottom surface of the protrusion. The width of the hole means the length of the upper side in the cross section in the direction perpendicular to the longitudinal direction when the opening portion is elongated; otherwise, it means the maximum length in the opening portion of the hole. The height of the convex portion is preferably from 1 nm to 500 μm, and more preferably from 34 201207034 - l〇nm to l〇〇pm, and particularly preferably from 15 nm to ΙΟμηι. The depth of the recesses is preferably averaging from 1 nm to 5 〇〇μΓη, more preferably from 1 〇 nm to ΙΟΟμητ, and more preferably from 15 nm to 1 〇 Llm. In the region where the flip pattern is dense, the interval between the adjacent convex portions (or recesses) is preferably 1 nm to 50 〇 μηι, and more preferably 匕 刈 刈 刈. The interval between the adjacent convex portions means the distance from the bottom end of the cross section of the convex portion to the bottom end of the cross section of the adjacent convex portion. The interval between adjacent concave portions means the distance from the upper end of the carrying surface of the concave portion to the upper end of the wearing surface of the adjacent concave portion. The minimum size of the convex portion is preferably Inm 50 50 μm, more preferably 1 nm to 500 nm, and particularly preferably 1 nm to 50 nm. The minimum size means the smallest of the width, length and southness of the projection.最小 The minimum size of the concave portion is preferably lnrn~50μηι, more preferably 1nm~5〇Onm, and particularly preferably 1nm~50nm. The minimum size means the width, length and depth of the four parts _ the smallest size. Step (a-Ι): The method of disposing the photocurable composition may, for example, be an inkjet method, a potting method, a spin coating method, a drum coating method, a cast coating method, a dip coating method, or a molding port. Coating method, Langmuir-Blodgett method, vacuum steaming method, and the like. The photocurable composition may be disposed on the entire surface of the substrate or may be disposed on a portion of the surface of the substrate. Step (a-2): Force 0 pressure (counting pressure) when the mold is pressed to the photocurable composition 35 201207034 It is preferable to be larger than G~1 GMPa or less, and Wei 1 to police a is better. The temperature at which the mold is pressed to the photocurable composition is preferably 〇~1〇〇〇c, and more preferably 丨〇~. Step (b-Ι): The method of disposing the photocurable composition may, for example, be an inkjet method, a filling method, a spin coating method, a roll coating method, a cast coating method, a dip coating method, a die coating method, or a blue screen Er-Broji method, vacuum distillation method, etc. The photocurable composition may be disposed on the entire surface of the inversion pattern of the mold, or may be disposed in one of the inversion patterns, and is preferably disposed on the entire surface of the inversion pattern. Step (b-2): The pressing force (counting pressure) at the time of pressing the substrate to the photocurable composition is preferably more than 0 to 10 MPa, more preferably 0.2 s MPa. The temperature at which the substrate is pressed to the photocurable composition is preferably 〇1 to 1 〇〇 ° C, and is 1 〇 to 6 〇.匚 Better. Step (c-2): A method of filling the photocurable composition between the substrate and the mold is exemplified by a method of attracting the photocurable composition to the void by a capillary phenomenon. The temperature at which the photocurable composition is filled is preferably 〇1 to 1 〇〇〇C, more preferably 10 to 60 °C. Steps (a-3), (b-3), and (c-3): The method of irradiating light may be, for example, a method of irradiating light from the mold side using a mold made of a light-transmitting material, or a substrate made of a light-transmitting material. A method of irradiating light on the substrate side. The wavelength of light is preferably 200 to 500 nm. When irradiated with light, also 36 201207034 - The photohardenable composition can be heated to promote hardening. The temperature at which the light is irradiated is preferably 〇1 to 1 〇〇 ° C, and more preferably 1 〇 to 6 〇 ° c. Steps (a-4), (b-4), and (c-4): The temperature at which the mold or the substrate and the mold are separated from the cured product is 〇1 to 1 Torr. (: Preferably, it is preferably 10 to 60 ° C. After the substrate and the mold are separated from the cured product, as shown in Fig. 3, the cured product 42 having only the surface on which the reverse pattern of the mold is transferred can be obtained. The molded body 40 having the fine pattern 44 on the surface thereof. When only the mold is separated from the cured product, as shown in Fig. 4, the cured product 42 and the substrate only having the surface on which the reverse pattern of the mold is transferred are obtained. 30 molded bodies 4 (layered body) having a fine pattern 44 on the surface thereof. Examples of the molded body having a fine pattern on the surface include the following items: Optical elements: microlens array, optical waveguide element, and optical switching element ( Grid 'polar polarizing element, wave plate, etc.), Fresenel zone plate element, binary element, blazed element, photonic crystal, etc. Anti-reflection member: AR (anti-reflection) coating Components, etc. Wafers: biochips, μ-TAS (micro total analysis system) wafers, microchips, etc. Others: recording media, display materials, catalyst carriers, filters, sensor components, semiconductor devices (including Photoresist used in the manufacture of MEMS.), a replica mold (mother mold) for electroforming, a replica mold for imprinting, a daughter mold, etc. When used as a photoresist, it can be Shaped molded body 37 201207034 As a mask, a substrate is formed into a fine pattern on a substrate. When used as a replica mold for an electric front, a conductive layer is formed on the surface of a molded body having the fine pattern by electroless plating or metal evaporation. Thereafter, nickel is deposited by electroplating on the surface of the conductive layer by nickel electroplating, whereby the nickel electroforming mold can be used. With the excellent mold release property of the surface of the molded body, it is easy to produce the nickel electroforming mold from the molded body. Further, since the molded body having the fine pattern has high transparency and high mold release property, it can also be used as a replica mold for imprinting. In particular, a light-transmitting material is used as a base of the molded body. In the case of a material, it can be used as a replica mold for photon imprinting. In the method for producing a molded body having a fine pattern on the surface of the present invention described above, the photocurable group of the present invention is used. The material can form a cured product excellent in release property, and is excellent in compatibility with a fluorine surfactant and other components, so that a fine pattern having a surface on which a reverse pattern of a mold is precisely transferred can be produced and a uniform surface composition can be formed. EXAMPLES Hereinafter, the present invention will be described by way of examples, but the present invention is not limited by the examples. Examples 1, 5 to 7, 10, 12, 13, 17 to 32, 37 to 46 are examples. Examples 2 to 4, 8, 9, U, 14 to 16, and 33 to 36 are comparative examples. (Mass average molecular weight) The mass average molecular weight of the polymer (D) is a GPC analyzer (Goldware Co., Ltd., GPC-101) For the measurement, specifically, use the column (KF801, KF802, KF803) of Showa Electric 38 201207034 Co., Ltd. to separate the eluate using tetrahydrofuran, and use polymethyl methacrylate as a standard substance. The mass average molecular weight is obtained. (Viscosity) The viscosity of the photocurable composition at 25 ° C was measured using a viscometer (manufactured by Toki Sangyo Co., Ltd., TV-20). The viscometer was calibrated with a standard solution (JS50 (33.17 mPa.s at 25 °C)). It is judged to be good for a viscosity of 300 mPa·s or less. (Sensitivity) The sensitivity of the photocurable composition was determined as follows. The photocurable composition was applied to the surface of the substrate by a spin coating method to have a thickness of about 1.5 μm, where the irradiation was carried out from a high-pressure mercury lamp (having a dominant wavelength at 255, 315, and 365 nm in 1.5 to 2.0 kHz). The light of the light source is obtained as the cumulative amount of light until it is completely hardened. Whether or not the photocurable composition is completely cured is determined by measuring the ruthenium spectrum based on the presence or absence of olefin absorption in the propylene group. It is judged to be good for those having a sensitivity of 5 〇〇 mJ/cm 2 or less. (Contact angle) The contact angle of the cured product with water was measured as follows. The photocurable composition was dropped to polyethylene terephthalate (T'gPETmm (trade name, manufactured by Toyobo Co., Ltd.)
主波長的光源)之光15秒鐘, 以载破片覆蓋於其上,再從其上照射 〇kHz中,於255、315、及365nm具有 >秒、鐘’得到硬化物。 39 201207034 針對該硬化物,使用接觸角計(協和界面科學社製, CA-X150型),使4μ!ν之水滴附在硬化物之表面上來測定。 對接觸角為80度以上者,判斷為良好。接觸角係成為 硬化物之脫模性的基準。 又,對於複數處測定接觸角時的偏差情況σ為2·5以下 者,判斷為良好。偏差情況σ係顯示硬化物表面後之組成 的均勻性者。 (化合物(Α)) 化合物(Α1-1) : 3,3,4,4,5,5,6,6,7,7,8,8,8-十三氟甲基丙 烯酸辛S旨(Aldrich社製)。 CH2=C(CH3)-C(0)0-(CH2)2-(CF2)6F · · · (A1-1)。 (化合物(B)) 化合物(B-1):聚乙二醇單甲基丙烯酸酯(日本油脂社 製,數平均分子量:284)。 CH2=C(CH3)-C(0)0-(CH2CH20)4 5-H· · «(B-l)。 化合物(B-2):聚乙二醇單曱基丙烯酸酯(日本油脂社 製,數平均分子量:438)。 CH2=C(CH3)-C(0)0-(CH2CH20)8-H · · · (B-2)。 化合物(B-3):聚乙二醇單甲基丙烯酸酯(日本油脂社 製,數平均分子量:174)。 CH2=C(CH3)-C(0)0-(CH2CH20)2-H· . .(B-3)。 化合物(B-4):曱氧聚乙二醇單甲基丙烯酸酯(曰本油脂 社製,數平均分子量:276)。 CH2=C(CH3)-C(0)0-(CH2CH20)4-CH3 · · · (B-4)。 40 201207034 (化合物(c)) 化合物(C-l) : 2-甲基丙烯酸乙基己酯(Aldrich社製)。 CH2=C(CH3)-C(0)0-CH2CH(C2H5)C4H9 . · · (C-1)。 化合物(C-2):甲基丙烯酸己酯(Aldrich社製)。 CH2=C(CH3)-C(0)0-C6Hl3 · · · (C-2)。 化合物(C-3):曱基丙烯酸異丁酯(Aldrich社製)。 CH2=C(CH3)-C(0)0-CH(CH3)C2H5 . · · (C-3)。 化合物(C-4):甲基丙烯酸十二烷酯(Aldrich社製)。 CH2=C(CH3)-C(0)0-Cl2H25 · . . (C-4)。 化合物(C_5):曱基丙烯酸十八烧醋(Aldrich社製)。 CH2=C(CH3)-C(0)0-C18H37 . · · (C-5)。 (化合物(E)) 化合物(El-1) : 3,3,4,4,5,5,6,6,7,7,8,8,8-十三氟丙烯酸 辛酉旨(Aldrich社製)。 CH2=CH-C(0)0-(CH2)2-(CF2)6F · · · (EM)。 (化合物(F)) 化合物(F-1) : 2-甲基-2-内稀酸金剛烧g旨(出光興產社 製)。 [化1]The light of the main wavelength source is lighted for 15 seconds, and the carrier is covered thereon, and then irradiated with 〇 kHz, and 255, 315, and 365 nm have > seconds, clocks to obtain a cured product. 39 201207034 For the cured product, a contact angle meter (manufactured by Kyowa Interface Science Co., Ltd., model CA-X150) was used, and a water droplet of 4 μm was attached to the surface of the cured product to measure. When the contact angle is 80 degrees or more, it is judged to be good. The contact angle is the basis for the release property of the cured product. In addition, it is judged that it is good that the deviation σ when the contact angle is measured at a plurality of points is 2.5 or less. The deviation σ indicates the uniformity of the composition after the surface of the cured product. (Compound (Α)) Compound (Α1-1) : 3,3,4,4,5,5,6,6,7,7,8,8,8-tridecafluoromethyl acrylate S (Aldrich) Social system). CH2=C(CH3)-C(0)0-(CH2)2-(CF2)6F · · · (A1-1). (Compound (B)) Compound (B-1): polyethylene glycol monomethacrylate (manufactured by Nippon Oil & Fats Co., Ltd., number average molecular weight: 284). CH2=C(CH3)-C(0)0-(CH2CH20)4 5-H· · «(B-l). Compound (B-2): polyethylene glycol monodecyl acrylate (manufactured by Nippon Oil & Fats Co., Ltd., number average molecular weight: 438). CH2=C(CH3)-C(0)0-(CH2CH20)8-H · · · (B-2). Compound (B-3): polyethylene glycol monomethacrylate (manufactured by Nippon Oil & Fats Co., Ltd., number average molecular weight: 174). CH2=C(CH3)-C(0)0-(CH2CH20)2-H. (B-3). Compound (B-4): decyloxy polyethylene glycol monomethacrylate (manufactured by Sakai Oil Co., Ltd., number average molecular weight: 276). CH2=C(CH3)-C(0)0-(CH2CH20)4-CH3 · · · (B-4). 40 201207034 (Compound (c)) Compound (C-1): 2-ethylhexyl methacrylate (manufactured by Aldrich Co., Ltd.). CH2=C(CH3)-C(0)0-CH2CH(C2H5)C4H9. (C-1). Compound (C-2): hexyl methacrylate (manufactured by Aldrich Co., Ltd.). CH2=C(CH3)-C(0)0-C6Hl3 · · · (C-2). Compound (C-3): isobutyl methacrylate (manufactured by Aldrich Co., Ltd.). CH2=C(CH3)-C(0)0-CH(CH3)C2H5 . · · (C-3). Compound (C-4): dodecyl methacrylate (manufactured by Aldrich Co., Ltd.). CH2=C(CH3)-C(0)0-Cl2H25 · . . (C-4). Compound (C_5): mercaptoacrylic acid octagonal vinegar (manufactured by Aldrich Co., Ltd.). CH2=C(CH3)-C(0)0-C18H37 . · · (C-5). (Compound (E)) Compound (El-1) : 3,3,4,4,5,5,6,6,7,7,8,8,8-trifluorotrifluoroacrylate (manufactured by Aldrich) ). CH2=CH-C(0)0-(CH2)2-(CF2)6F · · · (EM). (Compound (F)) Compound (F-1): 2-methyl-2-endoic acid radix sin (manufactured by Idemitsu Kosan Co., Ltd.). [Chemical 1]
化合物(F-2):丙烯酸異冰片酯(Aldrich社製)。 41 201207034 化合物(F-3) : 2-丙烯酸乙基己酯(Aldrich社製)。 (光聚合起始劑(G)) 光聚合起始劑(G-l): Ciba.Geigy.Specialty社製,商品 名:IRGACURE651。 光聚合起始劑(G-2): Ciba.Geigy. Specialty社製,商品 名:IRGACURE184。 光聚合起始劑(G-3): Ciba.Geigy.Specialty社製,商品 名:IRGACURE907。 (化合物(H)) 化合物(H-1):四乙二醇二丙烯酸酯(東京化成社製)。 化合物(H-2):以下式所表示之化合物(但,式中之r係 氫原子之化合物與R係甲基之化合物的混合物)(Aldrich社 製)。 CH2=C(CH3)-COO-CH2CH2OCONHCH2-(C(CH3)R-CH2 )2-CH2NHCOO-CH2CH2-OCO-C(CH3)=CH2 化合物(H-3):聚醚型之胺曱酸乙酯丙烯酸酯(商品名: UA-4200(新中村化學工業社製))。 化合物(H-4):新戊二醇二甲基丙烯酸酯(Aldrich社製)。 化合物(H-5):三環癸烧二丙稀酸g旨(Aldrich社製)。 化合物(H-6):雙酚A丙氧二丙烯酸酯(Aldrich社製)。 化合物(H-7):三羥曱基丙烷三丙烯酸酯(新中村化學工 業社製)。 化合物(H-8):新戍四醇四丙浠酸醋(Aldrich社製)。 [合成例1] 42 201207034 於100mL之財壓反應容器中加入16.00g之化合物 (Al-1)、16.68g之化合物(B-l)、7.32g之化合物(C-l)、3.88g 之作為分子量調整劑的辛硫醇(和光純藥工業社製)、40.00g 之作為溶劑的乙酸乙酯(和光純藥工業社製)、及0.60g之作 為聚合起始劑的二甲基2,2’-偶氮雙(2-丙酸曱酯)(和光純藥 工業社製),以氮氣取代反應容器内後,一面攪拌一面以70 °(:使其聚合16小時。聚合結束後,於減壓條件下蒸餾去除 乙酸乙酯,得到聚合物(D-1)。 [合成例2〜11] 除了如表1所示地變更化合物(A)〜(C)之種類、加入比 以外,與合成例1同樣地製作,得到聚合物(D-2)〜(D-11)。 [合成例12] 除了如表1所示地使用化合物(A)〜(C)之種類及加入 比,且將作為分子量調整劑之辛硫醇設為5.04g以外,與合 成例1同樣地製作,得到聚合物(D-12)。 [合成例13] 除了如表1所示地使用化合物(A)〜(C)之種類及加入 比,且將作為分子量調整劑之辛硫醇設為5.82g以外,與合 成例1同樣地製作,得到聚合物(D-13)。 [合成例14] 除了如表1所示地使用化合物(A)〜(C)之種類及加入 比,且將作為分子量調整劑之辛硫醇設為6.25g以外,與合 成例1同樣地製作,得到聚合物(D-14)。 [合成例15] 43 201207034 除了如表1所示地使用化合物(A)〜(C)之種類及加入 比,且將作為分子量調整劑之辛硫醇設為1.94g以外,與合 成例1同樣地製作,得到聚合物(D-15)。 [合成例16] 於100mL之而才壓反應容器中加入14.20 g之化合物 (Al-1)、9_94g之化合物(B-l)、4.26g之化合物(C-1)、2.76 g 之作為分子量調整劑的辛硫醇(和光純藥工業社製)、28.41 g 之作為溶劑的乙酸乙酯(和光純藥工業社製)及0.43 g之作為 聚合起始劑的二甲基2,2’-偶氮雙(2-丙酸甲酯)(和光純藥工 業社製),以氮氣取代反應容器内後,一面攪拌一面以70°C 使其聚合16小時。聚合結束後,於減壓條件下蒸餾去除乙 酸乙酯,得到聚合物(D-16)。 [合成例17〜19] 除了如表1所示地變更化合物(A)〜(C)之加入比以外, 與合成例16同樣地製作,得到聚合物(D-17)〜(D-19)。 44 201207034 [表l] 聚合物 (D) 化合物(A) (質量°/。) 化合物(B) (質量%) 化合物(C) (質量%) 質量平均 分子量 D-1 A1-1 40 B-1 42 C-1 18 4520 D-2 A1-1 40 B-2 42 C-1 18 4950~ D-3 A1-1 40 B-3 42 C-1 18 4950 D-4 A1-1 40 B-4 42 C-1 18 2600 D-5 A1-1 40 B-1 42 C-2 18 3880~~ D-6 A1-1 40 B-1 42 C-3 18 4020~ D-7 A1-1 40 B-1 42 C-4 18 4020 D-8 A1-1 40 B-1 42 C-5 18 4180 D-9 A1-1 60 B-1 28 C-1 12 3220~~ D-10 A1-1 25 B-1 52 C-1 23 4200 D-11 A1-1 10 B-1 60 C-1 30 3120~~ D-12 A1-1 40 B-1 42 C-1 18 2560 D-13 A1-1 40 B-1 42 C-1 18 1060 D-14 A1-1 40 B-1 42 C-1 18 850 D-15 A1-1 40 B-1 42 C-1 18 7540 D-16 A1-1 50 B-1 35 C-1 15 3500 D-17 A1-1 20 B-1 75 C-1 5 5010 ~ D-18 A1-1 40 B-1 卜60 C-1 ~~0~~ 4680 D-19 A1-1 25 B-1 30 C-1 45 3370 [例1] 於小玻璃瓶容器(内容積13mL)中,添加〇.〇4g之聚合物 (D-l)、2.00g之化合物(El-l)、4.〇〇g之化合物(jr])、3 36g 之化合物(H-1),接著混合〇.6〇§之光聚合起始劑(&〗),以 〇加之聚對苯二甲酸乙二_製财器過濾,得到光硬化性 組成物。於表2顯示該組成物之組成,於表3顯示評價結果。 [例2〜43] ° 如表2所示,除了變更組成以外,與如同樣地製作, 付到光硬化性組成物。於表3顯示評價結果。 45 201207034 [表 2-1] 例 聚合物(D) (質量%) 化合物(E) (質量%) 化合物(F) (質量%) 光聚合起 始劑(G) (質量%) 化合物(H) (質量%) 1 D-1 0.4 E1-1 20 F-1 40 G-1 6 H-1 33.6 2 D-2 0.4 E1-1 20 F-1 40 G-1 6 H-1 33.6 3 D-3 0.4 E1-1 20 F-1 40 G-1 6 H-1 33.6 4 D-4 0.4 E1-1 20 F-1 40 G-1 6 H-1 33.6 5 D-5 0.4 E1-1 20 F-1 40 G-1 6 H-1 33.6 6 D-6 0.4 E1-1 20 F-1 40 G-1 6 H-1 33.6 7 D-7 0.4 E1-1 20 F-1 40 G-1 6 H-1 33.6 8 D-8 0.4 E1-1 20 F-1 40 G-1 6 H-1 33.6 9 D-9 0.4 E1-1 20 F-1 40 G-1 6 H-1 33.6 10 D-10 0.4 E1-1 20 F-1 40 G-1 6 H-1 33.6 11 D-11 0.4 E1-1 20 F-1 40 G-1 6 H-1 33.6 12 D-12 0.4 E1-1 20 F-1 40 G-1 6 H-1 33.6 13 D-13 0.4 E1-1 20 F-1 40 G-1 6 H-1 33.6 14 D-14 0.4 E1-1 20 F-1 40 G-1 6 H-1 33.6 15 D-15 0.4 E1-1 20 F-1 40 G-1 6 H-1 33.6 16 - - E1-1 20 F-1 40 G-1 6 H-1 34.0 17 D-1 0.4 E1-1 20 F-2 40 G-1 6 H-1 33.6 18 D-1 0.4 E1-1 20 F-3 40 G-1 6 H-1 33.6 19 D-1 0.4 E1-1 20 F-1 40 G-2 6 H-1 33.6 20 D-1 0.4 E1-1 20 F-1 40 G-3 6 H-1 33.6 21 D-1 0.4 E1-1 20 F-1 40 G-1 6 H-2 33.6 22 D-1 0.4 E1-1 20 F-1 40 G-1 6 H-3 33.6 23 D-1 0.4 E1-1 20 F-1 40 G-1 6 H-4 33.6 24 D-1 0.4 E1-1 20 F-1 40 G-1 6 H-5 33.6 25 D-1 0.4 E1-1 20 F-1 40 G-1 6 H-6 33.6 [表 2-2] 例 聚合物(D) (質量%) 化合物(E) (質量%) 化合物 (F) (質量%) 光驾 起Μ (C (質1 L合 ί劑 0 Ϊ%) 化合物(Η) (質量%) 26 D-1 0.4 E1-1 20 F-1 40 G-1 6 Η-1+Η-2 23.6+10 27 D-1 0.4 E1-1 20 F-1 40 G-1 6 Η-1+Η-5 23.6+10 28 D-1 0.4 E1-1 20 F-1 40 G-1 6 Η-1+Η-7 23.6+10 29 D-1 0.4 E1-1 20 F-1 40 G-1 6 Η-1+Η-8 23.6+10 30 D-1 0.4 E1-1 20 F-1 40 G-1 6 Η-4+Η-7 23.6+10 31 D-1 0.4 E1-1 20 F-1 40 G-1 6 Η-5+Η-8 23.6+10 32 D-1 0.4 E1-1 11 F-1 12 G-1 6 Η-5+Η-8 30.6+40 33 D-16 0.4 E1-1 20 F-1 40 G-1 6 Η-1 33.6 34 D-17 0.4 E1-1 20 F-1 40 G-1 6 Η-1 33.6 35 D-18 0.4 E1-1 20 F-1 40 G-1 6 Η-1 33.6 36 D-19 0.4 E1-1 20 F-1 40 G-1 6 Η-1 33.6 46 201207034 37 D-l 3.1 El-1 19.5 F-l 38.9 G-l 5.8 H-5+H-8 23+9.7 38 D-l 0.05 El-1 20 F-l 40 G-l 6 H-5+H-8 23.95+10 39 D-l 0.4 El-1 8 F-l 19 G-l 6 H-5+H-8 42+24.6 40 D-l 0.4 El-1 30 F-3 30.6 G-l 6 H-4 33 41 D-l 0.4 El-1 15 F-l 50 G-l 8 H-l 26.6 42 D-l 0.4 El-l 20 F-l 35 G-l 3 H-l 41.6 43 D-l 3 El-1 30 F-l 40 G-l 9 H-l 18 [表3] 例 黏度 (mPa*s) 感度 (mJ/cm2) 接觸角 (度) 接觸角之偏 差情況σ 1 16 441 84 1.2 2 16 441 82 2.9 3 16 441 82 4.6 4 16 441 81 2.8 5 16 441 85 2.1 6 16 441 85 1.7 7 16 441 87 2.1 8 16 441 85 4.4 9 16 441 78 2.7 10 16 441 90 2.3 11 16 441 77 2.1 12 16 441 85 2.5 13 16 441 86 0.8 14 16 441 87 3.1 15 16 441 82 4.6 16 16 441 75 1.6 17 12 441 84 1.3 18 10 441 84 1.4 19 16 441 83 1.2 20 16 441 84 1.1 21 56 441 86 1.3 22 85 441 88 1.3 23 14 441 88 1.4 24 35 441 89 1.2 25 23 441 87 1.3 26 54 441 84 1.3 27 25 441 86 1.4 28 22 441 83 1.2 29 33 441 84 1.3 30 29 441 85 1.3 31 41 441 86 1.5 32 78 441 84 1.4 33 16 441 71 5.2 34 16 441 75 3.0 35 16 441 75 4.1 36 16 441 79 2.9 47 201207034Compound (F-2): isobornyl acrylate (manufactured by Aldrich Co., Ltd.). 41 201207034 Compound (F-3): 2-ethylhexyl acrylate (manufactured by Aldrich Co., Ltd.). (Photopolymerization initiator (G)) Photopolymerization initiator (G-1): manufactured by Ciba. Geigy. Specialty, trade name: IRGACURE 651. Photopolymerization initiator (G-2): manufactured by Ciba. Geigy. Specialty, trade name: IRGACURE 184. Photopolymerization initiator (G-3): manufactured by Ciba. Geigy. Specialty, trade name: IRGACURE 907. (Compound (H)) Compound (H-1): tetraethylene glycol diacrylate (manufactured by Tokyo Chemical Industry Co., Ltd.). The compound (H-2): a compound represented by the following formula (however, a mixture of a compound of the hydrogen atom and a compound of the R-methyl group) (a compound of Aldrich). CH2=C(CH3)-COO-CH2CH2OCONHCH2-(C(CH3)R-CH2)2-CH2NHCOO-CH2CH2-OCO-C(CH3)=CH2 Compound (H-3): Polyether type amine citrate Acrylate (trade name: UA-4200 (manufactured by Shin-Nakamura Chemical Industry Co., Ltd.)). Compound (H-4): neopentyl glycol dimethacrylate (manufactured by Aldrich Co., Ltd.). Compound (H-5): tricyclic tert-doped diacrylic acid g (manufactured by Aldrich Co., Ltd.). Compound (H-6): bisphenol A propoxy diacrylate (manufactured by Aldrich Co., Ltd.). Compound (H-7): trihydroxymercaptopropane triacrylate (manufactured by Shin-Nakamura Chemical Co., Ltd.). Compound (H-8): neodymethylene tetraacetate (manufactured by Aldrich Co., Ltd.). [Synthesis Example 1] 42 201207034 Into a 100 mL financial pressure reaction vessel, 16.00 g of a compound (Al-1), 16.68 g of a compound (Bl), 7.32 g of a compound (Cl), and 3.88 g of a molecular weight modifier were added. Ethyl mercaptan (manufactured by Wako Pure Chemical Industries, Ltd.), 40.00 g of ethyl acetate (manufactured by Wako Pure Chemical Industries, Ltd.) as a solvent, and 0.60 g of dimethyl 2,2'-azo as a polymerization initiator Bis(2-propionate) (manufactured by Wako Pure Chemical Industries, Ltd.), after replacing the inside of the reaction vessel with nitrogen, the mixture was stirred at 70 ° (for 16 hours). After the polymerization was completed, the mixture was distilled under reduced pressure. The ethyl acetate was removed to obtain a polymer (D-1). [Synthesis Examples 2 to 11] The same as the synthesis example 1 except that the types (A) to (C) of the compounds and the addition ratio were changed as shown in Table 1. The polymer (D-2) to (D-11) were obtained. [Synthesis Example 12] The types and addition ratios of the compounds (A) to (C) were used as shown in Table 1, and they were used as molecular weight regulators. The polymer (D-12) was obtained in the same manner as in Synthesis Example 1 except that the octyl mercaptan was 5.04 g. [Synthesis Example 13] The compound was used as shown in Table 1. The polymer (D-13) was obtained in the same manner as in Synthesis Example 1 except that the octyl mercaptan as the molecular weight modifier was 5.82 g, and the polymer (D-13) was obtained. In the same manner as in Synthesis Example 1, except that the types and addition ratios of the compounds (A) to (C) were used as shown in Table 1, and the octyl mercaptan as the molecular weight modifier was 6.25 g, a polymer was obtained. (D-14) [Synthesis Example 15] 43 201207034 In addition to the types and addition ratios of the compounds (A) to (C) as shown in Table 1, the octyl mercaptan as a molecular weight modifier was 1.94 g. The polymer (D-15) was obtained in the same manner as in Synthesis Example 1. [Synthesis Example 16] 14.20 g of the compound (Al-1) and 9-94 g of the compound (Bl) were added to the reaction vessel under 100 mL. 4.26 g of the compound (C-1), 2.76 g of octyl mercaptan (manufactured by Wako Pure Chemical Industries, Ltd.) as a molecular weight regulator, and 28.41 g of ethyl acetate (manufactured by Wako Pure Chemical Industries, Ltd.) and 0.43 g as a solvent. Dimethyl 2,2'-azobis(2-propionic acid methyl ester) (manufactured by Wako Pure Chemical Industries, Ltd.) as a polymerization initiator, replacing the reaction volume with nitrogen After the inside of the apparatus, the mixture was polymerized at 70 ° C for 16 hours while stirring. After the completion of the polymerization, ethyl acetate was distilled off under reduced pressure to obtain a polymer (D-16). [Synthesis Examples 17 to 19] The polymer (D-17) to (D-19) were obtained in the same manner as in Synthesis Example 16 except that the addition ratio of the compounds (A) to (C) was changed as shown in Table 1. 44 201207034 [Table 1] Polymer (D) Compound (A) (mass ° /.) Compound (B) (% by mass) Compound (C) (% by mass) Mass average molecular weight D-1 A1-1 40 B-1 42 C-1 18 4520 D-2 A1-1 40 B-2 42 C-1 18 4950~ D-3 A1-1 40 B-3 42 C-1 18 4950 D-4 A1-1 40 B-4 42 C-1 18 2600 D-5 A1-1 40 B-1 42 C-2 18 3880~~ D-6 A1-1 40 B-1 42 C-3 18 4020~ D-7 A1-1 40 B-1 42 C-4 18 4020 D-8 A1-1 40 B-1 42 C-5 18 4180 D-9 A1-1 60 B-1 28 C-1 12 3220~~ D-10 A1-1 25 B-1 52 C-1 23 4200 D-11 A1-1 10 B-1 60 C-1 30 3120~~ D-12 A1-1 40 B-1 42 C-1 18 2560 D-13 A1-1 40 B-1 42 C-1 18 1060 D-14 A1-1 40 B-1 42 C-1 18 850 D-15 A1-1 40 B-1 42 C-1 18 7540 D-16 A1-1 50 B-1 35 C -1 15 3500 D-17 A1-1 20 B-1 75 C-1 5 5010 ~ D-18 A1-1 40 B-1 Bu 60 C-1 ~~0~~ 4680 D-19 A1-1 25 B -1 30 C-1 45 3370 [Example 1] In a small glass bottle container (internal volume 13 mL), 4 g of a polymer (Dl), 2.00 g of a compound (El-l), 4. a compound of g (jr)), 3 36 g of a compound (H-1), followed by a photopolymerization initiator of 〇.6〇§ 〖), filtered with a polyethylene terephthalate to obtain a photocurable composition. The composition of the composition is shown in Table 2, and the evaluation results are shown in Table 3. [Examples 2 to 43] ° As shown in Table 2, except that the composition was changed, a photocurable composition was prepared in the same manner as in the above. The evaluation results are shown in Table 3. 45 201207034 [Table 2-1] Example polymer (D) (% by mass) Compound (E) (% by mass) Compound (F) (% by mass) Photopolymerization initiator (G) (% by mass) Compound (H) (% by mass) 1 D-1 0.4 E1-1 20 F-1 40 G-1 6 H-1 33.6 2 D-2 0.4 E1-1 20 F-1 40 G-1 6 H-1 33.6 3 D-3 0.4 E1-1 20 F-1 40 G-1 6 H-1 33.6 4 D-4 0.4 E1-1 20 F-1 40 G-1 6 H-1 33.6 5 D-5 0.4 E1-1 20 F-1 40 G-1 6 H-1 33.6 6 D-6 0.4 E1-1 20 F-1 40 G-1 6 H-1 33.6 7 D-7 0.4 E1-1 20 F-1 40 G-1 6 H-1 33.6 8 D-8 0.4 E1-1 20 F-1 40 G-1 6 H-1 33.6 9 D-9 0.4 E1-1 20 F-1 40 G-1 6 H-1 33.6 10 D-10 0.4 E1- 1 20 F-1 40 G-1 6 H-1 33.6 11 D-11 0.4 E1-1 20 F-1 40 G-1 6 H-1 33.6 12 D-12 0.4 E1-1 20 F-1 40 G- 1 6 H-1 33.6 13 D-13 0.4 E1-1 20 F-1 40 G-1 6 H-1 33.6 14 D-14 0.4 E1-1 20 F-1 40 G-1 6 H-1 33.6 15 D -15 0.4 E1-1 20 F-1 40 G-1 6 H-1 33.6 16 - - E1-1 20 F-1 40 G-1 6 H-1 34.0 17 D-1 0.4 E1-1 20 F-2 40 G-1 6 H-1 33.6 18 D-1 0.4 E1-1 20 F-3 40 G-1 6 H-1 33.6 19 D-1 0.4 E1-1 20 F-1 40 G-2 6 H-1 33.6 20 D-1 0.4 E1-1 20 F-1 40 G-3 6 H-1 33 .6 21 D-1 0.4 E1-1 20 F-1 40 G-1 6 H-2 33.6 22 D-1 0.4 E1-1 20 F-1 40 G-1 6 H-3 33.6 23 D-1 0.4 E1 -1 20 F-1 40 G-1 6 H-4 33.6 24 D-1 0.4 E1-1 20 F-1 40 G-1 6 H-5 33.6 25 D-1 0.4 E1-1 20 F-1 40 G -1 6 H-6 33.6 [Table 2-2] Example polymer (D) (% by mass) Compound (E) (% by mass) Compound (F) (% by mass) Light-driven Μ (C (quality 1 L combined) Ø0 Ϊ%) Compound (Η) (% by mass) 26 D-1 0.4 E1-1 20 F-1 40 G-1 6 Η-1+Η-2 23.6+10 27 D-1 0.4 E1-1 20 F-1 40 G-1 6 Η-1+Η-5 23.6+10 28 D-1 0.4 E1-1 20 F-1 40 G-1 6 Η-1+Η-7 23.6+10 29 D-1 0.4 E1-1 20 F-1 40 G-1 6 Η-1+Η-8 23.6+10 30 D-1 0.4 E1-1 20 F-1 40 G-1 6 Η-4+Η-7 23.6+10 31 D-1 0.4 E1-1 20 F-1 40 G-1 6 Η-5+Η-8 23.6+10 32 D-1 0.4 E1-1 11 F-1 12 G-1 6 Η-5+Η-8 30.6+40 33 D-16 0.4 E1-1 20 F-1 40 G-1 6 Η-1 33.6 34 D-17 0.4 E1-1 20 F-1 40 G-1 6 Η-1 33.6 35 D-18 0.4 E1-1 20 F-1 40 G-1 6 Η-1 33.6 36 D-19 0.4 E1-1 20 F-1 40 G-1 6 Η-1 33.6 46 201207034 37 Dl 3.1 El-1 19.5 Fl 38.9 Gl 5.8 H-5+H-8 23+9.7 38 Dl 0.05 El-1 20 Fl 40 Gl 6 H-5+H-8 23.95+10 39 Dl 0.4 El-1 8 Fl 19 Gl 6 H-5+H-8 42+24.6 40 Dl 0.4 El-1 30 F-3 30.6 Gl 6 H-4 33 41 Dl 0.4 El-1 15 Fl 50 Gl 8 Hl 26.6 42 Dl 0.4 El-l 20 Fl 35 Gl 3 Hl 41.6 43 Dl 3 El-1 30 Fl 40 Gl 9 Hl 18 [Table 3] Example Viscosity (mPa*s) Sensitivity (mJ/cm2) Contact angle (degrees) Deviation of contact angle σ 1 16 441 84 1.2 2 16 441 82 2.9 3 16 441 82 4.6 4 16 441 81 2.8 5 16 441 85 2.1 6 16 441 85 1.7 7 16 441 87 2.1 8 16 441 85 4.4 9 16 441 78 2.7 10 16 441 90 2.3 11 16 441 77 2.1 12 16 441 85 2.5 13 16 441 86 0.8 14 16 441 87 3.1 15 16 441 82 4.6 16 16 441 75 1.6 17 12 441 84 1.3 18 10 441 84 1.4 19 16 441 83 1.2 20 16 441 84 1.1 21 56 441 86 1.3 22 85 441 88 1.3 23 14 441 88 1.4 24 35 441 89 1.2 25 23 441 87 1.3 26 54 441 84 1.3 27 25 441 86 1.4 28 22 441 83 1.2 29 33 441 84 1.3 30 29 441 85 1.3 31 41 441 86 1.5 32 78 441 84 1.4 33 16 441 71 5.2 34 16 441 75 3.0 35 16 441 75 4.1 36 16 441 79 2.9 47 201207034
[例 44] 於25°C下,將例1之光硬化性組成物滴丨滴到矽晶圓表 面,得到均勻地塗布有該組成物之矽晶圓。將表面具有寬: 800nm、高:180nm、長:10_之凸部的石英製模具按壓 至石夕晶圓上之光硬化性組成物,並以此狀態直接以 0.5MPa(計示壓)加壓。 接著,於25°C下,從模具側對光硬化性組成物照射來 自高壓水銀燈(在I.5〜2.0kHz中,於255、315、及祕⑽具 有主波長的光源)的光15秒鐘’得到光硬化性組成物之硬化 物。於饥下’將模具自石夕晶圓分離,得到石夕晶圓之表面 形成有硬化物的成職,該硬化物係於其表面具有模具之 凸部翻轉後的凹部者。該凹部之深度為178〜18〇咖。 接著’將該成形體作為光罩,利用SAMC〇社製之乾式 姓刻裝置’並使用他㈣之卬與他㈣之氧的混合氣 體’於5Pa、7GW之條件下,進行乾式刻1卿鐘。可於 矽上刻寬:805nm、深:3〇nm、長:⑴哗之圖案。 [例 45] 、於25C下,將例3〇之光硬化性組成物滴丨滴到pET薄膜 (東洋、雜製’商品名:c〇sm〇sh_倾⑼)之易接著側 、表面㈣均勻地塗布有該組成物之ρΕτ薄膜。將表面具 48 201207034 - 有寬:800nm、高:180nm、長:1〇_之凸部的石英製模 具按壓至Ρ Ε Τ薄膜上之光硬化性組成物,並以此狀態直接以 0.5MPa(計示壓)加壓。 接著,於25°C下,從模具側對光硬化性組成物照射來 自高壓水銀燈(在1.5〜2.0kHz中,於255、315、及365nm具 有主波長的光源)的光15秒鐘,得到光硬化性組成物之硬化 物。於25°C下,將模具自PET薄膜分離,得到PET薄膜之表 面形成有硬化物的成形體,該硬化物係於其表面具有模具 之凸部翻轉後的凹部者。該凹部之深度為178〜18〇nm。 接著’將該成形體作為奈米壓印用之複製模具使用。 具體而言’將例1之光硬化性組成物滴1滴到PET薄膜(東洋 紡社製,商品名:COSMOSHINE A4100)之易接著側的表 面,得到均勻地塗布有該組成物之PET薄膜。將複製模具按 — 壓至PET薄膜上之光硬化性組成物,一面於25。(:下施加 5MPa之壓力,一面從複製模具側對光硬化性組成物照射來 自高壓水銀燈(在I·5〜2_〇kHz中,於255、315、及365nm具 有主波長的光源)的光15秒鐘,得到例1之光硬化性組成物 的硬化物。於25°C下,將複製模具自pet薄膜分離,得到 PET薄膜之表面形成有硬化物的成形體,該硬化物係於其表 面具有複製模具之凹部翻轉後的凸部者。該凸部之高度為 175〜177nm 。 [例 46] 於25°C下,將例30之光硬化性組成物滴1滴到PET薄膜 (東洋紡社製,商品名:COSMOSHINE A4100)之易接著側 49 201207034 的表面,得到均勻地塗布有該組成物之PET薄膜。將表面具 有寬:800nm、高:180nm、長:ΙΟμπι之凸部的石英製模 具按壓至PET薄膜上之光硬化性組成物,並以此狀態直接以 〇-5MPa(計示壓)加壓。 接著,於25°C下,從模具側對光硬化性組成物照射來 自高壓水銀燈(在1.5〜2.0kHz中,於255、315、及365πιη具 有主波長的光源)的光15秒鐘,得到光硬化性組成物之硬化 物。於25 C下,將模具自PET薄膜分離,得到pet薄膜之表 面形成有硬化物的成形體,該硬化物係於其表面具有模具 凸。卩翻轉後的凹部者。該凹部之深度為178〜18〇加^。 體而,著/將錢形體作為銻電鑄狀複製模具使用。具 社製)中鱗複製模具浸潰於無電解鍍齡液(高純度化學 、式’於表面設有鎳層。接著,將附有錦層之複製模具 於錦1:解電鍍職m夜巾流通電流進行錄電 附有鮮=為約2°一之膜厚時,停止電鑛作業,將 與複製模ΐ 鎳電解電财液取出,剝離鎳模具 件之錦模具之凸部的高度為178〜18。細。 皮菜上之可利用性 體,之製造方法所得之表面具有微細圖案之成形 體作為光學元件、防反射構件 紀錄媒砰王物日日片、微反應|§、 系體、觸媒載體、半導體裝 之複M 衣置1造用之光阻、壓印用 ^具、料狀複製模具等是有用的。 另外,在此沿用2009年2月5日申請的日本專利申請案 50 201207034 - 2009-025083號的專利說明書、申請專利範圍、圖式及發明 摘要的所有内容,作為本發明之專利說明書的揭示,納入 本發明。 I:圖式簡單說明3 第1圖係顯示表面具有微細圖案之成形體之製造方法 之一例的截面圖。 第2圖係顯示表面具有微細圖案之成形體之製造方法 之其他例的截面圖。 第3圖係顯示表面具有微細圖案之成形體之一例的截 面圖。 第4圖係顯示表面具有微細圖案之成形體之其他例的 截面圖。 ' 【主要元件符號說明】 • 1〇…模具 40...成形體 12.··翻轉圖案 42...硬化物 20.. .光硬化性組成物 44…微細圖案 30.. .基板 51[Example 44] The photocurable composition of Example 1 was dropped onto the surface of a tantalum wafer at 25 ° C to obtain a tantalum wafer uniformly coated with the composition. A quartz mold having a surface having a width of 800 nm, a height of 180 nm, and a length of 10 mm is pressed against a photocurable composition on a Shi Xi wafer, and is directly added at 0.5 MPa (measured pressure) in this state. Pressure. Next, the photocurable composition was irradiated with light from a high pressure mercury lamp (a light source having a dominant wavelength of 255, 315, and secret (10) at 1.5 to 2.0 kHz) from the mold side at 25 ° C for 15 seconds. 'A cured product of a photocurable composition is obtained. In the hunger, the mold was separated from the Shixi wafer, and the surface of the Shixi wafer was formed to form a cured product. The cured product was attached to the concave portion of the surface of the mold with the convex portion of the mold turned over. The depth of the recess is 178~18 〇. Then, 'the molded body is used as a photomask, and the dry type engraving device manufactured by SAMC Co., Ltd.' is used, and the mixed gas of the oxygen (4) and the oxygen of the (4) is used at 5 Pa, 7 GW to perform dry engraving. . It can be engraved on the :: 805nm, deep: 3〇nm, long: (1) 哗 pattern. [Example 45], at 25 C, the photocurable composition of Example 3 was dropped onto the pET film (Toyo, Miscellaneous 'trade name: c〇sm〇sh_dip (9)), the easy side, surface (4) The ρΕτ film of the composition was uniformly applied. A surface mold having a surface of 48 201207034 - a quartz mold having a width of 800 nm, a height of 180 nm, and a length of 1 〇 is pressed against the photocurable composition on the Ρ Ε film, and is directly 0.5 MPa in this state (in this state). The gauge pressure is pressurized. Next, the photocurable composition was irradiated with light from a high pressure mercury lamp (a light source having a dominant wavelength at 255, 315, and 365 nm at 1.5 to 2.0 kHz) from the mold side at 25 ° C for 15 seconds to obtain light. A hardened substance of a hardening composition. The mold was separated from the PET film at 25 ° C to obtain a molded body having a cured product formed on the surface of the PET film, which had a concave portion on the surface of which the convex portion of the mold was inverted. The depth of the recess is 178 to 18 〇 nm. Next, the molded body was used as a replica mold for nanoimprinting. Specifically, 1 of the photocurable composition of Example 1 was dropped on the surface of the PET film (trade name: COSMOSHINE A4100, manufactured by Toyobo Co., Ltd.), and a PET film uniformly coated with the composition was obtained. The replica mold was pressed to the photocurable composition on the PET film, one side at 25. (: A light having a pressure of 5 MPa is applied, and the photocurable composition is irradiated with light from a high-pressure mercury lamp (a light source having a dominant wavelength at 255, 315, and 365 nm in I·5 to 2 〇 kHz) from the replica mold side. After 15 seconds, a cured product of the photocurable composition of Example 1 was obtained. The replica mold was separated from the pet film at 25 ° C to obtain a molded body having a cured product formed on the surface of the PET film, and the cured product was attached thereto. The surface has a convex portion in which the concave portion of the replica mold is inverted. The height of the convex portion is 175 to 177 nm. [Example 46] A photocurable composition of Example 30 is dropped onto a PET film at 25 ° C (Toyo Spinning Co., Ltd.) Co., Ltd., trade name: COSMOSHINE A4100) The surface of the easy-to-contact side 49 201207034, a PET film uniformly coated with the composition was obtained. The surface was made of quartz having a width of 800 nm, a height of 180 nm, and a length of ΙΟμπι. The mold is pressed against the photocurable composition on the PET film, and is directly pressurized at 〇-5 MPa (measured pressure) in this state. Next, the photocurable composition is irradiated from the mold side at a temperature of 25 ° C from a high pressure. Mercury lamp (in 1.5~2.0kHz, at 255 , 315, and 365πιη light having a dominant wavelength of light source for 15 seconds to obtain a cured product of the photocurable composition. At 25 C, the mold is separated from the PET film to form a cured film having a surface formed with a cured product. The hardened body has a mold convex surface on the surface thereof, and the recessed portion is turned over. The depth of the concave portion is 178 to 18 〇 plus, and the money body is used as a enamel electroformed replica mold. Co., Ltd.) The medium scale replica mold is impregnated in the electroless plating solution (high-purity chemistry, the formula 'with a nickel layer on the surface. Next, the copying mold with the brocade layer attached to the brocade 1: deplating m night towel circulation When the current is recorded with a fresh film thickness of about 2°, the electric ore operation is stopped, and the copying of the nickel electrolysis liquid is taken out, and the height of the convex portion of the gold mold which is peeled off from the nickel mold is 178~ 18. Fine. Applicable body on the skin, the molded body obtained by the manufacturing method has a fine pattern as an optical element, an antireflection member, a recording medium, a Japanese film, a microreaction|§, a system, a touch Media carrier, semiconductor package, complex M clothing, 1 It is useful to use a mold, a embossing tool, a material copying mold, etc. In addition, the patent specification, patent application scope, and drawing of Japanese Patent Application No. 50 201207034 - 2009-025083, filed on Feb. 5, 2009. The entire disclosure of the invention and the summary of the invention is incorporated in the specification of the present invention. I: BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view showing an example of a method of producing a molded body having a fine pattern on its surface. 2 is a cross-sectional view showing another example of a method of producing a molded body having a fine pattern on its surface. Fig. 3 is a cross-sectional view showing an example of a molded body having a fine pattern on its surface. Fig. 4 is a cross-sectional view showing another example of a molded body having a fine pattern on its surface. ' [Main component symbol description] • 1〇...Mold 40...Formed body 12.··Flip pattern 42...cured material 20.. Photocurable composition 44...fine pattern 30.. .substrate 51