201206279 六、發明說明： 【發明所屬之技術領域】 本發明係關於為一種面板，特別是關於一種整合近接感應單元之面板 裝置。 【先前技術】 隨著光電科技的發展，近接切換裝置已被大量運用在不同的機器上， 例如：智慧性手機、運輸工具之購票系統、數位照像機、遙控器與液晶螢 _ 幕等。常見的近接切換裝置(Proximity Device)包括如近接感測器(pr0Xjmjty sensor)與觸摸面板(touch pane|)等，主要用以切換系統狀態。近接感測器 之運作方式為·當一物體靠近感測器之感應範圍内，近接感測器在觸及該 物體或不觸及物體的狀況下，經由近接感應之方式得知該物體所在之位 置，近接感測器將感應所得之信號轉變為一電子訊號，系統或機器會依據 該電子訊號做出適當的反應，達成控制系統狀態之目的。 近接感測器又稱近接開關(Proximity switch)，應用在許多液晶電視、 • 電源開關、家電開關、門禁系統、手持式遙控器與手機等，近年來，更是 這些裝置與設備不可或缺的角色之一。它負責偵測物體是否靠近，以便讓 控制器了解目前物體所在之位置。以家電應用來說，近接感測器被大量用 在燈源的控制上，只要靠近近接感測器或碰觸近接感測器，依據感測訊號 燈源就可進行開或關之動作。而近接感測器之種類及外型琳琅滿目，係為 長方型、四方型、圓柱型、圓孔型、溝型、多點型等。依其原理可分成以 下4種類型：電感式、電容式、光電式與磁氣式。 請參考第1圖，其為一般整合近接感應單元之面板裝置1〇()功能方塊 201206279 圖，其包括.物件10、近接感應單元101、感測電路105與微控制器1〇6 〇 當物件10靠近接感應單元101時’近接感應單元1〇1所感應之電容量會 隨著物件之距離而產生變動，此時，由振盪器1〇2產生之振盪頻率/波幅之 大小會依據物件之距離而改變並產生一振盪訊號。而檢波電路1〇3轉換振 盪訊號為固定直流電壓並傳送至輸出電路1〇4，輸出電路1〇4用以接受固 定直流電壓並增強驅動力為輸出訊號，並傳送至微控制器1〇6或受控之負 載端。 現今各式各樣的顯示面板已經大幅地應用於不同之裝置，為了實現觸 控面板互動式之概念，先前技術於面板之周邊增設一具近接感應功能之面 板’包括：電路板(PCB)、近接感應單元、感測電路與微控制器。如第2圖 所示者，其為先前技術整合近接感應單元之面板上視圖，其包括：面板13〇、 電路板(PCB)140與微控制器1〇6。其中，近接感應單元141形成於電路板 140上’並且’感測電路1〇5(未劃出)亦直接製作於電路板14〇上。電路板 140與微控制器106則藉由外部繞線之線路142形成電連接。 此種先前技術之作法，須於面板之外部另增設至少一個電路板(PCB)， 並將個別之近接感應單元放置於個別之電路板(PCB)之上，且須透過外部繞 線的方式將近接感應單元與感測電路的部分連接到微控制器。此種作法將 使得成本變高’且增加系統繞線之複雜度而使得系統難於整合。因此，在 面板的應用上’如何使得近接感應單元製作於面板上的成本能夠降低並簡 化系統繞線之複雜度，成為未來互.動式面板開發的重要議題。 【發明内容】 本發明係提出一種整合近接感應單元之面板裝置，包含基板與至少一 201206279 個電路板。其中’基板設置有一組線路於周邊，該組線路具有複數個連接 點。電路板藉由該組線路之連接點而固著於基板，每個電路板包含至少一 個近接感應單元’用以偵測一物件之靠近而產生一感應訊號。 為讓本發明之上述和其他目的、特徵、和優點能更明顯易懂，下文特 舉數個較佳實施例，並配合所附圖式，作詳細說明如下： 【實施方式】 本發明藉由於整合近接感應單元之面板裝置當中的基板上預先形成一 φ 組線路，進而讓製作好近接感應單元的電路板可結合並固著於基板，例如， 基板的側邊，進而可讓整合近接感應單元之面板裝置生產與容易，可避免 掉先前技術須另外進行電路板空間的安排，且須解決電路板繞線的問題。 凊參考第3圖，其為本發明之整合近接感應單元之面板裝置之一實施 例之上視結構圖。本實施例係以電路板裝置於基板的左下側邊與右下側邊 的實施例，裝置於基板的其他位置之實施例的原理皆相同，於此不多加贅 述。並且，裝置於基板的其他位置各有不同的優缺點，端視產品的實際應 φ 用而定。 例如，電路板裝置於基板之側邊，且近接感應單元背向基板之側邊， 即可於物件接近基板側邊時產生感應訊號。又例如，電路板裝置於基板之 側邊’且近接感應單元面向基板之出平面方向，即可於物件接近基板之出 平面方向時產生感應訊號。又例如，電路板裝置於基板之側邊且裝置於基 板的下方，且近接感應單元背向基板之側邊，即可於物件接近基板側邊且 下方時產生感應訊號；當物件接近基板的出平面方向或者側邊的上方，不 會有感應訊號。此外’亦可將電路板設置於基板的正面，直接黏著於基板 201206279 上，或者基板的背面等等，均可達嚼定的效果。 本發明之整合近接感應單元之面板裝置2QQ包含有：基板13〇、軟板 161、軟板162、軟板163、電路板181、電路板182與微控制單元15〇。 其中，基板130包含-組線路171、172，線路171、172具有複數個連接 點173、174、175而可分別與軟板16彳、軟板162、軟板163連接。軟板 161連接了電路板181與線路171。軟板162連接了電路板182與線路 172。軟板163連接了線路17彳、線路172與微控制單元15〇，使得電路板 181、電路板182與微控制單元15〇形成導通^電路板181與電路板彳拟， 分別包含至少一個近接感應單元141，每個近接感應單元141均用以感應 物件之靠近而產生感應訊號，而電路板181、182則分別藉由線路171、172 的連接點173、174經由軟板161、162固著於基板130。微控制單元150 經由線路171、172的連接點175經由軟板163固著於基板130，並且與 電路板181、182形成導通而控制近接感應單元141。 此外’感測電路可以設計在電路板181、182，或者，設計在微控制單 元150。感測電路連接近接感應單元141以接收感應訊號而產生控制訊號， 而後傳輸到微控制單元150.»此外，電路板181、182可採用以可撓基材製 作之電路板或硬式電路板。 接著，請參考第5圖，本發明之整合近接感應單元之面板裝置4〇〇包 含有：基板130、軟板163、電路板181、電路板182與微控制單元150。 此實施例係將電路板181、182直接黏著於基板130上的連接點173、174。 其中，基板130包含一組線路171、172，線路171、172具有複數個連接 點173、174、175而可分別與電路板181、電路板182、軟板163連接。 201206279 軟板163連接了線路171、線路172與微控制單元150，使得電路板181、 電路板182與微控制單元150形成導通。電路板181與電路板182，分別 包含至少一個近接感應單元141，每個近接感應單元141均用以感應物件 之靠近而產生感應訊號，而電路板181、182則分別藉由線路171、172的 連接點173、174經由軟板161、162固著於基板130 〇微控制單元150經 由線路171、172的連接點175經由軟板163固著於基板130，並且與電 路板181、182形成導通而控制近接感應單元141。 泰 第3圖與第4圖的實施例僅為本發明所列舉的實施例，其他的不同實 施例的原理皆相同，在此不多加贅述。 接著，請參考第5圖，其為本發明第3圖實施例之一實施例剖面圖， 其說明了將電路板181、182藉由軟板161、162而固著於基板130側邊的 實施例。藉由將電路板181、182以軟板161、162黏著於基板130上的連 接點(未畫出）而固著於基板13〇側邊，可讓電路板181、182所增加的面積 減少而可降低整體產品的設計複雜度，並且，可形成感應側邊的物件近接， • 適合特定的應用。此外，雙面膠191、192則可讓軟板161、162固定於基 板130側邊》 第5圖係為電路板181、182當中的近接感應單元141設計於背向基 板130侧邊，其可應用於物件接近基板13〇側邊時產生感應訊號。而物件 接近基板出平面方向(Ζ轴)時，則不會發生感應。 第6圖則為本發明第3圖實施例之另一實施例剖面圖，其說明了將電 路板181、182藉由軟板161'162而固著於基板13〇側邊的實施例，且近 接感應單元141係面對基板彳3〇的出平面方向(2軸）。藉由將電路板181、 201206279 182以軟板161、162 著於基板130上的連接點(未畫出）而固著於基板 130側邊。此應用為感應側邊物件的出平面方向近接，適合特定的應用。 第7圖則為本發明第4圖實施例之一實施例剖面圖，其說明了將電路 板181、182 i接黏著於連接點(未畫出)而直接固著於基板13〇正面的實施 例，且近接感應單元141係面對基板13㈣出平面方向(乙轴)。此應用與第 6圖相同，可感應側邊物件的出平面方向近接，適合特定的應用。 其中，近接感應單元141係為以下之任意組合：電容式近接感應單元、 電感式近接感應單元、光電式近接感應單元與磁氣式近接感應單元。亦即， 在實做上，可以採取一種近接感應單元製作在面板上，或者，採取多種近 接感應單元製作在面板上。 電容式近接感應單元係利用該物件之距離遠近而改變感應訊號之大 小，其中，感應訊號之大小係為電容量之變化。感測電路内之振遭電路依 據電容量之變化而改變振盪頻率/振幅之大小，並依據此振盪頻率/振幅之大 小產生控制訊號而輸出至微控制器。 電感式近接感應單元係利用物件之距離而改變感應訊號之大小，其 中，感應訊號之大小係為電感量之變化。感測電路内之振盪電路係藉由電 感量之變化而改變振盪頻率/振幅之大小，並依據此振盪頻率/振幅之大小產 生控制訊號而輸出至微控制器。 其中電容式與電感式之近接感應單元之形狀可選自：圓形、方形、橢 圓形、星形、心形、螺旋形、空心狀或任意形狀。 光電式近接感應單元包含：光發射器與光接收器，其運作之原理係利 用光發射器發射一光源，該光源係為紅外線。光電式近接感應單元接收藉 201206279 由物體表面反射回來之光量強度並產生近一光源訊號，且感測電路係依據 光源訊號之光量強度來產生電子訊號並輸出至微控制器。 磁氣式近接感應單元係為磁性感應元件，其運作之原理係利用外部之 磁性物件靠磁氣式近接感應單元，磁氣式近接感應單元之磁性感應元件是 由二片鐵性簧片所形成之接點。當磁性物件接近時，磁氣式近接感應單元 之鐵性簧片感應大量之磁性，而使得接點因此而導通。感測電路依據該接 點來產生電子訊號並輸出至微控制器。 • 其中’整合近接感應單元之面板裝置之基板130係選自：投射電容式 觸控面板之基板、表面電容式觸控面板之基板、電阻式觸控面板之基板、 超音波觸控面板之基板、紅外線觸控面板之基板、有機發光二極體面板 (OLED)之基板、液晶面板之基板、彩色濾光片基板、電子紙之基板、玻璃 基板、塑膠基板(PET)基板與壓克力基板。 雖然本發明之較佳實施例揭露如上所述，然其並非用以限定本發明， 任何熟習相關技藝者’在不脫離本發明之精神和範圍内’當可作些許之更 φ 動與潤飾，因此本發明之專利保護範圍須視本說明書所附之申請專利範圍 所界定者為準。 【圖式簡單說明】 第1圖係為先前技術之整合近接感應單元之面板裝置功能方塊圖(先前 技術）； 第2圖係為先前技術之整合近接感應單元之面板裝置之上視結構圖(先 前技術）； 第3圖係為本發明之整合近接感應單元之面板裝置之一實施例之上視 201206279 結構圖； 第4圖係為本發明第3圖實施例之剖面圖； 第5圖係為本發明第3圖實施例之一實施例剖面圖； 第6圖則為本發明第3圖實施例之另一實施例刮面圖；及 第7圖則為本發明第4圖實施例之一實施例剖面圖。 【主要元件符號說明】 10 物件 100、200、300、400 整合近接感應單元之面板裝置 101 近接感應單元 102 振盪電路 103 檢波電路 104 輸出電路 105 感測電路 106 微控制器 130 面板 140 電路板 141 近接感應單元 142 線路 150 微控制單元 161、162、163 軟板 171 ' 172 線路 連接點 173、174、175 201206279 181 191 182 192 電路板 雙面膠201206279 VI. Description of the Invention: [Technical Field] The present invention relates to a panel, and more particularly to a panel device incorporating a proximity sensing unit. [Prior Art] With the development of optoelectronic technology, the proximity switching device has been widely used in different machines, such as: smart phones, transportation ticket purchasing systems, digital cameras, remote controls, LCD screens, etc. . Common Proximity Devices include, for example, a proximity sensor and a touch panel, and are mainly used to switch system states. The proximity sensor operates in the sense that when an object approaches the sensing range of the sensor, the proximity sensor detects the location of the object by proximity sensing when the object is touched or not touched. The proximity sensor converts the induced signal into an electronic signal, and the system or machine responds appropriately according to the electronic signal to achieve the purpose of controlling the state of the system. Proximity sensors, also known as Proximity switches, are used in many LCD TVs, power switches, home appliance switches, access control systems, handheld remote controls and mobile phones. In recent years, these devices and devices are indispensable. One of the roles. It is responsible for detecting the proximity of an object so that the controller knows where the current object is. In the case of home appliance applications, the proximity sensor is used in a large number of sources to control the light source. As long as it is close to the proximity sensor or touches the proximity sensor, the light source can be turned on or off according to the sensing signal source. The types and appearances of proximity sensors are numerous, such as rectangular, square, cylindrical, round, groove, and multi-point. According to its principle, it can be divided into the following four types: inductive, capacitive, photoelectric and magnetic. Please refer to FIG. 1 , which is a panel device 1 〇 () function block 201206279 diagram of a general integrated proximity sensing unit, which includes an object 10 , a proximity sensing unit 101 , a sensing circuit 105 and a microcontroller 1 〇 6 物 物 物 物 物When the proximity sensing unit 101 is close to the sensing unit 101, the capacitance induced by the proximity sensing unit 1〇1 varies with the distance of the object. At this time, the magnitude of the oscillation frequency/amplitude generated by the oscillator 1〇2 depends on the object. The distance changes and produces an oscillating signal. The detection circuit 1〇3 converts the oscillation signal to a fixed DC voltage and transmits it to the output circuit 1〇4, and the output circuit 1〇4 receives the fixed DC voltage and enhances the driving force as an output signal, and transmits it to the microcontroller 1〇6. Or controlled load side. Nowadays, various display panels have been widely applied to different devices. In order to realize the interactive concept of the touch panel, the prior art adds a proximity sensing function panel around the panel, including: a circuit board (PCB), Proximity to the sensing unit, sensing circuit and microcontroller. As shown in FIG. 2, it is a top view of a prior art integrated proximity sensing unit comprising: a panel 13A, a circuit board (PCB) 140 and a microcontroller 110. The proximity sensing unit 141 is formed on the circuit board 140' and the sensing circuit 1〇5 (not drawn) is also directly fabricated on the circuit board 14A. The circuit board 140 and the microcontroller 106 are electrically connected by an externally wound line 142. In the prior art, at least one circuit board (PCB) must be added outside the panel, and the individual proximity sensing units are placed on a separate circuit board (PCB) and must be externally wound. A portion of the proximity sensing unit and the sensing circuit is coupled to the microcontroller. This approach will make the cost higher' and increase the complexity of the system winding, making the system difficult to integrate. Therefore, in the application of the panel, how to make the cost of the proximity sensing unit on the panel can be reduced and the complexity of the system winding is simplified, which becomes an important issue in the development of the interactive panel in the future. SUMMARY OF THE INVENTION The present invention provides a panel device that integrates a proximity sensing unit, including a substrate and at least one 201206279 circuit board. Wherein the substrate is provided with a set of lines at the periphery, the set of lines having a plurality of connection points. The circuit board is fixed to the substrate by the connection point of the set of lines, and each of the circuit boards includes at least one proximity sensing unit </ RTI> for detecting an proximity of an object to generate an inductive signal. The above and other objects, features, and advantages of the present invention will become more apparent and understood. A φ group circuit is pre-formed on the substrate in the panel device integrating the proximity sensing unit, so that the circuit board on which the proximity sensing unit is fabricated can be combined and fixed on the substrate, for example, the side of the substrate, thereby allowing the integrated proximity sensing unit The panel device is easy to manufacture, avoiding the need for additional board space arrangements in the prior art, and solving the problem of board winding. Referring to Fig. 3, there is shown a top plan view of an embodiment of a panel device incorporating a proximity sensing unit of the present invention. This embodiment is an embodiment in which the circuit board is disposed on the lower left side and the lower right side of the substrate, and the principle of the embodiment of the device at other positions of the substrate is the same, and will not be further described herein. Moreover, the device has different advantages and disadvantages at other positions of the substrate, depending on the actual use of the product. For example, the circuit board is disposed on the side of the substrate, and the proximity sensing unit faces away from the side of the substrate, so that an inductive signal is generated when the object approaches the side of the substrate. For example, the circuit board is disposed on the side of the substrate ′ and the proximity sensing unit faces the plane of the substrate, so that an inductive signal can be generated when the object approaches the plane of the substrate. For example, the circuit board is disposed on the side of the substrate and disposed under the substrate, and the proximity sensing unit faces away from the side of the substrate, so that an inductive signal can be generated when the object approaches the side of the substrate and below; when the object approaches the substrate There will be no sensing signal in the plane direction or above the sides. In addition, the circuit board can be placed on the front side of the substrate, directly adhered to the substrate 201206279, or the back side of the substrate, etc., to achieve a chewing effect. The panel device 2QQ of the integrated proximity sensor unit of the present invention comprises a substrate 13A, a flexible board 161, a flexible board 162, a flexible board 163, a circuit board 181, a circuit board 182, and a micro control unit 15A. The substrate 130 includes a set of lines 171 and 172. The lines 171 and 172 have a plurality of connection points 173, 174, and 175 and are connectable to the flexible board 16A, the flexible board 162, and the flexible board 163, respectively. The flexible board 161 is connected to the circuit board 181 and the line 171. The flexible board 162 is connected to the circuit board 182 and the line 172. The flexible board 163 is connected to the line 17A, the line 172 and the micro control unit 15A, so that the circuit board 181, the circuit board 182 and the micro control unit 15 are formed to be electrically connected to the circuit board 181 and the circuit board, respectively, and respectively comprise at least one proximity sensor. In the unit 141, each of the proximity sensing units 141 is configured to sense the proximity of the object to generate an inductive signal, and the circuit boards 181 and 182 are respectively fixed to the connecting points 173 and 174 of the lines 171 and 172 via the flexible boards 161 and 162, respectively. Substrate 130. The micro control unit 150 is fixed to the substrate 130 via the connection point 175 of the lines 171, 172 via the flexible board 163, and is electrically connected to the circuit boards 181, 182 to control the proximity sensing unit 141. Further, the sensing circuit can be designed on the circuit boards 181, 182 or, alternatively, in the micro control unit 150. The sensing circuit is connected to the proximity sensing unit 141 to receive the sensing signal to generate the control signal, and then transmitted to the micro control unit 150. In addition, the circuit boards 181, 182 can be made of a circuit board or a rigid circuit board made of a flexible substrate. Next, referring to FIG. 5, the panel device 4 incorporating the proximity sensing unit of the present invention includes a substrate 130, a flexible board 163, a circuit board 181, a circuit board 182, and a micro control unit 150. This embodiment bonds the circuit boards 181, 182 directly to the connection points 173, 174 on the substrate 130. The substrate 130 includes a set of lines 171 and 172. The lines 171 and 172 have a plurality of connection points 173, 174, and 175 and are connectable to the circuit board 181, the circuit board 182, and the flexible board 163, respectively. 201206279 The flexible board 163 is connected to the line 171, the line 172 and the micro control unit 150, so that the circuit board 181, the circuit board 182 and the micro control unit 150 are turned on. The circuit board 181 and the circuit board 182 respectively include at least one proximity sensing unit 141. Each of the proximity sensing units 141 is configured to sense the proximity of the object to generate an inductive signal, and the circuit boards 181 and 182 respectively pass the lines 171 and 172. The connection points 173, 174 are fixed to the substrate 130 via the flexible boards 161, 162. The micro control unit 150 is fixed to the substrate 130 via the connection point 175 of the lines 171, 172 via the flexible board 163, and is electrically connected to the circuit boards 181, 182. The proximity sensing unit 141 is controlled. The embodiments of Figures 3 and 4 are only the embodiments of the present invention, and the principles of the other different embodiments are the same, and will not be further described herein. Next, please refer to FIG. 5, which is a cross-sectional view showing an embodiment of the third embodiment of the present invention, illustrating the implementation of fixing the circuit boards 181 and 182 to the side of the substrate 130 by the flexible plates 161 and 162. example. By fixing the circuit boards 181 and 182 to the side of the substrate 13 by bonding the flexible plates 161 and 162 to the substrate 130 (not shown), the increased area of the circuit boards 181 and 182 can be reduced. It reduces the design complexity of the overall product and allows for the proximity of objects that sense the sides, • for specific applications. In addition, the double-sided tapes 191 and 192 can be used to fix the flexible plates 161 and 162 to the side of the substrate 130. The fifth proximity of the circuit boards 181 and 182 is designed to be adjacent to the side of the substrate 130. The sensing signal is generated when the object is close to the side of the substrate 13 . When the object is close to the plane of the substrate (the x-axis), no induction occurs. Figure 6 is a cross-sectional view showing another embodiment of the embodiment of Fig. 3 of the present invention, illustrating an embodiment in which the circuit boards 181, 182 are fixed to the side of the substrate 13 by the flexible board 161'162, and The proximity sensing unit 141 faces the exit plane direction (2-axis) of the substrate 彳3〇. The board 181, 201206279 182 is fixed to the side of the substrate 130 by a connection point (not shown) on which the flexible boards 161 and 162 are placed on the substrate 130. This application is designed to sense the out-of-plane orientation of the side objects for a specific application. Figure 7 is a cross-sectional view showing an embodiment of the fourth embodiment of the present invention, showing the implementation of attaching the circuit boards 181, 182 i to the connection point (not shown) and directly fixing the front surface of the substrate 13 For example, the proximity sensing unit 141 faces the plane direction (E-axis) of the substrate 13 (four). This application, like Figure 6, can sense the proximity of the side objects in the out-of-plane direction for a specific application. The proximity sensing unit 141 is any combination of the following: a capacitive proximity sensing unit, an inductive proximity sensing unit, a photoelectric proximity sensing unit, and a magnetic gas proximity sensing unit. That is to say, in practice, a proximity sensing unit can be used to make the panel, or a plurality of proximity sensing units can be used to make the panel. The capacitive proximity sensing unit changes the size of the sensing signal by using the distance of the object, wherein the magnitude of the sensing signal is a change in capacitance. The oscillation circuit in the sensing circuit changes the oscillation frequency/amplitude according to the change of the capacitance, and generates a control signal according to the oscillation frequency/amplitude to output to the microcontroller. Inductive proximity sensing units use the distance of the object to change the size of the sensing signal. The magnitude of the sensing signal is the change in inductance. The oscillating circuit in the sensing circuit changes the oscillating frequency/amplitude by changing the amount of inductance, and generates a control signal according to the oscillating frequency/amplitude to output to the microcontroller. The shape of the capacitive and inductive proximity sensing unit may be selected from the group consisting of: circular, square, elliptical, star, heart, spiral, hollow or any shape. The photoelectric proximity sensing unit comprises: a light emitter and a light receiver, the principle of operation of which is to emit a light source by using a light emitter, the light source being infrared light. The photoelectric proximity sensing unit receives the intensity of the light reflected from the surface of the object by 201206279 and generates a near-light source signal, and the sensing circuit generates an electronic signal according to the intensity of the light source signal and outputs the electronic signal to the microcontroller. The magnetic gas proximity sensing unit is a magnetic sensing element, and its operation principle is to use an external magnetic object to rely on a magnetic gas proximity sensing unit, and the magnetic induction element of the magnetic gas proximity sensing unit is formed by two iron reeds. The junction. When the magnetic object is close, the magnetic reed of the magnetic proximity sensor unit senses a large amount of magnetic force, so that the contact is thus turned on. The sensing circuit generates an electronic signal based on the contact and outputs the signal to the microcontroller. The substrate 130 of the panel device integrating the proximity sensing unit is selected from the group consisting of a substrate for projecting a capacitive touch panel, a substrate for a surface capacitive touch panel, a substrate for a resistive touch panel, and a substrate for an ultrasonic touch panel. Substrate of infrared touch panel, substrate of organic light emitting diode panel (OLED), substrate of liquid crystal panel, color filter substrate, substrate of electronic paper, glass substrate, plastic substrate (PET) substrate and acrylic substrate . While the preferred embodiment of the present invention has been described above, it is not intended to limit the invention, and the skilled artisan will be able to make some more modifications and refinements without departing from the spirit and scope of the invention. Therefore, the scope of patent protection of the present invention is defined by the scope of the claims appended hereto. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a functional block diagram of a prior art integrated proximity sensing unit panel device (prior art); FIG. 2 is a top structural view of a prior art integrated proximity sensing unit panel device ( 3 is a structural view of an embodiment of a panel device incorporating a proximity sensing unit of the present invention; FIG. 4 is a cross-sectional view of an embodiment of the third embodiment of the present invention; FIG. 6 is a cross-sectional view showing an embodiment of a third embodiment of the present invention; FIG. 6 is a plan view showing another embodiment of the third embodiment of the present invention; and FIG. 7 is a fourth embodiment of the present invention. A cross-sectional view of an embodiment. [Description of main component symbols] 10 Objects 100, 200, 300, 400 Panel device 101 integrated with proximity sensing unit Proximity sensing unit 102 Oscillation circuit 103 Detection circuit 104 Output circuit 105 Sensing circuit 106 Microcontroller 130 Panel 140 Circuit board 141 Proximity Sensing unit 142 Line 150 Micro control unit 161, 162, 163 Soft board 171 ' 172 Line connection point 173, 174, 175 201206279 181 191 182 192 Circuit board double-sided tape