201133066 六、發明說明： 【發明所屬之技術領域】 本發明係關於為一種面板，特別是關於一種近接感應面板。 【先前技術】 隨著光電科技的發展’近接切換裝置已被大量運用在不同的機器上， 例如.智慧性手機、運輸工具之購票系統、數位照像機、遙控器與液晶螢 幕等。常見的近距離控制裝置包括近接感測器(Pr〇xjmjty sens〇r)與觸摸面 板(touch panel)等，主要用以切換系統狀態。 請參考第1 K ’其為-般電感式近接感應系統1〇〇功能方塊圖，其包 括：物件10、近接感應單元101、感測電路1〇5與微控制器1〇6。當物件 1〇罪近接感應單元101時，近接感應單元1〇1所感應之電感量會隨著物件 之距離而產生變動’此時’由振盈器1〇2產生之振麵率/波幅之大小會依 據物件之距離而改變並產生—振盈訊號^而檢波電路1Q3轉換振魏號為 固疋直流電壓並傳送至輸出電路彳〇4，輸出電路彳〇4用以接受固定直流電 壓並增強驅動力騎出訊號’並傳送至微控制器1Q6或受控之負載端。 一般觸摸面板(t〇UCh呷阳丨）包括電阻式、表面電容式（Surface201133066 VI. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a panel, and more particularly to a proximity sensing panel. [Prior Art] With the development of optoelectronic technology, the proximity switching device has been widely used in different machines, such as smart phones, transportation ticket purchasing systems, digital cameras, remote controls and LCD screens. Common proximity control devices include proximity sensors (Pr〇xjmjty sens〇r) and touch panels, etc., which are mainly used to switch system status. Please refer to the 1K's functional block diagram of the inductive proximity sensor system, which includes an object 10, a proximity sensing unit 101, a sensing circuit 1〇5 and a microcontroller 1〇6. When the object 1 is close to the sensing unit 101, the inductance induced by the proximity sensing unit 1〇1 varies with the distance of the object 'this time' is the surface area/amplitude generated by the vibrator 1〇2. The size will change according to the distance of the object and generate the vibration signal ^ and the detection circuit 1Q3 converts the vibration signal to the fixed DC voltage and transmits it to the output circuit 彳〇4, and the output circuit 彳〇4 is used to receive the fixed DC voltage and enhance The driving force rides the signal 'and transmits it to the microcontroller 1Q6 or the controlled load side. The general touch panel (t〇UCh呷阳丨) includes resistive and surface capacitive (Surface)
Capacitive Touch Panel ’ SCT)、投射電容式(pr〇jected Capacitive TouchCapacitive Touch Panel ’ SCT), projected capacitive (pr〇jected Capacitive Touch)
Panel ’ PCT)'紅外線式、聲波式、光學式、電磁感應式與數位式等。請參 考第2圖，其為-般電阻式觸控面板11〇功能方塊圖，其包括：電阻式觸 控面板120、驅動電路122、感測電路124與微控制器126。電阻式之運 作方式為：當物體碰觸電阻式觸控面板12Q時，其電阻式觸控面板12〇會 201133066 依據碰觸之位置產生-類比龍準位並傳送至感測器124，經由感測器124 將此類比電鲜位轉變為-數位訊號至傳送至微控制器126，微控制器126 會依據該電子域做㈣當的反應，達雜織綠態之目的。接著，請 參考第3 @為-般電阻式糖面板之結翻，其包括1蓋層15〇、導電 薄膜152、隔離點154、導電玻璃156、基板158與液晶面板160。 以往的觸控面板都必需碰觸其面板，在某些小型的家電觸控面板上， 必須藉由碰觸這個動作才能操作人機晝面。為了增加互動性並減少碰觸面 板而使得產品不易損壞，實在有必要提出一個新的架構，能夠取代以往必 需碰觸其面板才·生動作，只需靠近其面板並_近接錢之動作操作 互動式之人機介面。 【發明内容】 本發明係提出一種近接感應面板，提出將近接感應單元形成於面板之 基板。此面板有別於之前之觸控面板，可無須觸碰於近接感面板中並產生 一感應訊號，同時，降低碰觸面板之次數而使得產品的使用期限延長。 本發明更提出一種近接感應面板，包括：基板、至少一個近接感應單 元與至少一個感測電路。近接感應單元形成於基板，近接感應單元感應物 件之靠近而產生所對應之一感應訊號。感測電路連接近接感應單元，用以 接收感應訊號而產生一控制訊號。 為讓本發明之上述和其他目的、特徵、和優點能更明顯易懂，下文特 舉數個較佳實施例，並配合所附圖式，作詳細說明如下： 【實施方式】 本發明提出一種近接感應面板’包含基板與至少一個近接感應單元。 201133066 藉由將近接感應單元直接形成於各種不同面板之基板中，使得所應用的基 板具有近接感應功能，並可遠距離地控制面板的人機介面，而達到更佳之 人機互動效果。同時，在不同的近接感應面板的情形下，可降低受環境影 響所干擾之成份。將此近接感應單元形成於面板中，可在不影響原面板製 作的流程上’並設法將近接感應單元的製作整合入面板的製作流程，如此， 即可大幅降低近接感應單元所需的成本。 請參考第4圖，其為本發明近接感應面板200之功能方塊圖，其中， φ 近接感應面板200包含：面板210、至少一個近接感應單元230與至少一 個感測電路240。至少一個近接感應單元230形成於基板，其可依據物件 1〇之靠近而產生所對應之近接感應訊號，且近接感應訊號之大小係依據物 件10之距離遠近來改變。感測電路240用以接收近接感應訊號而產生控制 訊號。微控制器250連接感測電路240，用以接收控制訊號並進行計算而 產生座標資訊(X，Y)。微控制器240可利用此座標資訊(χ,γ)進行手勢方向之 判斷，例如：物件由左至右、由右至左、由左斜至右斜、由右斜至左斜、 φ 由上至下、由下至上、兩物件放大、兩物件縮小等等。如此，即可實現使 用者與各種面板的互動手勢。 其中，近接感應單元230係為依據電感之變化產生感應訊號的一電感 式近接感應單元。亦即，而基板可以是：玻璃基板、塑膠基板或彩色滤光 片基板。 電感式近接感應單元係利用物件之距離而改變感應訊號之大小，其 中，感應訊號之大小係為電感量之變化。感測電路24〇内之振盈電路係藉 由電感量之變化崎變紐鮮/振社Α小，並麟此絲鮮/振幅之大 201133066 小產生控制訊號而輸出至微控制器250。 其中，近接感應單元230亦可為電容之變化產生感應訊號之一電容式 近接感應單元。亦即，該基板可以是：玻璃基板、塑膠基板或彩色濾光片 基板。 而電容式近接感應單元係利用該物件之距離遠近而改變感應訊號之大 小’其中，感應訊號之大小係為電容量之變化。感測電路240内之振盪電 路依據電容量之變化而改變振盪頻率/振幅之大小，並依據此振盪頻率/振幅 之大小產生控制訊號而輸出至微控制器250。其中，電容式近接感應單元 包含了自容式近接感應單元與互容式近接感應單元。自容式近接感應單元 係運用至少一電極進行驅動(Driving)與偵測(Sensing) 〇而互電容式近接感 應單元係運用至少兩電極的排列分別來進行驅動與偵測。 其中’近接感應面板之近接感應單元排列之方式係為矩形、菱形，或 是任意排列方式。 以下’第5圖、第6圖、第7圖與第8圖之實施例，將分別列舉四個 近接感應面板之排列近接感應單元之實施例。 接著，請參考第5圖，其說明近接感應面板之排列近接感應單元之第 —實施例上視圖，近接感應單元於近接感應面板中係採用矩形排列之設計。 接著，請參考第6圖，其說明近接感應面板之排列近接感應單元之第 二實施例上視圖，近接感應單元於近接感應面板中係採用交錯排列之設計。 接著’請參考第7圖，其說.明近接感應面板之排列近接感應單元之第 三實施例上視圖’近接感應單元於近接感應面板中係採用六角形排列之設 201133066 接著，請參考第8圖，其說明近接感應面板之排列近接感應單元之第 四實施例上視圖，近接感應單元於近接感應面板中係採用同心圓排列之設 計。 以下’第9圖列舉一個近接感應面板實施例剖面圖。其中，近接感應 面板212包括：覆蓋層220、近接感應單元222、基板224與液晶面板226。 由於基板224的表面為形成電極層，因此，近接感應單元14〇可形成於基 板224上表面或下表面。 其中，近接感應單元之形狀可選自：一圓形、一方形、一橢圓形、一 工形、一回形、一菱形、一螺旋形或任意形狀。 接著，第10圖與第11圖分別列舉二個近接感應單元形成於基板之實 訑例。其中，清參考第1Q圖，其說明近接感應單元之形狀係為螺旋形。其 中’請參考第11圖，其說明近接感應單元之形狀係為回形。 接著’請參考帛12目，其近賊應面板之電料面板之#—實施例圖。 其第12 _互容式之顧電路，其中，互容式近接感應單元至少包括兩個 電極，如第12圖所示者。而運用互容式近接感應單元23〇來進行物件近接 偵測的動作原理為：由驅動電路241驅動一信號於與其相連的第一電極， 第一電極會產生相應的互電容感應^當物件靠近近接感應單元時，近 接感應早元23G的電容量將受到擾動而改變，此時，偵測電路Μ?即可依 據與其所連接的第二電極勤!到電容的變化，並藉由電壓或電流的大小的 改變’進而得知近接感應單元23Q電容量變化。如此，即可計算物件接近 面板的相對距離。 其中’運用互容式近接感應單元，可達到反應速度較快，且穩定性較 201133066 高的功效。 雖然本發明之較佳實施例揭露如上所述，然其並非用以限定本發明， 任何熟習相關技藝者，在不脫離本發明之精神和範圍内，當可作些許之更 動與潤飾，因此本發明之專利保護範圍須視本說明書所附之申請專利範圍 所界定者為準。 【圖式簡單說明】 第1圖係為電感式近接感應系統功能方塊圖(先前技術）； 第2圖係為先前技術電阻式觸控面板之結構圖(先前技術）； 第3圖係為先前技術電阻式觸控面板之結構圖(先前技術）； 第4圖係為近接感應面板之系統功能方塊圖； 第5圖係為近接感應面板之排列近接感應單元之第一實施例上視圖； 第6圖係為近接感應面板之排列近接感應單元之第二實施例上視圖； 第7圖係為近接感應面板之排列近接感應單元之第三實施例上視圖； 第8圖係為近接感應面板之排列近接感應單元之第四實施例上視圖； 第9圖係為近接感應面板之剖面圖； 第10圖係為近接感應單元之形狀之第一實施例； 第11圖係為近接感應單元之形狀之第二實施例；及 第12圖係為近接感應面板之電容式面板之另一實施例圖。 【主要元件符號說明】 10 物件 100 電感式近接感應系統 101 近接感應單元 201133066Panel ’ PCT) 'Infrared, sonic, optical, electromagnetic induction and digital. Please refer to FIG. 2 , which is a functional block diagram of a general resistive touch panel 11 , which includes a resistive touch panel 120 , a driving circuit 122 , a sensing circuit 124 , and a microcontroller 126 . The operation mode of the resistive type is: when the object touches the resistive touch panel 12Q, the resistive touch panel 12〇201133066 generates an analog-like level according to the position of the touch and transmits it to the sensor 124. The detector 124 converts the analog-to-electricity bit into a digital signal to the microcontroller 126, and the microcontroller 126 performs the (4) reaction according to the electronic domain to achieve the purpose of the hybrid green state. Next, please refer to the junction of the 3rd-type resistive sugar panel, which includes a cap layer 15A, a conductive film 152, an isolation point 154, a conductive glass 156, a substrate 158, and a liquid crystal panel 160. In the past, touch panels had to touch the panel. On some small home appliance touch panels, it was necessary to touch the action to operate the human-machine surface. In order to increase the interactivity and reduce the touch panel, the product is not easy to be damaged. It is necessary to propose a new architecture, which can replace the previous action that must touch the panel, and only need to be close to its panel and interact with the action of the money. Human-machine interface. SUMMARY OF THE INVENTION The present invention provides a proximity sensing panel that proposes a substrate in which a proximity sensing unit is formed on a panel. This panel is different from the previous touch panel, and it does not need to touch the proximity sensor panel to generate a sensing signal. At the same time, the number of times the panel is touched is reduced, and the product life is extended. The invention further provides a proximity sensing panel comprising: a substrate, at least one proximity sensing unit and at least one sensing circuit. The proximity sensing unit is formed on the substrate, and the proximity sensing unit senses the proximity of the object to generate a corresponding one of the sensing signals. The sensing circuit is connected to the proximity sensing unit for receiving the sensing signal to generate a control signal. The above and other objects, features, and advantages of the present invention will become more apparent and understood. The proximity sensing panel 'includes a substrate and at least one proximity sensing unit. 201133066 By directly forming the proximity sensing unit in the substrates of different panels, the applied substrate has a proximity sensing function and can remotely control the human interface of the panel to achieve better human-computer interaction. At the same time, in the case of different proximity sensing panels, the components disturbed by environmental influences can be reduced. The proximity sensing unit is formed in the panel, and the process of making the proximity sensing unit can be integrated into the manufacturing process of the panel without affecting the process of the original panel manufacturing, so that the cost required for the proximity sensing unit can be greatly reduced. Please refer to FIG. 4 , which is a functional block diagram of the proximity sensing panel 200 of the present invention, wherein the φ proximity sensing panel 200 includes: a panel 210 , at least one proximity sensing unit 230 and at least one sensing circuit 240 . At least one proximity sensing unit 230 is formed on the substrate, and the corresponding proximity sensing signal is generated according to the proximity of the object 1〇, and the size of the proximity sensing signal is changed according to the distance of the object 10. The sensing circuit 240 is configured to receive a proximity sensing signal to generate a control signal. The microcontroller 250 is coupled to the sensing circuit 240 for receiving control signals and performing calculations to generate coordinate information (X, Y). The microcontroller 240 can use the coordinate information (χ, γ) to judge the gesture direction, for example, the object is left to right, right to left, left oblique to right oblique, right oblique to left oblique, φ Down to the bottom, up to the top, two objects to enlarge, two objects to shrink, and so on. In this way, the user can interact with various panels. The proximity sensing unit 230 is an inductive proximity sensing unit that generates an inductive signal according to a change in inductance. That is, the substrate may be a glass substrate, a plastic substrate or a color filter substrate. Inductive proximity sensing units use the distance of the object to change the size of the sensing signal. The magnitude of the sensing signal is the change in inductance. The oscillating circuit in the sensing circuit 24 is outputted to the microcontroller 250 by the change of the inductance, and the sinusoidal/sense is small. The proximity sensing unit 230 can also generate a capacitive proximity sensing unit for the change of the capacitance. That is, the substrate may be a glass substrate, a plastic substrate or a color filter substrate. The capacitive proximity sensing unit changes the size of the sensing signal by using the distance of the object. The magnitude of the sensing signal is a change in capacitance. The oscillating circuit in the sensing circuit 240 changes the oscillating frequency/amplitude according to the change of the capacitance, and generates a control signal according to the oscillating frequency/amplitude to output to the microcontroller 250. Among them, the capacitive proximity sensing unit includes a self-capacitance proximity sensing unit and a mutual capacitive proximity sensing unit. The self-capacitance proximity sensing unit uses at least one electrode for driving and sensing (Sensing), and the mutual capacitive proximity sensor unit uses at least two electrodes for driving and detecting. The arrangement of the proximity sensing units of the proximity sensing panel is rectangular, diamond-shaped, or arbitrarily arranged. In the following embodiments of Figs. 5, 6, 7, and 8, there will be respectively an embodiment in which four proximity sensing panels are arranged in proximity to the sensing unit. Next, please refer to FIG. 5, which illustrates a top view of the proximity sensing unit of the proximity sensing panel, and the proximity sensing unit adopts a rectangular arrangement in the proximity sensing panel. Next, please refer to FIG. 6 , which illustrates a top view of the second embodiment of the proximity sensing panel arranged in the proximity sensing unit, and the proximity sensing unit adopts a staggered design in the proximity sensing panel. Then, please refer to Fig. 7, which is a top view of the third embodiment of the proximity sensor panel. The proximity sensor unit is arranged in a hexagonal arrangement in the proximity sensor panel. Next, please refer to section 8. The figure illustrates a top view of a fourth embodiment of a proximity sensing panel arranged in proximity to the sensing unit, and the proximity sensing unit is designed in a concentric circular arrangement in the proximity sensing panel. The following Figure 9 illustrates a cross-sectional view of an embodiment of a proximity sensing panel. The proximity sensor panel 212 includes a cover layer 220, a proximity sensing unit 222, a substrate 224, and a liquid crystal panel 226. Since the surface of the substrate 224 is an electrode layer, the proximity sensing unit 14A can be formed on the upper surface or the lower surface of the substrate 224. The shape of the proximity sensing unit may be selected from the group consisting of: a circle, a square, an ellipse, a shape, a shape, a diamond, a spiral or any shape. Next, Fig. 10 and Fig. 11 respectively show an example in which two proximity sensing units are formed on a substrate. Here, reference is made to the 1Qth diagram, which illustrates that the shape of the proximity sensing unit is spiral. Here, please refer to Fig. 11, which shows that the shape of the proximity sensing unit is a shape. Then, please refer to 帛12 mesh, and the thief should be the panel of the electric panel of the panel. The 12th _ mutual capacitive circuit, wherein the mutual capacitive proximity sensing unit comprises at least two electrodes, as shown in FIG. The principle of using the mutual-capacity proximity sensing unit 23〇 to perform the object proximity detection is that the driving circuit 241 drives a signal to the first electrode connected thereto, and the first electrode generates a corresponding mutual capacitance sensing. When the proximity sensor unit is connected, the capacitance of the proximity sensor early 23G will be disturbed and changed. At this time, the detection circuit can be based on the change of the capacitance of the second electrode connected to it, and by voltage or current. The change in size 'further, the capacitance of the proximity sensing unit 23Q is changed. In this way, the relative distance of the object to the panel can be calculated. Among them, the use of the mutual-capacity proximity sensor unit can achieve a faster reaction speed and higher stability than 201133066. While the preferred embodiment of the present invention has been described above, it is not intended to limit the present invention, and it is intended that those skilled in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The patent protection scope of the invention is subject to the definition of the scope of the patent application attached to the specification. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a functional block diagram of an inductive proximity sensing system (prior art); Fig. 2 is a structural diagram of a prior art resistive touch panel (prior art); The structural diagram of the technical resistive touch panel (previous technique); the fourth figure is the system function block diagram of the proximity sensing panel; the fifth figure is the top view of the first embodiment of the proximity sensing panel arranged by the proximity sensing panel; 6 is a top view of a second embodiment of a proximity sensing unit arranged in a proximity sensing panel; FIG. 7 is a top view of a third embodiment of a proximity sensing unit arranged in proximity sensing panel; and FIG. 8 is a proximity sensing panel. FIG. 9 is a cross-sectional view of a proximity sensing panel; FIG. 10 is a first embodiment of a shape of a proximity sensing unit; and FIG. 11 is a shape of a proximity sensing unit The second embodiment; and the 12th figure are another embodiment of a capacitive panel of the proximity sensing panel. [Main component symbol description] 10 Objects 100 Inductive proximity sensing system 101 Proximity sensing unit 201133066
102 振盪電路 103 檢波電路 104 輸出電路 105 感測電路 106 微控制器 110 電阻式觸控系統 120 電阻式觸控面板 122 驅動器 124 感測器 126 微控制器 150 覆蓋層 152 導電薄膜 154 隔離點 156 導電玻璃 158 基板 160 液晶面板 200 近接感應面板系統 210 近接感應面板 212 近接感應面板 214 近接感應面板 216 近接感應面板 218 近接感應面板 201133066 220 覆蓋層 222 近接感應單元 224 基板 226 液晶面板 230 近接感應單元 240 感測電路 241 驅動電路 242 偵測電路 250 微控制器102 Oscillation circuit 103 Detection circuit 104 Output circuit 105 Sensing circuit 106 Microcontroller 110 Resistive touch system 120 Resistive touch panel 122 Driver 124 Sensor 126 Microcontroller 150 Cover layer 152 Conductive film 154 Isolation point 156 Conductive Glass 158 substrate 160 liquid crystal panel 200 proximity sensing panel system 210 proximity sensing panel 212 proximity sensing panel 214 proximity sensing panel 216 proximity sensing panel 218 proximity sensing panel 201133066 220 overlay 222 proximity sensing unit 224 substrate 226 liquid crystal panel 230 proximity sensing unit 240 sense Measuring circuit 241 driving circuit 242 detecting circuit 250 microcontroller