TWI544384B - Touch device - Google Patents
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- TWI544384B TWI544384B TW103144702A TW103144702A TWI544384B TW I544384 B TWI544384 B TW I544384B TW 103144702 A TW103144702 A TW 103144702A TW 103144702 A TW103144702 A TW 103144702A TW I544384 B TWI544384 B TW I544384B
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Description
本發明為一種觸控裝置,係指一種用於電子裝置中作為輸入單元用的觸控裝置。 The present invention relates to a touch device and refers to a touch device used as an input unit in an electronic device.
隨著電子產品的進步,許多更便於使用者操作的功能也相應產生,近接感應裝置即為其中一種。近接感應裝置設於觸控裝置中,用來感測物體接近觸控裝置與否,近接感應裝置將物體接近與否的近接感應訊號傳遞回控制單元後,再由控制單元依據該近接感應訊號決定所需進行的相對應指令,例如開關電子元件、執行特定指令等。以使用觸控面板之行動電話為例,為了讓避免當使用者接聽電話時,因人臉觸碰到面板而誤下指令,故該等行動電話係於適當位置設有近接感應裝置,來偵測人臉接近與否,若人臉接近時,控制單元接收到近接感應訊號而關閉觸控面板,以避免人臉誤觸。 With the advancement of electronic products, many functions that are more user-friendly are also produced, and a proximity sensing device is one of them. The proximity sensing device is disposed in the touch device for sensing whether the object is in proximity to the touch device, and the proximity sensing device transmits the proximity sensing signal of the object to the control unit, and then the control unit determines according to the proximity sensor signal. Corresponding instructions that need to be made, such as switching electronic components, executing specific instructions, and so on. Taking a mobile phone using a touch panel as an example, in order to prevent a user from accidentally giving a command when a user touches a panel when receiving a call, the mobile phone is provided with a proximity sensor device at an appropriate position to detect If the face is close or not, if the face is close, the control unit receives the proximity sensor and closes the touch panel to avoid the face being touched.
現有技術的近接感應裝置係主要為光學式,並將光學偵測器設於電子裝置的可視區之外,來偵測物體接近與否,設於可視區外係因可視區內均設置有感應層以供觸控操作。然而,設置光學偵測器會增加成本,使得電子裝置整體造價提高。另一種現有技術為採用電容式近接感應裝置,係於電容式觸控面板上設置近接感應電極來取代光學偵測器,無論該觸控面板將感應層鍍於基板(薄膜(film)或玻璃(glass))上。於設置電容式近接感應電極時,均係將電容式近接感應電極與感應層一併整合設置於基板上,如此一來,基板的設 置範圍勢必需擴大到可視區之外,其勢必得增加基板尺寸,無疑增加成本,且此時若變更設計而欲採用光學式偵測器,則由於設置光學偵測器之位置與近接感應電極之位置重疊,而必須要移除該近接感應電極,但無論基板選擇為薄膜或玻璃,一旦鍍上感應層與近接感應電極後,就不能單獨移除該近接感應電極,僅能更換整片基板,如此將耗費更多成本。 The proximity sensing device of the prior art is mainly optical, and the optical detector is disposed outside the visible area of the electronic device to detect the proximity of the object, and is disposed outside the visible area because the sensing area is provided with an induction. Layer for touch operation. However, setting an optical detector increases the cost and increases the overall cost of the electronic device. Another prior art method uses a capacitive proximity sensor device in which a proximity sensing electrode is disposed on the capacitive touch panel instead of the optical detector, and the touch panel is plated on the substrate (film or glass). Glass)). When the capacitive proximity sensing electrode is disposed, the capacitive proximity sensing electrode and the sensing layer are integrated on the substrate, so that the substrate is provided. The range must be extended beyond the visible area, which is bound to increase the size of the substrate, which will undoubtedly increase the cost. At this time, if the design is changed and the optical detector is to be used, the position of the optical detector and the proximity sensing electrode are set. The position overlaps, and the proximity sensing electrode must be removed. However, whether the substrate is selected as a film or glass, once the sensing layer and the proximity sensing electrode are plated, the proximity sensing electrode cannot be separately removed, and only the entire substrate can be replaced. This will cost more.
有鑑於此,本發明係針對近接感應電極單元之設置方式進行改良,以期減少成本耗損。 In view of this, the present invention is directed to improving the arrangement of the proximity sensing electrode unit in order to reduce cost loss.
為達到上述之發明目的,本發明所採用的技術手段為設計一種觸控裝置,係包括:一基板,具有一可視區;一感應層,係對應該可視區設於該基板之一第一側面;一載板,係設於該基板之第一側面且位於該可視區之外,該載板上設有一近接感應電極單元與一觸控積體電路元件,該感應層經由該載板與該觸控積體電路元件形成電連接,該近接感應電極單元與該觸控積體電路元件形成電連接,其中該觸控積體電路元件藉由該近接感應電極單元所產生的一近接感應訊號,以判斷是否有物件靠近該觸控裝置。 In order to achieve the above object, the technical means adopted by the present invention is to design a touch device comprising: a substrate having a visible area; and a sensing layer corresponding to the first side of the substrate a carrier board disposed on the first side of the substrate and located outside the visible area, the carrier board is provided with a proximity sensing electrode unit and a touch integrated circuit component, and the sensing layer is connected to the sensing layer The touch integrated circuit component is electrically connected to the touch integrated circuit component, wherein the touch integrated circuit component is coupled to the proximity sensing signal by the proximity sensing electrode unit. To determine whether an object is close to the touch device.
再者,本發明另設計了一種觸控裝置,係包括:一基板,包括一可視區與一非可視區;一感應層,包括有多個感應電極位於該可視區下方,用以感測物件在該可視區的觸摸;及一載板,位於該非可視區下方,包括一觸控積體電路元件經由該載板的多條導線與該多個感應電極電連接,該載板包括一近接感應電極單元電連接該觸 控積體電路元件,該觸控積體電路元件接收該近接感應電極單元所產生的一近接感應訊號,以判斷是否有物件靠近該觸控裝置。 Furthermore, the present invention further provides a touch device comprising: a substrate comprising a visible area and a non-visible area; and a sensing layer comprising a plurality of sensing electrodes under the visible area for sensing the object a touch in the visible area; and a carrier plate located below the non-visible area, including a touch integrated circuit component electrically connected to the plurality of sensing electrodes via a plurality of wires of the carrier, the carrier comprising a proximity sensor The electrode unit electrically connects the touch And controlling the integrated circuit component, the touch integrated circuit component receives a proximity sensing signal generated by the proximity sensing electrode unit to determine whether an object is close to the touch device.
本發明的優點在於,藉由將近接感應電極單元設於載板上,故近接感應電極單元的設置不影響感應層的設置,因此,感應層的範圍無需延伸出可視區外,而可降低設置感應層的成本,再者,由於近接感應電極單元與感應層為分開設置,故當欲變更近接感應電極單元之設置時,僅需更換載板即可,而無需重新設置感應層,進而節省製程及材料的浪費。 The invention has the advantages that the proximity sensing electrode unit is disposed on the carrier board, so the arrangement of the proximity sensing electrode unit does not affect the setting of the sensing layer, and therefore, the range of the sensing layer does not need to extend beyond the visible area, and the setting can be reduced. The cost of the sensing layer is further reduced. Since the proximity sensing electrode unit and the sensing layer are separately disposed, when the setting of the proximity sensing electrode unit is to be changed, only the carrier board needs to be replaced, and the sensing layer is not required to be reset, thereby saving the process. And the waste of materials.
10、10A、10B‧‧‧基板 10, 10A, 10B‧‧‧ substrate
11‧‧‧可視區 11‧‧‧visible area
12‧‧‧非可視區 12‧‧‧Invisible area
20、20A、20B‧‧‧感應層 20, 20A, 20B‧‧‧ sensing layer
21‧‧‧感應線 21‧‧‧Induction line
200A‧‧‧薄膜 200A‧‧‧ film
30‧‧‧載板 30‧‧‧ Carrier Board
31、31A‧‧‧近接感應電極單元 31, 31A‧‧‧ proximity sensing electrode unit
311‧‧‧驅動電極 311‧‧‧ drive electrode
312‧‧‧接收電極 312‧‧‧ receiving electrode
32、32A‧‧‧觸控積體電路元件 32, 32A‧‧‧ touch integrated circuit components
321‧‧‧掃描電路 321‧‧‧ Scanning circuit
3211‧‧‧驅動電路 3211‧‧‧Drive circuit
3212‧‧‧接收電路 3212‧‧‧ receiving circuit
3211A‧‧‧自容掃描電路 3211A‧‧‧ self-capacitor scanning circuit
3212A‧‧‧互容掃描電路 3212A‧‧‧ mutual capacitance scanning circuit
322、322A‧‧‧微處理器 322, 322A‧‧‧ microprocessor
33A‧‧‧第一開關 33A‧‧‧First switch
34A‧‧‧第二開關 34A‧‧‧Second switch
圖1為本發明之平面示意圖。 Figure 1 is a schematic plan view of the present invention.
圖2為本發明之部分元件電路方塊示意圖。 2 is a block diagram showing the circuit of some components of the present invention.
圖3為本發明之一實施例的側視剖面圖。 Figure 3 is a side cross-sectional view of one embodiment of the present invention.
圖4為本發明之另一實施例的側視剖面圖。 Figure 4 is a side cross-sectional view showing another embodiment of the present invention.
圖5為本發明之部分元件另一實施例之電路方塊示意圖。 Figure 5 is a block diagram showing another embodiment of a part of the components of the present invention.
以下配合圖式及本發明之實施例,進一步闡述本發明為達成預定發明目的所採取的技術手段。 The technical means adopted by the present invention for achieving the intended purpose of the invention are further explained below in conjunction with the drawings and the embodiments of the present invention.
請參閱圖1所示,本發明之觸控裝置包含有一基板10、一感應層20、及一載板30。 Referring to FIG. 1 , the touch device of the present invention comprises a substrate 10 , a sensing layer 20 , and a carrier 30 .
前述之基板10具有一可視區11及一非可視區12,可視區11係供一顯示單元對應設置,而讓使用者透過該可視區11可看到該顯示單元所呈現之畫 面,該非可視區12設於該可視區11之外,在一實施例中,該非可視區12環繞設置於該可視區11之週緣。該基板10可為玻璃基板。 The substrate 10 has a visible area 11 and a non-visible area 12. The visible area 11 is provided for a display unit, and the user can see the picture displayed by the display unit through the visible area 11. The non-visible area 12 is disposed outside the visible area 11. In an embodiment, the non-visible area 12 is disposed around the periphery of the visible area 11. The substrate 10 can be a glass substrate.
請參閱圖1及圖2所示,前述之感應層20設於該基板10之第一側面且對應於該可視區11,該感應層20係用以感測物件在該可視區11的觸碰事件,該感應層20包含有複數條縱橫交錯的感應線21,其中該感應線21可由複數感應電極所構成。在一實施例中,所述感應線21包含有複數條驅動感應線TX1~TXn以及複數條接收感應線RX1~RXm,所述驅動感應線TX1~TXn沿第一軸設置且相互呈平行排列,所述接收感應線RX1~RXm沿第二軸平行設置且相互呈平行排列。請參閱圖3所示,在一實施例中,該感應層20A成形於一薄膜200A之表面,該薄膜200A貼合於該基板10A之第一側面,且該感應層20A貼靠於該基板10A之第一側面;請參閱圖3所示,在另一實施例中,該感應層20B可直接成形於該基板10B之第一側面上。 As shown in FIG. 1 and FIG. 2 , the sensing layer 20 is disposed on the first side of the substrate 10 and corresponds to the visible area 11 , and the sensing layer 20 is configured to sense the touch of the object in the visible area 11 . Evently, the sensing layer 20 includes a plurality of criss-crossing sensing lines 21, wherein the sensing lines 21 can be formed by a plurality of sensing electrodes. In one embodiment, the sensing line 21 includes a plurality of driving sensing lines TX1~TXn and a plurality of receiving sensing lines RX1 R RXm, and the driving sensing lines TX1~TXn are arranged along the first axis and arranged in parallel with each other. The receiving sensing lines RX1 R RXm are arranged in parallel along the second axis and arranged in parallel with each other. As shown in FIG. 3, in an embodiment, the sensing layer 20A is formed on the surface of a film 200A. The film 200A is attached to the first side of the substrate 10A, and the sensing layer 20A is in contact with the substrate 10A. The first side; as shown in FIG. 3, in another embodiment, the sensing layer 20B can be directly formed on the first side of the substrate 10B.
請參閱圖1至3所示,前述之載板30設於該基板10之第一側面,且須對應設置於該非可視區12的範圍。,該載板30可以是一軟性電路板。該載板30上設有一近接感應電極單元31與一觸控積體電路元件32,該觸控積體電路元件32與該近接感應電極單元31形成電連接,以驅動該近接感應電極單元31,並接收該近接感應電極單元31所產生的近接感應訊號,來判斷是否有物件靠近該觸控裝置,該觸控積體電路元件32與該感應層20形成電連接,以驅動該感應層20之複數驅動感應線TX1~TXn,並接收該感應層20之接收感應線RX1~RXm所產生的感應訊號,來判斷可視區11上的觸碰事件。 Referring to FIGS. 1 to 3, the carrier 30 is disposed on the first side of the substrate 10 and is disposed in the range of the non-visible area 12. The carrier 30 can be a flexible circuit board. The carrier board 30 is provided with a proximity sensing electrode unit 31 and a touch integrated circuit component 32. The touch integrated circuit component 32 is electrically connected to the proximity sensing electrode unit 31 to drive the proximity sensing electrode unit 31. And receiving the proximity sensing signal generated by the proximity sensing electrode unit 31 to determine whether an object is close to the touch device, and the touch integrated circuit component 32 is electrically connected to the sensing layer 20 to drive the sensing layer 20 The plurality of sensing lines TX1~TXn are driven, and the sensing signals generated by the sensing lines RX1~RXm of the sensing layer 20 are received to determine the touch event on the visible area 11.
請參閱圖2所示,在一實施例中,該觸控積體電路元件32包含有一掃描電路321及一微處理器322,該掃描電路321與該感應層20之複數驅動感應線TX1~TXn及接收感應線RX1~RXm形成電連接,其中該掃描電路321包含有一驅動電路3211及一接收電路3212,該驅動電路3211用以驅動所述驅動感應線 TX1~TXn,並經由該接收電路3212接收所述接收感應線RX1~RXm之感應訊號。該微處理器322與該掃描電路321形成電連接,以透過該感應訊號來判斷該可視區11上的觸碰事件,該近接感應電極單元31包含一驅動電極311及一接收電極312,該掃描電路321與該近接感應電極單元31形成電連接,則該微處理器322可透過所接收到的近接感應訊號來判斷是否有物件靠近該觸控裝置;在一實施例中,該驅動電路3211與該驅動電極311形成電連接,以驅動該近接感應電極單元31,該接收電路3212與該接收電極312形成電連接,以接收該近接感應訊號。藉由該掃描電路321驅動位於該非可視區12的近接感應電極單元31,並接收其電容感應訊號,以進一步透過該電容感應訊號的變化來判斷是否有物件靠近該觸控裝置。 Referring to FIG. 2, in an embodiment, the touch integrated circuit component 32 includes a scanning circuit 321 and a microprocessor 322. The scanning circuit 321 and the sensing layer 20 drive the sensing lines TX1~TXn. And receiving the sensing lines RX1 R RXm to form an electrical connection, wherein the scanning circuit 321 includes a driving circuit 3211 and a receiving circuit 3212, wherein the driving circuit 3211 is configured to drive the driving sensing line TX1~TXn, and receiving the sensing signals of the receiving sensing lines RX1 R RXm via the receiving circuit 3212. The microprocessor 322 is electrically connected to the scanning circuit 321 to determine a touch event on the visible area 11 through the sensing signal. The proximity sensing electrode unit 31 includes a driving electrode 311 and a receiving electrode 312. The scanning The circuit 321 is electrically connected to the proximity sensing electrode unit 31. The microprocessor 322 can determine whether an object is close to the touch device through the received proximity sensing signal. In an embodiment, the driving circuit 3211 is The driving electrode 311 is electrically connected to drive the proximity sensing electrode unit 31, and the receiving circuit 3212 is electrically connected to the receiving electrode 312 to receive the proximity sensing signal. The scanning circuit 321 drives the proximity sensing electrode unit 31 located in the non-visible area 12 and receives the capacitive sensing signal to further determine whether an object is close to the touch device by the change of the capacitive sensing signal.
請參閱圖5所示,在另一實施例中,該觸控積體電路元件32A之掃描電路包含有一自容掃描電路3211A及一互容掃描電路3212A,該自容掃描電路3211A及該互容掃描電路3212A分別與該微處理器322A形成電連接,該近接感應電極單元31A透過一第一開關33A選擇性與該自容掃描電路3211A或與該互容掃描電路3212A形成電連接,而該感應層20之複數驅動感應線TX1~TXn及接收感應線RX1~RXm透過一第二開關34A選擇性與該自容掃描電路3211A或該互容掃描電路3212A形成電連接。即該近接感應電極單元31A可透過自容式感測或互容式感測,而該感應層20之感應線亦可為自容式感測或互容式感測。 Referring to FIG. 5, in another embodiment, the scanning circuit of the touch integrated circuit component 32A includes a self-capacitance scanning circuit 3211A and a mutual capacitance scanning circuit 3212A, and the self-capacitance scanning circuit 3211A and the mutual capacitance. The scanning circuit 3212A is electrically connected to the microprocessor 322A, and the proximity sensing electrode unit 31A is selectively electrically connected to the self-capacitance scanning circuit 3211A or the mutual capacitance scanning circuit 3212A through a first switch 33A, and the sensing is performed. The plurality of driving sensing lines TX1~TXn and the receiving sensing lines RX1~RXm of the layer 20 are selectively electrically connected to the self-capacitance scanning circuit 3211A or the mutual capacitance scanning circuit 3212A through a second switch 34A. That is, the proximity sensing electrode unit 31A can transmit self-capacitive sensing or mutual capacitive sensing, and the sensing line of the sensing layer 20 can also be self-capacitive sensing or mutual capacitive sensing.
本發明實施時,由於該近接感應電極單元31係設於該載板30上,故原有的感應層20無需延伸至該非可視區11,而可節省該感應層20的成本,且縱然欲改變設計而不使用近接感應電極單元31時,也無需變動該感應層20,僅需要更換不同的該載板30即可,相對減少製程的變化,以簡化製程,且降低成本耗損。 In the implementation of the present invention, since the proximity sensing electrode unit 31 is disposed on the carrier 30, the original sensing layer 20 does not need to extend to the non-visible area 11, and the cost of the sensing layer 20 can be saved, and even if it is to be changed When the proximity sensing electrode unit 31 is not designed, the sensing layer 20 does not need to be changed, and only the different carrier 30 needs to be replaced, and the process variation is relatively reduced to simplify the process and reduce the cost.
以上所述僅是本發明的實施例而已,並非對本發明做任何形式上的限制,雖然本發明已以實施例揭露如上,然而並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明技術方案的範圍內,當可利用上述揭示的技術內容作出些許更動或修飾為等同變化的等效實施例,但凡是未脫離本發明技術方案的內容,依據本發明的技術實質對以上實施例所作的任何簡單修改、等同變化與修飾,均仍屬於本發明技術方案的範圍內 The above is only the embodiment of the present invention, and is not intended to limit the scope of the present invention. The present invention has been disclosed by the embodiments, but is not intended to limit the invention, and any one of ordinary skill in the art, In the scope of the technical solutions of the present invention, equivalent modifications may be made to the equivalents of the embodiments of the present invention without departing from the technical scope of the present invention. Any simple modifications, equivalent changes and modifications made to the above embodiments are still within the scope of the technical solution of the present invention.
10基板 11可視區 12非可視區 20感應層 30載板 31近接感應電極單元 32觸控積體電路元件10 substrate 11 visible area 12 non-visible area 20 sensing layer 30 carrier board 31 proximity sensing electrode unit 32 touch integrated circuit component
Claims (11)
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TW103144702A TWI544384B (en) | 2014-12-22 | 2014-12-22 | Touch device |
CN201510030026.5A CN105867705A (en) | 2014-12-22 | 2015-01-21 | Touch control device |
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TW103144702A TWI544384B (en) | 2014-12-22 | 2014-12-22 | Touch device |
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TW201624214A TW201624214A (en) | 2016-07-01 |
TWI544384B true TWI544384B (en) | 2016-08-01 |
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TWI796055B (en) * | 2021-12-17 | 2023-03-11 | 大陸商北京集創北方科技股份有限公司 | Proximity off-screen method and handheld device based on touch sensing |
CN114153332B (en) * | 2021-12-17 | 2024-10-29 | 北京集创北方科技股份有限公司 | Control method and control device of touch equipment |
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CN101018447B (en) * | 2006-02-10 | 2010-06-09 | 财团法人工业技术研究院 | Circuit base board, its encapsulation structure, and making method of the encapsulation structure |
TWI590133B (en) * | 2010-12-31 | 2017-07-01 | 樂金顯示科技股份有限公司 | Apparatus and method for driving touch sensor |
TWI472971B (en) * | 2012-02-20 | 2015-02-11 | Innocom Tech Shenzhen Co Ltd | An electronic device and sensing method |
CN103309481B (en) * | 2012-03-08 | 2016-05-04 | 群康科技(深圳)有限公司 | Display module and electronic installation |
TWI511055B (en) * | 2012-12-28 | 2015-12-01 | Egalax Empia Technology Inc | Method and device for detecting touch screen |
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CN105867705A (en) | 2016-08-17 |
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