TW201202370A - Liquid adhesive for an electronic component and adhesive tape - Google Patents

Abstract

A liquid adhesive for an electronic component; wherein a component (a) which is an acrylonitrile-butadiene copolymer, a component (b) which is a phenolic resin, and a component (c) which is a compound having two or more maleimide groups are dissolved in an organic solvent, and the component (c) comprises a compound represented by the general formula (1) and a compound represented by the general formula (2).

Description

201202370 VI. Description of the Invention: The present invention relates to a liquid adhesive for an electronic component and an adhesive tape for use in a member around a lead frame constituting a semiconductor device, for example, a lead pin (lead) Pin), a semiconductor wafer mounting substrate, a heat sink, and a semiconductor wafer itself are used in succession. The present application claims priority based on Japanese Patent Application No. 2010-069063, filed on Jan. (Effectively, the adhesive tape used for the resin-sealed semiconductor is a tape for fixing a lead frame, a TAB tape, or the like. For example, the adhesive tape for fixing the lead frame is used to improve the production yield and productivity of the lead frame itself and the assembly process of the semiconductor by fixing the lead pins of the lead frame. This fixing adhesive tape is usually attached to the lead frame at the lead frame manufacturer and shipped to the semiconductor manufacturing factory. After the _ 1C is mounted in the semiconductor manufacturing factory, it is sealed with a resin. 1 Therefore, in addition to the general reliability of the semiconductor grade and the workability at the time of attachment, the adhesive tape for fixing the lead frame also requires sufficient room temperature adhesion immediately after attachment, and can withstand the assembly steps of the semiconductor device. Full financial security, etc. Conventionally, as an adhesive tape for such use, for example, a synthetic rubber resin such as polyacrylonitrile, polyacrylate or acrylonitrile-butadiene copolymer is coated on a carrier film such as a polyimide film. Or as a binder of other resins, or an adhesive mixed with other resins, as a user of Phase B 4 322948 .201202370 (B-Stage). In recent years, a resin-sealed type semiconductor device (semiconductor package) having a structure as shown in Figs. 1 to 3 has been developed and manufactured. - The resin-sealed semiconductor package f of the first embodiment has a connection between the lead pin 3 and the substrate 2 by the bonding layer 6 'the semiconductor wafer 1 is mounted on the substrate 2' and the semiconductor wafer 1 and the lead pins 3 The bonding wires 4 are sealed together by the resin 5. Further, the apparatus of Fig. 2 has a structure in which the lead pins 3 and the semiconductor wafer 1 are fixed by the bonding layer 6, and the bonding wires 4 are sealed by the resin 5. The device of Fig. 3 has a wafer pad 7 on which a semiconductor wafer 1 is mounted, an electrode 8 is fixed by an adhesive layer 6, and is bonded between the semiconductor wafer 1 and the electrode 8 and between the electrode 8 and the lead pin 3, respectively. The wires 4 are joined, and these are constructed by sealing the resin 5. As an adhesive layer of the resin-sealed semiconductor device having the structure shown in FIGS. 1 to 3, e' is known as an adhesive which can be cured at a lower temperature and has sufficient heat resistance and reliability (for example). 'Refer to Patent Document [). Further, the reliability means that leakage or short-circuit of the current is not caused even under the conditions of the migration (WPT: Pressure Cooker Biased Test) described later. However, for such an adhesive, it has been sought to further enhance its migration resistance. Anti-migration means that in the migration test, no short circuit or dendrite growth is caused. [Prior Art] 322948 5 201202370 [Patent Document] [Patent Document] Japanese Laid-Open Patent Publication No. Hei 09-176593 (Patent Document) The present invention has been made in view of the above problems, and its object is It is to provide a liquid adhesive for electronic parts and an adhesive tape which can be cured at a low temperature and has sufficient heat resistance and reliability, and is excellent in migration resistance. (Means for Solving the Problem) The present invention can solve the above problems by the following technical configuration. (1) A liquid adhesive for electronic parts, which is dissolved in an organic solvent: component (a) acrylonitrile-butadiene copolymer, component (b) phenol resin, and component (c) contain two or more horses The compound of the imine group is referred to, and the component (c) is a compound represented by the formula (1) described later, and a compound represented by the formula (2). (2) The liquid adhesive for an electronic component according to the above aspect, wherein the front mold (a) has a Mooney viscosity of 50 to Qnw l〇〇t. Ml+4

The liquid adhesive for electronic components according to the above aspect, wherein the component (a) is an acrylonitrile-butadiene copolymer having a carboxyl group. The liquid adhesive for electronic components according to the item 1, wherein the front V-forming blade (b) is a phenol tree containing a resol-type phenolic phenol 322948 6 201202370 (5) The liquid adhesive for electronic parts according to Item 1, wherein the component (b) is a combination of a novolac type phenol resin and a novolac-type resin.

(6) The liquid adhesive for an electronic component according to Item 1, wherein the mass ratio of the compound represented by the formula (1) and (2) of the component (c) is 3·^^45. (7) The liquid accommodating agent for electronic components of the component (a), wherein the total amount θ phase of the component (b) and the component (c) is 10 to 900 parts by mass, and The total amount of the component (b) and the component (c) is a mass ratio of the component (b) of 10 to 90% by mass. (8) The liquid adhesive for electronic parts according to Item 1, which contains the component (d) diamine compound ❶ >, 'repeated as the eighth item, -,, . The component (d) is a compound represented by the formula (3) which will be described later. (10) The liquid binder for an electronic component according to the eighth aspect, wherein the component (d) is a compound represented by the following formula (4), and the molecular weight is 200 to 7,000. 〇 weight average (8) as described in the first description of the liquid adhesive for electronic components, ^ containing 4 to 4G% by mass of the total solid content of the particle size ^ below ^ filler U2) - followed by tape, which is resistant to the secret _ The electronic test described in item i is applied to the layer after the application of the surface. And formed

32:!Q4S 7 201202370 (13) The adhesive tape as described in item 12, wherein the imine film is used. Heat resistant enthalpy

The at least one-side coating is formed by drying (14) an adhesive tape which is attached to the liquid adhesive for the electronic component described in the first item and added to the layer. (Effect of the Invention) According to the present invention, it is possible to provide an electronic component sufficient adhesive and an adhesive tape which can be cured at a low temperature, have heat resistance and reliability, and have excellent migration resistance. In other words, the liquid adhesive for electronic parts of the present invention can be cured or cured at a low temperature, has sufficient heat resistance and reliability, and is excellent in migration resistance. Therefore, the use of the adhesive tape of the present invention is suitably used, for example. The lead frame fixing tape, the TAB tape, or the like is placed between the members constituting the periphery of the lead frame of the semiconductor device, for example, a lead pin, a semiconductor wafer mounting substrate, a heat sink, and a semiconductor wafer itself. [Embodiment] Hereinafter, the present invention will be described in detail. First, a preferred example of a liquid adhesive for electronic parts will be described. However, the invention is not limited to those described in the examples. The liquid adhesive for electronic parts of the present invention is dissolved in an organic solvent: component (a) acrylonitrile-butadiene copolymer, component (b) phenol resin, and component (c) contain two or more Malay The compound of the quinone imine group, and the component (c) contains the compound represented by the following formula 0) and (2). 8 322948 201202370

(1) Each component will be described below. Component (a): The acrylonitrile-butadiene copolymer as the component (a) may be used as a whole, and an acrylonitrile-butadiene copolymer having a warp group is preferred. The reason for this is that the thermal stability at the time of heating is increased, the thermal stability is improved, the compatibility with other resins is increased, the insulating property is stabilized, and the tensile strength of the resin is increased. The carboxyl equivalent of the acrylonitrile-butadiene copolymer having a carboxyl group is preferably from 1,000 to 20,000. Further, the carboxyl equivalent is a value calculated by a number average molecular weight. In addition, when the Mooney viscosity is 50 to 9 servings 1+4 (1〇〇. The best one is because the viscosity is good in the above range, the thermal stability is improved and the heat resistance is improved. In addition, since the solvent solubility is improved and the melt viscosity is lowered, it is preferable because it is excellent in workability and adhesion when used as an adhesive. When the Mooney viscosity is lower than the lower limit of the above range, the heat resistance of the resin is lowered. Worry that the heat resistance necessary for the conductor assembly step cannot be obtained. Further, if the melt viscosity of the B-stage of the adhesive is lowered, the outflow of the adhesive at the processing of the lead frame is 322948 9 201202370, and the workability is lowered, so that the workability is lowered. On the other hand, when the Mooney viscosity exceeds the upper limit of the above range, the adhesive is difficult to be melted, the fluidity is lowered, and the adhesion of the lead frame is lowered. Further, the solubility in a solvent is lowered to prepare an adhesive. The acrylonitrile content of the copolymer is preferably from 5 to 5% by mass, more preferably from 10 to 40% by mass. The acrylonitrile content is within the above range. In addition, heat resistance and solvent solubility are in a suitable range, and insulation stability is improved and reliability is improved. When the right is lower than the lower limit of the above range, the heat resistance of the resin is lowered, and it is impossible to obtain a semiconductor assembly step. On the other hand, when the temperature exceeds the upper limit of the above range, the solubility in a solvent is lowered (the workability of the adhesive is lowered), which is not preferable. Further, the migration resistance is also lowered. b): As the phenol resin of the component (b), a known phenol resin can be used, and the temperature can be lowered, the curing temperature of the adhesive can be lowered, and a sufficient adhesive force can be obtained. The phenolic resin of the alkylphenol is preferred. Further, it is more preferable to use a phenol of a novolac type and a phenol of a novolak type, and the mass ratio of the novolak type phenol resin to the novolak type phenol resin is 100:5. It is better to 100:1, and 100:10 to 100:50 is better. The reason is because the combination of a novolac type phenol and a novolac type phenol can inhibit the adhesion of the surface. Suppressable In the case of poor handling of the frame processing, 10 322948 201202370 In addition, since the curing property of the novolac type phenol resin is poor, if the mass ratio of the novolac type phenol resin is excessive with respect to the novolac type phenol, the adhesive is The hardening property is lowered and the migration resistance is lowered, which is not preferable. Specific examples thereof include a p-phenolic phenol type p-tert-butylphenol and a novolac type o-tert-butylphenol. Component (C): The compound containing two or more maleimine groups as the component (C) must be used in combination with the compounds represented by the above formulas (1) and (2). The reason is that the bonding temperature and the adhesion of the adhesive can be made. The temperature is lowered, and a high adhesion force can be obtained. Further, by improving the thermal stability and improving the adhesion at the time of the hot temperature, the compatibility with other resins is improved, and the migration resistance is excellent. Further, the mass ratio of the compound represented by the above formulas (1) and (2) is preferably from 3:3 to 3:45, and preferably from 3:3.9 to 3:19. : 3 to 1: 7 is a more baby. The liquid adhesive for electronic parts of the present invention is preferably one containing the component (d): an amine compound, and the component (d) is preferably a compound represented by the following formula (3) or (4). . H2N-R1~Nh2 (3) Chinese Γν 2 R Ν 2 Η R & i Θ ,Μέ_Μ Table M--slM T ο 2 Η Ν Ν 1 / A base R2 Family I Fragrance Me*l η (wherein R2 represents a propyl group or a phenoxymethylene group, and η represents an integer of 0 to 322948 11 201202370 7). The reason is because the hardening can be adjusted by using a maleimide group as a hardener. The reason for the temperature. The compound represented by the above formula (3) may, for example, be as described below. The present invention is not limited to the above-described divalent aromatic group. The divalent aromatic group means a divalent group containing an aromatic group, and any one may be selected depending on the necessity. For example, an unrestricted amount of a phenyl group may further have a substituent if necessary. 3, 3'-diaminobiphenyl, 3,4'-diaminobiphenyl, 4,4'-diaminobiphenyl, 3,3'-diaminodiphenyl decane, 3, 4 '-Diaminodiphenylnonane, 4,4'-diaminodiphenylmethane, 2,2-(3,3'-diaminodiphenyl)propane, 2, 2-(3 , 4'-diaminodiphenyl)propyl, 2,2-(4,4'-diaminodiphenyl)propane, 2,2-(3,3'-diaminodiphenyl) Hexafluoropropane, 2,2-(3,4'-diaminodiphenyl)hexafluoropropane, 2,2-(4,4'-diaminodiphenyl)hexafluoropropane, 3, 3' -oxydiphenylamine, 3,4'-oxydiphenylamine, 4,4'-oxydiphenylamine, 3,3'-diaminodiphenyl sulfide, 3,4'-diaminodiphenyl sulfide Bond, 4,4'-diaminodiphenylsulfide scale, 3,3'-diaminodiphenyl terminus, 3,4'-diaminodiphenyl hydrazine, 4,4'-diaminodi Phenylhydrazine, 1, 3-bis[1-(3-aminophenyl)-1-indenylethyl]benzene, 1,3-bis[1-(4-aminophenyl)-1-indenyl Ethyl] benzene, 1,4-bis[1-(3-aminophenyl)-1-indenylethyl]benzene, 1,3-bis(3-aminophenoxy)benzene, 1,3 - bis(4-aminophenoxy)benzene, 1,4-bis(3-aminophenoxyl) Benzene, 1,4-bis(4-aminophenoxy)benzene, 3,3'-bis(3-aminophenoxy)diphenyl ether, 3,3'-bis(4-amino group) Phenoxy)diphenyl ether, 3,4'-bis(3-aminophenoxy)diphenyl ether, 3,4'-bis(4-aminophenoxy)diphenyl ether, 4 , 4'-bis(3-aminophenoxy)diphenyl ether, 4,4'-bis(4- 12 322948 201202370 aminophenoxy)diphenyl, "-bis-[Aminophenyl] )-" bis-(3-aminophenoxy)biphenyl, 3,3,_bis(4-monophenoxy)biphenyl, 3,4'-bis(3,ylphenoxy) Biphenyl, 3, 4,-bis(4-aminophenoxy)biphenyl, 4, 4, a bis(3-aminophenoxy), stupid, 4,4,-bis(4-amine Phenyloxy)biphenyl 'bis[4-(3-aminophenoxy)phenyl]sulfone, bis[4_(4-aminophenoxy)phenyl]sulfone, 2,2-dual [3 -(3-Aminophenoxy)phenyl]propane, 2,2-bis[3-(4-aminophenoxy)phenyl]propane, 2,2_bis[4_(3-amino Phenoxy)phenyl]propane, 2,2-bis[4-(4-aminophenoxy)phenyl]propane, 2,2-[3-(3-amine basic oxy)phenyl] Hexafluoropropane, 2,2_ [3_(4-aminoisophenyloxy)phenyl]hexapropane, 2,2-bis[4-(3-aminophenyloxy)phenyl\hexafluoropropane, 2,2-bis[4- (4-Aminophenyloxy)phenyl]hexafluoropropane, 9 9-bis(3-aminophenyl); 9,9-bis(4-aminophenyl)anthracene. The compound represented by the above formula (4) preferably has a weight average molecular weight of from 2 Å to 7, 000. The reason for this is because it is easily dissolved in a solvent and is easy to handle. The compound represented by the above formula (4) may, for example, be bis(3aminopropyl)tetradecyldioxanane, an aminopropyl terminated dimercaptodecane alkane, or 8 A polymer, bis(3-aminophenoxyfluorenyl)tetradecyldioxane, or the like may be used in combination. The blending ratio of the liquid adhesive is preferably from 1 to 9 parts by mass based on the total content of the component (b) and the component (c) per part by mass of the component (a). The total content is preferably from 20 to 800 parts by mass, more preferably from 5 to 400 parts by mass, and the total amount is from 1 to 4 parts. The total amount is preferably 0 322948 13 201202370 if the ingredients ( b), the total content of the component (5) is cured by coating in the above range, and then the heat resistance of the layer, in particular, the Young's modulus, and the purpose suitable for the purpose of Tg, in addition, will continue When the layer is hardened to the B-stage, the workability is good, and the adhesion to the heat-resistant film of the carrier is also not embrittled. In this case, the workability and the properties of the cured resin are made, and the eight components (c) In the total content of the components (the amount of _f is preferably knives (), the amount is preferably 20% to 53% by mass. To 90%, the ratio of the components (c) to (4), (4) The imine group i molar equivalent, the amine group of the component (4), is a knife (〇 is 0. 01 to 2. 〇 molar equivalent is good, 〇. 1 to 1 〇 molar equivalent set as the composition (4) The amine group equivalent is within the above range, and it is better to receive the field, and is better. In the B stage, the layer itself is not embrittled. The adhesion of the working heat-resistant film is also good. In addition to the carrier, the adhesive is not gelled during mixing, so the adhesive can be adjusted. f knife (4), component (6), component (c), and component (d) # The person is prepared by dissolving the solvent A. The 'bar & solvent system can be selected according to the requirements, for example, gamma, heart group B, "_ 增甲甲甲甲,基:2: 风% <sulfene lane, hexamethylphosphonic acid triamine, l diimidazole pyridine, hexane, benzene, f benzene, xylene, methyl ethyl hydrazine, di-, mono ether, tetrahydrofuran, diterpenes Alkane, 1,2-dimethoxyethane, diethanolol-T-ether ether, methyl cellosolve, ceramide acetate, sterol, ethanol, propanol, isopropanol, acetic acid Ester, ethyl acetate, 322948 14 201202370 acetonitrile, decane chloride, chloroform, tetra-carbonized carbon, gas benzene, di-benzene, di-ethane, trichloroethane, etc. From this, appropriate The type and amount of each component that can be dissolved are selected. The liquid adhesive can be used to promote the addition reaction of the above components (a) and the like (b). A reaction accelerator is added. The reaction accelerator may, for example, be diazabicyclinane, or methyl ethyl ketone peroxide, peroxycyclohexanol, peroxidized 3, 3, 5_3 Methylcyclohexanone, methylcyclohexyl peroxide, methyl acetonitrile peroxide, acetam peroxide, U-bis (tert-butyl peroxide) _3,3,5 trimethyl hexane, 1, b double (t-butyl peroxide) ~ cyclohexane, 2, 2 - bis (t-butyl peroxide) - octane, n-butyl _4 4 - hydrazine, 4 pairs (peroxidation third Butyl) bismuth valerate, 2'2-bis-p-tert-butyl) butyrate, heptahydroperoxylated third butyl group of seven (7)hyd-Ning ing), hydroperoxide bacteria Xiangxia di-n-butylbenzene, Gas peroxidation, p-carbolysis, peroxidation, 2, 5-dimethylhexane-2, 5~, methylbutyl, peroxy-indole-butyron, U, 3,3-tetra (_ ), gasified di-isopropylphenyl, a, -butyl hexane, propyl-based-isopropyl) stupid, 25-dimethyl bis (pervaporated tert-butyl-alkane, 2,5 ~_甲其/ς土,~一(Third butyl peroxide) hexanium, oxidized isobutyl ketone* butyl) Gasification of metformin, peroxide soil. •, cerium peroxide, benzoic acid benzoic acid, brewing, 3,5,5-trimethylhexyl peroxide, bismuth peroxide, 2,4-dichlorobenzamide, over-oxidation Ethylene carbonate 4 (4) Emulsified m-toluamyl thiol, peroxydicarbonate _ η 匕 di-2-ethylhexyl carbonate, acid-propyl vinegar, peroxydicarbonate double-butane butyl 322948 15 201202370 η, peroxidation Dibasic acid di-fourteen _, peroxidized second sister two n peroxydicarbonate, peroxidation = 3-mercapto. decyloxybutyl, peroxydicarbonate di-propane == acetal triacetate Vinegar, third butyl sulphate isobutyrate, third τδ 过 二 Ι Ι Ι Ι Ι 过 癸 癸 癸 癸 异丙 异丙 异丙 异丙 异丙 异丙 异丙 异丙 异丙 异丙 异丙 异丙 异丙 异丙 异丙 异丙 乙基 乙基 乙基 乙基 乙基Base vinegar, dodecanoic acid dodecanoic acid, peroxidized dibenzoic acid, third vinegar, peroxyisophthalic acid, bis-tert-butyl-methyl-2,5-di(benzoate) ) calcined - 曰' three butyl, tert-butyl peroxy isopropyl succinate 1st ςηητ-^ 1 1 曰 (t-butyl peroxy ΓΓ ^ Γ ' ^ first;: 8th, peroxidation Trimethyl acetoacetate, third vinegar, neohexanoic acid Organic peroxide; 1>2_dimethyl::, = base: upper: base; m. sitting, 2-methyl-m-m. sitting, 2-ethyl+methyl-meridene, 2-12 m ::yl-2-ethylmithio, phendiyl-2-ethyl+methyl, sit, 2-ethyl...2-isopropylimidazole, 2-stylyl+benzylimidazolium , Am 7 # 录 ethyl-2- 2 + ^ group + methyl light, cyanoethyl-decene, cyanoethyl 2 - isopropyl diyl ethyl 2 - phenyl, Trimellitic acid vinegar, & + [2-methyl^sodium-(1,)μethyl_s_trisole, diamine 322948 16 201202370 -6-[2'-ethyl-4-methyl Imidazolyl-(Γ)]ethyl-s_trisyl, 2,4-diamine-6-[2'-undecylimidazolyl-(Γ)]-ethyl-s_three-plow, 2 _Methylimidazole rust iso-cyanuric acid adduct, 2-phenylimidazole rust isocyanuric acid adduct, 2,4-diamine-6-[2'-methylimidazolyl-(Γ) ]_Ethyl_s_three tillage-iso-cyanuric acid adduct, 2-·phenyl-4, 5-dihydroxymethylmeridene, 2-phenyl-4-benzyl-5-hydroxyindole Imidazole, 4, 4'-methylene-bis-(2-ethyl-5-methylimidazole), 1-amineethyl-2-mercaptoimidazole, 1-cyanoethyl-2-phenyl -4, 5 Bis(cyanoethoxymethyl)imidazole, 1-dodecyl-2-methyl-3-benzylimidazolium rust, 2-methylimidazole·benzotriazole adduct, ι_amine B Base 2_ethyl °m ° sit, 1-(gasethylethylamine)- 2-mercaptopurine, N, ν'-[2-methyl-m-syl-(1)-B Base]--dihexyldiamine, hydrazine, ν, bis-(2-methylimidyl-1-ethyl) urea, hydrazine-(2-methylimidazolylethyl)urea, hydrazine Ν, a [2-mercaptoalkyl-l-(1)-ethyl]dodecanedioyldiamide, N,Ν'-[2-mercaptoimidazolyl-(1)-ethyl An imidazole such as decadecyldioxin, 1-benzyl-2-pyridyl imide hydrochloride, or a reaction accelerator such as diphenylphosphine. They can be used singly or in combination of two or more. Further, the liquid adhesive may contain a filler having a particle diameter of 1 # m or less in order to be suitable for application to the adhesive tape. The stability of the attachment property means that when the adhesive tape is thermally bonded to the wire, the adhesive is prevented from overflowing from the end face of the tape due to melting, and the subsequent layer maintains an appropriate thickness to maintain the adhesion. The content of the filler is set to 4 to 4% by mass of the total solid content, and preferably in the range of 9 to 24% by mass. 322948 17 201202370 When the content is within the above range, the effect of the stability of the attachment property is increased. In addition, the subsequent workability of the adhesive tape is improved, and the workability such as lamination is good. As the filler, for example, cerium oxide, quartz powder, alumina, calcium carbonate, magnesium oxide, diamond powder, mica, fluororesin, zircon powder or the like can be used. In addition, the liquid adhesive may be taken out after the reaction is completed, that is, after drying, and washed with an organic solvent, water, or a mixture of an organic solvent and water, and then dissolved in response to the reaction. It is used as an adhesive in the selected organic solvent. The organic solvent which can be used for washing may, for example, be acetone, ethyl hydrazine, hexene, benzene, toluene, xylene, decyl alcohol, ethanol, propanol: diether, tetrahydrofuran, decyl acetate, ethyl acetate , _ a gas burning, chloroform, four gasified carbon, gas benzene, two gas benzene, dichloroethane, tri-ethane and so on. Next, the adhesive tape of the present invention will be described. In the adhesive tape of the present invention, the above-mentioned electronic material-based adhesive is applied to at least the surface of the heat-resistant film or the release film, and the (four) layer is formed by drying. At this time, the coating thickness is 5 to 100//m, and especially the helmet 1Λ

^ ^ Chiyou thinks that the encirclement of 10 to 50/ZH is better. Examples of the heat-resistant film include a heat-resistant resin film such as polyimine, polyphenylene sulfide, polyether, polyparabanic acid, and polyethylene to polyethylene terephthalate. Epoxy resin - glass cloth, epoxy resin - polyimine - glass cloth and other complex people D, *,, ^ ^ ^, and 322948 18 201202370 special polyimine film is preferred. The thickness of the thermal film is set to 7.5 to 130 / / m, preferably in the range of 12.5 ' to 75 / / m. The shape and size of the heat-resistant film can be selected according to the requirements. If it is within the above range, then the thickness of the tape is sufficient, and the press work becomes easy. As the release film, the thickness is from 1 to 200 #m, and particularly preferably from 10 to 100 #m, it functions as a temporary carrier. The shape and size of the release film can be selected according to the needs. Examples of the release film that can be used include polypropylene ray, fluororesin film, polyethylene film, polyethylene terephthalate film, paper, and, as the case may be, a release property such as a silicone resin. . The peeling film of such a film has a 90° peel strength of preferably 0.01 to 7. Og/cm. When the peeling strength is within the above range, the peeling film is not easily peeled off from the adhesive layer when the adhesive tape is conveyed, and the peelable film can be completely peeled off from the adhesive layer at the time of use, and the workability is good. Further, when the heat resistant film forms the adhesive layer, a protective film may be further provided on the adhesive layer. As the protective film, the same as the above-mentioned peelable film can also be used. (Embodiment) Hereinafter, the present invention will be described in detail based on examples. [Example 1] Ingredient (a). 19 322948 201202370 Acrylonitrile-butadiene copolymer (containing no carboxyl group, Mui viscosity 70 Mh 4100 ° C, acrylonitrile content 27%) 100 parts by mass of component (b): A third butyl phenol type resol phenol resin (trade name: "CKM-1282", manufactured by Sigma and Polymers Co., Ltd.) 50 parts by mass of a copolymerized novolac phenol resin of p-tert-butylphenol and Bis-A ( CKM-2400, manufactured by Showa Polymer Co., Ltd., 20 parts by mass of component (c): 30 parts by mass of a compound represented by the above formula (1), which is commercially available, 50 parts by mass of a compound represented by the above formula (2) ( d): 0.25 parts by weight of 1,3-bis(3-aminopropyl)-1,1,3,3-tetradecyldioxane. The above components are added to tetrahydrofuran and thoroughly mixed and dissolved. The component ratio was adjusted to 30% by mass, and a liquid adhesive for an electronic component of Example 1 was obtained. The molar equivalent of the amine group is 0.51, relative to the 1 molar equivalent of the maleimine group. [Example 2] The component (a) was changed as follows. Component (a): a carboxyl group-modified butadiene-acrylonitrile copolymer (hydroxyl group equivalent 100, Mui viscosity 60 M1 + 4100 ° C, acrylonitrile content: 27%) 100 parts by mass, which was treated in the same manner as in Example 1. A liquid adhesive for an electronic component of Example 2 was obtained. 20 322948 201202370 [Example 3] The component (b) was changed as follows. Component (b): 70 parts by mass of p-tert-butylphenol type resole phenol resin (trade name: "CKM-1282", manufactured by Showa Polymer Co., Ltd.) was treated in the same manner as in Example 1 to obtain A liquid adhesive for an electronic component of Example 3. [Example 4] The component (b) was changed as follows. Component (b): p-T-butylphenol type resole phenol resin (trade name: "CKM-1282", manufactured by Showa Polymer Co., Ltd.) 50 parts by mass of p-tert-butylphenol and Bis-A copolymerization 40 parts by mass of a novolac phenol resin (CKM-2400, manufactured by Showa Polymer Co., Ltd.) was treated in the same manner as in Example 1 to obtain a liquid adhesive for an electronic component of Example 4. [Example 5] The component (c) was changed as follows. Component (c): 15 parts by mass of a compound represented by the above formula (1), which is commercially available, 65 parts by mass of a compound represented by the above formula (2), and treated in the same manner as in Example 1 to give Example 5 A liquid adhesive for electronic parts. [Example 6] 21 322948 201202370 The component (d) was changed as follows. Ingredient (d):

Further, the film was treated in the same manner as in Example 1 to obtain a liquid adhesive for an electronic component of Example 6. [Example 7] The component (b) and the component (c) were changed as follows. Component (b): p-tert-butylphenol type resole phenol resin (trade name: "CKM-1282", manufactured by Showa Polymer Co., Ltd.) 16. 6 parts by mass of p-tert-butylphenol and Bis-A Copolymer type novolak phenol resin (CKM-2400, manufactured by Showa Polymer Co., Ltd.) 6. 7 parts by mass of component (c): 10 parts by mass of a compound represented by the above formula (1), which is commercially available as the above formula (2) 7 parts by mass of the compound shown in the same manner as in Example 1 to obtain a liquid adhesive for an electronic component of Example 7. [Example 8] The component (b) and the component (c) were changed as follows. Component (b): p-tert-butylphenol type resole phenol resin (trade name: "CKM-1282", manufactured by Showa Polymer Co., Ltd.) 33. 3 parts by mass of p-tert-butylphenol and Bis-A Copolymer type novolac phenol resin (CKM- 22 322948 201202370 2400, manufactured by Showa Polymer Co., Ltd.) 13. 4 parts by mass of component (c): * Commercially available compound of the above formula (1) 20 parts by mass * Commercially available 33.3 parts by mass of the compound represented by the above formula (2) was treated in the same manner as in Example 1 to obtain a liquid adhesive for an electronic component of Example 8*. [Example 9] The component (b) and the component (c) were changed as follows. Component (b): p-tert-butylphenol type resole phenol resin (trade name: "CKM-1282", manufactured by Showa Polymer Co., Ltd.) 133. 3 parts by mass of p-tert-butylphenol and Bis-A Copolymer type novolak phenol resin (CKM-2400, manufactured by Showa Polymer Co., Ltd.) 53. 4 parts by mass of component (c): 80 parts by mass of a compound represented by the above formula (1), which is commercially available as the above formula (2) 133.3 parts by mass of the compound shown in the same manner as in Example 1 to obtain a liquid adhesive for an electronic component of Example '9. [Example 10] The component (b) and the component (c) were changed as follows. Component (b): p-tert-butylphenol type resole phenol resin (trade name · "CKM-1282", manufactured by Showa Polymer Co., Ltd.) 266. 6 parts by mass of p-tert-butylphenol and Bis- A copolymerized novolac phenol resin (CKM- 23 322948 201202370 2400, manufactured by Showa Polymer Co., Ltd.) ι〇6. 7 parts by mass of component (c): 160 parts by mass of a compound represented by the above formula (1) 266.7 parts by mass of the compound represented by the above formula (2) was sold in the same manner as in Example 1 to obtain a liquid adhesive for an electronic component of Example 1. [Example 11] The component (b) and the component (c) were changed as follows. Component (b): p-tert-butylphenol type resole phenol resin (trade name: "1282", manufactured by Showa Polymer Co., Ltd.) 85.7 parts by mass of p-tert-butylphenol and Bis-A Copolymer type novolak phenol resin (manufactured by Showa Polymer Co., Ltd.) 34. 3 parts by mass of component (c): 11.2 parts by mass of a compound represented by the above formula (1), which is commercially available, and the above formula (2) 18.8 parts by mass of the compound shown was treated in the same manner as in Example 1 to obtain a liquid adhesive for an electronic component of Example u. [Example 12] The component (b) and the component (c) were changed as follows. Component (b): p-Second butyl phenol type resole phenol resin (trade name: "cKM_1282"'s manufactured by Showa Polymer Co., Ltd.) 32 1 part by mass of copolyphenolic phenolic acid of Bis-butylphenol and Bis_A Varnish phenol resin (CKM_ 322948 24 201202370 2400, manufactured by Showa Polymer Co., Ltd.) 12. 9 parts by mass of component (c): * Commercially available compound of the above formula (1): 39.4 parts by mass of the above-mentioned formula (2) 66.5 parts by mass of the compound shown in the same manner as in Example 1 to obtain a liquid adhesive for an electronic component of Example 12'. [Example 13] The component (b) and the component (c) were changed as follows. Component (b): p-tert-butylphenol phenolic phenolic resin (trade name: "CKM-1282", manufactured by Showa Polymer Co., Ltd.) 21.4 parts by mass of p-tert-butylphenol and Bis-A copolymerization The phenolic phenol resin (CKM-2400, manufactured by Showa Polymer Co., Ltd.) 8.6 parts by mass of the component (c): 45 parts by mass of the compound represented by the above formula (1), which is commercially available as the above formula (2). 75 parts by mass of the compound shown was treated in the same manner as in Example 1 to obtain a liquid adhesive for an electronic component of Example 13. [Example 14] The component (b) and the component (c) were changed as follows. Ingredient (b): p-tert-butylphenol phenolic phenolic resin (trade name: "CKM-1282", manufactured by Showa Polymer Co., Ltd.) 10. 7 parts by mass of p-tert-butylphenol and Bis-A Copolymer type novolac phenol resin (CKM- 25 322948 201202370 2400, manufactured by Showa Polymer Co., Ltd.) 4. 3 parts by mass of component (c): commercially available compound of the above formula (1): 50.6 parts by mass, commercially available as described above 84.4 parts by mass of the compound represented by the formula (2) was treated in the same manner as in Example 1 to obtain a liquid adhesive for an electronic component of Example 14. [Example 15] The component (c) was changed as follows. Component (c): 5 parts by mass of a commercially available compound represented by the above formula (1), 75 parts by mass of a compound represented by the above formula (2), which was treated in the same manner as in Example 1, to give Example 15 A liquid adhesive for electronic parts. [Example 16] The component (c) was changed as follows. Component (c): 10 parts by mass of a compound represented by the above formula (1), which is commercially available, 70 parts by mass of a compound represented by the above formula (2), and treated in the same manner as in Example 1 to give Example 16 A liquid adhesive for electronic parts. [Example 17] The component (c) was changed as follows. Component (c): 20 parts by mass of a compound represented by the above formula (1), commercially available, 26 322948 201202370 60 parts by mass of a compound represented by the above formula (2), which was obtained in the same manner as in Example 1, was obtained. Example Π 'The liquid adhesive for electronic parts. - [Example 18] The component (c) was changed as follows. Component (c). 40 parts by mass of a compound represented by the above formula (1), which is commercially available, 40 parts by mass of a compound represented by the above formula (2), and treated in the same manner as in Example 1 to give Example 18 A liquid adhesive for electronic parts. [Comparative Example 1] The component (c) was changed as follows. Component (c): 80 parts by mass of the compound of the above formula (1), which was commercially available, was treated in the same manner as in Example 1 to obtain a liquid for electronic component of Comparative Example 1 which did not contain the compound of the formula (2). Binder. [Comparative Example 2] The component (c) was changed as follows. Component (c): 80 parts by mass of the compound represented by the above formula (2), which was commercially available, was treated in the same manner as in Example 1 to obtain a liquid for electronic component of Comparative Example 2 containing no compound represented by the formula (1). Binder. The main conditions of the examples and comparative examples are shown in Table 1. 27 3:!2948 201202370 [Table 1] Ingredient (a) Ingredient (b) Ingredient (C) Ingredient (d) Example 1 Acrylonitrile-butadiene copolymer Resin phenolic phenol + varnish phenol (mass ratio 50 : 20 Compound of formula (丨) + compound of wu (2) (mass ratio 30: 50) 1,3-bis(3-aminopropyl)-1,1,3,3-tetramethyldioxane Example 2 The carboxy-modified butadiene-acrylonitrile gamma copolymer was the same as the example 与. The same as Example 相同 The same as Example 1 The same exemplified phenolic phenol was the same as Example 1 except that Example 1 was the same as Example 1. Example 4 The same as Example 1 soluble furfural phenol + aldehyde "varnish phenol (mass ratio 50: 40) The same as in Example 1 and Example 1 The same Example 5 Same as Example 1 The same as Example 1 Compound + Compound of formula (2) (mass ratio: 15: 65) Same as Example 1 Example 6 Same as Example 1 Example 1 and Example 1 of the same formula (5) Example 1 The same resole phenolic phenol + novolak phenol (mass ratio 16.6: 6. 7) Compound of formula (1) + compound of formula (2) (mass 3: ratio 10: 16. 7) The same as in Example 1, Example 8 was the same as Example 1, Resorcinol + Aldehyde, varnish phenol (mass ratio 33.3: 13.4) Compound of Formula (1) + Compound of Formula (2) (mass ratio 20: 33_3) The same as Example 1 Example 9 The same as Example 1, the soluble phenol "phenol + furfural phenol (mass ratio 133.3: 53. 4) compound of formula (丨) + compound of formula (2) (mass ratio 80: 133. 3) Same as Example 1 Example 10 The same soluble phenol as in Example 《 "Phenol + aldehyde varnish (mass ratio 266·6: 106.7) Compound of formula (1) + formula (2) Compound (mass ratio 160:266.7) Same as Example 1 Example 11 The same as Example 1 Resole phenolic phenol + novolak phenol (mass ratio 85.7: 34.3) Compound of formula (丨) + Formula (2) Compound (mass ratio 11.2: 18.8) Same as Example 1 Example 12 Same as Example 1 Solvable phenolic hydrazine + aldehyde varnish phenol (mass ratio 32.1: 12_9) Formula (丨) of compound + formula ( Compound of 2) (mass ratio: 39.4: 65. 6) The same as in Example 1 Example 13 and Example 1 together with soluble furfural, aldehyde varnish phenol (mass ratio 21.4: 8. 6) Compound of the formula (丨) + compound of the formula (2) (mass ratio: 45: 75) The same as in Example 1 The same procedure as in Example 1 The same phenolic phenolic aldehyde + aldehyde varnish (mass ratio) 10_7 : 4·3) Compound of the formula (丨) + compound of the formula (2) (mass ratio 50_6: 84. 4) The same as in Example 1 Example 15 Same as Example 1 The same formula as in Example 1 (1) Compound + Compound of formula (2) (Q3: ratio 5: 75) The same as Example 1 Example 16 The same as Example 1 The compound of the same formula (丨) of Example 1 + the compound of formula (2) (mass ratio 10: 70) Same as Example 实施 Example 17 Same as Example 1 The compound of the formula (1) and the compound of the formula (2) (mass ratio 20: 60) were the same as those of Example 1 - Example 1 The same Example 18 The same as Example 丨 The compound of the formula (1) and the compound of the formula (2) (mass ratio: 40: 40) were the same as those of Example 1. Comparative Example 1 was the same as Example 1 The compound of the same formula (1) of Example 1 is the same as that of Example 1 Comparative Example 2 The same as the Example 丨 is the same as the compound of the same formula (2) of Example 1. Same as in Example 1 322948 28 201202370 The 2 L bovine liquid of Example 1 to the a-form adhesive waste material is described on both sides of the polyimide film; the degree is 2°_ Cloth ^ 5 mi : ',,, wind-drained dryer with 160 ° (: dry ^ knife! An adhesive tape using the agent of Example U was prepared. Next, the follower of the right 1 2, using the adhesive tape using the adhesive, the second magic 8 and the comparative example 2 for the semiconductor package shown in Fig. 1 == affixed with the following _

The stamping of the tape is followed by the tape (4), and then the tape is punched into a ring shape by the mold. The tape is made of metal and is temporarily attached. The next condition was 2 sec / 4 Kgf / cm 2 . The bottom plate, more and more,: two. After the above steps are followed by the adhesive tape, the position of the body of the "Cu" material is superimposed, and the tape is heated and heated to make the line frame (Cu material) and the bottom plate adhere to each other. The condition is HC/2 sec / 4 Kgf / cm 2 . Miscellaneous ==: (r, ing): The condition of thermal hardening by the nitrogen-substituted hot air circulation is 20 (TC/1 hour). (4) wire frame (CU to discuss the following process group 褽 semiconductor package. Conductor: use the grain followed by silver glue 'will be half θ θ on the bottom plate portion of the lead frame attached to the bottom plate, to 150 29 322948 201202370 °C Hardening for 2 hours. Wire bonding: Wire the bonding wires on the semiconductor wafer and the silver-plated portions of the inner lead ends of the lead pins with gold wires by wire bonding. Molding: Ring The oxygen-based casting agent is subjected to transfer molding. Finishing steps: performing steps such as resetting, stamping, and plating of the outer lead portion to complete the packaging. [Evaluation] [Low temperature, hardening] For Examples 1 to 18 and Comparative Example 1 , 2, the tape, whether it can be easily and quickly followed by the attached Evaluation of the body (ie, the bottom plate or the lead pins). Specifically, after bonding (attaching) the tape to the copper plate at 100 ° C, 14 (TC or 180 ° C), measure the tape 10 mm wide in the chamber. 90° peel strength (adjacent force). The results are shown in Table 2. 30 322948 201202370 [Table 2] Next force (N/cm) 100 ° C 140 ° C 180 ° C Example 1 3. 1 5. 1 5 2 Example 2 8. 1 8. 2 8. 1 Example 3 3. 3 6. 0 6. 2 Example 4 2. 15 5. 0 5. 1 Example 5 7. ii 8. 0 8. 1 Example 6 3. 1 5. 2 5. 1 Example 7 4. (i 4. 7 4. 9 Example 8 3. 9 4. 5 5. 2 Example 9 4. 2 4. 5 4. 7 Implementation Example 10 4. 5 4. 7 4. 9 Example 11 5. 1 5. 9 6. 1 Example 12 5. 6 6. 0 6. 3 Example 13 4. 5 4. 8 5. 0 Example 14 3. 9 4.2 4. 2 Example 15 7.4 7. 5 7. 7 Example 16 7.4 7.6 7. 9 Example 17 6.5 7.4 7.8 Example 18 2.8 4. 9 5. 3 Comparative Example 1 1. 1 4. 2 4. 1 Comparative Example 2 7. 5 7. 7 7. 8 Next, the adhesion force was 4. 2 N/cm or more, and the evaluation of [low temperature adhesion and hardening] was performed on the basis of the following criteria. ◎: It can be followed at 100t. Practically superior. 31 322948 201202370 〇. Can be continued at 140 °C. Practically no problem. △: It can be continued at 180 °C. Practical. X ·· cannot be continued at 180 °C. Practical problems. The results of evaluation of low temperature adhesion and hardening are shown in Table 5. [Heat resistance] The evaluation was performed based on the following holes and shearing force. (Hole) When the adhesive is hardened, it is visually judged by the microscope whether or not the pores generated in the adhesive become practically problematic. Specifically, the adhesive tape was attached (attached) to the copper plate at 140 ° C, and then stored in 3 (TC/70% RH humidity adjustment was performed as a test sample. Next, the test sample was placed at 16 〇. On the heater assembly of °C for 1 minute, the state of the hole between the tape and the copper plate was visually determined by a microscope. [Shear force] [Finishing test body] The following tape was cut into a width of 5 mm and a length of 75 mm. 140 ° C fit (attached) to the end of a 20 mm X 20 mm copper plate (the central part of a piece). The attached area is 25 mm 2 (5 mm X 5 mm size), and the length of the tape that is not adhered to the steel is 70 mm. [Shear strength measurement] After the test piece was fixed to a heater unit of 160 ° C, the portion of the tape which was not adhered to the copper plate was attached to a universal tensile tester, and the strength was measured. 322948 32 201202370 When pulled, copper plate The tensile tester has a jig separation distance of 5 〇 and a tensile speed of 5 〇 111 (11/min.

Further, in order to stabilize the measurement temperature, the test piece was fixed to the addition member, and measurement was started after five seconds. The ...D results are shown in Table 3. [Table 3] _ _ "―--- Hole Shear Strength (N/cm2) Example 1 No 27.8 Example 2 No 44.2 Example 3 No 27.4 Example 4 No 29.8 Example 5 No 20. 5 Implementation Example 6 No 24.3 Example 7 No 36.8 Example 8 No 32.2 Example 9 No 22. 1 Example 10 No 17.7 Example 11 No 29.8 Example 12 No 26.4 Example 13 No 24.8 Example 14 No 22.2 Example 15 None 16.8 Example 16 No 20.0 Example 17 No 22.4 Example 18 No 28.8 Comparative Example 1 No 40.8 Comparative Example 2 Yes --- 7.7 322948 33

201202370 Next, the evaluation of [heat resistance] was performed on the basis of the following criteria. • The hole 7 is the same and the shearing force is then 40N/cm2 or more (there is no problem in practical use). 〇 2 has no pores, and the shear force is then 20 N/cm 2 or more and less than 40 N/cm (no problem in practical use). △ No hole 〆 the same and the shear strength is less than 20 N/cm 2 (there is a hole in the practical X) and the shear force is followed by the strength curtain / practically problematic). The evaluation results of heat resistance are shown in Table 5. [Dimensional stability of the lead pins] When the aligning is completed, the evaluation is made based on whether or not the positional deviation of the lead pins has reached a practical level. Specifically, the tape was punched into a square (ring shape) having an outer dimension of 22 mm x inner dimension 20 using a mold, and then attached to a predetermined position of the evaluation lead frame (QFP208 pin) by heat pressing. The hot pressurization condition was a pressure of 5 Kgf/cm 2 and a press time of 〇. 3 seconds. The pressing temperature is (10) to bribe (the temperature at which the thickness of the adhesive on the lead pins becomes 15 to 18/zm is regarded as the temperature at which the bonding can be performed). Also, the lead frame pitch of the used lead frame is 168 vra. [Measurement of the positional deviation of the lead pin] After the tape is attached and in the hot air circulation type furnace 2 (after rc/1 hour treatment), the lead pitch of the lead frame is measured by a microscope. The press-fit temperature and the measurement result are shown. Table 4. 322948 34 201202370 [Table 4] Pressing temperature (°C) Pin spacing just after bonding (um) 200°C / 1 hour pin spacing after heating (β 〇0 Example 1 120 170 166 Example 2 140 165 162 Example 3 120 168 171 Example 4 140 172 171 Example 5 120 171 173 Example 6 120 172 175 Example 7 120 172 171 Example 8 120 170 167 Example 9 120 168 159 Example 10 120 169 148 Example 11 120 168 149 Example 12 120 169 163 Example 13 120 168 164 Example 14 120 170 164 Example 15 120 165 157 Example 16 120 167 163 Example 17 120 173 170 Example 18 120 172 169 Comparative Example 1 120 165 168 Comparative Example 2 120 178 195 Next, evaluate the [Dimensional Stability of Lead Pins] on the basis of the following criteria: 〇: the pitch of the tape just attached to the tape, and the hot air circulation type furnace Department 35 322948 201202370 200 C/1 After the hour, the pitch of the pins is within the range of i68emii〇%. △. The distance between the pads just attached to the tape and the distance between the pins after 200 hours of treatment in the hot air circulation furnace are more than 168//m±1〇%. Within 168 A m ± 15%. X. The distance between the pads just attached to the tape and the distance between the pins after 200 C/1 hour in the hot air circulation furnace are more than 168 μm ± 15%. The evaluation results of the dimensional stability of the pins are shown in Table 5. [Reliability] For the package obtained as described above, a pressure cooker Biased Test was performed. The condition was to apply 100 volts at 13 (rc, 2 atm). 85% RH is carried out to carry out the electrical reliability test. Next, the evaluation of [reliability] is carried out on the following basis. 〇: There is no short circuit in 240 hours. X : There is a short circuit in 240 hours. The evaluation result of the reliability is shown in the table. 5. [Immobilization resistance] After the above-mentioned reliability test, the substrate was exposed to the surface of the adhesive and exposed to a microscope. Next, the evaluation of [anti-migration] was carried out on the basis of the following criteria. ◎. There is no sure w to the dendrites, and the lead pins are not discolored. 〇: The dendrites are not confirmed, and the lead pins are discolored. X: Evaluation results of dendritic migration resistance are shown in Table 5. 322948 36 201202370 « [Workability] When attaching the lead frame, attaching the tape, etc., handling during use, properties (curl, transferability), and adhesion of the adhesive on the surface of the adhesive tape are based on the following criteria. [Workability] evaluation. _ 〇: Non-adhesive and very conducive to work: less adhesive and easy to carry out work X: viscous and not conducive to the operation The evaluation results are shown in Table 5. 37 322948 201202370 [Table 5]

Low-temperature adhesion, heat-resistant heat-resistant lead pin, dimensional safety, reliability, migration resistance, workability, Example 1 〇〇〇〇 ◎ 〇 Example 2 ◎ ◎ 〇〇 ◎ 〇 Example 3 〇〇〇〇 ◎ 〇 Example 4 〇〇〇〇〇〇Example 5 ◎ 1 〇〇〇 ◎ 〇 Example 6 〇〇〇〇 ◎ 〇 Example 7 ◎ 〇〇〇〇 △ Example 8 〇〇〇〇〇〇 Example 9 ◎ 〇〇〇 ◎ Example 10 ◎ Δ Δ 〇 ◎ Δ Example 11 ◎ 〇 Δ 〇 ◎ 〇 Example 12 ◎ 〇〇〇〇〇 Example 13 ◎ 〇〇〇〇〇 Example 14 〇〇〇〇〇〇 Example 15 ◎ △ 〇〇 ◎ 〇 Example 16 ◎ 〇〇〇 ◎ 〇 Example 17 ◎ 〇〇〇 ◎ 〇 Example 18 〇〇〇〇 ◎ 〇 Comparative Example 1 〇 ◎ 〇 XX 〇 Comparative Example 2 ◎ XX 〇 ◎ X

[Evaluation Results] As shown in Table 5, the adhesive tapes of Examples 1 to 18 were all Δ or more without practical problems. In particular, Example 5, Example 9, Example 16, and Example 17' were excellent in low-strength, hardening, Nike-resistant, and migration-resistant. Further, in Example 38 322948 201202370 2, the low temperature adhesion, hardening, heat resistance, and migration resistance were excellent. The adhesive tape of the comparative example was a short circuit in the reliability test and a dendritic migration resistance, so that there was a practical problem. Further, the adhesive tape of Comparative Example 2 has practical problems with regard to the heat retention property and the dimensional stability of the lead pins. (Industrial Applicability) ▲ A liquid adhesive and an adhesive tape for electronic parts which are excellent in heat resistance and reliability and have excellent resistance to migration at a low temperature can be provided. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing an example of a resin-sealed semiconductor device (semiconductor package) using the present invention or a conventional adhesive tape. Fig. 2 is a cross-sectional view showing another example of a resin-sealed semiconductor device (semiconductor package) using the present invention or a conventional adhesive tape. Fig. 3 is a cross-sectional view showing still another example of a resin-sealed semiconductor device (semiconductor package) using the present invention or a conventional adhesive tape. [Main component symbol description] 1 Semiconductor wafer 2 Backplane 3 Lead pins 4 Bonding wires 5 Resin 6 Next layer 7 Wafer 塾 8 Electrode 39

Claims (1)

201202370 VII. Shenqing patent scope: 1. A liquid adhesive for electronic components, dissolved in an organic solvent: component (a) acrylonitrile-butadiene copolymer, (b) phenol resin, and (c a compound containing two or more maleimine groups, and the above component (c) comprises a compound represented by the following formula (1) and a compound represented by the following formula (2). 2. The liquid adhesive for electronic parts according to claim 1, wherein the component (a) has a Mooney viscosity of 50 to 90 M1 + 4100 °C. 3. The liquid adhesive for electronic parts according to claim 1, wherein the component (a) is an acrylonitrile-butadiene copolymer having a carboxyl group. 4. The liquid adhesive for electronic parts according to claim 1, wherein the component (b) is a phenol resin containing a resole type (res? 1 type) alkylphenol. 5. The liquid adhesive for electronic parts according to claim 1, wherein the component (b) is combined with a resole type (res〇i_type) 1 322948 201202370 phenol resin and novolak type (novolac_type) ) phenolic resin. 6. The liquid adhesive for electronic parts according to claim 1, wherein the mass ratio of the compound represented by the formula (1) and (2) in the component (c) is 3: 3 to 3: 45. 7. The liquid adhesive for electronic parts according to the above-mentioned patent scope, wherein the total amount of the components (b) and (c) is 1 to 9 with respect to 100 parts by mass of the component (a). 5% by mass of the component (8) and the sigma of the component (6), the mass ratio of the component (b) to the 卯 mass%, the liquid adhesive for an electronic component according to claim 1, wherein A compound containing the component (d) diamine compound. The liquid component for an electronic component according to the above-mentioned patent application, wherein the component (4) is a compound represented by the following formula (3), H2N~R1-NH2 (3) (wherein R1 represents a divalent aromatic Family base). A liquid form for the electronic component described in item 8 of the patent (4) is followed (wherein, R2 is an integer). Wherein the component (4) is a compound represented by the following formula (4), and the average molecular weight in the weight is 200 to 7, whichever is the case, R2 represents a propenyl group or a phenoxymethylene group, and η is a hydrazine to a liquid for electronic parts according to item 1 of the patent application, followed by a 322948 2 201202370 agent containing 4 to 40% by mass of the total solid content. Fillers with particle sizes below 1 "m. A continuous adhesive tape which is formed by coating a liquid adhesive for an electronic component according to the first aspect of the patent application at least one side of a heat-resistant film and drying it to form an adhesive layer. 13. The adhesive tape according to claim 12, wherein the heat resistant film is a polyimide film. An adhesive tape which is formed by coating a liquid adhesive for an electronic component according to item 1 of the application of the above-mentioned patent application on at least one side of a release film and drying it to form an adhesive layer. 3 322948