201201669 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種散熱組合結構，尤其涉及一種帶有熱管 之散熱組合結構。 【先前技術】 [0002] 隨著科技之日新月異’電子產業及資訊技術之不斷發展 ，電子裝置資訊處理之能力越來越強，電子元件集成化 程度越來越高’其產生之熱量亦越來越多’是故，業界 通常於中央處理器或重要之電子元件表面上裝設有高效 能之散熱結構，以對該等電手元件散熱。 [0003] 目前通常之散熱結構主要包括複數散熱片及穿設或卡設 於該等散熱片之一熱管。 [0004] 此種散熱結構於製造時，先於散熱片上穿孔，然後將熱 管穿設或卡設於相應之穿孔中。各散熱片之穿孔與熱管 為間隙配合’亦即散熱片之穿孔A寸通常_大於熱管之 V. 截面。藉此’熱管與散熱片之間存在較大熱阻’不能快 速的散發電子元件之熱量。 【發明内容】 [0005] 有鑒於此，有必要提供一種熱阻較小之散熱組合結構。 [0006] —種散熱組合結構，包括複數散熱片及一熱管，所述散 熱片上開設有一固定孔，所述熱管穿設於所述固定孔中 ，所述散熱片上於固定孔之兩側各設置有〆弱化結構， 所述弱化結構受力後可壓縮變形，使所述固定孔緊縮而 使散熱片與所述熱管緊密貼合。 0992034705-° 099119609 表單編號A0101 第3頁/共14頁 201201669 [0007] [0008] [0009] [0010] 本發明藉由於Μ孔之相對兩側之散熱片上設有弱化， 構，並於㈣上施Μ使鰭片與熱導管無間隙貼合，達到 最佳之熱傳效果。 【實施方式】 請一併參閱圖i及圖2,其所示為本發明第—實施例中之 散熱組合結構100。該散熱組合結構1〇〇包括由複數散敎 片10藉由扣合之方式堆疊結合而形成之散熱片組2〇及;; 熱管30,所述熱管3G將從發熱電子元件（圖未示）上所 吸收之熱量傳導至所述散熱片組2〇上，進而散發到周圍 之空氣中。 所述散熱片10由導熱性良好之材科製威，&鋼鋁等製 成。請又參閱圖3，每—散熱片1〇包括一本體12及自該本 體12之相對兩側沿同一方向垂直延伸出之兩個折板η。 所述本體12為-長方形板體，其包括二相對之第一側邊 11及二相對之第二側邊13。所述本體12中部形成有一橢 圓形之固定孔16，其形狀與所述熱管30之橫截面大致相 同，且尺寸略大於所述熱管之尺寸，從而使熱管30能 夠穿過該固定孔16。所述本體12之相對兩側、自二第二 側邊13之中部朝向固定孔16形成有二弱化結構122。於本 實施例中，所述每一弱化結構122為由複數平行於所述第 一側邊11之長條狀片體相互鏈結而形成之一波浪片，且 弱化結構122之厚度較所述本體12薄，受力後可壓縮變形 即可。所述固定孔1 6之一側邊向外延伸有一垂直於所述 本體12之、橢圓形之一環緣。所述環緣1〇之寬度與高 度與固定孔16之寬度與高度相等。所述環緣18靠近所述 099119609 表單編號A0101 第4頁/共14頁 0992034705-0 201201669 [0011] ο [0012] Ο [0013] 099119609 弱牝結構m之兩側各 牙之缺口 182。 所述折板14是從所述本體12之相 緣18延伸之1延伸m長方形^邊11沿所述環 延伸之長度與所述環緣18延狀切相·=折板14 -相對兩側同向間隔之凸伸有二扣合件二母；折板14 142内側、於折板14與第-側邊11之連接處二扣合件 孔144。所述收容孔144用於收容相 ^置有—收容 件142。於本實施例中，所述扣合件μ:片對應之扣合 144均呈“凸”字形之結構，且所 ^1收容孔 合件142相適應。所述本體12之第—=U44與所述扣 孔144之位置向上凸起一擋止部146 於所述收谷 所述擋止部146λ 一方形片體且其頂端與折板14共面。 J以理解地，於装 他實施例中，收容孔144及扣合件149 、 可以呈其他任专之 形狀，只要相應之扣合件142能夠吹容於對應之: 144中，從而使相鄰之散熱片1〇能夠穩定組人即可 所述熱管30由導熱性好之材料如麵 中，所述熱管3〇為一縱長之扁平 &於本實施例 s狀體，其橫截面盥所 述固定孔之形狀相匹配，即亦為 *面'、所 哥圓形。可以理解地， 於其他實施例中，所述熱管3〇 其他形狀。 根據實際之使用需要為 對散熱組合結構100進行組裝時， Λ , 、、，先將一片散熱片10之扣 合件142對準相鄰之另一散熱片 乃10對應之收容孔144，並 使扣合件142收容於收容孔144 & Αβ1 ^ 内’所述散熱片10之擋止 =6亦收容於其相鄰之散熱片1〇對應之收容孔144襄’ 阻擋所述散熱片10從前一散埶 表單編號細 第5頁,共14;片1〇上脫出。藉此可完成 Κ 0992034705-0 201201669 所述散熱片10及與其相鄰之前一散熱片10之扣合。後面 依此進行組裝，散熱片10之數目不做限定，可根據具體 之實際情況來安排。此時，所述散熱片10上之環緣18之 自由前端抵頂於前一散熱片10之固定孔16之邊緣，該等 環緣18形成一尺寸較熱管30大之收容通道22供所述熱管 30穿設。 [0014] 所述熱管30之外表面塗上錫膏（圖未示），然後將塗滿 錫膏之熱管30穿設於所述散熱片組20之收容通道22中， 直至其一端露出於所述收容通道22外。由於所述熱管30 之尺寸稍微小於收容通道22之尺寸，所述熱管30與收容 通道22之間存在間隙，所述熱管30能很方便地穿設於所 述散熱片組20之收容通道22中，且不會把塗於熱管30外 表面上之錫膏刮擦掉。此時於所述散熱片組20上施加與 所述弱化結構122之朝向相垂直之力，於本實施例中，即 於所述散熱片組20上施加一平行於所述第二側邊13之力 ，使所述弱化結構122緊縮，相應地，所述缺口 182之高 度亦慢慢減小，散熱片組20受力而高度變小，並使固定 孔16及環緣18之高度因為被擠壓而縮小，使所述熱管30 上下兩側與被擠壓之環緣18相互貼合。此時所述熱管30 被卡設於所述散熱片組20之收容通道22中，其上下表面 與所述散熱片組20之環緣18之内表面緊密貼合。再將錫 膏烘烤，使熱管30與環緣18之間均勻緊密結合。 [0015] 藉此，藉由於所述散熱片10之固定孔16之兩側之本體12 上設置弱化結構122，並於散熱片組20上施壓使散熱片組 20與所述熱管30無間隙貼合，不會造成部分錫膏於穿設 099119609 表單編號A0101 第6頁/共14頁 0992034705-0 201201669 [⑻ 16] ❹ 於收容通道22之過程中被到擦掉，達到最佳之熱傳效果。 請同時參閱圖4，為本發明提供之第二實施例之一散熱片 10a之立體圖。本實施例中之散熱片10a與第一實施例中 之散熱片10相似，其區別在於：其弱化結構122a與第一 實施例中之弱化結構122不同。第一實施例中本體12—側 之一弱化結構122於本實施例中被一自環緣18—側之本體 12中部、沿所述第一側邊11之方向上、自環緣1 8之缺口 182 —直延伸到相應一第二側邊13之一縱長之開口 123取 代，第一實施例中本體12另一侧之一弱化結構122於本實 施例中被一自環緣18另一侧之本體12中部、沿所述第一 侧邊11之方向上、自環緣18之缺口 182朝向第二側邊13 延伸之一縱長之開槽124取代，該開槽124藉由一連接片 125與第二側邊13連接，從而該開槽124不貫穿第二側邊 13 ° [0017] 〇 [0018] 099119609 請同時參閱圖5，為本發明提供之第三實施例之一散熱片 10b之立體圖。本實施例中之散熱片10b與第一實施例中 之散熱片10相似，且其弱化結構122b與第一實施例中之 弱化結構122基本相同，區別在於，於第三實施例中，每 一個弱化結構122b於其中部、沿所述第一侧邊11之方向 上開設有一與環緣18之缺口 182連通之開槽126，且此開 槽126不貫穿第二側邊13。 【圖式簡單說明】 圖1為本發明第一實施例中之散熱組合結構之立體組合圖 〇 圖2為圖1中之散熱組合結構之立體分解圖。 表單編號A0101 第7頁/共14頁 0992034705-0 [0019] 201201669 [0020] 圖3為圖1中兩片散熱片之立體放大圖。 [0021] 圖4為本發明第二實施例中兩片散熱片之立體放大圖。 [0022] 圖5為本發明第三實施例中兩片散熱片之立體放大圖。 【主要元件符號說明】 [0023] 散熱組合結構：100 [0024] 散熱片組：20 [0025] 散熱片：10/10a/10b [0026] 散熱器：1 2 [0027] 本體：14 [0028] 固定孔：1 6 [0029] 環緣：18 [0030] 熱管：30 [0031] 收容通道：22 [0032] 扣合件：142 [0033] 收容孔：144 [0034] 擋止部：146 [0035] 缺口 ： 1 8 2 [0036] 弱化結構：1 22/1 22a/122b [0037] 第一侧邊：11 [0038] 第二側邊：13 099119609 表單編號A0101 第8頁/共14頁 0992034705-0201201669 VI. Description of the Invention: [Technical Field of the Invention] [0001] The present invention relates to a heat dissipating assembly structure, and more particularly to a heat dissipating combination structure with a heat pipe. [Prior Art] [0002] With the ever-changing technology industry and the continuous development of electronic technology and information technology, the ability of electronic device information processing is getting stronger and stronger, and the integration of electronic components is getting higher and higher. The more the reason is, the industry usually installs a high-efficiency heat dissipation structure on the surface of the central processing unit or important electronic components to dissipate heat from the electric components. [0003] At present, the conventional heat dissipation structure mainly includes a plurality of heat sinks and a heat pipe that is disposed or attached to one of the heat sinks. [0004] Such a heat dissipating structure is formed by perforating the heat sink prior to manufacture, and then the heat pipe is pierced or snapped into the corresponding perforation. The perforations of the fins are in a clearance fit with the heat pipe, i.e., the perforation A of the fin is usually greater than the V. section of the heat pipe. Therefore, there is a large thermal resistance between the heat pipe and the heat sink, and the heat of the electronic component cannot be quickly dissipated. SUMMARY OF THE INVENTION [0005] In view of the above, it is necessary to provide a heat dissipating structure having a small thermal resistance. [0006] A heat dissipating combination structure includes a plurality of heat sinks and a heat pipe. The heat sink has a fixing hole. The heat pipe is disposed in the fixing hole, and the heat sink is disposed on both sides of the fixing hole. The weakened structure is compressible and deformable after being stressed, so that the fixing hole is tightened and the heat sink is closely adhered to the heat pipe. 0992034705-° 099119609 Form No. A0101 Page 3 / Total 14 Pages 201201669 [0007] [0009] [0010] The present invention is provided by the weakening, heat dissipation, and (4) on the opposite sides of the pupil Shi Wei makes the fins and the heat pipe fit without gaps to achieve the best heat transfer effect. [Embodiment] Referring to Figures i and 2 together, a heat dissipating assembly 100 in a first embodiment of the present invention is shown. The heat dissipating structure 1 〇〇 includes a heat sink group 2 形成 formed by stacking and bonding a plurality of entangled sheets 10; and a heat pipe 30, the heat pipe 3G will heat-generating electronic components (not shown) The heat absorbed thereon is conducted to the fin group 2, and is then radiated into the surrounding air. The heat sink 10 is made of a material having good thermal conductivity, & steel, aluminum, and the like. Referring to FIG. 3 again, each fin 1 includes a body 12 and two flaps η extending perpendicularly from the opposite sides of the body 12 in the same direction. The body 12 is a rectangular plate body including two opposite first side edges 11 and two opposite second side edges 13. An elliptical fixing hole 16 is formed in the middle of the body 12, and has a shape substantially the same as the cross section of the heat pipe 30, and is slightly larger in size than the heat pipe, so that the heat pipe 30 can pass through the fixing hole 16. Two weakened structures 122 are formed on opposite sides of the body 12 from the middle of the second and second side edges 13 toward the fixing holes 16. In the present embodiment, each of the weakened structures 122 is formed by a plurality of strips parallel to the first side 11 to form a wave sheet, and the thickness of the weakened structure 122 is smaller than The body 12 is thin and can be compressed and deformed after being stressed. One of the fixing holes 16 extends outwardly from a rim of one of the elliptical shapes perpendicular to the body 12. The width and height of the rim 1 相等 are equal to the width and height of the fixing hole 16. The rim 18 is adjacent to the 099119609. Form No. A0101 Page 4 of 14 0992034705-0 201201669 [0012] Ο [0013] 099119609 The gaps 182 of the teeth on both sides of the weak 牝 structure m. The flap 14 is extended from the edge 18 of the body 12, and the length of the rectangle 11 is extended along the length of the ring to the edge of the ring 18. The same direction of the protrusion has two fastening members and two female members; the inner side of the folding plate 14 142 and the second fastening member hole 144 at the junction of the folding plate 14 and the first side edge 11. The receiving hole 144 is for receiving the receiving member 142. In the embodiment, the fastening member μ: the corresponding buckle 144 of the sheet has a structure of "convex" shape, and the receiving hole 142 is adapted. The position of the -= U44 and the fastening hole 144 of the body 12 is upwardly convex, and a stopping portion 146 is formed on the square blocking body 146λ and the top end thereof is coplanar with the folding plate 14. In an embodiment, the receiving hole 144 and the fastening member 149 may be in any other special shape, as long as the corresponding fastening member 142 can be blown into the corresponding: 144, thereby making the adjacent The heat sink 1 can stabilize a group of people. The heat pipe 30 can be made of a material having good thermal conductivity, such as a surface, and the heat pipe 3 is a longitudinally flattened & s shaped body of the embodiment, the cross section of which is 盥The shape of the fixing holes is matched, that is, it is also a * face ', a circle of the brother. It can be understood that in other embodiments, the heat pipe 3 has other shapes. When the heat dissipating assembly 100 is assembled according to the actual use, the fastening member 142 of one of the fins 10 is first aligned with the receiving hole 144 of the adjacent one of the other fins 10, and The fastening member 142 is received in the receiving hole 144 & Αβ1 ^ 'the stop of the heat sink 10=6 is also received in the receiving hole 144' corresponding to the adjacent heat sink 1〇, blocking the heat sink 10 from the front A dilated form number is detailed on page 5, a total of 14; Thereby, the heat sink 10 of the Κ 0992034705-0 201201669 and the fastening of the heat sink 10 adjacent thereto can be completed. The rear is assembled accordingly, and the number of the heat sinks 10 is not limited, and may be arranged according to actual conditions. At this time, the free front end of the rim 18 on the heat sink 10 abuts against the edge of the fixing hole 16 of the previous heat sink 10, and the rim 18 forms a receiving passage 22 which is larger than the heat pipe 30 for the said The heat pipe 30 is pierced. [0014] The outer surface of the heat pipe 30 is coated with a solder paste (not shown), and then the heat pipe 30 coated with the solder paste is disposed in the receiving passage 22 of the heat sink group 20 until one end thereof is exposed. The outside of the receiving passage 22. Since the size of the heat pipe 30 is slightly smaller than the size of the receiving passage 22, there is a gap between the heat pipe 30 and the receiving passage 22, and the heat pipe 30 can be conveniently disposed in the receiving passage 22 of the heat sink group 20. The solder paste applied to the outer surface of the heat pipe 30 is not scraped off. At this time, a force perpendicular to the orientation of the weakened structure 122 is applied to the heat sink group 20, and in the embodiment, a heat is applied to the heat sink group 20 parallel to the second side 13 The force of the weakened structure 122 is tightened. Accordingly, the height of the notch 182 is also gradually reduced, the heat sink group 20 is stressed and the height is reduced, and the height of the fixing hole 16 and the rim 18 is Squeezing and contracting, the upper and lower sides of the heat pipe 30 and the pressed rim 18 are attached to each other. At this time, the heat pipe 30 is disposed in the receiving passage 22 of the fin group 20, and the upper and lower surfaces thereof are in close contact with the inner surface of the rim 18 of the fin group 20. The solder paste is then baked to uniformly bond the heat pipe 30 to the rim 18. [0015] Thereby, the weakened structure 122 is disposed on the body 12 on both sides of the fixing hole 16 of the heat sink 10, and the heat sink group 20 is pressed on the heat sink group 20 to make the heat sink group 20 and the heat pipe 30 have no gap. Fit, will not cause part of the solder paste to be worn 099119609 Form No. A0101 Page 6 / 14 pages 0992034705-0 201201669 [(8) 16] 被 In the process of receiving channel 22, it is wiped off to achieve the best heat transfer effect. Please refer to FIG. 4, which is a perspective view of a heat sink 10a according to a second embodiment of the present invention. The heat sink 10a in this embodiment is similar to the heat sink 10 in the first embodiment except that the weakened structure 122a is different from the weakened structure 122 in the first embodiment. In the first embodiment, the body 12-side weakening structure 122 is in the middle of the body 12 from the side of the ring edge 18, in the direction of the first side edge 11, and from the ring edge 18 The notch 182 is replaced by an opening 123 extending to the length of one of the second side edges 13. In the first embodiment, one of the weakened structures 122 on the other side of the body 12 is in the present embodiment by a self-ring 18 and another In the middle of the side body 12, in the direction of the first side edge 11, a slot 124 extending from the notch 182 of the ring edge 18 toward the second side edge 13 is replaced by a slot 124. The sheet 125 is connected to the second side 13 so that the slot 124 does not penetrate the second side 13 [0017] 〇 [0018] 099119609 Please also refer to FIG. 5, which is a heat sink of a third embodiment of the present invention. 10b perspective view. The heat sink 10b in this embodiment is similar to the heat sink 10 in the first embodiment, and the weakened structure 122b is substantially the same as the weakened structure 122 in the first embodiment, except that in the third embodiment, each The weakened structure 122b defines a slot 126 communicating with the notch 182 of the rim 18 in a direction of the first side edge 11 , and the slot 126 does not extend through the second side 13 . BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective assembled view of a heat dissipating assembly structure in a first embodiment of the present invention. FIG. 2 is an exploded perspective view of the heat dissipating assembly structure of FIG. Form No. A0101 Page 7 of 14 0992034705-0 [0019] 201201669 [0020] FIG. 3 is a perspective enlarged view of two fins of FIG. 4 is a perspective enlarged view of two fins in a second embodiment of the present invention. 5 is a perspective enlarged view of two fins in a third embodiment of the present invention. [Main component symbol description] [0023] Heat dissipation combined structure: 100 [0024] Heat sink group: 20 [0025] Heat sink: 10/10a/10b [0026] Heat sink: 1 2 [0027] Body: 14 [0028] Fixing hole: 1 6 [0029] Ring: 18 [0030] Heat pipe: 30 [0031] Containing channel: 22 [0032] Fastening member: 142 [0033] Housing hole: 144 [0034] Stop: 146 [0035 ] Notch: 1 8 2 [0036] Weakened structure: 1 22/1 22a/122b [0037] First side: 11 [0038] Second side: 13 099119609 Form number A0101 Page 8 of 14 0992034705- 0