201201651 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種電子裝置殼體及其製作方法，尤其涉及 一種具有三維天線之電子裝置殼體及其製作方法。 【先前技#ί】 [0002] 隨著通訊、藍牙等技術之發展，實現該等應用之電子裝 置具有愈來愈多之功能，然該等電子裝置之體積向著輕 、薄之方向發展，故，如何簡化該等電子裝置中内置元 0 件之結構、減小該等内置元件之體積對於簡化整個電子 裝置之結構及降低該電子裝置之體積具有非常重要之作 用。天線作為電子裝置中一收發訊號之重要元件，其結 構之簡化及體積之減小對於簡化整個電子裝置之結構及 降低該電子裝置之體積具有關鍵之作用。 [0003] 習知電子裝置之天線通常被設置於電子裝置之殼體上。 該天線通常係一金屬彈片，其被組裝於殼體之一天線支 架上或直接安裝於殼體上。由於金屬彈片容易變形且暴 〇 露於殼體之外，於其組裝過程中很容易造成劃傷或破壞 。特別係對於需要有特定結構之三維天線，天線之製作 與組裝之難度會更高，且效率低下。雖然，目前亦有使 用導電油墨以絲網印刷之方法於電子裝置之殼體上形成 天線，然，目前該種方法僅限於殼體上印刷制得二維天 線，未能製作成所需結構之三維天線。另，殼體裝配於 本體上時，殼體與三維天線輻射體之間會存在間隙。故 不利於減小電子裝置之體積。 【發明内容】 099120744 表單編號Α0101 第3頁/共14頁 0992036600-0 201201651 [0004] 有鑒於此，有必要提供一種與三維天線一體成型之電子 裝置殼體。 [0005] 另，還有必要提供一種上述電子裝置殼體之製作方法。 [0006] 一種電子裝置殼體，其包括一第一本體、一第二本體及 一三維天線輻射體，該三維天線輻射體藉由移印之方法 形成於該第一本體上，該第二本體形成於該第一本體上 並覆蓋該三維天線輻射體，且該三維天線輻射體包括至 少一部分地露出於所述第一本體及第二本體外部之端子 〇 [0007] —種電子裝置殼體之製作方法，其包括如下步驟： [0008] 提供一第一成型模具及一第二成型模具，該第一成型模 具具有一一次成型型腔，該第二成型模具具有一二次成 型型腔； [0009] 向所述一次成型型腔中注塑熱塑牲材料形成該電子裝置 殼體之第一本體； [0010] 向該第一本體上移印一導電油墨層以形成該電子裝置殼 體之三維天線輻射體； [0011] 加熱該第一本體，使所述導電油墨固化； [0012] 向所述二次成型型腔中注塑熱塑性材料以形成該電子裝 置殼體之第二本體，該第二本體與該第一本體相結合並 將該三維天線輻射體部分地覆蓋。 [0013] 本發明較佳實施方式之電子裝置殼體之製作方法將三維 天線輻射體藉由兩次注塑成型而形成於電子裝置之殼體 099120744 表單編號A0101 第4頁/共14頁 0992036600-0 201201651 中，該電子裝置殼體可將三維天線輻射體進行保護，防 止三維天線輻射體被劃傷或損壞，保證電子裝置之通訊 性能。另，該三維天線輻射體藉由移印技術形成於電子 裝置殼體内，故無須考慮殼體與三維天線輻射體之間存 在間隙之問題’可減小電子裝置之體積。 【實施方式】 [0014] 請參閱圖1及圖2 ’本發明較佳實施方式之電子裝置殼體 10包括一第一本體11、第二本體13及一形成於第一本體 11及第二本體13之間之三維天線輕射體丨5 ’該三維天線 輻射體15至少一端琴伸至第一本體u及第二本體13之外 [0015] 該第一本體11以注塑成型之方式製成，以作為該三維天 線輻射體15之載體。該第一本體η之材質可為熱塑性塑 膠，該熱塑性塑膠可選自聚丙烯（pp)、聚醯胺（PA) 、聚碳酸酯（pc)、聚對苯二甲:酸乙二酯（PET)及聚曱 基丙烯酸甲酯（PMMA)中之任一種。 [0016] 所述二維天綠輻射體15為一不經過破壞無法展開於同一 平面上之天線，該三維天線輻射體15為一形成於第一本 體11之預選區域之導電油墨層，導電油墨層以移印之方 式形成於該第一本體11上。該導電油墨層之厚度以18_22 為最佳。所述導電油墨中包含有導電成分，如銀粉或 銅粉等。該導電油墨還包含有樹脂、硬化劑 '溶劑及添 加劑。該樹脂可為一般油墨常用之樹脂。該添加劑包括 有顏料、表面調整劑、流動調整劑、增量劑等。為使該 導電油墨層能夠牢固地附著於該第一本體11上，可於注 099120744 表單編號A0101 第5頁/共14頁 0992036600-0 201201651 [0017] [0018] [0019] [0020] [0021] 塑成型時’於該第-本體lm應該導電油墨層之位置形 成有增加附著力之結構’如形成凹Λ不平之粗糙面等。/ 該第二本體13以注塑成型之方式形成於該第—本體^上 並將二維天線輻射體〗5遮蓋。注塑成型第二本體丨3之材 料選自為聚丙歸、聚醯胺、聚碳酸醋、聚對笨二甲酸乙 二酯及聚甲基丙烯酸甲酯令之任一種。 請一併參閱圖3及圖4 ,本發明較佳實施方式之製作所述 電子裝置殼體10之方法包括如下步驟： 提供一第一成型模具及一第二成型模具，該第—成型模 具包括一一次成型型腔，該第二成型模具包括一二次成 型型腔。 向所述一次成型型腔中注塑熱塑性塑膠以形成電子裝置 殼體之第一本體11，並於一預選區域上成形有粗糙面。 該粗糙面可為於注塑成型時直接形成，亦可為將成型後 之第一本體11經過粗楼化處硿而形成。該預選區域與三 維天線輻射體15之形狀一致。 製作一銅凹版或鋼凹版’該銅凹版或鋼凹版之一表面上 形成有與該三維天線輻射體15之形狀相對應之凹槽，該 凹槽中裝有導電油墨。移印時，使移印機之矽膠頭先壓 向所述銅凹版或鋼凹版，使所述硬膠頭吸取凹槽中之導 電油墨，然後再使該矽膠頭壓向該第一本體11之預選區 域’將所述導電油墨轉印至該第一本體11上。由於預選 區域上成形有粗糙面，故導電油墨牢固地附著於該第一 本體11上。轉印完成後對該第一本體11進行加熱，使所 099120744 表單編號Α0101 第6頁/共14頁 0992036600-0 201201651 述導電油墨固化，即制得該三維天線輻射體15。 [0022] 再將第一本體11及形成於第一本體1 1之三維天線輻射體 15放置於該二次成型型腔中，並向所述二次成型型腔中 注塑熱塑性塑膠形成該第二本體13，該第二本體13結合 - 於第一本體11之一側並將三維天線輻射體15部分覆蓋， 使得三維天線輻射體15之至少一端子151由第一本體11及 第二本體13之間延伸而形成一端子以連接其他電子元件 〇 Ο [0023] 本發明所述之電子裝置殼體1 0可應用於無線通訊產品如 筆記本電腦、手機等產品中。 [0024] 本發明較佳實施方式之電子裝置殼體10之製作方法將三 維天線輻射體15藉由兩次注塑成型而形成於電子裝置之 殼體中，該電子裝置殼體10可將三維天線輻射體15進行 保護，防止三維天線輻射體15被劃傷或損壞，保證電子 裝置之通訊性能。另，該三維天線輻射體15藉由移印技 術形成於電子裝置殼體10内，故無須考慮殼體與三維天 ◎ 線輻射體15之間存在間隙之問題，可減小電子裝置之體 積。 [0025] 綜上所述，本發明符合發明專利要件，爰依法提出專利 申請。惟，以上所述者僅為本發明之較佳實施例，本發 明之範圍並不以上述實施例為限，舉凡熟悉本案技藝之 人士援依本發明之精神所作之等效修飾或變化，皆應涵 蓋於以下申請專利範圍内。 【圖式簡單說明】 099120744 表單編號A0101 第7頁/共14頁 0992036600-0 201201651 [0026] 圖1為本發明較佳實施方式電子裝置殼體之立體示意圖。 [0027] 圖2為圖1中電子裝置殼體之局部分解示意圖。 [0028] 圖3為圖1中電子裝置殼體之天線輻射體形成於第一本體 上之立體示意圖。 [0029] 圖4為沿圖1中IV- IV方向之局部剖視圖。 【主要元件符號說明】 [0030] 電子裝置殼體：10 [0031] 第一本體：11 [0032] 第二本體：13 % [0033] 三維天線輻射體：15 [0034] 端子：151 0992036600-0 099120744 表單編號A0101 第8頁/共14頁201201651 VI. Description of the Invention: [Technical Field] The present invention relates to an electronic device housing and a method of fabricating the same, and more particularly to an electronic device housing having a three-dimensional antenna and a method of fabricating the same. [0002] [0002] With the development of technologies such as communication and Bluetooth, electronic devices that implement such applications have more and more functions, but the volume of such electronic devices is moving toward light and thin, so How to simplify the structure of the built-in components in the electronic devices and reduce the volume of the built-in components plays an important role in simplifying the structure of the entire electronic device and reducing the volume of the electronic device. As an important component of an electronic signal in an electronic device, the simplification and volume reduction of the antenna plays a key role in simplifying the structure of the entire electronic device and reducing the volume of the electronic device. [0003] An antenna of a conventional electronic device is usually disposed on a housing of an electronic device. The antenna is typically a metal dome that is assembled to one of the housing antenna mounts or directly to the housing. Since the metal shrapnel is easily deformed and exposed to the outside of the casing, it is liable to cause scratches or damage during the assembly process. In particular, for a three-dimensional antenna that requires a specific structure, the fabrication and assembly of the antenna is more difficult and inefficient. Although an antenna is formed on the casing of an electronic device by using a conductive ink by screen printing, the method is currently limited to printing a two-dimensional antenna on a casing, and the desired structure is not formed. Three-dimensional antenna. In addition, when the housing is mounted on the body, there is a gap between the housing and the three-dimensional antenna radiator. Therefore, it is not conducive to reducing the size of the electronic device. SUMMARY OF THE INVENTION 099120744 Form No. 1010101 Page 3 of 14 0992036600-0 201201651 [0004] In view of the above, it is necessary to provide an electronic device housing integrally formed with a three-dimensional antenna. [0005] In addition, it is also necessary to provide a method of fabricating the above-described electronic device housing. An electronic device housing includes a first body, a second body, and a three-dimensional antenna radiator. The three-dimensional antenna radiator is formed on the first body by a pad printing method, and the second body is The three-dimensional antenna radiator is formed on the first body and covers the terminal body 至少 [0007] The manufacturing method comprises the following steps: [0008] providing a first molding die and a second molding die, the first molding die having a primary molding cavity, the second molding die having a secondary molding cavity; [0009] forming a first body of the electronic device housing by molding the thermoplastic material into the primary molding cavity; [0010] printing a conductive ink layer onto the first body to form the electronic device housing a three-dimensional antenna radiator; [0011] heating the first body to cure the conductive ink; [0012] molding a thermoplastic material into the overmolded cavity to form a second body of the electronic device housing The second body combined with the first body and the three-dimensional radiator partially covered. [0013] A method for fabricating an electronic device housing according to a preferred embodiment of the present invention forms a three-dimensional antenna radiator formed in a housing of an electronic device by two injection moldings. Form No. A0101 Page 4 / Total 14 Page 0992036600-0 In 201201651, the electronic device housing can protect the three-dimensional antenna radiator to prevent the three-dimensional antenna radiator from being scratched or damaged, and to ensure the communication performance of the electronic device. In addition, the three-dimensional antenna radiator is formed in the housing of the electronic device by pad printing technology, so that there is no need to consider the problem of the gap between the housing and the three-dimensional antenna radiator, which can reduce the volume of the electronic device. The electronic device housing 10 of the preferred embodiment of the present invention includes a first body 11 , a second body 13 , and a first body 11 and a second body . The three-dimensional antenna light-emitting body 13 between the 13's and the at least one end of the three-dimensional antenna radiator 15 is extended to the outside of the first body u and the second body 13 [0015] The first body 11 is formed by injection molding. As the carrier of the three-dimensional antenna radiator 15. The material of the first body η may be a thermoplastic plastic, and the thermoplastic plastic may be selected from the group consisting of polypropylene (pp), polyamidoamine (PA), polycarbonate (pc), and polyparaphenylene: ethylene glycol (PET). And any of polymethyl methacrylate (PMMA). [0016] The two-dimensional sky-green radiator 15 is an antenna that cannot be unfolded on the same plane without being broken. The three-dimensional antenna radiator 15 is a conductive ink layer formed in a preselected area of the first body 11, and the conductive ink The layer is formed on the first body 11 by pad printing. The thickness of the conductive ink layer is preferably 18-22. The conductive ink contains a conductive component such as silver powder or copper powder. The conductive ink further contains a resin, a hardener 'solvent and an additive. The resin can be a resin commonly used in general inks. The additive includes pigments, surface conditioners, flow regulators, extenders, and the like. In order to enable the conductive ink layer to be firmly attached to the first body 11, it can be noted in 099120744 Form No. A0101 Page 5 / Total 14 Page 0992036600-0 201201651 [0018] [0019] [0020] [0021 When molding, the structure in which the first-body lm should have a conductive ink layer is formed with a structure for increasing the adhesion, such as a rough surface for forming a concave unevenness. / The second body 13 is formed on the first body by injection molding and covers the two-dimensional antenna radiator. The material of the injection molded second body 丨3 is selected from the group consisting of polyacrylamide, polyamide, polycarbonate, polyethylene terephthalate and polymethyl methacrylate. Referring to FIG. 3 and FIG. 4, a method for fabricating the electronic device housing 10 according to a preferred embodiment of the present invention includes the following steps: providing a first molding die and a second molding die, the first molding die including The cavity is formed once, and the second molding die includes a secondary molding cavity. A thermoplastic plastic is injection molded into the primary molding cavity to form a first body 11 of the electronic device housing, and a rough surface is formed on a preselected region. The rough surface may be formed directly during injection molding, or may be formed by roughening the first body 11 after molding. The preselected area coincides with the shape of the three-dimensional antenna radiator 15. A copper intaglio or steel intaglio plate is formed. On the surface of one of the copper intaglio or steel intaglio, a groove corresponding to the shape of the three-dimensional antenna radiator 15 is formed, and the groove is filled with a conductive ink. When printing, the silicone head of the pad printing machine is first pressed against the copper intaglio or steel gravure, so that the hard rubber head absorbs the conductive ink in the groove, and then the rubber head is pressed against the first body 11 The preselected area 'transfers the conductive ink onto the first body 11. Since the rough surface is formed on the preselected area, the conductive ink is firmly attached to the first body 11. After the transfer is completed, the first body 11 is heated to make the conductive ink solidified by the 099120744 form number Α0101 page 6/14 page 0992036600-0 201201651, that is, the three-dimensional antenna radiator 15 is obtained. [0022] The first body 11 and the three-dimensional antenna radiator 15 formed on the first body 11 are placed in the overmolded cavity, and the thermoplastic is molded into the overmolded cavity to form the second body. The body 13 is coupled to one side of the first body 11 and partially covers the three-dimensional antenna radiator 15 such that at least one terminal 151 of the three-dimensional antenna radiator 15 is composed of the first body 11 and the second body 13 The terminal extends to form a terminal to connect other electronic components. [0023] The electronic device housing 10 of the present invention can be applied to products of wireless communication products such as notebook computers, mobile phones, and the like. [0024] The manufacturing method of the electronic device housing 10 of the preferred embodiment of the present invention forms a three-dimensional antenna radiator 15 in a housing of an electronic device by two injection molding, and the electronic device housing 10 can have a three-dimensional antenna The radiator 15 protects the three-dimensional antenna radiator 15 from being scratched or damaged to ensure the communication performance of the electronic device. Further, the three-dimensional antenna radiator 15 is formed in the electronic device casing 10 by the pad printing technique, so that it is not necessary to consider the problem of the gap between the casing and the three-dimensional antenna radiator 15, and the volume of the electronic device can be reduced. [0025] In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited to the above-described embodiments, and equivalent modifications or variations made by those skilled in the art in light of the spirit of the present invention are It should be covered by the following patent application. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a housing of an electronic device according to a preferred embodiment of the present invention. FIG. 1 is a schematic view of a housing of an electronic device according to a preferred embodiment of the present invention. 2 is a partially exploded perspective view of the electronic device housing of FIG. 1. 3 is a perspective view showing the antenna radiator of the electronic device housing of FIG. 1 formed on the first body. 4 is a partial cross-sectional view taken along line IV-IV of FIG. 1. [Main component symbol description] [0030] Electronic device housing: 10 [0031] First body: 11 [0032] Second body: 13% [0033] Three-dimensional antenna radiator: 15 [0034] Terminal: 151 0992036600-0 099120744 Form No. A0101 Page 8 of 14