201200867 六、發明說明： 【發明所屬之技術領域】 本發明涉及一種檢出晶片式發光二極體(Chip LED)的密 封樹脂部份發生的刮傷、碎裂等缺損的檢查裝置。 【先前技術】 晶片式LED有很多種款式，其中有一種如圖4所示。 如同圖4所示’該晶片sLED5〇由具有透光性的基板51、 在該基板51畏面相互分離的狀態下所形成的兩個以上的無透 光性電極部52、§馈在52和所述基板51的表面巾央部的發 光部幻、覆蓋基板51的表面對所述發光部53進行密封的透 光性密封樹脂54構成。 所述密封樹脂54，其覆蓋發光部53的部位成型出凸曲面 狀（該例為大致半球狀），除了具備上述的進行密封發光部S3 的作用之外’凸曲面部擔負著對發光部53發出來的光進 行收集的鏡片作用。 因此，如果擔負著相關作用的凸曲面部54a發生刮傷、碎 裂等情況時’發光部W發出來的細會被該缺損部打亂，從 而導致該晶片式LED50照射出來的光發生不均勻的現象。 為此’以刖就盼望著能夠有一種可以檢出發生於密封樹脂 54 (特別是凸曲面部54a)的缺損的檢查裝置。 另一方面，現有檢查裝置並不是以晶片式LED為檢查物 件物的’岐-麟半導體躲的配賴歧行檢查的装置， 這款檢查裝置的發明專利申請公佈說明書的專利號為 2009-288050。 201200867 這款檢查裝置採用間接照明手段，對被檢體進行照明，利 用線感測相機對該被檢體進行拍攝，並分析其圖像從而檢出其 缺點，間接照明手段，配備了含有加工成半球形狀的凹曲面狀 的反射面的主體，從形成在主體開口部侧内面的光出射口，對 所述反射面進行照射光，採用該反射面反射出來的光對下方的 被檢體進行照明。另外’相機是從形成在所述主體的觀察窗對 所述被檢體進行拍攝。 但是，如果是具有上述結構的晶片式LED時，雖然也可 以採用現有檢查裝置進行檢查該晶片式LED，但由於該晶片 气LED的結構影響，現有檢查裝置無法正確地檢出存在於密 封樹脂部的缺損部。 利用上述現有間接照明手段對晶片式LED進行照明時， 相機所拍攝下來賴像如圖5所示，從平面觀細的結果顯示 為所述凸曲面部的週邊部位（從基板的立起來的部位）（符號 55)與沒有電極的部位（表裏透光的部位）（符號56)呈現出 黑暗的，而其他電極部與發光部卻呈現現明亮的明暗圖像。另 外，圖像中對應於晶片式LED50的部位以外也是黑暗的。 因為電極部與發光部相對來說會經常反射光，透過密封樹 月曰與基板的光會在該電極部被進行反射，再次透過基板與密封 樹脂進入相機’所以同部呈現出明亮的；相反，沒有形成電極 的地方由於透過密封樹脂與基板的光沒有被反射，所以呈現出 黑暗。 我們§忍為所述凸曲面部的基板立起來部位（週邊部位）， 在包括上述結構的現有間接照明手段當中，給予照明的所述反 201200867 射光（照明光）變成朝下有—定程度指向性的光，與該照明光 以銳角交差的所述週邊部當中，在該週邊部表面被正反射的照 明光很多，而且進入樹脂内部的照明光很少，所以從該週邊部 進入相機的反射絲少，因此呈現出黑暗的。 -個方面，因為所述缺損部的表面呈現出凸凹狀，在該缺 損部内照射光被漫聽，所Μ現出明亮的。因此，若缺損位 於週邊部以外的凸曲面部或已形成電極部㈣相應位置時，因 為都呈現出明亮的’所以报難檢出該缺損。（參照圖5。圖5 中符號57為缺損。） 另外，晶片式LED除上述款式以外，也有的是基板裏面 全部為不ϋ級樹脂或其他部材的款式，但是它們在所述電極 部或發光部呈現出明亮的方面，沒有分岐。 繁於上述實際情況’本發明的目的是提供一種檢查裝置， 對存在於晶>{式led的密峨脂部的缺損部，碎其 在位置都能夠正確地檢出來。 … 【發明内容】 為解決上述課題’本發明涉及-種晶片式LED檢查裝置 ’其是-麵由具有透級的基板、形成在該基域面^透 光性電極部、設摘絲板表Φ巾央糊發光部、覆蓋所述 基板表面㈣所述發光部的透光性密封翻旨，構成的該密封樹 脂中至少經所述發絲崎分，形成凸曲的晶片式LED 的所述密封樹脂已發生的缺損進行檢出的檢查裝置，包括： 支樓所述晶片式LED的透^^錄或薄板狀的支撐部材； …配詨在所述支卿材上方，進行雜承餘該支撐部材上 201200867 的晶片式LED表面侧圖像的相機； 設置在所述支撐部材下方位置，挾住支撐部材並與所述相 機相對的遮光板； 設置在所述遮光板下方的照明機構； 所述遮光板具有至少比所述晶片式led平面形狀的大的 平面形狀；以及 所述照明機構從所述遮光板的外侧透過所述支撐部材，對 於承載在所述支#部材上的晶片式led的密封樹脂部進行照 明。[Technical Field] The present invention relates to an inspection apparatus for detecting a defect such as scratches or chipping of a sealing resin portion of a chip type LED (Chip LED). [Prior Art] There are many types of wafer type LEDs, one of which is shown in FIG. As shown in FIG. 4, the wafer sLED 5 is composed of a substrate 51 having light transmissivity, two or more non-transmissive electrode portions 52 formed in a state in which the substrate 51 is separated from each other, and § The light-emitting portion of the surface of the substrate 51 is formed by a light-transmitting sealing resin 54 that covers the surface of the substrate 51 and seals the light-emitting portion 53. The sealing resin 54 is formed in a convex curved shape (in this example, a substantially hemispherical shape) in a portion covering the light-emitting portion 53, and the convex curved portion is responsible for the light-emitting portion 53 in addition to the above-described function of sealing the light-emitting portion S3. The emitted light is used to collect the lens. Therefore, when the convex curved surface portion 54a that is responsible for the occurrence of scratches or chipping occurs, the thin portion emitted from the light-emitting portion W is disturbed by the defective portion, and the light emitted from the wafer-type LED 50 is uneven. The phenomenon. For this reason, it is expected that there can be an inspection device capable of detecting a defect occurring in the sealing resin 54 (particularly, the convex curved portion 54a). On the other hand, the conventional inspection apparatus is not a device for checking the misalignment of the 岐-Lin semiconductor with the wafer type LED as the inspection object, and the patent number of the invention patent application publication of this inspection apparatus is 2009-288050. 201200867 This inspection device uses indirect illumination to illuminate the subject, uses a line-sensing camera to shoot the subject, analyzes the image to detect its shortcomings, and indirect lighting is equipped with The main body of the concave curved surface of the hemispherical shape is irradiated with light from the light exit opening formed on the inner surface of the main body opening side, and the light reflected by the reflecting surface illuminates the lower subject. . Further, the camera photographs the subject from an observation window formed in the main body. However, in the case of the wafer type LED having the above configuration, the wafer type LED can be inspected by a conventional inspection apparatus. However, due to the structural influence of the wafer gas LED, the conventional inspection apparatus cannot accurately detect the presence of the sealing resin portion. Defective department. When the wafer type LED is illuminated by the above-described conventional indirect illumination means, the image taken by the camera is as shown in FIG. 5, and the result of the planar view is shown as the peripheral portion of the convex curved surface portion (from the stand of the substrate) (Signal 55) appears dark with the portion without the electrode (the portion that transmits light in the surface) (symbol 56), while the other electrode portions and the light-emitting portion exhibit bright and bright images. In addition, the portion of the image corresponding to the portion of the wafer type LED 50 is also dark. Since the electrode portion and the light-emitting portion reflect light frequently, the light transmitted through the sealing tree and the substrate is reflected at the electrode portion, and the substrate and the sealing resin are again transmitted into the camera, so that the same portion is bright; Where the electrode is not formed, since the light transmitted through the sealing resin and the substrate is not reflected, it appears dark. We § endure the raised portion (peripheral portion) of the substrate of the convex curved surface portion, and among the existing indirect illumination means including the above structure, the anti-201200867 illumination (illumination light) given illumination becomes downward-oriented Sexual light, among the peripheral portions where the illumination light intersects at an acute angle, the illumination light that is regularly reflected on the surface of the peripheral portion is large, and the illumination light entering the inside of the resin is small, so the reflection from the peripheral portion into the camera Less silk, so it appears dark. On the other hand, since the surface of the defect portion is convex and concave, the illumination light is heard in the defect portion, and the brightness is bright. Therefore, if the defect is located at a convex curved surface portion other than the peripheral portion or the corresponding position of the electrode portion (4) is formed, the defect is detected because it is bright. (Refer to Fig. 5. The reference numeral 57 in Fig. 5 is a defect.) In addition to the above-described styles, the wafer type LEDs may be of a type in which all of the substrates are made of non-grade resin or other components, but they are in the electrode portion or the light-emitting portion. Presenting a bright aspect, there is no separation. The present invention has been made in view of the above circumstances. It is an object of the present invention to provide an inspection apparatus capable of accurately detecting a defect portion of a dense grease portion present in a crystal type. SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention relates to a wafer type LED inspection device which has a substrate having a transmissive surface, a transparent electrode portion formed on the base surface, and a wire plate table. a blister-shaped light-emitting portion, and a light-transmissive sealing layer covering the light-emitting portion of the substrate surface (4), wherein the sealing resin is formed by at least the hairline and forming a convex curved wafer type LED An inspection device for detecting a defect that has occurred in the sealing resin, comprising: a transparent member of the wafer type LED of the branch building or a thin plate-shaped supporting member; ... disposed above the supporting material for performing a heterogeneous residue a camera for supporting a wafer-type LED surface side image of 201200867 on a support member; a light shielding plate disposed under the support member to hold the support member and opposed to the camera; and an illumination mechanism disposed under the light shielding plate; The visor has a planar shape that is at least larger than a planar shape of the wafer type LED; and the illuminating mechanism transmits the support member from an outer side of the visor for a wafer type carried on the branch The sealing resin portion of d is illuminated.
本發明涉及一種檢查裝置，首先使檢查物件的晶片式LED 位於支撐部材上的檢查領域内（所述相機的拍攝視野領域）。 搬送晶片式LED的機構可以是：例如採用合理的搬送手段進 行搬送晶片式LED承載在所述支撐部材上的檢查領域内的機 構；也可以是在支撐部材上採用合理的搬送手段進行搬送晶片 式LED，按照合理的搬送速度使其通過所述檢查領域内的機 構；或者也可以是移動已承載晶片式LED狀態的支撐部材， 將該晶片式LED按照合理的搬送速度通過所述檢查領域内的 機構。 所述照明機構對位於支撐部材上的檢查領域内的晶片式 LED進行照明，相機對其表面侧圖像進行拍攝。 在與所述相機相對的位置，也就是所述晶片式LED的正 下方，設有遮光板，所述的照明機構，從所述遮光板的外側， 透過所述支撐部材對晶片式led的密封樹脂部進行照明。也 就是，因為設有遮光板，所以晶片式LED僅僅由所述照明機 6 201200867 構照射出麵斜下方的絲其㈣旨料行照明。 射方2==_的純本上縣林的按照 -點點=部。因此，進人所述相機的光僅僅只有 點點，由該相機拍攝到的晶以LED圖像為 個方©，當密封樹脂部存在缺損時，因為其表面呈現出 凹狀，所以在由所述照明機構照射出來的光當中，碰撞到該 貝部触，在其凸凹表面發生漫反射現象，當中有-部分進 〇所述相_。因此，由所述卿機構對所述密封樹脂部進行 …、明’且存在缺損時，同侧呈現出明亮的圖像。 。這樣’根據本發明’當密封樹脂部存在缺損時，可以獲得 只有同缺損部呈現出明亮的圖像，所以在所述判定部中，在分 析拍攝圖像進行觸有無該缺損辦，能關單且正確地作出 另外在本發明中，所述照明機構可以由上面開口的圓筒 狀主體、配設成在該主體内以圓周方向等間隔進行照射朝向内 侧斜上方的光軸的光的複數光源組成。 根據相關構成的照明機構’配設在主體上的複數光源整體 主要將上方的環狀領域設為高照度領域進行照明，所述晶片式 LED，從該照明機構照射饴來的光内，主要採用朝向内侧斜上 方照射出來的光，對其密封樹脂部進行照明。 本發明中涉及的所述遮光板，最好希望是呈現出黑色的。 因為若為黑色，被它反射的反射光很少，不容易產生外部I先。 檢查物件物晶片式LED，由具有透光性的基板、形成在 7 201200867 設在所述基板表面中央部的 才所述發光部的透光性密封樹 發光部的部分形成凸曲面狀， 該基板裏面的不透光性電極部、配設 發光部、覆蓋所述基板表面密封所立 脂，該密封樹脂中至少覆蓋所述發光 凸曲面狀的形狀不受任何限制。 如上所述，本發明可以將相機拍攝下來The present invention relates to an inspection apparatus which firstly places a wafer type LED of an inspection object in an inspection field on a support member (a field of view of the camera). The mechanism for transporting the wafer type LED may be, for example, a mechanism for transporting the wafer type LED on the support member by a reasonable transfer means, or a transfer method using a reasonable transfer means on the support member. The LED passes through the mechanism in the inspection field at a reasonable transport speed; or may be a support member that moves the state of the wafer-mounted LED, and the wafer-type LED passes through the inspection field at a reasonable transport speed. mechanism. The illumination mechanism illuminates the wafer-type LED in the inspection area on the support member, and the camera images the surface side image thereof. At a position opposite to the camera, that is, directly under the wafer type LED, a light shielding plate is provided, and the illumination mechanism seals the wafer type LED from the outside of the light shielding plate through the support member. The resin part is illuminated. That is, since the visor is provided, the wafer type LED is illuminated by the illuminating machine 6 201200867 only. The base of the shooting party 2 == _ according to the county forest - the point = the Ministry. Therefore, the light entering the camera is only a little bit, and the crystal image captured by the camera is a square image ©, and when the sealing resin portion is defective, since the surface thereof is concave, Among the light irradiated by the illumination mechanism, the bump contact is hit, and a diffuse reflection phenomenon occurs on the convex and concave surface, and some of the phase _ is entered. Therefore, when the sealing resin portion is subjected to the above-described sealing mechanism and there is a defect, the same side presents a bright image. . According to the present invention, when the sealing resin portion is defective, it is possible to obtain a bright image only in the same defect portion. Therefore, in the determination unit, if the image is analyzed and the defect is touched, the defect can be checked. Further, in the present invention, the illumination mechanism may be a plurality of light sources that are open from the upper surface of the cylindrical body and that are arranged to illuminate the optical axis of the optical axis obliquely upward in the circumferential direction at equal intervals in the body. composition. According to the illuminating mechanism of the related configuration, the entire plurality of light sources disposed on the main body mainly illuminate the upper annular region as a high illuminance region, and the wafer-type LED is mainly used for illuminating the illuminating light from the illuminating mechanism. The light that is irradiated obliquely upward toward the inner side illuminates the sealing resin portion. Preferably, the visor in accordance with the present invention is desirably black. Because if it is black, there is very little reflected light reflected by it, and it is not easy to generate external I. The object-type wafer type LED is formed of a translucent substrate, and a portion of the translucent sealing tree light-emitting portion of the light-emitting portion formed at a central portion of the surface of the substrate at 7 201200867 is formed into a convex curved surface. The opaque electrode portion, the light-emitting portion, and the surface of the substrate are sealed to seal the liquid, and the shape of the sealing resin covering at least the light-emitting convex surface is not limited. As described above, the present invention can take a camera down
部存在缺損時’可以獲得只有該缺損部呈現為明亮的圖像，因 3躡下來的晶片式LED的 亥結果為當所述密封樹脂 此對所獲得_料行分析並觀#無缺損時 確地作出判斷。 【實施方式】 下面參照關詳細地本翻的—種實施方式。 如圖1所示’本例晶片式LED檢查裝置！包括承載檢查 物件晶U LED5G的透明板狀的讀部材5，配設在這敏 樓部材5上方進行拍攝已承載在該支撑部材5上面晶片式 LED50的表面側圖像相機6，設在所述支撑部材5下方位置(本 例為支撐部材5的裏面）挾住該支撐部材5並設置成與所述相 機6相對的遮光板1G，設置在麵光板⑴下綠置與所述相 機6相對的照明機構^，和通過分析相機6拍攝下來的圖像 對晶片式LED50的良否進行判定的判定部8。 本例的檢查物件物晶片式LED5〇，是一種具有如所述圖4 所示款式的產品。 所述支撐部材5，如果是玻璃等不會發生彎曲且透光的話 其材質沒有限制，而且其款式除剛性高的板材以外，也可以為 具有可撓性的薄板材。 201200867 所述照明機構15如圖2所示，由上面開口的關狀主體 16、配設成在該主體16内以圓周方向等間隔進行照射朝向内 側斜上方的光軸的光的複數LED燈17組成。 據s亥照明機構15，從配設成環狀的各LED燈17照射出 照明光，照射出來的光穿過主體16開口部18，複數led燈 17整體將上方的環狀領域設為高照度領域進行照明。這樣， 承載在支樓部材5上的晶片式ledso，由從該照明機構15朝 向内侧斜上方進行照射，透過支撐部材5的光進行照明。 所述相機6拍攝位於下方的晶片式LED5〇的圖像，只要 能拍攝圖像的都可以，比如面誠爾目機或線_相機都能適 用。但是’當___機時，需要按指定速度移動晶片式 LED50。 所述遮光板10 ’由呈現出黑色的部材構成，平面形狀至 少要大於所述晶片式LED50的平面形狀，也就是晶片式 LED50的大小不要突出該遮光板1〇。 所述的判定部8，對相機6拍攝下來的圖像進行分析，例 如將拍攝®像進行2值化處理’進行觸晶片式LED5〇的密 封樹腊54部位是否存在缺損。 利用具備上述結構的本例檢查裝置丨，按照下列順序，對 晶片式LED50進行檢查。.外 首先，採用合適的搬送手段進行搬送檢查物件晶片式 LED50 ’使其位於㈣讀部材5上的檢查賴，也就是使其 位於所述相機拍攝視野領域内。 一 在所述支撐部5上葯所述檢查領域内 ，由照明機構15對 201200867 晶片式LED50進行照射，在這種狀態下，相機6對該晶片式 LED50的表面侧圖像進行拍攝。 在晶片式LED50的正下方設有遮光板1〇，由照明機構15 照射出來的朝向内側斜上方的光，從該遮光板1G的外侧透過 5 #g #式LED5G進行綱，晶片式LED5G的密封 樹轉54 (凸曲面部54a )則由來自斜下方的光被進行照明。 從斜下方的照射在凸曲面部54a的光，基本上原封不動的 按照射方向透過該凸曲面部54a。因此，進人所述相機6的光 健只有-點點，_機6拍攝下來的^式咖的圖像如 圖3所示，其整體為黑暗的圖像。 码一巧叫。丨〜抑仔隹缺損時，因為其表面呈港 出^凹狀，所以由照明機構15照射出來的光當t，碰撞到驾 缺損部57的光，在其凸凹表面發生亂反射現象，當中有一苟 分進入相機6内。因此，當照明機構15對凸曲面部地進朽 照明’且存在缺損部57時，關3所示， 明亮的圖像。 兄出 相機6拍攝下來的這種圖像被發送到所述縱部8，在該 ^部·魏的圖像進行分析，進行财是歸在所述 所 拍攝下來的圖像當中只有缺損部57 马明免的’所以能夠簡單且正確地檢出該缺，部^。 然後，將承載在支撐部材5上的晶 成新的，並執行上述—連㈣㈣ ；5G依次更換 w進行連續性缺損檢查。—所^崎多個晶片式 上述針對本發明的這一實施方式進行了說明’但本發明能 201200867 採用的具體对’ iM；贼魏对，在魏縣發明的宗旨 的前提下，也可以採用其他方式實現。 例如’這裏採用的是由呈現出黑色的部材構成遮光板1〇， 但是並不限於這種部材。 另外，檢查物件物的晶片式LED5〇的款式不限於上例， 具有凸曲面狀的密封樹脂54誠品，採用本發明涉及的檢查 裝置’能夠很好的進行檢查有無缺損，凸曲面部5如的形狀也 不受任何限定。 例當中對所述支撐部材5進行了固定，但是也可以移1 已承載晶片式LED50的支撐部材5，_“式LED5〇按丨 合理的搬送速度通過所述檢查領域内。 【圖式簡單說明】 圖1表示本發_-種實施方式的檢查裝置正面圖。 圖2表示本實施方式照明機構的縱向剖面圖。 圖3表示本實财式中⑼式LED的拍_像的說明圖。 圖4是說明晶片式LED形態的說明圖。 獲得的拍攝圖像的說明圖。 6 晶片式LED檢查裝置 支樓部材 相機 判定部 ·遮光板 15:照明機構. 11 201200867 16 :主體 17 : LED 燈When there is a defect in the part, it is possible to obtain an image in which only the defect portion appears bright, because the result of the chip-type LED of the 3 蹑 is that when the sealing resin is obtained from the pair, it is confirmed that there is no defect. Make judgments. [Embodiment] Hereinafter, an embodiment of the present invention will be described in detail. As shown in Figure 1 'This wafer type LED inspection device! A transparent plate-shaped reading member 5 that carries the inspection object crystal U LED 5G is disposed above the sensitive floor member 5 to capture a surface side image camera 6 that is carried on the support member 5 on the wafer-type LED 50. A position below the support member 5 (in this example, the inside of the support member 5) is placed on the support member 5 and disposed to face the camera 6 with the light shielding plate 1G disposed opposite the camera 6 (1). The illumination unit 2 and the determination unit 8 that determines whether or not the wafer type LED 50 is good or not by the image captured by the analysis camera 6. The inspection object wafer type LED 5' of this example is a product having the style shown in Fig. 4. The support member 5 is not limited in material if it is not bent or light-transmitted, and the shape thereof may be a flexible sheet material in addition to a sheet having high rigidity. As shown in FIG. 2, the illumination unit 15 has a plurality of LED lamps 17 that are disposed on the upper side of the body 16 and that are arranged to illuminate the optical axis of the optical axis obliquely upward in the circumferential direction at equal intervals in the main body 16. composition. According to the shai illumination mechanism 15, illumination light is emitted from each of the LED lamps 17 arranged in a ring shape, and the irradiated light passes through the opening portion 18 of the main body 16, and the plurality of LED lamps 17 as a whole have a high illumination area in the upper annular region. The field is illuminated. Thus, the wafer type ledso carried on the branch member 5 is irradiated with light passing through the support member 5 by being irradiated obliquely upward from the illumination unit 15 toward the inside. The camera 6 captures an image of the wafer-type LED 5 位于 located below, as long as it can capture an image, such as a face machine or a line camera. However, when the ___ machine is used, it is necessary to move the wafer type LED 50 at a specified speed. The visor 10' is composed of a member exhibiting a black color, and the planar shape is at least larger than the planar shape of the wafer-type LED 50, that is, the size of the wafer-type LED 50 does not protrude from the visor. The determination unit 8 analyzes the image captured by the camera 6, for example, binarizing the image of the image of the image, and performing a defect on the portion of the sealed tree wax 54 that touches the chip type LED 5A. With the inspection apparatus of this example having the above configuration, the wafer type LED 50 is inspected in the following order. First, the inspection of the article wafer type LED 50' is carried out by a suitable conveyance means so as to be placed on the (four) reading member 5, that is, to be placed in the field of view of the camera. In the inspection area of the support portion 5, the 201200867 wafer type LED 50 is irradiated by the illumination unit 15, and in this state, the camera 6 images the surface side image of the wafer type LED 50. A light-shielding plate 1A is provided directly under the wafer-type LED 50, and the light obliquely upward toward the inside, which is irradiated by the illumination unit 15, passes through the 5 #g#-type LED 5G from the outside of the light-shielding plate 1G, and the wafer-type LED 5G is sealed. The tree turn 54 (the convex curved surface portion 54a) is illuminated by light from obliquely below. The light irradiated on the convex curved surface portion 54a from obliquely downward is transmitted through the convex curved surface portion 54a in the incident direction substantially as it is. Therefore, the lightness of the camera 6 is only a little bit, and the image of the coffee machine photographed by the machine 6 is as shown in Fig. 3, and the whole is a dark image. The code is called by skill. When the defect of the 丨 抑 抑 抑 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The enthalpy enters the camera 6. Therefore, when the illumination mechanism 15 illuminates the convex curved portion and the defective portion 57 is present, the bright image is indicated by the off 3 . The image captured by the camera 6 is sent to the vertical portion 8, and the image of the image is analyzed, and the image is processed. Only the defect portion 57 among the captured images is included. Ma Ming-fu's ability to detect the deficiency simply and correctly. Then, the crystals carried on the support member 5 are newly formed, and the above-mentioned (four) (four); 5G are sequentially replaced, and the continuity defect inspection is performed. - The above-mentioned embodiment of the present invention has been described in the following description. However, the present invention can be used in the specific example of 'iM; thief Wei, which can be adopted under the premise of the invention of Weixian. Other ways to achieve. For example, 'the light-shielding plate 1' is formed of a member which exhibits black color, but is not limited to such a material. In addition, the style of the wafer type LED 5A for inspecting an object is not limited to the above example, and the sealing resin 54 having a convex curved surface is excellent in inspection, and the inspection apparatus according to the present invention can perform inspection with or without defects, and the convex curved surface portion 5 is as The shape is also not subject to any restrictions. In the example, the support member 5 is fixed, but the support member 5 that has carried the wafer type LED 50 may be moved, and the "type LED 5" passes through the inspection area at a reasonable conveyance speed. Fig. 1 is a front view showing an inspection apparatus according to an embodiment of the present invention. Fig. 2 is a longitudinal sectional view showing an illumination unit according to the present embodiment. Fig. 3 is an explanatory view showing a beat image of the LED of the type (9) in the present invention. 4 is an explanatory diagram for explaining a form of a wafer type LED. An illustration of a captured image obtained. 6 Chip type LED inspection device Branch member camera judgment unit · Light shield 15: Illumination mechanism. 11 201200867 16 : Main body 17 : LED lamp
50 :晶片式LED 51 :基板 52 :電極 53 :發光部 54 :密封樹脂 54a :凸曲面部50: wafer type LED 51: substrate 52: electrode 53: light-emitting portion 54: sealing resin 54a: convex curved surface portion