TW201144404A - Circuit connection material, connection structure using same, and temporary pressure-bonding method - Google Patents

Circuit connection material, connection structure using same, and temporary pressure-bonding method Download PDF

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Publication number
TW201144404A
TW201144404A TW099139515A TW99139515A TW201144404A TW 201144404 A TW201144404 A TW 201144404A TW 099139515 A TW099139515 A TW 099139515A TW 99139515 A TW99139515 A TW 99139515A TW 201144404 A TW201144404 A TW 201144404A
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Taiwan
Prior art keywords
circuit
mass
connecting material
substrate
film
Prior art date
Application number
TW099139515A
Other languages
Chinese (zh)
Other versions
TWI452110B (en
Inventor
Takashi Nakazawa
Kouji Kobayashi
Takanobu Kobayashi
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Hitachi Chemical Co Ltd
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Publication of TW201144404A publication Critical patent/TW201144404A/en
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Publication of TWI452110B publication Critical patent/TWI452110B/en

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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    • C08L31/04—Homopolymers or copolymers of vinyl acetate
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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Abstract

Provided is a circuit connection material that electrically connects opposing circuit electrodes. Said circuit connection material contains a thermoplastic polymer that contains: (a) an epoxy resin; (b) a latent hardener; (c) a film-forming material; and (d) a monomer unit, namely a carboxylic acid vinyl ester.

Description

201144404 六、發明說明 【發明所屬之技術領域】 本發明關於電路連接材料、使用其之連接結構物及暫 時性壓著之方法。 【先前技術】 作爲半導體兀件或液晶顯不兀件用的黏著劑，使用黏 著性優異且顯示高的可靠性之環氧樹脂等的熱硬化性樹脂 (例如參照專利文獻1)。作爲上述黏著劑的構成成分，一 般使用環氧樹脂、與環氧樹脂有反應性的酚樹脂等之硬化 劑、促進環氧樹脂與硬化劑的反應之熱潛在性觸媒。熱潛 在性觸媒係決定黏著劑的硬化溫度及硬化速度之重要因 子’從室溫的儲存安定性及加熱時的硬化速度之觀點來 看，使用各種的化合物。 又’最近著眼於由丙烯酸酯衍生物或甲基丙烯酸酯衍 生物等的自由基聚合性化合物與自由基聚合引發劑的過氧 化物所構成的自由基硬化型黏著劑（例如，參照專利文獻 2)。自由基硬化型黏著劑雖然可在低溫且短時間進行硬 化’但黏著性係有被連接構件的表面狀態所左右之傾向。 另一方面，作爲在比較低溫且短時間可進行黏著的電路連 接材料’使用環氧樹脂的陽離子聚合系之黏著劑係被開發 而實用化（例如參照專利文獻3) ^ 先前技術文獻 專利文獻 -5- 201144404 專利文獻1 :特開平1 - 1 1 3 480號公報 專利文獻2 :國際公開第98/044067號小冊 專利文獻3 :特開平7-90237號公報 【發明內容】 發明所欲解決的問題 然而，以往使用環氧樹脂的黏著劑，與自由基硬 黏著劑比較下，係在連接構件進行暫時性黏著之際的 壓著性有劣化的傾向，特別希望在低溫且短時間的暫 著性之提高》 因此’本發明之目的爲提供對連接構件的低溫且 間之暫時壓著性十分優異的II路連接材料、使用其之 結構物及暫時性壓著之方法。 解決問題的手段 本發明提供一種電路連接材料，其爲將對向之電 極彼此電連接之電路連接材料，其含有（a)環氧樹脂 潛在性硬化劑、（c)薄膜形成材料與（d)含有以羧酸乙 作爲單體單位之熱塑性聚合物。 本發明的電路連接材料藉由具備上述構成，對連 件的低溫且短時間之暫時壓著性十分優異。此處，戶斤 暫時性壓著，就是指將形成於支撐薄膜上的由電路連 料所成的黏著劑層轉印至被附體的電路構件之步驟。 述步驟中’通常藉由加熱及加壓而使構成黏著劑層的 化型 暫時 時壓 短時 連接 路電 、（b) 烯酯 接構 謂的 接材 於上 樹脂 -6 - 201144404 成分熔融，黏著於電路構件後，將支撐薄膜剝離而使黏著 劑層轉印至電路構件上。然而，當爲環氧樹脂系的電路連 接材料時，由於暫時性壓著時的熱而會進行硬化，故加熱 溫度係受限制。於是，於電路連接材料中，要求對被附體 的黏著性與由支撐薄膜的剝離性之並存。因此，本發明的 電路連接材料藉由含有（a)成分的環氧樹脂連同作爲（b)成 分的潛在性硬化劑，可在暫時性壓著時不進行環氧樹脂的 硬化，而在以後的正式連接中顯示良好的連接性。其一方 面，由於必須藉由加熱而使某一程度的樹脂成分熔融，暫 時性黏著於電路構件，故作爲（d)成分，利用含有以羧酸 乙烯酯爲單體單位的熱塑性聚合物，可藉由暫時性壓著時 的加熱溫度將（d)成分熔融，而暫時性黏著於電路構件。 上述羧酸乙烯酯較佳爲乙酸乙烯酯。藉此，電路連接 材料係可進一步提高對連接構件的低溫且短時間的暫時壓 著性。 又，於本發明的電路連接材料中，從可使正式連接時 的步驟成爲低溫化•短時間化來看，潛在性硬化劑較佳爲 陽離子聚合型潛在性硬化劑，陽離子聚合型潛在性硬化劑 更佳爲芳香族锍鹽。 再者，從提高對各種連接構件的黏著性之觀點來看， 本發明的電路連接材料較佳爲更含有有機微粒子。 又’本發明提供一種連接結構物，其特徵爲具備有： 具有第一之基板及形成於該基板之主面上之第一之電路電 極的第一之電路構件；與’具有第二之基板及形成於該基 201144404 板之主面上之第二之電路電極，該第二之電路電極與上述 第一之電路電極爲以對向方式配置，該第二之電路電極與 上述第一之電路電極爲以電連接的第二之電路構件；與， 介於第一之電路構件及第二之電路構件之間的連接部；其 中連接部爲上述本發明的電路連接材料之硬化物。 上述連接結構物由於使用低溫且短時間的暫時壓著性 優異之電路連接材料來形成連接部，而成爲具有安定品質 的連接結構物。 再者，本發明提供一種暫時性壓著之方法，其具備 有：使具備有支撐薄膜與設置於該支撐薄膜之一側面上之 由本發明的電路連接材料所形成之黏著劑層的薄膜狀黏著 劑，於80°C以下對具有基板及形成於該基板之主面上之電 路電極的電路構件進行暫時性黏著之步驟：與，於暫時性 黏著後，將前述支撐薄膜剝離而使黏著劑層轉印至基板的 主面之步驟。 若依照上述暫時性壓著之方法，由於可在低溫且短時 間將黏著劑層轉印至電路構件，故可高作業效率地製作具 有安定的黏著力之連接結構物。 發明的效果 若依照本發明，可提供對連接構件的低溫且短時間之 暫時壓著性十分優異的電路連接材料、使用其之連接結構 物及暫時性壓著之方法。 201144404 【實施方式】 實施發明的形態 以下’按照需要一邊參照圖面，一邊詳細說明本發明 的適宜實施形態。惟，本發明係不受以下的實施形態所限 定。再者，圖面中，對相同要素係附有相同符號，重複的 說明係省略。又’只要沒有特別預先指明，則上下左右等 的位置關係以圖面所示的位置關係爲基礎。再者，圖面的 尺寸比率係不受圖示的比率所限定。又，本說明書中的 「（甲基）丙烯酸」係意味「丙烯酸」及對應其的「甲基丙 烯酸」。 本實施形態的電路連接材料係將電路電極彼此電連接 用的黏著劑。圖1係顯示電路連接材料的一實施形態之截 面圖。圖1所示的電路連接材料1係由樹脂層3與在樹脂 層3內分散的複數之導電粒子5所構成，且具有薄膜狀之 形狀。樹脂層3係含有（a)環氧樹脂' (b)潛在性硬化劑、 (c)薄膜形成材及（d)含有以羧酸乙烯酯作爲單體單位之熱 塑性聚合物。換言之，電路連接材料丨係含有（a)環氧樹 脂、（b)潛在性硬化劑、（c)薄膜形成材及含有以羧酸乙 烯酯作爲單體單位的熱塑性聚合物，與導電性粒子5。當 電路連接材料1被加熱時’藉由環氧樹脂的交聯而在樹脂 層3中形成交聯構造，形成電路連接材料丨之硬化物。 以下說明電路連接材料〗的各構成材料。 (a)環氧樹脂 ⑷作爲環氧樹脂’雙@ A、F、AD帛的雙關環氧 -9 - 201144404 丙基醚之雙酚型環氧樹脂及苯酚酚醛清漆或甲酚酣醒清'漆 所衍生的環氧酚醛清漆樹脂係代表的環氧樹脂。作爲其它 例，可舉出具有萘骨架的萘型環氧樹脂、環氧丙基胺型環 氧樹脂、環氧丙基酯型環氧樹脂、脂環式環氧樹脂及雜環 式環氧樹脂。此等可爲單獨或混合2種以上使用。 於上述環氧樹脂之中，雙酚型環氧樹脂爲分子量不同 的等級，由於可廣泛取得，可任意設定黏著性或反應性等 而較佳。於雙酣型環氧樹脂之中，特佳爲雙酚F型環氧樹 脂。雙酚F型環氧樹脂的黏度係低，藉由與苯氧樹脂的組 合使用，可容易地在廣範圍中設定電路連接材料的流動 性。又，雙酚F型環氧樹脂亦具有容易對電路連接材料賦 予良好的黏著性之優點。 爲了防止電子遷移，較佳爲使用雜質離子（Na+、Cr 等）濃度或水解性氯爲300ppm以下的環氧樹脂。 (b)潛在性硬化劑 (b)作爲潛在性硬化劑，只要是可使環氧樹脂硬化者 即可。又，潛在性硬化劑係可爲與環氧樹脂反應而倂入交 聯構造中的化合物，也可爲促進環氧樹脂的硬化反應之觸 媒型硬化劑。亦可倂用兩者。 作爲觸媒型硬化劑，例如可舉出促進環氧樹脂的陰離 子聚合之陰離子聚合型潛在性硬化劑，及促進環氧樹脂的 陽離子聚合之陽離子聚合型潛在性硬化劑。 作爲陰離子聚合型潛在性硬化劑，例如可舉出咪唑 系、醯肼系、三氟硼-胺錯合物、胺醯亞胺、聚胺的鹽、 -10- 201144404 氰胍及此等的改性物。咪唑系的陰離子聚合型潛在性硬化 劑例如係將咪唑或其衍生物附加於環氧樹脂而形成。 作爲陽離子聚合型潛在性硬化劑，例如較佳爲經由能 量線照射而使環氧樹脂硬化的感光性鑰鹽（主要使用芳香 族重氮鑰鹽、芳香族锍鹽等）。又，作爲能量線照射以外 經由加熱活性化而使環氧樹脂硬化者，有脂肪族鏑鹽。此 種硬化劑由於具有速硬化性的特徵而較佳。 此等潛在性硬化劑經聚胺甲酸酯系、聚酯系等的高分 子物質、鎳、銅等的金屬薄膜及矽酸鈣等的無機物被覆而 成爲微膠囊化者，由於能延長可使用時間而較佳。 相對於100質量份的（a)環氧樹脂而言，陰離子聚合 型潛在性硬化劑的配合量較佳爲30〜60質量份，更佳爲 40〜55質量份。若未達30質量份，則電路連接材料的硬 化收縮所致的對被附體之緊固力係降低。結果，不保持導 電粒子5與電路電極之接觸，可靠性試驗後的連接電阻有 變容易上升的傾向。若超過60質量份，則由於緊固力變 過強’電路連接材料的硬化物中的內部應力變大，有容易 導致黏著強度的降低之傾向。 相對於100質量份的（a)環氧樹脂而言，陽離子聚合 型潛在性硬化劑的配合量較佳爲3〜1 5質量份，更佳爲5 〜1 0質量份。若未達3質量份，則電路連接材料的硬化 收縮所致的對被附體之緊固力係.降低。結果，不保持導電 粒子5與電路電極之接觸，可靠性試驗後的連接電阻有變 容易上升的傾向。若超過1 5質量份，則由於緊固力變過 -11 - 201144404 強，電路連接材料的硬化物中的內部應力變大，有容易導 致黏著強度的降低之傾向。 (C)薄膜形成材 所謂的薄膜形成材，就是將液狀物固形化而使構成組 成物成爲薄膜形狀時，使該薄膜的操作成爲容易，賦予不 容易裂開、破裂或發黏的機械特性等，可在通常的狀態 (常溫常壓）下作爲薄膜操作者。 作爲（C)薄膜形成材，例如可舉出苯氧樹脂、聚乙烯 縮甲醛樹脂、聚苯乙烯樹脂、聚乙烯縮丁醛樹脂、聚酯樹 脂、聚醯胺樹脂、二甲苯樹脂、聚胺甲酸酯樹脂。於此等 之中’從黏著性、相溶性、耐熱性及機械強度優異來看， 較佳爲苯氧樹脂。 苯氧樹脂係藉由使二官能酚類與環氧氯丙烷反應直到 成爲高分子量爲止，或使二官能環氧樹脂與二官能酚類進 行聚加成反應而得之樹脂。苯氧樹脂例如可藉由使1莫耳 的2官能性酚類與0.985〜1.015莫耳的環氧氯丙烷在鹼 金屬氫氧化物等的觸媒之存在下，於非反應性溶劑中，在 40〜120°C的溫度進行反應而得。 又，作爲苯氧樹脂，從樹脂的機械特性或熱的特性之 觀點來看，特佳爲使2官能性環氧樹脂與2官能性酚類的 配合當量比成爲環氧基/酚性羥基=1/0.9〜1/1.1，在鹼金 屬化合物、有機磷系化合物' 環狀胺系化合物等的觸媒之 存在下，於沸點爲120°C以上的醯胺系、醚系、酮系、內 酯系、醇系等之有機溶劑中，在反應固體成分爲50質量 -12- 201144404 %以下的條件下，加熱至5 0〜2 0 (TC，使進行聚加成反應 而得者。 作爲2官能性環氧樹脂，可使用雙酚a型環氧樹 脂、雙酚F型環氧樹脂、雙酚AD型環氧樹脂、雙酚S型 環氧樹脂。2官能性酚類係具有2個酚性羥基者，例如可 舉出氫醌類、雙酚A、雙酚F'雙酚AD、雙酌s等之雙 酚化合物。 苯氧樹脂亦可經由自由基聚合性的官能基所改性。苯 氧樹脂可爲單獨1種或混合2種以上使用。 從製膜性等的觀點來看，上述（c)成分的重量平均分 子量較佳爲1 0000以上。惟，熱塑性樹脂的重量平均分子 量若爲1000000以上，則與其它成分的混合有變困難的傾 向。再者，本案所規定的重量平均分子量係指藉由以下的 條件之凝膠滲透層析法（GPC)，以標準聚苯乙烯的校正曲 線爲基礎所決定之値。 < GPC條件> 使用的機器：日立L-6000型（日立製作所（股）製） 管柱：Gelpack G L-R420 + G elpack GL-R43 0 + G elp ack GL-R440(計3支）（日立化成工業（股）製） 溶析液：四氫呋喃 測定溫度：40°C 流量：1 .75mL/分鐘 檢測器：L- 3 3 00RI(日立製作所（股）製） -13- 201144404 (C)成分的配合s ’相對於（a)及（b)成分的合計10〇質 量份而Η ’較佳爲50〜140質量份，更佳爲70〜120質量 份。 (d)含有以羧酸乙烯酯作爲單體單位之熱塑性聚合物 .作爲（d)成分的熱塑性聚合物，只要是含有以羧酸乙 烯酯作爲單體單位者’則沒有特別的限定。本發明的電路 連接材料係在暫時性壓著步驟的指定之加熱溫度下，藉由 將（d)成分熔融（或軟化）而顯示黏著性，可對被附體容易地 暫程性黏著。又’以接著性提高爲目的，將後述的有 機微粒子加到電路連接材料時，黏著性會稍微降低而使暫 時壓著性降低。於特別的情況下，（d)成分係可具有能使 電路連接材料的黏著性與接著性並存之機能。 作爲羧酸乙烯酯，例如可舉出乙酸乙烯酯、丙酸乙烯 酯、丁酸乙烯酯、己酸乙烯酯、辛酸乙烯酯、月桂酸乙烯 酯、肉豆蔻酸乙烯酯、棕櫚酸乙烯酯、硬脂酸乙烯酯、環 己基羧酸乙烯酯、三甲基乙酸乙烯酯、辛酸乙烯酯及苯甲 酸乙烯酯。其中，從與其它單體的共聚合性之觀點來看， 較佳爲乙酸乙烯酯、丙酸乙烯酯、丁酸乙烯酯、己酸乙烯 酯、辛酸乙烯酯及月桂酸乙烯酯，更佳爲乙酸乙烯酯。 (d)熱塑性聚合物由於含有極性單體單位的羧酸乙烯 酯同時含有以非極性單體單位的烯烴作爲單體單位，故 可更有效且確實地展現暫時黏著性優異的本發明之效果。 作爲烯烴’可例示乙烯及丙烯》 又，於不脫離本發明的低溫暫時壓著性優異之效果的 -14 - 201144404 範圍內，上述熱塑性聚合物亦可含有與羧酸乙烯酯可共聚 合的單體作爲單體單位。作爲如此的單體，例如可舉出羧 酸烯丙酯、（甲基）丙烯酸烷酯，具體地可例示醋酸烯丙 酯、（甲基）丙烯酸甲酯及（甲基）丙烯酸乙酯。 以構成（d)成分的全部單體100質量％爲基準，羧酸乙 烯酯的比例較佳爲20質量％以上且未達60質量％，更佳 爲· 25質量％以上且未達55質量％，尤佳爲30質量％以上 且未達50質量％。若爲60質量％以上，則在室溫下樹脂 展現黏著性，於形成電路連接材料的捲繞體之際，會轉印 至支撐薄膜的背面，有作業性有差的傾向。若未達20質 量％，則樹脂本身的熔點上升，於暫時性壓著步驟中不充 分熔融，有難以得到黏著力的提高效果之傾向。 從暫時性壓著時對被附體的黏著性優異，同時支撐薄 膜的剝離性優異來看，（d)熱塑性聚合物較佳爲含有烯烴-羧酸乙烯酯共聚物，從與構成電路連接材料的其它樹脂成 分之相溶性的觀點來看，較佳爲含有乙烯-乙酸乙烯酯共 聚物。 (d)成分係重量平均分子量（以下稱爲「Mw」）較佳爲 40000 〜150000，更佳爲 60000 〜130000，尤佳爲 70000 〜 1 20000。若超過1 50000，則在泛用溶劑的甲苯、乙酸乙 酯或甲基乙基酮等中之溶解性有降低的傾向，若未達 40000，則樹脂層3的內聚力降低而黏著力有降低的傾 向。 (d)萌分係熔點較佳爲30°C以上且未達80°C，更佳爲 -15- 201144404 30〜70°C。熔點未達30°C時，由於在暫時性壓著時變容易 誘發樹脂的滲出，作業性有降低的傾向。另一方面，熔點 爲80°C以上時，難以達成低溫的暫時壓著性優異之本發明 的效果。 (d) 成分的配合量，相對於（a)及（c)成分的合計100質 量份而言，較佳爲0.5〜5質量份，更佳爲1〜3質量份。 (d)成分的配合量未達0.5質量份時，有難以達成低溫的暫 時壓著性優異之本發明的效果的傾向，超過5質量份時， 連接可靠性或連接外觀有降低的傾向。 (e) 有機微粒子 於本發明的電路連接材料中，按照需要亦可配合有機 微粒子。有機微粒子係具有作爲具應力緩和性的耐衝撃緩 和劑之機能。電路連接材料藉由含有有機微粒子當作（E) 成分’可進一步提高暫時性壓著後的正式連接中與各種連 接構件的黏著性。特別地，當爲使用陽離子聚合型潛在性 硬化劑當作（b)成分的電路連接材料時，由於對被附體的 黏著強度有比使用陰離子聚合型潛在性硬化劑時還稍差的 傾向，故藉由添加（e)成分可改善黏著性。 作爲有機微粒子，例如可舉出含有丙烯酸樹脂、聚矽 氧樹脂、丁二烯、聚酯、聚胺甲酸酯、聚乙烯縮丁醛、聚 芳酯 '聚甲基丙烯酸甲酯、丙烯酸橡膠、聚苯乙烯、 NBR、SBR、聚矽氧改性樹脂等作爲成分的共聚物。從提 高黏著性的觀點來看’作爲有機微粒子，較佳爲使用（甲 基）丙烯酸烷酯-丁二烯-苯乙烯共聚物、（甲基）丙烯酸烷 -16- 201144404 酯-聚矽氧共聚物、聚矽氧-(甲基）丙烯酸共聚物、聚砂氧 與（甲基）丙烯酸的複合物、（甲基）丙烯酸烷酯-丁二嫌-苯 乙烯與聚矽氧的複合物及（甲基）丙烯酸烷基與聚矽氧的複 合物。又，作爲（E)成分，亦可使用具有芯殼型的構造且 芯層與殼層的組成爲不同的有機微粒子。作爲芯殻型的有 機微粒子，具體地可舉出以聚矽氧-丙烯酸橡膠作爲芯而 將丙烯酸樹脂接枝的粒子，於丙烯酸共聚物接枝有丙烯酸 樹脂的粒子。 配合（e)成分時，其配合量相對於1 〇 〇質量份的（a)成 分而言較佳爲20〜50質量份，更佳爲30〜40質量份。藉 由使（e)成分的配合量成爲上述範圍，有容易調整支撐薄 膜對樹脂層3的被附體的黏著性與剝離性的平衡之傾向。 再者，電路連接材料1(樹脂層3)亦可含有填充材、 軟化材、促進劑、防老化劑、著色劑、難燃化劑、搖變 劑、偶合劑、酚樹脂、蜜胺樹脂及異氰酸酯類。含有塡充 材時，由於得到連接可靠性等的提高而較佳。塡充材的最 大直徑只要是未達導電性粒子5的粒徑則可使用，配合量 較佳爲5〜60體積％的範圍。若超過60體積％，則可靠性 提高的效果係飽和。作爲偶合劑，從黏著性的提高之點來 看，較佳爲具有乙烯基、丙烯醯基、胺基、環氧基或異氰 酸酯基的化合物。 作爲導電性粒子5，可舉出含有Au、Ag、Ni、Cu、 焊錫等的金屬之金屬粒子，以及碳粒子。導電性粒子5較 佳爲由Au、Ag、鉑族的貴金屬類，更佳爲由Au構成其 -17- 201144404 表層。由於導電性粒子5的表層係由此等金屬所構成，可 得到充分的使用期限。導電性粒子5亦可N i等的過渡金 屬類之表面經Au等的貴金屬類所被覆者。或者，也可於 非導電性的玻璃、陶瓷、塑膠等上被覆前述導通層等而形 成’亦可使最外層成爲貴金屬類。當最外層爲貴金屬類， 核體爲塑膠或熱熔融金屬的被覆粒子時，由於具有加熱加 壓所致的變形性，故在連接時與電極的接觸面積增加，可 靠性提高而較佳。 導電性粒子的配合量係可按照用途而適宜設定，通常 相對於電路連接材料中的導電性粒子以外的成分100體積 份而言爲0.1〜30體積份的範圍。爲了防止過剩的導電性 粒子所致的鄰接電路之短路等，更佳爲0.1〜10體積份。 本發明的電路連接材料係不受圖1所示的構成所限 定。例如，電路連接材料亦可具有由組成不同的2層以上 之層所構成的層合構造。此時，潛在性硬化劑與導電性粒 子亦可各自含於不同的層。藉此，電路連接材料的保存安 定性（使用期限）升高。又，電路連接材料亦可不含有導電 性粒子。 本發明的電路連接材料例如係適用於形成如半導體晶 片、電阻體晶片及電容器晶片等的晶片零件、以及如印刷 配線板之具有"或2個以上的電路電極（連接端子）之電路 構件彼此連接的連接結構物。 圖2係顯示連接結構物之一實施形態的截面圖。圖2 中所示的電路構件之連接結構物丨〇〇係具備：具有第一之 -18- 201144404 基板11及形成其主面上之第一之電路電極13的第一之電 路構件10;具有第二之基板21及形成於其主面上之第二 之電路電極23，以第二之電路電極23與第一之電路電極 13呈對向方式所配置的第二之電路構件20;及，介於第 —之電路構件10及前述第二之電路構件20之間的連接部 la。對向的第一之電路電極13與第二之電路電極23係經 電連接。 連接部1 a係將電路連接材料1硬化所形成的硬化 物，由已硬化的樹脂層3 a與導電性粒子5所構成。連接 部la係以電連接對向的第一之電路電極13與第二之電路 電極23之方式，黏合第一之電路構件1〇與第二之電路構 件20。對向的第一之電路電極13與第二之電路電極23 係經由導電粒子5而電連接》再者，當連接部不含有導電 性粒子時，可藉由直接黏合第一之電路電極13與第二之 電路電極23而電連接。 第一之基板11係含有由聚酯對苯二甲酸酯、聚醚 颯、環氧樹脂' 丙烯酸樹脂及聚醯亞胺樹脂所成之群中選 出的至少一種樹脂之樹脂薄膜。第一之電路電極13係由 具有能作爲電極機能之程度的導電性之材料（較佳爲由 金、銀、錫、鉑族的金屬及銦-錫氧化物所成之群中選出 的至少一種）所形成。 第二之基板21係玻璃基板。第二之電路電極較佳爲 由透明導電性材料所形成。作爲透明導電性材料，典型上 使用ITO。 -19- 201144404 電路構件之連接結構物1 00，例如係可藉由依順序層 合第一之電路構件10、上述薄膜狀的電路連接材料1與 第二之電路構件20，以使得第一之電路電極13與第二之 電路電極23呈對峙，將所得之層合體加熱及加壓，以第 —之電路電極13與第二之電路電極23被電連接的方式， 連接第一之電路構件10與第二之電路構件20之方法而獲 得。 於此方法中，可首先於使支撐薄膜上所形成的薄膜狀 之電路連接材料1貼合在第二之電路構件20上之狀態 下，進行加熱及加壓而暫時性黏著電路連接材料1，剝離 支撐薄膜後，邊定位電路電極邊載置第一之電路構件 10’而準備層合體。再者，爲了防止連接之際的加熱所產 生的揮發成分對連接的影釋，於連接步驟之前較佳爲將電 路構件預先加熱處理。 圖3係藉由示意截面圖顯示使用電路連接材料的暫時 性壓著之方法的一實施形態之步驟圖。 於本實施形態中，首先準備薄膜狀黏著劑 2(圖 3(a))，其具備支撐薄膜7，與設置於該支撐薄膜7之一側 面上的由薄膜狀的電路連接材料1所形成之黏著劑層 lb ° 其次，朝向第二之電路構件20之形成有電路電極23 的面，載置黏著劑層1 b之側，於貼合的狀態下進行加熱 及加壓，而將黏著劑層1 b暫程性黏著於第二之電路構件 20(圖3(b))。暫程性黏著的溫度爲80°C以下，較佳爲70t -20- 201144404 以下’更佳爲60°C以下。暫程性黏著溫度的下限値係沒有 特別的限定’從生產性的觀點來看爲50<t左右。暫程性黏 著的時間係按照黏著溫度而適宜調整，較佳爲進行〇.丨〜5 秒，更佳爲0.5〜3秒。 接著，剝離支撐薄膜7 ’而將黏著劑層1 b轉印至第 二之基板21的主面上（圖3(c))。 如此地，於黏著劑層1 b暫時性壓著於第二之電路構 件20上後’以第一之電路電極13朝向第二之電路構件 2〇之側的方式，將第一之電路構件1〇載置於黏著劑層lb 上’將層合體加熱及加壓而得到連接結構物1 0 0。 將上述層合體加熱及加壓的條件，係按照電路連接材 料中的黏著劑組成物之硬化性等來適宜調整，而使得電路 連接材料進行硬化，得到充分的黏著強度。 藉由黏著劑層lb的加熱，於將第一之電路電極13與 第二之電路電極23之間的距離充分減小的狀態下，黏著 劑層1 b進行硬化，經由連接部1 a而強固地連接第一之電 路構件1 〇與第二之電路構件20。 藉由黏著劑層1 b的硬化而形成連接部1 a，得到如圖 2所示的連接結構物1 〇〇。再者，連接的條件係按照所使 用的用途、電路連接材料、電路構件來適宜選擇。 本發明係不受上述實施形態所限定。本發明在不脫離 其要旨的範圍內，各式各樣的變形係可能。例如，構成連 接結構物的電路構件所具有之基板’係可爲矽及鎵/砷等 的半導體晶片，以及玻璃、陶瓷、玻璃/環氧複合物，以 -21 - 201144404 及塑膠等之絕緣基板。 實施例 以下，以實施例爲基礎來具體說明本發明，惟本發明 不受此所限定。 本實施例中的構成電路連接材料之各成分係如以下》 「EP_4〇10S」：環氧丙烷變性環氧樹脂（環氧當量 3 3 0 〜3 90，ADEKA 製） 「YL98 3 U」：雙酚F型環氧樹脂（環氧當量165〜 175，日本環氧樹脂製） 「BPA3 2 8」：丙烯酸微粒子分散型環氧樹脂（含有17 質量％的丙烯酸微粒子，環氧當量220〜240，日本觸媒製） 「EP- 1 03 2H60」：甲酚酚醛清漆型環氧樹脂（環氧當 量 163 〜1 75) 「HX3 94 1 HP」：含有陰離子聚合型潛在性硬化劑的 環氧樹脂（含有35質量％的咪唑系微膠囊型硬化劑之雙酚 F型及A型環氧樹脂混合類型，環氧當量160〜190，旭 化成化學製） 「ZX 1 3 5 6-2」：雙酚 A.F共聚合型苯氧樹脂 (Mw50000，東都化成製） 「PKHC」：雙酚 A型苯氧樹脂（Mw45000，INCHEM 公司製） 「丙烯酸橡膠A」：：40質量份的丙烯酸丁酯-30質 量份的丙烯酸乙酯-30質份的丙烯腈-3質量份的甲基丙 -22- 201144404 烯酸環氧丙酯之共聚物（MW約85萬） 「EXL-2655」：有機微粒子（由丁二烯-苯乙烯-甲基 丙烯酸酯共聚物所形成的芯殼聚合物，Rohm and Haas公 司製） 「EV40W」：乙烯-乙酸乙烯酯共聚物（乙酸乙烯酯含 有率41%’ MW80000’熔點40°C，熔體流速65g/10分 鐘，三井·杜邦化學製） 「EV150」：乙烯-乙酸乙烯酯共聚物（乙酸乙烯酯含 有率33% ’熔點 6 1°C ，熔體流速30g/10分鐘， Mwl20000，三井·杜邦化學製） 「AUL-7 04」：於平均粒徑4μιη的聚苯乙烯球狀粒子 之表面上設有0.1 μιη的Ni層及Au層之導電性粒子（積水 化學製） 「SH6〇4〇」：矽烷偶合劑（γ_環氧丙氧基丙基三甲氧 基砂院，東麗•道康寧.聚砂氧（股）製） 「SI-60LA」：陽離子聚合型潛在性硬化劑（芳香族锍 鹽，三新化學製） (實施例1) 配合 30質量份的「EP-4010S」、15質量份的 「YL98 3U」、50質量份（以不揮發份換算爲20質量份）的 「ΖΧ1356-2」之甲苯/乙酸乙酯（ = 50/50)40質量％溶液、50 質量份（以不揮發份換算爲20質量份）的「PKHC」之甲苯/ 乙酸乙酯（ = 50/50)40質量％溶液、15質量份的「EXL- -23- 201144404 265 5」、10質量份（以不揮發份換算爲2質量份）的 「EV40W」之20質量。/。甲苯溶液、4質量份的r AUL-704」、1質量份「δΗ6〇4〇」（γ-環氧丙氧基丙基三甲氧基 矽烷’東麗·道康寧.聚矽氧（股）製）及3質量份的「SI-60LA」’而得到混合溶液。用塗佈機將所得之混合溶液 塗佈於PET薄膜上，藉由7〇〇c 1〇分鐘的熱風乾燥，而得 到黏著劑層的厚度爲20μπι的薄膜狀之電路連接材料。 (實施例2) 除了以 20質量份的「YL9 83U」、30質量份的 「ΒΡΑ3 2 8」、125質量份（以不揮發份換算爲5〇質量份） 「PKHC」之甲苯/乙酸乙酯（ = 50/50)40質量％溶液、10質 量份（以不揮發份換算爲2質量份）的「EV40W」之20質 量％甲苯溶液、4質量份的「AUL-704」、1質量份的 「SH6040」及3質S份的「SI-60LA」配合各成分以外， 與實施例1同樣地得到薄膜狀之電路連接材料。 (Η施例3) 除了使用「EV150」代替「EV40W」以外，與實施例 1同樣地得到薄膜狀之電路連接材料。 (實施例4) 除了以5質量份的「ΕΡ- 1 03 2Η60」、35質量份的 ΗΧ3941ΗΡ」、50質量份（以不揮發份換算爲20質量份） -24- 201144404 的「PKHC」之甲苯/乙酸乙酯（ = 50/50)40質量％溶液、200 質量份（以不揮發份換算爲20質量份）的「丙烯酸橡膠 A」之甲苯/乙酸乙酯（ = 50/50)10質量％溶液、20質量份的 「EXL-265 5」、10質量份（以不揮發份換算爲2質量份） 的「EV40W」之20質量％甲苯溶液、4質量份的「AUL-7 04」及1質量份的「SH6〇4〇」配合各成分以外，與實施 例1同樣地得到薄膜狀之電路連接材料。 (實施例5) 除了以10質量份的「BPA328」、40質量份的 「HX3 94 1 HP」、37·5質量份（以不揮發份換算爲15質量 份）的「PKHC」之甲苯/乙酸乙酯（ = 50/50)40質量％溶液、 350質量份（以不揮發份換算爲35質量份）的「丙烯酸橡膠 A」之甲苯/乙酸乙酯（ = 50/50)10質量％溶液、1〇質量份 (以不揮發份換算爲2質量份）的「EV40W」之20質量％甲 苯溶液、4質量份的「AUL_7〇4」及 1質量份的 「SH6 040」配合各成分以外，與實施例i同樣地得到薄 膜狀之電路連接材料。 (比較例1) 除了不添加「EV40W」以外，與實施例1同樣地得到 薄膜狀之電路連接材料。 (比較例2)。 •25- 201144404 除了不添加「EV40W」以外，與實施例2同樣地得到 薄膜狀之電路連接材料。 (比較例3) 除了不添加「E V 4 0 W」以外，與實施例4同樣地得到 薄膜狀之電路連接材料。 (比較例4)。 除了不添加「EV40W」以外，與實施例5同樣地得到 薄膜狀之電路連接材料。 表1中以質S份（不揮發份換算）顯示實施例所製作的 電路連接材料之組成，表2中以質量份（不揮發份換算）顯 示比較例所製作的電路連接材料之組成。 [表1] 實施例1 實施例2 實施例3 實施例4 實施例5 環氧樹脂 EP-4010S 30 一 30 — — YL983U 15 20 15 一 — BPA328 — 30 — - 10 EP-1032H60 — — — 5 一 含有潛在性硬化劑 的環氣樹脂 HX3941HP — 一 - 35 40 薄膜形成劑 2X-1356-3 20 — 20 一 - PKHC 20 50 20 20 15 丙烯酸橡膠A - 一 一 20 35 有機微粒子 EXL2655 15 - 15 20 - 潛在性硬化劑 SI-60LA 3 3 3 - — 烯烴-羧酸乙烯酯 共聚物 EVA40W 2 2 — 2 2 EVA150 一 - 2 一 一 偶合材 SH—6040 1 1 1 1 1 導電性粒子 AUL-704 4 4 4 4 4 -26- 201144404 [表2] 比較例1 比較例2 比較例3 比較例4 環氧樹脂 EP-4010S 30 — 一 — YL983U 15 20 — 一 巳PA328 — 30 一 10 EP-1032H60 — 一 5 — 含有潛在性硬化劑 的環氧樹脂 HX3941HP — — 35 40 薄膜形成劑 ZX-1356-3 20 — — 一 PKHC 20 50 20 15 丙烯酸橡膠A — — 20 35 有機微粒子 EXL2655 15 — 20 — 潛在性硬化劑 SI-60LA 3 3 — — 烯烴-羧酸乙烯酯 共聚物 EVA40W — — — — EVA150 — — — — 偶合材 SH-6040 1 1 1 1 導電性粒子 AUL-704 4 4 4 4 [暫時黏著性之評價] 將上述薄膜狀之電路連接材料的黏著劑層面，全面地 在具有氧化銦（ITO)的薄層之厚度0.7mm的玻璃板上，各 自以6(TC、70°C、8 0°C在IMPa的條件下，暫時性黏著1 秒或3秒後，剝離PET薄膜，評價暫時黏著性。將黏著 劑層均勻地轉印至ITO上之狀態當作「A」，將黏著劑層 部分地轉印至ITO上之狀態當作^ B」，將黏著劑層完全 沒有轉印至ITO上的狀態當作「C」。表3中顯示實施例 的評價結果，表4中顯示比較例的評價結果。 -27- 201144404BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit connecting material, a connecting structure using the same, and a method of temporarily pressing. [Prior Art] As the adhesive for a semiconductor element or a liquid crystal display, a thermosetting resin such as an epoxy resin which is excellent in adhesion and high in reliability is used (for example, see Patent Document 1). As a constituent component of the above-mentioned adhesive, a curing agent such as an epoxy resin or a phenol resin reactive with an epoxy resin, and a thermal latent catalyst for promoting the reaction between the epoxy resin and the curing agent are generally used. The thermal latent catalyst determines the hardening temperature and the hardening rate of the adhesive. From the viewpoint of storage stability at room temperature and curing speed at the time of heating, various compounds are used. In the meantime, a radical-curable adhesive composed of a radical polymerizable compound such as an acrylate derivative or a methacrylate derivative and a peroxide of a radical polymerization initiator has been recently focused (for example, see Patent Document 2) ). The radical-curable adhesive can be hardened at a low temperature for a short period of time, but the adhesiveness tends to be affected by the surface state of the member to be joined. On the other hand, as a circuit connecting material which can be adhered at a relatively low temperature and for a short period of time, a cationic polymerization type adhesive using an epoxy resin has been developed and put into practical use (for example, refer to Patent Document 3). 5-201144404 Patent Document 1: Japanese Laid-Open Patent Publication No. Hei No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. However, in the past, compared with the radical hard adhesive, the adhesive agent using an epoxy resin tends to be degraded when the connecting member is temporarily adhered, and it is particularly desirable to temporarily and at a low temperature for a short period of time. Therefore, the object of the present invention is to provide a II-way connecting material which is excellent in the low-temperature and temporary compressive properties of the connecting member, a structure using the same, and a method of temporarily pressing. Means for Solving the Problems The present invention provides a circuit connecting material which is a circuit connecting material electrically connecting opposite electrodes to each other, which comprises (a) an epoxy latent hardener, (c) a film forming material, and (d) A thermoplastic polymer containing carboxylic acid B as a monomer unit. The circuit connecting material of the present invention has the above-described configuration, and is excellent in low-temperature and short-time temporary crimping of the joint. Here, the term "temporary pressing" refers to the step of transferring the adhesive layer formed of the circuit material formed on the support film to the circuit member of the attached body. In the above-described step, the heating of the adhesive layer is usually controlled by heating and pressurization, and the bonding of the (b) olefin-bonded material to the upper resin -6 - 201144404 component is melted. After adhering to the circuit member, the support film is peeled off to transfer the adhesive layer to the circuit member. However, when an epoxy resin-based circuit is connected to a material, it is hardened by heat at the time of temporary pressing, so the heating temperature is limited. Therefore, in the circuit connecting material, the adhesion to the attached body and the peeling property by the supporting film are required to coexist. Therefore, the circuit connecting material of the present invention can be hardened by epoxy resin at the time of temporary pressing by the epoxy resin containing the component (a) together with the latent hardener as the component (b). Good connectivity is shown in the formal connection. On the other hand, since it is necessary to melt a certain amount of the resin component by heating and temporarily adhere to the circuit member, the thermoplastic polymer containing the vinyl carboxylate as a monomer unit can be used as the component (d). The component (d) is melted by the heating temperature at the time of temporary pressing, and is temporarily adhered to the circuit member. The above vinyl carboxylate is preferably vinyl acetate. Thereby, the circuit connecting material can further improve the low temperature and short-time temporary pressure of the connecting member. Further, in the circuit connecting material of the present invention, the latent curing agent is preferably a cationic polymerization type latent curing agent, and a cationic polymerization type latent curing agent, from the viewpoint of lowering the temperature at the time of the main connection and shortening the time. The agent is more preferably an aromatic sulfonium salt. Further, from the viewpoint of improving the adhesion to various connecting members, the circuit connecting material of the present invention preferably further contains organic fine particles. Further, the present invention provides a connection structure characterized by comprising: a first circuit member having a first substrate and a first circuit electrode formed on a main surface of the substrate; and a substrate having a second And a second circuit electrode formed on the main surface of the substrate 201144404, the second circuit electrode and the first circuit electrode are disposed in an opposite manner, the second circuit electrode and the first circuit The electrode is a second circuit member electrically connected; and a connection portion between the first circuit member and the second circuit member; wherein the connection portion is a cured product of the above-described circuit connection material of the present invention. The connection structure is formed into a connection portion by using a circuit connecting material having a low temperature and a short temporary compressive property to form a connection structure having a stable quality. Furthermore, the present invention provides a temporary crimping method comprising: providing a film-like adhesive having a support film and an adhesive layer formed of the circuit connecting material of the present invention provided on one side of the support film; a step of temporarily adhering a circuit member having a substrate and a circuit electrode formed on a main surface of the substrate at 80 ° C or lower: and, after temporarily adhering, peeling the support film to form an adhesive layer The step of transferring to the main surface of the substrate. According to the above method of temporary pressing, since the adhesive layer can be transferred to the circuit member at a low temperature and for a short period of time, the connection structure having a stable adhesive force can be produced with high work efficiency. Advantageous Effects of Invention According to the present invention, it is possible to provide a circuit connecting material which is excellent in low-temperature and short-time temporary crimping property of a connecting member, a connecting structure using the same, and a method of temporarily pressing. [Embodiment] Mode for Carrying Out the Invention Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the drawings, as needed. However, the present invention is not limited by the following embodiments. In the drawings, the same elements are denoted by the same reference numerals, and the repeated description is omitted. Further, the positional relationship such as up, down, left, and right is based on the positional relationship shown on the drawing, unless otherwise specified. Furthermore, the dimensional ratio of the drawings is not limited by the ratios shown. In addition, "(meth)acrylic acid" in this specification means "acrylic acid" and the corresponding "methacrylic acid". The circuit connecting material of the present embodiment is an adhesive for electrically connecting circuit electrodes to each other. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing an embodiment of a circuit connecting material. The circuit connecting material 1 shown in Fig. 1 is composed of a resin layer 3 and a plurality of conductive particles 5 dispersed in the resin layer 3, and has a film-like shape. The resin layer 3 contains (a) an epoxy resin ' (b) a latent curing agent, (c) a film forming material, and (d) a thermoplastic polymer containing a vinyl carboxylate as a monomer unit. In other words, the circuit connecting material contains (a) an epoxy resin, (b) a latent curing agent, (c) a film forming material, and a thermoplastic polymer containing a vinyl carboxylate as a monomer unit, and the conductive particles 5 . When the circuit connecting material 1 is heated, a crosslinked structure is formed in the resin layer 3 by crosslinking of the epoxy resin to form a cured product of the circuit connecting material. The constituent materials of the circuit connecting material will be described below. (a) Epoxy resin (4) as epoxy resin 'double @ A, F, AD帛 pungent epoxy-9 - 201144404 propyl ether bisphenol epoxy resin and phenol novolac or cresol 酣 清 clear 'lacquer The epoxy resin represented by the epoxy novolac resin is derived. Other examples include a naphthalene type epoxy resin having a naphthalene skeleton, a epoxypropylamine type epoxy resin, a glycidyl ester type epoxy resin, an alicyclic epoxy resin, and a heterocyclic epoxy resin. . These may be used alone or in combination of two or more. Among the above epoxy resins, the bisphenol type epoxy resin has a different molecular weight, and since it can be widely obtained, adhesion or reactivity can be arbitrarily set, and it is preferable. Among the bismuth-type epoxy resins, a bisphenol F-type epoxy resin is particularly preferred. The bisphenol F type epoxy resin has a low viscosity, and by using it in combination with a phenoxy resin, the fluidity of the circuit connecting material can be easily set in a wide range. Further, the bisphenol F type epoxy resin also has an advantage of easily imparting good adhesion to the circuit connecting material. In order to prevent electron migration, it is preferred to use an epoxy resin having a concentration of impurity ions (Na+, Cr, etc.) or hydrolyzable chlorine of 300 ppm or less. (b) latent curing agent (b) as a latent curing agent, as long as it can cure the epoxy resin. Further, the latent curing agent may be a compound which reacts with the epoxy resin to enter the crosslinking structure, or may be a catalyst-type curing agent which accelerates the curing reaction of the epoxy resin. You can also use both. Examples of the catalyst-type curing agent include an anionic polymerization type latent curing agent that promotes anion polymerization of an epoxy resin, and a cationic polymerization type latent curing agent that promotes cationic polymerization of an epoxy resin. Examples of the anionic polymerization type latent curing agent include imidazole-based, fluorene-based, trifluoroborane-amine complex, amine sulfimine, and polyamine salts, and -10-201144404 cyanoguanidine and the like. Sex. The imidazole-based anionic polymerization type latent curing agent is formed, for example, by adding an imidazole or a derivative thereof to an epoxy resin. As the cationic polymerization type latent curing agent, for example, a photosensitive key salt which hardens an epoxy resin by irradiation with an energy ray (mainly using an aromatic diazo salt or an aromatic sulfonium salt) is preferable. Further, as the epoxy resin is cured by heating activation other than the energy ray irradiation, there is an aliphatic sulfonium salt. Such a hardener is preferred because of its rapid hardening characteristics. These latent curing agents are coated with a polymer material such as a polyurethane or a polyester, a metal thin film such as nickel or copper, or an inorganic material such as calcium citrate to form a microencapsulated one. Time is better. The amount of the anionic polymerization type latent curing agent is preferably from 30 to 60 parts by mass, more preferably from 40 to 55 parts by mass, per 100 parts by mass of the (a) epoxy resin. If it is less than 30 parts by mass, the fastening force to the attached body due to the hardening shrinkage of the circuit connecting material is lowered. As a result, the contact resistance between the conductive particles 5 and the circuit electrode is not maintained, and the connection resistance after the reliability test tends to increase. When the amount is more than 60 parts by mass, the fastening force becomes too strong. The internal stress in the cured product of the circuit-connecting material increases, which tends to cause a decrease in the adhesive strength. The amount of the cationically polymerizable latent curing agent is preferably from 3 to 15 parts by mass, more preferably from 5 to 10 parts by mass, per 100 parts by mass of the (a) epoxy resin. If it is less than 3 parts by mass, the fastening force to the attached body due to the hardening shrinkage of the circuit connecting material is lowered. As a result, the contact between the conductive particles 5 and the circuit electrodes is not maintained, and the connection resistance after the reliability test tends to increase. When the amount is more than 15 parts by mass, the internal stress of the cured material of the circuit-connecting material is increased due to the strong tightening force of -11 - 201144404, which tends to cause a decrease in the adhesive strength. (C) The film-forming material is a film-forming material in which the liquid material is solidified and the constituent material is formed into a film shape, whereby the operation of the film is facilitated, and mechanical properties that are not easily cracked, cracked, or sticky are imparted. Etc., it can be used as a film operator in a normal state (normal temperature and normal pressure). Examples of the (C) film-forming material include phenoxy resin, polyvinyl acetal resin, polystyrene resin, polyvinyl butyral resin, polyester resin, polyamide resin, xylene resin, and polyamine. Acid ester resin. Among these, phenoxy resin is preferred from the viewpoint of excellent adhesion, compatibility, heat resistance and mechanical strength. The phenoxy resin is a resin obtained by reacting a difunctional phenol with epichlorohydrin until it becomes a high molecular weight, or a polyaddition epoxy resin and a difunctional phenol are subjected to a polyaddition reaction. The phenoxy resin can be, for example, a non-reactive solvent in the presence of a catalyst such as an alkali metal hydroxide in the presence of a catalyst of 0.985 to 1.015 mol of epichlorohydrin in a molar amount of 1 mol of the bifunctional phenol. It is obtained by carrying out a reaction at a temperature of 40 to 120 °C. Further, as the phenoxy resin, it is particularly preferable that the compounding equivalent ratio of the bifunctional epoxy resin to the bifunctional phenol is an epoxy group/phenolic hydroxyl group from the viewpoint of mechanical properties of the resin or thermal properties. 1/0.9 to 1/1.1, in the presence of a catalyst such as an alkali metal compound or an organophosphorus compound or a cyclic amine compound, in a guanamine, ether, or ketone system having a boiling point of 120 ° C or higher. In an organic solvent such as an ester or an alcohol, the reaction solid content is 50 mass -12 to 201144404% or less, and is heated to 50 to 20 (TC) to obtain a polyaddition reaction. Functional epoxy resin, bisphenol a type epoxy resin, bisphenol F type epoxy resin, bisphenol AD type epoxy resin, bisphenol S type epoxy resin. Bifunctional phenol type has 2 phenols Examples of the hydroxyl group include a bisphenol compound such as hydroquinone, bisphenol A, bisphenol F′ bisphenol AD, and bisphenol s. The phenoxy resin may be modified by a radical polymerizable functional group. The phenoxy resin may be used alone or in combination of two or more. From the viewpoint of film forming properties and the like, the weight of the above component (c) is flat. The molecular weight of the thermoplastic resin is preferably 1,000,000 or more. However, when the weight average molecular weight of the thermoplastic resin is 1,000,000 or more, mixing with other components tends to be difficult. Further, the weight average molecular weight specified in the present invention means the following conditions. Gel permeation chromatography (GPC) is determined based on the calibration curve of standard polystyrene. <GPC condition> Machine used: Hitachi L-6000 type (manufactured by Hitachi, Ltd.) Pipe column: Gelpack G L-R420 + G elpack GL-R43 0 + G elp ack GL-R440 (3 pieces) (Hitachi Chemical Industry Co., Ltd.) Eluent: Tetrahydrofuran Measurement Temperature: 40 ° C Flow Rate: 1.75 mL / min Detector: L- 3 3 00 RI (manufactured by Hitachi, Ltd.) -13- 201144404 (C) The blending s ' of the components is 10 parts by mass based on the total of the components (a) and (b), and Η ' is preferably 50 to 140 parts by mass, more preferably 70 to 120 parts by mass. (d) A thermoplastic polymer containing a vinyl carboxylate as a monomer unit. The thermoplastic polymer as the component (d) is not particularly limited as long as it contains a vinyl carboxylate as a monomer unit. The circuit connecting material of the present invention exhibits adhesiveness by melting (or softening) the component (d) at a predetermined heating temperature in the temporary pressing step, and can easily adhere to the adherend temporarily. Further, when the organic fine particles to be described later are applied to the circuit connecting material for the purpose of improving the adhesion, the adhesiveness is slightly lowered to temporarily deteriorate the temporary compressibility. In a special case, the component (d) may have a function of coexisting adhesion and adhesion of the circuit connecting material. Examples of the vinyl carboxylate include vinyl acetate, vinyl propionate, vinyl butyrate, vinyl hexanoate, vinyl octanoate, vinyl laurate, vinyl myristate, vinyl palmitate, and hard. Vinyl fatty acid ester, vinyl cyclohexyl carboxylate, trimethyl vinyl acetate, vinyl octanoate and vinyl benzoate. Among them, from the viewpoint of copolymerizability with other monomers, vinyl acetate, vinyl propionate, vinyl butyrate, vinyl hexanoate, vinyl octanoate and vinyl laurate are more preferred. Vinyl acetate. (d) Thermoplastic polymer Since the vinyl carboxylate containing a polar monomer unit contains an olefin having a nonpolar monomer unit as a monomer unit, the effect of the present invention excellent in temporary adhesion can be exhibited more effectively and surely. Further, as the olefin', ethylene and propylene can be exemplified, and the thermoplastic polymer may contain a copolymerizable copolymer with a vinyl carboxylate in the range of -14,044,404,404, which does not deviate from the effect of the low-temperature temporary crimping property of the present invention. The body acts as a monomer unit. Examples of such a monomer include allyl carboxylate and alkyl (meth)acrylate, and specific examples thereof include allyl acetate, methyl (meth)acrylate, and ethyl (meth)acrylate. The ratio of the vinyl carboxylate is preferably 20% by mass or more and less than 60% by mass, more preferably 25% by mass or more and less than 55% by mass based on 100% by mass of all the monomers constituting the component (d). More preferably, it is 30% by mass or more and less than 50% by mass. When the content is 60% by mass or more, the resin exhibits adhesiveness at room temperature, and when it is formed into a wound body of a circuit-connecting material, it is transferred to the back surface of the support film, which tends to be inferior in workability. If it is less than 20% by mass, the melting point of the resin itself increases, and it is not sufficiently melted in the temporary pressing step, and it is difficult to obtain an effect of improving the adhesion. From the viewpoint of excellent adhesion to the adherend at the time of temporary pressing and excellent peelability of the support film, (d) the thermoplastic polymer preferably contains an olefin-vinyl carboxylate copolymer, and a material for connecting the constituent circuits. From the viewpoint of compatibility of other resin components, it is preferred to contain an ethylene-vinyl acetate copolymer. The weight average molecular weight (hereinafter referred to as "Mw") of the component (d) is preferably from 40,000 to 150,000, more preferably from 60,000 to 1,30,000, and particularly preferably from 70,000 to 1,200. When it exceeds 150,000, the solubility in toluene, ethyl acetate, methyl ethyl ketone or the like of a general-purpose solvent tends to decrease, and if it does not reach 40,000, the cohesive force of the resin layer 3 is lowered and the adhesive strength is lowered. tendency. (d) The melting point of the germination line is preferably 30 ° C or more and less than 80 ° C, more preferably -15 - 201144404 30 to 70 ° C. When the melting point is less than 30 °C, the bleeding of the resin is likely to be induced at the time of temporary pressing, and the workability tends to be lowered. On the other hand, when the melting point is 80 °C or more, it is difficult to achieve the effect of the present invention which is excellent in temporary compressibility at a low temperature. The amount of the component (d) is preferably 0.5 to 5 parts by mass, more preferably 1 to 3 parts by mass, based on 100 parts by mass of the total of the components (a) and (c). When the amount of the component (d) is less than 0.5 part by mass, the effect of the present invention which is excellent in temporary compressibility at a low temperature tends to be difficult, and when it exceeds 5 parts by mass, the connection reliability or the connection appearance tends to be lowered. (e) Organic fine particles In the circuit connecting material of the present invention, organic fine particles may be blended as needed. The organic fine particle system has a function as a stress relieving agent having stress relaxation properties. The circuit connecting material can further improve the adhesion to various connecting members in the final connection after the temporary pressing by using the organic fine particles as the (E) component. In particular, when a cationically-based latent curing agent is used as the circuit connecting material of the component (b), the adhesive strength to the adherend tends to be slightly worse than when the anionic polymeric latent curing agent is used. Therefore, the adhesion can be improved by adding the (e) component. Examples of the organic fine particles include an acrylic resin, a polyoxyxylene resin, butadiene, a polyester, a polyurethane, a polyvinyl butyral, a polyarylate, a polymethyl methacrylate, an acrylic rubber, and the like. A copolymer of a polystyrene, NBR, SBR, polyoxymethylene modified resin or the like as a component. From the viewpoint of improving adhesion, 'as organic fine particles, it is preferred to use alkyl (meth)acrylate-butadiene-styrene copolymer, (meth)acrylic acid alkyl-16- 201144404 ester-polyoxyl copolymer , polyoxyn-(meth)acrylic acid copolymer, polysiloxane-(meth)acrylic acid complex, (meth)acrylic acid alkyl ester-butyl di-styrene-polyoxyl complex and A complex of an alkyl (meth) acrylate and a polyoxymethylene. Further, as the component (E), an organic fine particle having a core-shell structure and having a different composition of the core layer and the shell layer may be used. Specific examples of the core-shell type organic fine particles include particles obtained by grafting an acrylic resin with a polyfluorene-acrylic rubber as a core, and particles of an acrylic resin grafted with an acrylic resin. When the component (e) is blended, the amount thereof is preferably 20 to 50 parts by mass, more preferably 30 to 40 parts by mass, per part by mass of the component (a). By setting the amount of the component (e) to be in the above range, it is easy to adjust the balance between the adhesion of the supporting film to the adherend of the resin layer 3 and the peeling property. Further, the circuit connecting material 1 (resin layer 3) may further contain a filler, a softening material, an accelerator, an anti-aging agent, a colorant, a flame retardant, a shaker, a coupling agent, a phenol resin, a melamine resin, and Isocyanates. When the ruthenium filler is contained, it is preferable to improve the connection reliability and the like. The maximum diameter of the cerium filler can be used as long as it does not reach the particle diameter of the conductive particles 5, and the blending amount is preferably in the range of 5 to 60% by volume. If it exceeds 60% by volume, the effect of improving reliability is saturated. As the coupling agent, a compound having a vinyl group, an acryl group, an amine group, an epoxy group or an isocyanate group is preferred from the viewpoint of improving the adhesion. Examples of the conductive particles 5 include metal particles containing a metal such as Au, Ag, Ni, Cu, or solder, and carbon particles. The conductive particles 5 are preferably noble metals of Au, Ag or a platinum group, and more preferably Au is composed of a layer of -17-201144404. Since the surface layer of the conductive particles 5 is composed of such a metal, a sufficient lifespan can be obtained. The conductive particles 5 may be coated with a surface of a transition metal such as Ni or the like by a noble metal such as Au. Alternatively, the conductive layer or the like may be coated on a non-conductive glass, ceramic, plastic or the like to form 'the outermost layer may be a noble metal. When the outermost layer is a noble metal and the core is a coated particle of a plastic or a hot molten metal, the deformability due to heating and pressing is increased, so that the contact area with the electrode at the time of connection increases, and the reliability is improved. The amount of the conductive particles to be added is appropriately set according to the application, and is usually in the range of 0.1 to 30 parts by volume based on 100 parts by volume of the components other than the conductive particles in the circuit connecting material. More preferably, it is 0.1 to 10 parts by volume in order to prevent a short circuit or the like of an adjacent circuit due to excess conductive particles. The circuit connecting material of the present invention is not limited by the configuration shown in Fig. 1. For example, the circuit connecting material may have a laminated structure composed of two or more layers having different compositions. At this time, the latent hardener and the conductive particles may each be contained in different layers. Thereby, the storage stability (lifetime) of the circuit connecting material is increased. Further, the circuit connecting material may not contain conductive particles. The circuit connecting material of the present invention is, for example, suitable for forming a wafer part such as a semiconductor wafer, a resistor wafer, a capacitor wafer, or the like, and a circuit member having a " or more than two circuit electrodes (connection terminals) such as a printed wiring board Connected connection structure. Fig. 2 is a cross-sectional view showing an embodiment of a connection structure. The connecting structure of the circuit member shown in FIG. 2 is provided with: a first circuit member 10 having a first -18-201144404 substrate 11 and a first circuit electrode 13 formed on the main surface thereof; a second substrate 21 and a second circuit electrode 23 formed on the main surface thereof, and a second circuit member 20 disposed opposite to the first circuit electrode 13 by the second circuit electrode 23; A connection portion 1a between the first circuit member 10 and the second circuit member 20. The opposing first circuit electrode 13 and the second circuit electrode 23 are electrically connected. The connecting portion 1a is a cured product formed by curing the circuit connecting material 1, and is composed of a cured resin layer 3a and conductive particles 5. The connecting portion 1a bonds the first circuit member 1A and the second circuit member 20 in such a manner as to electrically connect the opposing first and second circuit electrodes 13 and 23. The opposing first circuit electrode 13 and the second circuit electrode 23 are electrically connected via the conductive particles 5. Further, when the connecting portion does not contain conductive particles, the first circuit electrode 13 can be directly bonded The second circuit electrode 23 is electrically connected. The first substrate 11 is a resin film containing at least one resin selected from the group consisting of polyester terephthalate, polyether oxime, epoxy resin 'acrylic resin, and polyimine resin. The first circuit electrode 13 is at least one selected from the group consisting of a conductive material capable of functioning as an electrode (preferably a metal of gold, silver, tin, a platinum group, and an indium-tin oxide). ) formed. The second substrate 21 is a glass substrate. The second circuit electrode is preferably formed of a transparent conductive material. As the transparent conductive material, ITO is typically used. -19- 201144404 The connecting structure of the circuit component 100, for example, by sequentially laminating the first circuit member 10, the film-like circuit connecting material 1 and the second circuit member 20, so that the first circuit The electrode 13 is opposite to the second circuit electrode 23, and the obtained laminate is heated and pressurized, and the first circuit member 10 is connected to the first circuit electrode 13 and the second circuit electrode 23 by electrical connection. Obtained by the method of the second circuit member 20. In this method, first, the film-like circuit connecting material 1 formed on the support film is bonded to the second circuit member 20, and the circuit connecting material 1 is temporarily adhered by heating and pressurization. After the support film is peeled off, the first circuit member 10' is placed while positioning the circuit electrodes to prepare a laminate. Further, in order to prevent the release of the volatile component generated by the heating at the time of connection, it is preferable to heat-treat the circuit member before the connection step. Fig. 3 is a flow chart showing an embodiment of a method of temporarily pressing a circuit connecting material by a schematic cross-sectional view. In the present embodiment, first, a film-like adhesive 2 (Fig. 3(a)) including a support film 7 and a film-like circuit connecting material 1 provided on one side surface of the support film 7 is prepared. Adhesive layer lb ° Next, the surface of the second circuit member 20 on which the circuit electrode 23 is formed is placed on the side of the adhesive layer 1 b, and is heated and pressurized in a bonded state, and the adhesive layer is applied. 1b is temporarily adhered to the second circuit member 20 (Fig. 3(b)). The temperature of the temporary adhesion is 80 ° C or less, preferably 70 t -20 - 201144404 or less, and more preferably 60 ° C or less. The lower limit of the temporary adhesive temperature is not particularly limited. From the viewpoint of productivity, it is 50. <t or so. The time for the temporary adhesion is suitably adjusted according to the adhesion temperature, preferably 〇.丨~5 seconds, more preferably 0.5 to 3 seconds. Next, the support film 7' is peeled off and the adhesive layer 1b is transferred onto the main surface of the second substrate 21 (Fig. 3(c)). In this manner, after the adhesive layer 1 b is temporarily pressed against the second circuit member 20, the first circuit member 1 is placed such that the first circuit electrode 13 faces the side of the second circuit member 2A. The crucible is placed on the adhesive layer lb'. The laminate is heated and pressurized to obtain a bonded structure 100. The conditions for heating and pressurizing the above-mentioned laminate are appropriately adjusted in accordance with the hardenability of the adhesive composition in the circuit connecting material, and the circuit connecting material is hardened to obtain sufficient adhesive strength. The adhesive layer 1 b is hardened by the heating of the adhesive layer 1b in a state where the distance between the first circuit electrode 13 and the second circuit electrode 23 is sufficiently reduced, and is strengthened by the connecting portion 1a. The first circuit member 1 〇 and the second circuit member 20 are connected. The joint portion 1 a is formed by hardening of the adhesive layer 1 b to obtain the joint structure 1 如图 as shown in Fig. 2 . Further, the conditions of the connection are appropriately selected in accordance with the intended use, the circuit connecting material, and the circuit member. The present invention is not limited to the above embodiments. The present invention is susceptible to various modifications without departing from the spirit thereof. For example, the circuit member constituting the connection structure may have a semiconductor wafer of germanium and gallium/arsenic, and a glass, ceramic, glass/epoxy composite, and an insulating substrate of -21 - 201144404 and plastic. . EXAMPLES Hereinafter, the present invention will be specifically described on the basis of examples, but the present invention is not limited thereto. The components constituting the circuit connecting material in the present embodiment are as follows: "EP_4〇10S": propylene oxide-modified epoxy resin (epoxy equivalent 3 3 0 to 3 90, manufactured by ADEKA) "YL98 3 U": double Phenol F-type epoxy resin (epoxy equivalent 165 to 175, made of Nippon epoxy resin) "BPA3 2 8": Acrylic microparticle-dispersed epoxy resin (containing 17% by mass of acrylic fine particles, epoxy equivalent 220 to 240, Japan Catalyst) "EP- 1 03 2H60": cresol novolak type epoxy resin (epoxy equivalent 163 to 1 75) "HX3 94 1 HP": epoxy resin containing an anionic polymerization type latent curing agent (containing 35 mass% of imidazole microcapsule type hardener bisphenol F type and A type epoxy resin mixed type, epoxy equivalent 160~190, manufactured by Asahi Kasei Chemicals Co., Ltd. "ZX 1 3 5 6-2": bisphenol AF Polymeric phenoxy resin (Mw50000, manufactured by Tohto Kasei Co., Ltd.) "PKHC": bisphenol A type phenoxy resin (Mw45000, manufactured by INCHEM) "Acrylic rubber A": 40 parts by mass of butyl acrylate - 30 parts by mass of acrylic acid Ethyl ester - 30 parts by weight of acrylonitrile - 3 parts by mass of methyl propyl - 22- 201144404 Copolymer of epoxidized acrylate (MW about 850,000) "EXL-2655": Organic microparticles (core shell polymer formed from butadiene-styrene-methacrylate copolymer, Rohm And Haas Co., Ltd.) "EV40W": ethylene-vinyl acetate copolymer (vinyl acetate content: 41% 'MW80000' melting point 40 ° C, melt flow rate 65 g/10 min, manufactured by Mitsui & DuPont Chemical Co., Ltd.) "EV150": Ethylene-vinyl acetate copolymer (vinyl acetate content 33% 'melting point 6 1 ° C, melt flow rate 30 g/10 min, Mwl20000, manufactured by Mitsui DuPont Chemical Co., Ltd.) "AUL-7 04": average particle size 4 μιη The surface of the polystyrene spherical particles is provided with 0.1 μm of Ni layer and conductive layer of Au layer (manufactured by Sekisui Chemical Co., Ltd.) "SH6〇4〇": decane coupling agent (γ-glycidoxypropyltrimethyl) Oxygen Sand Institute, Toray Dow Corning. Polysilicate (manufactured by polysilicon) (SI-60LA): Cationic polymerization type latent curing agent (aromatic sulfonium salt, manufactured by Sanshin Chemical Co., Ltd.) (Example 1) with 30 mass "EP-4010S", 15 parts by mass of "YL98 3U", 50 parts by mass (without "PKHC" of 40 parts by mass of toluene/ethyl acetate (= 50/50) and 50 parts by mass (20 parts by mass in terms of nonvolatile content) of "ΖΧ1356-2" in terms of volatile matter (20 parts by mass) "EV40W" of toluene/ethyl acetate (=50/50) 40% by mass solution, 15 parts by mass of "EXL--23-201144404 265 5", and 10 parts by mass (2 parts by mass in terms of non-volatile content) 20 quality. /. Toluene solution, 4 parts by mass of r AUL-704", 1 part by mass of "δΗ6〇4〇" (γ-glycidoxypropyltrimethoxydecane' Toray Dow Corning. Polyoxyl (manufactured by the company) And 3 parts by mass of "SI-60LA"' to obtain a mixed solution. The resulting mixed solution was applied onto a PET film by a coater, and dried by hot air at 7 ° C for 1 minute to obtain a film-like circuit connecting material having a thickness of the adhesive layer of 20 μm. (Example 2) In addition to 20 parts by mass of "YL9 83U", 30 parts by mass of "ΒΡΑ3 2 8", and 125 parts by mass (in terms of nonvolatile matter, 5 parts by mass) "PKHC" toluene/ethyl acetate (= 50/50) 40% by mass solution, 10 parts by mass (2 parts by mass in terms of nonvolatile matter) of 20% by mass toluene solution of "EV40W", 4 parts by mass of "AUL-704", and 1 part by mass A film-like circuit connecting material was obtained in the same manner as in Example 1 except that "SI-60LA" of "SH6040" and three-component S parts were blended with each component. (Example 3) A film-like circuit connecting material was obtained in the same manner as in Example 1 except that "EV150" was used instead of "EV40W". (Example 4) In addition to 5 parts by mass of "ΕΡ-1 03 2Η60", 35 parts by mass of ΗΧ3941ΗΡ", 50 parts by mass (20 parts by mass in terms of nonvolatile matter) -24-201144404 of "PKHC" toluene /ethyl acetate (= 50/50) 40% by mass solution, 200 parts by mass (20 parts by mass in terms of nonvolatile content) of "acrylic rubber A" toluene / ethyl acetate (= 50/50) 10% by mass 20 parts by mass of "EXL-265 5", 10 parts by mass (2 parts by mass in terms of non-volatile content), 20% by mass of toluene solution of "EV40W", and 4 parts by mass of "AUL-7 04" and 1 A film-like circuit connecting material was obtained in the same manner as in Example 1 except that the "SH6〇4〇" of the parts by mass was used. (Example 5) "PKHC" toluene/acetic acid of 10 parts by mass of "BPA328", 40 parts by mass of "HX3 94 1 HP", and 37. 5 parts by mass (15 parts by mass in terms of nonvolatile matter) Ethyl acetate (= 50/50) 40% by mass solution, 350 parts by mass (35 parts by mass in terms of nonvolatile content) of "acrylic rubber A" in toluene/ethyl acetate (= 50/50) 10% by mass solution, 1 part by mass (2 parts by mass in terms of non-volatile content) of 20% by mass toluene solution of "EV40W", 4 parts by mass of "AUL_7〇4", and 1 part by mass of "SH6 040", in addition to each component, In the same manner as in Example i, a film-like circuit connecting material was obtained. (Comparative Example 1) A film-like circuit connecting material was obtained in the same manner as in Example 1 except that "EV40W" was not added. (Comparative Example 2). • 25-201144404 A film-like circuit connecting material was obtained in the same manner as in Example 2 except that "EV40W" was not added. (Comparative Example 3) A film-like circuit connecting material was obtained in the same manner as in Example 4 except that "E V 4 0 W" was not added. (Comparative Example 4). A film-like circuit connecting material was obtained in the same manner as in Example 5 except that "EV40W" was not added. The composition of the circuit connecting material produced in the examples is shown in Table 1 in terms of the mass S (in terms of nonvolatile matter), and the composition of the circuit connecting material produced in the comparative example is shown in parts in Table 2 in parts by mass (nonvolatile). [Table 1] Example 1 Example 2 Example 3 Example 4 Example 5 Epoxy resin EP-4010S 30 - 30 - YL983U 15 20 15 A - BPA328 - 30 - - 10 EP-1032H60 — — — 5 Ring gas resin HX3941HP with latent hardener — One - 35 40 Film forming agent 2X-1356-3 20 — 20 One - PKHC 20 50 20 20 15 Acrylic rubber A - One to 20 35 Organic fine particles EXL2655 15 - 15 20 - Potential hardener SI-60LA 3 3 3 - olefin-vinyl carboxylate copolymer EVA40W 2 2 - 2 2 EVA150 one - 2 - one coupling SH-6040 1 1 1 1 1 Conductive particle AUL-704 4 4 4 4 4 -26- 201144404 [Table 2] Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 Epoxy Resin EP-4010S 30 — One — YL983U 15 20 — One PA328 — 30 A 10 EP-1032H60 — A 5 — Epoxy Resin HX3941HP with Potential Hardener - 35 40 Film Forming Agent ZX-1356-3 20 — — PKHC 20 50 20 15 Acrylic Rubber A — — 20 35 Organic Microparticles EXL2655 15 — 20 — Potential Hardener SI -60LA 3 3 — olefin-vinyl carboxylate Ester Copolymer EVA40W — — — — EVA150 — — — — Coupling Material SH-6040 1 1 1 1 Conductive Particles AUL-704 4 4 4 4 [Evaluation of Temporary Adhesion] Adhesive of the above-mentioned film-like circuit connecting material Level, comprehensively on a glass plate with a thickness of 0.7 mm of a thin layer of indium oxide (ITO), each of which is temporarily adhered to 1 second or 3 at 6 (TC, 70 ° C, 80 ° C under IMPa). After the second, the PET film was peeled off, and the temporary adhesion was evaluated. The state in which the adhesive layer was uniformly transferred onto the ITO was regarded as "A", and the state in which the adhesive layer was partially transferred onto the ITO was regarded as ^B". The state in which the adhesive layer was not transferred to the ITO at all was regarded as "C". The evaluation results of the examples are shown in Table 3, and the evaluation results of the comparative examples are shown in Table 4. -27- 201144404

[表3] 實St 5例1 實拥 ί例2 實M S例3 實拥 i例4 實51 S例5 連接時間 (秒） 1 3 1 3 1 3 1 3 1 3 60°C A A A A A A A A A A 70°C A A A A A A A A A A 80°C A A A A A A A A A A[Table 3] Real St 5 Case 1 实 实 Example 2 Real MS Case 3 Real Example i Example 4 Real 51 S Example 5 Connection Time (seconds) 1 3 1 3 1 3 1 3 1 3 60°CAAAAAAAAAA 70°CAAAAAAAAAA 80 °CAAAAAAAAAA

[表4] tt® ί例1 比® mz 比較例3 tb® 测4 連接時間 (秒） 1 3 1 3 1 3 1 3 60°C c C c C c C c C 70°C c B c B B B B B 80°C B A B A B A B A 確認本發明的薄膜狀之電路連接材料即使在60°C 1秒 的極低溫且短時間的條件下，暫時黏著性也十分優異。 【圖式簡單說明】 圖1係顯示電路連接材料的一實施形態之截面圖。 圖2係顯示連接結構物的一實施形態之截面圖。 圖3係藉由示意截面圖顯示使用電路連接材料的暫時 性壓著之方法的一實施形態之步驟圖。 【主要元件符號說明】 1 :電路連接材料 2 :薄膜狀黏著劑 1 a :連接部 1 b :黏著劑層 3 :樹脂層 -28 - 201144404 3 a :已硬化的樹脂層 5 :導電性粒子 7 :支撐薄膜 1 0 :第一之電路構件 1 1 :第一之基板 1 3 :第一之電路電極 20 :第二之電路構件 21 :第二之基板 23:第二之電路電極 100 :連接結構物 -29[Table 4] tt® ίExample 1 vs. mz Comparative Example 3 tb® Measurement 4 Connection time (seconds) 1 3 1 3 1 3 1 3 60°C c C c C c C c C 70°C c B c BBBBB 80 ° C BABABABA It was confirmed that the film-like circuit connecting material of the present invention is excellent in temporary adhesiveness even under the conditions of extremely low temperature of 60 ° C for 1 second and short time. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing an embodiment of a circuit connecting material. Fig. 2 is a cross-sectional view showing an embodiment of a joint structure. Fig. 3 is a flow chart showing an embodiment of a method of temporarily pressing a circuit connecting material by a schematic cross-sectional view. [Explanation of main component symbols] 1 : Circuit connection material 2 : Film-like adhesive 1 a : Connection portion 1 b : Adhesive layer 3 : Resin layer -28 - 201144404 3 a : Hardened resin layer 5 : Conductive particles 7 : Supporting film 10 : First circuit member 1 1 : First substrate 1 3 : First circuit electrode 20 : Second circuit member 21 : Second substrate 23 : Second circuit electrode 100 : Connection structure -29

Claims (1)

201144404 七、申請專利範圍 1. 一種電路連接材料，其爲將對向之電路電極彼此 電連接（electrically c〇nnected)之電路連接材料，其特 徵爲含有 (a )環氧樹脂，與 (b)潛在性硬化劑，與 (c )薄膜形成材料，與 (d )含有以羧酸乙烯酯作爲單體單位之熱塑性聚合 物。 2 ·如申請專利範圍第1項之電路連接材料，其中， 前述羧酸乙烯酯爲乙酸乙烯酯。 3. 如申請專利範圍第1或2項之電路連接材料，其 中，前述潛在性硬化劑爲陽離子聚合型潛在性硬化劑。 4. 如申請專利範圍第3項之電路連接材料，其中， 前述陽離子聚合型潛在性硬化劑爲含有芳香族锍鹽。 5 ·如申請專利範圍第1〜4項中任一項之電路連接材 料，其更含有有機微粒子。 6.—種連接結構物，其特徵爲具備有， 具有第一之基板及形成於該基板之主面上之第一之電 路電極的第一之電路構件，與 具有第二之基板及形成於該基板之主面上之第二之電 路電極，該第二之電路電極與前述第一之電路電極爲以對 向方式配置，該第二之電路電極與前述第一之電路電極爲 以電連接的第二之電路構件，與 -30- 201144404 介於前述第一之電路構件及前述第二之電路構件之間 的連接部， 又，前述連接部爲申請專利範圍第1〜5項中任一項 之電路連接材料之硬化物。 7 . —種暫時性壓著之方法’其特徵爲具備有， 使具備有支撐薄膜，與設置於該支撐薄膜之一側面上 之由申請專利範圍第1〜5項中任一項之電路連接材料所 形成之黏著劑層的薄膜狀黏著劑，於80 t：以下對具有基 板及形成於該基板之主面上之電路電極的電路構件暫時性 黏著之步驟，與， 暫時性黏著後，將前述支撐薄膜剝離使黏著劑層轉印 於前述基板之主面之步驟。 -31 -201144404 VII. Patent application scope 1. A circuit connecting material, which is a circuit connecting material electrically connecting circuit electrodes to each other, characterized by containing (a) epoxy resin, and (b) A latent hardener, (c) a film forming material, and (d) a thermoplastic polymer containing a vinyl carboxylate as a monomer unit. 2. The circuit connecting material of claim 1, wherein the vinyl carboxylate is vinyl acetate. 3. The circuit connecting material according to claim 1 or 2, wherein the latent hardener is a cationic polymerization latent hardener. 4. The circuit connecting material according to claim 3, wherein the cationically polymerizable latent curing agent contains an aromatic onium salt. The circuit connecting material according to any one of claims 1 to 4, which further contains organic fine particles. 6. A connection structure comprising: a first substrate member having a first substrate and a first circuit electrode formed on a main surface of the substrate; and a substrate having a second substrate a second circuit electrode on the main surface of the substrate, the second circuit electrode and the first circuit electrode are disposed in an opposing manner, and the second circuit electrode is electrically connected to the first circuit electrode a second circuit member, and a connection portion between the first circuit member and the second circuit member of -30-201144404, wherein the connection portion is any one of claims 1 to 5 of the patent application scope The hardening of the circuit connection material of the item. 7. A method of temporarily pressing a feature that is provided with a supporting film and is connected to a circuit provided on one side of the supporting film by any one of the first to fifth aspects of the patent application. a film-like adhesive of an adhesive layer formed of a material, which is temporarily adhered to a circuit member having a substrate and a circuit electrode formed on a main surface of the substrate at 80 t: or less, and temporarily adhered thereto The support film is peeled off to transfer the adhesive layer to the main surface of the substrate. -31 -
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