TW201144067A - Laminated film - Google Patents

Laminated film Download PDF

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TW201144067A
TW201144067A TW100104315A TW100104315A TW201144067A TW 201144067 A TW201144067 A TW 201144067A TW 100104315 A TW100104315 A TW 100104315A TW 100104315 A TW100104315 A TW 100104315A TW 201144067 A TW201144067 A TW 201144067A
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Taiwan
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resin
film
weight
laminated film
release layer
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TW100104315A
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Chinese (zh)
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TWI532598B (en
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Taichi Yatsuzuka
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Sumitomo Bakelite Co
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Priority claimed from JP2010026147A external-priority patent/JP5488809B2/en
Priority claimed from JP2010026146A external-priority patent/JP5557152B2/en
Priority claimed from JP2010026148A external-priority patent/JP5581717B2/en
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Publication of TW201144067A publication Critical patent/TW201144067A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/302—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/08—Copolymers of ethene
    • C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
    • C08L23/0869—Acids or derivatives thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2270/00—Resin or rubber layer containing a blend of at least two different polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/704—Crystalline
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2451/00—Decorative or ornamental articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2519/00—Labels, badges

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)

Abstract

Disclosed is a laminated film which can be subjected to press bonding with good workability and enables the production of FPCs in improved yield. Specifically disclosed is a laminate film (100, 100A) which comprises a first mold release layer (110, 110a) and a cushion layer (120). The first mold release layer comprises a resin mainly composed of a polystyrene resin having a syndiotactic structure. The cushion layer comprises more than 60 parts by weight and not more than 98 parts by weight of a polyolefin resin and not less than 2 parts by weight and less than 40 parts by weight of a polystyrene resin having a syndiotactic structure. The cushion layer is arranged on one surface of the first mold release layer.

Description

201144067 六、發明說明： 【發明所屬之技術領域】 本發明係有關於一種積層膜。 【先前技術】 於日本特開2001-315273號公報中，提出一種積層 =，其具有：脫模層，其包括以對排（syndi〇tactic)聚 苯乙烯樹脂為主要成分的樹脂；以及中間層，其係由在對 排聚苯乙烯樹脂中含有3〇〜6〇重量％之彈性體樹脂單體、 烯烴系樹脂單體或該等之混合物之混合樹脂所構成。例 如，當在露出電路之撓性膜（以下稱為「電路露出膜」） 上，經由黏著劑並藉由熱壓來黏著覆蓴膜（以下稱為「CL 膜」），以製作撓性印刷電路基板（以下稱為「Fpc」）時， 上述積層膜可用作此時之脫模膜。 [先前技術文獻] (專利文獻） 專利文獻1 :日本特開200卜315273號公報 【發明内容】 [發明所欲解決之問題] 然而，本申請案發明者經研究，結果發現，如曰本特 ’ 〇1 31 5273號公報所揭示之「中間層包含有相對大量 之對排聚笨乙烯樹脂的積層膜」的彈性模數過高，因此在 程易破裂。並且’若在施壓過程中積層膜破裂， 此破裂之積層膜可能會導致Fpc損傷，甚至存在Fpc的不 201144067 良品率提高之虞。 再者’藉由本申請案發明者可以知道，同上述原因， 於製造FPC時，此種積層膜難以將cl媒均句地施壓至電路 露出膜’於黏著劑中容易產生空隙（微小的中空缺陷）， 甚至導致FPC的不良品率提高。 再者此種積層膜，施壓套件（press set )的操作性 非常差。 μ 本發明的課題在於提供一種能夠使施壓套件的操作性 良好並可提咼FPC等的良品率之積層膜。 [解決問題之技術手段] (1) 本發明一態樣之積層膜，係包括第1脫模層和緩衝層 (相當於中間層）。第1脫模層，係由以具有對排結構之 聚苯乙烯系樹脂為主要成分之樹脂所形成。再者，假如形 成第1脫模層之樹脂為100重量份時，具有對排結構之聚 笨乙烯系樹脂較佳是佔形成第1脫模層之樹脂的至少7〇重 量份以上’更佳是85重量份以上。緩衝層，係含有超過 60重量份且為98重量份以下之聚烯烴系樹脂、和2重量 份以上且未達40重量份之具有對排結構之聚苯乙烯系樹 脂。再者’更佳是緩衝層含有65重量份以上且為95重量 份以下之聚烯烴系樹脂、和5重量份以上且為35重量份以 下之具有對排結構之聚苯乙烯系樹脂。並且，此緩衝層， 係設置於第1脫模層的一側。再者，此緩衝層，亦可僅由 聚烯烴系樹脂和具有對排結構之聚苯乙烯系樹脂所形成。 201144067 ;不損本發明的宗旨之範圍内’此緩衝層，亦可八 有聚烯樹月旨和具有對排結構之聚苯乙稀系樹脂 樹脂。 & 本申請案發明者努力研究，結果發現，若緩衝層的組 成係如上所述，則（i )施壓套件的操作性良好，並且發現 (11)積層膜的彈性模數適度，從而積層膜在施壓過程中 不易破裂’進而發現（i i i )於製造FPC時，可將CL膜均 勻地施壓至電路露出膜上，於黏著劑中不易產生空隙（微 小的中空缺陷）’ FPC的良品率提高。 因此’此積層膜，不僅能夠使施壓套件的操作性良好， 還可以提高FPC等的良品率。 (2) 於本發明一態樣之積層膜中，聚烯烴系樹脂，較佳是 含有3重量份以上且為4〇重量份以下之聚丙烯樹脂、和超 過20重量份且為95重量份以下之乙烯-曱基丙烯酸曱酯共 聚物樹脂。再者，更佳是聚烯烴系樹脂係含有5重量份以 上且為35重量份以下之聚丙烯樹脂、和30重量份以上且 為90重量份以下之乙烯-甲基丙烯酸曱酯共聚物樹脂。 本申請案發明者努力研究，結果發現，若緩衝層中的 聚烯烴系樹脂的組成係如上所述，則無須使用底塗劑 (primer)即可使緩衝層與第1脫模層的黏著性良好，並 且發現，可進而使緩衝層的彈性模數為適度的範圍内。 因此，使用此積層膜，可以使緩衝層與第1脫模層良 好地黏著，而且，可以進而適度地保持緩衝層的彈性模數。 201144067 (3) ;本發明—態樣之積層膜中，較佳是在乙烯—甲基丙締 鲅甲Sa共聚物樹脂中，含有5重量％以上且為14重量％以下 之由甲基丙烯酸甲酯所衍生之單元。再者，於不損本發明 的宗旨之範圍内，乙烯-甲基丙烯酸甲酯共聚物樹脂，亦可 3有由乙烯和甲基丙烯酸甲酯以外的單體所衍生之單元。 本申請案發明者努力研究，結果發現，若由甲基丙烯 甲S日所街生之單元的含率係如上所述’則無須使用底塗 劑即可使緩衝層與第丨脫模層的黏著性良好，並且發現進 而可減少在施壓過程中緩衝層端面渗出至加熱板之量。 因此，使用此積層膜，則無須使用底塗劑即可使緩衝 層與第1脫模層良好地黏著。再者，此積層膜可以減少在 她壓過程中的緩衝層端面滲出量。 (4) ,於本發明一態樣之積層膜中，形成第1脫模層之樹脂 較佳是藉由差示掃描熱量測定法而測定之結晶度為14. 〇% 30·〇%〇再者’此時，第上脫模層，既可經由' 底塗劑來與緩衝層一體化，亦可不經由底塗劑而直接與緩 衝層一體化。 本申請案發明者努力研究，結果發現，若形成第i脫 模層之樹脂的結晶度係如上所述，則在將CL膜黏著至電路 出膜時可以防止第1脫模層密接於電路露出膜和CL 、並且可獲得相較於先前的脫模膜更為良好的埋置性。 因此，右將此積層膜用作脫模膜，在將CL膜黏著至電 201144067 路露出膜時，可以防止第！脫模層密接於電路露出膜和π 膜，並且可獲得相較於習知的脫模膜更為良好的埋置性。 再者’可推測此效果的原因在於： (i)於將CL膜黏著至電路露出膜之初期，形成第丄 脫模層之樹脂的結晶度被設定為充分低，於此黏著步驟 (PROCESS)中，第i脫模層易於追隨緩衝層之變形， (H)於將CL膜黏著至電路露出臈之步驟中，形成第 1脫模層之樹脂藉由加熱而結晶化，從而帛i脫模層相對 於電路露出膜和CL膜之密接性充分降低。 (5) 本發明一態樣之積層膜，較佳是進而包括第2脫模 層。此第2脫模層係形成於缓衝層之與第i脫模層形成側 的相反側。再者’ &第2脫模層，可由聚甲基戊稀樹脂所 形成，亦可由以聚f基戊烯樹脂為主要成分之樹脂所形 成’還可由以具有對排結構之聚苯乙烯系樹脂為主要成分 之樹脂所形成’又可由其他脫模性樹脂所形成。當第2脫 模層係由「聚甲基戊烯樹脂」、「以聚甲基戊稀樹脂為主 要成分之樹脂」以及「其他脫模性樹脂」所形成時第^ 脫模層可經由底塗劑層（黏著層）而黏著至緩衝層。當第 2脫模層係由「以具有對排結構之聚苯乙烯系樹脂為主要 成分之樹脂」所形成時，第2脫模層無須使用底塗劑（黏 著劑）即可黏著至緩衝層。 如此一來，若於緩衝層之與第1脫模層形成側的相反 側’形成第2脫模層，則在將以膜黏著至電路露出膜時， 201144067201144067 VI. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a laminated film. [Prior Art] In Japanese Laid-Open Patent Publication No. 2001-315273, there is proposed a laminate = having a release layer comprising a resin containing a syndi〇tactic polystyrene resin as a main component; and an intermediate layer It is composed of an elastomer resin monomer, an olefin resin monomer or a mixed resin of the mixture of 3 to 6 wt% in the para-polystyrene resin. For example, when a flexible film (hereinafter referred to as a "circuit exposed film") that exposes a circuit is adhered to a film (hereinafter referred to as a "CL film") by an adhesive by an adhesive, a flexible printing is produced. In the case of a circuit board (hereinafter referred to as "Fpc"), the laminated film can be used as a release film at this time. [Prior Art Document] (Patent Document) Patent Document 1: JP-A-200-315273 [Invention] [Problems to be Solved by the Invention] However, the inventors of the present application have studied and found that, for example, 曰本特The "intermediate layer contains a relatively large number of laminated films of agglomerated stupid vinyl resin" disclosed in the Japanese Patent Publication No. 1 31 5273 has an excessively high modulus of elasticity, and thus is easily broken during the process. And if the laminated film breaks during the pressing process, the cracked laminated film may cause Fpc damage, and even the FPC's failure rate is not improved. Furthermore, the inventors of the present application can know that, in the above-mentioned reason, when the FPC is manufactured, it is difficult for the laminated film to uniformly press the cl medium to the circuit to expose the film, which is easy to generate voids in the adhesive (small hollow Defects), and even lead to an increase in the defective rate of FPC. Further, such a laminated film has a very poor handleability of a press set. μ An object of the present invention is to provide a laminated film which can improve the workability of a pressure-applying kit and improve the yield of FPC or the like. [Technical means for solving the problem] (1) A laminated film according to an aspect of the present invention includes a first release layer and a buffer layer (corresponding to an intermediate layer). The first release layer is formed of a resin containing a polystyrene resin having a side-by-side structure as a main component. Further, if the resin forming the first release layer is 100 parts by weight, the polystyrene resin having the aligned structure preferably contains at least 7 parts by weight or more of the resin forming the first release layer. It is 85 parts by weight or more. The buffer layer contains more than 60 parts by weight and less than 98 parts by weight of the polyolefin-based resin, and 2 parts by weight or more and less than 40 parts by weight of the polystyrene-based resin having the aligned structure. Further, it is more preferable that the buffer layer contains 65 parts by weight or more and 95 parts by weight or less of the polyolefin-based resin, and 5 parts by weight or more and 35 parts by weight or less of the polystyrene-based resin having the aligned structure. Further, the buffer layer is provided on one side of the first release layer. Further, the buffer layer may be formed only of a polyolefin resin and a polystyrene resin having a aligned structure. 201144067; within the scope of the gist of the present invention, the buffer layer may have a polystyrene resin having a polyene resin structure and a tandem structure. & The inventors of the present application have diligently studied and found that if the composition of the buffer layer is as described above, (i) the workability of the pressure-applying kit is good, and it is found that (11) the laminated film has a moderate elastic modulus, thereby laminating The film is not easily broken during the pressing process. It is found that (iii) when the FPC is manufactured, the CL film can be uniformly pressed onto the exposed film of the circuit, and voids (small hollow defects) are not easily generated in the adhesive. The rate is increased. Therefore, the laminate film can improve not only the workability of the pressure-applying kit but also the yield of the FPC or the like. (2) In the laminated film according to the aspect of the invention, the polyolefin resin preferably contains 3 parts by weight or more and 4 parts by weight or less of the polypropylene resin, and more than 20 parts by weight and 95 parts by weight or less. Ethylene-mercapto acrylate copolymer resin. Furthermore, it is more preferable that the polyolefin resin contains 5 parts by weight or more and a polypropylene resin of 35 parts by weight or less, and 30 parts by weight or more and 90 parts by weight or less of the ethylene-methacrylic acid methacrylate copolymer resin. As a result of intensive studies, the inventors of the present invention found that if the composition of the polyolefin resin in the buffer layer is as described above, the adhesion between the buffer layer and the first release layer can be achieved without using a primer. It is good, and it has been found that the elastic modulus of the buffer layer can be made to be within a moderate range. Therefore, by using this laminated film, the buffer layer can be adhered to the first release layer well, and the elastic modulus of the buffer layer can be appropriately maintained. 201144067 (3) In the laminated film of the present invention, it is preferable that the ethylene-methyl propyl sulfonium-Sa copolymer resin contains 5% by weight or more and 14% by weight or less of methacrylic acid. A unit derived from an ester. Further, the ethylene-methyl methacrylate copolymer resin may have a unit derived from a monomer other than ethylene and methyl methacrylate, within the scope of the gist of the present invention. The inventors of the present application have diligently studied and found that if the content of the unit produced by the methacrylonitrile group S is as described above, the buffer layer and the second release layer can be obtained without using a primer. The adhesion is good, and it has been found that the amount of the end face of the buffer layer oozing out to the heating plate during the pressing process can be reduced. Therefore, by using this laminated film, the buffer layer and the first release layer can be adhered well without using a primer. Further, the laminated film can reduce the amount of bleeding of the end face of the buffer layer during her pressing. (4) In the laminated film according to an aspect of the invention, the resin forming the first release layer is preferably a crystallinity measured by differential scanning calorimetry of 14. 〇% 30·〇%〇 At this time, the first release layer may be integrated with the buffer layer via the primer, or may be directly integrated with the buffer layer without passing through the primer. As a result of intensive studies, the inventors of the present invention found that if the crystallinity of the resin forming the i-th release layer is as described above, the first release layer can be prevented from being in close contact with the circuit when the CL film is adhered to the circuit. Membrane and CL, and better embedding properties than previous release films are available. Therefore, the laminated film is used as the release film on the right, and when the CL film is adhered to the electricity to expose the film, the film can be prevented! The release layer is in close contact with the circuit exposed film and the π film, and a better embedding property than that of the conventional release film can be obtained. Furthermore, the reason for this effect is presumed to be that: (i) the crystallinity of the resin forming the second release layer is set to be sufficiently low at the initial stage of adhering the CL film to the exposed film of the circuit, and this adhesion step (PROCESS) In the middle, the i-th release layer is likely to follow the deformation of the buffer layer, and (H) in the step of adhering the CL film to the circuit to expose the crucible, the resin forming the first release layer is crystallized by heating, thereby releasing the mold. The adhesion of the layer to the exposed film of the circuit and the CL film is sufficiently lowered. (5) The laminated film of one aspect of the present invention preferably further comprises a second release layer. This second release layer is formed on the opposite side of the buffer layer from the side on which the i-th release layer is formed. Furthermore, the & second release layer may be formed of a polymethyl pentene resin or a resin having a polyf-pentene resin as a main component, and may also be composed of a polystyrene system having a aligned structure. The resin formed by the resin as a main component can be formed of other release resins. When the second release layer is formed of "polymethylpentene resin", "resin containing polymethyl pentene resin as a main component", and "other release resin", the second release layer can pass through the bottom. The coating layer (adhesive layer) adheres to the buffer layer. When the second release layer is formed of "a resin containing a polystyrene resin having a side-by-side structure as a main component", the second release layer can be adhered to the buffer layer without using a primer (adhesive). . As a result, when the second release layer is formed on the side opposite to the side on which the first release layer is formed on the buffer layer, when the film is adhered to the circuit to expose the film, 201144067

可以防止緩衝層附著於施壓加熱板。因此，可以縮短將CL 媒黏著至電路露出膜之步驟等所耗費之時間。 (6) 於本發明—態樣之積層臈中，第2脫模層較佳是由以 具有對排結構之聚苯乙烯系樹脂為主要成分之樹脂所形 成。 如此一來，若由以具有對排結構之聚苯乙烯系樹脂為 主要成分之樹脂來形成第2脫模層，則無須使用底塗劑（黏 著劑）即可黏著至緩衝層。因此，此積層膜’可以將材料 成本或步驟成本維持為較低而進行製造。 (7) 於本發明一態樣之積層膜中，形成第2脫模層之樹脂 較佳是藉由差示掃描熱量測定法測定之結晶度為ΐ4· 〇%以 上且未達30.0%。 當本發明一態樣之積層膜係如上述（4 )所述時，若形 成第2脫模層之樹脂的結晶度係如上所述， 、J坪乙脱模層 ”有與第1脫模層相同的功能。因此，於使用本積層膜時， 使用者無須特別規定第1脫模層與第2脫模層。因此，若 利用此積層膜，使用者可以省去辨識第丨脫模層與第2右 模層之麻煩，並可防止帛！脫模層與第2因: 誤而引起黏著不良。 特疋錯 【實施方式】 如第1圖所示’本發明的實施形態之 〜 <積層膜100，係 201144067 主要由脫模層110和緩衝層12〇構成。再者，於本實施形 態中，較佳是積層膜100的厚度為25〜3〇〇以爪。 以下’分別對這些層進行詳細說明。 〈積層膜構成層的詳細說明> 1.脫模層 脫模層110係由以具有對排結構之聚笨乙烯系樹脂 (以下稱為「SPS樹脂」）為主要成分之樹脂（以下稱為「脫 模層形成樹脂」）所形成。此外，此種脫模層形成樹脂係由 出光興產（股）（Idemitsu Kosan)使用商品名XAREC (註 冊商標）而於市面進行銷售。脫模層形成樹脂中的sps樹 脂的含率為70重量％以上且為90重量％以下，較佳是85重 量％以上且為90重量％以下。於本實施形態中，脫模層 的厚度較佳是5 “以上，更佳是10 ρ以上。於本實施 形態中，脫模層形成樹脂的結晶度較佳是藉由差示掃描熱 量計（DSC)而測定之值為14.〇%以上且未達3〇〇%。其原 因在於：若脫模層形成樹脂的結晶度係如上所述，則於將 CL膜黏著至電路露出膜時，可以防止脫模層⑴密接於電 路路出膜和CL臈，並能夠獲得相較於先前的脫模膜更為良 好的埋置f生。再|，此時，脫模| 的貯存彈性模數的 溫度相關性，如第6圖所示。 乂下對脫模層形成樹脂的構成成分進行詳細說明。 (1 ) SPS樹脂 SPS樹脂係指具有對排結構之樹脂，此對排結構亦即 係相對於由碳ϋ所形成之主鏈，作為側鏈之苯基或取 201144067 代苯基交錯地位於相反方向之立體規則結構。 再者’此種SPS樹脂，例如可以列舉：如日本特開 2000-038461號公報所示，外消旋二合物（racemic diad) 為75%以上，較佳是85%以上，或外消旋五合物（racemic pentad)為30%以上，較佳是50%以上之具有對排性之聚苯 乙烯、聚（烷基苯乙烯）、聚（芳基苯乙烯）、聚（鹵化苯乙 烯）、聚（鹵化烷基苯乙烯）、聚（烷氧基苯乙烯）、聚（笨曱 酸乙烯酯）、該等之氩化聚合物及該等之混合物、或者以該 等為主要成分之共聚物等。 聚（烷基苯乙烯），例如可以列舉：聚（甲基苯乙烯）、 聚（乙基苯乙烯）、聚（異丙基苯乙烯）及聚（三級丁基苯乙烯） 聚（芳基苯乙烯），例如可以列舉：聚（苯基苯乙烯）、 聚（乙烯基萘）及聚（乙烯基苯乙稀）等。It is possible to prevent the buffer layer from adhering to the pressing heating plate. Therefore, it is possible to shorten the time taken for the step of adhering the CL medium to the circuit to expose the film. (6) In the laminated crucible of the present invention, the second release layer is preferably formed of a resin containing a polystyrene resin having a side-by-side structure as a main component. In this case, when the second release layer is formed of a resin containing a polystyrene resin having a side-by-side structure as a main component, it is possible to adhere to the buffer layer without using a primer (adhesive). Therefore, the laminated film ' can be manufactured by keeping the material cost or the step cost low. (7) In the laminated film according to one aspect of the invention, the resin forming the second release layer is preferably a crystallinity measured by differential scanning calorimetry of ΐ4·〇% or more and less than 30.0%. When the laminated film of one aspect of the present invention is as described in the above (4), if the crystallinity of the resin forming the second release layer is as described above, the J Pingping release layer has the first release. Therefore, when the laminated film is used, the user does not need to specify the first release layer and the second release layer. Therefore, by using the laminated film, the user can dispense with the identification of the second release layer. It is troublesome with the second right mold layer, and it is possible to prevent 帛! The release layer and the second cause: Adhesive defects are caused by mistakes. [Embodiment] As shown in Fig. 1, the embodiment of the present invention is < The build-up film 100, 201144067, is mainly composed of a release layer 110 and a buffer layer 12A. Further, in the present embodiment, it is preferable that the thickness of the build-up film 100 is 25 to 3 inches. The details of the laminated film constituent layer are as follows: 1. The release layer release layer 110 is mainly composed of a polystyrene-based resin having a side-by-side structure (hereinafter referred to as "SPS resin"). The resin (hereinafter referred to as "release layer forming resin") is formed. In addition, such a release layer-forming resin is marketed by Idemitsu Kosan under the trade name XAREC (registered trademark). The content of the sps resin in the release layer forming resin is 70% by weight or more and 90% by weight or less, preferably 85 % by weight or more and 90% by weight or less. In the present embodiment, the thickness of the release layer is preferably 5" or more, more preferably 10 ρ or more. In the present embodiment, the crystallinity of the release layer-forming resin is preferably by a differential scanning calorimeter ( The value measured by DSC) is 14.5% or more and less than 3 %. The reason is that when the crystallinity of the release layer forming resin is as described above, when the CL film is adhered to the circuit to expose the film, It is possible to prevent the release layer (1) from being in close contact with the circuit path and the CL 臈, and to obtain a better embedding of the release film than the previous release film. Further, at this time, the storage elastic modulus of the release | The temperature dependence is shown in Fig. 6. The composition of the release layer-forming resin is described in detail below. (1) SPS resin SPS resin refers to a resin having a row structure, which is also With respect to the main chain formed by carbonium, the phenyl group as a side chain or the phenyl group of 201144067 is interlaced in a three-dimensional regular structure in the opposite direction. Further, such an SPS resin can be exemplified by, for example, JP-A 2000 As shown in the publication -038461, the racemic diad is 75. More than 100%, preferably 85% or more, or a racemic pentad of 30% or more, preferably 50% or more of polystyrene having a pair of discharge properties, poly(alkylstyrene), Poly(arylstyrene), poly(halogenated styrene), poly(halogenated alkylstyrene), poly(alkoxystyrene), poly(vinyl stearate), argonized polymers and the like Such a mixture, or a copolymer containing these as a main component, etc. Poly(alkylstyrene), for example, poly(methylstyrene), poly(ethylstyrene), poly(isopropyl) Examples of the styrene) and the poly(tris-butylstyrene) poly(arylstyrene) include poly(phenylstyrene), poly(vinylnaphthalene), and poly(vinylstyrene).

苯乙烯）及聚（氟苯乙烯）等。Styrene) and poly(fluorostyrene).

烯）等。 聚（烧•氧基苯乙烯）， 聚（乙氧基苯乙烯）等。Alkene). Poly(flaming oxystyrene), poly(ethoxystyrene), and the like.

氫化聚苯乙烯以及包含該等結構翠元 可以列舉：聚（曱氧基苯乙烯）及 烯）、聚（對三級丁基苯乙 民乙烯）、聚（對氟苯乙烯）、 1單元之共聚物。 10 201144067 (2 ) SPS樹脂以外的樹脂 構成脫模層形成樹脂之SPS樹脂以外的樹脂，例如可 以列舉：彈性體樹脂、聚烯烴系樹脂、聚苯乙烯系樹脂、 聚酯系樹脂、聚醯胺系樹脂、聚苯醚樹脂、聚苯硫醚樹脂 (polyphenylene sulfide ’ PPS)等。再者，這些樹脂可 單獨使用或組合兩種以上使用。 再者，彈性體樹脂，例如可以列舉：天然橡膠、聚丁 二烯、聚異戊二烯、聚異丁烯、氣丁橡膠、聚硫醚橡膠、 聚硫橡膠（thiokol rubber)、丙烯酸橡膠、胺酯（urethane) 橡膠、$夕氧橡膠、表氣醇橡膠、苯乙稀-丁二稀嵌段共聚物 (styrene-butadiene block copolymer，SBR )、氫化苯乙 稀-丁二稀嵌段共聚物（hydrogenated styrene-butadiene block copolymer，SEB)、苯乙烯-丁二稀-苯乙烯嵌段共聚 物（styrene-butadiene-styrene block copolymer，SBS)、 氫化苯乙稀-丁二烯-苯乙稀後段共聚物（hydrogenated styrene-butadiene-styrene block copolymer， SEBS)、 苯乙烯-異戊二烯後段共聚物（styrene-isoprene block copolymer，SIR)、氫化苯乙稀-異戊二烯嵌段共聚物 (hydrogenated styrene-isoprene block copolymer， SEP)、苯乙烯-異戊二烯-苯乙烯嵌段共聚物 (styrene-isoprene-styrene block copolymer，SIS)、 氫化苯乙烯-異戊二烯-苯乙烯嵌段共聚物（hydrogenated styrene-isoprene-styrene block copolymer > SEPS)、或 乙烯丙稀橡膠（ethylene propy 1 ene monomer，ΕΡΜ)、三 201144067 元乙丙橡膠（ethylene propylene diene monomer，EPDM)、 直鏈狀低密度聚乙烯系彈性體等烯烴系橡膠、或者丁二烯-丙稀腈-苯乙稀-核殼橡膠（butadiene-acrylonitrile -styrene-core shel 1 rubber，ABS)、甲基丙烯酸甲酯-丁 一 烯'本乙烯-核殼橡膠（methy 1 methacry 1 ate- butadiene-styrene-core shell rubber，MBS)、甲基丙烯 酸曱酯-丙烯酸丁酯-苯乙烯-核殼橡膠（methyl methacrylate-butyl acrylate-styrene-core shell rubber ’ MAS)、丙烯酸辛酯-丁二烯—苯乙烯—核殼橡膠 (octyl scry 1at6-butadiene~styrene-core shell rubber，MABS)、丙烯酸烷酯-丁二烯-丙烯腈—苯乙烯_核殼 橡谬（alkyl acrylate-butadiene-acrylonitrile -styrene-core shell rubber，AABS)、丁二稀-笨乙稀 _ 核设橡膠（butadiene-styrene-core shell rubber，SBR)、 甲基丙烯酸曱酯-丙烯酸丁酯-矽氧烷等含有矽氧烧之核殼 橡膠等核殼型粒子狀彈性體、或將該等改性之橡膠等。 聚烯烴系樹脂’例如可以例舉：直鏈狀高密度聚乙烯、 直鏈狀低密度聚乙烯、高壓法低密度聚乙稀、同排 (isotactic)聚丙烯、對排聚丙烯、嵌段聚丙稀、無規聚 丙烯（random polypropylene)、聚丁烯、υ —聚丁二稀、 聚（4-曱基戊烯）、環狀聚烯烴以及該等之共聚物（例如乙 烯-曱基丙烯酸曱酯共聚物等）等。 聚苯乙烯系樹脂’例如可以列舉：雜排聚苯乙稀 (atactic polystyrene)、同排聚苯乙烯、耐衝擊性聚笨 12 201144067 乙烯（high impact polystyrene，HIPS)、丙烯腈-丁二稀 -苯乙烯共聚物（ABS)、丙烯腈-笨乙烯共聚物（AS)、苯乙 烯-甲基丙烯酸共聚物、苯乙烯-甲基丙烯酸烷基酯共聚 物、苯乙烯-甲基丙烯酸縮水甘油酯共聚物、苯乙烯—丙稀 酸共聚物、苯乙烯-丙烯酸烷基酯共聚物、苯乙烯—順丁稀 二酸共聚物、及苯乙烯-反丁稀二酸共聚物等。 聚酯系樹脂’例如可以例舉：聚碳酸酯、聚對笨二甲 酸乙二酯及聚對笨二甲酸丁二酯等。 聚醯胺系樹脂，例如可以列舉：尼龍（註冊商標）6， 尼龍（註冊商標）6, 6等。 (3 )其他 於脫模性形成樹脂中，亦可調配各種添加劑，例如， 防黏（antiblocking)劑、抗氧化劑、成核劑、抗靜電劑、 加工油、塑化劑、脫模劑、阻燃劑、阻燃助劑及顏料等。 再者防黏劑，可以列舉如下述般之無機粒子或有機 粒子。無機粒子可以列舉：ϊ A族、nA族、WA族、矾八 知VHA族、νίΠΑ族、IB族、ΠΒ族、ΠΒ族及IVB族元素 的氧化物、氫氧化物、硫化物、氮化物、函化物、碳酸鹽、 乙酸鹽、磷酸鹽、亞磷酸鹽、有機羧酸鹽、矽酸 鈦、硼酸鹽及該等之水合物、以及以該等為中心 之複合化合物和天然礦物粒子。 此種無機粒子的具體例，可以列舉：氟化鋰、硼砂（硼 酸鈉水合61、Λ a )等I Α杈7L素化合物；碳酸鎂、磷酸鎂、氧 化鎮 Λψ \ 、、氣化鎂、乙酸鎂、氟化鎂、鈦酸鎂、矽酸鎂、 13 201144067 矽酸鎮水合鹽（滑石）、碳酸鈣、磷酸鈣、亞磷酸鈣、硫酸 鈣（石膏）、乙酸鈣、對苯二甲酸鈣、氫氧化鈣、矽酸鈣、 氟化鈣、鈦酸鈣、鈦酸锶、碳酸鋇、磷酸鋇、硫酸鋇、亞 硫酸鋇等ΠΑ族元素化合物；二氧化鈦（鈦氧）、一氧化鈦、 氮化鈦、二氧化锆（锆氧）、一氧化鍅等WA族元素化合物； 二氧化鉬、三氧化鉬、硫化鉬等W A族元素化合物；氯化 錳、乙酸錳等WA族元素化合物；氣化鈷、乙酸鈷等观族 兀素化合物；碘化亞銅等IB族元素化合物；氧化鋅、乙 酸鋅等族元素化合物；氧化銘（純）、氫氧化銘、氟 化銘、銘石夕酸鹽（石夕酸銘、高嶺土及高嶺石）等]〇族元 素化合物；氧化石夕（石夕石、石夕膠）、石墨、碳、石墨（ophite) 及玻璃等IVB族元素化合物；以及光齒石Uarnaiite)、Hydrogenated polystyrene and the inclusion of such structures can be exemplified by poly(decyloxystyrene) and alkene, poly(p-tert-butyl butyl ethene ethylene), poly(p-fluorostyrene), and 1 unit. Copolymer. 10 201144067 (2) Resin other than the SPS resin The resin other than the SPS resin which forms the release layer forming resin, for example, an elastomer resin, a polyolefin resin, a polystyrene resin, a polyester resin, and a polyamide A resin, a polyphenylene ether resin, a polyphenylene sulfide 'PPS, or the like. Further, these resins may be used singly or in combination of two or more. Further, examples of the elastomer resin include natural rubber, polybutadiene, polyisoprene, polyisobutylene, butadiene rubber, polythioether rubber, thiokol rubber, acrylic rubber, and amine ester. (urethane) rubber, oxime rubber, gas alcohol rubber, styrene-butadiene block copolymer (SBR), hydrogenated styrene-butadiene block copolymer (hydrogenated Styrene-butadiene block copolymer (SEB), styrene-butadiene-styrene block copolymer (SBS), hydrogenated styrene-butadiene-styrene post-copolymer Hydrogenated styrene-butadiene-styrene block copolymer (SEBS), styrene-isoprene block copolymer (SIR), hydrogenated styrene-isoprene block copolymer (hydrogenated styrene-isoprene) Block copolymer, SEP), styrene-isoprene-styrene block copolymer (SIS), hydrogenated styrene-isoprene-styrene block copolymer (hy Drogenated styrene-isoprene-styrene block copolymer > SEPS), or ethylene propy rubber (ethylene propy 1 ene monomer, 2011) 201144067 ethylene propylene diene monomer (EPDM), linear low density polyethylene An olefin-based rubber such as an elastomer, or butadiene-acrylonitrile-styrene-core shel 1 rubber (ABS), methyl methacrylate-butene-ene Meth 1 methacry 1 ate- butadiene-styrene-core shell rubber (MBS), methyl methacrylate-butyl acrylate-styrene-core shell (methyl methacrylate-butyl acrylate-styrene-core shell) Rubber ' MAS), octyl scry 1at6-butadiene to styrene-core shell rubber (MABS), alkyl acrylate-butadiene-acrylonitrile-styrene_nuclear Alkyl acrylate-butadiene-acrylonitrile (styrene-core shell rubber, AABS), butadiene-styrene-core shell rubber (SBR), bismuth methacrylate A core-shell type particulate elastomer such as a core-shell rubber containing oxime-oxygen or the like, or a rubber modified by the like, such as butyl acrylate or oxime. The polyolefin-based resin can be exemplified by linear high-density polyethylene, linear low-density polyethylene, high-pressure low-density polyethylene, isotactic polypropylene, butted polypropylene, and block polypropylene. Rare, random polypropylene, polybutene, bismuth-polybutylene, poly(4-decylpentene), cyclic polyolefins, and copolymers thereof (eg, ethylene-mercaptoacrylate) Ester copolymers, etc.). Examples of the polystyrene-based resin include atactic polystyrene, the same-row polystyrene, and impact-resistant polystyrene 12 201144067 (high impact polystyrene (HIPS), acrylonitrile-butadiene-- Styrene copolymer (ABS), acrylonitrile-stupid ethylene copolymer (AS), styrene-methacrylic acid copolymer, styrene-alkyl methacrylate copolymer, styrene-glycidyl methacrylate copolymerization , styrene-acrylic acid copolymer, styrene-alkyl acrylate copolymer, styrene-cis-succinic acid copolymer, and styrene-antibutadibilic acid copolymer. The polyester resin' may, for example, be polycarbonate, polyethylene terephthalate or polybutylene dicarboxylate. Examples of the polyamine-based resin include nylon (registered trademark) 6, nylon (registered trademark) 6, 6, and the like. (3) Others in the release-forming resin may also be formulated with various additives such as antiblocking agents, antioxidants, nucleating agents, antistatic agents, processing oils, plasticizers, mold release agents, and resistance agents. Fuel, flame retardant and pigments. Further, examples of the anti-adhesive agent include inorganic particles or organic particles as described below. The inorganic particles may be exemplified by oxides, hydroxides, sulfides, nitrides of lanthanum A, nA, wa, 矾8, V, ν, IB, IB, ΠΒ, ΠΒ and IVB elements. a compound, a carbonate, an acetate, a phosphate, a phosphite, an organic carboxylate, a titanium citrate, a borate, and the like, and a composite compound and natural mineral particles centered thereon. Specific examples of such inorganic particles include I Α杈 7L compounds such as lithium fluoride, borax (sodium borate hydrate 61, Λ a ), magnesium carbonate, magnesium phosphate, oxidized samarium, magnesium sulfide, and acetic acid. Magnesium, magnesium fluoride, magnesium titanate, magnesium citrate, 13 201144067 Hydrate hydrated salt (talc), calcium carbonate, calcium phosphate, calcium phosphite, calcium sulfate (gypsum), calcium acetate, calcium terephthalate, a lanthanide compound such as calcium hydroxide, calcium citrate, calcium fluoride, calcium titanate, barium titanate, barium carbonate, barium phosphate, barium sulfate, barium sulfite; titanium dioxide (titanium oxide), titanium oxide, nitriding a group wa compound such as titanium, zirconium dioxide (zirconia) or cerium oxide; a group wa compound such as molybdenum dioxide, molybdenum trioxide or molybdenum sulfide; a group wa compound such as manganese chloride or manganese acetate; , anthraquinone compounds such as cobalt acetate; IB group compounds such as cuprous iodide; group elements such as zinc oxide and zinc acetate; oxidized Ming (pure), oxidized Ming, fluorinated, and sinensis Shi Xi acid, kaolin and kaolinite, etc.] Elemental compounds; oxide group Xi (Shi Xishi, Shi Xijiao), graphite, carbon, graphite (ophite) and glass IVB group element compounds; and tartar Uarnaiite),

钟鹽鎮戴、雲母- X «母（K母石、金雲母）、玫瑰紅礦等天然礦物 的粒子。 有機粒子，可以列舉：氟樹脂、1聚I胺系樹脂、苯 :烯--乙烯苯共聚物、丙烯酸系樹脂矽氧以及該等之交聯 上 思…、機粒子或有機粒子的平均粒徑較佳是0 1〜 以&quot;1，添加量較佳是0.01〜15重量％。 . 再者L黏劑可單獨使用或組合兩種以上使用。 抗氧化劑，可以列舉：鱗系抗氧化 硫系抗氧朴杰丨j盼糸抗氧化劑、 氧化劑及丙烯酸2-[(1-羥基_3,5_二_ = 乙基卜4 R —級戍基笨基 ，一—三級戍基苯酯等。再者，這此於备α A 獨使用戋纟31 π 、二抗氧化劑可單 4組合兩種以上使用。 201144067 成核劑，可以列舉：二（對三級丁基苯甲酸）鋁等羧酸 金屬鹽、亞甲基雙（2, 4-二-三級丁基苯酚）酸式磷酸鈉等磷 酸金屬鹽、滑石及酞菁衍生物等。再者，這些成核劑可單 獨使用或組合兩種以上使用。 塑化劑，可以列舉：聚乙二醇、聚酿胺低聚物、伸乙 基雙硬月曰贐胺（ethylenebissteaUmide )、鄰苯二甲酸酉t 聚苯乙烯低聚物、聚乙烯蠟及矽油等。再者，這些塑化劑 可單獨使用或組合兩種以上使用。 脫模劑，可以列舉：聚乙烯蠟、矽油、長鏈羧酸、長 鏈羧酸金屬鹽等。再者，這些脫模劑可單獨使用或組合兩 種以上使用。 加工油，可以列舉：石蠟系油、環烷系油及芳香系油。 再者，於該等之中，較佳是藉由n_d_M法計算出之與石蠟 (直鏈）相關之碳數相對於整體碳數之百分比為6〇%Cp以 上的石壤系油。 加工油的黏度，較佳是於4(TC下之動力黏度為15〜 6〇〇cs，更佳是15〜50〇cs。再者’加工油的添加量較佳 是相對於脫模性形成樹脂1〇〇重量份為0 01〜15重量 份，更佳是0.05〜1.4重量份，進而更佳是〇1〜13重量 份。再者，這些加工油可單獨使用或組合兩種以上使用。 2.緩衝層 於本實施形態中，緩衝層120係主要由超過重量份 且為98重量份以下之聚烯烴系樹脂與2重量份以上且未達 40重量份之SPS樹脂之樹脂混合物所形成。再者，此樹脂 15 201144067 可藉由 較佳是 更佳是 混合物，可藉由不預先揉合之乾混合法來製備，亦 t轴捏合機進行預處理。再者，於本實施形態中， 緩衝層12°的厚度為脫模層110厚度的3倍以上， 5倍以上，進而更佳是8倍以上。 再者’聚烯烴系樹脂，例如可以列舉：直鍵狀高密度 聚乙烯鏈狀低密度聚乙烯、高壓法低密度聚乙烯、同 排聚丙烯、對排聚丙烯、嵌段聚丙烯、無規聚丙烯、聚丁 烯、1’2-聚丁二烯、料4—曱基戊烯）、環狀聚烯烴以及該 等之共聚4勿（例如乙烯-甲基丙烯酸甲酯共聚物等）等。 SPS樹脂係與上述spS樹脂相同。 此緩衝層120更佳是由2重量份以上且未達4〇重量份 之SPS樹脂、3重量份以上且為4〇重量份以下之聚丙烯樹 脂以及超過20重量份且為95重量份以下之乙烯_甲基丙烯 酸甲酯共聚物樹脂之樹脂混合物所形成。此時，乙烯-甲基 丙烯酸甲酯共聚物樹脂較佳是含有5重量％以上且為14重 量％以下之由甲基丙烯酸甲酯所衍生之單元。其原因在於： 若緩衝層120的組成和乙烯—曱基丙烯酸甲酯共聚物樹脂 的組成係如上所述，則（i)無須使用底塗劑即可使緩衝層 120與脫模層110之黏著性良好，並且，（ϋ)在施壓過程 中可以減少緩衝層120端面渗出至加熱板之量。 再者’於不損本發明宗旨之範圍内，此樹脂混合物亦 可根據需要調配其他或者上述彈性體樹脂或添加劑。 &lt;積層膜的製造方法&gt; 本實施形態之積層膜1〇〇，可藉由共擠壓法或擠壓積 16 201144067 層法等方法來製造。 共擠壓法係藉由使用夾鉗式送料機構和多分歧管模 具，同時擠壓出脫模層110和緩衝層12〇,來製造積層膜 100再者’共擠壓法’如第3圖所示，將通過模具210之 溶解物Μ被引導至第1輥23〇與托輥（t〇uch Γ〇η) 22〇 之間’藉由托輥220和第1輥230進行冷卻直至自第i輥 230脫離為止，從而成為積層膜1〇〇。之後，此積層膜ι〇〇， 藉由第2輥240被輸送至送膜方向（參照第3圖的箭頭） 下游側，最終捲取至捲取輥（未圖示）。再者，此時，第i 輥230的溫度較佳是30〜l〇(Tc，托輥220的溫度較佳是 50〜120°C，第2輥240相對於第1輥230之周速比較佳是 0. 990〜0. 998。 擠壓積層法’係藉由將擠壓機圓筒溫度設定為27〇〜 300°C來擠壓出脫模層11〇,並使此脫模層11〇與緩衝層12〇 會合，藉此積層脫模層11〇與緩衝層丨2〇,從而製造出積 層膜100。再者，擠壓積層法，如第3圖所示，將藉由通 過模具210之脫模層形成樹脂的溶解物μ引導至第1輥23〇 與托輥220之間，藉由托輥220和第1輥230進行冷卻直 至自第1輥230脫離，從而成為脫模層膜f»之後，此脫 模層膜F’藉由第2輥240被輸送至送膜方向（參照第3 圖的箭頭）下游側。繼而，將形成緩衝層120之樹脂混合 物的熔融物（未圖示）與輸送至送膜方向下游側之脫模層 臈F會合，與脫模層膜F —體化，從而製造出積層膜1〇〇。 再者，如此製造之積層膜1〇〇’進而捲取至設於送膜方向 17 201144067 下游側之捲取輥（未圖示）。再者，此時，第丨輥23〇的溫 度亦較佳是30〜100t，托輥220的溫度亦較佳是5〇〜12〇 C，第2輥240相對於第1輥230之周速比亦較佳是〇 99〇 〜0·998。 再者，亦可根據需要，藉由公知的熱處理裝置來調節 如上述般所得之積層膜100的脫模層11〇中的sps樹脂的 結晶度。例如，可以使用藉由拉幅機裝置於乾燥機中對積 層膜100進行熱固定之方法、或者使用熱處理輥在50〜 C左右進行熱處理。 &lt;使用積層膜之一例&gt; 於將CL膜黏著至電路露出膜時，A 了使^膜密接於 電路圖案的凹凸部’而以包覆GL膜的方式配置本發明的實 施形態之積層膜100,並與電路露出膜以及α膜一齊由施 壓裝置加壓。具體而言，如第4圖所示，積層冑⑽，以 與脫模層UM目對向的方式’夾持將電路露出膜和α膜藉 由黏著劑暫時@)定而成的材# 34G後，將其依序以鐵氣龍 (Teflon)(註冊商標）片材33〇、橡膠緩衝器32〇及不鏽 鋼板310夾持’並由加熱板_施壓（參照第*圖的空心 箭頭）。再者，此加熱板300之加熱方法如第5圖所示。亦 即，。加熱板3GG開始加錢’在10秒内自常溫迅速升溫至 WC ’之後’維持此溫度6〇秒。再者，加熱板_之加 壓’於G秒時刻開始，於7Q秒時刻放開。再者，此時的施 壓壓力可於5〜15MPa内適當調節。 &lt;變化例&gt; 18 201144067 (A) 於上述實施形態中，介紹了一種僅於緩衝層120的一 側設置脫模層11 〇之積層膜100，但如第2圖所示，於緩 衝層120的兩側設置脫模層110a、ll〇b之積層膜11〇A亦 包含於本發明的一實施形態中。再者，以下，將符號為11 〇a 之脫模層稱為「第1脫模層」，將符號為11 〇b之脫模層稱 為「第2脫模層」。 第1脫模層110a係具有與上述實施形態之脫模層11〇 相同的結構。另一方面’第2脫模層11 〇b，可具有與第1 脫模層110a相同的結構’亦可具有與第1脫模層ii〇a不 同的結構。於後者之情形下，第2脫模層11 〇b，例如係由 以聚甲基戊稀樹脂或曱基戊烯烯烴共聚物為主要成分 之樹脂所形成。再者，此種樹脂係已由三井化學（股）使 用商品名TPX (註冊商標）而於市面進行銷售。此時，存 在第2脫模層110b與緩衝層120之黏著力降低之虞，但是 於此種情形下，可於第2脫模層ll〇b與緩衝層120之間介 置固定層（Anchor layer)或底塗劑層（；黏著層）β (Β) 於使用上述貫施形態之積層膜之一例中，在積層膜1〇〇 與加熱板300之間依序夾持有鐵氟龍（註冊商標）片材 330、橡膠缓衝器32〇及不鏽鋼板31〇 ’但是鐵氟龍（註冊 商標）片材330、橡膠緩衝器32〇及不鏽鋼板31〇亦可省 去0 &lt;實施例&gt; 201144067 以下列出實施例，以更為詳細地說明本發明。 [實施例1 ] 1.積層膜的製造 (1)脫模層的原料 、層的原料’使用的是SPS樹脂（出光興產（股）公 司製造的XAREC(註冊商標）S104)。 (2)緩衝層的原料 &quot;緩衝層的原料，使用的是將20重量份的SPS樹脂（出 光'、產（知）A司製造的XArec (註冊商標）si〇4)、75重量份 的EMMA亦即乙烯_甲基丙烯酸曱酯共聚物（甲基丙烯酸曱 酯⑽A)衍生單元含量：5重量％)(住友化學(SumitomoZhongyan Town Dai, Mica-X «Mother (K mother stone, phlogopite), rose red ore and other natural mineral particles. Examples of the organic particles include a fluororesin, a poly-I-amine resin, a benzene-ene-vinyl benzene copolymer, an acrylic resin, oxime, and the like, and the average particle diameter of the organic particles or organic particles. Preferably, 0 1 to &lt;1, the amount of addition is preferably 0.01 to 15% by weight. Further, the L adhesive may be used singly or in combination of two or more. Antioxidants, for example, scaly antioxidant sulfur-based antioxidants, anti-oxidants, anti-oxidants and acrylic acid 2-[(1-hydroxy_3,5_di_ = ethyl b 4 R - fluorenyl) Stupid base, mono-tertiary decyl phenyl ester, etc. In addition, this is used in the preparation of α A alone 戋纟31 π, the second antioxidant can be used in combination of two or more. 201144067 Nucleating agent, can be listed: (for tributyl benzoic acid) a metal salt of a carboxylic acid such as aluminum or a metal phosphate such as methylene bis(2,4-di-tertiary butylphenol) acid sodium phosphate, talc or a phthalocyanine derivative. Further, these nucleating agents may be used singly or in combination of two or more. Plasticizers may, for example, be polyethylene glycol, polyacrylamide oligomers, ethylenebissteaUmide, or adjacent酉t-polystyrene oligomer, polyethylene wax, eucalyptus oil, etc. Further, these plasticizers may be used singly or in combination of two or more. Examples of release agents include polyethylene wax, eucalyptus oil, and long a chain carboxylic acid, a long-chain carboxylic acid metal salt, etc. Further, these release agents may be used singly or in combination of two or more. The processing oil may, for example, be a paraffinic oil, a naphthenic oil or an aromatic oil. Further, among these, the carbon number associated with the paraffin (linear) is preferably calculated by the n_d_M method. The stone soil oil with a percentage of the total carbon number of 6〇% Cp or more. The viscosity of the processing oil is preferably 4 (the dynamic viscosity under TC is 15~6〇〇cs, more preferably 15~50〇cs) Further, the amount of the processing oil to be added is preferably from 0 to 15 parts by weight, more preferably from 0.05 to 1.4 parts by weight, even more preferably from 1 to 13 parts by weight, per part by weight of the release-forming resin. Further, these processing oils may be used singly or in combination of two or more. 2. Buffer layer In the present embodiment, the buffer layer 120 is mainly composed of a polyolefin resin exceeding 98 parts by weight and more than 98 parts by weight. The resin mixture of the SPS resin is added in an amount of not more than 40 parts by weight. Further, the resin 15 201144067 can be prepared by a dry mixing method which is preferably pre-twisted, preferably by a mixture. The t-axis kneader also performs pretreatment. Further, in the present embodiment, the buffer layer 12 The thickness of the mold release layer 110 is three times or more, five times or more, and more preferably eight times or more. Further, the 'polyolefin resin' may, for example, be a linear high-density polyethylene chain-like low-density polymer. Ethylene, high pressure low density polyethylene, identical polypropylene, aligned polypropylene, block polypropylene, atactic polypropylene, polybutene, 1'2-polybutadiene, 4-decylpentene The cyclic polyolefin and the copolymer 4 (for example, an ethylene-methyl methacrylate copolymer), etc. The SPS resin is the same as the above spS resin. The buffer layer 120 is more preferably 2 parts by weight or more. Up to 4 parts by weight of the SPS resin, 3 parts by weight or more and 4 parts by weight or less of the polypropylene resin, and more than 20 parts by weight and less than 95 parts by weight of the ethylene-methyl methacrylate copolymer resin mixture form. In this case, the ethylene-methyl methacrylate copolymer resin preferably contains 5% by weight or more and 14% by weight or less of a unit derived from methyl methacrylate. The reason for this is that if the composition of the buffer layer 120 and the composition of the ethylene-methyl methacrylate copolymer resin are as described above, (i) the buffer layer 120 and the release layer 110 can be adhered without using a primer. The property is good, and (ϋ) can reduce the amount of the end face of the buffer layer 120 oozing out to the heating plate during the pressing process. Further, the resin mixture may be formulated with other or the above elastomer resin or additive as needed within the scope of the present invention. &lt;Manufacturing Method of Laminated Film&gt; The laminated film 1 of the present embodiment can be produced by a co-extrusion method or a method of extrusion molding, such as the layer 201110467 layer method. The co-extrusion method is to produce the laminated film 100 by using the clamp type feeding mechanism and the multi-frozen tube mold, and simultaneously extruding the release layer 110 and the buffer layer 12〇, and then the 'co-extrusion method' as shown in FIG. As shown, the dissolved material 通过 passing through the mold 210 is guided between the first roller 23〇 and the idler (t〇uch Γ〇η) 22〇' by the idler roller 220 and the first roller 230 until the second When the i-roller 230 is detached, it becomes a laminated film 1〇〇. Thereafter, the laminated film is transported to the downstream side in the film feeding direction (see the arrow in FIG. 3) by the second roller 240, and finally wound up to a take-up roll (not shown). Further, at this time, the temperature of the i-th roll 230 is preferably 30 to 1 Torr (Tc, the temperature of the idler 220 is preferably 50 to 120 ° C, and the peripheral speed of the second roll 240 with respect to the first roll 230 is compared. Preferably, it is 0. 990~0. 998. The extrusion lamination method squeezes the release layer 11〇 by setting the extruder cylinder temperature to 27 〇 to 300 ° C, and the release layer 11 is obtained. The crucible and the buffer layer 12 are joined together, thereby laminating the release layer 11 and the buffer layer 2 to produce the laminated film 100. Further, the extrusion lamination method, as shown in Fig. 3, is passed through the mold. The dissolved substance μ of the release layer forming resin of 210 is guided between the first roll 23〇 and the idler 220, and is cooled by the idler roll 220 and the first roll 230 until it is separated from the first roll 230, thereby becoming a release layer. After the film f», the release layer film F' is transported to the downstream side in the film feeding direction (see the arrow of Fig. 3) by the second roller 240. Then, the melt of the resin mixture forming the buffer layer 120 is formed (not In the drawing, the release layer 臈F conveyed to the downstream side in the film feeding direction is brought into contact with the release layer film F to produce a laminated film 1〇〇. Further, the laminated film 1 manufactured in this manner is produced. Further, it is taken up to a take-up roll (not shown) provided on the downstream side of the film feeding direction 17 201144067. Further, at this time, the temperature of the second roll 23〇 is also preferably 30 to 100 t, and the temperature of the idler 220 It is also preferably 5 〇 to 12 〇C, and the peripheral speed ratio of the second roller 240 to the first roller 230 is also preferably 〇99 〇 to 0·998. Further, a known heat treatment may be used as needed. The device adjusts the crystallinity of the sps resin in the release layer 11 of the laminated film 100 obtained as described above. For example, a method of thermally fixing the laminated film 100 in a dryer by a tenter device, or Heat treatment is performed at about 50 to C using a heat treatment roll. <Example of using a laminated film> When a CL film is adhered to a circuit exposed film, A is adhered to the uneven portion of the circuit pattern to coat the GL film. The laminated film 100 of the embodiment of the present invention is placed in the same manner as the circuit exposed film and the alpha film, and is pressurized by a pressing device. Specifically, as shown in Fig. 4, the laminated layer (10) is laminated to the release layer UM. The opposite direction 'clamping the circuit to expose the film and the alpha film by the adhesive temporarily @) After the material #34G, it is sequentially sandwiched between a Teflon (registered trademark) sheet 33〇, a rubber bumper 32〇, and a stainless steel plate 310, and pressed by a heating plate (refer to the figure *) Hollow arrow). Furthermore, the heating method of the heating plate 300 is as shown in Fig. 5. That is,. The heating plate 3GG starts to add money 'after a rapid temperature rise from normal temperature to WC' within 10 seconds', this temperature is maintained for 6 seconds. Further, the pressing of the heating plate _ starts at the time of G seconds and is released at the time of 7Q seconds. Further, the pressing pressure at this time can be appropriately adjusted within 5 to 15 MPa. &lt;Modifications&gt; 18 201144067 (A) In the above embodiment, a laminated film 100 in which the release layer 11 is provided only on one side of the buffer layer 120 is described, but as shown in Fig. 2, in the buffer layer The laminated film 11A having the release layers 110a and 110b on both sides of the 120 is also included in an embodiment of the present invention. In the following, the release layer having the symbol 11 〇a is referred to as "first release layer", and the release layer having the symbol 11 〇b is referred to as "second release layer". The first release layer 110a has the same structure as the release layer 11A of the above embodiment. On the other hand, the second mold release layer 11b may have the same structure as the first mold release layer 110a, and may have a structure different from that of the first mold release layer ii〇a. In the latter case, the second release layer 11 〇 b is formed, for example, of a resin containing a polymethyl pentene resin or a decyl pentene olefin copolymer as a main component. In addition, this resin is marketed by Mitsui Chemicals Co., Ltd. under the trade name TPX (registered trademark). At this time, there is a possibility that the adhesion between the second release layer 110b and the buffer layer 120 is lowered. However, in this case, a fixed layer may be interposed between the second release layer 11b and the buffer layer 120 (Anchor) Layer) or primer layer (adhesive layer) β (Β) In one example of the laminated film using the above-described continuous form, Teflon is sequentially sandwiched between the laminated film 1〇〇 and the heating plate 300 ( Registered trademark) sheet 330, rubber bumper 32〇 and stainless steel plate 31〇' but Teflon (registered trademark) sheet 330, rubber bumper 32〇 and stainless steel plate 31〇 may also omit 0 &lt;Example &gt; 201144067 The following examples are set forth to illustrate the invention in more detail. [Example 1] 1. Production of laminated film (1) Raw material of the release layer, and raw material of the layer 'The use of SPS resin (XAREC (registered trademark) S104 manufactured by Idemitsu Kosan Co., Ltd.) was used. (2) Raw material of the buffer layer &quot;The raw material of the buffer layer is used in an amount of 20 parts by weight of SPS resin (XArec (registered trademark) si〇4 manufactured by Idemitsu, Ikea A), 75 parts by weight EMMA is also ethylene-methacrylic acid decyl ester copolymer (decyl methacrylate (10) A) derived unit content: 5% by weight) (Sumitomo Chemical Co., Ltd. (Sumitomo

Chemical Co.，Ltd·)(股）製造的 ACRYFT(註冊商標）WD106) 及5重量伤的聚丙烯（PP(住友化學（股）製造的NOBlen FH1016))乾混合而成之原料（以下稱為「緩衝層形成混合 樹脂」）。 (3)積層膜之製作 利用共擠壓法，製作於緩衝層表裏具有相同脫模層之 積層膜（參照第2圖）。 再者，具體而言，係使用夾鉗式送料機構和多分歧管 模具’同時擠壓出SPS樹脂（出光興產（股）公司製造的 XAREC(註冊商標）sl〇4 )、缓衝層形成混合樹脂及SpS樹脂 (出光興產（股）公司製造的XAREC(註冊商標）S1〇4)，從而 製作積層膜。再者’此時使用了第3圖所示之裝置，第1 親230的溫度為3(rc，托輥22〇的溫度為7〇t&gt;c，第2輥 240相對於第1輥23〇之周速比為〇. 99〇。 20 201144067 關於此積層膜的脫模層厚度，表裏均為25 ，緩衝 層厚度為70 #m。 2.積層膜之評價 (1 )施壓套件的操作性 由操作者進行感官試驗。其結果為，上述積層膜的施 塵套件的操作性良好（參照表1)。 (2 )空隙觀察ACRYFT (registered trademark) WD106 manufactured by Chemical Co., Ltd.) and 5-weighted polypropylene (PP (NOBlen FH1016 manufactured by Sumitomo Chemical Co., Ltd.)) are dry-mixed raw materials (hereinafter referred to as "The buffer layer forms a mixed resin"). (3) Production of laminated film A laminated film having the same release layer in the surface of the buffer layer was produced by a co-extrusion method (see Fig. 2). In addition, in particular, the use of a clamp-type feeding mechanism and a multi-frozen tube mold 'simultaneously extrudes SPS resin (XAREC (registered trademark) sl〇4 manufactured by Idemitsu Kosan Co., Ltd.) and buffer layer formation A laminated film was produced by mixing a resin and a SpS resin (XAREC (registered trademark) S1〇4 manufactured by Idemitsu Kosan Co., Ltd.). Furthermore, the apparatus shown in Fig. 3 is used at this time, the temperature of the first parent 230 is 3 (rc, the temperature of the idler 22 为 is 7 〇 t &gt; c, and the second roller 240 is opposite to the first roller 23 〇 The circumferential speed ratio is 〇. 99〇. 20 201144067 The thickness of the release layer of this laminated film is 25 in the table and the thickness of the buffer layer is 70 #m. 2. Evaluation of laminated film (1) Operation of pressure-applying kit The sensory test was performed by the operator, and as a result, the workability of the dusting kit of the laminated film was good (refer to Table 1).

利用光學顯微鏡觀察施壓後的FPC，於此FPC中未發 現空隙（參照表丨^ X (3) CL膜黏著試驗 實際上，利用上述積層膜，將經由黏著劑暫時固定有 CL膜之電路露出膜，自兩侧包覆’並藉由加熱板施壓而按 …第5圖所不之加熱模式進行熱壓。結果於積層膜上未產 生破裂（參照表1)。電路露出膜與CL膜之間的黏著劑滲 出至電路圖案之量未達”，處於容許範圍内（參照 表1)緩衝層端面的滲出量未達5 ，處於容許範圍内（參 照表1)。 y [實施例2 ] 除了使用將20重量份的SPS樹脂（出光興產（股）公司 製造的XAREC(註冊商標）S1⑷、7〇重量份的乙稀_甲基丙 稀m曰#聚物（曱基丙烯酸甲酿衍生單元含量：5重量幻 (住友化學（股）製造的ACRYFT(註冊商標）謝⑻及1〇重 里伤的聚丙烯（住友化學（股）製造的N〇BLEN FH1〇l6)乾 奶〇而成之原料，作為緩衝層形成混合樹脂以外，係與實 21 201144067 施例i相同地製作積層冑’並對此積層膜進行了評價。 評價結果為此積層膜的施壓套件的操作性良好1參照 表1)。於施壓後的FPC中，未發現空隙：（參照表丄）。= 層膜，即便於熱壓後亦未產生破裂（參照表〇。電路露出 膜與CL膜之間的黏著劑滲出至電路圖案之量未達1〇〇 ym，處於容許範圍内（參照表1)β緩衝層端面的渗出量 未達5 mm，處於容許範圍内（參照表i )。 [實施例3] 除了使用將20重量份的SPS樹脂（出光興產（股）公司 製造的XAREC(註冊商標）S104)、6〇重量份的乙烯_甲基丙 烯酸曱酯共聚物（曱基丙烯酸曱酯衍生單元含量：5重量 (住友化學（股）製造的ACRYFT(註冊商標）WD1〇6)及2〇重 量份的聚丙烯（住友化學（股）製造的N〇BLM FH1〇l6)乾 混合而成之原料，作為緩衝層形成混合樹脂以外，係與實 施例1相同地製作積層臈，並對此積層膜進行了評價。再 者，此積層膜的脫模層厚度，表裏均為25 ，緩衝層厚 度為70 // m。 評價結果為此積層膜之施壓套件的操作性良好（參照 表1)。於施壓後的FPC中，未發現空隙（參照表j八此積 層膜，即便於熱壓後亦未產生破裂（參照表丨）。電路露出 膜與CL膜之間的黏著劑滲出至電路圖案之量未達i〇〇 #m，處於容許範圍内（參照表緩衝層端面的滲出量 未達5 mm，處於容許範圍内（參照表1 )。 [實施例4] 22 201144067 除了使用將20重量份的SPS樹脂（出光興產（股）公司 製造的XAREC( §主冊商標）si〇4)、50重量份的乙烯_甲基丙 烯酸甲S曰共1物（甲基丙稀酸甲醋衍生單元含量重量％) (住友化學（股）製造的ACRYFT(註冊商標）〇1〇6)及3〇重 量份的聚丙烯（住友化學（股）製造的N〇BLEN FHl〇i6)乾 混合而成之原料，作為緩衝層形成混合樹脂以外，係與實 施例1相同地製作積層膜，並對此積層膜進行了評價。再 者，此積層膜的脫模層厚度，表裏均為25 ，緩衝層厚 度為7 0 /X m。 評價結果為此積層膜的施壓套件的操作性良好（參照 表1)。於施壓後的FPC中，未發現空隙（參照表n。^積 層膜，即便於熱壓後亦未產生破裂（參照表n。電路露出 膜與CL膜之間的黏著劑滲出至電路圖案之量未達1〇〇 處於容許範圍内（參照表1)β緩衝層端面的滲出量 未達5 mm，處於容許範圍内（參照表i )。 [實施例5 ] m ,除了使用將2〇重量份的SPS樹脂（出光興產（股）公司 製造的XAREC(註冊商標）S104)、70重量份的乙烯_曱基丙 烯酸曱醋共聚物（甲基丙烯酸甲雖衍生單元含量：1〇 ^量 %)(住友化學（股）製造的ACRYFT(往冊商標）_㈠ 及10重量份的聚丙稀（住友化學（股）製造的議副 _⑻乾混合而成之原料，作為緩衝層形成混合樹脂以 係與實射&quot;相同地製作積層膜，並對此積層膜進行 了评價。再者，此積層膜的脫模層厚度，表裏均為2 23 201144067 缓衝層厚度為70 //m。 評價結果為此積層膜的施壓套件的操作性良好（參照 表2 )。於施壓後的FPC中，未發現空隙（參照表2 ) ^此積 層膜’即便於熱壓後亦未產生破裂（參照表2)&lt;&gt;電路露出 膜與CL膜之間的黏著劑滲出至電路圖案之量未達上⑽ //m，處於容許範圍内（參照表2)β緩衝層端面的滲出量 未達5 mm ’處於容許範圍内（參照表2 )。 [實施例6] 除了使用將20重量份的SPS樹脂（出光興產（股）公司 製造的XAREC(註冊商標）S104)、70重量份的乙烯_曱基丙 烯酸甲酯共聚物（甲基丙烯酸曱酯衍生單元含量：14重量 %)(住友化學（股）製造的ACRYFT (註冊商標）CM8033 ) 及ίο重量份的聚丙烯（住友化學（股）製造的n〇blen FH1016)乾混合而成之原料，作為緩衝層形成混合樹脂以 外，係與實施例1相同地製作積層膜，並對此積層膜進行 了評價。再者，此積層膜的脫模層厚度，表裏均$ 25⑽ 缓衝層厚度為70 /zm。 評價結果為此積層膜的施壓套件的操作性良好（參昭 表2)。於施壓後的FPC中，未發現空隙（參照表2)。此積 層膜’即便於熱壓後亦未產生破裂（參照表2)。電路露出 膜與CL膜之間的黏著劑滲出至電路圖案之量未達ι〇〇 處於容許範圍内（參照表2)'緩衝層端面的滲出量 未達5 mro，處於容許範圍内（參照表2)。 [實施例7] 24 201144067 除了使用將39重量份的SPS樹脂（出光興產（股）公司 製造的XAREC(註冊商標）S104)、21重量份的乙烯_曱基丙 烯酸曱酯共聚物（甲基丙烯酸甲酯衍生單元含量：重量 %)(住友化學（股）製造的ACRYFT (註冊商標）CM8〇33^ 及40重量份的聚丙烯（住友化學（股）製造的n〇blen FH1016)乾混合而成之原料，作為緩衝層形成混合樹脂以 外，係與實施例1相同地製作積層膜，並對此積層膜進行 了評價。再者’此積層膜的脫模層厚度，表裏均為25 緩衝層厚度為70 μ m。 評價結果為此積層膜的施壓套件的操作性良好（參照 表2)。於施壓後的FPC中，未發現空隙（參照表2)。此積 層膜’即便於熱壓後亦未產生破裂（參照表電路露出 膜與CL膜之間的黏著劑滲出至電路圖案之量未達 μιη’處於容許範圍内（參照表2)。緩衝層端面的滲出量 未達5 mm，處於容許範圍内（參照表2 )。 [實施例8] 除了使用將5重量份的SPS樹脂（出光興產（股）公司 製造的XAREC (註冊商標）S104)、90重量份的乙稀_曱基丙 烯酸甲酯共聚物（曱基丙烯酸甲酯衍生單元含量：14重量 0/〇)(住友化學（股）製造的ACRYFT (註冊商標）CM8033 ) 及5重量份的聚丙烯（住友化學（股）製造的n〇blenfh1〇16) 乾混合而成之原料，作為緩衝層形成混合樹脂以外，係與 實施例1相同地製作積層膜，並對此積層膜進行了評價。 V m，緩衝層 再者，此積層膜的脫模層厚度，表裏均為25 25 201144067 厚度為70 β m。 評價結果為此積層膜的施壓套件的操作性良好（參照 表2)。於施壓後的FPC中，未發現空隙（參照表2)。此積 層膜，即便於熱壓後亦未產生破裂（參照表2 )。電路露出 膜與CL膜之間的黏著劑滲出至電路圖案之量未達1〇〇 // m ’處於容許範圍内（參照表2 )。緩衝層端面的滲出量 未達5 mm，處於容許範圍内（參照表2 )。 [實施例9] 除了使用將20重量份的SPS樹脂（出光興產（股）公司 製造的XAREC(註冊商標）S104)、與80重量份的乙稀-甲基 丙烯酸曱酯共聚物（曱基丙烯酸曱酯衍生單元含量：5重 量％)(住友化學（股）製造的ACRYFT(註冊商標）WD106)乾 混合而成之原料，作為緩衝層形成混合樹脂以外，係與實 施例1相同地製作積層膜’並對此積層膜進行了評價。再 者’此積層模的脫模層厚度，表裏均為25 /zm，緩衝層厚 度為70 /z m。 §平價結果為此積層膜的施壓套件的操作性良好（參照 表3)。於施壓後的FPC中，未發現空隙（參照表3)。此積 層臈，即便於熱壓後亦未產生破裂（參照表3)β電路露出 膜與CL·膜之間的黏著劑滲出至電路圖案之量未達1〇〇 Mm，處於容許範圍内（參照表3)β然而，緩衝層端面的 滲出量為5 mm以上，處於容許範圍之外（參照表3)。 [實施例10] 除了使用將20重量份的SPS樹脂（出光興產（股）公司 26 201144067 製造的XAREC(註冊商標）sl〇4)、7〇重量 里里份的乙烯_甲基丙 烯酸甲酯共聚物（甲基丙烯酸甲酯衍 土早7L含量：2〇重量 住友化學（股）製造的ACRYFT (技冊商標）刪6) 及10重量份的聚丙烯（住友化學（股）製造的_LEN m〇16)乾混合而成之原料，作為緩衝層形成混合樹脂以 外，係與實施例1㈣地製作積層膜，並對此積層膜進行 了評價。再者’此積層膜的脫模層厚度，表裏均為25&quot;， 緩衝層厚度為70 /zm。 評價結果為此積層膜的施壓套件的操作性良好（來照 表3)。於施壓後的FPC中’未發現空隙（參照表3 )。此積 層膜，即便於熱壓後亦未產生破裂（參照表3)。電路露出 膜與CL膜之間的黏著劑滲出至電路圖案之量未達 //ni，處於容許範圍内（參照表3)。然而，緩衝層端面的 滲出量為5 mm以上，處於容許範圍之外（參照表3)。 [實施例11] 除了使用將20重量份的SPS樹脂（出光興產（股）公司 製造的XAREC(註冊商標）S104)、70重量份的乙稀_甲基丙 烯酸甲酯共聚物（甲基丙烯酸甲酯衍生單元含量：17 5重 量％)(住友化學（股）製造的ACRYFT (註冊商標）CM8014) 及10重里伤的¾^丙稀（住友化學（股）製造的N〇ble N FH1016 )混合而成之原料作為緩衝層形成混合樹脂以外， 係與實施例1相同地製作積層膜，並對此積層膜進行了評 價。再者，此積層膜的脫模層厚度，表裏均為25 /zm，緩 衝層厚度為70 /zm。 27 201144067 評價結果為此積層膜的施壓套件的操作性良好（參照 表3)。於施壓後的Fpc中，未發現空隙（參照表3 )。此積 層膜’即便於熱壓後亦未產生破裂（參照表3 電路露出 膜與CL膜之間的黏著劑滲出至電路圖案之量未達1 〇〇 y m ’處於容許範圍内（參照表3 )。然而，緩衝層端面的 渗出量為5 mm以上，處於容許範圍之外（參照表3 )。 [實施例12] 1.積層膜之製造 (1)脫模層的原料 脫模層的原料，使用的是SPS樹脂（出光興產（股）公 司製造的XAREC(註冊商標）S104)。 (2 )緩衝層的原料 緩衝層的原料，使用的是將20重量份的SPS樹脂（出 光興產（股）公司製造的XAREC (註冊商標）S104)、70重量份 的乙烯-曱基丙烯酸曱酯共聚物（甲基丙烯酸曱酯衍生單元 含量：5重量％)(住友化學（股）製造的aCRYFT(註冊商 標）WD106)及1〇重量份的聚丙烯（住友化學（股）製造的 NOBLEN FH1016 )乾混合而成之原料（以下稱為「緩衝層形 成混合樹脂」）。 (3)積層膜之製作 利用共擠壓法’製作於緩衝層表裏具有相同脫模層之 積層膜（參照第2圖）。 再者，具體而言’係使用多分歧管模具同時擠壓出SpS 樹脂、緩衝層形成混合樹脂及SPS樹脂，從而製作積層膜。 28 201144067 再者，此時使用了第3圖所示之裝置，第i親23〇的溫度 為35°C，托輥220的溫度為7(rc，第2報24〇相對於第又工 輥230之周速比為0.998。 關於此積層膜的脫模層厚度，表裏均為25 ，緩衝 層厚度為70/ζιη。 2.積層膜之評價 (1 )施壓套件的操作性 由操作者進行了感官試驗。其結果為，上述積層膜的 施壓套件的操作性良好（參照表4 )。 (2 )空隙觀察 利用光學顯微鏡觀察施壓後的FPC，於此Fpc中未發 現空隙（參照表4)。 (3 ) CL膜黏著試驗 實際上，利用上述積層膜，將經由黏著劑暫時固定有 CL膜之電路露出膜，自兩側包覆，並藉由加熱板㈣⑲ 照第5圖所示之加熱模式進行熱壓。之後，可輕易地將上 述積層膜自電路露出膜以及CL膜剝離（參照| 4)。再者， 於積層膜上，未產生破裂（參照表4)。電路露出膜與CL 膜之間的黏著劑滲出至電路圖案之量未達8() “，優於先 前的脫模膜（參照表4)。緩衝層端面的渗出量未達5mm， 處於容許範圍内（參照表4)。 (4 )脫模層的結晶度測定 自上述積層膜將脫模層剝下，利用差示掃描熱量計， 以2 0 C /分之速度，對此脫模層片 肌犋層月進仃升溫，測定熔化焓 29 201144067 (△ Hf)以及冷結晶化之焓（△ hTcc )。然後，將此熔化焓 (△ Hf )以及冷結晶化之給（△ hTcc )的值代入下式來計算 脫模層的結晶度，結果此值為15. 8% (參照表4 ) 結晶度（％) =1〇〇χ(ΔΗί-Δ Htcc ) /53 (J/g) [實施例13] 除了設定第1輥230的溫度為98 °C，托輥220的溫度 為120°C，第2輥240相對於第1輥230之周速比為〇. 998 以外，係與實施例12相同地製作積層膜，並對此積層膜進 行了評價。再者，此積層膜的脫模層厚度，表裏均為25 Mm，緩衝層厚度為70 /zm。 §平價結果為此積層膜的施壓套件的操作性良好（參照 表4)。於施壓後的FPC中，未發現空隙（參照表4)。此 積層膜，即便於熱壓後亦未產生破裂（參照表4)。電路 路出膜與CL膜之間的黏著劑滲出至電路圖案之量未達 vm，優於先前的脫模膜（參照表4)。緩衝層端面的滲出 量未達5 urn，處於容許範圍内.（參照表4)。此積層膜的 脫模層的結晶度為17. 3% (參照表4 )。積層膜可以輕易地 自電路露出膜以及CL膜剝離（參照表4)。 [實施例14] 除了設定第1輥230的溫度為35°C，托輥220的溫度 為7〇°C，第2輥240相對於第1輥230之周速比為〇 998 以外’係與實施例12相同地製作積層膜，進而，利用表面 恤度為120C之不鏽鋼板夾持此積層膜，並於壓力i〇Mpa 下保持10分鐘，以此進行退火處理之後，對此積層膜進行 30 201144067 了評價。再者，此積層膜的脫模層厚度，表裏均為25iUm， 緩衝層厚度為70 μιη。 評價結果為此積層膜的施壓套件的操作性良好（參照 表4)。於施壓後的FPC中，未發現空隙（參照表4) ^此 積層膜，即便於熱壓後亦未產生破裂（參照表4)。電路 露出膜與CL膜之間的黏著劑滲出至電路圖案之量未達8〇 V m ’優於先前的脫模膜（參照表4 )。緩衝層端面的滲出 量未達5 mm’處於容許範圍内（參照表4)。此積層膜的 脫模層的結晶度為20 · 5% (參照表4)。積層膜可輕易地自 電路露出膜以及CL膜剝離（參照表4 )。 [實施例15] 除了設定第1輥230的溫度為35。(：，托輥220的溫度 為70°C，第2輥240相對於第1輥230之周速比為〇. 998 以外’係與實施例12相同地製作積層膜，進而，利用表面 ⑽度為125C之不鐵鋼板夹持此積層膜，並於壓力1 〇Mpa 下保持10分鐘，以此進行退火處理後，對此積層膜進行了 評價。再者，此積層膜的脫模層厚度，表裏均為25 μπι， 緩衝層厚度為70 ym。 5平價結果為此積層膜的施壓套件的操作性良好（失照 表4) ^於施壓後的FPC中，未發現空隙（參照表4)。此 積層膜’即便於熱壓後亦未產生破裂（參照表4)。電路 露出膜與CL膜之間的黏著劑滲出至電路圖案之量未達 Vm，優於習知的脫模膜（參照表4)。緩衝層端面的滲出 量未達5 mm，處於容許範圍内（參照表4)。此積層膜的 31 201144067 脫模層的結晶度為23.4%(參照表4)。積®胺_p J 顸增膜可以輕易地 自電路露出膜以及CL膜剝離（參照表4 )。 [實施例16] 扼報2 2 0的溫度 之周速比為〇. 998 除了設定第1輥230的溫度為35°c 為7〇°C，第2輥240相對於第1輥23〇 以外，係與實施例12相同地製作積層膜，進而，利用表面 溫度為130°C之不鏽鋼板夹持此積層膜，並於壓力l〇Mpa 下保持10分鐘’以此進行退火處理後’對此積層膜進行了 評價。再者，此積層膜的脫模層厚度，表裏均為 緩衝層厚度為70 em。 5 平4貝結果為此積層膜的施壓套件的操作性良好（夫照 表4) ^於施壓後的FPC中’未發現空隙（參照表4)。此 積層膜’即便於熱壓後亦未產生破裂（參照表4) ^電路 露出膜與CL膜之間的黏著劑滲出至電路圖案之量未達8〇 以m’優於先前的脫模膜（參照表4)。緩衝層端面的滲出 量未達5 mm，處於容許範圍内（參照表4 )。此積層膜的 脫模層的結晶度為28. 7% (參照表4 )。積層膜可以輕易地 自電路露出膜以及CL膜剝離（參照表4)。 (比較例1) 除了使用將80重量份的乙烯-曱基丙烯酸曱酯共聚物 (甲基丙烯酸甲酯衍生單元含量：5重量％)(住友化學（股） 製造的ACRYFT(註冊商標）WD106)、與20重量份的聚丙烯 (住友化學（股）製造的NOBLEN FH1016)乾混合而成之原 料’作為緩衝層形成混合樹脂以外，係與實施例1相同地 32 201144067 製作積層m ’並對此積層膜進行了評價。再者，此積層膜 的脫模層厚度’表裏均為25 &quot;m，緩衝層厚度為7〇㈣。 評價結果為此積層膜的施壓套件的操作性良好（參照 表5)。於施壓後的FPC中，未發現空隙（參照表5)。此 積層膜，即便於熱壓後亦未產生破裂（參照表5)。電路 露出膜與CL膜之間的黏著劑滲出至電路圖案之量未達上⑽ Mm，處於容許範圍内（參照表5)。緩衝層端面的滲出量 未達5 nrn，處於容許範圍内（參照表5)。然而，當自完 成之FPC剝下積層膜時，緩衝層會自接觸電路露出膜及^ 膜之側之脫模層剝離，無法以良好的狀態取出Fpc。 (比較例2) 除了使用將40重量份的SPS樹脂（出光興產（股）公司 製造的XAREC(註冊商標）sl〇4)、5〇重量份的乙烯_甲基丙 烯酸甲酯共聚物（甲基丙烯酸曱酯衍生單元含量：5重量％) (住友化學（股）製造的ACRYFT(註冊商標）〇1〇6)及1〇重 量份的聚丙烯（住友化學（股）製造的N〇BLEN FH1〇i6)乾 混合而成之原料，作為緩衝層形成混合樹脂以外，係與實 施例1相同地製作積層冑，並對此積層膜進行了評價。再 者，此積層膜的脫模層厚度，表裏均為25 &quot;m，緩衝層厚 度為70 y m。 評價結果為，此積層膜的施壓套件的操作性不能謂之 為良好（參照表5)。於施壓後的Fpc中，發現了極為少 里的空隙（參照表5)。此積層膜，於熱壓後，產生了微 小的破裂（參照表5)。電路露出膜與CL膜之間的黏著劑 33 201144067 滲出至電路圖案之量為100 以上，處於容許範圍之外 (參，’、、表5)。緩衝層端面的滲出量未達&amp; mm，處於容許 範圍内（參照表5)。 (比較例3) 除了使用將70重量份的SPS樹脂（出光興產（股）公司 製造的XAREC(註冊商標）S104)、2〇重量份的乙烯_甲基丙 烯S文曱酯共聚物（甲基丙烯酸曱酯衍生單元含量：5重量％) (住友化學（股）製造的ACRYFT(註冊商標）WD1〇6)及1〇重 置份的聚丙烯（住友化學（股）製造的N〇BLEN FH1〇i6)乾 而成之原料，作為緩衝層形成混合樹脂以外，係與實 施例1相同地製作積層膜，並對此積層膜進行了評價。再 者’此積層膜的脫模層厚度，表裏均為25 ，緩衝層厚 度為7 0 # U]。 評價結果為此積層膜的施壓套件的操作性不佳（參照 表5)。於施壓後的FPC中，發現了相當大量之空隙 參 照表5)。此積層膜於熱壓後，產生了相對較大的破裂（參 照表5)。電路露出膜與CL膜之間的黏著劑滲出至電路圖 案之量為100 μ m以上，處於容許範圍之外（參照表5 )。 緩衝層端面的滲出量未達5 mm，處於容許範圍内 '(參照表 5) 。 * 34 201144067 〔1&lt;〕 實施例4 LO OJ XAREC 〇 1 »0 (N 容許範圍内 容許範圍内 &amp; 1 1 實施例3 m οα 1 〇 1 in CN 碟 容許範圍内 容許範圍内 &amp; 1 ϊ § 實施例2 LO οα 1 〇 1 们 CN 媸 碟 容許範圍内 容許範圍内 &amp; 〇 1 1 〇 實施例1 LO οα 1 〇 1 们 CS 容許範圍内 容許範圍内 &amp; 1 1 tn 層厚（ym) 樹脂成分 調配比率（重量份） 層厚（/zm) MMA調配量（重量％) 層厚（&quot;m) 積層膜整體厚度（//m) 施壓套件操作性 有無空隙 破裂之產生 黏著劑參出量 1端面滲出量 表側脱模層 緩衝層 裏側脫模層 評價結果 201144067 實施例8 in CN| XAREC ο 1 CN 碟 容許範圍内 容許範圍内 &amp; in EMMA 寸 實施例7 (N XAREC m ο 1 uo CN 宕 碟 容許範圍内 容許範圍内 o EMMA 寸 實施例6 in CN XAREC ο 1 in (N τ—Η 良好 容許範圍内 容許範圍内 £ o EMMA o 實施例5 in &lt;N XAREC 宕 ο 1 (N 良好 容許範圍内 容許範圍内 £ o EMMA o ο 層厚（# m) 樹脂成分 調配比率(重量份） 層厚(/ζ m) ΜΜΑ調配量（重量％) 層厚(//m) 積層膜整體厚度(#m) 施壓套件操作性 有無空隙 破裂之產生 黏著劑渗出量 端面渗出量 表側脫模層 緩衝層 裏側脫模層 評價結果 201144067 〔οοΐ 實施例11 CN XAREC 〇 1 (N 120 碟 容許範圍内 容許範圍外 〇 EMMA 〇 17.5 實施例10 in CS XAREC 〇 1 in (N 120 良好 碟 容許範圍外 &amp; 〇 EMMA 〇 S 實施例9 in (N XAREC 〇 1 &lt;N 1 120 1____ . 碟 Θ 祐· 容許範圍外 〇 EMMA 層厚(/zm) 樹脂成分 調配比率（重量份） 層厚(#m) MMA調配量（重量％) 層厚(#m) 瑶 施壓套件操作性 有無空隙 破裂之產生 黏著劑渗出量 端面渗出量 表側脫模層 緩衝層 裏側脫模層 評價結果 201144067 實施例16 _1 (N 震 〇 1 &lt;N 碟 容許範圍内 28.7 〇 1 〇 實施例15 (N 1 〇 1 in &lt;N t-H 容許範圍内 23.4 &amp; 〇 1 〇 in 實施例14 in (N 屬 〇 1 in (N 120 m 容許範圍内 20.5 &amp; 〇 麵 〇 in 實施例13 &lt;N 1 〇 1 i〇 &lt;N 良好 m #： 容許範圍内 17.3 &gt;fri^ 〇 1 〇 實施例12 (N 1 〇 1 yn cs 120 良好 容許範圍内 15.8 1 良好 〇 1 〇 層厚（#Π1) 樹脂成分 調配比率（重量份） 層厚（#m) j MMA調配量（重量％) 層厚（/zm) 積層膜^®!·度(/zm) 施壓套件操作性 有無空隙 破裂之產生 黏著劑滲出量 端面渗出量 結晶度(％) 脫模性 表側脫模層 緩衝層 評價結果 201144067 〔Lod 比較例3 CN XAREC 〇 〇 1 &lt;Ν 120 不良 容許範圍外 §： 〇 EMMA 比較例2 CN XAREC 〇 〇 1 CN 120 不良 容許範圍外 〇 EMMA 们 比較例1 CN XAREC 〇 〇 1 &lt;Ν 120 容許範圍内 EMMA in 層厚(^m) 樹脂成分 調配比率（重量份） 層厚〇m) MMA調配量（重量％) 層厚(/zm) 積層膜整體厚度(β m) 施壓套件操作性 有無空隙 破裂之產生 黏著劑滲出量 表側脫模層 緩衝層 裏侧脫模層 評價結果 201144067 [產業上之可利用性] 本發明之積層膜，具有能夠使施壓套件的操作性良 並可提μ FPC等的良品率之特徵，於藉由加壓施壓將 CL膜黏著至電路露出膜時，為了冑CL膜密接於電路圖案 的凹凸部’本發明之積層膜作為用於包覆覆蓋膜之脫模膜 尤其有用。 ' 作為脫模膜，還已知有（丨）於製造積層板時所使用之 脫模膜、（2)於製造前端複合材料製品時所使用之脫模膜、 以及（3 )於製造運動休閒用品時所使用之脫模膜本發明 之積層膜，作為這些脫模膜亦很有用。再者，於製造積層 板時所使用之脫模膜，係指於製造多層印刷基板時的施壓 成形中，為了防止印刷基板與隔板或其他印刷基板之間黏 著而介置於其間之膜。於製造前端複合材料製品時所使用 之脫模膜，係指例如，於使玻璃布、碳纖維或芳族聚醯胺 纖維和環氧樹脂所構成之預浸體硬化來製造各種製品時所 使用之膜。於製造運動休間用品時所使用之脫模膜，係指 例如於製造釣魚竿、高爾夫球桿的長柄及風浪板的桅杆等 時’在將預浸體捲成圓筒狀並使其於高壓釜中硬化時，纏 繞在此預浸體之上之膜。 除此之外’此積層膜，作為膠帶、雙面膠帶、遮蔽膠 帶、標簽、密封紙、貼紙、皮膚黏貼用藥布劑等的剝離膜 亦很有用。 此積層膜，作為於製造印刷電路基板、陶瓷電子零件、 熱硬化性樹脂製品或裝飾板等時所使用之步驟臈亦彳艮有 40 201144067 用。再者，此處所謂的步驟膜，係指於製造印刷基板'陶 瓷電子零件'熱硬化性樹脂製品或裴飾板等時，為了防止 金屬板之間或樹脂之間彼此黏著，而於成形步驟時夾於金 屬板之間或樹脂之間的膜，其尤其適用於製造積層板、撓 性印刷基板、前端複合材料製品或運動休間用品。 此積層膜，作為包裝膜亦很有用。 【圖式簡單說明】 第1圖係本發明的實施形態之積層膜的縱剖面圖。 第2圖係變化例（a )之積層膜的縱剖面圖。 第3圖係表示本發明的實施形態之積層膜的製造裝置 的一例之圖。 第4圖係表示本發明的實施形態之積層膜的使用方法 的一例之圖。 第5圖係表示於使用本發明的實施形態之積層膜來將 CL膜密接於電路圖案的凹凸部時，熱壓的加熱模式之圖。 第6圖係表示本發明的實施形態之積層膜的脫模層的 貯存彈性模數的溫度相關性之圖表。 201144067 【主要元件符號說明】 100 、 100A 積層膜 110 脫模層（第1脫模層） 110a 第1脫模層 110b 第2脫模層 120 緩衝層 210 模具 220 托棍 230 第1輥 240 第2輥 300 加熱板 310 不鐘鋼板 320 橡膠緩衝器 330 鐵氟龍片材 340 將電路露出膜和CL膜藉由黏著劑 暫時固定而成的材料 42The FPC after the pressure was observed by an optical microscope, and no void was found in the FPC (refer to Table X X (3) CL film adhesion test. Actually, the circuit in which the CL film was temporarily fixed via the adhesive was exposed by the above laminated film. The film was coated with both sides and pressed by a hot plate to perform hot pressing in a heating mode not shown in Fig. 5. As a result, no crack occurred on the laminated film (refer to Table 1). The circuit exposed film and CL film The amount of adhesive between the adhesive bleed to the circuit pattern is not reached, and within the allowable range (refer to Table 1), the amount of bleeding of the end face of the buffer layer is less than 5, which is within the allowable range (refer to Table 1). y [Example 2] In addition to using 20 parts by weight of SPS resin (XAREC (registered trademark) S1 (4) manufactured by Idemitsu Kosan Co., Ltd., 7 parts by weight of ethylene-methyl propylene m 曰 #polymer (mercapto acrylonitrile derivative) Unit content: 5-weight phantom (ACRYFT (registered trademark) Xie (8) manufactured by Sumitomo Chemical Co., Ltd.) and 1 〇 heavy-duty polypropylene (N〇BLEN FH1〇l6 manufactured by Sumitomo Chemical Co., Ltd.) Raw materials, as a buffer layer to form a mixed resin, 1 201144067 The example i was produced in the same manner as in the case of i. The laminate film was evaluated in the same manner. The evaluation results show that the workability of the pressure-sensitive adhesive layer of the laminated film is good. 1 Refer to Table 1). In the FPC after the pressure application, it was not found. Void: (Refer to Table 丄). = The film is not cracked even after hot pressing (refer to Table 〇. The amount of the adhesive between the exposed film and the CL film oozing out to the circuit pattern is less than 1 μm, Within the allowable range (see Table 1), the amount of bleeding of the end face of the β buffer layer was less than 5 mm, which was within the allowable range (see Table i). [Example 3] In addition to using 20 parts by weight of SPS resin XAREC (registered trademark) S104 manufactured by the company, 6 parts by weight of ethylene-methyl methacrylate copolymer (decyl methacrylate derivative unit content: 5 weights (ACRYFT manufactured by Sumitomo Chemical Co., Ltd.) A registered product of WD1〇6) and 2 parts by weight of polypropylene (N〇BLM FH1〇l6 manufactured by Sumitomo Chemical Co., Ltd.) is used as a buffer layer to form a mixed resin. The laminated crucible is produced in the same manner, and the laminated film is subjected to In addition, the thickness of the release layer of the laminated film was 25 in the table and the thickness of the buffer layer was 70 // m. The evaluation results showed that the pressure-applied kit of the laminated film was excellent in operation (refer to Table 1). In the FPC after pressing, no void was observed (refer to the laminated film of Table j), and no crack occurred even after hot pressing (see Table 丨). The amount of the adhesive between the exposed film and the CL film oozes to the circuit pattern. If it is less than i〇〇#m, it is within the allowable range (the amount of exudation of the end surface of the reference buffer layer is less than 5 mm and is within the allowable range (refer to Table 1). [Example 4] 22 201144067 In addition to the use of 20 parts by weight SPS resin (XAREC (§ ́s main trade mark) si〇4) manufactured by Idemitsu Kosan Co., Ltd., 50 parts by weight of ethylene-methyl methacrylate, a total of 1 (methyl methacrylate-derived vinegar derived unit content) % by weight (ACRYFT (registered trademark) 〇1〇6 manufactured by Sumitomo Chemical Co., Ltd.) and 3 parts by weight of polypropylene (N〇BLEN FHl〇i6 manufactured by Sumitomo Chemical Co., Ltd.) A product was produced in the same manner as in Example 1 except that a mixed resin was formed as a buffer layer. Film, and this laminated sheet was evaluated. Further, the thickness of the release layer of the laminated film was 25 in the front and the thickness of the buffer layer was 70 / X m. As a result of the evaluation, the workability of the pressure-sensitive adhesive layer of the laminated film was good (refer to Table 1). In the FPC after the pressure application, no void was observed (refer to Table n. The laminated film was not broken even after hot pressing (refer to Table n. The adhesive between the exposed film and the CL film leaked out to the circuit pattern) The amount of exudation of the end face of the β buffer layer is less than 5 mm within the allowable range (see Table 1), and is within the allowable range (refer to Table i). [Example 5] m, except for the weight of 2 使用Separate SPS resin (XAREC (registered trademark) S104 manufactured by Idemitsu Kosan Co., Ltd.), 70 parts by weight of ethylene-mercaptoacrylic acid vinegar copolymer (methacrylic acid methyl, although the content of the unit is: 1%) (ACRYFT (registered trademark) _ (1) manufactured by Sumitomo Chemical Co., Ltd. and 10 parts by weight of polypropylene (Sumitomo Chemical Co., Ltd. manufactured by the company) _ (8) dry mixed raw materials, as a buffer layer to form a mixed resin to The laminated film was produced in the same manner as the real shot &quot; and the laminated film was evaluated. Further, the thickness of the release layer of the laminated film was 2 23 201144067, and the thickness of the buffer layer was 70 //m. As a result, the operability of the pressure-applying kit for the laminated film is good (refer to 2). In the FPC after the pressure application, no void was found (refer to Table 2) ^ This laminated film did not cause cracking even after hot pressing (refer to Table 2) &lt;&gt; between the exposed film and the CL film The amount of adhesive oozing out to the circuit pattern is less than (10) //m, within the allowable range (refer to Table 2). The amount of exudation of the end face of the β buffer layer is less than 5 mm 'within the allowable range (refer to Table 2). Example 6] In addition to using 20 parts by weight of SPS resin (XAREC (registered trademark) S104 manufactured by Idemitsu Kogyo Co., Ltd.), 70 parts by weight of ethylene methyl methacrylate copolymer (derived from methacrylate) Unit content: 14% by weight) (ACRYFT (registered trademark) CM8033 manufactured by Sumitomo Chemical Co., Ltd.) and ίο parts by weight of polypropylene (n〇blen FH1016 manufactured by Sumitomo Chemical Co., Ltd.) A laminated film was produced in the same manner as in Example 1 except that the buffer layer was formed as a mixed resin, and the laminated film was evaluated. The thickness of the release layer of the laminated film was both $25 (10) and the thickness of the buffer layer was 70 / Zm. Evaluation results for the operation of the pressure-applying kit for this laminated film The properties were good (see Table 2). No voids were found in the FPC after the pressure application (see Table 2). This laminated film did not crack even after hot pressing (refer to Table 2). The circuit exposed the film and CL. The amount of adhesive between the films oozing out to the circuit pattern is not within the allowable range (see Table 2). The amount of exudation at the end face of the buffer layer is less than 5 mro, which is within the allowable range (refer to Table 2). Example 7] 24 201144067 In addition to using 39 parts by weight of SPS resin (XAREC (registered trademark) S104 manufactured by Idemitsu Kogyo Co., Ltd.), 21 parts by weight of an ethylene-mercapto methacrylate copolymer (methacrylic acid A) Ester-derived unit content: wt%) (ACRYFT (registered trademark) CM8〇33^ manufactured by Sumitomo Chemical Co., Ltd. and 40 parts by weight of polypropylene (n〇blen FH1016 manufactured by Sumitomo Chemical Co., Ltd.) A laminated film was produced in the same manner as in Example 1 except that a mixed resin was formed as a buffer layer, and the laminated film was evaluated. Furthermore, the thickness of the release layer of the laminated film was 25 μm in the surface of the buffer layer. As a result of the evaluation, the workability of the pressure-applying kit for the laminated film was good (refer to Table 2). No void was found in the FPC after the pressure application (refer to Table 2). This laminated film 'is not broken even after hot pressing (the amount of the adhesive between the exposed film and the CL film oozing out to the circuit pattern is less than μηη) is within an allowable range (refer to Table 2). The amount of exudation is less than 5 mm and is within the allowable range (refer to Table 2). [Example 8] In addition to 5 parts by weight of SPS resin (XAREC (registered trademark) S104 manufactured by Idemitsu Kosan Co., Ltd.), 90 parts by weight of ethylene methyl methacrylate copolymer (methyl methacrylate derivative unit content: 14 weight 0 / 〇) (ACRYFT (registered trademark) CM8033 manufactured by Sumitomo Chemical Co., Ltd.) and 5 parts by weight A laminate film was prepared in the same manner as in Example 1 except that a polypropylene resin (n〇blenfh1〇16 manufactured by Sumitomo Chemical Co., Ltd.) was used as a buffer material to form a mixed resin, and the laminate film was evaluated. V m, buffer layer Further, the thickness of the release layer of the laminated film is 25 25 201144067 and the thickness is 70 β m. The evaluation results show that the pressure-sensitive adhesive layer of the laminated film has good workability (refer to Table 2). In the FPC after the pressure, not The void was found (refer to Table 2). This laminated film did not cause cracking even after hot pressing (refer to Table 2). The amount of the adhesive between the exposed film and the CL film oozing out to the circuit pattern was less than 1 〇〇/ / m ' is within the allowable range (refer to Table 2). The amount of bleeding of the end face of the buffer layer is less than 5 mm and is within the allowable range (refer to Table 2). [Example 9] In addition to using 20 parts by weight of SPS resin (light-emitting) XAREC (registered trademark) S104 manufactured by Xingye Co., Ltd., and 80 parts by weight of ethylene-methyl methacrylate copolymer (decyl methacrylate derivative unit content: 5% by weight) (Sumitomo Chemical Co., Ltd.) In the same manner as in Example 1, a laminated film was produced in the same manner as in Example 1 except that the raw material of the manufactured ACRYFT (registered trademark) WD106 was used as a buffer layer, and the laminated film was evaluated. The thickness of the release layer of the mold is 25 /zm in the surface and the thickness of the buffer layer is 70 /zm. § The result of the parity is good for the pressure-applying kit of the laminated film (refer to Table 3). In the FPC after pressure application No voids were found (refer to Table 3). It is easy to prevent cracking after hot pressing (refer to Table 3). The amount of the adhesive between the exposed film of the β circuit and the CL·film oozes to the circuit pattern is less than 1 μm, which is within the allowable range (refer to Table 3). The amount of bleeding of the end face of the buffer layer was 5 mm or more, which was outside the allowable range (refer to Table 3). [Example 10] Except that 20 parts by weight of SPS resin (XAREC manufactured by Idemitsu Co., Ltd. 26 201144067) was used. (registered trademark) sl〇4), 7〇 by weight of ethylene-methyl methacrylate copolymer (methyl methacrylate derivative soil 7L content: 2 〇 weight of ACRYFT manufactured by Sumitomo Chemical Co., Ltd. (6) and 6 parts by weight of polypropylene (the _LEN m〇16 manufactured by Sumitomo Chemical Co., Ltd.) are dry-blended, and a mixed resin is formed as a buffer layer, and a laminate is produced in the same manner as in the first embodiment. The film was evaluated for this laminated film. Furthermore, the thickness of the release layer of the laminated film was 25 &quot;, and the thickness of the buffer layer was 70 /zm. As a result of the evaluation, the workability of the pressure-applying kit for the laminated film was good (see Table 3). No void was observed in the FPC after the pressure (see Table 3). This laminated film did not cause cracking even after hot pressing (refer to Table 3). The amount of the adhesive between the film and the CL film oozing out to the circuit pattern is less than /4 ni, which is within the allowable range (refer to Table 3). However, the amount of bleeding of the end face of the buffer layer is 5 mm or more, which is outside the allowable range (refer to Table 3). [Example 11] In addition to using 20 parts by weight of SPS resin (XAREC (registered trademark) S104 manufactured by Idemitsu Kogyo Co., Ltd.), 70 parts by weight of ethylene methyl methacrylate copolymer (methacrylic acid) Methyl ester derived unit content: 17 5 wt%) (ACRYFT (registered trademark) CM8014 manufactured by Sumitomo Chemical Co., Ltd.) and 10⁄4^ propylene (N〇ble N FH1016 manufactured by Sumitomo Chemical Co., Ltd.) A laminated film was produced in the same manner as in Example 1 except that the obtained raw material was used as a buffer layer to form a mixed resin, and the laminated film was evaluated. Further, the thickness of the release layer of the laminated film was 25 /zm in the surface and the thickness of the buffer layer was 70 /zm. 27 201144067 Evaluation results The operability of the pressure-applying kit for laminated film is good (refer to Table 3). No void was found in the Fpc after the pressure application (refer to Table 3). This laminated film 'has not broken even after hot pressing (refer to Table 3, the adhesive between the exposed film and the CL film oozes to the circuit pattern is less than 1 〇〇 ym ' within the allowable range (refer to Table 3) However, the amount of bleeding of the end face of the buffer layer is 5 mm or more, which is outside the allowable range (refer to Table 3). [Example 12] 1. Production of laminated film (1) Raw material of release layer of release layer The SPS resin (XAREC (registered trademark) S104 manufactured by Idemitsu Kosan Co., Ltd.) is used. (2) The raw material buffer layer of the buffer layer is made of 20 parts by weight of SPS resin. XAREC (registered trademark) S104 manufactured by the company, 70 parts by weight of an ethylene-mercapto methacrylate copolymer (content of methacrylate-derived unit: 5% by weight) (aCRYFT manufactured by Sumitomo Chemical Co., Ltd.) (registered trademark) WD106) and 1 part by weight of polypropylene (NOBLEN FH1016 manufactured by Sumitomo Chemical Co., Ltd.) are dry-mixed raw materials (hereinafter referred to as "buffer layer forming mixed resin"). (3) Laminated film Production by co-extrusion method in the buffer layer A laminate film having the same release layer in the table (see Fig. 2). Specifically, a laminate film is produced by simultaneously extruding a SpS resin and a buffer layer to form a mixed resin and an SPS resin using a manifold mold. 28 201144067 Furthermore, at this time, the device shown in Fig. 3 is used, the temperature of the i-th parent 23 为 is 35 ° C, and the temperature of the idler 220 is 7 (rc, the second report 24 〇 relative to the second work roll The circumferential speed ratio of 230 is 0.998. The thickness of the release layer of the laminated film is 25 in the table, and the thickness of the buffer layer is 70/ζι. 2. Evaluation of the laminated film (1) The operability of the pressing set is performed by the operator The sensory test was carried out. As a result, the workability of the pressure-sensitive adhesive layer of the laminated film was good (see Table 4). (2) Observation of voids The FPC after the pressure was observed by an optical microscope, and no void was found in the Fpc (refer to the table). 4) (3) CL film adhesion test In fact, the film is exposed by a circuit in which a CL film is temporarily fixed by an adhesive, and is coated from both sides by a heating film (four) 19 as shown in Fig. 5 The heating mode is hot pressed. After that, the above can be easily The film was peeled off from the circuit exposed film and the CL film (see | 4). Further, no crack occurred on the laminated film (refer to Table 4). The amount of the adhesive between the exposed film and the CL film oozes to the circuit pattern. Less than 8 () ", better than the previous release film (refer to Table 4). The amount of exudation of the end face of the buffer layer is less than 5 mm, which is within the allowable range (refer to Table 4). (4) Crystallinity of the release layer The release layer was peeled off from the above laminated film, and the temperature of the release layer of the release layer was increased by a differential scanning calorimeter at a rate of 20 C /min., and the melting enthalpy was measured. 29 201144067 (△ Hf ) and the crystallization of cold crystallization (△ hTcc ). Then, the crystallinity of the release layer is calculated by substituting the value of the enthalpy of enthalpy (ΔHf) and the crystallization of the cold crystallization (ΔhTcc), and the value is 15.8% (refer to Table 4). %) = 1 〇〇χ (ΔΗί - Δ Htcc ) / 53 (J / g) [Example 13] In addition to setting the temperature of the first roll 230 to 98 ° C, the temperature of the idler 220 was 120 ° C, the second A laminate film was produced in the same manner as in Example 12 except that the peripheral speed ratio of the roller 240 to the first roller 230 was 〇. 998, and the laminate film was evaluated. Further, the thickness of the release layer of the laminated film was 25 Mm in the surface and the thickness of the buffer layer was 70 /zm. § The result of the parity is good for the pressure-sensitive kit of the laminated film (refer to Table 4). No void was found in the FPC after the pressure application (refer to Table 4). This laminated film did not cause cracking even after hot pressing (refer to Table 4). The amount of adhesive between the circuit-out film and the CL film oozing out to the circuit pattern is less than vm, which is superior to the previous release film (refer to Table 4). The amount of bleeding on the end face of the buffer layer is less than 5 urn, which is within the allowable range (see Table 4). The crystallinity of the release layer of the laminated film was 17.3% (refer to Table 4). The laminated film can be easily peeled off from the circuit exposed film and the CL film (refer to Table 4). [Example 14] In addition to setting the temperature of the first roll 230 to 35 ° C, the temperature of the idler 220 was 7 ° C, and the peripheral speed ratio of the second roll 240 to the first roll 230 was 〇 998. In the same manner as in Example 12, a laminated film was produced in the same manner, and the laminated film was held by a stainless steel plate having a surface degree of 120 C, and held under pressure i〇Mpa for 10 minutes to carry out annealing treatment, and then the laminated film was subjected to 30. 201144067 The evaluation. Further, the thickness of the release layer of the laminated film was 25 μMm in the surface and the thickness of the buffer layer was 70 μm. As a result of the evaluation, the workability of the pressure-sensitive adhesive layer of the laminated film was good (refer to Table 4). No void was observed in the FPC after the pressure application (refer to Table 4). This laminate film did not cause cracking even after hot pressing (refer to Table 4). The adhesive between the exposed film and the CL film bleeds out to the circuit pattern by less than 8 〇 V m ' to be superior to the previous release film (refer to Table 4). The amount of bleeding on the end face of the buffer layer was less than 5 mm' (see Table 4). The release layer of this laminated film had a crystallinity of 20 · 5% (refer to Table 4). The laminated film can be easily peeled off from the circuit exposed film and the CL film (refer to Table 4). [Example 15] The temperature of the first roll 230 was set to 35. (: The temperature of the idler roller 220 is 70 ° C, and the peripheral speed ratio of the second roller 240 to the first roller 230 is 〇. 998.) A laminated film is produced in the same manner as in the embodiment 12, and the surface (10) is further used. The laminated film was sandwiched between a 125 C non-ferrous steel sheet and held at a pressure of 1 〇Mpa for 10 minutes, and then the laminate film was evaluated. Further, the thickness of the release layer of the laminated film was The table has a thickness of 25 μm and a buffer layer thickness of 70 μm. 5 The parity result is good for the pressure-sensitive test piece of the laminated film (disqualification table 4) ^In the FPC after pressure application, no void is found (refer to Table 4) The laminated film 'failed even after hot pressing (refer to Table 4). The adhesive between the exposed film and the CL film oozes out to the circuit pattern in an amount of less than Vm, which is superior to the conventional release film. (Refer to Table 4.) The amount of exudation of the end face of the buffer layer is less than 5 mm, which is within the allowable range (refer to Table 4). 31 201144067 The laminated film has a crystallinity of 23.4% (see Table 4). The amine_p J 顸 film can be easily peeled off from the circuit exposed film and the CL film (refer to Table 4). [Example 16] 扼The circumferential speed ratio of the temperature of 2 2 0 is 〇. 998. The second roller 240 is the same as the first embodiment except that the temperature of the first roller 230 is 35 ° C is 7 ° C. A laminated film was produced, and the laminated film was sandwiched by a stainless steel plate having a surface temperature of 130 ° C, and held at a pressure of 10 MPa for 10 minutes. After the annealing treatment, the laminated film was evaluated. The thickness of the release layer of the laminated film is 70 em. The thickness of the buffer layer is 70 em. The result of the pressure of the laminate of the laminated film is good (cf. Table 4) ^ after the pressure application In the FPC, no void was found (refer to Table 4). This laminated film did not crack even after hot pressing (refer to Table 4) ^The amount of adhesive between the exposed film and the CL film oozing out to the circuit pattern was not reached. 8〇 is superior to the previous release film by m' (refer to Table 4). The amount of exudation of the end face of the buffer layer is less than 5 mm, which is within the allowable range (refer to Table 4). The crystallinity of the release layer of the laminated film is 28. 7% (refer to Table 4). The laminate film can be easily peeled off from the circuit and the CL film (refer to Table 4). 1) In addition to using 80 parts by weight of an ethylene-mercapto methacrylate copolymer (methyl methacrylate derivative unit content: 5% by weight) (ACRYFT (registered trademark) WD106 manufactured by Sumitomo Chemical Co., Ltd.), and 20 In the same manner as in Example 1, except that the raw material of the polypropylene (manufactured by Sumitomo Chemical Co., Ltd., NOBLEN FH1016) was mixed and formed as a buffer layer, a laminate m' was produced in the same manner as in Example 1 and the laminate film was formed. In addition, the thickness of the release layer of the laminated film is 25 &quot; m, and the thickness of the buffer layer is 7 〇 (four). As a result of the evaluation, the workability of the pressure-applying kit for the laminated film was good (refer to Table 5). No void was found in the FPC after the pressure application (refer to Table 5). This laminated film did not cause cracking even after hot pressing (refer to Table 5). The amount of the adhesive between the exposed film and the CL film oozing out to the circuit pattern is less than (10) Mm, which is within the allowable range (refer to Table 5). The amount of bleeding on the end face of the buffer layer was less than 5 nrn and was within the allowable range (refer to Table 5). However, when the laminated film is peeled off from the completed FPC, the buffer layer peels off from the release layer on the side where the contact film is exposed and the film is removed, and the Fpc cannot be taken out in a good state. (Comparative Example 2) In addition to using 40 parts by weight of SPS resin (XAREC (registered trademark) sl 4 manufactured by Idemitsu Kosan Co., Ltd.), 5 parts by weight of ethylene-methyl methacrylate copolymer (A) Ethyl acrylate-derived unit content: 5% by weight) (ACRYFT (registered trademark) 〇1〇6 manufactured by Sumitomo Chemical Co., Ltd.) and 1 part by weight of polypropylene (N〇BLEN FH1 manufactured by Sumitomo Chemical Co., Ltd.) In the same manner as in Example 1, except that the mixed raw material was used as a buffer layer to form a mixed resin, the laminated film was evaluated. Further, the thickness of the release layer of the laminated film was 25 &quot; m in the surface and the thickness of the buffer layer was 70 μm. As a result of evaluation, the workability of the pressure-applying kit of the laminated film was not good (refer to Table 5). In the Fpc after the pressure application, extremely few voids were found (refer to Table 5). This laminated film produced a slight crack after hot pressing (refer to Table 5). Adhesive between the exposed film of the circuit and the CL film 33 201144067 The amount of exudation to the circuit pattern is 100 or more, which is outside the allowable range (see, ', Table 5). The amount of bleeding on the end face of the buffer layer was less than & mm and was within the allowable range (refer to Table 5). (Comparative Example 3) In addition to using 70 parts by weight of SPS resin (XAREC (registered trademark) S104 manufactured by Idemitsu Kogyo Co., Ltd.), 2 parts by weight of ethylene-methyl propylene sulfonate copolymer (A) Dimethyl acrylate-derived unit content: 5% by weight) (ACRYFT (registered trademark) WD1 〇 6 manufactured by Sumitomo Chemical Co., Ltd.) and 1 〇 replacement portion of polypropylene (Numi BLEN FH1 manufactured by Sumitomo Chemical Co., Ltd.) In the same manner as in Example 1, except that the mixed raw material was used as the buffer layer to form a mixed resin, the laminated film was evaluated. Further, the thickness of the release layer of the laminated film was 25 in the surface and the thickness of the buffer layer was 70 # U]. As a result of the evaluation, the workability of the pressure-applying kit for the laminated film was poor (refer to Table 5). A considerable amount of voids were found in the FPC after pressing, see Table 5). This laminate film produced a relatively large crack after hot pressing (refer to Table 5). The amount of the adhesive between the exposed film and the CL film oozing out to the circuit pattern is 100 μm or more, which is outside the allowable range (refer to Table 5). The amount of bleeding on the end face of the buffer layer is less than 5 mm and is within the allowable range ' (see Table 5). * 34 201144067 [1&lt;] Example 4 LO OJ XAREC 〇1 »0 (N Within the allowable range within the allowable range & 1 1 Example 3 m οα 1 〇1 in CN Within the allowable range of the disc & 1 ϊ § Example 2 LO οα 1 〇1 CN Within the allowable range of the allowable range & 〇1 1 〇Example 1 LO οα 1 〇1 CS Within the allowable range within the allowable range & 1 1 tn Layer thickness (ym Resin composition ratio (parts by weight) Layer thickness (/zm) MMA compounding amount (% by weight) Layer thickness (&quot;m) Integrated film thickness (//m) Pressure-applied kit operability with or without void cracking Reference amount 1 end surface exudation gauge side release layer buffer layer inner side release layer evaluation result 201144067 Example 8 in CN| XAREC ο 1 CN Within the allowable range of the disc tolerance &amp; in EMMA inch Example 7 (N XAREC m ο 1 uo CN 宕 allowed within the allowable range o EMMA inch Example 6 in CN XAREC ο 1 in (N τ - 容许 within the allowable range within the allowable range £ o EMMA o Example 5 in &lt;N XA REC 宕ο 1 (N Within the allowable range of good tolerance range £ o EMMA o ο Layer thickness (# m) Resin composition ratio (parts by weight) Layer thickness (/ζ m) ΜΜΑ Formulation (% by weight) Layer thickness (/ /m) Overall thickness of laminated film (#m) Pressure-sensitive test kit Operating property with or without void cracking Adhesive agent Exudation amount End surface Exudation gauge side Release layer Buffer layer Inside side release layer Evaluation result 201144067 [οοΐ Example 11 CN XAREC 〇1 (N 120 disc tolerance within the allowable range 〇EMMA 〇17.5 Example 10 in CS XAREC 〇1 in (N 120 Good disc tolerance range &amp; 〇EMMA 〇S Example 9 in (N XAREC 〇1 &lt; N 1 120 1____ . 碟 Θ · Allowable range 〇 EMMA layer thickness (/zm) Resin composition ratio (parts by weight) Layer thickness (#m) MMA compounding amount (% by weight) Layer thickness (#m) Kit operability with or without void rupture, adhesive bleed amount, end surface bleed out, side release layer, buffer layer, inner release layer evaluation result 201144067 Example 16 _1 (N shock 1 &lt;N disc tolerance range 28.7 〇1 〇Example 15 (N 1 〇 1 in &lt; N tH Within the allowable range 23.4 &amp; 〇 1 〇in Example 14 in (N belongs to in 1 in (N 120 m permissible range 20.5 &amp; 〇 〇 in Example 13 &lt;N 1 〇1 i〇&lt;N Good m #: Within the allowable range 17.3 &gt;fri^ 〇1 〇Example 12 (N 1 〇1 yn cs 120 Within a good tolerance range 15.8 1 Good 〇1 〇 layer thickness ( #Π1) Resin composition ratio (parts by weight) Layer thickness (#m) j MMA compounding amount (% by weight) Layer thickness (/zm) Laminated film ^®!·degree (/zm) Pressure test kit operability with or without void cracking Adhesive bleed amount End surface bleed amount Crystallinity (%) Release property side release layer buffer layer evaluation result 201144067 [Lod Comparative Example 3 CN XAREC 〇〇1 &lt; Ν 120 Out of tolerance range §: 〇EMMA comparison Example 2 CN XAREC 〇〇1 CN 120 Poor tolerance range 〇EMMA Comparison Example 1 CN XAREC 〇〇1 &lt;Ν 120 Within the allowable range EMMA in Layer thickness (^m) Resin composition ratio (parts by weight) Layer thickness 〇 m) MMA blending amount (heavy %) Thickness of layer (/zm) Overall thickness of laminated film (β m) Pressure-sensitive test kit Operational presence or absence of void cracking Adhesive exudation amount Side release layer Buffer layer Inside side release layer Evaluation result 201144067 [Industrial use The laminated film of the present invention has the characteristics of being able to improve the workability of the pressure-applying kit and improving the yield of μ FPC, etc., and when the CL film is adhered to the circuit to expose the film by pressure application, in order to 胄CL The film is in close contact with the uneven portion of the circuit pattern. The laminated film of the present invention is particularly useful as a release film for coating a cover film. 'As a release film, there are also known release films used in the production of laminates, (2) release films used in the manufacture of front-end composite products, and (3) in the manufacture of sportswear. Release Film Used in Supplies The laminate film of the present invention is also useful as these release films. Further, the release film used in the production of the laminated board refers to a film interposed therebetween in order to prevent adhesion between the printed substrate and the separator or other printed substrate during press forming in the production of the multilayer printed substrate. . The release film used in the manufacture of the front end composite material means, for example, used in the production of various products by hardening a prepreg composed of glass cloth, carbon fiber or aramid fiber and epoxy resin. membrane. The release film used in the manufacture of the sports rest means, for example, when manufacturing a fishing rod, a long handle of a golf club, and a mast of a windsurfing board, etc. 'When the prepreg is rolled into a cylindrical shape and made high pressure When hardened in the kettle, the film is wound around the prepreg. In addition, this laminated film is also useful as a release film for tapes, double-sided tapes, masking tapes, labels, sealing papers, stickers, and skin patching agents. This laminated film is used as a step for producing a printed circuit board, a ceramic electronic component, a thermosetting resin product, a decorative board, or the like, and is also used in 2011. In addition, the term "step film" as used herein refers to a forming step in order to prevent adhesion between metal plates or resins when manufacturing a printed circuit board 'ceramic electronic component' thermosetting resin product or a enamel plate. A film sandwiched between metal sheets or between resins, which is particularly suitable for use in the manufacture of laminates, flexible printed substrates, front end composite articles or sports articles. This laminated film is also useful as a packaging film. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a longitudinal sectional view showing a laminated film according to an embodiment of the present invention. Fig. 2 is a longitudinal sectional view showing a laminated film of a modification (a). Fig. 3 is a view showing an example of a manufacturing apparatus of a laminated film according to an embodiment of the present invention. Fig. 4 is a view showing an example of a method of using a laminated film according to an embodiment of the present invention. Fig. 5 is a view showing a heating mode of hot pressing when the CL film is adhered to the uneven portion of the circuit pattern by using the laminated film of the embodiment of the present invention. Fig. 6 is a graph showing the temperature dependence of the storage elastic modulus of the release layer of the laminated film of the embodiment of the present invention. 201144067 [Description of main component symbols] 100, 100A laminated film 110 Release layer (first release layer) 110a First release layer 110b Second release layer 120 Buffer layer 210 Mold 220 Stick 230 First roll 240 2nd Roller 300 heating plate 310 not steel plate 320 rubber bumper 330 Teflon sheet 340 material that exposes the film and the CL film temporarily fixed by the adhesive 42

Claims (1)

201144067 七、申請專利範圍： 1. 一種積層膜，其包括： 第1脫模層’其由以具有對排結構之聚笨乙烯系樹脂 為主要成分之樹脂所形成；以及 緩衝層，其含有超過60重量份且為98重量份以下之 聚烯烴系樹脂、和2重量份以上且未達4 0重量份之具有對 排結構之聚本乙稀糸樹脂，並設置於上述第1脫模層的_ 側0 2. 如申請專利範圍第1項所述之積層膜，其中： 上述聚烯烴系樹脂，係含有3重量份以上且為40重量 份以下之聚丙烯樹脂、和超過20重量份且為95重量份以 下之乙烯-曱基丙烯酸甲酯共聚物樹脂。 3. 如申請專利範圍第2項所述之積層膜，其中： 於上述乙烯-甲基丙烯酸甲酯共聚物樹脂中，含有5重 量％以上且為14重量％以下之由曱基丙烯酸甲酯所衍生之 單元。 4. 如申請專利範圍第1項至第3項中任一項所述之積層 膜，其中： 第1脫模層，係由以具有對排結構之聚苯乙烯系樹脂 為主要成分，且藉由差示掃描熱量測定法測定之結晶度為 14.0%以上且未達30.0%之樹脂所形成。 43 201144067 5.如申請專利範圍第 膜，其中： 1項至第 3項中任一 項所述之積層 1脫模層形成側的 進而包括形成於上述緩衝層之與第 相反側之第2脫模層。 •如申請專利範圍第5項所述之積層膜，其中： 上述第2脫模層，係由以具有上述對排結構之聚苯乙 歸系樹脂為主要成分之樹脂所形成。 如申請專利範圍第6項所述之積層膜，其中： 形成上述第2脫模層之樹脂，係藉由差示掃描熱量測 定法測定之結晶度為14. 0%以上且未達30. 0%。 44201144067 VII. Patent Application Range: 1. A laminated film comprising: a first release layer formed of a resin mainly composed of a polystyrene resin having a side-by-side structure; and a buffer layer containing more than 60 parts by weight and 98 parts by weight or less of the polyolefin-based resin, and 2 parts by weight or more and less than 40 parts by weight of the polyethylene ruthenium resin having the aligned structure, and disposed on the first release layer The laminated film according to the first aspect of the invention, wherein the polyolefin resin contains 3 parts by weight or more and 40 parts by weight or less of the polypropylene resin, and more than 20 parts by weight. 95 parts by weight or less of the ethylene-methyl methacrylate copolymer resin. 3. The laminated film according to claim 2, wherein: the ethylene-methyl methacrylate copolymer resin contains 5% by weight or more and 14% by weight or less of methyl methacrylate Derived unit. 4. The laminated film according to any one of the preceding claims, wherein: the first release layer is composed of a polystyrene resin having a side-by-side structure as a main component, and The resin having a crystallinity of 14.0% or more and less than 30.0% as measured by differential scanning calorimetry was formed. The method of forming a release layer of the laminate 1 according to any one of the items 1 to 3, further comprising forming a second off on the opposite side of the buffer layer. Mold layer. The laminated film according to claim 5, wherein the second release layer is formed of a resin containing a polyphenylene-based resin having the above-described aligned structure as a main component. The crystallization of the resin of the second release layer is determined by differential scanning calorimetry. The crystallinity measured by the differential scanning calorimetry is 14.0% or more and less than 30. 0. %. 44
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Cited By (2)

* Cited by examiner, † Cited by third party
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TWI675617B (en) * 2012-08-16 2019-10-21 日商住友電木股份有限公司 Electromagnetic wave shielding film and method of covering electronic component
TWI815578B (en) * 2017-03-22 2023-09-11 日商住友電木股份有限公司 Release film and method for manufacturing flexible circuit board

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5895755B2 (en) * 2012-07-17 2016-03-30 住友ベークライト株式会社 Release film
JP6062407B2 (en) * 2013-11-14 2017-01-18 株式会社ダイセル Release film, laminate, method for producing the same, and method for producing fuel cell

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1255146A (en) * 1997-05-30 2000-05-31 陶氏化学公司 Films made from long chain branched syndiotactic vinyl aromatic polymers
JP2001047573A (en) * 1999-08-06 2001-02-20 Idemitsu Petrochem Co Ltd Resin laminate
JP2001310428A (en) * 2000-04-28 2001-11-06 Idemitsu Petrochem Co Ltd Laminated film and its application
JP4216010B2 (en) * 2002-07-17 2009-01-28 出光興産株式会社 Adhesive resin composition and laminate
WO2009016952A1 (en) * 2007-07-31 2009-02-05 Sumitomo Bakelite Co., Ltd. Mold release film
JP5245497B2 (en) * 2008-03-31 2013-07-24 住友ベークライト株式会社 Release film

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI675617B (en) * 2012-08-16 2019-10-21 日商住友電木股份有限公司 Electromagnetic wave shielding film and method of covering electronic component
TWI815578B (en) * 2017-03-22 2023-09-11 日商住友電木股份有限公司 Release film and method for manufacturing flexible circuit board

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