201141773 , 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種晶圓輸送分配裝置及其方法’尤其是一種藉由不同 輸送方向之晶圓輸送軌道，來達到晶圓進行輸送時，可自動分配晶圓輸送 路徑之動作。 【先前技術】 隨著科技不斷地提昇’目前半導體廠、太陽能電池晶圓廠為了提高生 0 產力或保持競爭優勢，有很多都已經採用自動化方式進行晶圓的製造與搬 運，同時可以節省人事成本以及提高生產效率，因此工廠自動化已經是半 導體必然的走向了，而為了因應工廠自動化，有許多工廠的輸送系統以及 輸送路線的設計是非常重要的。 一般在工廠中的晶圓搬送處理，係為載入裝置將晶圓載入輸送帶上， 將晶圓藉由輸送帶（輸送軌道）運送至承載裝置或作業平台，因此輸送帶 的穩定與否非常重要’當輸送帶發生蛇行或不平滑移動時，祕容易導致 Φ 晶圓掉落、疊置、或不均勻沈積； 而目剛之輸送系統大多為單—方向運送之輸送軌道，因此當晶圓輸 送路！需要轉換方向，往往僅能單一軌道對單一軌道運送，故會相當浪費 廠房規劃之空間，而目前之輸送系統也都是採用無人自動化進行搬運，因 在4之喊個廠制部的尺寸、高度及晶賭送路徑料都必須事先 規劃好乂些規劃一旦畴定之後就不能夠輕易做變更，因此若是有某一個 地方在運送路徑上做了敎，肢得整個晶圓盒的輸送流程產生衝突。 因此’若能提供—種自動化晶圓輸送分配裝置及其方法，當複數個載 201141773 入裝置將晶圓載入複數個輸送帶上時，可經由晶圓輸送裝置之改良，使晶 圓能夠轉換輸送至不同輸送帶上，以期使作業平台與載送工具以及晶圓承 載裝置之間，可以順利地進行輸送並且可以避免過多的廠房空間浪費。 【發明内容】 本發明之目的即在於提供一種晶圓輸送分配裝置及其方法，係為了使 晶圓輸送帶能夠自動調整，並能配合晶圓輸送路徑，使得晶圓輸送能夠自 動調整方向。 本發明之次要目的即在於提供一種晶圓輸送分配裝置及其方法，係為 了能夠在產線規劃時，可以使晶圓輸送路徑更有規劃之彈性，同時能節省 產線空間使用。 可達成上述發明目的之晶圓輸送分配裝置及其方法，係由兩個橫向輸 送執道、複數個縱向輸送軌道所組成，其中該橫向輸送軌道中係包含複數 個軌道交錯結構、-導正裝置一緩衝容置件及祕平行設置於橫向輸送 軌道兩側之輸送帶，而該軌道交錯結構係設置於兩組平行設置之輸送帶中 央其中該軌道交錯結構之左右兩端係為一凹口，並於中央凸口頂端設置 -感測器，用於晶圓通過縱向輸送軌道與橫向輸送軌道交錯區域之軌道交 錯’、、„構時’賴數個縱向輸送軌道會自動下降與兩個橫向輸送軌道交錯重 疊’並使輪送之晶圓能經由橫向輸送軌道輸送，財便承接設備之使用。 而該縱向輸送執道及橫向輸送軌道之輸送晶圓方向前端處，係會各自 設置-緩衝容置件，用於暫時容置晶圓之用，因此當輸送之晶圓停止於輸 送帶上時，而次—片晶®又開始向前輸送’輸送帶會將帶動原晶圓至緩衝 201141773 容置件内；糾該橫向輸送軌道兩姆會跨設_導正裝置用於晶圓輸送 間導引晶圓歸回正確位置角度，以降低晶圓之損壞風險。 更具體的說，所述兩個橫向輸送軌道上各自可設置複數個軌道交錯結 構於軌道交錯區域間’而魏道交錯結構之數量係由縱向輸送軌道之數量 而定。 更具體的說，所述縱向輸送軌道上係包含有一開口、一緩衝容置件及 兩組平行設置於縱向輸送軌道上之輸送帶，其巾該開口大小必須大於軌道 交錯結構之中央凸口，以利於縱向輸送軌道能與橫向輸送軌道交錯重疊。 【實施方式】 有關於本發明之前述及其他技術内容、特點與功效，在以下配合參考 圖式之較佳實施例的詳細說明中，將可清楚的呈現。 請參閱圖一A、圖一B及圖一c為本發明晶圓輸送分配裝置及其方法 之立體結構圖、縱向輸送軌道上升示意圖及縱向輸送軌道下降示意圖，由 圖一 A中可知，該晶圓輸送分配裝置主要包括： 複數個縱向輸送軌道1，係與橫向輸送軌道2交錯設置，而該橫向輸 送執道2與縱向輸送軌道1之間係會具有高度差，另外該縱向輸送轨道1 上係包含有一開口 11、一緩衝容置件12及兩組平行設置於縱向輸送軌道i 兩側之輸送帶13，其開口 11大小必須大於執道交錯結構21之中央凸口 211 ’以利於該複數個縱向輸送軌道1能與兩個橫向輸送執道2交錯重疊； 兩個橫向輸送軌道2，係與縱向輸送軌道1交錯設置，其中該橫向輸 送軌道2中係包含有複數個軌道交錯結構21、一導正裝置22、一緩衝容置 件23及一組平行設置於橫向輸送軌道2兩側之輸送帶24，而該軌道交錯結 201141773 構21係設置於該組輸送帶24中央，其中該軌道交錯結抑之左右兩端係 為-凹口 212，並於中央凸口 211頂端設置一感測器3，而該感測器3係為 -用於測錢體的出現、離開和運動之感測器，因此當晶圓經由縱向輪送 軌道i通過該軌道交錯結構21區域時，該感測器3自動觸發調整（上升或 下降）縱向輸送軌道i之高度，使複數個縱向輸送軌道丨自動下降與兩個 橫向輸送軌道2交錯重叠，並使輸送之晶圓再經由橫向輸送軌道2輸送， 以方便承接設備之使用； 另外該導正裝置22係跨設於橫向輸送軌道2兩側，其中該導正裝置 22係包3有兩組平行配置之夾具22卜該夾具221内緣可沿晶圓4輸送方 向，接觸並夾制導正晶圓4，使該晶圓4歸回正確位置角度（請參考圖三广 值得一提的是’該縱向輸送軌道1及橫向輸送軌道2之輸送晶圓方向 前端處，係會各自設置-緩衝容置件12,23，用於暫時容置晶圓之用，因此 當輸送之晶圓4停止於輸送帶上時，而次—片晶圓5又開始向前輸送，輪 送帶會將帶誠晶1] 4至緩衝容置件12,22内（請參考圖四及圖五）。 請參閱圖二A至圖二D，為本發明晶圓輸送分配裝置及其方法之實施 J圖由圖中了知，違晶圓輪送分配裝置及其方法之其中一實施運作方式 為： 1.輸入晶圓41，42,43,44經由縱向輸送執道！輸送（請參考圖二; 田b日圓41,42,43,44到達縱向輸送軌道1與橫向輸送軌道2交錯區域 (執道交錯結構）時（請參考圖：B)，該縱向輸送軌道】停止向 别輸送晶圓41，42’43,44，並會自動下降與橫向輸送軌道2交錯重 201141773 ' 疊，同時橫向輸送軌道2啟動，將晶圓4!，42及晶圓43,44送往不同 之方向（請參考圖二C); 當晶圓4M2,43,44完全離開縱向輸送執道i與橫向輸送軌道2交錯 區域時’該縱向輸送軌道1會自動上升，與橫向輸送軌道2脫離連 結，同時縱向輸送軌道1啟動，繼續向前輸送晶圓41，42,43,44 (請 參考圖二D)。 值得-提的是，當晶圓41，42,43,44到達縱向輸送軌道丨與橫向輸送執 • 道2交錯區域時’該晶圓41，42,43,44會將軌道交錯結構所設置之感測器觸 發，因此驅動縱向輸送軌道i自動下降，而當晶圓41，42,43,44完成離開軌 道交錯區域時’感測器將再次被觸發，因此驅動縱向輸送軌道i自動上升。 本發明所提供之晶圓輸送分g碟置及其方法，與其他習紐術相互比 較時，更具備下列優點： 1. 本發明之晶圓輸送分配裝置及其方法，係可使晶圓輸送帶能夠自 動調整上升與下降，並能配合晶圓輸送路徑，使得晶圓輸送能夠 • 自動調整方向，以配合承載裝置或不同作業平台使用。 2. 本發明之晶圓輸送分配裝置及其方法係有利於進行廠房規劃 時，配合整個廠房内部的尺寸、高度，使晶圓輸送路徑更有規劃 之彈性，同時能節省薇房空間使用。 藉由以上較佳具體實施例之詳述，係希望能更加清楚描述本發明之特 徵與精神’而麟以上述所賊驗佳具體實關來對本發明之範鳴加以 限制。相反地，其目的是希望能涵蓋各種改變及具相等性的安排於本發明 所欲申請之專利範圍的範疇内。 201141773 【圖式簡單說明】 圖一 A為本發明晶圓輸送分配裝置及其方法之立體架構圖； 圖一 B為本發明晶圓輸送分配裝置及其方法之縱向輸送軌道上升示意 圖； 圖一 C為本發明晶圓輸送分配裝置及其方法之縱向輸送軌道下降示意 圖； 圖二A為本發明晶圓輸送分配裝置及其方法之實施例圖； 圖二B為本發明晶圓輸送分配裝置及其方法之實施例圖； 圖二C為本發明晶圓輸送分配裝置及其方法之實施例圖； 圖二D為本發明晶圓輸送分配裝置及其方法之實施例圖； 圖三為本發明晶圓輸送分配裝置及其方法之導正裝置實施示意圖； 圖四為本發明晶圓輸送分配裝置及其方法之縱向輸送軌道之緩衝容置 示意圖；以及 圖五為本發明晶圓輸送分配裝置及其方法之橫向輸送軌道之緩衝容置 示意圖》 【主要元件符號說明】 1 縱向輸送執道 11 開口 12 緩衝容置件 13 輸送帶 2 橫向輸送軌道 201141773201141773, VI. Description of the Invention: [Technical Field] The present invention relates to a wafer transport distribution device and a method thereof, in particular, a wafer transport track by different transport directions to achieve wafer transport The action of the wafer transport path can be automatically assigned. [Prior Art] With the continuous improvement of technology, 'currently semiconductor factories and solar cell fabs have adopted automated methods for wafer fabrication and handling in order to increase production capacity or maintain competitive advantages, while saving personnel. Costs and increased production efficiency, so factory automation is already an inevitable trend for semiconductors, and in order to respond to factory automation, there are many factory delivery systems and the design of the transmission route is very important. Generally, the wafer transfer processing in the factory is to load the wafer onto the conveyor belt by the loading device, and transport the wafer to the carrier device or the working platform by the conveyor belt (conveying rail), so the conveyor belt is stable or not. Very important 'When the belt is meandering or not moving smoothly, it is easy to cause Φ wafers to fall, stack, or unevenly deposit; and the conveyor system is mostly single-direction transport conveyor, so when the wafer Conveying road! Need to change direction, often only a single track to a single track, so it will be quite a waste of plant planning space, and the current conveyor system is also carried out by unmanned automation, because of the size and height of the factory The gambling path material must be planned in advance. Once the plan is set, it cannot be easily changed. Therefore, if there is a place where the sputum is made on the transport path, the transport process of the entire wafer cassette conflicts. . Therefore, if an automated wafer transfer distribution device and method thereof are provided, when a plurality of loads of the 201141773 device are loaded onto a plurality of conveyor belts, the wafer can be converted by the improvement of the wafer transfer device. It is transported to different conveyor belts, so that the work platform and the carrying tool and the wafer carrier can be transported smoothly and excessive waste of workshop space can be avoided. SUMMARY OF THE INVENTION An object of the present invention is to provide a wafer transfer and distribution device and a method thereof for automatically adjusting a wafer conveyance belt and matching a wafer conveyance path so that wafer conveyance can be automatically adjusted in direction. A secondary object of the present invention is to provide a wafer transport distribution device and method thereof, which can make the wafer transport path more flexible when planning the production line, and at the same time save space for the production line. The wafer transport distribution device and the method thereof for achieving the above object are composed of two lateral transport lanes and a plurality of longitudinal transport rails, wherein the transverse transport rail includes a plurality of rail interlaced structures, and a guiding device a buffering member and a conveyor belt disposed in parallel on both sides of the transverse conveying rail, wherein the rail staggered structure is disposed in the center of two sets of parallelly disposed conveyor belts, wherein the left and right ends of the rail staggered structure are a notch. And a sensor is arranged at the top of the central protrusion for the wafer to be staggered by the longitudinal conveying track and the track of the transverse conveying track interlaced area, and the plurality of longitudinal conveying tracks are automatically lowered and two lateral conveying are carried out. The tracks are interlaced and overlapped, and the wafers that are transferred can be transported through the lateral transport track, and the materials are used by the equipment. The longitudinal transport lanes and the lateral transport rails are respectively disposed at the front end of the wafer direction. The device is used for temporarily accommodating the wafer, so when the transported wafer stops on the conveyor belt, the sub-platelet® starts to feed forward again. The conveyor belt will drive the original wafer into the buffer of the 201141773 accommodating member; correcting the lateral conveying track will span the _ guiding device for the wafer conveying to guide the wafer back to the correct position angle to reduce the wafer More specifically, each of the two lateral transport tracks may be provided with a plurality of track interlaced structures between the track staggered regions' and the number of Weidao staggered structures is determined by the number of longitudinal transport tracks. The longitudinal conveying track comprises an opening, a buffering accommodating member and two sets of conveying belts arranged in parallel on the longitudinal conveying rail, and the opening of the towel must be larger than the central bulge of the rail staggered structure to facilitate the longitudinal direction. The transport track can be alternately overlapped with the lateral transport track. [Embodiment] The foregoing and other technical contents, features and effects of the present invention will be clearly described in the following detailed description of the preferred embodiments with reference to the drawings. Please refer to FIG. 1A, FIG. 1B and FIG. 1c. FIG. 1 is a perspective structural view and a longitudinal conveying track of a wafer conveying and distributing device and a method thereof. FIG. 1A shows that the wafer conveying and distributing device mainly comprises: a plurality of longitudinal conveying rails 1 which are arranged alternately with the horizontal conveying rails 2, and the horizontal conveying lanes 2 and the longitudinal direction There is a height difference between the conveying rails 1. The longitudinal conveying rail 1 further comprises an opening 11, a buffering receiving member 12 and two sets of conveying belts 13 arranged in parallel on both sides of the longitudinal conveying rail i, and the opening 11 thereof The size must be larger than the central protrusion 211 ' of the obedient staggered structure 21 to facilitate the plurality of longitudinal transport rails 1 being able to overlap with the two lateral transport lanes 2; the two lateral transport rails 2 are interlaced with the longitudinal transport rails 1 The transverse transport track 2 includes a plurality of track staggered structures 21, a guiding device 22, a buffering member 23, and a set of conveyor belts 24 disposed in parallel on both sides of the lateral conveying track 2, and the track The staggered junction 201141773 is arranged in the center of the set of conveyor belts 24, wherein the left and right ends of the track are staggered and formed as a notch 212, and a top end of the central boss 211 is disposed. a sensor 3, which is a sensor for the appearance, departure and movement of the money body, so when the wafer passes through the track interlacing structure 21 via the longitudinal wheel track i, The sensor 3 automatically triggers the adjustment (rise or fall) of the height of the longitudinal transport track i such that the plurality of longitudinal transport track turns automatically and alternately overlaps the two lateral transport tracks 2, and the transported wafer is again transported via the lateral transport track 2 The guiding device 22 is disposed on both sides of the lateral conveying rail 2, wherein the guiding device 22 has three sets of clamps 22 arranged in parallel, and the inner edge of the clamp 221 is In the direction of the wafer 4, the wafer 4 is contacted and sandwiched, and the wafer 4 is returned to the correct position angle (refer to FIG. 3, it is worth mentioning that the transport of the longitudinal transport track 1 and the lateral transport track 2) At the front end of the circular direction, the buffering members 12, 23 are respectively disposed for temporarily accommodating the wafer, so that when the transported wafer 4 is stopped on the conveyor belt, the secondary wafer 5 is again Start to move forward, the belt will bring Crystal 1] 4 to the buffer housing 12, 22 (please refer to Figure 4 and Figure 5). Referring to FIG. 2A to FIG. 2D, the implementation of the wafer transport distribution device and the method thereof according to the present invention is shown in the figure. One of the implementation modes of the wafer transfer distribution device and the method thereof is as follows: 1 The input wafers 41, 42, 43, 44 are routed through the longitudinal direction! Conveying (please refer to Figure 2; when the field b, 41, 42, 43, 44 reaches the interlaced area of the longitudinal conveying track 1 and the horizontal conveying track 2 (refer to the figure: B), the longitudinal conveying track] stops The wafers 41, 42'43, 44 are transported to the other end, and are automatically lowered and staggered with the lateral transport track 2 to overlap the 201141773', while the lateral transport track 2 is activated, and the wafers 4!, 42 and wafers 43, 44 are sent to Different directions (please refer to Figure 2C); When the wafer 4M2, 43, 44 completely leaves the longitudinal conveying lane i and the lateral conveying rail 2 staggered area, the longitudinal conveying rail 1 will automatically rise and be separated from the lateral conveying rail 2 The connection, while the longitudinal transport track 1 is activated, continues to transport the wafers 41, 42, 43, 44 forward (please refer to Figure 2D). It is worth mentioning that when the wafers 41, 42, 43, 44 reach the longitudinal transport track When the 输送 and the lateral transport are performed, the wafers 41, 42, 43, 44 will trigger the sensors provided by the track interleaving structure, thus driving the longitudinal transport track i to automatically drop, and when the wafer 41, When the 42,43,44 finishes leaving the track interlaced area, the sensor will be triggered again, so drive The longitudinal conveying track i is automatically raised. The wafer conveying device and the method thereof provided by the present invention have the following advantages when compared with other Xiujian: 1. The wafer conveying and distributing device and method thereof The wafer conveyor belt can automatically adjust the rise and fall, and can match the wafer transport path, so that the wafer transport can be automatically adjusted to match the carrier or different operating platforms. The conveying and distributing device and the method thereof are favorable for the planning of the plant, and the size and height of the whole plant are matched, so that the wafer conveying path is more flexible in planning, and at the same time, the use of the room space can be saved. The detailed description is intended to more clearly describe the features and spirit of the present invention, and Lin has limited the scope of the present invention with the above-mentioned thieves. In contrast, the purpose is to cover various changes and The equivalence is arranged within the scope of the patent application to which the present invention is intended. 201141773 [Simplified Schematic] FIG. FIG. 1B is a schematic diagram of a longitudinal transport track rise of a wafer transport distribution device and a method thereof according to the present invention; FIG. 1C is a longitudinal transport track of a wafer transfer and distribution device and a method thereof according to the present invention; FIG. 2B is a view showing an embodiment of a wafer transfer and distribution device and a method thereof according to the present invention; FIG. 2B is a view showing an embodiment of a wafer transfer and distribution device and a method thereof; FIG. 2D is a view showing an embodiment of a wafer transfer and distribution device and a method thereof according to the present invention; FIG. 3 is a schematic view showing the implementation of a wafer transfer and distribution device and a method thereof; 4 is a schematic diagram of the buffering arrangement of the longitudinal conveying track of the wafer conveying and distributing device and the method thereof; and FIG. 5 is a schematic diagram of the buffering and accommodating of the lateral conveying track of the wafer conveying and distributing device and the method thereof according to the present invention. Description] 1 Longitudinal conveying road 11 Opening 12 Buffering container 13 Conveyor belt 2 Horizontal conveying track 201141773
21 執道交錯結構 211 中央凸口 212 凹口 22 導正裝置 221 夾具 23 緩衝容置件 24 輸送帶 3 感測器 4 晶圓 41 〜44 晶圓21 obstructed staggered structure 211 central raised mouth 212 notch 22 guiding device 221 clamp 23 buffering receptacle 24 conveyor belt 3 sensor 4 wafer 41 ~ 44 wafer