201139125 六、發明說明： 【發明所屬之技術領域】 [0001]本發明涉及一種微透鏡陣列的製備裝置，尤其涉及—種 可改善影像感應器感光靈敏度的微透鏡陣列的製備裝置 [先前技術3 [0002] 微透鏡陣列（Micro Lens Array ; MLA)廣泛應用於影 像感應器當中，例如電荷耦合元件（Charge-coupled Device ; CCD)和互補金屬氡化物半導體（c〇mpie_ g\ U mentary Metal Oxide Semiconductor; CMOS)影像 感應器，用於改善其感光靈敏度》 [0003] 採用UV固化材料製作微透鏡陣列，一般在基材表面塗布 一層UV固化材料，通過壓印於基材表面成型微透鏡陣列 ，最後通過UV固化使得微透鏡固定於基材表面。使用該 方法製備微透鏡陣列，步驟複雜且成本高》 【發明内容】 Q [〇〇〇4] 有鑒於此，有必要提供一種製:備步驟簡單且成本低廉的 微透鏡陣列製備裝置。 [0005] 一種微透鏡陣列製備裝置，用於在基材表面成形微透鏡 陣列，所述製備裝置包括一張緊裝置、一壓印滾輪和— 冷卻設備，所述張緊裝置張緊固定基材於壓印滾輪表面 並帶動基材運動；所述壓印滚輪設置有復數個加熱條和 壓印孔’基材與壓印滾輪貼合部分經加熱條加熱成軟化 狀態後被吸入壓印孔中；所述冷卻設備用於持續固化受 張緊裝置帶動與壓印孔脫離的基材部分而在基材表面成 099114770 表單編號A0101 第3頁/共11頁 0992026209-0 201139125 型微透鏡陣列。 [0006] [0007] 本發明提供一種微透鏡陣列製備裝置，該製備裝置結構 簡單且相找有的使則㈣化材料製備微透鏡陣財驟 簡單，成本低廉。 【實施方式】 請參閱圖1，為本發明一較佳實施方式微透鏡陣列製備裝 置100的示意圖。所述製備裝置100用於製備基材2〇〇表 面的微透鏡陣列，其包括一張緊裝置10、—壓印滾輪20 和一冷卻設備30。所述張緊裝置10用於張緊基材2〇〇使之 緊密貼合於壓印滾輪2〇表面並帶動基材2〇〇相對壓印滚輪 20運動，所述壓印滾輪2〇用於加熱並壓印基材2〇〇使其表 面成型微透鏡陣列，所述冷卻設備3〇用於冷卻固化基材 2 0 0表面的微透鏡陣列。 [0008] 所述張緊裝置10包括平行設置於壓印滾輪2〇兩端的第一 滾輪11和第二滾輪12。所迷第一滾輪u和第二滚輪12分 別如圖1中箭頭所示方向轉動，其轉動速度同為所述 基材200兩端分別與第一滾輪n和第二滾輪12接觸，中間 貼合於壓印滾輪20表面。所述基材2〇〇受第一滾輪n和第 一滾輪12共同作用而相對壓印滾輪2 〇運動。同時，通過 調整轉動速度V的大小可以調節基材2〇〇的運動速度及張 緊程度，可用來調節貼合於壓印滾輪2〇表面基材2〇〇部分 的加熱時間長度和被吸引時間長度，進而改變基材2〇〇表 面壓印的微透鏡大小和深度。 [0009] 099114770 凊一併參閱圖2和圖3，分別為圖丨所示微透鏡陣列製備裝 置100内壓印滾輪20的立體圖和剖視圖。所述壓印滾輪2〇 表單編號A0101 第4頁/共π頁 0992026209-0 201139125 為一空心圓柱體，其内壁設置有復數個加熱條21 ’所述 加熱條21平行壓印滾輪2〇軸心方向設置。所述壓印滾輪 20外壁均勻開設有復數個壓印孔22。所述壓印滚輪2〇各 設置一端蓋23，所述端蓋23開設有一吸氣孔24，所述吸 氣孔24連通外部吸氣設備（圖中未示）和壓印滾輪20外 壁上的壓印孔22。 [0010] 所述冷卻設備30設置於第一滾輪11和壓印滚輪2〇之間。 在本實施方式當中，冷卻設備30為一吹氣冷卻設備’其 向外輸出特定溫度的氣體，使得遠離壓印滾輪2〇運動的 ❹ 基材200被冷卻而固牝。 [0011] 工作時，冷卻設備30和吸氣設備分別處於工作狀態，第 一滚輪11和第二滚輪12同時轉動使得基材200相對壓印滚 輪20運動。所述基材200與壓印滾輪20貼合部分經加熱條 21加熱成軟化狀態後，被吸入壓印孔22後成型為微透鏡 。隨著第一滾輪11和第二滾輪12繼續轉動，成型為微透 鏡的基材200脫離壓印滾輪20，冷卻設備3〇使得該部分冷 〇 卻固化。如此迴圈，基材200不同部分依次被加熱、吸入 成型後冷卻成為微透鏡’最終使得基材200表面成型微透 鏡陣列。 【圖式簡單說明】 [0012] 圖1係本發明一較佳實施方式微透鏡陣列製備裝置的示竟 圖。 [0013] 圖2係圖1所示微透鏡陣列製備裝置内壓印滾輪的立體圖 099114770 表單編號A0101 第5頁/共11頁 0992026209-0 201139125 [0014] 圖3係圖1所示微透鏡陣列製備裝置内壓印滾輪的剖視圖 〇 【主要元件符號說明】 [0015] 微透鏡陣列製備裝置：100 [0016] 基材：200 [0017] 張緊裝置： 10 [0018] 第一滾輪： 11 [0019] 第二滾輪： 12 [0020] 壓印滾輪： 20 [0021] 加熱條：21 [0022] 壓印孔：22 [0023] 端蓋：23 [0024] 吸氣孔：24 [0025] 冷卻設備： 30 099114770 表單編號A0101 第6頁/共11頁 0992026209-0201139125 VI. Description of the Invention: [Technical Field] [0001] The present invention relates to a device for preparing a microlens array, and more particularly to a device for preparing a microlens array capable of improving the sensitivity of an image sensor [Prior Art 3 [ 0002] Micro Lens Array (MLA) is widely used in image sensors, such as Charge-coupled Device (CCD) and Complementary Metal Telluride Semiconductor (c〇mpie_g\U mentary Metal Oxide Semiconductor; CMOS) image sensor for improving its sensitivity. [0003] Microlens arrays are fabricated using UV-curable materials. Generally, a UV-curable material is coated on the surface of the substrate, and the microlens array is formed by imprinting on the surface of the substrate. UV curing allows the microlens to be attached to the surface of the substrate. The microlens array is prepared by the method, and the steps are complicated and costly. [Invention] Q [〇〇〇4] In view of the above, it is necessary to provide a microlens array preparation apparatus which is simple in steps and low in cost. [0005] A microlens array preparing device for forming a microlens array on a surface of a substrate, the preparation device comprising a tensioning device, an embossing roller, and a cooling device, the tensioning device tensioning the substrate Stamping the surface of the roller and driving the substrate; the embossing roller is provided with a plurality of heating strips and embossing holes. The substrate and the embossing roller are heated by the heating strip to be softened and then sucked into the embossing hole. The cooling device is used for continuously curing the portion of the substrate that is driven by the tensioning device to be detached from the embossed hole and is formed on the surface of the substrate as 099114770 Form No. A0101 Page 3 of 11 0992026209-0 Type 201139125 microlens array. [0007] The present invention provides a microlens array preparation apparatus, which has a simple structure and is found to have a simple and low cost for preparing a microlens array. [Embodiment] Please refer to FIG. 1, which is a schematic diagram of a microlens array preparation device 100 according to a preferred embodiment of the present invention. The preparation apparatus 100 is used to prepare a microlens array of a substrate 2, which includes a tensioning device 10, an impression roller 20, and a cooling device 30. The tensioning device 10 is used for tensioning the substrate 2 so as to be in close contact with the surface of the embossing roller 2 and driving the substrate 2 运动 relative to the embossing roller 20, and the embossing roller 2 is used for The substrate 2 is heated and embossed to form a microlens array thereon, and the cooling device 3 is used to cool the microlens array of the surface of the cured substrate. The tensioning device 10 includes a first roller 11 and a second roller 12 that are disposed in parallel at both ends of the platen roller 2 . The first roller u and the second roller 12 are respectively rotated in the direction indicated by the arrow in FIG. 1 , and the rotation speed thereof is the same as that of the first roller n and the second roller 12 respectively at the two ends of the substrate 200, and the intermediate bonding is performed. The surface of the roller 20 is embossed. The substrate 2 is moved by the first roller n and the first roller 12 to move relative to the impression roller 2 。. At the same time, by adjusting the rotation speed V, the moving speed and tension of the substrate 2 can be adjusted, and the heating time and the attraction time of the substrate 2 surface of the surface of the printing roller 2 can be adjusted. The length, which in turn changes the size and depth of the microlens imprinted on the substrate 2 。 surface. [0009] 099114770 Referring to FIG. 2 and FIG. 3, respectively, a perspective view and a cross-sectional view of the embossing roller 20 in the microlens array preparing device 100 shown in FIG. The embossing roller 2 〇 form number A0101 page 4 / π page 0992026209-0 201139125 is a hollow cylinder, the inner wall of which is provided with a plurality of heating strips 21 'the heating strip 21 parallel embossing roller 2 〇 axis Direction setting. A plurality of embossing holes 22 are uniformly formed on the outer wall of the embossing roller 20. The embossing rollers 2 are respectively provided with an end cover 23, and the end cover 23 defines an air suction hole 24, and the air suction hole 24 communicates with an external air suction device (not shown) and the outer wall of the embossing roller 20. The hole 22 is embossed. [0010] The cooling device 30 is disposed between the first roller 11 and the impression roller 2A. In the present embodiment, the cooling device 30 is an air blowing cooling device' which outputs a gas of a specific temperature outward, so that the crucible base material 200 moving away from the platen roller 2 is cooled and solidified. [0011] In operation, the cooling device 30 and the suction device are respectively in an operating state, and the first roller 11 and the second roller 12 are simultaneously rotated to move the substrate 200 relative to the platen roller 20. The bonding portion of the substrate 200 and the impression roller 20 is heated to a softened state by the heating strip 21, and then sucked into the embossing hole 22 to form a microlens. As the first roller 11 and the second roller 12 continue to rotate, the substrate 200 formed into a microlens is detached from the embossing roller 20, and the cooling device 3 〇 causes the portion to be cooled but solidified. In this loop, different portions of the substrate 200 are sequentially heated, inhaled and cooled to form a microlens. Finally, the surface of the substrate 200 is molded into a microlens array. BRIEF DESCRIPTION OF THE DRAWINGS [0012] FIG. 1 is a view showing a microlens array preparation apparatus according to a preferred embodiment of the present invention. 2 is a perspective view of an imprint roller in the microlens array preparation apparatus shown in FIG. 1 099114770 Form No. A0101 Page 5 / 11 page 0992026209-0 201139125 [0014] FIG. 3 is a microlens array preparation shown in FIG. Cross-sectional view of the embossing roller in the device 〇 [Main component symbol description] [0015] Microlens array preparing device: 100 [0016] Substrate: 200 [0017] Tensioning device: 10 [0018] First roller: 11 [0019] Second roller: 12 [0020] Embossing roller: 20 [0021] Heating bar: 21 [0022] Embossing hole: 22 [0023] End cap: 23 [0024] Suction hole: 24 [0025] Cooling device: 30 099114770 Form No. A0101 Page 6 of 11 0992026209-0