201139027 六、發明說明： 【智^明屬•^支彳柯Ά貝-¾^¾】 發明領域 本發明係有關於一種用以雷射加工半導體晶圓等工件 的雷射加工裝置。 L 前 j 發明背景 在半導體裝置製造步驟中，係藉由沿著切割道切割略 圓板狀的半導體工件’而分割成各電路並製成各個半導體 曰曰片而°亥半導體工件係在經於表面排列成格子狀之切割 道(切割線)區劃而成之區域形成有IC、LSI等電路之切割道 者。沿著半導體玉件之切割道之切騎常係藉由稱為切塊 機之切肖丨裝置所進行’但亦f試有藉由照射雷射光線而進 行切割之加卫方式(例如，參照專利文獻1}。 當沿著半導體晶圓之切割道照射雷射光線時，由於熱 月b曰集中於所照射的區域而產生碎屑，因此本申請人曾提 出有於被加工物覆蓋保護膜，並透過保護膜照射雷射光線 於被加工物 < 方法’以防止碎相著於晶圓表面（參照專 利文獻2)。一般而言，用以形成保護膜之水溶性液狀樹脂 係經水等溶劑稀釋過後再使用。 先前技術文獻 專利文獻 【專利文獻1】特開平10-305420號公報 【專利文獻2】特開2004-188475號公報 201139027BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser processing apparatus for laser processing a workpiece such as a semiconductor wafer. BACKGROUND OF THE INVENTION In the semiconductor device manufacturing step, a semiconductor wafer is cut into individual circuits by cutting a substantially circular plate-shaped semiconductor workpiece along a dicing street, and each semiconductor wafer is fabricated. A region in which the dicing lines (cut lines) are arranged in a lattice shape forms a scriber for circuits such as ICs and LSIs. The cutting along the cutting path of the semiconductor jade is usually performed by a cutting device called a dicer, but it is also tried to cut by irradiating the laser light (for example, reference) Patent Document 1}. When laser light is irradiated along a dicing street of a semiconductor wafer, since the heat ray b 曰 concentrates on the irradiated area to generate debris, the applicant has proposed to cover the protective film with the workpiece. And irradiating the laser light to the object to be processed by the protective film to prevent the particles from colliding with the surface of the wafer (refer to Patent Document 2). In general, the water-soluble liquid resin used to form the protective film is In the case of a solvent such as water, it is used after the dilution of the solvent. [Patent Document 1] Japanese Laid-Open Patent Publication No. Hei 10-305420 (Patent Document 2) JP-A-2004-188475A No. 201139027
I：發明内容J 發明揭示 發明欲解決之課題 然而，水溶性液狀樹脂之稀釋比例係因工件之種類而 不同，當處理多種工件時，則必須事先準備並保管多種稀 釋程度不同的水溶性液狀樹脂。 本發明係鑒於前述事實而製成者，其主要的技術課題 在於提供一種雷射加工裝置，其係即使在處理多種工件 時，仍可在不使用多種水溶性液狀樹脂的情況下進行水溶 性液狀樹脂之覆蓋處理者。 用以欲解決課題之手段 本發明係一種雷射加工裝置，包含有：將水溶性液狀 樹脂供給至工件之被加工面以形成用以保護被加工面之保 護膜的保護膜形成機構；從被加1©之相反面固持於被加 工面形成有保護膜之工件的固持台；及從固持於固持台之 工件之形成有保護膜之被加工面舰射雷射光束的雷射照 射機構。x ’保護卿成機構具有用以稀釋水溶性液狀樹 脂之液狀樹脂稀釋裝置。 液狀树月曰稀釋裳置以包含有：用以送出水溶性液狀樹 知之第以’用以送出可稀釋水溶性液狀樹脂之溶劑的 L H用1^合經第—系部送出之水溶性液狀樹脂與 經=二泵部送出之溶劑的混合部；及用以檢測經在混合部 :、而稀釋之水溶性液狀樹脂之濃度的濃度檢測部 為佳。又，第~‘石. 泵。卩係伸縮泵，並以包含有：用以檢測伸 201139027 縮泵之上流側之配管内的壓力之壓力檢測部；及根據經壓 力檢測部檢測出之壓力控制伸縮泵與第二泵部之動作的控 制部為佳。 發明效果 由於本發明具有用以稀釋作為工件之被加工面之保護 膜的水溶性液狀樹脂之液狀樹脂稀釋裝置，因此即使在處 理多種工件之情況下，仍可藉由以所要的比例稀釋水溶性 樹脂，而在不使用多種保護膜之情況下進行保護膜之覆蓋 處理。 又，藉由具有用以檢測業經稀釋之水溶性液狀樹脂之 濃度的濃度檢測部，便可根據濃度檢測部之檢測結果，在 濃度未達到所要之值時鳴響警報器並停止裝置，並且控制 第一泵部或第二泵部以調整濃度。 藉由第一泵部係伸縮泵，並包含有：用以檢測伸縮泵 之上流側之配管内的壓力之壓力檢測部；及根據經壓力檢 測部檢測出之壓力控制伸縮泵與第二泵部之動作的控制 部，並且藉由根據壓力檢測部之壓力值調整伸縮泵之吸收 速度，便可在不產生氣泡之範圍内以最快的速度輸送液體。 圖式簡單說明 第1圖係顯示雷射加工裝置之一例的透視圖。 第2圖係顯示液狀樹脂稀釋裝置之結構的方塊圖。 第3圖係擴大顯示於被加工面覆蓋有保護膜之工件之 一部分的截面圖。 第4圖係擴大顯示將雷射光束照射在於被加工面覆蓋 201139027 有保護膜之工件之狀態的戴面圖。 L賓^施*冷式;j 用以實施發明之形態 第1圖所7^之雷射加工裝置1係對固持於固持台2之被 加工物（工件)從雷射照射機構3照射雷射光束以進行工件1 加工的裝置。固持台2係形成透過傳送機構4而傳送於X軸方 向及與X轴方向平行地垂直之γ軸方向的結構。傳送機構4 係由X方向傳送機構5與γ方向傳送機構6所構成。 雷射照射機構3固定於設於裝置後端部之壁部丨〇，且具 有朝下照射雷射光束之照射頭3〇。 X方向傳送機構5包含有：延伸於χ轴方向之滾珠螺桿 50 ;與滚珠螺桿50配置成平行之導軌51 ;連接於滾珠螺桿 50之一鈿並使滾珠螺桿50旋動之電動機52 ;及下部滑動連 接於導軌51並且内部具有圖未示之擰緊至滾珠螺桿5〇之螺 帽的滑動板53 ;並形成隨著滾珠螺桿5〇之旋動，滑動板兄 便經導軌51之引導而移動於X軸方向之結構。滑動板53固定 有内部具有脈動電動機之旋轉驅動部54,而該旋轉驅動部 54可使固持台2以預定角度旋轉。 Υ方向傳送機構6包含有：延伸於γ軸方向之滚珠螺桿 60 ;與滾珠螺桿60配置成平行之導軌61 ;連接於滚珠螺桿 60之一 Aft並使滾珠螺杯60旋動之電動機62 ;及下部滑動連 接於導軌61並且内部具有圖未示之擰緊至滾珠螺桿6〇之螺 帽的滑動板63 ;並形成隨著滚珠螺桿60之旋動，滑動板63 便經導軌61之引導而移動於X轴方向之結構。滑動板63配置 201139027 有X方向傳送機構5，並形成隨著滑動板63之¥軸方向的移 動而X方向傳送機構5亦可朝同方向移動之結構。 壁部10前方具有將水溶性液狀樹脂供給至加工前之工 件之被加面以覆蓋用以保護被加I面之保護膜的保護膜 形成機構7。保護膜形成機構7包含有：用以固持晶圓並可 旋轉之旋轉台70;將晶圓固定於旋轉台7〇之固定部Μ ;及 從晶圓上方滴下水溶性液狀樹脂之滴下部72。滴下部乃配 置於以軸部73為中心'而可闕定歧搖動之臂料的前端。 壁部10之前面具有將工件從保護膜形成機構7運送至 固持台2之運送機構8。運送機構8包含有：延伸於γ軸方向 之滚珠螺桿80 ;與滾珠螺桿8G配置成平行之導細；連接 於淚珠螺桿80之-端並使滾珠螺桿8峻動之f動機82 ;及 側部滑動連接於導柳並且㈣具有圖未示之擰緊至滚珠 螺桿80之的㈣細；相對於移動⑽進行升降之升 降部I賴定於升M84之下部的巧固持部85 ;並形 成隨著滾珠螺桿8G之旋動，移動_便經導㈣之引導而 動於Y軸方向，且藉此gj持有晶IU之工件固持部85便朝同 方向移動’而將晶圓運送於保護卿成機構7與 間的結構。 保護膜形成機構7具有用以稀釋液狀樹脂之液狀樹脂 ，釋裝置9。液狀樹脂稀釋裝置9具有藉由混合水溶性樹脂 〜溶劑而稀釋水溶性液狀樹脂之功能，並具有如第2圖所示 冷f生液狀樹月日之槽90,而該槽9〇係透過壓力檢測部w 連接於第一栗部92。 201139027 第一栗部92係伸縮泵，且輸出側連接於混合部93，並 且具有將貯存於槽9〇之水溶性液狀樹脂之原液送至混合部 93之功能。混合部93亦連接有第二泵部94，而該第二果部 94具有將溶劑（水）送至混合部93之功能。在混合部93，自 第一泵部92送出之水溶性液狀樹脂便與自第二泵部94送出 之溶劑混合且稀釋。混合部93可使用，例如，可動式者戈 靜態混合器等。 壓力檢測部91具有用以檢測第一泵部92之上流側之配 官内之壓力的功能。壓力檢測部91的檢測結果係在控制部 95經辨識，並在控制部95進行根據認識結果之處理。 在混合部93業經稀釋之水溶性液狀樹脂係送至保護膜 形成機構7。混合部93與保護_錢構7之間配置有用以 檢測從混合部93送至保護膜形成機構7之業經稀釋之水溶 性液狀樹脂之濃度的濃度檢測部97 ^度檢測㈣的檢測 結果係在㈣部95_識’並進行根據認識結果之處理。 濃度檢測部97可使用，例如，導電性感測器。X，控制部 95連接有警報㈣’並可根據滚度檢測_的檢測結果鳴 針對使用第1圖所示之雷射加卫裝£1於工件之 被加工©形絲細並從保_憑射雷射光束時之裝置 的動作進行說明。X，卫件並無特別限制，可抑晶圓、 ^匕鎵等半導體晶圓、作為安裝晶片用而設於晶圓裡面之 祕（賴式黏膠材）等轉構件、半導體製品之包裝、陶 瓷玻璃、藍寶石（ai2〇3)系之無機材料基板' 咖驅動器 201139027 等各種電子零件 種加工材料。 或者要求有n級加王位置精密度之各 旰之被加工面的相反面於保護膜 形成機構7之旋轉台7G。接著，使旋轉台7峨轉，並一面搖 動臂部74—面自滴下部72滴下水溶性液狀樹脂至工件之被 加工面’並且稭由旋轉塗佈而如第3圖所示般覆蓋由水溶性 液狀樹脂所構成之保護膜於工件W之被加工面Wle 自滴下部72滴下之水溶性液狀樹脂係在第2圖所示之 液狀樹脂稀釋裝置9業經稀釋。第—果部_將自槽9〇取入 之水溶性液狀樹脂之原液送自混合部％，而第二泵部94係 將水、有機溶酵賴送至混合部％。之後，便在混合 93進行該等的混合輯釋，並駐健卿錢構7。^ :來’便可調整自第-粟部92及第二泵部94送出之液體的 里並使其於混合部混合，因此可根據讀之觀等形成業 經所要比例稀釋之水溶性液狀樹脂。因此，不必設想多種 工件並準備稀釋程度不同之多種水溶性液狀樹脂，且即使 在處理多種JL件的情況下，亦不需要槽之更替或複雜的存 貨管制。 自混合部93流出之業經稀釋之水溶性液狀樹脂之濃度 係經濃度檢測部97檢測出並在控制部95經辨識。控制部95 可根據所辨識到的濃度調整來自第一泵部92或第二泵部94 之流出量，並可進行用以保持業經稀釋之水溶性液狀樹脂 之濃度於一定之回饋控制。又，當濃度檢測部97的濃度之 值並非所妻之濃度時，控制部95亦可鳴響警報器％並停止 201139027 裝置，並且通知操作員。 壓力檢測部91可檢測第—泵物與槽⑽之間之配管 900内部的壓力’而控制部95可根據前述壓力之值控制第一 栗部92與第二栗部94之動作。具體而言，#第一栗部92盘 獅之間之配管_内部為負壓時，便會自液中之溶存氣體 產生亂泡’因此則有氣泡混人水溶性樹脂之情況，而該情 況破視為覆蓋於J1件之表面的保護膜無法均等的原因。因 此，在此係在㈣部95時常監視經壓力制部91檢測出之 配管900的壓力’並根據配管9_部之負壓之值進行減少 自第-泵部92送來之每單位時間之液體的量以降低配管 900内部之貞壓之絕對值的控制。藉由進行前述控制，可防 止氣泡混入至自保護膜形成機構7供給至工件之水溶性液 狀樹脂，因此可使覆蓋於工件之保護膜之厚度均等。又， 由於可根據水溶性液狀樹脂之黏度等條件的變化自動地控 制第一泵部92與第二泵部94之動作，因此可在不產生氣泡 之情況下以最快的速度輸送液體。 如刖所述，在形成如第3圓所示之保護膜p後，便藉由 第1圖所示之運送機構8將工件W運送至固持台2，並在固持 台2固持為被加工面wi之相反面的内面W2。之後，X方向 傳送機構5及Y方向傳送機構6便一面將固持台2送至χ方向 及Y方向’而照射頭30便如第4圖所示般―面㈣皮加工面側 W1對切割道S照射雷射光束L。此時，即使因雷射光束匕之 照射產生碎屑，由於形成有電路C之被加工面…丨受保護膜p 保護，因此電路C亦受到保護。 10 201139027 實施例1 在第2圖所示之配管900的長度為i.5[m]，自槽90至第一 聚部92之彳主上吸之南度為1，2[m]，配管900之内徑為 6[mm] ’而水溶性液狀樹脂之濃度為i8〇[cp]的情況下，第 一泵部92之水溶性液狀樹脂之吸收速度與壓力檢測部91之 壓力的測量值間則確認有下表的關係。 液狀樹脂之吸收速度[ml/secl 壓力值[kPal 10 -97 7 -60 3 -38 又，當壓力檢測部91之測量值在_60 [kPa]以下時，則 確認有來自水溶性液狀樹脂之溶存氣體之氣泡產生。為了 安全起見’當以邊線為20[kPa]，並以若壓力在_4〇[k；Pa]以上 則視為不會產生氣泡時，根據前述表，若水溶性液狀樹脂 之吸收速度在3[ml/sec]以下的話，在前述條件下則視為不 會產生氣泡。 又’在水溶性液狀樹脂之黏度為60[cP]的情況下，以水 溶性液狀樹脂之吸收速度為1 〇[ml/sec]時之壓力值則確認 為-40[kPa]。因此，在該情況下，當以水溶性液狀樹脂之吸 收速度為10[ml/sec]時，則視為不會產生氣泡。 當水溶性液狀樹脂之黏度變化於6〇[cP]〜180[cP]之間 時，必須使吸收速度在3[ml/sec]以下，以對應該範圍之任 一黏度的水溶性液狀樹脂並抑制氣泡之產生。然而，在該 情況下，相對於至少需花約33[秒]以吸收l〇〇[ml]之水溶性 液狀樹脂’若吸收速度為1 〇[ml/sec]的話，則僅需花1 〇[秒]， 11 201139027 即甚至產生23[秒]的差異。因此，藉由在壓力檢測裝置91 測量配管900内部之負壓的值並回饋測量值，並且藉由控制 部95根據負壓之值調整第一泵部92的吸收速度，而可在不 產生氣泡之範圍内進行最快速的泵動作。 I：圖式簡單說明3 第1圖係顯示雷射加工裝置之一例的透視圖。 第2圖係顯示液狀樹脂稀釋裝置之結構的方塊圖。 第3圖係擴大顯示於被加工面覆蓋有保護膜之工件之 〇 一部分的截面圖。 第4圖係擴大顯示將雷射光束照射在於被加工面覆蓋 有保護膜之工件之狀態的截面圖。 【主要元件符號說明】 1...雷射加工裝置 5卜6卜81...導軌 2...固持台 52，62，82...電動機 3...雷射照射機構 53，63...滑動板 4...傳送機構 54...旋轉驅動部 5...X方向傳送機構 70...旋轉台 6... Y方向傳送機構 71...固定部 7...保護膜形成機構 72...滴下部 8...運送機構 73...軸部 9...液狀樹脂稀釋裝置 74...臂部 10...壁部 83...移動塊 30...照射頭 84...升降部 50，60，80···滾珠螺桿 85...工件固持部 12 201139027 90.. .# 91.. .壓力檢測部 92…第一泵部 93.. .混合部 94.. .第二泵部 95.. .控制部 96.. .警報器 97.. .濃度檢測部 900.. .配管 C...電路 L...雷射光束 P...保護膜 S...切割道 W."工件 W1...被加工面 W2...内面 X，Y，Z...方向I. SUMMARY OF THE INVENTION PROBLEM TO BE SOLVED BY THE INVENTION However, the dilution ratio of the water-soluble liquid resin differs depending on the type of the workpiece. When processing a plurality of workpieces, it is necessary to prepare and store a plurality of water-soluble liquids having different dilution levels in advance. Resin. The present invention has been made in view of the above-described facts, and a main technical object thereof is to provide a laser processing apparatus which can perform water solubility without using a plurality of water-soluble liquid resins even when a plurality of workpieces are processed. The cover of the liquid resin is processed. Means for Solving the Problems The present invention relates to a laser processing apparatus comprising: a protective film forming mechanism for supplying a water-soluble liquid resin to a surface to be processed of a workpiece to form a protective film for protecting a surface to be processed; A holding table that is held on the opposite side of the surface to be formed with a protective film on the surface to be processed; and a laser irradiation mechanism that emits a laser beam from the processed surface on which the protective film is formed by the workpiece held on the holding table. The x' protection system has a liquid resin dilution device for diluting the water-soluble liquid resin. The liquid tree sap is diluted to include: a water-soluble liquid-like tree for dispensing a water-soluble liquid-like resin, and a solvent for delivering a solvent capable of diluting the water-soluble liquid resin, which is water-soluble by the first phase The mixing portion of the liquid resin and the solvent sent by the second pump portion; and the concentration detecting portion for detecting the concentration of the water-soluble liquid resin diluted in the mixing portion are preferable. Also, the first ~ stone. Pump. The tethered telescopic pump includes: a pressure detecting portion for detecting a pressure in a pipe on the upstream side of the extension pump of the 201139027; and a movement of the telescopic pump and the second pump portion according to the pressure detected by the pressure detecting portion The control department is better. Advantageous Effects of Invention Since the present invention has a liquid resin dilution device for diluting a water-soluble liquid resin as a protective film of a processed surface of a workpiece, it can be diluted by a desired ratio even in the case of processing a plurality of workpieces. The water-soluble resin is subjected to a cover treatment of the protective film without using a plurality of protective films. Further, by having the concentration detecting portion for detecting the concentration of the diluted water-soluble liquid resin, the alarm can be sounded and the device can be stopped when the concentration does not reach the desired value, based on the detection result of the concentration detecting portion, and The first pump portion or the second pump portion is controlled to adjust the concentration. The first pump unit telescopic pump includes: a pressure detecting unit for detecting a pressure in a pipe on the upstream side of the telescopic pump; and a telescopic pump and a second pump unit according to the pressure detected by the pressure detecting unit; In the control unit of the operation, by adjusting the absorption speed of the telescopic pump based on the pressure value of the pressure detecting portion, the liquid can be transported at the fastest speed within a range where no air bubbles are generated. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing an example of a laser processing apparatus. Fig. 2 is a block diagram showing the structure of a liquid resin dilution device. Fig. 3 is a cross-sectional view showing a part of a workpiece which is covered with a protective film on a surface to be processed. Fig. 4 is an enlarged view showing the state in which the laser beam is irradiated onto the surface of the workpiece having the protective film of 201139027. In the laser processing apparatus 1 of the first embodiment, the laser processing apparatus 1 for irradiating the workpiece (workpiece) held on the holding table 2 from the laser irradiation mechanism 3 is irradiated with laser light. The beam is used to machine the workpiece 1. The holding table 2 is configured to be transmitted through the transport mechanism 4 to be transmitted in the X-axis direction and in the γ-axis direction perpendicular to the X-axis direction. The transport mechanism 4 is composed of an X-direction transport mechanism 5 and a γ-direction transport mechanism 6. The laser irradiation mechanism 3 is fixed to a wall portion 设 provided at the rear end portion of the device, and has an irradiation head 3 照射 that irradiates the laser beam downward. The X-direction conveying mechanism 5 includes: a ball screw 50 extending in the z-axis direction; a guide rail 51 disposed in parallel with the ball screw 50; a motor 52 connected to one of the ball screws 50 and rotating the ball screw 50; and a lower portion Slidingly connected to the guide rail 51 and having a sliding plate 53 which is not shown to be screwed to the nut of the ball screw 5〇; and formed with the rotation of the ball screw 5, the sliding plate brother is guided by the guide rail 51 to move Structure in the X-axis direction. The slide plate 53 is fixed with a rotary drive portion 54 having a pulsating motor inside, and the rotary drive portion 54 allows the holding table 2 to rotate at a predetermined angle. The Υ direction conveying mechanism 6 includes: a ball screw 60 extending in the γ-axis direction; a guide rail 61 disposed in parallel with the ball screw 60; and a motor 62 connected to one of the ball screws 60 and rotating the ball screw cup 60; The lower portion is slidably coupled to the guide rail 61 and has a sliding plate 63 which is not shown to be screwed to the nut of the ball screw 6; and is formed to rotate along the guide rail 61 by the rotation of the ball screw 60. Structure in the X-axis direction. The slide plate 63 is arranged. The sun-direction conveyance mechanism 5 is arranged in the X-direction conveyance mechanism 5, and the X-direction conveyance mechanism 5 can be moved in the same direction as the slide plate 63 moves in the direction of the spool. The front side of the wall portion 10 has a surface to be coated with a water-soluble liquid resin supplied to the workpiece before processing to cover the protective film forming mechanism 7 for protecting the surface to be coated. The protective film forming mechanism 7 includes: a rotating table 70 for holding the wafer and rotatable; a fixing portion for fixing the wafer to the rotating table 7; and a dropping portion 72 for dropping the water-soluble liquid resin from above the wafer. . The lower portion of the drop is placed at the front end of the arm member which is centered on the shaft portion 73 and is capable of swaying. The front surface of the wall portion 10 has a transport mechanism 8 for transporting a workpiece from the protective film forming mechanism 7 to the holding table 2. The transport mechanism 8 includes: a ball screw 80 extending in the γ-axis direction; a guide thinner arranged in parallel with the ball screw 8G; a motive 82 connected to the end of the teardrop screw 80 and causing the ball screw 8 to move; and a side portion Slidingly connected to the guide willow and (4) having a (four) thinness that is not shown to be screwed to the ball screw 80; the lifting portion I that is raised and lowered relative to the movement (10) is fixed to the lower portion of the lift M84; and formed with the ball The rotation of the screw 8G, the movement _ is guided by the guide (4) and moved in the Y-axis direction, and the workpiece holding portion 85 holding the crystal IU is moved in the same direction by the gj, and the wafer is transported to the protection mechanism. 7 and the structure between. The protective film forming mechanism 7 has a liquid resin releasing device 9 for diluting a liquid resin. The liquid resin dilution device 9 has a function of diluting the water-soluble liquid resin by mixing a water-soluble resin to a solvent, and has a groove 90 of a cold-frozen liquid-like tree as shown in Fig. 2, and the groove 9〇 It is connected to the first chest portion 92 through the pressure detecting portion w. 201139027 The first chestnut portion 92 is a telescopic pump, and the output side is connected to the mixing portion 93, and has a function of feeding the raw liquid of the water-soluble liquid resin stored in the tank 9 to the mixing portion 93. The mixing portion 93 is also connected to the second pump portion 94, and the second fruit portion 94 has a function of sending a solvent (water) to the mixing portion 93. In the mixing unit 93, the water-soluble liquid resin sent from the first pump unit 92 is mixed with the solvent sent from the second pump unit 94 and diluted. The mixing portion 93 can be used, for example, a movable type static mixer or the like. The pressure detecting portion 91 has a function of detecting the pressure in the inside of the flow side of the first pump portion 92. The detection result of the pressure detecting unit 91 is recognized by the control unit 95, and the control unit 95 performs processing based on the recognition result. The water-soluble liquid resin which has been diluted in the mixing unit 93 is sent to the protective film forming mechanism 7. A detection result of the concentration detecting unit 97 for detecting the concentration of the diluted water-soluble liquid resin sent from the mixing unit 93 to the protective film forming mechanism 7 is disposed between the mixing unit 93 and the protective unit 7 (4). In the (four) part 95_ _ ' and proceed according to the results of the recognition. The concentration detecting portion 97 can use, for example, a conductive sensor. X, the control unit 95 is connected with an alarm (4)' and can be used according to the detection result of the hobbing detection _ for the use of the laser hoisting device shown in Fig. 1 to be processed on the workpiece. The operation of the device when shooting a laser beam will be described. X, the Guardian is not particularly limited, and can suppress semiconductor wafers such as wafers and bismuth gallium, transfer members such as secrets (laid adhesive materials) installed in the wafer for mounting wafers, and packaging of semiconductor products. Ceramic glass, sapphire (ai2〇3) inorganic material substrate ' coffee driver 201139027 and other electronic parts processing materials. Alternatively, it is required that the opposite surface of the processed surface of each of the n-stage plus the positional precision is on the rotary table 7G of the protective film forming mechanism 7. Next, the turntable 7 is turned, and the water-soluble liquid resin is dropped from the lower portion 72 of the arm portion 74 to the surface to be processed of the workpiece, and the straw is coated by spin coating as shown in Fig. 3 The water-soluble liquid resin which is dropped from the dropping portion 72 on the surface Wle of the workpiece W by the protective film made of the water-soluble liquid resin is diluted in the liquid resin dilution device 9 shown in Fig. 2 . The first fruit portion _ the raw liquid of the water-soluble liquid resin taken in from the tank 9 is sent from the mixing portion %, and the second pump portion 94 sends the water and the organic lysate to the mixing portion %. After that, the mixed mixture is released in the mixed 93, and is stationed in Jianqing. ^ : "You can adjust the liquid from the first and second portions 92 and the second pump portion 94 and mix them in the mixing portion. Therefore, the water-soluble liquid resin which is diluted in proportion to the desired ratio can be formed according to the reading. . Therefore, it is not necessary to envisage a plurality of workpieces and prepare a plurality of water-soluble liquid resins having different dilution levels, and even in the case of processing a plurality of JL members, no replacement of tanks or complicated storage regulation is required. The concentration of the diluted water-soluble liquid resin flowing out of the mixing unit 93 is detected by the concentration detecting unit 97 and recognized by the control unit 95. The control unit 95 can adjust the outflow amount from the first pump portion 92 or the second pump portion 94 in accordance with the recognized concentration, and can perform feedback control for maintaining the concentration of the diluted water-soluble liquid resin. Further, when the value of the density of the concentration detecting portion 97 is not the concentration of the wife, the control unit 95 may sound the alarm % and stop the device of the 201139027, and notify the operator. The pressure detecting unit 91 can detect the pressure inside the pipe 900 between the first pump and the tank (10), and the control unit 95 can control the operations of the first pump portion 92 and the second pump portion 94 based on the value of the pressure. Specifically, the piping between the first chestnut portion 92 and the lion _ when the inside is a negative pressure, the solvent is generated from the dissolved gas in the liquid. Therefore, there is a case where the bubble is mixed with the water-soluble resin. Breaking is considered to be the reason why the protective film covering the surface of the J1 piece cannot be equalized. Therefore, in the (fourth) portion 95, the pressure "the pressure of the pipe 900 detected by the pressure portion 91" is constantly monitored, and the value per unit time sent from the first pump portion 92 is reduced according to the value of the negative pressure of the pipe portion 9_. The amount of liquid is controlled to reduce the absolute value of the pressure inside the piping 900. By performing the above control, it is possible to prevent the bubbles from being mixed into the water-soluble liquid resin supplied from the protective film forming mechanism 7 to the workpiece, so that the thickness of the protective film covering the workpiece can be made uniform. Further, since the operations of the first pump portion 92 and the second pump portion 94 can be automatically controlled in accordance with changes in conditions such as the viscosity of the water-soluble liquid resin, the liquid can be transported at the fastest speed without generating air bubbles. As described above, after the protective film p as shown in the third circle is formed, the workpiece W is transported to the holding table 2 by the transport mechanism 8 shown in Fig. 1 and held at the holding table 2 as a processed surface. The inner surface W2 of the opposite side of wi. Thereafter, the X-direction transport mechanism 5 and the Y-direction transport mechanism 6 send the holding table 2 to the χ direction and the Y direction ′, and the illuminating head 30 is as shown in Fig. 4 (surface) (4) dermis processing surface side W1 cleavage path S illuminates the laser beam L. At this time, even if debris is generated by the irradiation of the laser beam, the surface C of the circuit C is protected by the protective film p, and the circuit C is also protected. 10 201139027 Example 1 The length of the pipe 900 shown in Fig. 2 is i.5 [m], and the south of the groove 90 to the first collecting portion 92 is 1, 2 [m], and the piping is used. When the inner diameter of 900 is 6 [mm]' and the concentration of the water-soluble liquid resin is i8 〇 [cp], the absorption speed of the water-soluble liquid resin of the first pump portion 92 and the pressure of the pressure detecting portion 91 are The relationship between the measured values is confirmed between the measured values. Absorption rate of liquid resin [ml/secl pressure value [kPal 10 -97 7 -60 3 -38 Further, when the measured value of the pressure detecting unit 91 is _60 [kPa] or less, it is confirmed that there is a water-soluble liquid. A bubble of a dissolved gas of the resin is generated. For the sake of safety, 'when the edge is 20 [kPa], and if the pressure is above _4 〇 [k; Pa], it is considered that no bubble will be generated. According to the above table, if the absorption rate of the water-soluble liquid resin is When it is 3 [ml/sec] or less, it is considered that bubbles do not occur under the above conditions. In the case where the viscosity of the water-soluble liquid resin is 60 [cP], the pressure value at a rate of absorption of the water-soluble liquid resin of 1 〇 [ml/sec] is confirmed to be -40 [kPa]. Therefore, in this case, when the absorption rate of the water-soluble liquid resin is 10 [ml/sec], it is considered that no bubbles are generated. When the viscosity of the water-soluble liquid resin varies between 6 〇 [cP] and 180 [cP], the absorption rate must be below 3 [ml/sec], in a water-soluble liquid state corresponding to any viscosity of the range. The resin inhibits the generation of bubbles. However, in this case, it is only necessary to spend at least 33 [seconds] to absorb 100 [ml] of the water-soluble liquid resin', if the absorption speed is 1 〇 [ml/sec], then only 1 〇 [sec], 11 201139027 Even the difference of 23 [seconds] is produced. Therefore, by measuring the value of the negative pressure inside the pipe 900 at the pressure detecting device 91 and feeding back the measured value, and by adjusting the absorption speed of the first pump portion 92 according to the value of the negative pressure by the control portion 95, no bubble can be generated. The fastest pump action is performed within the range. I: Brief Description of Drawings Fig. 1 is a perspective view showing an example of a laser processing apparatus. Fig. 2 is a block diagram showing the structure of a liquid resin dilution device. Fig. 3 is a cross-sectional view showing a part of a part of the workpiece covered with a protective film on the surface to be processed. Fig. 4 is a cross-sectional view showing an enlarged state in which a laser beam is irradiated onto a workpiece covered with a protective film on a surface to be processed. [Description of main component symbols] 1... Laser processing device 5 Bu 6 82 81. Guide rail 2... Holding table 52, 62, 82... Motor 3... Laser irradiation mechanism 53, 63. .. slide plate 4...transport mechanism 54...rotation drive unit 5...X-direction transfer mechanism 70...rotary table 6...Y-direction transfer mechanism 71...fixed portion 7...protection Film forming mechanism 72... dripping lower portion 8... transporting mechanism 73... shaft portion 9... liquid resin dilution device 74... arm portion 10... wall portion 83... moving block 30. .. illuminating head 84... lifting part 50, 60, 80···ball screw 85... workpiece holding part 12 201139027 90.. .# 91.. pressure detecting part 92... first pump part 93.. Mixing section 94... 2nd pump part 95.. Control part 96.. Alarm 97.. Concentration detecting part 900.. piping C... Circuit L... Laser beam P.. .Protective film S...cutting path W."Workpiece W1...machined surface W2...inside X,Y,Z...direction
S 13S 13