201135300 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種晶圓級(wafer level)鏡頭模組及其相關製造 方法，尤指一種用以消除/減少不必要之雜散(stray)光的晶圓級鏡頭 模組以及相關製造方法。 【先前技術】 隨著光學科技的進步.，影像擷取裝置在各種不同產品的應用上 也廣受歡迎，舉例來說，除了數位械之外，—些行動裝置：如手 機個人數位助理(personal dlgltal assistam，pDA)以及筆記型電腦 (_b〇〇k ’ NB)亦具有影像擷取功能的裝置安裝於其内。 鏡頭杈，、且疋衫像摘取聚置中最重要的元件之一，献而，設置於 !兄頭模組之下的影像感測器(imagese 、 震置的整體效能，便 而導致雜訊的產生或影像對比的惡化。因此，響’因 感測器接㈣私要的__f彡像錄_地避免影像 成為相關產針-個待解細$要議題。 【發明内容】 201135300 因此，本發明的目的之一在於提供一種晶圓級鏡頭模組、晶圓 級攝影機以及相關的製造方法，以解決上述之問題。 依據本發明之一實施例，其係提供一種晶圓級鏡頭模組。該晶 圓級鏡頭板組包含有一第一光學層、一間隔層以及一第二光學層。 該間隔層係設置於該第一光學層之上，並具有一孔洞穿透其中以透 光，其中該孔洞的表面大致上避免了光反射，以及該第二光學層係 設置於該間隔層上。 依據本發明之另一實施例，其係提供一種晶圓級攝影機。該晶 圓級攝影機包含有一影像感測器、一間隔層以及一晶圓級鏡頭模 組。該間隔層係設置於該影像感測器之上，並具有一孔洞穿透其中 以透光，其中該孔洞的表面大致上避免了光反射，以及該晶圓級鏡 頭模組係設置於該間隔層之上。 依據本發明之另一實施例，其係提供一種製造一晶圓級鏡頭模 組的方法。該方法包含有下列步驟：提供一第一光學層、一間隔層 以及一第二光學層，其中有一孔洞穿透過該間隔層以透光；將該間 隔層設置於該第一光學層之上，以及將該苐二光學層設置於該間隔 層之上；以及將一特定薄膜層設置於該孔洞之表面上。 依據本發明之另一實施例，其係提供一種製造一晶圓級鏡頭模 組的方法。該方法包含有下列步驟：提供一第一光學層、一間隔層 201135300 將該間隔層設置於該第一光學層之上， 以及一第二光學層； 該第二光學層設置於該間隔層之上 洞具有一粗梭表面。 —、w 巧甲增i上，以及將 ;以及使穿透過該間隔層之一孔 【實施方式】 —在摘書及後續的申請專利範圍當中使用了某些詞棄來指稱特 鲁定的70件。所屬領域中具有通常知識者應可理解，硬體製造商可能 會用不同的名詞來稱呼同樣的元件。本說明書及後續的申請專利範 圍並不以名稱的差異來作為區分元件的方式，而是以元件在功能上 的差異來作為區分的準則。在通篇說明書及後續的請求項當中所提 及的「包含」係為-開放式的用語，故應解釋成「包含但不限定於」。 另外’「耦接」一詞在此係包含任何直接及間接的電氣連接手段。因 此，若文中描述一第一裝置耦接於一第二裝置，則代表該第一裝置 可直接電氣連接於該第二裝置，或透過其他裝置或連接手段間接地 •電氣連接至該第二裝置。 第1圖為本發明之第一實施例中一晶圓級攝影機1〇〇之結構的 剖面圖。晶圓級攝影機100包含有(但不侷限於）一影像感測器11〇、 一第一間隔層120、一晶圓級鏡頭模組130以及複數個特定薄膜層 140。如第1圖所示，晶圓級鏡頭模組130包含設置於第一間隔層 120之上的一第一透鏡載板(iens plate)l3卜設置於一第二間隔層！32 之上的一第二透鏡載板133以及設置於一第三間隔層134之上的一 201135300 光圈(diaphragm)135。請注意，在此實施例中，該些特定薄膜層l4〇 係分別設置於間隔層120、132以及134中孔洞的表面(如第2圖所 示）’但這並非本發明之限制。換句話說，特定薄膜層可依實際設計 需求而設置於晶圓級攝影機100内的任何間隔層上。 舉個例子來說，晶圓級攝影機100可以是一微型攝影模組 (compact camera module，CCM)且設置於一影像擷取裝置内，但這並 非作為本發明的限制，除此之外，特定薄膜層14〇的數量及厚度亦 無特定限制。也就是說’在不違背本發明之精神下，特定薄膜層14〇 的數量及厚度可依照實際需求作雜及修正，此類設計上的變化均 屬本發明之範嘴。 在實轭例中’該些特定薄膜層14〇皆為光屏蔽(Ught shielding) 層’所以當雜散光照射於間隔層12(M32以及134中孔洞的表面時， 4刀亦或所有的雜散光會被該些光屏蔽層所吸收，因此，設置於 曰曰圓、’及鏡頭模組13〇之下的影像感測器丨⑴便不會受到不必要之雜 政?*所〜響’進而提升影像品質。然而’本發明並不受限於此，也 二疋兒’、匕此大幅避免或大量減少光反射的薄膜層亦屬本發明之 :圍此外帛1圖中晶圓級攝景織·的結構僅是作為範例說明， 並非本發明之限制。 立第3圖為本發明之第二實施例中一晶圓級攝影機之結構的 】圖其類似於第1圖中所示之晶圓級攝影機漏。晶圓級攝影 201135300 機300包含有(但不侷限於）一影像感測器3ι〇、一第一間隔層32〇 -以及一晶圓級鏡頭模組330。如第3圖所示’晶圓級鏡頭模組33〇 '包含設置於第一間隔層320之上的一第一透鏡載板33卜設置於-第-間隔層说之上的-第二透鏡載板333以及設置於一第三間隔 層334之上的-光圈335。請注意，在此實施例巾，間隔層挪、说 以及334中孔洞的表面(如第4圖所示）皆為粗糖表面，但這並非本 ^明^限制，換句話說’位於間隔層中孔洞的任何表面可個別地依 籲设计需求而為-粗縫表面。當雜散光照射於間隔層伽、说以及 334中孔洞的粗·面時’入射的雜散光會往隨機的方向散射，如 此-來，影像感測器310便不容易受到雜散光的嚴重影響。 請注意，上述的實施例僅用來說明本發明之技術特徵，並非用 來舰本發明之範轉。熟習此項技藝者應可了解，第i圖以及第3 圖中的晶圓級攝影機的結構亦可在不違背本發明之精神下 變化及修正。 田 月乡考第5圖’第5圖為本發明之製造-晶圓級鏡賴組的方 法之-實關的流糊。請注意，假若可大致上獲得_的結果， 步驟不一定要親第5圖巾柄之:欠序來依序執行。财法包含有 下列步驟： 步驟502 :提供一第一光學層、一間隔層以及—第二光學層，其中 有一孔洞穿透過該間隔層以透光。 201135300 步驟504 :將該間隔層設置於該第一光學層之上，以及將該第二光 學層設置於該間隔層之上。 步驟506 :將一特定薄膜層設置於該孔洞之表面上。 在步驟502中，該第一光學層可為一透鏡載板，以及該第二光 學層可為一光圈或一透鏡載板。在步驟506中，該特定薄膜層係為 一光屏蔽層。結合第5圖的步驟、第1圖以及第2圖中的元件可清 楚了解製造一晶圓級鏡頭模組(例如晶圓級鏡頭模組130)的步驟，故 詳細的步驟說明於此便不另贅述。 請參考第6圖，第6圖為本發明之製造一晶圓級鏡頭模組的方 ’去之另一貫施例的流程圖。該方法包含有(但不偈限於)下列步驟： 步驟602 :提供—第一光學層、—間隔層以及—第二光學層。 ^驟604 .將該間隔層設置於該第一光學層之上，以及將該第二光 學層設置於該間隔層之上。 〉驟606 .使得穿透過該間隔層之一孔洞具有一粗糖表面。 與^步驟602中，該第-光學層可為一透鏡載板，以及該第二光 予層可為一光圈或一透鏡載板。結合第ό圖的步驟、第3圖以及第 _圖中的tl件可清楚了解製造-晶圓級鏡賴組(例如晶圓級鏡賴 、、、且33〇)的步驟，故詳細的步驟說明於此便不另贅述。 201135300 上述流程圖中之步驟僅作為本發明可實行的實施例，並不為本 - 發明之限制。熟習此項技藝者應可了解，在不違背本發明之精神下， . 上述之製造方法亦可插入其它步驟或合併數個步驟成一單一步驟， 均屬本發明之範疇。舉例來說，在一種設計變化下，第5圖以及第 6圖中的步驟可選擇性地合併。 綜上所述，本發明找些實關提供了關級鏡麵組、晶圓 鲁級攝影機以及製造晶圓級鏡麵組的相關方法。在一實施例中，本 發明設置-特定薄膜層於晶圓級攝影機内間隔層中孔洞的表面，因 此，當雜散光照射於間隔層中孔洞的表面時，雜散光會被該特定薄 膜層所吸收，如此-來’晶圓級攝影機内的影像感測器便不會受到 不必要之雜散光所影響。在另一實施例中，晶圓級攝影機内間隔層 中之孔洞具有⑽造的表面，因此，當雜散光照射於間隔層中孔洞的 粗輪表面時’讀_散光錢機地料同方向散射，如此可防止 晶圓級攝影機内的影像感測器受到雜散光的嚴重影響。簡而言之， 任何_本發明之技術特徵啦彡像擷取裝置可倾歧善其整體效 能。 、上所述僅為本^明之較佳實施例，凡依本發明+請專利範圍 所做之均㈣化與修飾1應屬本發明之涵蓋範圍。 【圖式簡單說明】 201135300 第1圖為本發明之第〆實施例巾―晶圓級攝影機之結構的剖面圖。 第2圖為第1圖中晶圓級攝影機内一間隔層的部分放大圖。 第3圖為本發明之第二實施例中一晶圓級攝影機之結構的剖面圖。 第4圖為第3圖中晶圓級攝影機内一間隔層的部分放大圖。 第5圖本發明之製造一晶圓級鏡頭模組的方法之—實施例的流程 圖。 第6圖本發明之製造一晶圓級鏡頭模組的方法之另一實施例的流程 圖。 【主要元件符號說明】 1〇〇、3〇〇 晶圓級攝影機 110、310 影像感測器 120、132、134、320、332、334 間隔層 晶圓級鏡頭模組 透鏡載板 光圈 130、330 131 ' 133 > 331 ' 333 135 、 335 140 特定薄膜層201135300 VI. Description of the Invention: [Technical Field] The present invention relates to a wafer level lens module and related manufacturing method, and more particularly to a method for eliminating/reducing unnecessary stray Wafer-level lens modules and related manufacturing methods. [Prior Art] With the advancement of optical technology, image capture devices are also popular in a variety of different applications, for example, in addition to digital devices, some mobile devices: such as mobile personal digital assistants (personal The dlgltal assistam, pDA) and the notebook (_b〇〇k 'NB) also have an image capture function installed in it. The lens is smashed, and the smock is like one of the most important components in the concentrating, and the image sensor (imagese, the overall performance of the stunned The occurrence of the signal or the deterioration of the image contrast. Therefore, the __f彡 录 地 地 地 地 避免 避免 避免 避免 避免 避免 避免 避免 避免 避免 避免 避免 避免 避免 避免 避免 避免 避免 避免 避免 避免 避免 避免 避免 避免 避免 避免 避免 避免 避免 避免 避免 避免 避免 避免 避免 避免 避免 避免 避免One of the objects of the present invention is to provide a wafer level lens module, a wafer level camera, and related manufacturing methods to solve the above problems. According to an embodiment of the present invention, a wafer level lens module is provided. The wafer level lens plate set comprises a first optical layer, a spacer layer and a second optical layer. The spacer layer is disposed on the first optical layer and has a hole penetrating therein for transmitting light. Wherein the surface of the hole substantially avoids light reflection, and the second optical layer is disposed on the spacer layer. According to another embodiment of the present invention, a wafer level camera is provided. Contains one An image sensor, a spacer layer, and a wafer level lens module. The spacer layer is disposed on the image sensor and has a hole penetrating therethrough for light transmission, wherein the surface of the hole is substantially avoided The light reflection and the wafer level lens module are disposed on the spacer layer. According to another embodiment of the present invention, a method for manufacturing a wafer level lens module is provided. The method includes the following Step: providing a first optical layer, a spacer layer, and a second optical layer, wherein a hole penetrates through the spacer layer to transmit light; the spacer layer is disposed on the first optical layer, and the second layer An optical layer is disposed on the spacer layer; and a specific film layer is disposed on the surface of the hole. According to another embodiment of the present invention, a method for manufacturing a wafer level lens module is provided. The method includes the steps of: providing a first optical layer, a spacer layer 201135300, placing the spacer layer on the first optical layer, and a second optical layer; the second optical layer is disposed on the spacer layer The hole has a rough shuttle surface. -, w, and the hole; and the hole that penetrates through the spacer layer. [Embodiment] - Some words are used in the scope of the excerpt and subsequent patent applications. To claim 70 of Trude. It is understood by those of ordinary skill in the art that hardware manufacturers may use different nouns to refer to the same components. The scope of this specification and subsequent patent applications does not differ by name. As a way to distinguish between components, but as a difference in the functional difference of components. The "contains" mentioned in the entire specification and subsequent claims are open-type terms, so they should be explained. The word "including but not limited to" is used herein to include any direct and indirect electrical connection means. Therefore, if a first device is coupled to a second device, The first device can be directly electrically connected to the second device or indirectly/electrically connected to the second device through other devices or connection means. Fig. 1 is a cross-sectional view showing the structure of a wafer level camera 1 in the first embodiment of the present invention. The wafer level camera 100 includes, but is not limited to, an image sensor 11A, a first spacer layer 120, a wafer level lens module 130, and a plurality of specific film layers 140. As shown in FIG. 1 , the wafer level lens module 130 includes a first lens carrier 13 disposed on the first spacer layer 120 and disposed on a second spacer layer! A second lens carrier 133 above 32 and a 201135300 diaphragm 135 disposed above a third spacer layer 134. Note that in this embodiment, the specific film layers 14 are respectively disposed on the surfaces of the holes in the spacer layers 120, 132, and 134 (as shown in Fig. 2). However, this is not a limitation of the present invention. In other words, a particular film layer can be placed on any of the spacer layers within the wafer level camera 100 as desired by the actual design. For example, the wafer level camera 100 can be a compact camera module (CCM) and disposed in an image capture device, but this is not a limitation of the present invention. The number and thickness of the film layer 14 are also not particularly limited. That is to say, the number and thickness of the specific film layer 14〇 can be mixed and corrected according to actual needs without departing from the spirit of the present invention, and such design changes are all in the scope of the present invention. In the solid yoke example, the specific film layers 14 are all Ught shielding layers. Therefore, when stray light is irradiated on the surface of the holes in the spacer layer 12 (M32 and 134), 4 or all of the stray light. It will be absorbed by the light shielding layers. Therefore, the image sensor 丨(1) placed under the circle, 'and the lens module 13〇 will not be subjected to unnecessary miscellaneous policies. Improving the image quality. However, the present invention is not limited to this, and the film layer which greatly avoids or greatly reduces the light reflection is also the present invention: The structure of the woven structure is merely an example and is not a limitation of the present invention. Fig. 3 is a view showing the structure of a wafer level camera in the second embodiment of the present invention, which is similar to the crystal shown in Fig. 1. The circular camera leaks. The wafer level photography 201135300 machine 300 includes, but is not limited to, an image sensor 3ι, a first spacer 32〇, and a wafer level lens module 330. The 'wafer level lens module 33A' shown includes a first layer disposed on the first spacer layer 320. The lens carrier 33 is disposed on the second lens carrier 333 above the -first spacer layer and the aperture 335 disposed on a third spacer layer 334. Please note that in this embodiment, the spacer layer The surface of the holes in the 334, as shown in Figure 4, is the surface of the raw sugar, but this is not a limitation. In other words, 'any surface in the hole in the spacer layer can be individually designed according to the design requirements. For the rough surface, when the stray light is irradiated on the gap layer, and the rough surface of the hole in 334, the incident stray light will scatter in a random direction, so that the image sensor 310 is not easy. It is severely affected by stray light. Please note that the above-described embodiments are only used to illustrate the technical features of the present invention, and are not intended to be used in the invention. Those skilled in the art should understand that the first and third figures are understood. The structure of the wafer level camera can also be changed and corrected without departing from the spirit of the present invention. Tianyue Township Test 5th Figure 5 is a method for manufacturing the wafer-level mirror group of the present invention. Close the flow of paste. Please note that if you can get the result of _ The step does not have to be performed in the fifth row: the order is performed in order. The method includes the following steps: Step 502: providing a first optical layer, a spacer layer, and a second optical layer, wherein a hole is worn. Passing through the spacer layer to transmit light. 201135300 Step 504: disposing the spacer layer on the first optical layer, and placing the second optical layer on the spacer layer. Step 506: setting a specific film layer On the surface of the hole, in step 502, the first optical layer can be a lens carrier, and the second optical layer can be an aperture or a lens carrier. In step 506, the specific film layer is As a light shielding layer, the steps of manufacturing the wafer level lens module (for example, wafer level lens module 130) can be clearly understood by combining the steps of FIG. 5, FIG. 1 and FIG. 2, so that detailed The description of the steps will not be repeated here. Please refer to FIG. 6. FIG. 6 is a flow chart of another embodiment of the present invention for fabricating a wafer level lens module. The method includes, but is not limited to, the following steps: Step 602: providing - a first optical layer, a spacer layer, and a second optical layer. Step 604. The spacer layer is disposed on the first optical layer, and the second optical layer is disposed on the spacer layer. Step 606. The pores penetrating through the spacer layer have a rough sugar surface. In step 602, the first optical layer may be a lens carrier, and the second optical layer may be an aperture or a lens carrier. The steps of the manufacturing-wafer-level mirror group (for example, wafer level mirror, and 33 〇) can be clearly understood by combining the steps of the first drawing, the third drawing, and the tl of the drawing, so the detailed steps are detailed. The description will not be repeated here. The steps in the above-described flowcharts are only examples of the embodiments of the present invention, and are not intended to limit the invention. It is to be understood by those skilled in the art that the above-described manufacturing methods may be inserted into other steps or combined into several steps in a single step without departing from the spirit of the invention. For example, in one design change, the steps in Figures 5 and 6 can be selectively combined. In summary, the present invention provides a related method for providing a level mirror group, a wafer level camera, and a wafer level mirror group. In one embodiment, the present invention provides that the specific film layer is on the surface of the hole in the spacer layer in the wafer level camera. Therefore, when stray light is irradiated on the surface of the hole in the spacer layer, stray light is trapped by the specific film layer. Absorption, so - the image sensor in the wafer level camera is not affected by unwanted stray light. In another embodiment, the holes in the spacer layer in the wafer level camera have a (10) surface, so that when stray light illuminates the surface of the hole in the hole in the spacer layer, the read astigmatism material scatters in the same direction. This prevents image sensors in wafer level cameras from being severely affected by stray light. In short, any of the technical features of the present invention can be used to distinguish its overall effectiveness. The above description is only the preferred embodiment of the present invention, and the uniformity and modification 1 according to the scope of the invention and the scope of the invention should be within the scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS 201135300 Fig. 1 is a cross-sectional view showing the structure of a wafer-level wafer camera of the third embodiment of the present invention. Figure 2 is a partial enlarged view of a spacer layer in the wafer level camera of Figure 1. Figure 3 is a cross-sectional view showing the structure of a wafer level camera in the second embodiment of the present invention. Figure 4 is a partial enlarged view of a spacer layer in the wafer level camera of Figure 3. Figure 5 is a flow diagram of an embodiment of a method of fabricating a wafer level lens module of the present invention. Figure 6 is a flow diagram of another embodiment of a method of fabricating a wafer level lens module of the present invention. [Main component symbol description] 1〇〇, 3〇〇 wafer level camera 110, 310 image sensor 120, 132, 134, 320, 332, 334 spacer wafer level lens module lens carrier aperture 130, 330 131 ' 133 > 331 ' 333 135 , 335 140 specific film layer