TW200735333A - Compact multi-chips camera module and method thereof - Google Patents

Compact multi-chips camera module and method thereof

Info

Publication number
TW200735333A
TW200735333A TW095107228A TW95107228A TW200735333A TW 200735333 A TW200735333 A TW 200735333A TW 095107228 A TW095107228 A TW 095107228A TW 95107228 A TW95107228 A TW 95107228A TW 200735333 A TW200735333 A TW 200735333A
Authority
TW
Taiwan
Prior art keywords
chips
camera module
compact
substrate
compact multi
Prior art date
Application number
TW095107228A
Other languages
Chinese (zh)
Inventor
Kuo-Tung Tiao
Yu-Te Hsieh
Jing-Du Liu
Original Assignee
Optronics Technology Inc A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Optronics Technology Inc A filed Critical Optronics Technology Inc A
Priority to TW095107228A priority Critical patent/TW200735333A/en
Publication of TW200735333A publication Critical patent/TW200735333A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/12105—Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/19—Manufacturing methods of high density interconnect preforms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73267—Layer and HDI connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92244—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a build-up interconnect

Landscapes

  • Cameras In General (AREA)
  • Studio Devices (AREA)
  • Lens Barrels (AREA)

Abstract

A compact multi-chips camera module and a method thereof are disclosed. It adopts a substrate building-in packaging technology to integrate multi-chips into compact camera module. Therefore, the imaging effect is enhanced, and provides a total solution. The present invention integrates the multi-chips of the auto focusing system and the photo zoom lens system into a single substrate. Thereby, the requirement of being small and compact is achieved. By using the packaging procedures of the present invention, the thickness is maintained. The thickness of the substrate does not increase according the number of the chips. The compact multi-chips camera module includes a substrate, a plurality of chips, a dielectric layer, an imaging sensor, a lens holder and a set of lens.
TW095107228A 2006-03-03 2006-03-03 Compact multi-chips camera module and method thereof TW200735333A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW095107228A TW200735333A (en) 2006-03-03 2006-03-03 Compact multi-chips camera module and method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095107228A TW200735333A (en) 2006-03-03 2006-03-03 Compact multi-chips camera module and method thereof

Publications (1)

Publication Number Publication Date
TW200735333A true TW200735333A (en) 2007-09-16

Family

ID=57913457

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095107228A TW200735333A (en) 2006-03-03 2006-03-03 Compact multi-chips camera module and method thereof

Country Status (1)

Country Link
TW (1) TW200735333A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI426311B (en) * 2010-04-13 2014-02-11 Himax Tech Ltd Wafer level lens module, method for forming wafer level lens module and wafer level camera

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI426311B (en) * 2010-04-13 2014-02-11 Himax Tech Ltd Wafer level lens module, method for forming wafer level lens module and wafer level camera

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